Wire bonding device, method for measuring opening amount of clamping device, and method for calibrating clamping device

Abstract

The present invention provides a wire bonding device, a measurement method, and a calibration method for a clamping device, which can measure the opening amount of the clamping device in a state assembled in the bonding device. The wire bonding device of one embodiment includes: a clamping device including a pair of arms; a platform that moves the clamping device in a horizontal direction; a rod member; a contact detection unit that detects contact between the rod member and the clamping device; and a control device that controls the opening and closing of the pair of arms and the operation of the platform, and obtains position information of the clamping device. The control device calculates the opening amount of the pair of arms based on the position information of the clamping device when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are closed, and the position information of the clamping device when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are opened.

Description

Technical Field

[0001] The present disclosure relates to a wire bonding device, a measuring method, and a calibration method for a clamping device. Background Art

[0002] Wire bonding devices are known for electrically connecting electrodes formed on a semiconductor chip to electrodes formed on a circuit board using metal wires. For example, the wire bonding device described in Patent Document 1 below includes a solder pin through which a bonding wire is inserted, a first clamper that moves in conjunction with the solder pin, a second clamper that holds the wire above the first clamper, and a control unit that controls the opening and closing of the first and second clampers.

[0003] The device joins the wire with the first clamp closed and the second clamp open, then raises the soldering needle and the first clamp to cut the wire. Furthermore, the soldering needle and the first clamp are raised with the first clamp open and the second clamp closed, allowing the wire to extend from the soldering needle.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-161176 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] In the wire bonding device described above, in order to perform the desired wire bonding, it is desirable to control the opening amount of the clamping device holding the wire with high precision. However, because the opening amount of the clamping device is affected by the operating environment of the wire bonding device, the opening amount of the clamping device installed on multiple wire bonding devices with different operating environments sometimes produces mechanical differences. If there are mechanical differences in the opening amount of the clamping device, the loop shape or tail length of the wire will become uneven, which will cause the reliability of the wire bonding device to decrease. Therefore, it is desirable to measure the opening amount of the clamping device with high precision.

[0009] Furthermore, if the clamp is removed from the bonding apparatus, the amount of clamp opening can be measured using a laser displacement meter or the like. However, since the amount of clamp opening is also affected by the temperature conditions during use of the wire bonding apparatus, it is necessary to measure the amount of clamp opening while the wire bonding apparatus is assembled in the bonding apparatus.

[0010] Technical means to solve the problem

[0011] The wire bonding device of one embodiment includes: a clamping device including a pair of arms; a platform for moving the clamping device in a horizontal direction; a rod member; a contact detection unit for detecting contact between the rod member and the clamping device; and a control device for controlling the opening and closing of the pair of arms and the operation of the platform and obtaining position information of the clamping device, and the control device performs: a first control for moving the clamping device so that the outer side surface of the first arm of the pair of arms contacts the rod member when the pair of arms are closed, and obtaining position information of the clamping device when contacting the rod member; a second control for moving the clamping device so that the outer side surface of the first arm contacts the rod member when the pair of arms are opened, and obtaining position information of the clamping device when contacting the rod member; and a third control for calculating the opening amount of the pair of arms based on the position information of the clamping device obtained in the first control and the second control.

[0012] In the wire bonding device of the embodiment described above, the amount of opening of the clamping device is determined based on positional information obtained when the outer side surface of the first arm contacts the rod member when the pair of arms are closed, and when the outer side surface of the first arm contacts the rod member when the pair of arms are open. Therefore, the amount of opening of the clamping device can be measured while the device is assembled in the wire bonding device.

[0013] In one embodiment, the control device also performs: a fourth control, in which the outer side surface of the second arm in the pair of arms is brought into contact with the rod member by moving the clamping device when the pair of arms are closed, and position information of the clamping device when in contact with the rod member is obtained; and a fifth control, in which the outer side surface of the second arm is brought into contact with the rod member when the pair of arms are opened by moving the clamping device, and position information of the clamping device when in contact with the rod member is obtained, and in the third control, the position information of the clamping device obtained in the fourth control and the fifth control is also used to calculate the opening amount of the pair of arms.

[0014] In the embodiment, the opening amount of the clamping device can be measured with higher accuracy by also using the position information of the outer side surface of the second arm when the pair of arms are closed and the position information of the outer side surface of the second arm when the pair of arms are opened to calculate the opening amount of the clamping device.

[0015] In one embodiment, the control device may further execute a sixth control performed before the first control, wherein the sixth control moves the clamping device so that the front end of the first arm or the second arm contacts the front end of the rod member and obtains position information of the clamping device when in contact with the rod member.

[0016] In the above embodiment, since the position information of the clamp device when the tip of the first arm or the second arm is brought into contact with the tip of the rod member is acquired, the position information of the tip of the rod member can be acquired.

[0017] In one embodiment, a lifting mechanism for moving the rod member in the vertical direction may be further included.

[0018] In the above embodiment, by moving the rod in the up-down direction, it is possible to prevent the clamping device from contacting or interfering with the rod member during wire bonding.

[0019] In one embodiment, a method for measuring the amount of opening of a clamping device including a pair of arms that can be opened and closed is provided. The method includes: a first step of moving the clamping device so that the outer side surface of a first arm of the pair of arms contacts a rod member while the pair of arms are closed, and obtaining position information of the clamping device at the time of contact with the rod member; a second step of moving the clamping device so that the outer side surface of the first arm contacts the rod member while the pair of arms are open, and obtaining position information of the clamping device at the time of contact with the rod member; and a third step of calculating the amount of opening of the pair of arms based on the position information of the clamping device obtained in the first and second steps.

[0020] As described above, in the method for measuring the opening amount of the clamp device according to the embodiment, the opening amount of the clamp device can be measured in a state where the clamp device is mounted in the wire bonding apparatus.

[0021] The measuring method of one embodiment further includes: a fourth step, in which the outer side surface of the second arm of the pair of arms is brought into contact with the rod member by moving the clamping device when the pair of arms are closed, and the position information of the clamping device when the arm contacts the rod member is obtained; and a fifth step, in which the outer side surface of the second arm is brought into contact with the rod member when the pair of arms are opened, and the position information of the clamping device when the arm contacts the rod member is obtained. In the third step, the position information of the clamping device obtained in the fourth and fifth steps can also be used to calculate the opening amount of the pair of arms.

[0022] In the measuring method of the embodiment, the opening amount of the clamp device can be measured with higher accuracy.

[0023] The measuring method of one embodiment may further include a sixth step performed before the first step, wherein the sixth step moves the clamping device so that the tip of the first arm or the second arm contacts the tip of the rod member, and obtains position information of the clamping device when in contact with the rod member.

[0024] In the measuring method of the above embodiment, the position information of the tip portion of the rod member can be acquired.

[0025] A method for calibrating a clamping device according to one embodiment includes the steps of determining an opening amount of the clamping device using the above-described measuring method, and calibrating the clamping device based on the opening amount of the clamping device.

[0026] In the correction method, the clamping device can be corrected to reduce the error between the opening amount of the clamping device specified by the control signal and the actual opening amount of the clamping device.

[0027] Effects of the Invention

[0028] According to one embodiment and various implementations of the present invention, the opening amount of the clamping device can be measured in a state where the clamping device is assembled to the joining device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a perspective view showing a wire bonding apparatus according to one embodiment.

[0030] Figure 2 This is a side view showing a wire bonding apparatus according to one embodiment.

[0031] Figure 3 (a) and Figure 3 (b) is a plan view schematically showing the clamping device.

[0032] Figure 4 This is a flowchart showing a calibration method of a clamping device according to one embodiment.

[0033] Figure 5 This is a flowchart showing a method for measuring the opening amount of a clamp device according to one embodiment.

[0034] Figure 6 (a) and Figure 6 (b) is a plan view schematically showing the movement of the clamping device.

[0035] Figure 7 (a) to Figure 7 (c) is a plan view schematically showing the movement of the clamping device.

[0036] Figure 8 (a) to Figure 8 (c) is a plan view schematically showing the movement of the clamping device.

[0037] Figure 9 (a) to Figure 9 (c) is a plan view schematically showing the movement of the clamping device.

[0038] Figure 10 (a) to Figure 10 (c) is a plan view schematically showing the movement of the clamping device.

[0039] [Explanation of Symbols]

[0040] 1: Wire bonding device

[0041] 2: XY platform

[0042] 2: XY platform

[0043] 3: Joint head

[0044] 4: Z-direction drive mechanism

[0045] 5: Ultrasonic welding head

[0046] 6: Clamping device

[0047] 7: Soldering pin

[0048] 8: Spool

[0049] 9: Camera

[0050] 10: Joint unit

[0051] 11: Joining platform

[0052] 12: A pair of arms

[0053] 13: Deformation Department

[0054] 14: Drive unit

[0055] 15: First Arm

[0056] 15a, 16a: base ends of a pair of arms

[0057] 15b: Front end of the first arm

[0058] 15c: medial surface of the first arm

[0059] 15d: Lateral surface of the first arm

[0060] 16: Second Arm

[0061] 16b: Front end of the second arm

[0062] 16c: medial surface of the second arm

[0063] 16d: Lateral surface of the second arm

[0064] 17: A pair of clamps

[0065] 20: Rod member

[0066] 20a: Base end portion of the rod member

[0067] 20b: Front end of the rod member

[0068] 22: Lifting mechanism

[0069] 23: Framework

[0070] 24: Drive device

[0071] 26: Contact detection unit

[0072] 30: Control device

[0073] 31: Image acquisition unit

[0074] 32: Drive control unit

[0075] 33: Contact information acquisition department

[0076] 34: Position information acquisition unit

[0077] 35: Open the measurement unit

[0078] 36: Correction Department

[0079] D: semiconductor chip

[0080] Gx, Gy: distance

[0081] W: Line

[0082] ST1, ST2, ST11 to ST30: Steps DETAILED DESCRIPTION

[0083] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following description, identical or equivalent components are denoted by identical reference numerals, and descriptions thereof will not be repeated. The dimensional ratios of the accompanying drawings may not necessarily correspond to those of the components described.

[0084] Figure 1 This is a perspective view of a wire bonding apparatus according to one embodiment. Figure 2 It is a side view of the wire bonding device. Figure 1 and Figure 2 The wire bonding apparatus 1 shown bonds a wire W to a semiconductor chip D arranged on a circuit substrate. Figure 1 and Figure 2 , three mutually orthogonal directions are shown as the X direction (first direction), the Y direction (second direction), and the Z direction (third direction). The X direction indicates the direction in which the semiconductor chip D to be bonded is conveyed, the Y direction indicates the horizontal direction perpendicular to the X direction, and the Z direction indicates the height direction of the wire bonding apparatus 1. Figure 1 In the figure, for convenience of explanation, a rod member 20 described later is omitted.

[0085] like Figure 1 and Figure 2As shown, the wire bonding apparatus 1 includes an XY stage 2, a bonding unit 10, a rod member 20, and a control device 30. The XY stage 2 supports the bonding unit 10 thereon. The XY stage 2 horizontally moves the bonding unit 10 supported thereon within an XY plane, a two-dimensional plane including the X and Y directions, using, for example, a stepping motor. The XY stage 2 outputs information indicating the coordinate position of the XY stage 2 within the XY plane via an encoder.

[0086] The bonding unit 10 includes a bonding head 3, a Z-direction drive mechanism 4, an ultrasonic welding head 5, a clamping device 6, a welding needle 7, a bobbin 8, and a camera 9. The bonding head 3 is supported on the XY stage 2. The Z-direction drive mechanism 4 is mounted on the bonding head 3. The Z-direction drive mechanism 4 rotates about a rotation axis extending in the X direction using the driving force of a motor, for example, to move the clamping device 6 and welding needle 7 in the Z direction.

[0087] An ultrasonic horn 5 is attached to the Z-direction drive mechanism 4. The ultrasonic horn 5 is moved in the X and Y directions by the XY stage 2. The ultrasonic horn 5 extends from the Z-direction drive mechanism 4 in the Y direction, and a soldering needle 7 is attached to its tip. A wire W supplied from a spool 8 is passed through the soldering needle 7. The soldering needle 7 bonds the wire W to the semiconductor chip D.

[0088] The clamping device 6 is attached to the Z-direction driving mechanism 4 above the welding needle 7. Therefore, the clamping device 6 is moved in the X-direction and the Y-direction together with the ultrasonic horn 5 by the driving of the XY stage 2.

[0089] Figure 3 (a) is a plan view schematically showing an exemplary clamping device 6. Figure 3 As shown in FIG. 1 (a), the clamping device 6 includes a pair of arms 12, a deforming portion 13, and a driving portion 14. The pair of arms 12 open and close by moving toward or away from each other in the X direction. The clamping device 6 holds the wire W above the soldering needle 7 by opening and closing the pair of arms 12.

[0090] The pair of arms 12 includes a first arm 15 and a second arm 16. The first arm 15 extends in the Y direction between a base end portion 15a and a front end portion 15b. The first arm 15 includes an inner side surface 15c located inside the opening and closing direction (X direction) of the pair of arms 12; and an outer side surface 15d located outside the opening and closing direction of the pair of arms 12. Similarly, the second arm 16 extends in the Y direction between the base end portion 16a and the front end portion 16b. The second arm 16 includes an inner side surface 16c facing inside the opening and closing direction (X direction) of the pair of arms 12; and an outer side surface 16d facing outside the opening and closing direction of the pair of arms 12.

[0091] A pair of clamping pieces 17 are provided on the inner side surface 15c of the first arm 15 and the inner side surface 16c of the second arm 16 to clamp the wire W. The pair of clamping pieces 17 are fixed to the inner side surface 15c of the first arm 15 and the inner side surface 16c of the second arm 16 at positions close to the front end portions 15b and 16b.

[0092] The base ends 15a and 16a of the pair of arms 12 are connected to the deformation portion 13. The deformation portion 13 is provided between the pair of arms 12 and the drive portion 14. The deformation portion 13 has a U-shaped planar shape, for example, and deforms as the drive portion 14 expands and contracts.

[0093] The driving part 14 is a piezoelectric element that converts electrical energy into kinetic energy and deforms according to the applied voltage. When a predetermined voltage is applied to the driving part 14, the driving part 14 stretches in the Y direction and squeezes the deformed part 13. The deformed part 13 squeezed by the driving part 14 is as shown in FIG. Figure 3 As shown in (b), the pair of arms 12 are elastically deformed so that they open in the X direction. Conversely, if the voltage applied to the drive unit 14 is stopped, the drive unit 14 contracts in the Y direction, and the deforming portion 13 elastically deforms so that the pair of arms 12 close. The voltage applied to the drive unit 14 is controlled by a control signal sent from the control device 30. In other words, the clamping device 6 opens and closes the pair of arms 12 so that the opening amount specified by the control device 30 is achieved.

[0094] Refer again Figure 1 The camera 9 is positioned offset in the X direction relative to the clamping device 6. The camera 9 is mounted on, for example, the bonding head 3 and is driven by the XY stage 2 to move in the X and Y directions along with the clamping device 6 and the soldering needles 7. The camera 9 captures, for example, an image of an area encompassing the semiconductor chip D and the soldering needles 7 and outputs the image data obtained to the control device 30.

[0095] A bonding stage 11 supporting a semiconductor chip D to be bonded is provided in front of the bonding head 3 in the Y direction. A conveying device 11a is provided on the bonding stage 11. The conveying device 11a conveys the semiconductor chip D placed on the circuit board in the X direction.

[0096] like Figure 2 As shown, the rod member 20 is provided in front of the joint unit 10 in the Y direction. The rod member 20 is an elongated member made of a conductive material such as metal. The rod member 20 includes a base end 20a and a front end 20b, and extends in the Y direction between the base end 20a and the front end 20b.

[0097] A contact detection unit 26 is connected to the rod member 20. The contact detection unit 26 detects the contact state between the clamping device 6 and the rod member 20. For example, the contact detection unit 26 applies a voltage to the rod member 20 and detects the current flowing through the rod member 20. When the contact detection unit 26 detects that a current is flowing through the rod member 20 due to, for example, contact between the clamping device 6 and the rod member 20, the contact detection unit 26 outputs contact information indicating that the clamping device 6 and the rod member 20 are in contact to the control device 30.

[0098] In addition, the wire bonding apparatus 1 further includes a lifting mechanism 22. The lifting mechanism 22 moves the rod member 20 in the vertical direction (Z direction). Figure 2 In the embodiment shown, the lifting mechanism 22 includes a frame 23 and a drive device 24. The frame 23 extends in the Z direction. The base end portion 20a of the rod member 20 is connected to the drive device 24. The drive device 24 includes, for example, a rotary solenoid, and moves the rod member 20 in the Z direction along the frame 23. Figure 2 The structure shown may adopt any structure as long as the rod member 20 can be moved in the Z direction.

[0099] The control device 30 is a computer comprising a processor, a storage unit, an input device, a display device, and other components, and controls the overall operation of the wire bonding apparatus 1. In the control device 30, an operator can use the input device to input commands and manage the wire bonding apparatus 1. Furthermore, the display device can visualize the operating status of the wire bonding apparatus 1. Furthermore, the storage unit of the control device 30 stores a control program for controlling various processes performed by the wire bonding apparatus 1 via the processor. The control device 30 implements the various functions described below by executing this control program via the processor.

[0100] The control device 30 is connected to the XY stage 2, the Z-direction drive mechanism 4, the clamping device 6, the camera 9, the lifting mechanism 22, and the contact detection unit 26 in a communicative manner. The control device 30 sends control signals to the XY stage 2, the Z-direction drive mechanism 4, the clamping device 6, the camera 9, and the lifting mechanism 22 to control the operation of the XY stage 2, the operation of the Z-direction drive mechanism 4, the opening and closing of the clamping device 6, the operation of the camera 9, the operation of the lifting mechanism 22, etc. In addition, the control device 30 has the following function: based on the position information of the clamping device 6 when the clamping device 6 contacts the rod member 20, it measures the opening amount d of the clamping device 6 (refer to Figure 3 (b)), and the clamping device 6 is corrected based on the measured opening amount d.

[0101] like Figure 1As shown, the control device 30 includes an image acquisition unit 31, a drive control unit 32, a contact information acquisition unit 33, a position information acquisition unit 34, an opening amount measurement unit 35, and a calibration unit 36 as functional components. The image acquisition unit 31 acquires images captured by the camera 9. The drive control unit 32 sends control signals to the XY stage 2, the Z-direction drive mechanism 4, and the lifting mechanism 22 to move the clamping device 6 and the soldering needle 7 in the X, Y, and Z directions, and to move the rod member 20 in the Z direction.

[0102] The contact information acquisition unit 33 acquires contact information indicating contact between the clamping device 6 and the rod member 20 from the contact detection unit 26. The position information acquisition unit 34 acquires position information of the clamping device 6 in the X, Y, and Z directions based on, for example, encoder outputs from the XY stage 2 and the Z-direction drive mechanism 4. The opening amount measurement unit 35 measures the opening amount of the pair of arms 12 of the clamping device 6 based on the position information of the clamping device 6. The calibration unit 36 calibrates the clamping device 6 based on the opening amount of the pair of arms 12 measured by the opening amount measurement unit 35.

[0103] Secondly, refer to Figure 4 The functions of the control device 30 will be described in detail, and a calibration method of the clamping device 6 using the wire bonding device 1 according to one embodiment will be described.

[0104] Figure 4 This is a flowchart showing a calibration method of the clamping device 6 according to one embodiment. Figure 4 The calibration method shown is executed by the control device 30 of the wire bonding device 1. Figure 4 As shown, in the calibration method, first, the opening amount of the clamping device 6 is measured by the control device 30 (step ST1).

[0105] Reference Figure 5 A method for measuring the opening amount of the clamp device 6 will be described. Figure 5 Flowchart showing a method for measuring the opening amount of the clamping device 6. Figure 5 As shown, in the measuring method, first, the drive control unit 32 controls the lifting mechanism 22 to raise the rod member 20 so that the height positions of the rod member 20 and the clamping device 6 become the same in the Z direction (step ST11).

[0106] Next, the drive control unit 32 is as follows Figure 6 As shown in (a), the XY stage 2 is controlled to dispose the clamping device 6 behind the rod member 20 in the Y direction, and then the clamping device 6 is moved toward the rod member 20 along the Y direction. Figure 6As shown in (b) of FIG1 , the front end portion 15b of the first arm 15 is brought into contact with the front end portion 20b of the rod member 20 (step ST12). Furthermore, in step ST12, the front end portion 16b of the second arm 16 may be brought into contact with the front end portion 20b of the rod member 20. Here, in steps ST11 and ST12, the front end portion 15b of the first arm 15 or the front end portion 16b of the second arm 16 may be brought into contact with the front end portion 20b of the rod member 20 by manually operating the input device of the control device 30.

[0107] If the contact detection unit 26 detects contact between the first arm 15 or the second arm 16 and the rod member 20, the contact detection unit 26 transmits contact information to the control device 30. If the contact information acquisition unit 33 acquires the contact information, the position information acquisition unit 34 acquires the position information of the clamping device 6 on the XY plane based on the encoder output of the XY stage 2 (step ST13) (sixth control, sixth step). Based on this position information, the position of the tip portion 20b of the rod member 20 on the XY plane is determined. The acquired position information of the clamping device 6 is stored in, for example, the storage unit of the control device 30.

[0108] Next, the drive control unit 32 controls the XY stage 2 to move the clamping device 6 to the first standby position (step ST14). Figure 7 As shown in (a), the first standby position is a position in which the first arm 15 is positioned closer to the rod member 20 than the second arm 16 in the X direction. For example, the first standby position is a position in which the outer side surface 15d of the first arm 15 is separated from the rod member 20 by a distance Gx in the X direction and the first arm 15 and the rod member 20 overlap by a distance Gy in the Y direction. Although not limited to these, the distance Gx is, for example, 500 μm, and the distance Gy is, for example, 300 μm.

[0109] Next, the drive control unit 32 is as follows Figure 7 As shown in (b), the XY stage 2 is controlled so that the clamping device 6 moves toward the rod member 20 along the X direction with the pair of arms 12 closed. Figure 7 As shown in (c), the outer side surface 15d of the first arm 15 is brought into contact with the rod member 20 (step ST15). At this time, the outer side surface 15d is brought into contact with the rod member 20 near the front end portion 15b of the first arm 15.

[0110] When the contact detection unit 26 detects contact between the outer side surface 15d of the first arm 15 and the rod member 20, the contact detection unit 26 transmits contact information to the control device. When the contact information acquisition unit 33 acquires the contact information, the position information acquisition unit 34 acquires at least the position information of the clamping device 6 in the X direction based on the encoder output of the XY stage 2 (step ST16) (first control, first process). The acquired position information of the clamping device 6 is stored in, for example, the storage unit of the control device 30.

[0111] Next, the drive control unit 32 is as follows Figure 8 As shown in (a), the XY stage 2 is controlled to move the clamp 6 away from the rod 20 along the X direction, and the clamp 6 is placed in the first standby position (step ST17). That is, the drive control unit 32 separates the clamp 6 from the rod 20.

[0112] Next, the drive control unit 32 sends a control signal to the clamping device 6 to set the opening amount of the clamping device 6 to the specified opening amount, thereby opening the pair of arms 12 (step ST18). For example, the drive control unit 32 applies a voltage corresponding to the specified opening amount to the drive unit 14 of the clamping device 6. Next, the drive control unit 32 opens the pair of arms 12 as shown in step ST18. Figure 8 As shown in (b), the clamping device 6 is moved toward the rod member 20 along the X direction in a state where the pair of arms 12 are opened. Figure 8 As shown in (c), the outer side surface 15d of the first arm 15 is brought into contact with the rod member 20 (step ST19). At this time, the outer side surface 15d is brought into contact with the rod member 20 near the front end portion 15b of the first arm 15.

[0113] When the contact detection unit 26 detects contact between the outer side surface 15d of the first arm 15 and the rod member 20, the contact detection unit 26 transmits contact information to the control device. When the contact information acquisition unit 33 acquires the contact information, the position information acquisition unit 34 acquires at least the position information of the clamping device 6 in the X direction based on the encoder output of the XY stage 2 (step ST20) (second control, second process). The acquired position information of the clamping device 6 is stored in, for example, the storage unit of the control device 30.

[0114] Next, the drive control unit 32 separates the clamping device 6 from the rod member 20 and controls the clamping device 6 to close the pair of arms 12 (step ST21). Next, the drive control unit 32 controls the XY stage 2 to move the clamping device 6 to the second standby position (step ST22). Figure 9As shown in (a), the second standby position is separated from the first standby position in the X direction via the rod member 20, and is positioned such that the second arm 16 is closer to the rod member 20 than the first arm 15 in the X direction. For example, the second standby position is such that the outer side surface 16d of the second arm 16 is separated from the rod member 20 by a distance Gx in the X direction, and the tip 16b of the second arm 16 overlaps the tip 20b of the rod member 20 by a distance Gy in the Y direction. Although not limited thereto, the distance Gx is, for example, 500 μm, and the distance Gy is, for example, 300 μm.

[0115] Next, the drive control unit 32 is as follows Figure 9 As shown in (b), the clamping device 6 is moved from the second standby position to the rod member 20 along the X direction. Figure 9 As shown in (c) of FIG. 1 , the outer side surface 16 d of the second arm 16 is brought into contact with the lever member 20 (step ST23 ).

[0116] When the contact detection unit 26 detects contact between the outer side surface 16d of the second arm 16 and the rod member 20, the contact detection unit 26 transmits contact information to the control device. When the contact information acquisition unit 33 acquires the contact information, the position information acquisition unit 34 acquires at least the position information of the clamping device 6 in the X direction based on the encoder output of the XY stage 2 (step ST24) (fourth control, fourth process). The acquired position information of the clamping device 6 is stored in, for example, the storage unit of the control device 30.

[0117] Next, the drive control unit 32 is as follows Figure 10 As shown in (a), the XY stage 2 is controlled to move the clamp 6 away from the rod member 20 along the X direction and place the clamp 6 in the second standby position (step ST25). That is, the drive control unit 32 separates the clamp 6 from the rod member 20.

[0118] Next, the drive control unit 32 sends a control signal to the clamping device 6 to set the opening amount of the clamping device 6 to the designated opening amount, thereby opening the pair of arms 12 (step ST26). Figure 10 As shown in (b), the clamping device 6 is moved toward the rod member 20 along the X direction in a state where the pair of arms 12 are opened. Figure 10 As shown in (c), the outer side surface 16d of the second arm 16 is brought into contact with the lever member 20 (step ST27). At this time, the outer side surface 16d of the second arm 16 is brought into contact with the lever member 20 near the front end portion 16b.

[0119] When the contact detection unit 26 detects contact between the outer side surface 16d of the second arm 16 and the rod member 20, the contact detection unit 26 transmits contact information to the control device. When the contact information acquisition unit 33 acquires the contact information, the position information acquisition unit 34 acquires at least the position information of the clamping device 6 in the X direction based on the encoder output of the XY stage 2 (step ST28) (fifth control, fifth step). The acquired position information of the clamping device 6 is stored in, for example, the storage unit of the control device 30.

[0120] Next, the opening amount measuring unit 35 measures the opening amount of the clamp 6 based on the position information obtained in steps ST16, ST20, ST24, and ST28 (step ST29). (Third control, third step.) For example, the difference between the X-direction position information of the clamp 6 obtained in step ST20 and the X-direction position information of the clamp 6 obtained in step ST16 represents the X-direction movement amount of the first arm 15 when the clamp 6 is opened from the closed state. Furthermore, the difference between the X-direction position information of the clamp 6 obtained in step ST28 and the X-direction position information of the clamp 6 obtained in step ST24 represents the X-direction movement amount of the second arm 16 when the clamp 6 is opened from the closed state.

[0121] For example, when the position information of the clamping device 6 in the X direction obtained in steps ST16, ST20, ST24 and ST28 is set to x1, x2, x3 and x4 respectively, the opening amount d of the clamping device 6 can be calculated based on the opening amount measuring unit 35 and the following formula (1).

[0122] d=∣x2-x1∣+∣x4-x3...(1)

[0123] After measuring the opening amount of the clamp 6, the drive control unit 32 controls the lifting mechanism 22 to lower the clamp 6 (step ST30). By lowering the clamp 6, the clamp can be prevented from contacting or interfering with the rod member 20.

[0124] Refer again Figure 4 .like Figure 4 As shown in FIG. 1 , after measuring the opening amount of the clamping device 6, the correction unit 36 corrects the clamping device 6 based on the measured opening amount of the clamping device 6 (step ST2). This correction is performed by correcting the voltage applied to the driving unit 14 of the clamping device 6 in steps ST18 and ST26 so that the opening amount specified by the control device 30 matches the opening amount measured in step ST29.

[0125] In the wire bonding apparatus 1 described above, the opening amount of the pair of arms 12 is determined based on positional information obtained when the outer side surface 15 d of the first arm 15 contacts the rod member 20 when the pair of arms 12 are closed, positional information obtained when the outer side surface 15 d of the first arm 15 contacts the rod member 20 when the pair of arms 12 are opened, positional information obtained when the outer side surface 16 d of the second arm 16 contacts the rod member 20 when the pair of arms are closed, and positional information obtained when the outer side surface 16 d of the second arm 16 contacts the rod member 20 when the pair of arms 12 are opened. Therefore, the opening amount of the clamping device 6 can be measured while the device is assembled in the wire bonding apparatus 1.

[0126] Furthermore, in the wire bonding apparatus 1, since the clamp 6 is corrected based on the measured opening amount of the clamp 6, the error between the clamp opening amount specified by the control device 30 and the actual clamp opening amount can be reduced.

[0127] Furthermore, in the wire bonding apparatus 1 , since the rod member 20 can be moved in the Z direction, the rod member 20 can be retracted in the Z direction when bonding the semiconductor chip D. As a result, the rod member 20 can be prevented from contacting or interfering with the clamp 6 .

[0128] The above describes various embodiments of the wire bonding device 1, a method for measuring the opening amount of the clamping device 6 using the wire bonding device 1, and a method for calibrating the clamping device 6. However, the present invention is not limited to the aforementioned embodiments, and various modified forms can be configured without changing the spirit of the invention.

[0129] For example, Figure 2 The wire bonding apparatus 1 shown includes a lifting mechanism 22 that moves the rod member 20 in the Z direction along a frame 23. However, any structure may be used as long as the rod member 20 can be moved in the Z direction. Furthermore, while the contact detection unit 26 detects contact between the clamp 6 and the rod member 20 based on the current flowing through the rod member 20, a different method may be used to detect contact between the clamp 6 and the rod member 20.

[0130] In the embodiment, the opening amount of the pair of arms 12 is calculated based on the position information of the outer surface 15d of the first arm 15 when it contacts the rod member 20, and the position information of the outer surface 16d of the second arm 16 when it contacts the rod member 20. However, in one embodiment, the opening amount of the pair of arms 12 can also be calculated based on only the position information of one of the arms 12 when it contacts the rod member 20.

[0131] For example, the control device 30 can cause the outer side surface 15d of the first arm 15 to contact the rod member 20 when the pair of arms 12 are closed, and obtain position information of the clamping device 6 when contacting the rod member 20. Furthermore, when the pair of arms 12 are open, the control device 30 can cause the outer side surface 15d of the first arm 15 to contact the rod member 20 and obtain position information of the clamping device 6 when contacting the rod member 20. Based on the two pieces of position information obtained for the clamping device 6, the amount of opening of the pair of arms can be calculated. For example, if the position information in the X direction of the outer side surface 15d of the first arm 15 when contacting the rod member 20 when the pair of arms 12 are closed is x1, and the position information in the X direction of the outer side surface 15d of the first arm 15 when contacting the rod member 20 when the pair of arms 12 are open is x2, the amount of movement of the first arm 15 in the X direction can be expressed as |x2-x1|. Alternatively, the control device 30 can calculate the amount of opening of the pair of arms 12 by doubling the amount of movement of the first arm 15.

Claims

1. A wire bonding device, characterized in that: include: a clamping device comprising a pair of arms; a platform for moving the clamping device in a horizontal direction; rod components; a contact detecting portion for detecting contact between the rod member and the clamping device; as well as A control device controls the opening and closing of the pair of arms and the operation of the platform, and obtains position information of the clamping device, and The control device performs: a first control for moving the clamping device so that the outer side surface of the first arm of the pair of arms contacts the rod member while the pair of arms are closed, and acquiring position information of the clamping device when the clamping device contacts the rod member; a second control for moving the clamping device so that the outer side surface of the first arm contacts the rod member while the pair of arms are opened, and acquiring position information of the clamping device when the clamping device contacts the rod member; as well as The third control determines the opening amount of the pair of arms based on the position information of the clamp device acquired in the first control and the second control.

2. The wire bonding device according to claim 1, wherein: The control device also performs: a fourth control of moving the clamping device so that the outer side surface of the second arm of the pair of arms contacts the rod member while the pair of arms are closed, and acquiring position information of the clamping device when the clamping device contacts the rod member; as well as The fifth control is to move the clamping device so that the outer side surface of the second arm contacts the rod member in the state where the pair of arms are opened, and obtain position information of the clamping device when the clamping device contacts the rod member, and In the third control, the opening amount of the pair of arms is determined by further using the position information of the clamp device acquired in the fourth and fifth controls.

3. The wire bonding device according to claim 2, wherein: The control device also executes a sixth control performed before the first control, wherein the sixth control moves the clamping device so that the front end portion of the first arm or the second arm contacts the front end portion of the rod member, and obtains position information of the clamping device when contacting the rod member.

4. The wire bonding device according to any one of claims 1 to 3, wherein: Also includes: The lifting structure moves the rod member in the up and down directions.

5. A method for measuring the opening amount of a clamping device, comprising a pair of arms capable of opening and closing, characterized in that: The determination method comprises: The first step is to move the clamping device so that the outer side surface of the first arm of the pair of arms contacts the rod member in a state where the pair of arms are closed, and obtain position information of the clamping device when the clamping device contacts the rod member; a second step of moving the clamping device so that the outer side surface of the first arm contacts the rod member while the pair of arms are opened, and acquiring position information of the clamping device when the clamping device contacts the rod member; as well as The third step is to obtain the opening amount of the pair of arms based on the position information of the clamping device acquired in the first step and the second step.

6. The measuring method according to claim 5, characterized in that Also includes: a fourth step of moving the clamping device so that the outer side surface of the second arm of the pair of arms contacts the rod member while the pair of arms are closed, and acquiring position information of the clamping device when the clamping device contacts the rod member; as well as The fifth step is to move the clamping device so that the outer side surface of the second arm contacts the rod member in the state where the pair of arms are opened, and obtain position information of the clamping device when the clamping device contacts the rod member, and In the third step, the opening amount of the pair of arms is determined by further using the position information of the clamping device acquired in the fourth and fifth steps.

7. The measuring method according to claim 6, wherein The method further includes a sixth step performed before the first step, wherein the clamping device is moved so that the front end portion of the first arm or the second arm contacts the front end portion of the rod member, and position information of the clamping device when the clamping device contacts the rod member is obtained.

8. A method for calibrating a clamping device, characterized in that: Include: A step of determining the opening amount of the clamping device by the measuring method according to any one of claims 5 to 7; and The process of correcting the clamping device based on the amount of opening of the clamping device.

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