Apparatus and method for processing a substrate

Abstract

An apparatus and method for processing a substrate, the apparatus including a transfer section; first and second transfer robots disposed in a longitudinal direction of the transfer section; a liquid processing section disposed at one side of the transfer section to apply a liquid to the substrate by supplying the liquid to the substrate, and a heat processing section disposed at an opposite side of the transfer section to face the first process processing section to perform a heat process with respect to the substrate. The heat processing section includes a cooling transfer module to transfer the substrate between the first and second transfer robots and cool the substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0141446, filed with the Korean Intellectual Property Office on October 28, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to an apparatus and method for processing a substrate, and more specifically, to an apparatus and method for forming a liquid film. Background Technology

[0004] To manufacture semiconductor devices, various patterns must be formed on a substrate such as a semiconductor wafer. These semiconductor patterns are formed through subsequent deposition, photolithography, and etching processes.

[0005] The photolithography process includes a coating process that applies a photosensitive liquid, such as photoresist, to a substrate to form a photoresist film; an exposure process that transfers a pattern formed on a reticle to the photoresist film on the substrate to form a circuit; and a development process that supplies a developing liquid to the photoresist film on the substrate to selectively remove exposed areas or the opposite areas. Heat treatment is performed relative to the substrate before and after applying the photoresist to the substrate, and before and after supplying the developing liquid to the substrate.

[0006] Korean Unexamined Patent Publication No. 2016-0017699 discloses an embodiment of a substrate processing apparatus that performs the aforementioned coating and developing processes. Therefore, the substrate processing apparatus has coating modules and developing modules stacked on top of each other, and each coating module and developing module has a transfer chamber, a liquid processing chamber, and a baking unit. The transfer chamber has a length extending longitudinally in a first direction. The baking chamber is located at one side of the opposite side, and the liquid processing chamber is located at the other side of the opposite side when viewed in the first direction. Furthermore, a buffer is provided at the opposite ends of the transfer chambers to transfer the substrate between an index module and an interface module. A cooling unit and a heating unit are sequentially arranged within the housing of the baking chamber, and a transfer plate is disposed within the housing such that the substrate is transferred within the housing. The transfer plate transfers the substrate to the heating unit. Then, when the substrate is fully heated, the substrate placed on the transfer plate is cooled by the cooling unit via the transfer plate.

[0007] However, in the substrate processing apparatus having the above-described structure, since the baking chamber is disposed at one side of the opposite sides in the longitudinal direction of the transfer chamber, the number of liquid treatment chambers disposed in the coating module or the developing module is limited. Therefore, in order to increase the production amount of the equipment, the process time of the liquid treatment chamber (coating unit) can be reduced or the number of liquid treatment chambers can be increased. When the number of liquid treatment chambers is increased, it can not be possible to perform the relevant work using only the robot. SUMMARY

[0008] Embodiments of the present inventive concept provide an apparatus and a method for processing a substrate, which can increase the throughput by increasing the number of liquid treatment units such as a coating module or a developing module.

[0009] In addition, embodiments of the present inventive concept provide an apparatus and a method for processing a substrate, which can cool a substrate while transferring the substrate between two substrate transfer robots.

[0010] In addition, embodiments of the present inventive concept provide an apparatus and a method for processing a substrate, which can reduce the steps of transferring a substrate while performing a processing process.

[0011] In addition, embodiments of the present inventive concept provide an apparatus and a method for processing a substrate, which can cool a substrate while transferring the substrate.

[0012] The objects to be achieved in the present inventive concept are not limited to the above-mentioned objects, and other objects not mentioned will become apparent to those skilled in the art from consideration of the following description.

[0013] According to an embodiment, an apparatus for processing a substrate can include a transfer part, a first transfer robot and a second transfer robot disposed in a longitudinal direction of the transfer part, a liquid treatment part disposed at one side of the transfer part to apply a liquid to a substrate by supplying the liquid to the substrate, and a heat treatment part disposed at the opposite side of the transfer part to face the first process treatment part and configured to perform a heat treatment with respect to the substrate. The heat treatment part includes a cooling transfer module to transfer and cool the substrate between the first transfer robot and the second transfer robot.

[0014] In addition, the cooling transfer module can be disposed at a boundary at which a first movement passage of the first transfer robot meets a second movement passage of the first transfer robot.

[0015] Further, the cooling transfer module can include a housing having a first region and a second region disposed in a longitudinal direction of the transfer portion, and a transfer plate disposed inside the housing to transfer the substrate between the first region and the second region.

[0016] Further, the first region can be disposed in a first substrate transfer region accessible to the first transfer robot, and the second region can be disposed in a second substrate transfer region accessible to the second transfer robot.

[0017] Further, the housing can include a first opening adjacent to the first region, wherein the substrate is introduced to or extracted from the first opening by the first transfer robot, and a second opening adjacent to the second region, wherein the substrate is introduced to or extracted from the second opening by the second transfer robot.

[0018] Further, the cooling transfer module can include a cooling unit for cooling the substrate. The cooling unit can be disposed in at least one of the first region and the second region.

[0019] Further, the transfer plate can include a cooling passage through which a coolant for cooling the substrate passes.

[0020] Further, the liquid treatment portion can include a first liquid treatment chamber disposed on a movement passage accessible to the first transfer robot and performing a process of applying a first liquid to the substrate, and a second liquid treatment chamber disposed on a movement passage accessible to the second transfer robot and applying a second liquid to the substrate.

[0021] Further, the first liquid is a liquid for forming an anti-reflective film on the substrate, and the second liquid can be a liquid for forming a photoresist film on the anti-reflective film formed on the substrate.

[0022] According to one embodiment, an apparatus for processing a substrate includes: an indexing module and a processing module, the indexing module and the processing module being sequentially arranged in a first direction, wherein the indexing module includes: a load port for placing a container, the container receiving the substrate; and an indexing frame having an indexing robot to transfer the substrate between the processing module and the container placed in the load port, wherein the processing module includes: a transfer section; a first transfer robot and a second transfer robot, the first transfer robot and the second transfer robot being disposed in a longitudinal direction of the transfer section; a liquid processing section disposed at one side of the transfer section to apply a liquid onto the substrate by supplying the liquid to the substrate; and a thermal processing section including: a thermal processing module disposed at an opposite side of the transfer section to face the first process section to perform a thermal process with respect to the substrate; and a cooling transfer module disposed at a boundary where a first movement passage of the first transfer robot meets a second movement passage of the second transfer robot to transfer and cool the substrate between the first transfer robot and the second transfer robot.

[0023] Further, the cooling transfer module can include: a housing disposed in the longitudinal direction of the transfer section and having a first area into which the first transfer robot is accessible and a second area into which the second transfer robot is accessible; a transfer plate disposed in the housing to transfer the substrate between the first area and the second area; and a cooling unit for cooling the substrate disposed in one of the first area and the second area.

[0024] Further, the cooling transfer module can include: a housing disposed in the longitudinal direction of the transfer section and having a first area into which the first transfer robot is accessible and a second area into which the second transfer robot is accessible; and a transfer plate disposed in the housing to transfer the substrate between the first area and the second area. A cooling passage is disposed in the transfer plate such that a coolant for cooling the substrate passes through the cooling passage.

[0025] Further, the housing can include: a first opening adjacent to the first area, wherein the substrate is introduced into or taken out of the first opening by the first transfer robot; and a second opening adjacent to the second area, wherein the substrate is introduced into or taken out of the second opening by the second transfer robot.

[0026] Further, the liquid treatment section can include a first liquid treatment section disposed on the movement passage into which the first transfer robot can enter to perform a process of applying a first liquid to the substrate, and a second liquid treatment section disposed on the movement passage into which the second transfer robot can enter to perform a process of applying a second liquid to the substrate.

[0027] According to an embodiment, an apparatus for processing a substrate includes a transfer section for disposing a first transfer section and a second transfer section in a first direction, a first transfer robot disposed in the first transfer section, a second transfer robot disposed in the second transfer section, a first processing group including a first liquid treatment module disposed on opposite sides of the first transfer section to apply an anti-reflection film to the substrate, and a first heat treatment module for performing heat treatment on the substrate associated with the application of the anti-reflection film, a second processing group including a second liquid treatment module disposed on opposite sides of the second transfer section to apply a photoresist film to the substrate having the anti-reflection film, and a second heat treatment module for performing heat treatment on the substrate associated with the application of the photoresist, and a cooling transfer module inserted between the first heat treatment module and the second heat treatment module to be disposed adjacent to a boundary at which the first transfer section meets the second transfer section, and configured to transfer the substrate between the first transfer robot and the second transfer robot and cool the substrate.

[0028] Further, the cooling transfer module can include a housing disposed in a longitudinal direction of the transfer section and having a first area into which the first transfer robot can enter and a second area into which the second transfer robot can enter, a transfer plate disposed in the housing to transfer the substrate between the first area and the second area, and a cooling unit disposed in one of the transfer plate, the first area, and the second area to cool the substrate.

[0029] Further, a first plate can be disposed in the second area, the substrate transferred by the transfer plate is placed on the first plate, and the substrate to be transferred by the second transfer robot is on standby on the transfer plate.

[0030] According to one embodiment, a method for processing a substrate, the method comprising: forming an antireflection film on the substrate in a first processing group; forming a photoresist film on the antireflection film formed on the substrate in a second processing group; and cooling the substrate having the antireflection film in a cooling transfer module inserted between the first processing group and the second processing group before coating the photoresist film. In the cooling step, a first transfer robot transferring the substrate in the first processing group introduces the substrate into the cooling transfer module before the cooling. A second transfer robot transferring the substrate in the second processing group takes out the substrate from the cooling transfer module after the cooling.

[0031] Further, in the cooling, the substrate can be cooled by any one of a first area into which the first transfer robot can enter, a second area into which the second transfer robot can enter, and a transfer plate for transferring the substrate from the first area to the second area.

[0032] Further, the first liquid is a liquid in which the antireflection film is formed on the substrate, and the second liquid can be a liquid in which the photoresist film is formed on the antireflection film formed on the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0033] The above and other objects and features will become apparent from the following description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the application and the best mode presently contemplated by the inventors for carrying out the application, and in which:

[0034] Figure 1 FIG. 1 is a view schematically showing a device for processing a substrate according to an embodiment of the present inventive concept;

[0035] Figure 2 FIG. 2 is a plan view schematically showing the device for processing a substrate of Figure 1 FIG. 3 is a plan view schematically showing the device for processing a substrate of

[0036] Figure 3 FIG. 4 is a plan view schematically showing the device for processing a substrate of Figure 1 FIG. 5 is a plan view schematically showing the device for processing a substrate of

[0037] Figure 4 FIG. 6 is a view schematically showing a hand of a transfer robot;

[0038] Figure 5 FIG. 7 is a plan view schematically showing a heat treatment chamber;

[0039] Figure 6 FIG. 8 is an elevation view schematically showing the heat treatment chamber of Figure 5 FIG. 9 is a plan view schematically showing the heat treatment chamber of

[0040] Figure 7 FIG. 10 is a plan view schematically showing a liquid treatment chamber;

[0041] Figure 8 andFigure 9 is a view showing a cooling transfer module;

[0042] Figure 10 is a flowchart sequentially showing a method for processing a substrate; and

[0043] Figure 11 is a view schematically showing a path for transferring a substrate until an exposure device is transferred into a container. DETAILED DESCRIPTION

[0044] Hereinafter, embodiments of the inventive concept will be described more fully with reference to the accompanying drawings. Embodiments of the inventive concept can be modified in various ways, and the scope of the inventive concept should not be construed as being limited to the embodiments of the inventive concept described below. Embodiments of the inventive concept are provided so as to describe the present disclosure more completely to one of ordinary skill in the art. Therefore, the shapes of components in the drawings are exaggerated for more clear description.

[0045] Figure 1 is a view schematically showing an apparatus for processing a substrate according to an embodiment of the inventive concept; and Figure 2 is a plan view of the apparatus for processing a substrate of Figure 1 . Figure 3 is a plan view of the apparatus for processing a substrate of Figure 1 , which shows a coating block.

[0046] Referring to Figures 1 to 3 , the substrate processing apparatus 1 includes an indexing module 20, a processing module 30, and an interface module 40.

[0047] According to an embodiment, the indexing module 20, the processing module 30, and the interface module 40 are aligned in a row in order to each other. Hereinafter, the direction in which the indexing module 20, the processing module 30, and the interface module 40 are arranged is referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0048] The indexing module 20 transports a substrate "W" from a container 10 for accommodating the substrate "W" to the processing module 30, and the processed substrate "W" is accommodated into the container 10. The length direction of the indexing module 20 is disposed in the second direction 14. The indexing module 20 has a loading port 22 and an indexing frame 24. The loading port 22 is positioned on the opposite side of the processing module 30 based on the indexing frame 24. The container 10 having the substrate "W" is placed on the port 22. A plurality of loading ports 22 can be provided and can be arranged in the second direction 14.

[0049] The container 10 can include a container 10 for sealing, such as a front opening wafer container (FOUP). The container 10 can be placed on the load port 22 by a transport means (not shown) such as an overhead transport, an overhead transport machine, or an automated guided vehicle, or a worker.

[0050] The indexing robot 2200 is disposed inside the indexing frame 24. A guide rail 2300 having a length direction disposed in the second direction 14 can be disposed in the indexing frame 24, and the indexing robot 2200 can be disposed to be movable on the guide rail 2300. The indexing robot 2200 can include a hand 2220 in which the substrate "W" is positioned, and the hand 2220 can be disposed to be movable forward and backward, rotatable about the third direction 16, and movable in the third direction 16.

[0051] The processing module 30 performs a coating and developing process with respect to the substrate "W".

[0052] The processing module 30 has a coating block 30a and a developing block 30b. The coating block 30a performs a coating process with respect to the substrate W, and the developing block 30 performs a developing process with respect to the substrate. A plurality of coating blocks 30a are disposed and stacked with each other. A plurality of developing blocks 30b are disposed and stacked with each other.

[0053] According to an embodiment of the present application, Figure 1 three coating blocks 30a are disposed and three developing blocks 30b are disposed. The coating blocks 30a can be disposed below the developing blocks 30b. According to an embodiment, the three coating blocks 30a can be subjected to the same process and can be disposed in the same structure. In addition, the three developing blocks 30b can be subjected to the same process and can be disposed in the same structure.

[0054] Referring to Figure 2 , the coating block 30a includes a heat treatment part 3200, a transport part 3400, and a liquid treatment part 3600.

[0055] The transport part 3400 transports the substrate "W" between the heat treatment part 3200 and the liquid treatment part 3600 inside the coating block 30a. The transport part 3400 can include a first transport section 3402 serving as a first moving passage and a second transport section 3404 serving as a second moving passage. The first transport section 3402 and the second transport section 3404 have a length direction parallel to the first direction 12 and are connected to each other. A first transport robot 3422 and a second transport robot 3424 are disposed in the first transport section 3402 and the second transport section 3404, respectively.

[0056] According to an embodiment, the first and second transfer robots 3422 and 3424 can include a hand 3420 in which the substrate "W" is positioned, and the hand 3420 can be provided to be movable forward and backward, rotatable about the third direction 16, and movable in the third direction 16. Rails 3300 having a length direction parallel to the first direction 12 are provided in the first and second transfer sections 3402 and 3404, and the transfer robots 3422 and 3424 can be provided to be movable on the rails 3300.

[0057] Figure 4 A view showing a hand of a transfer robot.

[0058] Referring to Figure 4 , the hand 3420 has a base 3428 and support protrusions 3429. The base 3428 can have an annular ring shape, a portion of a circumference of the base being curved. The base 3428 has an inner diameter greater than a diameter of the substrate "W". The support protrusions 3429 extend inward from the base 3428. A plurality of support protrusions 3429 are provided to support edge regions of the substrate "W". According to an embodiment, four support protrusions 3429 can be provided at equal intervals.

[0059] Referring to Figure 2 , the first and second transfer sections 3402 and 3404 can be provided in the same structure. The first transfer section 3402 is provided closer to the index module 20, and the second transfer section 3404 is provided closer to the interface module 40.

[0060] The heat treatment section 3200 performs a heat treatment process with respect to the substrate "W". The heat treatment process can include a cooling process and a heating process. The liquid treatment section 3600 supplies a liquid onto the substrate "W" to form a liquid film. The liquid film can be a photoresist film or an anti-reflection film.

[0061] The liquid treatment section 3600 includes a first liquid treatment section 3600-1 having a liquid treatment chamber to coat an anti-reflection film to the substrate "W", and a second liquid treatment section 3600-2 having a liquid treatment chamber to coat a photoresist film to the substrate "W" having the anti-reflection film. The first liquid treatment section 3600-1 is provided at one side of the first transfer section 3402, and the second liquid treatment section 3600-2 is provided at one side of the second transfer section 3404.

[0062] The heat treatment section 3200 can include a first heat treatment section 3200-1 having a heat treatment chamber 3202 to heat treat the substrate "W" associated with coating of the antireflection film, and a second heat treatment section 3200-2 having a heat treatment chamber 3204 to heat treat the substrate "W" associated with coating of the photoresist. The first heat treatment section 3200-1 is disposed at opposite sides of the first transfer section 3402, and the second heat treatment section 3200-2 is disposed at opposite sides of the second transfer section 3404. The heat treatment chamber 3202 disposed at the side of the first transfer section 3402 is referred to as a front heat treatment chamber, and the heat treatment chamber 3204 disposed at the side of the second transfer section 3404 is referred to as a rear heat treatment chamber.

[0063] The processing section 3600-1 for forming the antireflection film on the substrate and the processing section 3200-1 are disposed in the first transfer section 3402, and the processing section 3600-2 for forming the photoresist film on the substrate and the processing section 3200-2 are disposed in the second transfer section 3404.

[0064] Meanwhile, the processing module 30 includes a plurality of buffer chambers 3802 and 3804. Some of the buffer chambers 3802 and 3804 are disposed between the indexing module 20 and the transfer section 3400. Hereinafter, these buffer chambers are referred to as front buffer zones 3802. A plurality of front buffer zones 3802 are provided, and the front buffer zones are stacked in the vertical direction. Other buffer chambers 3802 and 3804 are disposed between the transfer section 3400 and the interface module 40. Hereinafter, these buffer chambers are referred to as rear buffer zones 3804. A plurality of rear buffer zones 3804 are provided, and the rear buffer zones are stacked in the vertical direction. The front buffer zones 3802 and the rear buffer zones 3804 temporarily store a plurality of substrates "W". Meanwhile, buffer transfer robots 3812 and 3814 are disposed in the buffer chambers to transfer the substrates "W".

[0065] Figure 5 A plan view of the heat treatment chamber of the heat treatment section is schematically shown, and 6 is a front view of the heat treatment chamber of Figure 5 .

[0066] The heat treatment chamber 3202 and the heat treatment chamber 3204 have a housing 3210, a cooling unit 3220, a heating unit 3230, and a transfer plate 3240.

[0067] The housing 3210 has a substantially parallelepiped shape. The housing 3210 has an inlet 3211 formed in a side wall thereof to introduce or take out a substrate "W". The inlet can be maintained in an open state. A door (not shown) can be provided to selectively open and close the inlet. A cooling unit 3220, a heating unit 3230, and a transport plate 3240 are provided in the housing 3210. The housing 3210 has a first region 3212 and a second region 3214 formed in the housing 3210. The first region 3212 and the second region 3214 are provided side by side along the second direction 14. According to an embodiment, the cooling unit 3220 is provided in the first region 3212, and the heating unit 3230 is provided in the second region 3214.

[0068] The cooling unit 3220 has a cooling plate 3222. The cooling plate 3222 can have a substantially circular shape when viewed from above. The cooling plate 3222 has a cooling member 3224. According to an embodiment, the cooling member 3224 can be formed inside the cooling plate 3222 as a fluid passage through which a cooling fluid flows.

[0069] The heating unit 3230 has a heating plate 3232, a cover 3234, and a heater 3233. The heating plate 3232 can have a substantially circular shape when viewed from above. The heating plate 3232 can have a diameter greater than that of the substrate "W". The heater 3233 is disposed in the heating plate 3232. The heater 3233 can be provided in the form of a heating resistor to which an electric current is applied. Lift pins 3238 are provided on the heating plate 3232 to be driven in the vertical direction along the third direction 16. The lift pins 3238 receive the substrate "W" from a transport unit outside the heating unit 3230 to place the substrate "W" on the heating plate 3232 or lift the substrate "W" from the heating plate 3232 to deliver the substrate "W" to the transport unit outside the heating unit 3230. According to an embodiment, three lift pins 3238 can be provided. The cover 3234 has an inner space having an open lower portion. The cover 3234 is positioned on an upper portion of the heating plate 3232 and is moved in the vertical direction by a driver 3236. When the cover 3234 is brought into contact with the heating plate 3232, a space surrounded by the cover 3234 and the heating plate 3232 is provided as a heating space for heating the substrate "W".

[0070] The transfer plate 3240 is provided in a shape of a substantially circular plate, and has a diameter corresponding to a diameter of the substrate W. Notches 3244 are formed in edges of the transfer plate 3240. The notches 3244 can have a shape corresponding to the support protrusions 3429 formed on the hand portions 3420 of the transfer robots 3422 and 3424. Further, the number of the notches 3244 can be provided to correspond to the number of the support protrusions 3429 formed in the hand portions 3420, and can be formed at positions corresponding to the support protrusions 3429. When the vertical positions of the hand portions 3420 and the transfer plate 3240 are changed in a state where the hand portions 3420 and the transfer plate 3240 are aligned in the vertical direction, the substrate W is transferred between the hand portions 3420 and the transfer plate 3240. The transfer plate 3240 can be mounted on a guide rail 3249, and can be moved along the guide rail 3249 by a driver 3246 between the first region 3212 and the second region 3214. A plurality of guide grooves 3242 are provided in a shape of a slit in the transfer plate 3240. The guide grooves 3242 extend from an end of the transfer plate 3240 to an inside of the transfer plate 3240. Longitudinal directions of the guide grooves 3242 are provided in the second direction 14, and the guide grooves 3242 are positioned to be spaced apart from each other in the first direction 12. The guide grooves 3242 prevent interference between the transfer plate 3240 and the lift pins 3240 when the substrate W is transferred between the transfer plate 3240 and the heating unit 3230.

[0071] According to an embodiment of the present application, Figure 5 When the substrate W is placed directly on the heating plate 3232, heating of the substrate W is achieved, and cooling of the substrate W is achieved in a state where the transfer plate 3240 having the substrate W is in contact with the cooling plate 3222. The transfer plate 3240 is formed of a material having a heat transfer coefficient, so that heat is smoothly transferred between the cooling plate 3222 and the substrate W. According to an embodiment, the transfer plate 3240 can be formed of a metal material.

[0072] The heating unit 3230 provided in some of the thermal treatment chambers 3202 and 3404 can improve the adhesion rate of the photoresist to the substrate W by supplying a gas during heating of the substrate W. According to an embodiment, the gas can include hexamethyldisilane gas.

[0073] The liquid treatment part 3600 has a plurality of liquid treatment chambers 3602 and 3604. The plurality of liquid treatment chambers 3602 and 3604 can be provided along the longitudinal direction of the transfer unit 3400. Some of the liquid treatment chambers 3602 and 3604 can be provided to be stacked with each other.

[0074] Figure 7 A plan view of the liquid treatment chambers 3602 and 3604 is schematically shown.

[0075] Referring to Figure 7 The liquid processing chambers 3602 and 3604 include a housing 3610, a cup 3620, a support unit 3640, and a liquid supply unit 3660.

[0076] The housing 3610 has substantially a substantially parallelepiped shape. The housing 3610 is formed with an inlet (not shown) in a side wall thereof to introduce or take out a substrate "W". The inlet can be opened by a door (not shown). The cup 3620, the substrate support unit 3640, and the liquid supply unit 3660 are disposed in the housing 3610. A fan filter unit 3670 can be disposed on a top wall of the housing 3610 to form a downward air flow inside the housing 3610. The cup 3620 has a processing space having an open upper portion. The support unit 3640 is disposed in the processing space to support the substrate "W". The support unit 3640 is disposed so that the substrate "W" is rotatable during liquid processing. The liquid supply unit 3660 supplies a liquid to the substrate "W" supported by the support unit 3640.

[0077] Referring again to Figure 2 Some of the liquid processing chambers 3602 and 3604 can be disposed at a side of the first transfer section 3402. Hereinafter, these liquid processing chambers 3602 are referred to as front liquid processing chambers. Other liquid processing chambers 3602 and 3604 can be disposed at a side of the second transfer section 3404. Hereinafter, these liquid processing chambers are referred to as rear liquid processing chambers 3604. The front liquid processing chambers 3602 can be disposed at one side of the first transfer section 3402 in the longitudinal direction. The rear liquid processing chambers 3604 can be disposed at one side of the second transfer section 3404 in the longitudinal direction.

[0078] A first liquid is coated on the substrate "W" in the front liquid processing chamber 3602, and a second liquid is coated on the substrate "W" in the rear liquid processing chamber 3604. The first liquid can be different from the second liquid. According to an embodiment, the first liquid is an anti-reflection liquid, and the second liquid is a photoresist. The photoresist can be applied to the substrate "W" coated with the anti-reflection film.

[0079] The interface module 40 connects the processing module 30 with the external exposure apparatus 50. The interface module 40 has an interface frame 4100, an attached process chamber 4200, an interface buffer 4400, and a transfer member 4600.

[0080] A fan filter unit can be provided at the upper end of the interface frame 4100 to form a descending airflow in the interface frame 4100. An additional process chamber 4200, an interface buffer 4400, and a transfer member 4600 are provided inside the interface frame 4100. Before the substrate "W" is introduced into the exposure apparatus 50, the substrate "W" subjected to a process in the coating block 30a can be subjected to a predetermined additional process in the additional process chamber 4200. Alternatively, before the substrate "W" is introduced into the developing block 30b, the substrate "W" subjected to a process in the exposure apparatus 50 can be subjected to a predetermined additional process in the additional process chamber 4200. According to an embodiment, the additional process can be an edge exposure process for exposing an edge region of the substrate "W", a top surface cleaning process for cleaning a top surface of the substrate "W", or a bottom surface cleaning process for cleaning a bottom surface of the substrate "W". A plurality of additional process chambers 4200 can be provided, and the plurality of additional process chambers can be provided stacked one on another. All of the additional process chambers 4200 can be provided to perform the same process. Alternatively, some of the additional process chambers can be provided to perform mutually different processes.

[0081] The interface buffer 4400 is provided with a space for temporarily staying the substrate "W" transferred between the interface buffer 4400, the coating block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b. A plurality of interface buffers 4400 can be provided, and can be provided stacked one on another.

[0082] The transfer member 4600 transfers the substrate "W" between the coating block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b. The transfer member 4600 can be provided with one or more robot hands. According to an embodiment, the transfer member 4600 has a first robot hand 4602 and an interface robot hand 4606.

[0083] The first robot hand 4602 can be provided to transfer the substrate "W" between the coating block 30a, the additional process chamber 4200, and the interface buffer 4400, and the interface robot hand 4606 can be provided to transfer the substrate "W" between the interface buffer 4400 and the exposure apparatus 50.

[0084] The hands of the index robot hand 2200, the first robot hand 4602, and the interface robot hand 4606 can all have the same shape as the hands of the transfer robot hands 3422 and 3424. Alternatively, the hands of the robot hands that directly transfer and receive the substrate "W" together with the transfer plate 3240 of the heat treatment chamber are provided in the same shape as the shape of the hands 3420 of the transfer robot hands 3422 and 3424, and the hands of the remaining robot hands can be provided in a different shape.

[0085] Referring again toFigure 2 The cooling transfer module 3900 is provided for transferring and cooling the substrate "W" between the first transfer robot 3422 and the second transfer robot 3424. The cooling transfer module 3900 is provided in the heat treatment part 3200 adjacent to the boundary of the first movement passage of the first transfer robot 3422 and the second movement passage of the second transfer robot 3424. The cooling transfer module 3900 can be stacked in a multi-stage manner on each cooling transfer module 3900, which is similar to the heat treatment chamber.

[0086] Figure 8 and Figure 9 FIG. 10 shows a view of the cooling transfer module.

[0087] Referring to Figure 2 , Figure 8 and Figure 9 The cooling transfer module 3900 includes a housing 3910, a first plate 3920, a second plate 3930, and a transfer plate 3940.

[0088] The housing 3910 has a substantially parallelepiped shape. The housing 3910 is formed with a first opening 3911 and a second opening 3912 in a side wall thereof to introduce or extract the substrate "W". The first opening 3911 and the second opening 3912 can be maintained in an open state. A door (not shown) can be provided to selectively open and close the openings. The first opening 3911 allows the substrate to enter and exit by the first transfer robot, and the second opening 3912 allows the substrate to enter and exit by the second transfer robot.

[0089] The first plate 3920, the second plate 3930, and the transfer plate 3940 are provided in the housing 3910. The housing 3910 has a first region 3914 and a second region 3916 in the housing 3910. The first region 3914 and the second region 3916 are provided side by side in a first direction 12, which is a longitudinal direction of the transfer part. According to an embodiment, the first plate 3920 is provided in the first region 3914, and the second plate 3930 is provided in the second region 3916. The first region 3914 is provided in a first substrate transfer region into which the first transfer robot can enter, and the second region 3916 is provided in a second substrate transfer region into which the second transfer robot can enter.

[0090] The first plate 3920 has a cooling plate 3922. The cooling plate 3922 can have a substantially circular shape when viewed from above. The cooling plate 3922 has a cooling member 3924. According to an embodiment, the cooling member 3924 can be formed inside the cooling plate 3922 as a fluid passage through which a cooling fluid flows.

[0091] The second plate 3930 can have a substantially circular shape when viewed from above. Lift pins 3938 are provided on the second plate 3930 to vertically drive along the third direction 16. The lift pins 3938 receive the substrate "W" from the transfer plate 3940 and place the substrate "W" on the second plate 3930, or lift the substrate "W" from the top surface of the second plate 3930 and transfer the substrate "W" to the second transfer robot. For example, the second plate 3930 can have a cooling plate 3932 to cool the substrate "W" seated on the top surface of the cooling plate 3932. A cooling member 3934 having fluid passages for cooling fluid flow can be provided inside the cooling plate 3922.

[0092] The transfer plate 3940 is provided in the shape of a substantially circular plate and has a diameter corresponding to the diameter of the substrate "W". Notches 3944 are formed in the edges of the transfer plate 3940. The notches 3944 can have shapes corresponding to the support protrusions 3429 formed on the hands 3420 of the first and second transfer robots 3422 and 3424. In addition, the number of notches 3244 can be provided to correspond to the number of support protrusions 3429 formed in the hands 3420, and can be formed at positions corresponding to the support protrusions 3429. When the vertical positions of the hands 3420 and the transfer plate 3940 are changed in a state in which the hands 3420 and the transfer plate 3940 are aligned in the vertical direction, the substrate "W" is transferred between the hands 3420 and the transfer plate 3940. The transfer plate 3940 can be mounted on a guide rail 3949 and can move along the guide rail 3949 between the first and second regions 3914 and 3916 by a driver 3946. A plurality of guide grooves 3942 are provided in the transfer plate 3940 in the shape of a slit. The guide grooves 3942 extend from the ends of the transfer plate 3940 to the inside of the transfer plate 3940. The longitudinal direction of the guide grooves 3942 is provided in the second direction 12, and the guide grooves 3942 are positioned to be spaced apart from each other in the first direction 14. The guide grooves 3942 prevent interference between the transfer plate 3940 and the lift pins 3240 when the substrate "W" is transferred between the transfer plate 3940 and the second plate 3930

[0093] According to an embodiment with reference to Figure 8 and Figure 9 , the substrate "W" is cooled in a state in which the transfer plate 3940 having the substrate "W" is in contact with the cooling plate 3922 of the first plate 3920. The transfer plate 3940 is formed of a material having a heat transfer coefficient, so that heat is smoothly transferred between the cooling plate 3922 and the substrate "W". According to an embodiment, the transfer plate 3940 can be formed of a metal material.

[0094] For another example, cooling of the substrate "W" can be performed in a case in which the substrate "W" is placed on the second plate 3930.

[0095] For example, cooling of the substrate "W" can be performed in a case where the substrate is transferred from the first area 3914 to the second area 3916 by the transfer plate 3940. To this end, a cooling member (not shown) having a flow path for the flow of a cooling fluid can be provided inside the transfer plate 3940.

[0096] According to the inventive concept, the cooling transfer module 3900 can cool the substrate because a cooling unit is provided to at least one of the first plate 3920, the second plate 2930, and the transfer plate 3940, thereby cooling the substrate.

[0097] As described above, according to the inventive concept, two transfer apparatuses can be provided in the process module, and the cooling transfer module is interposed between the two transfer apparatuses so that the two transfer apparatuses transfer or receive the substrate "W", thereby improving the accessibility of the transfer robot and overcoming the difficulty in maintenance and air control.

[0098] Hereinafter, a method of processing a substrate using the above-described apparatus for processing a substrate according to the embodiments will be described with reference to Figure 10 and Figure 11

[0099] Figure 10 is a flowchart sequentially showing a method for substrate processing, and Figure 11 is a view schematically showing a path for transferring a substrate until an exposure apparatus is transferred into a container. Hereinafter, the details of an exposure process and a development process will be omitted.

[0100] Referring to Figure 10 and Figure 11 , a coating process (S20) for the substrate "W" is performed by sequentially performing a low refractive film coating process (S22) in the front liquid treatment chamber 3602 of the first liquid treatment section 3600-1, a heat treatment process (S23) in the front heat treatment chamber 3202 of the first heat treatment section 3200-1, a cooling process (S24) in the cooling transfer chamber (3900), a photoresist film coating process (S25) in the rear liquid treatment chamber of the second liquid treatment section 3600-2, and a heat treatment process (S26) in the rear heat treatment chamber 3204 of the second heat treatment section 3200-2.

[0101] Hereinafter, a path of transferring the substrate "W" in a coating block will be described with reference to Figure 11

[0102] ​​The first transfer robot 3422 takes out the substrate "W" from the front buffer 3802 and transfers the substrate "W" to the front liquid treatment chamber 3602. When the antireflection film is completely coated, the first transfer robot 3422 takes out the substrate "W" from the front liquid treatment chamber 3602 and transfers the substrate "W" to the front heat treatment chamber 3202. When the heat treatment is completed, the first transfer robot 3422 takes out the substrate "W" from the front heat treatment chamber 3202 and transfers the substrate "W" to the transfer plate 3940 through the first opening 3911 of the cooling transfer chamber 3900. The substrate "W" is cooled and transferred in the cooling transfer chamber 3900. The completely cooled substrate "W" is standby on the second plate 3930. The second transfer robot 3424 takes out the substrate "W" through the second opening 3912 and transfers the substrate "W" to the rear liquid treatment chamber 3604. When the photoresist film is completely coated, the second transfer robot 3424 takes out the substrate "W" from the rear liquid treatment chamber 3604 and transfers the substrate "W" to the rear heat treatment chamber 3204. When the heat treatment is completed, the second transfer robot 3424 takes out the substrate "W" from the rear heat treatment chamber 3204 and transfers the substrate "W" to the rear buffer 3804. The substrate "W" can be cooled in the rear buffer 3804. For another embodiment, when the heat treatment is completed, the second transfer robot 3424 takes out the substrate "W" from the rear heat treatment chamber 3204 and transfers the substrate "W" to the second plate 3930 through the second opening 3912 of the cooling transfer chamber 3900 to cool the substrate "W". The substrate "W" can be transferred to the rear buffer 3804.

[0103] As a reference, a heat treatment process of the substrate can be added before coating the antireflection film and before coating the photoresist film.

[0104] According to the present inventive concept, a plurality of treatment chambers can be provided in a limited space in a coating module or a developing module.

[0105] Further, according to the present inventive concept, a transfer step of the substrate can be reduced when performing a treatment process.

[0106] Further, according to the present inventive concept, an air flow can be easily controlled in a transfer space.

[0107] Further, according to the present inventive concept, a cooling process can be performed with respect to a substrate in a process of transferring the substrate in a cooling transfer chamber.

[0108] Effects of the present inventive concept are not limited to what has been described above, and any additional effects of the present inventive concept that are not mentioned above can be clearly understood from the description by those skilled in the art to which the present inventive concept pertains.

[0109] The above description is intended for the purpose of illustration. Furthermore, the above-described content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, variations, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the scope of the technical or knowledge of those skilled in the art. The written embodiments describe the best state for implementing the technical spirit of the inventive concept, and various changes necessary in the specific application field and purpose of the inventive concept can be made. The written embodiments describe the best state for implementing the technical spirit of the inventive concept, and various changes necessary in the specific application field and purpose of the inventive concept can be made. Furthermore, it should be understood that the appended claims include other embodiments.

[0110] Although the inventive concept has been described with reference to embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above-described embodiments are not restrictive, but are illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a transfer section; a first path and a second path, the first path and the second path being disposed in a longitudinal direction of the transfer section and connected to each other; a first transfer robot and a second transfer robot, the first transfer robot being disposed in the first path and the second transfer robot being disposed in the second path; a liquid processing section disposed at one side of the transfer section to apply a liquid to the substrate by supplying the liquid to the substrate; and a heat processing section disposed at an opposite side of the transfer section to face the liquid processing section and configured to perform a heat process with respect to the substrate, wherein the heat processing section comprises: a first heat processing section having a heat processing chamber disposed at an opposite side of the first path; a second heat processing section having a heat processing chamber disposed at an opposite side of the second path; a cooling transfer module disposed to transfer and cool the substrate between the first transfer robot and the second transfer robot, wherein the cooling transfer module is disposed between the first heat processing section and the second heat processing section. The cooling transfer module is disposed at a boundary where a first movement passage of the first transfer robot meets a second movement passage of the first transfer robot.

2. The apparatus of claim 1, wherein, The cooling transfer module comprises:

3. The apparatus of claim 1, wherein, a housing having a first area and a second area disposed in the longitudinal direction of the transfer section; and a transfer plate disposed inside the housing to transfer the substrate between the first area and the second area. The first area is disposed in a first substrate transfer area into which the first transfer robot is able to enter, and 4. The apparatus of claim 3, wherein, wherein the second area is disposed in a second substrate transfer area into which the second transfer robot is able to enter. The housing comprises:

5. The apparatus of claim 3, wherein, a first opening adjacent to the first area, wherein the substrate is introduced to or extracted from the first opening by the first transfer robot; and a second opening adjacent to the second area, wherein the substrate is introduced to or extracted from the second opening by the second transfer robot. The cooling transfer module comprises:

6. The apparatus of claim 3, wherein, a cooling unit for cooling the substrate; and wherein the cooling unit is disposed in at least one of the first area and the second area. The transfer plate comprises:

7. The apparatus of claim 3, wherein, a cooling passage formed in the transfer plate such that a coolant for cooling the substrate passes through the cooling passage. The liquid processing section comprises:

8. The apparatus of claim 3, wherein, a first liquid processing chamber disposed on a movement passage into which the first transfer robot is able to enter to perform a process of applying a first liquid to the substrate; and a second liquid processing chamber disposed on a movement passage into which the second transfer robot is able to enter to perform a process of applying a second liquid to the substrate. a second liquid processing chamber disposed on a moving passage into which the second transfer robot can enter to apply a second liquid to the substrate.

9. The apparatus of claim 8, wherein, the first liquid is a liquid for forming an anti-reflection film on the substrate; and wherein the second liquid is a liquid for forming a photoresist film on the anti-reflection film formed on the substrate. 10.An apparatus for processing a substrate, the apparatus comprising: an indexing module and a processing module sequentially arranged in a first direction, wherein the indexing module comprises: a load port for placing a container receiving the substrate; and an indexing frame having an indexing robot to transfer the substrate between the processing module and the container placed in the load port, wherein the processing module comprises: a transfer section; a first path and a second path disposed in a longitudinal direction of the transfer section and connected to each other; a first transfer robot disposed in the first path and a second transfer robot disposed in the second path; a liquid processing section disposed at one side of the transfer section to apply a liquid to the substrate by supplying the liquid to the substrate; and a heat processing section at an opposite side of the transfer section to face the liquid processing section to perform heat processing with respect to the substrate; wherein the heat processing section comprises: a first heat processing section having a heat processing chamber disposed at an opposite side of the first path; a second heat processing section having a heat processing chamber disposed at an opposite side of the second path; a cooling transfer module disposed to transfer the substrate between the first transfer robot and the second transfer robot and cool the substrate, wherein the cooling transfer module is disposed between the first heat processing section and the second heat processing section.

11. The apparatus of claim 10, wherein, the cooling transfer module comprises: a housing disposed in the longitudinal direction of the transfer section and having a first area into which the first transfer robot can enter and a second area into which the second transfer robot can enter; a transfer plate disposed in the housing to transfer the substrate between the first area and the second area; and a cooling unit for cooling the substrate disposed in one of the first area and the second area.

12. The apparatus of claim 10, wherein, the cooling transfer module comprises: a housing disposed in the longitudinal direction of the transfer section and having a first area into which the first transfer robot can enter and a second area into which the second transfer robot can enter; and a transfer plate disposed in the housing to transfer the substrate between the first area and the second area, The cooling passage is provided in the transfer plate such that a coolant for cooling the substrate passes through the cooling passage.

13. The apparatus of claim 11, wherein, The housing includes: a first opening adjacent to the first region, wherein the substrate is introduced into or taken out of the first opening by the first transfer robot; and a second opening adjacent to the second region, wherein the substrate is introduced into or taken out of the second opening by the second transfer robot.

14. The apparatus of claim 11, wherein, The liquid processing section includes: a first liquid processing section provided on a moving passage into which the first transfer robot can enter to perform a process of applying a first liquid to the substrate; and a second liquid processing chamber provided on a moving passage into which the second transfer robot can enter to perform a process of applying a second liquid to the substrate.

15. An apparatus for processing a substrate, the apparatus comprising: a transfer section for providing a first transfer section and a second transfer section in a first direction; wherein the first transfer section and the second transfer section are connected to each other; a first transfer robot provided in the first transfer section; a second transfer robot provided in the second transfer section; a first processing group including: a first liquid processing module provided on opposite sides of the first transfer section to apply an antireflection film to the substrate; and a first heat treatment module for performing heat treatment on the substrate associated with the application of the antireflection film; a second processing group including: a second liquid processing module provided on opposite sides of the second transfer section to apply a photoresist film to the substrate having the antireflection film; and a second heat treatment module for performing heat treatment on the substrate associated with the application of the photoresist, and a cooling transfer module inserted between the first heat treatment module and the second heat treatment module adjacent to a boundary at which the first transfer section and the second transfer section meet, and configured to transfer and cool the substrate between the first transfer robot and the second transfer robot.

16. The apparatus of claim 15, wherein, The cooling transfer module includes: a housing provided in a longitudinal direction of the transfer section and having a first region into which the first transfer robot can enter and a second region into which the second transfer robot can enter; a transfer plate provided in the housing to transfer the substrate from the first region to the second region; a cooling unit provided in one of the transfer plate, the first region, and the second region to cool the substrate.

17. The apparatus of claim 16, wherein, A first plate is provided in the second region, the substrate transferred by the transfer plate is placed on the first plate, and the substrate to be transferred by the second transfer robot is standby on the transfer plate.

18. A method for processing a substrate by the apparatus according to claim 15, the method comprising: forming an antireflection film on the substrate in the first processing group; coating a photoresist film on the antireflection film formed on the substrate in the second processing group; and cooling the substrate with the antireflection film in the cooling transfer module inserted between the first processing group and the second processing group before coating the photoresist film, wherein, in the cooling, the first transfer robot transferring the substrate in the first processing group introduces the substrate into the cooling transfer module before the cooling, and the second transfer robot transferring the substrate in the second processing group takes out the substrate from the cooling transfer module after the cooling. In the cooling, the substrate is cooled by one of a first region, a second region, and a transfer plate, the first transfer robot can enter the first region, the second transfer robot can enter the second region, and the transfer plate is used to transfer the substrate from the first region to the second region.

19. The method of claim 18, wherein, The first liquid is a liquid for forming the antireflection film on the substrate, and 20. The method of claim 18, wherein, wherein the second liquid is a liquid for forming the photoresist film on the antireflection film formed on the substrate. ​

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