Waveguide device

Abstract

A spatial light modulating (SLM) device comprising one or more light inputs; one or more light outputs; a plurality of waveguides arranged in an array of receivers and / or emitters, wherein each waveguide is coupled to one or more light inputs; and at least one light modulating element for modulating light passing through at least one of the plurality of waveguides. Wherein the waveguides and the light modulating element are integrated in at least one common module, wherein one of the light inputs or light outputs interfaces with a free space region partially occupied by a vacuum, a gas, a liquid and / or a solid medium.

Description

Technical Field

[0001] This invention generally relates to waveguide devices and optical systems including waveguide devices. Specific embodiments relate to optically related processing systems. Background Technology

[0002] Traditional optical information processing systems consist of displays and camera devices operating in a free-space environment, utilizing the physical properties of light propagation and interaction in that environment, such as reflection, refraction, and diffraction. These systems include those that replace air with another gas (such as nitrogen), completely remove gases (by creating a vacuum), or incorporate liquids (such as fluids with matching refractive indices) or solids (such as glass with matching refractive indices). These modifications are intended to overcome problems arising in real-world operating environments due to airflow, heat, vibration, and other factors.

[0003] To input or change data in these traditional systems, microdisplay devices, such as liquid crystal displays (LCDs) and digital micromirror displays (DMDs), are typically used. These devices comprise an array of pixels and are generally operated by modulating the transmission of light (each pixel in the device acts as a shutter), reflection (each pixel changes the direction and / or properties of incident light), or diffraction (each pixel causes the incident light to diffract).

[0004] Recently, self-emissive microdisplay devices, such as organic light-emitting diode (OLED) and inorganic light-emitting diode (microLED) displays, have been developed, in which each electrically controlled pixel emits its own light. For display applications requiring coherent light, such as optical information processing or computation, both non-emissive and self-emissive displays have their drawbacks. The switching speed of non-emissive displays can be quite limited because they rely on the mechanical movement of liquid substances or solid structures, theoretically much slower than the speed achievable with solid-state electrical signal modulation. Existing self-emissive displays emit incoherent light and cannot be used in system designs requiring optical coherence. Therefore, a new type of display is needed that can both emit coherent light and be modulated at high speeds.

[0005] Similarly, these conventional systems use cameras and sensors to convert the results of optical processing into electrical signals for use by conventional electronic computing systems. These sensors are typically photodetector arrays or imaging sensors (cameras) fabricated using complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) technologies. However, most of these sensors are generally designed for applications where light intensity is more important than phase, such as cinematography or astronomy, where phase is preferred for optical information processing systems due to its higher information carrying capacity. Likewise, typical sensors operate very slowly (usually one to two orders of magnitude slower) compared to the memory technologies available in conventional computing systems, partly due to their targeted operational use (human-centric devices such as cinema and video cameras) and partly due to chip packaging. Therefore, there is a strong need for photodetector arrays that operate at high speeds and manipulate the phase or multiple properties of light. Summary of the Invention

[0006] According to a first independent aspect, an SLM device according to claim 1 is provided. Optionally, the SLM device may be self-emitting.

[0007] This aspect of the invention relates to optical modulation (especially phase, optionally intensity, amplitude, and / or polarization) for information transmission and / or information processing purposes, wherein multiple light emitting, modulation, and / or detection components or devices are combined in various configurations, with or without conventional optical components or devices, to form an optical information processing system. The device according to this aspect includes one or more optical waveguides that carry light for modulation, transmission, and / or detection (phase, intensity, amplitude, polarization, or combinations thereof). At least one (preferably each) waveguide can be modulated or influenced by straight, adjacent, or surrounding components (e.g., electro-optic waveguides, thermo-optic waveguides, or other adjacent waveguides) to alter or maintain optical properties, including phase, intensity, amplitude, and / or polarization, as light passes through the waveguides and the device.

[0008] The device according to at least one independent aspect of the invention is an optical modulation or through-hole device. Phase, intensity, amplitude, and / or polarization modulated optical waveguides on the device are arranged as an array of transmitters to form an emitting or self-emitting spatial light modulator or display device.

[0009] Optical modulation can be achieved, for example, passively through the physical design of the waveguide or actively through an electronically controlled modulator, by using one or more modulation materials aligned with, adjacent to, or surrounding the optical waveguide to alter the refractive index of the waveguide or to generate interference within the waveguide. Such modulation materials or components can include, but are not limited to, materials or components that induce linear (Pockels) effects, such as thermo-optical phase shifters; materials or components that induce quadratic (Kerr) effects, such as electro-optic polymers; or materials or components that induce other nonlinear effects. Modulation components can also include gain components, such as linear waveguide amplifiers, planar waveguide amplifiers, or volumetric waveguide amplifiers, including evanescent coupled-pump amplifiers. For example, the light source can be coupled to each transmitting waveguide of the device, either on or off-device, via a branched or fan-out waveguide array, thereby splitting the original light source into multiple paths. If desired, such as in the case of a fiber-coupled laser diode, this allows the emitted light to maintain the coherence characteristics of the original light source. For example, the waveguide and phase modulation elements can be formed using photolithography. In the optical path, a microlens array may optionally follow the emitting element. This microlens array is used to capture the light emitted from each waveguide and project it onto the collimating stage.

[0010] Optionally, all transmitting element waveguides branch off from a single waveguide, which is coupled via a waveguide or optical fiber to a light source on or outside the device. Each waveguide may have any number of modulation or mixing components, as described for the core modulation device. The transmitting surface may be planar, hemispherical, or some other non-planar shape.

[0011] In another independent aspect, a receiver-transmitter SLM device is provided according to any one of the appended claims. Accordingly, the device has at least two element arrays, one for receiving light and one for transmitting light. The number of elements on the receiving array may or may not be equal to the number of elements on the transmitting array. The receiving element and / or transmitting element may each be coupled to their own external fiber optic cable, thereby allowing modulated light to enter and / or leave the device through the fiber rather than free space. At least one waveguide connects the receiving element to the transmitting element and may or may not have any number of modulation components as described above with respect to the first independent aspect. The receiving array may or may not be in the same spatial plane, orthogonal plane, opposite plane, or have any other configuration relative to the transmitting array, including non-planar arrangement or orientation.

[0012] In one variation of the receiver-transmitter device, the number of receiving array elements is equal to the number of transmitting array elements, and the device may or may not have waveguide modulation or mixing components. In a second variation of the receiver-transmitter device, the number of receiving array elements is less than the number of transmitting array elements, and it may or may not be configured to scale the input to a larger array; the device may or may not have waveguide modulation or mixing components. In a third variation of the receiver-transmitter device, the number of receiving array elements is greater than the number of transmitting array elements, and it may or may not be configured to scale down a larger array to a smaller array; the device may or may not have waveguide modulation or mixing components, wherein the waveguides may or may not be configured such that light in one or more waveguides may or may not interact with or affect light in one or more waveguides within the device.

[0013] In the subordinate aspect, a single-source transmitter is combined with a receiver-transmitter SLM device variant. Data enters the receiver array of each element via free space or coupled optical fiber and modulates the single-source branch waveguide array within the device. After modulation, light exits the device from the modulated single-source branch waveguide transmitter array. The internal waveguide array may or may not have modulation or mixing components as described above for the core single-source transmitter and receiver-transmitter devices.

[0014] In another independent aspect, a photoelectric detection device as described in any one of the appropriate claims is provided. This photoelectric detection device may include a receiver waveguide-coupled optical receiving element, as described in a receiver-transmitter device. The internal waveguide may or may not have modulation or mixing components as described with respect to the first device and its variations.

[0015] In one variation of the photodetector device, a photodetector array is provided, with each waveguide terminating at an electro-optical photodetector. All waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0016] In another variation of the photoelectric detection device, an element-by-element interferometry apparatus is provided. The light source, which serves as the data carrier for the system, is branched as described in the single-source transmitter (SLM) device and coupled to a receiver element waveguide array via interferometric or differential elements, such as Mach-Zender interferometers or differential detector elements, which determine the phase shift between the original light source and the light received by each basic waveguide in the device. All waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0017] In another variation of the photoelectric detection device, a hybrid amplitude-phase detection device is provided, which is a combination of the first and second variations. Each basic waveguide terminates in a hybrid detection device that may or may not divide the waveguide into one or more separate detectors to measure a variety of optical properties, including but not limited to detectors for measuring the amplitude or intensity of light, detectors for measuring the phase of light, detectors for measuring the polarization of light, or detectors for measuring any combination of optical properties. All possible detectors measure these properties relative to known values ​​(e.g., known constant values), previous values, or values ​​relative to the original light source. All waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0018] In another subordinate aspect, an optical system including a self-emitting SLM device is provided, wherein each of the plurality of waveguides shares a common optical axis with at least one other device via a free-space region. The free-space region may, for example, be a gas, liquid, solid, or vacuum.

[0019] Optionally, the optical system includes at least one lens with a focal length of f, and any number of additional optical elements. Optionally, the optical system includes at least one component with a focal length of f, and any number of additional optical elements. The optical path length of the free space between two connected devices can be equal to 2f. Optionally, the total optical path length of the free space between three successively connected devices is equal to 4f. Alternatively, the optical path length of the free space between two connected devices is at least 2f. Optionally, the total optical path length of the free space between three successively connected devices is at least 4f.

[0020] Any device that performs photoelectric detection can detect: the phase of light, the amplitude of light, the polarization of light, the intensity of light, the phase and amplitude of light, the phase and intensity of light, the phase and polarization of light, the amplitude and polarization of light, the intensity and polarization of light, the phase, amplitude and polarization of light, and the phase, intensity and polarization of light.

[0021] Fundamentally, the first independent aspect refers to a spatial light modulation device used to modulate or transmit light to subsequent stages of the system, and at least one further independent aspect refers to a photoelectric detection device used to terminate the system and convert information from the optical domain to the electrical domain. Variations of these two devices can form components in an optical information processing system.

[0022] Variations of the independent aspects defined in the claims can be used to replace one or more components in a conventional optical information processing system. A single-source emitter can be used in place of a conventional display device (such as a television, computer, or projector display) or as the first stage of a conventional optical information processing system, replacing both the light source and the first spatial light modulator in the system. Similarly, a receiver-transmitter (SLM) device can be used as a filter stage in an optical modulator / optical information processing system. A photodetector can be used as a replacement for the final stage of a conventional optical information processing system, replacing a camera or imaging sensor array, where the input light source is a laser or other coherent light source that can be coupled to the photodetector.

[0023] Using these displays and sensor arrays together can create compact optical information processing systems. Different combinations of these displays and camera devices offer different benefits, providing the possibility of replacing some or all of traditional optical information processing systems with these components. In their preferred configurations, optical information processing systems offer significant improvements in speed, resolution, and accuracy compared to traditional systems, and can completely replace traditional electronic computing architectures.

[0024] Other aspects

[0025] In another independent aspect, a spatial optical modulation (SLM) device is provided, comprising: one or more optical inputs; one or more optical outputs; a plurality of waveguides arranged as a receiver and / or transmitter array, wherein each waveguide is coupled to one or more optical inputs; and at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides. The waveguides and the optical modulation element are integrated in at least one common module, wherein one of the optical inputs or outputs is connected to a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. Preferably, the module has electro-optical interconnects for connection to a processing system. Preferably, the at least one optical modulation element is aligned with at least one of the plurality of waveguides. Preferably, the at least one optical modulation element is a waveguide adjacent to at least one of the plurality of waveguides. Optionally, the at least one optical modulation element surrounds at least one of the plurality of waveguides.

[0026] Preferably, at least one optical modulation element comprises one or more of the following: a thermo-optical phase shifter, an electro-optic polymer, at least one gain component, and / or an evanescent coupling pump amplifier. Optionally, the optical input is external to the device and coupled to each of the plurality of waveguides via branching elements. In another embodiment, the device further includes another waveguide array for splitting the optical input into multiple optical paths. In another embodiment, the device further includes a microlens array for capturing the modulated light after passing through at least one of the plurality of waveguides and projecting the captured modulated light into a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In one aspect, the plurality of waveguides branch off from a single waveguide coupled to the optical input. In another aspect, the module integrates the plurality of waveguides and has an optical emitting surface and / or an optical receiving surface. In another aspect, at least one of the plurality of waveguides has a planar optical emitting surface and / or a planar optical receiving surface. Optionally, at least one of the plurality of waveguides has a non-planar optical emitting surface and / or a non-planar optical receiving surface. In another aspect, the SLM device is self-emitting.

[0027] In another independent aspect, embodiments provide an optical processing system comprising a plurality of SLM devices according to any aspect disclosed herein, wherein at least two SLM devices are connected via a common free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In one subsidiary aspect, at least one lens is optically positioned between the at least two SLM devices. In another subsidiary aspect, at least one of the SLM devices is in contact with an electro-optical carrier. In another subsidiary aspect, the optical processing system includes at least one lens with a focal length of f and any number of additional optical elements. Preferably, the optical processing system includes at least one component with a focal length of f and any number of additional optical elements. Preferably, the optical path length of the free space between two connected devices is equal to 2f. Further optionally, the optical path length of the free space between two connected devices is at least 2f. Further optionally, the optical path length of the free space between two connected devices satisfies one or more of the following: at least f, less than f, equal to f. Further optionally, the total optical path length of the free space between three successively connected devices is equal to 4f. Further optionally, the total optical path length of the free space between three successively connected devices is at least 4f. In a further aspect, the total optical path length in free space between the three successively connected devices satisfies one or more of the following: at least f, less than f, or equal to f. In another auxiliary aspect, one or more of the devices perform photoelectric detection and detect one or more of the following: the phase of light; the amplitude of light; the polarization of light; the intensity of light; the phase and amplitude of light; the phase and intensity of light; the phase and polarization of light; the amplitude and polarization of light; the intensity and polarization of light; optionally, intensity and polarization can be detected simultaneously; combinations of the phase, amplitude, and polarization of light; combinations of the phase, intensity, and polarization of light.

[0028] In a broader aspect, embodiments provide an optical correlator comprising a plurality of SLM devices according to any aspect described herein, wherein at least two SLM devices are interconnected via a common free space region partially occupied by a vacuum, gas, liquid, and / or solid medium.

[0029] In a broader aspect, a receiver-transmitter SLM device includes a first plurality of elements arranged as a transmitter array, a second plurality of elements arranged as a receiver array, and a waveguide array coupling the transmitter array and the receiver array; wherein the transmitter array, the receiver array, and the waveguide array are integrated into a common module. Preferably, the module has electro-optical interconnects for connection to a processing system. More preferably, the first plurality of elements are coupled to corresponding optical fibers to allow modulated light to leave the device. Optionally, the second plurality of elements are coupled to corresponding optical fibers to allow modulated light to enter the device. In another aspect, the receiver-transmitter SLM device further includes at least one optical modulation element for modulating light passing through at least one waveguide. In another aspect, the at least one optical modulation element is aligned with the at least one waveguide. In another aspect, the at least one optical modulation element is a waveguide adjacent to the at least one waveguide. In another aspect, the at least one optical modulation element surrounds part or all of the at least one waveguide. Preferably, at least one optical modulation element comprises one or more of the following: a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, a mechanical modulator, and at least one gain component; optionally, the at least one gain component comprises an evanescent coupled-pump amplifier. Optionally, the transmitter array and the receiver array are in the same plane. More preferably, the transmitter array is a plane orthogonal to the receiver array. Optionally, the transmitter array is in a plane opposite to the receiver array. In another aspect, the number of transmitters is equal to, greater than, or less than the number of receivers.

[0030] In a broader aspect, embodiments provide a system comprising at least one SLM device according to any aspect described herein and at least one receiver-transmitter SLM device according to any aspect described herein, the system being configured to receive light with a receiver array of the receiver-transmitter SLM device to provide an optical input, wherein a plurality of waveguides of the self-emitting spatial light modulation SLM device branch out from a single waveguide coupled to the optical input.

[0031] In a broader aspect, a photoelectric detection device includes an input array, an output array, and a plurality of waveguides optically arranged between the input array and the output array, wherein the input array, the output array, and the plurality of waveguides are integrated in a common module and equipped with a photodetector to convert modulated light from the optical domain to the electrical domain. Optionally, the photoelectric detection device further includes at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides. Optionally, the photoelectric detection device includes at least one of the plurality of waveguides terminating at one or a combination of: an interferometric photodetector, an electro-optical photodetector, and / or a differential photodetector. Optionally, one or more waveguides are divided into multiple detectors for measuring various optical properties. In a further dependent aspect, the photodetector performs photoelectric detection by one or more of the following: detecting the phase of light, detecting the amplitude of light, detecting the polarization of light, detecting the intensity of light, detecting both phase and amplitude of light, detecting both phase and intensity of light, detecting both phase and polarization of light, detecting both amplitude and polarization of light, detecting both intensity and polarization of light; optionally, intensity and polarization can be detected simultaneously; a combination of phase, amplitude, and polarization of light can be detected; a combination of phase, intensity, and polarization of light can be detected.

[0032] In a broader sense, embodiments provide a display device that includes an SLM device according to any aspect described herein.

[0033] In a broader aspect, the SLM-photodetector includes one or more optical inputs, one or more optical outputs, a plurality of waveguides arranged as an array of receivers and / or transmitters, wherein each waveguide is coupled to one or more optical inputs, and at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides; wherein the waveguides and the optical modulation element are integrated in at least one common module, wherein one of the optical inputs or the optical outputs is in contact with a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium; the device also includes one or more photodetectors for converting the modulated light from the optical domain to the electrical domain, the photodetectors operating with a plurality of waveguide elements of the waveguides or with a plurality of waveguide elements of another plurality of waveguides; the plurality of waveguide elements are arranged to form a receiver array.

[0034] In a broader sense, embodiments of the present invention relate to SLM-photoelectric detection devices.

[0035] In a broader aspect, a receiver-transmitter-photodetector device includes: a first plurality of elements arranged as a transmitter array; a second plurality of elements arranged as a receiver array; at least one waveguide coupling at least one of the first plurality of elements to at least one of the second plurality of elements; the device further includes one or more photodetector elements for converting modulated light from an optical domain to an electrical domain, the photodetector elements operating with one or more of the plurality of elements or with one or more of another plurality of elements; the plurality of elements being arranged as part of the receiver array or arranged as another receiver array.

[0036] In a broader aspect, embodiments describe an optical information processing system comprising at least one SLM device according to any aspect described herein. In a broader aspect, embodiments describe an optical information processing system comprising at least one SLM-photodetector according to any aspect described herein.

[0037] In a broader sense, the embodiments describe an optical information processing system comprising at least one receiver-transmitter-photodetector according to any suitable foregoing aspect.

[0038] In a broader sense, embodiments describe an optical information processing system comprising at least one receiver-transmitter SLM device and a photodetector device according to any suitable foregoing aspect.

[0039] In a broader sense, embodiments describe an optical information processing system comprising at least one SLM and a photodetector according to any suitable foregoing aspect.

[0040] In a broader aspect, an optical system includes at least one SLM device according to any of the preceding claims, wherein each of the emitting or receiving surfaces from any given SLM shares a common optical axis with at least one other emitting or receiving surface via a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium.

[0041] Advantageously, many of these embodiments offer a significant reduction in the number of pixels and consequently lower resolution compared to liquid crystal SLM arrays or panels, but the integrated waveguide provides improved speed for the integrated solution. Attached Figure Description

[0042] Various aspects of the invention will be described with reference to the accompanying drawings, in which:

[0043] Figure 1 A schematic diagram of a 2f system with one input device and one output device is shown.

[0044] Figure 2 A schematic diagram of a 4f system with one input device and one output device is shown.

[0045] Figure 3 A schematic diagram of a 4f system with an input device, a filter device and an output device is shown.

[0046] Figure 4 A schematic diagram of a 4f system with two input devices, one filter device, and one output device is shown.

[0047] Figure 5 It shows Figure 4 The diagram shows the configuration of the system, where each input has an independent external laser to provide a carrier signal and / or pump energy.

[0048] Figure 6 It shows Figure 4 The diagram shows the configuration of a system in which all inputs share the same external laser to provide carrier signals and / or pump energy.

[0049] Figure 7 It shows Figure 4 The diagram shows the configuration of a system in which all inputs share a laser on the same device to provide carrier signals and / or pump energy.

[0050] Figure 8 It shows Figure 3 The diagram shows the configuration of a system where the input has an external laser to provide a carrier signal and / or pump energy.

[0051] Figure 9 It shows Figure 3 The diagram shows a system configuration where the input has an on-device laser to provide a carrier signal and / or pump energy.

[0052] Figure 10 It shows Figure 1 The diagram shows the configuration of a system where the input has an external laser to provide a carrier signal and / or pump energy.

[0053] Figure 11 It shows Figure 1 The diagram shows a system configuration where the input has an on-device laser to provide a carrier signal and / or pump energy.

[0054] Figure 12 It shows Figure 4 The diagram shows the configuration of the system, where each input has an independent on-device laser to provide a carrier signal and / or pump energy.

[0055] Figure 13 It shows Figure 4 The diagram shows the configuration of the system, where the data line provides both carrier and data signals.

[0056] Figure 14 It shows Figure 3 The diagram shows the configuration of the system, where the data line provides both carrier and data signals.

[0057] Figure 15 It shows Figure 1 The diagram shows the configuration of the system, where the data line provides both carrier and data signals.

[0058] Figure 16a and Figure 16b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices and their receiving and transmitting surfaces are parallel to the top surface of a carrier chip shared by these devices.

[0059] Figure 17a and Figure 17b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices consist of multiple chips, and all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip.

[0060] Figure 18a and Figure 18b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices consist of multiple chips, all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are incorporated into the carrier chip.

[0061] Figure 19a and Figure 19b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices consist of multiple chips, all receiving and transmitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are incorporated into the carrier chip.

[0062] Figure 20a and Figure 20b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices are integrated in their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of the shared carrier chip.

[0063] Figure 21a and Figure 21b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices are single monolithic components and all receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0064] Figure 22a and Figure 22b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, wherein all devices include multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0065] Figure 23a and Figure 23b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, wherein all devices include multiple components stacked perpendicular to the top surface of their shared carrier chip, and all aggregated receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0066] Figure 24a and Figure 24b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0067] Figure 25a and Figure 25b They are shown respectively Figure 5 The diagram shows a top view and a side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0068] Figure 26a and Figure 26b They are shown respectively Figure 8 The diagram shows a top view and a side view of a possible configuration, in which all devices and their receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0069] Figure 27a and Figure 27b They are shown respectively Figure 8 The diagram shows a top view and a side view of a possible configuration, wherein all devices include multiple chips, and all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip.

[0070] Figure 28a and Figure 28b They are shown respectively Figure 8 The diagram shows a top view and a side view of a possible configuration, in which all devices include multiple chips, all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are integrated in the carrier chip.

[0071] Figure 29a and Figure 29b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices include multiple chips, all receiving and transmitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are integrated into the carrier chip.

[0072] Figure 30a and Figure 30b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices are integrated into their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0073] Figure 31a and Figure 31b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices are single monolithic components and all receiving and transmitting surfaces are perpendicular to the top surface of the shared carrier chip.

[0074] Figure 32a and Figure 32b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices include multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated receive and transmit surfaces perpendicular to the top surface of their shared carrier chip.

[0075] Figure 33a and Figure 33b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices include multiple components stacked perpendicular to the top surface of their shared carrier chip, and all aggregated receive and transmit surfaces are perpendicular to the top surface of their shared carrier chip.

[0076] Figure 34a and Figure 34b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0077] Figure 35a and Figure 35b They are shown respectively Figure 8 The diagram shows a top and side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0078] Figure 36a and Figure 36b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices and their receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0079] Figure 37a and Figure 37b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices include multiple chips, and all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip.

[0080] Figure 38a and Figure 38b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices include multiple chips, all receiving and transmitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are integrated into the carrier chip.

[0081] Figure 39a and Figure 39b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices include multiple chips, all receiving and transmitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks, except for the receiving and transmitting chips, are integrated into the carrier chip.

[0082] Figure 40a and Figure 40b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices are integrated into their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0083] Figure 41a and Figure 41b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices are single monolithic components and all receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0084] Figure 42a and Figure 42b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices include multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated receive and transmit surfaces perpendicular to the top surface of their shared carrier chip.

[0085] Figure 43a and Figure 43b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices include multiple components stacked perpendicular to the top surface of their shared carrier chip, and all aggregated receive and transmit surfaces are perpendicular to the top surface of their shared carrier chip.

[0086] Figure 44a and Figure 44b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are parallel to the top surface of their shared carrier chip.

[0087] Figure 45a and Figure 45b They are shown respectively Figure 10 The diagram shows a top and side view of a possible configuration, in which all devices and free space regions are integrated into their shared carrier chip, and all receiving and transmitting surfaces are perpendicular to the top surface of their shared carrier chip.

[0088] Figure 46 A schematic diagram of a general complex optical system is shown, comprising one or more subsystem components, wherein the subsystem components can be any and / or possible complex optical systems, structures, configurations, systems, devices and / or variations thereof.

[0089] Figure 47 It shows Figure 46 The diagram shows a possible configuration of a complex system with four subsystem components.

[0090] Figure 48A schematic diagram of a possible computer peripheral device incorporating a complex optical system is shown.

[0091] Figure 49 A schematic diagram of a possible computer peripheral device is shown, which combines a complex optical system with the functionality of a complex optical system and from... Figure 48 The electrical components and / or memory assemblies of the peripheral devices shown.

[0092] Figure 50 A schematic diagram of a possible computer motherboard incorporating a complex optical system is shown.

[0093] Figure 51 A schematic diagram of a possible smartphone motherboard incorporating a complex optical system is shown.

[0094] Figure 52 A schematic diagram of a possible processor combining an electrical processing unit and a complex optical system is shown.

[0095] Figure 53 The combination is shown Figure 52 The diagram shows a possible computer motherboard for an electro-optical processor.

[0096] Figure 54 A schematic diagram of a possible electro-optical computer motherboard incorporating a complex optical system is shown.

[0097] Figure 55 A schematic diagram of a possible electro-optic high-performance computing system is shown, including one or more electrical and / or electro-optic computer servers.

[0098] Figure 56 A schematic diagram of a basic waveguide array device is shown.

[0099] Figure 57 A schematic diagram of a basic waveguide array device with an enlarged view is shown.

[0100] Figure 58 A schematic diagram with an enlarged view of a basic waveguide array device and an internal waveguide network is shown.

[0101] Figure 59 A schematic diagram showing an enlarged view of a photoelectric detection device with a waveguide array and an internal waveguide network is presented. Detailed Implementation

[0102] In the example, the optical information processing system includes one or more variations of the means according to the independent aspects described herein, wherein these means can be configured as follows: Figure 1 The 2f optical information processing system shown (e.g., a joint transform correlator system), such as Figure 2 and Figure 3The illustrated 4f optical information processing system (e.g., a matched filter correlator system), and / or any other combination of components and / or devices. The components and / or devices of the optical information processing system may be isolated by free space, gas (e.g., nitrogen), liquid (e.g., a refractive index-matching liquid), solid (e.g., a refractive index-matching glass), or vacuum. One or more light sources may be used together with one or more devices in the system as data carriers and / or modulators. Embodiments of the system may be standalone, or part of a larger system (a conventional optical system, electrical system, or electro-optic system, or a system linked together with the same or other configurations), or integrated into an optical fiber communication system (e.g., integrated into an optical fiber transmission line for online analysis, processing, or modulation). For 2f, 4f, and / or free-space optical systems, the systems described herein can be fully simulated internally and can detect the phase of light or simultaneously detect the amplitude and phase of light. Similarly, embodiments employ waveguide transmitting arrays with receiving (photodetection) arrays to implement the optical information processing system. The potential to combine small waveguides into compact waveguide arrays enables, in some embodiments, these optical information processing systems to be packaged into compact form factors, similar to existing chip-level devices such as central processing unit (CPU) chips, field-programmable gate array (FPGA) chips, and graphics processing unit (GPU) chips.

[0103] For embodiments of certain devices, systems, configurations, complex systems, and / or variations thereof disclosed herein, waveguide refers to an optical waveguide, i.e., a waveguide capable of propagating light, including but not limited to wires, ribs, slots, buried channels, strip loads, optical tubes, optical fibers, etc., with a design wavelength preferably between 100 nm and 1 mm, preferably a visible light wavelength of about 380 nm to 750 nm, to be compatible with conventional display and camera systems, and a telecommunications wavelength in the range of 850 nm to 1625 nm. A telecommunications wavelength of 1550 nm is a preferred target wavelength for embodiments of the invention because it is the primary wavelength used in telecommunications and allows optical information processing systems to be directly coupled to existing fiber optic infrastructure to achieve conventional functions such as network monitoring or routing, analysis or filtering, encryption or decryption, encoding or decoding, compression or decompression, or many other conceivable functions (all of which can be implemented using conventional mathematical models or artificial intelligence methods). Furthermore, waveguides may be designed for single-mode propagation, which makes the fiber smaller and more predictable because waveguides are capable of propagating only single-mode light, making the defects very noticeable when zero propagation occurs. Therefore, at the preferred telecommunication wavelength of 1559 nm, where the waveguide satisfies the single-mode propagation condition, the primary waveguide diameter of interest in at least some embodiments of the present invention will be between 100 nm and 1000 nm. The waveguides described herein can be made of many materials, including but not limited to silicon, germanium, gallium arsenide, and indium phosphate. Preferred materials should have low loss and be compatible with conventional electronic chip lithography methods to increase ease of integration with existing chips and platforms and minimize costs. For the preferred design wavelength of 1550 nm, silicon-on-insulator (e.g., silicon-on-silicon dioxide) with a ribbed waveguide design can support single-mode propagation with zero birefringence at a rib diameter of 277 nm and an etch depth of 360 nm. To ensure no crosstalk between waveguides, it is assumed that the distance between waveguides is at least one to two times the maximum rib size (but smaller spacing is also feasible). Therefore, if a two-dimensional waveguide array is considered, such as the two-dimensional waveguide array in the embodiments of receiving and / or transmitting arrays, the pixel pitch of the array may optionally be between 720 nm and 1080 nm. A larger pixel pitch will be used to calculate the waveguide array resolution of the example system described here, but for ease of discussion, the pixel pitch will be approximated as 1 μm.

[0104] Modulators, detectors, and other electro-optical elements coupled to waveguide networks of all devices, systems, configurations, complex systems, and / or variations thereof disclosed herein may be components that limit the maximum possible data throughput in some embodiments, because in preferred embodiments, the optical components of the system operate passively at the speed of light. Therefore, in some embodiments, the assumed system operating rate may be equivalent to the operating rate of the slowest system component. Depending on the included devices, the operating speed may be between 20 MHz and 30 GHz, but slower or faster operating speeds are conceivable.

[0105] Figures 1 to 55 Schematic diagrams of all devices, systems, configurations, structures, complex systems, and / or variations thereof are shown, and are not intended to limit the scope of the invention, but rather to clearly depict the basic components that can be incorporated into each embodiment of a device, system, configuration, structure, complex system, and / or variation thereof. Therefore, unless expressly stated herein, the drawings do not necessarily depict the actual size, scale, or location of any component, device, system, configuration, structure, complex system, and / or variation thereof. Similarly, unless expressly stated herein, other devices, systems, configurations, structures, complex systems, and / or variations thereof, including those shown in the figures and / or described herein, may exist in addition to those depicted in the figures and / or described herein.

[0106] Figure 56A simplified drawing of apparatus 5604 is shown, comprising a building block or module that can be used in any embodiment of a spatial optical modulation apparatus, a receiver-transmitter apparatus, and / or variations thereof. In a broad sense, the apparatus may be a receiver-transmitter SLM apparatus comprising: a first plurality of elements arranged in a transmitter array; a second plurality of elements arranged in a receiver array; and at least one waveguide coupling at least one of the first plurality of elements to at least one of the second plurality of elements. In a more extensive sense, the apparatus may be a receiver SLM apparatus or a transmitter SLM device. In an accessory aspect, the apparatus may optionally include the first plurality of elements coupled to corresponding optical fibers to allow modulated light to exit the apparatus. In another accessory aspect, the second plurality of elements may optionally be coupled to corresponding optical fibers to allow modulated light to enter the apparatus. In yet another accessory aspect, the apparatus may optionally further include at least one optical modulation element for modulating light passing through the at least one waveguide. In yet another accessory aspect, the at least one optical modulation element is aligned with the at least one waveguide. In yet another accessory aspect, the at least one optical modulation element is a waveguide adjacent to the at least one waveguide. Preferably, the modulation element and the waveguide are packaged in a silicon chip. In another aspect, at least one optical modulation element optionally surrounds a portion or all of the at least one waveguide. In another aspect, the at least one optical modulation element is one or a combination of the following: a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, and / or a mechanical modulator. In another aspect, the at least one optical modulation element optionally includes at least one gain component. In another aspect, the at least one gain component optionally includes an evanescent-coupled pump amplifier. In another aspect, the transmitter array and the receiver array are in the same plane. In another aspect, the transmitter array is in a plane orthogonal to the receiver array. In another aspect, the transmitter array is in a plane opposite to the receiver array. In another aspect, the number of transmitters is equal to, greater than, or less than the number of receivers.

[0107] Preferably, these devices have an internal waveguide network (see...) Figure 58 The waveguide network includes one or more optical waveguides that carry light for the purpose of modulating, transmitting, and / or detecting the light carried within them (the phase, intensity, amplitude, polarization, or combinations thereof). Each waveguide may be modulated or influenced by components (e.g., electro-optic, thermo-optic, or other neighboring waveguides) that are in line with, adjacent to, or surrounding the waveguide, with the aim of altering or maintaining the properties of the light, including phase, intensity, amplitude, and / or polarization, as the light passes through the waveguide and the device. Similarly, the device has one or more waveguide coupling array surfaces that allow the waveguide network to be connected to external systems (see [link to external system documentation]). Figure 57Device 5604 illustrates a device with two surfaces, optional surface 5606 and surface 5608. These surfaces can be used, for example, to receive light from an external source via optional surface 5606, or can be used, for example, to emit light via surface 5608. The number of elements in the waveguide array on any given surface is not limited. Similarly, the number of elements in any given waveguide array may not be equal to the number of elements on any other waveguide array surface.

[0108] Figure 57 A simplified schematic diagram of device 5604 is shown, including an enlarged view of the waveguide array surface. For Figure 57 The description of device 5604 and its target Figure 56 The description given is the same, with the following additional optional details. An internal waveguide 5712 terminates at a surface 5608, such that the internal waveguide 5712 can emit light from its interior via surface 5608 in a transmitting configuration, or receive light from surface 5608 in a receiving configuration. Each waveguide termination is optionally coupled to a microlens 5722 that facilitates coupling light into and out of the waveguide.

[0109] Figure 58 A simplified schematic diagram of device 5604 is shown, including an enlarged view of the internal waveguide 5712. (For...) Figure 58 The description of embodiments of the device 5604 can be related to those for... Figure 57 and Figure 58 The description given is the same, with the following additional details. The internal waveguide 5712 optionally terminates at the waveguide array 5608, such that the internal waveguide 5712 can, in a transmitting configuration, emit light from and receive light from the waveguide array surface 5608. Each waveguide termination is optionally coupled to a microlens 5722 that facilitates coupling light into and out of the waveguide. The modulator 5832 represents any component aligned with, adjacent to, or surrounding the waveguide 5712 that can alter or maintain the characteristics (including phase, intensity, amplitude, and / or polarization) of the light within the waveguide through electro-optic, thermo-optic, acousto-optic, or any other modulation method. Any waveguide in the network of internal waveguides 5712 can have any number of modulators directed to the modulator 5832. If the device has multiple waveguide array surfaces, the internal waveguide network will interconnect with these surfaces to achieve the desired modulation of the received light. In some embodiments, the waveguide and modulator are integrated in the same block, module, or chip, which may optionally be made of silicon. In some embodiments, the block or module is arranged to emit or receive light from free space through a space containing gas or liquid, the space being suitable for optical communication between modules or blocks of the type discussed.

[0110] Figure 59A photodetector 5904 is shown as a simplified example of a photodetector for converting light into an electrical signal. In a broader, independent aspect, embodiments include a photodetector for converting modulated light from an optical domain to an electrical domain, the device comprising a plurality of waveguide elements arranged to form a receiver array. Optionally, the photodetector further includes at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides. In another aspect, at least one of the plurality of waveguides terminates at one or more interferometric photodetectors, one or more electro-optical photodetectors, and / or one or more differential photodetectors. In another aspect, the device includes an optical input coupled to at least one waveguide element. In another aspect, the coupling is achieved via an interferometric element or a differential element. In another aspect, at least another of the plurality of waveguides may optionally be divided into a plurality of detectors for measuring a plurality of optical properties. In another aspect, the photoelectric detection device performs photoelectric detection by one or more of the following methods: detecting the phase of light; detecting the amplitude of light; detecting the polarization of light; detecting the intensity of light; detecting both the phase and amplitude of light; detecting both the phase and intensity of light; detecting both the phase and polarization of light; detecting both the amplitude and polarization of light; detecting both the intensity and polarization of light; optionally, simultaneously detecting both intensity and polarization; detecting the phase, amplitude, and polarization of light; and detecting both the phase, intensity, and polarization of light.

[0111] Return to Figure 59 Surface 5906 is a light-receiving surface, and the array of coupled waveguide elements therein is shown in a magnified view. In some embodiments, the description of surface 5906 is consistent with that of... Figures 56 to 58 The description given for surface 5608 is the same. Similarly, in some embodiments, the description of internal waveguide 5964 is the same as that given for... Figures 56 to 58 The description of the internal waveguide 5608 is the same as that given in some embodiments. In some embodiments, the description of the microlens 5922 may also be the same as that given for... Figures 56 to 58The description given for the microlens 5722 is the same. The photodetector 5904 and internal waveguide 5964 are coupled to photodetector component 5982, which is one or more electro-optical or optical components, including but not limited to detector components for measuring the amplitude or intensity of light, detector components for measuring the phase of light, detector components for measuring the polarization of light, or detector components for measuring any combination of optical properties. All possible detector components can measure these optical properties relative to known values ​​(e.g., known constant values), previous values, or original light sources, and may have interferometric or differential components such as a Mach-Zender interferometer or differential detector element, which determine the relative difference between the reference light source and the light received by the internal waveguide 5964. In some embodiments, both the waveguide and the photodetector are integrated into a common block, module, or chip, preferably a silicon-based chip. In some embodiments, the block or module is arranged to emit or receive light from free space through a space containing gas or liquid, the space being suitable for optical communication between modules or blocks of the type discussed.

[0112] Figure 1System 102 is shown, which can be used as an embodiment of an optical information system. In another broader aspect, embodiments of the invention provide an optical processing system comprising a plurality of SLM devices, wherein each SLM device includes: one or more optical inputs; one or more optical outputs; a plurality of waveguides arranged as a receiver and / or transmitter array, wherein each waveguide is coupled to one or more optical inputs; and at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides. The waveguides and the optical modulation element are integrated in at least one common module, wherein one of the optical inputs or outputs is in contact with a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. At least two SLM devices are connected through the common free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In a dependent aspect according to the broader aspect, at least one SLM device is configured such that at least one optical modulation element is aligned with at least one of the plurality of waveguides. Optionally, at least one SLM device is configured such that at least one optical modulation element is a waveguide adjacent to at least one of the plurality of waveguides. In another aspect, at least one SLM device in the SLM device includes at least one optical modulation element surrounding at least one of the plurality of waveguides. In another aspect, the at least one optical modulation element for the at least one SLM device in the SLM device is selected from: a thermo-optical phase shifter, an electro-optic polymer, and at least one gain component (optionally an evanescent coupled-pump amplifier). In another aspect, the optical input for the at least one SLM device in the SLM device is coupled to each of the plurality of waveguides via a branching element. In another aspect, the at least one SLM device in the SLM device further includes another waveguide array for splitting the optical input into multiple optical paths. In another aspect, the at least one SLM device in the SLM device further includes a microlens array for capturing the modulated light after passing through at least one of the plurality of waveguides and projecting the captured modulated light into a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In another aspect, the at least one SLM device in the SLM device is configured such that its plurality of waveguides branch off from a single waveguide coupled to the optical input. In another aspect, at least one SLM device in the SLM device is configured such that at least one of its plurality of waveguides has a planar light emitting surface and / or a planar light receiving surface. In another aspect, at least one SLM device in the SLM device is configured such that at least one of its plurality of waveguides has a non-planar light emitting surface and / or a non-planar light receiving surface. In another aspect, at least one SLM device in the SLM device is self-emitting. In another aspect, the optical processing system optionally includes at least one lens with a focal length f, and any number of additional optical elements.In another aspect, the optical processing system optionally includes at least one component with a focal length of f, and any number of additional optical elements. In another aspect, the optical path length of the free space between two connected devices is equal to 2f. In another aspect, the optical path length of the free space between two connected devices can be at least 2f. In another aspect, the optical path length of the free space between two connected devices can satisfy one or more of the following: at least f, less than f, equal to f. In another aspect, the total optical path length of the free space between three successively connected devices is equal to 4f. In another aspect, the total optical path length of the free space between three successively connected devices is at least 4f. In another aspect, the total optical path length of the free space between three successively connected devices satisfies one or more of the following: at least f, less than f, equal to f. In another aspect, the apparatus for performing photoelectric detection may optionally be configured to detect one or more of the following: the phase of light; the amplitude of light; the polarization of light; the intensity of light; the phase and amplitude of light; the phase and intensity of light; the phase and polarization of light; the amplitude and polarization of light; the intensity and polarization of light; optionally simultaneously detecting intensity and polarization; the phase, amplitude and polarization of light; and / or the phase, intensity and polarization of light.

[0113] For example, system 102 is a single processing device system that includes any variation of a spatial light modulator device (input device 104) and any variation of a photodetector (output device 106). The input device may be, for example... Figure 56 and Figure 57 The transmitter device can take the form of, for example, an output device. Figure 59 The receiver device takes the form of an input device and an output device, or both of them, can also be combined with an optical modulation element that can be embedded in a silicon photonic device, for example... Figure 58As shown. Input device 104 and output device 106 are separated from each other by a free space region 108 along their common optical axis, with a spacing of 2f. In other embodiments, it is envisioned that space occupied by gas or liquid replaces free space to suit optical communication between the modules or blocks in question. In some embodiments, the term "device" may take the form of an integrated chip or a portion of a chip combined with a waveguide and / or modulator arrangement as described in any other embodiment. A Fourier transform lens 110 is arranged at a distance f along their common optical axis between input device 104 and output device 106. Input data is received by input device 104 via wires, optical fibers, or free space (not shown) and used to modulate light within input device 104. Modulated light 112 is emitted from input device 104, received by lens 110 as converging light 114, and then incident on the receiving array (not shown) of output device 106. Output data is transmitted from system 102 using wires, optical fibers, or free space (not shown) connected to output device 106 at the output stage of system 102. System 102 reflects the functionality of a conventional "2f" optical Fourier transform configuration. Variations of the simplest system 102 include replacing the air in free space 108 with a gas (e.g., nitrogen), a liquid (e.g., a refractive index-matching fluid), a solid (e.g., a refractive index-matching glass), or a vacuum. In some embodiments, another variation of one of the simplest systems and all variations thereof include zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components along the common optical axis between input device 104 and output device 106.

[0114] One configuration of system 102 is a linear computation system, wherein linear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or linear element-wise mathematical operations are performed on the modulated light after modulation of the input data in input device 104 and before transmission. These operations include, for example, addition and multiplication. A second configuration of system 102 is a nonlinear computation system, wherein nonlinear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or nonlinear element-wise mathematical operations are performed on the modulated light after modulation of the input data in input device 104 and before transmission from device 104. These operations include, for example, quadratic and cubic operations. Figure 2The fourth configuration of the system 102 shown is system 102b, a "no-operation" or buffered system, in which light within the input device 104 is directly modulated by the input data without additional modulation and emitted as modulated light 112, passing through Fourier transform lens 110, then through Fourier transform lens 210, and received as collimated light 212 by the output device 106, where it is converted into an electrical signal without further modulation. In some embodiments, system 102b may be similar to system 102 except for an additional 4f optical path length between the input device 104 and the output device 106, and the addition of a second Fourier transform lens 210 along the common optical axis of the input device 104 and the output device 106. The fifth configuration of system 102 is characterized by any combination or variation of the configuration or function of the input device 104 and / or the output device 106. All variations of system 102 apply to all configurations of system 102. To avoid any doubt, the transmitter device may employ... Figures 56 to 58 The integrated waveguide unit can take the form of any of the descriptions in the text, and the receiver device can adopt... Figure 59 The receiver device can also be in the form of an integrated waveguide unit. Figures 56 to 58 The integrated waveguide unit is configured appropriately.

[0115] A more powerful optical information system than System 102 is a multiprocessor system, comprising one or more of the following: any variation of spatial light modulator devices arranged in any relative configuration, and any variation of photodetector devices (output devices). In some embodiments, the SLM device and the output device may be separated from each other by free space. A Fourier transform lens may be present between the SLM and the output device. The system's input stage receives input data via wires, optical fibers, or free space and uses the input data to modulate light within the system's input device. Output data is transmitted out of the system using one or more of wires, optical fibers, or free space connected to the output device at the system's output stage. One variation of the system includes replacing the free space air gap between one or more devices with a gas (e.g., nitrogen), a liquid (e.g., a refractive index-matching fluid), a solid (e.g., a refractive index-matching glass), or a vacuum, where such replacement of air in one free space region with another medium does not require implementation in any other free space region and is not the same as a substitution performed in any other free space region. Another variation of the system and all variations thereof include zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components.

[0116] Figure 3System 302 is shown, which is a relatively simple form of a multiprocessor system. System 302 is a dual-processor system, including an input device 104 and a filter device 304 (both the input device 104 and the filter device 304 are any variations of a spatial light modulator device, which can be...). Figures 56 to 58 As shown) and output device 106 (which can be any variation of a photoelectric detection device, such as Figure 59As shown in the diagram. Input device 104 and filter device 304 are spaced apart from each other along their common optical axis through the region of free space 108 by a distance of 2f. Similarly, filter device 304 and output device 106 are spaced apart from each other along their common optical axis through the region of free space 308 by a distance of 2f. A Fourier transform lens 110 is arranged between input device 104 and filter device 304 at a distance f along their common optical axis. Likewise, a Fourier transform lens 210 is arranged between filter device 304 and output device 106 at a distance f along their common optical axis. Because the converging light 114 received by filter device 304 travels internally before being emitted into free space 308 as modulated diverging light 214, the optical axis shared by input device 104 and filter device 304 within free space 108 and the optical axis shared by filter device 304 and output device 106 within free space 308 need not be the same optical axis (i.e., the optical axes can be different). The input device 104 of system 302 receives input data via wires, optical fibers, or free space (not shown) and uses the input data to modulate the light within the input device 104 of system 302. Modulated light 112 is emitted from the input device 104, received by lens 110, and becomes converging light 114, which is then incident on the receiving array (not shown) of the filter device 304. The filter device 304 of system 302 receives filtered data via wires, optical fibers, or free space (not shown) and uses the filtered data to modulate the light within the filter device 304 of system 302. The modulated diverging light 214 is emitted from the filter device 304, received by lens 210, and becomes collimated light 212, which is then incident on the receiving array (not shown) of the output device 106. Output data is transmitted from system 302 using wires, optical fibers, or free space (not shown) connected to the output stage of system 302. System 302 reflects the functionality of a conventional 4f optical Fourier transform configuration. For this embodiment and any other embodiment, other variations of the embodiment include replacing the air in free space 108 and / or any other free space (e.g., free space 308) with a gas (e.g., nitrogen), a liquid (e.g., a refractive index-matched fluid), a solid (e.g., a refractive index-matched glass), or a vacuum. Such replacement of air in one free space region with another medium does not need to be implemented in any other free space region, nor is it the same as a substitution performed in any other free space region. Another variation of the system and all variations thereof include zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components along the common optical axis between input device 104 and any other device (e.g., filter device 304), and / or along the common optical axis between any device (e.g., filter device 304) and output device 106.

[0117] One configuration of system 302 is a linear operation system, wherein linear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or linear element-wise mathematical operations are performed on the modulated light after modulation of the input data in input device 104 and before emission; and / or linear element-wise mathematical operations are performed on the filtered data before optical modulation in filtering device 304, or element-wise mathematical operations are performed on the modulated light after modulation of the filtered data in filtering device 304 and before emission, wherein the operations are, for example, addition, multiplication, etc. The second configuration of system 302 is a nonlinear computation system, wherein nonlinear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or on the modulated light after modulation by the input data in input device 104 and before emission from device 104; and / or on the filtered data before optical modulation in filtering device 304, or on the modulated light after modulation by the filtered data in filtering device 304 and before emission, wherein the operations are, for example, quadratic operations, cubic operations, etc. The third configuration of system 302 is an "operation-free" or buffered system, wherein the light in input device 104 is directly modulated by the input data and there is no additional modulation before emission, and the filtering device 304 does not modulate the light when it passes through the light and emits the light as divergent light 214. This configuration is similar to system 102b, except that a filter 304 is inserted at a distance 2f between the input device 104 and the filter 106 (which does not perform modulation and only relays data between the receiving and transmitting surfaces). The fourth configuration of system 302 is characterized by any combination or variation of the configuration or function of the input device 104, the filter 304, and / or the output device 106. All variations of system 302 apply to all configurations of system 302.

[0118] In some embodiments, the transmitter, filter, and receiver may include waveguides and / or modulators integrated into a common block, module, or chip. In some embodiments, the block or module is arranged to transmit / receive light at any block interface, which may be adjacent to free space or a gas- or liquid-containing space suitable for optical communication between the modules or blocks in question.

[0119] Figure 4System 402 is shown as a more advanced form of a multiprocessor system. System 402 is a dual-input dual-processor system that extends the functionality of system 302 by adding an additional input device 404 (input device 404 is any variant of a spatial light modulator device). Both input devices 104 and 404 are arranged such that each of their emitting surfaces provides input to filter 304 via a separate Fourier transform lens. Both input devices can employ, for example... Figures 56 to 58 The integrated waveguide unit described above can be used, and the output device can also be in the form of... Figure 59The integrated waveguide unit is in the form described. System 402 allows for simultaneous Fourier transform calculations of two different sets of input data optically, with their modulated signals combined within the filter 304, as described. Input device 104 and filter 304 are spaced apart from each other along their common optical axis through the region of free space 108 by a distance of 2f. Similarly, input device 404 and filter 304 are spaced apart from each other along their common optical axis through the region of free space 408 by a distance of 2f. Likewise, filter 304 and output device 106 are spaced apart from each other along their common optical axis through the region of free space 308 by a distance of 2f. A Fourier transform lens 110 is arranged between input device 104 and filter 304 at a distance f along their common optical axis. Similarly, a Fourier transform lens 410 is arranged between input device 404 and filter 304 at a distance f along their common optical axis. Similarly, a Fourier transform lens 210 is arranged at a distance f along the common optical axis between the filter device 304 and the output device 106. Because the converging light 114 and converging light 414 received by the filter device 304 travel internally before being emitted into the free space 308 as modulated diverging light 214, the optical axes shared by the input device 104 and the filter device 304 in the free space 108, the optical axes shared by the input device 404 and the filter device 304 in the free space 408, and the optical axes shared by the filter device 304 and the output device 106 in the free space 308 do not need to be the same (i.e., the optical axes can be different). The input device 104 of the system 402 receives input data via wires, optical cables, or free space (not shown) and uses the input data to modulate the light within the input device 104 of the system 402. Modulated light 112 is emitted from input device 104, received by lens 110, and becomes converging light 114, which is then incident on the receiving array (not shown) of filter device 304. Similarly, input device 404 of system 402 receives additional input data via wires, optical cables, or free space (not shown), which may or may not be the same as the input data received by input device 104, and uses this input data to modulate the light within input device 404 of system 402. Modulated light 412 is emitted from input device 404, received by lens 410, and becomes converging light 414, which is then incident on the receiving array (not shown) of filter device 304. The converging light 114 and converging light 414 received by filter device 304 are mixed within filter device 304 (i.e., filter device 304 uses the light received from converging light 414 to modulate the light received from converging light 114 within filter device 304). Modulated divergent light 214 is emitted from filter 304, received by lens 210, and collimated into collimated light 212, which is then incident on the receiving array (not shown) of output device 106. Output data is transmitted from system 402 using wires, optical fibers, or free space (not shown) connected to output device 106 on the output stage of system 402.System 402 reflects the functionality of a conventional 4f optical Fourier transform configuration. The simplest variation of system 402 includes replacing the air in free space 108 and / or free space 308 and / or free space 408 with a gas (e.g., nitrogen), a liquid (e.g., a refractive index-matching fluid), a solid (e.g., a refractive index-matching glass), or a vacuum. This replacement of air in one free space region with another medium does not require implementation in any other free space region and is not the same as a substitution performed in any other free space region. Another variation of system 402 and all variations thereof include zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components along the common optical axis between input device 104 and filter device 304, and / or along the common optical axis between input device 404 and filter device 304, and / or along the common optical axis between filter device 304 and output device 106.

[0120] One configuration of system 402 is a linear operation system, wherein linear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or linear element-wise mathematical operations are performed on the modulated light after modulation by the input data in input device 104 and before transmission; and / or linear element-wise mathematical operations are performed on the input data before optical modulation in input device 404, or linear element-wise mathematical operations are performed on the modulated light after modulation by the input data in input device 404 and before transmission; and / or linear element-wise mathematical operations are performed on the received light before optical modulation in filtering device 304, or linear element-wise mathematical operations are performed on the modulated light after modulation by filtered data in filtering device 304 and before transmission, wherein the operations include, for example, addition, multiplication, etc. The second configuration of system 402 is a nonlinear computation system, wherein nonlinear element-wise mathematical operations are performed on the input data before optical modulation in input device 104, or nonlinear element-wise mathematical operations are performed on the modulated light after modulation by the input data in input device 104 and before transmission from device 104; and / or nonlinear element-wise mathematical operations are performed on the input data before optical modulation in input device 404, or nonlinear element-wise mathematical operations are performed on the modulated light after modulation by the input data in input device 404 and before transmission; and / or nonlinear element-wise mathematical operations are performed on the received light before optical modulation in filtering device 304, or nonlinear element-wise mathematical operations are performed on the modulated light after modulation by filtered data in filtering device 304 and before transmission, wherein the operations are, for example, quadratic operations, cubic operations, etc. The third configuration of system 402 is an "operation-free" or buffered system, in which the light within input device 104 is directly modulated by the input data, and there is no additional modulation before emission. Input device 404 does not emit light or emits uniformly modulated light, and when the light passes through filter device 304, filter device 304 does not modulate it and emits the light as divergent light 214. The fourth configuration of the simplest system 402 is characterized by any combination or variation of the configuration or function of input device 104, filter device 304, and / or output device 106. All variations of system 402 apply to all configurations of system 402. The configuration of a multiprocessor system can include any number of combinations or variations of any configuration of a single-processor system or a multiprocessor system.

[0121] In embodiments of the optical information processing system, input data is received via one or more optical fibers directly coupled to the waveguides of the system's input stage and output from the system's output stage to one or more optical fibers, allowing the system to operate at speeds up to and including fiber optic transmission speeds. The input and output stages include one or more variations of any type of spatial optical modulator device arranged relative to each other in any relative configuration. Similarly, any number of spatial optical modulator devices of any type can exist between the input and output stages, arranged relative to each other in any relative configuration. In one variation of the system, means may be present to decode and / or encode data into a format suitable for transmission over optical fibers, such as multiplexers and / or demultiplexers on the output and / or input sides of the system, respectively.

[0122] In some embodiments, the filtering device may include waveguides and / or modulators integrated into a common block, module, or chip. In some embodiments, the block or module is arranged to transmit / receive light at any of its block interfaces, which may be adjacent to free space or a space containing a gas or liquid suitable for optical communication between the modules or blocks in question. In another embodiment, the filtering device incorporates multiple input interfaces and one or more output interfaces.

[0123] Figure 5 Configuration 502 of system 402 is shown, wherein two input devices have separate external lasers that provide data carrier light and / or pump energy for amplification of photosensitive signals. External laser 504 generates coherent light and transmits it to input device 104 via optical guide 506, which may be a waveguide, optical fiber, plasma waveguide, or any other optical propagation medium. Input data (not shown) for modulation of the light provided on optical guide 506 by input device 104 internally is provided via input data line 508, which may be a wire, optical fiber, waveguide, and / or any other data-bearing medium. Similarly, control data (not shown) for controlling and / or modifying the operation of input device 104 and / or reading status information, statistical information, and / or other information from input device 104 is transmitted to and / or from input device 104 via input control line 510, which may be a wire, optical fiber, waveguide, and / or any other data-bearing medium. Similarly, external laser 514 generates coherent light and transmits it to input device 404 via optical guide 516, where optical guide 516 can be a waveguide, optical fiber, plasma waveguide, or any other light propagation medium. Input device 104 and input device 404 can be employed as follows: Figures 56 to 58 The device can take the form of an output device. Figure 59The output device is in the form of a device. Devices 104, 404, and 106 can be integrated into a common silicon photonics system or chip. Input data (not shown) for use internally by input device 404 to modulate light provided on light guide 516 is provided via input data line 518, which can be a wire, optical fiber, waveguide, and / or any other data-bearing medium. Similarly, control data (not shown) for controlling and / or modifying the operation of input device 404 and / or reading status information, statistical information, and / or other information from input device 404 is transmitted to and / or from input device 404 via input control line 520, which can be a wire, optical fiber, waveguide, and / or any other data-bearing medium. Reference light guide 526 can be optionally connected to output device 106 to provide a reference signal for output device 106 in determining collimated light 212 ( Figure 4 This is used when the original laser characteristics are altered to modulated light propagating through system 402, wherein the light guide 526 can be a waveguide, optical fiber, plasma waveguide, or any other light propagation medium. Output data (not shown) is transmitted from output device 106 in configuration 502 via output data line 528, wherein output data line 528 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) for controlling and / or modifying the operation of output device 106 and / or reading status information, statistical information, and / or other information from output device 106 is transmitted to and / or from output device 106 via output control line 530, wherein output control line 530 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium. Filtered data (not shown) is transmitted to filter device 304 in configuration 502 via filter data line 538. Figure 4 The filtered data line 538 can be a wire, optical fiber, waveguide, and / or any other data carrier. Similarly, it is used to control and / or modify the filtering device 304. Figure 4 ) operation behavior and / or from filter device 304 ( Figure 4 Control data (not shown) that reads status information, statistical information, and / or other information is transmitted to the filter device 304 via the filter control line 540. Figure 4 ) and / or from filter device 304 ( Figure 4 Transmission, wherein the filter control line 540 can be a wire, optical fiber, waveguide and / or any other data-carrying medium. Filtering device 304 ( Figure 4 It may have an internal laser (not shown) and / or an external laser (not shown), for the filter device 304. Figure 4 It provides data carrier light and / or pump energy for amplification of the photosensitive signal.

[0124] In one variation of configuration 502, laser 504 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In a second variation of configuration 502, laser 514 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 518. This fiber and / or waveguide input data line 518 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 404, wherein as few as one fiber or waveguide may be coupled to input device 404, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 404, wherein there may be any number of receiving elements in the receiving array of input device 404. A third variation of configuration 502 combines the first and second variations of configuration 502. Any variation of configuration 502 can be combined to form a new variation of configuration 502. In some embodiments, the device may include waveguides and / or modulators integrated into a common block, module, or chip. In some embodiments, blocks or modules are arranged to emit / receive light at any block interface, which may be adjacent to free space or a space containing a gas or liquid suitable for optical communication between the modules or blocks in question. In some embodiments, the laser is integrated with the block, module, or chip, while in a preferred embodiment, the laser may be disposed outside the block. In some embodiments, the laser is input via a waveguide partially located outside the block.

[0125] Figure 6 Configuration 602 of system 402 is shown, in which the same external laser provides data carrier light and / or pump energy to both input devices for photosensitive signal amplification. The description of configuration 602 is the same as that of configuration 502, except that: light guide 516 now branches directly from light guide 506 and transmits light from laser 504. The light between light guide 506, light guide 516, and / or optional reference light guide 526 can be separated in any proportion. All other descriptions of the devices and variations of configuration 502 apply to configuration 602.

[0126] In one variation of configuration 602, laser 504 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In a second variation of configuration 602, laser 504 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 518. This fiber and / or waveguide input data line 518 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 404. There may be as few as one fiber or waveguide coupled to input device 404, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 404. There may be any number of receiving elements in the receiving array of input device 404. A third variation of configuration 602 combines the first and second variations of configuration 602. Any variation of configuration 602 can be combined to form a new variation of configuration 602. In some embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips. In some embodiments, blocks or modules are arranged to emit / receive light on any block interface, which may be adjacent to free space or adjacent to a space containing a gas or liquid suitable for optical communication between the modules or blocks in question.

[0127] Figure 7 Configuration 702 of system 402 is shown, wherein an internal on-device laser 704 provides data carrier light and / or pump energy to two input devices for photosensitive signal amplification. Configuration 702 is described as being the same as configuration 602, except that: laser light is generated from the on-device laser 704 in configuration 702, wherein the on-device laser 704 can be a diode laser, VCSEL, or any other chip-level laser device mounted, bonded, attached, embedded, or fabricated within or on the input device 104 and providing light to the input device 104 via a waveguide network 706. The integrated input device 104 can be configured according to… Figures 55 to 58 Each embodiment is configured, and the output device 106 can be configured according to... Figure 59The embodiment is configured as follows. Laser light from laser 704 on the device is transmitted via waveguide network 706 to waveguide coupler 708, and finally to optical guide 516 and optional reference optical guide 526. Waveguide coupler 708 can be any device or component capable of coupling a waveguide to optical guide 516 and / or optional reference optical guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. Light between branches in waveguide network 706, optical guide 516, and / or optional reference optical guide 526 can be split at any ratio. All other descriptions of the device and variations of configuration 602 apply to configuration 702. In one variation of configuration 702, laser 704 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In a second variation of configuration 702, laser 704 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 518. This fiber and / or waveguide input data line 518 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 404. There may be as few as one fiber or waveguide coupled to input device 404, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 404. There may be any number of receiving elements in the receiving array of input device 404. A third variation of configuration 702 combines the first and second variations of configuration 702. Any variation of configuration 702 can be combined to form a new variation of configuration 702. In some preferred embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips, to provide a silicon photonic integrated waveguide and modulator solution. In some embodiments, blocks or modules are arranged to emit / receive light on any block interface, which may be adjacent to free space or adjacent to a space containing a gas or liquid suitable for optical communication between the modules or blocks in question.

[0128] Figure 8Configuration 802 of system 302 is shown, in which an external laser provides data carrier light and / or pump energy for amplification of the photosensitive signal. Configuration 802 is similar to configuration 502, except that the core optical information processing system is system 302 in configuration 802, and therefore there is no second input device. For configuration 802, external laser 504 generates coherent light and transmits it to input device 104 via optical guide 506, wherein optical guide 506 may be a waveguide, optical fiber, plasma waveguide, or any other optical propagation medium. Input data (not shown) for modulation of the light provided on optical guide 506 by input device 104 internally is provided via input data line 508, wherein input data line 508 may be a wire, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operation of input device 104 and / or read status information, statistical information, and / or other information from input device 104 is transmitted to and / or from input device 104 via input control line 510, wherein input control line 510 may be a wire, optical fiber, waveguide, and / or any other data carrying medium. Input device 104 and output device 106 may be configured as shown in reference. Figures 56 to 59 The described array of integrated waveguides. Reference waveguide 526 may optionally be connected to output device 106 to provide a reference signal for output device 106 in determining collimated light 212 ( Figure 3 This is used when the original laser characteristics are altered to modulated light propagating through system 302, wherein the light guide 526 can be a waveguide, optical fiber, plasma waveguide, or any other optical propagation medium. Output data (not shown) is transmitted from output device 106 in configuration 802 via output data line 528, wherein output data line 528 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) for controlling and / or modifying the operation of output device 106 and / or reading status information, statistical information, and / or other information from output device 106 is transmitted to and / or from output device 106 via output control line 530, wherein output control line 530 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium.

[0129] Filtered data (not shown) is transmitted via filter data line 538 to filter device 304 in configuration 802. Figure 3 The filtered data line 538 can be a wire, optical fiber, waveguide, and / or any other data carrier. Similarly, it is used to control and / or modify the filtering device 304. Figure 3 ) operation behavior and / or from filter device 304 ( Figure 3 Control data (not shown) that reads status information, statistical information, and / or other information is transmitted to the filter device 304 via the filter control line 540. Figure 3 ) and / or from filter device 304 ( Figure 3 Transmission, wherein the filter control line 540 can be a wire, optical fiber, waveguide and / or any other data-carrying medium. Filtering device 304 ( Figure 3 It may have an internal laser (not shown) and / or an external laser (not shown), for the filter device 304. Figure 3 It provides data carrier light and / or pump energy for amplification of the photosensitive signal.

[0130] In one variation of configuration 802, laser 504 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. Any variation of configuration 802 can be combined to form new variations of configuration 802. In some embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips (preferably silicon photonic chips). In some embodiments, blocks or modules are arranged to emit / receive light on any block interface, which may be adjacent to free space or adjacent to a space containing a gas or liquid suitable for optical communication between the modules or blocks in question.

[0131] Figure 9 Configuration 902 of system 302 is shown, wherein an internal on-device laser 704 provides data carrier light and / or pump energy to two input devices for photosensitive signal amplification. Configuration 902 is described similarly to configuration 802, except that laser light is generated from the on-device laser 704 in configuration 902. The on-device laser 704 can be a diode laser, VCSEL, or any other chip-level laser device that is mounted, bonded, attached, embedded, or fabricated within or on the input device 104 and provides light to the input device 104 via a waveguide network 706. For the avoidance of doubt, in a preferred embodiment, the input and output devices can be configured according to… Figures 55 to 59Each embodiment is configured as follows. Laser light from laser 704 on the device is transmitted via a branch from waveguide network 706 to optional waveguide coupler 708, and finally to optional reference optical guide 526. The optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to the optional reference optical guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. Light between branches in the waveguide network 706 and / or optional reference optical guide 526 can be split at any ratio. All other descriptions of the device and variations of configuration 802 apply to configuration 902.

[0132] In one variation of configuration 902, laser 704 does not provide a data carrier signal, but instead provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508. Fiber and / or waveguide input data lines 508 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 104, wherein as few as one fiber or waveguide may be coupled to input device 104, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In another variation of configuration 902, input device 104 does not have an optional waveguide coupler 708. Any variation of configuration 902 can be combined to form new variations of configuration 902. In some embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips. In some embodiments, blocks or modules are arranged to emit / receive light at any block interface, which may be adjacent to free space or adjacent to a space with a gas or liquid suitable for optical communication between the modules or blocks in question.

[0133] Figure 10Configuration 1002 of system 102 is shown, in which an external laser provides data carrier light and / or pump energy for amplification of the photosensitive signal. Configuration 1002 is similar to configuration 802, except that the core optical information processing system is system 102 in configuration 1002, and therefore there is no filtering device. For configuration 1002, external laser 504 generates coherent light and transmits it to input device 104 via optical guide 506, wherein optical guide 506 can be a waveguide, optical fiber, plasma waveguide, or any other optical propagation medium. Input data (not shown) for modulation of the light provided on optical guide 506 by input device 104 internally is provided via input data line 508, wherein input data line 508 can be a wire, optical fiber, waveguide, and / or any other data carrying medium. Similarly, control data (not shown) used to control and / or modify the operation of input device 104 and / or read status information, statistical information and / or other information from input device 104 is transmitted to and / or from input device 104 via input control line 510, wherein input control line 510 may be a wire, optical fiber, waveguide and / or any other data carrying medium. Reference light guide 526 may optionally be connected to output device 106 to provide a reference signal for output device 106 when determining the converged light 114 (…). Figure 1 This is used when the original laser characteristics are altered to modulated light propagating through system 302, wherein the light guide 526 can be a waveguide, optical fiber, plasma waveguide, or any other optical propagation medium. Output data (not shown) is transmitted from output device 106 in configuration 1002 via output data line 528, wherein output data line 528 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) for controlling and / or modifying the operation of output device 106 and / or reading status information, statistical information, and / or other information from output device 106 is transmitted to and / or from output device 106 via output control line 530, wherein output control line 530 can be a wire, optical fiber, waveguide, and / or any other data-carrying medium.

[0134] In one variation of configuration 1002, laser 504 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. Any variation of configuration 1002 can be combined to form a new variation of configuration 1002. Input device 104 and output device 106 can be configured as referenced. Figures 56 to 59 The described unit. In some embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips. In some embodiments, the blocks or modules are arranged to transmit / receive light at any block interface, which may be adjacent to free space or adjacent to a space with a gas or liquid suitable for optical communication between the modules or blocks in question.

[0135] Figure 11 Configuration 1102 of system 102 is shown, in which an internal on-device laser 704 provides data carrier light and / or pump energy to two input devices for photosensitive signal amplification. Configuration 1102 is described similarly to configuration 1002, except that in configuration 1102, laser light is generated from the on-device laser 704. The on-device laser 704 can be a diode laser, VCSEL, or any other chip-scale laser device that is mounted, joined, attached, embedded, or fabricated within or on the input device 104 and provides light to the input device 104 via a waveguide network 706. Laser light from the on-device laser 704 is transmitted via the waveguide network 706 to an optional waveguide coupler 708, and finally to an optional reference light guide 526. The optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to the optional reference light guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. The light between the branches in waveguide network 706 and / or optional reference light guide 526 can be split at any ratio. All other descriptions of the device and variations of configuration 1002 apply to configuration 1102.

[0136] In one variation of configuration 1102, laser 704 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508. The fiber and / or waveguide input data line 508 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 104, wherein as few as one fiber or waveguide may be coupled to input device 104, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In another variation of configuration 1102, input device 104 does not have an optional waveguide coupler 708. Any variation of configuration 1102 can be combined to form new variations of configuration 1102. In some embodiments, one or more devices may include waveguides and / or modulators integrated into a common block, module, or chip, or multiple blocks, modules, or chips. One or more of the devices may employ reference... Figures 56 to 59 The form of the description. In some embodiments, blocks or modules are arranged to emit / receive light at any block interface, which may be adjacent to free space or adjacent to a space with a gas or liquid suitable for optical communication between the modules or blocks in question.

[0137] Figure 12Configuration 1202 of system 402 is shown, in which two input devices have their own internal on-device lasers to provide data carrier light and / or pump energy for photosensitive signal amplification. Configuration 1202 is described the same as configuration 502, except that laser light is generated from on-device laser 704 of input device 104 and on-device laser 1214 of input device 404 in configuration 1202. On-device laser 704 may be a diode laser, VCSEL, or any other chip-level laser device mounted, bonded, attached, embedded, or manufactured within or on input device 104 and providing light to input device 104 via waveguide network 706. Similarly, on-device laser 1214 may be a diode laser, VCSEL, or any other chip-level laser device mounted, bonded, attached, embedded, or manufactured within or on input device 404 and providing light to input device 404 via waveguide network 1216. Laser light from laser 704 on the device is transmitted via a branch from waveguide network 706 to optional waveguide coupler 708 and finally to optional reference optical guide 526. The optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to the optional reference optical guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. The light between branches in waveguide network 706 and / or optional reference optical guide 526 can be split at any ratio. All other descriptions of the device and variations of configuration 502 apply to configuration 1202. In one variation of configuration 1202, laser 704 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 508, which may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104. There may be as few as one fiber or waveguide coupled to input device 104, or as many as one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. In a second variation of configuration 1202, laser 1214 does not provide a data carrier signal, but instead provides pump energy to amplify the signal received via fiber and / or waveguide input data line 518. The fiber and / or waveguide input data line 518 may or may not be directly coupled to the receiving elements or receiving array (not shown) of input device 404, wherein as few as one fiber or waveguide may be coupled to input device 404, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 404, wherein there may be any number of receiving elements in the receiving array of input device 404. In a third variation of configuration 1202, input device 104 does not have an optional waveguide coupler 708. Any variation of configuration 1202 can be combined to form a new variation of configuration 1202. Any of the devices may preferably be referenced to Figures 56 to 59 As described.

[0138] Figure 13 Configuration 1302 of system 402 is shown, wherein the system receives laser light via input data line 508, input data line 518, and / or filter data line 538. Configuration 1302 is described the same as configuration 1202, except that: in input device 104, input device 404, and filter device 304 (… Figure 4 There are no internal lasers on either of them. Input data line 508 may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104, wherein there may be as few as one fiber or waveguide coupled to input device 104, or up to one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. Similarly, input data line 518 may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 404, wherein there may be as few as one fiber or waveguide coupled to input device 404, or up to one fiber or waveguide for each receiving element on the receiving array (not shown) of input device 404, wherein the receiving array of input device 404 may have any number of receiving elements. Filter data line 538 may or may not be directly coupled to filter device 304. Figure 4 The receiving element or receiving array (not shown), wherein as few as one fiber or waveguide may be coupled to the filter device 304. Figure 4 Each receiving element on the receiving array, or up to a filter device 304, can be used. Figure 4 Each receiving element on the receiving array (not shown) has an optical fiber or waveguide, wherein in the filtering device 304 ( Figure 4 The receiver array can contain any number of receiving elements. The filtered data line 538 does not need to carry light and can be a wire or any other data-carrying medium. All other descriptions of the apparatus and variations of configuration 1202 apply to configuration 1302. Any of the apparatuses may preferably be referenced to... Figures 56 to 59 As described.

[0139] Figure 14 Configuration 1402 of system 302 is shown, in which the system receives laser light via input data line 508 and / or filter data line 538. Configuration 1402 is described the same as configuration 902, except that input device 104 and filter device 304 are absent. Figure 3The input data line 508 may or may not be directly coupled to the receiving element or receiving array (not shown) of the input device 104, wherein as few as one fiber or waveguide may be coupled to the input device 104, or up to one fiber or waveguide for each receiving element on the receiving array (not shown) of the input device 104, wherein the receiving array of the input device 104 may have any number of receiving elements. The filter data line 538 may or may not be directly coupled to the filter device 304. Figure 3 The receiving element or receiving array (not shown), wherein as few as one fiber or waveguide may be coupled to the filter device 304. Figure 3 Each receiving element on the receiving array, or up to a filter device 304, can be used. Figure 3 Each receiving element on the receiving array (not shown) has an optical fiber or waveguide, wherein in the filtering device 304 ( Figure 3 The receiver array can contain any number of receiving elements. The filtered data line 538 does not need to carry light and can be a wire or any other data-carrying medium. All other descriptions of the apparatus and variations of configuration 902 apply to configuration 1402. Any of the apparatuses may preferably be referenced to... Figures 56 to 59 As described.

[0140] Figure 15 Configuration 1502 of system 102 is shown, in which the system receives laser light via input data line 508. The description of configuration 1502 is the same as that of configuration 1102, except that there is no internal laser on input device 104. Input data line 508 may or may not be directly coupled to the receiving element or receiving array (not shown) of input device 104, wherein as few as one fiber or waveguide may be coupled to input device 104, or as many as one fiber or waveguide per receiving element on the receiving array (not shown) of input device 104, wherein the receiving array of input device 104 may have any number of receiving elements. All other descriptions of the device and variations of configuration 1102 apply to configuration 1502. Any of these devices is preferred. Figures 56 to 59 As described.

[0141] Additional variations of configurations and / or systems can be formed by combining any variations of any configuration of any system or device. Furthermore, any variations, configurations, systems, or devices can be connected together in any number to form more complex variations, configurations, or systems. The described systems and system configurations can be constructed using electrically discrete components and devices, as well as discrete optics, for example, conventionally constructed on an optical stage. However, systems and system configurations can be constructed using methods that implement interconnections between some or all electrical components and / or optical components, which are interconnected using electro-, optical, or electro-optical carrier devices having a function similar to that of a printed circuit board supporting the electrical interconnections of mounted electrical components and devices, and can be printed circuit boards supporting optical interconnections, and / or carrier chips, hereinafter referred to as carrier chips. Such interconnected components can be located on the same carrier chip, with their free-space light receiving and emitting surfaces parallel to, or perpendicular to, their electro-optical connection surfaces, or in some other orientation. In all cases, optical components will compensate for the various component and device orientations by using mirrors, beam splitters, and / or other optical components. Some examples of system configurations constructed using this carrier chip method are shown in [reference to a document / document]. Figures 16a to 19b , Figures 21a to 23b , Figures 26a to 29b , Figures 31a to 33b , Figures 36a to 39b and Figures 41a to 43b The following is given. Furthermore, systems and system configurations can be built using the same manufacturing process, such as microfabrication on the same wafer via electron beam or optical lithography, creating a single chip with one or more components, which are then used to implement optical connections using optical components such as lenses, mirrors, and beam splitters. Some examples of system configurations where components and devices are manufactured as a single chip are given in [the document / reference]. Figures 20a to 20b , Figures 30a to 30b and Figures 40a to 40b As provided in the document. Furthermore, with the aid of advanced chip stacking or three-dimensional (3D) microfabrication techniques, systems and system configurations (including optics) can be fabricated as a single solid-state 3D chip or device. Figures 24a to 25b , Figures 34a to 35b and Figures 44a to 45b The document provides some examples of system configurations where the entire system configuration is manufactured as a single 3D chip. The possible implementations of the system and system configuration are not limited to the various architectures described herein.

[0142] Figure 16a and Figure 16b Configuration 502 is shown. Figure 5Structure 1602, wherein all devices and their receiving and transmitting surfaces are oriented parallel to the top surface of carrier chip 1604. All components and devices of configuration 502 are incorporated into structure 1602. Similarly, the description of configuration 502 applies to structure 1602, except for the components with the following additional details and descriptions. Carrier chip 1604 provides electrical and / or optical interconnects between itself and input device 104, filter device 304, input device 404 and / or output device 106, wherein carrier chip 1604 may be a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnect platform. Laser 504 and laser 514 may be mounted, bonded, attached, embedded, or fabricated within or on carrier chip 1604. Optical guides 506, 516, and / or optional optical guide 526 may be waveguides on or within carrier chip 1604. Input data, filtered data, output data, and control data (not shown) of all devices connected to and / or including carrier chip 1604 can be transmitted to carrier chip 1604 via carrier chip data line 1608 and carrier chip control line 1610. The carrier chip data line 1608 and / or carrier chip control line 1610 can be wires (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data-carrying or energy-propagating medium. Their terminals, connectors, and / or connection surfaces can be located on one or more surfaces and / or edges of carrier chip 1604. Electro-optical network 1674 can carry electrical and / or optical signals between the entire carrier chip 1610 and carrier chip data line 1608, carrier chip control line 1610, and / or electrical and / or optical signals to / from input device 104, filter device 304, input device 404, and / or output device 106. Electro-optical network 1674 can include wires, optical fibers, waveguides, and / or any other data and / or energy-propagating medium. Input device 104 is connected to carrier chip 1604 at an electrical and / or optical contact surface 1662, wherein contact surface 1662 is the physical interface between input device 104 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to input device 104. Input and control data (not shown) can be provided to input device 104 via contact surface 1662 through input data line 508 and input control line 510 connected to electro-optical network 1674. Similarly, input device 404 is connected to carrier chip 1604 at an electrical and / or optical contact surface (not shown), wherein its contact surface (not shown) is the physical interface between input device 404 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to input device 404. Input data can be provided via input data line 518 connected to electro-optical network 1674 (… Figure 5) and input control line 520 ( Figure 5 The filter device 304 provides input and control data (not shown) to the input device 404 via its contact surface (not shown) with the carrier chip 1604. The filter device 304 is connected to the carrier chip 1604 at an electrical and / or optical contact surface 1664, which is the physical interface between the filter device 304 and the carrier chip 1604, and can provide power, electrical, optical, and / or control data from the carrier chip 1604 to the filter device 304. Filter and control data (not shown) can be provided to the filter device 304 via the contact surface 1664 through filter data lines 538 and filter control lines 540 connected to the electro-optical network 1674. The output device 106 is connected to the carrier chip 1604 at an electrical and / or optical contact surface 1666, which is the physical interface between the output device 106 and the carrier chip 1604, and can provide power, electrical, optical, and / or control data from the carrier chip 1604 to the output device 106. Output data (not shown) can be received from output device 106 via output data line 528 through contact surface 1662, and control data (not shown) can be transmitted to or received from output device 106 via output control line 530 through contact surface 1662, wherein both output data line 528 and output control line 530 are connected to electro-optical network 1674. Carrier chip 1604 can perform preprocessing or post-processing on any data transmitted through electro-optical network 1674, including but not limited to modulation of light propagating by optical waveguides and / or mathematical operations on electrical signals propagating in wires in electro-optical network 1674. The propagation and / or modulation of light within input device 104, as described for configuration 502 and its variations, occurs within waveguide network 706. Input data (not shown) can be received by input device 104 via optional receiving surface 1612 and / or through contact surface 1662, wherein optional receiving surface 1612 includes an optical waveguide array coupled to waveguide network 706, the optical waveguide array being arranged as for device 5604. Figures 56 to 58 Any configuration and / or variation thereof of the waveguide array described above. Similarly, input device 104 includes a transmitting surface 1616 that transmits light propagated by and / or modulated within the waveguide network 706 into free space 108, wherein the transmitting surface 1616 includes an optical waveguide array coupled to the waveguide network 706, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58Any configuration and / or variation of the waveguide array described for configuration 502 and its variations. Similarly, the propagation and / or modulation of light within the input device 404 described for configuration 502 and its variations occurs within the waveguide network 1216. The input device 404 can receive input data (not shown) via an optional receiving surface 1622 and / or via its contact surface with the carrier chip 1604 (not shown), wherein the optional receiving surface 1622 comprises an optical waveguide array coupled to the waveguide network 1216, the optical waveguide array being arranged as described for device 5604 ( Figures 56 to 58 Any configuration and / or variation of the waveguide array described for device 5604. Similarly, input device 404 includes a transmitting surface 1626 that transmits light propagated by and / or modulated within the waveguide network 1216 into free space 408, wherein the transmitting surface 1626 includes an optical waveguide array coupled to the waveguide network 1216, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 Any configuration and / or variation of the waveguide array described for configuration 502 and its variations. The propagation and / or modulation of light within the filtering device 304 described for configuration 502 and its variations occurs within the waveguide network 1634. The filtering device 304 can receive filtered data (not shown) from free space 108 via receiving surface 1632, and / or from free space 408 via receiving surface 1642, and / or via contact surface 1664, wherein receiving surface 1632 and receiving surface 1642 each include an optical waveguide array coupled to the waveguide network 1634, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide arrays described herein may be any configuration and / or variations thereof, and the two arrays may include different numbers of receiving waveguide elements. Similarly, the filtering device 304 includes a transmitting surface 1636 that transmits light propagated by and / or modulated within the waveguide network 1634 into free space 308, wherein the transmitting surface 1636 includes an optical waveguide array coupled to the waveguide network 1634, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described for configuration 502 and its variations is described in the following configurations and / or variations. Within the output device 106, light propagation, modulation, and / or detection occur within the waveguide network 1654. The output device 106 can receive output data (not shown) via a receiving surface 1652, which includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58The waveguide array described in the diagram is a configuration and / or variation thereof. Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within the waveguide network 1654, wherein the emitting surface 1656 includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described in the configuration and / or variations.

[0143] In one variation of structure 1602, input device 104 has an optional receiving surface 1612, whose receiving array is coupled to an external waveguide or waveguide array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a second variation of structure 1602, input device 104 has an optional receiving surface 1612, whose receiving array is coupled to an external optical fiber or fiber array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a third variation of structure 1602, input device 104 has an optional receiving surface 1612, whose receiving array is coupled to free space (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a fourth variation of structure 1602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 1602, and input data for input device 104 is received only through receiving surface 1612. In a fifth variation of structure 1602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 1602, and input data for input device 104 is received through receiving surface 1612 and / or input data line 508. In a sixth variation of structure 1602, input device 104 does not have an optional receiving surface 1612, and input data is provided from carrier chip 1604 only through input data line 508. In a seventh variation of structure 1602, input device 404 has an optional receiving surface 1622, whose receiving array is coupled to an external waveguide or waveguide array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1622 may contain any number of waveguides. In an eighth variation of structure 1602, input device 404 has an optional receiving surface 1622, whose receiving array is coupled to an external optical fiber or fiber array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1622 may contain any number of waveguides. In a ninth variation of structure 1602, input device 404 has an optional receiving surface 1622, whose receiving array is coupled to free space (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1622 may contain any number of waveguides. In the tenth variation of structure 1602, input device 404 has an optional receiving surface 1622 as described in the seventh, eighth and / or ninth variations of structure 1602, and input data for input device 404 is received only through receiving surface 1622.In a variant of structure 1602, input device 404 has an optional receiving surface 1622 as described in the seventh, eighth and / or ninth variants of structure 1602, and input data for input device 404 is transmitted through receiving surface 1622 and / or input data line 518. Figure 5 In a twelfth variation of structure 1602, input device 404 does not have an optional receiving surface 1622, and is only received via input data line 518. Figure 5 Input data is provided from carrier chip 1604. In a thirteenth variation of structure 1602, output device 106 has an optional transmitting surface 1656, whose transmitting array is coupled to an external waveguide or waveguide array (not shown) to provide output data, for example, to another optical system, wherein the transmitting array of transmitting surface 1656 may have any number of waveguides. In a fourteenth variation of structure 1602, output device 106 has an optional transmitting surface 1656, whose transmitting array is coupled to an external optical fiber or fiber array (not shown) to provide output data, for example, to another optical system, wherein the transmitting array of transmitting surface 1656 may have any number of waveguides. In a fifteenth variation of structure 1602, output device 106 has an optional transmitting surface 1656, whose transmitting array is coupled to free space (not shown) to provide output data, for example, to another optical system, wherein the transmitting array of transmitting surface 1656 may have any number of waveguides. In a sixteenth variation of structure 1602, output device 106 has an optional transmit surface 1656 as described in the thirteenth, fourteenth, and / or fifteenth variations of structure 1602, and input data for output device 106 is received only through transmit surface 1656. In a seventeenth variation of structure 1602, output device 106 has an optional transmit surface 1656 as described in the thirteenth, fourteenth, and / or fifteenth variations of structure 1602, and output data of output device 106 is transmitted through transmit surface 1656 and / or output data line 528. In an eighteenth variation of structure 1602, output device 106 does not have an optional transmit surface 1656, and output data is transmitted to carrier chip 1604 only through output data line 528. In a nineteenth variation of structure 1602, it can be combined with any variation of the first to eighteenth variations of structure 1602 or other variations, with the basic configuration replaced by configuration 602. Figure 6 ), wherein there is only one laser source, an external laser 504, and a light guide 516 and an optional reference light guide 526 branching from the light guide 506. In the twentieth variant of structure 1602, it can be combined with any of the first to eighteenth variants of structure 1602 or other variants, the basic configuration being configuration 702 ( Figure 7This configuration includes a single laser source, an internal laser 704 coupled to the waveguide network 706, an optical guide 516, and an optional reference optical guide 526 coupled to the waveguide network 706 via a waveguide coupler 708. In the twenty-first variant of configuration 1602, it can be combined with any of the first to eighteenth variants of configuration 1602 or any other variant, with the basic configuration replaced by configuration 1202. Figure 12 The structure 1602 includes two laser sources, an internal laser 704 coupled to waveguide network 706, an internal laser 1214 coupled to waveguide network 1216, and an optional reference optical guide 526 coupled to waveguide network 706 via waveguide coupler 708. In a twenty-second variation of structure 1602, it can be combined with any of the first to eighteenth variations of structure 1602 or any other variation, with the basic configuration replaced by configuration 1302. Figure 12 In this configuration, there is no laser source configured, and the optional reference optical guide 526 is coupled to the waveguide network 706 via waveguide coupler 708. Any variation of structure 1602 can be combined to form a new variation of structure 1602.

[0144] Figure 17a and Figure 17b Configuration 502 is shown. Figure 5Structure 1702 is provided, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 1702 are the same as those of structure 1602, except that the input device, filtering device, and output device are divided into multiple sub-device chips. Input device 104 includes base control chip 1714, optional receiving chip 1712, and transmitting chip 1716. Base control chip 1714 includes waveguide 706 and is connected to carrier chip 1604 via contact surface 1662. Optional receiving chip 1712 includes optional receiving surface 1612 and is connected to base control chip 1714 via contact surface 1762, wherein contact surface 1762 provides an electro-optical interconnect between optional receiving chip 1712 and base control chip 1714. Similarly, the transmitter chip 1716 includes a transmitter surface 1616 and is connected to the base control chip 1714 via a contact surface 1764, wherein the contact surface 1764 provides an electro-optical interconnect between the transmitter chip 1716 and the base control chip 1714. Likewise, the input device 404 includes a base control chip 1724, an optional receiver chip 1722, and a transmitter chip 1726. The base control chip 1724 includes a waveguide 1216 and is connected to the carrier chip 1604 via an electro-optical contact surface (not shown). The optional receiver chip 1722 includes an optional receiver surface 1622 and is connected to the base control chip 1724 via a contact surface (not shown) that provides an electro-optical interconnect between the optional receiver chip 1722 and the base control chip 1724. Similarly, the transmitter chip 1726 includes a transmitter surface 1626 and is connected to the base control chip 1724 via a contact surface (not shown) that provides an electro-optical interconnect between the transmitter chip 1726 and the base control chip 1724. The filtering device 304 includes a base control chip 1734, a receiver chip 1732, a receiver chip 1742, and a transmitter chip 1736. The base control chip 1734 includes a waveguide 1634 and is connected to a carrier chip 1604 via a contact surface 1664. The receiver chip 1732 includes a receiving surface 1632 and is connected to the base control chip 1734 via a contact surface, wherein the contact surface 1772 provides an electro-optical interconnect between the receiver chip 1732 and the base control chip 1734. Similarly, the receiver chip 1742 includes a receiving surface 1642 and is connected to the base control chip 1734 via a contact surface 1776, wherein the contact surface 1776 provides an electro-optical interconnect between the receiver chip 1742 and the base control chip 1734. The transmitter chip 1736 includes a transmitting surface 1636 and is connected to the base control chip 1734 via a contact surface 1774, wherein the contact surface 1774 provides an electro-optical interconnect between the transmitter chip 1736 and the base control chip 1734. The output device 106 includes a base control chip 1754, a receiver chip 1752, and an optional transmitter chip 1756. The base control chip 1754 includes a waveguide 1654 and is connected to the carrier chip 1604 via a contact surface 1666.The receiver chip 1752 includes a receiving surface 1652 and is connected to the base control chip 1754 via a contact surface 1782, wherein the contact surface 1782 provides an electro-optical interconnect between the receiver chip 1752 and the base control chip 1754. Similarly, the optional transmitter chip 1756 includes an optional transmitter surface 1656 and is connected to the base control chip 1754 via a contact surface 1784, wherein the contact surface 1784 provides an electro-optical interconnect between the optional transmitter chip 1756 and the base control chip 1754.

[0145] All variations of structure 1602 apply to structure 1702, except as follows: Any variation of structure 1702 with optional receiving surface 1612 will also have optional receiving chip 1712, and any variation without optional receiving surface 1612 will not have optional receiving chip 1712. Similarly, any variation of structure 1702 with optional receiving surface 1622 will also have optional receiving chip 1722, and any variation without optional receiving surface 1622 will not have optional receiving chip 1722. Finally, any variation of structure 1702 with optional transmitting surface 1656 will also have optional transmitting chip 1756, and any variation without optional transmitting surface 1656 will not have optional receiving chip 1756. Any variation of structure 1702 can be combined to form new variations of structure 1702.

[0146] Figure 18a and Figure 18b Configuration 502 is shown. Figure 5Structure 1802 is used in which all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and portions of each input device, filtering device, and output device are incorporated into the carrier chip 1604. The description and variations of structure 1802 are the same as those of structure 1702, except that components and functions of the control chip in structure 1702 are integrated into the carrier chip 1604 for structure 1802. For input device 104, components and functions of control chip 1714, including portions of waveguide 706, are integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1662. Optional receiving chip 1712 is connected to carrier chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiving chip 1712, carrier chip 1604, and waveguide network 706. Similarly, the transmitting chip 1716 is connected to the carrier chip 1604 via a contact surface 1764, which provides an electro-optical interconnect between the transmitting chip 1716, the carrier chip 1604, and the waveguide network 706. Similarly, for the input device 404, components and functions of the control chip 1724, including portions of the waveguide 1216, are integrated into the carrier chip 1604. An optional receiving chip 1722 is connected to the carrier chip 1604 via an electro-optical contact surface (not shown) providing an electro-optical interconnect between the optional receiving chip 1722, the carrier chip 1604, and the waveguide network 1216. Likewise, the transmitting chip 1726 is connected to the carrier chip 1604 via an electro-optical contact surface (not shown) providing an electro-optical interconnect between the transmitting chip 1726, the carrier chip 1604, and the waveguide network 1216. For the filter device 304, the components and functions of the control chip 1734, including a portion of the waveguide 1634, have been integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1664. The receiver chip 1732 is connected to the carrier chip 1604 via contact surface 1772, which provides electro-optical interconnection between the receiver chip 1732, the carrier chip 1604, and the waveguide network 1634. Similarly, the receiver chip 1742 is connected to the carrier chip 1604 via contact surface 1776, which provides electro-optical interconnection between the receiver chip 1742, the carrier chip 1604, and the waveguide network 1634. The transmitter chip 1736 is connected to the carrier chip 1604 via contact surface 1774, which provides electro-optical interconnection between the transmitter chip 1736, the carrier chip 1604, and the waveguide network 1634. For the output device 106, the components and functions of the control chip 1754, including the portion of the waveguide 1654, have been integrated into the carrier chip 1604, thereby eliminating the need for the contact surface 1666.Receiver chip 1752 is connected to carrier chip 1604 via contact surface 1782, where contact surface 1782 provides electro-optical interconnection between receiver chip 1752, carrier chip 1604, and waveguide network 1654. Similarly, optional transmitter chip 1756 is connected to carrier chip 1604 via contact surface 1784, where contact surface 1784 provides electro-optical interconnection between optional transmitter chip 1756, carrier chip 1604, and waveguide network 1654. All variations of structure 1702 are applicable to structure 1802. Any variation of structure 1802 can be combined to form a new variation of structure 1802.

[0147] Figure 19a and Figure 19b Configuration 502 is shown. Figure 5 Structure 1902 is similar to structure 1802, in which all receiving and transmitting surfaces are oriented parallel to the top surface of carrier chip 1604, and portions of each input device, filtering device, and output device are integrated into carrier chip 1604. Structure 1902 is identical in description and variations to structure 1802, except that optional receiving chip 1712, transmitting chip 1716, optional receiving chip 1722, transmitting chip 1726, receiving chip 1732, transmitting chip 1736, receiving chip 1742, receiving chip 1752, and optional transmitting chip 1756 are oriented parallel to the top surface of carrier chip 1604, such that all receiving and transmitting surfaces are oriented parallel to the top surface of carrier chip 1604. Structure 1902 is similar to structure 1602, except that portions of input device 104, input device 404, filtering device 304, and output device 106 are integrated into carrier chip 1604. All variations of structure 1802 apply to structure 1902. Any variation of structure 1902 can be combined to form a new variation of structure 1902.

[0148] Figure 20a and Figure 20b Configuration 502 is shown. Figure 5Structure 2002, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of carrier chip 1604, and all input devices, filtering devices, and output devices are integrated into carrier chip 1604. The description and variations of structure 2002 are the same as those of structure 1902, except that all components of input device 104, input device 404, filtering device 304, and output device 106 are mounted, joined, attached, incorporated, embedded, or manufactured in carrier chip 1604, thereby eliminating optional receiver chip 1712, transmitter chip 1716, optional receiver chip 1722, transmitter chip 1726, receiver chip 1732, transmitter chip 1736, receiver chip 1742, receiver chip 1752, and optional transmitter chip 1756. All variations of structure 1602 apply to structure 2002. Any variation of structure 2002 can be combined to form new variations of structure 2002.

[0149] Figure 21a and Figure 21b Configuration 502 is shown. Figure 5 Structure 2102 is used in which all receiving and transmitting surfaces are oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 2102 are the same as those of structure 1602, except that input device 104, input device 404, filtering device 304, and output device 106 are all connected to carrier chip 1604 such that optional receiving surface 1612, transmitting surface 1616, optional receiving surface 1622, transmitting surface 1626, receiving surface 1632, transmitting surface structure 1636, receiving surface 1642, receiving surface 1652, and optional transmitting surface 1656 are oriented perpendicular to the top surface of carrier chip 1604. All variations of structure 1602 apply to structure 2102. Any variation of structure 2102 can be combined to form new variations of structure 2102.

[0150] Figure 22a and Figure 22b Configuration 502 is shown. Figure 5Structure 2202, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, filtering devices, and output devices comprise multiple stacked chips. The description and variations of structure 2202 are the same as those of structure 2102, except that input device 104, input device 404, filtering device 304, and output device 106 comprise multiple chips stacked parallel to the top surface of the carrier chip 1604. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more rows of a receiver array (not shown) of optional receiver surface 1612, one or more rows of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for the optional receiver surface 1612 and transmitter surface 1616 portions within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure the optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surfaces 1662, as described for input device 104 with respect to structure 1604 and variations thereof. Similarly, input device 404 includes chip stack 2222, which includes optional receiver surface 1622, waveguide network 1216, and transmitter surface 1626. Each chip in the chip stack 2222 includes one or more rows of a receiver array (not shown) of an optional receiver surface 1622, one or more rows of a transmitter array (not shown) of a transmitter surface 1626, and necessary electro-optic components and / or portions of the waveguide network 1216 to provide the input device 404 with the required functionality for the optional receiver surface 1622 and transmitter surface 1626 portions within each chip, and interconnects with adjacent chips via electro-optic contact surfaces (not shown) between the chips in the chip stack 2222. The number of chips in the chip stack 2222 is the same as the number required to construct the optional receiver surface 1622 and transmitter surface 1626 to the required size of the input device 404. The chip stack 2222 is connected to the carrier chip 1604 via electro-optic contact surfaces (not shown), as described for the input device 404 of structure 1604 and its variations. The filter device 304 includes a chip stack 2232, which includes a receiving surface 1632, a receiving surface 1642, a waveguide network 1634, and a transmitting surface 1636.Each chip in chip stack 2232 includes one or more rows of receiver arrays (not shown) of receiver surface 1632, one or more rows of receiver arrays (not shown) of receiver surface 1642, one or more rows of transmitter arrays (not shown) of transmitter surface 1636, and necessary electro-optic components and / or portions of waveguide network 1634 to provide the required functionality of filter device 304 for portions of receiver surface 1632, receiver surface 1642, and transmitter surface 1636 within each chip, and interconnects with adjacent chips via contact surfaces 2264 between the chips in chip stack 2232. The number of chips in chip stack 2232 is the same as the number required to construct receiver surfaces 1632, receiver surface 1642, and transmitter surface 1636 into the required dimensions of filter device 304. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1664, as described for filter device 304 with respect to structure 1604 and its variations. Output device 106 includes a chip stack 2252, which includes a receiving surface 1652, a waveguide network 1654, and an optional transmitting surface 1656. Each chip in chip stack 2252 includes one or more rows of a receiving array (not shown) of the receiving surface 1652, one or more columns of a transmitting array (not shown) of the optional transmitting surface 1656, and necessary electro-optic components and / or portions of the waveguide network 1654 to provide the required functionality of output device 106 for portions of the receiving surface 1652 and optional transmitting surface 1656 within each chip, and interconnects with adjacent chips via contact surfaces 2266 between the chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to construct the receiving surface 1652 and optional transmitting surface 1656 to the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surfaces 1666, as described for output device 106 with respect to structure 1604 and its variations. All variations of structure 2102 apply to structure 2202. Any variation of structure 2202 can be combined to form a new variation of structure 2202.

[0151] Figure 23a and Figure 23b Configuration 502 is shown. Figure 5Structure 2302, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, filtering devices, and output devices comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 2302 are the same as those of structure 2102, except that input device 104, input device 404, filtering device 304, and output device 106 comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. Additionally, the filter device 304 of structure 2302 does not have a receiving surface 1642 and also includes an additional sub-device component 2338, which is designed to mix and / or modulate light received from free space 108 and free space 408 to transmit it to a receiving array 1632 at the contact surface 2342 of the chip stack 2232. The sub-device component 2338 may be an optical component such as a beam splitter, a waveguide device, a composite stack of waveguide devices or components, or a waveguide system, including but not limited to any of the previously described devices, systems, and / or variations thereof. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more columns of a receiver array (not shown) of optional receiver surface 1612, one or more columns of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for the optional receiver surface 1612 and transmitter surface 1616 portions within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure the optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surfaces 1662, as described for input device 104 with respect to structure 1604 and its variations. Similarly, input device 404 includes chip stack 2222, which includes optional receiver surface 1622, waveguide network 1216, and transmitter surface 1626. Each chip in the chip stack 2222 includes one or more columns of a receiver array (not shown) of an optional receiver surface 1622, one or more columns of a transmitter array (not shown) of a transmitter surface 1626, and necessary electro-optic components and / or portions of the waveguide network 1216 to provide the input device 404 with the required functionality for the optional receiver surface 1622 and transmitter surface 1626 portions within each chip, and interconnects with adjacent chips via electro-optic contact surfaces (not shown) between the chips in the chip stack 2222. The number of chips in the chip stack 2222 is the same as the number required to construct the optional receiver surface 1622 and transmitter surface 1626 to the required dimensions of the input device 404.Chip stack 2222 is connected to carrier chip 1604 via electro-optic contact surfaces (not shown), as described for input device 404 and its variants. Filtering device 304 includes chip stack 2232, which includes a receiving surface 1632, a waveguide network 1634, and a transmitting surface 1636. Each chip in chip stack 2232 includes one or more rows of receiving arrays (not shown) of receiving surface 1632, one or more rows of transmitting arrays (not shown) of transmitting surface 1636, and necessary electro-optic components and / or portions of waveguide network 1634 to provide the required functionality of filtering device 304 for the receiving surface 1632 and transmitting surface 1636 portions within each chip, and interconnects with adjacent chips via contact surfaces 2264 between chips in chip stack 2232. The number of chips in chip stack 2232 is the same as the number required to construct receiving surface 1632 and transmitting surface 1636 to the required dimensions of filtering device 304. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1664, as described in filter device 304 for structure 1604 and its variants. Output device 106 includes chip stack 2252, which includes receiving surface 1652, waveguide network 1654, and optional transmitting surface 1656. Each chip in chip stack 2252 includes one or more columns of receiving array (not shown) of receiving surface 1652, one or more columns of transmitting array (not shown) of optional transmitting surface 1656, and necessary electro-optic components and / or portions of waveguide network 1654 to provide the required functionality of output device 106 for portions of receiving surface 1652 and optional transmitting surface 1656 within each chip, and interconnects with adjacent chips via contact surfaces 2266 between chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to construct receiving surface 1652 and optional transmitting surface 1656 to the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surface 1666, as described for output device 106 for structure 1604 and its variations. All variations of structure 2102 apply to structure 2302. Any variation of structure 2302 can be combined to form a new variation of structure 2302.

[0152] Figure 24a and Figure 24b Configuration 502 is shown. Figure 5Structure 2402, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and all input devices, filtering devices, output devices, and free space regions are incorporated into the carrier chip 1604. The description and variations of structure 2402 are the same as those of structure 2002, except that all components of free spaces 108, 308, 408, optional free spaces 2408, optional free spaces 2418, and optional free spaces 2458 are mounted, joined, attached, incorporated, embedded, or manufactured within the carrier chip 1604, wherein optional free spaces 2408, 2418, and / or 2458 can be regional air or other gases (e.g., nitrogen), liquids (e.g., refractive index matching fluids), solids (e.g., refractive index matching glass), or vacuum, including zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components. Optional free space 2408 provides an optical connection between optional receiver array 1612 and the surface of carrier chip 1604 to enable interconnection between input device 104 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2408 share a common optical axis with optional receiver array 1612. Similarly, optional free space 2418 provides an optical connection between optional receiver array 1622 and the surface of carrier chip 1604 to enable interconnection between input device 104 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2418 share a common optical axis with optional receiver array 1622. Optional free space 2458 provides an optical connection between optional transmitter array 1656 and the surface of carrier chip 1604 to enable interconnection between output device 106 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2458 share a common optical axis with optional receiver array 1656. All variations of structure 2002 are applicable to structure 2402. Any variation of structure 2402 can be combined to form a new variation of structure 2402.

[0153] Figure 25a and Figure 25b Configuration 502 is shown. Figure 5Structure 2502, wherein all receiving and transmitting surfaces are oriented perpendicular to the top surface of carrier chip 1604, and all input devices, filtering devices, output devices, and free space regions are incorporated into carrier chip 1604. The description and variations of structure 2502 are the same as those of structure 2102, except that input devices 104, 404, 304, 106, 108, 308, and 408 are mounted, joined, attached, incorporated, embedded, or fabricated within carrier chip 1604, thereby eliminating contact surfaces 1662, 1664, and 1666. Optional receiving surfaces 1612, 1622, and 1656 are located on the side surfaces of carrier chip 1604, such that they can be optionally interconnected with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, optical fibers, microlens arrays, or other optical carrier media (not shown). All variations of structure 2102 are applicable to structure 2502. Any variation of structure 2502 can be combined to form a new variation of structure 2502.

[0154] Figure 26a and Figure 26b Configuration 802 is shown. Figure 8Structure 2602, wherein all devices and their receiving and transmitting surfaces are oriented parallel to the top surface of carrier chip 1604. All components and devices of configuration 802 are incorporated into structure 2602. Similarly, the description for configuration 802 applies to structure 2602, except for the components with the following additional details and descriptions. Carrier chip 1604 provides electrical and / or optical interconnects between itself and input device 104, filter device 304, and / or output device 106, wherein carrier chip 1604 may be a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnect platform. Laser 504 may be mounted, bonded, attached, embedded, or fabricated within or on carrier chip 1604. Optical guide 506 and / or optional optical guide 526 may be waveguides on or within carrier chip 1604. Input data, filtered data, output data, and control data (not shown) of all devices connected to and / or including carrier chip 1604 can be transmitted to carrier chip 1604 via carrier chip data line 1608 and carrier chip control line 1610. The carrier chip data line 1608 and / or carrier chip control line 1610 can be wires (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data-carrying or energy-propagating medium. Their terminals, connectors, and / or connection surfaces can be located on one or more surfaces and / or edges of carrier chip 1604. Electro-optical network 1674 can carry electrical and / or optical signals between the entire carrier chip 1610 and carrier chip data line 1608 and carrier chip control line 1610, and / or electrical and / or optical signals to / from input device 104, filter device 304, and / or output device 106. Electro-optical network 1674 can include wires, optical fibers, waveguides, and / or any other data and / or energy-propagating medium. Input device 104 is connected to carrier chip 1604 at electrical and / or optical contact surface 1662, where contact surface 1662 is the physical interface between input device 104 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to input device 104. Input and control data (not shown) can be provided to input device 104 via contact surface 1662 through input data line 508 and input control line 510 connected to electro-optical network 1674. Filtering device 304 is connected to carrier chip 1604 at electrical and / or optical contact surface 1664, where contact surface 1664 is the physical interface between filtering device 304 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to filtering device 304. Filter and control data (not shown) can be provided to filter device 304 via contact surface 1664 through filter data line 538 and filter control line 540 connected to electro-optical network 1674.Output device 106 is connected to carrier chip 1604 at electrical and / or optical contact surface 1666, where contact surface 1666 is the physical interface between output device 106 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to output device 106. Output data (not shown) can be received from output device 106 via output data line 528 via contact surface 1662, and control data (not shown) can be transmitted to or received from output device 106 via output control line 530 via contact surface 1662, where both output data line 528 and output control line 530 are connected to electro-optical network 1674. Carrier chip 1604 can perform preprocessing or post-processing on any data transmitted through electro-optical network 1674, including but not limited to modulation of light propagating by optical waveguides and / or mathematical operations on electrical signals propagating in wires in electro-optical network 1674. As described for configuration 802 and its variations, the propagation and / or modulation of light within the input device 104 occurs within the waveguide network 706. Input data (not shown) can be received by the input device 104 via an optional receiving surface 1612 and / or through a contact surface 1662, wherein the optional receiving surface 1612 includes an optical waveguide array coupled to the waveguide network 706, the optical waveguide array being arranged as for device 5604. Figures 56 to 58 Any configuration and / or variation thereof of the waveguide array described above. Similarly, input device 104 includes a transmitting surface 1616 that transmits light propagated by and / or modulated within the waveguide network 706 into free space 108, wherein the transmitting surface 1616 includes an optical waveguide array coupled to the waveguide network 706, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 Any configuration and / or variation of the waveguide array described for configuration 802 and its variations. Optical propagation and / or optical modulation within the filter device 304 described for configuration 802 and its variations occur within the waveguide network 1634. The filter device 304 can receive filtered data (not shown) from free space 108 via a receiving surface 1632 and / or via a contact surface 1664, wherein the receiving surface 1632 includes an optical waveguide array coupled to the waveguide network 1634, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array can be any configuration and / or variation thereof, and may include a different number of receiving waveguide elements. Similarly, the filtering device 304 includes a transmitting surface 1636 that transmits light propagated by and / or modulated within the waveguide network 1634 into free space 308, wherein the transmitting surface 1636 includes an optical waveguide array coupled to the waveguide network 1634, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58The waveguide array described for configuration 802 and its variations is used in the configuration and / or variations thereof. The propagation, modulation, and / or detection of light within the output device 106, as described for configuration 802 and its variations, occurs within the waveguide network 1654. The output device 106 can receive output data (not shown) via a receiving surface 1652, wherein the receiving surface 1652 includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described in the diagram is a configuration and / or variation thereof. Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within the waveguide network 1654, wherein the emitting surface 1656 includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described in the configuration and / or variations.

[0155] In one variation of structure 2602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to an external waveguide or waveguide array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a second variation of structure 2602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to an external optical fiber or fiber array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a third variation of structure 2602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to free space (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a fourth variation of structure 2602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 2602, and input data for input device 104 is received only through the receiving surface 1612. In a fifth variation of structure 2602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 2602, and input data for input device 104 is received through the receiving surface 1612 and / or the input data line 508. In a sixth variation of structure 2602, input device 104 does not have an optional receiving surface 1612, and input data is provided from carrier chip 1604 only through input data line 508. In a seventh variation of structure 2602, output device 106 has an optional emitting surface 1656, the emitting array of which is coupled to an external waveguide or waveguide array (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides. In an eighth variation of structure 2602, output device 106 has an optional emitting surface 1656, the emitting array of which is coupled to an external optical fiber or fiber array (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides. In a ninth variation of structure 2602, output device 106 has an optional emitting surface 1656, the emitting array of which is coupled to free space (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides.In a tenth variation of structure 2602, output device 106 has an optional transmitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 2602, and input data for output device 106 is received only through the transmitting surface 1656. In an eleventh variation of structure 2602, output device 106 has an optional transmitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 2602, and output data of output device 106 is transmitted through the transmitting surface 1656 and / or output data line 528. In a twelfth variation of structure 2602, output device 106 does not have an optional transmitting surface 1656, and output data is transmitted to carrier chip 1604 only through output data line 528. In a thirteenth variation of structure 2602, it can be combined with any of the first to twelfth variations of structure 2602 or other variations, with the basic configuration replaced by configuration 902. Figure 9 This configuration includes a single laser source, an internal laser 704 coupled to a waveguide network 706, and an optional reference optical guide 526 coupled to the waveguide network 706 via an optional waveguide coupler 708. In a fourteenth variation of configuration 2602, it can be replaced with configuration 1402 by any of the first to twelfth variations or other combinations thereof. Figure 14 In this configuration, no laser source is configured, and an optional reference optical guide 526 can be coupled to the waveguide network 706 via an optional waveguide coupler 708. Any variation of structure 2602 can be combined to form a new variation of structure 2602.

[0156] Figure 27a and Figure 27b Configuration 802 is shown. Figure 8Structure 2702 is used where all receiving and transmitting surfaces are oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 2702 are the same as those of structure 2602, except that the input device, filtering device, and output device are divided into multiple sub-device chips. Input device 104 includes a base control chip 1714, an optional receiving chip 1712, and a transmitting chip 1716. Base control chip 1714 includes a waveguide 706 and is connected to carrier chip 1604 via contact surface 1662. Optional receiving chip 1712 includes an optional receiving surface 1612 and is connected to base control chip 1714 via contact surface 1762, wherein contact surface 1762 provides an electro-optical interconnect between optional receiving chip 1712 and base control chip 1714. Similarly, the transmitting chip 1716 includes a transmitting surface 1616 and is connected to the base control chip 1714 via a contact surface 1764, wherein the contact surface 1764 provides an electro-optical interconnect between the transmitting chip 1716 and the base control chip 1714. The filtering device 304 includes a base control chip 1734, a receiving chip 1732, and a transmitting chip 1736. The base control chip 1734 includes a waveguide 1634 and is connected to the carrier chip 1604 via a contact surface 1664. The receiving chip 1732 includes a receiving surface 1632 and is connected to the base control chip 1734 via a contact surface 1772, wherein the contact surface 1772 provides an electro-optical interconnect between the receiving chip 1732 and the base control chip 1734. The transmitting chip 1736 includes a transmitting surface 1636 and is connected to the base control chip 1734 via a contact surface 1774, wherein the contact surface 1774 provides an electro-optical interconnect between the transmitting chip 1736 and the base control chip 1734. Output device 106 includes a base control chip 1754, a receiver chip 1752, and an optional transmitter chip 1756. The base control chip 1754 includes a waveguide 1654 and is connected to a carrier chip 1604 via a contact surface 1666. The receiver chip 1752 includes a receiving surface 1652 and is connected to the base control chip 1754 via a contact surface 1782, wherein the contact surface 1782 provides an electro-optical interconnect between the receiver chip 1752 and the base control chip 1754. Similarly, the optional transmitter chip 1756 includes an optional transmitting surface 1656 and is connected to the base control chip 1754 via a contact surface 1784, wherein the contact surface 1784 provides an electro-optical interconnect between the optional transmitter chip 1756 and the base control chip 1754. All variations of structure 2602 are applicable to structure 2702, except as described below. Any variation of structure 2702 with optional receiving surface 1612 will also have optional receiving chip 1712, and any variation without optional receiving surface 1612 will not have optional receiving chip 1712.Similarly, any variant of structure 2702 with optional emitter surface 1656 will also have optional emitter chip 1756, and any variant without optional emitter surface 1656 will not have optional receiver chip 1756. Any variant of structure 2702 can be combined to form new variants of structure 2702.

[0157] Figure 28a and Figure 28b Configuration 802 is shown. Figure 8Structure 2802, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and portions of each input device, filtering device, and output device are incorporated into the carrier chip 1604. The description and variations of structure 2802 are the same as those of structure 2702, except that, for structure 2802, components and functions of the control chip of structure 2702 are integrated into the carrier chip 1604. For input device 104, components and functions of control chip 1714, including portions of waveguide 706, are integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1662. Optional receiving chip 1712 is connected to carrier chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiving chip 1712, carrier chip 1604, and waveguide network 706. Similarly, the transmitting chip 1716 is connected to the carrier chip 1604 via contact surface 1764, where contact surface 1764 provides electro-optical interconnection between the transmitting chip 1716, the carrier chip 1604, and the waveguide network 706. For the filtering device 304, the components and functions of the control chip 1734, including portions of the waveguide 1634, have been integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1664. The receiving chip 1732 is connected to the carrier chip 1604 via contact surface 1772, where contact surface 1772 provides electro-optical interconnection between the receiving chip 1732, the carrier chip 1604, and the waveguide network 1634. The transmitting chip 1736 is connected to the carrier chip 1604 via contact surface 1774, where contact surface 1774 provides electro-optical interconnection between the transmitting chip 1736, the carrier chip 1604, and the waveguide network 1634. For output device 106, components and functions of control chip 1754, including portions of waveguide 1654, have been integrated into carrier chip 1604, thereby eliminating contact surface 1666. Receiver chip 1752 is connected to carrier chip 1604 via contact surface 1782, which provides electro-optical interconnection between receiver chip 1752, carrier chip 1604, and waveguide network 1654. Similarly, optional transmitter chip 1756 is connected to carrier chip 1604 via contact surface 1784, which provides electro-optical interconnection between optional transmitter chip 1756, carrier chip 1604, and waveguide network 1654. All variations of structure 2702 are applicable to structure 2802. Any variation of structure 2802 can be combined to form new variations of structure 2802.

[0158] Figure 29a and Figure 29b Configuration 802 is shown. Figure 8Structure 2902 is an embodiment of structure 2802, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of carrier chip 1604, and portions of each input device, filtering device, and output device are incorporated into carrier chip 1604. The description and variations of structure 2902 are the same as those of structure 2802, except that: optional receiving chip 1712, transmitting chip 1716, receiving chip 1732, transmitting chip 1736, receiving chip 1752, and optional transmitting chip 1756 are oriented parallel to the top surface of carrier chip 1604, such that all receiving and transmitting surfaces are oriented parallel to the top surface of carrier chip 1604. Structure 2902 is similar to structure 2602, except that input device 104, filtering device 304, and output device 106 have been integrated into carrier chip 1604. All variations of structure 2802 apply to structure 2902. Any variation of structure 2902 can be combined to form new variations of structure 2902.

[0159] Figure 30a and Figure 30b Configuration 802 is shown. Figure 8 Structure 3002, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and all input devices, filtering devices, and output devices are incorporated into the carrier chip 1604. The description and variations of structure 3002 are the same as those of structure 2902, except that all components of input device 104, filtering device 304, and output device 106 are mounted, joined, attached, incorporated, embedded, or manufactured within the carrier chip 1604, thereby eliminating the optional receiving chip 1712, transmitting chip 1716, receiving chip 1732, transmitting chip 1736, receiving chip 1752, and optional transmitting chip 1756. All variations of structure 2602 apply to structure 3002. Any variation of structure 3002 can be combined to form a new variation of structure 3002.

[0160] Figure 31a and Figure 31b Configuration 802 is shown. Figure 8 Structure 3102 is used in which all receiving and transmitting surfaces are oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 3102 are the same as those of structure 2602, except that: input device 104, filter device 304, and output device 106 are connected to carrier chip 1604 such that optional receiving surface 1612, transmitting surface 1616, receiving surface 1632, transmitting surface 1636, receiving surface 1652, and optional transmitting surface 1656 are oriented perpendicular to the top surface of carrier chip 1604. All variations of structure 2602 apply to structure 3102. Any variation of structure 3102 can be combined to form new variations of structure 3102.

[0161] Figure 32a and Figure 32b Configuration 802 is shown. Figure 8Structure 3202, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, filtering devices, and output devices comprise multiple stacked chips. The description and variations of structure 3202 are the same as those of structure 3102, except that: input device 104, filtering device 304, and output device 106 comprise multiple chips stacked parallel to the top surface of the carrier chip 1604. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more rows of a receiver array (not shown) of optional receiver surface 1612, one or more rows of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for the optional receiver surface 1612 and transmitter surface 1616 portions within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure the optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1662, as described for input device 104 with respect to structure 1604 and its variations. Filtering device 304 includes chip stack 2232, which includes receiver surface 1632, waveguide network 1634, and transmitter surface 1636. Each chip in chip stack 2232 includes one or more rows of a receiver array (not shown) of a receiver surface 1632, one or more rows of a transmitter array (not shown) of a transmitter surface 1636, and necessary electro-optic components and / or portions of a waveguide network 1634 to provide the required functionality of the filter device 304 for the receiver surface 1632 and transmitter surface 1636 portions within each chip, and interconnects with adjacent chips via contact surfaces 2264 between the chips in chip stack 2232. The number of chips in chip stack 2232 is the same as the number required to construct the receiver surface 1632 and transmitter surface 1636 into the required dimensions of the filter device 304. Chip stack 2212 is connected to carrier chip 1604 via contact surfaces 1664, as described for filter device 304 with respect to structure 1604 and its variations. Output device 106 includes chip stack 2252, which includes a receiver surface 1652, a waveguide network 1654, and an optional transmitter surface 1656.Each chip in chip stack 2252 includes one or more rows of a receiver array (not shown) of a receiver surface 1652, one or more rows of a transmitter array (not shown) of an optional transmitter surface 1656, and necessary electro-optic components and / or portions of a waveguide network 1654 to provide the output device 106 with the required functionality of the portion of the receiver surface 1652 and optional transmitter surface 1656 within each chip, and interconnects with adjacent chips via contact surfaces 2266 between the chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to configure the receiver surface 1652 and optional transmitter surface 1656 to the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surfaces 1666, as described for output device 106 for structure 1604 and its variations. All variations of structure 3102 apply to structure 3202. Any variation of structure 3202 can be combined to form a new variation of structure 3202.

[0162] Figure 33a and Figure 33b Configuration 802 is shown. Figure 8Structure 3302, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, filtering devices, and output devices comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 3302 are the same as those of structure 3102, except that: input device 104, filtering device 304, and output device 106 comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more columns of a receiver array (not shown) of optional receiver surface 1612, one or more columns of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for the optional receiver surface 1612 and transmitter surface 1616 portions within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure the optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1662, as described for input device 104 with respect to structure 1604 and its variations. Filtering device 304 includes chip stack 2232, which includes receiver surface 1632, waveguide network 1634, and transmitter surface 1636. Each chip in chip stack 2232 includes one or more columns of a receiver array (not shown) of a receiver surface 1632, one or more columns of a transmitter array (not shown) of a transmitter surface 1636, and necessary electro-optic components and / or portions of a waveguide network 1634 to provide the filter device 304 with the required functionality for the receiver surface 1632 and transmitter surface 1636 portions within each chip, and interconnects with adjacent chips via contact surfaces 2264 between the chips in chip stack 2232. The number of chips in chip stack 2232 is the same as the number required to construct the receiver surface 1632 and transmitter surface 1636 into the required dimensions of filter device 304. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1664, as described for filter device 304 with respect to configuration 1604 and its variations. Output device 106 includes chip stack 2252, which includes a receiver surface 1652, a waveguide network 1654, and an optional transmitter surface 1656.Each chip in chip stack 2252 includes one or more columns of a receiver array (not shown) of a receiver surface 1652, one or more columns of a transmitter array (not shown) of an optional transmitter surface 1656, and necessary electro-optic components and / or portions of a waveguide network 1654 to provide the output device 106 with the required functionality for the receiver surface 1652 and optional transmitter surface 1656 portions within each chip, and interconnects with adjacent chips via contact surfaces 2266 between the chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to construct the receiver surface 1652 and optional transmitter surface 1656 into the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surfaces 1666, as described for output device 106 for structure 1604 and its variations. All variations of structure 3102 apply to structure 3302. Any variation of structure 3302 can be combined to form a new variation of structure 3302.

[0163] Figure 34a and Figure 34b Configuration 802 is shown. Figure 8 Structure 3402, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and all input devices, filtering devices, output devices, and free space regions are incorporated into the carrier chip 1604. The description and variations of structure 3402 are the same as those of structure 3002, except that all components of free space 108, free space 308, optional free space 2408, and optional free space 2458 are mounted, joined, attached, incorporated, embedded, or manufactured within the carrier chip 1604, wherein optional free space 2408 and / or optional free space 2458 can be regional air or other gases (e.g., nitrogen), liquids (e.g., refractive index matching fluids), solids (e.g., refractive index matching glass), or vacuum, including zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components. Optional free space 2408 provides an optical connection between optional receiver array 1612 and the surface of carrier chip 1604 to enable interconnection between input device 104 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2408 share a common optical axis with optional receiver array 1612. Similarly, optional free space 2458 provides an optical connection between optional transmitter array 1656 and the surface of carrier chip 1604 to enable interconnection between output device 106 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2458 share a common optical axis with optional receiver array 1656. All variations of structure 3002 are applicable to structure 3402. Any variation of structure 3402 can be combined to form a new variation of structure 3402.

[0164] Figure 35a and Figure 35b Configuration 802 is shown. Figure 8 Structure 3502, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, filtering devices, output devices, and free space regions are incorporated into the carrier chip 1604. The description and variations of structure 3502 are the same as those of structure 3102, except that all components of input device 104, filtering device 304, output device 106, free space 108, and free space 308 are mounted, joined, attached, incorporated, embedded, or fabricated within the carrier chip 1604, thereby eliminating contact surfaces 1662, 1664, and 1666. Optional receiving surface 1612 and optional transmitting surface 1656 are positioned at the side surfaces of the carrier chip 1604, such that they can be selectively interconnected with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, optical fibers, microlens arrays, or other optical propagation media (not shown). All variations of structure 3102 apply to structure 3502. Any variation of structure 3502 can be combined to form a new variation of structure 3502.

[0165] Figure 36a and Figure 36b Configuration 1002 is shown. Figure 10Structure 3602, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604. All components and devices of configuration 1002 are incorporated into structure 3602. Similarly, the description of configuration 1002 applies to structure 3602, except for the following additional details and described components. Carrier chip 1604 provides electrical and / or optical interconnects between itself and input device 104 and / or output device 106, wherein carrier chip 1604 may be a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnect platform. Laser 504 may be mounted, bonded, attached, embedded, or fabricated within or on carrier chip 1604. Optical guide 506 and / or optional optical guide 526 may be waveguides on or within carrier chip 1604. Input data, filtered data, output data, and control data (not shown) of all devices connected to and / or including carrier chip 1604 can be transmitted to carrier chip 1604 via carrier chip data line 1608 and carrier chip control line 1610. The carrier chip data line 1608 and / or carrier chip control line 1610 can be wires (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data-carrying or energy-propagating medium. Their terminals, connectors, and / or connection surfaces can be located on one or more surfaces and / or edges of carrier chip 1604. Electro-optical network 1674 can carry electrical and / or optical signals between the entire carrier chip 1610 and carrier chip data line 1608 and carrier chip control line 1610, and / or electrical and / or optical signals to / from input device 104, filter device 304, and / or output device 106. Electro-optical network 1674 can include wires, optical fibers, waveguides, and / or any other data and / or energy-propagating medium. Input device 104 is connected to carrier chip 1604 at an electrical and / or optical contact surface 1662, where contact surface 1662 is the physical interface between input device 104 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to input device 104. Input and control data (not shown) can be provided to input device 104 via contact surface 1662 through input data line 508 and input control line 510 connected to electro-optical network 1674. Output device 106 is connected to carrier chip 1604 at an electrical and / or optical contact surface 1666, where contact surface 1666 is the physical interface between output device 106 and carrier chip 1604, and power, electrical, optical, and / or control data can be provided from carrier chip 1604 to output device 106.Output data (not shown) can be received from the output device 106 via the output data line 528 through the contact surface 1662, and control data (not shown) can be transmitted to or received from the output device 106 via the output control line 530 through the contact surface 1662, wherein both the output data line 528 and the output control line 530 are connected to the electro-optical network 1674. The carrier chip 1604 can perform preprocessing or post-processing on any data transmitted through the electro-optical network 1674, including but not limited to modulation of light propagating by optical waveguides and / or mathematical operations on electrical signals propagating in wires in the electro-optical network 1674. The propagation and / or modulation of light within the input device 104, as described for configuration 1002 and its variations, occurs within the waveguide network 706. Input data (not shown) can be received by input device 104 via optional receiving surface 1612 and / or via contact surface 1662, wherein optional receiving surface 1612 includes an optical waveguide array coupled to waveguide network 706, the optical waveguide array being arranged as for device 5604. Figures 56 to 58 Any configuration and / or variation thereof of the waveguide array described above. Similarly, input device 104 includes a transmitting surface 1616 that transmits light propagated by and / or modulated within the waveguide network 706 into free space 108, wherein the transmitting surface 1616 includes an optical waveguide array coupled to the waveguide network 706, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 Any configuration and / or variation of the waveguide array described for configuration 1002 and its variations. The propagation, modulation, and / or detection of light within the output device 106 described for configuration 1002 and its variations occurs within the waveguide network 1654. The output device 106 can receive output data (not shown) via a receiving surface 1652, wherein the receiving surface 1652 includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described in the diagram is a configuration and / or variation thereof. Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within the waveguide network 1654, wherein the emitting surface 1656 includes an optical waveguide array coupled to the waveguide network 1654, the optical waveguide array being arranged as described for device 5604. Figures 56 to 58 The waveguide array described in the configuration and / or variations.

[0166] In one variation of structure 3602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to an external waveguide or waveguide array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a second variation of structure 3602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to an external optical fiber or fiber array (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a third variation of structure 3602, input device 104 has an optional receiving surface 1612, the receiving array of which is coupled to free space (not shown) that provides input data (e.g., from another optical system), wherein the receiving array of receiving surface 1612 may contain any number of waveguides. In a fourth variation of structure 3602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 3602, and input data for input device 104 is received only through receiving surface 1612. In a fifth variation of structure 3602, input device 104 has an optional receiving surface 1612 as described in the first, second, and / or third variations of structure 3602, and input data for input device 104 is received through receiving surface 1612 and / or input data line 508. In a sixth variation of structure 3602, input device 104 does not have an optional receiving surface 1612, and input data is provided from carrier chip 1604 only through input data line 508. In a seventh variation of structure 3602, output device 106 has an optional emitting surface 1656, whose emitting array is coupled to an external waveguide or waveguide array (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides. In an eighth variation of structure 3602, output device 106 has an optional emitting surface 1656, whose emitting array is coupled to an external optical fiber or fiber array (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides. In a ninth variation of structure 3602, output device 106 has an optional emitting surface 1656, whose emitting array is coupled to free space (not shown) to provide output data, for example, to another optical system, wherein the emitting array of emitting surface 1656 may have any number of waveguides. In the tenth variant of structure 3602, output device 106 has an optional transmitting surface 1656 as described in the seventh, eighth and / or ninth variants of structure 3602, and input data for output device 106 is received only through transmitting surface 1656.In the eleventh variation of configuration 3602, output device 106 has an optional transmit surface 1656 as described in the seventh, eighth, and / or ninth variations of configuration 3602, and transmits output data of output device 106 through transmit surface 1656 and / or output data line 528. In the twelfth variation of configuration 3602, output device 106 does not have an optional transmit surface 1656, and transmits output data to carrier chip 1604 only through output data line 528. In the thirteenth variation of configuration 3602, it can be combined with any of the first to twelfth variations of configuration 3602 or other variations, with the basic configuration replaced by configuration 1102. Figure 11 This configuration contains only one laser source, laser 704 coupled to an internal device of waveguide network 706, and an optional reference optical guide 526 coupled to waveguide network 706 via an optional waveguide coupler 708. In the fourteenth variant of configuration 3602, it can be combined with any of the first to twelfth variants or other variants of configuration 3602, with the basic configuration replaced by configuration 1502. Figure 15 In this configuration, no laser source is configured, and the optional reference optical guide 526 can be coupled to the waveguide network 706 via an optional waveguide coupler 708. Any variation of structure 3602 can be combined to form a new variation of structure 3602.

[0167] Figure 37a and Figure 37b Configuration 1002 is shown. Figure 10Structure 3702, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 3702 are the same as those of structure 3602, except that the input and output devices are divided into multiple sub-device chips. Input device 104 includes a base control chip 1714, an optional receiving chip 1712, and a transmitting chip 1716. Base control chip 1714 includes a waveguide 706 and is connected to carrier chip 1604 via contact surface 1662. Optional receiving chip 1712 includes an optional receiving surface 1612 and is connected to base control chip 1714 via contact surface 1762, wherein contact surface 1762 provides an electro-optical interconnect between optional receiving chip 1712 and base control chip 1714. Similarly, the transmitter chip 1716 includes a transmitter surface 1616 and is connected to the base control chip 1714 via a contact surface 1764, wherein the contact surface 1764 provides an electro-optical interconnect between the transmitter chip 1716 and the base control chip 1714. The output device 106 includes a base control chip 1754, a receiver chip 1752, and an optional transmitter chip 1756. The base control chip 1754 includes a waveguide 1654 and is connected to the carrier chip 1604 via a contact surface 1666. The receiver chip 1752 includes a receiver surface 1652 and is connected to the base control chip 1754 via a contact surface 1782, wherein the contact surface 1782 provides an electro-optical interconnect between the receiver chip 1752 and the base control chip 1754. Similarly, the optional transmitter chip 1756 includes an optional transmitter surface 1656 and is connected to the base control chip 1754 via a contact surface 1784, wherein the contact surface 1784 provides an electro-optical interconnect between the optional transmitter chip 1756 and the base control chip 1754. All variations of structure 3602 apply to structure 3702, except as follows. Any variation of structure 3702 with optional receiving surface 1612 will also have optional receiving chip 1712, and any variation without optional receiving surface 1612 will not have optional receiving chip 1712. Similarly, any variation of structure 3702 with optional transmitting surface 1656 will also have optional transmitting chip 1756, and any variation without optional transmitting surface 1656 will not have optional receiving chip 1756. Any variation of structure 3702 can be combined to form new variations of structure 3702.

[0168] Figure 38a and Figure 38b Configuration 1002 is shown. Figure 10Structure 3802, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and portions of each input and output device are incorporated into the carrier chip 1604. The description and variations of structure 3802 are the same as those of structure 3702, except that, for structure 3802, components and functions of the control chip of structure 3702 are integrated into the carrier chip 1604. For input device 104, components and functions of control chip 1714, including portions of waveguide 706, are integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1662. Optional receiving chip 1712 is connected to carrier chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiving chip 1712, carrier chip 1604, and waveguide network 706. Similarly, the transmitting chip 1716 is connected to the carrier chip 1604 via contact surface 1764, where contact surface 1764 provides electro-optical interconnection between the transmitting chip 1716, the carrier chip 1604, and the waveguide network 706. For the output device 106, components and functions of the control chip 1754, including portions of the waveguide 1654, have been integrated into the carrier chip 1604, thereby eliminating the need for contact surface 1666. The receiving chip 1752 is connected to the carrier chip 1604 via contact surface 1782, where contact surface 1782 provides electro-optical interconnection between the receiving chip 1752, the carrier chip 1604, and the waveguide network 1654. Similarly, an optional transmitting chip 1756 is connected to the carrier chip 1604 via contact surface 1784, where contact surface 1784 provides electro-optical interconnection between the optional transmitting chip 1756, the carrier chip 1604, and the waveguide network 1654. All variations of structure 3702 apply to structure 3802. Any variation of structure 3802 can be combined to form a new variation of structure 3802.

[0169] Figure 39a and Figure 39b Configuration 1002 is shown. Figure 10Structure 3902, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and portions of each input and output device are incorporated into the carrier chip 1604. The description and variations of structure 3902 are the same as those of structure 3802, except that: optional receiving chip 1712, transmitting chip 1716, receiving chip 1752, and optional transmitting chip 1756 are oriented parallel to the top surface of the carrier chip 1604, such that all receiving and transmitting surfaces are oriented parallel to the top surface of the carrier chip 1604. Structure 3902 is similar to structure 3602, except that portions of the input device 104 and output device 106 are integrated into the carrier chip 1604. All variations of structure 3802 apply to structure 3902. Any variation of structure 3902 can be combined to form new variations of structure 3902.

[0170] Figure 40a and Figure 40b Configuration 1002 is shown. Figure 10 Structure 4002, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and all input and output devices are incorporated into the carrier chip 1604. The description and variations of structure 4002 are the same as those of structure 3902, except that all components of input device 104 and output device 106 are mounted, joined, attached, incorporated, embedded, or manufactured within the carrier chip 1604, thereby eliminating the optional receiving chip 1712, transmitting chip 1716, receiving chip 1752, and optional transmitting chip 1756. All variations of structure 3602 apply to structure 4002. Any variation of structure 4002 can be combined to form a new variation of structure 4002.

[0171] Figure 41a and Figure 41b Configuration 1002 is shown. Figure 10 Structure 4102 is used in which all receiving and transmitting surfaces are oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 4102 are the same as those of structure 3602, except that: input device 104 and output device 106 are connected to carrier chip 1604 such that optional receiving surface 1612, transmitting surface 1616, receiving surface 1652, and optional transmitting surface 1656 are oriented perpendicular to the top surface of carrier chip 1604. Structure 3602 is applicable to structure 4102. Any variation of structure 4102 can be combined to form a new variation of structure 4102.

[0172] Figure 42a and Figure 42b Configuration 1002 is shown. Figure 10Structure 4202, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input and output devices include multiple stacked chips. The description and variations of structure 4202 are the same as those of structure 4102, except that: input device 104 and output device 106 include multiple chips stacked parallel to the top surface of the carrier chip 1604. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more rows of a receiver array (not shown) of optional receiver surface 1612, one or more rows of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for the optional receiver surface 1612 and transmitter surface 1616 portions within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure the optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surfaces 1662, as described for input device 104 with respect to structure 1604 and its variations. Output device 106 comprises chip stack 2252, which includes receiver surface 1652, waveguide network 1654, and optional transmitter surface 1656. Each chip in chip stack 2252 includes one or more rows of a receiver array (not shown) of receiver surface 1652, one or more rows of a transmitter array of optional transmitter surface 1656, and necessary electro-optic components and / or portions of waveguide network 1654 to provide the output device 106 with the required functionality of the receiver surface 1652 and optional transmitter surface 1656 portions within each chip, and interconnects with adjacent chips via contact surfaces 2266 between the chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to construct receiver surface 1652 and optional transmitter surface 1656 to the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surfaces 1666, as described for output device 106 for structure 1604 and its variations. All variations of structure 4102 are applicable to structure 4202. Any variation of structure 4202 can be combined to form a new variation of structure 4202.

[0173] Figure 43a and Figure 43b Configuration 1002 is shown. Figure 10Structure 4302, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input and output devices comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 4302 are the same as those of structure 4102, except that: input device 104 and output device 106 comprise multiple chips stacked perpendicular to the top surface of the carrier chip 1604. Input device 104 includes a chip stack 2212, which includes an optional receiving surface 1612, a waveguide network 706, and a transmitting surface 1616. Each chip in chip stack 2212 includes one or more columns of a receiver array (not shown) of optional receiver surface 1612, one or more columns of a transmitter array (not shown) of transmitter surface 1616, and necessary electro-optic components and / or portions of waveguide network 706 to provide the input device 104 with the required functionality for portions of optional receiver surface 1612 and transmitter surface 1616 within each chip, and interconnects with adjacent chips via contact surfaces 2262 between the chips in chip stack 2212. The number of chips in chip stack 2212 is the same as the number required to configure optional receiver surface 1612 and transmitter surface 1616 to the required dimensions of input device 104. Chip stack 2212 is connected to carrier chip 1604 via contact surface 1662, as described for input device 104 with respect to structure 1604 and its variations. Output device 106 includes chip stack 2252, which includes receiver surface 1652, waveguide network 1654, and optional transmitter surface 1656. Each chip in chip stack 2252 includes one or more columns of a receiver array (not shown) of a receiver surface 1652, one or more columns of a transmitter array (not shown) of an optional transmitter surface 1656, and necessary electro-optic components and / or portions of a waveguide network 1654 to provide the output device 106 with the required functionality of the receiver surface 1652 and the optional transmitter surface 1656 portion within each chip, and interconnects with adjacent chips via contact surfaces 2266 between the chips in chip stack 2252. The number of chips in chip stack 2252 is the same as the number required to configure the receiver surface 1652 and the optional transmitter surface 1656 to the required dimensions of output device 106. Chip stack 2252 is connected to carrier chip 1604 via contact surfaces 1666, as described for output device 106 for structure 1604 and its variations. All variations of structure 4102 apply to structure 4302. Any variation of structure 4302 can be combined to form a new variation of structure 4302.

[0174] Figure 44a and Figure 44b Configuration 1002 is shown. Figure 10Structure 4402, wherein all receiving and transmitting surfaces of the devices are oriented parallel to the top surface of the carrier chip 1604, and all input devices, output devices, and free space regions are incorporated into the carrier chip 1604. The description and variations of structure 4402 are the same as those of structure 4002, except that all components of free space 108, optional free space 2408, and optional free space 2458 are mounted, joined, attached, incorporated, embedded, or fabricated within the carrier chip 1604, wherein optional free space 2408 and / or optional free space 2458 may be regional air or other gases (e.g., nitrogen), liquids (e.g., refractive index matching fluids), solids (e.g., refractive index matching glass), or vacuum, including zero or more lenses, beam splitters, polarizers, waveplates, waveguides, optical fibers, microlens arrays, or other optical components. Optional free space 2408 provides an optical connection between optional receiver array 1612 and the surface of carrier chip 1604 to enable interconnection between input device 104 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2408 share a common optical axis with optional receiver array 1612. Similarly, optional free space 2458 provides an optical connection between optional transmitter array 1656 and the surface of carrier chip 1604 to enable interconnection between output device 106 and other devices, configurations, structures, and / or variations thereof, wherein all optical elements within free space 2458 share a common optical axis with optional receiver array 1656. All variations of structure 4002 are applicable to structure 4402. Any variation of structure 4402 can be combined to form a new variation of structure 4402.

[0175] Figure 45a and Figure 45b Configuration 1002 is shown. Figure 10 Structure 4502, wherein all receiving and transmitting surfaces of the devices are oriented perpendicular to the top surface of the carrier chip 1604, and all input devices, output devices, and free space regions are incorporated into the carrier chip 1604. The description and variations of structure 4502 are the same as those of structure 4102, except that all components of input device 104, output device 106, and free space 108 are mounted, joined, attached, incorporated, embedded, or fabricated within the carrier chip 1604, thereby eliminating contact surfaces 1662 and 1666. Optional receiving surface 1612 and optional transmitting surface 1656 are positioned on the side surfaces of the carrier chip 1604, allowing them to be selectively interconnected with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, optical fibers, microlens arrays, or other optical propagation media (not shown).

[0176] All variations of structure 4102 are applicable to structure 4502. Any variation of structure 4502 can be combined to form a new variation of structure 4502.

[0177] Figures 5 to 15 The possible structures of the configurations shown are not limited to those shown. Figures 16a to 45b The structure shown may vary depending on the number, physical dimensions, and / or layout and / or positioning of components, parts, devices, and / or systems, to improve manufacturing efficiency and / or meet form factor requirements, including but not limited to more compact and / or modular designs. Similarly, possible structures in the illustrated configuration may differ from the illustrated construction in their external interfaces and / or packaging to support electrical and / or optical interconnections with another device, system, configuration, and / or structure on any surface and / or facet of the possible structure. These possible structures may include, but are not limited to, zero or more wires, pins and / or pads, optical fibers, waveguides, couplers, and / or any other light or energy propagation medium and / or connectors to facilitate such interconnections.

[0178] All possible structures, configurations, systems, devices, and / or variations thereof can be connected to a complex system to perform various tasks, wherein any number of connection structures, configurations, systems, devices, and / or variations thereof can exist in a given complex system. Data can enter and / or leave the complex system as electrical and / or optical information, wherein data entering the complex system in a given form (i.e., encoded, compressed, modulated, or otherwise) or via a given carrier type (i.e., electrical, optical, or otherwise) does not need to leave the complex system in the same form or carrier type. Similarly, data within the complex system can move between the electrical and / or optical domains during processing as data moves between components of the complex system, wherein the data may be modified and may modulate other data and / or signals, and / or be modulated by other data and / or signals.

[0179] Figure 46A complex system 4604 is illustrated, which is a general-purpose complex optical system having one or more subsystem components (not shown), wherein the subsystem components can be any and / or possible complex optical systems, structures, configurations, systems, devices, and / or variations thereof. The subsystem components (not shown) can be interconnected via wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions) and / or any other data-carrying or energy-propagating medium (not shown). Input data is received via interconnect 4614 and output via interconnect 4615, wherein interconnects 4614-4615 can be one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions) and / or any other data-carrying or energy-propagating medium. Interconnects 4614 and 4615 do not need to include the same type or number of data or energy-propagating components. Complex system 4604 may be, but is not limited to: a printed circuit board having subsystem components (not shown) mounted, joined, attached and / or connected to its surface; a chip having subsystem parts (not shown) mounted, joined, attached, embedded and / or manufactured in or on its surface; or a collection of discrete subsystem parts (not shown) associated with the contribution to the requirements of complex system 4604, wherein these discrete subsystem parts (not shown) may be physically distant from each other.

[0180] Figure 47 Complex system 4704 is illustrated, which is a possible configuration of complex system 4604 with four subsystem components. Subsystems 4711 to 4714 can be any and / or possible structures, configurations, systems, devices, and / or variations thereof connected via interconnects 4722-4724, wherein interconnects 4722-4724 can be one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Input data is received via interconnect 4721 and output via interconnects 4725-4726, wherein interconnects 4721 and / or interconnects 4725-4726 can be one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium.

[0181] Various forms of optical information processing systems (including, but not limited to, their devices, configurations, structures, complex systems, and / or variations thereof) can be used to replace some or all of a given information processing, analysis, and / or learning application devices and / or systems, including but not limited to those designed for artificial intelligence, pattern recognition (audio, image, video, etc.), data preprocessing / postprocessing, high-frequency trading, information and computer security, encryption and / or decryption, compression and / or decompression, encoding and / or decoding, and / or conventional computing system devices and / or components, including but not limited to those that completely replace conventional electronic computing systems.

[0182] For traditional computing system components, optical information processing systems can be used to replace electrical, optical, or electro-optical networking systems, storage systems, and / or data processing systems, as optical network systems, optical storage systems, and optical information processing systems, wherein any combination of these systems can be used to create optical computing systems. Variations of optical computing systems have electrical and / or optical data communication systems for communicating with other computing systems.

[0183] Figure 48 A computer peripheral device 4802 is shown, which is an example computer peripheral device incorporating a complex optical system. A printed circuit board 4804 may support and electrically interconnect and / or optically interconnect a complex system 4806, a processor 4808, optional memories 4820-4822, optional optical networking connectors 4830-4831, and optional electrical networking connectors 4840-4841, wherein such interconnection is achieved through one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions) and / or any other data-carrying or energy-transmitting medium. The complex system 4806 may be electrically and / or optically mounted, coupled, attached, and / or connected to the printed circuit board 4804, wherein the complex system 4806 may be a complex system 4604 (…). Figure 46Any variation or configuration of the circuit board 4802. Input and / or output data can be transmitted to and / or from the computer peripheral device 4802 via optional optical networking connectors 4830-4831, optional electrical networking connectors 4840-4841, and / or electrical computer connector 4810. Complex system 4806 can receive and / or transmit data via optional optical networking connectors 4830-4831, optional electrical networking connectors 4840-4841, electrical computer connector 4810, optional memory 4820-4822, and / or processor 4808, wherein complex system 4806 can be directly connected to optional optical networking connectors 4830-4831 via optical fiber, waveguide, and / or other optical propagation media. In addition to the components and / or devices shown, additional components and / or devices may be present on the printed circuit board 4804. Similarly, the relative positioning of components on the printed circuit board 4804 may differ from that shown.

[0184] In one variant of the computer peripheral 4802, optional optical networking connectors 4830-4831 are not present, and data is transmitted only through optional electrical networking connectors 4840-4841 and / or electrical computer connector 4810. In a second variant of the computer peripheral 4802, optional electrical networking connectors 4840-4841 are not present, and data is transmitted only through optional optical networking connectors 4830-4831 and / or electrical computer connector 4810. In a third variant of the computer peripheral 4802, neither optional optical networking connectors 4830-4831 nor optional electrical networking connectors 4840-4841 are present, and data is transmitted only through electrical computer connector 4810. In a fourth variant of the computer peripheral 4802, optional memories 4820-4822 are not present, and the complex system 4806 and / or processor 4808 have the necessary storage and / or data latency capabilities to support the functional requirements of the computer peripheral 4802. The fifth variant 4802 of the computer peripheral device is a combination of the fourth variant and any one of the first to third variants.

[0185] Figure 49 An example computer peripheral device 4902 is shown, i.e., an example computer peripheral device in which the functions of an electrical processor and / or memory components have been integrated into a complex system 4906. The description and variations of computer peripheral device 4902 are the same as those for computer peripheral device 4802, except that the functions provided by processor 4808 and / or optional memory 4820-4822 have been integrated into complex system 4906, where complex system 4906 may be complex system 4604 (…). Figure 46 Any variation or configuration of ). Figure 50A computer motherboard 5002 is shown, i.e., an example computer motherboard incorporating a complex optical system. A printed circuit board 5004 may hold and electrically and / or optically interconnect complex system 5006, processor 5008, memory 5020, optional electrical peripheral connectors 5050-5053, and optional input / output ports 5060, wherein such interconnection is via one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions) and / or any other data-carrying or energy-transmitting medium. Complex system 5006 may be electrically and / or optically mounted, coupled, attached, and / or connected to printed circuit board 5004, wherein complex system 5006 may be complex system 4604 (…). Figure 46 Any variation or configuration of the complex system 5006 is permitted. The complex system 5006 can receive and / or transmit data via the processor 5008, memory 5020, optional PCI connectors 5050-5053, and / or optional input / output ports 5060. Additionally, besides those shown, the printed circuit board 5004 may have additional components and / or devices. Similarly, the relative positioning of components on the printed circuit board 5004 may differ from that shown.

[0186] In one variant of the computer motherboard 5002, one or more optional electrical peripheral connectors 5050-5053 are present. In a second variant of the computer motherboard 5002, there are no optional electrical peripheral connectors 5050-5053. In a third variant of the computer motherboard 5002, there is no optional input / output port 5060. A fourth variant of the computer motherboard 5002 combines variant three with either variant one or variant two.

[0187] Figure 51 A smartphone motherboard 5102 is shown, specifically an example smartphone motherboard incorporating a complex optical system. A printed circuit board 5104 can hold and electrically and / or optically interconnected complex systems 5106, a processor 5108, a memory 5120, and a camera 5170, wherein such interconnection is via one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-transmitting medium. Complex system 5106 can be electrically and / or optically mounted, coupled, attached, and / or connected to printed circuit board 5104, wherein complex system 5106 can be complex system 4604 (…). Figure 46Any variation or configuration of the complex system 5106. The complex system 5106 can receive and / or transmit data via the processor 5108, memory 5120, and / or camera 5170, wherein the complex system 5106 can be directly connected to the camera 5170 via wires, optical fibers, waveguides, and / or other light or energy propagation media. In addition to those shown, the printed circuit board 5104 may also have additional components and / or devices. Similarly, the relative positioning of components on the printed circuit board 5104 may differ from that shown.

[0188] Figure 52 An electro-optic processor 5202 is shown, i.e., an example processor combining an electrical processing unit and a complex optical system. A carrier chip 5204 can hold and electrically and / or optically interconnect the complex system 5206 and the processor 5208, wherein such interconnection is via one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions) and / or any other data-carrying or energy-transmitting medium. The complex system 5206 can be electrically and / or optically mounted, combined, attached, connected, embedded, or fabricated within or on the carrier chip 5204, wherein the complex system 5206 can be a complex system 4604 (…). Figure 46 Any variation or configuration of the carrier chip 5204. Similarly, the processor 5208 may be electrically and / or optically mounted, coupled, attached, connected, embedded, or manufactured within or on the carrier chip 5204, wherein the processor 5208 may include one or more electronic central processing units, graphics processing units, and / or memory components. The carrier chip 5204 may be a printed circuit board, an integrated chip, a chip carrier, an inserter, or any other electrical and / or optical interconnect platform. The carrier chip 5204 may have wires (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data-carrying or energy-propagating medium, the terminals, connectors, and / or connection surfaces of which may be positioned on one or more surfaces and / or edges of the carrier chip 5204 to facilitate connection to printed circuit boards, receptacles, devices, and / or other systems. In addition to those shown, the carrier chip 5204 may also have additional components and / or devices. Likewise, the relative positioning of components on the printed circuit board 5204 may differ from that shown.

[0189] Figure 53 A computer motherboard 5302 is shown, that is, an example computer motherboard incorporating an electro-optical processor. The description and variations of computer motherboard 5302 are the same as those for computer motherboard 5002, except that the processor 5008 and complex system 5006 from computer motherboard 5002 have been replaced by an electro-optical processor 5307, wherein the electro-optical processor 5307 can be any electro-optical processor 5202 ( Figure 52 Variations or configurations of ).

[0190] Figure 54 An electro-optical motherboard 5402 is shown, i.e., an example electro-optical computer motherboard incorporating a complex optical system. A carrier chip 5404 may hold and electrically and / or optically interconnect complex system 5406, optional optical networking connectors 5430-5431, and optional electrical networking connectors 5440-5441, wherein such interconnection is via one or more wires, optical fibers, waveguides, free space regions (including but not limited to vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-transmitting medium. Complex system 5406 may be electrically and / or optically mounted, combined, attached, connected, embedded, or manufactured within or on carrier chip 5404, wherein complex system 5406 may be complex system 4604 (…). Figure 46 Any variation or configuration of the carrier chip 5404. Input and / or output data can be transmitted to and / or from the electro-optical motherboard 5402 via optional optical networking connectors 5430-5431 and / or optional electrical networking connectors 5440-5441. Complex system 5406 can receive and / or transmit data via optional optical networking connectors 5430-5431 and / or optional electrical networking connectors 5440-5441, wherein complex system 5406 can be directly connected to optional optical networking connectors 5430-5431 via optical fiber, waveguide, and / or other optical propagation media. Carrier chip 5404 can be a printed circuit board, integrated chip, chip carrier, inserter, or any other electrical and / or optical interconnect platform. In addition to those shown, carrier chip 5404 may have additional components and / or devices. Similarly, the relative positioning of components on carrier chip 5404 may differ from that shown.

[0191] In one variant of the electro-optical motherboard 5402, there are no optional optical networking connectors 5430-5431, and data is transmitted only through optional electrical networking connectors 5440-5441. In a second variant of the electro-optical motherboard 5402, there are no optional electrical networking connectors 5440-5441, and data is transmitted only through optional optical networking connectors 5430-5431.

[0192] Figure 55 The diagram illustrates an electro-optical high-performance computing system 5502, specifically a server rack connected to an electro-optical and / or electro-optical computer server. The server rack 5504 contains computer servers 5580-5586, which can be conventional electronic computer servers or electro-optical computer servers integrated with electro-optical motherboards, for example… Figure 50 , Figure 53 and Figure 54The computer servers 5580-5586 are connected together and / or connected to an external computer system via electrical and / or optical networking cables, as shown. In addition to those shown, server rack 5504 may contain additional and / or fewer computer servers, components, and / or devices. Similarly, the relative positioning of the computer servers and components in server rack 5504 may differ from that shown.

[0193] Complex systems and devices, such as Figures 46 to 55 The examples shown can be used in many different applications, including but not limited to artificial intelligence, pattern recognition (audio, image, video, etc.), data preprocessing / postprocessing, high-frequency trading, information and computer security, encryption and / or decryption, compression and / or decompression, encoding and / or decoding, and / or traditional computing system devices and / or component functions, where sufficiently complex systems can completely replace traditional electronic computing systems.

[0194] Using sophisticated optical information processing systems to process large amounts of information, such as for image processing and / or artificial intelligence applications, offers several potential advantages. Optical information processing systems have the potential to process high-resolution image data at the same rate as low-resolution image data by eliminating the need for image scaling, sampling, and / or compression—which are infeasible for conventional electronic processor hardware or dedicated AI chips (limited only by the waveguide array size of the optical processing system). Furthermore, if a sophisticated optical system is designed to process full-resolution images (i.e., full-resolution image or video data from a given camera), then such a sophisticated system can be used for deep learning applications without any pooling. Conventional deep learning models implemented on electronic chips and devices require pooling and low-resolution tensor / matrix operations, which are inefficient at high resolutions due to limitations in feasible hardware design, whereas sophisticated optical systems are efficient regardless of resolution and / or matrix size (limited only by the waveguide transmitting and / or receiving array size of the optical processing system).

[0195] The array size for complex systems will vary depending on the constraints of the target platform. For complex systems in smartphones, such as... Figure 1 The system shown. (As shown in the image) Figure 51As shown, the array diameter can be between 4 and 6 mm, which would give a resolution range between 4000x4000 and 6000x6000 pixels for a pixel pitch of 1 μm (as described earlier regarding the design of a silicon-on-insulator waveguide array with a wavelength of 1550 nm). When limited by the operating speed of the system's electro-optic components (as described earlier regarding modulation and photodetection components) between 20 MHz and 30 GHz, the data throughput of a complex system would be between 320 TB / s and 480 PB / s (for a 4 mm array), and between 720 TB / s and 1 EB / s (all calculations assume 10 bits of data resolution per waveguide). However, for larger complex systems, such as those in… Figure 48 and Figure 49 The complex system designed for use on the computer peripheral device shown has an array diameter between 20 and 40 mm, which, for a pixel pitch of 1 μm, would give a resolution range between 20,000 x 20,000 and 40,000 x 40,000 pixels. When constrained by the operating speed of the system's electro-optic components between 20 MHz and 30 GHz, the data throughput of the complex system would be between 8 PB / s and 12 EB / s (for a 4 mm array), and between 32 PB / s and 48 EB / s (all calculations assume 10 bits of data resolution per waveguide). This analysis is merely an example and is not intended to limit the scope of the described complex system, but rather to illustrate the potential operating rates given the design assumptions.

[0196] Similarly, small and large array systems may be designed for different use cases, such as for artificial intelligence applications, where large array systems can be used for training systems and small array systems can be used for inference systems.

[0197] For artificial intelligence applications, such as deep learning, optical information processing systems can be configured as 4f systems to perform convolution and deconvolution operations in convolutional neural networks. In this case, the optical 4f system is essentially a single convolutional, deconvolutional, and / or nonlinear layer within the deep learning neural network. More complex optical systems can be constructed by linking multiple layers together (i.e., multiple devices, systems, configurations, constructions, complex systems, and / or variations thereof), where sufficiently complex systems can fully realize the entire optical neural network. More complex systems can be used to perform convolution / deconvolution and nonlinear (e.g., ReLU) operations. More complex systems can be used to perform convolution / deconvolution, nonlinear operations, and other mathematical operations such as addition and multiplication. More complex systems can acquire raw input from sensors and directly process information as an artificial neural network optical information processing system, outputting decisions electrically and / or optically, manipulating external devices, and / or transmitting information to other electrical and / or optical computing systems.

[0198] For pattern recognition, optical information processing systems can be configured as 4f systems for cross-correlation to perform cross-correlation between one or more data sets or datasets. More sophisticated systems can be used as pattern recognition optical information processing systems to process cross-correlation outputs and identify matches using peak detection algorithms or in conjunction with variants of artificial intelligence systems.

[0199] For high-frequency trading, artificial neural network optical information processing systems can be configured as optical high-frequency trading decision systems to make trading decisions using logic trained on historical and simulated trading data. During the decision-making process, more sophisticated systems can be used to perform differential and comparison operations between multiple data sources. More sophisticated systems can be used to detect and adapt to trading patterns that change over time. More sophisticated systems can be used to heuristically learn and react to competitors' trading algorithms. More sophisticated systems can combine any number of variations of optical high-frequency trading decision systems to create a more robust decision system. More sophisticated systems combine any variation of artificial neural network optical information processing systems with any variation of optical computing systems to create all-optical high-frequency trading systems.

[0200] For information and computer security, artificial neural network optical information processing systems can be configured as optical information security systems to analyze information provided indirectly or directly by sensors, networks, and memory storage systems to perform security and defense operations, authentication and authorization operations, and other information security tasks for networks, computers, and systems.

[0201] For data preprocessing / postprocessing, an optical information processing system can be configured as an optical data processing system to perform various mathematical operations to preprocess and / or postprocess information for use by other optical information processing system variants and / or computer systems, such as scaling, filtering, segmentation, etc.

[0202] For encryption / decryption, optical information processing systems and / or artificial neural network optical information processing systems can be configured as optical encryption / decryption systems.

[0203] For compression / decompression, optical information processing systems and / or artificial neural network optical information processing systems can be configured as compression / decompression systems.

[0204] For encoding / decoding, optical information processing systems and / or artificial neural network optical information processing systems can be configured as encoding / decoding systems.

[0205] In some respects, the term "communication" should be interpreted broadly to include one-way communication and any number of potential types of communication, such as two-way communication. It can simply include the transmission of data, signals, or (when referring to optical communication) light from one optical element to another.

Claims

1. An optical processing system, comprising: Spatial light modulation (SLM) device, including: One or more optical inputs, A first module includes a plurality of first waveguides arranged in an array of transmitters to form an optical output, wherein each first waveguide is coupled to one of one or more optical inputs. The first module further includes at least one optical modulation element for modulating light passing through at least one of the plurality of first waveguides. The first waveguides and the optical modulation element are integrated in at least one common module, wherein the surface of the transmitter is in contact with a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium. The system also includes: A second module, comprising a plurality of second waveguides arranged in an array, the second module having at least a receiver surface to contact the free space region; and At least one Fourier transform lens with a focal length of f, wherein the Fourier transform lens is arranged along a common optical axis between the first module and the second module, and the first module and the second module are spaced apart from each other by a distance f from adjacent Fourier transform lenses in the at least one Fourier transform lens.

2. The optical processing system according to claim 1, wherein, The first module and / or the second module have electro-optical interconnects for connection to the processing system.

3. The optical processing system according to claim 1 or 2, wherein, The at least one optical modulation element is aligned with at least one of the plurality of first waveguides.

4. The optical processing system according to claim 1 or 2, wherein, The at least one optical modulation element is a waveguide adjacent to at least one of the plurality of first waveguides.

5. The optical processing system according to claim 1 or 2, wherein, The at least one optical modulation element surrounds the at least one of the plurality of first waveguides.

6. The optical processing system according to claim 1 or 2, wherein, The at least one optical modulation element includes one or more of the following: a thermo-optical phase shifter, an electro-optical polymer, at least one gain component, and / or an evanescent coupling pump amplifier.

7. The optical processing system according to claim 1 or 2, wherein, The optical input is outside the device and coupled to each of the plurality of first waveguides via a branching element.

8. The optical processing system according to claim 1 or 2, wherein the device further comprises another waveguide array for splitting the optical input into multiple optical paths.

9. The optical processing system according to claim 1 or 2 further includes a microlens array for capturing modulated light after passing through at least one of the plurality of first waveguides and projecting the captured modulated light into the free space region.

10. The optical processing system according to claim 1 or 2, wherein, The plurality of first waveguides branch out from a single waveguide coupled to the optical input.

11. The optical processing system according to claim 1 or 2, wherein, At least one of the plurality of first waveguides has a planar light emitting surface and / or a planar light receiving surface.

12. The optical processing system according to claim 1 or 2, wherein, At least one of the plurality of waveguides has a non-planar light emitting surface and / or a non-planar light receiving surface.

13. The optical processing system according to claim 1 or 2, wherein, The SLM device is self-emitting.

14. The optical processing system according to claim 1 or 2, wherein, The SLM device is connected to the electro-optic carrier.

15. The optical processing system according to claim 1, wherein, The optical path length of the free space between the first module and the second module is at least 2f.

16. The optical processing system according to claim 15, wherein, The optical path length of the free space between the first module and the second module is equal to 2f.

17. The optical processing system according to claim 15, wherein, The optical path length of the free space between the first module and the second module is at least 4f.

18. The optical processing system according to claim 17, wherein, The optical path length of the free space between the first module and the second module is equal to 4f.

19. The optical processing system according to claim 1, wherein, The second module further includes a photodetector arranged to detect one or more of the following: the phase of light; the amplitude of light; the polarization of light; the intensity of light; the phase and amplitude of light; the phase and intensity of light; the phase and polarization of light; the amplitude and polarization of light; the intensity and polarization of light; optionally, capable of simultaneously detecting intensity and polarization; a combination of the phase, amplitude, and polarization of light; and a combination of the phase, intensity, and polarization of light.

20. An optical correlator comprising the system according to any one of the preceding claims.

21. An optical processing system, comprising: Receiver-transmitter SLM device, including: The first group of elements is arranged as a transmitter array. The second set of multiple elements are arranged as a receiver array; and A waveguide array that couples the transmitter array to the receiver array; The transmitter array, the receiver array, and the waveguide array are integrated into a common module, and the system further includes: Additional receiver arrays; and A Fourier transform lens with a focal length of f, wherein the Fourier transform lens is disposed along the common optical axis between the transmitter array and the additional receiver array, and the transmitter array and the additional receiver array are separated from the Fourier transform lens by a distance f.

22. The optical processing system of claim 21 further comprises an electro-optical interconnect for connection to the processing system.

23. The optical processing system according to any one of claims 21 to 22, further comprising at least one optical modulation element for modulating light passing through at least one of the waveguides.

24. The optical processing system according to claim 23, wherein, The at least one optical modulation element is aligned with at least one of the waveguide elements.

25. The optical processing system according to claim 23, wherein, The at least one optical modulation element is a waveguide adjacent to at least one of the waveguides.

26. The optical processing system according to claim 21 or 22, wherein, At least one optical modulation element surrounds a portion or all of at least one of the waveguides.

27. The optical processing system according to claim 21 or 22, wherein, At least one optical modulation element includes one or more of the following: a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, a mechanical modulator, and at least one gain component; optionally, the at least one gain component includes an evanescent coupling pump amplifier.

28. The optical processing system according to claim 21 or 22, wherein, The transmitter array and the receiver array are on the same plane.

29. The optical processing system according to claim 21 or 22, wherein, The transmitter array is located in a plane orthogonal to the receiver array.

30. The optical processing system according to claim 21 or 22, wherein, The transmitter array is located in a plane opposite to the receiver array.

31. The optical processing system according to claim 21 or 22, wherein, The number of transmitters is equal to, greater than or less than the number of receivers.

32. An optical processing system, comprising: A photoelectric detection device includes an input array, an output array, and a plurality of waveguides optically arranged between the input array and the output array, wherein the input array, the output array, and the plurality of waveguides are integrated in a common module, and a photodetector is provided to convert modulated light from the optical domain to the electrical domain. transmitter array, and A Fourier transform lens with a focal length of f is provided, wherein the Fourier transform lens is positioned along the common optical axis between the transmitter array and the input array, and the transmitter array and the input array are separated from the Fourier transform lens by a distance f. The system further includes at least one optical modulation element for modulating light passing through at least one of the waveguides.

33. The optical processing system according to claim 32, wherein, At least one of the plurality of waveguides terminates in one or a combination of the following: an interferometric photodetector, an electro-optical photodetector, and / or a differential photodetector.

34. The optical processing system according to claim 32, wherein, One or more waveguides in the waveguide are divided into multiple detectors for measuring a variety of optical properties.

35. The optical processing system according to claim 32, wherein, The photodetector performs photoelectric detection in one or more of the following ways: detecting the phase of light; detecting the amplitude of light; detecting the polarization of light; detecting the intensity of light; detecting both the phase and amplitude of light; detecting both the phase and intensity of light; detecting both the phase and polarization of light; detecting both the amplitude and polarization of light; detecting both the intensity and polarization of light; optionally, detecting both intensity and polarization simultaneously; detecting a combination of the phase, amplitude, and polarization of light; and detecting a combination of the phase, intensity, and polarization of light.

36. An SLM-photoelectric detection device, comprising: One or more optical inputs; One or more optical outputs; Multiple waveguides are arranged in a transmitter array, wherein each waveguide is coupled to one of one or more optical inputs; and At least one optical modulation element for modulating light passing through at least one of the waveguides; The waveguide and the optical modulation element are integrated in at least one common module, wherein one of the optical input or the optical output is connected to a free space region partially occupied by a vacuum, gas, liquid and / or solid medium. One or more photodetectors are used to convert modulated light from the optical domain to the electrical domain, the one or more photodetectors operating together with a plurality of additional waveguides; and the plurality of additional waveguides are arranged to form a receiver array. A Fourier transform lens with a focal length of f, wherein the Fourier transform lens is arranged along the common optical axis between the transmitter array and the receiver array, and the transmitter array and the receiver array are separated from the Fourier transform lens by a distance f.

37. An optical processing system, comprising: Receiver-transmitter-photoelectric detection device, including: The first group of elements is arranged as a transmitter array. The second set of multiple elements are arranged as a receiver array; and At least one waveguide that couples at least one of the first plurality of elements to at least one of the second plurality of elements; The system also includes: Additional receiver array; A Fourier transform lens with a focal length of f, wherein the Fourier transform lens is arranged along the common optical axis between the transmitter array and the other receiver array, and the transmitter array and the other receiver array are separated from the Fourier transform lens by a distance f; One or more photodetector elements for converting modulated light from the optical domain to the electrical domain, the one or more photodetector elements being arranged to operate together with one or more of the additional receiver array.

38. An optical information processing system, comprising the system according to any one of the preceding claims.

39. An optical system comprising the system according to any one of the preceding claims, wherein, Each of the emitting or receiving surfaces from any given SLM shares a common optical axis with at least one other emitting or receiving surface through a free space region partially occupied by a vacuum, gas, liquid, and / or solid medium.

Images