Wafer back cutting equipment

Abstract

The invention discloses a wafer back-cutting device, comprising: two horizontal multi-joint robotic arms arranged on the same lifting column, and a wafer feeding platform matched with the horizontal multi-joint robotic arms, a three-axis wafer pre-positioning device, and a wafer back-cutting device and a ceramic carrier fixed on a wafer laser back-cutting platform, wherein the horizontal multi-joint robotic arms are respectively a first horizontal multi-joint robotic arm and a second horizontal multi-joint robotic arm, a U-shaped frame is fixed on the movable end of the first horizontal multi-joint robotic arm, a first rotating motor is fixed on the upper end of the U-shaped frame, a first suction cup robot is fixed on the output end of the first rotating motor, a second rotating motor is directly fixed on the movable end of the second horizontal multi-joint robotic arm, a second suction cup robot is fixed on the output end of the second rotating motor, and a U-shaped mouth of the U-shaped frame provides a way for the second horizontal multi-joint robotic arm.

Description

Technical Field

[0001] The invention relates to the field of wafer back-cutting, and in particular to a wafer back-cutting device. Background Art

[0002] With the advancement of technology, smart wearables, smart phones, and tablets are developing towards high-speed and large-capacity storage; the volume is developing towards thinness. The direction of technological development requires that flash memory and memory controllers are also continuously thinner. The wafer area tends to be larger and the thickness tends to be thinner, which makes the cracking problem in the conventional process when processing and cutting extremely thin wafers more challenging. The increase in volume and the reduction in thickness will increase the internal stress during the wafer processing process. With the lack of its own strength, the warpage of the wafer surface is likely to increase. Therefore, cutting the inside of the wafer first and then thinning the wafer can effectively avoid the poor processing caused by the wafer warping caused by the wafer thickness being too thin during the wafer processing. At present, hidden cutting is performed from the front of the wafer, and it is impossible to process wafers with metal coatings on the surface. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a wafer back-cutting device capable of processing a wafer with a metal coating on the surface.

[0004] The specific plan is as follows:

[0005] The wafer back-cutting device comprises: two horizontal multi-joint robotic arms arranged on the same lifting column, and a wafer feeding platform matched with the horizontal multi-joint robotic arms, a three-axis wafer pre-positioning device, and a wafer back-cutting device and a ceramic carrier fixed on the wafer laser back-cutting platform. It is characterized in that the horizontal multi-joint robotic arms are respectively a first horizontal multi-joint robotic arm and a second horizontal multi-joint robotic arm, the movable end of the first horizontal multi-joint robotic arm is fixed with a U-shaped frame, the upper end of the U-shaped frame is fixed with a first rotating motor, the output end of the first rotating motor is fixed with a first suction cup robot, the movable end of the second horizontal multi-joint robotic arm is directly fixed with a second rotating motor, the output end of the second rotating motor is fixed with a second suction cup robot, and the U-shaped mouth of the U-shaped frame provides a way for the second horizontal multi-joint robotic arm.

[0006] The lifting column, wafer feeding platform, three-axis wafer pre-positioning device and wafer laser hidden cutting platform are all fixed on the marble machine base, and the wafer feeding platform, three-axis wafer pre-positioning device and wafer laser hidden cutting platform are evenly distributed circumferentially with the lifting column as the center.

[0007] Two wafer feeding platforms are provided.

[0008] The ceramic carrier itself is equipped with a negative pressure device to adsorb the wafer.

[0009] The wafer hidden cutting processing platform can move along the X-axis and Y-axis planes and can rotate around itself.

[0010] A processing method for wafer back-cutting, the processing steps are as follows: a horizontal multi-joint robot arm takes material from a wafer feeding platform, a rotating motor rotates to flip the wafer 180°, a three-axis wafer pre-positioning device is used to find the center of the wafer, and the periphery of the wafer is detected, and the horizontal multi-joint robot arm places the wafer on a ceramic carrier, and the ceramic carrier adsorbs the wafer through its own negative pressure device, and performs hidden cutting with the movement of the wafer laser hidden cutting platform. The two wafer feeding platforms provided by the present invention enable the equipment to feed materials uninterruptedly, ensuring high work efficiency, and the U-shaped frame enables the two horizontal multi-joint robot arms to not interfere with each other during operation, and the suction cup robot arm is rotated 180° by a rotating motor, and the wafer rotates 180° as it rotates, so that there is no need to install a ring during the hidden cutting process, and at the same time, for wafers with metal coatings on the surface, the three-axis wafer pre-positioning device can accurately locate the position of the wafer, which is more helpful for hidden cutting of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of the structure of a wafer back-cutting device;

[0012] Figure 2 yes Figure 1 Schematic diagram of the structure at A in the middle.

[0013] 1. Wafer feeding platform, 2. Three-axis wafer pre-positioning device, 3. Wafer laser invisible cutting platform, 4. Ceramic carrier, 5. First horizontal multi-joint robotic arm, 6. Lifting column, 7. First suction cup robot, 8. U-shaped frame, 9. First rotating motor, 10. Second horizontal multi-joint robotic arm, 11. Second rotating motor, 12. Second suction cup robot. DETAILED DESCRIPTION

[0014] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the implementation of the present invention, not all of the implementations. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] like Figure 1-Figure 2As shown. The wafer back-cutting device comprises: two horizontal multi-joint mechanical arms arranged on the same lifting column 6, and a wafer feeding platform 1 matched with the horizontal multi-joint mechanical arms, a three-axis wafer pre-positioning device 2, and a wafer hidden cutting device and a ceramic carrier 4 fixed on a wafer laser hidden cutting platform 3, characterized in that the horizontal multi-joint mechanical arms are respectively a first horizontal multi-joint mechanical arm 5 and a second horizontal multi-joint mechanical arm 10, a U-shaped frame 8 is fixed on the movable end of the first horizontal multi-joint mechanical arm 5, a first rotating motor 9 is fixed on the upper end of the U-shaped frame 8, a first suction cup mechanical arm 7 is fixed on the output end of the first rotating motor 9, a second rotating motor 11 is directly fixed on the movable end of the second horizontal multi-joint mechanical arm 10, a second suction cup mechanical arm 12 is fixed on the output end of the second rotating motor 11, and a U-shaped mouth of the U-shaped frame 8 provides a way for the second horizontal multi-joint mechanical arm 10. The lifting column 6 controls the height of the two horizontal multi-joint robotic arms, so that during the working process, the wafer can be transported to the specified position, and the suction cup robot uses negative pressure to take the wafer out of the wafer feeding platform 1 and transfer it to various positions. The lifting column 6, the wafer feeding platform 1, the three-axis wafer pre-positioning device 2 and the wafer laser hidden cutting platform 3 are all fixed on the marble machine base, and the wafer feeding platform 1, the three-axis wafer pre-positioning device 2, and the wafer laser hidden cutting platform 3 are evenly distributed around the lifting column 6. The three-axis wafer pre-positioning device 2 can accurately position the wafer to the center and edge of the wafer, so that accurate cutting can be performed.

[0016] The ceramic carrier 4 itself is provided with a negative pressure device to adsorb the wafer. The adsorption manipulator places the positioned wafer on the ceramic carrier 4 and fixes the wafer by negative pressure. During hidden cutting, the wafer hidden cutting processing platform can move along the X-axis and Y-axis planes and can rotate around itself, so that the X-axis and Y-axis cutting paths can be cut inside the wafer.

[0017] Two wafer feeding platforms 1 enable the equipment to feed materials continuously, greatly improving work efficiency.

[0018] A wafer back-cutting processing method, the processing steps are: a horizontal multi-joint robotic arm takes material from a wafer feeding platform 1, a rotary motor turns the wafer 180°, a three-axis wafer pre-positioning device 2 finds the wafer center, and detects the wafer periphery, a horizontal multi-joint robotic arm places the wafer on a ceramic carrier 4, the ceramic carrier 4 adsorbs the wafer through its own negative pressure device, and performs hidden cutting as the wafer laser hidden cutting platform 3 moves.

[0019] The two wafer feeding platforms 1 provided in the present invention enable the equipment to feed materials uninterruptedly, ensuring high working efficiency. The U-shaped frame 8 can prevent the two horizontal multi-joint robotic arms from interfering with each other during operation. The suction cup robot is rotated 180° by a rotating motor, and the wafer rotates 180° as well, so that there is no need to install a ring during the hidden cutting process. At the same time, for processing wafers with metal coatings on the surface, the three-axis wafer pre-positioning device 2 can accurately locate the position of the wafer, which is more conducive to hidden cutting of the wafer.

[0020] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. Wafer back-cutting device, including: Two horizontal multi-joint robotic arms are arranged on the same lifting column, as well as a wafer feeding platform, a three-axis wafer pre-positioning device, and a wafer laser cutting device and a ceramic carrier matched with the horizontal multi-joint robotic arms. It is characterized in that the horizontal multi-joint robotic arms are respectively a first horizontal multi-joint robotic arm and a second horizontal multi-joint robotic arm, the movable end of the first horizontal multi-joint robotic arm is fixed with a U-shaped frame, the upper end of the U-shaped frame is fixed with a first rotating motor, the output end of the first rotating motor is fixed with a first suction cup manipulator, the movable end of the second horizontal multi-joint robotic arm is directly fixed with a second rotating motor, the output end of the second rotating motor is fixed with a second suction cup manipulator, and the U-shaped mouth of the U-shaped frame provides a way for the second horizontal multi-joint robotic arm.

2. The wafer back-cutting device according to claim 1, characterized in that: The lifting column, wafer feeding platform, three-axis wafer pre-positioning device and wafer laser hidden cutting platform are all fixed on the marble machine base, and the wafer feeding platform, three-axis wafer pre-positioning device and wafer laser hidden cutting platform are evenly distributed circumferentially with the lifting column as the center.

3. The wafer back-cutting device according to claim 1, characterized in that: Two wafer feeding platforms are provided.

4. The wafer back-cutting device according to claim 1, characterized in that: The ceramic carrier itself is equipped with a negative pressure device to adsorb the wafer.

5. The wafer back-cutting device according to claim 1, characterized in that: The wafer hidden cutting processing platform can move along the X-axis and Y-axis planes and can rotate around itself.

6. A method for processing a wafer using the wafer back-cutting device according to any one of claims 1 to 5, characterized in that: The processing steps are as follows: a horizontal multi-joint robotic arm takes material from a wafer feeding platform, a rotary motor turns the wafer 180°, a three-axis wafer pre-positioning device finds the wafer center, and detects the wafer periphery, and a horizontal multi-joint robotic arm places the wafer on a ceramic carrier. The ceramic carrier absorbs the wafer through its own negative pressure device, and performs hidden cutting as the wafer laser hidden cutting platform moves.

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