Electroluminescent display device and method of manufacturing an electroluminescent display device

Abstract

Electroluminescent display devices and methods of manufacturing electroluminescent display devices. An electroluminescent display device includes a display panel having a display area and a non-display area. A planarization layer is positioned over the non-display area. A bank layer is positioned on the planarization layer. An organic layer and a cathode are positioned on the bank layer. A trench pattern extends through the cathode and the organic layer. An adhesive layer and an encapsulation substrate are positioned over the cathode. The adhesive layer covers the trench pattern. The adhesive layer can be effective to slow the rate of moisture penetration to the side surface of the non-display area, allowing for improved reliability and reduced bezel width.

Description

Technical Field

[0001] This disclosure relates to an electroluminescent display device, and more particularly, to an electroluminescent display device having a narrow bezel. Background Technology

[0002] Recently, as our society has developed towards an information-oriented society, the field of display devices for visually expressing electrical information signals has developed rapidly. Correspondingly, various display devices with excellent performance in terms of thinness, lightness, and low power consumption have been developed.

[0003] Representative display devices include liquid crystal displays (LCDs), electrowetting displays (EWDs), and organic light-emitting diode displays (OLEDs).

[0004] Among these various display devices, electroluminescent displays, including organic light-emitting displays, are self-emissive and can be manufactured in a thin and light form because, unlike liquid crystal displays which have an independent light source, they do not require a separate light source. Furthermore, electroluminescent displays have advantages in power consumption due to their low-voltage operation and excel in color reproduction, response speed, viewing angle, and contrast ratio (CR). Therefore, it is desirable to apply electroluminescent displays to various fields.

[0005] An electroluminescent display device is constructed by using an organic material to form a light-emitting layer between two electrodes called the anode and the cathode. Then, when holes from the anode are injected into the light-emitting layer and electrons from the cathode are injected into the light-emitting layer, the injected electrons and holes recombine with each other to form excitons in the light-emitting layer and emit light.

[0006] The luminescent layer comprises a host material and a dopant material, which interact with each other. The host material generates excitons from electrons and holes and uses them to transfer energy to the dopant, which is a small amount of dye-based organic material added to receive energy from the host material and convert it into light. Summary of the Invention

[0007] In current electroluminescent display devices, reduced bezel distances are beneficial to reliability, such as by preventing moisture penetration. A "reliable bezel" can be a bezel distance small enough to achieve a beneficial level of moisture penetration resistance. A reliable bezel can be the distance from the end of the upper substrate (e.g., the encapsulation substrate) to the end of the cathode.

[0008] In response to the increasing demand for thinner display devices, the need for thinner non-display areas, which are typically located outside the display area where the image is displayed, is also growing. During the deposition of the cathode and organic layers, shadow areas are created due to the gap between the mask and the substrate. These shadow areas can increase the difficulty of reducing bezel dimensions. The location and length of the shadow areas are not uniform due to process variations, and quality uniformity may be reduced due to differences in reliable bezel distances between each product.

[0009] Therefore, the technical features of this disclosure provide an electroluminescent display device that can reduce the bezel width by converting an existing shadow area into a reliable bezel area.

[0010] The technical features disclosed herein are not limited to those described above. Those skilled in the art can clearly understand other technical features not mentioned above through the following description.

[0011] An electroluminescent display device according to an embodiment of the present disclosure may include: a display panel divided into a display area and a non-display area; a planarization layer and a dam layer extending to the non-display area of ​​the display panel; an organic layer and a cathode disposed on the dam layer and extending to the non-display area of ​​the display panel; a trench pattern disposed in the non-display area outside the display area and in the trench pattern at locations where the cathode and organic layer have been removed; an adhesive layer and an encapsulation substrate disposed above the cathode, wherein the adhesive layer covers the trench pattern.

[0012] An electroluminescent display device according to another embodiment of the present disclosure may include: a substrate divided into a display area and a non-display area; a planarization layer disposed on the substrate; a dam layer disposed above the planarization layer; an organic layer; a cathode; and a capping layer disposed on the dam layer and extending to the non-display area of ​​the substrate; at least one trench pattern disposed in the non-display area outside the display area and wherein the capping layer, cathode, organic layer, dam layer and planarization layer are removed; a passivation layer disposed on the bottom inside the trench pattern; an adhesive layer filling the interior of the trench pattern and disposed above the substrate; and an encapsulation substrate disposed on the adhesive layer.

[0013] Further details of the implementation methods are included in the detailed description and accompanying drawings.

[0014] In this disclosure, by forming a trench pattern in the unwanted shadow area resulting from the use of a deposition mask to remove a portion of the cathode and organic layer, the rate of moisture penetration to the side surface of the non-display area can be delayed, thereby allowing for improved reliability and reduced bezel width.

[0015] The effects of this disclosure are not limited to those shown above; this specification includes a variety of other effects. Attached Figure Description

[0016] Figure 1 This is a plan view of an electroluminescent display device according to the first embodiment of this disclosure.

[0017] Figure 2 This is a cross-sectional view of a sub-pixel of an electroluminescent display according to the first embodiment of this disclosure.

[0018] Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0019] Figure 4 This is a partial cross-sectional view of an electroluminescent display device according to various embodiments.

[0020] Figures 5A to 5E yes Figure 3 A cross-sectional view of the manufacturing process of an electroluminescent display device.

[0021] Figure 6 This is a cross-sectional view of an electroluminescent display device according to a second embodiment of the present disclosure.

[0022] Figure 7 This is a cross-sectional view of an electroluminescent display device according to a third embodiment of the present disclosure.

[0023] Figure 8 This is a cross-sectional view of an electroluminescent display device according to the fourth embodiment of this disclosure.

[0024] Figure 9 This is a plan view of an electroluminescent display device according to the fifth embodiment of this disclosure.

[0025] Figure 10 This is a plan view of an electroluminescent display device according to the sixth embodiment of this disclosure.

[0026] Figure 11 It is along Figure 10 A cross-sectional view taken by line X-X'. Detailed Implementation

[0027] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will become clear from the following detailed description of embodiments in conjunction with the accompanying drawings. This disclosure is not limited to the embodiments disclosed herein, but can be implemented in various forms. These embodiments are provided to enable those skilled in the art to better understand the technical features and advantages of the invention.

[0028] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe embodiments of this disclosure are examples, and the embodiments are not limited thereto. Such shapes, dimensions, ratios, angles, quantities, etc., should be understood to include appropriate ranges readily discernible to those skilled in the art. Throughout the specification, similar reference numerals generally denote similar elements. In the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid departing from the technical features and advantages described with reference to embodiments of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to be open-ended, allowing for the addition of other components, unless these terms are used in conjunction with the term “only.” Unless explicitly stated otherwise, any singular reference may include the plural.

[0029] Even if not explicitly stated, the components and their dimensions include the range of tolerances, errors, variations, etc.

[0030] When using terms such as “on,” “above,” “above,” “below,” “under,” “below,” and “next” to describe the positional relationship between two components, one or more components may be located between the two aforementioned components unless these terms are used in conjunction with “adjacent” or “directly.” The positional terms just listed should include above, below, right, left, front, and back, which will be understood based on the orientation of the structure comprising the two components.

[0031] When a component or layer is described as being disposed "on" another component or layer, the other layer or component may be directly inserted on or between the other components.

[0032] Although the terms "first," "second," etc., are used to describe various components, these components (e.g., in terms of order, priority, physical size, etc.) are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, the first component mentioned below can be the second component in the technical concepts of this disclosure (e.g., order).

[0033] The dimensions and thicknesses of each component shown in the figures are for ease of description and may not be drawn to scale. Therefore, the dimensions and thicknesses of each component shown should be within the scope of understanding as described in the various embodiments, or as can be discerned by those skilled in the art.

[0034] Features, structures, or characteristics may be described in the context of a single implementation or multiple implementations. In one or more implementations, features, structures, or characteristics may be omitted. Features, structures, or characteristics described in the context of one or more implementations may be combined with each other in any suitable manner and may be structurally positioned and / or connected and operated in various ways. Various implementations may be implemented independently of each other or in relation to each other.

[0035] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0036] Figure 1 This is a plan view of an electroluminescent display device according to the first embodiment of this disclosure.

[0037] Reference Figure 1 The electroluminescent display device according to the first embodiment of the present disclosure may include a display panel 100, a flexible film 160, and a printed circuit board 170.

[0038] Display panel 100 is a panel used to display images to the user.

[0039] In the display panel 100, display elements for displaying images, driving elements for driving the display elements, and lines for sending various signals to the display elements and driving elements can be provided. Depending on the type of display panel 100, the display elements may include different materials and / or structures. For example, when the display panel 100 is an organic light-emitting display panel, the display element is an organic light-emitting element that includes an anode, an organic light-emitting layer, and a cathode. For example, when the display panel 100 is a liquid crystal display panel, the display element may be a liquid crystal display element. In the following description, the display panel 100 is provided in the context of an organic light-emitting display panel, but the display panel 100 is not limited to an organic light-emitting display panel.

[0040] The display panel 100 may include a display area AA and a non-display area NA.

[0041] Display area AA is the area on display panel 100 where images are displayed.

[0042] Multiple subpixels constituting multiple pixels and circuitry for driving these subpixels can be disposed within a display area AA. Multiple subpixels are the units constituting the display area AA, and display elements can be disposed in each of the multiple subpixels, with the multiple subpixels forming a single pixel. For example, an organic light-emitting element comprising an anode, an organic light-emitting layer, and a cathode can be disposed in each of the multiple subpixels, but is not limited thereto. Furthermore, the circuitry for driving the multiple subpixels can include driving elements, wiring, etc. For example, the circuitry can include thin-film transistors, capacitors, gate lines, data lines, etc., but is not limited thereto.

[0043] The non-display area (NA) is the area where no image is displayed.

[0044] Figure 1 The diagram shows a non-display area NA surrounding a display area AA with a rectangular shape, but the shape and arrangement of the display area AA and the non-display area NA are not limited to these. Figure 1 The example shown.

[0045] In other words, the shape of the display area AA and the non-display area NA can be adapted to the design of an electronic device on which an electroluminescent display device is mounted. For example, the shape of the display area AA can be pentagonal, hexagonal, circular, elliptical, etc.

[0046] Various lines and circuits used to drive the organic light-emitting elements of the display area AA can be arranged in the non-display area NA. For example, in the non-display area NA, link lines for sending signals to multiple sub-pixels and circuits of the display area AA, or driver ICs such as gating driver ICs and data driver ICs, can be provided, but are not limited to these.

[0047] Electroluminescent display devices may include various additional components for generating various signals or driving pixels in the display area AA. Additional components for driving pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, etc. Electroluminescent display devices may also include additional components associated with functions other than driving pixels. For example, an electroluminescent display device may include additional components providing touch sensing functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure sensing functions, haptic feedback functions, etc. These additional components may be located in the non-display area NA and / or connected to external circuitry of a connection interface.

[0048] The flexible film 160 is a film in which various components are disposed on a flexible base film. Specifically, the flexible film 160 is a film used to provide signals to multiple sub-pixels and circuits of the display area AA, and can be electrically connected to the display panel 100. The flexible film 160 can be disposed at one end of the non-display area NA of the non-display panel 100 and provide power supply voltage, data voltage, etc. to multiple sub-pixels and circuits of the display area AA. The number of flexible films 160 can be varied according to the design, but is not limited to... Figure 1 The configuration shown.

[0049] Simultaneously, driver ICs such as gating driver ICs and data driver ICs can be disposed on the flexible film 160. Driver ICs are components that process data used for displaying images and drive signals used to process that data. Driver ICs can be disposed using chip-on-glass (COG), chip-on-film (COF), or tape-on-carrier (TCP) methods, depending on the mounting method.

[0050] A printed circuit board 170 may be disposed at and connected to the first end of the flexible film 160. The opposite end of the flexible film 160 may be connected to the display panel 100. The printed circuit board 170 is a component that provides signals to a driver IC. The printed circuit board 170 may provide various signals, such as drive signals and data signals, to the driver IC. For example, a data driver that generates data signals may be mounted on the printed circuit board 170, and the generated data signals may be provided to multiple sub-pixels and circuits of the display panel 100 through the flexible film 160. Figure 1 A single printed circuit board 170 is shown. In one embodiment, two or more printed circuit boards 170 may be coupled to the display panel 100 and / or coupled to each other.

[0051] In electroluminescent display devices, reduced bezel distances are beneficial for ensuring reliability, such as preventing moisture penetration, and the need for thinner non-display areas (NAs) is also increasing due to the thinning requirements of display devices. In this case, when the cathode and organic layer are deposited, shadow areas are created due to the gap between the mask and the substrate, thus limiting the reduction of the bezel.

[0052] Therefore, the first embodiment of this disclosure is characterized by removing a portion of the cathode and organic layer by forming a trench pattern 180 in the shadow area of ​​the non-display area NA, thereby delaying the rate at which moisture penetrates to the side surface of the non-display area NA. In this way, the bezel width can be reduced by converting the existing shadow area into a reliable bezel area.

[0053] The trench pattern 180 according to the first embodiment of this disclosure can be formed on three surfaces (or "ends") of the non-display area NA, excluding the lower end of the display panel 100 connected to the flexible film 160, but is not limited thereto. Due to the risk of laser damage caused by the arrangement of the driver IC and the application of voltage, the trench pattern 180 may not be formed in the lower end of the display panel 100, but this disclosure is not limited thereto. Figure 1 As shown, the end portion includes an upper end portion opposite to the lower end portion, and left and right end portions extending from the upper end portion to the lower end portion. The groove pattern 180 is located above the upper end portion and the left and right end portions. The lower end portion is substantially free of the groove pattern 180.

[0054] The trench pattern 180 can be formed, for example, by ablation of the cathode and organic layer of the shadow area outside the display area AA via laser ablation. Therefore, the reliable border area can be enlarged, and the border width can be reduced by an amount equal to the increased length of the reliable border area.

[0055] The planarization layer and the bank area are pathways with lower moisture permeability. In one embodiment, the trench pattern 180 can be extended into the planarization layer and the bank area by a photolithography process, but this disclosure is not limited thereto.

[0056] A passivation layer for protecting the gate in-board (GIP) circuitry from laser ablation can be provided in the trench pattern 180, but is not limited to this. (See reference...) Figure 2 and Figure 3 The description details the various components constituting the electroluminescent display device, including the groove pattern 180.

[0057] Figure 2 This is a cross-sectional view of a sub-pixel of an electroluminescent display according to the first embodiment of this disclosure.

[0058] Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0059] Figure 3 A cross-section of a portion of the right side of a display panel 100, for example, in which a groove pattern 180 is formed, is shown. Figure 3 For ease of description, pixel unit 115 in display area AA is schematically shown. Pixel unit 115 may include various components beneath organic layer 152. Additionally, gate in-board (GIP) unit 125 in non-display area NA may also include various components and is schematically shown. Pixel unit 115 may be or include one or more pixel structures and pixel circuits, and may be referred to as pixel structure 115 or pixel circuit 115. GIP unit 125 may be GIP circuit 125, and may be referred to as GIP circuit 125.

[0060] Reference Figure 2 and Figure 3 In the electroluminescent display device according to the first embodiment of the present disclosure, the driving element 110 may be disposed on the substrate 101.

[0061] The planarization layer 105 can be disposed on the drive element 110.

[0062] An organic light-emitting element 150 electrically connected to a driving element 110 is disposed on a planarization layer 105, and a cover layer 120 may be disposed on the organic light-emitting element 150 to minimize or reduce the penetration of oxygen and moisture into the organic light-emitting element 150.

[0063] The adhesive layer 130 and the encapsulation substrate 140 may be sequentially disposed on the cover layer 120. However, this disclosure is not limited to this stacked structure.

[0064] The substrate 101 can be a glass or plastic substrate. In the case of a plastic substrate, materials based on polyimide or polycarbonate can be used to provide flexibility. Specifically, polyimide is widely used for plastic substrates because it can be used in high-temperature processes and can be coated.

[0065] The buffer layer 102 can be disposed on the substrate 101.

[0066] The buffer layer 102 is a functional layer used to protect various electrodes and circuits from impurities such as alkali ions leaking from the substrate 101 or its underlying layer. It may have a multilayer structure formed by a first buffer layer 102a and a second buffer layer 102b, but is not limited thereto. The buffer layer 102 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0067] Buffer layer 102 can delay the diffusion of permeated moisture and / or oxygen into substrate 101. Furthermore, buffer layer 102 may include multiple buffer layers and / or active buffer layers. Active buffer layers can protect the active layer 111, which is composed of semiconductors of driving element 110, and block various types of defects introduced from substrate 101. Active buffer layers can be formed of, for example, amorphous silicon (a-Si).

[0068] The driving element 110 may have an active layer 111, an insulating layer 103, a gate 113, a gate insulating layer 104, a source, and a drain 112 arranged in sequence, and may be electrically connected to the organic light-emitting element 150 via a connecting electrode 114, thereby sending current or a signal to the organic light-emitting element 150.

[0069] The active layer 111 may be located on the buffer layer 102. The active layer 111 may be formed of polycrystalline silicon (p-Si), and in this case, a predetermined region or selected region thereof may be doped with impurities. The active layer 111 may be formed of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. The active layer 111 may be formed of oxide.

[0070] The insulating layer 103 may be located on the active layer 111. The insulating layer 103 may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), or it may be formed of an insulating organic material.

[0071] The gate 113 may be located on the insulating layer 103. The gate 113 may be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0072] The gate insulating layer 104 may be located on the gate 113. The gate insulating layer 104 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or it may be formed of an insulating organic material.

[0073] Contact holes exposing the source and drain regions can be formed by selectively removing insulating layer 103 and gate insulating layer 104. The source and drain 112 can be electrode materials on the gate insulating layer 104 and can be formed as a single layer or multiple layers. In one embodiment, an additional passivation layer formed of inorganic insulating material can be formed to cover the source and drain 112.

[0074] The planarization layer 105 can be disposed on the drive element 110 configured as described above.

[0075] The planarization layer 105 may have a multilayer structure consisting of at least two layers, and, for example, refer to... Figure 2 It may include a first planarization layer 105a and a second planarization layer 105b. The first planarization layer 105a may be configured to cover the driving element 110 and may be configured to expose portions of the source and drain 112 of the driving element 110.

[0076] The planarization layer 105 can extend to the non-display area NA to cover the GIP unit 125, such as Figure 3 As shown.

[0077] The planarization layer 105 may have a thickness ranging from about 1 micrometer (μm) to about 5 μm (such as 1 μm, 2 μm, 3 μm, 4 μm, 5 μm or any thickness in between), but is not limited to this.

[0078] The planarization layer 105 can be an outer coating layer, but is not limited to it.

[0079] The planarization layer 105 can be configured to terminate at a position spaced at a predetermined or selected distance from the end of the substrate 101. Figure 3 The middle is marked as "D" PS ", but not limited to this."

[0080] The connection electrode 114 for electrically connecting the driving element 110 and the organic light-emitting element 150 can be disposed on the first planarization layer 105a. Additionally, although in Figure 2 Although not shown, various metal layers, such as data lines and signal lines, can be disposed on the first planarization layer 105a as lines / electrodes.

[0081] A second planarization layer 105b may be disposed on the first planarization layer 105a and the connecting electrode 114. As the number of various signal lines increases with the higher resolution of electroluminescent display devices, the planarization layer 105 according to the first embodiment of this disclosure may be formed by two planarization layers 105a and 105b. Therefore, providing an additional planarization layer 105b helps with wiring on a single layer while ensuring minimal or reduced distance between lines. Including such an additional layer (e.g., the second planarization layer 105b) provides a location for line wiring, thereby allowing for further improvement in line / electrode wiring design. In one embodiment, a dielectric material is used as the planarization layer 105, which includes multiple layers, enabling the formation of capacitors between metal layers embedded in the planarization layer 105.

[0082] The second planarization layer 105b can be formed as part of the exposed connection electrode 114, and the drain 112 of the driving element 110 and the anode of the organic light-emitting element 150 can be electrically connected to each other through the connection electrode 114.

[0083] The organic light-emitting element 150 can be configured by sequentially arranging an anode 151, a plurality of organic layers 152, and a cathode 153. That is, the organic light-emitting element 150 may include an anode 151 formed on a planarization layer 105, an organic layer 152 formed on the anode 151, and a cathode 153 formed on the organic layer 152.

[0084] Electroluminescent display devices can be implemented using either a top-emitting or bottom-emitting method. In the top-emitting method, a reflective layer formed of an opaque conductive material with high reflectivity, such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof, can be added below the anode 151, such that light emitted from the organic layer 152 is reflected by the anode 151 and directed upwards (i.e., towards the cathode 153 and away from the substrate 101). In the case of the bottom-emitting method, the anode 151 can be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. The following description is provided in the context of an electroluminescent display device with a bottom-emitting method configuration. It should be understood that this description is similarly applicable to embodiments with a top-emitting method configuration.

[0085] A dam layer 106 can be formed on the planarization layer 105 in areas other than the light-emitting area. The dam layer 106 can have dam holes exposing the anode 151. The location of the dam holes corresponds to the light-emitting area, such as... Figure 2 As shown in the figure. The dam layer 106 can be formed of inorganic insulating materials such as silicon nitride (SiNx) or silicon oxide (SiOx) or organic insulating materials such as BCB, acrylic resin or imide resin.

[0086] Layer 106 can extend to the non-display area NA, such as Figure 3 As shown.

[0087] The thickness of the embankment 106 may be in the range of about 0.1 μm to about 10 μm (such as about 1 μm, 2 μm or 3 μm), but is not limited thereto. It should be understood that any value between about 0.1 μm and about 10 μm (such as 4.501 μm or 6.356 μm) is included in the thickness range of the embankment 106.

[0088] The embankment 106 may cover the upper part of the GIP unit 125, but is not limited thereto. In one embodiment, the embankment 106 partially covers the upper surface of the GIP unit 125 and exposes one or more areas of the upper surface, such as... Figure 3 As shown.

[0089] The organic layer 152 can be disposed on the exposed anode 151 of the embankment layer 106. The organic layer 152 may include one or more layers selected from the following: a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer.

[0090] Organic layer 152 can extend into the non-display area NA, such as Figure 3 As shown.

[0091] In the non-display area NA, the organic layer 152 can be disposed on the embankment layer 106.

[0092] The cathode 153 can be disposed on the organic layer 152.

[0093] In the case of a top-emitting method, the cathode 153 may comprise a transparent conductive material. For example, the cathode 153 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the case of a bottom-emitting method, the cathode 153 may comprise any one of the following metallic materials, or alloys thereof, such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), etc. Alternatively, the cathode 153 may be configured by stacking layers formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO) and layers formed of metallic materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), etc., or alloys thereof, but is not limited thereto.

[0094] Cathode 153 can extend to the non-display area NA, such as Figure 3 As shown.

[0095] In the non-display area NA, the cathode 153 may be configured to cover the organic layer 152. In one embodiment, the cathode 153 covers the upper surface of the organic layer 152 and one or more sidewalls of the organic layer 152, such as... Figure 3 As shown. In one embodiment, the cathode 153 may have an end that contacts the dam layer 106.

[0096] The organic layer 152 can be configured to be spaced apart from the end of the cathode 153 by a predetermined distance or a selected distance. Figure 3 The middle is marked as "D" OC ", but not limited to this."

[0097] The cathode 153 can be configured to be spaced at a predetermined or selected distance from the end of the embankment 106. Figure 3 The middle is marked as "D" CB ", but not limited to this."

[0098] To reduce diffuse reflection of external light, a cover layer 120 formed of a material with high refractive index and light absorption can be disposed on the organic light-emitting element 150.

[0099] The cover layer 120 may be an organic layer formed of organic material, and may be omitted in some embodiments.

[0100] Overlay 120 can extend to the non-display area NA, such as Figure 3 As shown.

[0101] In the non-display area NA, the overlay layer 120 can be disposed on the cathode 153.

[0102] The capping layer 120, cathode 153, and organic layer 152 can be collectively referred to as "multiple functional layers".

[0103] The adhesive layer 130 and the encapsulation substrate 140 can be disposed on the cover layer 120.

[0104] The adhesive layer 130 and the encapsulation substrate 140 may extend to the non-display area NA to cover a portion of the planarization layer 105 and the embankment layer 106, such as Figure 3 As shown. In one embodiment, the adhesive layer 130 is in contact with the cover layer 120, the embankment layer 106, and the planarization layer 105.

[0105] The adhesive layer 130 can be configured to surround the cover layer 120 and the pixel unit 115. Together with the cover layer 120 and the encapsulation substrate 140, the adhesive layer 130 protects the organic light-emitting element 150 unit 115 of the pixel from external moisture, oxygen, impact, etc. The adhesive layer 130 may also include a moisture-absorbing material. The moisture-absorbing material may be or include hygroscopic particles and can absorb moisture and oxygen from the outside, thereby minimizing or reducing the penetration of moisture and oxygen into the pixel unit 115.

[0106] The encapsulation substrate 140 can be disposed on the adhesive layer 130. The encapsulation substrate 140, together with the adhesive layer 130, can protect the organic light-emitting element 150 of the pixel unit 115. The encapsulation substrate 140 can protect the organic light-emitting element 150 from external moisture, oxygen, impact, etc.

[0107] The adhesive layer 130 may be configured to be spaced apart from the end of the encapsulation substrate 140 by a predetermined distance or a selected distance, but is not limited thereto. In one embodiment, the adhesive layer 130 terminates at a position laterally offset from the end of the encapsulation substrate 140 by a certain distance. Figure 3 The middle is marked as "D" AE ".

[0108] As described above, in an electroluminescent display device, the minimum or reduced bezel distance (i.e., the reliable bezel L) (see...) Figure 3 This helps ensure reliability, such as preventing moisture penetration.

[0109] The reliable border L may include the distance measured from the end of the package substrate 140 to the end of the cathode 153.

[0110] In the non-display area NA, the outer region of the display area AA, excluding the reliable border L, can be referred to as the shadow area. When the cathode 153 and the organic layer 152 are deposited, the shadow area can include the gap between the mask and the substrate 101.

[0111] In one embodiment, the trench pattern 180 is formed in the shaded area and extends through the capping layer 120, cathode 153, organic layer 152, embankment layer, and planarization layer 105.

[0112] Figure 3 Two groove patterns 180 are shown, but this disclosure is not limited thereto. The groove pattern 180 may include a single groove pattern or multiple groove patterns of two or more groove patterns, but this disclosure does not limit the number of groove patterns 180.

[0113] The trench pattern 180 can be formed, for example, by removing the cover layer 120, cathode 153 and organic layer 152 in the shadow area outside the display area AA by laser ablation.

[0114] In the case of planarization layer 105 and embankment layer 106, the trench pattern 180 can be extended by one or more photolithography processes, but is not limited thereto.

[0115] When the laser width is 50 μm, the groove pattern 180 can have a width of approximately 70 μm, but is not limited to this. This takes into account the width of the region affected by laser heat (e.g., approximately 20 μm).

[0116] The interior of the groove pattern 180 may be filled with an adhesive layer 130, but this disclosure is not limited thereto. The material filling the groove pattern 180 can be any material, as long as it can prevent moisture penetration.

[0117] The passivation layer 185 used to protect the GIP unit 125 from laser ablation can be disposed on the bottom of the trench pattern 180 formed prior to the deposition of the organic layer 152, cathode 153 and capping layer 120, but is not limited thereto.

[0118] The passivation layer 185 can be formed of a transparent conductive material constituting the anode 151 to absorb 100% of the laser energy when using a laser with an ultraviolet spectrum of approximately 266 nm. The transparent conductive material may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc.

[0119] As described above, according to the first embodiment of this disclosure, by forming a trench pattern 180 in the passive shadow area to remove a portion of the cover layer 120, cathode 153, organic layer 152, planarization layer 105, and embankment layer 106, the rate at which moisture penetrates to the side surface of the non-display area NA can be delayed. In other words, the bezel width can be reduced by converting the shadow area into an area of ​​reliable bezel L.

[0120] Figure 4 This is a partial cross-sectional view of an electroluminescent display device according to one or more embodiments.

[0121] Except for the absence of groove pattern 180, Figure 4 The electroluminescent display device shown has the same characteristics as... Figure 3 The configuration is substantially the same as that of the electroluminescent display device according to the first embodiment of this disclosure.

[0122] Reference Figure 4 In the electroluminescent display device according to the comparative example, since the groove pattern 180 according to the first embodiment of this disclosure is absent, it can be seen that the length of the reliable border L' is greater than that of the groove pattern 180 according to the first embodiment of this disclosure. Figure 3 The reliable border L in the electroluminescent display device according to the first embodiment of the present disclosure. By including the groove pattern 180, the reliable border L can have a reduced length, such as Figure 3 As shown, this makes the non-display area NA thin.

[0123] Figures 5A to 5E It is shown in sequence. Figure 3 A cross-sectional view of a part of the manufacturing process of an electroluminescent display device.

[0124] Reference Figure 5A Various components of the pixel unit 115 are formed on the substrate 101.

[0125] As described above, the pixel unit 115 is formed in the display area AA of the substrate 101 and may include various components below the organic layer.

[0126] GIP units 125, including various components, can be formed in the non-display area NA of substrate 101.

[0127] The planarization layer 105 can be formed to extend into the non-display area NA to cover the GIP unit 125.

[0128] The planarization layer 105 can be formed at a predetermined distance or a selected distance from the end of the substrate 101 (in Figure 3 (The text is incomplete and cannot be translated accurately.)

[0129] The dam layer 106 can be formed in the area of ​​the planarization layer 105 other than the light-emitting area.

[0130] The embankment 106 can be formed to extend into the non-display area NA.

[0131] The embankment 106 may cover the upper part of the GIP unit 125, but is not limited thereto.

[0132] The embankment 106 and planarization layer 105 of the non-display area NA outside the display area AA can be selectively removed by a predetermined photolithography process or a selected photolithography process (including, for example, coating process, soft baking process, exposure process, development process and curing process), thereby forming the main trench pattern 180'.

[0133] In one embodiment, the main groove pattern 180' can be formed on three surfaces of the non-display area NA, excluding the lower end of the display panel (see...). Figure 1 (but not limited to this).

[0134] The main groove pattern 180' can be used to prevent moisture from penetrating to the side surface of the non-display area NA through the embankment layer 106 and the planarization layer 105.

[0135] After forming the main groove pattern 180', refer to Figure 5B A predetermined passivation layer 185 or a selected passivation layer 185 may be formed at the bottom of the main trench pattern 180'. In one embodiment, the passivation layer 185 is formed on the portion of the upper surface of the GIP unit 125 exposed by the main trench pattern 180'.

[0136] The passivation layer 185 can be formed of a transparent conductive material to absorb 100% of the laser when using a laser in the ultraviolet region with a wavelength of about 266 nm.

[0137] Transparent conductive materials may include indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0138] In one embodiment, the thickness of the passivation layer 185 is less than the thickness of the planarization layer 105.

[0139] Figure 5A and Figure 5B The example shown is the formation of a passivation layer 185 after the formation of a planarization layer 105 and a dam layer 106, but this disclosure is not limited thereto.

[0140] In one embodiment, when a transparent conductive material such as ITO is used to form the anode 151, ITO has an absorption rate of 100% in the ultraviolet spectrum. Therefore, the passivation layer 185 can be formed in the same process operation as the anode 151, which avoids the need for a separate process operation to form the passivation layer 185. When the anode is formed in the pixel unit 115, the passivation layer 185 can be formed on the bottom of the main trench pattern 180'. In one embodiment, when the anode is formed in the pixel unit 115, after forming the planarization layer 105 including the main trench pattern 180', the passivation layer 185 can be formed on the bottom of the main trench pattern 180' using the same process. Subsequently, a dam layer 106 including the main trench pattern 180' can be formed on the planarization layer 105.

[0141] Subsequently, refer to Figure 5C Organic layer 152, cathode 153 and capping layer 120 can be sequentially formed on substrate 101 on which the main trench pattern 180' is formed.

[0142] The organic layer 152 may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc.

[0143] The organic layer 152 can be formed to extend into the non-display area NA.

[0144] In the non-display area NA, the organic layer 152 can be disposed on the embankment layer 106.

[0145] The interior of the main groove pattern 180' can be filled with organic material that constitutes the organic layer 152.

[0146] The cathode 153 can be disposed on the organic layer 152.

[0147] The cathode 153 can be formed to extend into the non-display area NA.

[0148] In the non-display area NA, a cathode 153 can be formed to cover the organic layer 152.

[0149] The organic layer 152 can be formed at a predetermined distance or a selected distance from the end of the cathode 153 (in Figure 3 (The text is incomplete and cannot be translated accurately.)

[0150] The cathode 153 can be formed at a predetermined distance or a selected distance from the end of the embankment 106 (in Figure 3 (The text is incomplete and cannot be translated accurately.)

[0151] To reduce diffuse reflection of external light, a capping layer 120 made of a material with high refractive index and light absorption can be formed on the cathode 153.

[0152] The cover layer 120 may be an organic layer formed of organic material, and may be omitted in some embodiments.

[0153] The overlay 120 can be configured to extend into the non-display area NA.

[0154] Then, refer to Figure 5D A portion of the capping layer 120, cathode 153, organic layer 152, dam layer 106, and planarization layer 105 on the passivation layer 185 are sequentially removed by laser ablation using a predetermined laser or a selected laser, thereby forming a trench pattern 180. The portion of the trench pattern 180 extending through the capping layer 120, cathode 153, and organic layer 152 can be referred to as a "sub-trench pattern".

[0155] The groove pattern 180 can be used to prevent moisture from penetrating the side surface of the non-display area NA.

[0156] In the first embodiment of this disclosure, since the groove pattern 180 is also formed in the embankment 106 and the planarization layer 105, moisture can be effectively prevented from penetrating through the embankment 106 and the planarization layer 105 to the side surface of the non-display area NA.

[0157] Since the passivation layer 185, which can absorb 100% of the laser, is located at the bottom of the trench pattern 180, the GIP unit 125 disposed below it can be protected from laser ablation. Therefore, laser ablation can continue uninterruptedly through the region including the GIP unit 125, thereby achieving a high degree of freedom during the laser ablation process.

[0158] Subsequently, refer to Figure 5E The adhesive layer 130 and the encapsulation substrate 140 can be sequentially formed on the substrate 101 on which the cover layer 120 is formed.

[0159] The adhesive layer 130, together with the cover layer 120 and the encapsulation substrate 140, can protect the organic light-emitting element of the pixel unit 115 from external moisture, oxygen, impact, etc. The adhesive layer 130 may also include a moisture-absorbing material.

[0160] The interior of the groove pattern 180 can be filled with organic material of the adhesive layer 130.

[0161] The encapsulation substrate 140 can be disposed on the adhesive layer 130.

[0162] The adhesive layer 130 can be formed to be spaced apart from the end of the packaging substrate 140 by a predetermined distance or a selected distance (in Figure 3 (The text is incomplete and cannot be translated accurately.)

[0163] In the first embodiment of this disclosure, since the trench pattern 180 is formed in the shadow area outside the display area AA, the speed at which water penetrates to the side surface of the non-display area NA can be slowed down. That is, by converting the shadow area into a reliable border area, the border width can be reduced by an amount equal to the length of the reliable border.

[0164] In one embodiment, the trench pattern 280 may not extend into the planarization layer 105 and the embankment layer 106, as shown below. Figure 6 describe.

[0165] Figure 6 This is a cross-sectional view of an electroluminescent display device according to a second embodiment of the present disclosure.

[0166] exist Figure 6 In the second embodiment of this disclosure shown, the configuration of the groove pattern 280 differs from that described above. Figures 1 to 5E The described groove pattern 180 configuration, other configurations are the same as Figure 3 The configurations of the electroluminescent display devices according to the first embodiment of the present invention are substantially the same. Therefore, for the sake of brevity, repeated descriptions will be omitted. Similar reference numerals are used for similar components.

[0167] Reference Figure 6 In the electroluminescent display device according to the second embodiment of the present disclosure, the trench pattern 280 is formed such that the area from the cover layer 120 to the organic layer 152 outside the display area AA is removed therefrom.

[0168] In other words, the groove pattern 280 according to the second embodiment of this disclosure may not be formed in the planarization layer 105 and the embankment layer 106. Therefore, the GIP unit 125 can be protected from laser ablation by the embankment layer 106 and the planarization layer 105, and the passivation layer 185 is absent.

[0169] For example, the trench pattern 280 can be formed by removing the cover layer 120, cathode 153 and organic layer 152 in the shadow area outside the display area AA by laser ablation.

[0170] The interior of the groove pattern 280 may be filled with an adhesive layer 130, but this disclosure is not limited thereto.

[0171] In one embodiment, the trench pattern is formed over the underlying planarization layer, but the passivation layer may not be formed on the bottom of the trench pattern, as will be explained below. Figure 7 Describe it.

[0172] Figure 7 This is a cross-sectional view of an electroluminescent display device according to a third embodiment of the present disclosure.

[0173] exist Figure 7 In the third embodiment of this disclosure, the configuration of the groove pattern 380 differs from that in the reference embodiment. Figures 1 to 6 The described configuration, other configurations and Figure 6 The electroluminescent display devices shown are configured essentially the same. Therefore, for the sake of brevity, repeated descriptions will be omitted. Similar reference numerals are used for similar components.

[0174] Reference Figure 7 The electroluminescent display device according to the third embodiment of the present disclosure includes a groove pattern 380 extending through the cover layer 120 and into the planarization layer 105 in a region outside the display area AA.

[0175] The passivation layer 185 is not formed on the bottom of the trench pattern 380. In this case, the laser path during the laser ablation operation can be modified to avoid passing through the GIP unit 125.

[0176] The interior of the groove pattern 380 may be filled with an adhesive layer 130, but this disclosure is not limited thereto.

[0177] According to this disclosure, an inorganic layer may be formed additionally on the capping layer, as will be described below. Figure 8 Describe it.

[0178] Figure 8 This is a cross-sectional view of an electroluminescent display device according to the fourth embodiment of this disclosure.

[0179] exist Figure 8 In the fourth embodiment of this disclosure shown, the configuration of the trench pattern 480 and the inorganic layer 486 differs from that in the reference embodiment. Figures 1 to 7 The described configuration, other configurations and references Figure 2 The configuration described in the first embodiment of this disclosure is substantially the same. Therefore, for the sake of brevity, repeated descriptions will be omitted. Similar reference numerals are used for similar components.

[0180] Reference Figure 8 According to the fourth embodiment of the present disclosure, the electroluminescent display device includes an external groove pattern 480 located in the display area AA, the groove pattern 480 extending through the cover layer 120 and into the underlying planarization layer 105.

[0181] The passivation layer 185 may be disposed on the bottom of the trench pattern 480, but is not limited thereto.

[0182] An inorganic layer 486 formed of an inorganic insulating material may be disposed on the capping layer 120. The inorganic layer 486 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0183] The inorganic layer 486 can be formed to cover the upper part of the capping layer 120 and the side surfaces of the capping layer 120, the cathode 153 and the organic layer 152.

[0184] The interior of the groove pattern 480 may be filled with an inorganic layer 486, but this disclosure is not limited thereto.

[0185] In the fourth embodiment of this disclosure, by forming an inorganic layer 486 on the cover layer 120, moisture penetration above the organic layer 152 can be slowed down, and defects caused by dents or foreign matter can be reduced.

[0186] In one embodiment, the groove pattern of this disclosure can be divided into multiple patterns instead of a continuous single pattern, as will be described below. Figure 9 Describe it.

[0187] Figure 9 This is a plan view of an electroluminescent display device according to the fifth embodiment of this disclosure.

[0188] exist Figure 9 In the fifth embodiment of this disclosure shown, the configuration of the groove pattern 580 differs from that in the reference embodiment. Figures 1 to 8 The described configuration, other configurations and Figure 1 The configuration of the electroluminescent display device according to the first embodiment of this disclosure is substantially the same. Therefore, for the sake of brevity, repeated descriptions will be omitted. Similar reference numerals are used for similar components.

[0189] Reference Figure 9 The electroluminescent display device according to the fifth embodiment of this disclosure may include a display panel 100, a flexible film 160, and a printed circuit board 170.

[0190] In the fifth embodiment of this disclosure, the groove pattern 580 is formed in a portion of the non-display area NA outside the display area AA.

[0191] The trench pattern 580 can be formed such that the area from the cover layer 120 to the planarization layer 105 is removed therefrom, but is not limited thereto.

[0192] According to the fifth embodiment of this disclosure, the groove pattern 580 can be formed above three surfaces of the non-display area NA, excluding the lower end of the display panel 100 connected to the flexible film 160, but this disclosure is not limited thereto.

[0193] exist Figure 9 The illustration shows a case where the groove pattern 580 is divided into multiple sections to form two columns, but this disclosure is not limited thereto. The groove pattern 580 may be divided into multiple sections to form one, two, or more columns, but this disclosure is not limited to the number of columns in the groove pattern 580.

[0194] Furthermore, the groove pattern of this disclosure can be set in multiple groove patterns of three or more groove patterns, as will be referred to below. Figure 10 and Figure 11 Describe it.

[0195] In one embodiment, the formation of the trench pattern 580 includes one or more laser ablation operations. In each laser ablation operation, as the laser travels along the path of each trench pattern 580, the laser can be pulsed to form two or more trench segments 580S.

[0196] Figure 10 This is a plan view of an electroluminescent display device according to the sixth embodiment of this disclosure.

[0197] Figure 11 It is along Figure 10 A cross-sectional view taken by line X-X'.

[0198] For example, Figure 11 A cross-section of a portion of the right side of a display panel 100 in which a groove pattern 680 is formed is shown.

[0199] exist Figure 10 and Figure 11 In the sixth embodiment of this disclosure shown, the configuration of the groove pattern 680 differs from the previous description, and other configurations are also different from those described above. Figures 1 to 3 The configuration of the electroluminescent display device according to the first embodiment of this disclosure is substantially the same. Therefore, repeated descriptions will be omitted for the sake of brevity. Similar reference numerals are used for similar components.

[0200] Reference Figure 10 and 11 The electroluminescent display device according to the sixth embodiment of the present disclosure may include a display panel 100, a flexible film 160, and a printed circuit board 170.

[0201] In the sixth embodiment of this disclosure, the groove pattern 680 is formed in the portion of the non-display area NA outside the display area AA.

[0202] According to the sixth embodiment of this disclosure, the groove pattern 680 can be formed on three surfaces of the non-display area NA, excluding the lower end of the display panel 100 connected to the flexible film 160, but is limited to this.

[0203] exist Figure 10 The example shown is a case of setting three groove patterns 680, but this disclosure is not limited thereto.

[0204] The trench pattern 680 according to the sixth embodiment of this disclosure may include at least one first trench pattern 680a and at least one second trench pattern 680a, wherein the region from the capping layer 120 to the underlying planarization layer 105 is removed from the first trench pattern 680a, and the region from the capping layer 120 to the organic layer 152 is removed from the second trench pattern 680b, but this disclosure is not limited thereto. In one embodiment, the second trench pattern 680b is located on the embankment layer 106. In one embodiment, the first trench pattern 680a is located on the GIP unit 125.

[0205] As an example, Figure 10 and Figure 11 The illustration shows a configuration with two first trench patterns 680a and a second trench pattern 680b between the two first trench patterns 680a, but the present disclosure is not limited thereto. In this case, a passivation layer 185 may additionally be disposed on the bottom of the first trench pattern 680a, but is not limited thereto.

[0206] The first groove pattern 680a and the second groove pattern 680b can be set alternately.

[0207] The second groove pattern 680b may be disposed between the first groove patterns 680a. In one embodiment, two or more second groove patterns 680b are disposed between an adjacent pair of first groove patterns 680a.

[0208] Furthermore, as long as the first groove pattern 680a and the second groove pattern 680b according to the sixth embodiment of this disclosure have different shapes, they can be configured here by applying various forms of the first embodiment to the fifth embodiment of this disclosure as described above.

[0209] The interior of the first groove pattern 680a and the second groove pattern 680b may be filled with an adhesive layer 130, but this disclosure is not limited thereto.

[0210] The embodiments of the present invention can also be described as follows:

[0211] According to an embodiment of this disclosure, an electroluminescent display device is provided. The electroluminescent display device includes: a display panel having a display area and a non-display area; a planarization layer and a dam layer extending to the non-display area of ​​the display panel; an organic layer and a cathode disposed on the dam layer and extending to the non-display area of ​​the display panel; a trench pattern disposed in the non-display area outside the display area, wherein the cathode and the organic layer are removed from the trench pattern; an adhesive layer and an encapsulation substrate disposed above the cathode, wherein the adhesive layer covers the trench pattern.

[0212] The groove pattern can be set above three surfaces in the non-display area, excluding the lower end of the display panel connected to the flexible film.

[0213] The electroluminescent display device may also include a capping layer disposed on the cathode, wherein the capping layer, cathode, and organic layer may be removed in the trench pattern.

[0214] The electroluminescent display device may also include gate in-plane (GIP) units disposed in a non-display area, wherein the planarization layer may extend into the non-display area to cover the GIP units.

[0215] The embankment can be set in the remaining areas of the planarization layer except for the light-emitting area, and can extend into the non-display area to cover the upper part of the GIP unit.

[0216] The adhesive layer and encapsulation substrate can extend into the non-display area to cover a portion of the planarization layer and the embankment layer.

[0217] The groove pattern can be provided as one groove pattern or two or more groove patterns.

[0218] The capping layer, cathode, organic layer, embankment layer, and planarization layer can be removed from the trench pattern.

[0219] The trench pattern can be set above the GIP cell, and the passivation layer can be set on the bottom inside the trench pattern.

[0220] The passivation layer can be made of a transparent conductive material that forms the anode of the display area.

[0221] Transparent conductive materials may include indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0222] The interior of the groove pattern can be filled with an adhesive layer.

[0223] The electroluminescent display device may also include an inorganic layer disposed on the cover layer, wherein the interior of the groove pattern may be filled with the inorganic layer.

[0224] The inorganic layer can be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0225] The inorganic layer can be configured to cover the upper part of the capping layer as well as the side surfaces of the capping layer, cathode, and organic layer.

[0226] The groove pattern can be divided into multiple groove patterns.

[0227] The trench pattern may include at least one first trench pattern in which the area from the capping layer down to the planarization layer can be removed and at least one second trench pattern in which the area from the capping layer down to the organic layer can be removed.

[0228] The first groove pattern and the second groove pattern can be set alternately.

[0229] The second groove pattern can be set between the first groove patterns.

[0230] According to another embodiment of this disclosure, an electroluminescent display device is provided. The electroluminescent display device includes: a substrate having a display area and a non-display area; a planarization layer disposed on the substrate; a dam layer disposed above the planarization layer; an organic layer; a cathode; and a capping layer disposed on the dam layer and extending to the non-display area of ​​the substrate; at least one trench pattern disposed in the non-display area outside the display area, wherein the capping layer, cathode, organic layer, dam layer, and planarization layer are removed; a passivation layer disposed at the bottom inside the trench pattern; an adhesive layer filling the interior of the trench pattern and disposed above the substrate; and an encapsulation substrate disposed on the adhesive layer.

[0231] The various embodiments described above can be combined to provide further embodiments. All U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications, and non-patent publications mentioned in and / or listed in the application data sheets are incorporated herein by reference in their entirety. If it is necessary to employ the concepts of various patents, applications, and publications to provide additional embodiments, aspects of the embodiments may be modified.

[0232] These and other changes can be made to the embodiments based on the detailed description above. Generally, the terminology used in the appended claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full scope of equivalents enjoyed by such claims. Therefore, the claims are not limited by this disclosure.

[0233] Cross-reference to related applications

[0234] This application claims the benefit and priority of Korean Patent Application No. 10-2020-0147366, filed in Korea on November 6, 2020, the entire contents of which are hereby expressly incorporated by reference.

Claims

1. An electroluminescent display device, the electroluminescent display device comprising: The display panel includes a substrate, and the substrate includes a display area and a non-display area. A planarization layer, the planarization layer being located above the non-display area; A dike layer, which is located on the planarization layer; An organic layer, which is located on the embankment layer; A cathode, located on the embankment and extending into the non-display area of ​​the display panel; A trench pattern is provided in the non-display area and located where the cathode and the organic layer have been removed; An adhesive layer is located above the cathode and the trench pattern; as well as A packaging substrate, located above the cathode and the adhesive layer. The cathode has its vertical end, which is located outside the trench pattern, covering the end of the organic layer.

2. The electroluminescent display device according to claim 1, in, The display panel includes multiple ends, one of which is connected to a flexible film and does not have the groove pattern. The groove pattern is disposed above the other ends of the plurality of ends.

3. The electroluminescent display device according to claim 1, further comprising: A capping layer is disposed on the cathode, and the trench pattern extends through the capping layer.

4. The electroluminescent display device according to claim 3, wherein, The trench pattern extends through the embankment and the planarization layer.

5. The electroluminescent display device according to claim 3, further comprising: An inorganic layer is disposed on the cover layer, wherein the groove pattern is filled with the inorganic layer.

6. The electroluminescent display device according to claim 5, wherein, The inorganic layer is made of silicon oxide, silicon nitride, or a multilayer of silicon oxide and silicon nitride.

7. The electroluminescent display device according to claim 5, wherein, The inorganic layer is configured to cover the upper part of the capping layer and the side surfaces of the capping layer, the cathode, and the organic layer.

8. The electroluminescent display device according to claim 3, wherein, The groove pattern includes: At least one first trench pattern, the at least one first trench pattern extending through the planarization layer; and At least one second trench pattern, the at least one second trench pattern being located on the embankment layer.

9. The electroluminescent display device according to claim 8, wherein, The second groove pattern is disposed between a pair of adjacent first groove patterns.

10. The electroluminescent display device according to claim 1, further comprising: An in-board gate IP cell is provided, wherein the IP cell is disposed in the non-display area, and the planarization layer extends to the non-display area to cover the IP cell.

11. The electroluminescent display device according to claim 10, wherein, The embankment is formed on the planarization layer in the area excluding the light-emitting area and covers the upper part of the GIP unit.

12. The electroluminescent display device according to claim 10, wherein, The trench pattern is disposed above the GIP unit, wherein the passivation layer is disposed at the bottom of the trench pattern.

13. The electroluminescent display device according to claim 12, wherein, The passivation layer includes a transparent conductive material, the composition of which is the same as that of the anode of the display area.

14. The electroluminescent display device according to claim 13, wherein, The transparent conductive material includes indium tin oxide, indium zinc oxide, or indium gallium zinc oxide.

15. The electroluminescent display device according to claim 1, wherein, The adhesive layer and the encapsulation substrate cover a portion of the dike layer and the planarization layer.

16. The electroluminescent display device according to claim 1, wherein, The groove pattern includes two or more groove segments.

17. The electroluminescent display device according to claim 1, wherein, The groove pattern is filled with the adhesive layer.

18. An electroluminescent display device, the electroluminescent display device comprising: A substrate, the substrate including a display area and a non-display area; A planarization layer is disposed on the substrate; A dike layer, wherein the dike layer is disposed above the planarization layer; Multiple functional layers are disposed on the non-display area of ​​the substrate on the embankment layer; At least one trench pattern, the at least one trench pattern being located in the non-display area, the at least one trench pattern extending through the plurality of functional layers, the embankment layer, and the planarization layer; A passivation layer is disposed in the trench pattern; An adhesive layer is located on the passivation layer and fills the trench pattern; as well as A packaging substrate, wherein the packaging substrate is disposed on the adhesive layer. The plurality of functional layers include a cathode and an organic layer; and The cathode has a vertical end that covers the organic layer at the end outside the at least one trench pattern.

19. The electroluminescent display device according to claim 18, wherein, The plurality of functional layers also include a cover layer on the cathode.

20. A method for manufacturing an electroluminescent display device, the method comprising the following steps: A planarization layer is formed on the non-display area of ​​the substrate; A dike layer is formed on the planarization layer; Multiple functional layers are formed on the embankment; Forming trenches that extend through the plurality of functional layers; An adhesive layer is deposited into the trench; as well as The packaging substrate is attached to the adhesive layer located above the trench. The plurality of functional layers include a cathode and an organic layer; and The cathode has a vertical end that covers the organic layer at the end outside the trench.

21. The method according to claim 20, wherein, The steps for forming the trench include the following: The main trench pattern is formed by at least one photolithography operation, creating trenches that pass through the embankment and the planarization layer; and The sub-groove pattern is formed by at least one laser ablation operation, which creates a groove pattern that passes through the multiple functional layers.

22. The method according to claim 20, wherein, The plurality of functional layers also include a cover layer on the cathode.

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