Temperature calibration apparatus for a semiconductor wafer thermal processing apparatus

Abstract

The present disclosure provides a temperature calibration device for a semiconductor wafer heat treatment equipment, which comprises a clamp and a temperature calibration tool. The clamp comprises a support and a supporting leg, the support has a through hole, and the supporting leg is fixed to the lower surface of the support. The temperature calibration tool has a probe extending outward, and the probe passes through the through hole of the support. The temperature calibration tool is fixed to the clamp. The clamp and the temperature calibration tool can form a fixed connection structure or be integrally formed. Based on the fixed clamp and the temperature calibration tool, the present disclosure can keep the position of the probe of the temperature detection tool unchanged during the detection process without manual adjustment, so as to obtain accurate and reliable temperature detection results of the temperature detection tool. Moreover, the present disclosure also provides a self-rotating probe, so that the maximum temperature value obtained during the self-rotation process can be taken as the detection result of the current position, and the temperature sensor is calibrated based on the detection result.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor wafer heat treatment technology, and more specifically, to a temperature calibration device for semiconductor wafer heat treatment equipment. Background Technology

[0002] In semiconductor manufacturing processes, rapid thermal processing (RTP) is a heat treatment method with a very fast heating rate, which can greatly reduce heat treatment time and cost. This often requires calibrating the temperature sensors used in the heat treatment equipment to address operational errors.

[0003] Currently, pyrometers are commonly used temperature sensors in semiconductor wafer thermal processing equipment. For example... Figure 3 As shown, a jig is placed on the reflector plate, and a temperature matching tool passing through the jig is used to detect the temperature at different positions on the reflector plate one by one. The temperature detected by the temperature sensor is then calibrated based on the detection results.

[0004] However, there is an unavoidable gap between the temperature calibration tool and the fixture. This gap causes the temperature calibration tool to shake when operated manually. During the shaking process, it is difficult to obtain accurate temperature detection results. The process of adjusting the position and state of the temperature calibration tool leads to a longer detection time. Moreover, the existing solution relies too much on the manual operation experience of technicians, and the results obtained are not reliable and have a large error. Summary of the Invention

[0005] To address the problems of long detection time, excessive reliance on the operational experience of technicians, and low reliability of detection results in existing solutions, this disclosure innovatively provides a temperature calibration device for semiconductor wafer thermal processing equipment.

[0006] To achieve the aforementioned technical objectives, this disclosure provides a temperature calibration device for a semiconductor wafer thermal processing apparatus. The temperature calibration device includes a clamp and a temperature calibration tool. The clamp includes a support and a foot; the support has a through hole, and the foot is fixed to the lower surface of the support. The temperature calibration tool has an outwardly extending probe that passes through the through hole in the support. The temperature calibration tool is fixed to the clamp. The clamp can form a fixed connection structure with the temperature calibration tool, or the clamp and the housing of the temperature calibration tool can be integrally formed.

[0007] The beneficial effects of this disclosure are as follows:

[0008] Based on the mutually fixed clamps and temperature calibration tools, this disclosure ensures that the probe position of the temperature detection tool remains constant during the detection process, eliminating the need for manual adjustment and preventing probe wobbling. This results in accurate and highly reliable temperature detection results. Furthermore, this disclosure provides a self-rotating probe, allowing the maximum temperature value (Max Temp) obtained during rotation to be used as the detection result for the current position, which can then be used to calibrate the temperature sensor.

[0009] The technical solution provided in this disclosure does not require manual adjustment of the position and status of the temperature calibration tool, thus significantly reducing the reliance on the operating experience of technicians, shortening the testing time, and reducing personnel input costs.

[0010] This disclosure also enables sequential or simultaneous calibration of temperatures at multiple locations based on multiple probes set simultaneously. It is evident that this disclosure not only improves the accuracy of the detection results of the temperature calibration tool, but also greatly improves the error calibration efficiency of the temperature sensor used in heat treatment equipment. Attached Figure Description

[0011] Figure 1 A schematic diagram of the longitudinal section of a temperature calibration device, including a fixedly connected clamp and a temperature calibration tool, is shown on a reflector plate.

[0012] Figure 2 A schematic diagram of the longitudinal section of a temperature calibration device, including a one-piece molded fixture and a temperature calibration tool, is shown.

[0013] Figure 3 A schematic diagram illustrating the working principle of existing fixtures and temperature calibration tools is shown.

[0014] In the picture,

[0015] 100. Fixtures.

[0016] 101. Support.

[0017] 102. Support leg.

[0018] 200. Temperature calibration tool.

[0019] 201. Probe.

[0020] 300. Reflector. Detailed Implementation

[0021] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0022] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0023] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0024] like Figure 1 , 2 As shown, one or more embodiments of this disclosure can provide a temperature calibration device for a semiconductor wafer thermal processing equipment. The temperature calibration device may include, but is not limited to, a fixture 100 and a temperature calibration tool 200. This disclosure innovatively integrates the fixture 100 and the temperature calibration tool 200 into one device, thereby effectively solving the problems of long detection time, low reliability of results, and excessive reliance on the operating experience of technicians in the existing technology error calibration process. The specific structure of the temperature calibration device is described below.

[0025] like Figure 1 As shown, in some embodiments of this disclosure, the clamp 100 and the temperature calibration tool 200 can be fixedly connected. During operation, the temperature calibration device, consisting of the clamp 100 and the temperature calibration tool 200, is placed on the reflector 300. Multiple temperature sensors (not shown in the figure) used in the heat treatment equipment can be embedded in the reflector 300 or disposed below the reflector 300. The specific working principle and process of the temperature sensors are prior art and will not be described in detail in this disclosure. Combined with... Figure 2The reference numerals in the accompanying drawings indicate that the temperature calibration tool 200 is fixed to the fixture 100. The fixture 100 may include, but is not limited to, a support 101 and a foot 102. The foot 102 is fixed to the lower surface of the support 101 and may be an annular ring or multiple symmetrically arranged support columns. The temperature calibration device is placed on the reflector 300 based on the support of the foot 102. The support 101 may have one or more through holes for the probe 201 of the temperature calibration tool 200 to pass through. The temperature calibration tool 200 has a tool body and a probe 201 extending outward from the tool body. The probe 201 passes through the through hole on the support 101, and there is a gap between the probe 201 and the through hole to accommodate the self-rotation function of the probe 201. The tool body can be used to realize the functions of temperature detection result acquisition, output, and display, and is a conventional optional device, which will not be described in detail in this embodiment.

[0026] In some preferred embodiments of this disclosure, the number of through holes through which the probe 201 passes is multiple. These multiple through holes are distributed on the support 101, and each through hole corresponds one-to-one with a multiple temperature sensor installed on the heat treatment equipment. The number of probes 201 is the same as the number of through holes; in this embodiment, one probe 201 can be installed in each through hole. Based on the multiple probes, this disclosure eliminates the need for the existing method of sequentially inserting probes into through holes for detection; instead, it enables detection at all locations after the temperature calibration device has been placed once. Therefore, this disclosure can significantly shorten the detection time and improve error calibration efficiency.

[0027] In some preferred embodiments of this disclosure, the temperature calibration tool 200 has a drive mechanism for rotating the probe 201. More specifically, the probe 201 has a cylindrical structure, and the axis of rotation of the probe 201 is the center line of the cylindrical structure. The direction of the through hole is perpendicular to the plane where the support 101 is located. The vertically arranged through hole has a central axis, which coincides with the axis of rotation of the probe 201. The probe 201 may have an end for sensing temperature, and the end of the probe 201 is preferably flush with the lower end of the support 102. In this embodiment, the support 101 may be a circular plate that matches the emitter plate 300, and the temperature calibration tool 200 is fixedly connected to the support 101. The drive mechanism may include a motor, drive shaft, power supply, etc., and can be selected from conventional drive equipment, so it will not be described in detail in this embodiment. With the action of the probe 201 with a self-rotating function, this disclosure not only omits the traditional manual rotation operation of the temperature calibration tool 200, but also can obtain multiple temperature values ​​obtained by the probe at the same position more quickly for selection.

[0028] like Figure 2 As shown, in some other embodiments of this disclosure, the clamp 100 and the temperature calibration tool 200 are formed into an integral structure. Figure 1As shown, the clamp 100 may include a support 101 and a foot 102. The temperature calibration tool 200 has a tool body and a probe 201 extending outward from the tool body. Figure 2 The clamp 100 is integrally formed with the tool body and the outer shell of the temperature calibration tool 200. A support leg 102 is fixed to the lower surface of the support 101, and the temperature calibration device is placed on the reflector 300 based on the support leg 102. The support 101 has a through hole for the probe 201 to pass through. The probe 201 passes through the through hole in the support 101, and there is a gap between the probe 201 and the through hole. The tool body can be used to realize functions such as temperature detection result acquisition, output, and display, and is a conventional optional device, which will not be described in detail in this embodiment. In some preferred embodiments of this disclosure, the number of through holes is multiple. Multiple through holes are distributed on the support 101, and each through hole corresponds one-to-one with multiple temperature sensors installed on the heat treatment equipment. The number of probes 201 is the same as the number of through holes; in this embodiment, one probe 201 is installed in one through hole. In some preferred embodiments of this disclosure, the temperature calibration tool 200 has a drive mechanism for driving the probe 201 to rotate. More specifically, the probe 201 has a cylindrical structure, and the axis of rotation of the probe 201 is the center line of the cylindrical structure. The direction of the through hole is perpendicular to the plane where the support 101 is located. The through hole has a central axis, and the central axis of the through hole coincides with the axis of rotation of the probe 201. The probe 201 may have an end for sensing temperature, and the end of the probe 201 is preferably flush with the lower end of the support 102.

[0029] Based on the content already provided in this disclosure, a solution for welding and fixing the fixture 100 to the housing of the temperature calibration tool 200, or other fixed connection solutions, such as bonding, may also be provided.

[0030] One or more embodiments of this disclosure can operate as follows: First, the temperature calibration device is placed on the reflector 300, and the temperature calibration tool 200 is started. Each probe is activated sequentially according to a pre-set probe operating order. It should be understood that this disclosure can also activate all probes or at least two probes simultaneously. Specifically, when using any probe 201 for temperature detection, the probe 201 is controlled to rotate, and multiple temperature values ​​are obtained during the rotation. Then, the maximum value among the multiple temperature values ​​is used as the detection result of the current probe at the current position, and this detection result is used to calibrate the corresponding temperature sensor.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0033] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0034] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0035] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A temperature calibration device for a semiconductor wafer thermal processing equipment, characterized in that, include: A clamp, the clamp including a support, the support having a through hole; A temperature calibration tool has an outwardly extending probe that passes through a through hole in a support, with a gap between the probe and the through hole; wherein the temperature calibration tool is fixed to a clamp, the clamp and the temperature calibration tool forming a fixed connection structure, or the clamp and the outer shell of the temperature calibration tool are integrally formed. The temperature calibration tool has a drive mechanism for rotating the probe. The temperature calibration tool is used to control the probe's self-rotation and obtain multiple temperature values ​​detected by the probe during the self-rotation process. The maximum value among the multiple temperature values ​​is used as the probe's detection result for the current position, and the detection result is used to calibrate the corresponding temperature sensor on the heat treatment equipment.

2. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 1, characterized in that, The number of through holes is multiple; the multiple through holes distributed on the support correspond one-to-one with the multiple temperature sensors installed on the heat treatment equipment. The number of probes is the same as the number of through holes; one probe is installed in each through hole.

3. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 1, characterized in that, The probe has a cylindrical structure, and the axis of the probe's rotation is the center line of the cylindrical structure.

4. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 3, characterized in that, The through hole extends in a direction perpendicular to the plane where the support is located.

5. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 4, characterized in that, The through hole has a central axis, which coincides with the axis of the probe's rotation.

6. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 1, characterized in that, The clamp also includes a support leg; the support leg is fixed to the lower surface of the support.

7. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 6, characterized in that, The probe has an end for sensing temperature, which is flush with the lower end of the support leg.

8. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 1, characterized in that, The support is in the shape of a circular plate, and the temperature calibration tool is fixedly connected to the support.

9. The temperature calibration device for semiconductor wafer thermal processing equipment according to claim 1, characterized in that, The clamp is integrally formed with the housing of the temperature calibration tool, or the clamp is welded to the housing of the temperature calibration tool.

Images