Substrate surface treatment device

Through the negative pressure adsorption, heating and adhesion technology of the substrate surface treatment device, the dust and static problems of the substrate surface are solved, and the double-sided treatment with high cleanliness is achieved, and the yield and production efficiency of IC carrier plate manufacturing are improved.

CN114433568BActive Publication Date: 2025-08-15ZHAO SHENG PRECISION TECH CO LTD
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Patent Information

Application Number
CN202011192964.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-10-30
Publication Date
2025-08-15
Estimated Expiration
2040-10-30

AI Technical Summary

Technical Problem

In the manufacturing process of IC carrier plates, the rubber particles on the surface of the substrate lead to the problem of lowering the yield of the manufacturing line, especially in the manufacturing of high-density multi-layer boards, the existing heat sealing method cannot effectively remove dust from the surface of the non-edge large area, affecting the circuit quality.

Method used

The substrate surface treatment device is adopted, including a conveying module, a negative pressure air extraction module, a heating module and a pressure adhesive wheel. The dust on the surface of the substrate is removed through negative pressure adsorption, heating and adhesion, while eliminating static electricity, so as to achieve double-sided treatment of the substrate without flipping.

Benefits of technology

It improves the cleanliness of the substrate surface, enhances the manufacturing yield, reduces the accumulation of dust and static electricity, and maintains the environment of the production process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a substrate surface treatment device, which is used to transport a substrate to a working area of a transport module, utilize a negative pressure suction module to negatively adsorb the surface of the substrate onto the working area, utilize a heating module to heat the surface of the substrate to melt the adhesive particles thereon, and finally utilize a pressure-adhesion wheel to adhere the adhesive particles on the substrate surface. If two sets of transport modules, negative pressure suction modules, heating modules, and pressure-adhesion wheels are arranged adjacent to each other and in a mirrored structure, during the substrate transport process, the upper surface of the substrate is first heated to melt the adhesive particles thereon and the adhesive particles thereon. Without turning the substrate over, the lower surface of the substrate is then heated to melt the adhesive particles thereon and the adhesive particles thereon. In this way, both the upper and lower surfaces of the substrate can be dust-removed, thereby achieving a high yield in subsequent processes.
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Description

Technical Field

[0001] The present invention relates to a substrate surface treatment device, and more particularly to the technical field of removing dust from the upper and lower surfaces of a substrate during the conveying and manufacturing process of the substrate. Background Art

[0002] In current IC substrate manufacturing, insulating film substrates are often required. However, during both the manufacturing and transportation processes, these substrates can retain mobile adhesive particles on their surface. If left untreated, these adhesive particles can reduce the yield of fabricated circuits. For example, copper clad substrates (CCLs) are commonly available in pre-cured insulating film sheets and rolls, which can be cut into small (panel-sized) sheets according to customer specifications. However, during cutting, varying adhesive formulations can easily generate dust that accumulates along the edges of the cuts, often creating challenges for downstream customers. Dust removal is essential to improve circuit production yield.

[0003] Regarding the dust problem generated during the cutting process, some industry insiders have proposed a method that applies hot air or infrared rays around the stack of films to perform a one-time heat-sealing operation on the edges of the cut surfaces where the adhesive powder has broken. This can reduce the problem of film dust falling during subsequent processes. However, this heat-sealing method does not treat the adhesive powder on the large surfaces of the non-edge surfaces of the film. Under the stringent conditions of printed circuit boards (PCBs), where the circuit density is increasing and the circuit width is also increasing, and the copper foil used in the production of circuits is becoming thinner and thinner, if the surface cleanliness of the copper foil substrate is not sufficient, it will cause degradation of optical components or circuit defects, resulting in reduced manufacturing yield. This is particularly important for high-end, high-density multi-layer boards. Therefore, how to effectively solve the problem of dust particles on the surface of the substrate to improve the manufacturing yield is an urgent problem that needs to be solved. Summary of the Invention

[0004] In view of the above problems of the conventional technology, the main purpose of the present invention is to provide a method that can transport the substrate smoothly and remove dust from the conveying device and the surface of the substrate through a cleaning method of adhesion of the pressure wheel, so that the substrate has good surface cleanliness.

[0005] A secondary purpose of the present invention is to provide a substrate that can be continuously transported twice, and the upper and lower surfaces can be treated without turning the substrate over, thereby effectively solving the problem of dust attached to the surface of the substrate.

[0006] Another object of the present invention is to eliminate static electricity on the surface of a substrate and to easily and quickly remove dust from the surface of the substrate.

[0007] The technical means adopted by the present invention are as follows.

[0008] According to the purpose of the present invention, a substrate surface treatment device is proposed, comprising a conveying module, a negative pressure exhaust module, a heating module and at least one pressure-adhesive wheel. The conveying module comprises a conveyor belt and a plurality of conveying wheels, the conveyor belt being arranged around these conveying wheels to form a space and a working area, these conveying wheels being spaced apart in the space, and the conveyor belt being used to convey at least one substrate to the working area. The negative pressure exhaust module is arranged in the space of the conveying module, and the negative pressure exhaust module is used to negatively adsorb the surface of the substrate on the working area. The heating module is adjacent to the conveying module, and the conveying module is located between the heating module and the negative pressure exhaust module, and the heating module heats the surface of the substrate to heat-melt the rubber particles thereon. The pressure-adhesive wheel is located on one side of the heating module, and the pressure-adhesive wheel is used to adhere the rubber particles on the surface of the substrate.

[0009] According to the above technical features, it further includes a feeding module, which includes a feeding sensor, a first feeding pressure wheel and a second feeding wheel arranged opposite to each other. The first feeding pressure wheel is arranged on the feeding sensor, and the second feeding wheel is adjacent to the conveying wheel closest to the working area among the conveying wheels.

[0010] According to the above technical features, the device further includes a static eliminator, which is disposed in the working area adjacent to the conveyor belt.

[0011] According to the above technical features, it further includes a cleaning module, which is arranged on one side of the conveying module. The cleaning module includes a cleaning body and at least one cleaning pressure wheel installed on the cleaning body. The cleaning pressure wheel is adjacent to at least one of the conveying wheels, and the cleaning pressure wheel is arranged opposite to the aforementioned conveying wheel and presses the two surfaces of the conveyor belt respectively.

[0012] According to the above technical features, it further includes a discharging module, which includes a discharging sensor, a first discharging pressure wheel and a second discharging wheel arranged opposite to each other. The first discharging pressure wheel is arranged on the discharging sensor, and the second discharging wheel is adjacent to the conveying wheel closest to the working area among the conveying wheels.

[0013] According to the above technical features, the negative pressure exhaust module includes a negative pressure cavity and at least one exhaust unit, the negative pressure cavity has an opening, the conveyor belt has a plurality of suction holes, the opening is connected to the suction holes, and the negative pressure state formed by the exhaust drive of the exhaust unit between the substrate placed in the working area and the suction holes causes the substrate to be adsorbed onto the working area of the conveyor belt.

[0014] According to the above technical features, the heating module includes a base and a heater installed on the base, and the base has a circulating space, an air inlet and an air outlet that are connected to each other.

[0015] According to the above technical features, the heating module further includes a temperature control unit, which is electrically connected to the heater and is used to control the heating temperature of the heater.

[0016] According to the above technical features, the heating module further includes a temperature sensor, which is electrically connected to the temperature control unit. The temperature sensor is used to sense the temperature in the circulation space. The temperature control unit controls the operation of the heater accordingly based on a sensing signal from the temperature sensor.

[0017] According to the above technical features, the device further includes a lifting module coupled to the heating module. The lifting module is used to control the heating module to rise away from the conveyor belt and to control the heating module to descend close to the conveyor belt.

[0018] According to the above technical features, the conveying module further includes a speed controller and a cooler. The speed controller is coupled to the conveyor belt to control the operating speed of the conveyor belt, and the cooler is coupled to the conveying wheels.

[0019] According to another object of the present invention, a substrate surface treatment device is proposed, comprising two conveying modules, two negative pressure exhaust modules, two heating modules and two pressure-adhesive wheels. The two conveying modules are adjacently arranged and have a mirrored structure. Each of the conveying modules comprises a conveyor belt and a plurality of conveying wheels. The conveyor belt is arranged around the conveying wheels to form a space and a working area. The conveying wheels are spaced apart in the space, and the conveyor belt is used to convey at least one substrate to the working area. The two negative pressure exhaust modules are respectively arranged in the spaces of the two first conveying modules, one of the negative pressure exhaust modules is used to negatively pressure adsorb the upper surface of the substrate on the working area of one of the first conveying modules, and the other of the negative pressure exhaust modules is used to negatively pressure adsorb the lower surface of the substrate on the working area of the other first conveying module. Two heating modules are respectively disposed adjacent to the two conveying modules, with each conveying module correspondingly located between one of the heating modules and the negative pressure exhaust module. The two heating modules heat the upper and lower surfaces of the substrate, respectively, to melt the adhesive particles on the upper and lower surfaces. Two pressing and adhering rollers are respectively located on one side of the two heating modules, and are used to adhere the adhesive particles on the upper and lower surfaces of the substrate.

[0020] According to the above technical features, it further includes a feeding module located on one side of one of the conveying modules. The feeding module includes a feeding sensor, a first feeding pressure wheel and a second feeding wheel arranged opposite to each other. The first feeding pressure wheel is arranged on the feeding sensor, and the second feeding wheel is adjacent to the conveying wheel closest to the working area among the conveying wheels.

[0021] According to the above technical features, it further includes a discharge module located on one side of the other conveying module, and the discharge module is far away from the feed module. The discharge module includes a discharge sensor, a first discharge pressure wheel and a second discharge wheel arranged opposite to each other. The first discharge pressure wheel is arranged on the discharge sensor, and the second discharge wheel is adjacent to the conveying wheel closest to the working area among the conveying wheels.

[0022] According to the above technical features, the device further includes two or more static eliminators, which are respectively arranged adjacent to the feeding module and the discharging module.

[0023] According to the above technical features, it further includes two cleaning modules, which are respectively arranged on one side of each conveying module. Each cleaning module includes a cleaning body and at least one cleaning pressure wheel installed on the cleaning body. The cleaning pressure wheel is adjacent to at least one conveying wheel, and the cleaning pressure wheel is arranged opposite to the conveying wheel and presses the two surfaces of the conveyor belt respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the first embodiment of the substrate surface treatment device of the present invention.

[0025] Figure 2 This is a schematic diagram of the substrate feeding state of the present invention.

[0026] Figure 3 It is a structural schematic diagram of the negative pressure module of the present invention.

[0027] Figure 4 It is a structural schematic diagram of the heating module of the present invention.

[0028] Figure 5 Schematic diagram of the state of the cleaning substrate surface of the present invention.

[0029] Figure 6 This is a diagram showing the operating state of the lifting module of the present invention.

[0030] Figure 7 This is a schematic diagram of the state of discharging the substrate of the present invention.

[0031] Figure 8 Schematic diagram of the structure of the second embodiment of the substrate surface treatment device of the present invention.

[0032] Figure 9 This is a schematic diagram of a state in which the substrate of the present invention is located between two conveying modules.

[0033] Figure 10 This is a schematic diagram of a substrate of the present invention undergoing another surface treatment.

[0034] Figure 11 This is a schematic diagram of the state of discharging the substrate of the present invention.

[0035] Description of the figure number:

[0036] 100: base material

[0037] 10, 10': conveying module

[0038] 11, 11': conveyor belt

[0039] 111: Air intake

[0040] 12, 12', 12a, 12b, 12b', 12c: conveyor wheels

[0041] 13: Space

[0042] 14, 14': working area

[0043] 15: Speed Controller

[0044] 16: Cooler

[0045] 20, 20': Negative pressure exhaust module

[0046] 21: Negative pressure chamber

[0047] 211: Opening

[0048] 22: Exhaust unit

[0049] 23: Vacuum drive

[0050] 30, 30': Heating module

[0051] 31: base body

[0052] 311: Circular Space

[0053] 312: Air Inlet

[0054] 313: Exhaust vent

[0055] 32: Heater

[0056] 33: Temperature control unit

[0057] 34: Temperature sensor

[0058] 40, 40': pressure sticking wheel

[0059] 50: Feeding module

[0060] 51: Feed sensor

[0061] 52: First feeding pressing wheel

[0062] 53: Second feeding wheel

[0063] 60: Static Eliminator

[0064] 70: Cleaning Module

[0065] 71: Clean the body

[0066] 72: Clean the pressure wheel

[0067] 80: Discharging module

[0068] 81: Discharge sensor

[0069] 82: First discharging pressing wheel

[0070] 83: Second discharge wheel

[0071] 90, 90': lifting module. DETAILED DESCRIPTION

[0072] Here we first explain the overall structure of the present invention. Figure 1 , is a schematic structural diagram of a first embodiment of a substrate surface treatment device of the present invention. The substrate surface treatment device includes a conveying module 10, a negative pressure exhaust module 20, a heating module 30, and at least one pressure-adhesive wheel 40. The conveying module 10 includes a conveyor belt 11 and a plurality of conveyor wheels 12. The conveyor belt 11 is arranged around these conveyor wheels 12 to form a space 13 and a working area 14. Among them, the arrangement of these conveyor wheels 12 is that at least two conveyor wheels 12a and 12b are horizontally arranged and abut against the conveyor belt 11, and the other conveyor wheels 12c are away from the conveyor belt 11. Therefore, the conveyor belt 11 is arranged around these conveyor wheels 12 to form a space 13, and the area of the conveyor belt 11 where the two conveyor wheels 12a and 12b are horizontally arranged and abut against serves as the working area 14. The conveying module 10 further includes a speed controller 15 and a cooler 16. The speed controller 15 is coupled to the conveyor belt 11 to control the operating speed of the conveyor belt 11. The cooler 16 is coupled to the conveyor wheels 12 to control the operating temperature of the conveyor wheels 12 so that the conveyor wheels 12 can cool the energy accumulated by the conveyor belt 11 due to heat, thereby preventing the conveyor belt 11 from continuing to heat up.

[0073] The negative pressure exhaust module 20 is disposed within the space 13 of the conveying module 10. The negative pressure exhaust module 20 includes a negative pressure chamber 21 and at least one exhaust unit 22, which may be a DC fan. The negative pressure exhaust module 20 further includes a vacuum actuator 23 coupled to the exhaust unit 22 to control the operation of the exhaust unit and appropriately adjust the vacuum level within the negative pressure chamber 21. The heating module 30 is adjacent to the conveying module 10. The conveying module 10 is located between the heating module 30 and the negative pressure exhaust module 20, with the heating module 30 and the negative pressure exhaust module 20 positioned above and below each other. A pressure bonding roller 40 is located to one side of the heating module 30. Here, the pressure bonding roller 40 is a heated pressure bonding roller. The heating module 30 controls the heating temperature of the pressure bonding roller 40 to adhere the adhesive particles to the substrate surface, as described in detail below.

[0074] The substrate surface treatment apparatus further includes a feed module 50 and an electrostatic eliminator 60. The feed module 50 includes an feed sensor 51, a first feed pressure wheel 52, and a second feed wheel 53 positioned opposite each other. The first feed pressure wheel 52 is positioned above the feed sensor 51, while the second feed wheel 53 is positioned adjacent to the conveyor wheel 12a closest to the work area 14. The electrostatic eliminator 60 is positioned adjacent to the work area 14 of the conveyor belt 11.

[0075] The substrate surface treatment device further includes a cleaning module 70. The cleaning module 70 is disposed on one side of the conveyor module 10 and includes a cleaning body 71 and at least one cleaning pressure wheel 72 mounted on the cleaning body 71. The cleaning pressure wheel 72 is adjacent to at least one conveyor wheel 12c and is disposed opposite the conveyor wheel 12c to press against the two surfaces of the conveyor belt 11. Specifically, when the conveyor belt 11 is in operation, the conveyor wheel 12c and the cleaning pressure wheel 72 are clamped against the two surfaces of the conveyor belt 11. The surface of the cleaning pressure wheel 72 is sticky and can adhere to dust on the surface of the conveyor belt 11. This allows the conveyor belt 11 to continuously undergo surface treatment and maintain cleanliness during operation, thereby preventing contamination of the substrate.

[0076] The substrate surface treatment apparatus further includes a discharge module 80. The discharge module 80 includes a discharge sensor 81, a first discharge pressure wheel 82, and a second discharge wheel 83 disposed opposite each other. The first discharge pressure wheel 82 is disposed above the discharge sensor 81, and the second discharge wheel 83 is adjacent to the conveyor wheel 12b closest to the work area 14 among the conveyor wheels 12.

[0077] Following the above structural description, the actual operation of the present invention will be described in detail. Figure 2The figure shows a schematic diagram of the substrate feeding state of the present invention. A substrate 100, such as a copper foil substrate, is placed in the substrate surface treatment device. After the two surfaces of the substrate 100 are clamped against each other by the first feeding pressure wheel 52 and the second feeding wheel 53 of the feeding module 50, the feeding sensor 51 detects the feeding sensing signal indicating that the substrate 100 has been fed. The negative pressure exhaust module 20 and the heating module 30 begin to operate according to the feeding sensing signal. It is worth noting that before the substrate 100 is conveyed to the conveying module 10, the static eliminator 60 is used to eliminate static electricity on the surface of the substrate 100 to prevent static electricity accumulation on the surface of the substrate 100. At the same time, the static electricity on the surface of the conveyor belt 11 is eliminated, making it easier for the cleaning module 70 to clean the surface of the conveyor belt 11.

[0078] For example Figure 3 Figure 2 is a schematic diagram of the structure of the negative pressure module of the present invention. The conveyor belt 11 is used to transport the substrate 100 to the working area 14, and the negative pressure suction module 20 is used to negatively adsorb the surface of the substrate 100 onto the working area 14. Specifically, the negative pressure chamber 21 has an opening 211, and the conveyor belt 11 has a plurality of suction holes 111, and the opening 211 is connected to these suction holes 111. The conveyor belt 11 can be a porous, high-temperature resistant Teflon conveyor belt. The negative pressure created by the suction drive of the suction unit 22 between the substrate 100 placed in the working area 14 and these suction holes 111 causes the substrate 100 to be adsorbed onto the working area 14 of the conveyor belt 11. The negative pressure exhaust module 20 mainly provides a uniform and flat vacuum adsorption surface, so that the substrate 100 adsorbed by the negative pressure on the conveyor belt 11 can be continuously and stably conveyed, and can be properly heated and flattened without flipping, thereby solving the problem of the conventional technology that excessive clamping and bending will cause the surface of the substrate 100 to crack and produce glue powder.

[0079] See also Figure 4 , is a structural schematic diagram of the heating module of the present invention. When the negative pressure exhaust module 20 and the heating module 30 are operating simultaneously, the structural design of the heating module 30 of the present invention is further described here. The heating module 30 includes a base 31 and a heater 32 mounted on the base 31. The base 31 has a circulation space 311, an air inlet 312 and an air outlet 313 that are connected to each other. The heating module 30 further includes a temperature control unit 33, which is electrically connected to the heater 32, and the temperature control unit 33 is used to control the heating temperature of the heater 32. The heating module 30 further includes a temperature sensor 34, which is electrically connected to the temperature control unit 33, and the temperature sensor 34 is used to sense the temperature in the circulation space 311. The temperature control unit 33 controls the operation of the heater 32 accordingly according to a sensing signal of the temperature sensor 34.

[0080] Specifically, the heater 32, such as an electric heater, cooperates with the feedback temperature of the temperature control unit 33 to control the radiant heat. After the air inlet 312 of the base 31 introduces air into the circulation space 311, the air is heated by the heater 32 to generate hot air, which provides appropriate hot air to accelerate the softening of the rubber particles on the surface of the substrate 100. Because the base 31 further has a return air duct 314 that is connected to the circulation space 311 and the exhaust port 313 is located in the return air duct 314, the hot air in the circulation space 311 can escape to the outside through the return air duct 314 and the exhaust port 313. This maintains the temperature of the rubber particles on the surface of the substrate 100 until the substrate 100 is transported away from the heating module 30. The return air duct 314 is used to prevent odors generated by heating from escaping outside the circulation space 311, maintaining a good working environment.

[0081] like Figure 5 The figure shows a schematic diagram of the substrate surface cleaning process according to the present invention. The heating module 30 moderately softens the adhesive powder particles on the substrate 100 surface, preventing the substrate 100 from curing due to the heating temperature. A pressing roller 40 is located on one side of the heating module 30. After the substrate 100 leaves the heating module 30, it is pressed against the conveyor belt 11 by the pressing roller 40. The heating module 30 controls the surface heating temperature of the pressing roller 40, which adheres the softened adhesive particles to the substrate 100 surface, preventing adhesive particles from falling off during subsequent processing of the substrate 100.

[0082] For example Figure 6 The figure shows the operating state of the lifting module of the present invention. The substrate surface treatment device further includes a lifting module 90, which is coupled to the heating module 30. The lifting module 90 is used to control the heating module 30 to rise away from the conveyor belt 11, and to control the heating module 30 to descend close to the conveyor belt 11. The present invention takes into account the problem of avoiding energy loss, and therefore utilizes the lifting operation mode of the lifting module 90, utilizes the feed sensor 51 to sense the feed sensing signal of the substrate 100, and the lifting module 90 controls the heating module 30 to descend close to the conveyor belt 11, so as to heat the substrate 100 on time. Of course, when heating is not required, the lifting module 90 is used to control the heating module 30 to rise away from the conveyor belt 11 to prevent the conveyor belt 11 from continuing to heat up. In addition, the lifting module 90 facilitates the subsequent cleaning or maintenance of the heating module 30.

[0083] For example Figure 7Figure 1 shows a schematic diagram of the substrate discharge process according to the present invention. After the substrate 100 is clamped against its two surfaces by the first discharge pressure roller 82 and the second discharge roller 83 of the discharge module 80, the discharge sensor 81 detects a discharge signal indicating that the substrate 100 has been discharged. The negative pressure exhaust module 20 and the heating module 30 then cease operation based on the discharge signal. After discharge, the substrate 100 is transported to the next station for stacking.

[0084] In addition to achieving effective cleanliness for a single surface treatment of the substrate 100, the present invention further proposes a method for achieving double surface treatment without turning the substrate 100 over. Figure 8 The figure shows a schematic structural diagram of the second embodiment of the substrate surface treatment device of the present invention. The substrate surface treatment device includes two conveying modules 10, 10', two negative pressure exhaust modules 20, 20', two heating modules 30, 30', and two pressure bonding wheels 40, 40'. The detailed structure and configuration relationship of the conveying module 10, the negative pressure exhaust module 20, the heating module 30 and the pressure bonding wheel 40 in the second embodiment are the same as those in the first embodiment. The second embodiment has the same components and the same reference numerals as the first embodiment, and the same parts are not repeated here. Only the differences are described here. In the first embodiment, only one set of the above-mentioned components is used to process a single surface of the substrate 100, while in the second embodiment, two sets are used to successively process the upper and lower surfaces of the substrate 100, and the two conveying modules 10 are adjacently arranged and in a mirrored structure.

[0085] The substrate surface treatment device's feed module 50 is located on one side of one of the conveyor modules 10. Its second feed wheel 53 is adjacent to the conveyor wheel 12a, which is closest to the work area 14, among the conveyor wheels 12. The discharge module 80 is located on the other side of the conveyor module 10', away from the feed module 50. Its second discharge wheel 83 is adjacent to the conveyor wheel 12b', which is closest to the work area 14' among the conveyor wheels 12'. The substrate surface treatment device includes two or more static eliminators 60, each located adjacent to the feed module 50 and the discharge module 80.

[0086] In the second embodiment, the conveying module 10, the negative pressure exhaust module 20, the heating module 30, and the pressing and sticking wheel 40 serve as a process for treating the upper surface of one group of substrates 100, and the other group of conveying modules 10', the negative pressure exhaust module 20', the heating module 30', and the pressing and sticking wheel 40' serve as a process for treating the lower surface of one group of substrates 100. As can be seen from the first embodiment, after the upper surface of the substrate 100 has been cleaned through the feeding, heating, and discharging processes, since the above-mentioned two sets of treatment processes are adjacent and in a mirror-image structure, the substrate 100 can be continuously conveyed to the conveying module 10' for the substrate's lower surface treatment process without turning over. Figure 9The figure shows a state diagram of the substrate of the present invention being located between two conveying modules. After the substrate 100 is conveyed away from the heating module 30, the substrate 100 will be pressed against the conveyor belt 11 by the pressing wheel 40. At this time, the heating module 30 can control the heating temperature of the upper surface of the pressing wheel 40. The pressing wheel 40 is used to adhere the softened rubber particles on the upper surface 101 of the substrate 100, and the lower surface 102 of the substrate is against the conveyor belt 11. Then, when the substrate 100u is transmitted to the working area 14' via the conveying wheel 12a' of the conveying module 10', the upper surface 101 of the substrate 100 is negatively adsorbed on the conveyor belt 11', as shown in FIG. Figure 10 FIG. 1 is a schematic diagram illustrating another surface treatment process for a substrate according to the present invention. The negative pressure suction module 20' is used to negatively suction the upper surface 101 of the substrate 100 onto the working area 14'. The lower surface 102 of the substrate 100 is facing the heating module 30'. The lifting module 90' controls the heating module 30' to descend toward the conveyor belt 11'. The heating module 30' heats the lower surface 102 of the substrate 100, softening the rubber powder particles on the lower surface 102 of the substrate 100. The substrate 100 is then continuously conveyed to the pressing and adhering roller 40', where the softened rubber particles adhere to the lower surface 102 of the substrate 100.

[0087] For example Figure 11 The figure shows a schematic diagram of the substrate discharge state of the present invention. Before continuously conveying the substrate 100 to the discharge module 80, the static eliminator 60 can be used to eliminate static electricity on the surface of the substrate 100 to avoid static electricity accumulation on the surface of the substrate 100. At the same time, the static electricity on the surface of the conveyor belt 11' is eliminated, making it easier for the cleaning module 70 to clean the surface of the conveyor belt 11'. After the two surfaces of the substrate 100 are clamped against each other by the first discharge pressure wheel 82 and the second discharge wheel 83 of the discharge module 80, the discharge sensor 81 will detect the discharge sensing signal indicating that the substrate 100 has been discharged, and the negative pressure exhaust module 20' and the heating module 30' will stop operating according to the discharge sensing signal. After the substrate 100 is discharged, it can be transported to the next station for stacking of the substrate 100.

[0088] From the above, it can be seen that this invention, while surpassing previous technologies, utilizes innovative structural improvements and surface treatment methods. Using heat and negative pressure to adsorb dust particles before adhering to them, it effectively improves substrate surface cleanliness. The production process, which eliminates the need for substrate flipping, not only increases production speed but also solves the problem of colloidal particles generated during substrate production. In addition to reducing pollution accumulation and cross-contamination between products, the novel heating module design maintains an odor-free environment during the production process.

Claims

1. A substrate surface treatment device, characterized in that: include: A conveying module (10) includes a conveyor belt (11) and a plurality of conveyor wheels (12), wherein the conveyor belt (11) is arranged around the conveyor wheels (12) to form a space (13) and a working area (14), and the conveyor wheels (12) are spaced apart in the space (13). The conveyor belt (11) is used to convey at least one substrate (100) to the working area (14); a negative pressure suction module (20) disposed in the space (13) of the conveying module (10), the negative pressure suction module (20) being used to negatively adsorb the surface of the substrate (100) on the working area (14); a heating module (30) adjacent to the conveying module (10), the conveying module (10) being located between the heating module (30) and the negative pressure exhaust module (20), the heating module (30) heating the surface of the substrate (100) to melt the rubber particles thereon; At least one pressing and sticking wheel (40) is located on one side of the heating module (30), and the pressing and sticking wheel (40) is used to stick the rubber particles on the surface of the substrate (100); and A cleaning module (70) is provided on one side of the conveying module (10). The cleaning module (70) includes a cleaning body (71) and at least one cleaning pressing wheel (72) mounted on the cleaning body (71). The cleaning pressing wheel (72) is adjacent to at least one of the conveying wheels (12). The cleaning pressing wheel (72) is arranged opposite to the aforementioned conveying wheel (12) and presses against two surfaces of the conveying belt (11) respectively.

2. The substrate surface treatment device according to claim 1, wherein The invention comprises a feeding module (50), wherein the feeding module (50) comprises a feeding sensor (51), a first feeding pressing wheel (52) and a second feeding wheel (53) arranged opposite to each other, wherein the first feeding pressing wheel (52) is arranged on the feeding sensor (51), and the second feeding wheel (53) is adjacent to the conveying wheel (12) closest to the working area (14) among the conveying wheels (12).

3. The substrate surface treatment device according to claim 1, wherein It includes an electrostatic eliminator (60), which is arranged in the working area (14) adjacent to the conveyor belt (11).

4. The substrate surface treatment device according to claim 1, wherein The invention comprises a discharging module (80), wherein the discharging module (80) comprises a discharging sensor (81), a first discharging pressing wheel (82) and a second discharging wheel (83) arranged opposite to each other, wherein the first discharging pressing wheel (82) is arranged on the discharging sensor (81), and the second discharging wheel (83) is adjacent to the conveying wheel (12) closest to the working area (14) among the conveying wheels (12).

5. The substrate surface treatment device according to claim 1, wherein The negative pressure exhaust module (20) includes a negative pressure cavity (21) and at least one exhaust unit (22), wherein the negative pressure cavity (21) has an opening (211), and the conveyor belt (11) has a plurality of suction holes (111), wherein the opening (211) is connected to the suction holes (111), and the substrate (100) placed in the working area (14) and the suction holes (111) is driven by the exhaust unit (22) to form a negative pressure state, so that the substrate (100) is adsorbed onto the working area (14) of the conveyor belt (11).

6. The substrate surface treatment device according to claim 1, wherein: The heating module (30) comprises a base (31) and a heater (32) mounted on the base (31); the base (31) has a circulating space (311), an air inlet (312) and an air outlet (313) that are connected to each other.

7. The substrate surface treatment device according to claim 6, wherein: The heating module (30) includes a temperature control unit (33), which is electrically connected to the heater (32) and is used to control the heating temperature of the heater (32).

8. The substrate surface treatment device according to claim 7, wherein: The heating module (30) includes a temperature sensor (34) electrically connected to the temperature control unit (33). The temperature sensor (34) is used to sense the temperature in the circulation space (311). The temperature control unit (33) controls the operation of the heater (32) accordingly based on a sensing signal from the temperature sensor (34).

9. The substrate surface treatment device according to claim 1, wherein: The invention comprises a lifting module (90), wherein the lifting module (90) is coupled to the heating module (30), and the lifting module (90) is used to control the heating module (30) to rise away from the conveyor belt (11), and to control the heating module (30) to descend close to the conveyor belt (11).

10. The substrate surface treatment device according to claim 1, wherein The conveying module (10) includes a speed controller (15) and a cooler (16). The speed controller (15) is coupled to the conveyor belt (11) to control the operating speed of the conveyor belt (11), and the cooler (16) is coupled to the conveying wheels (12).

11. A substrate surface treatment device, characterized in that: include: Two conveying modules (10') are arranged adjacent to each other and have a mirror structure, each of the conveying modules (10') includes a conveyor belt (11) and a plurality of conveying wheels (12), the conveyor belt (11) is arranged around the conveying wheels (12) to form a space (13) and a working area (14), the conveying wheels (12) are spaced apart in the space (13), and the conveyor belt (11) is used to convey at least one substrate (100) to the working area (14); Two negative pressure exhaust modules (20') are respectively arranged in the spaces (13) of the two conveying modules (10'), one of the negative pressure exhaust modules (20') is used to negatively adsorb the upper surface of the substrate (100) on the working area (14) of one conveying module (10'), and the other negative pressure exhaust module (20') is used to negatively adsorb the lower surface of the substrate (100) on the working area (14) of the other conveying module (10'); Two heating modules (30') are respectively arranged adjacent to the two conveying modules (10'), and each conveying module (10') is correspondingly located between one heating module (30') and the negative pressure exhaust module (20'). The two heating modules (30') respectively heat the upper surface and the lower surface of the substrate (100) to heat-melt the rubber particles on the upper surface and the lower surface; Two pressing and sticking wheels (40'), respectively located on one side of the two heating modules (30'), the pressing and sticking wheels (40') being used to stick the rubber particles on the upper surface and the lower surface of the substrate (100); and Two cleaning modules (70) are respectively arranged on one side of each conveying module (10'). Each cleaning module (70) includes a cleaning body (71) and at least one cleaning pressing wheel (72) installed on the cleaning body (71). The cleaning pressing wheel (72) is adjacent to at least one conveying wheel (12), and the cleaning pressing wheel (72) and the conveying wheel (12) are arranged opposite to each other and press the two surfaces of the conveying belt (11) respectively.

12. The substrate surface treatment device according to claim 11, wherein: The invention comprises a feeding module (50) located on one side of one of the conveying modules (10'), the feeding module (50) comprising a feeding sensor (51), a first feeding pressing wheel (52) and a second feeding wheel (53) arranged opposite to each other, the first feeding pressing wheel (52) being arranged on the feeding sensor (51), and the second feeding wheel (53) being adjacent to the conveying wheel (12) closest to the working area (14) among the conveying wheels (12).

13. The substrate surface treatment device according to claim 12, wherein: The invention comprises a discharge module (80) located on one side of the other conveying module (10'), and the discharge module (80) is far away from the feeding module (50), the discharge module (80) comprises a discharge sensor (81), a first discharge pressing wheel (82) and a second discharge wheel (83) arranged opposite to each other, the first discharge pressing wheel (82) is arranged on the discharge sensor (81), and the second discharge wheel (83) is adjacent to the conveying wheel (12) closest to the working area (14) among the conveying wheels (12).

14. The substrate surface treatment device according to claim 13, wherein: It comprises two or more static eliminators (60), which are respectively arranged adjacent to the feeding module (50) and the discharging module (80).

15. The substrate surface treatment device according to claim 11, wherein Each of the negative pressure exhaust modules (20') includes a negative pressure cavity (21) and at least one exhaust unit (22), the negative pressure cavity (21) has an opening (211), the conveyor belt (11) of each conveying module (10') has a plurality of suction holes (111), the opening (211) is connected to the suction holes (111), and a negative pressure state is formed between the substrate (100) placed in the working area (14) and the suction holes (111) through the exhaust drive of the exhaust unit (22).

16. The substrate surface treatment device according to claim 11, wherein Each heating module (30') includes a base (31) and a heater (32) mounted on the base (31). The base (31) has a circulating space (311), an air inlet (312), and an air outlet (313) that are connected to each other.

17. The substrate surface treatment device according to claim 16, wherein: The heating module (30') includes a temperature control unit (33), which is electrically connected to the heater (32) and is used to control the heating temperature of the heater (32).

18. The substrate surface treatment device according to claim 17, wherein: The heating module (30') includes a temperature sensor (34) electrically connected to the temperature control unit (33). The temperature sensor (34) is used to sense the temperature in the circulation space (311). The temperature control unit (33) controls the operation of the heater (32) accordingly based on a sensing signal from the temperature sensor (34).

19. The substrate surface treatment device according to claim 11, wherein: It comprises two lifting modules (90') respectively coupled to the two heating modules (30').

Citation Information

Patent Citations

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