An optical module

By setting up the light emitting chip array and the light receiving chip array in the optical module, and using the filter film layer of the lens assembly and the coating layer, high-precision beam combining and splitting of multi-wavelength signal light is achieved, and the coupling accuracy of existing optical modules is solved The problem of insufficient meets the data center's demand for high speed, small size and low cost.

CN114384647BActive Publication Date: 2025-01-10HISENSE BROADBAND MULTIMEDIA TECH
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Patent Information

Application Number
CN202011120982.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-10-19
Publication Date
2025-01-10
Estimated Expiration
2040-10-19

AI Technical Summary

Technical Problem

When existing optical modules realize photoelectric conversion of multi-wavelength channels, the coupling accuracy is insufficient, making it difficult to meet the data center's demand for high speed, small size and low cost.

Method used

An optical module was designed to achieve beam combining and beam splitting of signals of different wavelengths by setting up an optical emitting chip array and light receiving chip array on the circuit board, and using the filter film layer of the lens assembly and the coating layer, thereby improving the optical module. coupling accuracy in.

Benefits of technology

High-precision beam combining and splitting of multi-wavelength signal light is realized, which improves the coupling accuracy of optical modules when coupling multi-channels, and meets the data center's demand for high-speed, small size and low cost.

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Abstract

The present application discloses an optical module, wherein a first lens assembly and a circuit board form a first accommodating cavity, wherein the first accommodating cavity is provided with a light emitting chip array and a first collimating lens array in sequence from bottom to top, and a first reflection surface and a second convergence reflection surface are provided on the surface of the first lens assembly, and a third reflection surface is provided on the inner upper wall of the first accommodating cavity, wherein the third reflection surface is a coating layer, which is provided in parallel with the first reflection surface; the coating layer comprises a plurality of filter film layers distributed in parallel. In the optical module provided by the present application, the combination of multiple signal lights of different wavelengths is completed only through the first reflection surface and the third reflection surface provided by the first lens assembly, thereby improving the coupling accuracy when coupling multiple channels in the optical module.
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Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] One of the core links of fiber-optic communication is the conversion between optical and electrical signals. Fiber-optic communication uses optical signals carrying information to transmit in optical fiber / optical waveguide and other information transmission equipment. The passive transmission characteristics of light in optical fiber / optical waveguide can achieve low-cost and low-loss information transmission; while information processing equipment such as computers use electrical signals. In order to establish an information connection between information transmission equipment such as optical fiber / optical waveguide and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0003] At present, optical modules are an important component of modern optical communication networks. They provide Gbit high-speed data physical channels for communication networks, and optical transmitters and receivers are the core components of optical modules. With the rapid construction and upgrading of data center networks, data centers have put forward requirements for optical modules such as multi-wavelength channels, high speed, small size, and low cost. Summary of the invention

[0004] The present application provides an optical module capable of realizing photoelectric conversion of multiple wavelength channels.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] The embodiment of the present application discloses an optical module device, comprising: a circuit board; a light emitting chip array, arranged on the circuit board, for emitting signal lights of different wavelengths;

[0007] A first collimating lens array is arranged in the light emitting direction of the light emitting chip and is used to converge the signal light;

[0008] A first lens assembly, which is covered above the collimating lens array and forms a first accommodating cavity with the circuit board;

[0009] Wherein: the top of the lens assembly is provided with a first reflecting surface and a second converging reflecting surface; the first reflecting surface is an inclined surface;

[0010] A third reflective surface is disposed on the inner upper wall of the first accommodating cavity, and the third reflective surface is a coating layer disposed parallel to the first reflective surface; the coating layer includes a plurality of filter film layers;

[0011] The signal light enters the first lens assembly through different filter film layers, and is reflected and combined by the first reflection surface and the third reflection surface;

[0012] The second converging reflective surface is disposed on one side of the first reflective surface, and is used to converge and reflect the combined signal light to the first optical fiber array;

[0013] The first lens assembly is provided with a first optical fiber array fixing hole for fixing the first optical fiber array.

[0014] Optionally, the first lens assembly is a split structure, and the first lens assembly includes: a support body and a main body; the support body cover is arranged on the circuit board, and the support body and the main body are plugged and fixed; the third reflection surface is arranged on the bottom surface of the main body.

[0015] Optionally, the second converging reflective surface is arranged between the first reflective surface and the first optical fiber fixing hole, and the end face of the optical fiber array is arranged at the converging focus of the second converging reflective surface; the projection of the first reflective surface on the circuit board covers the third reflective surface; and the projection of the third reflective surface on the circuit board covers the light emitting chip array.

[0016] Optionally, the filter film layer corresponds to the light emitting chip array and is used to achieve selective transmission of signal light of corresponding wavelength.

[0017] Optionally, the first optical fiber fixing hole includes: a first mounting groove, a second mounting groove, and a third mounting groove that are connected in sequence;

[0018] The first mounting groove is plugged into the cladding of the first optical fiber array;

[0019] The second mounting groove is plugged into the protective cover of the first optical fiber array;

[0020] The third installation groove is plugged into the line collection rubber sleeve of the first optical fiber array.

[0021] In the optical module provided by the present application, the first lens assembly and the circuit board form a first accommodating cavity, and the first accommodating cavity is provided with a light emitting chip array and a first collimating lens array in sequence from bottom to top, and the surface of the first lens assembly is provided with a first reflection surface and a second convergent reflection surface, and a third reflection surface is provided on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating layer, which is arranged parallel to the first reflection surface; the coating layer includes a plurality of filter film layers. The light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit a plurality of signal lights of different wavelengths, and the signal lights are in a scattered state at this time, and are formed into parallel lights after being collimated and focused by the first collimating lens array, and the plurality of parallel lights of different wavelengths are transmitted to the film layer of the third reflection surface. A light beam of one wavelength is transmitted to the first reflection surface through a filter film layer of the third reflection surface, and is totally reflected by the first reflection surface to another filter film layer of the third reflection surface. At this time, a light beam of another wavelength passes through another filter film layer of the third reflection surface, is combined with the reflected light beam and is transmitted to the first reflection surface, and is totally reflected by the first reflection surface to the third reflection surface, repeating the previous combination to complete the combination of multiple signal lights of different wavelengths, and finally generate a signal light beam, which is reflected by the second converging reflection surface and converged into the optical fiber ribbon, realizing the simultaneous transmission of signal lights of multiple wavelengths in a single optical fiber. In the optical module provided by the present application, the combination of multiple signal lights of different wavelengths is completed only through the first reflection surface and the third reflection surface set by the first lens assembly, thereby improving the coupling accuracy when coupling multiple channels in the optical module.

[0022] On the other hand, the present application also provides an optical module, including: a circuit board;

[0023] A second lens assembly is disposed above the circuit board and forms a second accommodating cavity with the circuit board;

[0024] Wherein: a fourth reflection surface and a fifth convergent reflection surface are arranged at the top of the lens assembly; the fourth reflection surface is an inclined surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodating cavity, and the sixth reflection surface is arranged parallel to the fourth reflection surface; the sixth reflection surface comprises a plurality of filter film layers;

[0025] The fifth converging reflective surface is used to converge and reflect the signal light and transmit it to the sixth reflective surface; and then the sixth reflective surface cooperates with the fourth reflective surface to split and reflect the signal light;

[0026] An optical receiving chip array is arranged on the circuit board and is used to receive signal lights of different wavelengths;

[0027] The second collimating lens array is arranged in the light incident direction of the light receiving chip and is used to converge the signal light; the second lens assembly is provided with a second optical fiber array fixing hole for fixing the second optical fiber array.

[0028] Optionally, the second lens assembly is a split structure, and the second lens assembly includes: a support body and a main body; the support body cover is arranged on the circuit board and is plugged and fixed with the main body; the sixth reflection surface is arranged on the bottom surface of the main body.

[0029] Optionally, the fifth converging reflective surface is arranged between the fourth reflective surface and the second optical fiber fixing hole, and the port of the optical fiber array is arranged at the converging focus of the fifth converging reflective surface; the projection of the fourth reflective surface on the circuit board covers the sixth reflective surface; and the projection of the sixth reflective surface on the circuit board covers the optical receiving chip array.

[0030] Optionally, the filter film layer corresponds to the light receiving chip array and is used to achieve selective transmission of signal light of corresponding wavelength.

[0031] Optionally, the second optical fiber fixing hole includes: a fourth mounting groove, a fifth mounting groove, and a sixth mounting groove which are connected in sequence;

[0032] The fourth mounting groove is plugged into the cladding of the second optical fiber array;

[0033] The fifth mounting groove is plugged into the protective cover of the second optical fiber array;

[0034] The sixth installation groove is plugged into the line collection sleeve of the second optical fiber array.

[0035] The beneficial effects of this application are:

[0036] In the optical module provided by the present application, the second lens assembly and the circuit board form a second accommodating cavity, in which the optical receiving chip assembly and the second collimating lens array are sequentially arranged from bottom to top, and the top surface of the second lens assembly is provided with a fourth reflection surface and a fifth convergent reflection surface; a sixth reflection surface is provided on the inner upper wall of the second accommodating cavity, and the sixth reflection surface is arranged parallel to the fourth reflection surface; the sixth reflection surface comprises a plurality of filter film layers. A beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, and the beam of signal light is reflected by the fifth convergent reflection surface and converges to the sixth reflection surface, wherein a beam of light with one wavelength passes through the sixth reflection surface, and a beam of light with the remaining wavelength is reflected to the fourth reflection surface, and then reflected to the sixth reflection surface through the fourth reflection surface, and a beam of light with another wavelength passes through the sixth reflection surface, and a beam of light with the remaining wavelength is reflected to the fourth reflection surface, so that a beam of signal light with different wavelengths is demultiplexed into multiple beams of signal light with different wavelengths, and is sequentially transmitted to the optical receiving chip in the optical receiving chip array after passing through the second collimating lens array, so as to realize the function of the optical module receiving signal light with multiple wavelengths in a single optical fiber. In the optical module provided in the present application, only the fourth reflection surface and the sixth reflection surface provided by the second lens assembly are used to split a beam of signal lights of different wavelengths, thereby improving the coupling accuracy when coupling multiple channels in the optical module.

[0037] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] Figure 1 It is a schematic diagram of the connection relationship of optical communication terminals;

[0040] Figure 2 is a schematic diagram of the structure of an optical network unit;

[0041] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0042] Figure 4 A schematic diagram of the decomposed structure of an optical module provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of the structure of an optical module provided in an embodiment of the present application after removing the upper housing, the lower housing and the unlocking component;

[0044] Figure 6 A schematic diagram of a partial decomposition structure of an optical module provided in an embodiment of the present application;

[0045] Figure 7 A local light path diagram of the light emission process of the optical module provided in an embodiment of the present application;

[0046] Figure 8 A schematic diagram of a first lens assembly and a first collimating lens array structure provided in an embodiment of the present application Figure 1 ;

[0047] Fig. 9 A first lens assembly and a first collimating lens array cross section provided in an embodiment of the present application Figure 1 ;

[0048] Fig.10 A structure of a first collimating lens array provided in an embodiment of the present application Figure 1 ;

[0049] Fig.11 A schematic diagram of a first lens assembly and a first collimating lens array structure provided in an embodiment of the present application Figure 2 ;

[0050] Fig.12A first lens assembly and a first collimating lens array cross section are provided. Figure 2 ;

[0051] Fig.13 A structure of a first collimating lens array provided in an embodiment of the present application Figure 2 ;

[0052] Fig.14 A three-dimensional lens assembly of a first lens assembly provided in an embodiment of the present application Figure 1 ;

[0053] Fig.15 A three-dimensional lens assembly of a first lens assembly provided in an embodiment of the present application Figure 2 ;

[0054] Fig.16 A cross section of a first lens assembly provided in an embodiment of the present application Figure 1 ;

[0055] Fig.17 A schematic diagram of a first lens assembly structure provided in an embodiment of the present application Figure 1 ;

[0056] Fig.18 A cross section of a first lens assembly provided in an embodiment of the present application Figure 2 ;

[0057] Fig.19 A schematic diagram of the main structure of a first lens assembly provided in an embodiment of the present application;

[0058] Fig. 20 A schematic diagram of a first optical fiber array structure provided in an embodiment of the present application Figure 1 ;

[0059] Fig.21 A schematic diagram of a first optical fiber fixing hole structure provided in an embodiment of the present application;

[0060] Fig. 22 A first optical fiber array structure provided in an embodiment of the present application is schematically shown Figure 2 ;

[0061] Fig.23 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 1 ;

[0062] Fig.24 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 2 ;

[0063] Fig.25 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 3;

[0064] Fig.26 An exploded structural diagram of a second lens assembly and a second collimating lens array provided in an embodiment of the present application;

[0065] Fig. 27 A structural diagram of another second lens assembly and a second collimating lens array provided in an embodiment of the present application;

[0066] Fig.28 A local optical path diagram of the optical transmission and reception process of the optical module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0067] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0068] One of the core links of fiber-optic communication is the conversion between optical and electrical signals. Fiber-optic communication uses optical signals carrying information to transmit in optical fiber / optical waveguide and other information transmission equipment. The passive transmission characteristics of light in optical fiber / optical waveguide can achieve low-cost and low-loss information transmission; while information processing equipment such as computers use electrical signals. In order to establish an information connection between information transmission equipment such as optical fiber / optical waveguide and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0069] Optical modules realize the above-mentioned mutual conversion function of optical and electrical signals in the field of optical fiber communication technology. The mutual conversion of optical signals and electrical signals is the core function of optical modules. Optical modules realize electrical connection with external host computers through the gold fingers on their internal circuit boards. The main electrical connections include power supply, I2C signals, data signals and grounding. The electrical connection method realized by gold fingers has become the mainstream connection method in the optical module industry. Based on this, the definition of the pins on the gold fingers has formed a variety of industry protocols / specifications.

[0070] Figure 1 Figure 1 is a schematic diagram of the connection relationship of optical communication terminals. Figure 1 As shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

[0071] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0072] The optical port of the optical module 200 is connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100; the mutual conversion between the optical signal and the electrical signal is realized inside the optical module, so as to establish an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

[0073] The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a bidirectional electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used to access the network cable 103 and establish a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. The optical network terminal acts as a host computer of the optical module to monitor the operation of the optical module.

[0074] At this point, the remote server establishes a two-way signal transmission channel with the local information processing device through optical fiber, optical module, optical network terminal and network cable.

[0075] Common information processing equipment includes routers, switches, and electronic computers. The optical network terminal is the host computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module. Other common optical module host computers include optical line terminals.

[0076] Figure 2 Figure 1 is a schematic diagram of the optical network terminal structure. Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of the optical module such as the gold finger; a heat sink 107 is arranged on the cage 106, and the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0077] The optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

[0078] The cage 106 is located on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module, and the heat generated by the optical module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

[0079] Figure 3 A schematic diagram of an optical module structure provided by an embodiment of the present invention, Figure 4 The present invention provides an optical module decomposition structure diagram. Figure 3 , Figure 4 As shown, the optical module 200 provided in the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300 and an optical transceiver device.

[0080] The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body. Specifically, the lower shell includes a main board and two side panels located on both sides of the main board and perpendicular to the main board; the upper shell includes a cover plate, which is covered on the two side panels of the upper shell to form a wrapping cavity; the upper shell may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side panels to achieve the upper shell covering the lower shell.

[0081] The two openings can be two end openings (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204, and the gold finger of the circuit board extends from the electrical port 204 and is inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect the optical transceiver device inside the optical module; the circuit board 300, the optical transceiver device and other optoelectronic devices are located in the package cavity.

[0082] The upper shell and the lower shell are combined to facilitate installation of the circuit board 300, optical transceiver and other devices into the shell. The upper shell and the lower shell form the outermost packaging protection shell of the optical module. The upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation. The shell of the optical module is generally not made into an integrated component. In this way, when assembling components such as circuit boards, positioning components, heat dissipation and electromagnetic shielding components cannot be installed, which is not conducive to production automation.

[0083] The unlocking component 203 is located on the outer wall of the cavity / lower shell 202 and is used to achieve a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0084] The unlocking component 203 has a locking component that matches the cage of the host computer; pulling the end of the unlocking component can make the unlocking component move relatively on the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the locking component of the unlocking component fixes the optical module in the cage of the host computer; by pulling the unlocking component, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module and the host computer, so that the optical module can be pulled out of the cage of the host computer.

[0085] The circuit board 300 is provided with an optical transmitting chip, a driving chip of the optical transmitting chip, an optical receiving chip, a transimpedance amplifier chip, a limiting amplifier chip and a microprocessor chip, etc., wherein the optical transmitting chip and the optical receiving chip are directly mounted on the circuit board of the optical module. This form is called COB (chip on board) packaging in the industry.

[0086] The circuit board connects the electrical components in the optical module according to the circuit design through circuit routing to achieve electrical functions such as power supply, electrical signal transmission and grounding.

[0087] Circuit boards are generally rigid circuit boards. Rigid circuit boards can also perform load-bearing functions due to their relatively hard material. For example, rigid circuit boards can stably carry chips. When optical transceivers are located on the circuit boards, rigid circuit boards can also provide stable load-bearing. Rigid circuit boards can also be inserted into electrical connectors in the cage of the host computer. Specifically, metal pins / gold fingers are formed on the end surface of one side of the rigid circuit board for connecting to the electrical connector. These are not easy to achieve with flexible circuit boards.

[0088] The optical transceiver device includes an optical transmitting component and an optical receiving component, which are used to transmit and receive optical signals respectively. The optical transmitting component and the optical receiving component can be combined or independent of each other. This application mainly introduces the optical transmitting component as an example.

[0089] Figure 5 This is a schematic diagram of the structure of the optical module provided in the embodiment of the present application after removing the upper shell, the lower shell and the unlocking component. Figure 6 , which is a schematic diagram of a partial decomposition structure of an optical module provided in an embodiment of the present application.

[0090] like Figure 5As shown, the light emitting chip array 310 is arranged on the circuit board 300, and is used to emit signal light of different wavelengths. Further, in the present embodiment, the light emitting chip array 310 is defined as rows along the length direction of the circuit board 300; and is defined as columns along the length direction of the circuit board 300. In order to realize the beam combining of light of different wavelengths, a plurality of light emitting chips of different wavelengths are arranged in the same row, and this application takes 4 as an example; the same column can be light emitting chips of different wavelengths, or light emitting chips of the same wavelength. The number of columns of the light emitting chip array 310 can be 1 column, 2 columns, 3 columns or 4 columns, which can be set according to the actual needs of the optical module. In the present embodiment, the light emitting chip array 310 is set to a 4-row 4-array mode.

[0091] Further, if Figure 6 FIG. 1 is a schematic diagram of a partial decomposition structure of an optical module provided in an embodiment of the present application. In some embodiments, in an optical module provided in an embodiment of the present application, the first lens assembly 400 and the circuit board 300 form a first accommodating cavity that encloses the optical chip assembly, and the light emitting chip array 310 and the first collimating lens array 320 are sequentially arranged from the circuit board 300 to the first lens assembly 400.

[0092] The first collimating lens assembly 320 is covered above the light emitting chip array 310, and the number of lenses of the first collimating lens array 320 depends on the number of chips in the light emitting chip array 310. Usually, the number of lenses of the first collimating lens assembly 320 is equal to the number of chips in the light emitting chip array 310. In order to realize the installation of the first collimating lens assembly 320, the first collimating lens array 320 is provided with a collimating lens bracket, and the collimating lens bracket is connected and fixed to the circuit board 300.

[0093] Figure 7 The local optical path diagram of the optical module light emission process provided in the embodiment of the present application is combined with Figure 7 As shown, the signal light emitted by the light emitting chip array 310 is scattered light, which forms a parallel light beam after passing through the first collimating lens array 320 and irradiates the first lens assembly 400. In this embodiment, the first collimating lens array 320 has 4 rows and 4 columns, and the setting of the rows and columns is consistent with the direction of the rows and columns of the light emitting chip array.

[0094] The first lens assembly 400 is disposed on the circuit board 300, and is disposed above the light emitting chip array in a cover-type manner. The first lens assembly 400 and the circuit board 300 form a first accommodating cavity that wraps the light emitting chip array. The signal light emitted by the light emitting chip array enters the optical fiber array after being reflected and converged by the first lens assembly. The first lens assembly not only seals the optical chip, but also establishes an optical connection between the optical chip and the optical fiber. The first lens assembly is used to transmit a light beam and change the transmission direction of the light beam during the transmission process. In use: the light emitted by the light emitting chip in the light emitting chip array is transmitted and reflected by the first lens assembly and then enters the optical fiber. The first lens assembly not only seals the optical chip, but also establishes an optical connection between the light emitting chip and the optical fiber.

[0095] High-speed data transmission requires that the optical chip and its driver / matching chip be set close to each other to shorten the connection between the chips and reduce the signal loss caused by the connection. The first lens assembly 400 is set above the optical chip, so the first lens assembly generally covers the optical chip and its driver / matching chip at the same time. Therefore, the optical transmitter chip and the driver chip of the optical transmitter chip are set close to each other, and the first lens assembly covers the optical transmitter chip and the driver chip of the optical transmitter chip; the optical receiver chip and the transimpedance amplifier chip are set close to each other, and the first lens assembly covers the optical receiver chip and the transimpedance amplifier chip.

[0096] The size of each optical chip is generally small, while the size of the driver / matching chip of the optical chip is generally large, especially the driver / matching chip that achieves a rate of more than 100G. However, the size of the first lens assembly is limited, and there are certain restrictions on the setting positions of the optical chip and its driver / matching chip, without much spatial freedom.

[0097] further, Figure 8 A schematic diagram of a first lens assembly and a first collimating lens array structure is provided. Figure 1 . Fig. 9 A first lens assembly and a first collimating lens array cross section are provided. Figure 1 , Fig.10 A structure of a first collimating lens array Figure 1 . Combined Figure 8 , Fig. 9 and Fig.10 As shown, the first collimating lens array 320 is a support structure. The first lens assembly 400 is covered above the circuit board 300. The first lens assembly 400 and the circuit board 300 are assembled to form a closed cavity. The first collimating lens array 320 and the light emitting chip array 310 are arranged in the cavity.

[0098] Specifically, the support structure may include symmetrically arranged pillars and a flat plate arranged between the pillars, on which a collimating lens is arranged. The flat plate may be arranged at the top of the pillar, and the other end of the pillar is fixedly connected to the circuit board 300, so that a certain gap is formed between the first collimating lens array 320 and the circuit board 300, leaving space for the arrangement of the light emitting chip array 310.

[0099] The support structure can be a split structure or an integrated structure. In order to facilitate the assembly process and avoid the mismatch between the collimating lens and the optical chip optical path, the first collimating lens array 320 is an integrated structure to ensure the distance between the first collimating lens array 320 and the circuit board 300, and to ensure that the position between the flat plate and the pillar remains accurate, avoiding errors during the installation process, which is conducive to improving the stability of the entire optical module optical path.

[0100] Fig.11 A schematic diagram of a first lens assembly and a first collimating lens array structure is provided. Figure 2 . Fig.12 A first lens assembly and a first collimating lens array cross section are provided. Figure 2 ; Fig.13 A structure of a first collimating lens array Figure 2 .

[0101] Combination Fig.11 , Fig.12 and Fig.13 As shown, the first collimating lens array 320 is a flat plate structure, and the bottom end of the first lens assembly 400 has a first bearing surface 423 and a second bearing surface 422. The first bearing surface 423 is used to bear one end of the first collimating lens array 320, and the second bearing surface 422 is used to bear the other end of the first collimating lens array 320. The position of the lens in the first collimating lens array 320 corresponds to the position of the optical chip, and is not necessarily set at the center of the first collimating lens array.

[0102] The flat plate structure of the first collimating lens array 320 can be set to a horizontal I-shape, with both ends placed horizontally on the corresponding supporting surfaces, and a plurality of collimating lenses are arranged on the surface of the main plate in the middle of the I-shaped flat plate, and the plurality of collimating lenses are arranged on the surface of the main plate in the form of an array.

[0103] Furthermore, in order to facilitate the assembly of the first collimating lens array 320 and the first lens assembly 400, the first bearing surface 423 and the second bearing surface 422 of the first lens assembly 400 are connected to the side of the first lens assembly 400, so that the packaging cavity formed after the first lens assembly 400 and the circuit board 300 are assembled is not completely sealed, and an opening is set on the side of the first lens assembly 400, and the first collimating lens array 320 can be inserted and connected from the outside to the inside of the first lens assembly 400 at the opening position.

[0104] Fig.14 A three-dimensional lens assembly of a first lens assembly provided in an embodiment of the present application Figure 1 ; Fig.15 A three-dimensional lens assembly of a first lens assembly provided in an embodiment of the present application Figure 2 ; Fig.16 A cross section of the first lens assembly provided in the embodiment of the present application Figure 1 ; Fig.17 Schematic diagram of the first lens assembly provided in the embodiment of the present application Figure 1 .

[0105] Combination Fig.14 and Fig.15 As shown, the first lens assembly 400 includes: a first reflection surface 411, a second convergent reflection surface 412, a third reflection surface 413, and a first optical fiber fixing hole 414. The first reflection surface 411 and the second convergent reflection surface 412 are arranged on the top upper surface of the first lens assembly 400. The first reflection surface 411 is an inclined surface, and the inclination angle is consistent with that of the upper surface of the first lens assembly 400.

[0106] The third reflective surface 413 is disposed on the inner upper wall of the first accommodating cavity. The third reflective surface 413 is a coating layer and is disposed parallel to the first reflective surface 411. The signal light enters the third reflective surface 143 through different positions of the coating layer, and then is reflected toward the third reflective surface 413 through the first reflective surface 411, so as to realize the combination of signal lights of different wavelengths. The coating layer is provided with a plurality of filter film layers, and signal lights of different wavelengths are emitted into the first lens assembly 400 through different filter film layers.

[0107] The arrangement of the filter film layer corresponds to the arrangement of the light emitting chips, so as to achieve the combination of light with different wavelengths. For example, if four light emitting chips with different wavelengths are arranged in the same row of the light emitting chip array, then the coating layer needs to be provided with four different corresponding filter film layers. Furthermore, if the light emitting chips with the same wavelength are arranged in the same column in the light emitting chip array, then the filter film layers in the same column are the same sub-film layer, or may be a whole film layer covering the entire column direction. If the light emitting chips with different wavelengths are arranged in the same column in the light emitting chip array, then the filter film layers in the same column are different sub-film layers. Normally, in order to simplify the production process, light emitting chips with the same wavelength are arranged in the same column in the light emitting chip array. For example Fig.16As shown, the second converging reflective surface 412 is an inclined surface, provided with an arc-shaped protrusion, and the arc-shaped protrusion protrudes toward the outside of the first lens assembly 400, and the second converging reflective surface 412 is arranged on the side of the first reflective surface 411 away from the end of the circuit board 300, and the second converging reflective surface 412 is provided with an arc-shaped protrusion. The second converging reflective surface 412 is arranged between the first reflective surface 411 and the first optical fiber fixing hole 414, and is used for the transmission of the combined signal light between the second converging reflective surface 412 and the first optical fiber array 500. The surface of the second converging reflective surface in the present application is an arc, so that the second converging reflective surface 420 has a converging function, and no additional converging lens is required.

[0108] Combination Figure 7 As shown, in the light emitting device, the light emitting chip array 310 is a plurality of lasers. The embodiment of the present application takes a row of 4 light emitting chips as an example, and the signal light of four wavelengths emitted by the laser is converged into parallel light by the first collimating lens assembly 320. Four beams of parallel light are respectively incident on different filter film layers of the third reflection surface 413, and after multiple reflections in conjunction with the first reflection surface 411, the four beams of parallel light are incident on the second convergent reflection surface 412 together. The second convergent reflection surface 412 reflects and converges the light beams and transmits them to the first optical fiber array 500. The position of the optical fiber hole coincides with the position of the light beam convergence spot, ensuring that the light spot can reach the first optical fiber array, completing the coupling and transmission of light.

[0109] The wavelength of the first outgoing light emitted by the first laser 311 is λ1, the wavelength of the second outgoing light emitted by the second laser 312 is λ2, the wavelength of the third outgoing light emitted by the third laser 313 is λ3, and the wavelength of the fourth outgoing light emitted by the fourth laser 314 is λ4. The third reflection surface 413 is provided with a first filter film layer 4131, a second filter film layer 4132, a third filter film layer 4133, and a fourth filter film layer 4134, which only allow light beams of corresponding wavelengths to pass through, and reflect light beams of other wavelengths.

[0110] The first outgoing light is converged by the first collimating lens array 320 to form a parallel light beam, and reaches the first filter film layer 4131. The first filter film layer 4131 can allow light with a wavelength of λ1 to pass through. The first outgoing light is slightly refracted in the first filter film layer 4131 and is transmitted to the first reflection surface 411. After being reflected by the first reflection surface 411, the first outgoing light is transmitted to the second filter film layer 4132 and is reflected for the second time in the second filter film layer 4132.

[0111] The wavelength of the second outgoing light emitted by the second laser 312 is λ2. The second outgoing light forms a parallel light beam after being collimated by the first collimating lens assembly 320 and reaches the second filter film layer 4132. The second filter film layer 4132 allows light with a wavelength of λ2 to pass through. After entering the first lens assembly 400, the second outgoing light is combined with the first outgoing light for the first time to form a combined light beam. Then, according to the optical path diagram, the second outgoing light beam is combined with the third outgoing light beam and the fourth outgoing light beam in sequence to form a final combined light beam.

[0112] The final combined light beam is reflected and converged by the second converging reflective surface 412 and then transmitted to the first optical fiber array 500. To improve the light coupling accuracy, the end face of the first optical fiber array 500 is arranged at the convergence focus position of the second converging reflective surface 412, and the center line of the first optical fiber array 500 coincides with the center light beam of the second converging reflective surface 412. After the signal light beam is finally generated and transmitted to the second converging reflective surface 420, it is reflected by the second converging reflective surface 420 and converged into the first optical fiber array.

[0113] Furthermore, in order to realize multiple reflections of the light between the first reflection surface and the third reflection surface so that the light can be transmitted sequentially, the first reflection surface 411 is a total reflection surface.

[0114] The inclination angle of the third reflection surface is consistent with the inclination angle of the top plate of the first lens assembly 400. The angle is related to the spacing between optical chips of different wavelengths and is generally between 4-17°.

[0115] In some embodiments, in order to realize the transmission of the light beam between the first collimating lens array 320 and the second converging reflective surface 412, a certain angle is set between the first reflective surface 411 and the plane of the circuit board 300, and the light beam is reflected multiple times to realize the transmission of the light beam between the first collimating lens array 320 and the second converging reflective surface 412.

[0116] further, Fig.18 A schematic diagram of the structure of a first lens assembly is provided. Figure 2 ; Fig.19 A schematic diagram of the main structure of a first lens assembly is provided. Fig.18 and Fig.19 As shown, the first lens assembly 400 includes: a support body 420 and a main body 410. The main body 410 is provided with a first reflection surface 411, a second convergent reflection surface 412, a third reflection surface 413, a first optical fiber fixing hole 414, and a first cavity 440. The first reflection surface 411 and the second convergent reflection surface 412 are provided on the upper surface of the main body 410. The first reflection surface 411 is an inclined surface, and the inclination angle is consistent with that of the upper surface of the main body 410.

[0117] The support body 420 is covered on the circuit board 300 and is plugged and fixed with the main body 410. The support body 420 can be a rectangular column with a hollow interior formed by four brackets connected end to end. The support body 420 is provided with a plurality of fixing holes 421. A plurality of positioning posts 415 are provided on the bottom surface of the main body 410, and the positions and sizes of the fixing holes 421 and the positioning posts 415 are matched to achieve the plugging of the fixing holes 421 and the positioning posts 415.

[0118] Specifically, two fixing holes 421 may be provided on the support body 420, which are respectively located at diagonally opposite corners of the support body 420. In order to facilitate the assembly connection between the main body 410 and the support body 420 and the stability after assembly, the connection surface between the main body 410 and the support body 420 is a plane arranged parallel to the circuit board 300. Then, the main body 410 forms a first cavity 440. Further, in order to ensure the integrity of the coating layer during the coating process of the third reflective surface 413, the vertical height of the first cavity 440 cannot be too large. Therefore, the first cavity 440 of the main body 410 has a small space and cannot accommodate the light emitting chip array 310 and the first collimating lens array 320. The second cavity 430 inside the support body 420 is used to accommodate the light emitting chip array 310 and the first collimating lens array 320. The second cavity 430 is connected to the first cavity 440 to ensure the transmission of the signal light.

[0119] Fig.19 A schematic diagram of the main structure of a first lens assembly provided in an embodiment of the present application. The third reflection surface 413 is arranged on the bottom surface of the main body 410. In order to realize the beam combining or beam splitting effect of the optical module on the signal light, the third reflection surface 413 is a coating layer, and the coating layer includes a plurality of parallel distributed film layers to filter signal lights of different wavelengths. Or the third reflection surface 413 is a plurality of parallel distributed filters, and the filters are connected to the bottom surface of the main body by optical glue. The third reflection surface 413 is arranged parallel to the first reflection surface 411, and the projection of the third reflection surface 413 in the direction of the circuit board 300 covers the optical chip assembly, so that the third reflection surface 413 can receive all signal lights emitted or received by the optical chip. The projection of the first reflection surface 411 in the direction of the circuit board 300 covers the third reflection surface 413, so that the first reflection surface can process all signal lights to prevent signal loss.

[0120] Furthermore, the main body 410 and the support body 420 of the first lens assembly 400 are integrally formed, so that the position and size between the first optical fiber fixing hole 414 and the second converging reflection surface 412 are very stable, thereby improving the connection accuracy between components, thereby improving the coupling accuracy when coupling multiple channels in COB technology.

[0121] Furthermore, the first lens assembly 400 can also be an integrated structure. The integrated molding structure has high precision and avoids errors in the assembly process, so that the position and size between the first optical fiber fixing hole 414 and the second converging reflection surface 412 are very stable, thereby improving the connection accuracy between components, thereby improving the coupling accuracy when coupling multiple channels in COB technology.

[0122] The end face of the first optical fiber array 500 is arranged at the convergence focus position of the second convergence reflection surface 412, and the center line of the first optical fiber array 500 coincides with the center light of the second convergence reflection surface 412, so as to ensure the beam coupling accuracy. The position of the first optical fiber positioning hole coincides with the position of the beam convergence spot, so as to ensure that the spot can reach the first optical fiber array, so as to complete the coupling and transmission of light.

[0123] Fig. 20 A schematic diagram of a first optical fiber array structure provided in an embodiment of the present application Figure 1 ; Fig.21 A schematic diagram of a first optical fiber fixing hole structure provided in an embodiment of the present application. Fig. 20 and Fig.21 As shown, in order to ensure the positional relationship between the first optical fiber array 500 and the second converging reflective surface 412 so that the position of the first optical fiber array 500 is stable, the first optical fiber fixing hole 414 includes: a first mounting groove 4141 and a second mounting groove 4142, and the first mounting groove 4141 is internally connected to the second mounting groove 4142.

[0124] The first optical fiber array 500 includes: an inner core 510, a cladding 520 and a sheath 530; the cladding 520 is arranged between the inner core 510 and the sheath 530, the first mounting groove 4141 is matched with the cladding 520 of the first optical fiber array 500; the second mounting groove 4142 is matched with the sheath 530. The first optical fiber fixing hole 414 is fixedly connected to the first optical fiber array 500 by optical glue. In order to avoid bending of the first optical fiber array 500 and affect the service life of the first optical fiber array, the first mounting groove 441 and the second mounting groove 442 are coaxially arranged.

[0125] Further, in some embodiments, Fig. 22 , schematic diagram of the first optical fiber array structure Figure 2It is a schematic diagram of the structure of the first optical fiber array 500 from another angle. In order to bind multiple optical fibers into a whole, a collection rubber sleeve 540 is provided on the outer layer of the first optical fiber array 500 for collecting multiple optical fibers. The first optical fiber fixing hole 414 also includes: a third mounting groove 443, and the third mounting groove 443 matches the collection rubber sleeve 540. In order to avoid bending of the first optical fiber array 500 during installation, which affects the service life of the first optical fiber array, the first mounting groove 4141, the second mounting groove 4142, and the third mounting groove 4143 are coaxially arranged, so that the portion of the first optical fiber array in the first optical fiber fixing hole is arranged in a straight line to avoid bending that affects the service life, and the first lens assembly 400 is an integrally formed structure as a whole, the position of the light fixing hole is very stable, and the distance between the first optical fiber array and the second converging reflection surface 412 is fixed.

[0126] In order to facilitate the connection and fixation of the first optical fiber array 500 with the first optical fiber fixing hole 414, transition grooves are respectively arranged between the first mounting groove 4141, the second mounting groove 4142, and the third mounting groove 4143, and the outer edge of the transition groove is inclined from one mounting groove to the adjacent mounting groove, so that a smooth transition is made between the first mounting groove 4141, the second mounting groove 4142, and the third mounting groove 4143, thereby avoiding a contact dead angle between a single first optical fiber array and the mounting groove during the plug-in process, which affects the plug-in effect; ensuring that the end face of the first optical fiber array is arranged at the convergence focus of the second converging reflection surface 412, thereby improving the light coupling accuracy.

[0127] Meanwhile, after the first optical fiber array 500 is plugged and matched with the first optical fiber fixing hole 414 , there is a certain gap in the transition groove, so colloid is added in the gap to fix the first optical fiber array 500 and the first optical fiber fixing hole 414 .

[0128] Furthermore, in order to avoid affecting the transmission of the signal light beam in the first lens assembly 400, the colloid added to the gap portion is optical glue, which ensures the connection and fixation between the first optical fiber array 500 and the first optical fiber fixing hole 414 while ensuring the transmission of the signal light.

[0129] The embodiment of the present application also provides another method for connecting the first optical fiber array and the first lens assembly. Fig.23 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 1 , Fig.24 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 2 , Fig.25 A first lens assembly and an optical fiber support structure provided in an embodiment of the present application Figure 3 . Combined Fig.23 , Fig.24 and Fig.25As shown, the optical module also includes: a first optical fiber bracket 600. The first optical fiber bracket 600 includes: a bracket positioning hole 601 and a first optical fiber slot 602. The bracket positioning hole 601 is arranged on the side of the first optical fiber bracket 600, and is respectively arranged at both ends of the side. The first lens assembly 400 is provided with a bracket positioning column 417, which matches the position and size of the bracket positioning hole 601. During assembly, the bracket positioning column 415 is plugged into the bracket positioning hole 601 to achieve the connection between the first optical fiber bracket 600 and the first lens assembly 400.

[0130] Furthermore, to facilitate assembly, a guide groove 603 is provided on the bottom surface of the first optical fiber bracket 600, and a guide rail 416 is provided on the first lens assembly 400 to match the guide groove 603. During assembly, the operator can first match the guide rail 416 with the guide groove 603, and then push the first optical fiber bracket 600 toward the first lens assembly 400 for installation, which can avoid assembly deviation. At the same time, the cooperation between the guide rail 416 and the guide groove 603 makes assembly easier.

[0131] The upper surface of the first optical fiber bracket 600 is provided with a first optical fiber slot 602 for carrying the first optical fiber array 500. Further, in order to realize the connection between the first optical fiber array 500 and the first optical fiber bracket 600, an optical fiber hole 604 is provided on the side of the first optical fiber bracket 600 for fixing the end face of a single optical fiber, ensuring that the end face of the single optical fiber is set at the convergence focus of the second convergence reflection surface, thereby improving the coupling accuracy.

[0132] The optical module provided in the present application can realize multi-wavelength channels, independent light paths emitted by lasers of different wavelengths, and realize the function of combining multiple light paths. The first lens assembly is provided with a first optical fiber fixing hole for positioning the first optical fiber array. Among them, the first lens assembly is an integrated molding structure. Because it is mass-produced by integrated molding mold processing, the position and size of the hole relative to the second converging reflection surface are very stable. Such a design is both precise and simple to assemble. The alignment of the optical path with the first optical fiber array can be completed with a very simple process, the coupling of light can be completed, and the light coupling accuracy can be improved.

[0133] Next, the light receiving element will be described.

[0134] In the embodiment of the present application, the structure of the second lens assembly 400A is similar or identical to that of the first lens assembly 400. For the convenience of description, the lens assembly in light emission is defined as the first lens assembly, and the lens assembly in light reception is defined as the second lens assembly. Fig.26 An exploded structural diagram of a second lens assembly and a second collimating lens array provided in an embodiment of the present application; Fig. 27 This is another structural diagram of a second lens assembly and a second collimating lens array provided in an embodiment of the present application. Fig.26As shown in Figure 27, the second lens assembly 400A and the circuit board 300 form a second accommodating cavity, and the second accommodating cavity is used to set up optical devices. Specifically, from the circuit board 300 to the top, the second accommodating cavity is sequentially provided with a light receiving chip array 310A and a second collimating lens array 320A. In addition, the top surface of the second lens assembly 400A is provided with a fourth reflection surface 411A and a fifth convergent reflection surface 412A. The sixth reflection surface 413A is provided on the upper wall of the inner side of the second accommodating cavity, and the sixth reflection surface 413A is provided in parallel with the fourth reflection surface 411A. The sixth reflection surface 413A includes multiple filter film layers.

[0135] The optical receiving chip array 310A includes multiple optical receiving chips for receiving multiple signal light beams of different wavelengths, wherein the optical receiving chips are arranged in the form of an array, and optical receiving chips are provided in the length and width directions of the circuit board, wherein a row of optical receiving chips in the length direction is set as a group, so that multiple groups of optical receiving chips can be set.

[0136] The second collimating lens array 320A includes a plurality of collimating lenses for the signal light output by the second lens assembly 320A. The structure of the second collimating lens array 320A is similar to or the same as the structure of the first collimating lens array 320. The second collimating lens array 320A is covered above the light receiving chip array 310A, and the number of lenses of the second collimating lens array 400A depends on the number of light receiving chips in the light receiving chip array 310A. Usually, the number of lenses of the second collimating lens array 400A is equal to the number of light receiving chips in the light receiving chip array 310A.

[0137] The sixth reflective surface 413A has the same or similar structure as the third reflective surface 413, and the sixth reflective surface 413A includes a plurality of filter film layers arranged in parallel. In the embodiment of the present application, the sixth reflective surface 413A uses different film layers arranged at different positions to transmit and reflect signal lights of different wavelengths, thereby splitting a beam of signal lights including different wavelengths into multiple beams of light. The sixth reflective surface 413A coordinates and selects the number of reflections of each wavelength of signal light according to the type of wavelength of the split light and the number of split beams.

[0138] Specifically, a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the signal light is reflected by the fifth converging reflection surface 412A and converged to the sixth reflection surface 413A. A light beam of one wavelength is incident on its corresponding collimating lens through the sixth reflection surface 413A, and a light beam of the remaining wavelength is reflected to the fourth reflection surface 411A. After being reflected to the sixth reflection surface 413A by the fourth reflection surface 411A, a light beam of another wavelength is transmitted through the sixth reflection surface 413A, and a light beam of the remaining wavelength is reflected to the fourth reflection surface 411A, thereby completing the demultiplexing of a signal light beam with different wavelengths into multiple signal lights of different wavelengths, which are collimated by the second collimating lens array 320A and transmitted sequentially to the optical receiving chip in the optical receiving chip assembly, thereby realizing the function of the optical module receiving signal lights of multiple wavelengths in a single optical fiber.

[0139] Fig.28 The local optical path diagram of the optical module light transmission and reception process provided in the embodiment of the present application. In the optical receiving device, the optical receiving chip array 310A is a plurality of optical receiving chips. The embodiment of the present application takes a row of 4 optical receiving chips as an example.

[0140] A beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 400A, and the signal light is reflected by the fifth converging reflection surface 412A and converged to the sixth reflection surface 413A. The signal light includes four wavelengths of λ1, λ2, λ3 and λ4. Since light is reversible, it is reflected and filtered by the sixth reflection surface 413A and the fourth reflection surface 411A to achieve the splitting of a beam of signal light with different wavelengths.

[0141] In the embodiment of the present application, any unfinished parts about the second lens assembly 400A can refer to the first lens assembly 400. The second collimating lens array 320A has the same structure as the first collimating lens array 320; the second optical fiber array has the same structure as the first optical fiber array 500, and both can refer to each other.

[0142] In the optical module provided by the present application, the structures of the first lens assembly 400 and the second lens assembly 400A in the light emitting process and the light receiving process are completely consistent, and the light detectors and lasers can be arranged in an array in sequence, which can save space. The light emitting device and the light receiving device are arranged in the same lens assembly, which improves space utilization, reduces the number of light module components, and simplifies the assembly process.

[0143] The lens assembly is simultaneously covered above the light emitting chip array or the light receiving chip array, so as to facilitate the use of fewer devices to change the propagation direction of the signal light emitted by the light emitting chip or the signal light from outside the optical module. In the embodiment of the present application, the light emitting chip array and the light receiving chip array can be covered by the first lens assembly and the second lens assembly respectively; they can also be covered by the same lens assembly. Furthermore, in the embodiment of the present application, the number of columns of the first lens array can be 1, or 2, etc.

[0144] When the light emitting chip array and the light receiving chip array are covered by the same lens assembly, the same collimating lens array and the same optical fiber array can also be used at the same time. It is only necessary to arrange the optical chips in the light emitting chip array and the light receiving chip array in correspondence with the corresponding filter film layers in the lens assembly according to the needs.

[0145] In the optical module provided by the present application, the first lens assembly and the circuit board form a first accommodating cavity, and the first accommodating cavity is provided with a light emitting chip array and a first collimating lens array in sequence from bottom to top, and the surface of the first lens assembly is provided with a first reflection surface and a second convergent reflection surface, and a third reflection surface is provided on the inner upper wall of the first accommodating cavity, and the third reflection surface is a coating layer, which is arranged parallel to the first reflection surface; the coating layer includes a plurality of filter film layers. The light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit a plurality of signal lights of different wavelengths, and the signal lights are in a scattered state at this time, and are formed into parallel lights after being collimated and focused by the first collimating lens array, and the plurality of parallel lights of different wavelengths are transmitted to the film layer of the third reflection surface. A light beam of one wavelength is transmitted to the first reflection surface through a filter film layer of the third reflection surface, and is totally reflected by the first reflection surface to another filter film layer of the third reflection surface. At this time, a light beam of another wavelength passes through another filter film layer of the third reflection surface, is combined with the reflected light beam and is transmitted to the first reflection surface, and is totally reflected by the first reflection surface to the third reflection surface, repeating the previous combination to complete the combination of multiple signal lights of different wavelengths, and finally generate a signal light beam, which is reflected by the second converging reflection surface and converged into the optical fiber ribbon, realizing the simultaneous transmission of signal lights of multiple wavelengths in a single optical fiber. In the optical module provided by the present application, the combination of multiple signal lights of different wavelengths is completed only through the first reflection surface and the third reflection surface set by the first lens assembly, thereby improving the coupling accuracy when coupling multiple channels in the optical module.

[0146] In the optical module provided by the present application, the second lens assembly and the circuit board form a second accommodating cavity, in which the optical receiving chip assembly and the second collimating lens array are sequentially arranged from bottom to top, and the top surface of the second lens assembly is provided with a fourth reflection surface and a fifth convergent reflection surface; a sixth reflection surface is provided on the inner upper wall of the second accommodating cavity, and the sixth reflection surface is arranged parallel to the fourth reflection surface; the sixth reflection surface comprises a plurality of filter film layers. A beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, and the beam of signal light is reflected by the fifth convergent reflection surface and converges to the sixth reflection surface, wherein a beam of light with one wavelength passes through the sixth reflection surface, and a beam of light with the remaining wavelength is reflected to the fourth reflection surface, and then reflected to the sixth reflection surface through the fourth reflection surface, and a beam of light with another wavelength passes through the sixth reflection surface, and a beam of light with the remaining wavelength is reflected to the fourth reflection surface, so that a beam of signal light with different wavelengths is demultiplexed into multiple beams of signal light with different wavelengths, and is sequentially transmitted to the optical receiving chip in the optical receiving chip array after passing through the second collimating lens array, so as to realize the function of the optical module receiving signal light with multiple wavelengths in a single optical fiber. In the optical module provided in the present application, only the fourth reflection surface and the sixth reflection surface provided by the second lens assembly are used to split a beam of signal lights of different wavelengths, thereby improving the coupling accuracy when coupling multiple channels in the optical module.

[0147] At the same time, the present application also provides an implementation method of disposing a light emitting chip array and a light receiving chip array in the same lens assembly.

[0148] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0149] References throughout this specification to "multiple embodiments", "some embodiments", "one embodiment" or "an embodiment" etc. mean that the specific features, components or characteristics described in conjunction with the embodiment are included in at least one embodiment. Therefore, phrases such as "in multiple embodiments", "in some embodiments", "in at least another embodiment" or "in an embodiment" etc. that appear throughout this specification do not necessarily all refer to the same embodiment. In addition, in one or more embodiments, specific features, components or characteristics may be combined in any suitable manner. Therefore, without limitation, specific features, components or characteristics shown or described in conjunction with one embodiment may be combined in whole or in part with features, components or characteristics of one or more other embodiments. Such modifications and variations are intended to be included within the scope of this application.

[0150] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0151] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the invention herein. The present application is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0152] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light emitting chip array is arranged on the circuit board and is used to emit signal lights of different wavelengths; A first collimating lens array, arranged in the light emitting direction of the light emitting chip, for converging the signal light into parallel light; A first lens assembly, which is covered above the collimating lens array and forms a first accommodating cavity with the circuit board; Wherein: a first reflection surface and a second convergent reflection surface are provided at the top of the first lens assembly; the first reflection surface is an inclined plane; the first reflection surface is a total reflection surface; A third reflective surface is disposed on the inner upper wall of the first accommodating cavity, and the third reflective surface is a coating layer disposed parallel to the first reflective surface; the coating layer includes a plurality of filter film layers; The parallel signal light enters the first lens assembly through different filter film layers, and is reflected and combined by the first reflection surface and the third reflection surface; The second converging reflective surface is disposed on one side of the first reflective surface, and is used to converge and reflect the combined signal light to the first optical fiber array; The first lens assembly is provided with a first optical fiber array fixing hole for fixing the first optical fiber array.

2. The optical module according to claim 1, characterized in that: The second converging reflective surface is arranged between the first reflective surface and the first optical fiber fixing hole, and the end face of the optical fiber array is arranged at the converging focus of the second converging reflective surface; the projection of the first reflective surface on the circuit board covers the third reflective surface; and the projection of the third reflective surface on the circuit board covers the light emitting chip array.

3. The optical module according to claim 1, characterized in that: The filter film layer corresponds to the light emitting chip array and is used to achieve selective transmission of signal light of corresponding wavelength.

4. The optical module according to claim 1, characterized in that: The first optical fiber fixing hole comprises: a first installation groove, a second installation groove, and a third installation groove which are connected in sequence; The first mounting groove is plugged into the cladding of the first optical fiber array; The second mounting groove is plugged into the protective cover of the first optical fiber array; The third installation groove is plugged into the line collection rubber sleeve of the first optical fiber array.

5. An optical module, characterized in that: include: Circuit boards; A second lens assembly is disposed above the circuit board and forms a second accommodating cavity with the circuit board; Wherein: a fourth reflection surface and a fifth convergent reflection surface are arranged at the top of the lens assembly; the fourth reflection surface is an inclined plane, the fourth reflection surface is located at the side of the fifth convergent reflection surface, and the fourth reflection surface is a total reflection surface; a sixth reflection surface is arranged on the inner upper wall of the second accommodating cavity, the sixth reflection surface is arranged parallel to the fourth reflection surface, and the sixth reflection surface is located below the fourth reflection surface; the sixth reflection surface comprises a plurality of filter film layers; The fifth converging reflective surface is used to converge and reflect the signal light and transmit it to the sixth reflective surface; and then the sixth reflective surface cooperates with the fourth reflective surface to split and reflect the signal light; A light receiving chip array is arranged on the circuit board and is used to receive signal lights of different wavelengths; A second collimating lens array is arranged in the light incident direction of the light receiving chip and is used to converge the signal light; The second lens assembly is provided with a second optical fiber array fixing hole for fixing the second optical fiber array.

6. The optical module according to claim 5, characterized in that: The fifth converging reflective surface is arranged between the fourth reflective surface and the second optical fiber fixing hole, and the port of the optical fiber array is arranged at the converging focus of the fifth converging reflective surface; the projection of the fourth reflective surface on the circuit board covers the sixth reflective surface; and the projection of the sixth reflective surface on the circuit board covers the light receiving chip array.

7. The optical module according to claim 5, characterized in that: The filter film layer corresponds to the light receiving chip array and is used to achieve selective transmission of signal light of corresponding wavelength.

8. The optical module according to claim 5, characterized in that: The second optical fiber array fixing hole comprises: a fourth mounting groove, a fifth mounting groove, and a sixth mounting groove which are connected in sequence; The fourth mounting groove is plugged into the cladding of the second optical fiber array; The fifth mounting groove is plugged into the protective cover of the second optical fiber array; The sixth installation groove is plugged into the line collection sleeve of the second optical fiber array.

Citation Information

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