Contactless communication medium and method for producing the same

Abstract

The contactless communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member and a printed layer. The IC module is capable of performing contactless communication. The first member is made of a first transparent resin material, the first member includes a first surface and a second surface, the first surface is a surface forming a recessed portion in which the IC module is accommodated, and the second surface is located opposite to the first surface. The second member is made of a second transparent resin material, and the second member is connected to the first surface or the second surface. The printed layer is arranged between the first member and the second member.

Description

Technical Field

[0001] The present technology relates to a contactless communication medium and a method for producing the contactless communication medium. Background Art

[0002] Patent document 1 discloses a card body including an integrated circuit (IC) chip. The card body is molded using a colorless transparent material as a raw material, and a pattern and a coloring paint are printed on the card body. Therefore, even if a small number of card bodies are produced for each color, the production cost can be reduced by using the same resin raw material and the same metal mold. In addition, since a pattern is displayed on the transparent card body, it can be marked from the front and back surfaces of the transparent card body. This makes it possible to improve recognition performance, marking performance, and convenience (paragraphs

[0029] and

[0043] of Patent Document 1 and Figure 2 ).

[0003] Citation List

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2000-280665 Summary of the invention

[0006] Technical issues

[0007] There is a need for a technology that makes it possible to improve the design quality of such a contactless communication medium including an IC chip.

[0008] In view of the above circumstances, an object of the present technology is to provide a contactless communication medium and a method of producing the contactless communication medium, which make it possible to easily provide a contactless communication medium with high design quality.

[0009] Solution to the problem

[0010] In order to achieve the above-mentioned object, a non-contact communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member, and a printed layer.

[0011] The IC module is capable of performing contactless communication.

[0012] The first member is made of a first transparent resin material, and includes a first surface, which is a surface in which a concave portion accommodating the IC module is formed, and a second surface located opposite to the first surface.

[0013] The second member is made of a second transparent resin material, and the second member is connected to the first surface or the second surface.

[0014] The printed layer is disposed between the first member and the second member.

[0015] In the contactless communication medium, an IC module for performing contactless communication is accommodated in a recessed portion formed in a first member. Further, a second member is connected to a first surface or a second surface of the first member, and a printed layer is arranged between the first member and the second member. This makes it possible to easily provide a contactless communication medium with high design quality.

[0016] The contactless communication medium may further include a cover member arranged to cover the recessed portion in which the IC module is accommodated.

[0017] The cover member may include a plurality of recesses having different shapes.

[0018] The first transparent resin material may be acrylic resin or polycarbonate. In this case, the second transparent resin material may be acrylic resin or polycarbonate.

[0019] The first transparent resin material and the second transparent resin material may be the same material.

[0020] The contactless communication medium may have a plate shape with a uniform thickness. In this case, the first member and the second member may be connected to each other in the thickness direction.

[0021] The first member may include a first separation member and a second separation member, the first separation member being a member in which a through hole is formed, and the second separation member being connected to the first separation member to cover one of the openings of the through hole. In this case, the concave portion may be a through hole whose one opening is covered.

[0022] The contactless communication medium may further include a cover member arranged to cover the recessed portion in which the IC module is accommodated. In this case, the cover member may be arranged to cover the entire recessed portion when viewed from the thickness direction.

[0023] The cover member is arranged so that a surface of the cover member located opposite to the IC module is located in the same plane as the first surface of the first member.

[0024] The first member and the second member may have the same shape when viewed from the thickness direction.

[0025] The printed layer may be a layer on which at least one of characters, texts, pictures, photos, or graphics are printed.

[0026] When viewed from the thickness direction, the printed layer may have a specific outer shape. In this case, when viewed from the thickness direction, the first member and the second member may each have an outer shape based on the outer shape of the printed layer.

[0027] The first member, the second member, the cover member, and the printed layer may each be connected to another member using UV bonding, bonding with a double-sided tape, ultrasonic welding, laser welding, or thermal welding.

[0028] At least one of the first member, the second member, the cover member, or the printed layer is connected to another member using UV bonding.

[0029] The concave portion may be formed based on a specified reference position. In this case, the non-contact communication medium may further include a position display member indicating the reference position.

[0030] A method for producing a contactless communication medium according to another embodiment of the present technology includes:

[0031] Using a first transparent resin material to form a first member, the first member includes a first surface and a second surface, the first surface includes a concave portion, and the second surface is located opposite to the first surface;

[0032] forming a second member using a second transparent resin material;

[0033] accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; and

[0034] The second member is connected to the first surface or the second surface of the first member such that the printed layer is disposed between the first member and the second member.

[0035] A method for producing a contactless communication medium according to another embodiment of the present technology includes:

[0036] forming a first separation member using a first transparent resin material, the first separation member including a through hole;

[0037] forming a second separation member using a first transparent resin material;

[0038] A first member is formed by connecting a first separate member and a second separate member to cover one of the openings of the through hole, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being located opposite to the first surface;

[0039] forming a second member using a second transparent resin material;

[0040] accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; and

[0041] The second member is connected to the first surface or the second surface of the first member such that the printed layer is disposed between the first member and the second member.

[0042] A method for producing a contactless communication medium according to another embodiment of the present technology includes:

[0043] Using a first transparent resin material to form a first transparent member, the first transparent member includes a first surface and a second surface, the first surface includes a plurality of concave portions, and the second surface is located opposite to the first surface;

[0044] forming a second transparent member using a second transparent resin material;

[0045] accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of recessed portions;

[0046] connecting a second transparent member to the first surface or the second surface of the first transparent member so that the printed layer is disposed between the first transparent member and the second transparent member; and

[0047] A portion including each of the plurality of concave portions each accommodating an IC module therein is cut out so that the portion has a specific shape.

[0048] A method for producing a contactless communication medium according to another embodiment of the present technology includes:

[0049] forming a first separation member using a first transparent resin material, the first separation member including a plurality of through holes;

[0050] forming a second separation member using a first transparent resin material;

[0051] A first transparent member is formed by connecting a first separation member and a second separation member to cover corresponding openings of the plurality of through holes located on the same side, the first transparent member including a first surface including a plurality of concave portions and a second surface located opposite to the first surface;

[0052] forming a second transparent member using a second transparent resin material;

[0053] accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of recessed portions;

[0054] connecting a second transparent member to the first surface or the second surface of the first transparent member so that the printed layer is disposed between the first transparent member and the second transparent member; and

[0055] A portion including each of the plurality of concave portions each accommodating an IC module therein is cut out so that the portion has a specific shape.

[0056] Cutting out a portion including each of the plurality of concave portions so that the portion has a specific shape may be performed by laser processing or cutting processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 An example of the configuration of the communication system according to the first embodiment is schematically illustrated.

[0058] Figure 2 is an exploded perspective view illustrating an example of the configuration of an IC key chain item.

[0059] Figure 3 is a cross-sectional view illustrating a cross section of each member included in the IC key chain item.

[0060] Figure 4 The external shape of an IC key chain item is schematically illustrated.

[0061] Figure 5 is a schematic diagram for describing an example of a method for producing an IC key chain item.

[0062] Figure 6 is a schematic diagram for describing another example of a method for producing an IC key chain item.

[0063] Figure 7 is an exploded perspective view illustrating an example of the configuration of a processed plate.

[0064] Figure 8 is an exploded perspective view illustrating an example of the configuration of an IC key chain item according to the second embodiment.

[0065] Fig. 9 is a sectional view illustrating a cross section of each member included in the IC key chain item.

[0066] Fig.10 is an exploded perspective view illustrating another example of the configuration of the IC key chain item.

[0067] Fig.11 is a cross-sectional view illustrating a cross section of each member included in the IC key chain item.

[0068] Fig.12 is an exploded perspective view illustrating an example of the configuration of an IC key chain item.

[0069] Fig.13 is a cross-sectional view illustrating a cross section of each member included in the IC key chain item. DETAILED DESCRIPTION

[0070] Embodiments according to the present technology will be described below with reference to the drawings.

[0071] <First Embodiment>

[0072] [Communication System]

[0073] Figure 1An example of a configuration of a communication system according to a first embodiment of the present technology is schematically illustrated. A communication system 100 includes a reader / writer 5 and an IC key chain item 10 .

[0074] The IC key chain item 10 is a key chain item type communication medium that the user 1 can use.

[0075] An IC module that enables contactless communication is provided inside the IC key chain item 10. The IC key chain item 10 is a communication medium having the same appearance as, for example, an acrylic key chain item. Therefore, the IC key chain item 10 has the appearance of a common acrylic key chain item and can perform contactless wireless communication with the reader / writer 5.

[0076] In the present embodiment, use of the IC key chain item 10 enables communication according to near field communication (NFC) using an RF carrier frequency of 13.56 MHz and having a communication rate between 100 Kbps and 900 Kbps (hereinafter referred to as NFC communication).

[0077] An example of a communication system using NFC communication includes FeliCa (registered trademark) (communication rate between 212 Kbps and 424 Kbps). Of course, the present technology is not limited to this communication system, and can also be applied to NFC communication of another communication system. For example, a communication system according to a standard having a communication rate between 106 Kbps and 848 Kbps can be used.

[0078] The reader / writer 5 includes an antenna and can perform contactless communication with the IC key chain item 10. In other words, the reader / writer 5 can perform NFC communication with the IC key chain item 10. For example, the user 1 can perform, for example, electronic money payment by passing the IC key chain item 10 over the reader / writer 5.

[0079] [Structure of IC key chain items]

[0080] A specific example of the configuration of the IC key chain item 10 according to the present embodiment is described. The IC key chain item 10 corresponds to an embodiment of the contactless communication medium according to the present technology.

[0081] like Figure 1 As shown in FIG. 1 , the IC key chain article 10 includes a first main surface 7 located on the front side and on which the character can be seen, and a second main surface 8 located on the side opposite to the front side (see FIG. 1 ). Figure 2 ).

[0082] In the following description, the direction corresponding to the right and left sides of the character when the first main surface 7 is observed from the front (left-right direction) is defined as the X direction, and the direction corresponding to the top and bottom of the character when the first main surface 7 is observed from the front (up-down direction) is defined as the Y direction, so as to facilitate understanding of the description. In addition, the direction in which the first main surface 7 and the second main surface 8 face each other (thickness direction) is defined as the Z direction.

[0083] The user 1 can perform contactless communication by passing the first main surface 7 or the second main surface 8 over the reader / writer 5 without paying attention to the left-right direction (X direction) and the up-down direction (Y direction) with respect to the IC key chain item 10 .

[0084] Figure 2 A is an exploded perspective view illustrating an example of the configuration of the IC key chain article 10. In addition, Figure 2 B schematically illustrates the shape of the cover portion 15 when viewed from the Z-axis direction. Figure 3 1 is a cross-sectional view illustrating a cross section of each member included in the IC key chain article 10 . Figure 3 The cross-sectional view shown in FIG. 1 is a cross-sectional view of the IC key chain article 10 in an exploded state.

[0085] Figure 2 and Figure 3 The reference axis C shown in is an axis which is parallel to the Z direction (thickness direction) and passes through a communication reference position 17 defined with respect to the IC key chain article 10. The communication reference position 17 will be described later.

[0086] Figure 3 The cross-sectional view shown in FIG. 1 corresponds to a cross-sectional view cut along a plane parallel to the XZ plane and including the reference axis C. Figure 2 A cross-sectional view obtained from the exploded perspective view shown in .

[0087] like Figure 2 and Figure 3 As shown in FIG. 1 , the IC key chain article 10 includes a top layer portion 11, a printed portion 12, a recessed layer portion 13, an IC module 14, a cover portion 15, a printed layer 16, an adhesive layer 25, and a primer layer 27. Note that in FIG. Figure 2 The printed layer 16, the adhesive layer 25 and the primer layer 27 are omitted in the figure.

[0088] In this embodiment, a transparent resin material such as polymethyl methacrylate (PMMA) resin is used so that the IC key chain object 10 has the appearance of an acrylic key chain. The material of the IC key chain object 10 is not limited thereto and can be arbitrarily used.

[0089] In the present embodiment, the IC key chain article 10 has a uniform thickness from the first main surface 7 to the second main surface 8. In other words, the top layer portion 11 and the concave layer portion 13 are connected to each other in the thickness direction. In addition, the first main surface 7 and the second main surface 8 are flat without, for example, concavities and convexities. Therefore, when the IC key chain article 10 passes over the reader / writer 5, the communication distance between the IC key chain article 10 and the reader / writer 5 in the Z' direction becomes constant, and this enables high communication performance to be maintained.

[0090] The top layer portion 11 is a member made of a transparent resin material. The transparent resin material is a transparent resin material such as acrylic resin, polycarbonate or PMMA. Note that "transparent" conceptually includes "semi-transparent". In the present embodiment, the top layer portion 11 is a member made of PMMA.

[0091] In addition, the top portion 11 includes a first top surface 18a and a second top surface 18b corresponding to the first main surface 7. The second top surface 18b is a surface located opposite to the first top surface 18a (first main surface 7) and connected to the printing portion 12. In the present embodiment, the first top surface 18a and the second top surface 18b are flat in the X-axis direction and the Y-axis direction without concave-convex. In addition, in the present embodiment, the outer shape of the top portion 11 is a shape along the outline of the character printed in the printing portion 12.

[0092] The adhesive layer 25 is a member for connecting components of the IC key chain article 10. A UV adhesive or an acrylic pressure-sensitive adhesive hardened by ultraviolet light irradiation is used as a material of the adhesive layer 25. In the present embodiment, the adhesive layer 25 has a thickness of 0.03 mm.

[0093] In addition, in the present embodiment, a UV adhesive is used for the adhesive layer 25 arranged between the top layer portion 11 and the printed portion 12 and between the printed portion 12 and the concave layer portion 13, as shown in FIG. Figure 3 as shown in .

[0094] The primer layer 27 is a member that improves the adhesiveness of the adhesive layer 25. In the present embodiment, the primer layer 27 has a thickness of 0.03 mm. In addition, the primer layer 27 is arranged between the top layer portion 11 and the adhesive layer 25 and between the printed portion 12 and the adhesive layer 25.

[0095] The printing part 12 is a member that performs printing, and includes a transparent film 28 and a printing layer 29. In the present embodiment, the printing part 12 is formed by performing digital printing in the transparent film 28. At least one of characters, text, pictures, photos, or graphics is printed in the printing part 12.

[0096] The transparent film 28 is made of a transparent material. In the present embodiment, polyethylene terephthalate (PET) is used as the material of the transparent film 28. In addition, in the present embodiment, the transparent film 28 has a thickness of 0.075 mm.

[0097] The printing layer 29 is a member that performs printing. In the present embodiment, the printing layer 29 printed on the transparent film 28 has a thickness of 0.005 mm. In addition, liquid toner is used for the printing layer 29. Note that, in the present embodiment, the printing layer 29 corresponds to a printing layer arranged between the first member and the second member.

[0098] The concave layer portion 13 includes the concave portion 20 and is a member made of PMMA. In the present embodiment, the concave layer portion 13 includes a first concave layer surface 19 a corresponding to the second major surface 8 and a second concave layer surface 19 b connected to the printed portion 12 .

[0099] The concave portion 20 is formed in the first concave layer surface 19a (the second main surface 8) so as to be able to accommodate the IC module 14 therein. In the present embodiment, the concave portion 20 is formed so that the depth direction of the concave portion 20 is the Z-axis direction, and the concave portion 20 is circular when viewed from the Z-axis direction. The concave portion 20 has a shape that conforms to the circular shape of the IC module 14 when viewed from the Z-axis direction.

[0100] The first concave surface 19a is flat in the X-axis direction and the Y-axis direction (XY plane direction) except for the concave portion 20. The second concave surface 19b is also flat in the X-axis direction and the Y-axis direction.

[0101] In addition, the outer shape of the concave layer portion 13 is the shape of the outline of the character printed along the printing portion 12. In this embodiment, when viewed from the Z-axis direction, the top layer portion 11 and the concave layer portion 13 have the same outer shape, such as Figure 2 When viewed from the Z-axis direction, the top layer portion 11 and the concave layer portion 13 are connected to each other without misalignment of the respective edges of the top layer portion 11 and the concave layer portion 13.

[0102] In addition, in the present embodiment, the concave layer portion 13 has a thickness of 2 mm. The IC module 14 and the cover portion 15 are accommodated in the concave portion 20 formed in the concave layer portion 13. In addition, a first accommodating portion 21, a second accommodating portion 22, and a third accommodating portion 23 are formed in the concave portion 20. The first accommodating portion is used to accommodate the antenna, processor, and capacitor of the IC module 14, the second accommodating portion 22 is used to accommodate the substrate of the IC module 14, and the third accommodating portion 23 is used to accommodate the cover portion 15. Figure 3 as shown in .

[0103] The IC module 14 includes an antenna, a processor, a tuning circuit, and a capacitor. The various components included in the IC module 14 enable the IC key chain item 10 to perform contactless communication with the reader / writer 5. Note that in the present embodiment, a transparent resin material such as acrylic resin, polycarbonate, or PMMA is used. This makes it possible to reduce the impact on the IC module 14 in terms of communication performance, and therefore there is no need to adjust the tuning circuit. Of course, the antenna and the tuning circuit can be adjusted to suit the shape and material of the IC key chain item 10 in order to achieve specific communication performance. For example, the antenna and the tuning circuit are adjusted based on, for example, the length (thickness) of the IC key chain item 10 (thickness) in the Z-axis direction, or the dielectric constant of the components contained in the IC key chain item 10.

[0104] Examples of the IC module 14 include a contactless IC token in the form of a coin, such as RC-S 109. Without being limited thereto, the present technology can of course also be applied to other IC modules.

[0105] In this embodiment, the substrate of the IC module 14 has a thickness of 0.45 mm.

[0106] The cover portion 15 includes an adhesive layer 26, a cover layer 24 made of PMMA, and a printed layer 16 arranged between the adhesive layer 26 and the cover layer 24. In addition, when viewed from the thickness direction, the cover portion 15 is arranged to completely cover the recessed portion 20. In the present embodiment, the cover portion 15 is formed so that the cover portion 15 can be accommodated in the recessed portion 20. In other words, the cover portion 15 is arranged so that the IC module 14 is located between the cover portion 15 and the recessed layer portion 13.

[0107] In addition, in the present embodiment, the cover portion 15 is arranged so that the surface of the cover portion 15 located opposite to the IC module 14 (the surface of the cover layer 24) is located on a plane having the surface (the first concave layer surface 19a) of the concave layer portion 13 in which the concave portion 20 is formed. In other words, the surface of the concave layer portion 13 to which the cover portion 15 is connected is flat in the X-axis direction and the Y-axis direction.

[0108] In the present embodiment, the cover portion 15 has a thickness of 0.65 mm.

[0109] A mark indicating a communication reference position 17 used as a reference when contactless communication is performed by the IC module 14 is printed in the printed layer 16. For example, a pattern or text that enables visual recognition of the communication reference position 17 is printed. In addition, the printed layer 16 may use UV ink or the like.

[0110] The communication reference position 17 is a reference position at which wireless contactless communication can be performed between the IC key chain item 10 and the reader / writer 5. Wireless communication is correctly performed by passing a portion corresponding to the communication reference position 17 over the reader / writer 5. For example, when the IC key chain item 10 passes over the reader / writer 5 located away from the communication reference position 17, that is, when passing over a portion different from the portion corresponding to the communication reference position 17, this may result in inability to perform communication.

[0111] This enables the user 1 to correctly pass the IC key chain item 10 over the reader / writer 5 and thus reliably perform contactless communication. In other words, the user 1 is provided with higher operational performance.

[0112] Note that the shape and size of the mark printed in the printed layer 16 are not limited. For example, any other shape or size that prevents the IC module 14 from being seen from the Z-axis direction may be adopted. Since the IC module 14 is located between the printed layer 16 (cover portion 15) and the printed portion 12, the IC module 14 can be sufficiently prevented from being seen through.

[0113] In addition, the cover portion 15 includes a recess 15a and a recess 15b having different shapes, such as Figure 2 In the embodiment shown in B. In the present embodiment, the recesses 15a and 15b are formed asymmetrically. In other words, the cover portion 15 is formed so that the cover portion 15 is not in the same state even when the cover portion 15 is rotated or turned over, for example. This makes it possible to prevent the cover portion 15 in the wrong position from being inserted into the recessed portion 20.

[0114] In the present embodiment, the recessed portion 20 is formed to have a length of at least 1.13 mm in the Z-axis direction, taking into account the thickness of the substrate of the IC module 14, the cover portion 15, and the adhesive layer 26. Without being limited thereto, the recessed portion 20 may be formed arbitrarily depending on, for example, the thickness of the IC module 14, or a play may be provided. In addition, the shape of the recessed portion 20 is not limited. For example, the shapes of the first accommodating portion 21, the second accommodating portion 22, etc. may be appropriately designed according to the shape of the IC module 14.

[0115] In addition, there is no limitation on the method of connecting the IC module 14 to the cover portion 15. For example, an adhesive layer may be arranged between the IC module 14 and the cover portion 15, or the second accommodating portion 21 and the third accommodating portion 22 may be formed to have a structure (shape) that allows the IC module 14 and the cover portion 15 to be connected.

[0116] An acrylic pressure-sensitive adhesive is used for the adhesive layer 26. In the present embodiment, the adhesive layer 26 has a thickness of 0.03 mm.

[0117] Note that, in the present embodiment, the roof portion 11 is connected to the first surface or the second surface, and corresponds to a second member made of a second transparent resin material.

[0118] Note that, in the present embodiment, acrylic resin and polycarbonate correspond to the first transparent resin material and the second transparent resin material.

[0119] Note that, in the present embodiment, the concave layer portion 13 includes a first surface, a second surface located opposite to the first surface, and a concave portion formed in the first surface and accommodating the IC module therein. The concave layer portion 13 corresponds to a first member made of a first transparent resin material. In addition, the first concave layer surface 19a (second main surface 8) of the concave layer portion 13 corresponds to the first surface in which the concave portion accommodating the IC module is formed. In addition, the second concave layer surface 19b of the concave layer portion 13 corresponds to the second surface located opposite to the first surface.

[0120] Note that, in the present embodiment, the recessed portion 20 corresponds to a recessed portion in which an IC module is accommodated.

[0121] Note that, in the present embodiment, the cover portion 15 corresponds to a cover member arranged to cover a recessed portion in which an IC module is accommodated. In addition, in the present embodiment, the recesses 15a and 15b correspond to a plurality of recesses included in the cover member and having different shapes.

[0122] Note that, in the present embodiment, the printed layer 16 corresponds to a position display member indicating a reference position. In addition, the communication reference position 17 corresponds to a reference position.

[0123] Figure 4 There is schematically illustrated an example of a variation of the outer shape of the IC key chain article 10. A dotted circle 35 schematically indicates the position of the IC module 14.

[0124] In the present embodiment, the IC key chain article 10 is formed to have an outer shape 36 depending on a character 37 printed in the printed portion 12, such as Figure 4 As shown in A.

[0125] When viewed from the thickness direction (Z direction), the outer shape of the character 37 corresponds to the outer shape of the printed layer 29. In other words, the printed layer 29 has a specific outer shape when viewed from the thickness direction.

[0126] When viewed from the thickness direction, the surface portion 11 and the concave layer portion 13 have an outer shape based on the outer shape of the character 37 (the outer shape of the printed layer 29 ).

[0127] Without being limited thereto, the IC key chain article 10 may be formed to have any external shape. For example, the IC key chain article 10 may have an external shape 38 such as a rectangle, which includes a character 37 printed in the printed portion 12, such as Figure 4 In addition, for example, the IC key chain article 10 may have an outer shape 39 obtained by combining a shape along the character 37 and a rectangle, such as Figure 4 As shown in C. Furthermore, the IC key chain article 10 may have an outer shape 40 depending on the outer shape in the case where two characters 37 are arranged side by side in the printed portion 12 .

[0128] Figure 4 The configurations shown in B to D are also included in examples in which the surface portion 11 and the concave layer portion 13 have outer shapes based on the outer shape of the character 37 (the outer shape of the printed layer 29 ) when viewed from the thickness direction.

[0129] Therefore, the outer shape of the IC key chain article 10, when viewed from the thickness direction, can be Figure 2 and Figure 3 The XY plane direction shown in FIG.

[0130] As described above, the area around the position (dashed circle 35) where the IC module 14 is arranged has a fixed layer structure (fixed thickness) in the XY plane direction and is flat without projections and depressions. Figure 1 The same communication performance is achieved in the communication distance direction represented by the Z' direction shown in . In addition, the same communication performance is also achieved in the offset directions (X' axis direction and Y' axis direction) regardless of changes in the external shape, for example.

[0131] In other words, Figure 4 In each of the variant examples shown in A to D, the communication performance in contactless communication can be maintained.

[0132] In addition, the configuration of each layer of the IC key chain article 10 is defined, such as Figure 3 This makes it possible to arbitrarily set the position of the IC key chain item 10 at which the IC key chain item 10 passes over the reader / writer 5 to perform contactless communication. In other words, the position where the communication reference position 17 is to be set can be arbitrarily determined.

[0133] Based on the communication reference position 17 set, the recessed portion 20 is formed, and the IC module 14 is accommodated in the recessed portion 20. This results in correct wireless communication based on the communication reference position 17. It can also be said that the position of the IC module 14 (circle 35) can be arbitrarily set.

[0134] [Method for producing IC key chain items]

[0135] Generally speaking, acrylic key chain items are formed by back printing a single transparent acrylic sheet. In addition, the acrylic key chain items include a transparent surface and a transparent edge. This makes it possible to provide a depth appearance or a three-dimensional appearance.

[0136] In the present embodiment, the IC key chain article 10 which contains the IC module 14 inside and is capable of performing contactless communication is formed by joining a plurality of plate members such as the top layer portion 11 and the recessed layer portion 13, as for example Figure 2 as shown in .

[0137] For example, when plate members each having a smooth surface are bonded to each other, UV bonding is used; a welding technique using, for example, ultrasonic waves, lasers, or heat; or a double-sided tape such as an optically clear adhesive (OCA) is used.

[0138] As described above, if bubbles are generated when joining the plate members of the plurality of plate members to each other, and if the generated bubbles are present in the portion to be transparent, this may result in a significant reduction in marketability. Sufficient reduction in bubble generation makes it possible to provide a transparency and a three-dimensional appearance comparable to those of an acrylic key chain article of a single transparent acrylic plate. This makes it possible to provide an IC key chain article 10 that can perform contactless communication and has a high degree of marketability.

[0139] In addition, when UV bonding is used to bond plate members, there are advantages as shown below.

[0140] Since the material used for UV bonding is liquid, it is easy to eliminate the transparent film 28 and the printed layer 29 (see Figure 3 ) thickness, and is less likely to generate bubbles. In addition, the material used for UV bonding is highly transparent.

[0141] In addition, in the case of UV bonding, there is no need for a member used when performing laser welding or thermal (ultrasonic) welding, and there is no need to hold a plate member when bonding. There is also no need for a mold such as a metal mold for transferring heat to the bonding surface.

[0142] Furthermore, in the case of UV bonding, bubbles are less likely to be generated when the plate members are bonded to each other.

[0143] In addition, in the case of UV bonding, large workpiece sizes can be processed. In other words, in the case of UV bonding, large plate members can also be processed.

[0144] For example, UV bonding provides the use of, for example, later reference Figure 6 and Figure 7 The described method for producing a plurality of IC key chain articles 10 has the advantage of connecting the first transparent member 60 and the second transparent member 61 .

[0145] Figure 5 is a schematic diagram for describing an example of a method of producing the IC key chain article 10 . Figure 5 An example of a configuration of the IC key chain article 10 having a circular outer shape when viewed from the thickness direction is illustrated.

[0146] The concave layer portion 13 including the first concave layer surface 19 a (second major surface 8 ) having the concave portion 20 and the second concave layer surface 19 b located opposite to the second major surface 8 is formed using a transparent resin material.

[0147] The roof portion 11 is formed using a transparent resin material.

[0148] like Figure 5 As shown in FIG. 1 , an adhesive layer 25 (UV adhesive) and a primer layer 27 are applied between the top layer part 11 and the printed part 12 .

[0149] An adhesive layer 25 and a primer layer 27 are applied between the printed portion 12 and the recessed layer portion 13 .

[0150] The top layer portion 11, the printing portion 12, and the concave layer portion 13 are connected to each other, and the ultraviolet light 50 is irradiated onto the first top layer surface 18a (first main surface 7) of the top layer portion 11, and onto the second main surface 8 of the concave layer portion 13. In other words, the top layer portion 11 is connected to the first concave layer surface 19a of the concave layer portion 13, so that the printing portion 12 is arranged between the top layer portion 11 and the concave layer portion 13.

[0151] An IC module 14 for performing contactless communication is accommodated in the recessed portion 20 .

[0152] The IC module 14 and the cover portion 15 printed with the printed layer 16 are connected to each other using an adhesive layer 26 (acrylic pressure-sensitive adhesive).

[0153] Thus, the IC key chain article 10 is formed.

[0154] Figure 6 and Figure 7 is a schematic diagram for describing another example of a method for producing an IC key chain article 10. In this method, a plurality of IC key chain articles 10 are cut out for production.

[0155] The first transparent member 60 including the plurality of concave portions 20 is formed using a transparent resin material. Figure 7In the example shown in , each portion of the first transparent member 60 is indicated by a dotted line along the outer shape of a corresponding one of the IC key chain articles 10. However, such lines defining the outer shape or the like do not necessarily have to be formed.

[0156] The second transparent member 61 is formed using a transparent resin material.

[0157] A UV adhesive and a primer layer 27 are applied between the first transparent member 60 and the printed portion 12 in which the character of each IC key chain item 10 is printed.

[0158] UV adhesive and primer layer 27 are applied between second transparent member 61 and printed portion 12 .

[0159] The first transparent member 60 , the printing portion 12 , and the second transparent member 61 are connected to each other, and the ultraviolet light 50 is irradiated from both sides.

[0160] An IC module 14 for performing contactless communication is accommodated in each of the plurality of concave portions 20 .

[0161] The cover portion 15 printed with the printed layer 16 is arranged to cover each of the plurality of recessed portions 20 each accommodating therein the IC module 14. The IC module 14 and the cover portion 15 are connected to each other using an adhesive layer 26 (acrylic pressure-sensitive adhesive).

[0162] A portion including each of the plurality of recessed portions 20 (each accommodating the IC module 14 therein) is cut out to have a specific shape. Thus, a plurality of IC key chain articles 10 are formed.

[0163] Note that, in this embodiment, the method for producing IC key chain items corresponds to the method for producing contactless communication media. In addition, the above method for producing IC key chain items 10 is only an example, and the method for producing IC key chain items 10 is not limited to the above method.

[0164] Note that, in the present embodiment, the outer shapes 36 , 38 , 39 , and 40 each correspond to a specified shape of a cutout portion including a corresponding one of the plurality of recessed portions 20 each accommodating an IC module therein.

[0165] As described above, in the IC key chain article 10 according to the present embodiment, the IC module 14 for performing contactless communication is accommodated in the concave portion 20 formed in the concave layer portion 13, and the concave portion 20 is covered by the cover portion 15. In addition, the top layer portion 11 is connected to the first concave layer surface 19a (second main surface 8) of the concave portion 20 where the concave layer portion 13 is formed, or to the second concave layer surface 19b located opposite to the first concave layer surface 19a where the concave portion 20 is formed, and the printed portion 12 is arranged between the concave layer portion 13 and the top layer portion 11. This makes it possible to easily provide a contactless communication medium produced with high design quality.

[0166] There are two conceivable problems with the development of products having shapes different from those of cards and tokens and including contactless IC tags inside. The first problem is that the initial cost of metal molds or plates, for example, for forming various shapes is high, and the production lead time is long.

[0167] For example, for a metal mold, there is a method of punching using a trimming die to obtain a uniform prescribed card size.

[0168] In addition, for the plate, there is a method including: preparing a sheet-like printing plate on which a plurality of uniform shapes such as cards and a plurality of uniform faces are applied; bonding an exterior material obtained by printing using the printing plate to the front face; and performing punching.

[0169] This embodiment makes it possible to cut a large plate of any shape obtained by arranging printed sheets and plates in a stacked form and joining the sheets and plates, on which a variety of shapes are applied, such as Figure 6 and Figure 7 Alternatively, it is also possible to join back-printed acrylic sheets or printed transparent sheets, where printing is performed using a digital printer without the need for a printing plate.

[0170] This enables production without initial costs, ie without metal moulds or printing plates.

[0171] The second problem is that the antenna and tuning circuit of the contactless IC tag need to be adjusted for each shape because the dielectric constant, thickness, mass, etc. are different depending on the material covering the tag. This makes it necessary to perform tests related to communication performance (communication tests) again for each shape.

[0172] For products of different shapes that have any shape and include a contactless IC tag inside, the external shape and material vary depending on the product, unlike cards and tokens. Therefore, the antenna and tuning circuit are adjusted for each product as needed. In addition, for each adjustment, it is necessary to measure the communication distance and the offset communication distance from the communication position, and check whether the specified communication performance is achieved.

[0173] As in the case of a card, if the product of different shapes has a fixed thickness and the position where the product of different shapes passes, for example, above a reader / writer is defined, a communication test can be easily performed. On the other hand, key chain items obtained by performing printing in a single transparent plate, such as acrylic key chain items, are generally formed using a plate having the same thickness.

[0174] The present embodiment adopts a multilayer structure, which makes it possible to maintain a fixed layer structure while maintaining the appearance of an acrylic key chain article, as well as a layer structure for embedding an IC module. In addition, the present embodiment provides a plate-shaped IC key chain article that has no bumps or depressions in the offset direction (a direction orthogonal to the direction of the communication distance) and maintains a fixed layer structure (fixed thickness) relative to the communication distance. This makes it possible to maintain a defined communication performance without changing the communication performance. In addition, an IC key chain article having the same layer structure and the same thickness, and the same material of the layer structure is formed. This makes it possible to maintain a constant communication performance even when the external shape changes, and makes it unnecessary to adjust the tuning circuit and test again for each shape.

[0175] As described above, the use of the present technology makes it possible to solve the above-mentioned two problems, thus easily providing a non-contact communication medium produced with high design quality.

[0176] In addition, in the present embodiment, the cover portion 15 and the printed layer 16 are integrated with each other, and the recesses 15a and 15b are formed in the cover portion 15, so that the orientation and position of the cover portion 15 can be fixed. This makes it unnecessary to fix the transparent sheet to the base using a pin, for example, so as not to deviate from the position and orientation of the printed layer 16 (the transparent sheet is a sheet in which a mark is used to indicate the communication reference position 17).

[0177] In other words, in this embodiment, an expensive base required for each type is not required. In addition, a trimming mold required for each type of shape of the IC key chain item is not required. In addition, an area for a hole for a pin for fixing the printed layer 16, i.e., a disposable area, is not required. This improves the application efficiency at the time of production, thereby being able to reduce costs.

[0178] This makes it possible to improve operating efficiency and give the IC key chain item a high-quality appearance.

[0179] <Second Embodiment>

[0180] An IC key chain article 70 according to a second embodiment of the present technology is described. In the following description, description of a configuration and operation similar to those of the IC key chain article 10 described in the above embodiment is omitted or simplified.

[0181] In the first embodiment, the concave portion 20 is formed in the first concave layer surface 19a of the concave portion 13. In the second embodiment, a through hole portion including a through hole and a covering portion connected to the through hole portion to cover one of the openings of the through hole are formed. In other words, the concave layer portion 13 capable of accommodating the IC module 14 therein is provided by the through hole portion and the covering portion connected to each other.

[0182] Figure 8 : is an exploded perspective view illustrating an example of the configuration of an IC key chain article 70 according to the second embodiment of the present technology. Fig. 9 is a cross-sectional view illustrating a cross section of each member included in the IC key chain article 70 .

[0183] like Figure 8 and Fig. 9 As shown in FIG. 1 , the IC key chain article 70 includes a top layer portion 11, a printed portion 12, a cover portion 71, a through hole portion 72, an IC module 14, a printed layer 16, an adhesive layer 25, and a primer layer 27. Note that Figure 8 The printed layer 16, the adhesive layer 25 and the primer layer 27 are omitted in the figure.

[0184] The cover portion 71 is a member made of a transparent resin material. For example, the cover portion 71 is made of PMMA. In the present embodiment, the cover portion 71 includes a first connection surface 73 connected to the through hole portion 72 and a second connection surface 74 located opposite to the first connection surface 73.

[0185] The through hole portion 72 includes a through hole 75 and is a member made of a transparent resin material. For example, as in the case of the covering portion 71, the through hole 75 is formed using PMMA. The through hole 75 is formed so as to be able to accommodate the IC module 14 therein. In the present embodiment, the top layer portion 11 is connected to cover one of the openings of the through hole 75. Therefore, the same configuration as the recessed portion 20 described in the first embodiment is provided by the through hole 75 covering one of the openings.

[0186] like Fig. 9 As shown in FIG. 1 , the first connection surface 73 and the second connection surface 74 of the cover portion 71 are flat without concavities and convexities in the X-axis direction and the Y-axis direction. In addition, except for the through hole 75, the surface of the through hole portion 72 is flat without concavities and convexities in the X-axis direction and the Y-axis direction.

[0187] In the present embodiment, when viewed from the thickness direction (Z-axis direction), the cover portion 71 is formed to have a circular outer shape. In addition, when viewed from the thickness direction, the through hole portion 72 is formed to have a circular outer shape. In other words, when viewed from the thickness direction, the cover portion 71 and the through hole portion 72 have the same outer shape.

[0188] Note that the length of the through hole 75 in the thickness direction is not limited. In addition, the shape of the through hole 75 is also not limited. For example, the through hole 75 can be arbitrarily formed to have a shape depending on the shape of the IC module 14.

[0189] A UV adhesive or an acrylic pressure-sensitive adhesive is used for the adhesive layer 25 connecting the cover portion 71 and the through-hole portion 72 .

[0190] Note that, in the present embodiment, the through-hole portion 72 corresponds to a first separating member including a through-hole. The covering portion 71 corresponds to a second separating member connected to the first separating member to cover one of the openings of the through-hole.

[0191] In addition, in the present embodiment, when the cover portion 71 and the through hole portion 72 are connected to each other, the first connection surface 73 of the cover portion 71 and the through hole 75 correspond to a recessed portion in which the IC module is accommodated.

[0192] Laser processing is suitable for forming the through hole portion 72 including the through hole 75. Laser processing allows the through hole 75 to be formed with high accuracy in a short time. On the other hand, cutting processing such as countersinking processing is suitable for forming the concave portion 20 described in the first embodiment.

[0193] Note that the method for forming the respective components such as the roof layer portion 11, the recessed layer portion 13, and the through hole portion 72 is not limited. Any forming method can be appropriately adopted depending on various conditions such as production cost and production time.

[0194] The through hole portion 72 including the through hole 75 is formed using a transparent resin material.

[0195] The cover portion 71 is formed using a transparent resin material.

[0196] The roof portion 11 is formed using a transparent resin material.

[0197] The printed layer 16 is printed in the cover portion 71 .

[0198] UV adhesive is applied between the cover portion 71 and the through hole portion 72, and the cover portion 71 and the through hole portion 72 are connected to each other to cover one of the openings of the through hole 75. This provides a configuration similar to that of the concave layer portion 13 described in the first embodiment.

[0199] like Fig. 9 As shown in FIG. 2 , the through hole 75 is configured as the concave portion 20, and the surface of the through hole portion 72 on the roof portion 11 side corresponds to the first concave layer surface 19a. In addition, the second connection surface 74 of the cover portion 71 corresponds to the second concave layer surface 19b.

[0200] The IC module 14 for performing contactless communication is accommodated in the through hole 75 (recessed portion).

[0201] An adhesive layer 25 (UV adhesive) and a primer layer 27 are applied between the top layer part 11 and the printed part 12 .

[0202] An adhesive layer 25 and a primer layer 27 are applied between the printed portion 12 and the through-hole portion 72 .

[0203] The roof portion 11, the printing portion 12 and the through hole portion 13 are connected to each other, and the ultraviolet light 50 is irradiated. In other words, the roof portion 11 is connected to the through hole portion 72 so that the printing portion 12 is arranged therebetween.

[0204] Thus, the IC key chain article 10 is formed.

[0205] Note that the order of steps in the method for producing an IC key chain item is not limited.

[0206] In addition, if Figure 6 and Figure 7 As shown in , a plurality of IC key chain articles 70 can be cut out. For example, the first transparent member 60 can be provided by a first separate member and a second separate member connected to each other, the first separate member including a through hole 75, and the second separate member connected to the first separate member to cover one of the openings of the through hole 75.

[0207] The first separation member including the plurality of through holes 75 is formed using a transparent resin material.

[0208] The second separation member is formed using a transparent resin material.

[0209] The first transparent member 60 including the plurality of concave portions 20 is formed by connecting a first separation member and a second separation member to each other so as to cover the openings of the plurality of through holes 75 located on the same side.

[0210] An IC module 14 for performing contactless communication is accommodated in each of the plurality of concave portions 20 .

[0211] The second transparent member 61 is connected to the first transparent member 60 such that the printed portion 12 is arranged between the first transparent member 60 and the second transparent member 61 .

[0212] A portion including each of the plurality of recessed portions 20 each accommodating the IC module 14 therein is cut out to have a corresponding one of the outer shapes 36 to 40 .

[0213] In addition, as in the case of the above-described production method, the method for cutting out the IC key chain article 70 is performed by laser processing or cutting processing.

[0214] Fig.10 is an exploded perspective view illustrating another example of the configuration of the IC key chain article 70 (referred to as the IC key chain article 80 ). Fig.11 80 is a cross-sectional view illustrating a cross section of each member included in the IC key chain article 80. Note that the cross-sectional view related to, for example, Figure 8 The construction and operation of the cover portion 71 and the through hole portion 72 of the IC key chain article 70 shown in FIG. 7 are similar to the description of the construction and operation.

[0215] like Fig.10 and Fig.11 As shown in FIG. 8 , the IC key chain article 80 includes a top layer portion 11, a printed portion 12, a cover portion 71, a through hole portion 72, an IC module 14, a cover portion 15, a printed layer 16, an adhesive layer 25, and a primer layer 27. Note that Fig.10 The printed layer 16, the adhesive layer 25 and the primer layer 27 are omitted in the figure.

[0216] like Fig.11 As shown in FIG. 1 , the through hole portion 72 is connected to the first connection surface 73 of the cover portion 71. In other words, the cover portion 71 is connected to cover one of the openings of the through hole 75. Therefore, the same configuration as the concave portion 20 described in the first embodiment is provided by the through hole 75 covering one of the openings.

[0217] Note that, in the present embodiment, the cover portion 71 corresponds to a second separate member connected to the first separate member to cover one of the openings of the through hole. In addition, in the present embodiment, when the cover portion 71 and the through hole portion 72 are connected to each other, the first connection surface 73 of the cover portion 71 and the through hole 75 correspond to the concave portion in which the IC module is accommodated.

[0218] In addition, an example of a method for producing the IC key chain article 80 is described.

[0219] The through hole portion 72 including the through hole 75 is formed using a transparent resin material.

[0220] The cover portion 71 is formed using a transparent resin material.

[0221] UV adhesive is applied between the cover portion 71 and the through hole portion 72, and the cover portion 71 and the through hole portion 72 are connected to each other to cover one of the openings of the through hole 75. This allows a configuration similar to that of the concave layer portion 13 described in the first embodiment to be provided. In other words, a concave layer portion 13 having a first concave layer surface 19a including the concave portion 20 and a second concave layer surface 19b located opposite to the first concave layer surface 19a is formed.

[0222] This makes it possible to form the IC key chain article 80 as in the case of the method for producing the IC key chain article 10 described above.

[0223] Note that the order of steps in the method for producing an IC key chain article is not limited. For example, the through hole portion 72 may be connected to the cover portion 71 after the top layer portion 11, the printed portion 12, and the cover portion 71 are connected to each other.

[0224] In addition, if Figure 6 and Figure 7 As shown in , a plurality of IC key chain articles 80 can be cut out. For example, the first transparent member 60 can be provided by a first separate member and a second separate member connected to each other, the first separate member including the through hole 75, and the second separate member connected to the first separate member to cover one of the openings of the through hole 75.

[0225] The first separation member including the plurality of through holes 75 is formed using a transparent resin material.

[0226] The second separation member is formed using a transparent resin material.

[0227] The first transparent member 60 including the plurality of concave portions 20 is formed by connecting a first separation member and a second separation member to each other so as to cover the respective openings of the plurality of through holes 75 located on the same side.

[0228] An IC module 14 for performing contactless communication is accommodated in each of the plurality of concave portions 20 .

[0229] The cover portion 15 printed with the printed layer 16 is arranged to cover each of the plurality of recessed portions 20 each accommodating the IC module 14 therein.

[0230] The second transparent member 61 is connected to the first transparent member 60 such that the printed portion 12 is arranged between the first transparent member 60 and the second transparent member 61 .

[0231] A portion including each of the plurality of recessed portions 20 each accommodating the IC module 14 therein is cut out to have a corresponding one of the outer shapes 36 to 40 .

[0232] In addition, as in the case of the above-described production method, the method for cutting out the IC key chain article 80 is performed by laser processing or cutting processing.

[0233] <Other Implementation Methods>

[0234] The present technology is not limited to the above-described embodiments, and various other embodiments can be implemented.

[0235] In the first embodiment described above, the top layer portion 11 is arranged so that the printed layer 29 is located between the top layer portion 11 and the second concave layer surface 19b included in the concave layer portion 13 and located opposite to the first concave layer surface 19a. Without being limited to this, the layer configuration of the IC key chain article 10 may be arranged arbitrarily.

[0236] In addition, in the above embodiment, the printed layer 16 is printed in the cover portion 15. Without being limited thereto, the printed layer 16 may be disposed on a side opposite to the printed layer 12 so that the IC module 14 is located between the printed layer 16 and the cover portion 15.

[0237] Fig.12 is an exploded perspective view illustrating an example of the configuration of the IC key chain article 90 . Fig.13 is a cross-sectional view illustrating a cross section of each member included in the IC key chain 90 . Fig.13 The cross-sectional view shown in FIG. 1 is a cross-sectional view of the IC key chain article 90 in an exploded state.

[0238] like Fig.12 and Fig.13 As shown in , the IC key chain article 90 includes a top layer portion 11, a printed portion 12, a cover portion 15, an IC module 14, a recessed layer portion 13, a printed layer 16, and an adhesive layer 81. The various components of the IC key chain article 90 are the same as those of the first embodiment described above, and thus description thereof is omitted.

[0239] In this embodiment, the material of the adhesive layer 91 is a transparent adhesive tape, such as OCA.

[0240] For example, the printed layer 16 is printed in a surface of the concave layer portion 13 that is located opposite to the recessed portion 20 .

[0241] The IC module 14 is accommodated in the recessed portion 20 of the recessed layer portion 13 .

[0242] The cover portion 15 to which the adhesive layer 81 is attached is connected to the IC module 14 .

[0243] The printed portion 12 and the concave layer portion 13 are connected to each other in a state where an adhesive layer 91 is disposed between the printed portion 12 and the concave layer portion 13 .

[0244] The top layer portion 11 to which the adhesive layer 81 is attached is connected to the surface of the concave layer portion 13 connected to the printed portion 12 .

[0245] Note that the method for producing the IC key chain 90 is not limited, and for example, the order of the respective components is also not limited.

[0246] Note that UV adhesive can be used as Fig.12 and Fig.13 In this case, when the top layer portion 11 is connected to the surface (first concave layer surface 19a) in which the concave portion is formed, the concave portion 20 in which the IC module 14 is accommodated corresponds to the gap between the top layer portion 11 and the concave layer portion 13.

[0247] When there is a gap such as a concave portion between the plate members joined to each other, as described above, the air in the gap may be pushed into the space between the plate members to generate air bubbles.

[0248] In this embodiment, the cover portion 15 is arranged to cover the recessed portion, such as Fig.12 and Fig.13 As shown in . This makes it possible to sufficiently prevent the air in the concave portion from escaping from the concave portion when the top layer portion 11 and the concave portion layer portion 13 are bonded to each other. This makes it possible to sufficiently prevent the generation of bubbles, thereby providing an IC key chain article 90 that can perform contactless communication and has high marketability.

[0249] It is noted that the generation of bubbles can also be prevented by adjusting the amount of UV applied and the duration of the UV action when performing UV bonding. In addition, the generation of bubbles can be prevented by various methods such as adjusting the speed of the roller. For example, in the case of using OCA, an OCA having a thickness of about three times the thickness of the printed layer (about 175 μm) is used, and bonding is performed at a constant high temperature by applying a roller rolling at a fixed speed from one side. Similarly, in the case of UV bonding, the amount of UV applied, the temperature, and the speed of the roller are controlled to perform bonding without generating bubbles. By using such a technology, the generation of bubbles can be prevented, and therefore an IC key chain item 90 produced with high design quality can be provided.

[0250] In the above-described embodiments, the IC key chain articles 10, 70, 80, and 90 each have the appearance of an acrylic key chain article. Without limitation thereto, the IC module may be provided in any housing such as a belt, a wristband, or a figure. In addition, the IC module of each of the IC key chain articles 10, 70, 80, and 90 may also be provided outside the housing.

[0251] In the above-described embodiment, the IC key chain items 10, 70, 80, and 90 each have the appearance of a transparent acrylic key chain item. Without being limited thereto, the IC key chain items 10, 70, 80, and 90 each may have any shape and any color in appearance. For example, when a picture of a dolphin is printed in the printed portion 12, the coating or material allows the top layer portion 11 or the concave layer portion 13 to have a transparent blue color obtained by imitating the color of the sea.

[0252] In the above-described embodiment, the printed layer 16 is a member indicating a position used as a reference when contactless communication is performed by the IC module 14, and is arranged to hide the IC module 14. Without being limited thereto, a member for hiding the IC module 14 may be formed. For example, a printed layer printed with a back surface such as the back of a character may be arranged between the through-hole portion 72 and the second connection surface 74 of the cover portion 71.

[0253] In the above-described embodiment, characters and the like are printed in the transparent film 28 or the white film 30. Without being limited thereto, characters and the like may be printed in the top layer portion 11 or the concave layer portion 13. For example, characters and the like may be printed in the first connection surface 73 of the through hole portion 72 connected to the cover portion 71.

[0254] In the above-described embodiment, the IC key chain items 10, 70, 80, and 90 each have a fixed thickness. Without being limited thereto, the IC key chain items 10, 70, 80, and 90 may be formed to have any thickness within a range in which the communication performance achieved when the IC key chain items 10, 70, 80, and 90 are formed is maintained. For example, the thickness of the IC key chain items 10, 70, 80, and 90 may be appropriately set to a tolerance of, for example, + / - 10%.

[0255] In the above-described embodiment, the top layer portion 11, the concave layer portion 13, and the cover portion 15 are formed using one type of material such as PMMA. Without being limited thereto, components made of transparent resin materials such as acrylic resin and polycarbonate, respectively, may be combined. For example, the top layer portion 11 may be made of acrylic resin, and the concave layer portion 13 may be made of polycarbonate.

[0256] In the above-mentioned embodiment, UV adhesive or acrylic pressure-sensitive adhesive is used for adhesive layer 25. Without being limited thereto, any method of connecting the components can be adopted. For example, welding methods such as ultrasonic welding, laser welding or thermal welding can be used to connect the components to each other.

[0257] In the above-described embodiment, the IC module 14 is internally included in each of the IC key chain items 10, 70, 80, and 90. Without being limited thereto, the IC module 14 may be connected to the outside of each of the IC key chain items 10, 70, 80, and 90, or an antenna or the like of the IC module 14 may be connected to the outside of the IC key chain item 10.

[0258] In the above-described embodiments, each of the IC key chain items 10, 70, 80, and 90 includes two PMMA plates as the top layer portion 11 and the recessed layer portion 13, or three PMMA plates as the top layer portion 11, the cover portion 71, and the through hole portion 72. Without being limited thereto, the number of plates included in each of the IC key chain items 10, 70, 80, and 90 is not limited. For example, the configuration may be appropriately changed to include functions other than the IC module 14.

[0259] The various configurations of the IC key chain article, the top layer portion, the recessed layer portion, the cover portion, the through hole portion, etc. described with reference to the various figures; the method for producing the IC key chain article, etc. are merely embodiments, and any modifications may be made thereto without departing from the spirit of the present technology. In other words, for example, any other configuration and any other production method for practicing the present technology may be adopted.

[0260] In the present disclosure, expressions such as "center", "middle", "uniform", "equal", "same", "orthogonal", "parallel", "symmetrical", "extended", "axial", "cylinder", "cylindrical", "circular" and "annular" that define, for example, shape, size, positional relationship and state conceptually include expressions such as "substantially center / substantially center", "substantially middle / substantially middle", "substantially uniform", "substantially equal", "substantially same", "substantially orthogonal", "substantially parallel", "substantially symmetrical", "substantially extended", "substantially axial", "substantially cylinder", "substantially cylindrical", "substantially circular" and "substantially annular", respectively.

[0261] For example, expressions such as "center", "middle", "uniform", "equal", "same", "orthogonal", "parallel", "symmetrical", "extended", "axial", "cylinder", "cylindrical", "circular", and "annular" also respectively include states within a specified range (such as a range of + / - 10%), where expressions such as "exactly center / exactly center", "exactly middle / exactly middle", "exactly uniform", "exactly equal", "exactly same", "completely orthogonal", "completely parallel", "completely symmetrical", "completely extended", "all axial", "perfect cylinder", "perfect cylindrical", "perfectly circular" and "perfectly annular" are used as references, respectively.

[0262] At least two of the features of the present technology described above may also be combined. In other words, the various features described in the various embodiments may be arbitrarily combined regardless of the embodiment. In addition, the various effects described above are not restrictive but merely illustrative, and other effects may be provided.

[0263] Note that the present technology can also adopt the following configurations.

[0264] (1) A contactless communication medium comprising:

[0265] an integrated circuit (IC) module for performing contactless communication;

[0266] a first member made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface forming a concave portion in which the IC module is accommodated, and the second surface being located opposite to the first surface;

[0267] a second member made of a second transparent resin material, the second member being connected to the first surface or the second surface; and

[0268] A printed layer is disposed between the first member and the second member.

[0269] (2) The contactless communication medium according to (1), further comprising

[0270] A cover member is arranged to cover the recessed portion in which the IC module is accommodated.

[0271] (3) The contactless communication medium according to (2), wherein

[0272] The cover member includes a plurality of recesses having different shapes.

[0273] (4) The contactless communication medium according to any one of (1) to (3), wherein

[0274] The first transparent resin material is acrylic resin or polycarbonate, and

[0275] The second transparent resin material is acrylic resin or polycarbonate.

[0276] (5) The contactless communication medium according to (2), wherein

[0277] The first transparent resin material and the second transparent resin material are the same material.

[0278] (6) The contactless communication medium according to any one of (1) to (5), wherein

[0279] The contactless communication medium has a plate shape with a uniform thickness, and

[0280] The first member and the second member are connected to each other in the thickness direction.

[0281] (7) The contactless communication medium according to any one of (1) to (6), wherein

[0282] The first member includes a first separation member and a second separation member, the first separation member being a member in which a through hole is formed, the second separation member being connected to the first separation member to cover one of openings of the through hole, and

[0283] The recessed portion is a through hole one of the openings of which is covered.

[0284] (8) The contactless communication medium according to (6), further comprising

[0285] a cover member arranged to cover the recessed portion in which the IC module is accommodated, and

[0286] The cover member is arranged to cover the entirety of the recessed portion when viewed from the thickness direction.

[0287] (9) The contactless communication medium according to any one of (2) to (8), wherein

[0288] The cover member is arranged so that a surface of the cover member located opposite to the IC module is located in the same plane as the first surface of the first member.

[0289] (10) The contactless communication medium according to any one of (6) to (8), wherein

[0290] When viewed from the thickness direction, the first member and the second member have the same shape.

[0291] (11) The contactless communication medium according to any one of (1) to (10), wherein

[0292] The printed layer is a layer on which at least one of characters, texts, pictures, photos or graphics are printed.

[0293] (12) The contactless communication medium according to any one of (6) to (11), wherein

[0294] When viewed in the thickness direction, the printed layer has a specific outer shape, and

[0295] When viewed from the thickness direction, the first member and the second member each have an outer shape based on an outer shape of the printed layer.

[0296] (13) The contactless communication medium according to any one of (2) to (12), wherein

[0297] The first member, the second member, the cover member, and the printed layer are each connected to another member using UV bonding, bonding with a double-sided tape, ultrasonic welding, laser welding, or thermal welding.

[0298] (14) The contactless communication medium according to (13), wherein

[0299] At least one of the first member, the second member, the cover member, or the printed layer is connected to another member using UV bonding.

[0300] (15) The contactless communication medium according to any one of (1) to (14), wherein

[0301] The concave portion is formed based on a specific reference position, and

[0302] The contactless communication medium further includes a position display member indicating a reference position.

[0303] (16) A method for producing a contactless communication medium, the method comprising:

[0304] Using a first transparent resin material to form a first member, the first member includes a first surface and a second surface, the first surface includes a concave portion, and the second surface is located opposite to the first surface;

[0305] forming a second member using a second transparent resin material;

[0306] accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; and

[0307] The second member is connected to the first surface or the second surface of the first member such that the printed layer is disposed between the first member and the second member.

[0308] (17) A method for producing a contactless communication medium, the method comprising:

[0309] forming a first separation member using a first transparent resin material, the first separation member including a through hole;

[0310] forming a second separation member using a first transparent resin material;

[0311] A first member is formed by connecting a first separate member and a second separate member to cover one of the openings of the through hole, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being located opposite to the first surface;

[0312] forming a second member using a second transparent resin material;

[0313] accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; and

[0314] The second member is connected to the first surface or the second surface of the first member such that the printed layer is disposed between the first member and the second member.

[0315] (18) A method for producing a contactless communication medium, the method comprising:

[0316] Using a first transparent resin material to form a first transparent member, the first transparent member includes a first surface and a second surface, the first surface includes a plurality of concave portions, and the second surface is located opposite to the first surface;

[0317] forming a second transparent member using a second transparent resin material;

[0318] accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of recessed portions;

[0319] connecting a second transparent member to the first surface or the second surface of the first transparent member so that the printed layer is disposed between the first transparent member and the second transparent member; and

[0320] A portion including each of the plurality of concave portions each accommodating an IC module therein is cut out so that the portion has a specific shape.

[0321] (19) A method for producing a contactless communication medium, the method comprising:

[0322] forming a first separation member using a first transparent resin material, the first separation member including a plurality of through holes;

[0323] forming a second separation member using a first transparent resin material;

[0324] A first transparent member is formed by connecting a first separation member and a second separation member to cover respective openings of the plurality of through holes located on the same side, the first transparent member including a first surface and a second surface, the first surface including a plurality of concave portions, the second surface being located opposite to the first surface;

[0325] forming a second transparent member using a second transparent resin material;

[0326] accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of recessed portions;

[0327] connecting a second transparent member to the first surface or the second surface of the first transparent member so that the printed layer is disposed between the first transparent member and the second transparent member; and

[0328] A portion including each of the plurality of concave portions each accommodating an IC module therein is cut out so that the portion has a specific shape.

[0329] (20) The method for producing a contactless communication medium according to (18) or (19), wherein

[0330] Cutting out the portion including each of the plurality of concave portions is performed by laser processing or cutting processing so that the portion has a specific shape.

[0331] (21) The contactless communication medium according to any one of (1) to (15), wherein

[0332] The first member, the second member, the cover member or the printed layer are each connected to another member using UV bonding.

[0333] Reference Mark List

[0334] 7 First main surface

[0335] 8 Second main surface

[0336] 10 IC keychain items

[0337] 11 Top Section

[0338] 12 Printing Section

[0339] 13 Concave part

[0340] 14 IC Module

[0341] 15 Cover part

[0342] 16 Printing layer

[0343] 20 Concave part

[0344] 25 Adhesive layer

[0345] 29 Printing layer

[0346] 70 IC keychain items

[0347] 71 Covering part

[0348] 72 Through hole section

[0349] 75 Through Hole

[0350] 80 IC keychain items

[0351] 90 IC keychain items

[0352] 100 Communication Systems

Claims

1. A contactless communication medium, comprising: An integrated circuit IC module for performing contactless communication; a first member made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface forming a concave portion in which the IC module is accommodated, and the second surface being located opposite to the first surface; a second member made of a second transparent resin material, the second member being connected to the first surface or the second surface; a first printed layer disposed between the first member and the second member; as well as a cover member arranged to cover the recessed portion in which the IC module is accommodated, the cover member having a second printed layer printed thereon, wherein the IC module is located between the first printed layer and the second printed layer, the IC module is located between the first member and the cover member, but the IC module is not located between the first member and the second member, and Here, a mark for indicating a communication reference position is printed in the second printed layer, and the communication reference position is a reference position at which contactless communication can be performed between the contactless communication medium and the reader or writer.

2. The contactless communication medium according to claim 1, wherein The cover member includes a plurality of recesses having different shapes.

3. The contactless communication medium according to claim 1, wherein The first transparent resin material is acrylic resin or polycarbonate, and The second transparent resin material is acrylic resin or polycarbonate.

4. The contactless communication medium according to claim 1, wherein The first transparent resin material and the second transparent resin material are the same material.

5. The contactless communication medium according to claim 1, wherein The contactless communication medium has a plate shape with a uniform thickness, and The first member and the second member are connected to each other in the thickness direction.

6. The contactless communication medium according to claim 1, wherein The first member includes a first separation member and a second separation member, the first separation member being a member in which a through hole is formed, the second separation member being connected to the first separation member to cover one of openings of the through hole, and The recessed portion is a through hole one of the openings of which is covered.

7. The contactless communication medium according to claim 5, The cover member is arranged to cover the entirety of the recessed portion when viewed from the thickness direction.

8. The contactless communication medium according to claim 1, wherein The cover member is arranged so that a surface of the cover member located opposite to the IC module is located in the same plane as the first surface of the first member.

9. The contactless communication medium according to claim 5, wherein When viewed from the thickness direction, the first member and the second member have the same shape.

10. The contactless communication medium according to claim 1, wherein The first printed layer is a layer in which at least one of characters, texts, pictures, photos or graphics is printed.

11. The contactless communication medium according to claim 5, wherein When viewed from the thickness direction, the first printed layer has a specific outer shape, and When viewed from the thickness direction, the first member and the second member each have an outer shape based on an outer shape of the first printed layer.

12. The contactless communication medium according to claim 1, wherein The first member, the second member, the cover member, and the first printed layer are each connected to another member using UV bonding, bonding with a double-sided tape, ultrasonic welding, laser welding, or thermal welding.

13. The contactless communication medium according to claim 12, wherein At least one of the first member, the second member, the cover member, and the first printed layer is connected to another member using UV bonding.

14. The contactless communication medium according to claim 1, wherein The concave portion is formed based on a specific reference position, and The contactless communication medium further includes a position display member indicating the reference position.

15. A method for producing a contactless communication medium, the method comprising: Using a first transparent resin material to form a first member, the first member includes a first surface and a second surface, the first surface includes a concave portion, and the second surface is located opposite to the first surface; forming a second member using a second transparent resin material; accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; connecting the second member to the first surface or the second surface of the first member such that the first printed layer is disposed between the first member and the second member; and disposing a cover member covering the recessed portion in which the IC module is accommodated, the cover member having a second printed layer printed thereon, wherein the IC module is located between the first printed layer and the second printed layer, the IC module is located between the first member and the cover member, but the IC module is not located between the first member and the second member, and Here, a mark for indicating a communication reference position is printed in the second printed layer, and the communication reference position is a reference position at which contactless communication can be performed between the contactless communication medium and the reader or writer.

16. A method for producing a contactless communication medium, the method comprising: forming a first separation member using a first transparent resin material, the first separation member including a through hole; forming a second separation member using a first transparent resin material; forming a first member by connecting a first separate member and a second separate member to cover one of the openings of the through hole, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being located opposite to the first surface; forming a second member using a second transparent resin material; accommodating an integrated circuit (IC) module for performing contactless communication in the concave portion; connecting the second member to the first surface or the second surface of the first member such that the first printed layer is disposed between the first member and the second member; and disposing a cover member covering the recessed portion in which the IC module is accommodated, the cover member having a second printed layer printed thereon, wherein the IC module is located between the first printed layer and the second printed layer, the IC module is located between the first member and the cover member, but the IC module is not located between the first member and the second member, and Here, a mark for indicating a communication reference position is printed in the second printed layer, and the communication reference position is a reference position at which contactless communication can be performed between the contactless communication medium and the reader or writer.

17. A method for producing a contactless communication medium, the method comprising: Using a first transparent resin material to form a first transparent member, the first transparent member includes a first surface and a second surface, the first surface includes a plurality of concave portions, and the second surface is located opposite to the first surface; forming a second transparent member using a second transparent resin material; accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of concave portions; connecting a second transparent member to the first surface or the second surface of the first transparent member so that the first printed layer is disposed between the first transparent member and the second transparent member; cutting out a portion including each of the plurality of recessed portions each accommodating an IC module therein so that the portion has a specific shape; and disposing a cover member covering the recessed portion in which the IC module is accommodated, the cover member having a second printed layer printed thereon, wherein the IC module is located between the first printed layer and the second printed layer, the IC module is located between the first transparent member and the cover member, but the IC module is not located between the first transparent member and the second transparent member, and Here, a mark for indicating a communication reference position is printed in the second printed layer, and the communication reference position is a reference position at which contactless communication can be performed between the contactless communication medium and the reader or writer.

18. A method for producing a contactless communication medium, the method comprising: forming a first separation member using a first transparent resin material, the first separation member including a plurality of through holes; forming a second separation member using a first transparent resin material; A first transparent member is formed by connecting a first separation member and a second separation member to cover respective openings of the plurality of through holes located on the same side, the first transparent member including a first surface including a plurality of concave portions and a second surface located opposite to the first surface; forming a second transparent member using a second transparent resin material; accommodating an integrated circuit (IC) module for performing contactless communication in each of the plurality of concave portions; connecting a second transparent member to the first surface or the second surface of the first transparent member so that the first printed layer is disposed between the first transparent member and the second transparent member; cutting out a portion including each of the plurality of recessed portions each accommodating an IC module therein so that the portion has a specific shape; and disposing a cover member covering the recessed portion in which the IC module is accommodated, the cover member having a second printed layer printed thereon, wherein the IC module is located between the first printed layer and the second printed layer, the IC module is located between the first transparent member and the cover member, but the IC module is not located between the first transparent member and the second transparent member, and Here, a mark for indicating a communication reference position is printed in the second printed layer, and the communication reference position is a reference position at which contactless communication can be performed between the contactless communication medium and the reader or writer.

19. The method for producing a contactless communication medium according to claim 17 or 18, wherein Cutting out the portion including each of the plurality of concave portions so that the portion has a specific shape is performed by laser processing or cutting processing.

Images