An electronic device detection method, apparatus and electronic device

Abstract

The application discloses an electronic device detection method and device and electronic equipment, wherein the method comprises the following steps: obtaining reference test data of a device to be detected; controlling a detection fixture to move to the device to be detected; controlling the detection fixture to be connected to a second test point and a first part of test points in each first test point group, and obtaining first detection data; the first part of test points comprises a test point directly connected to the second test point; extracting first reference data corresponding to the first detection data from the reference test data, and judging whether a difference between the first detection data and the first reference data exceeds a preset error range; when the difference between the first detection data and the first reference data exceeds the preset error range, outputting a detection result that the device to be detected is unqualified. The method of the application realizes effective batch detection of the first test points on the device to be detected, and realizes effective detection of the electrical performance of the electronic device with high density and high point number.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to a method, apparatus, and electronic device for testing electronic components. Background Technology

[0002] With the development of electronic device integration, electronic devices have evolved from integrating small-pitch components to Mini and Micro products. Specifically in the display field, Mini / Micro LED (MLED) display technology has entered a phase of accelerated development in the past two years. It typically refers to miniaturizing the LED chip size to within 200 micrometers based on the traditional LED chip structure, arranging red, green, and blue MLEDs according to certain rules on a thin-film transistor (TFT) or complementary metal-oxide-semiconductor (CMOS) to form a micro-device capable of full-color display. However, because these products exhibit matrix-like, high-density, and high-dot-count characteristics on printed circuit boards (PCBs), traditional testing machines and methods cannot effectively complete electrical performance testing due to density or dot-count limitations.

[0003] Therefore, providing a method that can effectively perform electrical performance testing on high-density, high-point-count electronic devices has become an urgent problem to be solved. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide an electronic device testing method, apparatus and electronic device to realize the electrical performance testing of high-density, high-dot-count electronic devices such as Mini / Micro LEDs.

[0005] According to a first aspect, embodiments of the present invention provide an electronic device testing method, comprising the following steps:

[0006] Acquire benchmark test data of the device under test; the device under test includes several first test point groups and several second test points, and each test point in a first test point group is connected in series with a corresponding second test point.

[0007] Control the movement of the testing fixture onto the device to be tested;

[0008] The control and testing fixture is connected to the second test point and the test points in the first part of each first test point group, and acquires the first test data; the test points in the first part include test points that are directly connected to the corresponding second test point;

[0009] Extract the first benchmark data corresponding to the first detection data from the benchmark test data, and determine whether the difference between the first detection data and the first benchmark data exceeds the preset error range;

[0010] When the difference between the first test data and the first reference data exceeds the preset error range, the test result of the device under test being unqualified is output.

[0011] Furthermore, the electronic device testing method also includes the following steps:

[0012] When the difference between the first detection data and the first reference data does not exceed the preset error range, the detection fixture is controlled to move and connect to the test point of the second part in each first test point group, and the second detection data is acquired; there are the same test points between the test points of the second part and the test points of the first part.

[0013] Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range;

[0014] Repeat the above steps until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data is within the preset error range, output the test result that the device under test is qualified.

[0015] Furthermore, the device to be tested includes a first detection surface and a second detection surface, a first group of test points is located on the first detection surface, a second group of test points is located on the second detection surface, and the testing fixture includes a first fixture and a second fixture;

[0016] The steps for controlling the movement of the testing fixture onto the device under test include:

[0017] The first fixture and the second detection fixture are controlled to move onto the first detection surface and the second detection surface of the device to be tested, respectively.

[0018] The steps of controlling the testing fixture to connect to the second test point and the test points of the first part in each first test point group, and acquiring the first test data include:

[0019] The first fixture is controlled to connect to the test points in the first part of each first test point group, and the second detection fixture is controlled to connect to all the second test points and acquire the first detection data.

[0020] Furthermore, the electronic device testing method also includes the following steps:

[0021] When the difference between the first detection data and the first reference data does not exceed the preset error range, the first fixture is controlled to move and connect to the test point of the second part in each first test point group, and the second detection data is acquired; there are the same test points between the test points of the second part and the test points of the first part.

[0022] Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range;

[0023] Repeat the above steps until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data is within the preset error range, output the test result that the device under test is qualified.

[0024] Furthermore, the number of test points in the first part is the same as the number of test points in the second part.

[0025] Furthermore, the electronic device includes several devices to be tested.

[0026] According to a second aspect, embodiments of the present invention also provide an electronic device testing apparatus, comprising:

[0027] The first acquisition module is used to acquire the benchmark test data of the device under test; the device under test includes a number of first test point groups and a number of second test points, and each test point in a first test point group is connected in series to a corresponding second test point.

[0028] The first control module is used to control the movement of the testing fixture onto the device to be tested;

[0029] The second control module is used to control the detection fixture to connect to the second test point and the test points in the first part of each first test point group, and to acquire the first detection data; the test points in the first part include test points that are directly connected to the corresponding second test point.

[0030] The detection and judgment module is used to extract the first benchmark data corresponding to the first detection data from the benchmark test data, and to determine whether the difference between the first detection data and the first benchmark data exceeds the preset error range.

[0031] The result output module is used to output a test result indicating that the device under test is unqualified when the difference between the first test data and the first reference data exceeds a preset error range.

[0032] According to a third aspect, embodiments of the present invention provide an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to cause the at least one processor to perform any of the electronic device detection methods described in the first aspect.

[0033] According to a fourth aspect, embodiments of the present invention provide a computer-readable storage medium having computer instructions stored thereon, which, when executed by a processor, implement the steps of any of the electronic device detection methods described in the first aspect.

[0034] The technical solution provided by this invention has the following advantages:

[0035] 1. The electronic device testing method provided by this invention is based on the characteristics of Mini / Micro LED and other similar electronic devices having a matrix-like, high-density, and numerous first test points and a certain number of second test points (relatively fewer than the number of first test points). Multiple first test points (points in a first test point group) are connected in series to a second test point. Therefore, by controlling the testing fixture to move onto the device under test and first connecting it to the second test points and a first part of each first test point group (the test points in the first part include points directly connected to the corresponding second test points, i.e., the test points in the first part are points close to the second test points), the method detects whether the connection relationships between the test points in the first part and between the test points in the first part and the second test points are abnormal. This achieves effective batch testing of the first test points and effective testing of the electrical performance of high-density, high-point-count electronic devices.

[0036] 2. The electronic device testing method provided by the present invention, after effectively detecting the first test point and the second test point of the first part (and there are no problems with the electrical performance of the first test point and the second test point of the first part), controls the testing fixture to detect the test point of the second part, and there are identical test points between the test points of the second part and the test points of the first part, thereby further performing electrical performance testing on the remaining first test points of the device under test, and realizing effective testing of the electrical performance of high-density, high-point-count electronic devices. Attached Figure Description

[0037] The features and advantages of the invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the invention in any way. In the drawings:

[0038] Figure 1 An example front view of a Mini LED light panel is shown;

[0039] Figure 2 yes Figure 1 A magnified view of a portion of the image;

[0040] Figure 3 yes Figure 1 Example diagram of block-based partitioning in the image;

[0041] Figure 4 An example diagram of the back of a Mini LED light panel is shown;

[0042] Figure 5 A flowchart of an electronic device testing method according to an embodiment of the present invention is shown;

[0043] Figure 6 A flowchart of another electronic device detection method in an embodiment of the present invention is shown;

[0044] Figure 7 A schematic diagram showing the connection relationship of the test points of a device under test is shown.

[0045] Figure 8 A schematic block diagram of an electronic device testing device provided in an embodiment of the present invention is shown;

[0046] Figure 9 A schematic diagram of an electronic device structure provided by an embodiment of the present invention is shown. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] One application scenario for the electronic device testing method, apparatus, and electronic equipment in this embodiment of the invention is the electrical performance testing of Mini / Micro LEDs, such as... Figures 1-4 As shown, where, Figure 1 and Figure 2 This is an example of the front side of an LED light board, where the pads are arranged in a matrix, and several pads in a row or column are connected in series to the connection points on the back side (i.e., Figures 1-4 (The illustration shows a case where both surfaces have test points). In this case, the pads located in a row of series-connected connection points to the back surface, or in a column of series-connected connection points to the back surface, constitute the first test point group described below, and as follows: Figure 3As shown, the front of the LED light board can also be divided into blocks. Of course, the pads in one block are not connected to the pads in another block; for example... Figure 4 As shown, in addition to the connection point (i.e., the second test point below), the back of the LED light board can also be equipped with a power supply and driver chip.

[0049] Example 1

[0050] Figure 5 A flowchart of an electronic device testing method according to an embodiment of the present invention is shown, as follows: Figure 5 As shown, the method includes the following steps:

[0051] S501: Obtain the benchmark test data of the device under test.

[0052] In this application, the device under test includes a plurality of first test point groups and a plurality of second test points, and each test point in a first test point group is connected in series with a corresponding second test point.

[0053] Specifically, the first test point group and the second test point can be points on one surface of the device under test, or points on two surfaces of the device. In this case, such as Figure 2 As shown, the first test point group is located on one device surface (front) of the device under test, and the second test point is located on another device surface (back) of the device under test.

[0054] In this application, the benchmark test data includes the resistance data between each first test point and the corresponding second test point, and may also include the resistance data between two adjacent first test points.

[0055] S502: Control the movement of the testing fixture onto the device to be tested.

[0056] In this application, when both the first test point group and the second test point are located on a device surface of the device to be tested, the testing fixture may include only one fixture, which corresponds to the device surface with the first test point group and the second test point. Of course, it may also include two fixtures. In this case, the fixture corresponding to the device surface with the first test point group and the second test point performs the testing action, while the fixture corresponding to the other device surface does not perform the testing action. Of course, the fixture may also be moved onto the device to be tested to provide support.

[0057] In this application, when the first test point group is located on one device surface of the device under test and the second test point is located on another device surface of the device under test, the testing fixture includes two fixtures, namely the first fixture and the second fixture described below. At this time, the first fixture corresponds to the device surface of the device under test with the first test point group and the second fixture corresponds to the device surface of the device under test with the second test point.

[0058] S503: The control and testing fixture is connected to the second test point and the test points in the first part of each first test point group, and the first test data is acquired. In this application, the test points in the first part include test points directly connected to the corresponding second test point.

[0059] In this application, when only one fixture in the testing fixture performs the testing action, some of the testing probes in that fixture are connected to the second test point, and the remaining testing probes are connected to the test point in the first part; when the testing fixture includes a first fixture and a second fixture, the testing probes in the first fixture are connected to the test point in the first part, and the testing probes in the second fixture are connected to the second test point.

[0060] In this application, when the testing fixture includes a first fixture and a second fixture, the size of the second testing fixture can be set according to the distribution of the second test point on the device under test. When the second test point is only concentrated on a part of the device surface, the size of the second fixture can also cover only a part of the device under test. Of course, when the second test point is distributed at various locations on the device surface, the size of the second fixture must cover the entire device under test.

[0061] S504: Extract the first benchmark data corresponding to the first detection data from the benchmark test data, and determine whether the difference between the first detection data and the first benchmark data exceeds the preset error range.

[0062] S505: When the difference between the first detection data and the first reference data exceeds the preset error range, output the detection result that the device under test is unqualified.

[0063] The electronic device testing method in this application is based on the characteristics of Mini / Micro LEDs and other similar electronic devices having a matrix-like, high-density, and numerous first test points and a certain number of second test points (relatively fewer than the number of first test points). Multiple first test points (points in a first test point group) are connected in series to a second test point. Therefore, by controlling the testing fixture to move onto the device under test and first connecting it to the second test points and the test points of the first part of each first test point group (the first part includes test points directly connected to the corresponding second test points, i.e., the test points of the first part are points close to the second test points), the method detects whether the connection relationships between the test points of the first part and between the test points of the first part and the second test points are abnormal. This achieves effective batch testing of the first test points and effective testing of the electrical performance of high-density, high-point-count electronic devices.

[0064] As an optional implementation of this invention, when the difference between the first detection data and the first reference data does not exceed the preset error range, such as Figure 5 As shown, the electronic device testing method may further include the following steps:

[0065] S506: When the difference between the first detection data and the first reference data does not exceed the preset error range, the first fixture is controlled to move and connect to the test point of the second part in each first test point group, and the second detection data is acquired. At this time, there are identical test points between the test points of the second part and the test points of the first part.

[0066] In this application, when both the first group of test points and the second test point are located on a device surface of the device under test, the fixture corresponding to the starting surface having the first group of test points and the second test point is simultaneously connected to measure the test points of the first part and the second test point in step S503. However, in this step, it is only connected to measure the test points of the second part. Therefore, the number of test points in the second part is one more than the number of test points in the first part. When the first group of test points is located on a device surface of the device under test and the second test point is located on another device surface of the device under test, the number of test points in the second part is the same as the number of test points in the first part.

[0067] In this application, even if the first test point group is located on one device surface of the device under test and the second test point is located on another device surface of the device under test, it is not necessary to control the fixture corresponding to the device surface where the second test point is located to perform connection detection on the second test point.

[0068] In this application, in order to improve detection efficiency, there may be only one identical test point in the first part and the second part.

[0069] S507: Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range.

[0070] S508: Repeat steps S505-S507 until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data exceeds the preset error range, output the test result that the device under test is qualified.

[0071] The electronic device testing method in this application, after effectively testing the test points and the second test points of the first part (and there are no problems with the electrical performance of the test points and the second test points of the first part), controls the testing fixture to test the test points of the second part, and there are identical test points between the test points of the second part and the test points of the first part, thereby further testing the electrical performance of the remaining first test points of the device under test, and realizing the effective testing of the electrical performance of high-density, high-point-count electronic devices.

[0072] As one embodiment of the present invention, taking as an example a device to be tested including a first detection surface and a second detection surface, a first group of test points located on the first detection surface, a second group of test points located on the second detection surface, and a testing fixture including a first fixture and a second fixture, the electronic device testing method of the present invention will be described. In this case, as... Figure 6 As shown, the method includes the following steps:

[0073] S601: Obtain the benchmark test data of the device under test.

[0074] S602: Control the first fixture and the second detection fixture to move onto the first detection surface and the second detection surface of the device to be tested, respectively.

[0075] S603: Control the first fixture to connect to the test points of the first part in each first test point group, control the second detection fixture to connect to all second test points, and acquire the first detection data.

[0076] S604: Extract the first benchmark data corresponding to the first detection data from the benchmark test data, and determine whether the difference between the first detection data and the first benchmark data exceeds the preset error range.

[0077] S605: When the difference between the first detection data and the first reference data exceeds the preset error range, output the detection result that the device under test is unqualified.

[0078] S606: When the difference between the first detection data and the first reference data does not exceed the preset error range, the first fixture is controlled to move and connect to the test point of the second part in each first test point group, and the second detection data is acquired. Here, there are identical test points between the test points of the second part and the test points of the first part.

[0079] S607: Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range.

[0080] S608: Repeat steps S605-S607 until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data exceeds the preset error range, output the test result of the device under test as qualified.

[0081] Here, the number and distribution of the first test point combined with the second test point within a block on the LED light board are taken as examples. Figure 7 The above-described method for testing electronic devices will be further explained in detail using the example shown, so that those skilled in the art can understand the method. Figure 7 It includes the following 7 connection networks:

[0082] Network 1: A,1,2,3,4,5,6,7;

[0083] Network 2: B, 11, 12, 13, 14, 15, 16, 17;

[0084] Network 3: C, 21, 22, 23, 24, 25, 26, 27;

[0085] Network 4: D, 31, 32, 33, 34, 35, 36, 37;

[0086] Network 5: E, 41, 42, 43, 44, 45, 46, 47;

[0087] Network 6:F,51,52,53,54,55,56,57;

[0088] Network 7: G, 61, 62, 63, 64, 65, 66, 67.

[0089] In each network, the digital test points form a first test point group. For example, test points 1, 2, 3, 4, 5, 6, and 7 form the first first test point group, and test points 11, 12, 13, 14, 15, 16, and 17 form the second first test point group, and so on. The letter test points in each network form the second test points, that is, test points A, B, C, D, E, F, and G are all second test points.

[0090] Therefore, the electrical performance testing of all test points in the above 7 interconnected networks can be completed through 3 measurements. Specifically, the test points for the 3 measurements are as follows:

[0091] First test:

[0092] Network 1: A,1,2,3;

[0093] Network 2:B,11,12,13;

[0094] Network 3: C, 21, 22, 23;

[0095] Network 4: D, 31, 32, 33;

[0096] Network 5:E,41,42,43;

[0097] Network 6:F,51,52,53;

[0098] Network 7:G,61,62,63.

[0099] Points A, B, C, D, E, F, G are for the second fixture connection detection, and points 1, 2, 3, 11, 12, 13, 21, 22, 23, 31, 32, 33, 41, 42, 43, 51, 52, 53, 61, 62, 63 are for the first fixture connection detection.

[0100] The second inspection, and all points were connected to the first fixture:

[0101] Network 1:3,4,5;

[0102] Network 2:13,14,15;

[0103] Network 3:23,24,25;

[0104] Network 4:33,34,35;

[0105] Network 5:43,44,45;

[0106] Network 6:53,54,55;

[0107] Network 7:63,64,65.

[0108] The third inspection, and all points were connected to the first fixture:

[0109] Network 1:5,6,7;

[0110] Network 2:15,16,17;

[0111] Network 3:25,26,27;

[0112] Network 4:35,36,37;

[0113] Network 5:45,46,47;

[0114] Network 6:55,56,57;

[0115] Network 7:65,66,67.

[0116] Example 2

[0117] Figure 8An electronic device testing apparatus is shown, comprising: a first acquisition module 10, a first control module 20, a second control module 30, a detection and judgment module 40, and a result output module 50; wherein,

[0118] The first acquisition module 10 is used to acquire the benchmark test data of the device under test. In this application, the device under test includes a plurality of first test point groups and a plurality of second test points, and each test point in a first test point group is connected in series with a corresponding second test point.

[0119] The first control module 20 is used to control the movement of the testing fixture onto the device to be tested.

[0120] The second control module 30 is used to control the detection fixture to connect to the second test point and the test points in the first part of each first test point group, and to acquire the first detection data. Here, the test points in the first part include test points that are directly connected to the corresponding second test point.

[0121] The detection and judgment module 40 is used to extract the first benchmark data corresponding to the first detection data from the benchmark test data, and to determine whether the difference between the first detection data and the first benchmark data exceeds the preset error range.

[0122] The result output module 50 is used to output a test result indicating that the device under test is unqualified when the difference between the first test data and the first reference data exceeds a preset error range.

[0123] The further functional descriptions of each of the above modules are the same as those in Embodiment 1 above, and will not be repeated here.

[0124] Example 3

[0125] This invention provides an electronic device, such as... Figure 9 As shown, the electronic device may include a processor 91 and a memory 92, wherein the processor 91 and the memory 92 may be connected via a bus or other means. Figure 9 Taking the example of a connection between China and Israel via a bus.

[0126] Processor 91 can be a central processing unit (CPU). Processor 91 can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or combinations of the above types of chips.

[0127] Memory 92, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, and modules, such as the program instructions / modules corresponding to the electronic device detection method in Embodiment 1 of this invention (e.g., Figure 8 The first acquisition module 10, the first control module 20, the second control module 30, the detection and judgment module 40, and the result output module 50 are shown in the diagram. The processor 91 executes various functional applications and data processing by running non-transitory software programs, instructions, and modules stored in the memory 92, thereby realizing the electronic device detection method in the above method embodiment.

[0128] The memory 92 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created by the processor 91, etc. Furthermore, the memory 92 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 92 may optionally include memory remotely located relative to the processor 91, and these remote memories may be connected to the processor 91 via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0129] The one or more modules are stored in the memory 92, and when executed by the processor 91, they perform the following: Figures 5-7 The electronic device testing method in the illustrated embodiment.

[0130] For specific details regarding the aforementioned electronic devices, please refer to the relevant documentation. Figures 5 to 7 The relevant descriptions and effects in the illustrated embodiments are for understanding purposes only and will not be repeated here.

[0131] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk drive (HDD), or solid-state drive (SSD), etc.; the storage medium can also include combinations of the above types of memory.

[0132] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method for testing electronic devices, characterized in that, Includes the following steps: Obtain benchmark test data of the device under test; the device under test includes a plurality of first test point groups and a plurality of second test points, and each test point in a first test point group is connected in series with a corresponding second test point; The control fixture is moved onto the device to be tested; The detection fixture is controlled to connect to the second test point and the test points of the first part in each of the first test point groups, and the first detection data is acquired; the test points of the first part are a number of test points connected in series, and the test points of the first part include test points that are directly connected to the corresponding second test point. Extract the first benchmark data corresponding to the first detection data from the benchmark test data, and determine whether the difference between the first detection data and the first benchmark data exceeds a preset error range; When the difference between the first detection data and the first reference data exceeds the preset error range, the detection result of the device under test being unqualified is output. When the difference between the first detection data and the first reference data does not exceed the preset error range, the detection fixture is controlled to move and connect to the test points of the second part in each of the first test point groups, and the second detection data is acquired; the test points of the second part are a number of test points connected in series, and there are the same test points between the test points of the second part and the test points of the first part. Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range; Repeat the above steps until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data does not exceed the preset error range, output the qualified test result of the device under test.

2. The electronic device testing method according to claim 1, characterized in that, The device to be tested includes a first detection surface and a second detection surface, the first group of test points is located on the first detection surface, the second group of test points is located on the second detection surface, and the detection fixture includes a first fixture and a second fixture. The step of moving the control and detection fixture onto the device to be tested includes: Control the first fixture and the second fixture to move onto the first detection surface and the second detection surface of the device to be tested, respectively; The step of controlling the detection fixture to connect to the second test point and the test points of the first portion in each of the first test point groups, and acquiring the first detection data includes: The first fixture is controlled to connect to the test points in the first part of each first test point group, and the second fixture is controlled to connect to all second test points, and first detection data is acquired.

3. The electronic device testing method according to claim 2, characterized in that, It also includes the following steps: When the difference between the first detection data and the first reference data does not exceed the preset error range, the first fixture is controlled to move and connect to the test point of the second part in each of the first test point groups, and the second detection data is acquired; there are the same test points between the test points of the second part and the test points of the first part. Extract the second benchmark data corresponding to the second detection data from the benchmark test data, and determine whether the difference between the second detection data and the second benchmark data exceeds the preset error range; Repeat the above steps until all test points in the first test point group are tested; and when the difference between the test data of all test points in the first test point group and the corresponding reference data exceeds the preset error range, output the qualified test result of the device under test.

4. The method for testing electronic devices according to any one of claims 1-3, characterized in that, The number of test points in the first part is the same as the number of test points in the second part.

5. The electronic device testing method according to claim 4, characterized in that, The electronic device includes several devices to be tested.

6. An electronic device testing device, characterized in that, include: The first acquisition module is used to acquire the benchmark test data of the device under test; the device under test includes a plurality of first test point groups and a plurality of second test points, and each test point in a first test point group is connected in series to a corresponding second test point. The first control module is used to control the movement of the detection fixture onto the device to be detected; The second control module is used to control the detection fixture to connect to the second test point and the test points of the first part in each first test point group, and to acquire the first detection data; the test points of the first part are a number of test points connected in series, and the test points of the first part include test points that are directly connected to the corresponding second test point. The detection and judgment module is used to extract the first benchmark data corresponding to the first detection data from the benchmark test data, and to determine whether the difference between the first detection data and the first benchmark data exceeds a preset error range. The second control module is further configured to control the detection fixture to move and connect to the test points of the second part in each of the first test point groups, and acquire the second detection data, when the difference between the first detection data and the first reference data does not exceed the preset error range; the test points of the second part are a number of test points connected in series, and there are the same test points between the test points of the second part and the test points of the first part. The detection and judgment module is also used to extract second benchmark data corresponding to the second detection data from the benchmark test data, and to determine whether the difference between the second detection data and the second benchmark data exceeds a preset error range; The result output module is used to output a test result indicating that the device under test is unqualified when the difference between the first detection data and the first reference data exceeds the preset error range. It is also used to output the qualified test result of the device under test when the difference between the detection data of all test points in the first test point group and the corresponding reference data does not exceed the preset error range.

7. An electronic device, characterized in that, include: At least one processor; And a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to cause the at least one processor to perform the method described in any one of claims 1-5.

8. A computer-readable storage medium storing computer instructions thereon, characterized in that, When executed by the processor, this instruction implements the steps of the method described in any of claims 1-5.

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