Open spaceborne SAR array panel power supply and assembly method thereof

Abstract

The application discloses an open type spaceborne SAR array surface power supply and an assembling method thereof, and the array surface power supply comprises a cover plate, a frame and a bottom plate; the cover plate, the bottom plate and the frame are connected through fasteners; a small supporting plate and a large supporting plate are integrally arranged in the frame; a power transformer and a power inductor are assembled on the front surface of the small supporting plate and the large supporting plate; a printed board is further assembled in the frame, and the printed board is located in the same plane as the small supporting plate and the large supporting plate; all components except the power transformer and the power inductor are arranged on the printed board. In the application, the main components in the single machine are arranged on the board and are double-sidedly distributed, the volume and weight of the single machine are reduced to half of the traditional design under the premise of solving the space environment heat dissipation problem; the open type structure design is adopted, the surface-mounted test pads are introduced on the back of the printed board, and great convenience is brought to the batch production and debugging of the product.

Description

Technical Field

[0001] This invention belongs to the field of power system technology, and particularly relates to an open-type spaceborne SAR array power supply and its assembly method. Background Technology

[0002] A spaceborne SAR array power supply is a device that supplies power to the SAR antenna array of a satellite payload, converting the DC power provided by the satellite's batteries into a regulated power supply for the electrical equipment on the antenna array. Traditional spaceborne SAR array power supplies are designed with different functionalities and heat generation levels in separate sections. Control, protection, and detection circuits are housed on separate PCBs, while heat-generating components such as switching transistors and rectifier diodes are mounted on separate ceramic plates fixed to the housing. The PCB is then mounted on top of the ceramic plates, and the two are interconnected via wires. While this traditional design solved the heat dissipation problem in the space environment, it resulted in a large and heavy unit, and the complex internal structure and interconnections made manufacturing difficult and required extensive debugging.

[0003] With the development of spaceborne SAR in my country, the power equipment on the antenna array faces increasingly stringent requirements for miniaturization and lightweighting. Furthermore, spaceborne SAR antenna arrays are a fully distributed architecture system, and the number of power supply units required for the array increases rapidly with the number of satellites. Therefore, there is an urgent need to improve the traditional design methods for spaceborne SAR array power supplies in order to achieve miniaturization, lightweighting, and facilitate mass production, manufacturing, and debugging.

[0004] Patent application CN114190042A, entitled "High-Power Module Integrated Circuit Device and Assembly Method for Aerospace Power Products," describes a high-power module integrated circuit device for aerospace power supplies. The device features separate ceramic plates for heat-generating components such as switching transistors and rectifiers. The ceramic plates are then assembled with power transformers and power inductors to form a single device. However, the invention does not provide an overall solution that includes control, protection, and detection circuits. These components still require separate board layout, assembly, and interconnection, which is not conducive to reducing size and weight, as well as mass production and debugging. Summary of the Invention

[0005] To address the aforementioned issues, this invention proposes an open-type spaceborne SAR array power supply, comprising, from top to bottom: a cover plate, a frame, and a base plate; the cover plate, base plate, and frame are connected by fasteners; a small support plate and a large support plate are integrally arranged within the frame; a power transformer and a power inductor are mounted on the front of the small and large support plates, and a printed circuit board is also mounted within the frame, with the printed circuit board, small support plate, and large support plate on the same plane; all components except the power transformer and power inductor are respectively mounted on the printed circuit board; heat-generating devices are distributed on the back of the printed circuit board, and heat dissipation protrusions are provided on the base plate at positions corresponding to the heat-generating devices.

[0006] Furthermore, surface mount test pads are distributed on the back of the printed circuit board. The solder mask layer is removed from the surface of the surface mount test pads, and the signals to be monitored are connected to the surface mount test pads through printed lines.

[0007] Furthermore, the signals to be monitored include auxiliary source signals, drive signals, and switching waveform signals.

[0008] Furthermore, a thermally conductive pad is placed between the heat-generating device and the heat dissipation boss; the heat-generating device, the thermally conductive pad, and the heat dissipation boss are attached to each other in sequence.

[0009] Furthermore, the front of the small tray is equipped with a power transformer B and a power inductor B; the front of the large tray is equipped with a power transformer A and a power inductor A.

[0010] Furthermore, the printed circuit board is secured to the fixing holes around the frame; power transformer A, power inductor A, power transformer B, and power inductor B are soldered to the printed circuit board via lead-out enameled wires.

[0011] An open-type spaceborne SAR array power supply assembly method is also provided, the assembly method specifically includes the following steps:

[0012] Step 1: Complete the machining of the cover plate, frame, and base plate according to the structural drawings, and complete the bare board production of the printed circuit board according to the printed circuit board drawing;

[0013] Step 2: Complete the reflow soldering assembly of all components on the printed circuit board;

[0014] Step 3: Flexibly connect the surface-mount test pads on the back of the printed circuit board to the probes of the test station, and bring out the auxiliary source signal and drive signal to the test station to complete the low-voltage signal test at the printed circuit board level.

[0015] Step 4: Secure the printed circuit board, power transformer, and power inductor to the frame first, and then connect them electrically to each other;

[0016] Step 5: Flexibly connect the surface-mount test pads on the back of the printed circuit board to the probes of the test station, and lead the signal to be monitored to the test station to complete the frame-level power signal test.

[0017] Step Six: Measure the actual assembly height of the heating element, mill the height of the heat dissipation boss according to the measured height of the heating element, correct the gap size between the heating element and the heat dissipation boss, and add a thermal pad to the heat dissipation boss; this design introduces a good thermal path between the heating element and the base plate.

[0018] Step 7: Connect the cover plate, bottom plate and frame with fasteners to complete the assembly of the whole machine.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] (1) Low manufacturing difficulty and high yield: The internal layout is simple, the main components are designed on the same board, which reduces internal interconnection, increases the utilization rate of surface-mount components, facilitates automated production and assembly, reduces manufacturing difficulty, and improves yield.

[0021] (2) Facilitates troubleshooting and maintenance: The open structure design is adopted, and all components are assembled on the frame. After the frame is separated from the cover plate and the bottom plate, all components are visible, which facilitates early troubleshooting and later maintenance.

[0022] (3) Miniaturization and lightweighting: The main components are designed on a common board with a double-sided layout. Small-sized surface-mount packages are selected for the components, and the heat-generating devices are placed on the back of the printed circuit board, establishing a good heat path between the surface of the heat-generating devices and the base plate bosses. Under the premise of solving the heat dissipation problem of the space environment, the size and weight of the single unit are reduced to half of the traditional design;

[0023] (4) Facilitates batch non-destructive testing: Surface mount test pads are placed on the back of the printed circuit board. After the frame is separated from the base plate, the surface mount test pads are visible, and both the single board level and the frame level can elastically contact the probes of the test station. The test signal is brought out by contacting the surface mount test pads with the probes, which facilitates batch testing. Moreover, the elastic contact between the surface mount test pads and the probes is non-destructive, which is especially suitable for spaceborne products. Attached Figure Description

[0024] Figure 1 This is a side view structural diagram of the whole machine according to Embodiment 1 of the present invention.

[0025] Figure 2 This is a front view structural diagram of the enclosure frame according to Embodiment 1 of the present invention.

[0026] Figure 3 This is a front view schematic diagram of the array power supply after removing the cover plate according to Embodiment 1 of the present invention.

[0027] Figure 4 This is a schematic diagram of the rear view structure of the array power supply after removing the base plate according to Embodiment 1 of the present invention.

[0028] Figure 5 This is a front view structural diagram of the base plate according to Embodiment 1 of the present invention.

[0029] The labels in the diagram represent the following meanings:

[0030] 1. Cover plate; 2. Frame; 3. Base plate; 4. Small tray; 5. Large tray; 6. Printed circuit board; 7. Power transformer A; 8. Power inductor A; 9. Power transformer B; 10. Power inductor B; 11. Heating element; 12. Surface mount test pad; 13. Heat dissipation boss. Detailed Implementation

[0031] The purpose of this invention is to provide an open-type spaceborne SAR array power supply and its assembly method. The main components of the power supply are designed on a single board with a double-sided layout, reducing the size and weight of the unit to half that of traditional designs while solving the heat dissipation problem in the space environment. Furthermore, this invention employs an open structural design, introducing surface-mount test pads on the back of the PCB board, greatly facilitating mass production and debugging. The array power supply designed using this invention is suitable for spaceborne SAR antenna array power supply systems.

[0032] The embodiments of the present invention will now be described in further detail with reference to the accompanying drawings.

[0033] Various aspects of the invention are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure do not necessarily encompass all aspects of the invention. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed herein are not limited to any particular implementation. Furthermore, some aspects of the invention disclosed may be used alone or in any suitable combination with other aspects of the invention disclosed.

[0034] Example 1

[0035] like Figure 1 , Figure 2 , Figure 3 , Figure 4 ,and Figure 5 As shown, taking an open-type spaceborne SAR array power supply as an example, the array power supply internally includes an input filter, power conversion circuit, output filter circuit, control circuit, and protection circuit. The array power supply, from top to bottom, includes: a cover plate 1, a frame 2, and a base plate 3. The cover plate 1, base plate 3, and frame 2 are connected by fasteners. After separation, all components are visible from the front or back of the frame 2, facilitating assembly, debugging, and maintenance. A small tray 4 and a large tray 5 are integrated within the frame 2. The front of the small tray 4 is equipped with a large-size power transformer B9 and a power inductor B10; the front of the large tray 5 is equipped with a large-size power transformer A7 and a power inductor A8.

[0036] The frame 2 also houses a printed circuit board 6, which is located on the same plane as the small tray 4 and the large tray 5. The printed circuit board 6, power transformer A7, power inductor A8, power transformer B9, and power inductor B10 are first fastened to the frame 2 and then electrically connected to each other. The fastening method is as follows: the printed circuit board 6 is fastened to the fixing holes around the frame 2; power transformer A7 and power inductor A8 are fastened to the large tray 5 inside the frame; power transformer B9 and power inductor B10 are fastened to the small tray 4 inside the frame. The electrical connection method is as follows: power transformer A7, power inductor A8, power transformer B9, and power inductor B10 are soldered to the printed circuit board 6 via enameled wire (flat copper strip). In this embodiment, the overall casing features an open design, with all components assembled inside the frame 2. After the frame 2 is separated from the cover plate 1 and the base plate 3, all components are visible, facilitating inspection and replacement. Simultaneously, the open structure also provides convenience for batch non-destructive testing.

[0037] In this embodiment, all components except the power transformer and power inductor are mounted on the printed circuit board 6, preferably using small-size surface mount packages. Non-heat-generating components are mounted on both the front and back sides of the printed circuit board 6, while heat-generating components are mounted on the back side. The double-sided high-density layout of the components on the printed circuit board 6 reduces the overall size and weight of the device while increasing power density.

[0038] like Figure 4 As shown, the back of the printed circuit board 6 is provided with distributed heat-generating devices 11 and surface-mount test pads 12. A heat dissipation boss 13 is provided on the base plate 3 at a position corresponding to the heat-generating device 11, and a thermally conductive pad is placed between the heat-generating device 11 and the heat dissipation boss 13. The height of the heat dissipation boss 13 is milled and corrected according to the measured height of the heat-generating device 11, so that the heat-generating device 11, the thermally conductive pad, and the heat dissipation boss 13 are sequentially fitted together. This design introduces a good heat path between the heat-generating device 11 and the base plate 3, solving the heat dissipation problem caused by the reduction in size and weight.

[0039] The solder mask layer on the surface of the surface-mount test pads 12 on the back of the printed circuit board 6 is removed, and the auxiliary source signals, drive signals, and switch waveform signals to be monitored are connected to the surface-mount test pads 12 through printed lines. After the frame 2 is separated from the cover plate 1 and the base plate 3, the surface-mount test pads 12 are all visible and can be elastically brought into contact with the probes of the test station. The test signals are led out to the test station through the contact between the surface-mount test pads 12 and the probes, which solves the problem of batch non-destructive testing.

[0040] Example 2

[0041] This embodiment provides an assembly method for the open-type spaceborne SAR array power supply according to Embodiment 1, combined with... Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The assembly method specifically includes the following steps:

[0042] Step 1: Complete the machining of cover plate 1, frame 2, and base plate 3 according to the structural drawings, and complete the bare board production of printed circuit board 6 according to the printed circuit board drawing.

[0043] Step 2: Complete the reflow soldering assembly of all components on printed circuit board 6.

[0044] Step 3: Flexibly connect the surface-mount test pad 12 on the back of the printed circuit board 6 to the probe of the test station, and bring out the auxiliary source signal and drive signal to the test station to complete the low-voltage signal test at the printed circuit board level.

[0045] Step 4: Complete the assembly of the five units within frame 2. These five units are: printed circuit board 6, power transformer A7, power inductor A8, power transformer B9, and power inductor B10. First, secure these five units to frame 2, then electrically connect them to each other. The securing methods are as follows: printed circuit board 6 is secured to the fixing holes around frame 2; power transformer A7 and power inductor A8 are secured to the large support plate 5 inside the frame; power transformer B9 and power inductor B10 are secured to the small support plate 4 inside the frame. The electrical connection method is as follows: power transformer A7, power inductor A8, power transformer B9, and power inductor B10 are soldered to printed circuit board 6 via enameled wire (flat copper strip).

[0046] Step 5: Flexibly connect the surface-mount test pad 12 on the back of the printed circuit board 6 to the probe of the test station, and lead the switching waveform signal to the test station to complete the frame-level power signal test.

[0047] Step Six: Measure the actual assembly height of the heating element 11. Based on the measured height of the heating element 11, mill the height of the heat dissipation boss 13, correct the gap between the heating element 11 and the heat dissipation boss 13, and add a thermally conductive pad to the heat dissipation boss 13. This design introduces a good thermal path between the heating element 11 and the base plate 3.

[0048] The heat dissipation boss 13 needs to reserve a height for matching. First, calculate the basic size of the boss height based on the theoretical height of the device, and then calculate the height increase of each boss by 0.5mm to 1mm based on the height tolerance of different devices and the assembly and welding tolerance.

[0049] Step 7: Connect the cover plate 1, the bottom plate 3, and the frame 2 with fasteners to complete the assembly of the whole machine.

[0050] Step 8: Complete the overall electrical performance test of the array power supply and other related environmental tests.

[0051] Compared with the prior art, the present invention has the following advantages:

[0052] (1) Low manufacturing difficulty and high yield: The internal layout is simple, the main components adopt a common board design, which reduces internal interconnection, increases the utilization rate of surface-mount components, facilitates automated production and assembly, reduces manufacturing difficulty, and improves yield.

[0053] (2) Facilitates troubleshooting and maintenance: The open structure design is adopted, and all components are assembled on the frame. After the frame is separated from the cover plate and the bottom plate, all components are visible, which facilitates early troubleshooting and later maintenance.

[0054] (3) Miniaturization and lightweight: The main components adopt a common board design and double-sided layout method. The components are selected with small-size surface mount packages. The heat-generating devices are placed on the back of the printed circuit board. A good heat path is established between the surface of the heat-generating devices and the bottom plate boss. Under the premise of solving the heat dissipation problem of the space environment, the volume and weight of the single unit are reduced to half of the traditional design.

[0055] (4) Facilitates batch non-destructive testing: Surface-mount test pads are placed on the back of the printed circuit board. After the frame is separated from the base plate, the surface-mount test pads are visible. Both the single-board level and the frame level can be elastically contacted with the probes of the test station. The test signal is brought out by contact between the surface-mount test pads and the probes, which facilitates batch testing. Moreover, the elastic contact between the surface-mount test pads and the probes is non-destructive, which is especially suitable for spaceborne products.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An open-type spaceborne SAR array power supply, characterized in that, From top to bottom, it includes: cover plate (1), frame (2) and bottom plate (3); cover plate (1), bottom plate (3) and frame (2) are connected by fasteners; small tray (4) and large tray (5) are integrated inside the frame (2); power transformer and power inductor are mounted on the front of small tray (4) and large tray (5), and printed circuit board (6) is also mounted inside the frame (2), and printed circuit board (6) is located on the same plane as small tray (4) and large tray (5); except for power transformer and power inductor, all other components are respectively mounted on printed circuit board (6); heating device (11) is distributed on the back of printed circuit board (6), and heat dissipation boss (13) is provided on the bottom plate (3) at the position corresponding to the heating device (11); The heat-generating device (11) is a small-sized surface-mount package with top heat dissipation. A thermal pad is placed between the heat-generating device (11) and the heat dissipation boss (13). The heat-generating device (11), the thermal pad and the heat dissipation boss (13) are attached to each other in sequence.

2. The open-type spaceborne SAR array power supply according to claim 1, characterized in that, The back of the printed circuit board (6) is also provided with surface-mount test pads (12) distributed in a manner. The solder mask layer is removed from the surface of the surface-mount test pads (12), and the signal to be monitored is connected to the surface-mount test pads (12) through the printed lines.

3. The open-type spaceborne SAR array power supply according to claim 2, characterized in that, The signals to be monitored include auxiliary source signals, drive signals, and switching waveform signals.

4. The open-type spaceborne SAR array power supply according to claim 3, characterized in that, The front of the small tray (4) is equipped with a power transformer B (9) and a power inductor B (10); the front of the large tray (5) is equipped with a power transformer A (7) and a power inductor A (8).

5. The open-type spaceborne SAR array power supply according to claim 4, characterized in that, The printed circuit board (6) is fastened to the fixing holes around the frame (2); the power transformer A (7), power inductor A (8), power transformer B (9), and power inductor B (10) are soldered to the printed circuit board (6) through lead-out enameled wires.

6. An open-type spaceborne SAR array power supply assembly method, characterized in that, The open-type spaceborne SAR array power supply is the open-type spaceborne SAR array power supply according to any one of claims 1-5, and the assembly method specifically includes the following steps: Step 1: Complete the machining of cover plate (1), frame (2), and base plate (3) according to the structural drawings, and complete the bare board production of printed circuit board (6) according to the printed circuit board drawing; Step 2: Complete the reflow soldering assembly of all components on the printed circuit board (6); Step 3: Flexibly connect the surface-mount test pad (12) on the back of the printed circuit board (6) to the probe of the test station, and bring out the auxiliary source signal and drive signal to the test station to complete the weak current signal test at the printed circuit board level. Step 4: Secure the printed circuit board (6), power transformer, and power inductor to the frame (2) first, and then connect them electrically to each other; Step 5: Flexibly bring the surface-mount test pad (12) on the back of the printed circuit board (6) into contact with the probe of the test station, and bring out the signal to be monitored to the test station to complete the frame-level power signal test; Step 6: Measure the actual assembly height of the heating element (11), and mill the height of the heat dissipation boss (13) according to the measured height of the heating element (11). Correct the gap size between the heating element (11) and the heat dissipation boss (13), and add a thermal pad on the heat dissipation boss (13). Through this design, a good thermal path is introduced between the heating element (11) and the base plate (3). Step 7: Connect the cover plate (1), the bottom plate (3) and the frame (2) with fasteners to complete the assembly of the whole machine.

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