Cooling unit, substrate processing device and method using the same

Abstract

The present invention provides a cooling unit. In one embodiment, the cooling unit includes: a cooling plate having a mounting surface; a pin member disposed on the cooling plate and supporting a substrate; a pressure-reducing hole formed on the mounting surface; a pressure-reducing path formed within the cooling plate and connected to the pressure-reducing hole; a pressure-reducing member for reducing pressure on the pressure-reducing path; and a controller for controlling the pressure-reducing member, wherein the controller controls the pressure-reducing member to reduce pressure on the space between the substrate and the mounting surface of the cooling plate, thereby adjusting the distance between the substrate and the mounting surface of the cooling plate.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to a substrate processing apparatus including a cooling unit and a substrate processing method using the cooling unit, and more specifically, to a substrate processing apparatus including a cooling unit disposed within a baking unit and a substrate processing method for cooling a substrate after heating it. Background Technology

[0002] Semiconductor devices are typically manufactured using various processes such as cleaning, deposition, photolithography, etching, and ion implantation. Photolithography, used to form patterns, plays a crucial role in achieving high-density integration of semiconductor devices.

[0003] Photolithography involves forming a photoresist pattern on a semiconductor substrate. The photoresist pattern can be formed by processes including: a coating process that forms a photoresist layer on the substrate; an exposure process that exposes the photoresist layer to a light source using a photomask; a development process that develops the exposed photoresist layer to selectively remove portions of the exposed photoresist layer and form the photoresist pattern; and a baking process that heats and cools the substrate before and after each process.

[0004] The baking process involves heating the substrate using a heating unit. This unit has a heating plate on which the substrate is placed. After one set of substrates has been processed, before starting the processing of another set, the temperature of the heating plate should be adjusted to the appropriate processing conditions (i.e., heating temperature) for that new set of substrates. The temperature of the heating plate can be rapidly increased by increasing the heat energy supplied to it. However, lowering the temperature of the heating plate takes a long time because it is achieved through a natural cooling process. The time required for this natural cooling process leads to a decrease in operational capability.

[0005] On the other hand, the substrate heated in the heating unit is cooled in the cooling unit of the baking equipment before being removed from the baking equipment. The cooling unit has a cooling plate for placing the substrate. Cooling paths are provided inside the cooling plate. If the distance between the substrate and the cooling plate is not close enough, the heat transfer between the substrate and the cooling plate may be insufficient to cool the substrate adequately. If the distance between the substrate and the cooling plate is too close, a rapid drop in temperature may cause the substrate to crack due to thermal shock. Summary of the Invention

[0006] The present invention provides a cooling unit capable of improving cooling speed, as well as a substrate processing apparatus and method including the cooling unit.

[0007] Embodiments of the present invention also provide a cooling unit capable of preventing damage to a substrate due to thermal shock, and a substrate processing apparatus and method including the cooling unit.

[0008] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0009] The present invention provides a cooling unit. In one embodiment, the cooling unit for cooling a substrate includes: a cooling plate having a mounting surface; a pin member disposed on the cooling plate and supporting the substrate; a pressure-reducing hole formed on the mounting surface; a pressure-reducing path formed within the cooling plate and connected to the pressure-reducing hole; a pressure-reducing member for reducing pressure on the pressure-reducing path; and a controller for controlling the pressure-reducing member, wherein the controller controls the pressure-reducing member to reduce pressure on the space between the substrate and the mounting surface of the cooling plate, thereby adjusting the distance between the substrate and the mounting surface of the cooling plate.

[0010] In one embodiment, the cooling path is disposed within the cooling plate.

[0011] In one embodiment, the pin member includes a proximity pin supporting the substrate and an elastic member connected to the proximity pin.

[0012] In one embodiment, the elastic member is compressed by the pressure reduction of the pressure-reducing member and is not compressed by the load of the substrate supported by the proximity pin.

[0013] In one embodiment, the controller controls the pressure-reducing member to adjust the distance between the mounting surfaces of the substrate and the cooling plate, such that the cooling plate cools the substrate at a first distance between the substrate and the mounting surfaces of the cooling plate, and then cools the substrate at a second distance between the substrate and the mounting surfaces of the cooling plate, the second distance being shorter than the first distance.

[0014] In one embodiment, the proximity pin is disposed in an insertion groove formed on the mounting surface.

[0015] The present invention provides a substrate processing apparatus. In one embodiment, the apparatus includes: a housing; a heating unit located within the housing and having a heating plate for heating a substrate; and a cooling unit for cooling the heating plate and / or the substrate, wherein the cooling unit includes: a cooling plate having a mounting surface; a pin member disposed at the cooling plate and supporting the substrate; a pressure relief hole formed on the mounting surface; a pressure relief path formed within the cooling plate and connected to the pressure relief hole; a pressure relief member for depressurizing the pressure relief path; and a drive member for moving the cooling plate between a position within the housing above the heating plate and a position outside the position above the heating plate.

[0016] In one embodiment, a cooling plate is provided therein with a cooling path.

[0017] In one embodiment, the pin member includes an approach pin for supporting the substrate and an elastic member connected to the approach pin.

[0018] In one embodiment, the elastic member is compressed by the pressure reduction of the pressure-reducing member and is not compressed by the load of the substrate supported by the proximity pin.

[0019] In one embodiment, the proximity pin is arranged in an insertion slot formed on the mounting surface of the cooling plate.

[0020] In one embodiment, the heating unit is configured to move vertically within a pin hole formed in the heating plate, and the heating plate further includes a lifting pin for delivering the substrate to the cooling unit.

[0021] In one embodiment, the cooling plate is provided with a guide hole for delivering the substrate to the heating unit, and when the cooling plate moves to a second position, a lifting pin is inserted into the guide hole of the cooling plate to take over and support the substrate, wherein the guide hole extends outward to the edge of the cooling plate.

[0022] In one embodiment, the controller controls the cooling unit such that the cooling plate is positioned in contact with or adjacent to the heating plate to cool the heating plate.

[0023] In one embodiment, the controller controls the cooling unit such that the substrate is delivered from the heating plate to the cooling plate, and then the substrate supported by the cooling plate is cooled. Then, the space between the substrate and the mounting surface of the cooling plate is depressurized by the depressurization member to lower the substrate toward the mounting surface.

[0024] In one embodiment, the controller further controls the cooling unit so that the substrate is further cooled as it descends toward the mounting surface via the pressure-reducing member.

[0025] An embodiment of the present invention provides a substrate processing method. The method includes cooling the substrate with a cooling unit after heat treatment in a heating plate, wherein cooling the substrate with the cooling unit includes placing the substrate above a cooling plate of the cooling unit and cooling the substrate, and depressurizing the space between the substrate and the mounting surface of the cooling plate to lower the substrate to the mounting surface.

[0026] In one embodiment, cooling the substrate with a cooling unit further includes cooling the substrate at a second height, which is lower than the first height.

[0027] In one embodiment, placing a substrate above a cooling plate of a cooling unit includes: supporting the substrate with a pin member disposed in an insertion slot of the cooling plate, the pin member including an approach pin supporting the substrate and an elastic member connected to the approach pin, wherein depressurizing the space between the substrate and the mounting surface of the cooling plate to lower the substrate to the mounting surface includes depressurizing a depressurization path formed in the cooling plate and a depressurization hole formed on the mounting surface and connected to the depressurization path, and wherein depressurizing the space between the substrate and the mounting surface of the cooling plate compresses the elastic member, thereby lowering the substrate toward the mounting surface of the cooling plate.

[0028] The embodiments of the present invention improve the cooling rate of the cooling unit.

[0029] The embodiments of the present invention avoid substrate damage caused by thermal shock.

[0030] The effects of this invention are not limited to those described above. Those skilled in the art to which this invention pertains will clearly understand any effects not mentioned from this specification and the accompanying drawings. Attached Figure Description

[0031] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals throughout the various drawings refer to the same parts, and wherein:

[0032] Figure 1 This is a schematic perspective view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0033] Figure 2 It is shown Figure 1 A cross-sectional view of a substrate processing apparatus containing a coating block and a developing block.

[0034] Figure 3 It is shown Figure 1 Top view of the substrate processing apparatus.

[0035] Figure 4 The diagram shows Figure 3 Implementation method of the hand of the transfer robot.

[0036] Figure 5 It is shown Figure 3 A perspective view of the heat treatment chamber.

[0037] Figure 6 It is shown Figure 3 A top view of the heat treatment chamber.

[0038] Figure 7 It is shown Figure 3 Front view of the heat treatment chamber.

[0039] Figure 8 The figure illustrates a cooling unit according to an embodiment of the present invention.

[0040] Figures 9 to 15 These are views showing, in sequence, a substrate processing apparatus according to an embodiment of the present invention. Detailed Implementation

[0041] The inventive concept can be modified in various ways and can take many forms, and its specific embodiments will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant known technologies may be omitted where such descriptions may obscure the essence of the inventive concept.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “described” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising” and / or “comprising of” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an example or illustration.

[0043] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, without departing from the teachings of the inventive concept, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0044] Figure 1 This is a schematic perspective view illustrating the substrate processing apparatus of the present invention. Figure 2 It is shown Figure 1 Cross-sectional view of the coating block and developing block of the substrate processing apparatus. Figure 3 It is shown Figure 1 A plan view of the substrate processing apparatus.

[0045] refer to Figures 1 to 3The substrate processing apparatus 1 includes a transposition module 20, a processing module 30, and an interface module 40. According to an embodiment, the transposition module 20, the processing module 30, and the interface module 40 are arranged in a row sequentially. Hereinafter, the arrangement direction of the transposition module 20, the processing module 30, and the interface module 40 is referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0046] The transposition module 20 transfers the substrate W from the carrier 10 containing the substrate W to the processing module 30, and transfers the substrate W, which has been fully processed in the processing module 30, back to the carrier 10. The longitudinal direction module 20 of the transposition module 20 is parallel to the second direction 14. The transposition module 20 may have a loading port 22 in which the carrier 10 containing the substrate W is placed. Furthermore, the transposition module 20 has a transposition frame 24. The loading port 22 is located opposite the processing module 30, with the transposition frame 24 disposed between them. The carrier 10 containing the substrate W is placed on the loading port 22. Multiple loading ports 22 may be provided, and the multiple loading ports 22 may be arranged along the second direction 14.

[0047] An airtight carrier 10, such as a front-opening standard container (FOUP), can be used as the carrier 10. The carrier 10 can be placed on the loading port 22 by a conveying device (not shown) such as an overhead conveyor, overhead transport or automated guided vehicle, or by an operator.

[0048] A sorting robot 2200 is disposed in a sorting frame 24. A guide rail 2300 is disposed in the sorting frame 24, the longitudinal direction of which is parallel to the second direction 14. The sorting robot 2200 can move on the guide rail 2300. The sorting robot 2200 includes a hand 2220 on which a substrate W is placed. The hand 2220 can move back and forth, can rotate about a third direction 16 as an axis, and can move along the third direction 16.

[0049] Processing module 30 performs coating and developing processes on substrate W. Processing module 30 has coating blocks 30a and developing blocks 30b. Coating blocks 30a perform the coating process on substrate W, and developing blocks 30b perform the developing process on substrate W. Multiple coating blocks 30a are configured and stacked on top of each other. Multiple developing blocks 30b are configured and stacked on top of each other.

[0050] according to Figure 1In this embodiment, two coating blocks 30a and two developing blocks 30b are provided. The coating blocks 30a may be disposed below the developing blocks 30b. According to this embodiment, the two coating blocks 30a can perform the same process and can have the same structure. Furthermore, the two developing blocks 30b can perform the same process and can have the same structure.

[0051] refer to Figure 3 The coating block 30a includes a heat treatment chamber 3200, a transfer chamber 3400, a liquid treatment chamber 3600, and a buffer chamber 3800. The heat treatment chamber 3200 performs a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid treatment chamber 3600 forms a liquid film on the substrate W by dispensing liquid onto the substrate W. The liquid film may be a photoresist film or an anti-reflective film. The transfer chamber 3400 transfers the substrate W between the heat treatment chamber 3200 and the liquid treatment chamber 3600 in the coating block 30a.

[0052] A transfer chamber 3400 is configured such that its longitudinal direction is parallel to the first direction 12. A transfer robot 3422 is provided in the transfer chamber 3400. The transfer robot 3422 transfers the substrate W between the heat treatment chamber 3200, the liquid treatment chamber 3600, and the buffer chamber 3800. According to an embodiment, the transfer robot 3420 has a hand 3420 on which the substrate W is placed. The hand 3420 is movable back and forth, rotatable about a third direction 16, and movable along the third direction 16. A guide rail 3300 is provided in the transfer chamber 3400, the longitudinal direction of which is parallel to the first direction 12. The transfer robot 3422 can move on the guide rail 3300.

[0053] Multiple liquid processing chambers 3600 are provided. Some liquid processing chambers 3600 can be stacked on top of each other. The liquid processing chambers 3600 are placed on one side of the transfer chamber 3402. The liquid processing chambers 3600 are arranged along a first direction 12. Some liquid processing chambers 3600 are arranged adjacent to the indexing module 20. In the following text, the liquid processing chamber 3600 arranged adjacent to the indexing module 20 is referred to as the front liquid processing chamber 3602. Some liquid processing chambers 3600 are arranged adjacent to the interface module 40. In the following text, the liquid processing chamber 3600 arranged adjacent to the interface module 40 is referred to as the rear heat treatment chamber 3604.

[0054] A first liquid is coated onto the substrate W in a front liquid processing chamber 3602, and a second liquid is coated onto the substrate W in a second liquid processing chamber 3604. The first and second liquids can be different types of liquids. According to an embodiment, the first liquid is a suitable liquid for forming an anti-reflective layer, while the second liquid is photoresist for forming a photoresist layer. The photoresist can be coated onto the substrate W having the coated anti-reflective layer. Alternatively, the first liquid can be photoresist, and the second liquid can be a suitable liquid for forming an anti-reflective layer. In this case, the liquid for forming the anti-reflective layer can be coated onto the substrate W having a photoresist layer. Alternatively, the first and second liquids can be the same liquid, and both can be photoresist.

[0055] Multiple buffer chambers 3800 are configured. Some buffer chambers 3800 are placed between the indexing module 20 and the transfer chamber 3400. These buffer chambers are referred to below as front buffers 3802. Multiple front buffers 3802 are stacked on top of each other vertically. Some buffer chambers 3800 are placed between the transfer chamber 3400 and the interface module 40. These buffer chambers are referred to as rear buffers 3804. Multiple rear buffers 3804 are stacked on top of each other vertically. Each of the front buffers 3802 and rear buffers 3804 temporarily holds multiple substrates W. The substrates W stored in the front buffers 3802 are loaded or unloaded by the indexing robot 2200 and the transfer robot 3422. The substrates W stored in the rear buffers 3804 are loaded or unloaded by the transfer robot 3422 and the first robot 4602.

[0056] The developing block 30b has a heat treatment chamber 3200, a transfer chamber 3400, and a liquid treatment chamber 3600. The heat treatment chamber 3200, transfer chamber 3400, and liquid treatment chamber 3600 of the developing block 30b are configured and arranged to be substantially similar to those of the coating block 30a. However, all the liquid treatment chambers 3600 in the developing block 30b are supplied with developing solution and are configured as developing chambers 3600 for developing the substrate W.

[0057] Interface module 40 connects processing module 30 to external exposure device 50. Interface module 40 has interface frame 4100, additional processing chamber 4200, interface buffer 4400 and transfer member 4600.

[0058] A fan filter unit that generates a downward airflow internally may be provided at the top of the interface frame 4100. An additional processing chamber 4200, an interface buffer 4400, and a transport member 4600 are placed within the interface frame 4100. The additional processing chamber 4200 may perform some additional processing on the substrate W, which has already been processed in the coating block 30a, before it is loaded into the exposure apparatus 50. Alternatively and / or additionally, the additional processing chamber 4200 may perform some additional processing on the substrate W, which has already been processed in the exposure apparatus 50, before it is loaded into the developing block 30b. For example, the additional processing may be an edge exposure process that exposes the edge regions of the substrate W, and / or a top surface cleaning process that cleans the top surface of the substrate W, and / or a bottom surface cleaning process that cleans the bottom surface of the substrate W. Multiple additional processing chambers 4200 may be provided, and they may be stacked on top of each other. All additional processing chambers 4200 may be provided to perform the same processing. Alternatively, some additional processing chambers 4200 may be provided to perform different processing.

[0059] Interface buffer 4400 provides space for the substrate W to temporarily reside during transport between coating block 30a, additional processing chamber 4200, exposure apparatus 50 and developing block 30b. Multiple interface buffers 4400 can be configured, and multiple interface buffers 4400 can be stacked on top of each other.

[0060] For example, the additional processing chamber 4200 is placed on one side of the length line of the transmission chamber 3400, and the interface buffer 4400 can be placed on the other side of the length line of the transmission chamber 3400.

[0061] The transfer member 4600 transfers the substrate W between the coating block 30a, the additional processing chamber 4200, the exposure apparatus 50, and the developing block 30b. The transfer member 4600 can be a single robot or a combination of multiple robots. For example, the transfer member 4600 has a first robot 4602 and a second robot 4606. The first robot 4602 can transfer the substrate W between the coating block 30a, the additional processing chamber 4200, and the interface buffer 440; the interface robot 4604 can transfer the substrate W between the interface buffer 4400 and the exposure apparatus 50; and the second robot 4604 can transfer the substrate W between the interface buffer 4400 and the developing block 30b.

[0062] The first robotic arm 4602 and the second robotic arm 4606 each include a hand, on which a base plate W is placed. The hand 122 can be configured to move forward and backward, rotate about a third direction 16 as an axis, and move along the third direction 16.

[0063] The hands of the indexing robot 2200, the first robot 4602, and the second robot 4606 can all be configured to have the same shape as the hands 3420 of the transfer robots 3422 and 3424. The hands of the robots that send and receive substrate W directly from the transfer plate 3240 of the heat treatment chamber can be configured to have the same shape as the hands of the transfer robots 3422 and 3424, while the hands of the remaining robots can be configured to have different shapes.

[0064] According to the embodiment, a transfer robot 2200 is provided to directly send and receive the substrate W using the heating unit 3230 of the preheating chamber 3200 provided in the coating block 30a.

[0065] In addition, a transfer robot 3422 provided in the coating block 30a and the developing block 30b can be provided to send and receive substrate W directly from the transfer plate 3240 placed in the heat treatment chamber 3200.

[0066] Figure 4 It shows Figure 3 Implementation method of the hand part of the transfer robot. (Reference) Figure 4 The hand portion 3420 has a base 3428 and a support protrusion 3429. The base 3428 may have an annular hole shape, with a portion of its periphery cut off. The inner diameter of the base 3428 is larger than the diameter of the substrate W. The support protrusion 3429 extends inward from the base 3428. Multiple support protrusions 3429 are provided, and the support protrusions 3429 support the edge region of the substrate W. For example, four support protrusions 3429 may be provided at equal intervals.

[0067] Multiple heat treatment chambers 3200 are provided. The heat treatment chambers 3200 are arranged along the first direction 12. The heat treatment chambers 3200 are placed on one side of the transfer chamber 3400.

[0068] Figure 5 yes Figure 3 Perspective view of the intermediate heat treatment chamber 3202. Figure 6 yes Figure 3 Floor plan of heat treatment chamber 3202. Figure 7 yes Figure 3 Front view of the intermediate heat treatment chamber 3202. (Refer to route 5) Figure 7The heat treatment chamber 3202 heats the substrate W. For example, the heat treatment chamber 3202 performs a heating process such as a pre-baking process to remove organic matter or moisture from the surface of the substrate W by heating it to a certain temperature before applying photoresist, a soft baking process performed after photoresist is applied to the substrate W, or other heating processes, and a cooling process performed after each heating process for a turntable fan to cool the substrate W. A heating unit 3230 disposed in some of the heat treatment chambers 3202 can supply gas during the heating of the substrate W to improve the adhesion of the photoresist to the substrate W. For example, the gas can be hexamethyldisilane gas.

[0069] The heat treatment chamber 3202 includes a housing 3210, a heating unit 3230, a cooling unit 3220, and a controller 590. The controller 590 controls the cooling unit 3220 to perform the substrate processing method described below. The cooling unit 3220 and the heating unit 3230 are arranged along a second direction 14. For example, the cooling unit 3220 may be placed closer to the transfer chamber 3400 than the heating unit 3230.

[0070] The housing 3210 provides internal space for the baking process. The housing 3210 is configured in a cuboid shape. The housing 3210 includes a first sidewall 3211, a second sidewall 3213, and an inlet 3212.

[0071] A first sidewall 3211 is disposed on one side of the housing 3210. A second sidewall 3213 is disposed opposite to the first sidewall 3211. An inlet 3212 for the substrate W to enter and exit is formed on the sidewall of the housing 3210. In one example, the inlet 3212 may be formed on the first sidewall 3211. The inlet 3212 provides a channel for the substrate W to travel. In one example, the heating unit 3230 is disposed closer to the second sidewall 3213 than the first sidewall 3211.

[0072] Heating unit 3230 heats substrate W to a set temperature. Heating unit 3230 is provided to heat substrate W to a temperature above room temperature. In one example, heating unit 3230 heats substrate W at atmospheric pressure or below. Heating unit 3230 includes heating plate 3251, lifting pin 3253, cover 3255, and actuator 3257.

[0073] The heating plate 3251 has a heating device inside for heating the substrate W. For example, the heating device may be a heating coil. Alternatively and / or additionally, the heating plate 3251 may be provided with a heating pattern, wherein the hot wires are formed in a specific pattern. The heating plate 3251 is configured as a cylinder.

[0074] Inside the heating plate 3251, a pin hole 3254 is formed to receive a lifting pin 3253. The pin hole 3254 provides a path for the lifting pin 3253 to travel when the lifting pin 3253 moves the substrate W vertically. The pin hole 3254 is configured to vertically penetrate the heating plate 3251. In one example, multiple pin holes 3254 are provided at the same distance from the center of the heating plate 3251. For example, three pin holes 3254 and three corresponding lifting pins 3253 can be provided. The lifting pin 3253 moves vertically via a lift (not shown). The lifting pin 3253 can place the substrate W on the heating plate 3251. The lifting pin 3253 can raise the substrate W to a position spaced apart from the heating plate 3251.

[0075] A cover 3255 is located above a heating plate 3251. The cover 3255 is cylindrical. The cover 3255 provides a heating space inside. When the substrate W moves to the heating plate 3251 for heating, the cover 3255 is moved to the top of the heating plate 3251 by a driver 3257. The cover 3255 is then moved downwards by the driver 3257 to provide heating space and allow the substrate W to be heated. The driver 3257 is fixedly connected to the cover 3255 via a support unit 558. The driver 3257 moves the cover 3255 vertically to transfer the substrate W to or from the heating plate 3251. For example, the driver 3257 can be provided as a cylinder.

[0076] The cooling unit 3220 cools the heating plate 3251 and / or the substrate W that has already been processed. In one example, the cooling unit 3220 is configured to convey the substrate W within the housing 3210. The cooling unit 3220 includes a cooling plate 3221, a drive member 3225, a pin member 3224, and a pressure reducing unit 800.

[0077] The substrate W is placed on the cooling plate 3221. The cooling plate 3221 is arranged in a generally circular shape when viewed from above. The cooling plate 3221 is set to approximately the same size as the substrate W. The cooling plate 3221 is made of a metal with good thermal conductivity. In one example, a cooling path or channel 3226 may be provided inside the cooling plate 3221. The cooling path is supplied with coolant to cool the substrate W and / or the heating plate 3251.

[0078] A notch 3223 is formed at the edge of the cooling plate 3221. The notch 3223 may have a shape corresponding to the protrusion 3429 formed on the hand portion 3420 of the aforementioned transfer manipulators 3422 and 3424. Furthermore, the notch 3223 is configured to be as numerous as the protrusions 3429 formed on the hand portion 3420 and formed at positions corresponding to the protrusions 3429. The substrate W is transferred to a position between the hand portion 3420 and the cooling plate 3221 with the hand portion 3420 and the cooling plate 3221 vertically aligned. The cooling plate 3221 has a guide hole 3235. The guide hole 3235 is configured to extend inward from the edge of the cooling plate 3221. The guide hole 3235 allows the lifting pin 3253 of the heating unit 3230 to be accommodated during the movement of the cooling plate 3221 while the substrate W is being transferred between the cooling plate 3221 and the heating unit 3230.

[0079] The drive member 3225 includes an arm 3222 and a drive rail 3227. In one example, the arm 3222 is fixedly connected to a cooling plate 3221. The cooling plate 3221 is mounted on the drive rail 3227. The arm 3222 is positioned between the cooling plate 3221 and the drive rail 3227. The drive rail 3227 moves the cooling plate 3221. In one example, the drive rail 3227 moves the cooling plate 3221 horizontally or vertically. For example, the drive rail 3227 can move the cooling plate 3221 between a first position 3271 and a second position 3272. The first position 3271 is where the cooling plate 3221 is adjacent to a first sidewall 3211. The second position 3272 is where the cooling plate 3221 is near a second sidewall 3213 and corresponds to a position above the heating plate 3251.

[0080] In the following text, see references Figure 8 Describe pin component 3224 and pressure reducing unit 800.

[0081] refer to Figure 8 The pin member 3224 includes an approach pin 32240 and an elastic member 32243. The approach pin 32240 is disposed on the mounting surface of the cooling plate 3221 to support the substrate W. In one example, multiple approach pins 32240 are provided. For example, three approach pins 32240 may be provided. The approach pins 32240 may be arranged symmetrically about the center of the cooling plate 3221, for example, having the same distance from the center of the cooling plate and spaced apart from each other. The approach pins 32240 may be disposed in corresponding insertion holes 32242 formed on the mounting surface.

[0082] The approach pin 32240 can move between a first support position and a second support position via the pressure-reducing member 824 and the elastic member 32243. In one example, the elastic member 32243 may be a spring. Here, the first support position is the position where the tip of the approach pin 32240 protrudes a first height H1 above the mounting surface of the cooling plate 3221, and the second support position is the position where the tip of the approach pin 32240 is located at a second height H2 above the mounting surface of the cooling plate 3221. In one example, the second height H2 is lower than the first height H1. For example, the second height H2 is the position where the tip of the approach pin 32240 protrudes a height lower than the first height H1 above the mounting surface of the cooling plate 3221. In one example, the approach pin 32240 may include a body 32244 and a stop 32241. The body 32244 is configured as a pin and the tip of the body 32244 supports a base plate W. The stop 32241 is connected to the body 32244 and is disposed below the body 32244. The diameter of the stop 32241 is larger than the diameter of the body 32244. The stop part 32241 prevents the main body 32244 from coming out of the insertion hole 32242.

[0083] The elastic member 32243 is coupled to the access pin 32240 to provide a spring force to the access pin 32240. The elastic member 32243 provides a spring force such that the access pin 32240 is positioned in a first supported position. For example, the spring force can be adjusted to overcome the load on the substrate supported by the access pin 32240, such that the access pin 32240 can support the substrate at a constant height above the mounting surface of the cooling device (e.g., in the first position) unless a separate force is applied to the substrate.

[0084] The pressure-reducing unit 800 provides pressure relief in the space between the substrate W, supported by the proximity pin 32240, and the mounting surface of the cooling plate 3221. The pressure-reducing unit 800 includes pressure-reducing holes 811, a pressure-reducing path 810, and a pressure-reducing member 824. Multiple pressure-reducing holes 811 are formed on the mounting surface. For example, three to seven pressure-reducing holes 811 can be provided. The pressure-reducing holes 811 are connected to the pressure-reducing path 810 formed within the cooling plate 3221. The pressure-reducing member 824 reduces pressure on the pressure-reducing path 810. The pressure-reducing path 810 is provided with a pressure-reducing valve 822. The pressure-reducing valve 822 regulates whether pressure is reduced via the pressure-reducing member 824 provided on the pressure-reducing path 810. When the pressure-reducing valve 822 is open and the pressure-reducing member 824 provides pressure relief to the pressure-reducing path 810, pressure relief is formed in the space between the substrate W and the mounting surface through the pressure-reducing holes 811. In one example, the pressure relief member 824 is set to be greater than (e.g., overcome) the elastic force of the resilient member 32243, which allows the approach pin 32240 to support the substrate at a constant height, for example, provided to compress the resilient member 32243, thereby lowering the substrate down to the cooling plate 3221. In other words, when the pressure relief member 824 depressurizes the pressure relief path 810 and the pressure relief is applied to the space between the substrate and the mounting surface of the cooling plate 3211, the substrate can be lowered to the cooling plate 3221, and when the pressure relief applied to the space between the substrate and the mounting surface of the cooling plate 3211 is removed and the substrate is supported by the approach pin 32240 at a constant height defined by the elastic force of the resilient member 32243, the substrate can be raised.

[0085] In one example, the pressure relief hole 811 is configured not to overlap with the insertion hole 32242. Therefore, pressure relief is not provided to the insertion hole 32242, but rather to the space between the mounting surface and the bottom surface of the substrate W via the pressure relief hole 811. If pressure relief is provided between the mounting surface and the bottom surface of the substrate W, the substrate W is driven downwards. In one example, the access pin 32240 may be lowered due to the pressure relief of the pressure relief member 824, since the provided spring force is lower than the pressure relief.

[0086] In the following text, see references Figures 9 to 14 A substrate processing method according to the present invention is described. Figures 9 to 14 These are views showing, in sequence, a substrate processing method according to an embodiment of the present invention.

[0087] Cooling plate 3221 receives substrate W from the aforementioned transfer robots 3422 and 3424 through an inlet formed at the first sidewall 3211. Then, as... Figure 11As shown, the cooling plate 3221 moves from the first position 3271 to the second position 3272 and transfers the substrate W onto the heating plate 3251. Once the substrate W is placed on the heating plate 3251, the cover 3255 is moved downward by the driver 3257 to cover the heating plate 3251, and the substrate W is heated to a first temperature T1 within the heating unit 3230.

[0088] like Figure 9 As shown, after the substrate is transferred to the heating plate 3252, the cooling plate 3221 can return to the first position 3271. When the heat treatment of the substrate W is completed, the cover 3255 is lifted upward by the driver 3257, as... Figure 10 As shown. During or after lifting the cover 3255, the cooling plate 3221 can be moved from the first position 3271 to the second position 3272 to receive the heat-treated substrate from the heating unit, as shown. Figure 11 As shown. At the second position 3272, the substrate W is transferred from the heating plate 3251 to the cooling plate 3221.

[0089] The substrate W, placed on the cooling plate 3221, moves from the second position 3272 to the first position 3271, as follows: Figure 12 As shown. The substrate W is cooled by the cooling unit 3220 during or after moving to the first position 3271. The cooling plate 3221 is made of a metallic material, which facilitates heat transfer and increases the heat transfer efficiency between the cooling plate 3221 and the substrate W. Furthermore, the cooling path 3226 provided in the cooling plate 3221 further improves the heat transfer efficiency between the cooling plate 3221 and the substrate W. The cooling unit reduces the temperature of the substrate W from a first temperature T1 to a second temperature T2, which is lower than the first temperature T1. In one example, when the substrate W reaches the second temperature T2, no pressure reduction is provided between the bottom of the substrate W and the mounting surface.

[0090] like Figure 13 As shown, when the temperature of substrate W reaches a second temperature T2 from a first temperature T1, substrate W is located at a first height H1. Therefore, the distance between the bottom of substrate W and the mounting surface is maintained at H1 until the temperature of the substrate decreases from the first temperature T1 to the second temperature T2. Maintaining the distance between substrate W and the mounting surface while the temperature of substrate W decreases to the second temperature T2 prevents damage to substrate W due to thermal shock caused by a significant temperature drop. In one example, the time it takes for the temperature of substrate W to change to the second temperature T2 can be pre-calculated, and the calculated time can be input so that during the calculated time period, substrate W can be placed on cooling plate 3221 without providing decompression (i.e., without lowering the substrate to the cooling plate).

[0091] When the substrate W reaches the second temperature T2, the pressure reduction unit 800 provides pressure reduction. The pressure reduction unit 800 provides pressure reduction between the bottom surface of the substrate W and the mounting surface. Therefore, an airflow is formed between the bottom surface of the substrate and the mounting surface, and convection between the substrate W and the cooling plate 3221 becomes active to help the temperature of the substrate W decrease. Furthermore, since the elastic member 32243 is disposed below the proximity pin 32240, the elastic member 32243 is compressed, and therefore the proximity pin 32240 descends due to the pressure reduction between the bottom surface of the substrate W and the mounting surface. In one example, as... Figure 14 As shown, the substrate W is located at a second height H2. Therefore, the distance between the bottom surface of the substrate W and the mounting surface is set to H2. In one example, H2 is set at a distance shorter than H1. By placing the bottom surface of the substrate W and the cooling plate 3221 close to each other at H2, heat transfer between the substrate W and the cooling plate 3221 occurs more actively than at H1. The substrate W is cooled at the second height H2 until the temperature decreases from the second temperature T2 to the third temperature T3.

[0092] In the example above, a cooling plate 3221 was described for cooling the substrate W. However, unlike this, the cooling plate 3221 can be configured to cool the heating plate 3251. For example, without placing the substrate W on the cooling plate 3221 or the heating plate 3251, the cooling plate 3221 can be positioned at a second position 3272. In this case, the cooling plate 3221 is positioned in contact with or adjacent to the heating plate 3251. The cooling unit reduces the temperature of the heating plate 3251 from a first temperature T1 to a temperature below the first temperature T1. After the heating plate 3251 is cooled, the cooling plate 3221 moves from the second position 3272 to the first position 3271.

[0093] like Figure 15 As shown, the cooling plate 3221 conveys the substrate W to the aforementioned conveying robots 3422 and 3424 through an inlet formed at the first sidewall 3211.

[0094] According to an exemplary embodiment, the substrate is naturally cooled at a distance of a first height H1 from the cooling plate 3221, and then a pressure reduction is provided between the substrate and the cooling plate 3221 to lower the substrate to a second height H2 below the first height H1 and cool the substrate thereon. Therefore, this method has the advantages of avoiding thermal shock applied to the substrate and improving cooling efficiency.

[0095] The effects of this invention are not limited to those described above. Those skilled in the art can clearly understand the effects not mentioned from the specification and drawings.

[0096] Although preferred embodiments of the inventive concept have been illustrated and described to date, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art who are familiar with the inventive concept may implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and these modifications should not be interpreted separately from the technical spirit or prospect of the inventive concept.

Claims

1. A cooling unit for cooling a substrate, comprising: Cooling plate, the cooling plate having a mounting surface; A pin component, which is disposed at the cooling plate and supports the base plate; A pressure relief hole is formed on the mounting surface; A pressure relief path is formed within the cooling plate and connected to the pressure relief hole. A pressure-reducing component, used to reduce pressure on the pressure-reducing path; and Controller, the controller being used to control the pressure-reducing component, The pin component includes: A proximity pin that supports the substrate; and An elastic member, which is connected to the proximity pin. The controller controls the pressure-reducing member to reduce the pressure in the space between the substrate and the mounting surface of the cooling plate, thereby adjusting the distance between the substrate and the mounting surface of the cooling plate, such that the cooling plate cools the substrate at a first distance between the substrate and the mounting surface of the cooling plate, and then cools the substrate at a second distance between the substrate and the mounting surface of the cooling plate, the second distance being shorter than the first distance.

2. The cooling unit according to claim 1, wherein a cooling path is provided within the cooling plate.

3. The cooling unit according to claim 1, wherein the elastic member is compressed by the pressure reduction of the pressure-reducing member and is not compressed by the load of the substrate supported by the proximity pin.

4. The cooling unit according to claim 1, wherein the proximity pin is disposed in an insertion groove formed on the mounting surface.

5. A substrate processing apparatus, comprising: case; A heating unit located within the housing and having a heating plate for heating the substrate; and A cooling unit is used to cool the heating plate and / or the substrate. The cooling unit includes: Cooling plate, the cooling plate having a mounting surface; A pin component, which is disposed at the cooling plate and supports the substrate; A pressure relief hole is formed on the mounting surface; A pressure relief path is formed within the cooling plate and connected to the pressure relief hole. A pressure-reducing component, used to reduce pressure on the pressure-reducing path; and A driving member for moving the cooling plate within the housing between a position above the heating plate and a position outside the position above the heating plate. The pin component includes: Proximity pins, the proximity pins being used to support the substrate; and An elastic member, which is connected to the proximity pin. The substrate processing apparatus further includes a controller, wherein the controller controls the cooling unit such that the substrate is delivered from the heating plate to the cooling plate, then the substrate supported by the cooling plate is cooled, and then the space between the substrate and the mounting surface of the cooling plate is depressurized by the depressurization member to lower the substrate toward the mounting surface. The controller further controls the cooling unit to further cool the substrate as it descends toward the mounting surface via the pressure-reducing member.

6. The substrate processing apparatus according to claim 5, wherein the housing has an opening at a first sidewall for conveying the substrate to and from the housing, wherein... The heating unit is placed closer to the second sidewall opposite the first sidewall, and The driving member moves the cooling plate between a first position near the first sidewall and a second position near the second sidewall, the second position being a position above the heating plate.

7. The substrate processing apparatus according to claim 5, wherein a cooling path is provided in the cooling plate.

8. The substrate processing apparatus of claim 5, wherein the elastic member is decompressed by the pressure reduction of the pressure-reducing member and is not compressed by the load of the substrate supported by the proximity pin.

9. The substrate processing apparatus according to claim 5, wherein the proximity pin is arranged in an insertion groove formed on the mounting surface of the cooling plate.

10. The substrate processing apparatus of claim 6, wherein the heating unit is configured to move vertically within a pin hole formed in a heating plate, and the heating plate further includes a lifting pin for delivering the substrate to the cooling unit.

11. The substrate processing apparatus of claim 10, wherein the cooling plate is provided with a guide hole for delivering the substrate to the heating unit, and when the cooling plate moves to the second position, the lifting pin is inserted into the guide hole of the cooling plate to take over and support the substrate, and wherein the guide hole extends outward to the edge of the cooling plate.

12. The substrate processing apparatus according to any one of claims 5 to 11, further comprising a controller, wherein the controller controls the cooling unit such that the cooling plate is in contact with or adjacent to the heating plate to cool the heating plate.

13. A substrate processing method, comprising: After heat-treating the substrate in the heating plate, the substrate is cooled by the cooling unit. And the cooling of the substrate by the cooling unit includes: The substrate is placed above the cooling plate of the cooling unit and cooled for the first cooling step; and Adjust the distance between the substrate and the mounting surface of the cooling plate to perform a second cooling process. Placing the substrate above the cooling plate of the cooling unit includes: The substrate is supported by a pin member arranged in an insertion slot in the cooling plate. The pin member includes a proximity pin that supports the substrate and an elastic member connected to the proximity pin. The adjustment of the distance between the substrate and the mounting surface of the cooling plate for the second cooling includes depressurizing the space between the substrate and the mounting surface of the cooling plate to lower the substrate to the mounting surface. The process of depressurizing the space between the substrate and the mounting surface of the cooling plate to lower the substrate to the mounting surface includes depressurizing a depressurization path formed in the cooling plate and a depressurization hole formed on the mounting surface and connected to the depressurization path. Depressurizing the space between the substrate and the mounting surface of the cooling plate compresses the elastic member, thereby lowering the substrate toward the mounting surface of the cooling plate.

14. The substrate processing method of claim 13, wherein adjusting the distance between the substrate and the mounting surface of the cooling plate for a second cooling includes depressurizing the space between the substrate and the mounting surface of the cooling plate to lower the substrate to the mounting surface.

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