A multi-layered diamond bead and a method of manufacturing the same

Abstract

The application relates to the technical field of brazing beads, in particular to a multilayer diamond bead and a manufacturing method thereof. The multilayer diamond bead comprises a main base body, at least one layer of a secondary base body is arranged on the surface of the main base body, working layers are arranged on the surfaces of the main base body and the secondary base body, and a plurality of diamonds are arranged in the working layers. According to the structural arrangement of the multilayer diamond bead, the service life of the multilayer diamond bead can be doubled, the purpose of high efficiency and long service life is achieved, and the defects of low service life of traditional single-layer brazing diamond beads are solved; the arrangement of the secondary base body can stabilize the layers of the working layers, ensure that the brazing material is a certain amount and the diamonds between the layers of the working layers have a suitable exposure height, the secondary base body can be easily polished during the cutting of stone materials, the continuity of work is not affected, and blade opening treatment is not needed; and the appearance and size of the multilayer diamond bead are more stable.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of brazing beads, in particular to a multilayer diamond bead and a manufacturing method thereof. BACKGROUND

[0002] As a cutting tool widely applied to the cutting of stone, ceramic, metal material, graphite and other materials, a brazed diamond bead string wire saw has extremely high processing efficiency but very short service life. In order to improve the service life of the brazed diamond bead string wire saw, many manufacturers improve the diamond grade, reduce the thermal damage of the diamond, adopt cold pressing forming to mix and shape the diamond particles and the brazing filler, and adopt many other ways to improve the service life of the diamond tool, but the effects are not very ideal. The cold pressing forming method leads to excessive brazing filler, and the brazing filler layer flow material is deformed during sintering, so that the yield is extremely low. SUMMARY

[0003] Other features and advantages of the present application will be set forth in the following specification, and in part will be apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and claims thereof.

[0004] The present application aims to overcome the above-mentioned deficiencies, and provides a multilayer diamond bead and a manufacturing method thereof, so as to solve the problems of short service life of the existing diamond bead and brazing filler layer flow material during manufacturing.

[0005] To achieve the above-mentioned purpose, the technical solution of the present application is as follows: a multilayer diamond bead, the diamond bead comprises a main base body, at least one auxiliary base body is arranged on the surface of the main base body, a working layer is arranged on the surface of the main base body and the auxiliary base body, and a plurality of diamonds are arranged in the working layer.

[0006] As a further improvement, the diamonds arranged in the working layer are one of ordered distribution or disordered distribution.

[0007] As a further improvement, the ordered distribution of the diamonds is one of linear type, spiral type, folded type and wave shape.

[0008] As a further improvement, brazing filler is arranged in the working layer, and the brazing filler is one or a mixture of CuSnTi, NiCrP or NiCrSiB.

[0009] As a further improvement, the thickness of the auxiliary base body is 0.001mm-0.5mm.

[0010] As a further improvement, the auxiliary base body is made of one or a mixture of iron-based material, nickel-based material, aluminum-based material, copper-based material or tin-based material.

[0011] As a further improvement, the auxiliary base body comprises a supporting sleeve, and transverse fixing rings are arranged at two ends of the supporting sleeve respectively, and inner surfaces of the transverse fixing rings are provided with vertical fixing sleeves.

[0012] As a further improvement, the main base body is in a columnar structure.

[0013] As a further improvement, the outer diameter of the diamond is 0.2-1.0 mm.

[0014] The application also provides a manufacturing method of the multilayer diamond string beads, which comprises a manufacturing method of ordered distribution of the multilayer diamond string beads and a manufacturing method of disordered distribution of the multilayer diamond string beads.

[0015] As a further improvement, the manufacturing method of ordered distribution of the multilayer diamond string beads comprises surface pretreatment of the main base body and the auxiliary base body, a bead loading treatment step of the main base body, a bead loading treatment step of the auxiliary base body and a sintering step.

[0016] The surface pretreatment of the main base body and the auxiliary base body is surface roughening pretreatment of the main base body and the auxiliary base body.

[0017] The preparation step of the binder is mixing the brazing filler metal and the polymer organic compound glue in a proportion of 1:1-9:1 to obtain the binder.

[0018] The bead loading treatment step of the main base body is drying after coating the binder on the working layer of the main base body, coating the polymer organic compound glue on the surface of the main base body coated with the binder, drying after orderly arranging the diamonds on the main base body to obtain the main base body.

[0019] The bead loading treatment step of the auxiliary base body is winding the auxiliary base body soaked in the polymer organic compound glue on the main base body, drying after coating the binder on the working layer of the auxiliary base body, coating the polymer organic compound glue on the surface of the auxiliary base body coated with the binder, drying after orderly arranging the diamonds on the auxiliary base body to obtain the multilayer diamond ordered base body.

[0020] The sintering step is placing the multilayer diamond ordered base body in a brazing furnace and sintering at a temperature selected according to the material of the brazing filler metal and the auxiliary base body to obtain the multilayer diamond string beads.

[0021] As a further improvement, the orderly arrangement mode of the diamonds in the bead loading treatment step of the main base body is orderly arranging the diamonds on an ordered particle plate, rolling the diamond particles on the ordered particle plate to the main base body soaked with the polymer organic compound glue and drying, or spraying the polymer organic compound glue on the main base body by using a dispensing machine, orderly arranging the diamonds on the glue points sprayed by the dispensing machine and drying.

[0022] As a further improvement, the ordered arrangement of the diamond in the upper bead processing step of the secondary substrate is that the diamond is arranged on the ordered particle plate, the diamond particles on the ordered particle plate are roll-coated on the secondary substrate with polymer organic compound glue, and then dried; or the polymer organic compound glue is sprayed on the secondary substrate by using a dispensing machine, the diamond is scattered on the glue point sprayed by the dispensing machine to be arranged in order, and then dried.

[0023] As a further improvement, the manufacturing method of the multi-layer diamond string bead with disordered distribution includes surface pretreatment of the primary substrate and the secondary substrate, an upper bead processing step of the primary substrate, an upper bead processing step of the secondary substrate, and a firing step.

[0024] The surface pretreatment of the primary substrate and the secondary substrate is to perform surface roughening pretreatment on the primary substrate and the secondary substrate.

[0025] The preparation step of the adhesive is to mix the filler metal and the polymer organic compound glue in a proportion of 1:1-9:1 to obtain the adhesive.

[0026] The upper bead processing step of the primary substrate is to coat the adhesive on the working layer of the primary substrate, randomly arrange the diamond on the primary substrate, and then dry to obtain the primary body.

[0027] The upper bead processing step of the secondary substrate is to dip the secondary substrate in the polymer organic compound glue, roll the secondary substrate on the primary body, coat the surface of the secondary substrate coated with the adhesive with the polymer organic compound glue, randomly arrange the diamond on the secondary substrate, and then dry to obtain the multi-layer diamond disordered body.

[0028] The firing step is to place the multi-layer diamond disordered body in a brazing furnace, select a temperature according to the material of the filler metal and the secondary substrate, and fire to obtain the multi-layer diamond string bead.

[0029] By adopting the above technical solutions, the application has the following advantages:

[0030] 1. The structure of the multi-layer diamond string bead can double the service life of the brazed string bead, achieve high efficiency and long service life, and solve the defect of low service life of the traditional single-layer brazed diamond string bead.

[0031] 2. The secondary substrate provided on the multi-layer diamond string bead can stabilize the layers of the working layer, ensure a certain amount of filler metal and a suitable exposure height between the diamond particle layers, and easily be polished during the cutting of the stone without affecting the continuity of the work and without needing to be sharpened; on the other hand, the appearance and size of the multi-layer diamond string bead are more stable, and batch production is more reliable.

[0032] 3. The multilayer diamond beads produced by the production method of the present application make the production process of such beads more stable, and the processing quality and precision better and higher, and make the beads have very high processing efficiency while still having very high processing life, so that the working layer structure of the entire multilayer diamond beads is stable and not easy to fall off, does not need to be re-edged and has good working continuity.

[0033] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure.

[0034] It is obvious that such purposes of the present application and other purposes will become more apparent after the description of the preferred embodiments of the present application with various drawings and diagrams.

[0035] In order to make the above and other purposes, features and advantages of the present application more apparent and easy to understand, one or more preferred embodiments will be described in detail below, and the drawings will be described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0036] The drawings are used to provide a further understanding of the present application, and constitute a part of the specification, which is used together with the embodiments of the present application to explain the present application, and does not constitute a limitation on the present application.

[0037] In the drawings, the same components are marked with the same reference numerals, and the drawings are schematic and are not necessarily drawn according to the actual proportions.

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description can only be one or more embodiments of the present application, and those skilled in the art can obtain other drawings according to such drawings without creative labor.

[0039] Figure 1 A cross-sectional structure diagram of the multilayer diamond beads of the present application;

[0040] Figure 2 A structure diagram of the auxiliary matrix in the multilayer diamond beads of the present application;

[0041] Figure 3 A structure diagram of the ordered arrangement of diamonds in the multilayer diamond beads of the present application;

[0042] Figure 4 A production flow diagram of the multilayer diamond beads of the present application.

[0043] Explanation of reference numerals:

[0044] 1. Diamond beads;

[0045] 11, main base; 12, sub base; 13, working layer;

[0046] 121, support sleeve; 122, transverse fixing ring; 123, vertical fixing sleeve. DETAILED DESCRIPTION

[0047] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the specific embodiments. It should be understood that the specific embodiments described herein are merely used to explain the present application but not used to limit the present application.

[0048] In addition, in the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are merely used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0049] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or can be integrated; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. However, it is noted that direct connection means that the connection between the two main bodies does not form a connection relationship through a transition structure, but is connected only through a connection structure to form a whole. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] The specific embodiments of the present application will be described below with reference to the accompanying drawings.

[0052] Referring to Figures 1-2 , Figure 1 It is a cross-sectional structure schematic diagram of the multilayer diamond string bead of the application; Figure 2 It is a structure schematic diagram of the auxiliary matrix in the multilayer diamond string bead of the application.

[0053] The application provides a multilayer diamond string bead, which comprises a main matrix 11, at least one auxiliary matrix 12 is arranged on the surface of the main matrix 11, and a working layer 13 is arranged on the surface of the main matrix 11 and the auxiliary matrix 12, and a plurality of diamonds are arranged in the working layer 13. The main matrix 11 is in a columnar structure. The outer diameter of the diamond is 0.2-1.0 mm.

[0054] The main matrix 11 and the auxiliary matrix 12 are arranged on the multilayer diamond string bead 1, and the diamonds are arranged on the working layer 13 of the main matrix 11 and the auxiliary matrix 12. The auxiliary matrix 12 can multiply the service life of the multilayer diamond string bead 1, achieve the purpose of high efficiency and long service life, and solve the defect of low service life of the traditional single-layer brazing diamond string bead; on the one hand, the arrangement of the auxiliary matrix 12 stabilizes the layers of the working layer 13, ensures that the amount of the filler metal is certain and the diamonds between the layers of the working layer 13 have a suitable exposure height, and at the same time, the auxiliary matrix 12 is easily polished during the cutting of the stone and does not affect the continuity of the work, so that the blade opening treatment is not needed; on the other hand, the appearance and size of the multilayer diamond string bead are more stable.

[0055] The working layer 13 is provided with filler metal, and the filler metal is one or more of copper-tin-titanium filler metal (CuSnTi filler metal), nickel-chromium-phosphorus filler metal (NiCrP filler metal) or nickel-chromium-silicon-boron filler metal (NiCrSiB filler metal).

[0056] The thickness of the auxiliary matrix 12 is 0.001 mm-0.5 mm. The thickness of the auxiliary matrix 12 is arranged so that it is easily polished during the cutting of the stone.

[0057] The auxiliary matrix 12 is made of one or more of iron-based materials, nickel-based materials, aluminum-based materials, copper-based materials or tin-based materials.

[0058] The auxiliary matrix 12 comprises a supporting sleeve 121, transverse fixing rings 122 are arranged at both ends of the supporting sleeve 121 respectively, and vertical fixing sleeves 123 are arranged on the inner surfaces of the transverse fixing rings 122. The surface of the supporting sleeve 121 is the working layer 13, the transverse fixing rings 122 are used for connecting the supporting sleeve 121 and the transverse fixing rings 122, and the transverse fixing rings 122 are used for fixing the supporting sleeve 121 on the main matrix 11.

[0059] Referring to Figure 3 , Figure 3Fig. 2 is a schematic diagram of the structure of the ordered arrangement of the diamonds in the multilayer diamond bead of the present application.

[0060] The diamonds arranged in the working layer 13 are one of ordered distribution or disordered distribution. The ordered distribution of the diamonds is one of linear type, spiral type, folded type, and wave shape. The linear type, spiral type, folded type, and wave shape of the ordered arrangement of the diamonds refer to the shape of the arrangement of the diamonds after the diamonds are arranged on the working layer 13 of the main base body 11 or the auxiliary base body 12, wherein the linear type and the wave shape are high life types, i.e., the service life is longer after the diamonds are arranged on the bead base body 3, and the spiral type and the folded type are high sharpness types, i.e., the contact points can be fully played when the bead is cut after the diamonds are arranged on the bead base body 3, so that the cutting is more sharp.

[0061] Referring to Figures 1-4 , Figure 1 Fig. 3 is a schematic diagram of the cross-sectional structure of the multilayer diamond bead of the present application; Figure 2 Fig. 4 is a schematic diagram of the structure of the auxiliary base body in the multilayer diamond bead of the present application; Figure 3 Fig. 5 is a schematic diagram of the structure of the ordered arrangement of the diamonds in the multilayer diamond bead of the present application; Figure 4 Fig. 6 is a schematic diagram of the manufacturing process of the multilayer diamond bead of the present application.

[0062] The present application provides a manufacturing method of a multilayer diamond bead, including a manufacturing method of an ordered distribution multilayer diamond bead and a manufacturing method of a disordered distribution multilayer diamond bead.

[0063] The manufacturing method of the ordered distribution multilayer diamond bead includes surface pretreatment of the main base body 11 and the auxiliary base body 12, a bead arranging step of the main base body 11, a bead arranging step of the auxiliary base body 12, and a sintering step;

[0064] S11. Surface pretreatment of the main base body 11 and the auxiliary base body 12: surface roughening pretreatment is performed on the main base body 11 and the auxiliary base body 12;

[0065] S12. Preparation step of the adhesive: the solder and the polymer organic compound glue are mixed in a proportion of 1:1-9:1 to obtain the adhesive;

[0066] S13. Bead arranging step of the main base body 11: after the adhesive is coated on the working layer 13 of the main base body 11 and is dried, the surface of the main base body 11 coated with the adhesive is coated with the polymer organic compound glue, and the diamonds are arranged on the main base body 11 after drying treatment to obtain the main base body;

[0067] The manner of orderly arranging the diamonds on the main base body 11 can be that the diamonds are orderly arranged on an orderly particle plate, the diamond particles on the orderly particle plate are rolled and coated on the main base body 11 with the high-molecular organic compound glue, and then dried; or the high-molecular organic compound glue is sprayed on the main base body 11 by using a dispensing machine, the diamonds are scattered on the glue points sprayed by the dispensing machine to be orderly arranged, and then dried.

[0068] S14. The upper bead processing step of the secondary base body 12: the secondary base body 12 is immersed in the high-molecular organic compound glue and then rolled on the main base body, the adhesive is coated on the working layer 13 of the secondary base body 12 and then dried, the surface of the secondary base body 12 coated with the adhesive is coated with the high-molecular organic compound glue, the diamonds are orderly arranged on the secondary base body 12 and then dried, and a multi-layer diamond orderly blank is obtained.

[0069] The manner of orderly arranging the diamonds on the secondary base body 12 can be that the diamonds are orderly arranged on an orderly particle plate, the diamond particles on the orderly particle plate are rolled and coated on the secondary base body 12 with the high-molecular organic compound glue, and then dried; or the high-molecular organic compound glue is sprayed on the secondary base body 12 by using a dispensing machine, the diamonds are scattered on the glue points sprayed by the dispensing machine to be orderly arranged, and then dried.

[0070] S15. The firing step: the multi-layer diamond orderly blank is placed in a brazing furnace, and is fired according to the temperature selected according to the material of the filler metal and the secondary base body 12, and a multi-layer diamond string bead is obtained.

[0071] The manufacturing method of the multi-layer diamond string bead with disordered distribution includes the surface pretreatment of the main base body 11 and the secondary base body 12, the upper bead processing step of the main base body 11, the upper bead processing step of the secondary base body 12, and the firing step.

[0072] S21. The surface pretreatment of the main base body 11 and the secondary base body 12: the main base body 11 and the secondary base body 12 are subjected to surface roughening pretreatment.

[0073] S22. The preparation step of the adhesive: the filler metal and the high-molecular organic compound glue are mixed in a proportion of 1:1-9:1 to obtain the adhesive.

[0074] S23. The upper bead processing step of the main base body 11: the adhesive is coated on the working layer 13 of the main base body 11, the diamonds are randomly arranged on the main base body 11 and then dried, and a main blank is obtained.

[0075] S24. Upper bead processing step of the secondary matrix 12: after the secondary matrix 12 is coated with the high-molecular organic compound glue, it is rolled on the primary matrix, and then the surface of the secondary matrix 12 coated with the adhesive is coated with the high-molecular organic compound glue, and the diamonds are randomly arranged on the secondary matrix 12 and then dried to obtain the multi-layer diamond disordered matrix;

[0076] S25. Firing step: the multi-layer diamond disordered matrix is placed in a brazing furnace, and firing is performed at a temperature selected according to the material of the filler metal and the secondary matrix 12 to obtain the multi-layer diamond string bead.

[0077] Example 1

[0078] Reference Figure 4 The application also provides a method for manufacturing an ordered multi-layer diamond string bead, which comprises surface pretreatment of a primary matrix 11 and a secondary matrix 12, an upper bead processing step of the primary matrix 11, an upper bead processing step of the secondary matrix 12, and a firing step.

[0079] S11. Surface pretreatment of the primary matrix 11 and the secondary matrix 12: the primary matrix 11 with an outer diameter of 2.8 mm and the secondary matrix 12 punched from the hand-torn steel with a circumference of 13 mm and a thickness of 0.02 mm are placed in a sandblasting machine for surface roughening treatment for 10 min, and then the secondary matrix 12 is placed in a cylindrical mold with an outer diameter of 4.1 mm for secondary shaping to stabilize its shape.

[0080] S12. Preparation step of the adhesive: 9 grams of NiCrSiB filler metal with a particle size of 300 mesh and 1 gram of high-molecular organic compound glue are mixed according to the standard proportion of 9:1 to obtain the adhesive.

[0081] S13. Upper bead processing step of the primary matrix 11: the adhesive is uniformly coated on the working layer 13 of the primary matrix 11 using a scraper, and then a layer of 60 / 100 particle size NiCrSiB filler metal is coated and dried and cooled, and then the surface of the primary matrix 11 coated with the adhesive is coated with the high-molecular organic compound glue, the diamonds are placed on the ordered particle board for ordered distribution, and then the primary matrix 11 coated with the high-molecular organic compound glue is fixed by a connecting rod, and is uniformly rolled from the ordered particle board, so that the diamonds are ordered arranged on the working layer 13 of the primary matrix 11, and then the primary matrix 11 is dried to obtain the primary matrix.

[0082] S14. The upper bead processing step of the secondary matrix 12: the secondary matrix 12 is immersed in the high-molecular organic compound glue, so that the surface of the secondary matrix 12 has a thin layer of glue, and then the secondary matrix 12 is separated from the middle connecting part, the main embryo is inserted into the secondary matrix 12, and the secondary matrix 12 is fixed on both sides to make the secondary matrix 12 wrap around the main embryo. After the working layer 13 of the secondary matrix 12 is evenly sprinkled with 60 / 100 particle size NiCrSiB filler, drying treatment is performed, the binder is coated on the working layer 13 of the secondary matrix 12 by using a scraper, and then the binder is connected and fixed by a connecting rod. After rolling at a uniform speed from the ordered particle plate, the diamond is arranged in order in the working layer 13 of the secondary matrix 12, and after the diamond is attached, drying treatment is performed. According to the diamond layer requirement, the step is repeated to obtain a multi-layer diamond ordered embryo.

[0083] S15. The firing step: the firing temperature is set to 1030°C for 6min, the multi-layer diamond ordered embryo is placed in a vacuum brazing furnace for brazing, and a multi-layer diamond string bead is obtained.

[0084] Example 2

[0085] Referring to Figure 4 , the application also provides a method for making a multi-layer diamond string bead with unordered arrangement, comprising surface pretreatment of a main matrix 11 and a secondary matrix 12, an upper bead processing step of the main matrix 11, an upper bead processing step of the secondary matrix 12, and a firing step.

[0086] S21. Surface pretreatment of the main matrix 11 and the secondary matrix 12: the main matrix 11 with an outer diameter of 2.8mm and the secondary matrix 12 punched from the hand- torn steel with a circumference of 13mm and 18mm and a thickness of 0.02mm are placed in a sandblasting machine for surface roughening treatment for 10min, and then the secondary matrix 12 is placed on a cylindrical mold with an outer diameter of 4.1mm for secondary shaping to stabilize the shape.

[0087] S22. The preparation step of the binder: 9 grams of NiCrSiB filler with a particle size of 300 mesh and 1 gram of high-molecular organic compound glue are mixed according to the standard proportion of 9:1 to obtain the binder.

[0088] S23. The upper bead processing step of the main matrix 11: the binder is evenly coated on the working layer 13 of the main matrix 11 by using a scraper, and then a layer of 60 / 100 particle size NiCrSiB filler is coated and dried and cooled. After the working layer 13 of the main matrix 11 is evenly sprinkled with the binder, the diamond is evenly sprinkled on the working layer 13 of the main matrix 11, and then the diamond is pressed flat by patting, and drying treatment is performed to obtain the main embryo.

[0089] S24. The upper bead processing step of the secondary matrix 12: the secondary matrix 12 with a circumference of 13 mm is immersed in the high-molecular organic compound glue, so that the surface of the secondary matrix 12 has a thin layer of glue, the secondary matrix 12 is then separated from the middle connecting part, the primary embryo is then inserted into the secondary matrix 12, the secondary matrix 12 is fixed on both sides, so that the secondary matrix 12 is wrapped on the primary embryo, the working layer 13 of the secondary matrix 12 is evenly sprinkled with a layer of 60 / 100 particle size NiCrSiB filler, and then dried, the binder is coated on the working layer 13 of the secondary matrix 12 by using a scraper, and then the diamond is evenly sprinkled on the working layer 13 of the secondary matrix 12, and then dried, the secondary matrix 12 with a circumference of 18 mm is repeated with the above steps, and a multi-layer diamond disordered embryo is obtained;

[0090] S25. The firing step: the firing temperature is set to 1030℃ for 6min, the multi-layer diamond disordered embryo is placed in a vacuum brazing furnace for brazing, and a multi-layer diamond string bead is obtained.

[0091] Example 3

[0092] Reference Figure 4 The application also provides a method for manufacturing a multi-layer diamond string bead with disordered arrangement, which comprises surface pretreatment of a primary matrix 11 and a secondary matrix 12, an upper bead processing step of the primary matrix 11, an upper bead processing step of the secondary matrix 12, and a firing step.

[0093] S21. Surface pretreatment of the primary matrix 11 and the secondary matrix 12: the primary matrix 11 with an outer diameter of 9.2 mm and the secondary matrix 12 with a circumference of 33 mm and a thickness of 0.04 mm are placed in a sand blasting machine for surface roughening treatment for 10 min, and then the secondary matrix 12 is placed on a cylindrical mold with an outer diameter of 10.5 mm for secondary shaping to stabilize the shape.

[0094] S22. Preparation step of the binder: 9 grams of NiCrP filler with a particle size of 200 mesh and 1 gram of high-molecular organic compound glue are mixed according to the standard proportion of 9:1 to obtain the binder.

[0095] S23. The upper bead processing step of the primary matrix 11: the binder is evenly coated on the working layer 13 of the primary matrix 11 by using a scraper, and then a layer of 60 / 100 particle size NiCrP filler is coated and dried and cooled, a layer of binder is then coated, the diamond is evenly sprinkled on the working layer 13 of the primary matrix 11, and then pressed and flattened by patting, and then dried, and a primary embryo is obtained.

[0096] S24. Upper bead processing step of the sub-matrix 12: the sub-matrix 12 is immersed in a high-molecular organic compound glue, so that the surface of the sub-matrix 12 has a thin layer of glue, and then the sub-matrix 12 is separated from the middle connection, the main embryo is inserted into the sub-matrix 12, and the two sides of the sub-matrix 12 are fixed firmly, so that the sub-matrix 12 is wrapped on the main embryo, and then the working layer 13 of the sub-matrix 12 is evenly sprinkled with 60 / 100 particle size NiCrP filler, and then the working layer 13 of the sub-matrix 12 is coated with a binder using a scraper, and then the working layer 13 of the sub-matrix 12 is evenly sprinkled with diamond and then dried, and the above steps can be repeated according to the number of diamond layers to obtain a multi-layer diamond disordered embryo.

[0097] S25. Firing step: set the firing temperature to 970℃ for 5min, place the multi-layer diamond disordered embryo in a vacuum brazing furnace for brazing, and obtain a multi-layer diamond string bead.

[0098] It should be understood that the embodiments disclosed herein are not limited to the specific processing steps or materials disclosed herein, but extend to equivalent alternatives of such features as understood by those skilled in the relevant art. It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.

[0099] The term "embodiment" mentioned in the specification means that the specific features or characteristics described in connection with the embodiment are included in at least one embodiment of the present application. Therefore, the phrase "embodiment" or "embodiments" appearing throughout the specification does not necessarily mean the same embodiment.

[0100] In addition, the described features or characteristics can be combined into one or more embodiments in any other suitable manner. In the above description, some specific details, such as thickness, number, etc., are provided to provide a comprehensive understanding of the embodiments of the present application. However, those skilled in the relevant art will understand that the present application can be implemented without one or more of the above specific details or can be implemented using other methods, components, materials, etc.

Claims

1. A multi-layered diamond bead string, characterized by: The diamond string bead comprises a main base body, at least one sub-base body is arranged on the surface of the main base body, the surface of the main base body and the sub-base body is provided with a working layer, and a plurality of diamonds are arranged in the working layer; the thickness of the sub-base body is 0.001mm-0.5mm, the sub-base body is made of one or more of iron-based materials, nickel-based materials, aluminum-based materials, copper-based materials or tin-based materials, the sub-base body comprises a supporting sleeve, the two ends of the supporting sleeve are respectively provided with a transverse fixing ring, the inner surface of the transverse fixing ring is provided with a vertical fixing sleeve, the surface of the supporting sleeve is the working layer, the transverse fixing ring is used for connecting the supporting sleeve and the vertical fixing sleeve, and the transverse fixing ring is used for fixing the supporting sleeve on the main base body. The main base body is in a columnar structure. The outer diameter of the diamond is 0.2mm-1.0mm.

2. The polycrystalline diamond bead according to claim 1, wherein: The diamonds arranged in the working layer are in one of ordered distribution and disordered distribution.

3. The polycrystalline diamond bead according to claim 2, wherein: The ordered distribution of the diamonds is in one of linear type, spiral type, fold type and wave shape.

4. The polycrystalline diamond bead of claim 1, wherein: The working layer is provided with a brazing filler metal, and the brazing filler metal is one or more of copper-tin-titanium brazing filler metal, nickel-chromium-phosphorus brazing filler metal and nickel-chromium-silicon-boron brazing filler metal.

5. The method of claim 1, wherein: A manufacturing method of the ordered distribution multi-layer diamond string bead; The manufacturing method of the ordered distribution multi-layer diamond string bead comprises, Surface pretreatment of the main base body and the sub-base body: the main base body and the sub-base body are subjected to surface roughening pretreatment; Preparation of the adhesive: the brazing filler metal and the polymer organic compound glue are mixed at a ratio of 1:1-9:1 to obtain the adhesive; The surface of the main base body is coated with the adhesive, and then dried; the surface of the main base body coated with the adhesive is coated with the polymer organic compound glue; the diamonds are arranged in order on the main base body, and then dried to obtain the main base body; The surface of the sub-base body is immersed in the polymer organic compound glue, and then wound on the main base body; the adhesive is coated on the working layer of the sub-base body, and then dried; the surface of the sub-base body coated with the adhesive is coated with the polymer organic compound glue; the diamonds are arranged in order on the sub-base body, and then dried to obtain the multi-layer diamond ordered base body; Firing step: the multi-layer diamond ordered base body is placed in a brazing furnace, and fired at a temperature selected according to the material of the brazing filler metal and the sub-base body to obtain the multi-layer diamond string bead.

6. The method of claim 5, wherein: In the bead processing step of the main base body, the diamonds are arranged in order on the ordered particle board, the diamond particles on the ordered particle board are roll-coated on the main base body coated with the polymer organic compound glue, and then dried; or the polymer organic compound glue is sprayed on the main base body by using a dispensing machine, the diamonds are arranged in order on the glue points sprayed by the dispensing machine, and then dried.

7. The method of claim 5, wherein: The ordered arrangement mode of the diamond in the upper bead processing step of the secondary substrate is that the diamond is arranged on an ordered particle plate, the diamond particles on the ordered particle plate are roll-coated on the secondary substrate with the high-molecular organic compound glue, and then dried; or the high-molecular organic compound glue is sprayed on the secondary substrate by using a dispensing machine, the diamond is scattered on the glue points sprayed by the dispensing machine to be arranged in order, and then dried.

8. The method of claim 1, wherein: The method for manufacturing the multi-layer diamond string beads with disordered distribution comprises the following steps. The method for manufacturing the multi-layer diamond string beads with disordered distribution comprises the following steps. Surface pretreatment of the primary substrate and the secondary substrate: the primary substrate and the secondary substrate are subjected to surface roughening pretreatment. Preparation of the adhesive: the solder and the high-molecular organic compound glue are mixed at a ratio of 1:1-9:1 to obtain the adhesive. Upper bead processing of the primary substrate: the adhesive is coated on the working layer of the primary substrate, the diamond is randomly arranged on the primary substrate, and then dried to obtain a primary body. Upper bead processing of the secondary substrate: the secondary substrate is immersed in the high-molecular organic compound glue, and then wrapped on the primary body, the surface of the secondary substrate coated with the adhesive is coated with the high-molecular organic compound glue, the diamond is randomly arranged on the secondary substrate, and then dried to obtain a multi-layer diamond disordered body. Firing step: the multi-layer diamond disordered body is placed in a brazing furnace, and fired at a temperature selected according to the material of the solder and the secondary substrate to obtain the multi-layer diamond string beads.

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