A self-oscillating wafer cleaning and drying device

Abstract

The present invention discloses a self-oscillating wafer cleaning and drying device, comprising a cleaning tank and an oscillating mechanism disposed inside the cleaning tank, wherein the oscillating mechanism is provided with at least two wafer box carrying areas, wherein the wafer box carrying areas are used to place wafer boxes; the oscillating mechanism comprises a driving motor, a sliding track, a sliding block, a shaft-connected track and a swing arm, wherein the sliding track is arranged parallel to the shaft-connected track, the sliding track is located above the shaft-connected track, the sliding block is slidably mounted on the sliding track, and the driving motor is used to control the sliding block to reciprocate on the sliding track. The present invention forms an arc-shaped motion path through the oscillating mechanism, so that the wafer forms special vibrations and swings during the oscillation process. The effective swing motion makes the setting of the cleaning equipment more flexible, and improves the universality and feasibility of the general wet process construction.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to a self-oscillating wafer cleaning and drying device. Background Art

[0002] Wafer drying is a critical step in semiconductor wafer cleaning, and different drying techniques are used for different wafer products. Wafer drying is the final step in the wet cleaning process. Wafer drying must ensure the effective removal of moisture from the wafer surface while also controlling surface moisture and surface cleanliness.

[0003] For wafer products with surface patterning, the capillary phenomenon formed by water molecules under the surface tension of the pattern with a high aspect ratio will cause water to be absorbed into the pores or pore columns with a high aspect ratio, resulting in the possibility of water molecules flowing back to the huge void area or pore column under the pattern. During the drying process, although the surface is completely dried, most of the water remains deposited in the depletion area, resulting in unsatisfactory drying effect. Summary of the Invention

[0004] In response to the problems existing in the prior art, the present invention provides a self-oscillating wafer cleaning and drying device. The present invention enables the wafer box to produce reciprocating oscillating motion under a stable cycle, effectively removing liquid residue on the wafer surface and improving the drying effect of the wafer.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides a self-oscillating wafer cleaning and drying device, comprising a cleaning tank and an oscillating mechanism disposed inside the cleaning tank, wherein the oscillating mechanism is provided with at least two wafer box carrying areas, and the wafer box carrying areas are used to place wafer boxes;

[0007] The swing mechanism includes a drive motor, a sliding track, a sliding block, a shaft-connected track and a swing arm. The sliding track is arranged parallel to the shaft-connected track, the sliding track is located above the shaft-connected track, the sliding block is slidably mounted on the sliding track, and the drive motor is used to control the sliding block to reciprocate on the sliding track.

[0008] There are at least two swing arms, each of which includes a first arm and a second arm arranged in parallel. A sliding groove is provided on the upper part of the first arm along the length direction. A sliding wheel is correspondingly installed on the sliding block. The sliding wheel is installed in the sliding groove. The lower end of the first arm is axially mounted on the connection point on the shaft-connected track, and the wafer box carrying area is arranged at the lower end of the second arm.

[0009] As a preferred technical solution, the length of the second arm is greater than that of the first arm.

[0010] As a preferred technical solution, the wafer box carrying area is arranged on a side of the second arm away from the first arm.

[0011] As a preferred technical solution, a discharge port is provided at the bottom of the cleaning tank, and a top cover is provided at the top of the cleaning tank, and the top cover is connected to the cleaning tank shaft.

[0012] As a preferred technical solution, the swing angle range of the swing arm is 15-30 degrees.

[0013] As a preferred technical solution, the cleaning agent in the cleaning tank is a mixture of nitrogen and isopropyl alcohol.

[0014] As a preferred technical solution, the wafer box carrying area is a hollow structure.

[0015] As a preferred technical solution, the shell of the wafer cleaning tank is made of metal material.

[0016] Compared with the prior art, the present invention has the following technical effects:

[0017] (1) The present invention forms an arc-shaped motion path through a swinging mechanism, so that the wafer forms special vibration and swing during the swinging process. The effective swing motion makes the setting of the cleaning equipment more flexible, and improves the universality and feasibility of the general wet process construction.

[0018] (2) The present invention realizes micro-swing of the wafer through an oscillating motion mechanism, so that the water molecules in the specially patterned high aspect ratio structure can continuously destroy the surface tension between the water molecules and the high aspect ratio pore structure through the interaction of heated nitrogen and isopropyl alcohol during the drying process, and conversely, the water molecules in the depletion zone are continuously precipitated by the capillary phenomenon to undergo a drying reaction of water molecule replacement.

[0019] (3) The present invention causes the patterned microstructure on the wafer to have a slight tilt angle, and the droplet structure moves at the corner of the structure. By utilizing the instantaneous imbalance of the tension between the droplet and the corner of the microstructure, it is easier to readjust the tension between the water molecules, isopropyl alcohol and the wafer surface during nitrogen evaporation or isopropyl alcohol replacement. In the process of water molecules being successively extracted from the wafer pore structure, the structural integrity of the water molecule droplets is analytically destroyed and disintegrated. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a structural schematic diagram of the self-oscillating wafer cleaning device of the present invention.

[0022] Figure 2 This is one of the structural diagrams of the swing mechanism of the present invention.

[0023] Figure 3 This is the second structural diagram of the swing mechanism of the present invention.

[0024] Figure 4 It is a motion diagram of the swing mechanism of the present invention.

[0025] Among them, the specific description of the accompanying drawings is as follows: cleaning tank 1, top cover 2, drive motor 3, sliding rail 4, sliding block 5, shaft-connected rail 6, swing arm 7, sliding groove 8, wafer supporting area 9, first support arm 10, and second support arm 11. DETAILED DESCRIPTION

[0026] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0027] like Figures 1-4 As shown, this embodiment provides a self-oscillating wafer cleaning and drying device, comprising a cleaning tank 1 and an oscillating mechanism disposed within the cleaning tank 1. The oscillating mechanism is provided with two wafer cassette carrying areas 9 for placing wafer cassettes. The outer shell of the wafer cleaning tank 1 is made of metal material.

[0028] In this embodiment, the swing mechanism includes a drive motor 3, a sliding rail 4, a sliding block 5, an axially connected rail 6 and a swing arm 7. The sliding rail 4 is arranged parallel to the axially connected rail 6, and the sliding rail 4 is located above the axially connected rail 6. The sliding block 5 is slidably installed on the sliding rail 4, and the drive motor 3 is used to control the sliding block 5 to perform reciprocating motion on the sliding rail 4.

[0029] There are two swing arms 7, which include a first arm 10 and a second arm 11 arranged in parallel. A sliding groove 8 is provided on the upper part of the first arm 10 along the length direction. A sliding wheel is correspondingly installed on the sliding block 5, and the sliding wheel is installed in the sliding groove 8. The lower end of the first arm 10 is axially installed with the connection point on the axial track 6, and the wafer box carrying area is set at the lower end of the second arm 11.

[0030] The movement process of this embodiment is: the sliding block 5 is driven by the driving motor 3 to move along the sliding track 4, and the movement of the sliding block 5 drives the sliding wheel to slide along the sliding groove 8, so that the swing arm 7 swings along the axis connection point on the axis connection track 6, realizing the simple harmonic motion of the wafer.

[0031] In this embodiment, the length of the second arm 11 is greater than that of the first arm 10. This arrangement increases the swing amplitude of the wafer, and the swing angle range of the swing arm 7 is 15-30 degrees, thereby achieving better drying. The wafer box carrying area is arranged on the side of the second arm 11 away from the first arm 10, thereby avoiding mutual interference during movement. A discharge port is provided at the bottom of the cleaning tank 1, and a top cover 2 is provided at the top of the cleaning tank 1, which is connected to the axis of the cleaning tank 1. The cleaning agent in the cleaning tank 1 is a mixture of nitrogen and isopropyl alcohol, and the wafer box carrying area 9 is a hollow structure. The present invention realizes a slight swing of the wafer through a swinging motion mechanism, so that the water molecules in the specially patterned high aspect ratio structure can continuously destroy the surface tension of the water molecules and the high aspect ratio pore structure through the interaction of heated nitrogen and isopropyl alcohol during the drying process, and reversely causes the water molecules in the capillary phenomenon of the depletion zone to be continuously precipitated to undergo a drying reaction of water molecule replacement. Although the above embodiments have been described in detail for the present invention, it should be understood by those skilled in the art that modifications or improvements can be made based on the contents disclosed in the present invention without departing from the spirit and scope of the present invention, and that these modifications and improvements are within the spirit and scope of the present invention.

Claims

1. A self-oscillating wafer cleaning and drying device, characterized in that: The invention comprises a cleaning tank and a swing mechanism arranged inside the cleaning tank, wherein the swing mechanism is provided with at least two wafer box carrying areas, and the wafer box carrying areas are used to place wafer boxes; The swing mechanism includes a drive motor, a sliding track, a sliding block, a shaft-connected track and a swing arm. The sliding track is arranged parallel to the shaft-connected track, the sliding track is located above the shaft-connected track, the sliding block is slidably mounted on the sliding track, and the drive motor is used to control the sliding block to reciprocate on the sliding track. At least two swing arms are provided, and the swing arms include a first arm and a second arm provided in parallel. The length of the second arm is greater than that of the first arm. A sliding groove is provided on the upper part of the first arm along the length direction. A sliding wheel is correspondingly installed on the sliding block, and the sliding wheel is installed in the sliding groove. The lower end of the first arm is axially installed with the connection point on the shaft-connected track, and the wafer box carrying area is provided at the lower end of the second arm; the swing angle range of the swing arm is 15-30 degrees.

2. The self-oscillating wafer box cleaning and drying device according to claim 1, characterized in that: The wafer box carrying area is arranged on a side of the second support arm away from the first support arm.

3. The self-oscillating wafer box cleaning and drying device according to claim 1, characterized in that: The bottom of the cleaning tank is provided with a discharge port, the top of the cleaning tank is provided with a top cover, and the top cover is connected to the cleaning tank shaft.

4. The self-oscillating wafer box cleaning and drying device according to claim 1, characterized in that: The cleaning agent in the cleaning tank is a mixture of nitrogen and isopropyl alcohol.

5. The self-oscillating wafer box cleaning and drying device according to claim 1, characterized in that: The wafer box carrying area is a hollow structure.

6. The self-oscillating wafer box cleaning and drying device according to claim 1, characterized in that: The shell of the wafer cleaning tank is made of metal material.

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