An electroplating clamp and electroplating hanger

Abstract

This invention relates to the field of electroplating technology and discloses an electroplating clamp and an electroplating fixture. The electroplating clamp includes a first clamping arm and a second clamping arm. A plurality of first clamping claws are spaced apart on the first clamping arm, and a plurality of second clamping claws are spaced apart on the second clamping arm. At least one of the first and second clamping arms is movable relative to the other, allowing the plurality of first and second clamping claws to clamp or release the sheet to be electroplated. The first and / or second clamping claws are made of multiple conductive wires arranged sequentially. The conductive wires are conductive and elastic, and the clamping surface formed by the arrangement of the multiple conductive wires intersects with the grid lines on the sheet, so that at least a portion of the conductive wires abut against the grid lines on the sheet. The electroplating clamp proposed in this invention can fully utilize the grid lines on the sheet for clamping, eliminating the need for additional conductive clamping points. Moreover, it eliminates the need for precise positioning of the clamping points of the first and second clamping claws on the sheet, greatly improving the sheet clamping efficiency.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an electroplating clamp and an electroplating hanger. Background Technology

[0002] Currently, commercially available solar cells primarily use printed silver paste to create conductive grid lines, resulting in high processing costs. Electroplating technology, as a novel electrode preparation method, is being increasingly researched. Compared to silver paste-printed electrodes, electroplated electrodes have a higher aspect ratio and better conductivity, reducing the cell's internal resistance and minimizing losses due to shading, thereby further improving the solar cell's photoelectric conversion efficiency. Electroplating, as a promising electrode preparation method, can significantly reduce the cost of solar cell manufacturing processes.

[0003] In existing electroplating processes, electroplating clamps are required to hold solar cells. Using traditional electroplating clamps requires pre-reserving electroplating clamping points on the solar cells, which creates additional surface shading and affects power generation efficiency. Furthermore, the electroplating clamps need to be precisely aligned with the clamping points on the solar cells, resulting in low clamping efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide an electroplating clamp that eliminates the need for additional conductive clamping points when clamping solar cells, utilizing the existing grid lines on the solar cells for both clamping and conduction; the clamping process requires low alignment accuracy, thereby improving clamping efficiency.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An electroplating clamp, comprising:

[0007] A first gripper arm, having a plurality of first grippers spaced apart thereon; and

[0008] The second gripper arm has multiple second grippers spaced apart on it;

[0009] At least one of the first clamping arm and the second clamping arm is movable relative to the other, so that the plurality of first jaws and the plurality of second jaws can clamp or release the electroplated sheet;

[0010] The first gripper and / or the second gripper are made of a plurality of conductive wires arranged in sequence. The conductive wires are conductive and elastic. The clamping surface formed by the arrangement of the plurality of conductive wires can intersect with the grid lines on the sheet so that at least a portion of the conductive wires can abut against the grid lines on the sheet.

[0011] As an alternative to the aforementioned electroplating clip, the conductive wire is made of metal.

[0012] As an optional embodiment of the above-mentioned electroplating clamp, the electroplating clamp further includes:

[0013] A first clamping plate and a second clamping plate are connected to the first clamping arm, and the first clamping plate and the second clamping plate are arranged opposite to each other to clamp the first clamping claw;

[0014] A third clamping plate and a fourth clamping plate are connected to the second clamping arm, and the third clamping plate and the fourth clamping plate are arranged opposite to each other to clamp the second clamping claw.

[0015] As an alternative to the above-mentioned electroplating clamp, one of the first clamping plate and the second clamping plate is integrally formed with the first clamping arm, and one of the third clamping plate and the fourth clamping plate is integrally formed with the second clamping arm.

[0016] As an alternative to the above-mentioned electroplating clamp, all the first jaws are electrically connected, and / or all the second jaws are electrically connected.

[0017] As an alternative to the above-mentioned electroplating clamp, when the electroplating clamp holds the sheet, each of the first jaws and each of the second jaws are aligned one to one.

[0018] As an alternative to the above-mentioned electroplating clamp, the first clamping arm is pivotally connected to the second clamping arm, and the electroplating clamp further includes a driving part configured to drive the first clamping arm to rotate about a pivot axis with respect to the second clamping arm.

[0019] As an alternative to the above-mentioned electroplating clamp, the electroplating clamp further includes a first holding portion, which is configured to hold the position of the driving portion so that the plurality of first grippers hold the sheet material with the plurality of second grippers.

[0020] An electroplating fixture, comprising the electroplating clips as described above.

[0021] As an optional solution for the above-mentioned electroplating rack, the electroplating rack further includes a support frame fixedly connected to the first clamping arm or the second clamping arm. A clip is provided at one end of the support frame away from the first clamping arm and the second clamping arm. The clip can hold the first end of the sheet. The first clamping arm and the second clamping arm can hold the second end of the sheet. The first end and the second end are the two opposite ends of the sheet.

[0022] The beneficial effects of this invention are:

[0023] The electroplating clamp proposed in this invention, when the first and second jaws clamp the sheet, allows each conductive wire to be independent and flexible. The conductive wire aligned with the sheet's grid lines can be inserted into the grid lines, thus applying electricity to the sheet. This fully utilizes the grid lines on the sheet for clamping, eliminating the need for additional conductive clamping points. Furthermore, as long as at least one conductive wire is aligned with the grid line, precise positioning of the clamping points of the first and second jaws on the sheet is unnecessary, significantly improving the sheet clamping efficiency.

[0024] The electroplating fixture proposed in this invention improves the clamping efficiency during sheet electroplating. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the electroplating fixture provided by the present invention;

[0026] Figure 2 This is a schematic diagram of the silicon wafer structure provided by the present invention;

[0027] Figure 3 This is a partial exploded view of the electroplating clamp provided by the present invention;

[0028] Figure 4 yes Figure 1 Enlarged view of point A in the middle.

[0029] In the picture:

[0030] 100, Electroplating clip; 200, Support frame; 210, Card holder; 211, Card slot; 300, Silicon wafer; 310, Main bus line;

[0031] 1. First clamping arm; 2. Second clamping arm; 3. First gripper; 4. Second gripper; 5. First clamping plate; 6. Second clamping plate; 7. Third clamping plate; 8. Fourth clamping plate; 9. Conductive sheet; 10. Driving unit; 11. First holding unit. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0033] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0036] This embodiment provides an electroplating rack that can be used in an immersion plating production line to hold sheets (such as circuit boards, silicon wafers, etc.) to be immersion plated.

[0037] Please see Figure 1 The electroplating rack includes a support frame 200 and an electroplating clamp 100 mounted on the support frame 200. The support frame 200 and the electroplating clamp 100 are used to clamp the sheet material to be immersed in the electroplating rack, so that the sheet material is stably fixed on the electroplating rack. The electroplating clamp 100 is connected to a hanging arm (not shown in the figure). The hanging arm can be transported by external hoisting equipment and hung on the conveyor device of the immersion plating production line to form a transmission connection with the conveyor device, and is then driven by the conveyor device to move along the immersion plating tank. The part of the electroplating clamp 100 that clamps the sheet material needs to be in contact with the metal parts on the sheet material so that an electric current can be applied to the sheet material. When the metal parts on the sheet material come into contact with the electroplating solution in the immersion plating tank, a displacement reaction occurs, thereby generating the desired metal deposition layer on the surface of the metal parts.

[0038] Specifically, in this embodiment, the support frame 200 is preferably a rectangular frame, the electroplating clamp 100 is disposed at the upper end of the support frame 200, and the lower end of the support frame 200 is provided with a card holder 210, which is provided with a card slot 211. When the sheet is placed in the frame space formed by the support frame 200, the bottom end of the sheet can be held in the card slot 211 of the card holder 210, while the top end of the sheet, which is opposite to the bottom end of the sheet, is held and fixed by the electroplating clamp 100, so that the sheet is securely fixed on the electroplating hanger and is approximately in the same plane as the support frame 200, thus preventing the sheet from being disturbed by the electroplating liquid when it moves with the support frame 200.

[0039] It is understood that the card slot 211 should be oriented in the direction of the extension of the bottom edge of the sheet. The card holder 210 preferably supports at least both ends or near both ends of the bottom edge of the sheet to provide a stable supporting effect. Depending on the specific structure of the card holder 210, there may be only one card holder 210 or more. For example, when the card holder 210 has sufficient length to form a sufficiently long card slot 211, only one card holder may be provided; while when the length of the card holder 210 is shorter, two or more card holders need to be provided at intervals to achieve the aforementioned purpose of stably supporting the sheet.

[0040] Alternatively, in other embodiments, an electroplating clip 100 can be provided at the bottom of the support frame 200 to replace the card tray 210 or as a supplementary clamping structure for the card tray 210. The implementer can select based on the specific structure, weight and other factors of the sheet to be electroplated, and no specific restrictions are imposed here.

[0041] This embodiment also specifically provides an electroplating clamp 100, which can solve the problem mentioned in the background art that additional conductive clamps on the silicon wafer 300 cause additional surface shading to the silicon wafer 300. For example... Figure 2 The structure of silicon wafer 300 is shown. Multiple main gate lines 310 are provided on silicon wafer 300. The electroplating process of the main gate lines 310 on silicon wafer 300 will be described in detail below.

[0042] Please continue reading. Figure 1 and combined Figure 3The electroplating clamp 100 includes a first clamping arm 1 and a second clamping arm 2. The first clamping arm 1 has multiple first grippers 3 made of sequentially arranged conductive wires spaced apart, and the second clamping arm 2 has multiple second grippers 4 also made of sequentially arranged conductive wires spaced apart. When not clamping the silicon wafer 300, the clamping ends formed by the multiple conductive wires create a flush clamping surface. At least one of the first clamping arm 1 and the second clamping arm 2 can move relative to the other, allowing the multiple first grippers 3 and the multiple second grippers 4 to clamp or release the silicon wafer 300 to be electroplated. In this embodiment, the conductive wires are metal wires made of a metallic material, preferably elastic steel wire, which has good processability and high structural strength.

[0043] Specifically, the conductive wires are conductive and elastic. The clamping surface formed by multiple conductive wires can intersect with the main gate line 310 on the silicon wafer 300, so that at least some of the conductive wires can abut against the main gate line 310 on the silicon wafer 300. When the first clamping arm 1 and the second clamping arm 2 move towards each other to the clamping position, that is, when the first clamping claw 3 and the second clamping claw 4 press against the two sides of the silicon wafer 300 respectively, since each metal wire is independent and has a certain degree of flexibility, the metal wire facing the main gate line 310 of the silicon wafer 300 can be inserted into the main gate line 310, thereby applying electricity to the silicon wafer 300. By setting the first clamp 3 and the second clamp 4 as a structure with multiple metal wires, it is not necessary to set conductive clamping points on the silicon wafer 300 with a clamping surface no smaller than that of the first clamp 3 and the second clamp 4. The first clamp 3 and the second clamp 4 span the main gate line 310, and circuit connection can be achieved by having at least one metal wire abut against the main gate line 310. This effectively reduces the clamping point area on the silicon wafer 300 and increases the effective working surface of the silicon wafer 300.

[0044] Preferably, the widths of the first gripper 3 and the second gripper 4 are greater than the width of the main gate line 310. During clamping, any metal wire can be inserted into the main gate line 310 to achieve circuit connection. Therefore, there is no need to precisely position the clamping points of the first gripper 3 and the second gripper 4 on the silicon wafer 300; as long as at least one metal wire is aligned with the main gate line 310, it is sufficient, which greatly improves the clamping efficiency of the silicon wafer 300 on the electroplating fixture. On the other hand, since the metal wire has a certain degree of elasticity, it can undergo elastic deformation to offset the redundant clamping force applied to the silicon wafer 300 by the first gripper arm 1 and the second gripper arm 2, preventing the silicon wafer 300 from being broken and scrapped due to excessive clamping force. Meanwhile, in this embodiment, since the first gripper 3 and the second gripper 4 are elastic and non-rigidly connected to each other, the first gripper 3 and the second gripper 4 can compensate for the thickness difference of each clamping point of the silicon wafer 300 or other sheet (i.e. the clamping part of the electroplating clamp 100), and avoid poor connection and disconnection of the circuit of the electroplating clamp 100 to the silicon wafer 300 during the electroplating process.

[0045] It should be noted that, depending on the arrangement of the main gate lines 310 on the silicon wafer 300—that is, whether the silicon wafer 300 has main gate lines 310 on only one side or on both sides—the first clamping claw 3 and / or the second clamping claw 4 must be made of conductive material accordingly. Taking a silicon wafer 300 used for producing bifacial solar cells as an example, where main gate lines 310 are arranged on both sides, the electroplating clamp 100 should have at least enough first clamping claws 3 and enough second clamping claws 4 to clamp the main gate lines 310 on both sides of the silicon wafer 300, respectively, to form a circuit connection with each main gate line 310, thereby electroplating the surface of all main gate lines 310 to form the required metal layer.

[0046] For example, if the first gripper 3 or the second gripper 4 does not need to be conductive, the first gripper 3 or the second gripper 4 can be made of a non-conductive material, or the first gripper 3 or the second gripper 4 made of a conductive material can be coated with adhesive to prevent the first gripper 3 / second gripper 4 from forming electroplated metal residue on the surface of the silicon wafer 300 after immersion plating and clamping the area of ​​the silicon wafer 300 where the main gate line 310 is not provided. This ensures that the appearance quality and light-receiving area of ​​the silicon wafer 300 are not affected by the aforementioned electroplated metal residue.

[0047] Furthermore, to facilitate the installation of the metal wire, such as Figure 1 and Figure 4 As shown, the electroplating clamp 100 also includes a first clamping plate 5 and a second clamping plate 6 connected to the first clamping arm 1. The first clamping plate 5 and the second clamping plate 6 are arranged opposite each other to clamp the first clamping jaw 3. One of the first clamping plates 5 and 6 is integrally formed with the first clamping arm 1. In this embodiment, the first clamping plate 5 is integrally formed with the first clamping arm 1, and the second clamping plate 6 is independently set. After clamping the first clamping jaw 3, the second clamping plate 6 is fixedly connected to the first clamping plate 5 by fasteners or direct welding. The electroplating clamp 100 also includes a third clamping plate 7 and a fourth clamping plate 8 connected to the second clamping arm 2. The third clamping plate 7 and the fourth clamping plate 8 are arranged opposite each other to clamp the second clamping jaw 4. One of the third clamping plate 7 and the fourth clamping plate 8 is integrally formed with the second clamping arm 2. The arrangement of the third clamping plate 7 and the fourth clamping plate 8 is the same as that of the first clamping plate 5 and the second clamping plate 6, and will not be described again here.

[0048] Furthermore, to ensure that all first grippers 3 and / or all second grippers 4 uniformly apply electricity to the silicon wafer 300 to guarantee the electroplating effect, all first grippers 3 are electrically connected, and / or all second grippers 4 are electrically connected. The first gripping arm 1, the first clamping plate 5, and the second clamping plate 6 can be made of conductive materials to achieve the electrical connection between all first grippers 3. Similarly, the second gripping arm 2, the third clamping plate 7, and the fourth clamping plate 8 can be made of conductive materials. Of course, in other embodiments, the implementer may also use conductors such as wires or conductive sheets 9 to connect the individual first grippers 3 / second grippers 4; no specific limitation is made here.

[0049] In this embodiment, since both the first gripper 3 and the second gripper 4 need to apply electricity to the silicon wafer 300, such as Figure 1 As shown, conductors such as wires or conductive sheets 9 can be used to connect the first clamping arm 1 and the second clamping arm 2 so that all the first clamping jaws 3 and all the second clamping jaws 4 are electrically connected.

[0050] In the prior art, silicon wafers 300 are typically held stably by a dense arrangement of first clamps 3 and second clamps 4. However, since the number of main gate lines 310 on the silicon wafer 300 is limited, redundant first clamps 3 and second clamps 4 can easily cause surface defects after electroplating. Therefore, in this embodiment, the number of first clamps 3 and second clamps 4 depends on the number of main gate lines 310 on the silicon wafer 300. To ensure that the limited number of first clamps 3 and second clamps 4 can stably hold the silicon wafer 300, the main gate lines 310 on the front and back sides of the silicon wafer 300 are preferably symmetrically arranged. This ensures that when the electroplating clamp 100 holds the silicon wafer 300, each first clamp 3 and each second clamp 4 are aligned one-to-one, preventing the silicon wafer 300 from deflecting due to asymmetrical forces when the first clamps 3 and second clamps 4 are staggered, thus ensuring electroplating quality.

[0051] When the main gate lines 310 on both the front and back sides of the silicon wafer 300 cannot be unavoidably configured as an asymmetrical structure, auxiliary grippers (not shown in the figure) can be added to the first gripping arm 1 and the second gripping arm 2. These auxiliary grippers can be made of elastic non-conductive material, or have insulating treatments such as coating on the surface of conductive material. Furthermore, these auxiliary grippers can be evenly distributed on the first gripping arm 1 and the second gripping arm 2 to ensure that the silicon wafer 300 is held stably and to prevent deflection.

[0052] In this embodiment, the first clamping arm 1 and the second clamping arm 2 are pivotally connected. The second clamping arm 2 is fixedly mounted to the support frame 200, meaning that the first clamping arm 1 can rotate away from the second clamping arm 2 to allow the silicon wafer 300 to move in or out between the first clamping arm 1 and the second clamping arm 2. Of course, in other embodiments, the first clamping arm 1 can be alternatively fixedly mounted to the support frame 200, and the second clamping arm 2 can rotate away from the first clamping arm 1, or both the first clamping arm 1 and the second clamping arm 2 can be pivotally mounted to the support frame 200 so that they can rotate separately. This is not limited here.

[0053] like Figure 1 As shown, to facilitate handling of the first clamping arm 1, in this embodiment, the electroplating clamp 100 further includes a driving part 10, which is configured to drive the first clamping arm 1 to rotate about a pivot with the second clamping arm 2. Specifically, the driving part 10 may be a handle that is fixedly connected to the first clamping arm 1 and extends away from the first clamping arm 1 and is suitable for manual operation. The handle may be further connected to an electric or pneumatic actuator (such as an electric push rod, cylinder, etc.) to facilitate the electrically controlled rotation of the first clamping arm 1.

[0054] To facilitate the dip-plating operation, the electroplating clamp 100 also includes a first holding part 11. The first holding part 11 is configured to hold the position of the driving part 10 so that the plurality of first grippers 3 hold the silicon wafer 300 with the plurality of second grippers 4. That is, when the first gripper 3 is in the position of engaging with the second gripper 4 to hold the silicon wafer 300, the first holding part 11 can act on the driving part 10 to restrict the movement of the first gripper 3 by means of the driving part 10.

[0055] For example, the first retaining part 11 can be a lock fixedly mounted on the support frame 200, used to lock the drive unit 10. Alternatively, the first retaining part 11 can be an axially retractable pin, which, when the first gripper 3 is in the position where it engages with the second gripper 4 to hold the silicon wafer 300, can precisely extend into the rotation path of the drive unit 10 to restrict the movement of the drive unit 10. Figure 1 As shown, this embodiment utilizes the functions of the magnetic latch assembly driving part 10 and the first holding part 11 disclosed in patent document CN206143342U. Those skilled in the art can also use other locking structures already disclosed in the prior art as the aforementioned first holding part 11, which will not be elaborated upon here.

[0056] In addition, in order to maintain the axial position of the first jaw 3 and the second jaw 4 along their pivots, so that after the first clamping arm 1 and the second clamping arm 2 have rotated repeatedly, each of the first jaw 3 and each of the second jaw 4 can still clamp the silicon wafer 300 in a one-to-one correspondence, the electroplating clamp 100 provided in this embodiment preferably also includes a second holding part (not shown in the figure).

[0057] The second retaining part can be a double-nut structure respectively disposed at both ends of the pivot of the first clamping arm 1 and the second clamping arm 2. The two double-nut structures abut against both ends of the pivot of the first clamping arm 1 (i.e., the part sleeved on the pivot of the first clamping arm 1 and the second clamping arm 2). Since the second clamping arm 2 is directly fixed to the support frame 200, the two double-nut structures restrict the axial movement of the first clamping arm 1 along the pivot, thereby ensuring that the axial position of the first clamping jaw 3 and the second clamping jaw 4 along the pivot remains unchanged. Those skilled in the art can also use the limiting structure disclosed in the prior art as the above-mentioned second retaining part, which will not be described in detail here.

[0058] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. An electroplating clamp, characterized by, The electroplating clamp comprises: a first clamping arm (1) provided with a plurality of first clamping claws (3) at intervals; a second clamping arm (2) provided with a plurality of second clamping claws (4) at intervals; at least one of the first clamping arm (1) and the second clamping arm (2) is movable relative to the other, so that the plurality of first clamping claws (3) and the plurality of second clamping claws (4) can clamp or release the electroplated sheet; the first clamping claw (3) and / or the second clamping claw (4) is made of a plurality of conductive wires arranged in sequence, the conductive wires can conduct electricity and have elasticity, and the clamping surface formed by the plurality of conductive wires can intersect the grid lines on the sheet, so that at least part of the conductive wires can abut against the grid lines on the sheet; a first clamping plate (5) and a second clamping plate (6) connected to the first clamping arm (1), the first clamping plate (5) and the second clamping plate (6) are oppositely arranged to clamp the first clamping claw (3); a third clamping plate (7) and a fourth clamping plate (8) connected to the second clamping arm (2), the third clamping plate (7) and the fourth clamping plate (8) are oppositely arranged to clamp the second clamping claw (4). The conductive wires are made of metal materials.

2. The electroplating cell defined in claim 1, wherein One of the first clamping plate (5) and the second clamping plate (6) is integrally formed with the first clamping arm (1), and one of the third clamping plate (7) and the fourth clamping plate (8) is integrally formed with the second clamping arm (2).

3. The electroplating cell defined in claim 1, wherein All the first clamping claws (3) are electrically connected, and / or all the second clamping claws (4) are electrically connected.

4. The electroplating cell defined in claim 1, wherein When the electroplating clamp clamps the sheet, each first clamping claw (3) and each second clamping claw (4) are aligned one by one.

5. The electroplating cell defined in claim 1, wherein The first clamping arm (1) and the second clamping arm (2) are pivotally connected, and the electroplating clamp further comprises a driving part (10) configured to drive the first clamping arm (1) to rotate around the pivot of the second clamping arm (2).

6. The electroplating cell defined in claim 1, wherein The electroplating clamp further comprises a first retaining part (11) configured to retain the position of the driving part (10), so that the plurality of first clamping claws (3) retain the sheet clamped with the plurality of second clamping claws (4).

7. The electroplating cell defined in claim 6, wherein The electroplating clamp comprises the electroplating clamp according to any one of claims 1-7.

8. An electroplating rack characterized by, The electroplating hanger further comprises a carrier (200) fixedly connected to the first clamping arm (1) or the second clamping arm (2), one end of the carrier (200) away from the first clamping arm (1) and the second clamping arm (2) is provided with a clamping bracket (210), the clamping bracket (210) can clamp a first end of the sheet, the first clamping arm (1) and the second clamping arm (2) can clamp a second end of the sheet, and the first end and the second end are opposite ends of the sheet.

9. The electroplating rack of claim 8, wherein, ​

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