Chip failure analysis method and device, electronic equipment and medium

Abstract

The application provides a chip failure analysis method and device, electronic equipment and medium. After obtaining hot melt wax in a first state, the first state being a softened state, the method embeds a sample to be ground into one side of the hot melt wax in the first state by using a preset embedding method, and shapes the other side of the hot melt wax in the first state to obtain a grinding body in the first state. The sample to be ground in the grinding body remains horizontal. Based on the grinding body in the first state, a grinding body in a second state is obtained, the second state being a solidified state. After shaping the hot melt wax on the grinding body in the second state, the sample to be ground in the grinding body is ground to obtain a chip to be analyzed. The chip to be analyzed is subjected to failure analysis to obtain an analysis result. The method improves the grinding stability and safety, and also improves the failure analysis efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor analysis, in particular to a chip failure analysis method and device, an electronic device and a medium. BACKGROUND

[0002] Grinding is one of the high-precision machining methods. At present, a fixed abrasive disc is generally used to grind various brittle and hard materials, such as semiconductor silicon wafers and sapphire. However, in the prior art, the grinding sample is usually pressed on the grinding table by fingers, as shown in FIG. 1. If the grinding table rotates at a high speed, it is difficult for the fingers to control the grinding sample to remain stationary, resulting in insufficient grinding stability and reducing the grinding efficiency and safety. Figure 1 SUMMARY

[0003] The embodiments of the present application aim to provide a chip failure analysis method and device, an electronic device and a medium, to solve the above problems in the prior art and improve the grinding stability and safety, and the failure analysis efficiency.

[0004] In a first aspect, a chip failure analysis method is provided, which can include:

[0005] obtaining hot melt wax in a first state; the first state is a softened state;

[0006] embedding a sample to be ground in one side of the hot melt wax in the first state by a preset embedding method, and shaping the other side of the hot melt wax in the first state to obtain a grinding body in the first state; the sample to be ground remains horizontal in the grinding body;

[0007] obtaining a grinding body in a second state based on the grinding body in the first state; the second state is a solidified state;

[0008] grinding the sample to be ground in the grinding body after shaping the hot melt wax on the fixed grinding body in the second state to obtain a chip to be analyzed;

[0009] performing failure analysis on the chip to be analyzed to obtain an analysis result.

[0010] In an optional implementation, before embedding the sample to be ground in one side of the hot melt wax in the first state by the preset embedding method, the method further includes:

[0011] determining whether the sample to be ground is encapsulated;

[0012] if not encapsulated, wrapping the sample to be ground by AB glue to obtain a new sample to be ground.

[0013] ​In an optional implementation, the sample to be polished is embedded into one side of the hot-melt wax in the first state by using a preset embedding method, which comprises:

[0014] The one side of the hot-melt wax in the first state is pressed against the sample to be polished placed on a horizontal plane to keep the sample to be polished parallel to the plane.

[0015] In an optional implementation, the hot-melt wax in the first state is obtained, which comprises:

[0016] The obtained hot-melt wax in the second state is heated to a preset softening temperature to obtain the hot-melt wax in the first state; the preset softening temperature is not less than the minimum softening temperature of the hot-melt wax and less than the maximum softening temperature.

[0017] The abrasive body in the second state is obtained, which comprises:

[0018] The hot-melt wax in the abrasive body in the first state is cooled to a preset solidification temperature to obtain the abrasive body in the second state.

[0019] In an optional implementation, the sample to be polished in the abrasive body is polished to obtain a chip to be analyzed, which comprises:

[0020] The changing distance between the front surface of the sample to be polished and the back surface of the sample to be polished is monitored.

[0021] If the monitored changing distance is less than a preset safe polishing distance, a coarse polishing process is used to polish the sample to be polished in the abrasive body to obtain a primary abrasive body after polishing.

[0022] If the monitored changing distance is not less than the preset safe polishing distance, a fine polishing process is used to polish the sample to be polished in the primary abrasive body until the target position of the sample to be polished is reached.

[0023] After polishing to the target position, the hot-melt wax of the abrasive body after polishing is removed to obtain the chip to be analyzed.

[0024] The preset safe polishing distance is the distance between the initial polishing surface of the sample to be polished and the target position.

[0025] In an optional implementation, the chip to be analyzed is a single-side polished chip.

[0026] The sample to be polished is embedded into one side of the hot-melt wax in the first state by using a preset embedding method, which comprises:

[0027] The back surface of the sample to be polished is embedded into one side of the hot-melt wax in the first state by using a preset embedding method.

[0028] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the sample to be ground in the primary grinding body to a target position of the sample to be ground, including:

[0029] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the front surface of the sample to be ground in the primary grinding body to a position where the chip pad is exposed.

[0030] In an optional implementation, the chip to be analyzed is a double-sided ground chip.

[0031] After grinding to the position where the chip pad is exposed, the method further includes:

[0032] Obtaining new hot melt wax in a first state and the sample to be ground with the chip pad exposed;

[0033] The front surface of the sample to be ground with the chip pad exposed is upward, and the step of embedding the sample to be ground in one side of the hot melt wax in the first state by using a preset embedding mode and shaping the other side of the hot melt wax in the first state to obtain the grinding body in the first state is performed again.

[0034] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the sample to be ground in the primary grinding body to a target position of the sample to be ground, including:

[0035] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the front surface of the sample to be ground in the primary grinding body to a position where the chip pad is exposed.

[0036] In a second aspect, a chip failure analysis device is provided, which can include:

[0037] An obtaining unit is configured to obtain hot melt wax in a first state; the first state is a softened state.

[0038] An embedding unit is configured to embed a sample to be ground in one side of the hot melt wax in the first state by using a preset embedding mode.

[0039] A shaping unit is configured to shape the other side of the hot melt wax in the first state to obtain a grinding body in the first state; the sample to be ground in the grinding body is kept horizontal.

[0040] The obtaining unit is further configured to obtain a grinding body in a second state based on the grinding body in the first state; the second state is a solidified state.

[0041] a grinding unit, configured to grind the sample to be ground in the grinding body after the hot melt wax in the molding state of the second state, to obtain a chip to be analyzed;

[0042] a failure analysis unit, configured to perform failure analysis on the chip to be analyzed, to obtain an analysis result.

[0043] In an optional implementation, the apparatus further includes a determination unit and a processing unit.

[0044] The determination unit is configured to determine whether the sample to be ground has a package.

[0045] The processing unit is configured to, if there is no package, wrap the sample to be ground by using AB glue, to obtain a new sample to be ground.

[0046] In an optional implementation, the embedding unit is specifically configured to press one side of the hot melt wax in the first state against the sample to be ground placed on a horizontal plane, to keep the sample to be ground parallel to the plane.

[0047] In an optional implementation, the obtaining unit is specifically configured to:

[0048] heat the obtained hot melt wax in the second state to a preset softening temperature, to obtain hot melt wax in the first state; the preset softening temperature is not less than the minimum softening temperature of the hot melt wax and is less than the maximum softening temperature;

[0049] and cool the hot melt wax in the grinding body in the first state to a preset solidification temperature, to obtain a grinding body in the second state.

[0050] In an optional implementation, the grinding unit is specifically configured to:

[0051] monitor the distance between the front surface of the sample to be ground and the back surface of the sample to be ground;

[0052] if the monitored change distance is less than a preset safe grinding distance, use a coarse grinding process to grind the sample to be ground in the grinding body, to obtain a primary grinding body after grinding;

[0053] if the monitored change distance is not less than the preset safe grinding distance, use a fine grinding process to grind the sample to be ground in the primary grinding body, to the target position of the sample to be ground;

[0054] after grinding to the target position, remove the hot melt wax of the grinding body after grinding, to obtain a chip to be analyzed;

[0055] wherein the preset safe grinding distance is the distance between the initial grinding surface of the sample to be ground and the target position.

[0056] In an optional implementation, the chip to be analyzed is a single-side polished chip.

[0057] The embedding unit is further configured to embed the back of the sample to be polished upwards into one side of the hot melt wax in the first state in a preset embedding manner.

[0058] The polishing unit is further configured to polish the front of the sample to be polished in the primary polishing body to a position where the chip pads are exposed using a fine polishing process if the monitored change distance is not less than the preset safe polishing distance.

[0059] In an optional implementation, the chip to be analyzed is a double-side polished chip.

[0060] After polishing to a position where the chip pads are exposed, the obtaining unit is further configured to obtain new hot melt wax in the first state and the sample to be polished with the exposed chip pads.

[0061] The embedding unit is further configured to embed the front of the sample to be polished with the exposed chip pads upwards and return to perform the step of embedding the sample to be polished into one side of the hot melt wax in the first state in a preset embedding manner and shaping the other side of the hot melt wax in the first state to obtain the primary polishing body in the first state.

[0062] The polishing unit is further configured to polish the front of the sample to be polished in the primary polishing body to a position where the chip back is exposed using a fine polishing process if the monitored change distance is not less than the preset safe polishing distance.

[0063] In a third aspect, an electronic device is provided, which includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory complete communication with each other through the communication bus.

[0064] The memory is configured to store a computer program.

[0065] The processor is configured to execute the program stored on the memory to implement the method steps of any one of the first aspect.

[0066] In a fourth aspect, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the method steps of any one of the first aspect.

[0067] The chip failure analysis method provided in the application obtains hot melt wax in a first state, the first state being a softened state, embeds the sample to be ground into one side of the hot melt wax in the first state by using a preset embedding mode, and shapes the other side of the hot melt wax in the first state to obtain a grinding body in the first state; the sample to be ground in the grinding body is kept horizontal; based on the grinding body in the first state, a grinding body in a second state is obtained, the second state being a solidified state; after shaping the hot melt wax on the fixed grinding body in the second state, the sample to be ground in the grinding body is ground to obtain a chip to be analyzed; the chip to be analyzed is subjected to failure analysis to obtain an analysis result. The method improves the grinding stability and safety, and also improves the failure analysis efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0068] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments of the application. It should be understood that the following drawings only show some of the embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0069] Figure 1 A schematic diagram of a prior art grinding method provided for the embodiments of the application;

[0070] Figure 2 A flowchart of a chip failure analysis method provided for the embodiments of the application;

[0071] Figure 3 A structural schematic diagram of a grinding body provided for the embodiments of the application;

[0072] Figure 4 A structural schematic diagram of another grinding body provided for the embodiments of the application;

[0073] Figure 5 A structural schematic diagram of a chip failure analysis device provided for the embodiments of the application;

[0074] Figure 6 A structural schematic diagram of an electronic device provided for the embodiments of the application. DETAILED DESCRIPTION

[0075] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, and not all the embodiments. Based on the embodiments of the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the application.

[0076] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to explain and illustrate the present application, and are not used to limit the present application, and the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0077] Figure 2 A flowchart of a chip failure analysis method provided by an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, the method can include the following steps. Figure 2

[0078] In step S210, the hot melt wax in the first state is obtained.

[0079] The hot melt wax is also known as hot melt glue, hot melt stick or adhesive stick. It is a transparent material that can conveniently and quickly bond and fix ceramic, semiconductor, metal and other sample materials, and then perform the next material sample preparation work such as grinding, cutting, polishing or thinning. The softening temperature range of the hot melt wax is 65-135℃.

[0080] According to the preset softening temperature, the hot melt wax in the second state is heated, and the hot melt wax is softened to obtain the hot melt wax in the first state. The first state is a plastic state, i.e. a softened state. The preset softening temperature is not less than the minimum softening temperature of the hot melt wax and less than the maximum softening temperature. The preset softening temperature can be 70℃.

[0081] In step S220, the sample to be ground is embedded in one side of the hot melt wax in the first state by using a preset embedding method, and the other side of the hot melt wax in the first state is shaped to obtain a grinding body in the first state.

[0082] Before performing the step, since the hot melt wax expands when heated, directly embedding the bare chip without packaging into the hot melt wax in the first state can easily cause damage to the bare chip due to the expansion force of the hot melt wax. Therefore, it is necessary to determine whether the sample to be ground has packaging.

[0083] If there is no packaging, in order to avoid direct contact between the bare chip and the hot melt wax in the first state, the bare chip can be wrapped with AB glue around the four sides to obtain a new sample to be ground, which is the bare chip wrapped with AB glue. Then, step S220 is performed.

[0084] If there is packaging, step S220 can be directly performed.

[0085] In the specific implementation of step S220, the sample to be ground can be first placed on a horizontal plane, and then one side of the hot melt wax in the first state is pressed against the sample to be ground. In this way, the sample to be ground embedded in the hot melt wax can remain parallel to the plane, i.e. the sample to be ground remains horizontal.

[0086] ​Or, the sample to be ground can be held in hand, the sample to be ground is embedded on one side of the hot melt wax in the first state, and the other side of the hot melt wax in the first state is pinched by fingers, and the side embedded with the sample to be ground is pressed gently in a horizontal plane, that is, the bottom is pressed, so that the side of the hot melt wax embedded with the sample to be ground can be attached and flat, so that the sample to be ground is kept horizontal.

[0087] In the above process, the sample to be ground can be embedded in the hot melt wax in the first state, or can be partially embedded in the hot melt wax in the first state, that is, one side of the sample to be ground is embedded in the hot melt wax in the first state, and the other side of the sample to be ground is not embedded in the hot melt wax in the first state.

[0088] After that, in order to avoid the problem of unstable finger pressing in the prior art, the other side of the hot melt wax in the first state (that is, the side not embedded with the sample to be ground) can be shaped, for example, a toothpick or a plastic rod is used to accumulate a conical body, such as a pyramid shape, so as to obtain a grinding body in the first state, as shown in Figure 3 .

[0089] It can be understood that the shape of the other side of the hot melt wax in the first state can be customized according to business needs, which is not limited in the present application, and a fixed shape of the shaping mold can be made in advance to shape the other side of the hot melt wax in the first state by using the mold.

[0090] Step S230, based on the grinding body in the first state, obtaining a grinding body in a second state.

[0091] In the above process, the second state is a non-shapeable state, that is, a solidified state.

[0092] In specific implementation, since the periphery of the grinding body in the first state is wrapped with the hot melt wax in the first state, the hot melt wax in the first state is cooled to a preset solidification temperature, and the grinding body in the second state is obtained. The preset solidification temperature is a temperature at which the hot melt wax can be completely solidified, for example, the preset solidification temperature can be any temperature in the range of 20-25°C.

[0093] If rapid cooling is required, the grinding body in the first state can be placed in ice water to improve the cooling speed.

[0094] Step S240, after the hot melt wax shaped on the grinding body in the second state is fixed, the sample to be ground in the grinding body is ground until the chip pad of the sample to be ground is ground, and a chip to be analyzed is obtained.

[0095] In specific implementation, the grinding body can be fixed by holding the hot melt wax shaped on the grinding body in the second state with fingers, or the grinding body can be fixed by clamping the hot melt wax shaped on the grinding body in the second state with a fixed clamp, which is not limited in the present application.

[0096] Compared with the prior art of pressing by fingers, the fixing mode improves the stability and safety of fixing the sample to be ground, and the stability of the fixing mode improves the grinding efficiency in the later stage.

[0097] Specifically, since the grinding plane is a horizontal plane, the sample to be ground in the grinding body is parallel to the grinding plane, so that the distance between the front surface of the sample to be ground and the back surface of the sample to be ground (i.e. the real-time height difference of the sample to be ground) can be monitored in real time by using a 3D ultra-high resolution digital microscope (Optical microscope) during the grinding process of the sample to be ground in the grinding body; or, the side surface of the sample to be ground in the grinding body is ground first, and then the distance between the front surface of the sample to be ground and the back surface of the sample to be ground is monitored in real time by using a 2D OM ordinary optical microscope, and the specific mode is not limited herein. The front surface of the sample to be ground is the surface where the chip pad is located, and the back surface of the sample to be ground is the surface where the chip wafer is located.

[0098] Since the initial distance between the front surface of the sample to be ground and the back surface of the sample to be ground before grinding is known, and the distance between the front surface of the sample to be ground and the back surface of the sample to be ground is monitored during the grinding process, the real-time change distance between the front surface of the sample to be ground and the back surface of the sample to be ground can be monitored.

[0099] If the monitored change distance is less than the preset safe grinding distance, in order to improve the grinding efficiency, a coarse grinding process can be adopted to grind the sample to be ground in the grinding body, to obtain a primary grinding body after grinding;

[0100] If the monitored change distance is not less than the preset safe grinding distance, in order to remove the damage left by coarse grinding and reduce the grinding damage, a fine grinding process can be adopted to grind the sample to be ground in the primary grinding body until the target position of the sample to be ground is reached;

[0101] After grinding to the target position, the hot-melt wax of the grinding body after grinding can be removed by heating the grinding body after grinding or placing the grinding body after grinding in an acetone solvent, to obtain a chip to be analyzed.

[0102] The target position can be a position where the chip pad is exposed or a position where the chip wafer is exposed. The preset safe grinding distance is the distance between the initial grinding surface of the sample to be ground and the target position, and the initial grinding surface refers to the sample surface corresponding to the chip pad or the sample surface corresponding to the chip wafer before grinding. The heating temperature for removing the hot-melt wax of the grinding body after grinding can be any temperature greater than 135℃.

[0103] It should be noted that, depending on the actual failure analysis requirements, the target location can also be any location that exposes the chip lead cross-section; this application does not impose any limitations on this.

[0104] In one specific embodiment, based on actual analysis requirements, the chip to be analyzed can be a chip that has been ground on one side or a chip that has been ground on both sides, that is, both the front and back sides of the sample to be ground are ground.

[0105] (1) For chips that have undergone single-sided grinding:

[0106] In step S220, a preset embedding method is required, in which the back side of the sample to be ground is embedded upwards into one side of the hot melt wax in the first state. Furthermore, if the monitored change distance during the grinding process is not less than a preset safe grinding distance, a fine grinding process is employed to grind the front side of the sample in the primary grinding body until the chip pads are exposed, thus obtaining the chip to be analyzed.

[0107] (2) For chips that have undergone double-sided grinding:

[0108] After grinding to the position where the chip pads are exposed, it is necessary to obtain the new hot melt wax in the first state and the sample to be ground with the exposed chip pads; wherein, the sample to be ground with the exposed chip pads can be the sample after the hot melt wax has been removed, or the sample without the hot melt wax has been removed, that is, the grinding body after grinding.

[0109] Next, with the front side of the sample to be polished facing up and the chip pads exposed, return to step 220: using a preset embedding method, embed the sample to be polished into one side of the hot melt wax in the first state, and shape the other side of the hot melt wax in the first state to obtain the polishing body in the first state. At this time, a new polishing body in the first state will be obtained.

[0110] If the sample to be polished, exposing the chip pads, is a sample after the hot melt wax has been removed, then the shape of the new polishing head is the same as the shape of the original polishing head, such as... Figure 3 As shown; if the sample to be polished, with exposed chip pads, is a sample without removed hot melt wax, then the shape of the new polishing head will differ from the shape of the original polishing head, such as... Figure 4 As shown.

[0111] If the shape of the new grinding media is Figure 4 As shown, during grinding, the hot melt wax used for molding on the original grinding body needs to be ground off first, and then the back side of the sample to be ground is ground. Furthermore, if the monitored change distance during the grinding process is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the front side of the sample to be ground in the primary grinding body until the chip back is exposed, thus obtaining the chip to be analyzed.

[0112] Step S250, performing failure analysis on the chip to be analyzed to obtain an analysis result.

[0113] In a specific implementation, the front surface of the chip to be analyzed can be fixed upward on a fixed plate, such as a glass or a PCB plate.

[0114] The wire bonder is used to electrically connect the chip pad or the chip lead section to the analysis circuit board based on the configured wire bonding debugging parameters.

[0115] Specifically, a preset wire bonder is used to perform an electronic flame-off (EFO) operation on a predetermined amount of gold wire. When the gold wire is separated from the top end of the welding needle, a free air ball (FAB) is formed. Under the joint action of welding pressure, welding time, a certain ultrasonic energy, and temperature, one end of the gold wire is "welded" to the chip pad or the chip lead section, and the other end of the gold wire is "welded" to the analysis circuit board, such as a PCB board, to obtain a failure analysis chip sample.

[0116] Finally, an electrical signal is applied to the lead of the analysis circuit board to excite the leakage path. A conventional failure pinpointing device is used to perform failure pinpointing on the failure analysis chip sample, and an analysis result can be obtained.

[0117] It can be seen that the grinding device can improve the grinding efficiency and stability, and the efficiency and accuracy of failure analysis can be improved.

[0118] Corresponding to the above method, an embodiment of the present application also provides a chip failure analysis device, as shown in the figure. Figure 5 The chip failure analysis device includes an acquisition unit 510, an embedding unit 520, a molding unit 530, a grinding unit 540, and a failure analysis unit 550.

[0119] The acquisition unit 510 is configured to acquire hot melt wax in a first state; the first state is a softened state.

[0120] The embedding unit 520 is configured to embed a sample to be ground into one side of the hot melt wax in the first state by using a preset embedding method.

[0121] The molding unit 530 is configured to mold the other side of the hot melt wax in the first state to obtain a grinding body in the first state; the sample to be ground is kept horizontal in the grinding body.

[0122] The acquisition unit 510 is further configured to acquire a grinding body in a second state based on the grinding body in the first state; the second state is a solidified state.

[0123] A grinding unit 540 is configured to grind the sample to be ground in the grinding body after the hot melt wax in the molding state is fixed on the grinding body, so as to obtain a chip to be analyzed.

[0124] A failure analysis unit 550 is configured to perform failure analysis on the chip to be analyzed, so as to obtain an analysis result.

[0125] The functions of the functional units of the chip failure analysis device provided in the above embodiments can be realized through the above method steps, and therefore, the specific working processes and beneficial effects of each unit in the chip failure analysis device provided in the embodiments are not described herein.

[0126] The embodiments of the present application further provide an electronic device, as shown in the accompanying drawings, which comprises a processor 610, a communication interface 620, a memory 630 and a communication bus 640, wherein the processor 610, the communication interface 620 and the memory 630 complete mutual communication through the communication bus 640. Figure 6

[0127] The memory 630 is configured to store a computer program.

[0128] The processor 610 is configured to perform the program stored in the memory 630, and realize the following steps:

[0129] The hot melt wax in the first state is obtained; the first state is a softened state.

[0130] The sample to be ground is embedded into one side of the hot melt wax in the first state by using a preset embedding mode, and the other side of the hot melt wax in the first state is molded, so as to obtain a grinding body in the first state; the sample to be ground in the grinding body is kept horizontal.

[0131] The grinding body in the second state is obtained based on the grinding body in the first state; the second state is a solidified state.

[0132] The sample to be ground in the grinding body is ground after the hot melt wax in the molding state is fixed on the grinding body in the second state, so as to obtain a chip to be analyzed.

[0133] Failure analysis is performed on the chip to be analyzed, so as to obtain an analysis result.

[0134] In an optional implementation, before the sample to be ground is embedded into one side of the hot melt wax in the first state by using a preset embedding mode, the method further comprises:

[0135] It is determined whether the sample to be ground is encapsulated.

[0136] If not, the sample to be ground is wrapped by using AB glue, so as to obtain a new sample to be ground.​

[0137] In an optional implementation, the embedding of the sample to be polished into one side of the hot-melt wax in the first state is performed by using a preset embedding method, including:

[0138] Pressing one side of the hot-melt wax in the first state against the sample to be polished placed on a horizontal plane to keep the sample to be polished parallel to the plane.

[0139] In an optional implementation, the hot-melt wax in the first state is obtained by:

[0140] Heating the obtained hot-melt wax in the second state to a preset softening temperature to obtain the hot-melt wax in the first state; the preset softening temperature is not less than the minimum softening temperature of the hot-melt wax and less than the maximum softening temperature;

[0141] Obtaining the polishing body in the second state includes:

[0142] Cooling the hot-melt wax in the polishing body in the first state to a preset solidification temperature to obtain the polishing body in the second state.

[0143] In an optional implementation, the sample to be polished in the polishing body is polished to obtain a chip to be analyzed, including:

[0144] Monitoring the changing distance between the front surface of the sample to be polished and the back surface of the sample to be polished;

[0145] If the monitored changing distance is less than a preset safe polishing distance, a coarse polishing process is used to polish the sample to be polished in the polishing body to obtain a primary polishing body after polishing;

[0146] If the monitored changing distance is not less than the preset safe polishing distance, a fine polishing process is used to polish the sample to be polished in the primary polishing body until the target position of the sample to be polished is reached;

[0147] After polishing to the target position, the hot-melt wax of the polishing body after polishing is removed to obtain the chip to be analyzed;

[0148] The preset safe polishing distance is the distance between the initial polishing surface of the sample to be polished and the target position.

[0149] In an optional implementation, the chip to be analyzed is a single-side polished chip;

[0150] The embedding of the sample to be polished into one side of the hot-melt wax in the first state is performed by using a preset embedding method, including:

[0151] Embedding the back surface of the sample to be polished upward into one side of the hot-melt wax in the first state by using a preset embedding method;

[0152] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the sample to be ground in the primary grinding body to a target position of the sample to be ground.

[0153] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the front surface of the sample to be ground in the primary grinding body to a position exposing the chip pad.

[0154] In an optional implementation, the chip to be analyzed is a double-sided ground chip.

[0155] After grinding to a position exposing the chip pad, the method further includes:

[0156] Obtaining new hot melt wax in a first state and the sample to be ground exposing the chip pad;

[0157] The front surface of the sample to be ground exposing the chip pad is upward, and the step of embedding the sample to be ground in one side of the hot melt wax in the first state and shaping the other side of the hot melt wax in the first state to obtain the grinding body in the first state is performed again.

[0158] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the sample to be ground in the primary grinding body to a target position of the sample to be ground.

[0159] If the monitored change distance is not less than the preset safe grinding distance, a fine grinding process is adopted to grind the front surface of the sample to be ground in the primary grinding body to a position exposing the chip back.

[0160] The communication bus mentioned above can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or only one type of bus.

[0161] The communication interface is used for communication between the electronic device and other devices.

[0162] The memory can include a random access memory (RAM) and can also include a non-volatile memory (NVM), such as at least one disk memory. Optionally, the memory can also be at least one storage device located remotely from the aforementioned processor.

[0163] The processor described above can be a general processor, including a central processing unit (CPU), a network processor (NP), etc. It can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component.

[0164] The implementation manners and beneficial effects of the electronic device in the above embodiments can be achieved by referring to the steps in the above embodiments, and thus the specific working process and beneficial effects of the electronic device provided by the embodiments of the present application will not be repeated here. Figure 2 The implementation manners and beneficial effects of the electronic device in the above embodiments can be achieved by referring to the steps in the above embodiments, and thus the specific working process and beneficial effects of the electronic device provided by the embodiments of the present application will not be repeated here.

[0165] In another embodiment provided by the present application, a computer readable storage medium is provided, which stores instructions, and when the instructions run on a computer, the computer executes the chip failure analysis method in any of the above embodiments.

[0166] In another embodiment provided by the present application, a computer program product containing instructions is provided, and when the instructions run on a computer, the computer executes the chip failure analysis method in any of the above embodiments.

[0167] Those skilled in the art should understand that the embodiments in the embodiments of the present application can be provided as a method, a system or a computer program product. Therefore, the embodiments in the embodiments of the present application can be in the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware aspects. Moreover, the embodiments in the embodiments of the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.

[0168] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0169] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0170] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flowcharts and / or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0171] While preferred embodiments of the application have been described, modifications and variations can be apparent to those skilled in the art once aware of the general underlying concepts. Therefore, it is intended that the scope of the appended claims should include all such modifications and variations.

[0172] Obviously, numerous modifications and variations of the present embodiments are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A chip failure analysis method, characterized in that, The method includes: Obtain hot melt wax in a first state; the first state is a softened state. If it is determined that the sample to be ground is not encapsulated, then AB glue is used to encapsulate the sample to be ground to obtain a new sample to be ground. Using a preset embedding method, a new sample to be ground is embedded into one side of the hot melt wax in the first state, and the other side of the hot melt wax in the first state is shaped into a cone to obtain a grinding body in the first state; the sample to be ground in the grinding body is kept horizontal; Based on the first state of the grinding media, a second state of the grinding media is obtained, wherein the second state is a solidified state; After the hot melt wax molded on the grinding body in the second state is fixed, the sample to be ground in the grinding body is ground to obtain the chip to be analyzed; the method of fixing the hot melt wax molded on the grinding body in the second state includes: holding the cone-shaped hot melt wax molded on the grinding body in the second state with fingers, or clamping the cone-shaped hot melt wax molded on the grinding body in the second state with a fixing clip; Failure analysis was performed on the chip to be analyzed, and the analysis results were obtained.

2. The method as described in claim 1, characterized in that, Using a preset embedding method, the sample to be ground is embedded into one side of the hot melt wax in the first state, including: Press one side of the hot melt wax in the first state onto the sample to be ground, which is placed on a horizontal plane, to keep the sample to be ground parallel to the plane.

3. The method as described in claim 1, characterized in that, Obtaining the first state of hot melt wax includes: The obtained second-state hot melt wax is heated according to a preset softening temperature to obtain the first-state hot melt wax; the preset softening temperature is not less than the minimum softening temperature of the hot melt wax and is less than the maximum softening temperature. Obtaining the grinding media in the second state includes: The hot melt wax in the first-state grinding media is cooled to a preset solidification temperature to obtain the second-state grinding media.

4. The method as described in claim 1, characterized in that, The sample to be ground in the grinding media is ground to obtain a chip to be analyzed, comprising: Monitor the changing distance between the front and back sides of the sample to be ground; If the monitored change distance is less than the preset safe grinding distance, then a coarse grinding process is adopted to grind the sample to be ground in the grinding body to obtain the primary grinding body after grinding. If the monitored change distance is not less than the preset safe grinding distance, then a fine grinding process is adopted to grind the sample to be ground in the primary grinding body until the target position of the sample to be ground is reached. After grinding to the target position, the hot melt wax of the grinding body is removed to obtain the chip to be analyzed; The preset safe grinding distance is the distance between the initial grinding surface of the sample to be ground and the target position.

5. The method as described in claim 4, characterized in that, The chip to be analyzed is a chip that has been polished on one side only; Using a preset embedding method, the sample to be ground is embedded into one side of the hot melt wax in the first state, including: Using a preset embedding method, the back side of the sample to be ground is embedded upwards into one side of the hot melt wax in the first state; If the monitored change distance is not less than the preset safe grinding distance, then a fine grinding process is adopted to grind the sample to be ground in the primary grinding media until the target position of the sample to be ground is reached, including: If the monitored change distance is not less than the preset safe grinding distance, then a fine grinding process is adopted to grind the front side of the sample to be ground in the primary grinding body until the position of the chip pad is exposed.

6. The method as described in claim 5, characterized in that, The chip to be analyzed is a chip that has been polished on both sides; After grinding to expose the chip pads, the method further includes: Obtain the new hot melt wax in its first state and the sample to be polished with exposed chip pads; With the front side of the sample to be polished facing up and return to the execution step: using a preset embedding method, embed the sample to be polished into one side of the hot melt wax in the first state, and shape the other side of the hot melt wax in the first state to obtain the polishing body in the first state. If the monitored change distance is not less than the preset safe grinding distance, then a fine grinding process is adopted to grind the sample to be ground in the primary grinding media until the target position of the sample to be ground is reached, including: If the monitored change distance is not less than the preset safe grinding distance, then a fine grinding process is adopted to grind the front side of the sample to be ground in the primary grinding body until the chip back is exposed.

7. A failure analysis device, characterized in that, The device includes: The acquisition unit is used to acquire hot melt wax in a first state, which is a softened state; and if it is determined that the sample to be ground is not encapsulated, the sample to be ground is wrapped with AB glue to obtain a new sample to be ground. An embedding unit is used to embed a new sample to be ground into one side of the hot melt wax in the first state using a preset embedding method; A molding unit is used to mold the other side of the hot melt wax in the first state into a conical shape to obtain a grinding body in the first state; the sample to be ground in the grinding body is kept horizontal; The acquisition unit is further configured to acquire a grinding media in a second state based on the grinding media in the first state, wherein the second state is a solidified state. The grinding unit is used to grind the sample to be ground in the grinding body after the hot melt wax molded on the grinding body in the second state is fixed, to obtain the chip to be analyzed; the method of fixing the hot melt wax molded on the grinding body in the second state includes: holding the cone-shaped hot melt wax molded on the grinding body in the second state with fingers, or clamping the cone-shaped hot melt wax molded on the grinding body in the second state with a fixing clip; The failure analysis unit is used to perform failure analysis on the chip to be analyzed and obtain the analysis results.

8. An electronic device, characterized in that, The electronic device includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; Memory, used to store computer programs; A processor, when executing a program stored in memory, implements the steps of the method according to any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the method described in any one of claims 1-6.

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