Resonator Assembly and Flexible Filter

Abstract

The present invention discloses a resonator assembly and a flexible filter. The resonator assembly includes a flexible substrate and at least one group of resonator units located on at least one side of the flexible substrate. Each group of resonator units includes at least two first resonator sub-units and at least one second resonator sub-unit located on the side of the first resonator sub-unit away from the flexible substrate. The first resonator sub-unit includes at least two first resonators that support each other and are electrically connected to each other, and the setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate. The setting direction of the second resonator included in the second resonator sub-unit is parallel to the setting direction of the flexible substrate. At least two mutually supporting first resonators of the first resonator sub-unit form a first cavity structure with the flexible substrate, and at a position corresponding to at least one first cavity structure, the surface of the flexible substrate has a stress buffer structure. In the embodiments of the present invention, the area of the filter can be saved, and the stress resistance performance of the resonator assembly can be improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of electronic technologies, and in particular, to a resonator assembly and a flexible filter. Background Art

[0002] With the development of science and technology, filters are more and more widely used. In recent years, the replacement of traditional hard substrate integrated devices by flexible electronic devices has become an important development trend of future electronic technology. Most current filters are prepared using hard substrates, and the yield of filters prepared using flexible substrates is relatively low.

[0003] A filter is composed of at least one layer of resonator assemblies. A resonator assembly includes a substrate and resonators disposed on the substrate. In current filters, the resonators are usually tiled on the substrate by a planar layout method, that is, the resonators are in the horizontal direction, resulting in a large area of the filter. Moreover, in the current filters, in the thickness direction of the filter, only one layer of resonators is provided in one layer of resonator assemblies, further resulting in a large area of the filter. Summary of the Invention

[0004] The present invention provides a resonator assembly and a flexible filter to save the area of the filter and improve the yield of the flexible filter.

[0005] In a first aspect, an embodiment of the present invention provides a resonator assembly, including a flexible substrate and at least one group of resonator units located on at least one side of the flexible substrate. Each group of resonator units includes at least two first resonator sub-units and at least one second resonator sub-unit located on a side of the first resonator sub-units away from the flexible substrate;

[0006] The first resonator sub-unit includes at least two first resonators that support and electrically connect to each other, and the setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate where the first resonator is located; the second resonator sub-unit includes at least one second resonator, and the setting direction of the second resonator is parallel to the setting direction of the flexible substrate;

[0007] A first cavity structure is formed between at least two mutually supporting first resonators of the first resonator sub-unit and the flexible substrate, and at a position corresponding to at least one of the first cavity structures, the surface of the flexible substrate has a stress buffer structure.

[0008] Optionally, the vertical projection of the second resonator sub-unit on the flexible substrate is at least partially located between the projections of two adjacent first resonator sub-units on the flexible substrate; the second resonator sub-units included in each group of resonator units are respectively electrically connected to at least two first resonator sub-units included in the same group of resonator units.

[0009] Optionally, the first resonator includes a first lower electrode, a first piezoelectric layer, and a first upper electrode which are stacked. Two adjacent first resonators in the first resonator unit are electrically connected through their own first lower electrodes, and two adjacent first resonator units are electrically connected through the first upper electrodes of two adjacent first resonators respectively;

[0010] The second resonator includes a second lower electrode, a second piezoelectric layer, and a second upper electrode. The second resonators included in each group of resonator units are electrically connected through their own second lower electrodes to the first upper electrode of the first resonator located at the first edge in the same group of resonator units, and the second resonators included in each group of resonator units are electrically connected through their own second upper electrodes to the first upper electrode of the first resonator located at the second edge in the same group of resonator units. The first edge and the second edge are the start end and the terminal end on the series path of each first resonator unit respectively.

[0011] Optionally, each group of resonator units further includes an insulating layer, and the insulating layer is located between the first resonator unit and the second resonator unit.

[0012] Optionally, the setting direction of the insulating layer is parallel to the setting direction of the second resonator.

[0013] Optionally, the resonator unit includes two first resonator units and one second resonator. The second resonator and the two first resonator units form a second cavity structure, and the effective resonance region of the second resonator is within the range of the second cavity structure;

[0014] Wherein, the effective resonance region of the second resonator includes the region where the second lower electrode, the second piezoelectric layer, and the second upper electrode of the second resonator overlap each other.

[0015] Optionally, the stress buffer structure on the surface of the flexible substrate includes at least one groove on the surface of the flexible substrate.

[0016] Optionally, at least two groups of resonator units are arranged on one side surface of the flexible substrate.

[0017] Optionally, at least one group of resonator units is arranged on the first surface of the flexible substrate, and at least one group of resonator units is arranged on the second surface of the flexible substrate. The first surface and the second surface are two opposite surfaces of the flexible substrate, and the resonator units arranged on the first surface and the resonator units arranged on the second surface are arranged in a staggered manner.

[0018] In a second aspect, an embodiment of the present invention further provides a flexible filter, and the flexible filter includes the resonator assembly of the first aspect.

[0019] Optionally, the flexible filter includes at least two of the resonator components, the resonator components are stacked, and the resonant units in at least two adjacent resonator components are electrically connected.

[0020] Optionally, in at least two layers of the resonator components, the resonant units included in each resonator component are located on the same side of the flexible substrate in the resonator component where the resonant units are located.

[0021] Optionally, in at least two adjacent resonator components, the resonant units included in each resonator component are located on different sides of the flexible substrate in the resonator component where the resonant units are located.

[0022] Optionally, in adjacent layers of the resonator components, one layer of the resonator components includes at least two groups of resonant units, the adjacent groups of resonant units are electrically connected, the other layer of the resonator components includes at least one group of resonant units, the resonant units of the adjacent layers of the resonator components are arranged in an interleaved manner, and the distance between two adjacent flexible substrates is less than the sum of the thicknesses of the resonant units in two adjacent layers of the resonator components.

[0023] Optionally, the flexible substrates of adjacent layers of the resonator components are bonded and connected through a bonding structure.

[0024] Optionally, in adjacent layers of the resonator components, a group of resonant units in one layer of the resonator components and two adjacent groups of resonant units in the other layer of the resonator components form a set resonance structure. In the set resonance structure, the vertical projection of a group of resonant units in one layer of the resonator components on the other layer of the resonator components is at least partially located between two adjacent groups of resonant units in the other layer of the resonator components.

[0025] Optionally, the flexible filter includes at least three layers of the resonator components, and the vertical projections of the set resonance structures on both sides of the same flexible substrate on the flexible substrate do not overlap.

[0026] Optionally, the resonant units of the resonator components are electrically connected to the bonding structure through connection lines, and the shapes of the connection lines are straight lines, curves or polygons.

[0027] Optionally, the resonant units in two adjacent layers of the resonator components are arranged in opposite directions, the flexible substrates in two adjacent layers of the resonator components are connected through a conductive thin film, and the resonant units are electrically connected to the conductive thin film through connection lines in the flexible substrate.

[0028] Embodiments of the present invention provide a resonator assembly and a flexible filter. The resonator assembly includes a flexible substrate and at least one set of resonator units located on at least one side of the flexible substrate. Each set of resonator units includes at least two first resonator sub-units and at least one second resonator sub-unit located on the side of the first resonator sub-unit away from the flexible substrate. The first resonator sub-unit includes at least two first resonators that support and electrically connect to each other, and the setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate where the first resonator is located. The second resonator sub-unit includes at least one second resonator, and the setting direction of the second resonator is parallel to the setting direction of the flexible substrate. A first cavity structure is formed between the two mutually supporting first resonators of the first resonator sub-unit and the flexible substrate. At a position corresponding to at least one first cavity structure, the surface of the flexible substrate has a stress buffer structure. The setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate where the first resonator is located, which can reduce the area of the resonator assembly in the direction of the surface of the flexible substrate, facilitating the miniaturization of the device. And in the thickness direction of the resonator assembly, the second resonator and the first resonator are stacked, which can further reduce the area of the resonator assembly. At the same time, the flexible substrate can improve the flexibility of the resonator assembly. The surface of the flexible substrate has a stress buffer structure, and the stress buffer structure can release stress, better cooperate with the possible deformation of the flexible substrate, and improve the stress resistance of the resonator assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic structural diagram of a resonator assembly provided by an embodiment of the present invention;

[0030] Figure 2 is a circuit diagram of a resonator assembly provided by an embodiment of the present invention;

[0031] Figure 3 is a top view of a resonator assembly provided by an embodiment of the present invention;

[0032] Figure 4 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention;

[0033] Figure 5 is a circuit diagram of another resonator assembly provided by an embodiment of the present invention;

[0034] Figure 6 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention;

[0035] Figure 7 is a schematic structural diagram of a flexible filter provided by an embodiment of the present invention;

[0036] Figure 8 is a schematic structural diagram of another flexible filter provided by an embodiment of the present invention;

[0037] Figure 9 It is the circuit diagram of a flexible filter provided by an embodiment of the present invention;

[0038] Figure 10 It is the schematic structural diagram of another flexible filter provided by an embodiment of the present invention;

[0039] Figure 11 It is the schematic structural diagram of another flexible filter provided by an embodiment of the present invention. Detailed implementation manners

[0040] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only the parts related to the present invention rather than all the structures are shown in the accompanying drawings.

[0041] Figure 1 It is the schematic structural diagram of a resonator assembly provided by an embodiment of the present invention. Refer to Figure 1 , the resonator assembly includes a flexible substrate 100 and at least one group of resonator units 200 located on at least one side of the flexible substrate 100. Each group of resonator units 200 includes at least two first resonator sub-units 210 and at least one second resonator sub-unit 220 located on the side of the first resonator sub-units 210 away from the flexible substrate 100;

[0042] The first resonator sub-units 210 include at least two first resonators 211 that support and are electrically connected to each other. The setting direction of the first resonators 211 forms an angle greater than 0 degrees with the surface of the flexible substrate 100 where the first resonators 211 are located; the second resonator sub-units 220 include at least one second resonator 221, and the setting direction of the second resonators 221 is parallel to the setting direction of the flexible substrate 100;

[0043] At least two mutually supported first resonators 211 of the first resonator sub-units 210 and the flexible substrate 100 form a first cavity structure 01. At the position corresponding to at least one first cavity structure 01, the surface of the flexible substrate 100 has a stress buffer structure 110.

[0044] The setting direction of the first resonator 211 is the extending direction of the plane where the multiple stacked structures included in the first resonator 211 are located. Optionally, the first resonator 211 includes a first lower electrode 2111, a first piezoelectric layer 2112, and a first upper electrode 2113 that are stacked. Two adjacent first resonators 211 in the first resonator unit 210 are electrically connected through their own first lower electrodes 2111, and two adjacent first resonator units 210 are electrically connected through the first upper electrodes 2113 of the two adjacent first resonators 211 respectively. That is, the two first resonators 211 in each first resonator unit 210 are connected in series, and the first resonator units 210 included in each resonator unit 200 are connected in series. The setting direction of the first resonator 211 is the extending direction of the plane where the first lower electrode 2111 is located, or the extending direction of the plane where the first piezoelectric layer 2112 is located, or the extending direction of the plane where the first upper electrode 2113 is located. The closer the included angle between the setting direction of the first resonator 211 and the surface of the flexible substrate 100 where the first resonator 211 is located is to 90 degrees, the smaller the layout area of the resonator assembly, which is more beneficial to the miniaturization of the device. Compared with the first resonator 211 being directly laid flat on the flexible substrate 100, that is, the plane where the first resonator 211 is located is parallel to the plane where the flexible substrate 100 is located, in this embodiment, the included angle between the setting direction of the first resonator 211 and the surface of the flexible substrate 100 where the first resonator 211 is located is greater than 0 degrees, which can reduce the layout area of the resonator assembly. The effective area of the first resonator 211 is related to the shape of the first resonator 211. For example, when the projection of the first resonator 211 in its setting direction is a rectangle, the effective area of the first resonator 211 is determined by the length and width of the rectangle. The first resonator can also be other shapes, which are not specifically limited in this embodiment.

[0045] When forming the first resonator unit 210, a sacrificial layer can be deposited on the flexible substrate 100 first, and then the sacrificial layer is etched to form a triangular shape as shown in the first cavity structure 01. On the etched sacrificial layer, a first lower electrode layer is continuously deposited, and the first lower electrode layer is patterned to form Figure 1 the pattern connected to the first lower electrode 2111 shown in. A first piezoelectric material layer is deposited on the first lower electrode 2111 and patterned to form the first piezoelectric layer 2112. A first upper electrode layer is deposited on the first piezoelectric layer 2112 and patterned to form the first upper electrode 2113. Finally, the sacrificial layer is released, that is, the first resonator unit 210 is formed.

[0046] The setting direction of the flexible substrate 100 is a direction perpendicular to the thickness direction Y of the resonator assembly (the first direction X in the figure). The setting direction of the second resonator 221 is parallel to the setting direction of the flexible substrate 100, and the setting direction of the second resonator 221 is the extending direction of the plane where the structural layer included in the second resonator 221 is located. Optionally, the second resonator 221 includes a second lower electrode 2211, a second piezoelectric layer 2212, and a second upper electrode 2213, and the setting direction of the second resonator 221 is the extending direction of the plane where the second lower electrode 2211 is located or the extending direction of the plane where the second piezoelectric layer 2212 is located or the extending direction of the plane where the second upper electrode 2213 is located. The second resonator 221 is disposed above the first resonator 211 in the thickness direction Y of the resonator assembly, that is, two layers of resonators can be disposed on one side of the flexible substrate 100. In other embodiments, multiple layers of resonators can also be disposed on one side of the flexible substrate 100. Compared with the prior art in which a resonator assembly only includes one layer of resonator, the resonator assembly of this embodiment can further save the layout area of the resonator assembly.

[0047] In the prior art, the resonator is directly laid flat on the flexible substrate 100, and a cavity structure needs to be provided between the flexible substrate 100 and the resonator. The cavity structure is an essential structure for the resonator to resonate. In this embodiment, after the first resonator 211 is set, a first cavity structure 01 will be naturally formed between the two mutually supporting first resonators 211 and the flexible substrate 100 without additional setting, and the process is simpler. At the position corresponding to at least one first cavity structure 01, the surface of the flexible substrate 100 has a stress buffer structure 110. Optionally, the stress buffer structure 110 on the surface of the flexible substrate 100 includes at least one groove on the surface of the flexible substrate 100. The stress buffer structure 110 can further release the stress received by the resonator assembly, reduce the probability of the resonator assembly being damaged due to stress, and improve the yield of the resonator assembly.

[0048] In this embodiment, the setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate where the first resonator is located, which can reduce the area of the resonator assembly in the direction of the surface of the flexible substrate, facilitating the miniaturization of the device. And in the thickness direction of the resonator assembly, the second resonator and the first resonator are stacked, which can further reduce the area of the resonator assembly. At the same time, the flexible substrate can improve the flexibility of the resonator assembly. The surface of the flexible substrate has a stress buffer structure, and the stress buffer structure can release stress, better cooperate with the possible deformation of the flexible substrate, and improve the stress resistance of the resonator assembly.

[0049] Continue to refer to Figure 1, Optionally, the vertical projection of the second resonator unit 220 on the flexible substrate 100 is at least partially located between the projections of two adjacent first resonator units 210 on the flexible substrate; the second resonator units 220 included in each group of resonator units 200 are respectively electrically connected to at least two first resonator units 210 included in the same group of resonator units 200.

[0050] Specifically, the vertical projection of the second resonator unit 220 on the flexible substrate 100 is at least partially located between the projections of two adjacent first resonator units 210 on the flexible substrate 100, that is, the second resonator unit 220 is above at least two first resonator units 210 (that is, on the side of the first resonator unit 210 away from the flexible substrate 100). Therefore, the first resonator unit 210 can play a supporting role for the second resonator unit 220 to ensure the structural stability of the resonator assembly. Figure 1 Exemplarily shows a case where the resonator assembly includes two first resonator units 210 and one second resonator unit 220, and the second resonator unit 220 is electrically connected to the two first resonator units 210 respectively.

[0051] Continue to refer to Figure 1 , Optionally, the resonator unit 200 includes at least two first resonator units 210 and a second resonator 221. Each first resonator unit 210 is connected in series, and the second resonator 221 is connected in parallel with the first resonator units 210 connected in series.

[0052] Continue to refer to Figure 1 , Optionally, the second resonator 221 includes a second lower electrode 2211, a second piezoelectric layer 2212, and a second upper electrode 2213. The second resonator 221 included in each group of resonator units 200 is electrically connected to the first upper electrode 2113 of the first resonator 211 located at the first edge in the same group of resonator units 200 through its own second lower electrode 2211. The second resonator 221 included in each group of resonator units 200 is electrically connected to the first upper electrode 2113 of the first resonator 211 located at the second edge in the same group of resonator units 200 through its own second upper electrode 2213. The first edge and the second edge are the start end and the terminal end on the series path of each first resonator unit 210 respectively. In this embodiment, it is exemplarily shown that the resonator assembly includes one resonator unit 200, the resonator unit 200 includes two first resonator units 210 and one second resonator unit 220, the first resonator unit 210 includes two first resonators 211 connected in series, and the second resonator unit 220 includes one second resonator 221. Figure 1 In, four first resonators 211 are connected in series. The four first resonators connected in series include the first resonator one 2101 located at the leftmost side and the first resonator two 2102 located at the rightmost side. Figure 1Exemplarily shown therein, the leftmost side is used as the first edge (i.e., the starting end on the series path of each first resonator unit 210), and the rightmost side is used as the second edge (i.e., the terminal end on the series path of each first resonator unit 210). The starting end on the series path is the end where the signal is input, and the terminal end on the series path is the end where the signal is output. Figure 1 In this case, with the leftmost side as the first edge and the rightmost side as the second edge, the signal is input from the first resonator 2101 and output from the second resonator 2102. In other alternative embodiments, it can also be that the rightmost side is used as the first edge (i.e., the starting end on the series path of each first resonator unit 210), and the leftmost side is used as the second edge (i.e., the terminal end on the series path of each first resonator unit 210). Correspondingly, the signal is input from the second resonator 2102 and output from the first resonator 2101. Compared with the prior art where the second resonator 221 is all laid flat on the flexible substrate 100, in this embodiment, the second resonator 221 is stacked on the first resonator 211 in the thickness direction Y of the resonator assembly, which can further reduce the area of the resonator assembly and is more conducive to the miniaturization of the device. The materials of the first upper electrode 2113, the first lower electrode 2111, the second upper electrode 2213, and the second lower electrode 2211 can be the same, and the materials of the first piezoelectric layer 2112 and the second piezoelectric layer 2212 can be the same.

[0053] Figure 2 This is a circuit diagram of a resonator assembly provided by an embodiment of the present invention. Figure 2 The shown circuit diagram of the resonator assembly can correspond to Figure 1 the shown resonator assembly. Refer to Figure 1 and Figure 2 , four first resonators 211 are connected in series, and the second resonator 221 is connected in parallel with the four series-connected first resonators 211.

[0054] Continue to refer to Figure 1, Optionally, each group of resonator units 200 further includes an insulating layer 230, and the insulating layer 230 is located between the first resonator unit 210 and the second resonator unit 220. Specifically, after forming the first resonator unit 210, a sacrificial layer and an insulating material layer are sequentially deposited, and the insulating material layer is patterned to form the insulating layer 230. A second lower electrode material layer is deposited on the insulating layer, and the second lower electrode material layer is patterned to form the second lower electrode 2211. A second piezoelectric material layer is deposited on the second lower electrode 2211 to form the second piezoelectric layer 2212. A second upper electrode material layer is deposited on the second piezoelectric layer 2212 to form the second upper electrode 2213. Finally, the sacrificial layer is released to obtain the illustrated second resonator 221. The insulating layer 230 located between the first resonator unit 210 and the second resonator unit 220 can prevent the second lower electrode 2211 of the second resonator 221 from contacting the first upper electrode 2113 of the first resonator 211 at the start end of the series path of each first resonator unit 210, and can also prevent the second upper electrode 2213 of the second resonator 221 from contacting the first upper electrode 2113 of the first resonator 211 at the end of the series path of each first resonator unit 210, ensuring that the first resonator 211 and the second resonator 221 are properly connected to the circuit of the resonator assembly to ensure the normal operation of the resonator assembly.

[0055] Optionally, the setting direction of the insulating layer 230 is parallel to the setting direction of the second resonator 221.

[0056] The setting direction of the insulating layer 230 being parallel to the setting direction of the second resonator 221 enables the insulating layer 230 to support the second resonator 221 and ensure the stability of the resonator assembly.

[0057] Continue to refer to Figure 1 , the resonator unit 200 includes two first resonator units 210 and one second resonator 221. The second resonator 221 and the two first resonator units 210 form a second cavity structure 02, and the effective resonance region 2210 of the second resonator 221 is within the range of the second cavity structure 02;

[0058] Among them, the effective resonance region 2210 of the second resonator 221 includes the region where the second lower electrode 2211, the second piezoelectric layer 2212, and the second upper electrode 2213 of the second resonator 221 overlap each other.

[0059] When the second resonator 211 operates, resonance occurs within the effective resonance region 2210, thereby ensuring the normal operation of the resonator assembly. Among them, the effective resonance region 2210 of the second resonator 221 within the range of the second cavity structure 02 means that in the thickness direction Y of the resonator assembly, the region where the second lower electrode 2211, the second piezoelectric layer 2212, and the second upper electrode 2213 of the second resonator 221 overlap corresponds to the second cavity structure 02, and the orthographic projection of the region where the second lower electrode 2211, the second piezoelectric layer 2212, and the second upper electrode 2213 of the second resonator 221 overlap on the flexible substrate 100 falls within the range of the orthographic projection of the maximum cross-section of the second cavity structure 02 in the direction perpendicular to the thickness direction Y of the resonator assembly (i.e., the first direction X) on the flexible substrate 100.

[0060] Figure 3 is a top view of a resonator assembly provided by an embodiment of the present invention. Figure 3 The top view can correspond to Figure 1 the structure of the resonator assembly shown. Figure 3 Only the top view of the maximum cross-section of the second cavity structure 02 in the first direction X and the effective resonance region 2210 of the second resonator 221 are shown. In this embodiment, the exemplary top view shape of the effective resonance region of the second resonator 221 is a rectangle. In other embodiments, the top view shape of the effective resonance region of the second resonator 221 can be other shapes, which are not specifically limited in this embodiment; the shape of the maximum cross-section of the second cavity structure 02 in the first direction X is also not specifically limited and will not be elaborated here.

[0061] The effective resonance region 2210 of the second resonator 221 within the range of the second cavity structure 02 can prevent the sound wave generated when the second resonator 221 resonates from leaking into the first cavity structure 01 where the first resonator 211 resonates, and avoid the interference of the second resonator 221 resonance on the first resonator 211.

[0062] Optionally, the first surface of the flexible substrate at least includes a convex portion, and the second surface of the flexible substrate at least includes a concave portion. In the thickness direction of the flexible substrate, the convex portion on the first surface corresponds to the concave portion on the second surface.

[0063] Continuing to refer to Figure 1 , optionally, the flexible substrate 100 is U-shaped, the first surface 101 serves as the convex portion 103, and the second surface 102 serves as the concave portion 104.

[0064] The flexible substrate 100 includes two opposite surfaces, namely the upper surface and the lower surface. In this embodiment, a resonant unit 210 is disposed on one side of the upper surface. The upper surface is taken as the first surface 101, and the lower surface is taken as the second surface 102. The first surface 101 is convex, and the second surface 102 is concave.

[0065] Figure 4 It is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention. Refer to Figure 4 , optionally, at least two groups of resonant units 200 are disposed on one side surface of the flexible substrate 100.

[0066] In this embodiment, an example is shown in which two groups of resonant units 200 are disposed on one side surface of the flexible substrate 100. Each group of resonant units includes two first resonator sub-units 210 and one second resonator sub-unit 220. The first resonator sub-unit 210 includes two first resonators 211, and the second resonator sub-unit 220 includes one second resonator 221. Adjacent two groups of resonant units 200 are electrically connected through the first upper electrode 2113 of the adjacent first resonator 211, and then the adjacent two groups of resonant units 200 are connected in series.

[0067] Continue to refer to Figure 4 , optionally, both the first surface 101 and the second surface 102 include a convex portion 103 and a concave portion 104. In the thickness direction of the flexible substrate 100, the concave portion 104 of the first surface 101 corresponds to the convex portion 103 of the second surface 102.

[0068] The flexible substrate 100 includes two opposite surfaces, the upper surface and the lower surface. The upper surface can be the first surface 101 and the lower surface can be the second surface 102, or the upper surface can be the second surface 102 and the lower surface can be the first surface 101. In this embodiment, an example is shown in which the upper surface is the first surface 101 and the lower surface is the second surface 102.

[0069] Figure 5 It is a circuit diagram of another resonator assembly provided by an embodiment of the present invention. Figure 5 The shown circuit diagram of the resonator assembly is applicable to Figure 4 the shown schematic structural diagram of the resonator assembly. Refer to Figure 4 and Figure 5 , the two groups of resonant units 200 are connected in series. In each group of resonant units 200, the first resonators 211 are connected in series, and the second resonator 221 is connected in parallel with four series-connected first resonators 211.

[0070] In this embodiment, the setting direction of the first resonator 211 of the resonator unit 200 forms an angle greater than 0 degrees with the surface of the flexible substrate 100 where the first resonator 211 is located, which can reduce the area of the resonator assembly in the direction of the surface of the flexible substrate 100, facilitating the miniaturization of the device. And in the thickness direction Y of the resonator assembly, the second resonator 221 and the first resonator 211 are stacked, which can further reduce the area of the resonator assembly. A stress buffer structure 110 is provided between each resonator unit 200 and the flexible substrate 100, which can relieve the stress of the resonator assembly and improve the yield of the resonator assembly.

[0071] Figure 6 It is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention. Refer to Figure 6 , Optionally, at least one set of resonator units 200 is provided on the first surface 101 of the flexible substrate 100, and at least one set of the above-mentioned resonator units 200 is provided on the second surface 102 of the flexible substrate 100. The first surface 101 and the second surface 102 are two opposite surfaces of the flexible substrate 100, and the resonator units 200 provided on the first surface 101 and the resonator units 200 provided on the second surface 102 are arranged staggeredly.

[0072] The resonator units 200 on the first surface 101 of the flexible substrate 100 are arranged on the convex portion 103 of the first surface 101, and the resonator units 200 on the second surface 102 of the flexible substrate 100 are arranged on the convex portion 103 of the second surface. Alternatively, the resonator units 200 on the first surface 101 of the flexible substrate 100 are arranged in the concave portion 104 of the first surface 101, and the resonator units 200 on the second surface 102 of the flexible substrate 100 are arranged in the concave portion 104 of the second surface.

[0073] The concave portions 104 and the convex portions 103 of the flexible substrate 100 are arranged staggeredly. Therefore, in this embodiment, one set of resonator units 200 is arranged on the convex portion 103 of the first surface 101, and one set of resonator units 200 is arranged on the convex portion 103 of the second surface 102, which can make the resonator units 200 on the first surface 101 and the resonator units 200 on the second surface 102 arranged staggeredly. Avoid interference between the resonator units 200 during operation.

[0074] An embodiment of the present invention also provides a flexible filter, which includes the resonator assembly in the above embodiment. The beneficial effects of the flexible filter are the same as those of the resonator assembly, and will not be elaborated herein.

[0075] Optionally, the flexible filter includes at least two resonator assemblies, the resonator assemblies are stacked, and the resonator units in at least two adjacent resonator assemblies are electrically connected.

[0076] Each resonator component includes a flexible substrate. In the thickness direction of the flexible filter, the resonator components to which the two closest flexible substrates belong can be called adjacent resonator components. After the resonator units in the adjacent resonator components are electrically connected, series or parallel connection between the resonator units can be achieved, and then combined with other structures such as inductors or capacitors to realize the filtering function of the flexible filter. Compared with different resonator components being laid flat on the same plane, in this embodiment, the resonator components are stacked in the thickness direction of the flexible filter, which can reduce the layout area of the flexible filter and is beneficial to the miniaturization of the device.

[0077] Figure 7 FIG. 4 is a schematic structural diagram of a flexible filter provided by an embodiment of the present invention. Refer to Figure 7 , optionally, in at least two layers of resonator components 03, the resonator units 200 included in each resonator component 03 are located on the same side of the flexible substrate 100 in the resonator component 03 where they are located.

[0078] In this embodiment, it is exemplarily shown that the flexible filter includes two layers of resonator components 03. Each layer of resonator component 03 includes one resonator unit 200. One layer of resonator component 03 includes a first flexible substrate 1001 and one resonator unit 200, and the other resonator component includes a second flexible substrate 1002 and one resonator unit 200. The resonator unit 200 of the resonator component 03 to which the first flexible substrate 1001 belongs is disposed on the first surface 101 of the first flexible substrate 1001, and the resonator unit 200 of the resonator component 03 to which the second flexible substrate 1002 belongs is disposed on the first surface 101 of the second flexible substrate 1002.

[0079] The resonator unit 200 of the resonator component 03 to which the second flexible substrate 1002 belongs includes four first resonators, namely the first resonator one 2101 and the first resonator two 2102. There are also two serially connected first resonators connected between the first resonator one 2101 and the first resonator two 2102. The resonator unit 200 of the resonator component 03 to which the first flexible substrate 1001 belongs includes the first resonator three 2103 and the first resonator four 2104. There are also two serially connected first resonators connected between the first resonator three 2103 and the first resonator four 2104. The resonator units 200 in the two layers of resonator components 03 can be serially connected, that is, the first upper electrode 2113 of the first resonator two 2102 is electrically connected to the first upper electrode 2113 of the first resonator three 2103; or, the first upper electrode 2113 of the first resonator two 2102 is electrically connected to the first upper electrode 2113 of the first resonator four 2104.

[0080] The resonator units 200 in the two-layer resonator assembly 03 can also be connected in parallel. The first upper electrode 2113 of the first resonator 2101 is electrically connected to the first upper electrode 2113 of the third resonator 2103, and the first upper electrode 2113 of the second resonator 2102 is electrically connected to the first upper electrode 2113 of the fourth resonator 2104 (i.e., Figure 7 the structure shown); alternatively, the first upper electrode 2113 of the first resonator 2101 is electrically connected to the first upper electrode 2113 of the fourth resonator 2104, and the first upper electrode 2113 of the second resonator 2102 is electrically connected to the first upper electrode 2113 of the third resonator 2103.

[0081] Among them, the resonators in different-layer resonator assemblies 03 are connected by a connecting line 04, and the connecting line 04 penetrates through the second flexible substrate 1002.

[0082] Figure 8 It is a schematic structural diagram of another flexible filter provided by an embodiment of the present invention. Refer to Figure 8 , optionally, in at least two adjacent resonator assemblies 03, the resonator units 200 included in each resonator assembly 03 are located on different sides of the flexible substrate 100 in the resonator assembly 03 where they are located.

[0083] In this embodiment, it is exemplarily shown that the flexible filter includes two adjacent resonator assemblies 03. The flexible substrate 100 included in one layer of the resonator assembly 03 is the first flexible substrate 1001, and the flexible substrate included in the other adjacent resonator assembly 03 is the second flexible substrate 1002. The resonator units 200 of the resonator assembly 03 to which the first flexible substrate 1001 belongs are located on the first surface 101 of the first flexible substrate 1001, and the resonator units 200 of the resonator assembly 03 to which the second flexible substrate 1002 belongs are located on the second surface 102 of the second flexible substrate 1002.

[0084] Continuing to refer to Figure 8 , optionally, in adjacent-layer resonator assemblies 03, one layer of the resonator assembly 03 includes at least two groups of resonator units 200, and the adjacent groups of resonator units 200 are electrically connected. The other layer of the resonator assembly 03 includes at least one group of resonator units 200. The resonator units 200 of the adjacent-layer resonator assemblies 03 are arranged in an interleaved manner, and the distance between two adjacent flexible substrates 100 is less than the sum of the thicknesses of the resonator units 200 in two adjacent resonator assemblies 03.

[0085] In this embodiment, it is exemplarily shown that each resonator assembly 03 includes three resonator units 200, and adjacent groups of resonator units 200 are electrically connected through a connection line 04. A gap structure 05 can be formed between two adjacent resonator units 200 in the same resonator assembly 03, and a resonator unit 200 of a resonator assembly 03 adjacent to this resonator assembly 03 can be partially located in this gap structure 05, so that the distance between two adjacent flexible substrates 100 is less than the sum of the thicknesses of the resonator units 200 in two adjacent resonator assemblies 03, thereby reducing the overall thickness of the flexible filter and facilitating the thinning and lightening of the device.

[0086] Reference Figure 7 and Figure 8 , optionally, the flexible substrates 100 of adjacent-layer resonator assemblies 03 are bonded and connected through a bonding structure 300. Figure 7 The adjacent-layer resonator assemblies 03 in [] are electrically connected through the bonding structure 300 and the connection line 04.

[0087] Continue to refer to Figure 8 , optionally, in adjacent-layer resonator assemblies 03, a group of resonator units 200 in one resonator assembly 03 and two adjacent groups of resonator units 200 in another resonator assembly 03 form a set resonance structure 400. In the set resonance structure 400, the vertical projection of a group of resonator units 200 in one resonator assembly 03 is at least partially located between two adjacent groups of resonator units 200 in another resonator assembly 03.

[0088] In the set resonance structure 400, the vertical projection of a group of resonator units 200 in one resonator assembly 03 being at least partially located between two adjacent groups of resonator units 200 in another resonator assembly 03 can reduce the influence on the resonator units 200 in another resonator assembly 03 when two adjacent resonator units 200 in one resonator assembly 03 resonate.

[0089] The bonding structure 300 is a conductive material, and adjacent-layer resonator assemblies 03 can be electrically connected through the bonding structure 300.

[0090] , optionally, the flexible filter according to any embodiment of the present invention further includes a sealing ring. The sealing ring is arranged between two adjacent flexible substrates. The two adjacent flexible substrates and the sealing ring therebetween form a sealing structure, and each resonator and the bonding structure are located within the sealing structure.

[0091] Continue to refer to Figure 7 and Figure 8 , optionally, the resonator units 200 of the resonator assembly 03 are electrically connected to the bonding structure 300 through the connection line 04, and the shape of the connection line 04 is a straight line, a curve or a polygon.

[0092] The connecting line 04 can be made of the same material as the first upper electrode 2113 of the first resonator 211, that is, the connecting line 04 can be prepared on the same layer as the first upper electrode 2113, thereby simplifying the manufacturing process of the flexible filter. The shape of the connecting line 04 can be a straight line, or it can also be a curve or a polygon. When the shape of the connecting line 04 is a curve, the connecting line 04 is not easily broken due to stress, thereby improving the stress resistance of the flexible filter.

[0093] Figure 9 The circuit diagram of a flexible filter provided by an embodiment of the present invention Figure 9 The circuit diagram in Figure 8 corresponds to the structural schematic diagram of the flexible filter shown in Figure 8 Only a partial circuit diagram of the flexible filter is shown. Refer to Figure 8 and Figure 9 The first upper electrode of the first resonator 211 of a certain resonator assembly 03 is electrically connected to the first upper electrode 2113 of the first resonator 211 of the same set resonator structure 400 located in another resonator assembly 03 through a bonding structure 300 and a connecting line 04, thereby enabling the resonant units 200 located in different resonator assemblies 03 within the same set resonator structure 400 to be connected in parallel, and the resonant units 200 in adjacent set resonator structures 400 to be connected in series.

[0094] Figure 10 Another structural schematic diagram of a flexible filter provided by an embodiment of the present invention. Refer to Figure 10 Optionally, the flexible filter includes at least three layers of resonator assemblies 03, and the vertical projections of the set resonator structures 400 located on both sides of the same flexible substrate 100 on the flexible substrate 100 do not overlap.

[0095] In this embodiment, it is exemplarily shown that the flexible filter includes three layers of resonator assemblies 03. The first layer of resonator assembly 03 includes a first flexible substrate 1001, the second layer of resonator assembly 03 includes a second flexible substrate 1002, and the third layer of resonator assembly 03 includes a third flexible substrate 1003. And it is exemplarily shown that the vertical projections of the set resonator structures 400 located on both sides of the middle second flexible substrate 1002 on the second flexible substrate 1002 do not overlap. In other embodiments, it may also be that the vertical projections of the set resonator structures 400 located on both sides of the first flexible substrate 1001 on the first flexible substrate 1001 do not overlap, or the vertical projections of the set resonator structures 400 located on both sides of the third flexible substrate 1003 on the third flexible substrate 1003 do not overlap.

[0096] The vertical projections of the set resonance structures 400 on both sides of the same flexible substrate 100 do not overlap on the flexible substrate 100, which can avoid the mutual influence between the resonance units 200 on both sides of the same flexible substrate 100.

[0097] Figure 11 FIG. is a schematic structural diagram of another flexible filter provided by an embodiment of the present invention. Refer to Figure 11 Optionally, the resonance units 200 in the adjacent two layers of resonator assemblies 03 are arranged in opposite directions. The flexible substrates 100 of the adjacent two layers of resonator assemblies 03 are connected by a conductive thin film 500, and the resonance units 200 are electrically connected to the conductive thin film 500 through a connection line 04 in the flexible substrate 100.

[0098] Each resonator assembly 03 includes a flexible substrate 100. In the thickness direction of the flexible filter, the two resonator assemblies 03 to which the two closest flexible substrates 100 belong can be called adjacent two layers of resonator assemblies. In this embodiment, it is exemplarily shown that one layer of resonator assembly 03 of the flexible filter includes a first flexible substrate 1001 and a resonance unit 200, and the adjacent resonator assembly 03 includes a second flexible substrate 1002 and a resonance unit 200. The resonance unit 200 of the resonator assembly 03 to which the first flexible substrate 1001 belongs is arranged on the second surface 102 of the first flexible substrate 1001, and the resonance unit 200 in the resonator assembly 03 to which the second flexible substrate 1002 belongs is arranged on the first surface 101 of the second flexible substrate 1002.

[0099] In this embodiment, there are two flexible substrates 100 between the resonance units 200 of the adjacent two layers of resonator assemblies 03, so that the mutual interference between the resonance units 200 of the adjacent two layers of resonator assemblies 03 is small, and the projections of the resonance units 200 of different layers of resonator assemblies 03 in the thickness direction of the flexible substrate 100 can at least partially overlap, thereby reducing the layout area of the flexible filter and being beneficial to the miniaturization of the device. The setting direction of the first resonator 211 and the surface of the flexible substrate 100 where the first resonator 211 is located form an angle greater than 0 degrees, which can reduce the area of the resonator assembly 03 in the direction of the surface of the flexible substrate 100. And in the thickness direction of the resonator assembly, the second resonator 221 and the first resonator 211 are stacked, which can further reduce the area of the resonator assembly 03. It is beneficial to the miniaturization of the device. The stress buffer structure 110 can release stress, better cooperate with the possible deformation of the flexible substrate 100, and improve the stress resistance performance and yield of the flexible filter.

[0100] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A resonator component, characterized in that, It includes a flexible substrate and at least one set of resonant units located on at least one side of the flexible substrate. Each set of the resonant units includes at least two first resonator units and at least one second resonator unit located on the side of the first resonator unit away from the flexible substrate. The first resonator unit includes at least two first resonators that support and electrically connect to each other. The setting direction of the first resonator forms an angle greater than 0 degrees with the surface of the flexible substrate where the first resonator is located. The second resonator unit includes at least one second resonator, and the setting direction of the second resonator is parallel to the setting direction of the flexible substrate. A first cavity structure is formed between at least two mutually supported first resonators of the first resonator unit and the flexible substrate. At a position corresponding to at least one of the first cavity structures, the surface of the flexible substrate has a stress buffer structure. The first resonator includes a first lower electrode, a first piezoelectric layer, and a first upper electrode stacked. Two adjacent first resonators in the first resonator unit are electrically connected through their own first lower electrodes, and two adjacent first resonator units are electrically connected through the first upper electrodes of two adjacent first resonators respectively.

2. The resonator assembly according to claim 1, wherein, The vertical projection of the second resonator unit on the flexible substrate is at least partially located between the projections of two adjacent first resonator units on the flexible substrate. The second resonator units included in each set of the resonant units are electrically connected to at least two first resonator units included in the same set of the resonant units respectively.

3. The resonator assembly according to claim 1 or 2, wherein The second resonator includes a second lower electrode, a second piezoelectric layer, and a second upper electrode. The second resonators included in each set of the resonant units are electrically connected through their own second lower electrodes to the first upper electrodes of the first resonators located at the first edge in the same set of the resonant units, and the second resonators included in each set of the resonant units are electrically connected through their own second upper electrodes to the first upper electrodes of the first resonators located at the second edge in the same set of the resonant units. The first edge and the second edge are the start end and the terminal end respectively on the series path of each first resonator unit.

4. The resonator assembly according to claim 1, wherein, Each set of the resonant units further includes an insulating layer, and the insulating layer is located between the first resonator unit and the second resonator unit.

5. The resonator assembly according to claim 4, wherein The setting direction of the insulating layer is parallel to the setting direction of the second resonator.

6. The resonator assembly according to claim 1, wherein, The resonant unit includes two first resonator units and one second resonator. The second resonator and the two first resonator units form a second cavity structure, and the effective resonance region of the second resonator is within the range of the second cavity structure. Among them, the effective resonance region of the second resonator includes the region where the second lower electrode, the second piezoelectric layer, and the second upper electrode of the second resonator overlap each other.

7. The resonator assembly according to claim 1, characterized in that, The stress buffer structure on the surface of the flexible substrate includes at least one groove on the surface of the flexible substrate.

8. The resonator assembly according to claim 1, wherein, At least two sets of the resonant units are provided on one side surface of the flexible substrate.

9. The resonator assembly according to claim 1, wherein, At least one set of the resonant units is disposed on the first surface of the flexible substrate, and at least one set of the resonant units is disposed on the second surface of the flexible substrate. The first surface and the second surface are two opposite surfaces of the flexible substrate, and the resonant units disposed on the first surface and the resonant units disposed on the second surface are arranged in an interleaved manner.

10. A flexible filter, characterized in that, Comprising the resonator assembly according to any one of claims 1-9.

11. The flexible filter according to claim 10, wherein, Comprising at least two of the resonator assemblies, the resonator assemblies being stacked, and the resonant units in at least two adjacent resonator assemblies being electrically connected.

12. The flexible filter according to claim 11, wherein, In at least two layers of the resonator assemblies, the resonant units included in each resonator assembly are located on the same side of the flexible substrate in the resonator assembly where the resonant units are located.

13. The flexible filter according to claim 11, wherein In at least two adjacent resonator assemblies, the resonant units included in each resonator assembly are located on different sides of the flexible substrate in the resonator assembly where the resonant units are located.

14. The flexible filter according to claim 13, wherein, In adjacent layers of the resonator assemblies, one layer of the resonator assemblies includes at least two sets of resonant units, and adjacent sets of resonant units are electrically connected. Another layer of the resonator assemblies includes at least one set of resonant units. The resonant units of the adjacent layers of the resonator assemblies are arranged in an interleaved manner. The distance between adjacent layers of the flexible substrates is less than the sum of the thicknesses of the resonant units in the adjacent layers of the resonator assemblies.

15. The flexible filter according to claim 14, characterized in that, The flexible substrates of adjacent layers of the resonator assemblies are bonded and connected through a bonding structure.

16. The flexible filter according to claim 15, wherein, In adjacent layers of the resonator assemblies, a set of the resonant units in one layer of the resonator assemblies forms a set resonant structure with two adjacent sets of the resonant units in another layer of the resonator assemblies. In the set resonant structure, the vertical projection of a set of the resonant units in one layer of the resonator assemblies on another layer of the resonator assemblies is at least partially located between two adjacent sets of the resonant units in another layer of the resonator assemblies.

17. The flexible filter according to claim 16, characterized in that, Comprising at least three layers of the resonator assemblies, and the vertical projections of the set resonant structures on both sides of the same flexible substrate do not overlap on the flexible substrate.

18. The flexible filter according to claim 15, wherein, The resonant units of the resonator assembly are electrically connected to the bonding structure through a connecting wire, and the shape of the connecting wire is a straight line, a curve or a polygon.

19. The flexible filter according to claim 13, characterized in that, The resonant units in adjacent two layers of the resonator assemblies are arranged in opposite directions, the flexible substrates in adjacent two layers of the resonator assemblies are connected through a conductive film, and the resonant units are electrically connected to the conductive film through a connecting wire in the flexible substrate.

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