A high precision automated coupling device for optical communication modules

CN122690768APending Publication Date: 2026-09-04ZHONGSHAN SIGE AUTOMATION TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202610911968.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-24
Publication Date
2026-09-04

AI Technical Summary

Technical Problem

在亚微米级的对位精度要求下,线缆自身的重力拖拽、人工接触的微小震动以及插拔瞬间的机械应力,会直接传递至PCB板,导致本已对准的光路瞬间发生偏移

Benefits of technology

1、本发明通过在夹具两侧配置能自动伸出的供电拔插组件与MT头拔插组件,构建了无人工接触式的主动寻光反馈链路,消除了人工触碰和线缆拖拽产生的机械应力与震动,同时,配合上方跨设的驱动机构与执行模组,使得PCB板在夹具内保持锁定的前提下,即可原位完成视觉定位、点胶、动态对准与固化作业,克服了多工位流转带来的二次定位误差,提升了高端光模块的耦合精度与良率。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122690768A_ABST
    Figure CN122690768A_ABST
Patent Text Reader

Abstract

The application relates to the technical field of optical communication device manufacturing, in particular to a high-precision automatic coupling device for an optical communication module, which comprises a rack, a clamp, a driving mechanism, a mounting rack, a power supply plug-pull assembly, an MT head plug-pull assembly and an execution module, the execution module comprises a visual assembly, a coupling assembly, a dispensing assembly and a curing assembly, and is arranged on the two sides of the clamp respectively; the power supply plug-pull assembly and the MT head plug-pull assembly which can automatically extend are arranged on the two sides of the clamp, an active light-seeking feedback link without manual contact is constructed, mechanical stress and vibration caused by manual touching and cable dragging are reduced, meanwhile, the driving mechanism and the execution module are arranged on the upper side, so that the visual positioning, dispensing, dynamic alignment and curing operations can be completed in situ under the premise that the PCB board is locked in the clamp, secondary positioning errors caused by multi-station circulation are overcome, and the coupling precision and yield of high-end optical modules are improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of optical communication device manufacturing technology, specifically to a high-precision automated coupling device for optical communication modules. Background Technology

[0002] In the manufacturing process of high-end optical communication modules, the coupling and alignment between optical lenses (LENS) and the light-emitting or light-receiving chips on the optical communication PCB board is a core process that determines the product's optoelectronic performance. The spatial positional tolerance of LENS is typically required to be at the sub-micron level, making it a sensitive, high-precision assembly process. Existing semi-automated coupling equipment typically uses a multi-axis displacement stage combined with a vision positioning system for initial alignment to address this fundamental issue. Subsequently, the PCB board is illuminated, and the actual emitted light intensity data is read using an external optical power meter to guide the multi-axis displacement stage in micro-motion light-seeking (active alignment). After finding the point of highest optical power, adhesive curing is then performed. However, existing coupling technologies require power cables to be connected to the PCB board and test optical fibers (MT connectors) to be inserted into the optical ports before performing active light-seeking. Current technologies largely rely on manual insertion and removal operations by operators. Under sub-micron level alignment accuracy requirements, the weight of the cables, the minute vibrations from manual contact, and the mechanical stress at the moment of insertion and removal are directly transmitted to the PCB board, causing the initially aligned optical path to momentarily shift. In addition, traditional production lines often separate material feeding, dispensing, alignment, and curing into different workstations. The physical flow of PCB boards between workstations inevitably introduces errors, leading to yield losses. Summary of the Invention

[0003] To address the aforementioned issues, this invention provides a high-precision automated coupling device for optical communication modules. By configuring automatically extending power supply plug-in components and MT head plug-in components on both sides of the fixture, a contactless active light-seeking feedback link is constructed, eliminating mechanical stress and vibration caused by manual touching and cable dragging. Simultaneously, in conjunction with the drive mechanism and execution module mounted above, the PCB board can complete visual positioning, dispensing, dynamic alignment, and curing operations in situ while remaining locked within the fixture. This overcomes secondary positioning errors caused by multi-station transfers and improves the coupling accuracy and yield of high-end optical modules.

[0004] To address the problems of existing technologies, this invention provides a high-precision automated coupling device for optical communication modules, including a frame and a fixture disposed within the frame for locking an optical communication PCB board. The device further includes: a drive mechanism straddling the fixture, the drive mechanism having a mounting bracket capable of moving horizontally and vertically; an execution module mounted on the mounting bracket, the execution module including a vision component, a coupling component, a dispensing component, and a curing component; a power supply plug-in component and an MT head plug-in component, respectively disposed on both sides of the fixture; the power supply plug-in component and the MT head plug-in component are configured to automatically extend and plug into the electrical and optical interfaces of the PCB board, respectively, to establish a closed-loop active light-seeking feedback link; the drive mechanism is configured to sequentially switch the vision component, coupling component, dispensing component, and curing component to directly above the fixture via the displacement of the mounting bracket; before the coupling component performs dynamic alignment of the LENS based on the active light-seeking feedback link, the dispensing component and the curing component are configured to complete the application and curing of adhesive in situ.

[0005] Preferably, a vision component, a coupling component, and an adhesive dispensing component are sequentially distributed horizontally on the mounting bracket; the curing component is arranged below and to the side of the vision component.

[0006] Preferably, the dispensing assembly and the curing assembly are each equipped with a telescopic mechanism; the telescopic mechanism is configured to extend to directly above the clamp when the dispensing assembly or the curing assembly is working; and to retract upward to avoid physical interference when the coupling assembly performs the dynamic alignment of the LENS.

[0007] Preferably, the coupling assembly includes a platform fixedly connected to the mounting bracket, and a first angle adjustment shaft, a pressure sensor, and a vacuum suction cup sequentially connected in series on the platform.

[0008] Preferably, the coupling component further includes a first gripper that is fixedly connected to the side of the platform and can be independently lifted and lowered.

[0009] Preferably, the bottom of the fixture is equipped with a multi-axis adjustment platform, which includes a second angle adjustment axis and an electric slide table stacked on top of each other.

[0010] Preferably, the MT head plugging / unplugging assembly includes a second gripper and a first drive assembly.

[0011] Preferably, the power supply plug-in assembly includes a power supply plug, a multi-axis fine-tuning module, and a second drive assembly.

[0012] Preferably, the curing assembly includes a UV irradiation lamp head and a light shield.

[0013] Preferably, the device further includes a control system configured to control the drive mechanism to move the mounting frame, switching the vision component to directly above the fixture for visual positioning of the PCB board; control the power supply plug-in component and the MT head plug-in component to automatically extend and connect to the electrical and optical interfaces of the PCB board respectively, to establish a closed-loop active light-seeking feedback link; control the drive mechanism to move the mounting frame, sequentially switching the coupling component, dispensing component, and curing component to directly above the fixture; control the dispensing component to apply adhesive to the PCB board; control the coupling component to clamp the LENS and attach it to the PCB board, and perform dynamic alignment of the LENS based on the active light-seeking feedback link; and control the curing component to cure the adhesive in situ while the coupling component keeps the LENS in a locked position.

[0014] The advantages of this invention compared to the prior art are: 1. This invention constructs an active light-seeking feedback link without manual contact by configuring automatically extending power supply plug-in components and MT head plug-in components on both sides of the fixture. This eliminates the mechanical stress and vibration caused by manual touching and cable dragging. At the same time, in conjunction with the drive mechanism and execution module mounted above, the PCB board can complete visual positioning, dispensing, dynamic alignment and curing operations in situ while being locked in the fixture. This overcomes the secondary positioning error caused by multi-station transfer and improves the coupling accuracy and yield of high-end optical modules.

[0015] 2. The present invention arranges vision components, coupling components and dispensing components in sequence along the horizontal direction on the mounting frame, and places the curing component to the side and below the vision components. Through this staggered horizontal spatial layout, the narrow working space above the fixture is reasonably allocated, so that multiple components have independent cutting trajectories, avoiding mutual obstruction and crowding. This provides the necessary physical basis for the drive mechanism to smoothly switch working end faces and ensure the continuity of the in-situ coupling process. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a high-precision automated coupling device for optical communication modules.

[0017] Figure 2 This is a three-dimensional structural diagram of a drive mechanism, fixture, power supply plug-in assembly, MT head plug-in assembly, and execution module in a high-precision automated coupling device for optical communication modules.

[0018] Figure 3 This is a top view of the drive mechanism, fixture, power supply plug-in assembly, MT head plug-in assembly, and execution module in a high-precision automated coupling device for optical communication modules.

[0019] Figure 4 This is a front view of the drive mechanism, fixture, power supply plug-in assembly, MT head plug-in assembly, and execution module in a high-precision automated coupling device for optical communication modules.

[0020] Figure 5 This is a three-dimensional structural diagram of the drive mechanism and execution module in a high-precision automated coupling device used in optical communication modules.

[0021] Figure 6 yes Figure 5 Enlarged view of point A in the middle.

[0022] Figure 7 yes Figure 5 Enlarged view of point B in the middle.

[0023] Figure 8 This is a three-dimensional structural diagram of a clamp, power supply plug-in assembly, and MT head plug-in assembly in a high-precision automated coupling device for optical communication modules.

[0024] Figure 9 yes Figure 8 Enlarged view of point C in the middle.

[0025] Figure 10 yes Figure 8 Enlarged view of point D in the middle.

[0026] The diagram is labeled as follows: 1. Frame; 11. Fixture; 111. Multi-axis adjustment platform; 1111. Second angle adjustment axis; 1112. Electric slide; 12. Power supply plug-in assembly; 121. Power supply plug; 122. Multi-axis fine-tuning module; 123. Second drive assembly; 13. MT head plug-in assembly; 131. Second gripper; 132. First drive assembly; 2. Drive mechanism; 21. Mounting bracket; 22. Execution module; 221. Vision assembly; 222. Coupling assembly; 2221. Platform; 2222. First angle adjustment axis; 2223. Pressure sensor; 2224. Vacuum suction cup; 2225. First gripper; 223. Dispensing assembly; 224. Curing assembly; 2241. UV irradiation lamp head; 2242. Light shield; 3. PCB board; 4. Lens. Detailed Implementation

[0027] To further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0028] like Figures 1 to 4 and Figure 8The image shows a high-precision automated coupling device for optical communication modules, comprising a frame 1 and a clamp 11 disposed within the frame 1 for locking an optical communication PCB board 3; the device further includes: a drive mechanism 2, straddling the clamp 11, the drive mechanism 2 having a mounting frame 21 capable of moving horizontally and vertically; an execution module 22, mounted on the mounting frame 21, the execution module 22 including a vision component 221, a coupling component 222, a dispensing component 223, and a curing component 224; a power supply plug-in component 12 and an MT head plug-in component 13, respectively disposed within the clamp. On both sides of 11; the power supply plug-in assembly 12 and the MT head plug-in assembly 13 are configured to automatically extend and plug into the electrical interface and optical interface of the PCB board 3 respectively to establish a closed-loop active light-seeking feedback link; the drive mechanism 2 is configured to switch the vision assembly 221, coupling assembly 222, dispensing assembly 223 and curing assembly 224 sequentially to the top of the fixture 11 by the displacement of the mounting bracket 21. Before the coupling assembly 222 performs dynamic alignment of LENS4 based on the active light-seeking feedback link, the dispensing assembly 223 and the curing assembly 224 are configured to complete the application and curing of glue in place.

[0029] In the traditional manufacturing of high-precision optical communication modules, the assembly of PCB board 3 often requires multiple independent workstations to sequentially complete processes such as dispensing, LENS4 mounting, power-on testing, and UV curing. This conventional multi-workstation workflow is prone to introducing errors due to mechanical vibration or repositioning during work step switching. Especially when performing high-precision optical path coupling, existing technologies mostly rely on manual insertion of power cables and test optical fibers. The physical stress generated by dragging the cables can directly damage the fragile optical path alignment, making it difficult to improve the coupling yield.

[0030] This device establishes a static coordinate system through the frame 1 and the fixture 11 to stably lock the PCB board 3. Based on this, the device is equipped with a drive mechanism 2, and the execution module 22, which includes a vision component 221, a coupling component 222, a dispensing component 223 and a curing component 224, is highly integrated on its mounting frame 21. By setting the power supply plug-in component 12 and the MT head plug-in component 13 on both sides of the fixture 11, when the PCB board 3 is in place, the power supply plug-in component 12 and the MT head plug-in component 13 can automatically extend and plug into the electrical interface and optical interface of the PCB board 3 respectively, thereby establishing a closed-loop active light-seeking feedback link without any manual contact interference.

[0031] After the electrical circuit and optical path are stably connected, the drive mechanism 2 drives the mounting bracket 21 to move horizontally and vertically, sequentially switching the vision component 221, coupling component 222, dispensing component 223 and curing component 224 to the top of the fixture 11. Through this electromechanical coordination, the coupling component 222 can perform dynamic alignment of LENS4 based on the active light-seeking feedback link, while the PCB board 3 does not need to move at all. The dispensing component 223 and curing component 224 can immediately complete the application and curing of glue in place, avoiding the loss of precision caused by process separation and manual insertion and removal.

[0032] like Figures 2 to 7 As shown: a vision component 221, a coupling component 222, and a dispensing component 223 are sequentially distributed along the horizontal direction on the mounting bracket 21; the curing component 224 is arranged on the lower side of the vision component 221.

[0033] To achieve efficient integration of multiple processes within the limited space above the fixture 11 and to prevent physical collisions, a vision component 221, a coupling component 222, and a dispensing component 223 are sequentially distributed horizontally on the mounting frame 21, while a curing component 224 is positioned to the side and below the vision component 221. This staggered spatial layout allows optical path observation, material gripping, and auxiliary material dispensing to each have their own entry points.

[0034] like Figures 2 to 7 As shown: The dispensing assembly 223 and the curing assembly 224 are respectively equipped with telescopic mechanisms; the telescopic mechanisms are configured to extend to directly above the clamp 11 when the dispensing assembly 223 or the curing assembly 224 is working; and to retract upward to avoid physical interference when the coupling assembly 222 performs the dynamic alignment of the LENS4.

[0035] Furthermore, to address the potential mechanical interference caused by the simultaneous operation of the vision component 221, coupling component 222, dispensing component 223, and curing component 224 in a confined working area, the dispensing component 223 and curing component 224 are each equipped with a telescopic mechanism. In a specific embodiment, this telescopic mechanism can be a pneumatic slide or a high-frequency linear motor. Under electrical logic control, when the dispensing component 223 or curing component 224 needs to work, the corresponding telescopic mechanism drives it to tilt or extend vertically to directly above the fixture 11 for operation. When the coupling component 222 descends to perform dynamic alignment of the LENS4, which requires extremely high space, the telescopic mechanism drives the dispensing needle or UV lamp head to retract upwards. This dynamic avoidance mechanism ensures the safety margin of the core optical components during light-seeking movements.

[0036] like Figures 2 to 7As shown: The coupling component 222 includes a platform 2221 fixedly connected to the mounting bracket 21, and a first angle adjustment shaft 2222, a pressure sensor 2223 and a vacuum suction cup 2224 sequentially connected in series on the platform 2221.

[0037] The coupling component 222 also includes a first gripper 2225 that is fixedly connected to the side of the platform 2221 and can be independently lifted and driven.

[0038] When gripping and bonding fragile optical components such as LENS4, traditional rigid pressing can easily cause the components to break. Therefore, the coupling assembly 222 adopts a composite series configuration, including a platform 2221 fixedly connected to the mounting bracket 21. A first angle adjustment shaft 2222, a pressure sensor 2223, and a vacuum suction cup 2224 are sequentially connected in series on this platform 2221. In a preferred embodiment, the first angle adjustment shaft 2222 can be a servo rotary motor, and the pressure sensor 2223 is a high-precision strain gauge force sensor. When the drive mechanism 2 drives the vacuum suction cup 2224 to descend and contact the PCB board 3, the pressure sensor 2223 feeds back the contact force signal to the electrical system in real time, thereby achieving constant force flexible bonding and effectively avoiding the problem of pressure damage to optical components such as LENS4. Simultaneously, the first angle adjustment shaft 2222 can drive the vacuum suction cup 2224 to perform fine-tuning of the rotation angle in the horizontal plane to meet the posture correction requirements of flat optical components. To expand the compatibility of the coupling component 222 with materials of different shapes, a first gripper 2225 that can be independently lifted and driven is fixedly connected to the side of the platform 2221. The first gripper 2225 extends downward through an independent cylinder to grip structural parts with specific borders or mechanical centering features, thereby realizing dual-channel operation of suction and clamping on the same platform 2221.

[0039] like Figures 2 to 7 As shown: The bottom of the fixture 11 is equipped with a multi-axis adjustment platform 111, which includes a second angle adjustment axis 1111 and an electric slide 1112 stacked on top of each other.

[0040] To ensure that the initial posture of the PCB board 3 can match the working reference plane of the upper execution module 22, the bottom of the fixture 11 is equipped with a multi-axis adjustment platform 111. The multi-axis adjustment platform 111 includes a second angle adjustment axis 1111 and an electric slide 1112 stacked on top of each other. In the early stage of light seeking, the second angle adjustment axis 1111 can perform spatial coplanarity compensation for the pitch or roll angle of the PCB board 3, while the electric slide 1112 below is linked with the coupling component 222 above to perform horizontal position fine adjustment.

[0041] like Figure 2 , Figure 3 , Figures 8 to 10 As shown: The MT head plugging and unplugging assembly 13 includes a second gripper 131 and a first drive assembly 132.

[0042] The power supply plug-in assembly 12 includes a power supply plug 121, a multi-axis fine-tuning module 122, and a second drive assembly 123.

[0043] For the core signal access structures on both sides, the MT head plug-in assembly 13 is equipped with a second gripper 131 and a first drive assembly 132. Specifically, the first drive assembly 132 can be a high-rigidity linear module, which directly provides a stable horizontal thrust, allowing the MT head held by the second gripper 131 to be pushed into the optical interface. Correspondingly, due to the tolerance characteristics of the electrical interface, the power supply plug-in assembly 12 includes a power supply plug 121, a multi-axis fine-tuning module 122, and a second drive assembly 123. During the initial calibration stage of the equipment, technicians can use the multi-axis fine-tuning module 122 to align the relative position of the power supply plug 121 and the PCB board 3. After locking, the second drive assembly 123 pushes the power supply plug 121 in along the set trajectory, effectively improving the reliability of electrical access during batch operations.

[0044] like Figures 2 to 5 As shown: The curing component 224 includes a UV irradiation lamp head 2241 and a light shield 2242.

[0045] In the final photocuring stage, the UV irradiation lamp head 2241 in the curing component 224 performs the irradiation operation. The matching light shield 2242 can move synchronously with the mechanism. Although the curing lamp head itself has directional irradiation capability, the addition of the light shield 2242 can further physically shield the surrounding optical sensors or non-cured adhesive circuits, effectively reducing the risk of aging of the surrounding optical sensors and non-cured adhesive circuits due to UV diffuse reflection.

[0046] like Figures 1 to 4As shown: The device also includes a control system, which is configured to control the drive mechanism 2 to move the mounting frame 21, switching the vision component 221 to directly above the clamp 11 for visual positioning of the PCB board 3; control the power supply plug-in component 12 and the MT head plug-in component 13 to automatically extend and plug into the electrical and optical interfaces of the PCB board 3 respectively, to establish a closed-loop active light-seeking feedback link; control the drive mechanism 2 to move the mounting frame 21, sequentially switching the coupling component 222, the dispensing component 223 and the curing component 224 to directly above the clamp 11; control the dispensing component 223 to apply adhesive to the PCB board 3; control the coupling component 222 to clamp the LENS4 and attach it to the PCB board 3, and perform dynamic alignment of the LENS4 based on the active light-seeking feedback link; and control the curing component 224 to cure the adhesive in situ while the coupling component 222 keeps the LENS4 in a locked position.

[0047] By incorporating a control system into the device, in one specific embodiment, the control system employs a combination of a high-performance industrial control computer and a motion control card, with built-in closed-loop control logic. Its operational sequence is as follows: First, the drive mechanism 2 moves the mounting bracket 21, switching the vision component 221 to directly above the fixture 11 to perform initial coordinate positioning of the PCB board 3 and LENS4. Then, the power supply plug-in component 12 and the MT head plug-in component 13 automatically extend to establish an active light-seeking feedback link. Next, the mounting bracket 21 shifts, and the dispensing component 223 extends to complete local dispensing. The control system drives the coupling component 222 to clamp the LENS4 for flexible bonding, and based on the real-time optical power data read from the active light-seeking feedback link, directs the motor to execute a dynamic light-seeking algorithm until the optical power reaches a preset threshold or the optimal optical power position is found. Finally, with the coupling component 222 locking the LENS4 in its current optimal spatial position, the curing component 224 extends in situ to complete the curing of the adhesive, thus improving the production yield and manufacturing cycle time of high-end optical communication modules.

[0048] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims

1. A high-precision automated coupling device for optical communication modules, comprising a frame and a clamp disposed within the frame for locking the optical communication PCB board; characterized in that, The device further includes: a drive mechanism straddling the top of the fixture, the drive mechanism having a mounting frame capable of moving horizontally and vertically; an execution module mounted on the mounting frame, the execution module including a vision component, a coupling component, a dispensing component, and a curing component; a power supply plug-in component and an MT head plug-in component, respectively disposed on both sides of the fixture; the power supply plug-in component and the MT head plug-in component are configured to automatically extend and plug into the electrical and optical interfaces of the PCB board, respectively, to establish a closed-loop active light-seeking feedback link; the drive mechanism is configured to sequentially switch the vision component, coupling component, dispensing component, and curing component to the top of the fixture by the displacement of the mounting frame, and before the coupling component performs dynamic alignment of the LENS based on the active light-seeking feedback link, the dispensing component and the curing component are configured to complete the application and curing of adhesive in situ.

2. The high-precision automated coupling device for optical communication modules according to claim 1, characterized in that, A vision component, a coupling component, and an adhesive dispensing component are arranged sequentially along the horizontal direction on the mounting bracket; the curing component is arranged below and to the side of the vision component.

3. The high-precision automated coupling device for optical communication modules according to claim 2, characterized in that, The dispensing assembly and the curing assembly are each equipped with a telescopic mechanism; the telescopic mechanism is configured to extend to directly above the clamp when the dispensing assembly or the curing assembly is in operation. And while the coupling component performs the dynamic alignment of the LENS, it is driven to retract upwards to avoid physical interference.

4. A high-precision automated coupling device for optical communication modules according to claim 1, characterized in that, The coupling assembly includes a platform fixedly connected to the mounting bracket, and a first angle adjustment shaft, a pressure sensor, and a vacuum suction cup sequentially connected in series on the platform.

5. A high-precision automated coupling device for an optical communication module according to claim 4, characterized in that, The coupling assembly also includes a first gripper that is fixedly connected to the side of the platform and can be independently lifted and lowered.

6. A high-precision automated coupling device for an optical communication module according to claim 1, characterized in that, The bottom of the fixture is equipped with a multi-axis adjustment platform, which includes a second angle adjustment axis and an electric slide table stacked on top of each other.

7. A high-precision automated coupling device for an optical communication module according to claim 1, characterized in that, The MT head plugging / unplugging assembly includes a second gripper and a first drive assembly.

8. A high-precision automated coupling device for an optical communication module according to claim 1, characterized in that, The power supply plug-in assembly includes a power supply plug, a multi-axis fine-tuning module, and a second drive assembly.

9. A high-precision automated coupling device for an optical communication module according to claim 1, characterized in that, The curing components include a UV irradiation lamp head and a light shield.

10. A high-precision automated coupling device for an optical communication module according to any one of claims 1-9, characterized in that, It also includes a control system configured to control the drive mechanism to move the mounting frame, switching the vision component to directly above the fixture for visual positioning of the PCB board; control the power supply plug-in component and the MT head plug-in component to automatically extend and plug into the electrical and optical interfaces of the PCB board respectively, to establish a closed-loop active light-seeking feedback link; and control the drive mechanism to move the mounting frame, sequentially switching the coupling component, dispensing component, and curing component to directly above the fixture. The dispensing assembly is controlled to apply adhesive to the PCB board; the coupling assembly is controlled to clamp the LENS and attach it to the PCB board, and the dynamic alignment of the LENS is performed based on the active light-seeking feedback link; While the coupling component keeps the LENS position locked, the curing component is controlled to complete the curing of the adhesive in situ.