A packaging method for dual-color temperature COB light source and dual-color temperature COB light source

Abstract

This invention discloses a packaging method and a dual-color-temperature COB light source, comprising the following steps: mounting LED chips on the front side of a first substrate; forming a first dam around the perimeter of the first substrate to surround all LED chips; filling the first dam with a first phosphor layer; cutting the first substrate to obtain several low-color-temperature LED strips; mounting LED chips and low-color-temperature LED strips alternately on a second substrate; forming a second dam around the perimeter of the second substrate to surround all LED chips and low-color-temperature LED strips; and filling the second dam with a second phosphor layer. This invention separately prepares the low-color-temperature portion: independent die bonding and dispensing, and low-color-temperature LED strips are prepared by cutting or stripping. The low-color-temperature LEDs are connected to the entire COB through soldering or recess mounting, avoiding the problem of low-color-temperature adhesive covering high-color-temperature chips, reducing the defect rate. Furthermore, the separate preparation of the low-color-temperature LED strips allows for testing; the high-color-temperature LEDs are connected only after confirming the correct color temperature, further reducing the product defect rate.

Description

Technical Field

[0001] The present invention belongs to the technical field of COB light sources, and in particular relates to a packaging method of a dual-color temperature COB light source and a dual-color temperature COB light source. Background Art

[0002] Most of the current dual-color temperature COB packaging uses dams or high thixotropic fluorescent glue as partition boundaries. This type of dam glue or high thixotropic fluorescent glue is easy to shift, resulting in the problem that the glue in the low color temperature part covers the chip in the high color temperature part, thereby affecting the color temperature of the high color temperature part, affecting the stability of the color temperature, and reducing the product yield.

[0003] The traditional dual color temperature COB packaging method is to test the low color temperature and high color temperature together after they are tested together. The color temperature difference of the low color temperature part is large when it is tested separately. When the low color temperature has a problem, it cannot be inspected immediately, and the high color temperature part continues to be tested, which wastes powder glue and has a high scrap rate. Summary of the invention

[0004] In order to overcome the above technical defects, the present invention provides a packaging method of a dual-color temperature COB light source and a dual-color temperature COB light source, which can improve the yield rate.

[0005] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0006] A packaging method for a dual-color temperature COB light source comprises the following steps:

[0007] Mounting the LED chip on the front surface of the first substrate;

[0008] Make a first dam around the periphery of the first substrate to surround all LED chips;

[0009] Filling a first fluorescent glue layer in the first dam;

[0010] Cutting the first substrate to obtain a plurality of low color temperature light strips;

[0011] Mounting LED chips and low color temperature light strips on the second substrate at intervals;

[0012] Make a second dam around the periphery of the second substrate to surround all LED chips and low color temperature light strips;

[0013] A second fluorescent glue layer is filled in the second dam.

[0014] As a further improvement of the present invention, the LED chip is a face-up chip or a flip-chip.

[0015] As a further improvement of the present invention, the first substrate includes: a front electrode and a back electrode which are connected up and down, and the back electrode is connected to the second substrate.

[0016] As a further improvement of the present invention, a plurality of cutting lines are preset on the first substrate, and the first substrate is cut along the cutting lines.

[0017] As a further improvement of the present invention, the low color temperature light strip is welded on the second substrate by welding or groove installation.

[0018] In addition, the present invention also provides a dual-color temperature COB light source, which is manufactured using the above-mentioned packaging method.

[0019] Compared with the prior art, the present invention has the following beneficial effects: the low color temperature part is prepared separately: independent die bonding wire and glue dispensing, and the low color temperature small light strip is prepared by cutting or stripping. The low color temperature is connected to the entire COB by welding or groove installation, avoiding the problem of low color temperature glue covering the high color temperature chip, reducing the defect rate. In addition, the independently prepared low color temperature light strip can be tested, and the high color temperature can be connected after confirming that the color temperature is correct, reducing the product defect rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein:

[0021] Figure 1 This is a flow chart of the packaging method described in Example 1;

[0022] Figure 2 This is a full-page top view of the low color temperature light strip during the manufacturing process described in Example 1;

[0023] Figure 3 This is a full-page back view of the low color temperature light strip during the manufacturing process described in Example 1;

[0024] Figure 4 A top view of the dual-color temperature COB light source described in Example 1;

[0025] Figure 5 This is a cross-sectional view of the dual-color temperature COB light source described in Example 1 along the AA line.

[0026] Marking instructions: 1. Low color temperature light strip; 11. LED chip; 12. First substrate; 121. Front electrode; 122. Back electrode; 123. Cutting line; 13. First dam; 14. First fluorescent glue layer; 2. Dual color temperature COB light source; 21. Second substrate; 22. LED chip; 23. Second dam; 24. Second fluorescent glue layer; 25. Electrode. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0028] Example 1

[0029] This embodiment discloses a packaging method for a dual-color temperature COB light source. Figure 1 As shown, the steps include:

[0030] S1. Mount the LED chip 11 on the front side of the first substrate 12. The LED chip 11 can be a face-up chip or a flip-chip. According to different types of chips, the LED chip 11 is mounted on the first substrate 12 through the process in the prior art, and wires are welded between each column of chips.

[0031] S2 , making a first dam 13 around the periphery of the first substrate 12 to surround all the LED chips 11 .

[0032] S3 , filling the first fluorescent glue layer 14 in the first dam 13 .

[0033] S4, presetting a plurality of cutting lines 123 on the first substrate 12, and cutting the first substrate 12 along the cutting lines 123 to obtain a plurality of low color temperature light strips 1.

[0034] Through the above steps S1 to S4, Figure 2 and Figure 3 As shown, the packaging of the low color temperature light strip 1 can be completed, and the low color temperature part is prepared separately: independent die bonding wire and glue dispensing, and the low color temperature small light strip is made by cutting or stripping. The low color temperature is connected to the entire COB by welding or groove installation, which avoids the problem of low color temperature glue covering the high color temperature chip and reduces the defective rate. In addition, the low color temperature light strip 1 can be prepared independently for testing, and the high color temperature can be connected after confirming that the color temperature is correct, which reduces the product defective rate.

[0035] S5 , mounting the LED chips 22 and the low color temperature light strips 1 on the second substrate 21 at intervals.

[0036] Specifically, the low color temperature light strip 1 has: a front electrode 121 and a back electrode 122 that are conductive up and down, the front electrode 121 is connected to the LED chip 22, and the back electrode 122 is connected to the second substrate 21 by welding. The low color temperature light strip 1 is welded to the second substrate 21 by welding or groove installation.

[0037] S6, making a second dam 23 around the periphery of the second substrate 21 to surround all the LED chips 22 and the low color temperature light strip 1, and a plurality of electrodes 25 are provided on the second substrate 21;

[0038] S7, fill the second fluorescent glue layer 24 in the second dam 23, and then the packaging of the dual color temperature COB light source 2 can be completed. Figure 4-5 shown.

[0039] In summary, this embodiment has the following beneficial effects:

[0040] 1. In the low color temperature packaging process, the powder glue completely and evenly covers the chip, improving the yield rate;

[0041] 2. The low color temperature is determined correctly before high color temperature packaging, which reduces the scrap rate;

[0042] 3. Only one low thixotropic silicone can be used, or even no thixotropic silicone (expensive and with high process requirements) is needed to complete the encapsulation.

[0043] 4. The process is simple and easy to operate.

[0044] Example 2

[0045] This embodiment discloses a dual-color temperature COB light source, which is manufactured by the packaging method in Embodiment 1. The specific implementation process of this embodiment is shown in Embodiment 1, and will not be described in detail here.

[0046] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A packaging method for a dual-color temperature COB light source, characterized in that: Includes steps: Mounting the LED chip on the front surface of the first substrate; Make a first dam around the periphery of the first substrate to surround all LED chips; Filling a first fluorescent glue layer in the first dam; Cutting the first substrate to obtain a plurality of low color temperature light strips; Mounting LED chips and low color temperature light strips on the second substrate at intervals; Make a second dam around the periphery of the second substrate to surround all LED chips and low color temperature light strips; A second fluorescent glue layer is filled in the second dam.

2. The packaging method according to claim 1, characterized in that: The LED chip is a face-up chip or a flip-up chip.

3. The packaging method according to claim 1, characterized in that: The first substrate includes a front electrode and a back electrode which are connected up and down, and the back electrode is connected to the second substrate.

4. The packaging method according to claim 1, characterized in that: A plurality of cutting lines are preset on the first substrate, and the first substrate is cut along the cutting lines.

5. The packaging method according to claim 4, characterized in that: The low color temperature light strip is welded to the second substrate by welding or groove installation.

6. A dual color temperature COB light source, characterized in that: The invention is manufactured by adopting the packaging method as described in any one of claims 1 to 5.

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