Component mounting system and component mounting method

Abstract

This invention provides a component mounting system and a component mounting method capable of suppressing a decrease in yield. The component mounting system (1) includes a control unit (340) that determines whether an input unit (330) has received input during a period of non-receipt, which is the period before the number of processed blocks on which the mounting device (100) mounts the component (440) on the substrate (400) reaches a given number. If it is determined that the input unit has received input, the mounting device corrects the mounting position based on a first correction amount calculated by a calculation unit (320) based on the deviation amount measured by an inspection device (200) from each of the processed blocks of substrates. If it is determined that the input unit has not received input, the mounting device mounts the component on the given number of substrates, and corrects the mounting position based on a second correction amount calculated by the calculation unit based on the deviation amount measured by the inspection device from each of the given number of substrates.

Description

Technical Field

[0001] This invention relates to a component mounting system and a component mounting method. Background Technology

[0002] Conventionally, there are systems that mount electronic components such as driving circuits on substrates of display panels such as liquid crystal panels or organic EL (Electro Luminescence) panels (for example, see Patent Document 1).

[0003] The electronic component bonding device disclosed in Patent Document 1 includes an external lead bonding portion, a first formal crimping portion, and a second formal crimping portion. After aligning the external lead bonding portion, the bonding device performs formal crimping via the first and second formal crimping portions. This bonding device pre-estimates the positional deviation that may occur when crimping the electronic component to a display panel such as an LCD (Liquid Crystal Display) to align the electronic component and the display panel. Therefore, this bonding device can perform correct bonding.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 7-201932

[0007] In Patent Document 1, for example, when installing electronic components on a display panel, the position deviation of the installed electronic components from a given position is obtained for 50 display panels (samples), and the average value of the position deviation of each of the 50 samples is calculated as a correction amount for correcting the installation position of the mounting components of the mounting device.

[0008] Here, if the sample size is too small, there is a risk of calculating values ​​that deviate from the optimal correction amount. That is, if the sample size is too small, there is a concern that the calculated correction amount may be less accurate. Therefore, there is a concern about low installation accuracy and a decreased yield. On the other hand, if the sample size is too large, there will be more display panels with electronic components installed without correction. Therefore, the number of electronic components installed with lower installation accuracy increases, thus raising concerns about a decreased yield.

[0009] Therefore, whether the sample size is too large or too small, there is a concern about a decrease in the yield rate. Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] This invention provides a component mounting system, etc., that can suppress the decline in yield.

[0012] Methods for solving problems

[0013] One aspect of the present invention relates to a component mounting system comprising: a mounting device for mounting components on a substrate; a calculation unit for calculating a correction amount for causing the mounting device to correct the mounting position of the mounting device on the substrate component based on a deviation of the position of the component mounted to the substrate by the mounting device from a given position; a control unit for causing the mounting device to correct the mounting position based on the correction amount; and an input unit for receiving an input for causing the mounting device to correct the mounting position, wherein the control unit determines whether the input unit has received the input during a period in which the correction is not reached, the period in which the number of processing blocks in which the mounting device mounts components on the substrate reaches a given value. During the period before the number of blocks is determined, if it is determined that the input unit has received the input, the control unit causes the mounting device to correct the mounting position based on a first correction amount, which is calculated by the calculation unit based on the deviation amount measured from each of the substrates in the given number of blocks. If it is determined that the input unit has not received the input, the control unit causes the mounting device to mount the component on the substrates in the given number of blocks and causes the mounting device to correct the mounting position based on a second correction amount, which is calculated by the calculation unit based on the deviation amount measured from each of the substrates in the given number of blocks.

[0014] Furthermore, one aspect of the present invention relates to a component mounting method comprising: mounting a component on a substrate using a mounting device; calculating a correction amount for correcting the mounting device's mounting position on the substrate component based on a deviation of the position of the component mounted on the substrate by the mounting device from a given position; determining, during a period not reached, whether an input for correcting the mounting position by the mounting device has been received, the period not reached being a period before the number of processed blocks on which the mounting device has mounted a component on the substrate reaches a given number; if the input is determined to have been received, correcting the mounting position by the mounting device based on a first correction amount, the first correction amount being calculated based on the deviation measured from each of the processed blocks of substrates; and if the input is determined not to have been received, mounting a component on the given number of substrates using the mounting device, and correcting the mounting position by the mounting device based on a second correction amount, the second correction amount being calculated based on the deviation measured from each of the given number of substrates.

[0015] Furthermore, these general or specific methods can be implemented either through systems, methods, integrated circuits, computer programs, or storage media such as computer-readable CD-ROMs, or through any combination of systems, methods, integrated circuits, computer programs, and storage media.

[0016] Invention Effects

[0017] According to the present invention, a component mounting system and the like can be provided that can suppress the decline in yield. Attached Figure Description

[0018] Figure 1 This is a top view illustrating the component mounting system according to the embodiment.

[0019] Figure 2 This is a block diagram illustrating the structure of the component mounting system according to the embodiment.

[0020] Figure 3 It is a schematic three-dimensional diagram used to illustrate the position of the camera module's imaging substrate.

[0021] Figure 4 This is a back view of the substrate with components mounted on it.

[0022] Figure 5 This is a graph used to illustrate the deviation measured by the inspection device involved in the implementation method.

[0023] Figure 6 This is a flowchart illustrating the processing steps of the component mounting system according to the embodiment.

[0024] Symbol Explanation

[0025] 1: Component mounting system;

[0026] 1a, 1b, 1c: Abutment;

[0027] 10: Substrate loading department;

[0028] 11, 21, 31, 41, 51: Workbench;

[0029] 20: Attachment part;

[0030] 22, 32, 42: Workbench moving parts;

[0031] 23: Attachment mechanism;

[0032] 30: Pre-compression joint;

[0033] 33: Component Supply Department;

[0034] 34: Pre-compression tools;

[0035] 35: Equipped with a head;

[0036] 36: Equipped with a head movement mechanism;

[0037] 37, 210: Camera Department;

[0038] 40: Formal crimping section;

[0039] 43: Formal crimping tools;

[0040] 50: Board unloading part;

[0041] 60: Transport Department;

[0042] 61: Mobile base;

[0043] 62A, 62B, 62C, 62D: Substrate handling mechanism;

[0044] 63: Base;

[0045] 64: Arm unit;

[0046] 100: Installation device;

[0047] 200: Inspection device;

[0048] 220: Measurement section;

[0049] 300: Control device;

[0050] 310: Acquisition Department;

[0051] 320: Computing Department;

[0052] 330: Input section;

[0053] 340: Control Unit;

[0054] 350: Output section;

[0055] 360: Display unit;

[0056] 370: Storage Department;

[0057] 400: substrate;

[0058] 410: Electrode section;

[0059] 420, 421: Markers;

[0060] 430: ACF;

[0061] 440: Component;

[0062] 450: Given position;

[0063] L: Deviation. Detailed Implementation

[0064] Hereinafter, the component mounting system and the like according to embodiments of the present invention will be described in detail using the accompanying drawings. Furthermore, the embodiments described below are all specific examples of the present invention. Therefore, the values, shapes, materials, constituent elements, configurations of constituent elements, connection methods, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, constituent elements in the following embodiments that are not described in the independent technical solution illustrating the highest concept of the present invention will be described as arbitrary constituent elements.

[0065] Furthermore, the figures are schematic diagrams and may not be strictly illustrative. Also, the same symbols are used to label the same structural components in all figures.

[0066] Furthermore, in this specification and accompanying drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are mutually orthogonal and both orthogonal to the Z-axis. Additionally, in the following embodiments, the substrate transport direction is sometimes described as the positive X-axis direction, the positive Z-axis direction as upward, and the negative Z-axis direction as downward.

[0067] (Implementation Method)

[0068] [structure]

[0069] First, the structure of the component mounting system involved in the implementation method will be described.

[0070] Figure 1 This is a top view showing the component mounting system 1 according to the embodiment. Figure 2 This is a block diagram illustrating the structure of the component mounting system 1 according to the embodiment. Figure 3 This is a schematic perspective view used to illustrate the position of the imaging unit 37 and the imaging substrate 400.

[0071] In addition, Figure 1 In the diagram, the inspection device 200 and the control device 300 are shown as functional blocks. For example, the inspection device 200 and the control device 300 can be connected wirelessly or wired via a control line. Furthermore, for example, the control device 300 can be connected wirelessly or wired via a control line to each device included in the mounting device 100, such as the attachment part 20, the pre-pressing part 30, the final pressing part 40, and the transport part 60, and can control each device.

[0072] In addition, Figure 3 The illustration omits some of the components of the pre-pressing portion 30, such as the worktable 31 for mounting the substrate 400 and the spare worktable. Furthermore, in Figure 3In the diagram, the head-moving mechanism 36 is shown as a functional frame.

[0073] The component mounting system 1 is a system for mounting components 440 on a substrate 400. Specifically, the component mounting system 1 is a system in which an anisotropic conductive material (ACF) 430, which serves as an anisotropic conductive member, is attached to the substrate 400 where electrode portions 410 are formed, and the component 440 is mounted on the substrate 400 via the ACF 430. In this embodiment, the component mounting system 1 (more specifically, the mounting device 100) heat-presses the component 440 to the substrate 400 via the ACF 430.

[0074] The substrate 400 is a display panel such as a liquid crystal display panel or an organic EL panel. In this embodiment, the substrate 400 is a light-transmitting (more specifically, transparent) substrate.

[0075] The electrode section 410 is, for example, composed of electrodes.

[0076] Component 440 is, for example, an electronic component having a drive circuit, and examples include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

[0077] The component installation system 1 includes an installation device 100, an inspection device 200, and a control device 300.

[0078] The mounting device 100 is a device (system) for mounting the component 440 onto the substrate 400. In this embodiment, the mounting device 100 heat-presses the component 440 onto the substrate 400. Specifically, the mounting device 100 uses a mark 420 provided on the substrate 400 and a mark 421 provided on the back of the component 440 (see reference). Figure 4 After placing (pre-pressing) component 440 onto substrate 400, the pre-pressed component 440 is then heat-pressed (formally pressed) onto substrate 400.

[0079] The mounting apparatus 100 includes a substrate loading section 10, an attachment section 20, a pre-pressing section 30, a final pressing section 40, a substrate unloading section 50, and a transport section 60. The substrate loading section 10, attachment section 20, pre-pressing section 30, final pressing section 40, and substrate unloading section 50 are connected in this order. The mounting apparatus 100 performs a component mounting process (component pressing process), in which a component 440 is mounted (in this embodiment, pre-pressed and final pressed) to an electrode section 410 located at the periphery of the substrate 400, which is loaded by the substrate loading section 10 upstream of the transport substrate 400. The substrate 400 with the component 440 mounted is transported to the substrate unloading section 50 and then unloaded from the substrate unloading section 50 to the inspection apparatus 200.

[0080] The substrate loading section 10 includes a worktable 11 provided on the base 1a. A substrate 400 on which an electrode section 410 is formed is placed on the worktable 11.

[0081] The attachment section 20 is an apparatus for attaching (adheding) ACF 430, which serves as an adhesive member, to the electrode section 410 of the substrate 400. The attachment section 20 includes a worktable 21, a worktable moving section 22, and an attachment mechanism 23.

[0082] Workbench 21 is a workbench that holds the substrate 400 transported from workbench 11.

[0083] The table movement unit 22 is a mechanism for moving the substrate 400 placed on the table 21. The table movement unit 22 may include, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, and a Z-axis table movable in the Z-axis direction. The table movement unit 22 moves the substrate 400 placed on the table 21 via the X-axis table, the Y-axis table, and the Z-axis table.

[0084] The attachment mechanism 23 is a device for attaching ACF 430 to the electrode portion 410 of the substrate 400. The attachment mechanism 23 includes, for example, a supply section for supplying ACF 430 and an attachment tool for attaching the ACF 430 to the substrate 400. The attachment tool is, for example, disposed above the base 1b and has an attachment head for attaching the ACF 430 supplied from the supply section to a position corresponding to the electrode portion 410 of the substrate 400.

[0085] The pre-pressing part 30 is a device for performing a pre-pressing process in which the pre-pressing part 440 is placed (more specifically, pre-pressed) at the position where the ACF 430 is attached by the attachment part 20 on the substrate 400.

[0086] The pre-pressing section 30 includes a worktable 31, a worktable moving section 32, a component supply section 33, and a pre-pressing tool 34.

[0087] The worktable 31 is a worktable for placing the substrate 400 with ACF 430 attached.

[0088] The worktable moving part 32 is a mechanism for moving the substrate 400. The worktable moving part 32 may include, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, and a Z-axis table that is movable in the Z-axis direction.

[0089] The worktable moving part 32 has the same structure as the worktable moving part 22 of the attachment part 20. It holds the substrate 400 by means of the X-axis table, the Y-axis table and the Z-axis table, and has the functions of moving it in the horizontal plane, lifting it in the vertical direction and rotating it around the Z-axis.

[0090] The component supply unit 33 is a mechanism for supplying component 440 to the pre-pressing tool 34.

[0091] The pre-crimping tool 34 is a device for placing the component 440 on the substrate 400 via the ACF 430. The pre-crimping tool 34 has components mounted on the base 1b. Figure 3 The mounting head 35 shown, and the device for moving the mounting head 35 Figure 3 The shown head-mounted moving mechanism 36 Figure 3 The image unit 37 and the mounting support stage (so-called spare worktable) for supporting the substrate 400 are shown.

[0092] The mounting head 35 is used to pick up (adsorb) the component 440 and place the picked-up component 440 on the substrate 400.

[0093] The mounting head moving mechanism 36 is a device for moving the mounting head 35. The mounting head moving mechanism 36 is implemented, for example, by a motor and a guide for moving the mounting head 35.

[0094] The camera unit 37 is a camera that captures images of the substrate 400 and the component 440, so that the mounting head 35 can place the component 440 on the substrate 400 in an appropriate position.

[0095] The mounting head 35 moves freely in the horizontal plane and rises and falls in the Z-axis direction via the mounting head moving mechanism 36, picking up the component 440 supplied by the component supply unit 33 from above. The pre-pressing tool 34 uses information obtained from the camera unit 37 to place the component 440 picked up by the mounting head 35 onto the ACF 430, and presses it together with the substrate 400 onto the mounting support table, thereby placing the component 440 on the substrate 400.

[0096] The formal pressing section 40 is an apparatus that performs the formal pressing process (i.e., the hot pressing process), in which the component 440 placed on the substrate 400 by the pre-pressing section 30 is formally pressed (i.e., hot-pressed) onto the substrate 400.

[0097] Thus, the electrode portion 410 and component 440 formed on the substrate 400 are electrically connected via ACF 430.

[0098] The formal crimping unit 40 includes a worktable 41, a worktable moving part 42, and a formal crimping tool 43.

[0099] The worktable 41 is a worktable on which a substrate 400 with a component 440 pre-pressed is placed.

[0100] The worktable moving part 42 has the same structure as the worktable moving part 22 of the attaching part 20. It holds the substrate 400 by means of the X-axis table, the Y-axis table, and the Z-axis table, and has the functions of moving it in the horizontal plane, lifting it in the vertical direction, and rotating it about the Z-axis. For example, the worktable moving part 42 moves the substrate 400 held by the worktable 41 in a given direction, thereby moving the substrate 400 on which the component 440 is placed at the component pressing position where the component 440 is heat-pressed.

[0101] The formal crimping tool 43 is a mechanism for thermally crimping the component 440 to the substrate 400. The formal crimping tool 43 includes, for example, a crimping head and a heater for heating the crimping head. The formal crimping tool 43 performs thermal crimping by pressing the component 440 onto the substrate 400 via the heated crimping head through the ACF 430 while heating it.

[0102] The substrate removal unit 50 includes a worktable 51 placed on the base 1c. On the worktable 51, the substrate 400 transported from the formal pressing unit 40 is held. The substrate 400 held in the substrate removal unit 50 is moved out to the inspection device 200 located downstream of the mounting device 100.

[0103] The transport unit 60 is a device for transporting the substrate 400. Specifically, the transport unit 60 transports the substrate 400, which has been brought into the substrate loading unit 10, to the attachment unit 20, the pre-pressing unit 30, the final pressing unit 40, and the substrate unloading unit 50 in this order between a given work unit. The transport unit 60 is disposed in the front region (negative Y-axis direction side) of the attachment unit 20, the pre-pressing unit 30, and the final pressing unit 40.

[0104] The transport unit 60 has a substrate transport mechanism 62A, substrate transport mechanism 62B, substrate transport mechanism 62C and substrate transport mechanism 62D sequentially mounted on a movable base 61 that spans base 1a, base 1b and base 1c in the X-axis direction.

[0105] The substrate handling mechanisms 62A to 62D each have a base 63 and one or more arm units 64. In this embodiment, an example is shown where each of the substrate handling mechanisms 62A to 62D has two arm units 64.

[0106] A base 63 is mounted on a movable base 61 and can move freely in the X-axis direction. Two arm units 64 are arranged side-by-side in the X-axis direction on the base 63. In each arm unit 64, one or more arm-shaped suction nozzles extending horizontally are arranged side-by-side in the X-axis direction, and each arm is provided with a suction cup with its suction surface facing downwards. The arm unit 64 adsorbs the substrate 400 from above via the suction cups provided on the suction nozzles, and transports the adsorbed substrate 400.

[0107] For example, substrate transport mechanism 62A receives substrate 400 placed on worktable 11 of substrate loading section 10 and transfers it to worktable 21 of attachment section 20. Furthermore, substrate transport mechanism 62B receives substrate 400 from worktable 21 of attachment section 20 and transfers it to worktable 31 of pre-pressing section 30. Furthermore, substrate transport mechanism 62C receives substrate 400 from worktable 31 of pre-pressing section 30 and transfers it to worktable 41 of formal pressing section 40. Furthermore, substrate transport mechanism 62D receives substrate 400 from worktable 41 of formal pressing section 40 and transfers it to worktable 51 of substrate unloading section 50.

[0108] The inspection device 200 is a device for measuring (inspecting) the position of the component 440 mounted on the substrate 400. Specifically, the inspection device 200 measures the positional deviation of the mounted component 440 from a given position. Figure 5 The device 200 is used to check the deviation (L) shown. The checking device 200 is, for example, a computer equipped with a camera. This computer is implemented, for example, through a communication interface for communicating with the camera unit 210 and the control device 300, a non-volatile memory for storing programs, a volatile memory as a temporary storage area for executing programs, input / output ports for transmitting and receiving signals, and a processor for executing programs.

[0109] The inspection device 200 includes a camera unit 210 and a measuring unit 220.

[0110] The camera unit 210 is a camera used to identify the position of the mark 420 on the substrate 400 and the position of the mark 421 on the component 440.

[0111] Figure 4 This is a back view showing the substrate 400 on which the component 440 is mounted. Furthermore, in this embodiment, the substrate 400 is a transparent substrate, therefore... Figure 4 The diagram shows structures such as component 440 located above substrate 400.

[0112] The camera unit 210 generates an image including the mark 420 provided on the substrate 400 and the mark 421 provided on the component 440 by photographing the substrate 400 from the lower side of the substrate 400.

[0113] The measurement unit 220 is a processing unit that measures (inspects) the position of the component 440 mounted on the substrate 400 based on the image generated by the camera unit 210.

[0114] Figure 5 This is a graph used to illustrate the deviation L measured by the inspection device 200 according to the embodiment. Figure 5 For example, a diagram schematically showing an example of an image generated by the camera unit 210.

[0115] For example, the control device 300 places the component 440 on the substrate 400 by controlling the pre-pressing portion 30. Here, when the substrate 400 is placed with the component 440, the position of the component 440 relative to the substrate 400 may sometimes deviate from the desired position.

[0116] For example, the control device 300 controls the pre-compression joint 30 to... Figure 5 The component 440 is placed on the substrate 400 in such a way that the mark 421 overlaps with the given position 450. However, in practice, when the component 440 is placed on the substrate 400, the mark 421 may sometimes deviate from the given position 450. In particular, in this embodiment, after the pre-pressing portion 30 places the component 440 on the substrate 400, the formal pressing portion 40 formally presses the component 440 onto the substrate 400. Therefore, even if the pre-pressing portion 30 properly places the component 440 on the substrate 400, the component 440 may sometimes deviate relative to the substrate 400 when the formal pressing portion 40 formally presses the component 440 onto the substrate 400.

[0117] The measuring unit 220 measures, for example, the deviation L (e.g., distance) between the marker 421 and the given position 450 based on the image generated by the camera unit 210.

[0118] The measuring unit 220 outputs information indicating the measured deviation L to the control device 300.

[0119] For example, in component mounting system 1, components 440 are sequentially mounted (pre-pressed and final-pressed) on multiple substrates 400. The camera unit 210 generates images by sequentially capturing images of the multiple substrates 400 on which components 440 are mounted, and outputs the generated images sequentially to the measurement unit 220. The measurement unit 220 calculates the deviation amount L sequentially based on the acquired images, and outputs the calculated deviation amount L sequentially to the control device 300.

[0120] In addition, when the measuring unit 220 acquires two or more images from the imaging unit 210, it can also calculate two or more deviations L based on each of the two or more images, and output the calculated two or more deviations to the control device 300.

[0121] The measuring unit 220 is implemented, for example, by a control program stored in a memory provided by the inspection device 200 and representing the processing steps performed by the measuring unit 220, a CPU (Central Processing Unit) that executes the control program, and a communication interface for acquiring images from the camera unit 210 and sending the deviation amount L to the control device 300.

[0122] The control device 300 is a computer that controls the operation of each device in the mounting apparatus 100. Specifically, the control device 300 is communicatively connected to each device in the mounting apparatus 100, such as the attachment section 20, pre-pressing section 30, final pressing section 40, and transport section 60, via control lines (not shown), and controls the operation and timing of each device. For example, the control device 300 controls the attachment section 20, pre-pressing section 30, and final pressing section 40 to perform the aforementioned attachment, pre-pressing, and final pressing operations on the substrate 400, and controls the transport section 60 to perform a substrate transport operation that moves the substrate 400 between the devices in the component mounting system 1 to the next process. The control device 300 synchronously transports the substrate 400 from the upstream side to the downstream side between the devices in the component mounting system 1.

[0123] The control device 300 is implemented, for example, through a communication interface for communicating with the installation device 100 and the inspection device 200, a non-volatile memory for storing programs, a volatile memory for executing programs as a temporary storage area, an input / output port for transmitting and receiving signals, a processor for executing programs, and a display device for displaying images.

[0124] like Figure 2 As shown, the control device 300 includes an acquisition unit 310, a calculation unit 320, a control unit 340, an input unit 330, an output unit 350, a display unit 360, and a storage unit 370.

[0125] The acquisition unit 310 acquires information representing the deviation amount L (hereinafter also simply referred to as the deviation amount L) from the inspection device 200. The acquisition unit 310 is, for example, a communication interface for communicating with the inspection device 200. For example, the acquisition unit 310 acquires the deviation amounts L sequentially output from the inspection device 200 and sequentially outputs the acquired deviation amounts L to the calculation unit 320.

[0126] The calculation unit 320 calculates a correction amount for correcting the mounting position of the component 440 (marked as 421 on the component 440 in this embodiment) mounted on the substrate 400 by the mounting device 100, based on the deviation L from a given position 450, as measured by the inspection device 200. Specifically, the calculation unit 320 calculates a correction amount for correcting the mounting position of the component 440 mounted on the substrate 400, which is the target position of the mounting device 100 when mounting the component 440. More specifically, it calculates a correction amount for correcting the holding position of the holding component 440 and the position of the mounting head 35 when the component 440 is placed on the substrate 400. The correction amount is, for example, a coordinate representing the holding position of the holding component 440, a coordinate representing the position of the mounting head 35 when the component 440 is placed on the substrate 400, and a value representing the direction and amount (distance) of movement of the mounting head 35 by the mounting head moving mechanism 36.

[0127] The calculation unit 320 calculates a correction amount, for example, based on the deviation amount L in one substrate 400. Next, the calculation unit 320 calculates the correction amount again, for example, based on the calculated correction amount and the deviation amounts L in other substrates 400. For example, the calculation unit 320 calculates the average of the deviation amount L in one substrate 400 and the deviation amounts L in other substrates 400, and calculates the correction amount based on the calculated average. Alternatively, for example, the calculation unit 320 calculates the average of the correction amount calculated based on the deviation amount L in one substrate 400 and the correction amounts calculated based on the deviation amounts L in other substrates 400, as a new correction amount.

[0128] Thus, the calculation unit 320 recalculates (corrects) the correction amount sequentially based on the deviation amount L sequentially acquired by the acquisition unit 310. The calculation unit 320 outputs information representing the calculated correction amount to the control unit 340 and the display unit 360.

[0129] In this embodiment, the mounting apparatus 100 includes: a pre-pressing section 30 for placing a component 440 on a substrate 400; and a formal pressing section 40 for thermally pressing the component 440, which is placed on the substrate 400 by the pre-pressing section 30, onto the substrate 400. The calculation unit 320 corrects the placement position of the component 440 on the substrate 400 by the pre-pressing section 30 based on the deviation amount L measured by the inspection device 200, thereby calculating a correction amount for correcting the mounting position according to each type of substrate 400.

[0130] The input unit 330 accepts input for calibrating the mounting device 100 to the mounting position. The input unit 330 is, for example, a user interface such as a touch screen that accepts operator input, and accepts input (information) for calibrating the mounting device 100 to the mounting position by accepting operator input.

[0131] Alternatively, the input unit 330 can also be implemented through a communication interface or the like for acquiring information from a user interface such as a touchscreen.

[0132] The control unit 340 is a processing unit that controls the operation of the mounting device 100 via the output unit 350. For example, the control unit 340 determines the positions of markers 420 and 421 by performing image analysis on the image generated by the imaging unit 37, and determines the position of the mounting member 440 in the substrate 400 based on the determined positions of markers 420 and 421. More specifically, the control unit 340 determines the position of the mounting head 35 holding the member 440 based on the determined positions of markers 420 and 421. The control device 300 controls the pre-pressing unit 30 to place the member 440 on the substrate 400 at the determined position of the mounting member 440 in the substrate 400.

[0133] In addition, the control unit 340 determines whether the input unit 330 has received input during the period before the number of processing blocks of the component 440 mounted on the substrate 400 by the mounting device 100 reaches a given number.

[0134] Here, the term "given number of blocks" refers to a quantity arbitrarily determined in advance, and information indicating the given number of blocks is stored, for example, in the storage unit 370. The number of processed blocks refers to the number of components 440 mounted on the substrate 400 by the mounting device 100. More specifically, the number of processed blocks refers to the number of components 440 placed on the substrate 400 by the pre-pressing section 30.

[0135] Furthermore, for example, the "not reached" period refers to the period from the start of the mounting process of the mounting device 100 mounting the component 440 onto the substrate 400, or from the start of the mounting device 100 correcting the mounting position by the control unit 340, until the number of processed blocks reaches a given number. That is, for example, the number of processed blocks refers to the number of substrates 400 on which the mounting device 100 has mounted the component 440, from the start of the mounting process of the mounting device 100 mounting the component 440 onto the substrate 400, or from the start of the mounting device 100 correcting the mounting position by the control unit 340. Furthermore, for example, the "not reached" period refers to the period before the number of processed blocks on which the mounting device 100 has mounted the component 440 onto the substrate 400 reaches a given number.

[0136] When the control unit 340 determines that the input unit 330 has received input, it causes the mounting device 100 to correct the mounting position based on a first correction amount, which is calculated by the calculation unit 320 based on the deviation amount L measured by the inspection device 200 from each of the processed substrates 400. On the other hand, when the control unit 340 determines that the input unit 330 has not received input, it causes the mounting device 100 to mount the member 440 on a given number of substrates 400 and corrects the mounting position based on a second correction amount, which is calculated by the calculation unit 320 based on the deviation amount L measured by the inspection device 200 from each of the given number of substrates 400.

[0137] In this embodiment, the control unit 340 corrects (changes) the operation of the mounting head moving mechanism 36 based on the first correction amount or the second correction amount, so that the position of the mounting head 35 when the pre-pressing part 30 places the component 440 on the substrate 400 is corrected (changed).

[0138] Thus, when the number of processed blocks reaches a given number, the control unit 340 causes the pre-pressing unit 30 to correct the mounting position based on the correction amount (first correction amount) calculated by the calculation unit 320 based on each deviation L (first deviation) in the substrate 400 of the given number of blocks. On the other hand, even if the number of processed blocks has not reached the given number, if the input unit 330 receives an input indicating that the operator has made an instruction to correct the mounting position, the control unit 340 also causes the pre-pressing unit 30 to correct the mounting position based on the correction amount (second correction amount) calculated by the calculation unit 320 based on each deviation L (second deviation) in the substrate 400 of the processed number of blocks.

[0139] The output unit 350 is a communication interface for outputting information representing the processing performed by the control unit 340 to the control device 300.

[0140] The computing unit 320 and the control unit 340 are implemented, for example, by a control program stored in the storage unit 370 that represents the processing steps executed by the computing unit 320 and the control unit 340 respectively, and a CPU that executes the control program.

[0141] Furthermore, the computing unit 320 and the control unit 340 can be implemented using a single CPU or using different CPUs.

[0142] Display unit 360 is a display device that displays deviation information based on deviation amount L. Specifically, display unit 360 displays deviation information based on deviation amount L used by calculation unit 320 when calculating correction amount. Thus, display unit 360 displays deviation information based on deviation amount L, i.e., deviation information, as information for determining whether the operator needs to correct the installation position. In addition, display unit 360 can also display correction information indicating the correction amount calculated by calculation unit 320 based on deviation amount L.

[0143] The display unit 360 is, for example, a display device such as a liquid crystal display or an organic EL display. Alternatively, the display unit 360 may be implemented by a processing unit that displays deviation information on an external display device and a communication interface for communicating with the external display device.

[0144] The storage unit 370 stores various data required for each process, such as the size of the substrate 400, the type of component 440, the mounting (attachment of the ACF 430 and placement and pressing of the component 440), the mounting direction, and the timing of moving the substrate 400 between devices, as well as the control programs executed by each processing unit of the control device 300. The storage unit 370 is implemented using ROM (Read Only Memory) or RAM (Random Access Memory).

[0145] [Processing Steps]

[0146] Next, the processing steps of the component mounting system 1 according to the embodiment will be described in detail.

[0147] Figure 6 This is a flowchart illustrating the processing steps of the component mounting system 1 according to the implementation method.

[0148] First, the mounting device 100 mounts the component 440 onto the substrate 400 (step S101). In this embodiment, in step S101, the pre-pressing part 30 places the component 440 onto the substrate 400, and the formal pressing part 40 performs thermal pressing on the component 440 onto the substrate 400.

[0149] Next, the inspection device 200 measures the deviation L of the position of the component 440 in the substrate 400 from a given position (step S102). For example, the inspection device 200 generates an image by taking a picture of the substrate 400 with the component 440 mounted, and based on the generated image, for example, as... Figure 5 As shown, the deviation L between the mark 421 set on component 440 and the given position 450 is measured. The inspection device 200 outputs the measured deviation L to the control device 300 in sequence.

[0150] Next, the calculation unit 320 calculates a correction amount (step S103) based on the deviation amount L measured by the inspection device 200 to correct the position of the mounting device 100 on the mounting member 440 on the substrate 400, i.e., the mounting position. The calculation unit 320 may also count the number of processing blocks of the mounting device 100 each time the correction amount is calculated.

[0151] Next, the display unit 360 displays deviation information based on the deviation amount L (step S104). For example, if the number of processed blocks has not reached a given number of blocks, the display unit 360 displays the average value of the deviation amount L of the processed blocks as deviation information. Of course, if the number of processed blocks has reached a given number of blocks, the display unit 360 may also display the average value of the deviation amount L of the given number of blocks as deviation information. Alternatively, the display unit 360 may display the deviation amount L of each processed block and a representative value (e.g., average value or median value) of the deviation amount L used for the correction amount calculated based on the deviation amount L of each processed block. Alternatively, the display unit 360 may also display a time-series graph of the deviation amount L (a graph showing time on the horizontal axis and the time progression of the deviation amount L on the vertical axis).

[0152] Next, the control unit 340 determines whether the number of processing blocks on which the mounting device 100 has mounted the component 440 on the substrate 400 has reached a given number of blocks (step S105).

[0153] If the control unit 340 determines that the number of processing blocks in which the mounting device 100 has mounted the component 440 on the substrate 400 has not reached the given number of blocks (No in step S105), it determines whether the input unit 330 has received, for example, an input from an operator to correct the mounting position of the mounting device 100 mounting the component 440 on the substrate 400 (step S106). Thus, during the period before the given number of processing blocks is reached (i.e., in the case of No in step S105), the control unit 340 determines whether the input unit 330 has received an input to correct the mounting position of the mounting device 100.

[0154] If the control unit 340 determines that the input unit 330 has not received any input (No in step S106), the processing returns to step S101.

[0155] On the other hand, when the control unit 340 determines that the input unit 330 has received an input (Yes in step S106), it causes the mounting device 100 to correct the mounting position based on a correction amount (first correction amount) (step S107). This correction amount (first correction amount) is calculated by the calculation unit 320 based on the deviation amount L measured from each of the substrates 400 in the number of processing blocks of the mounting device 100.

[0156] Furthermore, when the control unit 340 determines that the number of processing blocks on which the mounting device 100 has mounted the component 440 on the substrate 400 has reached a given number (in step S105), it causes the mounting device 100 to correct the mounting position based on a correction amount (second correction amount) (step S108). This correction amount (second correction amount) is a correction amount based on the deviation amount L measured from each substrate 400 in the given number of substrates 400.

[0157] After step S107 or S108, that is, after the control unit 340 corrects the mounting position of the mounting device 100, the count of the number of processed blocks on the substrate 400 where the mounting device 100 has mounted the component 440 is initialized (step S109) (i.e., set to zero), and the process returns to step S101. Thus, the control unit 340 can determine in step S104 whether the period has not been reached. The period before the given number of processed blocks is reached, either from the start of the mounting process where the mounting device 100 begins mounting the component 440 on the substrate 400, or from the start of the control unit 340 correcting the mounting position of the mounting device 100.

[0158] [Effects, etc.]

[0159] As described above, the component mounting system 1 according to the embodiment includes: a mounting device 100 for mounting a component 440 on a substrate 400; a calculation unit 320 for calculating a correction amount for causing the mounting device 100 to correct the mounting position of the component 440 mounted on the substrate 400 on the substrate 400 based on a deviation L between the position of the component 440 mounted by the mounting device 100 to a given position; a control unit 340 for causing the mounting device 100 to correct the mounting position based on the correction amount calculated by the calculation unit 320; and an input unit 330 for receiving input for causing the mounting device 100 to correct the mounting position. The control unit 340 determines whether the input unit 330 has received input during a period before the number of processing blocks on the substrate 400 where the component 440 is mounted by the mounting device 100 reaches a given number of blocks. When the control unit 340 determines that the input unit 330 has received input, it causes the mounting device 100 to correct the mounting position based on a first correction amount, which is calculated by the calculation unit 320 based on the deviation amount L measured from each of the processed substrates 400. Conversely, when the control unit 340 determines that the input unit 330 has not received input, it causes the mounting device 100 to mount the member 440 on a given number of substrates 400 and corrects the mounting position based on a second correction amount, which is calculated by the calculation unit 320 based on the deviation amount L measured from each of the given number of substrates 400. In this embodiment, the control unit 340 corrects the mounting position of the mounting device 100 by causing the pre-pressing unit 30 to correct the placement position of the member in the pre-pressing unit 30.

[0160] Accordingly, the control unit 340 can automatically correct the mounting position based on a correction value calculated from the deviation L measured for each of the given number of substrates 400 (e.g., calculated based on the same number of deviations L as the given number of substrates). Furthermore, even if the number of processed substrates has not reached the given number, the mounting unit 100 can correct the mounting position at the moment the operator makes a judgment. For example, in the case where the mounting unit 100 initially performs the installation of component 440, the deviation L is initially assumed to be large. In such a case, even if the number of processed substrates has not reached the given number, i.e., even if the sample size used to calculate the correction amount is small, early correction of the mounting position can sometimes suppress a decrease in yield. Therefore, according to the component mounting system 1, the mounting unit 100 can correct the mounting position at the moment the operator makes a judgment, thereby suppressing a decrease in yield.

[0161] In addition, for example, the component mounting system 1 also includes a display unit 360, which displays deviation information based on the deviation amount L.

[0162] Based on this, the operator can confirm the deviation information displayed on the display unit 360. Therefore, the operator can easily determine whether the timing for correcting the installation position of the mounting device 100 is appropriate. Thus, by using the display unit 360, the decline in yield can be further suppressed.

[0163] Furthermore, for example, the number of processed blocks refers to the number of substrates 400 on which the mounting device 100 has mounted the component 440 since the mounting process of mounting the component 440 on the substrate 400 begins (step S101) from the start of the mounting process of mounting the component 440 on the substrate 400 from the start of the mounting process of mounting the component 440 on the substrate 400 from the start of the mounting process of the mounting device 100 correcting the mounting position (step S107) from the start of the control unit 340. Additionally, for example, the period before the number of processed blocks reaches a given number of blocks.

[0164] Accordingly, the installation device 100 can automatically correct the installation position based on the correction amount calculated according to an appropriate number of samples, and the installation device 100 can correct the installation position when the operator makes a judgment, thereby suppressing the decline in yield.

[0165] Furthermore, the component mounting method according to the embodiment mounts a component 440 onto a substrate 400 using a mounting device 100 (step S101). Based on the deviation L between the position of the component 440 mounted by the mounting device 100 onto the substrate 400 and a given position, a correction amount is calculated to correct the mounting position of the component 440 mounted by the mounting device 100 on the substrate 400 (step S103). During the period before the correction is reached (Yes in step S105), it is determined whether an input to correct the mounting position of the mounting device 100 has been received (step S106). The period before the correction is reached is the period before the number of processing blocks on which the mounting device 100 has mounted the component 440 onto the substrate 400 reaches a given number. If it is determined that an input has been received ( In step S106, the mounting device 100 is corrected for the mounting position based on the first correction amount (step S107). The first correction amount is calculated based on the deviation amount L measured from each of the processed substrates 400. If it is determined that no input has been received (in step S106), the mounting device 100 is mounted on the given number of substrates 400. That is, steps S101 to S106 are repeatedly executed until it is determined to be yes in step S105. The mounting device 100 is corrected for the mounting position based on the second correction amount (step S108). The second correction amount is calculated based on the deviation amount L measured from each of the given number of substrates 400.

[0166] Accordingly, the same effect as component mounting system 1 is achieved.

[0167] (Other implementation methods)

[0168] The component installation system and the like involved in this embodiment have been described above based on the above embodiments, but the present invention is not limited to the above embodiments.

[0169] For example, the substrate 400 is light-transmitting and has a mark 420 on its upper surface. Therefore, the mark 420 can be captured even when the camera unit 210 is shooting from below the substrate 400. Of course, the substrate 400 may also have the mark 420 on its lower surface. In this case, the substrate 400 may or may not be light-transmitting.

[0170] Furthermore, for example, in the above embodiments, all or part of the components of the control device 300 may be constructed by dedicated hardware, or may be implemented by executing software programs suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing software programs stored in a storage medium such as an HDD (Hard Disk Drive) or semiconductor memory.

[0171] Furthermore, the control device 300 can also be composed of one or more electronic circuits. These electronic circuits can be either general-purpose or dedicated circuits.

[0172] In one or more electronic circuits, semiconductor devices, integrated circuits (ICs), or large-scale integrated circuits (LSIs) may also be included. ICs or LSIs can be integrated into a single chip or multiple chips. Although referred to as ICs or LSIs here, the terminology varies depending on the degree of integration and may also be called system LSIs, very large-scale integrated circuits (VLSIs), or ultra-large-scale integrated circuits (ULSIs). Furthermore, field-programmable gate arrays (FPGAs) programmed after LSI fabrication can also be used for the same purpose.

[0173] Furthermore, the present invention also includes various modifications conceived by those skilled in the art to the various embodiments, and the implementation by arbitrarily combining the constituent elements and functions of the various embodiments without departing from the spirit of the present invention.

[0174] Industrial availability

[0175] The present invention can be used in a component mounting system for producing display panels and the like by mounting components on a substrate.

Claims

1. A component mounting system, comprising: Mounting device for mounting components on a substrate; The calculation unit calculates a correction amount for the mounting device to correct the mounting position of the mounting device on the substrate mounting component based on the deviation of the position of the component mounted on the substrate by the mounting device from a given position. The control unit, based on the correction amount, causes the mounting device to correct the mounting position; and The input unit accepts input for correcting the mounting device to the mounting position. The control unit determines whether the input unit has received the input during a period in which the number of processed blocks of components mounted on the substrate reaches a given number. If the input unit determines that the input has been received, the control unit causes the mounting device to correct the mounting position based on a first correction amount, which is calculated by the calculation unit based on the deviation amount measured from each of the processed substrates. If it is determined that the input unit has not received the input, the control unit causes the mounting device to mount the component on the given number of substrates, and causes the mounting device to correct the mounting position based on a second correction amount, which is calculated by the calculation unit based on the deviation amount measured from each of the given number of substrates.

2. The component mounting system according to claim 1, wherein, It also includes a display unit that displays deviation information based on the deviation amount.

3. The component mounting system according to claim 1 or 2, wherein, The number of processing blocks refers to the number of substrates on which the mounting device has mounted components, either from the start of the mounting process of the substrate mounting component by the mounting device or from the start of the control unit causing the mounting device to correct the mounting position. The unreached period is the period before the number of processed blocks reaches the given number of blocks.

4. A method for installing a component, comprising: Components are mounted on a substrate using a mounting device; Based on the deviation of the position of the component mounted to the substrate by the mounting device from a given position, a correction amount is calculated to enable the mounting device to correct the mounting position of the mounting device on the substrate mounting component. During the period before the target is reached, it is determined whether an input for correcting the mounting position by the mounting device is received. The period before the target is reached is the period before the number of processed blocks of components mounted on the substrate reaches a given number. If the input is determined to have been received, the mounting device is adjusted to adjust the mounting position based on a first adjustment amount, which is calculated based on the deviation measured from each of the substrates in the number of processing blocks. and If it is determined that the input has not been received, the mounting device mounts the component on the given number of substrates and corrects the mounting position based on a second correction amount, which is calculated based on the deviation amount measured from each of the given number of substrates.

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