Encapsulated antenna substrate and method of manufacturing the same, electronic device

Abstract

The application provides a packaged antenna substrate, a preparation method thereof and an electronic device. The packaged antenna substrate comprises a functional stack, a first dielectric layer and a feed network layer which are stacked on the functional stack. The first dielectric layer comprises a first material layer and a second material layer. The first material layer is closer to the functional stack than the second material layer. The material used in the first material layer is different from the material used in the second material layer. The second material layer comprises a heat-oxidation-resistant material. The technical solution of the application can reduce the loss of a transmission line between an antenna array and a radio frequency chip.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a packaging antenna substrate, a preparation method thereof and an electronic device. BACKGROUND

[0002] In the AiP (Antenna in Package) technology and the AOB (Antenna-on-Board) technology, the antenna array and the radio frequency chip are integrated on two opposite surfaces of a PCB (Printed Circuit Board), and a feeding network for feeding the antenna array is arranged inside the PCB, which can transmit signals between the antenna array and the radio frequency chip. At present, the transmission line between the antenna array and the radio frequency chip has high loss, which needs to be continuously improved and reduced. SUMMARY

[0003] Embodiments of the present application provide a packaging antenna substrate, a preparation method thereof and an electronic device, which can reduce the loss of the transmission line between the antenna array and the radio frequency chip.

[0004] In a first aspect, the present application provides a packaging antenna substrate, which comprises a functional stack, a first dielectric layer and a feeding network layer which are stacked on the functional stack, the first dielectric layer comprises a first material layer and a second material layer, the first material layer is closer to the functional stack than the second material layer, the material adopted by the first material layer and the material adopted by the second material layer are different, and the second material layer comprises a heat-oxidative aging resistant material.

[0005] It should be noted that the first dielectric layer can be arranged between the packaging stack and the feeding network layer, or the first dielectric layer can be arranged on the side of the feeding network layer away from the packaging stack, as long as it is in contact with the feeding network layer. The second material layer can be any material with strong heat-oxidative aging resistance, such as a thermoplastic fluororesin with high-temperature aging resistance.

[0006] The packaging antenna substrate uses a millimeter wave frequency band for communication. It can be understood that the higher the working frequency of electromagnetic waves, the shorter the corresponding working wavelength. When the working wavelength of electromagnetic waves is in the order of millimeters, such a frequency band is called a millimeter wave frequency band, and the advantage of using a millimeter wave frequency band for communication is that the millimeter wave frequency band has very wide spectrum resources, which can realize the ultra-high data transmission rate of the 5G system. There are many millimeter wave frequency bands planned in the 5G system, such as the n257 (26.5GHz-29.5GHz) frequency band mainly at 28GHz, or the n260 (37.0GHz-40.0GHz) frequency band mainly at 39GHz.

[0007] It can be understood that the millimeter wave signal transmission is very large, and by adopting the packaging antenna substrate, the radio frequency chip and the antenna array element can be integrated on the packaging antenna substrate to obtain the lowest link loss. However, due to the high transmission line loss between the radio frequency chip and the antenna array element, the working reliability of the packaging antenna substrate can be adversely affected. One of the main factors affecting the transmission line loss in the packaging antenna substrate is the dielectric loss in the packaging antenna substrate.

[0008] Therefore, by making the first dielectric layer adjacent to the feed network layer have two material layers with different materials, the first dielectric layer can be formed by mixing two different dielectrics. The first material layer is closer to the functional stack than the second material layer. That is, in the packaging antenna substrate, the first material layer is an inner layer structure in the dielectric layer, and the second material layer is an outer layer structure in the dielectric layer. In the first dielectric layer, the first material layer has good bonding performance and can have better bonding force with other structure layers (such as the functional stack) to improve the overall bonding performance of the first dielectric layer. The second material layer has good heat-oxidation resistance (also known as anti-thermal-oxidation resistance), which is beneficial to improve the high-temperature oxidation resistance of the packaging antenna substrate and has good reliability.

[0009] In addition, compared with the first dielectric layer formed by single dielectric lamination, the first dielectric layer formed by composite dielectric preparation can reduce the sharp deterioration of the first dielectric layer after high-temperature aging to the greatest extent, effectively enhance the high-temperature oxidation resistance of the first dielectric layer, and thus reduce the problem of high transmission line loss caused by the deterioration of the dielectric loss of the first dielectric layer after aging, which is beneficial to reduce the overall transmission loss of the packaging antenna substrate, so that the packaging antenna substrate has good transmission reliability and stability. On the other hand, it can effectively improve the equivalent isotropically radiated power (EIRP) of the packaging antenna substrate, so that the working reliability of the packaging antenna substrate is improved.

[0010] In one possible implementation, the packaging antenna substrate further includes a second dielectric layer, the functional stack, the first dielectric layer, the feed network layer, and the second dielectric layer are sequentially stacked, the second dielectric layer includes a third material layer and a fourth material layer, the fourth material layer is closer to the feed network layer than the third material layer, the material of the third material layer and the material of the fourth material layer are different, and the fourth material layer includes a heat-oxidation resistant material.

[0011] It should be noted that the fourth material layer can be any material with strong anti-thermal-oxidation resistance, such as a thermoplastic fluororesin with high-temperature aging resistance.

[0012] In a possible implementation, the material of the first material layer includes polyphenyl ether or hydrocarbon resin.

[0013] The material of the first material layer can be a low-loss thermosetting resin (semi-cured material). For example, the material of the first material layer can be a thermosetting resin of glass fiber type 1080, 1078, 1086, 106, 1037, 1027, 1067, or the like.

[0014] It can be understood that the first material layer has adhesion due to the use of polyphenyl ether or hydrocarbon resin, and has good bonding force with the functional layer and / or the feed network layer, so that the first dielectric layer is firmly bonded to the functional layer and / or the second dielectric layer is firmly bonded to the feed network layer.

[0015] In a possible implementation, the material of the second material layer includes a substrate or a fluorine resin film.

[0016] The material of the second material layer can be a material with low loss and high temperature aging resistance. It should be noted that the substrate can be prepared from a substrate material, which has good heat and oxygen aging resistance. For example, the substrate can be prepared from a material after stripping the surface copper layer of a copper clad laminate (CCL), or the substrate can be prepared from a material after stripping the surface copper layer of a flexible copper clad laminate (FCCL). The type of selection can be flexibly adjusted according to the actual application scenario of the packaging antenna substrate, and the technical solution of the present application does not make strict restrictions thereon.

[0017] For example, the material of the second material layer can include fluorine resin, such as polytetrafluoroethylene (PTFE), soluble polytetrafluoroethylene (PFA), fluorinated ethylene propylene (FEP), and the like and mixtures thereof, and can also include a high-temperature oxidation-resistant thermosetting resin.

[0018] It can be understood that the second material layer has good high-temperature aging resistance due to the use of the substrate or the fluorine resin film, and also has high bonding force with the copper foil, so as to be matched with a copper foil with lower roughness. Therefore, the first dielectric layer can effectively reduce the transmission loss of the packaging antenna substrate due to the use of the mixed composite dielectric, so that the packaging antenna substrate has good working reliability.

[0019] In a possible implementation, the dielectric loss of the first dielectric layer is less than 0.004 at a frequency of 10 GHz.

[0020] Therefore, the first dielectric layer with the dielectric loss satisfying the range can have a lower dielectric loss, can make the integrity of the signal in the first dielectric layer better, and is beneficial to improve the transmission loss of the packaging antenna substrate.

[0021] In a possible implementation, the dielectric constant of the first dielectric layer is less than 4.0 at a frequency of 10 GHz.

[0022] Therefore, the first dielectric layer with the dielectric loss satisfying the range can have a lower dielectric constant, can effectively improve the quality of the high-speed transmission signal, and improve the signal rate, which is beneficial to improve the transmission loss of the packaging antenna substrate.

[0023] In a possible implementation, the surface roughness of the feed network layer is less than 2 microns.

[0024] The surface roughness refers to the unevenness of small intervals and tiny peaks and valleys of a processed surface. The distance between two wave peaks or two wave troughs (wave distance) is very small, which belongs to the micro-geometric error.

[0025] Therefore, the feed network layer with the surface roughness satisfying the range can have a lower copper foil roughness, can effectively improve the conductor loss in the millimeter wave frequency band, and the loss is improved more obviously in the wave band with a high working frequency, which is beneficial to reduce the overall transmission line loss of the packaging antenna substrate.

[0026] In a possible implementation, the peel strength between the feed network layer and the first dielectric layer is greater than 3 pounds per inch.

[0027] Therefore, the first dielectric layer with the peel strength satisfying the range can have a stronger peel strength with the feed network layer, which is beneficial to improve the conductor loss in the millimeter wave frequency band, and further reduce the overall transmission line loss of the packaging antenna substrate.

[0028] In a second aspect, the present application further provides a preparation method of a packaging antenna substrate, the method comprising:

[0029] preparing a functional stack; and

[0030] preparing a first dielectric layer and a feed network layer which are arranged in a stack on the functional stack, the first dielectric layer comprising a first material layer and a second material layer, the first material layer being closer to the functional stack relative to the second material layer, the material adopted by the first material layer and the material adopted by the second material layer being different, and the second material layer comprising a heat-oxidative aging resistant material.

[0031] In one possible implementation, the first dielectric layer and the feed network layer are prepared to be stacked on the functional layer, the first dielectric layer includes a first material layer and a second material layer, the first material layer is closer to the functional layer than the second material layer, the first material layer and the second material layer are made of different materials, and the second material layer includes a heat-oxidative aging resistant material.

[0032] The first material layer and the copper-clad core layer are provided, the copper-clad core layer includes a second material layer and copper layers arranged on two opposite surfaces of the second material layer;

[0033] The copper layers are etched to form a feed network layer covering the second material layer; and

[0034] The functional layer, the first material layer, the second material layer and the feed network layer are laminated together to form the first dielectric layer and the feed network layer stacked on the functional layer, the first material layer is closer to the functional layer than the second material layer, the first material layer and the second material layer are made of different materials, and the second material layer includes a heat-oxidative aging resistant material.

[0035] In a third aspect, the application further provides an electronic device, which includes a mainboard and the packaging antenna substrate as described above, or the electronic device includes a mainboard and the packaging antenna substrate prepared by the preparation method as described above; and the packaging antenna substrate is connected to the mainboard. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the application;

[0037] Figure 2 is a structural schematic diagram of a packaging antenna substrate provided by an embodiment of the application;

[0038] Figure 3 is another structural schematic diagram of a packaging antenna substrate provided by an embodiment of the application;

[0039] Figure 4 is still another structural schematic diagram of a packaging antenna substrate provided by an embodiment of the application;

[0040] Figure 5 is a flowchart of a preparation method of a packaging antenna substrate provided by an embodiment of the application;

[0041] Figure 6 is a partial step schematic diagram of the preparation method of the packaging antenna substrate provided by an embodiment of the application. DETAILED DESCRIPTION

[0042] For the convenience of understanding, first, the terms involved in the embodiments of the present application are explained.

[0043] And / or: is only a description of the association relationship of the associated object, which means that there can be three relationships, for example, A and / or B, which can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone.

[0044] Multiple: refers to two or more than two.

[0045] Connection: should be understood broadly, for example, A is connected with B, which can be that A is directly connected with B, or A is indirectly connected with B through an intermediate medium.

[0046] The specific embodiments of the present application will be described clearly in combination with the drawings below.

[0047] With the advent of the high-rate communication era of 5G (the 5th Generation) and VR (Virtual Reality), millimeter wave communication gradually becomes the focus, and the design and application demand of millimeter wave antenna is also increasingly strong. Because the length of the transmission path of the millimeter wave frequency band has a great influence on the signal amplitude loss, and the processing precision requirement of the millimeter wave antenna is very high, therefore, the AiP (Antenna in Package) technology and the AOB (Antenna-on-Board) technology with extremely short antenna feed line path and high processing precision have become the mainstream technology in the field of millimeter wave antenna.

[0048] In the AiP (Antenna in Package) technology and the AOB (Antenna-on-Board) technology, the antenna array and the radio frequency chip are integrated on the two opposite surfaces of the circuit board (PCB), and the feed network for feeding the antenna array is arranged in the inside of the circuit board, which can transmit signals between the antenna array and the radio frequency chip. At present, the transmission line loss between the antenna array and the radio frequency chip is high, which needs to be continuously improved and reduced.

[0049] Based on this, please refer to Figures 1-6 The embodiments of the present application provide a packaging antenna substrate 100 and an electronic device 200 applying the packaging antenna substrate 100, which can reduce the transmission line loss between the antenna array and the radio frequency chip.

[0050] The electronic device 200 can be, but is not limited to, a smart consumer electronic device 200 such as a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, etc., a telecommunication equipment room device such as a metropolitan router, a central router, etc., an IT computer room device such as a data center server, a data center switch, etc., a vehicle-mounted device such as a MDC (Mobile Data Center), etc., and can also be applied to an industrial robot, a rail transit (e.g., a subway, a high-speed rail), a special power supply (e.g., a ship, an airplane, a vehicle), etc.

[0051] It should be noted that the packaging antenna substrate 100 is not limited to be applied to the devices listed above, and can also be applied to any device involving a signal receiving and transmitting requirement realized by an antenna, such as a device having a passive antenna array, an active radio frequency receiving or radiation phase control function, an optical module, a base station such as a RRU (Remote Radio Unit), an AAU (Active Antenna Unit), a BBU (Building Base band Unite), a RHUB (Remote Radio Unit-Hub), or a radar, etc., and the embodiments of the present application do not make strict limitations thereon.

[0052] Please refer to Figure 1 The electronic device 200 can include a mainboard 210 and the packaging antenna substrate 100 connected to the mainboard 210. The mainboard 210 can carry and assemble the packaging antenna substrate 100, thereby realizing electrical interconnection between the packaging antenna substrate 100. Exemplarily, the packaging antenna substrate 100 can be a packaging substrate in the form of a BGA (Ball Grid Array), and electrical connection between the packaging antenna substrate 100 and the mainboard 210 can be realized through solder balls arranged on the packaging antenna substrate 100.

[0053] It should be noted that Figure 1 The purpose of the above is only to schematically describe the connection relationship between the mainboard 210 and the packaging antenna substrate 100, and not to make specific limitations on the connection positions, specific structures and quantities of the devices. The structure schematically shown in the embodiments of the present application does not constitute a specific limitation on the electronic device 200. In other embodiments of the present application, the electronic device 200 can include more or fewer components than shown, or combine certain components, or split certain components, or different component arrangements. The components shown can be realized in hardware, software or a combination of software and hardware.

[0054] Please refer to Figure 2 , Figure 3 and Figure 4The packaging antenna substrate 100 includes a functional laminated layer 10, a first build-up layer 20, a second build-up layer 30, and a radio frequency chip 40 (RFIC, Radio Frequency Integrated Circuit). The packaging antenna substrate 100 communicates using a millimeter wave frequency band.

[0055] It can be understood that the higher the working frequency of the electromagnetic wave is, the shorter the corresponding working wavelength is. When the working wavelength of the electromagnetic wave is in the order of millimeters, such a frequency band is called a millimeter wave frequency band. The benefit of using the millimeter wave frequency band for communication is that the millimeter wave frequency band has very wide spectrum resources, which can achieve an ultra-high data transmission rate of the 5G system. There are many millimeter wave frequency bands planned in the 5G system, such as the n257 (26.5 GHz-29.5 GHz) frequency band mainly at 28 GHz or the n260 (37.0 GHz-40.0 GHz) frequency band mainly at 39 GHz.

[0056] Please continue to refer to Figure 2 , Figure 3 and Figure 4 The functional laminated layer 10 includes a plurality of circuit layers 11, a plurality of first insulating layers 12, and a plurality of second insulating layers 13. The plurality of circuit layers 11, the plurality of first insulating layers 12, and the plurality of second insulating layers 13 are continuously and alternately stacked in the order of one circuit layer 11, one first insulating layer 12, one circuit layer 11, one second insulating layer 13, and one circuit layer 11, to form a layout of “circuit layer 11-first insulating layer 12-circuit layer 11-second insulating layer 13-circuit layer 11...-circuit layer 11”. That is, each two adjacent circuit layers 11 are separated by one first insulating layer 12 or one second insulating layer 13. The first insulating layer 12 and the second insulating layer 13 can be made of high-frequency dielectric materials to meet the high-frequency transmission requirements of the packaging antenna substrate 100. In addition, the materials of the first insulating layer 12 and the second insulating layer 13 are different. For example, the material of the circuit layer 11 can be copper, such as a super-low profile copper foil (HVLP). The material of the first insulating layer 12 can be prepared by removing the copper layer on the surface of the copper clad laminate (CCL), and the material of the second insulating layer 13 can be a thermosetting resin.

[0057] It can be understood that the circuit layer 11 has a conductive function. By arranging the first insulating layer 12 or the second insulating layer 13 between the two adjacent circuit layers 11, the two adjacent circuit layers 11 can be effectively separated, so that the two adjacent circuit layers 11 can independently play their respective roles without interfering with each other, and the reliability is good.

[0058] It should be noted that each of the circuit layers 11 can be etched into a corresponding circuit pattern according to needs to have corresponding functions. For example, the circuit layers 11 can be used as a gap coupling layer. Alternatively, the circuit layers 11 can be used as a ground layer to achieve isolation or ground protection. Alternatively, the circuit layers 11 can be used as a power layer to achieve power supply for the radio frequency chip 40. Alternatively, the circuit layers 11 can be used as a control layer to control control signals such as clock signals (CLK), chip selection (CSB), etc. Alternatively, the circuit layers 11 can be used as a stripline layer to achieve the function of feeding power to the antenna radiation unit. Alternatively, the circuit layers 11 can be used as an antenna switching layer. In other words, in the functional stack 10, the roles of the multiple circuit layers 11 and their specific arrangement positions can be selected and arranged according to application scenarios, and the embodiments of the present application do not make strict limitations.

[0059] In a possible implementation, referring to Figure 2 The functional stack 10 can further include an interlayer interconnection structure 50. It can be understood that the interlayer interconnection structure 50 can be arranged at a predetermined position of the functional stack 10 according to needs, and can connect the circuit layers 11 that need to be interconnected in the multiple circuit layers 11. In addition, by arranging a metal region around the position of the interlayer interconnection structure 50 in the circuit layers 11 that need to be interconnected in the multiple circuit layers 11, and by arranging an insulating region around the position of the interlayer interconnection structure 50 in the circuit layers 11 that do not need to be interconnected in the multiple circuit layers 11, the circuit layers 11 that need to be interconnected in the multiple circuit layers 11 can form a metal connection band with the interlayer interconnection structure 50, and the circuit layers 11 that do not need to be interconnected in the multiple circuit layers 11 can form an insulating isolation band with the interlayer interconnection structure 50, so as to ensure that the circuit layers 11 that need to be interconnected and the circuit layers 11 that do not need to be interconnected in the multiple circuit layers 11 are independent of each other and do not interfere with each other, and further achieve the interconnection requirement of the interlayer interconnection structure 50. Exemplarily, the interlayer interconnection structure 50 can be a metallized via hole penetrating through all the circuit layers 11 in the functional stack 10, wherein the metallized via hole can be understood as an electrical connection structure formed by filling the inside of the via hole with electroplated metal.

[0060] It should be noted that the number of the interlayer interconnection structures 50 can be adjusted to one or more according to the manufacturing requirements of the package antenna substrate 100. Each of the interlayer interconnection structures 50 requires an independent metallized via, for example, if there are N interlayer interconnection structures 50, there are N metallized vias, N is a positive integer. There can be different interlayer interconnection structures 50 in the same circuit layer 11, for example, there are two interlayer interconnection structures 50 in the same circuit layer 11, one of which can realize the interconnection between two adjacent circuit layers 11, and the other of which can realize the interconnection between three adjacent circuit layers 11. In addition, the interlayer interconnection structure 50 can be used to realize the interconnection between multiple adjacent circuit layers 11, and the interlayer interconnection structure 50 can also be used to realize the interconnection between multiple non-adjacent circuit layers 11. The number, setting position, and specific interconnection requirements of the interlayer interconnection structure 50 can be selected according to the actual application requirements of the package antenna substrate 100, and the embodiments of the present application do not make strict restrictions thereon.

[0061] Continuing to refer to Figure 2 , Figure 3 and Figure 4 , the first build-up layer 20 and the second build-up layer 30 are respectively arranged on two sides of the functional stack 10. That is, the functional stack 10 is a double-sided stack, and both sides arranged oppositely can be provided with build-up layers. In other words, the first build-up layer 20 and the second build-up layer 30 are arranged on the two sides of the functional stack 10 arranged oppositely. It should be noted that the number of layers of the first build-up layer 20 and the number of layers of the second build-up layer 30 can be the same or different, and can be set according to the actual application requirements of the functional stack 10. When the number of layers of the first build-up layer 20 and the number of layers of the second build-up layer 30 are the same, the first build-up layer 20 and the second build-up layer 30 are symmetrically distributed on the two sides of the functional stack 10, which can effectively avoid the defect of warping during stack processing and ensure product quality. For example, the number of layers of the first build-up layer 20 is two, and the number of layers of the second build-up layer 30 is also two. When the number of layers of the first build-up layer 20 and the number of layers of the second build-up layer 30 are different, the first build-up layer 20 and the second build-up layer 30 are asymmetrically distributed on the two sides of the functional stack 10. For example, the number of layers of the first build-up layer 20 is three, and the number of layers of the second build-up layer 30 is five. In addition, the following is described by taking the example that the build-up layers are arranged on both sides of the functional stack 10, but the build-up layers can also be arranged on any one of the two sides of the functional stack 10 arranged oppositely, that is, the functional stack 10 can be a single-sided stack. The embodiments of the present application do not make strict restrictions on whether the functional stack 10 is a single-sided stack or a double-sided stack, and the functional stack 10 can be flexibly set according to the actual application requirements.

[0062] Specifically, the first build-up layer 20 may include a first dielectric layer 21, a feed network layer 22, a second dielectric layer 23, and a device layer 24, which are sequentially arranged on the functional stack 10. The first dielectric layer 21 and the second dielectric layer 23 may both be made of high-frequency dielectric materials to meet the high-frequency transmission requirements of the packaged antenna substrate 100. The feed network layer 22 and the device layer 24 may be made of copper foil, such as ultra-low profile copper foil (HVLP). The surface roughness of the feed network layer 22 may be less than 2 microns. Surface roughness refers to the unevenness of the small spacing and tiny peaks and valleys on the processed surface. The distance (wavelength) between its two peaks or two valleys is very small, which is a microscopic geometric shape error. Therefore, the feed network layer 22 whose surface roughness meets this range can have a lower copper foil roughness, which can effectively improve the conductor loss in the millimeter wave band, and this loss is more significantly improved in the band with high operating frequency, which is beneficial to reducing the overall transmission line loss of the packaged antenna substrate 100. In addition, the peel strength between the feed network layer 22 and the first dielectric layer 21 and / or the second dielectric layer 23 can be greater than 3 pounds per inch (e.g., 4 pounds per inch). Thus, the first dielectric layer 21 and / or the second dielectric layer 23 having a peel strength within this range can have a strong peel strength with the feed network layer 22, which is beneficial for improving conductor loss in the millimeter wave frequency band, thereby reducing the overall transmission line loss of the packaged antenna substrate 100.

[0063] It can be understood that the packaged antenna substrate 100 is a multi-layer board structure. By setting the feed network layer 22 on the second outer layer of the packaged antenna substrate 100, the feed network layer 22 can be set inside the packaged antenna substrate 100, so that the feed network layer 22 can transmit microwave signals (for example, above 28 Hz) between the antenna radiation unit and the RF chip 40, effectively ensuring the stable transmission of signals inside the packaged antenna substrate 100.

[0064] In one possible implementation, Figure 2 As shown, the first dielectric layer 21 includes a first material layer 211 and a second material layer 212. The first material layer 211 is the layer structure of the first dielectric layer 21 that contacts the functional stack 10, and the second material layer 212 is the layer structure of the first dielectric layer 21 that contacts the feed network layer 22. The material used in the first material layer 211 is different from the material used in the second material layer 212.

[0065] In this embodiment, the first material layer 211 is closer to the functional stack 10 than the second material layer 212 . The first material layer 211 is a low-loss adhesive sheet, and the second material layer 212 is a high heat-oxidation-resistant material layer.

[0066] It can be understood that the first material layer 211 is closer to the functional stack 10 than the second material layer 212. That is, in the packaging antenna substrate 100, the first material layer 211 is an inner layer structure in the dielectric layer, and the second material layer 212 is an outer layer structure in the dielectric layer. By setting the material layer on the inner side of the dielectric layer to have good adhesion and the material layer on the outer side to have good heat-oxidation resistance, the two can be combined to make a significant contribution to improving the high-temperature oxidation resistance of the packaging antenna substrate as a whole, and the reliability is good.

[0067] Exemplarily, the material of the first material layer 211 can include polyphenyl ether or hydrocarbon resin. The material of the second material layer 212 can include a substrate or a fluorine resin film.

[0068] It should be noted that the substrate can be prepared from a substrate material, which has good heat-oxidation resistance. For example, the substrate can be prepared from the material after stripping the surface copper layer in the copper clad laminate (CCL), or the substrate can be prepared from the material after stripping the surface copper layer in the flexible copper clad laminate (FCCL). The type of selection can be flexibly adjusted according to the actual application scenario of the packaging antenna substrate, and the technical solution of the present application does not make strict restrictions thereon.

[0069] It can be understood that the transmission of millimeter wave signals is very large, and by using the packaging antenna substrate 100, the radio frequency chip 40 and the antenna array can be integrated on the packaging antenna substrate 100 to obtain the lowest link loss. However, due to the high loss of the internal feed network transmission line of the packaging antenna substrate 100, it will have an adverse effect on the working reliability of the packaging antenna substrate 100. One of the main factors affecting the loss of the internal feed network transmission line of the packaging antenna substrate 100 is the dielectric loss in the packaging antenna substrate 100.

[0070] Thus, by making the first dielectric layer 21 adjacent to the power supply network layer 22 have two layers of material different from each other, the first dielectric layer 21 can be formed by two different dielectric mixed pressing. Compared with the first dielectric layer 21 formed by single dielectric pressing, the first dielectric layer 21 formed by composite dielectric preparation. On the one hand, it can maximize the reduction of the sharp deterioration of the first dielectric layer 21 after high temperature aging, effectively enhance the high temperature oxidation resistance of the first dielectric layer 21, and further reduce the problem of high transmission line loss caused by the deterioration of the dielectric loss of the first dielectric layer 21 after aging, which is beneficial to reduce the overall transmission loss of the packaging antenna substrate 100, so that the packaging antenna substrate 100 has good transmission reliability and stability. On the other hand, it can effectively improve the overall equivalent isotropically radiated power (EIRP) of the packaging antenna substrate 100, so that the working reliability of the packaging antenna substrate 100 is improved.

[0071] In this embodiment, the dielectric loss (Dissipation Factor, Df) of the first dielectric layer 21 can be less than 0.004 at a frequency of 10 gigahertz (Ghz). In other words, the dielectric loss of the first material layer 211 and the dielectric loss of the second material layer 212 can be less than 0.004. Thus, the first dielectric layer 21 with dielectric loss meeting this range can have lower dielectric loss, which can make the integrity of the signal in the first dielectric layer 21 better, and is beneficial to improve the transmission loss of the packaging antenna substrate 100.

[0072] And at a frequency of 10 gigahertz, the dielectric constant (Dielectric Constant, Dk) of the first dielectric layer 21 is less than 4.0. In other words, the dielectric constant of the first material layer 211 and the dielectric constant of the second material layer 212 can be less than 4.0. Thus, the first dielectric layer 21 with dielectric loss meeting this range can have lower dielectric constant, which can effectively improve the quality of high-speed transmission signal and improve signal rate, which is beneficial to improve the transmission loss of the packaging antenna substrate 100.

[0073] In a specific application scenario, the material of the first material layer 211 includes polyphenyl ether, and the material of the second material layer 212 includes a substrate, which can be prepared by removing the copper layer on the surface of a copper-clad plate. It can be understood that the first material layer 211 has an adhesive effect due to the use of polyphenyl ether, and has good bonding force with the functional stack 10, so that the first dielectric layer 21 can be firmly bonded to the functional stack 10. The second material layer 212 has good high-temperature aging resistance due to the use of the substrate, and also has high bonding force with the copper foil, so that a copper foil with lower roughness can be used. Thus, the first dielectric layer 21 can effectively reduce the transmission loss of the packaged antenna substrate 100 by using a mixed composite dielectric, so that the packaged antenna substrate 100 has good working reliability. For example, the first material layer 211 can use Megtron 7N level material. The material of the second material layer 212 can include fluororesin, such as polytetrafluoroethylene (PTFE), soluble polytetrafluoroethylene (PFA), fluorinated ethylene propylene (FEP), and the like, and mixtures thereof, or a high-temperature oxidation-resistant thermosetting resin.

[0074] In another specific application scenario, the material of the first material layer 211 includes carbon-hydrogen resin, and the material of the second material layer 212 includes a substrate, which can be prepared by removing the copper layer on the surface of a flexible copper-clad plate. It can be understood that the first material layer 211 has an adhesive effect due to the use of carbon-hydrogen resin, and has good bonding force with the functional stack 10, so that the first dielectric layer 21 can be firmly bonded to the functional stack 10. The second material layer 212 has good high-temperature aging resistance due to the use of the substrate, and also has high bonding force with the copper foil, so that a copper foil with lower roughness can be used. Thus, the first dielectric layer 21 can effectively reduce the transmission loss of the packaged antenna substrate 100 by using a mixed composite dielectric, so that the packaged antenna substrate 100 has good working reliability.

[0075] In another possible implementation, please refer to Figure 3 The second dielectric layer 23 includes a third material layer 231 and a fourth material layer 232. The third material layer 231 is a layer structure of the second dielectric layer 23 in contact with the feed network layer 22, and the fourth material layer 232 is a layer structure of the second dielectric layer 23 in contact with the device layer 24. The material of the third material layer 231 and the material of the fourth material layer 232 are different.

[0076] In this embodiment, the third material layer 231 is closer to the functional stack 10 than the fourth material layer 232, the third material layer 231 is a low-loss adhesive sheet, and the fourth material layer 232 is a high-heat-oxidation-resistant material layer.

[0077] It can be understood that the third material layer 231 is closer to the functional stack 10 than the fourth material layer 232. That is, in the packaged antenna substrate 100, the third material layer 231 is an inner layer structure in the dielectric layer, and the fourth material layer 232 is an outer layer structure in the dielectric layer. By setting the material layer closer to the inside of the dielectric layer to have good adhesion performance and setting the material layer closer to the outside to have good heat-oxidation-resistant performance, the two can be combined to make a significant contribution to improving the overall high-temperature oxidation resistance of the packaged antenna substrate, and the reliability is good.

[0078] For example, the material of the third material layer 231 can include polyphenyl ether or hydrocarbon resin. The material of the fourth material layer 232 can include a substrate or a fluorine resin film.

[0079] It should be noted that the substrate can be prepared from a substrate material, which has good heat-oxidation-resistant performance. For example, the substrate can be prepared from a material after stripping the surface copper layer in a copper clad laminate (CCL), or the substrate can be prepared from a material after stripping the surface copper layer in a flexible copper clad laminate (FCCL). The type of selection can be flexibly adjusted according to the actual application scenario of the packaged antenna substrate, and the technical solution of the present application does not make strict restrictions thereon.

[0080] It can be understood that the transmission of millimeter wave signals is very large, and by using the packaged antenna substrate 100, the radio frequency chip 40 and the antenna array can be integrated on the packaged antenna substrate 100 to obtain the lowest link loss. However, due to the high loss of the internal feed network transmission line of the packaged antenna substrate 100, it will have an adverse effect on the working reliability of the packaged antenna substrate 100. One of the main factors affecting the loss of the internal feed network transmission line of the packaged antenna substrate 100 is the dielectric loss in the packaged antenna substrate 100.

[0081] Thus, by making the second dielectric layer 23 adjacent to the power supply network layer 22 have two layers of material different from the material layer, the second dielectric layer 23 can be formed by two different media mixed pressing. Compared with the second dielectric layer 23 formed by single medium pressing, the second dielectric layer 23 formed by composite medium preparation. On the one hand, it can maximize the reduction of the case that the loss of the second dielectric layer 23 deteriorates sharply after high temperature aging, effectively enhance the high temperature oxidation resistance of the second dielectric layer 23, and further reduce the problem of high transmission line loss caused by the deterioration of the medium loss of the second dielectric layer 23 after aging, which is beneficial to reduce the overall transmission loss of the packaging antenna substrate 100, so that the packaging antenna substrate 100 has good transmission reliability and stability. On the other hand, it can effectively improve the overall equivalent isotropically radiated power (EIRP) of the packaging antenna substrate 100, so that the working reliability of the packaging antenna substrate 100 is improved.

[0082] In this embodiment, the dielectric loss (Dissipation Factor, Df) of the second dielectric layer 23 can be less than 0.004 at a frequency of 10 gigahertz (Ghz). In other words, the dielectric loss of the third material layer 231 and the dielectric loss of the fourth material layer 232 can be less than 0.004. Thus, the second dielectric layer 23 with dielectric loss meeting this range can have lower dielectric loss, which can make the integrity of the signal in the second dielectric layer 23 better, and is beneficial to improve the transmission loss of the packaging antenna substrate 100.

[0083] And at a frequency of 10 gigahertz, the dielectric constant (Dielectric Constant, Dk) of the second dielectric layer 23 is less than 4.0. In other words, the dielectric constant of the third material layer 231 and the dielectric constant of the fourth material layer 232 can be less than 4.0. Thus, the second dielectric layer 23 with dielectric loss meeting this range can have lower dielectric constant, which can effectively improve the quality of high-speed transmission signal and improve signal rate, which is beneficial to improve the transmission loss of the packaging antenna substrate 100.

[0084] In a specific application scenario, the third material layer 231 is made of polyphenyl ether, and the fourth material layer 232 is made of a substrate, which can be made of the material after the copper layer on the copper-clad plate is stripped. It can be understood that the third material layer 231 has adhesion due to the use of polyphenyl ether, and has good bonding force with the feed network layer 22, so that the second dielectric layer 23 can be firmly bonded to the feed network layer 22. The fourth material layer 232 has good high-temperature aging resistance due to the use of the substrate, can work in a high-temperature environment for a long time, and has small loss deterioration after aging. It also has high bonding force with the copper foil, so that it can be matched with a copper foil with lower roughness. Thus, the second dielectric layer 23 can effectively reduce the transmission loss of the packaged antenna substrate 100 due to the use of the mixed composite dielectric, so that the packaged antenna substrate 100 has good working reliability. For example, the third material layer 231 can be made of Megtron 7N material. The fourth material layer 232 can be made of fluororesin, such as polytetrafluoroethylene (PTFE), polytetrafluoroethylene (PFA), fluorinated ethylene propylene (FEP), and the like, and mixtures thereof, or a high-temperature oxidation-resistant thermosetting resin.

[0085] In another specific application scenario, the third material layer 231 is made of carbon-hydrogen resin, and the fourth material layer 232 is made of a substrate, which can be made of the material after the copper layer on the flexible copper-clad plate is stripped. It can be understood that the third material layer 231 has adhesion due to the use of carbon-hydrogen resin, and has good bonding force with the feed network layer 22, so that the second dielectric layer 23 can be firmly bonded to the feed network layer 22. The fourth material layer 232 has good high-temperature aging resistance due to the use of the substrate, can work in a high-temperature environment for a long time, and has small loss deterioration after aging. It also can be matched with a copper foil with lower roughness. Thus, the first dielectric layer 21 can effectively reduce the transmission loss of the packaged antenna substrate 100 due to the use of the mixed composite dielectric, so that the packaged antenna substrate 100 has good working reliability.

[0086] In another possible implementation, please refer to Figure 4The first dielectric layer 21 includes a first material layer 211 and a second material layer 212. In the first dielectric layer 21, the first material layer 211 is a layer structure of the first dielectric layer 21 in contact with the functional stack 10, and the second material layer 212 is a layer structure of the first dielectric layer 21 in contact with the feed network layer 22. The second dielectric layer 23 includes a third material layer 231 and a fourth material layer 232. In the second dielectric layer 23, the third material layer 231 is a layer structure of the second dielectric layer 23 in contact with the feed network layer 22, and the fourth material layer 232 is a layer structure of the second dielectric layer 23 in contact with the device layer 24. The material used by the third material layer 231 and the material used by the fourth material layer 232 are different.

[0087] In the embodiment, the first material layer 211 is closer to the functional stack 10 than the second material layer 212, and the third material layer 231 is closer to the functional stack 10 than the fourth material layer 232. The first material layer 211 and the third material layer 231 are low-loss adhesive sheets, and the second material layer 212 and the fourth material layer 232 are high-heat-oxidation-resistant material layers.

[0088] It can be understood that the first material layer 211 is closer to the functional stack 10 than the second material layer 212, and the third material layer 231 is closer to the functional stack 10 than the fourth material layer 232. That is, in the packaged antenna substrate 100, the first material layer 211 and the third material layer 231 are inner layer structures in the dielectric layer, and the second material layer 212 and the fourth material layer 232 are outer layer structures in the dielectric layer. By setting the material layer on the inner side of the dielectric layer to have good adhesion performance and setting the material layer on the outer side to have good heat-oxidation resistance, the two can be combined to make a significant contribution to improving the overall high-temperature oxidation resistance of the packaged antenna substrate, and the reliability is good.

[0089] For example, the material of the first material layer 211 and the third material layer 231 can include polyphenyl ether or hydrocarbon resin. The material of the second material layer 212 and the fourth material layer 232 can include a substrate or a fluorine resin film.

[0090] It should be noted that the substrate can be prepared from a substrate material, which has good heat-oxidation resistance. For example, the substrate can be prepared from a material after stripping the surface copper layer in a copper clad laminate (CCL), or the substrate can be prepared from a material after stripping the surface copper layer in a flexible copper clad laminate (FCCL). The type of selection can be flexibly adjusted according to the actual application scenario of the packaged antenna substrate, and the technical solution of the present application does not make strict limitations.

[0091] It can be understood that the millimeter wave signal transmission is very large, by adopting the packaging antenna substrate 100, the radio frequency chip 40 and the antenna array element can be integrated on the packaging antenna substrate 100 to obtain the lowest link loss. However, due to the high loss of the internal feed network transmission line of the packaging antenna substrate 100, it will have a bad influence on the working reliability of the packaging antenna substrate 100. One of the main factors affecting the loss of the internal feed network transmission line of the packaging antenna substrate 100 is the dielectric loss in the packaging antenna substrate 100.

[0092] Therefore, by making the first dielectric layer 21 and the second dielectric layer 23 adjacent to the feed network layer 22 have two layers of material layers with different materials, the first dielectric layer 21 and the second dielectric layer 23 can be formed by two different dielectric mixed pressing. Compared with the first dielectric layer 21 and the second dielectric layer 23 formed by single dielectric pressing, the first dielectric layer 21 and the second dielectric layer 23 formed by using composite dielectric preparation. On the one hand, it can maximize the reduction of the sharp deterioration of the first dielectric layer 21 and the second dielectric layer 23 after high temperature aging, effectively enhance the high temperature oxidation resistance of the second dielectric layer 23, and further reduce the problem of high transmission line loss caused by the deterioration of the dielectric loss of the first dielectric layer 21 and the second dielectric layer 23 after aging, which is beneficial to reduce the overall transmission loss of the packaging antenna substrate 100, so that the packaging antenna substrate 100 has good transmission reliability and stability. On the other hand, it can effectively improve the equivalent isotropic radiated power (EIRP) of the packaging antenna substrate 100 as a whole, so that the working reliability of the packaging antenna substrate 100 is improved.

[0093] In this embodiment, the dielectric loss (Dissipation Factor, Df) of the first dielectric layer 21 and the second dielectric layer and the dielectric loss of the second dielectric layer 23 can be less than 0.004 at a frequency of 10 gigahertz (Ghz). In other words, the dielectric loss of the first material layer 211 and the second material layer 212 of the first dielectric layer 21 can be less than 0.004, and the dielectric loss of the third material layer 231 and the fourth material layer 232 of the second dielectric layer 23 can be less than 0.004. Therefore, the first dielectric layer 21 and the second dielectric layer 23 with dielectric loss in this range can have lower dielectric loss, which can make the signal integrity in the first dielectric layer 21 and the second dielectric layer 23 better, and is beneficial to improve the transmission loss of the packaging antenna substrate 100.

[0094] At the frequency of 10 GHz, the dielectric constant (Dk) of the first dielectric layer 21 and the second dielectric layer 23 is less than 4.0. In other words, the dielectric constant of the first material layer 211 and the second material layer 212 of the first dielectric layer 21 can be less than 4.0, and the dielectric constant of the third material layer 231 and the fourth material layer 232 of the second dielectric layer 23 can be less than 4.0. In this way, the first dielectric layer 21 and the second dielectric layer 23 with dielectric loss in this range can have a lower dielectric constant, which can effectively improve the quality of high-speed transmission signals, increase the signal rate, and help improve the transmission loss of the packaging antenna substrate 100.

[0095] In a specific application scenario, the materials of the first material layer 211 and the third material layer 231 include polyphenyl ether, and the materials of the second material layer 212 and the fourth material layer 232 include a substrate, which can be prepared from the material after stripping the copper layer on the copper-clad plate. It can be understood that the first material layer 211 and the third material layer 231 have adhesion due to the use of polyphenyl ether, and have good bonding force with the functional layer 10 and the feed network layer 22, so that the first dielectric layer 21 can be firmly bonded to the functional layer 10 and the second dielectric layer 23 can be firmly bonded to the feed network layer 22. The second material layer 212 and the fourth material layer 232 have good high-temperature aging resistance due to the use of the substrate, and can work in a high-temperature environment for a long time with small loss deterioration after aging. They also have high bonding force with copper foil, so they can be matched with copper foil with lower roughness. In this way, the first dielectric layer 21 and the second dielectric layer 23 can effectively reduce the transmission loss of the packaging antenna substrate 100 by using mixed composite dielectric, so that the packaging antenna substrate 100 has good working reliability. For example, the first material layer 211 and the third material layer 231 can use Megtron 7N grade material. The materials of the second material layer 212 and the fourth material layer 232 can include fluororesin, such as polytetrafluoroethylene (PTFE), soluble polytetrafluoroethylene (PFA), fluorinated ethylene propylene (FEP), and mixtures thereof, and can also include high-temperature oxidation resistant thermosetting resin.

[0096] In another specific application scenario, the material of the first material layer 211 and the third material layer 231 includes hydrocarbon resin, and the material of the second material layer 212 and the fourth material layer 232 includes a substrate, which can be prepared by removing the copper layer on the peeling surface of the flexible copper-clad plate. It can be understood that the first material layer 211 and the third material layer 231 have adhesive effect due to the use of hydrocarbon resin, and have good bonding force with the functional layer stack 10 and the feed network layer 22, so that the first dielectric layer 21 can be firmly bonded to the functional layer stack 10 and the second dielectric layer 23 can be firmly bonded to the feed network layer 22. The second material layer 212 and the fourth material layer 232 have good high-temperature aging resistance due to the use of the substrate, can work in a high-temperature environment for a long time, and have small loss deterioration after aging. It also has high bonding force with the copper foil, so that it can be matched with a copper foil with lower roughness. Therefore, the first dielectric layer 21 and the second dielectric layer 23 can effectively reduce the transmission loss of the packaged antenna substrate 100 by using mixed composite dielectric, so that the packaged antenna substrate 100 has good working reliability.

[0097] Please refer to Figure 2 , Figure 3 and Figure 4 In the embodiment of the present application, the first dielectric layer 21 can have a first-order metallized via 60, the first-order metallized via 60 penetrating the first dielectric layer 21, and the functional layer stack 10 and the feed network layer 22 being electrically connected through the first-order metallized via 60. The second dielectric layer 23 can have a second-order metallized via 70, the second-order metallized via 70 penetrating the second dielectric layer 23, and the feed network layer 22 and the device layer 24 being electrically connected through the second-order metallized via 70.

[0098] Therefore, the first-order metallized via 60 and the second-order metallized via 70 can be matched with thin wires and close distances to realize interlayer interconnection, so as to load more electronic components or layout more lines in a unit area, and greatly enhance the signal transmission performance inside the packaged antenna substrate 100.

[0099] It can be understood that the number of the first-order metallized via 60 and the second-order metallized via 70 can be one or more as needed. The hole positions of the first-order metallized via 60 and the second-order metallized via 70 can be staggered with each other or stacked together in the vertical direction. The shape, number, position, etc. of the first-order metallized via 60 and the second-order metallized via 70 are not strictly limited in the embodiment of the present application.

[0100] It should be noted that the above is described by taking the first build-up layer 20 as a second-order build-up layer as an example, but the first build-up layer 20 can actually be a third-order build-up layer or a build-up layer of three or more orders. When the first build-up layer 20 is a third-order or a build-up layer of three or more orders, each dielectric layer in the first build-up layer 20 can be a composite dielectric layer formed by two kinds of dielectric mixed pressing as described above, and the embodiments of the present application do not make strict restrictions thereon.

[0101] Please refer to Figure 2 , Figure 3 and Figure 4 , the second build-up layer 30 can be consistent with the number of layers of the first build-up layer 20 and also be a second-order build-up layer. The second build-up layer 30 can include a third dielectric layer 31, a conductive layer 32, a fourth dielectric layer 33 and an antenna radiation layer 34 arranged in sequence on the functional layer 10. Among them, the third dielectric layer 31 and the fourth dielectric layer 33 can be made of high-frequency dielectric material to meet the high-frequency transmission requirements of the packaged antenna substrate 100. The conductive layer 32 and the antenna radiation layer 34 can be made of copper foil, such as ultra-low profile copper foil (HVLP).

[0102] The third dielectric layer 31 can have a first-order metallized via 60, and the first-order metallized via 60 penetrates the third dielectric layer 31. The functional layer 10 and the conductive layer 32 are electrically connected through the first-order metallized via 60. The fourth dielectric layer 33 can have a second-order metallized via 70, and the second-order metallized via 70 penetrates the fourth dielectric layer 33. The antenna radiation layer 34 and the conductive layer 32 are electrically connected through the second-order metallized via 70.

[0103] Therefore, by matching the fine line and the close pitch of the first-order metallized via 60 and the second-order metallized via 70, interlayer interconnection can be realized, so that more electronic components or more circuit lines can be carried in a unit area, and the signal transmission performance inside the packaged antenna substrate 100 can be greatly enhanced.

[0104] It can be understood that the number of the first-order metallized via 60 and the second-order metallized via 70 can be one or more as needed. The hole positions of the first-order metallized via 60 and the second-order metallized via 70 can be staggered with each other or can be overlapped together in the vertical direction. The embodiments of the present application do not make strict restrictions on the shape, number, position, etc. of the first-order metallized via 60 and the second-order metallized via 70.

[0105] It should be noted that the third dielectric layer 31 and the fourth dielectric layer 33 can be dielectric layers composed of a single dielectric (such as a thermosetting resin), or they can be composite dielectric layers formed by mixing two different dielectrics. When the third dielectric layer 31 and the fourth dielectric layer 33 are composite dielectric layers formed by mixing two different dielectrics, the specific layer structures of the third dielectric layer 31 and the fourth dielectric layer 33 can refer to the first dielectric layer 21 and the second dielectric layer 23 mentioned above, and will not be repeated here. The conductive layer 32 can be etched into corresponding circuit patterns as needed to have corresponding functions. The embodiments of the present application do not strictly limit the specific use of the conductive layer 32. The antenna radiation layer 34 can be etched into antenna elements with different arrangements as needed. Its specific arrangement is not a key design of the embodiments of the present application and will not be repeated here.

[0106] Please refer to Figure 2 、 Figure 3 and Figure 4 , the RF chip 40 is connected to the device layer 24, thereby enabling the antenna radiation layer 34 and the RF chip 40 to be located on both sides of the functional stack 10. The antenna radiation layer 34 couples or directly feeds the RF chip 40, and the RF chip 40 transmits and / or receives RF signals (such as millimeter wave signals) through the antenna radiation layer 34. Specifically, the RF chip 40 outputs the antenna RF signal, and the antenna RF signal is transmitted as energy to the antenna radiation layer 34. The antenna radiation layer 34 converts the received energy into radio waves that propagate in an unbounded medium (usually free space). The radio waves are radiated into the surrounding space, thereby realizing signal transmission. The antenna radiation layer 34 receives the radio waves in the space, converts the radio waves into energy, and transmits the energy to the RF chip 40. The RF chip 40 processes the received energy, thereby realizing signal reception.

[0107] The embodiment of the present application also provides a method for preparing a packaged antenna substrate 100. For the structure of the packaged antenna substrate 100, please refer to Figures 1-4 As well as the above description, I will not repeat it here. Figure 5 The method for preparing the package antenna substrate 100 may at least include S100 and S200, which are described in detail as follows.

[0108] S100: preparing a functional stack 10 .

[0109] S200: Prepare a first dielectric layer 21 and a feed network layer 22 stacked on the functional stack 10, wherein the first dielectric layer 21 includes a first material layer 211 and a second material layer 212. The first material layer 211 is closer to the functional stack 10 than the second material layer 212. The material used in the first material layer 211 is different from the material used in the second material layer 212. The second material layer 212 includes a heat-resistant and oxygen-aging-resistant material.

[0110] The following will further describe each step respectively.

[0111] S100: preparing the functional stack 10.

[0112] It can be understood that the key design of the embodiments of the present application is not in the preparation of the functional stack 10, and the preparation of the functional stack 10 can refer to the conventional process, and the specific number of layers can also be selected according to the actual application scene of the packaged antenna substrate 100, and the embodiments of the present application do not make strict restrictions thereon.

[0113] S200: preparing the first dielectric layer 21 and the feed network layer 22 arranged on the functional stack 10, the first dielectric layer 21 comprising a first material layer 211 and a second material layer 212, the first material layer 211 being closer to the functional stack 10 relative to the second material layer 212, the material adopted by the first material layer 211 and the material adopted by the second material layer 212 being different, and the second material layer 212 comprising a heat-oxidation-resistant material.

[0114] First, the first dielectric layer 21 and the feed network layer 22 are prepared, and the prepared first dielectric layer 21 and feed network layer 22 are laminated with the functional stack 10 to obtain the first dielectric layer 21 and the feed network layer 22 arranged on the functional stack 10 in sequence. Among them, in the process step of preparing the first dielectric layer 21 and the feed network layer 22, the third dielectric layer 31 and the conductive layer 32 can be prepared synchronously. In the process step of laminating the prepared first dielectric layer 21 and feed network layer 22 with the functional stack 10, the prepared third dielectric layer 31 and conductive layer 32 can be laminated with the functional stack 10 synchronously.

[0115] Secondly, the second dielectric layer 23 and the device layer 24 are prepared, and the prepared second dielectric layer 23 and device layer 24 are laminated with the functional stack 10, the first dielectric layer 21 and the feed network layer 22 in the foregoing step to obtain the first dielectric layer 21, the feed network layer 22, the second dielectric layer 23 and the device layer 24 arranged on the functional stack 10 in sequence. Among them, in the process step of preparing the second dielectric layer 23 and the device layer 24, the fourth dielectric layer 33 and the antenna radiation layer 34 can be prepared synchronously. In the process step of laminating the prepared second dielectric layer 23 and device layer 24 with the functional stack 10, the first dielectric layer 21 and the feed network layer 22 in the foregoing step, the prepared fourth dielectric layer 33 and antenna radiation layer 34 can be laminated with the functional stack 10, the third dielectric layer 31 and the conductive layer 32 synchronously.

[0116] It can be understood that the first dielectric layer 21 and / or the second dielectric layer 23 can each comprise two different material layers, which will be described below in combination with Figure 6Take the first dielectric layer 21 including the first material layer 211 and the second material layer 212 as an example to describe the preparation of the first dielectric layer 21 and the feed network layer 22 arranged on the functional layer 10 in sequence.

[0117] First, the first material layer 211 and the copper-clad core layer 25 are provided, the copper-clad core layer 25 including the second material layer 212 and the copper layer 26 arranged on two opposite surfaces of the second material layer 212.

[0118] Second, the copper layer 26 is etched to form the feed network layer 22 covering the second material layer 212, and in this step, the copper layer 26 in the copper-clad core layer 25 that will be in contact with the first material layer 211 is completely removed.

[0119] Then, the functional layer 10, the first material layer 211, the second material layer 212 and the feed network layer 22 are laminated together to form the first dielectric layer 21 and the feed network layer 22 arranged on the functional layer 10 in sequence, and the material of the first material layer 211 is different from the material of the second material layer 212.

[0120] The above describes the embodiments of the present application in detail, and the principles and implementation manners of the present application are described by applying specific examples; the above embodiment descriptions are only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range can be changed, and the above description should not be understood as the limitation of the present application.

Claims

1. A packaged antenna substrate, characterized in that: The packaged antenna substrate includes an antenna radiation layer, a radio frequency chip, a functional stack, and a first dielectric layer and a feed network layer stacked on the functional stack. The antenna radiation layer and the radio frequency chip are respectively located on both sides of the functional stack. The first dielectric layer and the feed network layer are both located between the functional stack and the radio frequency chip. The first dielectric layer is close to the functional stack relative to the feed network layer. The first dielectric layer includes a first material layer and a second material layer. The first material layer is close to the functional stack relative to the second material layer. The material used in the first material layer is different from the material used in the second material layer. The second material layer includes a heat-oxidation-aging-resistant material.

2. The package antenna substrate according to claim 1, wherein: The packaged antenna substrate also includes a second dielectric layer. The functional stack, the first dielectric layer, the feed network layer, and the second dielectric layer are stacked in sequence. The second dielectric layer includes a third material layer and a fourth material layer. The fourth material layer is closer to the feed network layer than the third material layer. The material used in the third material layer is different from the material used in the fourth material layer. The fourth material layer includes a heat-resistant and oxygen-aging-resistant material.

3. The package antenna substrate according to any one of claims 1 or 2, wherein: The material of the first material layer includes polyphenylene ether or hydrocarbon resin.

4. The packaged antenna substrate according to claim 1 or 2, wherein: The second material layer is made of a substrate or a fluororesin film.

5. The packaged antenna substrate according to claim 1 or 2, wherein: At a frequency of 10 GHz, the dielectric loss of the first dielectric layer is less than 0.

004.

6. The packaged antenna substrate according to claim 1 or 2, wherein: At a frequency of 10 GHz, the dielectric constant of the first dielectric layer is less than 4.

0.

7. The packaged antenna substrate according to claim 1 or 2, wherein: The surface roughness of the feed network layer is less than 2 microns.

8. The packaged antenna substrate according to claim 1 or 2, wherein: The peel strength between the feed network layer and the first dielectric layer is greater than 3 pounds per inch.

9. A method for preparing a packaged antenna substrate, characterized in that: The method comprises: preparing a functional stack; and A first dielectric layer and a feed network layer are prepared and stacked on the functional stack, wherein the first dielectric layer is closer to the functional stack than the feed network layer, the first dielectric layer comprises a first material layer and a second material layer, the first material layer is closer to the functional stack than the second material layer, the material used in the first material layer is different from the material used in the second material layer, the second material layer comprises a heat-oxidation-resistant material, and a radio frequency chip is arranged on a side of the feed network layer facing away from the first dielectric layer; An antenna radiation layer is prepared, where the antenna radiation layer is located on a side of the functional stack away from the first dielectric layer and the feed network layer.

10. The method according to claim 9, wherein The first dielectric layer and the feed network layer are stacked on the functional stack, wherein the first dielectric layer includes a first material layer and a second material layer, the first material layer is closer to the functional stack than the second material layer, the material used in the first material layer is different from the material used in the second material layer, and the second material layer includes a heat-oxidation-resistant material including: Providing a first material layer and a copper-clad core layer, wherein the copper-clad core layer includes a second material layer and copper layers arranged on two opposite sides of the second material layer; etching the copper layer to form a feed network layer covering the second material layer; and The functional stack, the first material layer, the second material layer, and the feed network layer are pressed together to form a first dielectric layer and a feed network layer stacked on the functional stack, wherein the first material layer is closer to the functional stack than the second material layer, the material used in the first material layer is different from the material used in the second material layer, and the second material layer includes a heat-oxidation-aging-resistant material.

11. An electronic device, characterized in that: The electronic device comprises a mainboard and the packaged antenna substrate according to any one of claims 1 to 8, or the electronic device comprises a mainboard and the packaged antenna substrate prepared by the preparation method according to any one of claims 9 to 10; The package antenna substrate is connected to the main board.

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