Portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology

Abstract

The portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided by the present invention relates to the field of blackbody metrology furnace. It includes a blackbody metrology furnace body, a semiconductor thermal management module, a temperature management module, and an inert gas module. The blackbody metrology furnace body is provided with a blackbody chamber; the semiconductor thermal management module includes a thermal management system and a semiconductor structure, the first end of the blackbody chamber has an opening connected to the blackbody chamber, the semiconductor structure is installed at the second end of the blackbody chamber, and the thermal management system is connected to the semiconductor structure; the temperature management module includes a temperature sensor and a VC soaking plate, the VC soaking plate is fitted with the semiconductor structure and is located at one end close to the blackbody chamber, the temperature sensor is connected to the VC soaking plate, and is used to obtain the temperature of the VC soaking plate; the inert gas module is connected to the blackbody metrology furnace body, and is used to purge inert gas into the blackbody chamber. The present invention can achieve effective control of heat, and is fast, efficient, and easy to use.

Description

Technical Field

[0001] The invention relates to the field of blackbody metrology furnaces, and in particular to a portable blackbody metrology furnace based on temperature metrology semiconductors and micro water cooling and heat dissipation technology. Background Art

[0002] Infrared temperature measurement technology is a common technology in the industrial field, which is used for real-time temperature monitoring, as well as monitoring related alarms and surveillance. Infrared thermometer is one of the application instruments of infrared temperature measurement technology, and it needs to be calibrated when used.

[0003] Infrared thermometers are usually calibrated using a blackbody metrology furnace. In order to facilitate the calibration of infrared thermometers, portable blackbody metrology furnaces have emerged. Portable blackbody metrology furnaces are small in size, light in weight, and easy to carry. However, the temperature measurement accuracy of portable blackbody metrology furnaces is limited by their size and is also reduced accordingly. The measurement accuracy of portable metrology furnaces in the existing technology is poor and cannot complete the calibration work on industrial sites well. Summary of the invention

[0004] The objects of the present invention include, for example, providing a portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology, which can achieve effective heat control, and has high speed, high efficiency and is easy to use.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] The embodiment of the present invention provides a portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling and heat dissipation technology, comprising a blackbody metrology furnace body, a semiconductor thermal management module, a temperature management module, and an inert gas module, wherein the blackbody metrology furnace body is provided with a blackbody chamber;

[0007] The semiconductor thermal management module comprises a thermal management system and a semiconductor structure, the first end of the black body chamber has an opening communicating with the black body chamber, the semiconductor structure is mounted on the second end of the black body chamber, and the thermal management system is connected to the semiconductor structure, wherein the first end is opposite to the second end;

[0008] The temperature management module includes a temperature sensor and a VC vapor chamber, wherein the VC vapor chamber is attached to the semiconductor structure and is located at one end close to the black body chamber, and the temperature sensor is connected to the VC vapor chamber to obtain the temperature of the VC vapor chamber;

[0009] The inert gas module is connected to the black body metering furnace and is used for purging inert gas into the black body chamber.

[0010] Further, in an optional embodiment, the heat dissipation system includes a first heat dissipation module and a second heat dissipation module, the first heat dissipation module is connected to the semiconductor structure for dissipating heat from the semiconductor structure, and the second heat dissipation module is connected to the blackbody metrology furnace for dissipating heat from the blackbody metrology furnace.

[0011] Furthermore, in an optional embodiment, the heat dissipation system further includes a heat dissipation separation module, which is disposed between the first heat dissipation module and the second heat dissipation module and is used to selectively conduct heat or isolate heat from the first heat dissipation module.

[0012] Further, in an optional embodiment, the heat dissipation separation module includes an annular chamber arranged between the first heat dissipation module and the second heat dissipation module, a liquid heat-conducting medium, and a power component that selectively accommodates the liquid heat-conducting medium in the annular chamber.

[0013] Further, in an optional embodiment, the power assembly includes a power water pump, a transmission pipeline and a storage container, the power water pump is connected to the transmission pipeline, one end of the transmission pipeline is located in the annular chamber, and the other end is located in the storage container, the power water pump is used to transfer the liquid heat-conducting medium in the annular chamber to the storage chamber, or to transfer the liquid heat-conducting medium in the storage chamber to the annular chamber.

[0014] Further, in an optional embodiment, the second heat dissipation module is arranged along the outer wall of the blackbody metrology furnace.

[0015] Further, in an optional embodiment, the second heat dissipation module includes a pipeline, a liquid medium and a circulation pump, the pipeline is arranged along the outer wall of the blackbody metrology furnace, and the circulation pump is used to circulate the liquid medium in the pipeline.

[0016] Further, in an optional embodiment, a thermal insulation layer and a sealing layer are sequentially arranged on the inner wall of the black body chamber, the sealing layer is located outside the thermal insulation layer, and the thermal insulation layer is located inside the black body chamber.

[0017] Further, in an optional embodiment, the inert gas module includes a gas pipeline and an air outlet plate, the air outlet plate is located in the black body chamber and connected to the VC heat sink, the gas pipeline is connected to the air outlet plate, and the air outlet plate is provided with a plurality of air outlets facing the black body chamber.

[0018] Further, in an optional embodiment, the inert gas module also includes a wind shield having an exhaust port formed thereon, and the wind shield is rotatably connected to the air outlet disc so that the exhaust port is opposite to the air outlet, or the wind shield blocks the air outlet.

[0019] The portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided by the present invention has the following beneficial effects:

[0020] The portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided in this embodiment: the portable blackbody metrology furnace can be used for on-site calibration of infrared thermometers, thereby facilitating the use of infrared thermometers, and the infrared thermometer has high measurement accuracy and can meet industrial production requirements. The present application mainly improves the effective control and management of the temperature of the blackbody metrology furnace, thereby improving the calibration effect of the infrared thermometer, and has the characteristics of fast speed and high efficiency. In the embodiment of the present invention, the blackbody metrology furnace body is used to calibrate the infrared thermometer, and the semiconductor thermal management module can quickly adjust and control the temperature in the blackbody metrology furnace body, wherein the thermal management system can adjust the heat of the semiconductor structure in a targeted manner, and the semiconductor structure can achieve rapid heating of the blackbody chamber, and the thermal management system can achieve rapid cooling and adjustment of the semiconductor structure. The temperature management module can obtain the current temperature situation, wherein the VC soaking plate can achieve temperature balance, so that the temperature of the semiconductor structure is transferred to the VC soaking plate to achieve uniform heat. The temperature sensor can obtain the temperature of the VC soaking plate, thereby indirectly reflecting the temperature in the blackbody chamber. The inert gas module can adjust the humidity in the black body chamber, thereby reducing or avoiding water vapor in the black body chamber. The portable black body metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided by the embodiment of the present invention can effectively control heat, and is fast, efficient and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling and heat dissipation technology according to a specific embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of a thermal management system according to a specific embodiment of the present invention;

[0024] Figure 3 It is a structural schematic diagram of an air outlet plate according to a specific embodiment of the present invention;

[0025] Figure 4It is a schematic structural diagram of a windshield according to a specific embodiment of the present invention.

[0026] Icons: 100-blackbody metering furnace; 101-blackbody chamber; 102-insulation layer; 103-sealing layer; 200-semiconductor thermal management module; 210-thermal management system; 211-first heat dissipation module; 212-second heat dissipation module; 213-heat dissipation partition module; 220-semiconductor structure; 300-temperature management module; 310-temperature sensor; 320-VC heat spreader; 400-inert gas module; 410-gas pipeline; 420-air outlet; 421-air outlet; 430-wind shield; 431-exhaust outlet. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0032] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings.

[0033] See also Figure 1 This embodiment provides a portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology, which can achieve effective heat control, and has fast speed, high efficiency and is easy to use.

[0034] It should be pointed out that in the embodiment of the present invention, the portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology can be used for on-site calibration of infrared thermometers, thereby facilitating the use of infrared thermometers, and the infrared thermometers have high measurement accuracy and can meet industrial production requirements. The inventors of the present application have found in their long-term work in related fields that for portable blackbody metrology furnaces, the calibration of infrared thermometers mainly lies in the large error in the temperature control of the blackbody metrology furnace itself. The present application mainly improves the effective control and management of the temperature of the blackbody metrology furnace, thereby improving the calibration effect of the infrared thermometer, and has the characteristics of fast speed and high efficiency.

[0035] In an embodiment of the present invention, a portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology includes a blackbody metrology furnace body 100, a semiconductor thermal management module 200, a temperature management module 300, and an inert gas module 400. The blackbody metrology furnace body 100 is provided with a blackbody chamber 101; the semiconductor thermal management module 200 includes a thermal management system 210 and a semiconductor structure 220. The first end of the blackbody chamber 101 has an opening connected to the blackbody chamber 101, and the semiconductor structure 220 is installed at the second end of the blackbody chamber 101. Two ends, and the thermal management system 210 is connected to the semiconductor structure 220, wherein the first end is opposite to the second end; the temperature management module 300 includes a temperature sensor 310 and a VC heat spreader 320, the VC heat spreader 320 is attached to the semiconductor structure 220 and is located at one end close to the blackbody chamber 101, the temperature sensor 310 is connected to the VC heat spreader 320, and is used to obtain the temperature of the VC heat spreader 320; the inert gas module 400 is connected to the blackbody metering furnace body 100, and is used to purge inert gas into the blackbody chamber 101.

[0036] It should be noted that, in the embodiment of the present invention, the blackbody metrology furnace 100 is used to calibrate the infrared temperature measuring instrument, and the semiconductor thermal management module 200 can quickly adjust and control the temperature in the blackbody metrology furnace 100, wherein the thermal management system 210 can specifically adjust the heat of the semiconductor structure 220, and the semiconductor structure 220 can achieve rapid heating of the blackbody chamber 101, and the thermal management system 210 can achieve rapid cooling and adjustment of the semiconductor structure 220. The temperature management module 300 can obtain the current temperature condition, wherein the VC heat plate 320 can achieve temperature balance, so that the temperature of the semiconductor structure 220 is transferred to the VC heat plate 320, and the heat is uniform. The temperature sensor 310 can obtain the temperature of the VC heat plate 320, thereby indirectly reflecting the temperature in the blackbody chamber 101. The inert gas module 400 can adjust the humidity in the blackbody chamber 101, thereby reducing or avoiding water vapor in the blackbody chamber 101.

[0037] Optionally, a humidity sensor can be installed in the blackbody chamber 101 to detect the humidity in the blackbody chamber 101. The humidity detected by the humidity sensor can be used to control the inert gas module 400. When the humidity is greater than a preset value, the inert gas module 400 can be controlled to introduce gas into the blackbody chamber 101, thereby reducing the humidity in the blackbody chamber 101 and improving the calibration accuracy.

[0038] See also Figure 2 In an optional embodiment, the heat dissipation system may include a first heat dissipation module 211 and a second heat dissipation module 212. The first heat dissipation module 211 is connected to the semiconductor structure 220 for dissipating heat from the semiconductor structure 220, and the second heat dissipation module 212 is connected to the blackbody metrology furnace body 100 for dissipating heat from the blackbody metrology furnace.

[0039] Optionally, the semiconductor structure 220 may be a semiconductor chip. In the embodiment of the present invention, the semiconductor structure 220 can achieve rapid temperature rise, and the first heat dissipation module 211 can achieve rapid temperature drop of the semiconductor structure 220, thereby ensuring temperature control in the black body chamber 101 and improving the calibration effect.

[0040] In addition, it should be pointed out that in the embodiment of the present invention, the first heat dissipation module 211 and the second heat dissipation module 212 can be water-cooled, that is, a heat dissipation pipe is provided, and a heat-conducting medium flows in the heat dissipation pipe. The water-cooled heat dissipation method dissipates heat more evenly and is easy to control, which can further ensure that the temperature in the black body chamber 101 is controlled and adjusted.

[0041] Furthermore, the heat dissipation system may further include a heat dissipation separation module 213 , which is disposed between the first heat dissipation module 211 and the second heat dissipation module 212 and is used to selectively conduct heat or isolate heat from the first heat dissipation module 211 .

[0042] That is to say, the first heat dissipation module 211 and the second heat dissipation module 212 are separated from each other, and the heat dissipation separation module 213 can realize heat exchange or no heat exchange between the first heat dissipation module 211 and the second heat dissipation module 212. It should be pointed out that in the embodiment of the present invention, the heat dissipation separation module 213 can realize whether heat exchange is performed between the first heat dissipation module 211 and the second heat dissipation module 212, so that heat exchange is performed when the first heat dissipation module 211 and the second heat dissipation module 212 need to perform heat exchange, and the heat of the first heat dissipation module 211 and the second heat dissipation module 212 does not affect each other when heat exchange is not required; the embodiment of the present invention can realize flexible regulation of heat, thereby improving the regulation of heat in the black body space.

[0043] In the embodiment of the present invention, the heat dissipation separation module 213 includes an annular chamber disposed between the first heat dissipation module 211 and the second heat dissipation module 212 , a liquid heat-conducting medium, and a power assembly that selectively accommodates the liquid heat-conducting medium in the annular chamber.

[0044] That is to say, in the embodiment of the present invention, liquid heat-conducting medium flows in the annular chamber, and the liquid heat-conducting medium has a good heat-conducting effect. The specific material type can refer to the existing technology related to heat conduction. The embodiment of the present invention is not an improvement on the liquid heat-conducting medium, but adjusts whether the first heat dissipation module 211 and the second heat dissipation module 212 are heat-conducting, thereby realizing flexible adjustment of heat.

[0045] In an optional embodiment, the power assembly includes a power water pump, a transmission pipeline and a storage container. The power water pump is connected to the transmission pipeline. One end of the transmission pipeline is located in the annular chamber, and the other end is located in the storage container. The power water pump is used to transfer the liquid heat-conducting medium in the annular chamber to the storage chamber, or to transfer the liquid heat-conducting medium in the storage chamber to the annular chamber.

[0046] It should be noted that, in the embodiment of the present invention, the power assembly includes a power water pump, a transmission pipeline and a storage container. The power water pump can extract the liquid heat-conducting medium from the annular space to the storage container, so that there is basically no liquid in the annular space; at this time, there is basically no heat conduction between the first heat dissipation module 211 and the second heat dissipation module 212, so that the heat between the first heat dissipation module 211 and the second heat dissipation module 212 is not transferred, and the heat of the two does not affect each other. Similarly, under the action of the power water pump, the liquid heat-conducting medium in the storage container can be transported to the annular space, and the heat transfer between the first heat dissipation module 211 and the second heat dissipation module 212 can be achieved through the liquid heat-conducting medium in the annular space, so that the first heat dissipation module 211 and the second heat dissipation module 212 are thermally connected together, and the heat of the first heat dissipation module 211 can be dissipated through the second heat dissipation module 212, which is conducive to further improving the heat dissipation effect of the first heat dissipation module 211 on the semiconductor structure 220, and improving speed and efficiency.

[0047] Optionally, the second heat dissipation module 212 is arranged along the outer wall of the blackbody metrology furnace 100. In an optional embodiment, the second heat dissipation module 212 includes a pipeline, a liquid medium and a circulation pump, the pipeline is arranged along the outer wall of the blackbody metrology furnace, and the circulation pump is used to circulate the liquid medium in the pipeline.

[0048] In an optional embodiment of the present invention, the circulation pump can be set as the same pump as the power pump. In this case, valves need to be set on the respective pipelines. When one of the valves is closed, the liquid in the pipeline where the other valve is located can flow. Of course, it is not limited to this, and the embodiments of the present invention do not make specific requirements and limitations on this.

[0049] Optionally, the liquid may be water or other liquid heat-conducting media, and the embodiment of the present invention does not impose any specific requirements or limitations on this.

[0050] In an optional embodiment, a thermal insulation layer 102 and a sealing layer 103 are sequentially disposed on the inner wall of the black body chamber 101 , the sealing layer 103 is located outside the thermal insulation layer 102 , and the thermal insulation layer 102 is located inside the black body chamber 101 .

[0051] In an optional embodiment, the inert gas module 400 may include a gas pipeline 410 and an air outlet plate 420, the air outlet plate 420 is located in the black body chamber 101 and connected to the VC heat sink 320, the gas pipeline 410 is connected to the air outlet plate 420, and the air outlet plate 420 is provided with a plurality of air outlets 421 facing the black body chamber 101.

[0052] Furthermore, the inert gas module 400 may further include a windshield 430 , on which an exhaust port 431 is opened. The windshield 430 is rotatably connected to the air outlet disc 420 so that the exhaust port 431 is opposite to the air outlet 421 , or the windshield 430 blocks the air outlet 421 .

[0053] See also Figure 3 and Figure 4 It should be noted that, in the embodiment of the present invention, the inert gas module 400 can reduce the water content, i.e., humidity, in the black body chamber 101, thereby reducing or avoiding the generation of water vapor. The exhaust port 431 on the wind shield 430 and the air outlet 421 on the air outlet disk 420 have the same shape, size, and position. When the wind shield 430 rotates relative to the air outlet disk 420, different combinations of the exhaust port 431 and the air outlet 421 can be achieved. There are mainly three types: first, the exhaust port 431 is completely opposite to the air outlet 421, and the air outlet is the largest at this time; second, the exhaust port 431 and the air outlet 421 do not overlap at all, and no air is discharged at this time; third, the position of the exhaust port 431 and the air outlet 421 is between the two, and the size of the air outlet can be adjusted at this time.

[0054] The portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided in this embodiment: the portable blackbody metrology furnace can be used for on-site calibration of infrared thermometers, thereby facilitating the use of infrared thermometers, and the infrared thermometers have high measurement accuracy and can meet industrial production requirements. This application mainly improves the effective control and management of the temperature of the blackbody metrology furnace, thereby improving the calibration effect of the infrared thermometer, and has the characteristics of fast speed and high efficiency. In the embodiment of the present invention, the blackbody metrology furnace body 100 is used to calibrate the infrared thermometer, and the semiconductor thermal management module 200 can quickly adjust and control the temperature in the blackbody metrology furnace body 100, wherein the thermal management system 210 can specifically adjust the heat of the semiconductor structure 220, and the semiconductor structure 220 can achieve rapid heating of the blackbody chamber 101, and the thermal management system 210 can achieve rapid cooling and adjustment of the semiconductor structure 220. The temperature management module 300 can obtain the current temperature conditions, wherein the VC vapor chamber 320 can achieve temperature balance, so that the temperature of the semiconductor structure 220 is transferred to the VC vapor chamber 320 to achieve uniform heat. The temperature sensor 310 can obtain the temperature of the VC vapor chamber 320, thereby indirectly reflecting the temperature in the black body chamber 101. The inert gas module 400 can adjust the humidity in the black body chamber 101, thereby reducing or avoiding water vapor in the black body chamber 101. The portable black body metrology furnace based on temperature metrology semiconductor and micro water cooling technology provided in the embodiment of the present invention can achieve effective control of heat, and is fast, efficient, and easy to use.

[0055] It should be noted that, in the description of the present invention, the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use, or are directions or positional relationships commonly understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0056] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0057] It should also be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms such as "setting" and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology, characterized in that: It includes a blackbody metrology furnace, a semiconductor thermal management module, a temperature management module, and an inert gas module, wherein the blackbody metrology furnace is provided with a blackbody chamber; The semiconductor thermal management module comprises a thermal management system and a semiconductor structure, the first end of the black body chamber has an opening communicating with the black body chamber, the semiconductor structure is mounted on the second end of the black body chamber, and the thermal management system is connected to the semiconductor structure, wherein the first end is opposite to the second end; The temperature management module includes a temperature sensor and a VC vapor chamber, wherein the VC vapor chamber is attached to the semiconductor structure and is located at one end close to the black body chamber, and the temperature sensor is connected to the VC vapor chamber to obtain the temperature of the VC vapor chamber; The inert gas module is connected to the black body metering furnace and is used to purge inert gas into the black body chamber; The thermal management system comprises a first heat dissipation module and a second heat dissipation module, wherein the first heat dissipation module is connected to the semiconductor structure and used to dissipate heat from the semiconductor structure, and the second heat dissipation module is connected to the blackbody metrology furnace and used to dissipate heat from the blackbody metrology furnace; The thermal management system further comprises a heat dissipation separation module, which is disposed between the first heat dissipation module and the second heat dissipation module and is used to selectively conduct heat or isolate heat from the first heat dissipation module; The heat dissipation separation module includes an annular chamber disposed between the first heat dissipation module and the second heat dissipation module, a liquid heat-conducting medium, and a power component that selectively accommodates the liquid heat-conducting medium in the annular chamber; The power assembly includes a power water pump, a transmission pipeline and a storage container. The power water pump is connected to the transmission pipeline. One end of the transmission pipeline is located in the annular chamber, and the other end is located in the storage container. The power water pump is used to transfer the liquid heat-conducting medium in the annular chamber to the storage container, or to transfer the liquid heat-conducting medium in the storage container to the annular chamber. The second heat dissipation module is arranged along the outer wall of the blackbody metrology furnace; The second heat dissipation module comprises a pipeline, a liquid medium and a circulation pump, wherein the pipeline is arranged along the outer wall of the black body metering furnace, and the circulation pump is used to circulate the liquid medium in the pipeline; The inert gas module includes a gas pipeline and an air outlet plate, wherein the air outlet plate is located in the black body chamber and connected to the VC heat sink, the gas pipeline is connected to the air outlet plate, and the air outlet plate is provided with a plurality of air outlets facing the black body chamber; The inert gas module further comprises a wind shield plate, an exhaust port is formed on the wind shield plate, and the wind shield plate is rotatably connected to the air outlet disc so that the exhaust port is opposite to the air outlet, or the wind shield plate blocks the air outlet.

2. The portable blackbody metrology furnace based on temperature metrology semiconductor and micro water cooling technology according to claim 1 is characterized in that: A heat preservation layer and a sealing layer are sequentially arranged on the inner wall of the black body chamber, wherein the sealing layer is located outside the heat preservation layer, and the heat preservation layer is located inside the black body chamber.

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