Multi-dimensional heat pipe, preparation method and electronic device

Abstract

The present invention relates to a multi-dimensional heat pipe and an electronic device. The multi-dimensional heat pipe includes a main pipe cavity extending along a first direction and a secondary pipe cavity extending along a second direction. The main pipe cavity includes: a corresponding shape including a flat tubular shape or a flat plate shape; and one end thereof is set as an evaporation end and the other end is set as a condensation end. The secondary pipe cavity includes: one side surface or at least one port thereof is sealed to the main pipe cavity and forms a common closed cavity with the main pipe cavity; or, one side surface or at least one port thereof is bonded to the main pipe cavity and forms respective closed non-common cavities with the main pipe cavity; or, a certain length corresponding to at least one end thereof extends into or passes through the main pipe cavity and forms respective closed non-common cavities with the main pipe cavity. Applying the embodiments of the present invention can expand the heat transfer dimension such as that of a heat pipe, reduce the space occupied in the thickness direction of an electronic device, improve the heat transfer performance, and enhance the use experience and lifespan of the electronic device.

Description

Technical Field

[0001] The present invention relates to the field of heat transfer devices, and particularly to a multi-dimensional heat pipe, a preparation method and an electronic device. Background Art

[0002] At present, electronic devices are developing towards the directions of ultra-thinness, light weight, high performance and long battery life, making the volume available for heat dissipation smaller and smaller. Heat pipes, vapor chambers, etc. as efficient phase change heat transfer devices have been widely used to solve the heat problems in the fields of microelectronics, optoelectronics, etc.

[0003] In the prior art, in order to reduce the space occupied by, for example, a heat pipe in an electronic device, especially the space occupied in the thickness direction, the heat pipe is usually flattened into an extremely thin flat tube shape, or a heat dissipation film such as graphene is compounded on one side in the thickness direction of the heat pipe. However, the thinner the heat pipe is flattened, the more significantly the volume of the closed cavity inside the pipe shell decreases, which will result in a very small total amount of working fluid that can be filled; and during operation, the flow channel of the vapor-phase working fluid is extremely small, the latent heat transfer is not smooth, and the return of the liquid-phase working fluid is poor due to the insufficient thickness of the wick, so the evaporation end is prone to dry burning, and thus the heat flux is greatly reduced. It can be seen that how to solve the space occupied by, for example, a heat pipe in an electronic device and improve the heat transfer performance has become an urgent technical problem to be solved. Summary of the Invention

[0004] In view of the above problems, the main purpose of the present invention is to provide a multi-dimensional heat pipe, a preparation method and an electronic device to overcome the deficiencies of the related prior art.

[0005] To achieve the purpose of the present invention, the following technical solutions are adopted in the present invention:

[0006] In a first aspect, the present invention provides a multi-dimensional heat pipe, which is characterized in that it includes: a main pipe cavity extending along a first direction, and a secondary pipe cavity extending along a second direction; wherein,

[0007] The main pipe cavity includes: a corresponding shape including a flat tube shape or a flat plate shape; and one end thereof is set as an evaporation end and the other end is set as a condensation end;

[0008] The secondary pipe cavity includes: one side surface or at least one port thereof is sealed to the main pipe cavity and forms a common closed cavity with the main pipe cavity; or, one side surface or at least one port thereof is bonded to the main pipe cavity and forms respective closed non-common cavities with the main pipe cavity; or, a certain length corresponding to at least one end thereof extends into or passes through the main pipe cavity and forms respective closed non-common cavities with the main pipe cavity.

[0009] Further, for the secondary pipe cavity, if one side surface or at least one port thereof is sealed to the main pipe cavity and forms a common closed cavity with the main pipe cavity, the secondary pipe cavity further includes:

[0010] In all or part of the corresponding space, a first wick is provided; wherein, the capillary structure corresponding to the first wick includes powder and / or fiber; the state of the powder and / or fiber includes a bulk state with a certain density.

[0011] Further, the main lumen includes:

[0012] Its inner wall surface is smooth, and / or is provided with nanostructures by chemical etching, and / or is provided with grooves, and / or is provided with a layer of powder particles, and / or is provided with powder particles of a certain thickness; and,

[0013] On the inner wall surface of the main lumen corresponding to the sealing joint to the evaporation end, the first wick is provided; at the evaporation end, a second wick is provided; wherein the second wick is connected to the first wick.

[0014] Further, for the auxiliary lumen, if at least one of its ports is sealed to the main lumen and forms a common closed cavity with the main lumen, then the auxiliary lumen further includes:

[0015] Its two ports are sealed to the main lumen; and the shape of the auxiliary lumen includes a circular tube; wherein, the sealing joint includes: the evaporation end and the condensation end corresponding to the main lumen; and / or, one side of the main lumen in the width direction.

[0016] Further, for the auxiliary lumen, if one of its sides is bonded to the main lumen and forms a non-common closed cavity with the main lumen, then the auxiliary lumen further includes:

[0017] The corresponding shape includes a flat tube, and one side in the width direction of the flat tube is bonded to one side in the thickness direction of the main lumen.

[0018] Further, for the auxiliary lumen, if a certain length of at least one of its ends extends into or passes through the main lumen and forms a non-common closed cavity with the main lumen, then the auxiliary lumen further includes:

[0019] The corresponding shape includes a flat tube or a circular tube; and, the at least one end includes being connected to the main lumen by needle sealing and extending into the main lumen for a certain distance; or, after the extension, it passes through the main lumen again by needle sealing, thereby forming the passing through;

[0020] Wherein, the position corresponding to the main lumen at the extension or passing through includes the condensation end of the main lumen; and, the relationship between the extension direction of the auxiliary lumen and the main lumen includes: orthogonally forming a cross shape or a T shape; or, a "Ψ" shape; or, a certain length of one end of the auxiliary lumen coaxially extends into the main lumen for a certain distance.

[0021] Second aspect, the present invention provides a multi-dimensional heat pipe, which is applied to an electronic device including mobile phones, tablets, and laptop computers. It is characterized in that the heat pipe includes a secondary pipe cavity as described in the first aspect above; wherein, the secondary pipe cavity includes a closed cavity formed into a flat tube shape, and its thickness direction is set perpendicular to the width or length direction of the electronic device.

[0022] Preferably, the multi-dimensional heat pipe includes: one end is set as an evaporation section, the other end is set as a condensation section, and a transition section is arranged between the two; wherein,

[0023] The evaporation section includes: being constructed in a flat plate shape, and its corresponding structural type includes the main pipe cavity as described in the first aspect above; and its inner wall surface is provided with a second wick as described in the first aspect above; and one side surface in its thickness direction is coupled to the top surface of the heat source of the electronic device, and the one side surface is perpendicular to the thickness direction of the electronic device;

[0024] The condensation section includes: being constructed in a flat tube shape, and its corresponding structural type includes the secondary pipe cavity; and all or part of its corresponding space is provided with a first wick as described in the first aspect above; and at least one side surface in the width direction corresponding to the flat tube shape of the condensation end is coupled to a graphene heat dissipation film, and the plane where the film is located is perpendicular to the thickness direction of the electronic device;

[0025] The transition section includes: being used to realize the structural transition from the evaporation end to the condensation end, and its inner wall surface is provided with a second wick as described in the first aspect above.

[0026] Third aspect, the present invention provides an electronic device, and the corresponding product types include mobile phones, tablets, and laptop computers. It is characterized in that the electronic device includes: a multi-dimensional heat pipe as described in the first aspect above; and / or a multi-dimensional heat pipe as described in the second aspect above.

[0027] Preferably, the electronic device further includes:

[0028] The mobile phone includes:

[0029] a strip-shaped gap formed by its internal components corresponding to the length or width direction of the mobile phone; and / or a hollow structure formed by its main board extending in the thickness direction; and / or an annular cavity is arranged around the periphery of its heat dissipation fan, and a heat source of the mobile phone is provided on one side of the fan, and one side of the mobile phone in the width direction is provided on the other side, and an air inlet and an air outlet of the fan are provided on the one side; wherein,

[0030] The strip-shaped gap, or the hollow structure, or the annular cavity is used to set the secondary lumen; the main lumen is coupled to the top of the heat source, or the top of the heat source and the fan.

[0031] The laptop computer includes:

[0032] A strip-shaped gap formed by its internal components and extending in the length or width direction of the laptop computer; and / or, a hollow structure formed by its main board extending in the thickness direction; and / or, a plate-shaped cavity provided at the top of its heat dissipation fin device; and / or, an annular cavity provided at the periphery of its heat dissipation fan; wherein,

[0033] The strip-shaped gap, or the hollow structure, or the plate-shaped cavity, or the annular cavity is used to set the secondary lumen; and, the thickness of the plate-shaped cavity is greater than the thickness of the main lumen described in the first aspect above, and the top surface of the plate-shaped cavity is in the same plane as the top surface of the main lumen.

[0034] From the above technical solutions, it can be seen that the present invention has at least the following beneficial effects:

[0035] Compared with the prior art, the multi-dimensional heat pipe provided by the present invention expands the heat transfer dimension of the main lumen through the secondary lumen, and improves the situation that the heat flux is greatly reduced when the thickness of the main lumen reaches a certain thinness. In some embodiments, one side or at least one port of the secondary lumen is sealed to the main lumen, and forms a common closed cavity with the main lumen, and a first wick is provided in all or part of the corresponding space, avoiding the adverse effects of too little total amount of working fluid that can be filled in the main lumen, too small air passage, and too thin wick thickness on the heat flux; it can further improve the height of the air passage of the main lumen by setting the inner wall surface of the main lumen to be smooth, and then the main lumen further releases the potential for thinning; it can further charge the working fluid into the secondary lumen so that the first wick therein is in a saturated water state, for example, to enhance the continuous and stable liquid supply to the second wick connected thereto, thereby changing the hydraulic conduction path and shortening the hydraulic conduction distance, as well as enhancing the hydraulic continuous conduction ability, and having sensible heat transfer corresponding to the saturated water state.

[0036] Implementing the present invention can reduce the space occupied by the phase change heat transfer device in the thickness direction of the electronic device, improve the heat transfer performance, and enhance the use experience and lifespan of the electronic device. More features and benefits of the present invention will be described in detail in the subsequent detailed implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1A It is a schematic side view structure diagram of a multi-dimensional heat pipe according to an embodiment of the first aspect of the present invention;

[0038] Figure 1B Schematic top view structure diagram of a multi-dimensional heat pipe according to an embodiment of the first aspect of the present invention;

[0039] Figure 1C Schematic cross-sectional structure diagram AA' of a multi-dimensional heat pipe according to an embodiment of the first aspect of the present invention;

[0040] Figure 1D Schematic cross-sectional structure diagram BB' of a multi-dimensional heat pipe according to an embodiment of the first aspect of the present invention;

[0041] Figure 2 Schematic top view structure diagram of a multi-dimensional heat pipe according to another embodiment of the first aspect of the present invention;

[0042] Figure 3A Schematic side view structure diagram of a multi-dimensional heat pipe according to an embodiment of the second aspect of the present invention;

[0043] Figure 3B Schematic top view structure diagram of a multi-dimensional heat pipe according to an embodiment of the second aspect of the present invention;

[0044] Figure 3C Schematic cross-sectional structure diagram DD' of a multi-dimensional heat pipe according to an embodiment of the second aspect of the present invention;

[0045] Figure 3D Schematic cross-sectional structure diagram EE' of a multi-dimensional heat pipe according to an embodiment of the second aspect of the present invention;

[0046] Figure 4A Schematic structure diagram in the corresponding process of an embodiment of a preparation method according to the fourth aspect of the present invention;

[0047] Figure 4B Schematic structure diagram in the corresponding process of another embodiment of a preparation method according to the fourth aspect of the present invention. Detailed implementation manners

[0048] In order to make the objectives, technical solutions and beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. All other embodiments obtained by those of ordinary skill in the art in the technical field of the present invention without creative efforts based on the embodiments of the present invention belong to the scope of protection of the present invention. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0049] Embodiments of the first aspect

[0050] Specifically, for the above-mentioned "main lumen extending in the first reverse direction and auxiliary lumen extending in the second direction", when the main lumen is in a flat tubular shape, the main lumen extending in the first reverse direction can also be a main lumen extending in the first plane, where the first plane is the plane formed by the width and length directions of the main lumen; and / or when the auxiliary lumen is in a flat tubular shape, the auxiliary lumen extending in the second reverse direction can also be an auxiliary lumen extending in the second plane, where the second plane is the plane formed by the width and length directions of the auxiliary lumen. The spatial relationship between the first plane and the second plane includes being orthogonal.

[0051] For the above-mentioned "one side or at least one port thereof is sealed to the main lumen and forms a common closed cavity with the main lumen", exemplarily, it is respectively selected from a flat tube body to form the auxiliary lumen and the main lumen; where: both ends of the flat tube body corresponding to the main lumen have end seals, and on one side (such as the bottom plate) in its thickness direction, a first slit with a belt-shaped hollow (such as a slit width of 1 mm) is provided corresponding to the length direction of the main lumen, and this slit can be set at any position in the width direction of the main lumen; and both ends of the flat tube body corresponding to the auxiliary lumen have end seals, and on one side in its width direction, a second slit with a belt-shaped hollow (such as a slit width of 1 mm) is provided corresponding to the length direction of the auxiliary lumen, and this slit can be set at any position in the thickness direction of the auxiliary lumen; further, the shapes of the first slit and the second slit match, and the two slits are sealed together, thereby forming a common closed cavity with the main lumen and the main lumen.

[0052] It should be noted that the structure obtained by the above sealing can also be obtained through integral molding, or stamping, or bending and welding, etc., and all can be regarded as a kind of the above sealing. The sealing is only for facilitating the clear description of relevant structures.

[0053] Please refer to Figures 1A - 1D , which respectively show the schematic side view, top view, cross-section AA' and BB' structures of the multi-dimensional heat pipe according to an embodiment of the first aspect of the present invention. As Figures 1A - 1D shown, it includes an auxiliary lumen 10, a condensation end 11, and a first wick 12; and a main lumen 13, an evaporation end 14, and a second wick 15. Among them, the auxiliary lumen 10 and the main lumen 13 form a common closed cavity; the first wick 12 occupies a part of the auxiliary lumen 10 to increase the airway volume for the circulation of the vapor working medium in the closed cavity jointly formed by the auxiliary lumen 10 and the main lumen 13. Among them Figure 1D For the auxiliary lumen 10 shown, a first wick 12 is provided in the corresponding partial space, the upper space is used as an airway, and the side wall surface corresponding to this upper space can be smooth, or a first wick 12 or a second wick 15 with a certain thickness can be respectively provided on the left and right side wall surfaces.

[0054] The main pipe cavity 13 corresponds to the inner wall surface except the evaporation end 14, and is set to be smooth or chemically etched with nanostructures, which has the benefit of significantly increasing the airway height of the main pipe cavity 13 for the circulation of the gaseous working medium.

[0055] In addition, it should be noted that the first wick 12 can also occupy the entire auxiliary pipe cavity 10 to increase the total amount of working medium that can be filled, so that the filled working medium is absorbed by the first wick 12 under the action of capillary force; and under the capillary action of the first wick 12, when the spatial attitude of the auxiliary pipe cavity 10 changes, the liquid-phase working medium therein will not be released quickly and in large quantities. When the potential energy of the auxiliary pipe cavity 10 is lower than that of the main pipe cavity 13, the first wick 12 will be in a saturated water state in whole or in large part. Thus, the auxiliary pipe cavity 10 is used as the main liquid storage cavity, and the first wick 12 therein is connected to the second wick 15. The second wick 15 has a shorter length, shortening the hydraulic conduction distance of the capillary water, and realizing the rapid, continuous and stable supply of capillary water from the first wick 12 to the second wick 15 located at the evaporation end 14.

[0056] Optionally, a graphene heat dissipation film can also be coupled to the top surface in the thickness direction of the main pipe cavity 13, and the spreading direction of the film is parallel to the top surface; and / or, a graphene heat dissipation film can also be coupled to the bottom surface of the auxiliary pipe cavity 10 facing away from the main pipe cavity 13, and the spreading direction of the film is parallel to the bottom surface. Among them, the top surface or the bottom surface can be parallel to the plane where the screen of the electronic device is located.

[0057] It should be noted that Figures 1A - 1D , one side surface of the auxiliary pipe cavity 10 is sealed to the main pipe cavity 13, and the auxiliary pipe cavity 10 and the main pipe cavity 13 form a common closed cavity.

[0058] From Figures 1A - 1D it can be clearly seen that there are two end parts of the auxiliary pipe cavity 10, one of which is the end part close to the evaporation end 14 (which can be defined as the front end part of the auxiliary pipe cavity 10), that is, the auxiliary pipe cavity 10 has a front end part close to the evaporation end 14. Furthermore, based on this front end part, the main pipe cavity can be divided into a first section located before (or on one side) of this front end part and a second section located after (or on the other side) of this front end part. The evaporation end 14 is distributed in the first section.

[0059] This end part close to the evaporation end 14 can also be understood as an end surface close to the evaporation end 14, and both are clearly and unambiguously determined based on qualitative analysis in Figures 1A - 1D .

[0060] In addition, it should be understood that when it comes to the description of directions, such as up, down, front, back, left, right, inside, outside, top, bottom, etc. (if any) indicating the orientation or positional relationship, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0061] Please refer to Figure 2 , which shows a schematic top view structure of a multi-dimensional heat pipe according to another embodiment of the first aspect of the present invention. As Figure 2 shown, it includes a secondary lumen 10, a condensation end 11, and a first wick 12; and a main lumen 13, an evaporation end 14, and a second wick 15. The secondary lumen 10 is located on the side in the width direction of the main lumen 13 and has a thickness not exceeding that of the main lumen 13. In addition, the first wick 12 occupies the entire secondary lumen 10 to increase the total amount of working fluid that can be filled, so that most of the filled working fluid is absorbed by the first wick 12 under the action of capillary force.

[0062] Wherein, the cross-section CC’ shown is the demarcation point. The thickness of the second wick 15 on the side away from the condensation end 11 is not less than the thickness of the second wick 15 on the other side. In some embodiments, the thickness of the second wick 15 on the side away from the condensation end 11 is the same as the height of the main lumen 13. The advantage is that it realizes the gas-phase and liquid-phase shunt, avoids the mutual obstruction caused by the opposite flow directions of the gas phase and the liquid phase in the prior art, and through the above-mentioned thickness difference, improves the capillary pumping force of the evaporation end 14, enhances the liquid-phase reflux in the secondary lumen 10, and resists the liquid-phase reflux obstruction caused by part of the gas-phase pressure. Preferably, the bottom side of the evaporation end 14 corresponding to the second wick 15 on the side of the cross-section CC’ close to the condensation end 11 is coupled to the top surface of a heat source (such as a CPU) inside, for example, a mobile phone.

[0063] Moreover, when the potential energy of the secondary lumen 10 is lower than that of the main lumen 13, the first wick 12 will be in a fully saturated or mostly saturated state. Furthermore, the secondary lumen 10 is realized as the main liquid-phase reflux channel and liquid storage cavity, and the first wick 12 therein, under the action of the tension of the water in the lumen on the inner wall of the secondary lumen 10, further strengthens the reflux of the liquid phase from the condensation end 11 to the evaporation end 14, and realizes the rapid, continuous, and stable replenishment of capillary water from the first wick 12 to the second wick 15 located at the evaporation end 14.

[0064] The inner wall surface corresponding to the main lumen 13 is set to be smooth, or is provided with nanostructures by chemical etching, or is provided with grooves, or is provided with a layer of powder particles, or is provided with powder particles of a certain thickness. In particular, for the smooth and nanostructured surfaces, it has the benefit of significantly increasing the airway height of the main lumen 13 for the flow of gaseous working medium. Thus, it focuses on relying on the auxiliary lumen 10 to achieve liquid phase reflux. The auxiliary lumen 10 constitutes a bypass branch of the main lumen 13, and the number of such bypass branches can be one or more; and it focuses on relying on the main lumen 13 to achieve gas phase flow, overcoming the flow resistance between the gas phase and the liquid phase to a certain extent.

[0065] In the above-mentioned "one side or at least one port thereof is bonded to the main lumen and forms a non-common closed cavity with the main lumen respectively", the bonding corresponds to the outer wall surface of the tube shells forming the main lumen and the auxiliary lumen; when the outer wall surfaces corresponding to the main lumen and the auxiliary lumen are in contact, they can be bonded at the contact part by welding, sintering, etc. Its benefit lies in expanding the heat transfer dimension of the main lumen, improving the situation where the heat flux decreases significantly when the thickness of the main lumen reaches a certain thinness, and further releasing the potential of thinning the main lumen.

[0066] In the above-mentioned "a certain length corresponding to at least one end thereof extends into or passes through the main lumen and forms a non-common closed cavity with the main lumen respectively", exemplarily, one end or both ends of the tube shell corresponding to the auxiliary lumen; and at any outer wall surface (such as the circumference, end) of the closed tube shell corresponding to the main lumen, the tube shell corresponding to the auxiliary lumen is coupled to the opening through one or two openings adapted to the cross-section of the tube shell corresponding to the auxiliary lumen. The coupling includes extending into or passing through, and further sealing the coupling part of the contact part, thereby forming a non-common closed cavity with the main lumen and the auxiliary lumen respectively. Its benefit lies in that especially when the auxiliary lumen is arranged at the condensation end corresponding to the main lumen, it significantly improves the heat dissipation at the condensation end and accelerates the liquefaction of the gaseous working medium.

[0067] In the above-mentioned "the first wick is arranged in all or part of the corresponding space; wherein, the capillary structure corresponding to the first wick includes powder and / or fiber; the state corresponding to the powder and / or fiber includes a loose state with a certain density", the first wick can be made of a porous structure such as a wire mesh arranged inside the auxiliary lumen or at the boundary between the auxiliary lumen and the main lumen, so that the first wick is limited in all or part of the corresponding space of the auxiliary lumen in the loose state and always maintains a certain density during operation; it can also be a sintered wick obtained by sintering.

[0068] The above-mentioned "its inner wall surface is smooth, and / or is chemically etched with nanostructures, and / or is provided with grooves, and / or is provided with a layer of powder particles, and / or is provided with powder particles of a certain thickness", wherein the nanostructures have an extremely thin thickness, can significantly save the airway volume inside the main lumen, and can have a certain hydrophilicity, a certain capillary force, and constitute the condensation nucleation sites at the condensation end; the layer of powder particles has a relatively thin thickness, can significantly save the airway volume inside the main lumen, also has a certain hydrophilicity, a small amount of capillary force, and constitutes the condensation nucleation sites at the condensation end, as well as the boiling bubble nucleation sites at the evaporation end.

[0069] Second aspect embodiment

[0070] Specifically, the above-mentioned "the heat pipe includes a secondary lumen as described in the first aspect above; wherein, the secondary lumen includes: a closed cavity forming a flat tube, and its thickness direction is set perpendicular to the width or length direction of the electronic device", in one embodiment, the heat pipe is the secondary lumen, and this secondary lumen forms a flat tubular closed cavity, and its width direction is set along the thickness direction of the electronic device; further, a graphene heat dissipation film can be coupled to one side of the top in the width direction of the heat pipe, and this film can be regarded as the main lumen described in the first aspect above, or play the same role as the main lumen, and then the cross-section corresponding to this film and the secondary lumen forms a T shape, obtaining corresponding multiple heat transfer dimensions.

[0071] Please refer to Figures 3A - 3D , which respectively show the schematic side view, top view, cross-section DD' and EE' structures of a multi-dimensional heat pipe according to an embodiment of the second aspect of the present invention. As Figures 3A - 3D shown, it includes a condensation section 21, a first wick 12; and a transition section 23, an evaporation section 24, a second wick 15. Among them, the first wick 12 occupies part of the cavity corresponding to the condensation section 21; and the cavity corresponding to the condensation section 21 except for the first wick 12 is an airway for the flow of the vapor working medium. The transition section 23 can achieve the structural transition from the evaporation end to the condensation end through, for example, a diameter change. The first wick 12 provided in the transition section 23 occupies the entire space of the transition section 23, forming a column with a rectangular cross-section and longitudinal section, and its two ends are respectively connected to the condensation section 21 and the evaporation section 24 to ensure the hydraulic continuity of the capillary force, and in some embodiments, the first wick 12 provided in the transition section 23 can also have a certain slope.

[0072] From Figures 3A - 3DAs can be clearly seen, the cavity that houses the first liquid absorbent core 12 is the auxiliary tube cavity, and the cavity that has an evaporation section 24 (or evaporation end) and a condensation section 21 (or condensation end) is the main tube cavity. Among them, there are two ends of the auxiliary tube cavity, one of which is an end near the evaporation section 24 (which can be defined as the front end of the auxiliary tube cavity), that is, the auxiliary tube cavity has a front end near the evaporation section 24. Furthermore, based on this front end, the main tube cavity can be divided into a first section located before (or on one side) of this front end and a second section located after (or on the other side) of this front end. The evaporation section 24 (or condensation end) is distributed in the first section.

[0073] The auxiliary tube cavity has a front end near the evaporation section 24, which can also be understood as the auxiliary tube cavity having an end face near the evaporation end 14, both of which are clearly and unambiguously determinable based on qualitative analysis in Figures 3A - 3D this context.

[0074] In addition, it should be understood that when it comes to orientation descriptions, such as up, down, front, back, left, right, inside, outside, top, bottom, etc. (if any), the indicated orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention.

[0075] Its benefits are as follows. For example, if this embodiment is applied to a mobile phone, when looking down at the mobile phone: the evaporation section 24 is square with a size adapted to the CPU, and its lower part is a heat source such as the CPU. And due to the presence of the condensation section 21, the evaporation section 24 is biased towards generating gaseous working medium, and the gaseous working medium is transmitted through the air channels therein. Therefore, the thickness of the evaporation section 24 can be extremely thin, for example, 0.25 mm; the condensation section 21 is in the shape of a strip with a certain width (for example, 1 mm), the length direction of this strip corresponds to the length direction of the mobile phone, and is perpendicular to one side of the square near the condensation section 21, and the condensation section 21 is coupled to one side in the width direction of the battery, and is arranged in the strip-shaped gap formed by facing the ground at a certain distance from this side and its adjacent devices.

[0076] Among them, this side and its adjacent devices can be on the same layer; the width of this gap (for example, 1 mm), and the height is coupled to the thickness of the battery (for example, 3.5 mm), and the length is coupled to the length of the battery (for example, 70 mm). It can be seen that if the thickness of the tube shell is 0.1 mm, then for the cavity formed by the condensation section 21, its cross-section can be 0.8 mm in width and at least 3.3 mm in total height; among them, the lower side height corresponding to this total height is set with the first liquid absorbent core 12 at 0 - 2.0 mm, and the upper side height above 2.0 mm is set as the air channel.

[0077] Furthermore, it can completely release the thickness space corresponding to the traditional flattened heat pipe in the prior art for the thickness space of the mobile phone, realizing further thinning of the mobile phone. The released space in terms of thickness can also be used to thicken the battery to obtain a larger battery capacity, or thicken the battery but reduce the size of the surface where the length and width of the battery are located (to obtain more space in the width direction of the mobile phone, which can be used to widen the above-mentioned gap, or thicken the condensation section 21 to, for example, 1.5 or 2.0 mm to significantly increase the airway volume therein, and then the improvement of the airway flow will be more significant), or be used to add other devices.

[0078] Optionally, the condensation section 21 is coupled to one side edge in the length or width direction of the battery inside the mobile phone and fixed by an adhesive.

[0079] Optionally, on the top and bottom surfaces in the thickness direction of the condensation section 21, a graphene heat dissipation film can be respectively coupled, and then the cross-section of the condensation section 21 and the two films correspondingly forms a "work" character shape. Among them, the top surface or the bottom surface can be parallel to the plane where the screen of the electronic device is located.

[0080] It should be noted that in the second aspect embodiment of the present invention, the above-mentioned condensation section 21 can also be regarded as a type of corresponding structure of the auxiliary lumen 10 or the condensation end 11 described in the first aspect embodiment of the present invention; the above-mentioned evaporation section 24 can also be regarded as a type of corresponding structure of the main lumen 13 or the evaporation end 14 described in the first aspect embodiment of the present invention.

[0081] Third aspect embodiment

[0082] Specifically, when looking down at the mobile phone perpendicular to the plane where the length and width of the mobile phone are located, a strip-shaped gap corresponding to the length or width direction of the mobile phone is formed by the internal devices therein. For example, the strip-shaped gap is located on the side of the battery inside the mobile phone and is on the same layer or the same pair of stacked layers as the battery, and this pair of stacked layers can be composed of a circuit board and / or components.

[0083] The above-mentioned hollow structure is, for example, a cylindrical shape, and the auxiliary lumen is coupled into the cylindrical shape. Further, the bottom side corresponding to the cylindrical shape can be coupled to a graphene heat dissipation film spread parallel to the main board. Among them, the graphene heat dissipation film is located below the main board or coupled to the inner wall surface of the bottom case of the laptop computer.

[0084] The above-mentioned heat dissipation fin device includes a plurality of fin structures and a frame for fixing the fin structures. A plate-shaped cavity is arranged at the top of the above-mentioned heat dissipation fin device, which can be obtained by reducing the height of the fin structures.

[0085] In one embodiment, one end of the auxiliary lumen is coaxially sealed to one end of the main lumen, and the two form an L shape. The auxiliary lumen is disposed in the plate-shaped cavity provided at the top of the heat dissipation fin device. The thickness of the auxiliary lumen is greater than that of the aforementioned main lumen, but the top surface of the plate-shaped cavity is in the same plane as the top surface of the main lumen. Moreover, in the corresponding partial space of the auxiliary lumen, a first wick is provided, and the space other than the partial space is a channel for the circulation of the vaporous working fluid. The advantage is that, due to the greater thickness of the auxiliary lumen than that of the main lumen, more vaporous working fluid and more liquid working fluid can be accommodated. Furthermore, it can also serve as a liquid storage tank to enhance the hydraulic continuity of the capillary seepage.

[0086] The above-mentioned annular cavity, for example, can be disposed at the condensation end or the adiabatic section between the evaporation end and the condensation end. The corresponding thickness of its cross-section is 1 mm. In the entire space of the cavity, a first wick is provided (for example, the first wick is a filled powder with a certain density, and the powder is not sintered but is restricted by a limiting effect such as a wire mesh, and the powder particles are kept close to each other). The first wick is connected to a second wick provided in the main lumen. Under some working conditions, the inside of the annular cavity is in a saturated liquid state, which can serve as a liquid storage tank to enhance the hydraulic conduction continuity towards the evaporation end, shorten the liquid supply distance from the condensation end to the evaporation end, and simultaneously obtain the heat dissipation performance of sensible heat.

[0087] Combining the embodiments of the first to third aspects of the present invention above, the following is an embodiment of the preparation method of the fourth aspect of the present invention, which can be used to prepare the multi-dimensional heat pipe as described in the above aspect embodiments. For the details not disclosed in the embodiment of the preparation method of the fourth aspect of the present invention, please refer to the above aspect embodiments of the present invention.

[0088] Please refer to Figure 4A , which shows a schematic structural diagram in the corresponding process of an embodiment of the preparation method of the fourth aspect of the present invention, used to prepare the multi-dimensional heat pipe as described in the above aspect embodiments. The method includes the following steps:

[0089] S101. Prepare a rectangular copper sheet 100;

[0090] S102. Perform multiple bends along multiple straight lines parallel to the length direction of the copper sheet 100, obtain a pair of butt joints 110 and seal them to obtain the target structure 120;

[0091] Among them, the rectangular copper sheet 100 is a top view; the target structure 120 is a schematic cross-sectional structure diagram.

[0092] Further, the first liquid absorption core and the second liquid absorption core as described in the embodiments of each aspect of the present invention are disposed in the target structure 120, and a part at one end of the target structure 120 is cut, flattened, and the edge seam is sealed. Further, end caps are added to both ends of the target structure 120 to obtain end sealing.

[0093] Or,

[0094] Please refer to Figure 4B , which shows a schematic structural diagram in the corresponding process of another preparation method embodiment of the fourth aspect of the present invention, for preparing the multi-dimensional heat pipe as described in the above aspect embodiment. The method includes the following steps:

[0095] S201. Prepare a circular copper tube 200;

[0096] S202. Obtain an intermediate structure 210 by stamping; wherein the shell thickness of the circular copper tube 200 corresponding to the stamping part is greater than that of other parts;

[0097] S203. Obtain an expected structure 220 by flattening;

[0098] Among them, the circular copper tube 200, the intermediate structure 210, and the expected structure 220 are all schematic cross-sectional structure diagrams.

[0099] Further, the first liquid absorption core and the second liquid absorption core as described in the embodiments of each aspect of the present invention are disposed in the expected structure 220, and end caps are added to both ends of the expected structure 220 to obtain end sealing.

[0100] Preferably, the circular copper tube 200 is a non-uniform thickness tube, and the stamping corresponds to the shell of the thicker part therein.

[0101] Or,

[0102] Another preparation method embodiment of the fourth aspect of the present invention is for preparing the multi-dimensional heat pipe as described in the above aspect embodiment. The method includes the following steps:

[0103] S301. Prepare a flat copper tube 300;

[0104] S302. Cut off half of a column with a certain height near one end of the flat copper tube 300 along the symmetry axis in the width direction of the column, and press a part of the other half into a plane to obtain an intermediate structure 310;

[0105] S303. Prepare a copper sheet with the same size as the plane, stack it on the lower side of the plane, and weld the corresponding obtained edge seam to obtain a corresponding flat inner cavity;

[0106] S304. Weld the cut seams obtained in step S302 and the other edge seams obtained in step S303 respectively to obtain the desired structure 320;

[0107] Among them, the flat copper tube 300 except the cylinder can be regarded as the auxiliary lumen as described in the above aspects after end sealing treatment; the flat inner peripheral cavity can be regarded as the main lumen as described in the above aspects after end sealing treatment; the auxiliary lumen and the main lumen together form a connected closed cavity.

[0108] In the above steps S301 to S304, it also includes: arranging the first liquid absorption core and the second liquid absorption core as described in the embodiments of each aspect of the present invention in the desired structure 320.

[0109] It should be noted that, for the convenience of describing the present invention and simplifying the description, in the steps of the preparation method embodiments of the fourth aspect of the present invention, conventional technical steps such as vacuum pumping and filling with working fluid are omitted.

[0110] It should be noted that the step numbers (if any) in the description, claims and drawings of the present invention are only for the convenience of explaining specific embodiments and do not serve to limit the execution order of the steps. Terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the term "above" expressing quantity means two or more than two. The terms "comprising", "having" and any of their variations are intended to cover non-exclusive inclusion.

[0111] It should be understood that regarding the orientation description, such as up, down, front, back, left, right, inside, outside, top, bottom, etc. (if any), the indicated orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0112] The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and deformations can be made, and these improvements and deformations should also be regarded as the protection scope of the present invention; without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. For the sake of avoiding unnecessary repetition, the present invention does not separately describe various possible combination methods.

Claims

1. A multi-dimensional heat pipe, which is applied to an electronic device, is characterized in that, Comprising: A main lumen extending along a first plane and a secondary lumen extending along a second plane; wherein, the main lumen includes: a corresponding shape including a flat tube shape or a flat plate shape, and one end thereof is set as an evaporation end and the other end is set as a condensation end; The secondary lumen includes Option A, Option B or Option C, wherein: Option A: One side surface thereof is sealed to the main lumen and forms a common closed cavity with the main lumen. The spatial relationship between the first plane and the second plane includes being orthogonal. The secondary lumen is in a flat tube shape. The second plane is the plane formed by the width and length directions of the secondary lumen. And the secondary lumen has an end near the evaporation end. The main lumen is divided into a first section located before the end and a second section located after the end. The evaporation end is distributed in the first section; Option B: One side surface or at least one port thereof is bonded to the main lumen and forms respective closed non-common cavities with the main lumen. The spatial relationship between the first plane and the second plane includes being orthogonal. The secondary lumen further includes: a corresponding shape including a flat tube shape. One side edge in the width direction of the flat tube shape is bonded to one side surface in the thickness direction of the main lumen. And the secondary lumen is configured to form a strip-shaped gap corresponding to the length or width direction of the internal components of the electronic device extending for the internal components of the electronic device. The electronic device includes a mobile phone or a laptop; Option C: A certain length of at least one end thereof extends into or passes through the main lumen and forms respective closed non-common cavities with the main lumen. The secondary lumen further includes: a corresponding shape including a flat tube shape or a round tube shape. And at least one end includes being connected to the main lumen by a needle seal, extending into the main lumen for a certain distance or, after the extension, passing through the main lumen again by a needle seal to form the passing. The position corresponding to the main lumen at the extension or passing includes the condensation end of the main lumen. The relationship between the extension direction of the secondary lumen and the main lumen includes: orthogonally forming a cross shape or a T shape or a "Ψ" shape, or a certain length of one end of the secondary lumen coaxially extending into the main lumen for a certain distance.

2. The multi-dimensional heat pipe according to claim 1, wherein Option A further includes: If the secondary lumen is sealed to the main lumen on one side surface thereof and forms a common closed cavity with the main lumen, then the secondary lumen further includes: A first liquid absorbent core is provided in all or part of the corresponding space; wherein, the first liquid absorbent core is configured with a corresponding capillary structure including powder and / or fiber. The state of the powder and / or fiber includes a loose state with a certain density, or is configured as a sintered liquid absorbent core.

3. The multi-dimensional heat pipe according to claim 2, wherein Further comprising: The first liquid absorbent core is configured to be limited to all or part of the corresponding space of the secondary lumen in the loose state through a wire mesh provided inside the secondary lumen or at the boundary between the secondary lumen and the main lumen, and always maintain a certain density during operation.

4. The multi-dimensional heat pipe according to claim 1, characterized in that, Further comprising: The main pipe cavity has a smooth inner wall surface, and / or is chemically etched with nanostructures, and / or is provided with grooves, and / or is provided with a layer of powder particles, and / or is provided with powder particles of a certain thickness; and, At the inner wall surface of the main pipe cavity corresponding to the evaporation end from the sealing point, the first liquid absorption core is provided; the evaporation end is provided with a second liquid absorption core; wherein the second liquid absorption core is connected to the first liquid absorption core.

5. The multi-dimensional heat pipe according to any one of claims 1-4, characterized in that, The solution A further includes: the thickness of the auxiliary pipe cavity is greater than the thickness of the main pipe cavity.

6. A multi-dimensional heat pipe, characterized in that, It includes: A main pipe cavity extending in a first direction and an auxiliary pipe cavity extending in a second direction; wherein, the main pipe cavity includes: the corresponding shape includes a flat tubular shape or a flat plate shape, and one end thereof is set as an evaporation end and the other end is set as a condensation end; The auxiliary pipe cavity has at least one port sealed to the main pipe cavity and forms a common closed cavity with the main pipe cavity, and the auxiliary pipe cavity further includes: its two ports are sealed to the main pipe cavity; and the corresponding shape of the auxiliary pipe cavity includes a circular tubular shape; wherein, the sealing point includes: the evaporation end and the condensation end corresponding to the main pipe cavity; and / or, one side edge in the width direction of the main pipe cavity.

7. The multi-dimensional heat pipe according to claim 6, wherein It further includes: The auxiliary pipe cavity further includes: the entire corresponding space is provided with a first liquid absorption core, wherein the first liquid absorption core is configured to have a corresponding capillary structure including powder and / or fiber, and the powder and / or fiber are in a corresponding state of a loose body with a certain density or are configured as a sintered liquid absorption core; The main pipe cavity further includes: its inner wall surface is smooth and / or is chemically etched with nanostructures and / or is provided with grooves and / or is provided with a layer of powder particles and / or is provided with powder particles of a certain thickness, and the inner wall surface of the main pipe cavity corresponding to the evaporation end from the sealing point is provided with the first liquid absorption core, and the evaporation end is provided with a second liquid absorption core, wherein the second liquid absorption core is connected to the first liquid absorption core.

8. The multi-dimensional heat pipe according to claim 7, wherein It further includes: the thickness of the auxiliary pipe cavity does not exceed that of the main pipe cavity; the first liquid absorption core occupies the entire auxiliary pipe cavity; and the evaporation end of the main pipe cavity is provided with a second liquid absorption core; at a preset cross-section of the main pipe cavity as a demarcation point, the thickness of the second liquid absorption core on the side far from the condensation end among the two sides is not less than the thickness of the second liquid absorption core on the side close to the condensation end.

9. The multi-dimensional heat pipe according to claim 8, characterized in that, The thickness of the second liquid absorption core on the side far from the condensation end among the two sides is not less than the thickness of the second liquid absorption core on the side close to the condensation end includes: the thickness of the second liquid absorption core on the side far from the condensation end is consistent with the height of the main pipe cavity.

10. The multi-dimensional heat pipe according to claim 9, wherein, The second liquid absorption core on the side close to the condensation end includes: the bottom side of the corresponding evaporation end is configured to be coupled to the top surface of a heat source.

11. A multi-dimensional heat pipe is applied to an electronic device, and the product types of the electronic device include mobile phones, tablets or laptop computers. It is characterized in that, The heat pipe includes the auxiliary pipe cavity as described in claim 1; wherein, the auxiliary pipe cavity includes: a closed cavity formed in a flat tubular shape, and its thickness direction is set perpendicular to the width or length direction of the electronic device.

12. The multi-dimensional heat pipe according to claim 11, characterized in that, The multi-dimensional heat pipe includes: one end is set as an evaporation section, the other end is set as a condensation section, and a transition section is arranged between the two; wherein, The evaporation section includes: being configured as a flat plate, and its corresponding structural type includes the main pipe cavity as described in any one of claims 1-5, and its inner wall surface is provided with a second wick as described in claim 4, and one side surface in the thickness direction thereof is coupled to the top surface of the heat source of the electronic device, and the one side surface is perpendicular to the thickness direction of the electronic device; The condensation section includes: being configured as a flat tube, and its corresponding structural type includes the auxiliary pipe cavity, and all or part of its corresponding space is provided with a first wick as described in any one of claims 2-3, and at least one side surface in the width direction corresponding to the flat tube of the condensation section is coupled to a graphene heat dissipation film, and the plane where the graphene heat dissipation film is located is perpendicular to the thickness direction of the electronic device; The transition section includes: being used to realize the structural transition from the evaporation section to the condensation section, and its inner wall surface is provided with a second wick as described in claim 4.

13. The multi-dimensional heat pipe according to claim 12, wherein The multi-dimensional heat pipe includes: the heat pipe is the auxiliary pipe cavity; and the auxiliary pipe cavity forms a closed cavity in the shape of a flat tube, and its width direction is set along the thickness direction of the electronic device.

14. The multi-dimensional heat pipe according to claim 13, wherein, It further includes: One side surface at the top of the width direction of the heat pipe is coupled to a graphene heat dissipation film, and further the graphene heat dissipation film and the cross section corresponding to the auxiliary pipe cavity form a T shape.

15. The multi-dimensional heat pipe according to claim 12, wherein The multi-dimensional heat pipe is configured to be applied to the mobile phone, and further includes: The evaporation section is square in size and adapted to the CPU, and the lower part of the evaporation section is configured to be coupled to the heat source; The condensation section is in the shape of a strip with a certain width, the length direction corresponding to the strip is along the length direction of the mobile phone and perpendicular to one side of the square close to the condensation section; and the condensation section is configured to be coupled to one side in the width direction of the battery and is arranged in a strip-shaped gap formed by facing each other with a certain distance between the side and the adjacent devices; the battery and the adjacent devices are included in the mobile phone.

16. The multi-dimensional heat pipe according to claim 15, characterized in that, It further includes: The side and the adjacent devices are configured to be located on the same layer; the strip-shaped gap has a height coupled to the thickness of the battery and a length coupled to the length of the battery.

17. The multi-dimensional heat pipe according to claim 16, wherein It further includes: The strip-shaped gap has a width of 1 mm, a height of 3.5 mm, and a length of 70 mm.

18. The multi-dimensional heat pipe according to any one of claims 11-17, characterized in that, The multi-dimensional heat pipe further includes: the auxiliary pipe cavity is configured to be arranged in a strip-shaped gap in the mobile phone, and the strip-shaped gap is formed by the internal devices of the mobile phone and extends corresponding to the length or width direction of the electronic device.

19. The multi-dimensional heat pipe according to any one of claims 11-17, characterized in that, The multi-dimensional heat pipe further includes: the condensation section is coupled to one side in the length or width direction of the internal battery of the mobile phone and is fixed by an adhesive.

20. The multi-dimensional heat pipe according to any one of claims 11-17, characterized in that, The multi-dimensional heat pipe further includes: the top surface and the bottom surface in the thickness direction of the condensation section are respectively coupled to a graphene heat dissipation film; further, the condensation section and the two graphene heat dissipation films form an "I" shape corresponding to the cross section; wherein, the top surface or the bottom surface is parallel to the plane where the screen of the electronic device is located.

21. A multi-dimensional heat pipe, which is applied to an electronic device, and the electronic device includes a mobile phone or a laptop computer, characterized in that, The multi-dimensional heat pipe includes: a main pipe cavity extending along a first plane and a secondary pipe cavity extending along a second plane, and the spatial relationship between the first plane and the second plane includes being orthogonal; wherein, the main pipe cavity includes: a corresponding shape including a flat tubular shape or a flat plate shape; and one end thereof is set as an evaporation end and the other end is set as a condensation end. The secondary pipe cavity includes: one side surface or at least one port thereof is sealed to the main pipe cavity and forms a common closed cavity with the main pipe cavity; the secondary pipe cavity is configured to be a strip-shaped gap disposed within the electronic device, and the strip-shaped gap is formed by the internal components of the electronic device and extends in a direction corresponding to the length or width direction of the electronic device.

22. The multi-dimensional heat pipe according to claim 21, wherein, It further includes: the secondary pipe cavity and the main pipe cavity are respectively constituted by a flat pipe body; wherein, Both ends of the flat pipe body corresponding to the main pipe cavity have end seals, and on one side surface in the thickness direction thereof, a first slit with a strip-shaped hollow is provided corresponding to the length direction of the main pipe cavity, and the first slit is provided at any position in the width direction of the main pipe cavity; and, Both ends of the flat pipe body corresponding to the secondary pipe cavity have end seals, and on one side surface in the width direction thereof, a second slit with a strip-shaped hollow is provided corresponding to the length direction of the secondary pipe cavity, and the second slit is provided at any position in the thickness direction of the secondary pipe cavity; The shapes of the first slit and the second slit match, and the first slit and the second slit are sealed together to form the common closed cavity.

23. The multi-dimensional heat pipe according to any one of claims 21-22, characterized in that, It further includes: The strip-shaped gap is located on the side of the battery within the mobile phone and is on the same layer or the same pair of stacked layers as the battery, and the pair of stacked layers is constituted by a circuit board and / or components.

24. An electronic device, the corresponding product types including mobile phones, tablets or laptop computers, characterized in that, The electronic device includes: the multi-dimensional heat pipe according to any one of claims 1-23.

25. The electronic device according to claim 24, wherein It further includes: The mobile phone includes: A strip-shaped gap formed by its internal components and extending in a direction corresponding to the length or width direction of the mobile phone; and / or, an annular cavity is provided peripherally around its heat dissipation fan, and a heat source of the mobile phone is provided on one side of the fan, and the other side is set as one side edge in the width direction of the mobile phone, and an air inlet and an air outlet of the fan are provided on the side edge. Wherein, the strip-shaped gap or the annular cavity is used to dispose the secondary pipe cavity; on the top of the heat source, or on the top of the heat source and the fan, the main pipe cavity is coupled.

26. The electronic device according to claim 24, wherein It further includes: The laptop computer includes: A strip-shaped gap formed by its internal components and extending in a direction corresponding to the length or width direction of the laptop computer, and / or, a hollow structure extending along the thickness direction of its main board, and / or, a plate-shaped cavity is provided on the top of its heat dissipation fin device, and / or, an annular cavity is provided peripherally around its heat dissipation fan; Wherein, the strip-shaped gap, or the hollow structure, or the plate-shaped cavity, or the annular cavity is used to dispose the secondary pipe cavity; and, the thickness of the plate-shaped cavity is greater than the thickness of the main pipe cavity according to any one of claims 1-22, and the top surface of the plate-shaped cavity is in the same plane as the top surface of the main pipe cavity.

27. The electronic device according to any one of claims 25 or 26, characterized in that, It further includes: The strip-shaped gap is located on the side of the battery within the mobile phone and is on the same layer or the same pair of stacked layers as the battery, and the pair of stacked layers is composed of a circuit board and / or components within the mobile phone.

28. A preparation method, characterized in that, For preparing the multi-dimensional heat pipe as described in claim 21, the preparation method includes the following steps: S101. Prepare a rectangular copper sheet (100); S102. Perform multiple bends along multiple straight lines parallel to the length direction of the copper sheet (100), obtain a pair of butt joints (110) and seal them to produce a target structure (120).

29. The preparation method according to claim 28, wherein, After the step S102, there is also a step S103, and the step S103 is used for preparing the multi-dimensional heat pipe as described in the solution A in claim 1, where: S103. Place the first liquid-absorbing core as described in any one of claims 2-3 and the second liquid-absorbing core as described in claim 4 in the target structure (120), and through local cutting, flattening and sealing the edge seams at one end of the target structure (120), and adding end caps at both ends of the target structure (120) to obtain end seals.

30. A preparation method, characterized in that, For preparing the multi-dimensional heat pipe as described in claim 21, the preparation method includes the following steps: S201. Prepare a circular copper tube (200); S202. Obtain an intermediate structure (210) through stamping; where the thickness of the tube shell of the circular copper tube (200) corresponding to the stamping area is greater than other parts of the circular copper tube (200) except the stamping area. S203. Flatten it to produce an expected structure (220).

31. The preparation method according to claim 30, characterized in that, After the step S203, the preparation method further includes the following steps: S204. Place the first liquid-absorbing core as described in any one of claims 2-3 and the second liquid-absorbing core as described in claim 4 in the expected structure (220), and add end caps at both ends of the expected structure (220) to obtain end seals.

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