Temperature control device and aging test system

Abstract

The present invention discloses a temperature adjustment device and an aging test system. The temperature adjustment device includes a temperature adjustment component having a first surface and a second surface opposite the first surface. During a low-temperature aging test, a current in a first direction is applied to the temperature adjustment component to heat an electronic device disposed on the first surface. During a high-temperature aging test, a current in a second direction is applied to the temperature adjustment component to dissipate heat from the electronic device through the first surface. The electronic device assists the product under test in the aging test. A thermal insulation cover surrounds at least the electronic device and is configured to slow heat exchange between the interior and exterior of the thermal insulation cover.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a temperature regulating device and an aging test system. Background Art

[0002] In the field of semiconductor technology, burn-in testing (burn-in testing) is a crucial step in the post-production process of chips. Burn-in testing simulates the harsh conditions experienced by a product during actual use, providing a reasonable prediction of its lifespan based on actual usage requirements. Burn-in testing can eliminate prematurely failing components and ensure product quality.

[0003] Taking memory chips as an example, one of the most common steps in the production testing process is to perform initial burn-in testing on packaged units. This is achieved by designing a burn-in board and socket based on the burn-in tester used. The unit to be tested is then mounted on the socket and placed in an oven for initial burn-in testing at high and low temperatures.

[0004] Currently, the industry performs the above-mentioned aging test by installing a controller on the aging substrate. However, in the related art, the controller used to control the product under test to perform the aging test has a short lifespan. Summary of the Invention

[0005] To solve the technical problems existing in the related art, an embodiment of the present invention provides a temperature adjustment device, wherein the temperature adjustment device includes:

[0006] A temperature adjustment component having a first surface and a second surface opposite to the first surface; wherein, during a low-temperature aging test, a current in a first direction is applied to the temperature adjustment component to heat an electronic device disposed on the first surface; and during a high-temperature aging test, a current in a second direction is applied to the temperature adjustment component to dissipate heat from the electronic device through the first surface; the electronic device is used to assist a product under test in performing aging testing during the aging test.

[0007] The heat-insulating cover at least surrounds the electronic device and is used to slow down the heat exchange between the inside and outside of the heat-insulating cover.

[0008] In the above solution, the temperature adjustment component includes a semiconductor refrigeration plate.

[0009] In the above solution, the number of stages of the semiconductor refrigeration plate includes N stages; wherein, N is a positive integer, and N is determined according to the temperature of the high temperature test and the temperature of the low temperature test of the aging test.

[0010] In the above solution, the temperature regulating device also includes: a first metal thermal conductive sheet, located between the electronic device and the first surface, for transferring heat generated by the first surface to the electronic device; wherein the first metal thermal conductive sheet completely covers the surface of the electronic device.

[0011] In the above solution, the thermal insulation cover has a gap that exposes the second surface;

[0012] The temperature regulating device further comprises: a second metal thermal conductive sheet covering the exposed second surface and used for transferring heat generated by the second surface to the outside of the thermal insulation cover.

[0013] In the above solution, the temperature regulating device further includes a temperature measuring component; the temperature measuring component is disposed in the thermal insulation cover and is used to measure the temperature of the electronic device.

[0014] In the above solution, the material of the thermal insulation cover includes phenolic plastic.

[0015] In the above solution, the electronic device includes a control chip.

[0016] An embodiment of the present invention further provides an aging test system, which is characterized by comprising:

[0017] The above-mentioned temperature regulating device;

[0018] The aging test substrate includes at least one interface; the interface is used to connect at least one product under test; the electronic device is arranged on the aging test substrate; the aging test substrate is used to control the product under test to enter a state of aging test;

[0019] A control device, wherein the temperature regulating component of the temperature regulating device is connected to the control device; the direction and magnitude of the current applied to the temperature regulating component are adjusted through the control action of the control device;

[0020] The aging test box has a housing space for accommodating the temperature regulating device and the aging test substrate; the aging test box is connected to the control device and is used to provide a temperature environment for aging testing in the housing space under the control of the control device.

[0021] In the above embodiment, the burn-in test system further includes an output device connected to the control device; the output device is configured to output the test results under the control of the control device. In the above embodiment, the product under test is disposed on the third surface of the burn-in test substrate; the electronic device is disposed on the fourth surface of the burn-in test substrate; and the third and fourth surfaces are opposite surfaces.

[0022] In the above solution, the product under test includes a memory device.

[0023] In the above solution, the memory device includes: a solid state drive, an embedded memory, or a universal flash memory storage.

[0024] A temperature regulating device proposed in an embodiment of the present invention includes: a temperature regulating component having a first surface and a second surface opposite to the first surface; wherein, when conducting a low-temperature test of an aging test, an electric current in a first direction is applied to the temperature regulating component to heat the electronic device arranged on the first surface; when conducting a high-temperature test of an aging test, an electric current in a second direction is applied to the temperature regulating component to dissipate heat from the electronic device through the first surface; the electronic device is used to assist the tested product in performing aging testing during the aging test; a thermal insulation cover at least surrounds the electronic device and is used to slow down the heat exchange between the inside and outside of the thermal insulation cover. In the embodiment of the present invention, by adjusting the current direction on the temperature adjustment component, the electronic device located on the first surface of the temperature adjustment component is heated or dissipated, so that the electronic device is always in a suitable temperature environment when assisting the tested product to perform aging test. At the same time, the thermal insulation cover can make the electronic device in a suitable temperature environment in thermal equilibrium in the high and low temperature environments of the aging test. Therefore, the electronic device can always be stably at a suitable temperature when assisting the tested product to perform aging test. In this way, the service life of the electronic device can be improved, thereby ensuring the stability and efficiency of the aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of an aging test system in related technology;

[0026] Figure 2 A schematic structural diagram of an aging test system provided by an embodiment of the present invention;

[0027] Figure 3 A schematic structural diagram of another aging test system provided by an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of the structural principle of a semiconductor refrigeration plate provided in an embodiment of the present invention;

[0029] Figure 5 A schematic structural diagram of another aging test system provided by an embodiment of the present invention;

[0030] Figure 6 A schematic diagram of an aging test system operating under a high temperature test of an aging test provided by an embodiment of the present invention;

[0031] Figure 7 A schematic diagram of an aging test system operating under a low-temperature test of an aging test provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0033] In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "up", "down", "top", "bottom", "left", "right", "front", "back", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0034] Figure 1 Schematic diagram of an aging test system in related art. Figure 1 The aging test device 10 includes an aging test substrate 101, a controller 103, a daughter board 102 of the controller, a metal shell 104, and a plurality of aging bases 105; wherein the aging base 105 is used to install the product under test ( Figure 1 The metal housing 104 is used to shield electromagnetic interference, and the controller 103 is used to assist and guide the product to be tested to enter the aging test state.

[0035] However, when performing a burn-in test using the aforementioned burn-in measurement system, controller 103 enters the burn-in test chamber (also known as a burn-in oven) along with the chip being tested. Therefore, controller 103 is exposed to both high and low temperatures during the test. Furthermore, controller 103 is repeatedly used during the burn-in test, so it is prone to experiencing a short service life, which can severely impact test stability and efficiency.

[0036] One solution is to introduce a ribbon cable between the controller and the burn-in test substrate. Figure 2In some embodiments, the burn-in test system 20 includes a burn-in test substrate 201, a controller 203, a controller daughterboard 202, a cable C connecting the controller daughterboard and the burn-in test substrate, a metal housing 204, and multiple burn-in bases 205. The burn-in test substrate 201 is connected to the controller daughterboard 202, which houses the controller 203, via the cable C. When a product under test is to be burn-in tested, the product under test is first inserted into the burn-in base 205. The burn-in base 205, burn-in test substrate 201, and metal housing 204 are then placed in a burn-in oven. The controller daughterboard 202 and controller 203 are then placed outside the burn-in oven. The cable C isolates the areas inside and outside the burn-in oven, protecting the controller 203 from the extreme high and low temperatures within the burn-in oven. However, in this case, connecting the cable C is time-consuming and therefore is not commonly used for burn-in testing of products under test during mass production.

[0037] It should be noted that in addition to the above-mentioned problems faced by the controller, electronic devices that enter the aging furnace together are at risk of being affected by extreme temperatures.

[0038] In this regard, an embodiment of the present invention provides a temperature regulating device to solve the problem of extreme temperatures faced by electronic devices such as the above-mentioned controller.

[0039] Combine Figure 3 , Figure 3 Schematic diagram of an aging test system according to an embodiment of the present invention. The aging test system 30 includes a temperature adjustment device 301. The temperature adjustment device 301 according to the embodiment of the present invention includes:

[0040] The temperature adjustment component 3011 has a first surface and a second surface opposite to the first surface. During a low-temperature aging test, a current in a first direction is applied to the temperature adjustment component 3011 to heat the electronic device 302 disposed on the first surface. During a high-temperature aging test, a current in a second direction is applied to the temperature adjustment component 3011 to dissipate heat from the electronic device 302 through the first surface. The electronic device 302 is used to assist the product under test in the aging test.

[0041] The thermal insulation cover 3012 at least surrounds the electronic device 302 and is used to slow down the heat exchange between the inside of the thermal insulation cover 3012 and the outside of the thermal insulation cover 3012.

[0042] Here, the temperature adjustment component 3011 has a first surface and a second surface, wherein the first surface and the second surface are opposite each other. In some embodiments, the first surface is adjacent to the surface of the electronic device 302. In some embodiments, during the low-temperature test of the aging test, heat needs to be generated on the first surface to protect the electronic device 302 from the effects of the low temperature, thereby keeping the simulated electronic device 302 approximately within the target temperature range. Similarly, in some embodiments, during the high-temperature test of the aging test, a low temperature needs to be generated on the first surface to protect the electronic device 302 from the effects of the high temperature, thereby keeping the electronic device 302 approximately within the target temperature range. The target temperature range herein refers to the appropriate temperature range for the electronic device 302 during its expected lifespan. In actual applications, the target temperature range will vary depending on the electronic device; generally, the target temperature range is 15°C-35°C. Here, the high temperature in the high-temperature test described in the embodiments of the present invention refers to the temperature corresponding to the extreme thermal environment that the product under test may experience in actual application scenarios, such as below 50°C, for example, 60°C-100°C. The low temperature used in the low-temperature test described in the embodiments of the present invention refers to the temperature corresponding to the extreme cold environment that the product under test may experience in actual application scenarios. For example, it is below 0°C, such as -55°C to -10°C. It should be noted that the high temperature described herein depends on the requirements of the actual application scenario of the product under test and is not limited to the specific temperature range mentioned above.

[0043] In practical applications, heating the first surface of the temperature adjustment component 3011 can be achieved by applying a current in a first direction to the temperature adjustment component 3011. Conversely, heat dissipation from the electronic device 303 through the first surface can be achieved by applying a current in a second direction to the temperature adjustment component 3011. Here, the first direction and the second direction of the current are opposite.

[0044] In some embodiments, the temperature regulating component 3011 includes a semiconductor refrigeration chip.

[0045] In practical applications, the principle of semiconductor refrigeration is to utilize the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple composed of two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the galvanic couple respectively, thus achieving the purpose of cooling and heating respectively at both ends of the galvanic couple.

[0046] Figure 4 Schematic diagram of the structure principle of the semiconductor refrigeration plate provided by the embodiment of the present invention. Figure 4Specifically, an N-type semiconductor and a P-type semiconductor are connected in series to form a thermocouple. The materials of the N-type and P-type semiconductors can be, for example, a ternary solid solution alloy based on bismuth telluride, where the P-type is Bi2Te3—Sb2Te3 and the N-type is Bi2Te3—Bi2Se3. When current flows through a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, and heat is transferred from one end to the other, thereby generating a temperature difference to form a hot and cold end. For example, when a current flows in the positive direction, the lower surface has a heating effect. In this case, the upper surface of the semiconductor refrigeration sheet has a cooling effect. Conversely, when a current flows in the reverse direction, the lower surface has a cooling effect, while the upper surface of the semiconductor refrigeration sheet has a heating effect. Therefore, the semiconductor refrigeration sheet has both cooling and heating functions, so a single piece can replace separate heating and cooling systems.

[0047] In some embodiments, the number of stages of the semiconductor refrigeration plate includes N stages; wherein N is a positive integer, and N is determined according to the temperature of the high temperature test and the temperature of the low temperature test of the aging test.

[0048] Here, when N is greater than 1, the multi-stage semiconductor refrigeration plate is formed by alternating the cooling and heating surfaces of two or more semiconductor refrigeration plates. In practical applications, a single-stage semiconductor refrigeration plate can provide a temperature difference of about 60°C, that is, the cold end temperature can reach -10°C to -20°C. It can be understood that by combining semiconductor refrigeration plates into a stack, that is, by combining the same type of stacks in series and parallel to form a refrigeration system, it is possible to achieve a power greater than that of a single-stage semiconductor refrigeration plate. For example, the cooling or heating power of a multi-stage semiconductor refrigeration plate can range from a few milliwatts to tens of thousands of watts. Therefore, increasing the number of stages of semiconductor refrigeration plates can increase the temperature difference generated at both ends of the semiconductor refrigeration plate, further achieving a wider temperature adjustment range.

[0049] It can be understood that the higher the high-temperature test temperature of the aging test, or the lower the low-temperature test temperature of the aging test, the greater the number of stages required for the semiconductor refrigeration plate. Those skilled in the art can determine the number of stages required for the semiconductor refrigeration plate based on factors such as the power of the semiconductor refrigeration plate.

[0050] It should be noted that the semiconductor refrigeration chip is a device that can produce both cold and hot temperatures. Therefore, a hot and cold interface is easily generated around the semiconductor refrigeration chip, and condensation water is easily generated at these interfaces. Based on this, the semiconductor refrigeration chip and electronic devices in the temperature control component need to be treated with certain waterproof and moisture-proof methods to ensure the normal operation of the temperature control component.

[0051] Here, combined Figure 3The thermal insulation cover 3012 at least surrounds the electronic device 302 and is used to isolate the temperature of the electronic device 302 from the ambient temperature in the aging test chamber to ensure that the temperature of the electronic device 302 can be maintained.

[0052] It is understandable that since the electronic device 302 is used to assist the product under test in the aging test, the entire temperature control device is also placed in the high and low temperature environment of the aging test. In order to ensure the temperature regulation effect of the temperature control component 3011 on the electronic device 302, it is necessary to set a thermal insulation cover 3012 to slow down the heat exchange between the inside of the thermal insulation cover 3012 and the outside of the thermal insulation cover 3012 as much as possible. Here, the heat refers to the energy transferred when energy is transferred from a high-temperature object to a low-temperature object. At this time, the energy transferred is defined as a positive value. It is understandable that the energy transferred when energy is transferred from a low-temperature object to a high-temperature object can be a negative value, which can be called negative heat or cold.

[0053] In some embodiments, the material of the thermal shield 3012 may include phenolic plastic.

[0054] Bakelite, also known as bakelite, is a material with high mechanical strength, good insulation, thermal insulation, heat resistance and corrosion resistance. Therefore, it is often used in the manufacture of electronic device materials, such as thermal insulation casings.

[0055] The thermal insulation cover 3012 of the embodiment of the present invention may also include other thermal insulation and heat-resistant materials, not limited to phenolic plastics.

[0056] Further, combined with Figure 3 In order to transfer the heat or cold generated by the temperature regulating component 3011 to the electronic device 302 to a greater extent, in some embodiments, the temperature regulating device 301 further includes: a first metal thermal conductive plate 3013, located between the electronic device 302 and the first surface, for transferring the heat generated by the first surface to the electronic device 302; wherein the first metal thermal conductive plate 3013 completely covers the surface of the electronic device 302.

[0057] Here, the first metal thermal conductor 3013 is located between the electronic device 302 and the first surface and the first metal thermal conductor 3013 completely covers the surface of the electronic device 302. The principle is that on the one hand, the heat or cold generated by the temperature adjustment component 3011 can be transferred more evenly to the electronic device 302 by utilizing the thermal conductivity of the metal. On the other hand, it prevents the local part of the electronic device 302 from being exposed to the high or low temperature of the test during the aging test, thereby preventing the local part of the electronic device 302 from being affected by the high or low temperature, thereby achieving better protection effect and extending the life of the electronic device 302.

[0058] Furthermore, in the temperature control device 301, since the thermal insulation cover 3012 needs to at least surround the electronic device 302 and also needs to transfer the cooling or heat generated by the second surface of the temperature control component to the outside of the thermal insulation cover 3012, in some embodiments, the thermal insulation cover 3012 includes a notch that exposes the second surface. It is understood that this notch allows at least a portion of the second surface to be exposed outside the environment in which the aging test is performed. At the same time, the cooling or heat generated by the second surface needs to be transferred to the outside. Therefore, in some embodiments, the temperature control device further includes: a second metal thermal conductive sheet 3014 covering the exposed second surface and used to transfer the heat generated by the second surface to the outside of the thermal insulation cover 3012.

[0059] The function of the second metal thermal conductive sheet 3014 is similar to that of the first metal thermal conductive sheet 3013 , that is, to transfer the heat or cold generated by the temperature adjustment component 3011 to the outside of the thermal insulation cover 3012 more evenly.

[0060] In practical applications, in order to ensure that the electronic device 302 is always at a reasonable temperature, it is necessary to monitor the surface temperature of the electronic device 302 or the temperature at which it is located, and adjust the heat or cold generated by the temperature adjustment component 3011 according to the monitored temperature value. Therefore, a temperature measuring component ( Figure 3 Not shown) and the controller ( Figure 3 not shown).

[0061] In some embodiments, the temperature regulating device 301 further includes a temperature measuring component; the temperature measuring component is disposed in the temperature-insulating cover and is used to measure the temperature of the electronic device;

[0062] In practical applications, the temperature measuring component can be a temperature sensor, such as a thermocouple or a thermistor diode. The location of the temperature sensor can be determined based on its function. For example, if the temperature measuring component is a thermocouple temperature sensor, it can be located inside the thermal shield 3012. In this case, the monitored temperature is the ambient temperature of the electronic device 302. If the temperature measuring component is a thermistor diode, it can be integrated into the printed circuit board (PCB) on which the electronic device 302 is mounted.

[0063] In some embodiments, the electronic device 302 may be a control chip.

[0064] For example, when the product under test is a memory chip, the electronic device 302 may be a memory controller responsible for controlling the memory chip to perform operations such as data writing, reading, and erasing.

[0065] For example, when the product under test is a system on chip (SoC) or a central processing unit (CPU), the electronic device 302 may be an operation control chip or a main control chip responsible for executing frequency control, voltage control, etc.

[0066] For example, when the product under test is a display semiconductor, such as a light-emitting diode (LED) display panel, an organic light-emitting diode (OLED) display panel, etc., the electronic device 302 may be a display driving unit.

[0067] The embodiment of the present invention also provides an aging test system, combined with Figure 5 , Figure 5 Schematic diagram of the composition of an aging test system 40 according to an embodiment of the present invention. The aging test system 40 includes: a temperature adjustment device 401, an aging test substrate 402, an aging test box 403 and a control device;

[0068] The temperature regulating device 401 has been described in detail above and will not be described again here.

[0069] The aging test substrate 402 includes at least one interface for connecting at least one product under test; the electronic device is arranged on the aging test substrate; and the aging test substrate is used to control the product under test to enter a state for aging test.

[0070] Here, the aging test substrate 402 may include one or more interfaces (ie, the aforementioned aging base), so as to perform aging tests on multiple products to be tested at the same time. Figure 5 Figure 4 shows a burn-in test substrate 402 including four interfaces 4021, 4022, 4023, and 4024. The burn-in test substrate of this embodiment may include any number of interfaces. The interfaces are used to connect to the product under test. In practical applications, the product under test can be connected to the interfaces via a plug-in connection. That is, one product under test can be plugged into one interface.

[0071] For the electronic device ( Figure 5 The interface and the electronic components may be provided on the same surface of the burn-in test substrate 402 or on different surfaces of the burn-in test substrate 402. The burn-in test substrate is used to control the product under test to enter a burn-in test state.

[0072] In some embodiments, the product under test is disposed on the third surface of the aging test substrate 403 ; the electronic device is disposed on the fourth surface of the aging test substrate 402 ; and the third surface and the fourth surface are opposite surfaces to each other.

[0073] Here, because the electronic device and the product under test are exposed to different temperature environments during the burn-in test, it is preferred to place them on opposite sides of the burn-in test substrate 403. In this way, the product under test and the electronic device can be placed at the test temperature and normal temperature, respectively. This not only achieves high-intensity testing that simulates the various harsh conditions that the product under test will experience during actual use, but also protects the electronic device from the effects of these simulated harsh conditions and high-intensity testing, thereby increasing the lifespan and stability of the electronic device and improving the efficiency of the burn-in test.

[0074] The aging test box 403 of the aging test system 40 in the embodiment of the present invention has a housing space for accommodating the temperature adjustment device 401 and the aging test substrate 402, and is used to provide a temperature environment for aging testing in the housing space under the control of the control device.

[0075] It can be understood that since the aging test of the product to be tested refers to the process of simulating the various factors involved in the actual use conditions of the product (this article mainly discusses extreme temperatures) to strengthen the corresponding conditions of the product aging, the environment that needs to be simulated needs to provide an extremely high temperature or extremely low temperature scene within a certain space. The aging test box 403 here can provide a storage space for the temperature regulating device 401 and the aging test substrate 402 on the one hand, and provide the extreme temperature required for the aging test on the other hand. Those skilled in the art can use appropriate means to provide high temperature, for example, using heating wires and the like. Suitable means can also be used to provide low temperature, such as compressors and the like.

[0076] In the embodiment of the present invention, the control of the aging test system 40 is connected to the temperature adjustment component of the temperature adjustment device 401. The direction and magnitude of the current applied to the temperature adjustment component are adjusted through the control of the control device.

[0077] In some embodiments, when a high-temperature aging test is required for the product under test, the aging test chamber 403 provides a high-temperature environment. Conversely, when a low-temperature aging test is required for the product under test, the aging test chamber 403 provides a low-temperature environment. The methods for providing high or low temperatures have been described in detail above and will not be repeated here.

[0078] That is to say, in practical applications, the device for controlling the temperature adjustment component can be integrated into the control device of the aging test system.

[0079] It should be noted that the control device can also control the burn-in test equipment to perform normal burn-in tests. For example, the control device can control the power supply device of the burn-in test system to provide the test voltage environment required for the product under test to undergo burn-in; the control device can also control the output device of the burn-in test system to output test results.

[0080] In some embodiments, the product under test includes a memory device, which may be a packaged memory chip or a system including a packaged memory chip, such as flash memory. In some embodiments, the flash memory may be in the form of, but not limited to, a solid-state drive (SSD), an embedded multi-media card (eMMc), or a universal flash storage (UFS).

[0081] Through the aging test system of the embodiment of the present invention, aging tests can be performed on the products under test in batches. Since the temperature method protects the electronic devices that assist the products under test in the aging test during the aging test, the life of the electronic devices can be increased, thereby improving the test stability and test efficiency.

[0082] The following will be combined Figure 6 and Figure 7 The operation of the aging test device of the present invention is described through different embodiments.

[0083] Figure 6 A schematic diagram of an aging test system operating under a high temperature test of an aging test provided by an embodiment of the present invention. Figure 6 The burn-in test system (not shown) is subjected to a high-temperature burn-in test at 85°C. The burn-in test system includes an electronic device to be protected 502, a daughter board 503 of the electronic device, a burn-in test substrate 504, burn-in bases 5051-5055, a semiconductor cooling plate 5011, an upper metal plate 5012 (related to the first metal thermal conductive plate mentioned above), a lower metal plate 5013 (related to the second metal thermal conductive plate mentioned above), and a metal shielding shell 506.

[0084] Multiple products to be tested are placed in the slots of the aging bases 5051 to 5055 for testing. When the product to be tested is at 85°C, the upper surface of the semiconductor refrigeration chip 5011 needs to be cooled so that the electronic device 502 can be stabilized within the temperature range of 15°C to 35°C. The direction of the current flowing through the semiconductor refrigeration chip 5011 is controlled by the control signal sent by the control device of the test system. In this case, the direction of the current flowing through the semiconductor refrigeration chip 5011 is as follows: Figure 6As shown, the upper surface of the semiconductor refrigeration plate 5011 is cooled, thereby maintaining a temperature of 25°C to 35°C on the upper surface and transferring heat through the upper metal plate 5012 to form a balance.

[0085] Figure 7 A schematic diagram of the operation of an aging test system under a low-temperature test for an aging test provided by an embodiment of the present invention. Different from the previous example, when the product to be tested is subjected to a high-temperature aging test at -10°C, the upper surface of the semiconductor refrigeration plate needs to be heated so that the electronic device 502 is stabilized within a temperature range of 25°C to 35°C. The direction of the current flowing through the semiconductor refrigeration plate 5011 is controlled by a control signal emitted by the control device of the test system. In this case, the direction of the current flowing through the semiconductor refrigeration plate 5011 is opposite to that in the previous example, as shown in FIG. Figure 7 At this time, the upper surface of the semiconductor refrigeration plate 5011 is heated, so that the temperature of the upper surface is maintained at 25° C. to 35° C. and heat is transferred through the upper metal plate 5012 to form a balance.

[0086] Through the aging test system of the embodiment of the present invention, whether in an extremely high temperature environment or an extremely low temperature environment, it is possible to control the direction of the current flowing through the semiconductor refrigeration plate as needed to ensure that the electronic devices that need to be protected are always at an appropriate temperature when assisting the tested product in the aging test. In this way, the service life of the electronic devices can be improved, thereby ensuring the stability and efficiency of the aging test.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature regulating device, characterized in that: include: A temperature adjustment component having a first surface and a second surface opposite to the first surface; wherein, during a low-temperature aging test, a current in a first direction is applied to the temperature adjustment component to heat an electronic device disposed on the first surface; and during a high-temperature aging test, a current in a second direction is applied to the temperature adjustment component to dissipate heat from the electronic device through the first surface; the electronic device is used to assist a product under test in performing aging testing during the aging test. A thermal insulation cover, at least surrounding the electronic device, and used to slow down the heat exchange between the inside of the thermal insulation cover and the outside of the thermal insulation cover; The temperature regulating component includes a semiconductor refrigeration plate; The thermal insulation cover has a gap that exposes the second surface; The temperature regulating device further comprises: a second metal thermal conductive sheet covering the exposed second surface and used for transferring heat generated by the second surface to the outside of the thermal insulation cover.

2. The temperature regulating device according to claim 1, characterized in that The number of stages of the semiconductor refrigeration plate includes N stages; wherein N is a positive integer, and N is determined according to the temperature of the high temperature test and the temperature of the low temperature test of the aging test.

3. The temperature regulating device according to claim 1, characterized in that The temperature regulating device further includes: a first metal thermal conductive sheet located between the electronic device and the first surface, for transferring heat generated by the first surface to the electronic device; wherein the first metal thermal conductive sheet completely covers the surface of the electronic device.

4. The temperature regulating device according to claim 1, characterized in that The temperature regulating device further comprises a temperature measuring component; the temperature measuring component is arranged in the temperature-insulating cover and is used to measure the temperature of the electronic device.

5. The temperature regulating device according to claim 1, characterized in that The material of the heat insulation cover includes phenolic plastic.

6. The temperature regulating device according to claim 1, characterized in that The electronic device includes a control chip.

7. An aging test system, characterized in that: include: The temperature regulating device according to any one of claims 1 to 6; A burn-in test substrate, comprising at least one interface; the interface is used to connect at least one product under test; the electronic device is arranged on the burn-in test substrate; The aging test substrate is used to control the product under test to enter the state of aging test; A control device, wherein the temperature regulating component of the temperature regulating device is connected to the control device; the direction and magnitude of the current applied to the temperature regulating component are adjusted through the control action of the control device; An aging test box having a housing space for accommodating the temperature adjustment device and the aging test substrate; The aging test box is connected to the control device and is used to provide a temperature environment for aging testing in the accommodating space under the control of the control device.

8. The aging test system according to claim 7, characterized in that: The aging test system further includes an output device; the output device is connected to the control device; and the output device is used to control the output device to output the test result under the control of the control device.

9. The aging test system according to claim 7, characterized in that: The product under test is arranged on the third surface of the aging test substrate; the electronic device is arranged on the fourth surface of the aging test substrate; and the third surface and the fourth surface are opposite surfaces to each other.

10. The aging test system according to claim 7, characterized in that: The product under test includes a memory device.

11. The aging test system according to claim 10, characterized in that: The memory device includes: a solid state drive, an embedded memory, or a universal flash memory storage.

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