Ball implantation method, device, electronic device and storage medium based on 3D printing process

Abstract

The present invention provides a ball planting method, device, electronic device and storage medium based on 3D printing process, including: obtaining ball planting parameters and ball planting material model; simulating and obtaining a simulated printing path based on the ball planting parameters and ball planting material model; fitting and obtaining the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate; performing printing on the substrate based on the actual printing path; performing sintering after printing based on the actual printing path to form spherical solder joints set according to the ball planting parameters on the substrate. It is used to solve the defects of high cost, large ball planting diameter, difficult ball planting quality assurance, and unsuitability for ball planting requirements of multi-variety and small batch BGA devices in the prior art, and realize the precise printing of high-density, high-reliability, high-efficiency, high-compatibility and cost-effective spherical solder joints without the use of solder balls.

Description

Technical Field

[0001] The present invention relates to the technical field of substrate ball planting, and in particular to a ball planting method, device, electronic equipment and storage medium based on a 3D printing process. Background Art

[0002] The development of big data and artificial intelligence has driven the development of integrated circuits, and packaging technology is also changing with each passing day. Electronic packaging technology is one of the three cores of the integrated circuit industry. Among them, thanks to its small size, large storage space, and only one-third of the volume of other packaging products under the same memory, BGA (Ball Grid Array) packaging has become the best choice for high-density, high-performance, multi-functional and high I / 0 pin packaging of VLSI chips such as CPUs and north and south bridges. At the same time, it also has the advantage of higher electrical performance, because the pins of BGA packaged memory are originally led outward from the center of the chip, which can effectively shorten the signal conduction path and reduce signal loss. In addition, the chip's anti-interference and anti-noise performance are also better.

[0003] At present, in the process of electronic assembly, BGA device ball planting generally uses BGA ball planting tools. Such tools are generally composed of solder ball leaking plates and fixtures. Solder ball leaking plates are usually made of stainless steel plates with laser holes, and the hole positions are determined according to the positions of the solder balls of BGA devices. The fixture is used to fix the BGA device and the leaking plate during the ball planting process. Before ball planting, solder paste is printed on the bottom of the BGA or flux is applied, and the leaking plate is placed on the fixture and installed. During operation, the solder balls are evenly sprinkled on the leaking plate. The solder balls will roll into the holes of the leaking plate, and the remaining solder balls can slide to the edge of the leaking plate. At this time, the leaking plate is removed and the solder balls remain on the BGA device. Finally, the BGA device and solder balls are heated as a whole, and the solder balls can be melted and welded on the BGA device to complete the ball planting operation. This method is inexpensive but has high technical requirements for the operator. It is easy to cause the solder balls to roll and shift from their original position, thereby creating the risk of short circuits. In addition, special tooling needs to be customized according to the device size for different BGA ball plantings, which cannot meet the ball planting needs of general electronic assembly plants for multi-variety and small batch BGA devices. Although dedicated BGA automated ball placement equipment has improved the efficiency and success rate of ball placement and reduced the cost of ball placement to a certain extent, this type of equipment is expensive and still requires customized special molds based on device sizes, so it cannot meet the general electronic assembly plant's multi-variety, small-batch BGA device placement needs.

[0004] At the same time, BGA devices are expensive and it is a great waste to discard them. However, when BGA devices are repaired, the solder balls will be damaged. Therefore, they need to be re-planted before reusing the devices. In addition, due to its small size, the BGA packaging method has very high requirements for solder joints. Once the solder joints have problems such as empty solder joints and false solder joints, the BGA packaging will directly fail. Therefore, a rework station equipment is still needed in the current BGA packaging process.

[0005] In addition, BGA-specific solder balls are required, which have a complex preparation process, are expensive, and have a low yield rate. Moreover, due to the limitations of the solder ball production process, it is difficult for existing BGA packages to achieve ball planting operations with a diameter of less than 200 μm. Summary of the invention

[0006] The present invention provides a ball planting method, device, electronic device and storage medium based on 3D printing technology, which are used to solve the defects of BGA packaging in the prior art, such as high cost, large ball planting diameter, difficult to ensure ball planting quality, and unsuitability for ball planting requirements of multi-variety and small batch BGA devices, and realize the precise printing of high-density, high-reliability, high-efficiency, high-compatibility and cost-effective spherical solder joints without the use of solder balls.

[0007] The present invention provides a ball planting method based on a 3D printing process, comprising:

[0008] Get ball planting parameters and ball planting material model;

[0009] Based on the ball planting parameters and the ball planting material model, a simulated printing path is obtained by simulation;

[0010] Based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, fitting is performed to obtain the actual printing path of the substrate;

[0011] performing printing on the substrate based on the actual printing path;

[0012] Based on the actual printing path, sintering is performed after printing is completed to form spherical solder joints set according to the ball implantation parameters on the substrate.

[0013] According to the ball planting method based on 3D printing process described in the present invention, the ball planting parameters at least include: ball planting diameter, ball grid spacing, and ball planting shape.

[0014] According to the ball planting method based on 3D printing process of the present invention, before fitting to obtain the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, the method includes:

[0015] Aligning the printing needle head with the processing point of the substrate;

[0016] Based on visual capture, the distance between the printing needle and the basic processing point is adjusted, and the distance is used as the height data.

[0017] According to the ball planting method based on 3D printing process of the present invention, before aligning the printing needle head with the processing point of the substrate, it also includes:

[0018] The substrate is clamped and fixed by a substrate clamp.

[0019] The present invention also provides a ball planting device based on a 3D printing process, comprising:

[0020] An acquisition module is used to obtain ball planting parameters and ball planting material models;

[0021] A simulation module, used for simulating and obtaining a simulated printing path based on the ball planting parameters and the ball planting material model;

[0022] A fitting module, used for fitting and obtaining an actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate;

[0023] an execution module, configured to execute printing on the substrate based on the actual printing path;

[0024] The sintering module is used to perform sintering after printing is completed based on the actual printing path, so as to form spherical solder joints set according to the ball implantation parameters on the substrate.

[0025] The ball implantation device based on 3D printing process according to the present invention further includes:

[0026] A calibration module, used to align the printing needle with the processing point of the substrate;

[0027] The adjustment module is used to adjust the distance between the printing needle and the basic processing point based on visual capture.

[0028] The ball implantation device based on 3D printing process according to the present invention further includes:

[0029] The fixing module is used to fix the substrate.

[0030] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, a ball implantation method based on a 3D printing process as described above is implemented.

[0031] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the ball implantation method based on the 3D printing process as described above is implemented.

[0032] The present invention also provides a computer program product, including a computer program, wherein when the computer program is executed by a processor, the ball implantation method based on the 3D printing process as described above is implemented.

[0033] The ball planting method, device, electronic device and storage medium based on 3D printing process provided by the present invention use the 3D printing process to form spherical solder joints set according to the ball planting parameters on the substrate with solder, thereby avoiding the use of solder balls. Based on the 3D printing process, the solder joints are accurate, with good uniformity in size and shape, high efficiency, and no need to use special molds, which greatly reduces costs. It can meet the ball planting needs of BGA devices of multiple varieties and small batches, and can achieve the ball planting needs of sub-micron ball grid arrays, greatly improving the current process accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 This is one of the flow diagrams of the ball implantation method based on the 3D printing process provided by the present invention;

[0036] Figure 2 This is the second flow chart of the ball implantation method based on the 3D printing process provided by the present invention;

[0037] Figure 3 It is a schematic diagram of the process of performing ball planting operation using the ball planting method based on 3D printing process provided by the present invention;

[0038] Figure 4 It is a schematic diagram of the top view of the ball planting sample after the ball planting operation is completed by using the ball planting method based on the 3D printing process provided by the present invention;

[0039] Figure 5a This is one of the cross-sectional views of the ball planting sample using the ball planting method based on the 3D printing process provided by the present invention;

[0040] Figure 5b This is the second cross-sectional view of a ball planting sample using the ball planting method based on the 3D printing process provided by the present invention;

[0041] Figure 5c This is the third cross-sectional view of a ball planting sample using the ball planting method based on the 3D printing process provided by the present invention;

[0042] Figure 6 It is a structural schematic diagram of a spherical solder joint using the ball planting method based on the 3D printing process provided by the present invention;

[0043] Figure 7aIt is one of the printing paths between two spherical solder joints using the ball planting method based on the 3D printing process provided by the present invention;

[0044] Figure 7b This is the second printing path between two spherical solder joints using the ball planting method based on the 3D printing process provided by the present invention;

[0045] Figure 7c This is the third printing path between two spherical solder joints using the ball planting method based on the 3D printing process provided by the present invention;

[0046] Figure 7d This is the fourth printing path between two spherical solder joints using the ball planting method based on the 3D printing process provided by the present invention;

[0047] Figure 8a A saddle reflow soldering curve is a reflow soldering operation performed on a substrate after a ball is implanted using the ball implantation method based on a 3D printing process provided by the present invention;

[0048] Figure 8b The invention provides a 3D printing process-based ball planting method, and then performs a reflow soldering operation on the substrate.

[0049] Fig. 9 This is one of the structural schematic diagrams of the ball planting device based on the 3D printing process provided by the present invention;

[0050] Fig.10 This is the second structural schematic diagram of the ball planting device based on the 3D printing process provided by the present invention;

[0051] Fig.11 It is a schematic diagram of the shape of the printing module in contact with the substrate when printing is performed using the ball planting device based on the 3D printing process provided by the present invention;

[0052] Fig.12 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] The traditional ball planting process can only accommodate ball grid spacing with a spacing limit of 100μm to 200μm, and there are few material options and low process compatibility. With the continuous reduction of integrated circuit size and the exponential growth of integration, the ball planting diameter and spacing are also constantly shrinking, and three-dimensional integration is becoming a new trend. The traditional process to achieve three-dimensional packaging of chips requires a complex process flow, which is time-consuming and labor-intensive, and greatly increases the packaging cost.

[0055] In order to solve the above technical problems, the present invention introduces ultra-high precision 3D printing technology into the semiconductor back-end packaging industry, develops a ball planting method based on ultra-high precision 3D printing, and realizes three-dimensional integrated rapid packaging of chips.

[0056] Combine the following Figure 1 - Figure 8 describes the ball planting method based on 3D printing process of the present invention. The ball planting method specifically includes the following steps:

[0057] 101. Obtain ball planting parameters and ball planting material model;

[0058] 102. Based on the ball planting parameters and the ball planting material model, simulate and obtain a simulated printing path;

[0059] 103. Based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, obtain the actual printing path of the substrate by fitting;

[0060] 104. Perform printing on the substrate based on the actual printing path;

[0061] 105. Based on the actual printing path, perform sintering after printing is completed to form spherical solder joints set according to the ball implantation parameters on the substrate.

[0062] Specifically, in one embodiment, the ball planting parameters at least include: ball planting diameter, ball grid pitch, and ball planting shape.

[0063] It is understandable that after the ball planting parameters and the ball planting material model are determined, the printing path model is determined based on the ball planting parameters and the ball planting material model simulation, and then the printing path model and the height data of the substrate processing point are fitted to obtain the actual printing path of the substrate; finally, based on the actual printing path, printing is performed on the substrate, and after the printing is completed, laser sintering or full-width infrared sintering is performed based on the same path to form the required spherical solder joints. The 3D printing technology is used to control the moving speed of the needle, the discharge frequency, and the discharge amount, so that the solder forms a distribution of spherical solder joints with the ball planting shape required by the ball planting parameters according to the set ball planting diameter and ball grid spacing on the substrate. The uniformity of the size and shape of the solder joints is easier to ensure, the reliability is high, and the ball planting speed is fast.

[0064] Specifically, the ball planting method described in the embodiment of the present invention is realized by 3D printing, and the ball planting process can be performed using metal conductive solders such as gold, silver, copper, tin, nickel, aluminum, and other semiconductors, superconductors, dielectric inks, polymers such as polymethyl methacrylate (PMMA), polydimethylsiloxane (PDMS), polyimide (PI), ceramics, and glass. Micro-nano metal powders or wires can also be used in conjunction with a heated extrusion print head to perform the operation.

[0065] More specifically, when different materials as described above are used, the ball implantation method described in the embodiment of the present invention can be applied to different fields, such as: ball grid array preparation, microlens preparation, microball plate preparation, microneedle array preparation and the preparation of corresponding products with similar morphology and process.

[0066] Furthermore, the ball planting method described in the embodiment of the present invention avoids the use of solder balls and customized special molds, thereby simplifying the process and greatly reducing costs. It can also meet the ball planting needs of multi-variety and small-batch BGA devices in general electronic assembly plants. At the same time, the solder is not easy to roll and shift from its original position, thereby reducing the risk of short circuit.

[0067] When a BGA device is repaired, the solder joints will be damaged. Before reusing the BGA device, it is necessary to re-plant the balls. According to the re-planting parameter requirements, after setting the re-planting parameters, the re-planting method based on the 3D printing process of the present invention is also applicable to the re-planting of BGA devices, thereby realizing the integrated packaging and repair of BGA devices, and at the same time, the repair reliability is high, far exceeding the traditional repair method.

[0068] In one embodiment, before fitting to obtain the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, the method includes:

[0069] Aligning the printing needle head with the processing point of the substrate;

[0070] Based on visual capture, the distance between the printing needle and the basic processing point is adjusted, and the distance is used as the height data.

[0071] It can be understood that the ball planting method based on 3D printing process described in the embodiment of the present invention is to print the ball planting material on the substrate according to the actual printing path through the printing needle. Therefore, in order to ensure that the obtained solder joints meet the requirements of the ball planting parameters, it is necessary to strictly control the distance between the printing needle and the substrate, as well as the speed and amount of the ball planting material dripping when the printing needle prints each solder joint.

[0072] Specifically, by aligning the printing needle with the processing point of the substrate; then adjusting the distance between the printing needle and the basic processing point based on visual capture, and using the distance as the height data, the accuracy of the printing path execution is further guaranteed, and the adjustment of the spacing can control the diameter, shape, etc. of the implanted ball, so that the spherical solder joint meets the set requirements.

[0073] More specifically, in order to obtain spherical solder joints that meet the ball planting parameters without strictly controlling the distance between the printing needle and the substrate, as another implementation of the ball planting method based on the 3D printing process described in the embodiment of the present invention, after aligning the processing points of the printing needle and the substrate, an electric field can be introduced during the printing process, and then under the action of the electric field, the printing needle can control the ball planting material more accurately, so that the spherical solder joints can be accurately printed even when the distance between the printing needle and the substrate is not accurately controlled. At the same time, after the electric field is introduced, ball planting materials with lower viscosity can also be planted based on the 3D printing process. In other words, the ball planting method described in the embodiment of the present invention can be more adaptable to ball planting materials and substrates.

[0074] Furthermore, in another embodiment, before aligning the printing needle head with the substrate processing point, the method further includes:

[0075] The substrate is clamped and fixed by a substrate clamp.

[0076] It is understandable that the substrate is clamped and fixed, and then the positioning and spacing are adjusted to make the positioning more accurate.

[0077] For example, after the substrate is clamped and fixed, it can be achieved by setting a reference point on the substrate and then visually aligning the print needle with the reference point; then, the distance between the print needle and the substrate can be detected based on the scanning of the height sensor, that is, the spacing adjustment between the print needle and the substrate can be achieved through the height sensor.

[0078] Therefore, the ball implantation method based on 3D printing technology provided by the present invention can be further divided into the following steps:

[0079] 201. Obtain ball planting parameters and ball planting material model;

[0080] 202. According to the ball planting parameters and the ball planting material model, obtain a simulated printing path by simulation;

[0081] 203. After the substrate is clamped and fixed by a substrate clamp, the printing needle and the substrate are positioned and the distance is adjusted;

[0082] 204. According to the simulated printing path and the height data of the printing needle from the processing point of the substrate, obtain the actual printing path of the substrate by fitting;

[0083] 205. Printing ball solder joints on the substrate according to the actual printing path;

[0084] 206. Sinter the substrate according to the actual printing path.

[0085] Specifically, Figure 3 As shown, the printing needle 1 is perpendicular to the surface of the substrate 2, so that the discharge port of the printing needle 1 is facing the surface of the substrate 2, and then the ball solder joint 3 can be formed on the substrate 2 by moving the printing needle 1 and controlling the discharge. Figure 4 The substrate structure shown.

[0086] More specifically, taking the case where the substrate is subjected to reflow soldering after the ball solder joints are printed on the substrate according to the printing path as an example, the ball planting method based on the 3D printing process of the present invention can be achieved by regulating the printing process in the ball planting process and controlling the reflow soldering curve in the post-processing process. Figure 5a -c shows various shapes of ball planting. The adjustment of the printing process mainly includes the control of the printing path, the precise control of ink extrusion, and the control of the shape of the print needle 1 nozzle.

[0087] Therefore, the printing path is obtained by simulating the ball planting parameters and the ball planting material model, and the purpose is that different printing paths have a certain influence on the shape of the formed ball solder joint 3, for example, Figure 7a -d shows several simple printing paths from ball planting point 1 to ball planting point 2. The direction of the printing path, the deflection angle, and the length of the path can affect the shape of the ball solder joint 3. Therefore, the optimal printing path can be designed according to different needs to achieve the optimization of the ball shape and various performance indicators.

[0088] Furthermore, as shown in Figure 6, there is a schematic diagram of the ball after ball implantation. The ball of this shape is the most common form of ball in the industry. The ball implantation method of the present invention can control the ratio of H to r of the ball by adjusting the printing path, ink extrusion and the shape of the nozzle of the printing needle 1 in the printing process to meet the current semiconductor packaging industry's demand for implanting balls with different aspect ratios.

[0089] Figure 8a , b shows two forms of reflow soldering curves, a is a saddle reflow soldering curve, b is a ramp reflow soldering curve, both reflow soldering methods are applicable to the ball implantation method based on 3D printing process of the present invention. Specifically, the reflow soldering temperature curve of the circuit board assembly includes four major blocks: preheating, heat absorption, reflow soldering and cooling.

[0090] Taking solder as an example, the preheating zone usually refers to the area where the temperature rises from room temperature to about 150℃. In this area, the temperature rises slowly (also called primary heating) so that some solvents and water vapor in the solder paste can evaporate in time, and the electronic parts (especially BGA and IO connector parts) slowly heat up to prepare for the high temperature later. The heat absorption zone is almost constant temperature, and the temperature is usually maintained in the area of ​​150±10℃. The ramp temperature usually falls between 150 and 190℃. At this time, the solder paste is on the eve of melting, and the volatiles in the solder paste will be further removed. The activator starts to start and effectively removes the oxides on the welding surface. The surface temperature of the PCB is affected by hot air convection, so that the temperature of components of different sizes and textures can be kept uniform. The reflow zone is the area with the highest reflow temperature in the entire section, which is usually also called the liquid holding time. The peak temperature of the reflow usually depends on the melting point of the solder and the temperature that the assembled parts can withstand. The general peak temperature should be about 25 to 30℃ higher than the normal melting point of the solder paste to successfully complete the welding operation. If it is lower than this temperature, it is very likely to cause cold welding and poor wetting. After the reflow area, the product cools down and solidifies the solder joints, which will be ready for the subsequent assembly process.

[0091] Combine the following Figure 9-11 A ball planting device based on a 3D printing process provided by the present invention is described. The ball planting device based on a 3D printing process described below and the ball planting method based on a 3D printing process described above can refer to each other.

[0092] The ball implantation device includes: an acquisition module 910, a simulation module 920, a fitting module 930, an execution module 940 and a sintering module 950, wherein:

[0093] The acquisition module 910 is used to acquire ball planting parameters and ball planting material model;

[0094] The simulation module 920 is used to simulate and obtain a simulated printing path based on the ball planting parameters and the ball planting material model;

[0095] The fitting module 930 is used to fit the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate;

[0096] The execution module 940 is used to execute printing on the substrate based on the actual printing path;

[0097] The sintering module 950 is used to perform sintering after printing is completed based on the actual printing path, so as to form spherical solder joints set according to the ball implantation parameters on the substrate.

[0098] Specifically, the ball planting parameters should at least include: ball planting diameter, ball grid spacing, and ball planting shape. After determining the ball planting parameters and ball planting material model, the simulation module first simulates and obtains the simulated printing path based on the ball planting parameters and the ball planting material model, and then the fitting module fits the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the substrate processing point. After that, the execution module performs printing on the substrate based on the actual printing path, that is, the solder is printed one by one on the substrate according to the ball grid spacing. Finally, the sintering module performs sintering after printing based on the actual printing path to form spherical solder joints set according to the ball planting parameters on the substrate. Through 3D printing technology, the uniformity of the size and shape of the spherical solder joints is easier to ensure, with high reliability and fast ball planting speed. The ball planting device is realized by 3D printing, and can use one or more metal conductive solders such as gold, silver, copper, tin, nickel, aluminum, and other semiconductors, superconductors, dielectric inks, polymers such as polymethyl methacrylate (PMMA), polydimethylsiloxane (PDMS), polyimide (PI), ceramics, and glass for ball planting. Micro-nano metal powders or wires can also be used in conjunction with a heated extrusion print head for this operation.

[0099] More specifically, when different materials as described above are used, the ball implantation method described in the embodiment of the present invention can be applied to different fields, such as: ball grid array preparation, microlens preparation, microball plate preparation, microneedle array preparation and the preparation of corresponding products with similar morphology and process.

[0100] Furthermore, by applying the ball planting device described in the embodiment of the present invention, the use of solder balls and customized special molds are avoided, so that the process can be simplified, the cost is greatly reduced, and the ball planting needs of multi-variety and small-batch BGA devices in general electronic assembly plants can be met. At the same time, the solder is not easy to roll and shift from its original position, thereby reducing the risk of short circuit.

[0101] In addition, the ball planting device of the present invention can also be used for re-balling of BGA devices, thereby realizing the integrated packaging and repair of BGA devices, and at the same time, the repair reliability is high, far exceeding the traditional repair method.

[0102] Furthermore, in order to improve the ball planting accuracy, the ball planting device based on the 3D printing process provided by the present invention also includes a calibration module 960 and an adjustment module 970 .

[0103] The calibration module 960 is used to align the printing needle head with the substrate processing point;

[0104] The adjustment module 970 is used to adjust the distance between the printing needle and the basic processing point based on visual capture.

[0105] Furthermore, the ball implantation device based on the 3D printing process provided by the present invention also includes a fixing module 980, and the fixing module 980 is used to fix the substrate.

[0106] like Fig.11 The schematic diagram of the ball implanting device of the present invention is shown in the process of the printing needle 1 discharging material and contacting the substrate 2. Fig.11 It can be seen that by controlling the distance H2 between the printing needle 1 and the substrate 2 during discharge, as well as the pressure and time of discharge, the diameter and shape of the implanted ball can be controlled to a certain extent. The contact area between the ball and the substrate 2 can also be controlled in this way, and controlling the contact area between the ball and the substrate 2 can change the adhesion of the ball and other parameters, thereby achieving the purpose of adjusting the mechanical properties and electrical properties of the implanted ball.

[0107] Fig.12 An example of a physical structure diagram of an electronic device is shown in FIG. Fig.12 As shown, the electronic device may include: a processor 1210, a communication interface 1220, a memory 1230 and a communication bus 1240, wherein the processor 1210, the communication interface 1220 and the memory 1230 communicate with each other through the communication bus 1240. The processor 1210 may call the logic instructions in the memory 1230 to execute a ball planting method based on a 3D printing process, the method comprising: obtaining ball planting parameters and ball planting material models; simulating and obtaining a simulated printing path based on the ball planting parameters and the ball planting material models; fitting and obtaining an actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate; performing printing on the substrate based on the actual printing path; performing sintering after printing based on the actual printing path to form a spherical solder joint set according to the ball planting parameters on the substrate.

[0108] In addition, the logic instructions in the above-mentioned memory 1230 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on such an understanding, the technical solution of the present invention can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0109] On the other hand, the present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the ball planting method based on the 3D printing process provided by the above-mentioned methods, and the method includes: obtaining ball planting parameters and ball planting material models; based on the ball planting parameters and ball planting material models, simulating to obtain a simulated printing path; based on the simulated printing path and the height data of the printing needle from the substrate processing point, fitting to obtain the actual printing path of the substrate; based on the actual printing path, performing printing on the substrate; based on the actual printing path, performing sintering after printing is completed, to form spherical solder joints on the substrate set according to the ball planting parameters.

[0110] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to execute the ball planting method based on the 3D printing process provided by the above-mentioned methods, the method comprising: obtaining ball planting parameters and ball planting material model; based on the ball planting parameters and ball planting material model, simulating to obtain a simulated printing path; based on the simulated printing path and the height data of the printing needle from the substrate processing point, fitting to obtain the actual printing path of the substrate; based on the actual printing path, performing printing on the substrate; based on the actual printing path, performing sintering after printing is completed, to form spherical solder joints on the substrate set according to the ball planting parameters.

[0111] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0112] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ball planting method based on 3D printing technology, characterized in that: include: Get ball planting parameters and ball planting material model; Based on the ball planting parameters and the ball planting material model, a simulated printing path is obtained by simulation; Aligning the printing needle with the processing point of the substrate, and then introducing an electric field so that the printing needle can more accurately control the ball implant material; Based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, fitting is performed to obtain the actual printing path of the substrate; performing printing on the substrate based on the actual printing path; Based on the actual printing path, sintering is performed after printing is completed to form spherical solder joints set according to the ball implantation parameters on the substrate.

2. The ball implantation method based on 3D printing process according to claim 1, characterized in that: The ball planting parameters at least include: ball planting diameter, ball grid spacing, and ball planting shape.

3. The ball implantation method based on 3D printing process according to claim 1, characterized in that: Before fitting to obtain the actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate, the method includes: Based on visual capture, the distance between the printing needle and the substrate processing point is adjusted, and the distance is used as the height data.

4. The ball implantation method based on 3D printing process according to claim 3, characterized in that: Before aligning the printing needle head with the substrate processing point, the method further includes: The substrate is clamped and fixed by a substrate clamp.

5. A ball implantation device based on 3D printing technology, characterized in that: include: An acquisition module is used to obtain ball planting parameters and ball planting material models; A simulation module, used for simulating and obtaining a simulated printing path based on the ball planting parameters and the ball planting material model; A calibration module is used to align the printing needle with the substrate processing point, and then introduce an electric field so that the printing needle can more accurately control the ball implant material; A fitting module, used for fitting and obtaining an actual printing path of the substrate based on the simulated printing path and the height data of the printing needle from the processing point of the substrate; an execution module, configured to execute printing on the substrate based on the actual printing path; The sintering module is used to perform sintering after printing is completed based on the actual printing path, so as to form spherical solder joints set according to the ball implantation parameters on the substrate.

6. The ball implantation device based on 3D printing process according to claim 5, characterized in that: Also includes: The adjustment module is used to adjust the distance between the printing needle and the processing point of the substrate based on visual capture.

7. The ball implantation device based on 3D printing process according to claim 6, characterized in that: Also includes: The fixing module is used to fix the substrate.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the ball implantation method based on the 3D printing process as described in any one of claims 1 to 4 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the ball implantation method based on the 3D printing process as claimed in any one of claims 1 to 4 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the ball implantation method based on the 3D printing process as claimed in any one of claims 1 to 4 is implemented.

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