Electronic tag for instrument, reading system and electronic tag preparation method

Abstract

The present invention discloses an electronic tag for instruments and meters, a reading system and an electronic tag preparation method, which may include: circuit board customization; chip SMT patching on the customized circuit board to form a semi-finished product of the electronic tag; using an automatic optical inspection machine to inspect the semi-finished product after patching to remove abnormal semi-finished products; after the semi-finished product is glued, the chip is initialized; the semi-finished product after initialization is injection molded, and the electronic tag is obtained after being inspected by an RFID inspection machine. The electronic tag for instruments and meters produced by the above process can be used for the identification of instruments and meters, and is suitable for large-scale industrial production.

Description

Technical Field

[0001] The present invention relates to the technical field of RFID-based asset management, and in particular to an electronic tag for instruments, a reading system and an electronic tag preparation method. Background Art

[0002] Instruments and meters are characterized by a wide variety, large number, high prices, and frequent use. Procurement and maintenance work is an important part of the cost expenditure in power operation and maintenance work. For the cost-benefit analysis of the use of instruments and meters, there are two common management methods used in existing technologies: First, manual registration (common): daily operations such as collection, return, maintenance, and testing are all recorded through manual registration. When analysis is required, statistical analysis is performed manually. Second, system reporting (less common): daily operations such as collection, return, maintenance, and testing. By filling in relevant business documents in the information system, statistical analysis is performed through the information system. Summary of the invention

[0003] The inventor found that, firstly, whether it is manual registration or system filling in documents, there are cases of forgetting to register or registering incorrectly. This will directly lead to inaccurate data for the subsequent cost-benefit analysis, thus affecting the effect of the analysis, and further resulting in low accuracy or lack of integrity of the data; secondly, it is inconvenient to operate. Due to the working environment, the users of the instruments and meters are inconvenient to bring mobile phones, there are oil stains, and they are not familiar with the system operation. Therefore, manual registration or registration through the system or mobile phone access system are inconvenient to operate.

[0004] In view of the above problems, the present invention is proposed to provide an electronic tag for instruments, a reading system and an electronic tag preparation method that overcome the above problems or at least partially solve the above problems.

[0005] In a first aspect, an embodiment of the present invention provides an electronic tag for an instrument, which may include: a circuit board, a chip, and a housing;

[0006] The circuit board is provided with a chip mounting position for mounting the chip;

[0007] The circuit board is also provided with at least one through hole; the circuit board is limited inside the shell through the through hole; the shell is integrally injection-molded and wrapped around the outside of the circuit board and the chip.

[0008] Optionally, the electronic tag may further include: a marking layer located on the outer surface of the shell; the marking layer and the shell are integrally formed; or the marking layer is connected to the outer surface of the shell.

[0009] Optionally, the shell extends outward to form a mounting ring for fixing the electronic tag.

[0010] Optionally, a radio frequency integrated circuit is provided on the circuit board, and the radio frequency integrated circuit is used to receive a radio frequency signal and convert a magnetic signal of the radio frequency signal into an electrical signal to power the radio frequency integrated circuit.

[0011] In a second aspect, an embodiment of the present invention provides an instrument reading system, which may include: an instrument, at least one electronic tag for an instrument as described in the first aspect, and at least one reader for reading the electronic tag for an instrument;

[0012] The electronic tag for the instrument is used to be set on the instrument to record the model, data, and / or status of the instrument;

[0013] The reader is used to identify the electronic tag for the instrument and read the model, data, and / or status stored on the electronic tag for the instrument.

[0014] Optionally, the system may further include: a management platform;

[0015] The management platform includes: a management server and a terminal connected to the management server;

[0016] The management server is installed with management and control software for receiving the model, data, and / or status on the electronic tag for the instrument read by the reader, and processing the data and / or status according to a preset algorithm;

[0017] The terminal is used to display the histogram and / or curve change diagram of the data / state changes of the instrument generated by the management and control software.

[0018] In a third aspect, an embodiment of the present invention provides a method for preparing an electronic tag for an instrument, which method may include:

[0019] Circuit board customization;

[0020] Perform chip SMT patching on the customized circuit board to form a semi-finished product of the electronic tag;

[0021] Use an automatic optical inspection machine to inspect the semi-finished products after patching to remove abnormal semi-finished products;

[0022] After the semi-finished product is subjected to a dispensing operation, the chip is initialized;

[0023] The semi-finished product after initialization is subjected to shell injection molding, and then tested by using an RFID testing machine to obtain the electronic tag.

[0024] Optionally, the circuit board customization may specifically include:

[0025] The obtained circuit board is baked for 3 to 5 hours at a baking temperature of 130 to 160°C;

[0026] Drill holes on the baked circuit board according to the preset hole positions;

[0027] After the holes are opened, the circuit board is ground with a grinding machine at a board spacing of 5 to 8 cm, and then coated with paint using a coating machine;

[0028] The coated circuit board is baked for a second time, the baking time is 10 to 30 minutes, and the baking temperature is 60 to 80°C;

[0029] Using a developing machine to develop the circuit board after the secondary baking to obtain a preset circuit pattern;

[0030] Use an etching machine to etch the circuit board after the development operation at 45-60°C, pH 8-9, and Baume 20-28, and remove the film at 50-60°C for 4-10 minutes;

[0031] The circuit board after film removal is subjected to immersion gold / spray tin to obtain a customized circuit board.

[0032] Optionally, performing SMT chip placement on the customized circuit board may specifically include:

[0033] Bake the customized circuit board at a baking temperature of 100 to 140°C for 100 to 140 minutes;

[0034] Print tin on the baked circuit board;

[0035] After attaching the chip to the printed circuit board, soldering is performed in a reflow furnace;

[0036] Carry out quality inspection on the soldered chips and circuit boards to realize chip SMT placement.

[0037] Optionally, the shell injection molding of the initialized semi-finished product may include:

[0038] The semi-finished product is subjected to primary injection molding and secondary injection molding to form a complete shell to obtain the electronic tag.

[0039] The beneficial effects of the above technical solution provided in the embodiments of the present invention include at least:

[0040] In the embodiment of the present invention, an electronic tag for instruments and meters, a reading system and an electronic tag preparation method are provided, which may include: circuit board customization; chip SMT patching on the customized circuit board to form a semi-finished product of the electronic tag; using an automatic optical inspection machine to inspect the semi-finished product after patching to remove abnormal semi-finished products; after the semi-finished product is glued, the chip is initialized; the semi-finished product after initialization is injection molded, and the electronic tag is obtained after being inspected by an RFID inspection machine. The electronic tag for instruments and meters produced by the above process can be used for the identification of instruments and meters, and is suitable for large-scale industrial production.

[0041] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0042] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0044] Figure 1 This is a schematic diagram of the overall structure of the electronic tag for instruments and meters provided in Example 1 of the present invention;

[0045] Figure 2 This is one of the exploded schematic diagrams of the electronic tag provided in Example 1 of the present invention;

[0046] Figure 3 This is the second exploded schematic diagram of the electronic tag provided in Embodiment 1 of the present invention;

[0047] Figure 4 This is a schematic diagram of the structure of the reading system provided in Example 2 of the present invention;

[0048] Figure 5 This is a flow chart of the method for preparing an electronic tag provided in Example 3 of the present invention;

[0049] Figure 6 One of the flowcharts customized for the circuit board provided in Embodiment 3 of the present invention;

[0050] Figure 7 A second flowchart customized for the circuit board provided in Embodiment 3 of the present invention;

[0051] Figure 8This is a flow chart of the chip SMT patch provided in Example 3 of the present invention;

[0052] Among them, 1 is the electronic tag for instruments; 2 is the instrument; 3 is the reader; 4 is the management platform; 5 is the alarm device;

[0053] 11 is a circuit board; 12 is a chip; 13 is a housing; 14 is a label layer; 41 is a management server; 42 is a terminal;

[0054] 121 is a chip installation position; 122 is a through hole; 131 is an upper shell; 132 is a lower shell; 133 is a limit column; 134 is a mounting ring;

[0055] 1311 is the first connection part; 1321 is the second connection part. DETAILED DESCRIPTION

[0056] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0057] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "far", "near", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0058] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] Example 1

[0060] Based on the inventor's long-term understanding of equipment and material management, he believes that with the rapid advancement of the Internet of Things, RFID (radio frequency identification) sensing technology is rapidly entering various application fields, providing stable and reliable digital communication and measurement, and RFID tags and corresponding monitoring systems have emerged.

[0061] In the first embodiment of the present invention, an electronic tag for an instrument is provided. Figure 1 to Figure 3 As shown, the electronic tag 1 may include: a circuit board 11, a chip 12 and a housing 13;

[0062] The circuit board 12 is provided with a chip mounting position 121 for mounting the chip 11;

[0063] At least one through hole 122 is also provided on the circuit board 12 ; the circuit board 12 is limited inside the housing 13 through the through hole 122 ; the housing 13 is integrally injection-molded and wraps around the outside of the circuit board 12 and the chip 11 .

[0064] The electronic tag for instruments and meters provided in the embodiment of the present invention electronically records the data of the instruments and meters to which they are connected, thereby avoiding the disadvantages of forgetting to register or registering incorrectly during manual registration, and avoiding direct operation of the instruments and meters by operators and inspectors, avoiding the disadvantages caused by dirty hands, or avoiding the occurrence of failure to read data normally due to unfamiliarity with the instruments and meters.

[0065] Preferably, an integrally formed housing is used in the embodiment of the present invention, so that the sealing and protection of the overall electronic tag can meet high requirements. At the same time, the integrally formed electronic tag is convenient for protecting the internal electronic components, so that the product can be used in harsh environments such as high temperature, high pressure, and humidity.

[0066] Of course, when the above-mentioned shell 13 is a split design, the shell 13 may include an upper shell 131 and a lower shell 132; the inner surface of the upper shell 131 and / or the lower shell 132 is provided with a limiting column 133 matching the through hole 122, the inner surface of the upper shell 131 is provided with a first connecting portion 1311, and the inner surface of the lower shell 132 is provided with a second connecting portion 1321, and the upper shell 131 and the lower shell 132 are detachably connected through the first connecting portion 1311 and the second connecting portion 1321.

[0067] In another alternative embodiment, referring to Figure 2As shown, the electronic tag may also include: a marking layer 14 located on the outer surface of the housing 13; the marking layer 14 is integrally formed with the housing 13; or the marking layer 14 is connected to the outer surface of the housing 13. The surface of the marking layer in the embodiment of the present invention is printed or laser-coded with the identity of the instrument, such as the number segment, barcode and other detailed information. The material of the marking layer is PET material, and of course, coated paper or high-performance engineering plastics and other materials can also be selected, which is not specifically limited in the embodiment of the present invention.

[0068] In another alternative embodiment, referring to Figure 2 and Figure 3 As shown, the housing 13 extends outward to form a mounting ring 134 for fixing the electronic tag. The mounting ring can be fixed on the instrument using a cable tie, and the close-range identification can facilitate reading and recording the data, status, etc. of the instrument.

[0069] In another optional embodiment, the chip is connected to the circuit on the circuit board by welding. It should be noted that in order to make the circuit signals of the chip and the circuit board more stable and form a stable loop, the chip and the circuit on the circuit board are connected by welding.

[0070] In another optional embodiment, a radio frequency integrated circuit is provided on the circuit board, and the radio frequency integrated circuit is used to receive radio frequency signals and convert the magnetic signals of the radio frequency signals into electrical signals to power the radio frequency integrated circuit. The radio frequency integrated circuit provided in the embodiment of the present invention can convert electromagnetic signals into electrical signals to power the circuit, thereby realizing the requirements of a passive electronic tag.

[0071] Example 2

[0072] Based on the same inventive concept, an instrument reading system is also provided in the embodiment of the present invention. Figure 4 As shown, the system may include: an instrument 2, at least one electronic tag 1 for an instrument in Embodiment 1, and at least one reader 3 for reading the electronic tag 1 for an instrument;

[0073] The electronic tag 1 for instruments is used to be set on the instrument 2 to record the model, data, and / or status of the instrument 2;

[0074] The reader 3 is used to identify the electronic tag 1 for an instrument and read the model, data, and / or status stored on the electronic tag 1 for an instrument.

[0075] In an optional embodiment, the reader may include a radio frequency antenna, which sends the reading instruction to the electronic tag for the instrument through a radio frequency signal;

[0076] The RF integrated circuit on the circuit board receives the RF signal and converts the magnetic signal of the RF signal into an electrical signal to power the RF integrated circuit.

[0077] In another optional embodiment, the system may further include: a management platform 4;

[0078] The management platform 4 may include: a management server 41 and a terminal 42 connected to the management server 41;

[0079] The management server 41 is installed with management and control software, which is used to receive the model, data, and / or status on the electronic tag 1 for instruments read by the reader 3, and process the data and / or status according to a preset algorithm;

[0080] The terminal 42 is used to display the histogram and / or curve change diagram of the instrument data / status change generated by the management and control software.

[0081] In another optional embodiment, the system may further include: an alarm device 5 connected to the management platform 4;

[0082] The management server 41 is also used to generate alarm information according to the data / status and send the alarm information to the alarm device 5;

[0083] The alarm device 5 issues a corresponding alarm according to the alarm information.

[0084] The above-mentioned system provided in the embodiment of the present invention can read various data of instruments and meters in a portable manner through a reader. Based on the RFID principle, it can realize rapid identification of various instruments and meters in a computer room or warehouse in a group reading manner, and can also quickly locate the position of the instruments and meters. Preferably, the above-mentioned reader can be arranged in a component reading network in a computer room. Of course, the antenna of the above-mentioned reader can also be arranged in the reading network. The data / status of the read instruments and meters is fed back to the management platform, and the management platform can control the above-mentioned data / status based on the set software system to display it to the management personnel or issue corresponding alarm information. The above-mentioned alarm device can be arranged in the computer room of the instrument and meter, and can also be arranged on the management platform end to receive the alarm information and issue the corresponding alarm, thereby further improving the safety of inspection or asset management.

[0085] Example 3

[0086] Embodiment 3 of the present invention provides a method for preparing an electronic tag for an instrument. Figure 5 As shown, the method may include the following steps:

[0087] Step S51: circuit board customization.

[0088] Step S52: Perform SMT chip mounting on the customized circuit board to form a semi-finished product of the electronic tag.

[0089] Step S53: Use an automatic optical inspection machine to inspect the semi-finished products after patching to remove abnormal semi-finished products.

[0090] Step S54, performing glue dispensing on the semi-finished product. The purpose of glue dispensing is to fill the chip with glue around it to fix the chip.

[0091] Step S55: Initialize the chip.

[0092] Step S56: perform shell injection molding on the initialized semi-finished product, and use an RFID detector to detect it to obtain an electronic tag. It should be noted that the RFID detector in this step is a VOYANTICY detector to detect whether the RFID chip can be used normally.

[0093] Step S57: Perform consistency test on the electronic tag and then package.

[0094] The electronic tag for instruments and meters produced by the method for preparing the electronic tag provided in the embodiment of the present invention through the process flow can be applied to the identification of instruments and meters and is suitable for large-scale industrial production.

[0095] In a specific embodiment, referring to Figure 6 and Figure 7 As shown, the above circuit board customization may specifically include the following steps:

[0096] Step S61, baking the obtained circuit board for 3 to 5 hours at a baking temperature of 130 to 160°C.

[0097] Step S62: drilling holes in the baked circuit board according to preset hole positions.

[0098] Step S63, grinding the circuit board after the holes are opened with a grinding machine at a board spacing of 5 to 8 cm, and then coating it with a coating machine.

[0099] Step S64, the coated circuit board is baked for a second time, the baking time is 10 to 30 minutes, and the baking temperature is 60 to 80°C.

[0100] Step S65: using a developing machine to perform a developing operation on the circuit board after the secondary baking to obtain a preset circuit pattern.

[0101] Step S66, using an etching machine to etch the circuit board after the development operation at 45-60° C., pH value 8-9, and Baume degree 20-28, and stripping the film at a temperature of 50-60° C. for 4-10 minutes.

[0102] Step S67, performing immersion gold / spray tin on the circuit board after the film removal process to obtain a customized circuit board.

[0103] The circuit board customization method provided in the embodiment of the present invention can customize a circuit board suitable for an RFID chip and is suitable for large-scale production.

[0104] In another specific embodiment, referring to Figure 8 As shown, chip SMT placement is performed on the customized circuit board, which may include:

[0105] Step S81, baking the customized circuit board at a baking temperature of 100-140° C. for 100-140 minutes.

[0106] Step S82: Tinning the baked circuit board.

[0107] Step S83, attaching the chip to the tin-printed circuit board.

[0108] Step S84: Positioning.

[0109] Step S85, soldering in a reflow furnace.

[0110] Step S86: perform quality inspection on the soldered chip and circuit board to implement chip SMT placement.

[0111] In an optional embodiment, the initialized semi-finished product is subjected to shell injection molding, comprising:

[0112] The semi-finished product is subjected to primary injection molding and secondary injection molding to form a complete shell to obtain an electronic tag.

[0113] In the embodiment of the present invention, an injection molding machine is used to perform injection molding twice to achieve complete plastic sealing of the chip and the circuit board. The through holes are used to limit the position during plastic sealing, so that the fixation is more stable, making the integrated structure of the electronic tag more stable.

[0114] Obviously, various changes and modifications may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention. The present disclosure is not limited to the precise structure described above and shown in the accompanying drawings, and various changes and modifications may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if these changes and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these changes and modifications.

Claims

1. A method for preparing an electronic tag for an instrument, characterized in that: The electronic tag for instruments and meters comprises: a circuit board, a chip and a shell; the circuit board is provided with a chip mounting position for mounting the chip; the circuit board is also provided with at least one through hole; the circuit board is limited inside the shell through the through hole; the shell is integrally injection-molded and wrapped around the outside of the circuit board and the chip; The preparation method comprises: Customization of circuit boards; the customization of circuit boards includes: baking the obtained circuit boards for 3 to 5 hours at a baking temperature of 130 to 160°C; drilling holes in the baked circuit boards according to preset hole positions; grinding the circuit boards after drilling with a board spacing of 5 to 8 cm using a grinding brush machine, and then coating them using a coating machine; secondary baking the coated circuit boards for 10 to 30 minutes at a baking temperature of 60 to 80°C; developing the circuit boards after secondary baking using a developing machine to obtain a preset circuit pattern; etching the circuit boards after development using an etching machine at 45 to 60°C, a pH value of 8 to 9, and a Baume degree of 20 to 28, and de-filming them at a temperature of 50 to 60°C for 4 to 10 minutes; performing gold immersion or tin spraying on the de-filmed circuit boards to obtain a customized circuit board; The customized circuit board is baked at a baking temperature of 100-140°C for 100-140 minutes; the baked circuit board is tinned; the chip is attached to the tinned circuit board and then soldered in a reflow oven; the soldered chip and circuit board are quality inspected to realize chip SMT patch, and the chip is attached to the chip mounting position of the circuit board to form a semi-finished product of the electronic tag; Use an automatic optical inspection machine to inspect the semi-finished products after patching to remove abnormal semi-finished products; After the semi-finished product is subjected to a dispensing operation, the chip is initialized; The semi-finished product after initialization is subjected to primary injection molding and secondary injection molding, so that the injection molding material limits the circuit board through the through hole during plastic sealing, and the electronic tag is obtained after detection by an RFID detection machine.

2. The method according to claim 1, characterized in that The electronic tag further includes: a marking layer located on the outer surface of the shell; the marking layer is integrally formed with the shell; or the marking layer is connected to the outer surface of the shell.

3. The method according to claim 1, characterized in that The shell extends outward to form a mounting ring for fixing the electronic tag.

4. The method according to any one of claims 1 to 3, characterized in that A radio frequency integrated circuit is arranged on the circuit board, and the radio frequency integrated circuit is used to receive a radio frequency signal and convert a magnetic signal of the radio frequency signal into an electrical signal to supply power to the radio frequency integrated circuit.

5. An instrument reading system, characterized in that: include: Instruments, at least one electronic tag for instruments prepared by the method for preparing electronic tags for instruments according to any one of claims 1 to 4, and at least one reader for reading the electronic tag for instruments; The electronic tag for the instrument is used to be set on the instrument to record the model, data, and / or status of the instrument; The reader is used to identify the electronic tag for the instrument and read the model, data, and / or status stored on the electronic tag for the instrument.

6. The system according to claim 5, characterized in that Also includes: Management platform; The management platform includes: a management server and a terminal connected to the management server; The management server is installed with management and control software for receiving the model, data, and / or status on the electronic tag for the instrument read by the reader, and processing the data and / or status according to a preset algorithm; The terminal is used to display the histogram and / or curve change diagram of the data / state changes of the instrument generated by the management and control software.

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