Substrate processing apparatus and substrate processing method

Abstract

The present inventive concept relates to a substrate processing apparatus including a processing chamber having a first body and a second body, a support unit supporting a substrate, a heating unit heating the substrate, a driver moving either one of the first body and the second body, a gap state detecting unit detecting a gap state between a sidewall of the first body and a sidewall of the second body when the first body and the second body are placed in a processing position, and a controller controlling the driver and the gap state detecting unit, wherein the gap state detecting unit includes a pressure providing line providing a positive pressure or a negative pressure between the sidewall of the first body and the sidewall of the second body, and a pressure measuring member measuring a change in pressure of the pressure providing line.

Description

TECHNICAL FIELD

[0001] Embodiments of the inventive concept described herein relate to a substrate processing apparatus and a substrate processing method. BACKGROUND

[0002] Generally, to manufacture a semiconductor device, various processes, such as a cleaning process, a deposition process, a lithography process, an etching process, and an ion implantation process, are performed. The lithography process performed to form a pattern plays an important role in realizing high integration of a semiconductor device. The lithography process is performed to form a photoresist pattern on a semiconductor substrate made of silicon. The lithography process includes a coating and soft bake process for forming a photoresist film on a substrate, an exposure and development process for forming a photoresist pattern from the photoresist film, an edge bead removal (EBR) process and a edge exposure wafer (EEW) process for removing an edge portion of the photoresist film or pattern, and a hard bake process for stabilizing or densifying the photoresist pattern.

[0003] A bake process is a process of heating a substrate. In the bake process, a chamber is provided to form a process space in which a substrate is processed. Generally, the chamber for the bake process has two bodies and has a process space formed therein by combining the two bodies. When a substrate is carried into or carried out of the process space, the chamber is opened, and when the bake process is performed in the process space, the chamber is closed. However, when the chamber is opened and then closed, it is difficult to identify whether the chamber is located at a correct position.

[0004] In particular, when the bake process is performed in a state in which the bodies are spaced apart from each other, it is difficult to identify whether the bodies are spaced apart from each other by a preset interval and whether the bodies are tilted or biased to one side. SUMMARY

[0005] Embodiments of the inventive concept provide a substrate processing apparatus and a substrate processing method capable of identifying whether an interval between process chambers is a preset interval.

[0006] Further, embodiments of the inventive concept provide a substrate processing apparatus and a substrate processing method capable of identifying whether an interval between process chambers is uniform.

[0007] Aspects of the inventive concept are not limited to this and other unmentioned aspects of the inventive concept can be clearly appreciated from the following description by those skilled in the art.

[0008] The present inventive concept provides a substrate processing apparatus. According to an embodiment, the substrate processing apparatus includes a process chamber having a first body and a second body combined with each other to have a processing space in the process chamber, a support unit located within the processing space and supporting a substrate, a heating unit heating the substrate placed on the support unit, a driver moving any one of the first body and the second body to move the first body and the second body between a process position and an open position, a gap state detecting unit detecting a gap state between a sidewall of the first body and a sidewall of the second body when the first body and the second body are placed in the process position, and a controller controlling the driver and the gap state detecting unit, wherein the gap state detecting unit includes a pressure providing line providing a positive pressure or a negative pressure between the sidewall of the first body and the sidewall of the second body, and a pressure measuring member measuring a change in pressure of the pressure providing line, and wherein the controller determines whether the gap state is defective based on the pressure measured by the pressure measuring member.

[0009] In one embodiment, when it is determined that the gap state is defective, the controller can control the driver and the gap state detecting unit so that the first body or the second body moves.

[0010] In one embodiment, the pressure providing line can include a main line connected to a pressure supply source, and branch lines branched from the main line and connecting the main line and fluid holes provided in the sidewall of the first body.

[0011] In one embodiment, the pressures of the fluid flowing in the branch lines can be the same.

[0012] In one embodiment, the pressure supply source can supply the fluid to the main line.

[0013] In one embodiment, the gap state detecting unit can inject the fluid toward surfaces of the sidewalls of the first body and the second body facing each other in a vertical direction.

[0014] In one embodiment, the pressure supply source can be a pressure reducing member.

[0015] In one embodiment, the gap state detecting unit can further include a gap detecting plate installed on a surface of the sidewall of the first body facing the sidewall of the second body, and the pressure providing line can provide the positive pressure or the negative pressure between the sidewall of the first body and the sidewall of the second body through fluid holes formed in the gap detecting plate.

[0016] In one embodiment, a thickness of the gap detecting plate can be the same as a gap between the sidewall of the first body and the sidewall of the second body facing each other in the process position.

[0017] In one embodiment, a plurality of interval detection plates can be provided along the sidewall of the first body.

[0018] In one embodiment, the pressure measuring means can include a differential pressure gauge that measures a pressure difference between the pressure supply line and the outside air.

[0019] In one embodiment, the controller can control the driver so that the interval between the sidewall of the first body and the sidewall of the second body is maintained at a preset interval when the substrate is processed within the processing space.

[0020] In one embodiment, the substrate processing apparatus can further include a gas supply unit that forms a gas curtain by spraying gas toward facing side surfaces of the first body and the second body, wherein the gas supply unit includes a plurality of gas supply holes formed in the side surface of the first body or the second body, and a gas supply line connected to a gas supply source and supplying gas to the gas supply holes.

[0021] In one embodiment, the processing of the substrate can be a baking process.

[0022] Further, embodiments of the inventive concept provide a substrate processing method. According to embodiments, the substrate processing method includes: heat-treating a substrate at a processing position in which the substrate is provided inside a second body and an interval between a sidewall of the first body and a sidewall of the second body is maintained at a preset interval; and detecting the interval before the heat-treating of the substrate, wherein in the detection of the interval, an interval state detection unit performs the following steps: spraying a fluid toward surfaces facing the first body and the second body; measuring a pressure of the fluid; determining an interval state between the sidewall of the first body and the sidewall of the second body based on the pressure when the first body and the second body are located at the processing position; and moving the first body or the second body when it is determined that the interval state is defective.

[0023] In one embodiment, the interval state detection unit can include: a pressure supply line that supplies the fluid to the surfaces facing the sidewall of the first body and the sidewall of the second body; and a pressure measuring means that measures a change in pressure of the pressure supply line, and the pressure supply line can include: a main line connected to a pressure supply source; and a branch line branched from the main line and connecting the main line and a fluid hole formed in the sidewall of the first body.

[0024] In one embodiment, the interval state detecting unit can further include an interval detecting plate installed on a surface of the sidewall of the first body facing the sidewall of the second body, wherein the pressure providing line can provide fluid between the sidewall of the first body and the sidewall of the second body through a fluid hole formed in the interval detecting plate, and wherein a thickness of the interval detecting plate can be set to be the same as an interval between the sidewall of the first body and the sidewall of the second body facing each other in the processing position.

[0025] In one embodiment, the substrate processing method can further include forming an air curtain that prevents external gas from being introduced into a region in which the substrate is provided through surfaces of the sidewall of the first body and the sidewall of the second body during the heat treatment.

[0026] In one embodiment, the heat treatment of the substrate can be a baking process.

[0027] Further, embodiments of the inventive concept provide a substrate processing apparatus. According to embodiments, the substrate processing apparatus includes a processing chamber having an upper body and a lower body combined with each other to have a processing space in which a baking process is performed on a substrate, a support unit located within the processing space and supporting the substrate, a heating unit heating the substrate placed on the support unit, a driver moving any one of the upper body and the lower body to move the upper body and the lower body between a processing position and an open position, an interval state detecting unit detecting an interval state between a sidewall of the upper body and a sidewall of the lower body when the upper body and the lower body are placed on the processing position, and a controller controlling the driver and the interval state detecting unit, wherein the interval state detecting unit includes a pressure providing line providing fluid in a vertical direction toward surfaces of the sidewall of the upper body and the sidewall of the lower body facing each other, and a pressure measuring member measuring a change in pressure of the pressure providing line, wherein the pressure providing line includes a main line connected to a pressure supply source, and a branch line branched from the main line and connecting the main line and a fluid hole formed in the sidewall of the upper body, wherein the pressure measuring member measures a change in pressure of the branch line, wherein the interval state detecting unit further includes an interval detecting plate installed on a surface of the sidewall of the upper body facing the sidewall of the lower body, wherein the pressure providing line provides fluid between the sidewall of the upper body and the sidewall of the lower body through a fluid hole formed in the interval detecting plate, wherein a thickness of the interval detecting plate is set to be the same as an interval between the sidewall of the upper body and the sidewall of the lower body facing each other in the processing position, wherein the controller controls the driver and the interval state detecting unit such that the interval between the upper body and the lower body is maintained at a preset interval when the substrate is processed within the processing space, and such that the interval state is determined based on the pressure measured by the pressure measuring member, and such that the upper body or the lower body is moved when it is determined that the interval state is defective. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other objects and features will become apparent from the following description taken in conjunction with the following accompanying drawings, wherein like reference numerals refer to like parts, and in which:

[0029] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to one embodiment of the present inventive concept;

[0030] Figure 2 is a cross-sectional view of a substrate processing apparatus showing Figure 1 a coating block or a developing block of

[0031] Figure 3 is a plan view of a substrate processing apparatus in Figure 1

[0032] Figure 4 is a cross-sectional view showing a substrate processing apparatus according to one embodiment of the present inventive concept;

[0033] Figure 5 is a plan view showing a first body according to one embodiment when viewed from the top;

[0034] Figure 6 is a flowchart showing a substrate processing method according to one embodiment of the present inventive concept;

[0035] Figures 7 to 9 are views sequentially showing a substrate processing method according to one embodiment of the present inventive concept; and

[0036] Figures 10 to 11 is a view showing a first body according to another embodiment when viewed from the top. DETAILED DESCRIPTION

[0037] Hereinafter, exemplary embodiments of the present inventive concept will be described in detail with reference to the accompanying drawings. Embodiments of the present inventive concept can be modified in various forms, and the scope of the present inventive concept should not be construed as being limited to the following embodiments. The embodiments of the present inventive concept are provided in order to more completely describe the present inventive concept to one of ordinary skill in the art. Accordingly, the shapes of the components of the drawings are exaggerated for the purpose of clearer description.

[0038] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to one embodiment of the present inventive concept, Figure 2 is a cross-sectional view of a substrate processing apparatus showing Figure 1 a coating block or a developing block of Figure 3 is a plan view of a substrate processing apparatus in Figure 1 ​​

[0039] Referring to Figures 1 to 3 The substrate processing apparatus 1 includes a indexing module 20, a processing module 30, and an interface module 40. According to one embodiment, the indexing module 20, the processing module 30, and the interface module 40 are arranged in a row. Hereinafter, a direction in which the indexing module 20, the processing module 30, and the interface module 40 are arranged is referred to as a first direction 12, a direction perpendicular to the first direction 12 when viewed from the top is referred to as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0040] The indexing module 20 transfers the substrate "W" from the container 10 that accommodates the substrate "W" to the processing module 30, and accommodates the completely processed substrate "W" in the container 10. A longitudinal direction of the indexing module 20 is provided as the second direction 14. The indexing module 20 has a loading pot 22 and an indexing frame 24. The loading pot 22 is located on the opposite side of the processing module 30 with respect to the indexing frame 24. The container 10 that accommodates the substrate "W" is placed on the loading pot 22. The loading pot 22 can be provided in a plurality of loading pots 22, and the plurality of loading pots 22 can be arranged in the second direction 14.

[0041] A sealed container 10 such as a front opening unified pod (FOUP) can be used as the container 10. The container 10 can be placed in the loading pot 22 by an operator or a transfer unit (not shown) such as an overhead conveyor, an overhead transporter, or an automated guided vehicle.

[0042] An indexing robot 2200 is provided inside the indexing frame 24. A guide rail 2300 having a longitudinal direction provided in the second direction 14 can be provided in the indexing frame 24, and the indexing robot 2200 can be provided to be movable on the guide rail 2300. The indexing robot 2200 can include a hand 2220 on which the substrate "W" is placed, and the hand 2220 can be provided to move forward or backward, rotate around the third direction 16, and move in the third direction 16.

[0043] The processing module 30 performs a coating process and a developing process on the substrate "W". The processing module 30 has a coating block 30a and a developing block 30b. The coating block 30a performs the coating process on the substrate "W", and the developing block 30b performs the developing process on the substrate "W". The coating block 30a is provided in a plurality of coating blocks 30a, which are provided to be stacked with each other. The developing block 30b is provided in a plurality of developing blocks 30b, which are stacked with each other. According to Figure 1In the embodiment of FIG. 1, two coating blocks 30a are provided, and two developing blocks 30b are provided. The coating blocks 30a can be arranged below the developing blocks 30b. According to an example, the two coating blocks 30a can perform the same process and can be provided to have the same structure. In addition, the two developing blocks 30b can perform the same process and can be provided to have the same structure.

[0044] Referring to Figure 3 The coating block 30a has a heat treatment chamber 3200, a transfer chamber 3400, a liquid treatment chamber 3600, and a buffer chamber 3800. The heat treatment chamber 3200 performs a heat treatment process on the substrate "W". The heat treatment process can include a cooling process and a heating process. The liquid treatment chamber 3600 forms a liquid film by supplying a liquid onto the substrate "W". The liquid film can be a photoresist film or an anti-reflective film. The transfer chamber 3400 transfers the substrate "W" between the heat treatment chamber 3200 and the liquid treatment chamber 3600 inside the coating block 30a.

[0045] The transfer chamber 3400 is provided such that a longitudinal direction thereof is parallel to the first direction 12. The transfer chamber 3400 is provided with a transfer robot 3422. The transfer robot 3422 transfers the substrate "W" between the heat treatment chamber 3200, the liquid treatment chamber 3600, and the buffer chamber 3800. According to an example, the transfer robot 3422 can have a hand 3420 on which the substrate "W" is placed, and the hand 3420 can be provided to move forward or backward, rotate about the third direction 16, and move in the third direction 16. A guide rail 3300 having a longitudinal direction provided parallel to the first direction 12 can be provided in the transfer chamber 3400, and the transfer robot 3422 can be provided to be movable on the guide rail 3300.

[0046] The heat treatment chamber 3200 is provided in a plurality of heat treatment chambers 3200. The heat treatment chambers 3200 are arranged in rows in the first direction 12. The heat treatment chambers 3200 are located at one side of the transfer chamber 3400.

[0047] Figure 4 is a cross-sectional view showing a substrate processing apparatus according to one embodiment of the inventive concept. Figure 4 The substrate processing apparatus of FIG. 1 can be a substrate processing apparatus in which Figure 1 One of the heating units 3230 provided in some of the heat treatment chambers 3200 of FIG. 1.

[0048] Referring to Figure 4 The substrate processing apparatus 500 includes a processing chamber 510, a support unit 530, a heating unit 540, a gas introduction unit 550, an exhaust member (not shown), a gas supply unit 570, and a spacing state detection unit 560.

[0049] The processing chamber 510 provides a processing space 501 therein. The processing chamber 510 can have a cylindrical shape. Alternatively, the processing chamber 510 can be provided in a cuboid shape. The processing chamber 510 includes a first body 513 and a second body 511. The first body 513 and the second body 511 are combined with each other to form the processing space 501 in the processing chamber. In one example, the first body 513 and the second body 511 can be arranged in a vertical direction with respect to each other. For example, the second body 511 can be provided as an upper body located above the first body 513, and the first body 513 can be provided as a lower body located below the second body 511. In one example, the first body 513 is provided to be circular when viewed from the top. Similarly, the second body 511 is provided to be circular when viewed from the top.

[0050] The driver 515 moves the first body 513 or the second body 511. The driver 515 can move one of the first body 513 and the second body 511 to change the relative distance between the first body 513 and the second body 511. Alternatively, the driver 515 can move both of the first body 513 and the second body 511 to change the relative distance between the first body 513 and the second body 511. In one example, the driver 515 is connected to the second body 511. The driver 515 can lift the second body 511 upward or downward. In one example, the driver 515 is provided to adjust the height and level of the second body 511. In one example, the driver 515 moves the processing chamber 510 between a processing position and an open position. For example, the driver 515 lowers the second body 511 so that the second body 511 is located in the processing position and raises the second body 511 so that the second body 511 is located in the open position. In one example, the processing position is a position in which the substrate "W" is baked within the processing chamber 510. In one example, the processing position can be a position in which the first body 513 and the second body 511 are spaced apart from each other by a predetermined interval. For example, the interval between the facing side surfaces of the first body 513 and the second body 511 in the processing position can be 1 mm to 10 mm. In one example, the open position is a position in which the driver 515 moves the second body 511 upward to open the inside of the processing chamber 510 when the substrate "W" is carried into or out of the processing chamber 510. In the present embodiment, an example in which the driver 515 is provided to be connected to the second body 511 has been described. However, unlike this, the driver 515 can be connected to the first body 513 and can lift the first body 513.

[0051] The support unit 530 supports the substrate "W". The support unit 530 is located inside the processing space 501. The support unit 530 is provided to be circular when viewed from the top. An upper surface of the support unit 530 can have a larger cross section than a cross section of the substrate "W". The support unit 530 can be made of a material having a high thermal conductivity. The support unit 530 can be made of a material having an excellent heat resistance.

[0052] The heating unit 540 heats the substrate "W" placed on the support unit 530. The heating unit 540 can be located inside the support unit 530. As one example, the heating unit 540 can be provided with a heater. In one example, the heater can be provided with a heating wire formed in a pattern in the support unit 530. Unlike this, the heater can be provided with a lamp or the like.

[0053] An exhaust member (not shown) exhausts the processing space 501 or a periphery of the processing space 501. Here, the periphery portion of the processing space 501 is defined as a space between the first body 513 and the second body 511. The exhaust member (not shown) can include a hole formed in the first body 513 or the second body 511 and a pressure reduction member that reduces the pressure of the hole. In one example, the hole can be provided with a plurality of holes arranged in the first body 513 so as not to overlap with the gas supply hole 575. Alternatively, the hole can be provided in the second body 511. In one example, the hole can be arranged at the same distance from the gas supply hole 575 with respect to the center of the support unit 530.

[0054] The gas supply unit 570 prevents the atmosphere inside the processing space 501 from leaking and prevents the outside air from being introduced into the processing space 501. In one example, the gas supply unit 570 includes a gas supply line 571, a gas supply hole 572, and a gas supply source 577. The gas supply line 571 receives a gas from the gas supply source 577 and supplies the gas to the gas supply hole 572. A gas control valve 573 is installed in the gas supply line 571. The gas control valve 573 controls whether to supply the gas provided to the gas supply hole 572 and a supply flow rate. The gas supply hole 572 ejects the gas to a space between the first body 513 and the second body 511. In one example, the gas supply hole 572 ejects the gas to facing side surfaces of the first body 513 and the second body 511. In one example, the gas supply hole 572 can be provided with a plurality of gas supply holes 572 in the first body 513. Alternatively, the gas supply hole 572 can be provided with a plurality of gas supply holes 572 in the second body 511. In one example, the gas is provided with an inert gas. For example, the gas is provided with nitrogen. In one example, a plurality of gas supply holes 572 can be arranged at the same distance from the center of the support unit 530.

[0055] When the first body 513 and the second body 511 are placed in the processing position, the interval state detecting unit 560 detects an interval state between the side wall of the first body 513 and the side wall of the second body 511. Referring to Figures 4 to 5 The interval state detecting unit 560 includes a pressure providing line 561, a pressure measuring member 565, and an interval detecting plate 580. In one example, the pressure providing line 561 provides a positive pressure or a negative pressure between the side wall of the first body 513 and the side wall of the second body 511. In one example, a fluid hole 562 connected to the pressure providing line 561 is formed in the first body 513 or the second body 511. For example, the fluid hole 562 is formed in the second body 511.

[0056] The pressure providing line 561 includes a main line 5611 and branch lines 5612. The main line 5611 is connected to a pressure supply source 567. The pressure supply source 567 provides a pressure to the main line 5611. In one example, the pressure supply source 567 can supply a fluid to the main line 5611. In one example, the fluid can be provided as a gas. For example, the fluid can be provided as air. Alternatively, the pressure supply source 567 can be provided as a pressure reducing member to provide a reduced pressure to the main line 5611. Hereinafter, it will be described that the pressure supply source 567 supplies air to the main line 5611 and the branch lines 5612.

[0057] The branch lines 5612 branch from the main line 5611 and connect the main line 5611 and the fluid hole 562 formed in the side wall of the first body 513. Alternatively, the fluid hole 562 can be provided as one fluid hole 562, and the main line 5611 can be directly connected to the fluid hole 562. In one example, the branch lines 5612 can be provided to have the same length and the same diameter, and the pressure of the fluid flowing in the branch lines 5612 can be set to be the same.

[0058] The pressure measuring member 565 measures or detects a change in the pressure of the pressure providing line 561. In one example, the pressure measuring member 565 detects a change in the pressure of the branch lines 5612. In one example, the pressure measuring member 565 includes a differential pressure gauge provided in the main line 5611. In one example, the differential pressure gauge can measure a pressure difference between the main line 5611 and the outside air. Alternatively, the differential pressure gauge can measure a pressure difference between the main line 5611 and the branch lines 5612. Alternatively, the fluid hole 562 can be provided as one fluid hole 562, the main line 5611 can be directly connected to the fluid hole 562, and the pressure measuring member 565 can be provided to measure or detect a change in the pressure of the main line 5611.

[0059] The spacing detection plate 580 is installed on a surface of the sidewall of the first body 513 facing the sidewall of the second body 511. In one example, the spacing detection plate 580 is placed on the first body 513. For example, the spacing detection plate 580 can be coupled to the first body 513. Alternatively, the spacing detection plate 580 can be coupled to the second body 511. In one example, the fluid hole 562 formed in the first body 513 extends upward to the spacing detection plate 580. In one example, the pressure providing line 561 provides a positive pressure or a negative pressure between the sidewall of the first body 513 and the sidewall of the second body 511 through the fluid hole 562 formed in the spacing detection plate 580. For example, the pressure providing line 561 can supply air to the fluid hole 562 formed in the spacing detection plate 580. The pressure providing line 561 injects air in a vertical direction toward a surface in which the sidewalls of the first body 513 and the second body 511 face each other.

[0060] In one example, the thickness of the spacing detection plate 580 is set to be the same as the spacing between the sidewall of the first body 513 and the sidewall of the second body 511 facing each other in the processing position. For example, when the substrate "W" is processed in the processing space, the first body 513 and the second body 511 are placed in the processing position, and in the processing position, the spacing between the sidewall of the first body 513 and the sidewall of the second body 511 is maintained as a preset spacing. Further, the thickness of the spacing detection plate 580 is set to be the same as the preset spacing. Accordingly, in the processing position, the spacing detection plate 580 is in close contact with the gap between the first body 513 and the second body 511. Accordingly, in the processing position, a predetermined pressure can be formed inside the main line 5611 and the branch lines 5612.

[0061] The branch lines 5612 have the same diameter and the same length, and the same pressure is provided to the branch lines 5612. Accordingly, when the spacing between the spacing detection plate 580 and the sidewall of the second body 511 is the same in all positions, the pressure formed inside the branch lines 5612 is also the same. In one example, the spacing detection plate 580 can be provided in a plurality of spacing detection plates 580 along the sidewall of the first body 513. For example, four spacing detection plates 580 can be provided on the first body 513 at the same spacing. Alternatively, the number of the spacing detection plates 580 can be less than or more than four.

[0062] Hereinafter, a method of processing a substrate "W" using the substrate processing apparatus 500 according to an embodiment of the present inventive concept will be described with reference to the drawings. Figures 6 to 8 A method of processing a substrate "W" using the substrate processing apparatus 500 according to an embodiment of the present inventive concept will be described with reference to the drawings.

[0063] Figure 6 is a flowchart illustrating a substrate processing method according to one embodiment of the present inventive concept, and Figures 7 to 9are sequentially shown views of a substrate processing method according to one embodiment of the inventive concept. Referring to Figure 6 , the substrate processing method according to the inventive concept includes a gap detection operation S10 and a substrate processing operation S20. Before the gap detection operation S10, as shown in Figure 7 , the processing chamber 510 is opened, and a substrate "W" transferred from the outside of the processing space 501 is seated on the support unit 530.

[0064] After the substrate "W" is transferred, the second body 511 is lowered, and thus the processing chamber 510 is located at a processing position, as shown in Figure 8 . When the processing chamber 510 is located at the processing position, the gap detection operation S10 starts. Alternatively, when the second body 511 is lowered, the gap detection operation S10 can start. In the gap detection operation S10, it is determined whether the first body 513 and the second body 511 are spaced apart from each other by a preset gap and whether the gap between the first body 513 and the second body 511 is uniform on the facing side surfaces of the first body 513 and the second body 511.

[0065] When the gap detection operation S10 starts, as shown in Figures 8 to 9 , the driver 515 lowers the second body 511 until the gap between the first body 513 and the second body 511 becomes the preset gap. When the gap detection operation S10 starts, air is supplied to the pressure supply line 561. Before the gap detection operation S10, when the gap between the first body 513 and the second body 511 is the preset gap, information about the pressure formed in the main line 5611 or the branch line 5612 is input to the controller. In one example, when the gap between the first body 513 and the second body 511 is the preset gap, information about the preset pressure formed in the main line 5611 is input to the controller.

[0066] Whether the first body 513 and the second body 511 are spaced apart from each other by a preset interval will be determined as follows. The controller controls the driver 515 so that the position of the second body 511 is adjusted until the pressure formed in the main line 5611 becomes a preset pressure. In one example, the information about the preset pressure can be information about the pressure measured by a pressure difference gauge. For example, the pressure difference gauge provided in the main line 5611 measures the pressure difference between the main line 5611 and the outside air. When the interval between the first body 513 and the second body 511 is the preset interval, information about the pressure difference between the main line 5611 and the outside air is input to the controller. When the pressure difference between the main line 5611 and the outside air is not the preset pressure difference, the controller determines that the interval state is defective. In one example, when the measured pressure difference between the main line 5611 and the outside air deviates from the preset pressure difference by a predetermined error range, the controller determines that the current state is defective. When it is determined that the interval state is defective, the controller controls the driver 515 so that the position of the second body 511 is adjusted until the pressure difference between the main line 5611 and the outside air becomes the preset pressure difference. Accordingly, the second body 511 is positioned at the desired height.

[0067] Whether the interval between the first body 513 and the second body 511 is uniform will be determined as follows. The pressure of the air supplied to the branch lines 5612 is the same, and the diameters and lengths of the branch lines 5612 are the same. Accordingly, when the interval between the first body 513 and the second body 511 is uniform on the facing side surfaces of the first body 513 and the second body 511, the pressure inside the branch lines 5612 is formed to be the same. When any part of the facing side surfaces of the first body 513 and the second body 511 has a different interval, the pressure inside some of the branch lines 5612 fluctuates. When the pressure fluctuation occurs even in one of the branch lines 5612, the pressure of the main line 5611 also fluctuates. When the pressure difference between the main line 5611 and the outside air measured by the pressure difference gauge is different from the preset pressure difference, the controller determines that the current state is defective. In one example, when the measured pressure difference between the main line 5611 and the outside air deviates from the preset pressure difference by a predetermined error range, the controller determines that the current state is defective. The controller controls the driver 515 so that the position of the second body 511 is adjusted until the pressure difference between the main line 5611 and the outside air becomes the preset pressure difference. In one example, the driver 515 can be provided in a plurality of air cylinders that provide air pressure, and the controller can adjust the air pressure of the corresponding air cylinders. Accordingly, the interval between the first body 513 and the second body 511 is uniform.

[0068] In one example, the interval detection operation S10 can be continuously performed even while the substrate processing operation S20 is performed. That is, while the substrate “W” is processed in the process chamber 510, whether the positions of the first body 513 and the second body 511 are appropriate is continuously determined.

[0069] In the above example, it has been described that the driver 515 adjusts the position of the second body 511 according to the command of the controller. Alternatively, instead of the driver 515, the operator can adjust the position of the first body 513 or the second body 511.

[0070] In the above example, it has been described that the interval state detection unit 560 is provided in the first body 513. Alternatively, in another example, the interval state detection unit 560 can be provided in the second body 511.

[0071] In the above example, it has been described that the differential pressure gauge is provided in the main line 5611. Alternatively, instead of this, a pressure gauge that measures the pressure of the branch line 5612 can be provided. Alternatively, a pressure gauge that measures the pressure of the main line 5611 can be provided.

[0072] In the above example, it has been described that the distance between the fluid hole 562 and the center of the support unit 530 and the distance between the air supply hole 575 and the center of the support unit 530 are different from each other. Alternatively, as shown in Figure 10 , the distance between the fluid hole 562 and the center of the support unit 530 and the distance between the air supply hole 575 and the center of the support unit 530 can be the same.

[0073] In the above example, it has been described that the interval detection plate 580 is provided. Alternatively, as shown in Figure 11 , the interval detection plate 580 can not be provided. In Figure 11 the embodiment shown, as described above, the first body 513 and the second body 511 can perform the substrate processing operation S20 while being spaced apart from each other. Alternatively, the first body 513 and the second body 511 can perform the substrate processing operation S20 while being in close contact with each other.

[0074] According to the present inventive concept, it is possible to identify whether the interval between the processing chambers 510 is the preset interval. In addition, it is possible to identify whether the interval between the processing chambers 510 is uniform.

[0075] Referring back to Figure 2 and Figure 3The liquid treatment chambers 3600 are provided in a plurality of liquid treatment chambers 3600. Some of the liquid treatment chambers 3600 can be arranged to be stacked on each other. The liquid treatment chambers 3600 are arranged on one side of the transfer chamber 3402. The liquid treatment chambers 3600 are arranged side by side in the first direction 12. Some of the liquid treatment chambers 3600 are arranged at positions adjacent to the indexing module 20. Hereinafter, these liquid treatment chambers are referred to as front liquid treatment chambers 3602. Other liquid treatment chambers 3600 are arranged at positions adjacent to the interface module 40. Hereinafter, these liquid treatment chambers are referred to as rear liquid treatment chambers 3604.

[0076] The front liquid treatment chambers 3602 apply a first liquid to the substrate "W", and the rear liquid treatment chambers 3604 apply a second liquid to the substrate "W". The first liquid and the second liquid can be different from each other. According to one embodiment, the first liquid is an antireflection film, and the second liquid is a photoresist. The photoresist can be applied to the substrate "W" on which the antireflection film is applied. Alternatively, the first liquid is a photoresist, and the second liquid is an antireflection film. In this case, the antireflection film can be applied to the substrate "W" on which the photoresist is applied. Alternatively, the first liquid and the second liquid can be the same liquid, and both the first liquid and the second liquid can be a photoresist.

[0077] The buffer chambers 3800 are provided in a plurality of buffer chambers 3800. Some of the buffer chambers 3800 are arranged between the indexing module 20 and the transfer chamber 3400. Hereinafter, these buffer chambers are referred to as front buffers 3802. The front buffers 3802 are provided in a plurality of front buffers 3802 and positioned to be vertically stacked on each other. Other buffer chambers 3800 are arranged between the transfer chamber 3400 and the interface module 40. Hereinafter, these buffer chambers are referred to as rear buffers 3804. The rear buffers 3804 are provided in a plurality of rear buffers 3804 and positioned to be vertically stacked on each other. The front buffers 3802 and the rear buffers 3804 temporarily store a plurality of substrates "W". The substrates "W" stored in the front buffers 3802 are carried in or out by the indexing robot 2200 and the transfer robot 3422. The substrates "W" stored in the rear buffers 3804 are carried in or out by the transfer robot 3422 and the first robot 4602.

[0078] The developing block 30b has a heat treatment chamber 3200, a transfer chamber 3400, and a liquid treatment chamber 3600. The heat treatment chamber 3200, the transfer chamber 3400, and the liquid treatment chamber 3600 of the developing block 30b can be provided to have structures and arrangements substantially similar to those of the heat treatment chamber 3200, the transfer chamber 3400, and the liquid treatment chamber 3600 of the coating block 30a. However, in the developing block 30b, the liquid treatment chamber 3600 is provided as a developing chamber that develops the substrate "W" by supplying a developer in the same manner.

[0079] The interface module 40 connects the process module 30 to the external exposure apparatus 50. The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a transfer member 4600.

[0080] A downwardly ventilated fan filter unit (not shown) can be provided at an upper end of the interface frame 4100. The additional process chamber 4200, the interface buffer 4400, and the transfer member 4600 are arranged inside the interface frame 4100. The additional process chamber 4200 can perform a predetermined additional process before the substrate "W" on which the process is completed in the coating block 30a is carried into the exposure apparatus 50. Alternatively, the additional process chamber 4200 can perform a predetermined additional process before the substrate "W" on which the process is completed in the exposure apparatus 50 is carried into the developing block 30b. According to one example, the additional process can include an edge exposure process that exposes an edge region of the substrate "W", an upper surface cleaning process that cleans an upper surface of the substrate "W", and a lower surface cleaning process that cleans a lower surface of the substrate "W". The additional process chamber 4200 can be provided with a plurality of additional process chambers 4200 that can be disposed stacked with each other. All of the additional process chambers 4200 can be provided to perform the same process. Alternatively, some of the additional process chambers 4200 can be provided to perform different processes.

[0081] The interface buffer 4400 provides a space in which the substrate "W" transferred between the coating block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b during the transfer temporarily stays. The interface buffer 4400 can be provided with a plurality of interface buffers 4400 that can be disposed stacked with each other.

[0082] According to one example, with respect to an extension line of the transfer chamber 3400 in the longitudinal direction, the additional process chamber 4200 can be disposed on one side thereof and the interface buffer 4400 can be disposed on the other side thereof.

[0083] The transfer member 4600 transfers the substrate "W" between the coating block 30a, the additional processing chamber 4200, the exposure apparatus 50, and the developing block 30b. The transfer member 4600 can be provided as one or more robots. According to one example, the transfer member 4600 has a first robot 4602 and a second robot 4606. The first robot 4602 can be provided for transferring the substrate "W" between the coating block 30a, the additional processing chamber 4200, and the interface buffer 4400, the interface robot 4604 can be provided for transferring the substrate "W" between the interface buffer 4400 and the exposure apparatus 50, and the second robot 4606 can be provided for transferring the substrate "W" between the interface buffer 4400 and the developing block 30b.

[0084] The first robot 4602 and the second robot 4606 each include a hand on which the substrate "W" is placed, and the hand can be arranged to move forward or backward, rotate around an axis parallel to the third direction 16, and move along the third direction 16.

[0085] All of the hands of the indexing robot 2200, the first robot 4602, and the second robot 4606 can be provided to have the same shape as that of the hands 3420 of the transfer robots 3422 and 3424. Alternatively, the hand of the robot that directly moves the substrate "W" into or out of the transfer plate 3240 of the heat treatment chamber 3200 can be provided to have the same shape as that of the hands 3420 of the transfer robots 3422 and 3424, and the hand of the other robot can be provided to have a different shape.

[0086] According to one embodiment, the indexing robot 2200 can be provided for directly moving the substrate "W" into or out of the heating unit 3230 of the heat treatment chamber 3200 provided in the coating block 30a.

[0087] Further, the transfer robot 3422 provided in the coating block 30a and the developing block 30b can be provided for directly moving the substrate "W" into or out of the transfer plate 3240 located in the heat treatment chamber 3200.

[0088] According to embodiments of the present inventive concept, it can be identified whether the interval between the processing chambers is a preset interval.

[0089] Further, according to the present inventive concept, it can be identified whether the interval between the processing chambers is uniform.

[0090] Effects of the present inventive concept are not limited to what has been described hereinabove and those skilled in the art will recognize many modifications and alternatives.

[0091] The above detailed description illustrates the inventive concept. In addition, the above-described content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, variations, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the range of technology or knowledge of those skilled in the art. The written embodiment describes the best state of the technical spirit implementing the inventive concept, and various changes required in the detailed application field and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiment state. In addition, it should be understood that the appended claims include other embodiments.

Claims

1. A substrate processing apparatus comprising: a processing chamber having a first body and a second body which are combined with each other to have a processing space in the processing chamber; a support unit located within the processing space and supporting a substrate; a heating unit configured to heat the substrate placed on the support unit; a driver configured to move either of the first body and the second body to move the first body and the second body between a processing position and an open position; a gap state detecting unit configured to detect a gap state between a sidewall of the first body and a sidewall of the second body when the first body and the second body are placed in the processing position; and a controller configured to control the driver and the gap state detecting unit, wherein the gap state detecting unit includes: a pressure providing line configured to provide a positive pressure or a negative pressure between the sidewall of the first body and the sidewall of the second body; and a pressure measuring member configured to measure a change in pressure of the pressure providing line, and wherein the controller determines whether the gap state is defective based on the pressure measured by the pressure measuring member. When it is determined that the gap state is defective, the controller controls the driver and the gap state detecting unit so that the first body or the second body moves.

2. The substrate processing apparatus according to claim 1, wherein The pressure providing line includes:

3. The substrate processing apparatus according to claim 1, wherein a main line connected to a pressure supply source; and a branch line branched from the main line and connecting the main line and a fluid hole provided in the sidewall of the first body. Pressures of fluids flowing in the branch line are the same.

4. The substrate processing apparatus according to claim 3, wherein The pressure supply source supplies the fluid to the main line.

5. The substrate processing apparatus according to claim 3, wherein The gap state detecting unit sprays the fluid toward surfaces of the sidewalls of the first body and the second body which face each other in a vertical direction.

6. The substrate processing apparatus according to claim 5, wherein The pressure supply source is a pressure reducing member.

7. The substrate processing apparatus according to claim 3, wherein The gap state detecting unit further includes a gap detecting plate installed on a surface of the sidewall of the first body which faces the sidewall of the second body, 8. The substrate processing apparatus according to claim 3, wherein wherein the pressure providing line provides the positive pressure or the negative pressure between the sidewall of the first body and the sidewall of the second body through a fluid hole formed in the gap detecting plate. A thickness of the gap detecting plate is the same as a gap between the sidewall of the first body and the sidewall of the second body which face each other in the processing position.

9. The substrate processing apparatus according to claim 8, wherein A plurality of gap detecting plates are provided along the sidewall of the first body.

10. The substrate processing apparatus according to claim 8, wherein The pressure measuring member includes a differential pressure gauge configured to measure a pressure difference between the pressure providing line and external air.

11. The substrate processing apparatus of claim 1, wherein, The controller controls the driver so that a gap between the sidewall of the first body and the sidewall of the second body is maintained at a preset gap when the substrate is processed within the processing space.

12. The substrate processing apparatus according to any one of claims 1 to 11, wherein 13. The substrate processing apparatus according to claim 12, further comprising: ​ a gas supply unit configured to form a gas curtain by spraying a gas toward a facing side surface of the first body and the second body, wherein the gas supply unit includes: a plurality of gas supply holes formed in a side surface of the first body or the second body; and a gas supply line connected to a gas supply source and configured to supply the gas to the gas supply holes.

14. The substrate processing apparatus of claim 12, wherein, the processing of the substrate is a baking process.

15. A substrate processing method comprising: heat-treating a substrate at a processing position in which the substrate is provided inside a second body and a gap between a side wall of a first body and a side wall of the second body is maintained at a predetermined gap; and detecting a gap before the heat-treating of the substrate, wherein, in the detection of the gap, a gap state detection unit performs the following steps: spraying a fluid toward a surface facing the first body and the second body; measuring a pressure of the fluid; determining a gap state between a side wall of the first body and a side wall of the second body based on the pressure when the first body and the second body are located at the processing position; and moving the first body or the second body when it is determined that the gap state is defective. the gap state detection unit includes:

16. The substrate processing method of claim 15, wherein, a pressure supply line configured to supply a fluid to a surface facing a side wall of the first body and a side wall of the second body; and a pressure measuring member configured to measure a change in pressure of the pressure supply line, wherein the pressure supply line includes: a main line connected to a pressure supply source; and a branch line branched from the main line and connecting the main line and a fluid hole formed in a side wall of the first body. the gap state detection unit further includes:

17. The substrate processing method of claim 16, wherein, a gap detection plate installed on a surface of a side wall of the first body facing a side wall of the second body, wherein the pressure supply line supplies the fluid between the side wall of the first body and the side wall of the second body through a fluid hole formed in the gap detection plate, and wherein a thickness of the gap detection plate is set to be the same as a gap between the side wall of the first body and the side wall of the second body facing each other in the processing position.

18. The substrate processing method according to any one of claims 15 to 17, further comprising: forming a gas curtain configured to prevent an external gas from being introduced into an area in which the substrate is provided through a surface facing a side wall of the first body and a side wall of the second body during the heat-treating. the heat-treating of the substrate is a baking process.

19. The substrate processing method according to any one of claims 15 to 17, wherein, 20. A substrate processing apparatus comprising: a processing chamber having an upper body and a lower body combined with each other to have a processing space in which a baking process is performed on a substrate in the processing space; a support unit located within the processing space and supporting the substrate; a heating unit configured to heat the substrate placed on the support unit; ​ a driver configured to move any one of the upper body and the lower body to move the upper body and the lower body between a processing position and an open position; a gap state detecting unit configured to detect a gap state between a side wall of the upper body and a side wall of the lower body when the upper body and the lower body are placed on the processing position; and a controller configured to control the driver and the gap state detecting unit, wherein the gap state detecting unit includes: a pressure providing line configured to provide a fluid in a vertical direction toward surfaces of the side wall of the upper body and the side wall of the lower body facing each other; and a pressure measuring member configured to measure a change in pressure of the pressure providing line, wherein the pressure providing line includes: a main line connected to a pressure supply source; and a branch line branched from the main line and connecting the main line and a fluid hole formed in the side wall of the upper body, wherein the pressure measuring member measures a change in pressure of the branch line, wherein the gap state detecting unit further includes: a gap detecting plate installed on a surface of the side wall of the upper body facing the side wall of the lower body, wherein the pressure providing line provides the fluid between the side wall of the upper body and the side wall of the lower body through a fluid hole formed in the gap detecting plate, wherein a thickness of the gap detecting plate is set to be the same as a gap between the side wall of the upper body and the side wall of the lower body facing each other in the processing position, wherein the controller controls the driver and the gap state detecting unit such that a gap between the upper body and the lower body is maintained at a preset gap when the substrate is processed within the processing space, and such that a gap state is determined based on the pressure measured by the pressure measuring member, and such that the upper body or the lower body is moved when it is determined that the gap state is defective.

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