Method for manufacturing a see-through display module

Abstract

A manufacturing method of a light-transmitting display module includes: providing a light-transmitting substrate; printing a first conductive layer on a first surface of the light-transmitting substrate; printing a first insulating layer on the first conductive layer; printing a second conductive layer on the first insulating layer; printing a second insulating layer on the second conductive layer; and disposing a plurality of optoelectronic components on the first surface of the light-transmitting substrate, wherein a portion of electrodes of each optoelectronic component is electrically connected to a second pad structure of the second conductive layer, and the portion of the electrodes of each optoelectronic component is electrically connected to a plurality of second lines of the second conductive layer through a plurality of second windows defined by a plurality of third insulating lines of the second insulating layer.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a light-transmitting display module that differs from traditional processes. Background Technology

[0002] Traditional optoelectronic devices are made using semiconductor processes, which include photolithography, etching, and other techniques. The manufacturing process is quite complex and expensive, and it also causes environmental pollution. Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing a light-transmitting display module. Unlike the manufacturing process of traditional optoelectronic devices, the manufacturing method of this invention has the advantages of simple process, low cost, and relatively environmental friendliness.

[0004] To achieve the above objectives, a light-transmitting display module according to the present invention includes at least the following steps: preparing a light-transmitting substrate, wherein the light-transmitting substrate defines opposing first and second surfaces; printing a first conductive layer on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structures extends from the first lines; printing a first insulating layer on the first conductive layer, wherein the first insulating layer includes a plurality of first insulating lines arranged along a first direction, a plurality of second insulating lines arranged along a second direction, and a plurality of first windows exposing the leads, the second direction being perpendicular to the first direction and forming a plane, the first insulating lines overlapping the first lines; printing A second conductive layer is applied on a first insulating layer, wherein the second conductive layer includes a plurality of second lines arranged along a second direction and a plurality of second pad structures, the second lines overlapping the second insulating lines and electrically connected to the leads through the first window, and the second pad structures electrically connected to the first pad structures; a second insulating layer is printed on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines arranged along a second direction and a plurality of second windows defined on the third insulating lines, the third insulating lines overlapping the second lines; and a plurality of photoelectric components are disposed on a first surface of a light-transmitting substrate, wherein each photoelectric component has a plurality of electrodes, some of the electrodes are electrically connected to the second pad structures, and some of the electrodes are electrically connected to the second lines through the second windows.

[0005] In some embodiments, during the step of printing the first conductive layer, a portion of the first pad structure is independent of the first line.

[0006] In some embodiments, before or after the step of setting the optoelectronic component, the method further includes: forming a plurality of protective units corresponding to the optoelectronic component on a first and / or second surface of a light-transmitting substrate.

[0007] In some embodiments, the protective unit is formed simultaneously during the step of printing the first insulating layer and / or the second insulating layer.

[0008] In some embodiments, during the step of printing the second conductive layer, a portion of the second pad structure is independent of the second circuit.

[0009] In some embodiments, during the step of printing the second conductive layer, a portion of the second pad structure overlaps with a portion of the first pad structure, which may be independent of or not independent of the second line.

[0010] In some embodiments, during the step of printing the second conductive layer, the conductivity of the first conductive layer is superior to that of the second conductive layer.

[0011] In some embodiments, prior to the step of printing the second insulating layer, the method further includes: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, some of the third pad structures overlapping and electrically connected to the second line, and some of the third pad structures stacked and electrically connected to the second pad structure.

[0012] In some embodiments, after the step of printing the second insulating layer, the method further includes: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, some of the third pad structures corresponding to the second window and electrically connected to the second line, and some of the third pad structures superimposed and electrically connected to the second pad structure.

[0013] In some embodiments, before or after the step of printing the second insulating layer, the method further includes: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures that are stacked and electrically connected to the second pad structure.

[0014] In some embodiments, the step of setting the optoelectronic component further includes: laying a plurality of conductive elements on the electrode, wherein the electrode of the optoelectronic component is electrically connected to the second pad structure and the second circuit through the conductive elements.

[0015] In some embodiments, the light-transmitting substrate is a glass substrate.

[0016] In some embodiments, in the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate supported on a rigid substrate; and after the step of setting the optoelectronic component, the method further includes: removing the rigid substrate.

[0017] In some embodiments, prior to the step of removing the rigid substrate, the method further includes attaching an optical film to the first side of the light-transmitting substrate.

[0018] In some embodiments, before or after the step of setting the optoelectronic component, a protective layer is further included: laying a protective layer on a first or second surface of the light-transmitting substrate.

[0019] In some embodiments, the protective layer is laid all over the first or second side of the light-transmitting substrate.

[0020] In some embodiments, the protective layer is laid along the second side of the light-transmitting substrate and corresponds at least to the first conductive layer, the first insulating layer, the second conductive layer, or the second insulating layer, or a combination thereof.

[0021] In some embodiments, before or after setting the optoelectronic component, the process further includes: performing an anti-reflective and / or anti-glare treatment to form an anti-reflective and / or anti-glare layer.

[0022] In some embodiments, an anti-reflective and / or anti-glare layer is formed on the first and / or second side of the light-transmitting substrate.

[0023] In some embodiments, the optoelectronic component is a millimeter- or micrometer-scale optoelectronic chip or optoelectronic package.

[0024] As described above, in the manufacturing method of the light-transmitting display module of the present invention, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer are sequentially formed on a light-transmitting substrate using a printing process. Then, multiple photoelectric components are disposed on the light-transmitting substrate, with some electrodes of each photoelectric component electrically connected to the second pad structure of the second conductive layer (and the first conductive layer). Simultaneously, some electrodes are electrically connected to the second circuit of the second conductive layer through a second window defined by the second insulating layer. Therefore, the manufacturing method of the light-transmitting display module of the present invention is different from traditional methods using photolithography, etching, etc., and has the advantages of simple process, low cost, and relatively environmentally friendly operation. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the process steps of a method for manufacturing a light-transmitting display module according to an embodiment of the present invention.

[0026] Figures 2 to 8C These are schematic diagrams illustrating the manufacturing process of a light-transmitting display module according to an embodiment of the present invention. Detailed Implementation

[0027] The following describes a method for manufacturing a light-transmitting display module according to some embodiments of the present invention, with reference to the accompanying drawings, wherein the same components will be described with the same reference numerals.

[0028] The term "transmittance" as used in this article excludes "opaqueness" and may include at least partially transparent states such as "transparent" or "semi-transparent," for example, the non-100% transmittance (or aperture ratio) of a pixel substrate after the circuit layer has been set, or the haze formed by the pixel substrate itself due to its material.

[0029] Figure 1 This is a schematic diagram illustrating the process steps of a method for manufacturing a light-transmitting display module according to an embodiment of the present invention. Figure 1 As shown, the method for manufacturing a light-transmitting display module proposed in this invention may include at least the following steps: preparing a light-transmitting substrate, wherein the light-transmitting substrate defines opposing first and second surfaces (step S01); printing a first conductive layer on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structures are extended from the first lines (step S02); printing a first insulating layer on the first conductive layer, wherein the first insulating layer includes a plurality of first insulating lines arranged along the first direction, a plurality of second insulating lines arranged along a second direction, and a plurality of first windows exposing the leads, the second direction being perpendicular to the first direction and forming a plane, the first insulating lines overlapping the first lines (step S03); printing a first insulating layer on the first conductive layer. A second conductive layer is applied on the first insulating layer, wherein the second conductive layer includes a plurality of second lines and a plurality of second pad structures arranged along the second direction, the second lines overlap the second insulating lines and are electrically connected to the leads through the first window, and the second pad structures are electrically connected to the first pad structures (step S04); a second insulating layer is printed on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines arranged along the second direction and a plurality of second windows defined on the third insulating lines, the third insulating lines overlap the second lines (step S05); and a plurality of photoelectric components are disposed on the first surface of the light-transmitting substrate, wherein each photoelectric component has a plurality of electrodes, some of the electrodes are electrically connected to the second pad structures, and some of the electrodes are electrically connected to the second lines through the second windows (step S06).

[0030] Please refer to the following. Figures 2 to 8C This section details the manufacturing process of the aforementioned light-transmitting display module. Specifically, Figures 2 to 8C These are schematic diagrams illustrating the manufacturing process of a light-transmitting display module according to an embodiment of the present invention.

[0031] First, such as Figure 2As shown, a light-transmitting substrate 11 is first prepared, wherein the light-transmitting substrate 11 defines opposing first surfaces S1 and second surfaces S2 (step S01). Here, the first surface S1 is the upper surface of the light-transmitting substrate 11, and the second surface S2 is the lower surface of the light-transmitting substrate 11. In addition, the light-transmitting substrate 11 in this embodiment also defines a surface along... Figure 2 The first direction D1, which extends vertically (up and down), and the second direction D2, which extends horizontally (left and right), are perpendicular to each other and form a plane (the plane is parallel to the first surface S1 and the second surface S2).

[0032] In some embodiments, the light-transmitting substrate 11 may be a rigid substrate or a flexible substrate. The material of the light-transmitting substrate 11 may be glass, resin, metal, ceramic, or a composite material. In some embodiments, the light-transmitting substrate 11 may be, for example, a glass substrate or a polyimide (PI) substrate. In some embodiments, the light-transmitting substrate 11 may be a transparent substrate or a semi-transparent substrate (e.g., a matte substrate, partially transparent). The image clarity of a transparent substrate may be better than that of a semi-transparent substrate, and the material is determined according to the designer's needs.

[0033] In some embodiments, if the light-transmitting substrate 11 is a flexible substrate, in order to facilitate the subsequent formation of components on the flexible substrate through subsequent processes and to facilitate operation of the flexible substrate, the flexible substrate can be first supported on a rigid substrate before proceeding with subsequent steps, and the rigid substrate can be removed after the subsequent step S06 of setting the optoelectronic component. However, in order to ensure that the flexible substrate (light-transmitting substrate 11) after removing the rigid substrate has sufficient strength and to prevent damage during manufacturing, an optical film (not shown) can be attached to the first surface S1 of the light-transmitting substrate 11 before removing the rigid substrate, and then the rigid substrate can be removed. The optical film can be, for example, but not limited to, optical adhesive (OCA). Of course, if the light-transmitting substrate 11 is a rigid substrate, the above process is not required.

[0034] Next, step S02 is performed: a first conductive layer 12 is printed on the first surface S1 of the light-transmitting substrate 11, wherein the first conductive layer 12 includes a plurality of first lines 121 arranged along a first direction D1 and substantially parallel to each other, a plurality of first pad structures 122, and a plurality of leads 123 extending from the first lines 121. At least a portion of the first pad structures 122 are extended from the first lines 121. The "pad structure" referred to in this invention can be a conductive pad, or further include a portion extending from the conductive lines (and is not limited by the directionality of the original conductive lines, for example, a portion extending from the first lines 121 toward the second direction D2). In this embodiment, the first pad structures 122 are all formed by extending the first lines 121 to one side, and can be used for conduction. In some embodiments, in step S02 of printing the first conductive layer 12, a portion of the first pad structure 122 may not extend from the first line 121, but may be a conductive pad independent of the first line 121. Printing the first pad structure 122 independent of the first line 121 can provide height, which is beneficial for improving the continuity and smoothness of subsequent processes (printing processes). Furthermore, in this embodiment, the lead 123 is formed by extending the first line 121 to at least one side (mostly both sides in this embodiment). The lead 123 is beneficial for improving the continuity of subsequent conductive material printing, as well as increasing the contact area and reducing impedance. In some embodiments, the material of the first conductive layer 12 (and / or the subsequent second conductive layer, and / or third conductive layer) may be a single-layer or multi-layer structure made of metal (e.g., aluminum, copper, silver, molybdenum, titanium) or its alloys.

[0035] After that, as Figure 3A As shown, step S03 is performed: a first insulating layer 13 is printed on the first conductive layer 12. The first insulating layer 13 includes a plurality of first insulating lines 131 arranged along a first direction D1 and substantially parallel to each other, a plurality of second insulating lines 132 arranged along a second direction D2 and substantially parallel to each other, and a plurality of first windows w1 exposing the leads 123 of the first conductive layer 12. The first insulating lines 131 overlap (or coincide) with the first lines 121. Here, the first insulating layer 13 can simply be arranged along and cover the first conductive layer 12. The material of the first insulating layer 13 (and / or the subsequent second insulating layer) can be black, white, or transparent. Black material can block light and improve the contrast and visual effect of the light-transmitting display module; white material can improve the light reflectivity of the light-transmitting display module; and transparent material can serve a protective function or be combined with other designs to extend to areas beyond the first conductive layer 12 to achieve comprehensive protection or more functions. Here, the color of the insulating material can be determined according to the designer's needs.

[0036] Specifically, in this embodiment, the first insulating line 131 and the second insulating line 132 in the first insulating layer 13 intersect each other at the lead 123 in a discontinuous state to form a first window w1, thereby exposing the lead 123. In some embodiments, the second insulating line 132 may partially overlap the two ends of the lead 123, thereby improving the continuity or smoothness of printing. It is worth noting that the terms "overlap" and "coincidence" used herein can refer to complete overlap or partial overlap. Complete overlap means that the upper layer completely covers the lower layer (e.g., the layer below is not visible when projected from the first surface S1 towards the second surface S2), while partial overlap means that the upper layer cannot completely cover the layer below (one or both sides of the lower layer are visible when projected from the first surface S1 towards the second surface S2).

[0037] In this embodiment, before step S06 of setting the optoelectronic component, multiple protective units corresponding to the optoelectronic component can be formed on the first surface S1 and / or the second surface S2 of the light-transmitting substrate 11. For example... Figure 3B As shown, this embodiment takes the formation of multiple protective units 18 corresponding to the optoelectronic component on the first surface S1 of the light-transmitting substrate 11 as an example, thereby protecting the subsequently installed optoelectronic component. The protective units 18 can be fabricated on the first insulating layer 13 or the second insulating layer. In this embodiment, the protective unit 18 is fabricated and covers a portion of the first insulating line 131 of the first insulating layer 13. In some embodiments, the protective unit 18 can be an insulating layer, the material of which can be the same as or different from the first insulating layer 13 and / or the second insulating layer. When the protective unit 18 is made of the same material as the first insulating layer 13 and / or the second insulating layer, the protective unit 18 can be printed simultaneously during the process of printing the first insulating layer 13 (step S03) and / or the second insulating layer (step S05). Furthermore, in some embodiments, the protective unit 18 can also be formed after step S06 of setting the optoelectronic component; this is not a limitation of the present invention. In some embodiments, multiple protective units 18 corresponding to the optoelectronic component can also be formed on the second surface S2 of the light-transmitting substrate 11, or simultaneously on the first surface S1 and the second surface S2. When the protective unit 18 is formed on the second surface S2 of the light-transmitting substrate 11, its fabrication steps are not limited to occurring before or after step S06 of setting the photoelectric component. Furthermore, the protective unit 18 can be made of a colored material to block light emitted from the photoelectric component onto the second surface S2 (lower side) of the light-transmitting substrate 11. For example, using a black material for the protective unit 18 can improve the contrast and visual effect of the light-transmitting display module; or using a white material for the protective unit 18 can improve light reflectivity. It is worth noting that the protective unit 18 may not be provided in this invention, and this is not a limitation.

[0038] Next, as Figure 4 As shown, step S04 is then performed: a second conductive layer 14 is printed onto the first insulating layer 13. The second conductive layer 14 includes a plurality of second lines 141 arranged along the second direction D2 and substantially parallel to each other, and a plurality of second pad structures 142. The second lines 141 overlap the second insulating lines 132, and the second lines 141 are electrically connected to the leads 123 of the first conductive layer 12 through the first window w1. That is, the material of the second lines 141 can be filled into the first window w1 and electrically connected to the leads 123. Furthermore, the second pad structures 142 of the second conductive layer 14 are electrically connected to the first pad structures 122 of the first conductive layer 12. Here, the second pad structures 142 can completely overlap or partially overlap the first pad structures 122; this embodiment uses complete overlap as an example. Figure 4 As shown, each protection unit 18 in this embodiment has three second gasket structures 142 corresponding to its periphery, and each second gasket structure 142 is electrically connected to its corresponding first gasket structure 122 (see also...). Figure 3B ).

[0039] It is understood that the lead 123 in the first window w1 can be thickened by repeated printing, and the material of the second line 141 can be electrically connected to the lead 123 in a manner corresponding to but not filling the first window w1. In some embodiments, in step S04 of printing the second conductive layer 14, a portion of the second pad structure 142 may not extend from the second line 141, but is electrically independent of the second line 141; the second pad structure 142 independently printed on the second line 141 can be used to increase the height, which is beneficial to improving the continuity and smoothness of subsequent processes (printing process); and the independent second pad structure 142 can be stacked on the independent first pad structure 122 respectively. In addition, the material of the second conductive layer 14 can be the same as or different from the first conductive layer 12. Understandably, in some embodiments, the portion of the second pad structure 142 extending from the second line 141 may not overlap with the first pad structure 122 (regardless of whether the first pad structure 122 and the first line 121 are electrically independent), or it may overlap with and be electrically connected to the independent first pad structure 122. Here, in the aforementioned embodiments, when the conductivity of the first conductive layer 12 is superior to that of the second conductive layer 14, the overall conductivity of the second pad structure 142 together with the first pad structure 122 (regardless of whether the first pad structure 122 and the first line 121 are electrically independent) is superior to the conductivity of the second pad structure 142 alone.

[0040] Please refer to Figures 5A to 5C As shown, where, Figure 5B and Figure 5C They are respectively Figure 5A The diagram shows a cross-sectional view along the cut lines 5B-5B and 5C-5C. In this embodiment, after step S04 of printing the second conductive layer 14 and before the next step S05, i.e., before printing the second insulating layer, the manufacturing method of the present invention may further include: printing a third conductive layer 17 on the second conductive layer 14, wherein the third conductive layer 17 includes a plurality of third pad structures 171, and a portion of the third pad structures 171 overlap and are electrically connected to the second line 141. Figure 5A , Figure 5B The third gasket structure 171 is partially superimposed on and electrically connected to the second gasket structure 142. Figure 5A , Figure 5C Here, the third pad structure 171 of the third conductive layer 17 is located at the periphery (outer side) of the protection unit 18, which allows the electrode positions corresponding to each photoelectric component to be thickened in the subsequent step S06 of setting up the photoelectric components, which is beneficial to the electrical connection of the photoelectric components.

[0041] After completing the third conductive layer 17, then, as follows: Figure 6 As shown, step S05 is then performed: a second insulating layer 15 is printed on the second conductive layer 14. The second insulating layer 15 includes a plurality of third insulating lines 151 arranged along the second direction D2 and substantially parallel to each other, and a plurality of second windows w2 defined on the third insulating lines 151. The third insulating lines 151 overlap the second lines 141. In this embodiment, each second window w2 corresponds to the position of the third gasket structure 171, exposing the third gasket structure 171 located on the second lines 141. It is worth noting that in the above-described process of printing the first insulating layer 13 or the second insulating layer 15, the first insulating lines 131 and the third insulating lines 151 printed on the first lines 121 and the second lines 141 respectively can cover the sidewalls of the conductive lines, improving the protection and insulation effects such as protecting the conductive lines or preventing oxidation.

[0042] Furthermore, in the above embodiments, only the second insulating layer 15 (third insulating line 151) printed along the second direction D2 is provided. However, this is not a limitation. In some embodiments, the second insulating layer 15 (e.g., a fourth insulating line not shown) can also be printed on the first insulating line 131 laid along the first direction D1. In addition to protecting or shielding the first insulating line 131, this can also increase the height. Moreover, if the second insulating layer 15 is different in color from the first insulating layer 13, the second insulating layer 15 laid along the first direction D1 and the second direction D2 can also maintain the consistency of the insulating layer color of the light-transmitting display module.

[0043] It is particularly noteworthy that the process of printing the third conductive layer 17 described above can also be performed after step S05 of printing the second insulating layer 15. In other words, the process of printing the third conductive layer 17 is performed after step S05 of printing the second insulating layer 15. In this embodiment, since the second insulating layer 15 is printed first, the second window w2 defined on the third insulating line 151 of the second insulating layer 15 will expose a portion of the second line 141, and the subsequently printed portion of the third pad structure 171 will correspond to the second window w2 and be electrically connected to the second line 141, and a portion of the third pad structure 171 will be superimposed and electrically connected to the second pad structure 142.

[0044] In some embodiments, the step of printing the third conductive layer 17 onto the second conductive layer 14 may be performed before or after the step of printing the second insulating layer S05. The third conductive layer 17 includes a plurality of third pad structures 171, which are stacked and electrically connected to the second pad structure 142. In other words, the third pad structures 171 are printed only at the locations of the second pad structures 142; the third pad structures 171 corresponding to the electrode locations are not printed on the second circuit 141. It is understood that the thickness of the third pad structures 171 in the third conductive layer 17 can be increased by repeated printing, for example, by printing only at the locations of the second pad structures 142, or further printing on the second circuit 141, or by alternating between the two methods.

[0045] Finally, as Figures 7 to 8C Step S06: Multiple photoelectric components 16 are disposed on the first surface S1 of the light-transmitting substrate 11, wherein each photoelectric component 16 has multiple electrodes E (marked on...). Figure 8B , Figure 8C The electrodes E of each optoelectronic component 16 are electrically connected to the second pad structure 142. Figure 8C The electrodes E of each optoelectronic component 16 are electrically connected to the second line 141 through the second window w2. Figure 8B Thus, a light-transmitting display module 1 is obtained. In some embodiments, the optoelectronic component 16 can be bonded to the protective unit 18 on the first surface S1 of the light-transmitting substrate 11 using an adhesive layer (e.g., adhesive, not shown).

[0046] In this embodiment, to enable the electrode E of the optoelectronic component 16 to be electrically connected to the second pad structure 142 (and the first pad structure 122) and the second line 141 respectively, multiple conductive elements C can be arranged on the electrode E, such as... Figure 8BAs shown, part of the electrode E is electrically connected to the second line 141 of the second conductive layer 14 through the conductive element C and the third pad structure 171; as Figure 8C As shown, part of the electrode E is electrically connected to the first pad structure 122 through the conductive element C, the third pad structure 171, and the second pad structure 142. In some embodiments, the conductive element C may include a conductive material, such as copper paste, silver paste, solder paste, or anisotropic conductive adhesive (ACP), which may be disposed in a through-hole in the surface of the optoelectronic component 16, or disposed on the side of the optoelectronic component 16 (e.g., in this embodiment), to electrically connect the electrode E of the optoelectronic component 16 to the second line 141 of the second conductive layer 14 and the first pad structure 122 (the first line 121). In some embodiments, the optoelectronic component 16 is a standard SMD component, and the conductive element C may be located on the side of the optoelectronic component 16 facing the light-transmitting substrate 11, for example, between the electrode E of the optoelectronic component 16 and the second pad structure 142 (and the first pad structure 122) and the second line 141. Here, the conductive element C can be a direct electrical connection through a hole in the surface of the optoelectronic component 16, or the optoelectronic component 16 is a standard SMD component that can be directly connected (Direct Mount), or a jumper located on the side of the optoelectronic component 16, or other electrical connection methods with equivalent effectiveness.

[0047] In some embodiments, the optoelectronic component 16 may be a millimeter- or micrometer-sized optoelectronic chip or optoelectronic package. In some embodiments, each optoelectronic component 16 may, for example, but not limited to, include at least one LED chip, a mini LED chip, a micro LED chip, or at least one package, or an optoelectronic chip or package of any size, whether millimeter-sized, micrometer-sized, or smaller. A millimeter-sized package may include a micrometer-sized chip. In some embodiments, each optoelectronic component 16 may include one optoelectronic chip or package, thereby understanding the optoelectronic component 16 as a single pixel; or, in some embodiments, each optoelectronic component 16 may include multiple optoelectronic chips or packages, which can be understood as the optoelectronic component 16 including multiple pixels. In some embodiments, the optoelectronic component 16 may include, for example, red, blue, or green LED, Mini LED, or Micro LED chips, or LED, Mini LED, or Micro LED chips or packages of other colors. When the three optoelectronic chips or packages on the optoelectronic component 16 are red, blue, and green LED, Mini LED, or Micro LED chips respectively, a full-color LED, Mini LED, or microLED display can be constructed. The aforementioned chip can be a chip of a horizontal electrode, a flip-chip electrode, or a vertical electrode, and is electrically connected to electrode E by wire bonding or flip-chip bonding.

[0048] In some embodiments, before or after step S06 of setting the optoelectronic component 16, the manufacturing method of the present invention may further include: laying a protective layer (not shown) on the first surface S1 of the light-transmitting substrate 11, wherein the protective layer may be laid all along the first surface S1 of the light-transmitting substrate 11 to protect the related components covered thereunder; or further, making the positions of the current-guiding structures such as the first conductive layer 12 and the second conductive layer 14 equivalent to the stress neutral layer of the overall structure to further protect the aforementioned current-guiding structures. In some embodiments, before or after step S06 of setting the optoelectronic component 16, the manufacturing method of the present invention may further include: laying a protective layer (not shown) on the second surface S2 of the light-transmitting substrate 11 to further balance the possible warpage of the light-transmitting substrate 11. In some embodiments, the protective layer may be laid all along the second surface S2 of the light-transmitting substrate 11, thereby improving the overall structural strength of the light-transmitting display module; here, the fully laid protective layer is transparent. In some embodiments, the protective layer may be provided at least corresponding to the first conductive layer 12, the first insulating layer 13, the second conductive layer 14, or the second insulating layer 15, or a combination thereof, to balance the stress formed on the first surface S1 of the light-transmitting substrate 11 by the first conductive layer 12, the first insulating layer 13, the second conductive layer 14, or the second insulating layer 15, or more other layers, or combinations thereof. Whether the protective layer is provided on the first surface S1 or the second surface S2 of the light-transmitting substrate 11, or is partially applied, materials such as black (for contrast), white (for reflection), or transparent (for full coverage, to avoid light obstruction) can be selected. Furthermore, the protective layer may be implemented together with the first insulating layer 13, the second insulating layer 15, or other protective layers, or it may be implemented independently; there are no limitations.

[0049] In some embodiments, before or after step S06 of setting the optoelectronic component 16, the manufacturing method of the present invention may further include: performing an anti-reflection and / or anti-glare treatment to form an anti-reflection and / or anti-glare layer (not shown). The anti-reflection and / or anti-glare layer may be formed on the first surface S1 and / or the second surface S2 of the light-transmitting substrate 11. In some embodiments, the anti-reflection and / or anti-glare treatment may also be performed during step S01 of placing the light-transmitting substrate 11, achieving the same anti-reflection and / or anti-glare effect.

[0050] In summary, the manufacturing method of the light-transmitting display module of the present invention involves sequentially forming a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer on a light-transmitting substrate using a printing process. Then, multiple photoelectric components are disposed on the light-transmitting substrate, with some electrodes of each photoelectric component electrically connected to the second pad structure of the second conductive layer (and the first conductive layer). Simultaneously, some electrodes are electrically connected to the second circuit of the second conductive layer through a second window defined by the second insulating layer. Therefore, the manufacturing method of the light-transmitting display module of the present invention is different from traditional methods using photolithography, etching, etc., and has the advantages of simple process, low cost, and environmental friendliness.

[0051] The above description is illustrative only and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included within the scope of the appended claims.

Claims

1. A method for manufacturing a light-transmitting display module, comprising at least the following steps: A light-transmitting substrate is prepared, wherein the light-transmitting substrate defines opposing first and second surfaces; A first conductive layer is printed on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first lines; wherein at least a portion of the first pad structures are extended from the first lines. A first insulating layer is printed on the first conductive layer, wherein the first insulating layer includes a plurality of first insulating lines arranged along the first direction, a plurality of second insulating lines arranged along the second direction, and a plurality of first windows exposing the leads, the second direction being perpendicular to the first direction and forming a plane, the first insulating lines overlapping the first line, and the first insulating lines also covering the two side walls of the first line. A second conductive layer is printed on the first insulating layer, wherein the second conductive layer includes a plurality of second lines and a plurality of second pad structures arranged along the second direction, the second lines overlap the second insulating lines and are electrically connected to the lead through the first window, and the second pad structures are electrically connected to the first pad structures; A second insulating layer is printed on the second conductive layer, wherein the second insulating layer includes a plurality of third insulating lines arranged along the second direction and a plurality of second windows defined on the third insulating lines, the third insulating lines overlapping the second line, and the third insulating lines also covering the side walls of the second line; as well as Multiple photoelectric components are disposed on the first surface of the light-transmitting substrate, wherein each photoelectric component has multiple electrodes, some of the electrodes are electrically connected to the second pad structure, and some of the electrodes are electrically connected to the second line through the second window.

2. The manufacturing method according to claim 1, wherein, In the step of printing the first conductive layer, a portion of the first pad structure is independent of the first circuit.

3. The manufacturing method according to claim 1, wherein, Before or after the step of setting the optoelectronic component, the following further methods are included: A plurality of protective units corresponding to the optoelectronic component are formed on the first and / or second surfaces of the light-transmitting substrate.

4. The manufacturing method according to claim 3, wherein, The protective unit is formed simultaneously during the step of printing the first insulating layer and / or the second insulating layer.

5. The manufacturing method according to claim 1, wherein, In the step of printing the second conductive layer, a portion of the second pad structure is independent of the second circuit.

6. The manufacturing method according to claim 2, wherein, In the step of printing the second conductive layer, a portion of the second pad structure overlaps with a portion of the first pad structure that is independent of or not independent of the second line.

7. The manufacturing method according to claim 1, wherein, In the step of printing the second conductive layer, the conductivity of the first conductive layer is superior to that of the second conductive layer.

8. The manufacturing method according to claim 1, wherein, Prior to the step of printing the second insulating layer, the process further includes: A third conductive layer is printed on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, some of the third pad structures overlap and are electrically connected to the second line, and some of the third pad structures are superimposed and electrically connected to the second pad structure.

9. The manufacturing method according to claim 1, wherein, After the step of printing the second insulating layer, the process further includes: A third conductive layer is printed on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, some of the third pad structures correspond to the second window and are electrically connected to the second line, and some of the third pad structures are superimposed and electrically connected to the second pad structure.

10. The manufacturing method according to claim 1, wherein, Before or after the step of printing the second insulating layer, the process further includes: A third conductive layer is printed on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, the third pad structures being superimposed and electrically connected to the second pad structure.

11. The manufacturing method according to claim 1, wherein, The step of setting up the optoelectronic component further includes: Multiple conductive elements are disposed on the electrode, wherein the electrode of the optoelectronic component is electrically connected to the second pad structure and the second circuit through the conductive elements.

12. The manufacturing method according to claim 1, wherein the light-transmitting substrate is a glass substrate.

13. The manufacturing method according to claim 1, wherein, In the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate supported on a rigid substrate; and after the step of setting the optoelectronic component, the process further includes: Remove the rigid substrate.

14. The manufacturing method according to claim 13, wherein, Prior to the step of removing the rigid substrate, the procedure further includes: An optical film is attached to the first surface of the light-transmitting substrate.

15. The manufacturing method according to claim 1, wherein, Before or after the step of setting the optoelectronic component, the following further methods are included: A protective layer is laid on the first or second surface of the light-transmitting substrate.

16. The manufacturing method according to claim 15, wherein the protective layer is laid all over the first or second surface of the light-transmitting substrate.

17. The manufacturing method of claim 15, wherein the protective layer is laid along the second surface of the light-transmitting substrate and corresponds at least to the first conductive layer, the first insulating layer, the second conductive layer, or the second insulating layer, or a combination thereof.

18. The manufacturing method according to claim 1, wherein, Before or after the step of setting the optoelectronic component, the following further methods are included: Implement anti-reflective and / or anti-glare treatments to form an anti-reflective and / or anti-glare layer.

19. The manufacturing method according to claim 18, wherein the anti-reflective and / or anti-glare layer is formed on the first surface and / or the second surface of the light-transmitting substrate.

20. The manufacturing method according to claim 1, wherein the optoelectronic component is a millimeter- or micrometer-scale optoelectronic chip or optoelectronic package.

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