Electronic component testing methods and equipment

Abstract

The present invention provides an electronic component testing method and apparatus, comprising: controlling a temperature control device to maintain the temperature within a testing chamber at a preset temperature; conveying the electronic components from a supply mechanism via a vibrating feed mechanism to a carrier slot on a carrier, and then transporting the electronic components by the carrier via an intermittent rotating flow path to a testing mechanism for testing, all performed at the preset temperature within the testing chamber; thereby reducing inaccuracy in test results.

Description

Technical Field

[0001] The present invention relates to a testing method and device, and more particularly to an electronic component testing method and device that uses an intermittent rotating flow path of a transport device to transport electronic components to a testing device for testing. Background Art

[0002] After manufacturing, electronic components such as LEDs or passive components usually need to be inspected to facilitate subsequent sorting according to their characteristics. These inspection devices often have a carrier tray with equally spaced slots arranged around a circumference on a base. The electronic components are accommodated in the slots and transported by the carrier tray in an intermittent rotating flow path. Various physical property detection instruments are set on the periphery of the carrier tray to detect the electronic components in the slots. For some electronic components that need to have good temperature characteristics under special temperature environments, such as thermistors, the existing technology adopts a method of providing a cover on the base to cover the carrier tray and the detection instrument, so that the carrier tray and the detection instrument are located in the internal space formed by the base and the cover, and injecting a gas of a preset temperature into the internal space to maintain a temperature different from that outside the cover. During the inspection, a feeding mechanism outside the cover sequentially supplies the electronic components to the carrier tray inside the cover, so that the electronic components are inspected at the preset temperature. Summary of the Invention

[0003] Conventional technology uses a cover to test electronic components that require good temperature characteristics in special temperature environments. However, there is a temperature difference between the outside and inside of the cover. As a result, after the electronic components are fed from a feeding mechanism outside the cover to the inside of the cover, the temperature difference may cause undesirable conditions such as moisture generation and testing before the component temperature reaches the preset temperature. These undesirable conditions may lead to inaccurate test results.

[0004] Therefore, an object of the present invention is to provide an electronic component testing method that can reduce the inaccuracy of testing results.

[0005] Another object of the present invention is to provide an electronic component testing device that can reduce inaccuracy in testing results.

[0006] Another object of the present invention is to provide a device for performing the electronic component testing method.

[0007] The electronic component testing method according to the present invention includes: controlling the temperature within a testing chamber to maintain a preset temperature using a temperature control device; conveying the electronic components from a supply mechanism via a vibrating feed mechanism to a carrier slot on a carrier, and then transporting the electronic components by the carrier via an intermittent rotating flow path to a testing mechanism for testing, all performed at the preset temperature within the testing chamber.

[0008] According to another purpose of the present invention, electronic component testing equipment includes: a testing chamber; a temperature control device for controlling the temperature in the testing chamber; a supply device disposed in the testing chamber, the supply device being provided with a supply mechanism and a vibrating feeding mechanism; a conveying device disposed in the testing chamber, the conveying device being provided with a carrier and a carrier driving mechanism; and a testing device disposed in the testing chamber, the testing device being provided with a testing mechanism.

[0009] According to another aspect of the present invention, an electronic component testing device includes: a device for executing the electronic component testing method.

[0010] According to the electronic component detection method and apparatus of the embodiments of the present invention, electronic components can be maintained at the same preset temperature while being transported between various mechanisms, thereby reducing moisture caused by temperature differences and allowing the component temperature to be closer to the preset temperature, thereby reducing inaccuracy in detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a three-dimensional schematic diagram of a detection device in an embodiment of the present invention.

[0012] Figure 2 In the embodiment of the present invention Figure 1 Before view diagram.

[0013] Figure 3 Schematic diagram of the carrier plate and the detection mechanism in an embodiment of the present invention.

[0014] Figure 4 It is a schematic diagram of the configuration relationship between the supply mechanism and the vibration feeding mechanism in an embodiment of the present invention.

[0015] Figure 5 Schematic diagram of the arrangement relationship between the tray drive mechanism, the conveying table and the tray in an embodiment of the present invention.

[0016] Figure 6 It is a schematic exploded perspective view of a carrier drive mechanism in an embodiment of the present invention.

[0017] Figure 7 Schematic diagram of an embodiment of the present invention in which the tray driving mechanism does not contact the conveying table.

[0018] Figure 8 3D is a schematic diagram of a detection mechanism in an embodiment of the present invention.

[0019] Figure 9 It is a schematic diagram of the configuration relationship between the collection box, the material receiving tube and the airflow amplifier in an embodiment of the present invention.

[0020]

Explanation of symbols

[0021] A: Testing room

[0022] B: Temperature control device

[0023] B1: First temperature control mechanism

[0024] B2: Second temperature control mechanism

[0025] B3: The third temperature control mechanism

[0026] B4: The fourth temperature control mechanism

[0027] C: Supply device

[0028] C1: Supply organization

[0029] C11: Hopper

[0030] C12: Forehearth

[0031] C13: Demagnetizer

[0032] C14: Driver

[0033] C2: Vibration feeding mechanism

[0034] C21: Circular vibration mechanism

[0035] C22: Direct vibration mechanism

[0036] D: Transport device

[0037] D1: carrier plate

[0038] D11: Loading slot

[0039] D12: Embedded hole

[0040] D2: Carrier drive mechanism

[0041] D21: Base

[0042] D211: Exhaust pipe

[0043] D22: Shell

[0044] D221: Shell cover

[0045] D222: Opening

[0046] D223: Intake pipe

[0047] D23: Axis tube seat

[0048] D231: Seat

[0049] D232: Axle tube

[0050] D233: Channel

[0051] D234: Annular groove

[0052] D235: Intake pipe

[0053] D236: Exhaust pipe

[0054] D24: Drive

[0055] D241: body

[0056] D242: Drive shaft

[0057] D25: Linkage shaft

[0058] D251: Steps

[0059] D252: Fixing parts

[0060] D26: Bushing

[0061] D27: Coupling

[0062] D28: Bearing

[0063] D3: Moving tabletop

[0064] D31: Refrigeration Department

[0065] D32: Hollow area

[0066] D33: carving

[0067] D4: discharge outlet

[0068] D5: Restricted parts

[0069] D51: Accommodation area

[0070] E: Detection device

[0071] E1: Testing agency

[0072] E11: Probe holder

[0073] E12: First probe set

[0074] E121: Probe

[0075] E122: First probe seat

[0076] E13: Second probe set

[0077] E131: Probe

[0078] E132: Second probe base

[0079] E14: Drive rack

[0080] E15: Drive

[0081] E16: Housing

[0082] E161: Intake pipe

[0083] E162: Exhaust pipe

[0084] E2: Testing Instruments

[0085] F: Gas circulation mechanism

[0086] F1: Refrigeration unit

[0087] F2: Inlet

[0088] F3: Exhaust port

[0089] G: Collection device

[0090] G1: Collection Box

[0091] G2: receiving tube

[0092] G3: Airflow Amplifier

[0093] H1: Pipeline

[0094] H2: Pipeline

[0095] H3: Pipeline

[0096] H4: Pipeline

[0097] T: Machine frame

[0098] T1: Machine table

[0099] U: Machine cover

[0100] W: Electronic components

[0101] W': sample element

[0102] d1: minimum inner diameter

[0103] d2: maximum outer diameter

[0104] d3: Maximum outer diameter DETAILED DESCRIPTION

[0105] See also Figure 1 The electronic component detection method of the embodiment of the present invention can be described by taking the detection device shown in the figure as an example. The detection device is provided with:

[0106] A testing room A;

[0107] a temperature control device B, controlling the temperature in the detection chamber A;

[0108] A feeding device C is provided in the detection chamber A, and the feeding device C includes a feeding mechanism C1 and a vibrating feeding mechanism C2;

[0109] A conveying device D is provided in the inspection chamber A. The conveying device D is provided with a carrier plate D1 and a carrier plate driving mechanism D2;

[0110] A detection device E is provided in the detection chamber A. The detection device E is provided with a detection mechanism E1.

[0111] See also Figure 1 The detection equipment is provided with a machine frame T and a machine cover U. The machine frame T is provided with a horizontal machine table T1. The machine cover U is provided on the machine table T1 and covers the mechanism provided on the machine table T1. The detection chamber A is formed between the machine table T1 and the machine cover U.

[0112] See also Figure 1 、 2 The temperature control device B is installed in the machine frame T outside the detection chamber A. The temperature control device B is equipped with a first temperature control mechanism B1, such as a chiller, a second temperature control mechanism B2, such as a chiller, a third temperature control mechanism B3, such as a vortex tube, and a fourth temperature control mechanism B4, such as a vortex tube. A gas circulation mechanism F is installed in the detection chamber A. The gas circulation mechanism F has a cooling portion F1, an air intake port F2, and an air exhaust port F3. Two pipelines H1 are installed between the first temperature control mechanism B1 and the cooling portion F1. The first temperature control mechanism B1 can output low-temperature liquid and pass it through one of the pipes H1 to the refrigeration section F1. The low-temperature liquid passes through and cools the refrigeration section F1, and then returns to the first temperature control mechanism B1 through the other pipe H1, thereby circulating the low-temperature liquid. The gas in the detection chamber A is sucked in through the air intake port F2, cooled by the refrigeration section F1, and then discharged into the detection chamber A through the exhaust port F3, so that the cooling gas circulates in the detection chamber A and the temperature in the detection chamber A is controlled to be maintained at a first temperature.

[0113] See also Figure 1 、 2 3. The conveying device D is provided with a conveying table D3 that is higher than the machine table E1 and spaced apart from the machine table E1. The carrier D1 is placed on the conveying table D3. The carrier D1 is provided with a plurality of loading slots D11 around its periphery. The loading slots D11 can carry electronic components W.

[0114] A cooling portion D31 is provided on the conveying table D3. Two pipes H2 are provided between the second temperature control mechanism B2 and the cooling portion D31. The second temperature control mechanism B2 can output a cryogenic liquid through one of the pipes H2 to the cooling portion D31. The cryogenic liquid passes through the cooling portion D31 and cools it before returning to the second temperature control mechanism B2 through the other pipe H2. This cycle of cryogenic liquid transport maintains the temperature of the conveying table D3 at a second temperature.

[0115] A pipeline H3 is provided between the third temperature control mechanism B3 and the platen drive mechanism D2. The third temperature control mechanism B3 can deliver low-temperature gas to the platen drive mechanism D2 through the pipeline H3 to control the temperature of the platen drive mechanism D2 to be maintained at a third temperature. A pipeline H4 is provided between the fourth temperature control mechanism B4 and the detection mechanism E1. The fourth temperature control mechanism B4 can deliver low-temperature gas to the detection mechanism E1 through the pipeline H4 to control the temperature of the detection mechanism E1 to be maintained at a fourth temperature.

[0116] Among them, the preset values ​​of the first temperature, the second temperature, the third temperature and the fourth temperature are the same, all of which are 25±0.05℃; a temperature sensor (not shown) can also be set in the inspection room A, so that when the temperature is different from the preset value, the temperature in the inspection room A can be independently adjusted; different temperature sensors (not shown) can also be set on the conveying table D3, the detection mechanism E1 and the carrier drive mechanism D2 at the same time, so that when the temperature is different from the preset value, the temperature of the conveying table D3, the detection mechanism E1 and the carrier drive mechanism D2 can be independently adjusted.

[0117] See also Figure 2 、 3 A collecting device G is provided inside the machine frame T outside the detection chamber A below the machine table T1. The collecting device G can collect the electronic components W discharged from the carrier D1. A plurality of discharge ports D4 are provided outside the periphery of the carrier D1. The collecting device F is provided with a plurality of collecting boxes G1 corresponding to the number of the discharge ports D4. Each collecting box G1 is connected to each discharge port D4 by a receiving tube G2.

[0118] See also Figure 3 、 4 The supply mechanism C1 and the vibration feeding mechanism C2 are both arranged on the machine table T1; the supply mechanism C1 is provided with a hopper C11, a feeding channel C12, a demagnetizer C13 and a driver C14 such as an electromagnet; the vibration feeding mechanism C2 is provided with a circular vibration mechanism C21 and a vertical vibration mechanism C22; the driver C14 can shake the hopper C11 and the feeding channel C12, so that the electronic components W in the hopper C11 fall from the hopper C11 to the feeding channel C12, and enter the circular vibration mechanism C21 after being demagnetized by the demagnetizer C13. After the electronic components W are arranged in sequence by the circular vibration mechanism C21 and the vertical vibration mechanism C22, they are sequentially supplied to the loading slot D11 of the carrier D1 by the vertical vibration mechanism C22.

[0119] See also Figure 5 、 67. The conveying table D3 is provided with a circular hollow section D32. The carrier D1 is attached to the upper portion of the hollow section D32. The carrier drive mechanism D2 passes through the hollow section D32 from below and is connected to the carrier D1, thereby driving the carrier D1 to intermittently rotate on the conveying table D3. The carrier drive mechanism D2 does not contact the conveying table D3.

[0120] The conveying table D3 is provided with a C-shaped plate-shaped limiting member D5 surrounding the periphery of the carrier D1 to prevent the electronic component W from being thrown out of the carrier slot D11 when the carrier D1 is intermittently rotated; the limiting member D5 is provided with a receiving area D51 for receiving a sample component W'; the discharge port D4 ( Figure 3 ) penetrates the conveying table D3 and the limiting member D5 and corresponds to the loading slot D11, so that the electronic components W can be discharged from the carrier D1 through the discharge port D4;

[0121] The outside of the carrier drive mechanism D2 is provided with a base D21, a shell D22 and a shaft tube seat D23. The carrier drive mechanism D2 is fixed on the machine table T1 ( Figure 1 ), the shell D22 is connected between the base D21 and the shaft tube seat D23; the shell D22 is composed of four shell covers D221, and its upper and lower ends are respectively provided with openings D222; the shaft tube seat D23 is provided with a seat portion D231 and a shaft tube portion D232, and a channel D233 passes through the two, the width of the seat portion D231 is wider than the shaft tube portion D232, and the openings at the upper and lower ends of the shell D22 are respectively controlled by the seat portion D231 of the shaft tube seat D23 and the base D21 shielded; the seat D231 is provided with an annular groove D234 on the outer periphery of the channel D233, and the seat D231 is provided with an air inlet pipe D235 and an air outlet pipe D236 respectively connected to the annular groove D234; the periphery of the shell D22 is provided with a plurality of air inlet pipes D223, and the lower part of the base D21 is provided with a plurality of air outlet pipes D211, and the air inlet pipes D223 and the air outlet pipes D211 are connected to the inside of the shell D22; the third temperature control mechanism B3 ( Figure 2 ) are respectively delivered to the annular groove D234 through the air inlet pipe D235 and discharged from the exhaust pipe D236, and delivered to the housing D22 through the air inlet pipe D223 and discharged from the exhaust pipe D211;

[0122] The interior of the carrier drive mechanism D2 is provided with a driver D24 such as a motor, a linkage shaft D25 and a sleeve D26; the driver D24 is fixedly arranged below the shaft tube seat D23 and is located in the housing D22, a body D241 of the driver D24 covers the lower end of the channel D233 and abuts against the annular groove D234, a driving shaft D242 above the driver D24 extends into the channel D233 and is connected to the lower end of the linkage shaft D25 by a coupling member D27, so that the driver D24 can drive the linkage shaft D25 to rotate intermittently; the bottom of the driver D24 maintains a distance from the base D21 and the The side edge of the driver D24 is also spaced apart from the housing D22, and the driver D24 does not contact the base D21 or the housing D22. The sleeve D26 is embedded in the upper end of the channel D233. The upper end of the linkage shaft D25 passes through the sleeve D26 and the hollow section D32 and is embedded in an embedding hole D12 of the carrier D1 to link the carrier D1. A plurality of bearings D28 are disposed between the linkage shaft D25 and the sleeve D26. The upper end of the linkage shaft D25 is provided with a step portion D251 that is slightly wider than the outer diameter of the linkage shaft D25. The carrier D1 is clamped between the step portion D251 and a fixing member D252 and is driven by the linkage shaft D25.

[0123] The minimum inner diameter d1 of the hollow section D32 is larger than the maximum outer diameter d2 of the linkage shaft D25 and the maximum outer diameter d3 of the sleeve D26, respectively. The upper end of the shaft tube D232 is located at the bottom of the hollow section D32 and maintains an appropriate distance from the conveying table D3.

[0124] Since the driver D24 of the carrier drive mechanism D2 is disposed in the housing D22 and the driver D24 is in contact with the shaft tube seat D23 only from the top, the heat generated by the driver D24 after the operation can be controlled by the third temperature control mechanism B3 ( Figure 2 ) controls the temperature to reduce heat diffusion outward; and because the carrier drive mechanism D2 does not contact the conveying table D3, it further reduces the heat transfer to the conveying table D3 and thus affects the electronic components W.

[0125] See also Figure 1 、 5 8. The detection device E is provided with a detection instrument E2 located in the detection chamber A and next to the conveying table D3. The detection instrument E2 is electrically connected to the detection mechanism E1 to analyze the information detected by the detection mechanism E1;

[0126] The detection mechanism E1 is provided with a probe rack E11, a first probe group E12, a second probe group E13, a drive rack E14 and a driver E15 such as an electromagnet; the upper surface of the probe rack E11 can extend through a long strip-shaped opening D33 on the conveying table D3 and be exposed on the conveying table D3; the first probe group E12 is provided with four first probes E121 on a first probe seat E122, and the second probe group E13 is provided with four second probes E131 on a second probe seat E132. The first probe group E12 is used to detect the sample in the accommodating area D51 The second probe assembly E13 is used to detect the electronic component W' in the loading slot D11 of the carrier D1 and is carried by the carrier D1; the first probe seat E122 and the second probe seat E132 are respectively spaced apart and arranged at one end of the driving frame E14, and the driver E15 can act on the other end of the driving frame E14 to drive the first probe seat E122 and the second probe seat E132 to move up and down, so that the first probe E121 and the second probe E131 can pass through the multiple through holes E111 of the probe frame E11 to detect the electronic component W and the electronic component W' respectively;

[0127] The driver E15 is disposed in a three-dimensional rectangular housing E16, which is provided with an air inlet pipe E161 and an air outlet pipe E162. Figure 2 ) The low-temperature gas output is delivered to the housing E16 through the inlet pipe E161 and discharged from the exhaust pipe E162 to reduce the temperature inside the housing E16 and reduce the heat generated by the driver E15 after the driver E15 is actuated and dissipated to other mechanisms;

[0128] The sample component W' has been previously tested at a temperature of 25±0.05°C in other testing equipment, and its test information is known. In this embodiment of the present invention, the sample component W', with known test information, is placed in a testing environment substantially identical to that of the electronic component W, and both components are tested simultaneously. The test information of the electronic component W is converted from the test information of the sample component W'. However, this conversion method is not the focus of the present invention and will not be further described here.

[0129] See also Figure 8 , an airflow amplifier G3 is provided between each collecting box G1 and each receiving tube G2, which makes the electronic components W ( Figure 3 ) can be discharged into the collection box G1 at an accelerated speed.

[0130] In the implementation of the electronic component detection method and apparatus of the embodiment of the present invention, the first temperature control mechanism B1, the second temperature control mechanism B2, the third temperature control mechanism B3 and the fourth temperature control mechanism B4 are used to independently control the temperature of different areas in the inspection chamber A, so that the temperature control device B controls the temperature in the inspection chamber A to be maintained at a preset temperature; the electronic component W is transported from the supply mechanism C1 to the loading slot D11 of the carrier D1 via the vibrating feeding mechanism C2, and is transported by the carrier D1 to the detection mechanism E1 via an intermittent rotating flow path for detection, all of which are performed at the preset temperature in the inspection chamber A; the electronic component W after being detected by the detection mechanism E1 is then discharged to the collection device G through the corresponding discharge port D4 according to its physical properties.

[0131] According to the electronic component detection method and apparatus of the embodiments of the present invention, the electronic component W can be kept at the same preset temperature while being transported between various mechanisms, thereby reducing moisture caused by temperature differences and allowing the component temperature to be closer to the preset temperature, thereby reducing inaccuracy in detection results.

[0132] The above description is only a preferred embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. In other words, any simple equivalent changes and modifications made according to the scope of the patent application and the content of the invention description are still within the scope of the patent of the present invention.

Claims

1. An electronic component testing device, comprising: a testing chamber formed between a machine table and a machine cover; A feeding device comprising a feeding mechanism and a vibrating feeding mechanism; A conveying device is provided with a carrier and a carrier driving mechanism; a detection device having a detection mechanism; A gas circulation mechanism having a cooling portion, an air intake port, and an air exhaust port; a temperature control device for controlling the temperature in the detection chamber; The supply device, the conveying device, the detection device and the gas circulation mechanism are all arranged in the detection chamber; the temperature control device is provided with a first temperature control mechanism outside the detection chamber; Two pipelines are provided between the first temperature control mechanism and the refrigeration part. The first temperature control mechanism can output low-temperature liquid and pass through one of the pipelines to the refrigeration part. The low-temperature liquid passes through and cools the refrigeration part and then flows back to the first temperature control mechanism through the other pipeline. The gas in the detection chamber is sucked in from the air intake port, cooled by the refrigeration part, and then discharged into the detection chamber through the exhaust port to control the temperature in the detection chamber to maintain at a preset value.

2. The electronic component testing device according to claim 1, wherein: The conveying device is provided with a conveying table that is higher than the machine table. The carrier is placed on the conveying table and is driven by a carrier driving mechanism. The periphery of the carrier is provided with multiple carrying slots for carrying electronic components. The conveying table is provided with a hollow area. The carrier is attached to the top of the hollow area. The carrier driving mechanism is connected to the carrier through the hollow area from the bottom of the hollow area.

3. The electronic component testing device according to claim 2, wherein: The tray driving mechanism does not contact the conveying table.

4. The electronic component testing device according to claim 2, wherein: The carrier drive mechanism comprises a base, a shell, a driver and a shaft tube seat; the driver is fixedly arranged below the shaft tube seat and located in the shell, and the driver does not contact the base and the shell, and low-temperature gas can be transported into the shell.

5. The electronic component testing device according to claim 4, wherein: The shaft tube seat is provided with an annular groove and the driver is close to the annular groove, and low-temperature gas can be transported into the annular groove.

6. The electronic component testing device according to claim 2, wherein: The temperature control device is provided with a second temperature control mechanism, a third temperature control mechanism and a fourth temperature control mechanism outside the detection chamber; the second temperature control mechanism controls the temperature of the conveying table to be maintained at a preset value; the third temperature control mechanism controls the temperature of the carrier drive mechanism to be maintained at a preset value; and the fourth temperature control mechanism controls the temperature of the detection mechanism to be maintained at a preset value.

7. The electronic component testing device according to claim 6, wherein: The preset value of the temperature in the detection chamber, the preset value of the temperature of the conveying table, the preset value of the temperature of the detection mechanism and the preset value of the temperature of the carrier driving mechanism are all the same.

8. The electronic component testing device according to claim 6, wherein: The second temperature control mechanism is used to transport low-temperature liquid, and the third and fourth temperature control mechanisms are used to transport low-temperature gas.

9. The electronic component testing device according to claim 1, wherein: The detection mechanism is provided with a driver, which can drive a plurality of probes to move to detect electronic components; the driver is arranged in a shell, and low-temperature gas can be transported into the shell.

10. The electronic component testing device according to claim 9, wherein: The detection device is further provided with a detection instrument beside the conveying table. The detection instrument is electrically connected with the detection mechanism to analyze the information after the detection by the detection mechanism.

Images