Standing wafer holder

Abstract

The present invention discloses a standing wafer holder, which includes at least one base unit; the base unit includes a first wafer seat and a second wafer seat; the first wafer seat has a first curved concave surface on the top, which forms a first active surface on the side facing the second wafer seat, the first active surface corresponds to the area where the first curved concave surface is located, and the shape of the first active surface is a left side structure after the Y-shaped vertical half is divided; the second wafer seat has a second curved concave surface on the top, which forms a second active surface on the side facing the first wafer seat, the second active surface corresponds to the area where the second curved concave surface is located, and the shape of the second active surface is a right side structure after the Y-shaped vertical half is divided; the first active surface and the second active surface cooperate to support the wafer to stand vertically. The present invention rationally utilizes the space in the vertical direction; the design of the first curved concave surface and the second curved concave surface, the first active surface and the second active surface makes it possible for the wafer to be placed in the holder with part of the arc as a whole limited, making it more stable.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor integrated circuit chip manufacturing, and in particular relates to a standing wafer holder. Background Art

[0002] Chemical mechanical planarization (CMP) is a process used in integrated circuit manufacturing. With technological advancements, the requirements for processing technology are increasing. CMP equipment typically consists of a front-end module (EFEM), a cleaning unit, a polishing unit, and a transfer unit. The EFEM primarily includes a wafer cassette, a wafer transfer robot, and an air purification system. The cleaning unit primarily consists of varying numbers of megasonic cleaning components, a roller brush cleaning unit, a drying unit, and a device for transferring wafers between components. The polishing unit primarily includes a polishing table, a polishing head, a polishing fluid supply system, and a polishing pad conditioning system. The transfer module, consisting of a series of robots or mobile platforms, transports wafers to be polished from the EFEM to the polishing unit and transfers polished wafers from the polishing unit to the cleaning unit.

[0003] The flat width of a 6-inch wafer is as long as 57.5mm, which can easily lead to unstable vertical placement of the wafer, causing the wafer to tilt and shift in position, affecting subsequent transmission. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a standing wafer holder that is not affected by the gap and can achieve stable support of the wafer.

[0005] The technical solution adopted by the present invention to solve its technical problem is: the technical solution adopted by the present invention to solve its technical problem is: a standing wafer holder,

[0006] including at least one base unit;

[0007] The base unit includes a first wafer bed and a second wafer bed;

[0008] The top of the first wafer seat has a first arc-shaped concave surface, and the side of the first arc-shaped concave surface facing the second wafer seat forms a first active surface. The first active surface corresponds to the area where the first arc-shaped concave surface is located, and the shape of the first active surface is a left side structure after being vertically divided into two halves of a Y shape;

[0009] The second wafer seat has a second arc-shaped concave surface on the top, and a second active surface is formed on the side facing the first wafer seat. The second active surface corresponds to the area where the second arc-shaped concave surface is located, and the shape of the second active surface is a right side structure after the Y shape is vertically divided in half;

[0010] The first active surface and the second active surface cooperate to support the wafer to stand vertically.

[0011] The present invention provides a first arc-shaped concave surface on the top of the first wafer seat, and a second arc-shaped concave surface on the top of the second wafer seat. The two arc-shaped concave surfaces are continuous surfaces or discontinuous surfaces. The corresponding first action surface and second action surface cooperate to form a stable support for the wafer. The wafer is fixed in a high position and will not shift, which is convenient for subsequent transmission of the wafer; even if there is a large notch in the wafer, it will not shake, and there is no need to accurately locate and control the position of the notch; the wafer stands vertically, getting rid of the large space problem caused by horizontal storage, reducing the floor space of the base unit, and having high space utilization. In addition, vertical storage is more convenient for the robot to pick up and place for the cleaning box in which the subsequent cleaning modules are all vertically placed wafers.

[0012] Furthermore, the first active surface forms a line contact with the wafer, and the second active surface forms a line contact with the wafer, so as to support the wafer to stand vertically;

[0013] Alternatively, the first active surface forms line contact with the wafer, and the second active surface forms surface contact with the wafer, so as to support the wafer to stand vertically;

[0014] Alternatively, the first active surface contacts the wafer forming surface, and the second active surface contacts the wafer forming surface, so as to support the wafer to stand vertically.

[0015] The first active surface and the second active surface respectively form line contact with the wafer, with a small contact area, which minimizes the impact on the wafer performance; the first active surface forms line contact with the wafer, and the second active surface forms surface contact with the back of the wafer, and the performance of the front of the wafer will not be affected; the first active surface and the second active surface respectively form surface contact with the edge of the wafer, making the support structure of the wafer more stable.

[0016] Furthermore, the first active surface includes a first inclined surface and a first vertical surface, and the second active surface includes a second inclined surface and a second vertical surface. The first vertical surface and the second vertical surface are in direct contact with each other, and the first inclined surface and the second inclined surface are in line contact with the wafer. The first inclined surface and the second inclined surface are V-shaped, which facilitates the placement of the wafer. Both inclined surfaces form line contact with the wafer, resulting in a small contact area.

[0017] Furthermore, the first active surface includes a first inclined surface and a first vertical surface, and the second active surface includes a second inclined surface and a second vertical surface; the first vertical surface and the second vertical surface are in contact with each other in an offset manner, with the first inclined surface in line contact with the wafer, and the offset portion of the second vertical surface and the first vertical surface in contact with the wafer surface; or the second inclined surface in line contact with the wafer, and the offset portion of the first vertical surface and the second vertical surface in contact with the wafer surface. The wafer is firmly supported and will not shift even if the notch is facing downward.

[0018] Furthermore, the first active surface includes a first inclined surface and a first vertical surface, and the second active surface includes a second inclined surface and a second vertical surface; the first vertical surface and the second vertical surface are in contact with the outer edge surfaces of both side surfaces of the wafer respectively.

[0019] Furthermore, the bottom of the first vertical surface or the second vertical surface forms a support surface perpendicular thereto, and the bottom of the second vertical surface or the first vertical surface forms a stepped surface. The stepped surface is mounted on the support surface and can be translated along the support surface to adjust the spacing between the first vertical surface and the second vertical surface. The spacing is adjustable to accommodate different wafer types and provide high flexibility. The thickness tolerance during wafer processing is subject to change, and the adjustable spacing can accommodate such processing errors.

[0020] Furthermore, the contact width between the wafer and the first vertical surface or / and the second vertical surface is h, and the radius of the wafer is R, then h:R is 0.01-1. The above numerical setting not only does not scratch the wafer surface, but also saves space, makes the wafer placement more stable, and reduces the possibility of fragmentation.

[0021] Furthermore, the central angle of the first arc-shaped concave surface and / or the second arc-shaped concave surface is 30-180 degrees. This allows the entire arc to be positioned after the wafer is placed in the holder, ensuring a secure support for the wafer and providing greater stability. This can accommodate 6-inch, 8-inch, and 12-inch wafers.

[0022] Furthermore, the invention comprises a plurality of base units, wherein the second wafer base and the first wafer base of adjacent base units are integrally arranged. The plurality of base units can be combined arbitrarily, and the structure is more compact, thereby accommodating more wafers, having high applicability and wide application.

[0023] Furthermore, the first wafer bed and the second wafer bed are configured as an integrated structure.

[0024] Furthermore, the first arc-shaped concave surface and / or the second arc-shaped concave surface are continuously or discontinuously arranged, and the structures of the first active surface and / or the second active surface are the same or different.

[0025] The beneficial effects of the present invention are: 1) vertical storage of wafers makes rational use of the vertical space and gets rid of the large space problem caused by horizontal storage. In addition, vertical storage is more convenient for the robot to pick up and place the wafers for the cleaning box in which the subsequent cleaning modules are all vertically placed wafers; 2) the design of the first arc-shaped concave surface and the second arc-shaped concave surface, the first action surface and the second action surface makes it more stable after the wafer is placed in the holder, with part of the arc being limited as a whole; 3) the wafer and the holder realize linear support or surface support, and the wafer with a notch can be well fixed even if the notch part contacts the holder, and the wafer does not need the notch part to face upward, that is, there is no need to accurately locate and control the position of the notch part; 4) 2-piece support wafers can also be combined with multiple pieces to support multiple wafers, which requires less additional space. When there are multiple pieces, the two sides of the single piece are respectively designed with action surfaces, making the structure more compact; 5) the wafers are stored stably, and will not shift even if part of the wafer arc contacts the first action surface and the second action surface; 6) the performance of the wafer will not be affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a front view of the base unit according to the first embodiment of the present invention.

[0027] Figure 2 This is a three-dimensional diagram of the base unit according to the first embodiment of the present invention.

[0028] Figure 3 This is a side view of multiple base units according to the first embodiment of the present invention.

[0029] Figure 4 for Figure 3 AA half section view in.

[0030] Figure 5 for Figure 4 A magnified view of the structure at point B in FIG.

[0031] Figure 6 This is a three-dimensional diagram of multiple base units according to the first embodiment of the present invention.

[0032] Figure 7 This is a three-dimensional diagram of a base unit according to a second embodiment of the present invention.

[0033] Figure 8 It is a side view of the base unit according to the second embodiment of the present invention.

[0034] Figure 9 for Figure 8 CC section view in.

[0035] Figure 10 for Figure 9 A magnified view of the structure at point D in the figure.

[0036] Figure 11 This is the main view of embodiment 3 of the present invention.

[0037] Figure 12 This is a three-dimensional diagram of embodiment 3 of the present invention.

[0038] Figure 13 This is a side sectional view of embodiment 3 of the present invention.

[0039] Figure 14 for Figure 13 Enlarged view of the structure at E in . DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0041] Example 1

[0042] like Figure 1-Figure 5 As shown, a standing wafer chuck includes at least one base unit 10 , and the base unit 10 includes a first wafer base 1 and a second wafer base 2 .

[0043] The top of the first wafer bed 1 has a first curved concave surface 11. The side of the first wafer bed 1 facing the second wafer bed 2 forms a first active surface 12. This first active surface 12 corresponds to the area where the first curved concave surface 11 is located. The first active surface 12 is shaped like the left side of a Y-shaped structure that is vertically divided in half. The central angle of the first curved concave surface 11 is between 90° and 180°.

[0044] The second wafer bed 2 has a second curved concave surface 21 on its top. A second active surface 22 is formed on the side of the second wafer bed 2 facing the first wafer bed 1. This second active surface 22 corresponds to the area where the second curved concave surface 21 is located. The second active surface 22 is shaped like the right side of a Y-shaped vertically divided half. The central angle of the second curved concave surface 21 is 30-180°, preferably 90-180°.

[0045] The first active surface 12 and the second active surface 22 cooperate to support the wafer 3 to stand vertically.

[0046] In this embodiment, the outer edge of the wafer 3 has a notch 31 , which is formed by horizontally cutting the edge of the wafer 3 , that is, has a plane, and the plane width of the notch 31 reaches 55-60 mm.

[0047] In this embodiment, the cross-sections of the first wafer bed 1 and the second wafer bed 2 are both trapezoidal structures with a larger upper portion and a smaller lower portion. Of course, in other embodiments, they may also be square or other structures.

[0048] like Figure 4 As shown, the first active surface 12 forms line contact with the wafer 3 , and the second active surface 22 forms surface contact with the wafer 3 , thereby supporting the wafer 3 to stand vertically.

[0049] More specifically, Figure 5 As shown, the first active surface 12 includes a first inclined surface 121 and a first vertical surface 122, and the second active surface 22 includes a second inclined surface 221 and a second vertical surface 222; the first vertical surface 122 and the second vertical surface 222 are in contact with each other in an offset manner, that is, the tops of the first vertical surface 122 and the second vertical surface 222 are not aligned. At this time, the first inclined surface 121 is in line contact with the wafer 3, or more precisely, in contact with the ridge line between the front and side surfaces of the wafer 3, and the portion where the second vertical surface 222 and the first vertical surface 122 are offset is in surface contact with the wafer 3, that is, a portion of the second vertical surface 222 is directly aligned with the first vertical surface 122, and another portion is higher than the first vertical surface 122, and this portion is aligned with the back edge of the wafer 3 to achieve surface contact, that is, Figure 5 At this time, the front surface of the wafer 3 will not contact the base unit 10 at all, and its performance is guaranteed to the maximum extent.

[0050] The first vertical surface 122 and the second vertical surface 222 may be vertical planes or vertical wavy surfaces, etc. They do not have to be planes, as long as they can contact with the wafer 3 to provide support.

[0051] The width of the portion where the back surface of wafer 3 contacts second vertical surface 222 is defined as h. The radius of wafer 3 is defined as R. Then, h:R is 0.01-1, preferably 0.01-0.06. Furthermore, h:L is greater than 0 and less than or equal to 1. This numerical setting not only prevents scratches on the wafer surface, but also saves space, makes wafer placement more stable, and reduces the possibility of fragmentation.

[0052] like Figure 6 As shown, the number of base units 10 can be multiple, and the second wafer seat 2 and the first wafer seat 1 of adjacent base units 10 are arranged integrally. In other words, the first active surface 12 and the second active surface 22 can be set on both sides of the first wafer seat 1 and the second wafer seat 2.

[0053] In the above-mentioned structure, the first wafer bed 1 and the second wafer bed 2 are separate structures. Of course, in other embodiments, the first wafer bed 1 and the second wafer bed 2 can also be an integrated structure, that is, the first arc-shaped concave surface 11, the second arc-shaped concave surface 21, the second active surface 22 and the first inclined surface 121 are directly formed on the top surface of the base unit 10.

[0054] In this embodiment, the first arcuate concave surface 11 and the second arcuate concave surface 21 are continuous surfaces. Of course, in other embodiments, they can also be discontinuous surfaces. In this case, there are multiple first arcuate concave surfaces 11 and multiple second arcuate concave surfaces 21, that is, there are multiple first active surfaces 12 and multiple second active surfaces 22.

[0055] Example 2

[0056] like Figure 7-10 As shown, the difference between this embodiment and the first embodiment is that the first active surface 12 forms a line contact with the wafer 3 , and the second active surface 22 forms a line contact with the wafer 3 , thereby supporting the wafer 3 to stand vertically.

[0057] More specifically, Figure 10 As shown, the first active surface 12 includes a first inclined surface 121 and a first vertical surface 122, and the second active surface 22 includes a second inclined surface 221 and a second vertical surface 222. The first vertical surface 122 and the second vertical surface 222 are in full face-to-face contact, i.e., the tops of the first and second vertical surfaces 122 and 222 are aligned. The first and second active surfaces 12 and 22 are combined to form a Y-shape. At this time, the first inclined surface 121 is in line contact with the wafer 3, specifically, with the ridgeline between the front and side surfaces of the wafer 3, and the second inclined surface 221 is in line contact with the wafer 3, specifically, with the ridgeline between the back and side surfaces of the wafer 3. In this case, neither the front nor the back of the wafer 3 contacts the base unit 10, and its performance is maximized.

[0058] The first inclined surface 121 and the second inclined surface 221 are in a V-shaped structure with the opening facing upward, and the flared design facilitates the placement of the wafer 3. The inclination angles of the first inclined surface 121 and the second inclined surface 221 can both be about 30°.

[0059] Example 3

[0060] like Figure 11-14 As shown, the difference between this embodiment and the first embodiment is that the first active surface 12 forms a line-surface contact with the wafer 3 , and the second active surface 22 forms a surface contact with the wafer 3 , thereby supporting the wafer 3 to stand vertically.

[0061] More specifically, Figure 14 As shown, the first active surface 12 includes a first inclined surface 121 and a first vertical surface 122, and the second active surface 22 includes a second inclined surface 221 and a second vertical surface 222. The first vertical surface 122 and the second vertical surface 222 are opposite to each other but do not contact each other. The oppositeness here can be completely opposite or offset. In other words, the first active surface 12 and the second active surface 22 form a Y-shaped structure with a gap.

[0062] The first vertical surface 122 and the second vertical surface 222 are in contact with the front and back outer edges of the wafer 3 respectively. The width of the portion where the wafer 3 is in contact with the first vertical surface 122 and the second vertical surface 222 is h, and the radius of the wafer 3 is defined as R, then h:R is 0.01-1, and Figure 14 h in is less than 3mm.

[0063] In order to adjust the distance between the first vertical surface 122 and the second vertical surface 222 to accommodate wafers of different thicknesses, or the adjustable distance can accommodate wafer processing errors, a support surface 223 perpendicular to the first vertical surface 122 or the second vertical surface 222 is formed at the bottom. In this embodiment, the support surface 223 formed at the bottom of the second vertical surface 222 is used as an example for explanation. The support surface 223 extends in the direction of the first vertical surface 122, and a step surface 123 is formed at the bottom of the second vertical surface 222. The step surface 123 can be mounted on the support surface 223 and can be translated along the support surface 223 to adjust the distance between the first vertical surface 122 and the second vertical surface 222, that is, Figure 14 The spacing S in the middle is adjustable, and S=0.5-2mm, preferably S=0.6-1.6mm.

[0064] A threaded hole 13 is opened on the first wafer bed 1. After the distance adjustment is completed, a screw can be screwed into the threaded hole 13 to support the second wafer bed 2, so that the distance between the first wafer bed 1 and the second wafer bed 2 is fixed.

[0065] Example 4

[0066] In the above-mentioned embodiments 1 to 3, the first active surface 12 and the second active surface 22 on a wafer cassette have the same structure. The difference between this embodiment and the above-mentioned embodiments is that the above-mentioned three structures can also be combined, that is, the number of first curved concave surfaces 11 and second curved concave surfaces 21 is multiple. In this case, the above-mentioned three structures can be applied to the same wafer cassette, and adjacent first curved concave surfaces 11 and adjacent second curved concave surfaces 21 can be provided with first active surfaces 12 and second active surfaces 22 of different structures. Of course, the curvature of the first curved concave surface 11 and the second curved concave surface 21 can be the same or different.

[0067] The above specific embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. Stand-up wafer holder, characterized by: The outer edge of the applicable wafer (3) is provided with a notch portion (31), and the notch portion (31) is formed by horizontally cutting the edge of the wafer (3), and its plane width reaches 55-60 mm; At least one base unit (10); The base unit (10) comprises a first wafer seat (1) and a second wafer seat (2); The first wafer seat (1) has a first arc-shaped concave surface (11) on the top, and a first active surface (12) is formed on the side facing the second wafer seat (2). The first active surface (12) corresponds to the area where the first arc-shaped concave surface (11) is located, and the shape of the first active surface (12) is a left side structure after the Y shape is vertically divided in half; The second wafer seat (2) has a second arc-shaped concave surface (21) on the top, and a second active surface (22) is formed on the side facing the first wafer seat (1). The second active surface (22) corresponds to the area where the second arc-shaped concave surface (21) is located, and the shape of the second active surface (22) is a right side structure after the Y shape is vertically divided in half; The first arc-shaped concave surface (11) and the second arc-shaped concave surface (21) are continuously arranged, and the central angle of the first arc-shaped concave surface (11) and / or the second arc-shaped concave surface (21) is 30-180°; The second active surface (22) forms surface contact with the wafer (3) to support the wafer (3) to stand vertically; The first active surface (12) includes a first inclined surface (121) and a first vertical surface (122), and the second active surface (22) includes a second inclined surface (221) and a second vertical surface (222); the first vertical surface (122) and the second vertical surface (222) are in contact with the outer edges of two side surfaces of the wafer (3) respectively; A support surface (223) perpendicular to the first vertical surface (122) or the second vertical surface (222) is formed at the bottom thereof, and a step surface (123) is formed at the bottom of the second vertical surface (222) or the first vertical surface (122). The step surface (123) is mounted on the support surface (223) and can be translated along the support surface (223) to adjust the spacing between the first vertical surface (122) and the second vertical surface (222), wherein the spacing is 0.5-2 mm.

2. The standing wafer holder according to claim 1, characterized in that: The surface contact width between the wafer (3) and the first vertical surface (122) or / and the second vertical surface (222) is h, and the radius of the wafer (3) is R, then h:R is 0.01-1.

3. The standing wafer holder according to claim 1, characterized in that: It comprises a plurality of base units (10), wherein the second wafer seats (2) and the first wafer seats (1) of adjacent base units (10) are integrally arranged.

4. The standing wafer holder according to claim 1, wherein: The structures of the first active surface (12) and / or the second active surface (22) are the same or different.

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