A chip micro-cooling system based on phase change liquid cooling

Abstract

The present invention discloses a chip micro-cooling system based on phase change liquid cooling, which includes a heat-conducting material at the bottom, a cooling box installed on the heat-conducting material, a liquid-cooling phase change material filled in the cooling box, and cooling fins installed on the cooling box. The cooling fins are columnar and have a cooling air duct formed inside with an inlet and an outlet communicating with the inside of the cooling box. The cooling air duct includes a number of upward channels and downward channels formed in an up-and-down turning shape, and a cooling gap is formed between adjacent upward channels and downward channels. The cooling gap is isolated from the cooling air duct and communicates with the atmosphere. It effectively increases the gasification area of the phase change liquid within a limited volume, increases the cooling path of the phase change liquid, and increases the liquefaction rate, which is beneficial to the miniaturization and high efficiency of the chip cooling system.

Description

Technical Field

[0001] The present technology relates to chip heat dissipation devices, particularly a chip micro heat dissipation system based on phase change liquid cooling. Background Art

[0002] With the development of electronic technology, the chip integration degree is getting higher and higher, the power consumption is getting larger and larger, while the chip area is getting smaller and smaller. If the large heat generated in a small area cannot be dissipated in time, it will have an extremely serious impact on the functions and stability of the chip and even the entire system. Therefore, the heat dissipation problem of the chip is a problem that must be solved.

[0003] Currently, common heat dissipation systems include air cooling and water cooling. The air cooling system is simple, but has low heat dissipation efficiency; due to the high heat capacity and high conductivity of the liquid, the water cooling system has stronger heat dissipation ability than the air cooling technology, but the water cooling system is complex to manufacture, large in volume, and has a certain degree of danger, that is, if a water leakage occurs, it will cause irreparable damage to the electronic system. Summary of the Invention

[0004] The object of the present invention is to provide a chip micro heat dissipation system based on phase change liquid cooling that is simple to manufacture, has high heat dissipation efficiency, and can be miniaturized.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a chip micro heat dissipation system based on phase change liquid cooling, which includes a heat conducting material at the bottom, a heat dissipation box body installed on the heat conducting material, a liquid cooling phase change material filled in the heat dissipation box body, and heat dissipation fins installed on the heat dissipation box body. The heat dissipation fins are columnar, and a heat dissipation air duct with an inlet and an outlet formed inside and connected to the inside of the heat dissipation box body is formed therein. The heat dissipation air duct includes a plurality of upward channels and downward channels formed in an up-and-down turning shape. A heat dissipation gap is formed between adjacent upward channels and downward channels. The heat dissipation gap is isolated from the heat dissipation air duct and connected to the atmosphere.

[0006] Another optimized solution is that each heat dissipation air duct includes two upward channels and two downward channels. The middle upward channel is columnar, and a downward channel, an upward channel, and a downward channel are sequentially arranged outside it in a cylindrical shape. The lower port of the middle upward channel is the inlet of the heat dissipation air duct, and the lower port of the outermost downward channel is the end outlet of the heat dissipation air duct.

[0007] Another optimized solution is that the heat dissipation gap is in a cylindrical groove shape.

[0008] Another optimized solution is that the heat dissipation gap is located between the first downward channel and the second upward channel from the inside to the outside.

[0009] Another optimization solution is that a gravity sensor switch is provided at the outlet, which is automatically turned on when a certain weight of liquid-cooled phase change material condenses at the lower end of the outermost downward channel.

[0010] Another optimization solution is that the heat dissipation box body is made of copper plate, and a plurality of grooves for increasing the contact area between the liquid-cooled phase change material and the heat dissipation box body are formed on the lower end face and / or side face thereof.

[0011] Another optimization solution is that the groove is a rectangular groove or a circular groove.

[0012] Another optimization solution is that the liquid-cooled phase change material is a fluorocarbon compound or a silicone coolant, and the heat dissipation fins are made of aluminum plate material.

[0013] Another optimization solution is that the lower ends of the first downward channel and the second upward channel from the inside to the outside are connected and separated from the heat dissipation box body by a gravity sensor switch. When the weight of the liquid-cooled phase change material in the liquid state on the gravity sensor switch at the lower ends of the first downward channel and the second upward channel from the inside to the outside is higher than the weight set by the gravity sensor switch, the gravity sensor switch corresponding to the liquid-cooled phase change material in the liquid state is opened to form a middle outlet.

[0014] Another optimization solution is that the gravity sensor switch is a micro spring switch.

[0015] Due to the application of the above technical solutions, the present invention has the following advantages compared with the prior art: effectively increasing the gasification area of the phase change liquid within a limited volume, increasing the cooling path of the phase change liquid, increasing the liquefaction rate, and being beneficial to the miniaturization and high efficiency of the chip heat dissipation system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 is a schematic structural diagram of the present invention;

[0017] Attached Figure 2 is a cross-sectional view of the present invention;

[0018] Attached Figure 3 is a schematic structural diagram of the heat dissipation air duct in the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] The present invention will be further described below with reference to the embodiments shown in the drawings.

[0020] Such as Figures 1-3As shown in the figure, the chip micro-cooling system based on phase change liquid cooling includes a heat-conducting material 1 located at the bottom, a cooling box body 2 installed on the heat-conducting material 1, a liquid-cooling phase change material filled in the cooling box body 2, and cooling fins 3 installed on the cooling box body 2. The heat-conducting material 1 is heat-conducting silica gel or heat-conducting silicone grease, etc., which can transfer the heat generated by the chip well. The liquid-cooling phase change material is fluorocarbon compound or organosilicon coolant, etc. The cooling fins 3 are made of materials such as aluminum plates. The cooling box body 2 is made of copper plates, and a plurality of grooves 21 for increasing the contact area between the liquid-cooling phase change material and the cooling box body 2 are formed on the lower end face and / or side face thereof. The grooves 21 are not limited to rectangular grooves 21 or circular grooves 21, etc. The cooling fins 3 are columnar, and a cooling air duct with an inlet 43 and a terminal outlet 44 formed inside and communicating with the inside of the cooling box body 2 is formed therein. The cooling air duct includes a plurality of upward channels 41 and downward channels 42 formed in an up-and-down turning shape. A cooling gap 45 hole is formed between adjacent upward channels 41 and downward channels 42. The cooling gap 45 hole is isolated from the cooling air duct and communicates with the atmosphere.

[0021] Each cooling air duct includes two upward channels 41 and two downward channels 42. The middle upward channel 41 is columnar, and a downward channel 42, an upward channel 41, and a downward channel 42 are sequentially arranged outside it in a cylindrical shape. The lower port of the middle upward channel 41 is the inlet 43 of the cooling air duct, and the lower port of the outermost downward channel 42 is the terminal outlet 44 of the cooling air duct. The lower ends of the first downward channel 42 and the second upward channel 41 from the inside to the outside are connected and separated from the cooling box body 2 by a gravity induction switch 6. When the weight of the liquid-cooling phase change material in the liquid state on the gravity induction switch 6 at the lower ends of the first downward channel 42 and the second upward channel 41 from the inside to the outside is higher than the weight set by the gravity induction switch 6, the gravity induction switch 6 corresponding to the liquid-cooling phase change material in the liquid state is opened to form a middle outlet 46. The cooling gap 45 is in the shape of a cylindrical groove. The cooling gap 45 is arranged between the first downward channel 42 and the second upward channel 41 from the inside to the outside, so that the gas with a temperature between 50-80 °C just passes through the cooling gap 45, which can maximize the heat dissipation speed. Compared with the cooling fins without a cooling gap, the gas liquefaction speed is significantly accelerated, and the speed of the gravity induction switch releasing droplets increases by more than double. If a fan is installed above the cooling fins, the air circulation rate of the cooling gap can be accelerated, and the liquefaction speed can be significantly increased.

[0022] Gravity induction switches 6 are provided on the terminal outlet 44 and the middle outlet 46, and are automatically opened when a certain weight of phase change material condenses at the lower end of the outermost downward channel 42. The gravity induction switch 6 is a micro spring switch. A lightweight plastic baffle adapted to the channel size is supported on the spring, and the other end of the spring is connected to the fin side wall.

[0023] The above embodiments are only used to illustrate the technical concept and features of the present invention. The purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and it should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A chip micro-cooling system based on phase change liquid cooling, which includes a heat-conducting material at the bottom, a cooling box installed on the heat-conducting material, a liquid cooling phase change material filled in the cooling box, and cooling fins installed on the cooling box, and is characterized in that: The heat dissipation fins are columnar, and a heat dissipation air duct with an inlet and an outlet formed inside and communicating with the inside of the heat dissipation box body respectively is formed inside. The heat dissipation air duct includes a plurality of upward channels and downward channels formed in an up-and-down rotating shape. A heat dissipation gap is formed between adjacent upward channels and downward channels. The heat dissipation gap is isolated from the heat dissipation air duct and communicates with the atmosphere. The heat dissipation gap is located between the first downward channel and the second upward channel from inside to outside; each heat dissipation air duct includes two upward channels and two downward channels. The middlemost upward channel is columnar, and a downward channel, an upward channel, and a downward channel are sequentially arranged outside it in a cylindrical shape. The lower port of the middlemost upward channel is the inlet of the heat dissipation air duct, and the lower port of the outermost downward channel is the end outlet of the heat dissipation air duct.

2. The chip micro-cooling system based on phase change liquid cooling according to claim 1, characterized in that: The heat dissipation gap is in a cylindrical groove shape.

3. The chip micro-cooling system based on phase change liquid cooling according to claim 1, wherein: A gravity induction switch is provided on the end outlet and automatically opens when a certain weight of liquid-cooled phase change material condenses and forms at the lower end of the outermost downward channel.

4. The chip micro-cooling system based on phase change liquid cooling according to claim 1, wherein: The heat dissipation box body is made of a copper plate, and a plurality of grooves for increasing the contact area between the liquid-cooled phase change material and the heat dissipation box body are formed on its lower end face and / or side face.

5. The chip micro-cooling system based on phase change liquid cooling according to claim 4, wherein: The grooves are rectangular grooves or circular grooves.

6. The chip micro-cooling system based on phase change liquid cooling according to claim 1, wherein: The liquid-cooled phase change material is a fluorocarbon compound or a silicone coolant, and the heat dissipation fins are made of aluminum plate material.

7. The chip micro-cooling system based on phase change liquid cooling according to claim 1, characterized in that: The lower ends of the first downward channel and the second upward channel from inside to outside are communicated and separated from the heat dissipation box body by a gravity induction switch. When the weight of the liquid-cooled phase change material in a liquid state on the gravity induction switch at the lower ends of the first downward channel and the second upward channel from inside to outside is higher than the weight set by the gravity induction switch, the gravity induction switch corresponding to the liquid-cooled phase change material in a liquid state opens to form a middle outlet.

8. The chip micro-cooling system based on phase change liquid cooling according to claim 7, wherein: The gravity induction switch is a micro spring switch.

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