Carrying assembly and glue coating and developing machine

Abstract

The application provides a bearing assembly and a gluing developing machine, and relates to the technical field of semiconductor manufacturing equipment, and is used for solving the technical problem of low wafer production efficiency. The bearing assembly comprises a support column, a first carrier and a second carrier. The second carrier is provided with a containing cavity and a mounting through hole in communication with the containing cavity. The second carrier comprises at least two housings. The at least two housings are spliced to form the mounting through hole matched with the support column and the containing cavity surrounding the first carrier. The at least two housings are detachably connected. When the second carrier is damaged, the second carrier is detached to expose the first carrier without detaching the first carrier, and the first carrier continues to bear, thereby saving the mounting time of the first carrier and improving the production efficiency of the wafer. In addition, when the first carrier is damaged, the second carrier is mounted outside the first carrier without detaching the first carrier, and the second carrier continues to bear, thereby saving the detaching time of the first carrier and further improving the production efficiency of the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, in particular to a bearing assembly and a glue coating and developing machine. BACKGROUND

[0002] In the process of semiconductor manufacturing, a wafer is usually processed by a series of processes such as pretreatment, glue coating, exposure, development and etching to form a desired pattern on the surface of the wafer for subsequent formation of an integrated circuit structure. The wafer needs to be fixed during the above-mentioned processes to ensure the quality of the formed pattern. For example, during the glue coating or development process, the wafer is placed on a bearing assembly, and the wafer is rotated by the bearing assembly, so that the photoresist or developing solution can be uniformly coated on the surface of the wafer to complete the glue coating or development process.

[0003] The bearing assembly usually includes a carrier and a driving device. The wafer is placed on the carrier and is relatively fixed with the carrier. The driving device includes a motor, which drives the carrier to rotate so that the wafer on the carrier rotates synchronously to perform the glue coating or development process. The carrier will be worn or damaged after a long time of work, and the damaged carrier will affect the yield of the wafer. Therefore, the damaged carrier needs to be removed and replaced with a new carrier. However, the downtime for removing the damaged carrier and replacing the new carrier is relatively long, which reduces the production efficiency of the wafer. SUMMARY

[0004] In view of the above problems, the present application provides a bearing assembly and a glue coating and developing machine to improve the production efficiency of the wafer.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, the present application provides a bearing assembly, which includes a support column, a first carrier fixedly installed on the support column, and a second carrier fixedly installed on the support column and located outside the first carrier; the second carrier is provided with a receiving cavity and a mounting through hole in communication with the receiving cavity; the second carrier includes at least two housings, the at least two housings are combined to form the mounting through hole adapted to the support column and the receiving cavity surrounding the first carrier, and the at least two housings are detachably connected.

[0007] The bearing assembly provided by the present application has the following advantages:

[0008] In the embodiment of the present application, the bearing assembly comprises a support column, a first carrier and a second carrier, the first carrier and the second carrier are fixedly installed on the support column respectively, so that the first carrier and the second carrier can move synchronously with the support column; the second carrier is provided with a receiving cavity and a mounting hole, the mounting hole is communicated with the receiving cavity, the first carrier is arranged in the receiving cavity inside the second carrier; the second carrier comprises at least two shells, the shells are spliced to form the mounting hole matched with the support column and the receiving cavity surrounding the first carrier, and the shells are detachably connected. By splitting the second carrier into at least two shells, the first carrier can be exposed when the second carrier is detached from the support column, when the second carrier is damaged, the second carrier can be detached without detaching the first carrier, so that the first carrier is exposed, and the first carrier continues to bear the wafer, thereby saving the installation time of the first carrier, reducing the downtime for replacing the bearing assembly, and further improving the production efficiency of the wafer. In addition, when the first carrier is damaged, at least two shells can be spliced into the second carrier without detaching the first carrier, so that the second carrier can be installed outside the first carrier and part of the support column, the second carrier continues to bear the wafer, thereby saving the disassembly time of the first carrier, reducing the downtime for replacing the bearing assembly, and further improving the production efficiency of the wafer.

[0009] In the bearing assembly described above, the shape of the second carrier is a circular truncated cone, the large end of the second carrier is a bearing end, and the small end of the second carrier is provided with the mounting hole.

[0010] In the bearing assembly described above, the diameter of the large end of the second carrier is 40-75 cm, the diameter of the small end of the second carrier is 30-60 cm, and the height of the second carrier is 50-80 cm.

[0011] In the bearing assembly described above, the second carrier is formed by splicing two shells, and the two shells are provided with notches, and the two notches form the mounting hole.

[0012] In the bearing assembly described above, the mounting hole is provided with an internal thread, the support column is provided with an external thread matched with the internal thread, and the second carrier is threadedly connected with the support column.

[0013] In the bearing assembly described above, the at least two shells are clamped to form the second carrier, or the at least two shells are fixed by a clamp.

[0014] In the bearing assembly as described above, the support column is provided with a first pipeline and a second pipeline; the bearing end of the first carrier is provided with a first suction port, and the first carrier is further provided with a first channel in communication with the first suction port, the first channel being in communication with the first pipeline; the bearing end of the second carrier is provided with a second suction port, and the second carrier is further provided with a second channel in communication with the second suction port, the second channel being not in communication with the accommodating cavity, and the second channel being in communication with the second pipeline.

[0015] In the bearing assembly as described above, the second channel is located in the shell wall of one of the housings.

[0016] In the bearing assembly as described above, the first carrier is in the shape of a circular truncated cone, the large end of the first carrier is the bearing end, and the small end of the first carrier is in contact with the support column.

[0017] In the bearing assembly as described above, the diameter of the large end of the first carrier is 15-50 cm, the diameter of the small end of the first carrier is 10-45 cm, and the height of the first carrier is 30-50 cm.

[0018] In the bearing assembly as described above, the support column comprises a first cylindrical body and a second cylindrical body, one end of the first cylindrical body is connected to the first carrier, and the other end of the first cylindrical body is connected to the second cylindrical body.

[0019] In the bearing assembly as described above, the diameter of the first cylindrical body is smaller than the diameter of the second cylindrical body, and one end of the second carrier provided with the mounting through hole is in contact with the step surface formed by the first cylindrical body and the second cylindrical body.

[0020] In a second aspect, the embodiment of the present application further provides a glue coating and developing machine, which comprises the bearing assembly as described above, a driving device connected to the bearing assembly and used for driving the bearing assembly, and a vacuumizing device in communication with the first suction port and the second suction port of the bearing assembly respectively.

[0021] The glue coating and developing machine in the embodiment of the present application comprises the bearing assembly as described above, and thus has the advantages of the bearing assembly, and can improve the production efficiency of the wafer, and the specific effects are referred to the above description, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0023] Figure 1 A schematic view of a gluing process in an embodiment of the present application;

[0024] Figure 2 A structural schematic view of a bearing assembly in an embodiment of the present application;

[0025] Figure 3 A structural schematic view of a support column in an embodiment of the present application;

[0026] Figure 4 A structural schematic view of a first carrier in an embodiment of the present application;

[0027] Figure 5 A dimensioned view of a first carrier in an embodiment of the present application;

[0028] Figure 6 A structural schematic view of a second carrier in an embodiment of the present application;

[0029] Figure 7 A dimensioned view of a second carrier in an embodiment of the present application;

[0030] Figure 8 A structural schematic view of a second carrier in an embodiment of the present application;

[0031] Figure 9 Another structural schematic view of a second carrier in an embodiment of the present application;

[0032] Figure 10 A working schematic view of a second carrier of a bearing assembly in an embodiment of the present application;

[0033] Figure 11 A working schematic view of a first carrier of a bearing assembly in an embodiment of the present application.

[0034] Explanation of reference numerals:

[0035] 10 - support column; 11 - first pipeline;

[0036] 12 - second pipeline; 13 - first cylinder;

[0037] 14 - second cylinder; 15 - stepped surface;

[0038] 20 - first carrier; 21 - bearing end of first carrier;

[0039] 22 - first suction port; 23 - first passage;

[0040] 30 - second carrier; 31 - accommodating cavity;

[0041] 32 - mounting through hole; 33 - bearing end of second carrier;

[0042] 34-second suction port; 35-connection end of the second carrier;

[0043] 36-second channel; 40-wafer;

[0044] 50-nozzle; 60-photoresist;

[0045] A1-diameter of the small end of the first carrier; B1-diameter of the large end of the first carrier;

[0046] H1-height of the first carrier; A2-diameter of the small end of the second carrier;

[0047] B2-diameter of the large end of the second carrier; H2-height of the second carrier;

[0048] A3-diameter of the small end of the accommodating cavity; B3-diameter of the large end of the accommodating cavity;

[0049] H3-height of the accommodating cavity; L-preset height difference. DETAILED DESCRIPTION

[0050] The carrier assembly provided by the embodiment of the present application comprises a support column, a first carrier and a second carrier, the first carrier and the second carrier are respectively fixedly installed on the support column, and the first carrier is located in an accommodating cavity of the second carrier, and the second carrier is further provided with a mounting through hole which is adapted to the support column and is in communication with the accommodating cavity. The second carrier is formed by splicing at least two shells, and the shells are detachably connected. The mounting through hole is formed after the splicing of the shells, so that the second carrier is surrounded outside the first carrier and is installed on the support column. When the second carrier is damaged, the first carrier is exposed by splitting the second carrier into at least two shells without disassembling the first carrier, and the first carrier can continue to carry the wafer, thereby saving the installation time of the first carrier, reducing the downtime for replacing the carrier assembly, and improving the production efficiency of the wafer. In addition, when the first carrier is damaged, the second carrier continues to carry the wafer by splicing the second carrier outside the first carrier without disassembling the first carrier, thereby saving the disassembly time of the first carrier, reducing the downtime for replacing the carrier assembly, and further improving the production efficiency of the wafer.

[0051] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0052] In the semiconductor production process, an integrated circuit is usually formed on a wafer through a thin film process, a patterning process, a doping process, a heat treatment process and the like. Among them, the patterning process transfers the pattern on the mask to the wafer, mainly including pretreatment, glue coating, soft baking, exposure, development, hard baking, etching, stripping and the like.

[0053] In the patterning process, the glue coating and developing machine (Track) is used in conjunction with the scanner (Scanner), and the glue coating and developing machine is used to form a photoresist film on the wafer surface and remove part of the photoresist film to make the pattern appear, so as to transfer the pattern on the mask to the photoresist film. The scanner exposes the photoresist film through the mask, so that the properties of the photoresist film change. The exposed photoresist film includes a soluble area that can be removed by a developing solution and a non-soluble area that cannot be removed by the developing solution.

[0054] The glue coating and developing machine usually includes a nozzle, a bearing assembly and a driving device. The nozzle is opposite to the bearing assembly, and the nozzle is connected to a photoresist storage device or a developing solution storage device for spraying photoresist or developing solution. The nozzle can be provided with multiple nozzles, and part of the nozzles are connected to the photoresist storage device, and the other part of the nozzles are connected to the developing solution storage device, so as to avoid interference between the photoresist and the developing solution.

[0055] The driving device drives the bearing assembly to move, specifically, the driving device drives the bearing assembly to move, so that the bearing assembly is opposite to the nozzle and has a certain distance. The driving device also drives the bearing assembly to rotate, so that the wafer on the bearing assembly rotates synchronously. The driving device can be a servo motor, and the output shaft of the servo motor can be connected to the bearing assembly through a shaft coupling, so as to drive the bearing assembly to move.

[0056] The bearing assembly is used to place and fix the wafer, so that the wafer moves synchronously with the bearing assembly. The bearing assembly can adopt a clamping head clamping, vacuum adsorption or electrostatic adsorption and the like to fix the wafer on the bearing assembly. In the embodiment of the present application, the bearing assembly is fixed in the mode of vacuum adsorption.

[0057] In the embodiment of the present application, one end of the bearing assembly for placing the wafer is provided with an adsorption port, and the adsorption port can be a plurality of adsorption holes, adsorption grooves or adsorption rings. A vacuum section is arranged in the bearing assembly, one end of the vacuum section is communicated with the adsorption port, and the other end of the vacuum section is communicated with a vacuumizing device, for example, the other end of the vacuum section is connected with a vacuum pump.

[0058] Reference Figure 1For example, in the process of coating photoresist, when the wafer 40 is placed on the bearing assembly and covers the suction port, the vacuum pump draws the vacuum section of the bearing assembly into a vacuum state, and the wafer 40 is pressed on the bearing assembly under the action of the external atmospheric pressure, so that the wafer 40 is fixed relative to the bearing assembly. Then, the position of the bearing assembly relative to the nozzle 50 is adjusted by the driving device, so that the wafer 40 on the bearing assembly has a preset distance from the nozzle 50.

[0059] In some possible examples, the driving device drives the bearing assembly to rotate, so that the wafer 40 on the bearing assembly rotates synchronously with the bearing assembly. Then, the photoresist 60 is sprayed to the surface of the wafer 40 by the nozzle 50, and with the rotation of the wafer 40, the photoresist 60 is uniformly coated from the center of the wafer 40 to the edge of the wafer 40, and finally the photoresist 60 is formed on the entire surface of the wafer 40, and the coating process is completed.

[0060] It should be noted that in the process of coating photoresist, the photoresist 60 can also be sprayed to the surface of the wafer 40 by the nozzle 50 when the bearing assembly is stationary, and then the bearing assembly is driven to rotate by the driving device, so that the wafer 40 on the bearing assembly rotates synchronously with the bearing assembly, so that the photoresist 60 in the central region of the wafer 40 is coated on the entire surface of the wafer 40 under the action of centrifugal force.

[0061] Referring to Figure 2 The bearing assembly in the embodiment of the present application comprises a support column 10, a first carrier 20 and a second carrier 30. The first carrier 20 and the second carrier 30 are fixedly connected with the support column 10, so that the first carrier 20 and the second carrier 30 can move synchronously with the support column 10.

[0062] It should be noted that the first carrier 20 and the support column 10 are detachably connected, and the second carrier 30 and the support column 10 are also detachably connected. In this way, when the first carrier 20 or the second carrier 30 is damaged, the first carrier 20 or the second carrier 30 can be replaced, thereby increasing the service life of the bearing assembly.

[0063] One end of the support column 10 is connected with a driving device. As shown in the orientation of Figure 2 the lower end of the support column 10 is connected with the driving device, and the driving device drives the support column 10 to move horizontally, move up and down and rotate. The other end of the support column 10 can be connected with the first carrier 20. As shown in the orientation of Figure 2 the upper end of the support column 10 is connected with the first carrier 20. The support column 10 can be connected with the second carrier 30. As shown in the orientation of Figure 2 the middle part of the support column 10 is connected with the second carrier 30.

[0064] The support column 10 is generally cylindrical, and the support column 10 can be cylindrical, elliptical cylindrical or prismatic. In the embodiment of the present application, the support column 10 is cylindrical to facilitate the manufacture of the support column 10 and the connection of the support column 10 with the driving device. The axis of the support column 10 can coincide with the center line of rotation of the support column 10, so that the support column 10 rotates around its own axis when rotating, thereby improving the stability of the support column 10 when rotating.

[0065] It can be understood that the support column 10 being cylindrical means that the cross section of the support column 10 is circular when viewed in a plane perpendicular to the axis of the support column 10. The diameters of the cross sections of the support column 10 can be the same or different.

[0066] For example, when the diameters of the cross sections of the support column 10 are the same, the support column 10 is a cylinder; when the diameters of the cross sections of the support column 10 gradually decrease along the axis of the support column 10 away from the driving device, the support column 10 is a truncated cone.

[0067] In the embodiment of the present application, the support column 10 is stepped cylindrical, i.e. the support column 10 comprises a first cylinder 13 and a second cylinder 14 connected with the first cylinder 13. One end of the first cylinder 13 is connected with the first stage 20, the other end of the first cylinder 13 is connected with one end of the second cylinder 14, and the other end of the second cylinder 14 is connected with the driving device.

[0068] It should be noted that the first cylinder 13 and the second cylinder 14 can be an integral structure, i.e. the first cylinder 13 and the second cylinder 14 are machined from one cylinder. The first cylinder 13 and the second cylinder 14 can also be a split structure, i.e. the first cylinder 13 and the second cylinder 14 are machined separately and then connected together.

[0069] For example, the end face of one of the first cylinder 13 and the second cylinder 14 with a larger diameter is provided with a connecting hole or a threaded hole, and the end of the other one of the first cylinder 13 and the second cylinder 14 with a smaller diameter is matched therewith, i.e. the first cylinder 13 and the second cylinder 14 are fixed by interference fit or threaded connection.

[0070] Continuing to refer to Figure 2 The upper end of the first cylinder 13 is connected with the first stage 20, the lower end of the first cylinder 13 is connected with the upper end of the second cylinder 14, and the lower end of the second cylinder 14 is connected with the driving device. In the embodiment of the present application, the diameter of the first cylinder 13 is different from the diameter of the second cylinder 14, so that a stepped surface 15 is formed between the first cylinder 13 and the second cylinder 14, and the stepped surface 15 can be used for positioning the second stage 30, i.e. one end of the second stage 30 is in contact with the stepped surface 15, so that the second stage 30 can abut against the stepped surface 15.

[0071] For example, the diameter of the first cylinder 13 is smaller than the diameter of the second cylinder 14, and a step surface 15 formed between the first cylinder 13 and the second cylinder 14 faces the first cylinder 13. In this way, the second cylinder 14 has less shaking, and the support column 10 has better stability.

[0072] In the embodiment of the present application, the axis of the first cylinder 13, the axis of the second cylinder 14, and the rotation center line of the support column 10 all coincide, which further reduces the shaking of the first cylinder 13 and the second cylinder 14, thereby further improving the stability of the support column 10.

[0073] The support column 10 further comprises a first pipeline 11 and a second pipeline 12, and the first pipeline 11 and the second pipeline 12 are part of a vacuum section of a bearing assembly. Figure 3 As shown, the first pipeline 11 is arranged at the center of the support column 10, and the second pipeline 12 is arranged at the edge of the support column 10.

[0074] For example, the first pipeline 11 is a straight-through hole penetrating the first cylinder 13 and the second cylinder 14. Referring to Figure 3 , the axis of the first pipeline 11 can coincide with the axis of the support column 10, that is, the first pipeline 11 penetrates the entire support column 10 along the axis direction of the support column 10.

[0075] One end of the first pipeline 11 is arranged at the end of the first cylinder 13 away from the second cylinder 14, and the other end of the first pipeline 11 is arranged at the end of the second cylinder 14 away from the first cylinder 13. As shown, Figure 3 one end of the first pipeline 11 is arranged at the upper end of the first cylinder 13, and the other end of the first pipeline 11 is arranged at the lower end of the second cylinder 14.

[0076] The second pipeline 12 can be a straight-through hole penetrating the second cylinder 14. Referring to Figure 3 , one end of the second pipeline 12 is arranged on the step surface 15 formed between the first cylinder 13 and the second cylinder 14, and the other end of the second pipeline 12 is arranged at the end of the second cylinder 14 away from the first cylinder 13. As shown, Figure 3 the second pipeline 12 is a straight-through hole penetrating the upper and lower ends of the second cylinder 14.

[0077] Continuing to refer to Figure 2 , the support column 10 is fixedly connected with a first loading platform 20. For example, the end of the support column 10 away from the driving device is provided with the first loading platform 20, and the support column 10 and the first loading platform 20 can be connected through threads.

[0078] Of the two opposite ends of the first platform 20, one end is the bearing end 21 of the first platform, and the other end is in contact with the support column 10. For example... Figure 4 As shown, the upper end of the first stage 20 is the bearing end 21 of the first stage, and the bearing end 21 of the first stage is used to place and fix the wafer 40; the lower end of the first stage 20 is in contact with the support column 10.

[0079] The first platform 20 can be frustum-shaped, such as... Figure 4 and Figure 5 As shown, the large end of the first platform 20 is the bearing end 21 of the first platform, and the small end of the first platform 20 contacts the support column 10. The diameter B1 of the large end of the first platform is larger than the diameter A1 of the small end of the first platform. For example, refer to... Figure 5 The diameter B1 of the large end of the first platform ranges from 15 to 50 cm, the diameter A1 of the small end of the first platform ranges from 10 to 45 cm, and the height H1 of the first platform is 30 to 50 cm.

[0080] In the above embodiments, the first platform 20 is frustum-shaped, but it is not limited to this. The first platform 20 can also be other shapes, such as a cylinder, that is, the diameters of the two ends of the first platform 20 are equal, and its diameter range can be 15-45cm.

[0081] Continue to refer to Figure 2 The first platform's bearing end 21 is provided with a first suction port 22, and the number of first suction ports 22 can be one, such as... Figure 2 As shown in the figure. The number of first adsorption ports 22 can also be multiple, such as... Figure 4 As shown, the first adsorption port 22 includes a plurality of hole-shaped, groove-shaped, or annular openings distributed in the central region of the bearing end 21 of the first stage, that is, the first adsorption port 22 can be a plurality of adsorption holes, adsorption grooves, or adsorption rings.

[0082] Multiple adsorption holes or adsorption grooves can be evenly distributed around the center of the bearing end 21 of the first stage, and multiple adsorption rings can be sequentially and equally spaced around the center of the bearing end 21 of the first stage. When the wafer 40 is placed on the bearing end 21 of the first stage, the wafer 40 covers the first adsorption port 22.

[0083] The first stage 20 also has a first channel 23 inside, which is part of the vacuum section of the supporting component. For example... Figure 4 As shown, one end of the first channel 23 is connected to the first adsorption port 22, and the other end of the first channel 23 is connected to the first conduit 11 inside the support column 10, so that the first stage 20 can adsorb the wafer 40. (Refer to...) Figures 2 to 4 When the first channel 23 of the first stage 20 and the first pipe 11 of the support column 10 are evacuated, the wafer 40 is adsorbed on the first adsorption port 22, thereby fixing it on the first stage 20.

[0084] With reference to the drawings again Figure 2 , the support column 10 is further fixedly connected with a second carrier 30, the second carrier 30 is surrounded outside the first carrier 20. With reference to Figure 6 , the inside of the second carrier 30 is provided with a receiving cavity 31, one end of the second carrier 30 is a connecting end 35 of the second carrier, the connecting end 35 of the second carrier is provided with a mounting through hole 32 in communication with the receiving cavity 31, the mounting through hole 32 is matched with the support column 10. The other end of the second carrier 30 is a bearing end 33 of the second carrier, that is, the end opposite to the connecting end 35 of the second carrier is the bearing end 33 of the second carrier, and the bearing end 33 of the second carrier is used for placing and fixing the wafer 40.

[0085] The shape of the second carrier 30 can be a circular truncated cone, with reference to Figure 6 and Figure 7 , the large end of the second carrier 30 is the bearing end 33 of the second carrier, the small end of the second carrier 30 is provided with a mounting through hole 32, and the diameter of the large end of the second carrier 30 is greater than the diameter of the small end of the second carrier 30. Exemplarily, with reference to Figure 7 , the diameter B2 of the large end of the second carrier is 40-75 cm, the diameter A2 of the small end of the second carrier is 30-60 cm, and the height H2 of the second carrier is 50-80 cm.

[0086] The shape of the receiving cavity 31 of the second carrier 30 is a circular truncated cone, and the axis of the receiving cavity 31, the axis of the second carrier 30 and the rotation center line of the second carrier 30 can coincide to reduce the eccentricity of the second carrier 30. The shape of the receiving cavity 31 is consistent with the shape of the second carrier 30, that is, the small end of the receiving cavity 31 is close to the small end of the second carrier 30, and the large end of the receiving cavity 31 is close to the large end of the second carrier 30.

[0087] Exemplarily, with reference to Figure 7 , the diameter A3 of the small end of the receiving cavity is 20-55 cm, the diameter B3 of the large end of the receiving cavity is 30-65 cm, and the height H3 of the receiving cavity is 40-60 cm. It can be understood that the height H3 of the receiving cavity is greater than the height H2 of the first carrier, so that the first carrier 20 can be placed in the receiving cavity 31.

[0088] In order to realize the installation or disassembly of the second carrier 30 without disassembling the first carrier 20 after the first carrier 20 is installed on the support column 10, the second carrier 30 can include at least two shells, the shells can be spliced to form the second carrier 30, and the at least two shells are spliced around the support column 10 to form the mounting through hole 32 and the receiving cavity 31.

[0089] It can be understood that the mounting through hole 32 is formed by splicing, and the side walls forming the mounting through hole 32 are distributed on at least some of the shells. When the shells are spliced, the complete mounting through hole 32 is formed, and the shells are spliced around the support column 10, so that the second carrier 30 can be spliced outside the support column 10 and surrounded by the first carrier 20.

[0090] The at least two shells forming the second carrier 30 are detachably connected, that is, the at least two shells can be spliced to form the second carrier 30, and the second carrier 30 can be separated into at least two shells. In this way, the installation and disassembly of the second carrier 30 can be realized without disassembling the first carrier 20.

[0091] It can be understood that the at least two shells are spliced into the second carrier 30 along the support column 10, and the mounting through hole 32 formed by splicing surrounds the outside of the support column 10; the second carrier 30 is separated into at least two shells along the support column 10, and the at least two shells are separated from the support column 10 after disassembly.

[0092] The at least two shells can be spliced to form the second carrier 30 by clamping connection, or the at least two shells are spliced to form the second carrier 30 and then fixed by a hoop to prevent the second carrier 30 from being scattered. For example, after the at least two shells are spliced to form the second carrier 30, a hoop is sleeved outside the at least two shells to fix the shells. It can be understood that the shells can be positioned by pin hole cooperation first, and then fixed by the hoop.

[0093] In some possible examples, referring to Figure 8 The second carrier 30 includes two shells, that is, the second carrier 30 is formed by splicing the two shells. The two shells are both provided with notches, and the two notches form the mounting through hole 32.

[0094] It can be understood that one end of each shell forms a connecting end 35 of the second carrier 30, and the end of each shell is provided with a notch, and the two notches respectively penetrate one end of the corresponding shell. When the two shells are spliced, the two notches can also be spliced into the mounting through hole 32 which is in communication with the accommodating cavity 31 of the second carrier 30.

[0095] For example, when the two shells are spliced to form the second carrier 30, the notches on the two shells are half of the mounting through hole 32, so that the two notches can be buckled on the support column 10 to form the complete mounting through hole 32. That is, the notches on the two shells can form the mounting through hole 32, and after the two notches form the mounting through hole 32, the support column 10 is located in the mounting through hole 32.

[0096] As Figure 8As shown, the second carrier 30 can be divided into two shells along a plane containing the axis of the second carrier 30, that is, the load end 33 of the second carrier is divided into two semicircles, and the connecting end 35 of the second carrier is divided into two semicircular rings, that is, the notches of the two shells are symmetrical to facilitate the assembly and disassembly of the second carrier 30.

[0097] The two shells of the second carrier 30 are mounted along the radial direction of the support column 10, and the two shells of the second carrier 30 are mounted along the direction of the arrow shown in Figure 8 The two shells of the second carrier 30 are mounted along the radial direction of the support column 10, and the two shells of the second carrier 30 are mounted along the direction of the arrow shown in Figure 8 The two shells of the second carrier 30 are mounted along the radial direction of the support column 10, and the two shells of the second carrier 30 are mounted along the direction of the arrow shown in

[0098] It should be noted that the second carrier 30 can also be assembled by three shells, at least two of the three shells are provided with notches for assembling the mounting hole 32. For example, each of the three shells can be provided with a notch, so that the three shells are mounted and disassembled along the radial direction of the support column 10.

[0099] In order to realize that the second carrier 30 can move synchronously with the support column 10, in a possible example, the mounting hole 32 of the second carrier 30 is provided with an internal thread, and the support column 10 is provided with an external thread matched with the internal thread, and the second carrier 30 is threadedly connected with the support column 10.

[0100] When the second carrier 30 is mounted, the second carrier 30 is first assembled on the light column section of the support column 10 which is not provided with a thread, and then the second carrier 30 is screwed on the threaded section of the support column 10 by rotating the second carrier 30.

[0101] In a possible example, when the support column 10 includes the first cylinder 13 and the second cylinder 14, the end of the first cylinder 13 away from the second cylinder 14 can be mounted with the first carrier 20, the end of the first cylinder 13 close to the second cylinder 14 can be mounted with the second carrier 30, the first cylinder 13 and the second cylinder 14 are formed with a stepped surface 15, the stepped surface 15 faces the first cylinder 13, and the stepped surface 15 is consistent with the direction of the load end 21 of the first carrier and the load end 33 of the second carrier.

[0102] The side wall of the first cylinder 13 in contact with the stepped surface 15 is provided with an external thread, and the mounting hole 32 is provided with an internal thread. When the first cylinder 13 is connected with the mounting hole 32 of the second carrier 30, the connecting end 35 of the second carrier abuts against the stepped surface 15, so that the stepped surface 15 can support the second carrier 30, and improve the reliability of the connection between the second carrier 30 and the support column 10.

[0103] In another possible example, the stepped surface 15 and the second carrier 30 are connected through a pin and a hole interference fit. For example, the stepped surface 15 is provided with a pin towards the second carrier 30, and the second carrier 30 is correspondingly provided with a hole, and the pin of the second carrier 30 is interference fit with the hole on the stepped surface 15, so as to fixedly connect the second carrier 30 on the support column 10.

[0104] With reference to Figure 6 , the carrying end 33 of the second carrier is further provided with a second suction port 34, and the second carrier 30 is provided with a second channel 36 in communication with the second suction port 34, and the second channel 36 is further in communication with the second pipeline 12. That is, one end of the second channel 36 is connected to the second suction port 34, and the other end of the second channel 36 is connected to the second pipeline 12. The structure of the second suction port 34 can refer to the structure of the first suction port 22, which will not be described here.

[0105] The second channel 36 is part of the vacuum section of the carrying assembly. In the embodiment of the present application, the first pipeline 11 and the second pipeline 12 of the support column 10, the first channel 23 of the first carrier 20, and the second channel 36 of the second carrier 30 together form the vacuum section of the carrying assembly. By respectively vacuumizing the first pipeline 11 and the first channel 23 or the second pipeline 12 and the second channel 36, the wafer 40 can be fixed on the first carrier 20 or the second carrier 30.

[0106] It can be understood that, in order to realize the vacuum suction function, the second channel 36 is not in communication with the accommodating cavity 31, so that the second channel 36 and the second pipeline 12 can suction the wafer 40 to the carrying end 33 of the second carrier through vacuumization.

[0107] In order to make the second carrier 30 have better suction effect, the second channel 36 can be arranged in the shell wall of one of the at least two shells. For example, when the second carrier 30 includes two shells, the second channel 36 is arranged in the shell wall of one of the two shells. It can be understood that the carrying end 33 of the second carrier can not be equally divided, and the connecting end 35 of the second carrier is still equally divided, that is, the notches of the two shells are still symmetrical.

[0108] As shown in Figure 9 , the second channel 36 is arranged in the shell wall of the right shell, and the second channel 36 can be formed without splicing the two shells. Compared with forming the second channel 36 after splicing, such arrangement can avoid the second channel 36 from having a gap, thereby reducing the leakage of the second channel 36, so as to improve the airtightness of the second channel 36, and make the second channel 36 form a better vacuum environment.

[0109] With reference to Figures 10 to 11The bearing assembly in the embodiment of the present application is used, the first bearing table 20 is installed on the support column 10 first, then at least two housings are spliced outside the support column 10 and the first bearing table 20 to form the second bearing table 30, and the second bearing table 30 is installed on the support column 10, so that the support column 10 can drive the first bearing table 20 and the second bearing table 30 to move. After installation, the bearing end of the first bearing table and the bearing end of the second bearing table have a preset height difference L, and the preset height difference L is less than or equal to 20 cm.

[0110] In use, as shown in Figure 10 The wafer 40 is placed on the bearing end of the second bearing table, and the wafer 40 is adsorbed and fixed through the second adsorption port. The driving device drives the support column 10 to move, so that the bearing end of the second bearing table reaches a preset position, and then the support column 10 is driven to rotate, so that the wafer 40 rotates synchronously. The nozzle sprays photoresist or developing solution to the center position of the wafer 40 to perform the gluing or developing process.

[0111] It should be noted that when the bearing assembly is used, the nozzle can first spray photoresist or developing solution to the center position of the wafer 40, and then the wafer 40 is rotated, so that the photoresist or developing solution is coated on the entire surface of the wafer 40. That is, the order of nozzle spraying and wafer rotation can be adjusted as needed, which is not limited herein.

[0112] Referring to Figure 11 When the second bearing table 30 is worn or damaged, the second bearing table 30 is split into at least two housings, and the installation through hole is split, so that the second bearing table 30 can be detached from the support column 10, and the first bearing table 20 inside the second bearing table 30 is exposed. The controller moves the first bearing table 20 away from the driving device, and the distance moved by the first bearing table 20 is equal to the preset height difference L. That is, the bearing end of the first bearing table is moved to the height of the original bearing end of the second bearing table, and then the wafer 40 is placed and adsorbed on the first bearing table 20, and the gluing or developing process is continued.

[0113] In addition, when the first bearing table 30 is worn or damaged, the second bearing table 30 is spliced outside the first bearing table 20 and part of the support column 10, and is fixedly connected with the support column 10. The controller moves the second bearing table 30 towards the driving device, and the distance moved by the second bearing table 30 is equal to the preset height difference L. That is, the bearing end of the second bearing table is moved to the original position of the bearing end of the second bearing table, and then the wafer 40 is placed and adsorbed on the second bearing table 30, and the gluing or developing process is continued.

[0114] In the embodiment of the present application, when the second carrier 30 needs to be replaced during the production cycle of the spin coater, the first carrier 20 inside the second carrier 30 can be used to continue to carry the wafer after the second carrier 30 is disassembled, and production can be carried out. When the first carrier 20 needs to be replaced, the second carrier 30 can be installed outside the first carrier 20, and the wafer can be continued to be carried by the first carrier 20 for production. In this way, the installation or disassembly time of the first carrier 20 is saved, the downtime for replacing the carrier assembly is reduced, the production efficiency of the wafer 40 is improved, and the production capacity is further improved. When the spin coater is in the maintenance cycle, the first carrier 20 and the second carrier 30 can be replaced, and spare parts can be prepared.

[0115] In the embodiment of the present application, the carrier assembly includes a support column 10, a first carrier 20 and a second carrier 30, the first carrier 20 and the second carrier 30 are fixedly installed on the support column 10, so that the first carrier 20 and the second carrier 30 can move synchronously with the support column 10; the second carrier 30 is provided with a receiving cavity 31 and a mounting through hole 32, the mounting through hole 32 is in communication with the receiving cavity 31, the first carrier 20 is arranged in the receiving cavity 31 inside the second carrier 30; the second carrier 30 includes at least two shells, the shells are spliced to form the mounting through hole 32 matched with the support column 10 and the receiving cavity 31 surrounding the first carrier 20, and the shells are detachably connected. By splitting the second carrier 30 into at least two shells, the first carrier 20 can be exposed after the second carrier 30 is disassembled from the support column 10, when the second carrier 30 is damaged, the second carrier 30 can be disassembled without disassembling the first carrier 20, so that the first carrier 20 is exposed, and the wafer can be continued to be carried by the first carrier 20, thereby saving the installation time of the first carrier 20, reducing the downtime for replacing the carrier assembly, and further improving the production efficiency of the wafer 40. In addition, when the first carrier 20 is damaged, at least two shells can be spliced into the second carrier 30 without disassembling the first carrier 20, so that the second carrier 30 can be installed outside the first carrier 20 and part of the support column 10, and the wafer 40 can be continued to be carried by the second carrier 30, thereby saving the disassembly time of the first carrier 20, reducing the downtime for replacing the carrier assembly, and further improving the production efficiency of the wafer 40.

[0116] The embodiments or implementations in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0117] Those skilled in the art should understand that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like in the disclosure of the present application are based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the systems or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the above terms cannot be understood as a limitation of the present application.

[0118] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0119] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A load bearing assembly, characterized in that, it comprises a support column, a first load table fixedly installed on the support column, and a second load table fixedly installed on the support column and located outside the first load table; the second load table is provided with a receiving cavity and a mounting through hole in communication with the receiving cavity, the second load table comprises at least two shells, the at least two shells are spliced to form the mounting through hole adapted to the support column and the receiving cavity surrounding the first load table, and the at least two shells are detachably connected; the support column is provided with a first pipeline and a second pipeline; the load bearing end of the first load table is provided with a first suction port, and the first load table is further provided with a first channel in communication with the first suction port, the first channel being in communication with the first pipeline; the load bearing end of the second load table is provided with a second suction port, and the second load table is further provided with a second channel in communication with the second suction port, the second channel being not in communication with the receiving cavity, and the second channel being in communication with the second pipeline. 2.The load bearing assembly according to claim 1, characterized in that, the second load table is in the shape of a circular truncated cone, the large end of the second load table is the load bearing end, and the small end of the second load table is provided with the mounting through hole. 3.The load bearing assembly according to claim 2, characterized in that, the diameter of the large end of the second load table is 40-75 cm, the diameter of the small end of the second load table is 30-60 cm, and the height of the second load table is 50-80 cm. 4.The load bearing assembly according to any one of claims 1-3, characterized in that, the second load table is formed by splicing two shells, the two shells are each provided with a notch, and the two notches form the mounting through hole. 5.The load bearing assembly according to claim 4, characterized in that, the mounting through hole is provided with an internal thread, the support column is provided with an external thread matched with the internal thread, and the second load table is threadedly connected with the support column. 6.The load bearing assembly according to claim 1, characterized in that, the at least two shells are clamped to form the second load table, or the at least two shells are fixed by a clamp. 7.The load bearing assembly according to claim 1, characterized in that, the second channel is located in the shell wall of one of the shells. 8.The load bearing assembly according to claim 1, characterized in that, the first load table is in the shape of a circular truncated cone, the large end of the first load table is the load bearing end, and the small end of the first load table is in contact with the support column. 9.The load bearing assembly according to claim 8, characterized in that, the diameter of the large end of the first load table is 15-45 cm, the diameter of the small end of the first load table is 10-50 cm, and the height of the first load table is 30-50 cm. 10.The load bearing assembly according to any one of claims 1-3, 6-9, characterized in that, the support column comprises a first cylindrical body and a second cylindrical body, one end of the first cylindrical body is connected with the first load table, and the other end of the first cylindrical body is connected with the second cylindrical body. 11.The load bearing assembly according to claim 10, characterized in that, The diameter of the first cylinder is smaller than the diameter of the second cylinder; The second carrier is provided with one end of the mounting through hole in contact with the step surface formed by the first cylinder and the second cylinder.

12. A gumming and developing machine, characterized in that, The driving device connected with the bearing assembly for driving the bearing assembly, and the vacuumizing device respectively communicated with the first suction port and the second suction port of the bearing assembly.

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