Composite phase change heat transfer device, composite heat pipe and terminal

Abstract

The present application relates to a kind of composite phase change heat transfer device, composite heat pipe and terminal.Therein the composite phase change heat transfer device, including: main body, and coupling in the isolation channel of the main body;Wherein, the main body, including: corresponding structure type includes phase change heat transfer piece;The corresponding structure type of the phase change heat transfer piece includes heat pipe, heat spreader, loop;The isolation channel, including: the communication cavity that is closed except its two ports is structured;And corresponding structure type includes by the first sheet inner wall constitutes, or, by the first sheet one side face and the part of the main body outer wall surface that constitutes inner wall constitutes.Embodiment of the present application can improve the heat dissipation efficiency of electronic equipment etc..

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat transfer equipment, in particular to a composite phase change heat transfer device, a composite heat pipe and a terminal. BACKGROUND

[0002] At present, electronic devices are developing towards ultra-thin, lightweight, stacking, high performance and long endurance, so that the volume available for heat dissipation is becoming smaller and smaller, and the heat dissipation problem has become one of the core elements restricting the development of high-end electronic devices. Heat pipe, heat plate and loop are the most efficient phase change heat transfer devices today, which have been widely used to solve the heat problem of microelectronic, optoelectronic and other terminal devices. Heat pipe, heat plate and loop are the most efficient phase change heat transfer devices today, one end of which is the evaporation end and the other end is the condensation end. The specific working principle is that the liquid working medium in the closed pipe shell based on vacuum extraction is easy to boil and evaporate, forming steam latent heat to quickly carry heat from the evaporation end to the condensation end. The steam flows from the center channel to the condensation section of the heat pipe, condenses into liquid and releases latent heat, and under the action of capillary force, the liquid flows back to the evaporation section. According to Baidu Encyclopedia, it has the following characteristics: first, the heat pipe mainly relies on the vapor-liquid phase change of the working liquid inside for heat transfer, and the thermal resistance is very small, so it has very high heat conduction capacity. Its heat conduction capacity exceeds any known metal. Compared with silver, copper, aluminum and other metals, the heat pipe can transfer several orders of magnitude of heat per unit weight. Secondly, the steam in the cavity of the heat pipe and other phase change heat transfer devices is in a saturated state, and the saturation temperature determines the saturation pressure. The pressure drop produced by the saturated steam flowing from the evaporation section to the condensation section is very small, and according to the equation in thermodynamics, the temperature drop is also very small, so the heat pipe has excellent isothermality.

[0003] In the prior art, compared with passive heat dissipation systems, active heat dissipation systems include phase change heat transfer devices, fins, fans, etc. Especially for notebook computers, the fan is usually large in size to increase the air inlet and enhance heat exchange, and the fins and the like also occupy a certain space accordingly. And for tablet computers or mobile phones, the thickness is more and more super-thin, and with the popularization of 5G, the heat flux of power devices is getting larger and larger. In addition, in order to reduce the space occupation of heat pipes such as electronic devices, especially the space occupation in the thickness direction, the heat pipe is usually flattened to an extremely thin flat pipe, or one side of the heat pipe in the thickness direction is compounded with a graphene heat dissipation film. However, the thinner the heat pipe is flattened, the volume of the closed cavity inside the pipe shell decreases significantly, which will result in that the total amount of working medium that can be filled is extremely small; and during operation, the flow channel of the gas phase working medium is extremely small, the latent heat transfer is not smooth, and the liquid phase working medium backflow is poor due to insufficient thickness of the wick, etc., the evaporation end is prone to dry burning, and the heat flux is greatly reduced. In addition, in the face of the development trend of electronic devices such as the above and the increasingly severe heat problems, the power consumption of CPUs and graphics cards is getting larger and larger, and air cooling has been difficult to suppress. Especially the traditional active heat dissipation system composed of heat pipes, fins and fans commonly used in notebook computers, however, its essence is still air cooling. If the high heat flux heat generated by the increasingly high-power heating components such as microelectronic chips in the limited space cannot be dissipated in time, the temperature of the components will rise, causing the chip to stall or reduce the frequency, and in severe cases, reducing its performance and service life, so such a traditional active heat dissipation system has been difficult to meet the high-performance development of electronic devices. Therefore, in order to improve the adaptability of electronic devices to high-performance heat dissipation, water cooling heat dissipation enters the field of view, and water cooling has to become an effective solution, but it also faces many challenges such as volume, cost and reliability problems. Built-in water cooling heat dissipation, the following technical developments appear:

[0004] (1) 2000s: The first water-cooled notebook computer appears. The existing technology 1: In June 2003, NEC Corporation of Japan launched the world's first thin and light notebook computer with built-in water cooling module, using piezoelectric pump driving technology, marking the first time that water cooling technology has entered the mobile computing field. The design aims to solve the problem of insufficient traditional air cooling caused by the small internal space of the notebook computer;

[0005] (2) 2010s: Bottleneck and background of water cooling technology. However, there are technical bottlenecks, that is, although the water cooling heat dissipation efficiency is much higher than air cooling (about 3500 times higher), due to cost and complexity, early notebook computer manufacturers prefer to optimize the air cooling system. For example, some high-end notebooks try to combine external water cooling docking stations or hybrid heat dissipation schemes. The high performance demand of electronic devices drives the continued exploration;

[0006] (3) 2020s: New exploration and commercialization of water cooling technology. In terms of manufacturer innovation, although the current mainstream notebook still mainly uses air cooling, the high-efficiency water cooling technology (such as double-cavity pump design, silent fan) launched by manufacturers such as Cool Master may provide technical reserves for future notebook integrated water cooling. In terms of industry trends, with the continuous improvement of processor performance (such as AI chips, high-density GPUs), the application of water cooling technology in light and thin high-performance notebooks may become a breakthrough direction, but the problems of volume, cost and reliability need to be solved. For example, at this stage, there is prior art 2: on January 25, 2022, Mechanical Revolution (MECHREVO) released the Kratos series of gaming laptops, which are equipped with an "Ice River Split Type Water Cooling Cooling System", which combines an internal water cooling pipe and an external cold pump. Specifically, the water inlet of the water inlet pipe and the water outlet of the water outlet pipe of the "external cold pump" are connected to the water outlet and the water inlet of the "internal water cooling pipe" in the form of quick sealing heads, respectively, to form a closed circulation cooling loop of water cooling liquid, which supports high-performance, high-power and high-heat Intel 12th generation i9 processors and RTX 3080Ti graphics cards. Please refer to the schematic Figure 0A The "internal water cooling pipe" is essentially an extremely thin copper pipe 01 that is flattened and bent. The copper pipe 01 has a water inlet 01a and a water outlet 01b, and the copper pipe 01 is attached to the top surface of a plurality of flattened heat pipes 02 (including a first flattened heat pipe 02 and a second flattened heat pipe 02), which are flat to form a better fit between the copper pipe 01 and the flattened heat pipes 02. The copper pipe 01 is staggered and intersects with the plurality of flattened heat pipes 02 in the extension direction, and the contact surfaces of the copper pipe 01 and the flattened heat pipes 02 are connected by welding or using thermal conductive glue, so that when the external cold pump drives the water cooling liquid in the copper pipe 01, the water cooling liquid will carry away part of the heat carried by the flattened heat pipes 02 (such as shell heat and latent heat of evaporation). This design is the first large-scale application of split type water cooling technology in consumer grade gaming laptops. However, as can be seen from the above technical developments (1) to (3), the water cooling technology of electronic devices such as notebooks has always been around the contradiction between "high-efficiency cooling" and "space limitation" since the first attempt in 2003. Although it has not been widely popularized yet, with the continuous increase of chip heat load, water cooling technology is expected to usher in a new stage of development in high-performance mobile devices. During this period, the application of notebook built-in water cooling technology still faces significant challenges. Therefore, how to solve the space occupation of the heat dissipation system in electronic devices, realize the miniaturization of the heat dissipation system, and improve the heat transfer performance, has become a technical problem to be solved. SUMMARY

[0007] However, the existing technology 2 in the above technical development (3) stage is the closest prior art, which is combined by "built-in water cooling pipe and external cooling pump", but: first, the water cooling liquid and the heat pipe are designed to be intersected and stacked, which makes the thickness of the notebook computer not well controlled, and the double thickness of the top shell plate and the bottom shell plate of the flattened copper pipe 01 (and the inner cavity therebetween) inevitably occupies the thickness space of the notebook computer, which is particularly for some thin and light notebooks, the heat dissipation space is limited, and the heat dissipation by the intersecting and stacking of the water cooling pipe and the heat pipe affects the use of the thin and light notebook; second, the "welding or using heat-conducting glue" arranged on the bonding surface between the upper copper pipe 01 and the lower flattened heat pipe 02 will inevitably have a large thermal resistance; third, the bonding surface between the upper copper pipe 01 and the lower flattened heat pipe 02 requires that the outer wall surfaces of the two are bonded to each other with high flatness, otherwise there will be more gaps at the contact position; fourth, the intersecting and stacking combination between the copper pipe 01 and the flattened heat pipe 02 inevitably requires that the top surfaces of the plurality of flattened heat pipes are at the same height, and the height difference should not be too large; fifth, the intersecting and stacking combination between the copper pipe 01 and the flattened heat pipe 02 inevitably has a small heat exchange contact area at the intersecting and bonding position; sixth, the intersecting and stacking combination between the copper pipe 01 and the flattened heat pipe 02 also makes the stacked devices inside the notebook computer appear messy or not regular. In view of the above problems, the main purpose of the present application is to provide a composite phase change heat transfer device, a composite heat pipe and a terminal to overcome the shortcomings of the related prior art.

[0008] To achieve the purpose of the present application, the technical scheme adopted by the present application is as follows:

[0009] In a first aspect, the present application provides a composite phase change heat transfer device, characterized in that it comprises: a main body and an isolation channel coupled to the main body; wherein,

[0010] The main body comprises: a corresponding structure type comprising a phase change heat transfer element; the corresponding structure type of the phase change heat transfer element comprises a heat pipe, a heat spreading plate and a loop;

[0011] The isolation channel comprises: a communication cavity closed except for its two ports; and a corresponding structure type comprising a first sheet inner wall or a part of the first sheet inner wall and a part of the outer wall of the main body.

[0012] More preferably, the coupling corresponds to the structure comprising:

[0013] The first sheet forms a tubular shape and is sleeved on the outer wall of the phase-change heat transfer member, so that the inner wall of the first sheet and the outer wall of the phase-change heat transfer member are at a certain distance or are partially attached corresponding to the sleeving position, thereby obtaining a hollow channel surrounded by the inner wall of the first sheet and the outer wall of the phase-change heat transfer member; or,

[0014] The first sheet forms a rectangular sheet shape, and the two sides of the first sheet are bonded to the outer wall of the phase-change heat transfer member, thereby obtaining a hollow channel surrounded by the inner wall of the first sheet and the outer wall of the phase-change heat transfer member.

[0015] The material corresponding to the first sheet includes copper sheet, aluminum sheet, graphene heat dissipation film sheet, or heat insulation plastic film sheet.

[0016] The hollow channel is used for passing fluid, which includes gas or liquid, and the gas includes air and the liquid includes water.

[0017] The hollow channel further includes that the two ports are respectively connected with an inlet pipe and an outlet pipe, so that the fluid sequentially passes through the inlet pipe, the hollow pipe and the outlet pipe without leakage along the way; or,

[0018] The two ports are respectively connected with an inlet pipe and an outlet pipe, so that the fluid sequentially passes through the inlet pipe, the hollow pipe and the outlet pipe without leakage along the way, and the open end of the outlet pipe is blocked by an end cover, and then the corresponding circulation of the fluid includes sequentially passing through the inlet pipe, the hollow pipe, the outlet pipe to the end cover, and then passing through the outlet pipe, the hollow pipe and the inlet pipe; or,

[0019] One port is connected with an inlet pipe, and the other port is bonded to the outer wall of the main body, and then the corresponding circulation of the fluid includes sequentially passing through the inlet pipe, the hollow pipe to the bonding position of the other port, and then passing through the hollow pipe and the inlet pipe without leakage along the way.

[0020] Further, the phase-change heat transfer member further includes the following structure types:

[0021] The multi-directional extension phase-change heat transfer structure is configured to have a first cavity extending along a first plane, and a second cavity extending along a second plane coupled to the first cavity; wherein,

[0022] The structure type of the first cavity or the second cavity includes a flat shape, and one end of the first cavity or the second cavity is set as the evaporation end of the multi-directional extension phase-change heat transfer structure.

[0023] The spatial relationship between the first plane and the second plane includes orthogonality.

[0024] The connecting relationship of the first cavity and the second cavity includes being in communication to form a closed cavity, or being not in communication to form a closed cavity respectively;

[0025] The first cavity or the second cavity corresponds to a partial space or a whole space, and a liquid absorption core is arranged in the partial space or the whole space, or the first cavity and the second cavity correspond to a partial space, and a liquid absorption core is arranged in the partial space.

[0026] Optionally, the composite phase change heat transfer device further comprises:

[0027] A power unit coupled to the isolation channel or near at least one opening of two ends of the isolation channel is used to force the flow of fluid in the isolation channel; wherein,

[0028] The product type corresponding to the power unit includes a pump, and the product type corresponding to the pump includes an air pump and a water pump, and the corresponding structure type includes an axial flow type and a radial flow type.

[0029] In a second aspect, the present application provides a composite heat pipe applied to electronic equipment including a mobile phone, a tablet computer and a notebook computer, and the composite heat pipe comprises the heat pipe and the isolation channel as described in the first aspect, or the heat pipe and the isolation channel as described in the first aspect, and one or more fins are arranged on the outer wall surface of the heat pipe, and the fins are arranged in the isolation channel as described in the first aspect.

[0030] The heat pipe further comprises:

[0031] The closed cavity is configured as a flat tubular shape, and the thickness direction of the closed cavity is perpendicular to the thickness direction of the electronic equipment; and

[0032] The axis shape of the heat pipe includes a straight line shape or an L shape, the L shape is bent around an axis corresponding to the width direction, and the two segments on both sides of the bent part correspond to a preset position including one segment arranged on one side surface of a battery in the electronic equipment and another segment arranged on an inner side surface of a frame of the electronic equipment; and

[0033] The closed cavity is provided with a liquid absorption core, and the preset structure of the liquid absorption core includes a plane parallel to the axis of the closed cavity and extending along the thickness direction of the closed cavity, so as to divide the closed cavity into an upper cavity and a lower cavity, and the whole space of the lower cavity is occupied by the liquid absorption core.

[0034] In a third aspect, the present application provides a terminal, and the corresponding product type includes a mobile phone, a notebook computer, a tablet computer, a desktop computer, a server, an LED lamp, a projector, a laser, a charger and a battery pack, and the terminal comprises the composite phase change heat transfer device as described in the first aspect.

[0035] Preferably, the mobile phone comprises:

[0036] a middle frame connected to the frame, coupled with the first cavity as described in the first aspect above; a side surface of the first cavity in the thickness direction is coupled with the second cavity as described in the first aspect above; wherein,

[0037] the first cavity has a thickness direction perpendicular to the extension direction of the middle frame, and one end is set as an evaporation end;

[0038] the first cavity and the second cavity are both flat and orthogonally form a T shape or an inverted T shape;

[0039] the second cavity is arranged in a plate-shaped gap between a stack of components in the mobile phone; the components include a battery; the thickness direction of the plate-shaped gap is perpendicular to the thickness direction of the mobile phone; the preset position of the gap includes between the front side of the battery along the length direction of the mobile phone and the stack of components facing the front side, or a certain width of the band gap formed by the battery being two pieces and arranged in the same layer, or a certain width of the band gap formed between the frame and the components; the front side is perpendicular to the length direction of the mobile phone;

[0040] the second cavity is coupled to the bottom side of the gap, which occupies a certain depth of the gap corresponding to the width of the shell; and the gap other than the part corresponding to the shell is used to set the isolation channel as described in the first aspect above, or the hollow channel as described in the first aspect above.

[0041] Preferably, the mobile phone comprises:

[0042] a wind pump as described in the first aspect above is provided; wherein the wind pump is arranged in a receiving cavity arranged near the inside of the frame, and the receiving cavity is used to accommodate the wind pump;

[0043] the receiving cavity further comprises:

[0044] a first side surface is open and coupled to a first part of the frame vertically, and a second side surface opposite to the first side surface is provided with an opening; wherein the opening is connected to a port of an independent air duct isolated from the internal space of the mobile phone, and the other port of the air duct is coupled to a second part of the frame; the corresponding structure type of the air duct includes the isolation channel as described in the first aspect above, or the hollow channel as described in the first aspect above;

[0045] the wind pump further comprises:

[0046] The plug-in part is configured to facilitate dust removal, and an outer wall surface of the plug-in part is provided with a plurality of first conductive contacts; the first conductive contacts are used to enable the air pump to obtain power supply to start working after the plug-in part is inserted into the accommodating cavity; an inner wall surface of the accommodating cavity is provided with second conductive contacts corresponding to the first conductive contacts, and the second conductive contacts are connected to the battery; or,

[0047] The water pump is arranged to be fixed in the accommodating cavity.

[0048] Preferably, the notebook computer comprises:

[0049] The heat plate is provided with the first sheet material, and one side of the heat plate in the thickness direction is provided with one or more than one channel, the first sheet material is bonded to the top of the corresponding wall surface of the channel on one side, and the first sheet material is bonded to the top of the corresponding wall surface of the channel on the other side, thereby forming the isolation channel or the hollow channel.

[0050] Preferably, the notebook computer comprises:

[0051] The water pump is arranged to be fixed in the accommodating cavity.

[0052] The water pump is used to drive a liquid fluid, the liquid fluid comprises water and nanofluid, the liquid fluid is arranged in an independent water channel isolated from the internal space of the notebook computer, and the water channel corresponds to the isolation channel or the hollow channel.

[0053] Preferably, the notebook computer comprises:

[0054] The water channel is coupled to the side frame of the notebook computer at two ports, and the two ports are used to connect a water outlet and a water inlet of a water-cooled heat dissipation device arranged outside the notebook computer, the water-cooled heat dissipation device comprises a power unit for driving the liquid fluid to circulate in the water channel, the water channel corresponds to the isolation channel or the hollow channel, and the liquid fluid comprises water and nanofluid.

[0055] In a fourth aspect, the application provides an isolation channel, characterized in that the isolation channel comprises the isolation channel according to any one of the first to third aspects or the hollow channel according to any one of the first or third aspects.

[0056] From the above technical solutions, the application has at least the following beneficial effects:

[0057] Compared with the excessive thickness space occupation in the closest prior art 2, and the problems of less area of heat exchange contact surface between the copper pipe and the flattened heat pipe, higher flatness requirement, and extremely high thermal resistance, the scheme of the present disclosure forms an isolation channel between the inner wall surface of the first sheet and the outer wall surface of the phase change heat transfer device such as a heat pipe, and the isolation channel is configured as a closed communication cavity except for its two ports, so that when the fluid passes through the isolation channel, direct contact heat exchange with the outer wall surface of the heat pipe is formed, and based on the isothermicity of the conventional phase change heat transfer device such as a heat pipe, isothermic heat exchange and large-area heat exchange without leakage of fluid along the way are formed, which obviously has extremely low heat exchange thermal resistance and extremely high heat exchange capacity. Compared with the prior art, the composite phase change heat transfer device provided by the present application has the beneficial effect of improving the heat dissipation efficiency of electronic equipment. The implementation of the present application can reduce the space occupation of the heat dissipation system in electronic equipment, realize the miniaturization of the power type heat dissipation system, improve the heat transfer performance, and improve the use experience and service life of electronic equipment. Moreover, the first sheet and the internal stacked device of the electronic equipment such as a notebook computer are neatly or not messy, and the electronic equipment space occupation is less (especially when the isolation channel is located at the same height of the side, such as the left side or the right side, of the phase change heat transfer device such as a heat pipe, which does not increase the thickness space occupation of the electronic equipment at all), and the isolation channel can be invisible to a certain extent. In summary, the scheme of the present disclosure preferably overcomes the above first to sixth technical problems of the closest prior art. More features and benefits of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0058] Figure 0A The structure schematic diagram of the closest prior art 2;

[0059] Figure 1A The structure schematic diagram of the first embodiment of the first aspect of the present application;

[0060] Figure 1B The structure schematic diagram of the second embodiment of the first aspect of the present application;

[0061] Figure 1C The structure schematic diagram of the third embodiment of the first aspect of the present application;

[0062] Figure 1D The structure schematic diagram of the fourth embodiment of the first aspect of the present application;

[0063] Figure 2 The structure schematic diagram of the first embodiment of the third aspect of the present application. DETAILED DESCRIPTION

[0064] In order to make the objectives, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The specific embodiments described herein are only used to explain the present application, and are not used to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described again in some embodiments.

[0065] First aspect embodiment

[0066] Specifically, the phase change heat transfer member is a gas-liquid two-phase heat transfer device. The corresponding structure types include heat pipes, heat plates, and loop-backs.

[0067] The above-mentioned "communicating cavity closed except for its two ports" means that the isolation channel is a channel with two open ends, such as a pipe (which can be a flat pipe or a special-shaped pipe, etc.). If the two ports of the isolation channel are blocked, the isolation channel forms a closed cavity.

[0068] The above-mentioned "enclosed by the entire one side of the first sheet and the part constituting the outer wall surface of the main body" is exemplarily that the first sheet is a rectangular copper sheet, and the main body is a flat tubular heat pipe. The length of the rectangular copper sheet corresponds to two side edges, which are parallel to the axis of the heat pipe and are bonded to the two side surfaces in the width direction of the heat pipe, respectively, thereby forming an integrated composite heat pipe structure. The two side surfaces in the width direction of the heat pipe are the two side surfaces directed by the width direction of the heat pipe, in other words, the two side surfaces are perpendicular to the width direction of the heat pipe.

[0069] The material of the isolation channel can be selected from a metal sheet, and the above-mentioned copper sheet and aluminum sheet are one of the metal sheets. Further, the surface of the copper sheet can be subjected to an oxidation-resistant treatment, such as an oxidation-resistant plating layer.

[0070] The graphene heat dissipation film sheet can also be further subjected to a plating treatment on the surface, such as a copper foil plating.

[0071] The middle-through pipe is one of the structure types of the isolation channel.

[0072] The hollow channel has one end connected with the inlet pipe and the other end adhered to the outer wall of the main body. One end of the inlet pipe is connected to the hollow channel, and the other end can be coupled to the frame of a mobile phone. A dust filter screen can also be provided at the frame, and the dust filter screen can also be a pluggable component. In addition, the other end of the hollow pipe is adhered to the outer wall of the main body, that is, the other end is closed, and fluid such as air outside the hollow pipe cannot enter the hollow pipe through the other end. The hollow channel is connected to the external space of the mobile phone, and the phase change heat transfer component such as the heat pipe is coupled in the hollow channel. One end of the heat pipe is connected to a heat source such as a CPU to achieve more efficient passive heat dissipation. The free port of the inlet pipe is sealed and adhered to the frame of the mobile phone to ensure that external air of the mobile phone cannot enter other cavities except the inlet pipe and the hollow channel, thereby preventing moisture and water from entering the CPU and other devices in the other cavities of the mobile phone.

[0073] Referring to Figure 1A , a structure diagram of a first embodiment of a first aspect of the present application is shown. As Figure 1A shown, the structure diagram is a cross-sectional view, including a first sheet 11, a phase change heat transfer component 12, a liquid absorbing core 13, and a hollow pipe 14. The first sheet 11 forms a tube, the phase change heat transfer component 12 is a heat pipe, the liquid absorbing core 13 has a certain thickness and is arranged on the inner wall of the heat pipe, and the outer wall of the heat pipe and the inner wall of the tube form the hollow pipe 14.

[0074] The first embodiment of the first aspect of the present application is particularly suitable for a notebook computer or a tablet computer. The heat pipe is a flat tube, one side (i.e., the bottom surface) of which is attached to one side of the mainboard in the notebook computer or the tablet computer, and one end of the heat pipe is coupled to a heat source (such as a CPU). The hollow pipe 14 can be located on the left side and / or the right side of the heat pipe. The advantage is that the thickness of the heat pipe is not increased, and the valuable space in the thickness of the notebook computer or the tablet computer is saved. Optionally, a part of the outer wall of the heat source (such as the CPU) can be coupled to the inner wall of the hollow pipe 14 to further enhance the heat exchange efficiency of the hollow pipe 14 through the fluid.

[0075] Referring to Figure 1B , a structure diagram of a second embodiment of the first aspect of the present application is shown. As Figure 1BAs shown, the structural schematic diagram is a cross-sectional view, including a first sheet 11, a phase change heat transfer piece 12, a liquid absorbing core 13, and a hollow channel 14. The first sheet 11 is prepared as a rectangular sheet, the phase change heat transfer piece 12 corresponds to a heat pipe, the heat pipe is in a flat tube shape, and the heat pipe is divided into an upper cavity and a lower cavity along the thickness direction, and the liquid absorbing core 13 completely occupies the lower cavity. The two side edges of one side of the first sheet 11 are bonded to the edge side of one side of the heat pipe in the width direction, thereby obtaining the hollow channel 14 surrounded by one side of the first sheet 11 and one side of the heat pipe in the width direction.

[0076] The second embodiment of the first aspect of the application is especially suitable for, for example, a notebook computer, a tablet computer or a mobile phone. The heat pipe is in a flat tube shape, and the thickness direction is perpendicular to the thickness direction of the notebook computer, the tablet computer or the mobile phone. The hollow channel 14 can be located at the top side and / or the bottom side of the heat pipe, or at the left side and / or the right side of the heat pipe. The advantage is that the precious thickness space of the notebook computer, the tablet computer or the mobile phone is saved.

[0077] A potential problem caused by this is that the corresponding bending resistance of the notebook computer, the tablet computer or the mobile phone, especially the mobile phone, decreases to a certain extent compared with the prior art. Therefore, a reinforcing structure, such as a connecting piece, can be arranged on the periphery or the top of the composite phase change heat transfer device. The connecting piece can be a metal strip (such as an aluminum alloy) or a frame structure with a certain rigidity, which is used to connect the stack composed of the devices on both sides of the cavity of the composite phase change heat transfer device, thereby reinforcing the bending resistance. However, the first cavity coupled to the middle frame of the mobile phone in the application has the same structure, shape and strength as the conventional ultra-thin vapor chamber. The shell of the ultra-thin vapor chamber can be made of stainless steel, thereby enhancing the bending resistance of the mobile phone. Therefore, the decrease in bending resistance caused by the occupation of the cavity by the second cavity is avoided or compensated.

[0078] In one example of the first aspect of the application, the first sheet is in a rectangular sheet shape, and the phase change heat transfer piece corresponds to a vapor chamber. The vapor chamber is in a flat plate shape, and the two pairs of side edges of the rectangular sheet are bonded to the outer wall surface of the upper cover plate of the vapor chamber.

[0079] In another example of the first aspect of the present invention, the composite phase-change heat transfer device is applied to a laptop computer, wherein the first sheet material is rectangular, and the phase-change heat transfer element corresponds to a heat pipe. The heat pipe is a flat tube, and two pairs of lateral edges corresponding to the rectangular sheet material are bonded to a side surface of the heat pipe in the width direction, thereby forming an isolation channel, wherein a portion of the inner wall of the isolation channel is formed by a portion of the outer wall of the heat pipe. Advantageously, the isolation channel, located on one side of the heat pipe, does not increase the thickness of the heat pipe, thus saving valuable space in the thickness direction of the laptop computer. Furthermore, the fluid (e.g., air) in the isolation channel directly contacts the heat pipe, flowing along the length of the heat pipe and undergoing continuous heat exchange. Compared to conventional heat pipes combined with cooling fans in the prior art, the present invention achieves more efficient heat exchange with the same air intake volume; reduces the fan volume, significantly saving space occupied by the related heat dissipation device in the laptop computer; and, through the isolation channel, achieves dustproof or dust-free effects, low noise, and moisture-proof effects in the laptop computer, further enhancing the sealing of the laptop computer. The laptop computer in this example can also be replaced by a tablet computer, which is even more beneficial.

[0080] See also Figure 1C , which shows a schematic structural diagram of the third embodiment of the first aspect of the present invention. Figure 1C The schematic diagram of the structure is a cross-sectional view, comprising a first cavity 21, a second cavity 22, and a wick 23; a first sheet 11, and a hollow tube 14. The first cavity 21 and the second cavity 22 are both flat, interconnected to form a closed cavity and a single inverted T-shaped component. The wick 23 has a certain thickness and is located on the inner wall of the first cavity 21, while the second cavity 22 may not have a wick.

[0081] Combine Figure 1C The advantage of this inverted T-shaped heat transfer arrangement is that, during operation, the first cavity 21 can be horizontal with one end coupled to the heat source, while the second cavity 22 can be vertical. The other end of the first cavity 21 and the second cavity 22 both serve as condensation ends. In particular, since the second cavity 22 does not require a wick, its internal volume is significantly increased (with extremely low thermal resistance), and its vertical orientation accelerates the return of condensate. Preferably, the second cavity 22 is coupled near the corresponding evaporation end of the first cavity 21 to achieve even stronger heat transfer performance.

[0082] For example, the first cavity is coupled to a middle frame of a mobile phone, the first cavity corresponds to a thickness of the shell, such as 0.25 mm, and a length, such as 60 mm, and a width, such as 30 mm, the second cavity extends along the width direction of the mobile phone and is arranged in the gap or gap formed between the front section and the middle section of the three-section layout formed by the internal device stack of the mobile phone, the second cavity corresponds to a thickness of the shell, such as 1 mm, and a width, such as 3.5 mm, and a length, such as 55 mm, and further increases the airway volume of the first cavity through the second cavity, thereby obtaining multiple dimensions of heat dissipation and higher heat flux, and conducting heat from the first cavity (layer) arranged at the middle frame to other stacked layers above or below the middle frame (i.e. to achieve efficient heat transfer across the stacked layers in the mobile phone, for example, from the lower side of the battery to the upper side of the battery, and the upper side of the battery can also be provided with a copper foil and / or graphene heat dissipation film, and coupled to the top surface of the second cavity), and realize the saving of the valuable space in the thickness direction of the mobile phone, while the space in the length direction of the mobile phone is not as valuable as the space in the thickness direction, and has more flexibility. Due to the addition of the second cavity on the basis of the first cavity, the volume or the area of any side of the first cavity can be further reduced. The second cavity corresponds to a shell width of 3.5 mm, which is reduced to 2 mm, and the gap formed between the front section and the middle section of the three-section layout along the width direction of the mobile phone, the length of the gap is 55 mm, the width is 1 mm, and the depth is 3.5 mm, then the gap has a plate-shaped cavity with a depth of 1.5 mm, a width of 1 mm, and a length of 55 mm, which can be used to set up the isolation channel described in the embodiments of the application.

[0083] Optionally, the second cavity can be further bent into a "Γ" shape; one end of the "Γ" shape is connected orthogonally to one side of the first cavity in the thickness direction; the bent portion of the second cavity corresponds to the end of the first cavity; the bent portion and the end of the first cavity opposite to it are coupled to the top surface and the bottom surface of the heat source, respectively. For example, the cross section of the second cavity is a flat plate cavity, which is changed into a flat plate cavity with a "Γ" shaped cross section after bending.

[0084] Preferably, the direction of the pump driving the fluid is from the evaporation end to the condensation end of the phase change heat transfer member.

[0085] Optionally, the isolation channel can be arranged only at the condensation end of one end of the phase change heat transfer member, for enhancing the condensation of the gas phase working medium in the condensation end, thereby accelerating the backflow.

[0086] In another embodiment, the first cavity and the second cavity are both flat or flat tubular or flat plate or plate-shaped and each constitute a closed cavity in a non-communicating manner, the first cavity is bonded orthogonally to one side of the second cavity in an inverted T shape or T shape. Among them, the bonding can be welding, thermal connection, etc.; the orthogonality can be that one side of the second cavity in the width direction is bonded to one side of the first cavity in the thickness direction. The benefits are that, for example, the first cavity can be selected from an ultra-thin vapor chamber, and the second cavity can be selected from a flattened heat pipe, and the two can be integrated by thermal connection of the outer wall surface, and the corresponding preparation method is simple and efficient; further, the first cavity is coupled to the middle frame of the mobile phone, and the second cavity extends along the gap or gap formed between the front section and the middle section in the three-section layout of the mobile phone internal device stack in the width direction of the mobile phone, and then through the flattened heat pipe, the airway volume of the ultra-thin vapor chamber is significantly improved, and multiple dimensional heat dissipation is obtained.

[0087] Please refer to Figure 1D , which shows the structural schematic diagram of the fourth embodiment of the first aspect of the present application. As shown in Figure 1D , the structural schematic diagram is a cross-sectional view, including a first cavity 21, a second cavity 22, and a wick 23; further including a first sheet 11 and a hollow pipe 14. Among them, the first cavity 21 and the second cavity 22 are both flat, and the two constitute a closed cavity in a communicating manner, and are a single component in a T shape; one end of the first cavity 21 is provided as an evaporation end, the other end is provided as a condensation end, and the second cavity 22 is provided as a condensation end; the first part of the wick 23 is provided in the evaporation end inner wall surface with a certain thickness, and the second part of the wick 23 is provided in the lower 1 / 2 space in the width direction of the second cavity 22, and partially occupies the lower 1 / 2 space, the first part and the second part are connected, so that the capillary force in the wick 23 is continuous, realizing continuous hydraulic conduction and stable backflow. The second part of the wick 23 can also be regarded as a liquid reservoir, and the second cavity 22 corresponding to the wick 23 except the second part and the connection between the first part and the second part of the wick 23 is used as an airway to improve the steam flow.

[0088] In combination with Figure 1DThe first cavity 21 is coupled to the middle frame of a mobile phone, and the thickness of the first cavity 21 corresponds to the thickness of the shell, for example, 0.25 mm. The thickness of the air channel in the first cavity 21 is as low as 0.05-0.1 mm. Even if the length is 60 mm and the width is 30 mm, the volume of the air channel of the first cavity 21 is extremely small, and the thermal resistance is significantly improved. The second cavity 22 is coupled to the gap between the two batteries placed left and right along the width direction of the mobile phone. The thickness of the second cavity 22 corresponds to the thickness of the shell, for example, 1 mm. The thickness of the air channel in the second cavity 22 is 0.8 mm. When the screen of the mobile phone is placed horizontally upwards, the second part of the liquid absorption core 23 is located at the lower part, and the upper part of the second part serves as the air channel of the second cavity, which significantly increases the volume of the air channel of the first cavity 21, obtains lower thermal resistance, larger heat exchange area, and realizes stronger heat flux.

[0089] It should be noted that the second cavity can be one or more, and if there are multiple second cavities, the spatial relationship between the second cavities includes parallel and orthogonal. The first cavity can be one or more, and further form, for example, one second cavity and two first cavities coupled to the two side surfaces in the width direction of the second cavity, and the first cavity is orthogonal to the second cavity, thereby obtaining a I-shaped heat dissipation piece. Further, the first cavities can be the same direction and the same end coupled to the top surface and the bottom surface of the heat source (such as CPU).

[0090] It should be noted that the side surface in the width direction of the second cavity, that is, the side surface pointed to by the width direction of the second cavity, in other words, the side surface is perpendicular to the width direction. Similarly, the side surface in the thickness direction of the first cavity, that is, the side surface pointed to by the thickness direction of the first cavity, in other words, the side surface is perpendicular to the thickness direction.

[0091] Second aspect embodiment

[0092] Specifically, the fins are used to enhance heat exchange and support the inner wall surface corresponding to the isolation channel, prevent the isolation channel from being easily deformed under pressure, and enhance the overall structural strength of the heat pipe. For example, the fin thickness is 0.1 mm, the length is 5 mm, the length direction is parallel to the axial direction of the heat pipe, to reduce the resistance of the fluid flow in the isolation channel, the top of the fin height direction is coupled to the inner wall surface of the isolation channel, and the number of fins is multiple, arranged in an array. The isolation channel can also have an internal support structure or an external support structure to enhance the structural strength of the isolation channel. In some embodiments, the fin can be regarded as a type of internal support structure of the isolation channel.

[0093] Optionally, the inner wall of the isolation channel corresponding to the composite heat pipe is provided with a first structure with a certain thickness for absorbing moisture in the air, which releases heat by evaporating the moisture when heated. The first structure can be selected from materials with moisture absorption and coated on all or part of the inner wall of the isolation channel.

[0094] In one embodiment, the composite phase change heat transfer device is applied to a mobile phone, and the device stack inside the mobile phone is arranged in three sections along the length direction (front section, middle section, and rear section). The CPU is arranged in the front section, and the battery is arranged in the middle section. The two ends of the L-shaped composite heat pipe correspond to the two sections of the L-shaped composite heat pipe, and the two sections are arranged in the plate-shaped cavity formed by the front side of the battery and the gap between the front section and the middle section. The other section is arranged in the plate-shaped gap between the left side of the battery and the inner side of the mobile phone frame. The benefits are that the mobile phone is provided with a middle frame, the middle frame is coupled with a super-thin vapor chamber, the end of the section is coupled (or bonded) to the super-thin vapor chamber, and the L-shaped composite heat pipe guides heat to the frame.

[0095] Optionally, one end of the composite heat pipe is coupled to the CPU and other heat sources, such as through a heat-conducting member to transfer heat to one end of the composite heat pipe, or through a plate-shaped cavity arranged perpendicular to the thickness direction of the mobile phone. The plate-shaped cavity is sealed through a side opening and the corresponding opening of the composite heat pipe, and the plate-shaped cavity and the cavity corresponding to the composite heat pipe are in communication and jointly form an integrated closed cavity that is vacuumed and filled with working medium. The plate-shaped cavity is arranged in the wick and connected to the wick in the composite heat pipe.

[0096] Alternatively, the bottom side of the composite heat pipe in the width direction is bonded to the top surface of the vapor chamber (VC) in the thickness direction of the middle frame of the mobile phone. One end of the vapor chamber is coupled to the CPU and other heat sources. The benefits are that the composite heat pipe can be one or more, the composite heat pipe is orthogonal to the vapor chamber, which further improves the overall strength of the mobile phone, and the composite heat pipe improves the heat dissipation area and dimension. The size of the vapor chamber can be more flexible.

[0097] In another embodiment, the composite heat pipe is applied to a mobile phone provided with two batteries, which are arranged in the front 1 / 3 and rear 1 / 3 regions along the length direction of the mobile phone, respectively. The SoC (system on chip) is arranged in the middle 1 / 3 region. The number of composite heat pipes is selected from two, which are arranged in the gap between the front 1 / 3 region and the middle 1 / 3 region, and the gap between the middle 1 / 3 region and the rear 1 / 3 region.

[0098] The top surface of the SoC, such as a CPU, is coupled to a super-thin vapor chamber located in the middle frame of the mobile phone, and the composite heat pipe is also coupled to the super-thin vapor chamber. The composite heat pipe can be one or more, and the composite heat pipe is orthogonal to the vapor chamber, so that the overall strength of the mobile phone is further improved, and the composite heat pipe improves the heat dissipation area and the heat dissipation dimension, so that the size of the vapor chamber can be more flexible. Further, the top surface in the width direction of the composite heat pipe can be coupled to a graphene heat dissipation film, further increasing the heat dissipation dimension.

[0099] In another implementation, the top surface of the SoC, such as a CPU, is coupled to a super-thin vapor chamber of a certain size (for example, a thickness of 0.25 mm), and one pair of side surfaces is coupled to one side surface of the composite heat pipe in the width direction. The coupling can be bonding corresponding to the outer wall surface, or each of the outer wall surfaces can be provided with a slit of the same size, and the slit is sealed to obtain a single member formed by a closed cavity in communication. The single member is still essentially a gas-liquid two-phase heat transfer device subjected to processes such as vacuumization and filling of working medium, and the super-thin vapor chamber is connected to the wick of the composite heat pipe.

[0100] Third aspect embodiment

[0101] The second cavity described above is arranged in a plate-shaped gap between a stack of components in the mobile phone, and the two side surfaces in the width direction of the second cavity are respectively attached or bonded to the adjacent stack of components, thereby conducting heat to the adjacent components or the frame. The frame coupled to the second cavity can be provided with a hollow structure to further enhance the heat accumulation in the mobile phone to be transmitted out through the hollow structure in the form of air convection, and the hollow structure can also prevent the skin from touching the second cavity.

[0102] The nanofluid has a higher heat exchange efficiency than the water body. Nanofluid refers to dispersing metal or non-metal nano-powder into traditional heat exchange medium such as water, alcohol, oil, etc. to prepare a new type of heat exchange medium with uniformity, stability and high thermal conductivity. The thermal conductivity of traditional heat exchange medium is low, which has gradually failed to meet the increasing demand for industrial engineering heat exchange. The thermal conductivity of some metal or non-metal nanoparticles is often hundreds or even thousands of times that of the heat exchange medium. For example, the thermal conductivity of common silicon carbide nanoparticles is 170-270 W / m·K. Uniform and stable dispersion of nanoparticles in heat exchange medium will greatly improve its thermal conductivity. Nanofluid technology has a very broad application prospect and potential economic value in the field of heat transfer enhancement, and is known as "the cooling and heat dissipation technology of the future".

[0103] The terminal can also include products such as air conditioners, refrigerators, and other devices that generate heat when operating.

[0104] Please refer toFigure 2 Fig. 1 shows a structural schematic diagram of a first embodiment of the third aspect of the present application. As shown, the structural schematic diagram is a cross-sectional view, comprising a first sheet 11, a phase-change heat transfer piece 12, a wick 13, and a hollow duct 14. The first sheet 11 is in a planar sheet shape, and the phase-change heat transfer piece 12 is a vapor chamber. The wick 13 is of a certain thickness and is arranged on the inner wall of the vapor chamber. The outer wall of the vapor chamber is provided with a plurality of grooves, and the first sheet 11 is coupled to the top of the highest groove, so that the bottom surface of the first sheet 11 and the cavity inside the groove form the hollow duct 14. The embodiment is particularly suitable for notebook computers and tablet computers, and can realize miniaturization of active heat dissipation systems inside notebook computers or tablet computers, obtain higher heat exchange performance, and have the advantages of dustproof, moistureproof, noise reduction, power saving, etc. Figure 2 It should be noted that, for example, one side of the first cavity in the thickness direction, specifically, either one of the two side surfaces of the first cavity corresponding to the outer wall of the tube shell in the thickness direction of the first cavity, in other words, either one of the two side surfaces of the first cavity corresponding to the outer wall of the tube shell is orthogonal to the thickness direction of the first cavity, or the side surface perpendicular (pointing) to the thickness direction of the first cavity, constitutes a spatial relationship in which the thickness direction of the first cavity is perpendicular to the side surface.

[0105] Fourth aspect embodiment

[0106] The fourth aspect of the present application provides an isolation channel, characterized in that it comprises the isolation channel according to any one of the first to third aspects described above, or the hollow channel according to any one of the first or third aspects described above.

[0107] It should be noted that the step numbers (if any) in the specification and claims of the present application and the drawings are only for the convenience of explanation of the specific embodiments, and do not serve as a limitation on the execution sequence of the steps. The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and do not necessarily describe a specific sequence or chronological order. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the term "above" in the expression of quantity indicates two or more than two. The terms "include", "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0108]

[0109] ​It should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by up, down, front, back, left, right, inner, outer, top, bottom, etc. (if any) is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0110] The above description is only the preferred embodiments of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application; in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In order to avoid unnecessary repetition, the present application does not further describe various possible combinations.

Claims

1. A composite phase change heat transfer device, characterized by, Comprise: a main body, and an isolated channel coupled to the main body; wherein, the main body corresponds to a structure type of a phase change heat transfer element, and the phase change heat transfer element corresponds to a structure type of a heat pipe, a vapor chamber, or a loop; the isolated channel corresponds to a structure type comprising: being enclosed by an inner wall of a first sheet, and the first sheet being tubular and fitted on an outer wall of the phase change heat transfer element, so that the inner wall of the first sheet and the outer wall of the phase change heat transfer element are at a certain distance or partially attached at a fitted position, thereby obtaining a first hollow channel enclosed by the inner wall of the first sheet and the outer wall of the phase change heat transfer element, and the first hollow channel is configured as a first continuous cavity closed except for two ports thereof, or, being enclosed by an inner wall of a first sheet and a part of an outer wall of the main body, and two side edges of the first sheet facing each other are bonded to the outer wall of the phase change heat transfer element, thereby obtaining a second hollow channel enclosed by the inner wall of the first sheet and the outer wall of the phase change heat transfer element, and the second hollow channel is configured as a second continuous cavity having two ports and being closed except for the two ports thereof.

2. The composite phase change heat transfer device of claim 1, wherein The second hollow channel further comprises: the first sheet is rectangular sheet-shaped, and the phase change heat transfer element corresponds to a structure type of a heat pipe; the heat pipe is flat tube-shaped, and two pairs of side edges of the rectangular sheet-shaped corresponding to the structure type are bonded to one side of the heat pipe in the width direction, thereby obtaining the isolated channel, and a part of the inner wall of the isolated channel is formed by a part of the outer wall of the heat pipe.

3. The composite phase change heat transfer device of claim 2, wherein, The fluid in the isolated channel directly contacts the part of the outer wall of the heat pipe and flows along the length direction of the heat pipe to continuously exchange heat.

4. The composite phase change heat transfer device of claim 2, wherein The second hollow channel is located on the left side and / or the right side of the heat pipe without increasing the thickness of the heat pipe.

5. The composite phase change heat transfer device of claim 4, wherein, The heat pipe is bonded to one side of the main board in the thickness direction, and one end of the heat pipe is coupled to the heat source, thereby saving space in the thickness direction of the notebook computer or the tablet computer.

6. The composite phase change heat transfer device of claim 1, wherein The second hollow channel further comprises: two side edges of the first sheet facing each other are bonded to the side of the heat pipe in the width direction, thereby obtaining the second hollow channel enclosed by one side of the first sheet and one side of the heat pipe in the width direction.

7. The composite phase change heat transfer device of claim 6, wherein The thickness direction of the heat pipe is perpendicular to the thickness direction of a notebook computer, a tablet computer, or a mobile phone; the second hollow channel is located on the top side and / or the bottom side of the heat pipe, or the second hollow channel is located on the top side and / or the bottom side of the heat pipe instead of being located on the left side and / or the right side of the heat pipe.

8. The composite phase change heat transfer device of claim 1, wherein, The second hollow channel further comprises: the first sheet is a rectangular copper sheet, the main body is the flat tube-shaped heat pipe, two side edges corresponding to the length of the rectangular copper sheet are parallel to the axis of the heat pipe and are bonded to two sides in the width direction of the heat pipe, and the two sides are perpendicular to the width direction of the heat pipe, thereby forming an integrated composite heat pipe structure.

9. The composite phase change heat transfer device of claim 8, wherein, The surface of the copper sheet is subjected to an oxidation-resistant treatment.

10. The composite phase change heat transfer device of claim 1, wherein, The second hollow channel further comprises: the structure type corresponding to the phase change heat transfer element is the uniform heat plate, one side of the uniform heat plate in the thickness direction is provided with one or more grooves, the grooves are covered with the first sheet, one pair of side edges of the first sheet is bonded to the top end of the groove corresponding wall surface, and then the bottom surface of the first sheet and the inner cavity of the groove form the second hollow channel.

11. The composite phase change heat transfer device of claim 1, wherein The isolation channel is arranged at the condensation end of one end of the phase change heat transfer element, and is used for enhancing the condensation of the gas phase working medium in the condensation end, so as to accelerate the reflux.

12. The composite phase change heat transfer device of claim 1, wherein The first hollow channel or the second hollow channel constitutes a hollow channel, and the hollow channel is used for passing a fluid; the fluid includes a gas or a liquid, the gas includes air, and the liquid includes water. The hollow channel further comprises: two ports thereof are respectively connected with an inlet pipe and an outlet pipe, so that the fluid sequentially passes through the inlet pipe, the hollow channel and the outlet pipe without leakage along the way; or, The two ports thereof are respectively connected with the inlet pipe and the outlet pipe, so that the fluid sequentially passes through the inlet pipe, the hollow channel and the outlet pipe without leakage along the way, and the opening end of the outlet pipe is blocked by an end cover, and then the corresponding circulation of the fluid includes sequentially passing through the inlet pipe, the hollow channel, the outlet pipe to the end cover, and then passing through the outlet pipe, the hollow channel and the inlet pipe; or, One port thereof is connected with the inlet pipe, and the other port is bonded to the outer wall surface of the main body, and then the corresponding circulation of the fluid includes sequentially passing through the inlet pipe, the hollow channel to the bonding position corresponding to the other port without leakage along the way, and then passing through the hollow channel and the inlet pipe.

13. The composite phase change heat transfer device of claim 1, wherein The phase change heat transfer element further comprises: A multidirectional extension phase change heat transfer structure; the multidirectional extension phase change heat transfer structure is configured to have a first cavity extending along a first plane, and a second cavity extending along a second plane and coupled to the first cavity; wherein, The structure type corresponding to the first cavity or the second cavity includes a flat shape; one end corresponding to the first cavity or the second cavity is provided as an evaporation end of the multidirectional extension phase change heat transfer structure; The spatial relationship corresponding to the first plane and the second plane includes orthogonality; The connection relationship corresponding to the first cavity and the second cavity includes that the first cavity and the second cavity are communicatively connected to form a closed cavity, or the first cavity and the second cavity are not connected to form a closed cavity respectively; The local space or the whole space corresponding to the first cavity or the second cavity is provided with a liquid absorption core, or the local space corresponding to the first cavity and the second cavity is provided with a liquid absorption core.

14. The composite phase change heat transfer device of any one of claims 1 to 13, wherein, Further comprising: A power unit coupled to at least one of the isolation channel or the opening near the two end openings, which is used to force the flow of the fluid in the isolation channel; wherein, The product type corresponding to the power unit includes a pump; the product type corresponding to the pump includes an air pump or a water pump, and the corresponding structure type includes an axial flow type or a radial flow type.

15. The composite phase change heat transfer device of claim 14, wherein, The direction of the fluid driven by the pump is from the evaporation end to the condensation end of the phase change heat transfer element.

16. The composite phase change heat transfer device of any one of claims 1 to 13, wherein, The phase-change heat transfer component further comprises a fan and fins.

17. A composite heat pipe for use in an electronic device comprising a cell phone, a tablet or a laptop, the electronic device comprising: The composite heat pipe comprises the heat pipe and the isolation channel in the composite phase-change heat transfer device of any one of claims 1-9, 11, 12, and one or more fins are arranged on the outer wall of the heat pipe and in the isolation channel.

18. The composite heat pipe of claim 17, wherein, The heat pipe is configured as a flat tubular closed cavity, and the thickness direction of the heat pipe is perpendicular to the thickness direction of the electronic device; and The corresponding axis shape of the heat pipe comprises a straight line or an L shape; the L shape is bent around an axis corresponding to the width direction, and the two segments on both sides of the bent part correspond to the preset positions of one segment arranged on one side of the battery in the electronic device and the other segment arranged on the inner side of the frame of the electronic device; and The closed cavity is provided with a wick, and the corresponding preset structure of the wick comprises a plane parallel to the axis of the closed cavity and extending along the thickness direction of the closed cavity, which divides the closed cavity into an upper cavity and a lower cavity, and the entire space of the lower cavity is occupied by the wick.

19. The composite heat pipe of claim 17, wherein, The inner wall of the isolation channel of the composite heat pipe is provided with a first structure with a certain thickness for absorbing moisture in the air, and the first structure releases heat by evaporating the moisture when heated.

20. The composite heat pipe of claim 19, wherein, The first structure is selected from a material with moisture absorption and covers all or part of the inner wall of the isolation channel.

21. A terminal, corresponding product types include mobile phones, laptops, tablets, desktop computers, servers, LED lamps, projectors, lasers, chargers or battery packs, characterized in that, The terminal comprises the composite phase-change heat transfer device of any one of claims 1 to 16, or the composite heat pipe of any one of claims 17-20.

22. The terminal according to claim 21, characterized by The mobile phone comprises: The phase-change heat transfer component of the composite phase-change heat transfer device corresponds to a structure type further comprising a multi-directional extension phase-change heat transfer structure; the multi-directional extension phase-change heat transfer structure is configured to have a first cavity extending along a first plane and a second cavity extending along a second plane coupled to the first cavity; wherein the first cavity or the second cavity corresponds to a structure type comprising a flat shape; one end of the first cavity or the second cavity corresponds to an evaporation end of the multi-directional extension phase-change heat transfer structure; the first plane and the second plane correspond to a spatial relationship comprising orthogonality; the first cavity and the second cavity correspond to a connection relationship comprising a closed cavity in communication, or a closed cavity respectively; the first cavity or the second cavity corresponds to a partial space or an entire space provided with a wick, or the first cavity and the second cavity correspond to a partial space provided with a wick; The mobile phone further comprises: The middle frame connected to the frame is coupled with the first cavity; one side of the first cavity in the thickness direction is coupled with the second cavity; wherein The first cavity has a thickness direction perpendicular to the extension direction of the middle frame, and one end is arranged as an evaporation end; the first cavity and the second cavity are both flat and orthogonally configured as a T shape or an inverted T shape. The second cavity is arranged in a plate-shaped gap between a stack of components in the mobile phone; the components include a battery; the thickness direction of the plate-shaped gap is perpendicular to the thickness direction of the mobile phone; the preset position of the gap includes the front side of the battery along the length direction of the mobile phone and the stack of components facing the front side, or a certain width of the gap formed by the battery arranged adjacent and in the same layer, or a certain width of the gap formed between the frame and the components; the front side is perpendicular to the length direction of the mobile phone; the second cavity is coupled to the bottom side of the gap, which occupies a certain depth of the gap corresponding to the width of the shell; and the gap other than the second cavity corresponding to the shell is used to set the isolation channel included in the composite phase change heat transfer device.

23. The terminal according to claim 21, characterized by The mobile phone comprises: A gas pump is arranged; wherein the gas pump is arranged in a containing cavity arranged near the inside of the frame of the mobile phone, and the containing cavity is used to contain the gas pump; The containing cavity further comprises: a first part which is configured to be open on the first side and is coupled to the frame vertically, and an opening is arranged on the second side facing the first side; wherein the opening is connected to a port of an independent air duct isolated from the internal space of the mobile phone, and the other port of the air duct is coupled to the second part of the frame; the corresponding structure type of the air duct includes the isolation channel included in the composite phase change heat transfer device; The gas pump further comprises: a pluggable part configured to facilitate dust removal, and the outer wall surface of the pluggable part is provided with a plurality of first conductive contacts; the first conductive contacts are used to enable the gas pump to obtain power supply to start working after the pluggable part is inserted into the containing cavity; the inner wall surface of the containing cavity is provided with second conductive contacts corresponding to the first conductive contacts, and the second conductive contacts are connected to the battery; or, the second conductive contacts are arranged to be fixed to the containing cavity.

24. The terminal of claim 21, wherein, The notebook computer comprises: The notebook computer comprises: One or more channels are arranged on one side in the thickness direction of the vapor chamber; the channels are covered with a first sheet included in the composite phase change heat transfer device; one side of the first sheet facing the corresponding wall surface of the channel is bonded to the top end of the channel, thereby forming the isolation channel included in the composite phase change heat transfer device.

25. The terminal of claim 21, wherein, The notebook computer comprises: A water pump is arranged; wherein the water pump is used to drive a liquid fluid, the liquid fluid includes water or nanofluid, the liquid fluid is arranged in an independent water channel isolated from the internal space of the notebook computer, and the corresponding structure type of the water channel includes the isolation channel included in the composite phase change heat transfer device; Or There is a separate water channel isolated from the internal space of the notebook computer; two ports of the water channel are respectively coupled to the side frames of the notebook computer; the two ports are used to connect the water outlet and water inlet of a water-cooled heat dissipation device outside the notebook computer, and the water-cooled heat dissipation device contains a power part for driving liquid fluid to circulate in the water channel; wherein the corresponding structure type of the water channel includes the isolated channel included in the composite phase change heat transfer device; the liquid fluid includes water or nanofluid.

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