Resin supply device, resin sealing device, and method for manufacturing resin sealed product

Abstract

The present invention provides a resin supply device, a resin sealing device and a method for manufacturing a resin sealed product that can suppress the generation of defects. The resin supply device (100) includes: a calculation unit (130) that calculates a resin supply pattern based on the shape of a cavity (201) of a resin sealing mold (200); and a supply unit (120) that supplies resin to a coated object along the resin supply pattern, wherein the resin supply pattern has a plurality of linear paths (14), one of the mutually adjacent linear paths is inclined relative to a symmetry axis (SM) that divides the cavity (201) linearly symmetrically, another of the mutually adjacent linear paths is inclined relative to one of the linear paths, and an area (19) between the mutually adjacent linear paths is open to the outside of the coated object on the side of the other linear path away from at least one of the linear paths.

Description

Technical Field

[0001] The present invention relates to a resin supply device, a resin sealing device and a method for manufacturing a resin sealed product. Background Art

[0002] It is known to seal a workpiece with resin by compression molding. A resin sealing device using such compression molding generally includes a resin supply device for supplying resin onto the workpiece or a separator, and a resin sealing mold for spreading the resin on the workpiece and applying heat and pressure.

[0003] Here, Patent Document 1 discloses that regarding a resin supply pattern supplied by a resin supply device, a spiral or lattice-shaped resin supply pattern is formed in a chamber in a vacuum state.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-134846 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, even if the resin is supplied in a vacuum chamber as in the resin supply device described in Patent Document 1, if there is air or gas generated by the resin in the mold being molded, it will be drawn into the resin, sometimes causing defects such as air traps or voids due to poor filling.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects.

[0010] Technical means of solving problems

[0011] A resin supply device according to one embodiment of the present invention is a resin supply device for supplying resin to an object to be coated arranged in a lower mold of a resin sealing mold, comprising: a calculation unit for calculating a resin supply pattern based on the shape of a mold cavity of the resin sealing mold; and a supply unit for supplying resin to the object to be coated along the resin supply pattern, the resin supply pattern having a plurality of linear paths, one of the plurality of mutually adjacent linear paths being inclined relative to an axis of symmetry that linearly divides the mold cavity, another of the plurality of mutually adjacent linear paths being inclined relative to one of the linear paths, and an area between the plurality of mutually adjacent linear paths being on a side of the other linear path away from at least one of the linear paths, and being open to the outside of the object to be coated.

[0012] According to the embodiment, the area between adjacent linear paths functions as a flow path for exhaust. In addition, when the resin is spread on the object to be coated, the area between mutually adjacent linear paths is slowly filled with resin from the side where the other linear path is close to one of the linear paths to the side where the other linear path is away from one of the linear paths. Therefore, when the resin is spread on the object to be coated, an area surrounded by resin in all directions is not generated, and the area between adjacent linear paths functions as a flow path for exhaust. Therefore, it is possible to prevent the air remaining in the area between adjacent linear paths or the gas generated by the resin from being drawn into the resin, and to prevent the occurrence of defects caused by poor filling.

[0013] In the embodiment, the plurality of linear paths may include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path, wherein the second linear path is connected to the first linear path at an end portion on a side close to the first linear path and is connected to the third linear path at an end portion on a side close to the third linear path.

[0014] In the above embodiment, the resin supply pattern may be in the shape of a continuous line.

[0015] In the embodiment, a corner portion of the resin supply pattern may have an R shape.

[0016] In the above-mentioned embodiment, the region between the adjacent linear paths among the plurality of linear paths may be open to the outside of the coated object on a side where another linear path is close to one of the linear paths.

[0017] In the above-described embodiment, the object to be coated may be a workpiece to be sealed using the supplied resin.

[0018] In the above-described embodiment, the object to be coated may be a separator for transferring the supplied resin to the workpiece.

[0019] The above-mentioned embodiment may further include an acquisition unit configured to acquire the shape of the cavity of the resin sealing mold and provide the shape to the calculation unit.

[0020] In the above-described embodiment, the calculation unit may calculate the resin supply pattern by taking into account the shape of the workpiece sealed with the resin supplied to the coating object.

[0021] In the above-described embodiment, the calculation unit may calculate the resin supply pattern by adopting information on arrangement of components on the workpiece to be sealed with the supplied resin.

[0022] In the embodiment described above, the axis of symmetry may extend in the direction in which the elements are arranged.

[0023] In the above-described embodiment, the resin supply pattern may be calculated so that the resin supply amount in a region where the component area ratio is small in the workpiece is larger than the resin supply amount in a region where the component area ratio is large.

[0024] In the embodiment, the plurality of linear paths may include a group of linear paths adjacent to each other in the center portion of the workpiece and another group of linear paths adjacent to each other in the end portion of the workpiece, wherein an angle formed by one group of linear paths is larger than an angle formed by the other group of linear paths.

[0025] In the embodiment, the plurality of linear paths include a group of linear paths adjacent to each other in the center of the workpiece and another group of linear paths adjacent to each other in the end of the workpiece, and the angle formed by the group of linear paths is smaller than the angle formed by the other group of linear paths.

[0026] A resin sealing device according to one embodiment of the present invention comprises a resin supply device according to any one of the embodiments described above, and a resin sealing mold for resin-sealing an element on a workpiece, the resin sealing mold having a mold cavity filled with resin, and a plurality of exhaust ports for exhausting air from the mold cavity, and an object to be coated is arranged on the resin sealing mold in such a manner that at least one of the plurality of exhaust ports is located on an extension line of an area between mutually adjacent linear paths among a plurality of linear paths.

[0027] According to the embodiment, when the mold is closed and the resin is heated and pressurized, the exhaust port provided on the extension line of the area between the linear paths will not be blocked before the area between the adjacent linear paths is filled with resin. Therefore, it is possible to prevent the air remaining in the area between the adjacent linear paths or the gas generated by the resin from being drawn into the resin inside the resin sealing mold, and to prevent the occurrence of defects caused by poor filling.

[0028] A method for manufacturing a resin sealant according to an embodiment of the present invention is a method for manufacturing a resin sealant comprising supplying resin to an object to be coated arranged in a lower mold of a resin sealing mold, comprising: calculating a resin supply pattern based on the shape of a mold cavity of the resin sealing mold; and supplying resin to the object to be coated along the resin supply pattern, the resin supply pattern having a plurality of linear paths, one of the plurality of mutually adjacent linear paths being inclined relative to an axis of symmetry that linearly divides the mold cavity, another of the plurality of mutually adjacent linear paths being inclined relative to one of the linear paths, and an area between the plurality of mutually adjacent linear paths being on a side of the other linear path away from at least one of the linear paths, and being open to the outside of the object to be coated.

[0029] According to the embodiment, the area between adjacent linear paths functions as a flow path for exhaust. In addition, when the resin is spread on the object to be coated, the area between mutually adjacent linear paths is slowly filled with resin from the side where the other linear path is close to one of the linear paths to the side where the other linear path is away from one of the linear paths. Therefore, when the resin is spreading on the object to be coated, an area surrounded by resin in all directions is not generated, and the area between adjacent linear paths functions as a flow path for exhaust. Therefore, it is possible to prevent the air remaining in the area between adjacent linear paths or the gas generated by the resin from being drawn into the resin, and to prevent the occurrence of defects caused by poor filling.

[0030] In the above-described embodiment, the object to be coated may be a workpiece to be sealed using the supplied resin.

[0031] In the above-described embodiment, the object to be coated may be a separator for transferring the supplied resin to the workpiece.

[0032] Effects of the Invention

[0033] According to the present invention, a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a diagram schematically showing the structure of the resin sealing device according to the first embodiment.

[0035] Figure 2 This is a plan view schematically showing the workpiece and the resin supply pattern in the resin sealing mold.

[0036] Figure 3 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device of the first embodiment.

[0037] Figure 4 This is a cross-sectional view schematically showing the resin on the workpiece immediately after being placed inside the resin sealing mold.

[0038] Figure 5 This is a cross-sectional view schematically showing the resin in the process of spreading through the resin sealing mold.

[0039] Figure 6 This is a cross-sectional view schematically showing the resin filled into the cavity by heating and pressurizing.

[0040] Figure 7 It is a plan view schematically showing a resin supply pattern according to a modified example.

[0041] Figure 8 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0042] Fig. 9 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0043] Fig.10 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0044] Fig.11 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0045] Fig.12 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0046] Fig.13 It is a plan view schematically showing a resin supply pattern according to another modified example.

[0047] Fig.14 It is a diagram schematically showing the structure of a resin sealing device according to a second embodiment.

[0048] Fig.15 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device according to the second embodiment.

[0049] Explanation of symbols

[0050] 1, 9: Resin sealing device

[0051] 10, 20, 30, 40, 50, 60, 70, 80: workpiece

[0052] 10A, 10B, 60B: External area

[0053] 11, 81: Substrate

[0054] 12, 52A, 52B: Components

[0055] 13, 53, 63, 83: Resin

[0056] 14, 24, 34, 44, 54, 64, 74, 84: Linear path

[0057] 14A: First linear path

[0058] 14B: Second linear path

[0059] 14C: Third linear path

[0060] 19, 39, 49, 79, 89: Areas between linear paths

[0061] 19A: Area between the first linear path and the second linear path

[0062] 19B: Area between the second linear path and the third linear path

[0063] 35: Relay Path

[0064] 100: Resin supply device

[0065] 110: Acquisition

[0066] 120: Supply Department

[0067] 121: Syringe

[0068] 122: Push rod (piston)

[0069] 122M: Fourth motor

[0070] 123: Pinch valve

[0071] 130: Calculation Department

[0072] 140: Drive unit

[0073] 141: Upper base

[0074] 142: First moving part

[0075] 142M: First Motor

[0076] 143: Second Mobile Unit

[0077] 143M: Second motor

[0078] 144: The Third Mobile Unit

[0079] 144M: Third motor

[0080] 150: Stage

[0081] 200, 900: Resin sealed mold

[0082] 201, 901: mold cavity

[0083] 203: Closed loop

[0084] 210, 910: Lower die

[0085] 220, 920: Upper mold

[0086] 221: Mold sleeve

[0087] 223, 913: Cavity block

[0088] 225, 915: Clamp

[0089] 226, 916: Exhaust port

[0090] 227: Chamber Block

[0091] 228: Exhaust hole

[0092] RF: Isolation Film

[0093] SM: Symmetry axis

[0094] S11~S16, S91~S96: Steps DETAILED DESCRIPTION

[0095] The following describes embodiments of the present invention with reference to the drawings. The drawings of the embodiments are for illustration only, and the dimensions and shapes of the parts are schematic, and should not be construed as limiting the technical scope of the present invention to the embodiments.

[0096] <First embodiment>

[0097] Reference Figure 1 and Figure 2 , the structure of the resin sealing device 1 according to the embodiment of the present invention will be described. Figure 1 It is a diagram schematically showing the structure of the resin sealing device according to the first embodiment. Figure 2 This is a plan view schematically showing the workpiece and the resin supply pattern in the resin sealing mold.

[0098] In order to clarify the relationship between the drawings and help understand the positional relationship of the components, an orthogonal coordinate system including an X-axis, a Y-axis, and a Z-axis is sometimes marked for convenience. The direction pointed by the arrow of the Z-axis is set as the upward direction, and the direction opposite to the direction of the arrow of the Z-axis is set as the downward direction.

[0099] The resin sealing device 1 is a device for resin sealing (molding) a workpiece 10 with a resin 13. The resin sealing device 1 includes: a resin supply device 100, which applies (supplies) the resin 13 for resin sealing on the coated object (for example, the workpiece 10 or the isolation film RF); and a resin sealing mold 200, which heats and pressurizes the resin to harden it. The workpiece 10 includes, for example, a substrate 11 and an element 12 arranged on the substrate 11, and the element 12 is arranged in a first direction X and a second direction Y, respectively. In the following description, when the workpiece 10 is viewed from the positive direction of the third direction Z (hereinafter referred to as the upper direction), the area from the edge of the substrate 11 to the outermost element 12 is referred to as the "external area of ​​the workpiece 10". In the external area of ​​the workpiece 10, the area clamped by the resin sealing mold 200 is referred to as the "external area 10A", and the area closer to the element 12 side than the external area 10A is referred to as the "external area 10B".

[0100] The structures of the substrate 11 and the element 12 are not limited. For example, the substrate 11 is a semiconductor wafer, and the element 12 can be a semiconductor chip mounted on the substrate 11 by flip-chip. In the case, there is a gap between the substrate 11 and the element 12 at the time of supplying the resin 13, and the resin is filled into the gap by heating and pressurizing. The present invention is not limited to the above-mentioned embodiment. For example, there can be a form in which there is no gap between the substrate 11 and the element 12 and only the element 12 is mounted on the substrate 11, or it can be applied to a form in which the bottom filling resin is filled between the substrate 11 and the element 12. In addition, the element 12 can be a multilayer body in which a plurality of semiconductor chips are stacked at intervals in the third direction Z, or it can be an element other than a semiconductor element (a micro-electromechanical system (MEMS) device or an electronic device, etc.). The configuration form of the element 12 on the substrate 11 is not limited. For example, the element 12 can be mounted on the substrate 11 by wire bonding, or the element 12 can be fixed on the substrate 11 so that it can be loaded and unloaded. The substrate 11 may be a resin substrate or a glass substrate, or an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, etc. When the workpiece 10 is viewed from the upper side, for example, the planar shape of the substrate 11 is circular, and the planar shape of the element 12 is rectangular, but the planar shapes of the substrate 11 and the element 12 are not limited to these shapes. For example, the planar shape of the substrate may be rectangular, and the planar shape of the element may be polygonal or circular. Two or more elements of different shapes may be arranged on the workpiece.

[0101] The resin supply device 100 includes an acquisition unit 110 , a supply unit 120 , a calculation unit 130 , a drive unit 140 , and a stage 150 .

[0102] The acquisition unit 110 acquires structural information of the cavity 201 (e.g., information related to the shape or size of the cavity 201) constituting the internal space filled with the resin 13 of the resin sealing mold 200. The acquisition unit 110 acquires the structural information by inputting from an external terminal, etc. The method for acquiring the structural information of the cavity 201 is not limited to the above method. For example, the acquisition unit 110 may also read a code assigned to the resin sealing mold 200 and acquire structural information corresponding to the code, etc. from a pre-recorded database.

[0103] The acquisition unit 110 not only acquires the structural information of the cavity 201, but also acquires the configuration information of the components 12 on the workpiece 10 (more specifically, the substrate 11) (for example, information related to the shape or size, arrangement direction, number, or spacing of the components 12). The acquisition unit 110 acquires the configuration information of the components 12 by, for example, photographing the workpiece 10 and performing image analysis. The acquisition unit 110 may acquire the configuration information for each workpiece, or may acquire the configuration information for each batch of multiple workpieces. Furthermore, the method for acquiring the configuration information of the components 12 is not limited to the above. For example, the acquisition unit 110 may also acquire the configuration information corresponding to the code or the like from a pre-recorded database by reading the code or the like assigned to the workpiece 10. In addition, the acquisition unit 110 may also acquire the configuration information by inputting from an external terminal or the like. In addition, the acquisition unit 110 may also detect the position of a V-notch or the like in the workpiece 10 such as a wafer to acquire the orientation of the workpiece 10. The resin supply device 100 may also align the orientation of the workpiece 10 based on the orientation of the workpiece 10 acquired by the acquisition unit 110, and then supply the resin 13 described later.

[0104] The supply unit 120 supplies the resin 13 onto the object to be coated (the workpiece 10 or the isolation film RF). The supply unit 120 is, for example, a dispenser that ejects the liquid resin 13. The supply unit 120 includes: a syringe 121 that stores the resin 13; a push rod (piston) 122 that is inserted into the syringe 121 and can press the resin 13; and a pinch valve 123 that opens and closes the nozzle at the front end of the syringe 121. The supply unit 120 is provided with a structure that can replace the used syringe 121 with a new syringe 121 when the resin 13 stored in the syringe 121 is used up. Furthermore, the supply unit 120 is not limited to the above, and may include an opening and closing valve instead of the pinch valve 123. In addition, the supply unit 120 may also be a structure that prepares two liquids separately and mixes them on the spot before supplying them. For example, the supply unit 120 may be a feeder that ejects a powdery resin.

[0105] The calculation unit 130 calculates a resin supply pattern (the shape of the resin 13 applied to the object to be coated) based on the shape of the cavity 201 of the resin sealing mold 200 received from the acquisition unit 110. The resin supply pattern calculated by the calculation unit 130 has a plurality of linear paths 14 extending along the first direction X and arranged in the second direction Y.

[0106] like Figure 2As shown, when the workpiece 10 is viewed from above (hereinafter referred to as "when viewed from above"), a plurality of linear paths 14 are inclined relative to the symmetry axis SM that divides the cavity 201 linearly symmetrically. Since the symmetry axis SM of the cavity 201 is parallel to the first direction X, the plurality of linear paths 14 are inclined from the first direction X to the second direction Y, and the inclination angle of the linear paths 14 from the first direction X is an acute angle. The mutually adjacent linear paths 14 are respectively inclined in opposite directions relative to the first direction X, and one of the mutually adjacent linear paths 14 is inclined relative to the other linear path. That is, one of the mutually adjacent linear paths 14 approaches the other linear path as it moves toward the positive direction side or the negative direction side of the first direction X.

[0107] For example, when one of the mutually adjacent linear paths 14 approaches the side of the other linear path, the ends of the mutually adjacent linear paths 14 overlap. That is, the mutually adjacent linear paths 14 are connected to each other on the element 12 at the outermost edge of the workpiece 10 and are a continuous line. The resin supply pattern is a continuous line as a whole, and the resin 13 can be supplied in one go over the entire resin supply pattern. In other words, the resin supply pattern is formed into a linear pattern by repeatedly folding back in a manner that the inclined linear paths are connected at the ends. In addition, the angle formed by the mutually adjacent linear paths 14 is constant regardless of the position of the workpiece 10. In addition, the mutually adjacent linear paths 14 extend to the element 12 at the outermost edge of the workpiece 10. Therefore, the resin 13 can be supplied to the entire workpiece 10.

[0108] When the workpiece 10 is viewed from above, the area 19 between the mutually adjacent linear paths 14 among the plurality of linear paths 14 is open to the outside of the workpiece 10 on the side where one of the mutually adjacent linear paths 14 is away from the other linear path. The area 19 between the mutually adjacent linear paths 14 is blocked by the mutually connected linear paths 14 on the side opposite to the side open to the outside of the workpiece 10.

[0109] The corners of the resin supply pattern may have a sharp shape, or may also have an R shape.

[0110] The resin supply pattern is described in more detail by taking the first linear path 14A, the second linear path 14B adjacent to the first linear path 14A, and the third linear path 14C adjacent to the second linear path 14B as examples. When the workpiece 10 is viewed from above, the first linear path 14A and the third linear path 14C are inclined at an acute angle in the clockwise direction from the first direction X, and the second linear path 14B is inclined in the counterclockwise direction from the first direction X. The second linear path 14B is close to the first linear path 14A on the negative direction side of the first direction, and is close to the third linear path 14C on the positive direction side of the first direction X. The ends of the first linear path 14A and the second linear path 14B on the negative direction side of the first direction X overlap on the outermost element 12, and the ends of the second linear path 14B and the third linear path 14C on the positive direction side of the first direction X overlap on the outermost element 12. In other words, the second linear path 14B is connected to the first linear path 14A at the end on the side close to the first linear path 14A (the negative direction side of the first direction X), and is connected to the third linear path 14C at the end on the side close to the third linear path 14C (the positive direction side of the first direction X). The resin 13 can be supplied in one go along the first linear path 14A, the second linear path 14B, and the third linear path 14C. The angle formed by the first linear path 14A and the second linear path 14B is substantially the same as the angle formed by the second linear path 14B and the third linear path 14C.

[0111] When the workpiece 10 is viewed from above, the region 19A between the first linear path 14A and the second linear path 14B is blocked on the negative direction side of the first direction X (the side where the first linear path 14A approaches the second linear path 14B), and is open to the outside of the workpiece 10 on the positive direction side of the first direction X (the side where the first linear path 14A is away from the second linear path 14B). On the contrary, the region 19B between the second linear path 14B and the third linear path 14C is blocked on the positive direction side of the first direction X (the side where the third linear path 14C approaches the second linear path 14B), and is open to the outside of the workpiece 10 on the negative direction side of the first direction X (the side where the third linear path 14C is away from the second linear path 14B). The region 19A between the first linear path 14A and the second linear path 14B is not divided by other parts of the resin supply pattern, and is continuous in the first direction X. The region 19B between the second linear path 14B and the third linear path 14C is also continuous in the first direction X.

[0112] The driving unit 140 moves the supply unit 120 along the resin supply pattern relative to the fixed workpiece 10. Specifically, the driving unit 140 includes an upper base 141, a first motor 142M, a first moving unit 142, a second motor 143M, a second moving unit 143, a third motor 144M, a third moving unit 144, and a fourth motor 122M.

[0113] The first moving part 142 is configured to be movable in a first direction X relative to the upper base part 141, the second moving part 143 is configured to be movable in a second direction Y relative to the first moving part 142, and the third moving part 144 is configured to be movable in a third direction Z relative to the second moving part 143. Specifically, the upper base part 141 has a guide rail, and the first moving part 142 has a slider that slides on the guide rail of the upper base part 141 by driving the first motor 142M. The first moving part 142 has a guide rail, and the second moving part 143 has a slider that slides on the guide rail of the first moving part 142 by driving the second motor 143M. The second moving part 143 has a guide rail, and the third moving part 144 has a slider that slides on the guide rail of the second moving part 143 by driving the third motor 144M. The syringe 121 of the supply part 120 is fixed to the third moving part 144. The third moving part 144 has a guide rail, and the push rod 122 of the supply part 120 has a slider that slides on the guide rail of the third moving part 144 by the drive of the fourth motor 122M. That is, the first motor 142M controls the movement amount and movement speed of the supply part 120 in the first direction X, the second motor 143M controls the movement amount and movement speed of the supply part 120 in the second direction Y, and the third motor 144M controls the movement amount and movement speed of the supply part 120 in the third direction Z. In addition, the fourth motor 122M controls the ejection amount and ejection speed of the resin 13 from the supply part 120 by controlling the movement amount and movement speed of the push rod 122.

[0114] Furthermore, the driving unit 140 is not limited to the above-mentioned case, and can be used as long as it moves at least one of the workpiece 10 and the supply unit 120 relative to the other along the resin supply pattern. For example, the driving unit 140 can fix the supply unit 120 and move the stage 150 on which the workpiece 10 is placed relative to the supply unit 120, or can move both the workpiece 10 and the supply unit 120.

[0115] The stage 150 carries the workpiece 10. The stage 150 includes, for example, a weight scale. The resin supply device 100 adjusts the supply amount of the resin 13 while measuring the weight of the resin 13 supplied to the workpiece 10 by the weight scale of the stage 150. Specifically, the driving of the first motor 142M to the fourth motor 122M of the drive unit 140 is changed according to the measurement result of the weight scale. With this structure, the resin 13 is supplied at an arbitrary ejection speed while the syringe 121 is moved at an arbitrary moving speed, thereby supplying an arbitrary amount of resin 13 to the workpiece 10 in an arbitrary shape. For example, if the moving speed in the first direction X and the second direction Y is increased, the supply amount under a specified length can be reduced even if the ejection speed is the same, and if the moving speed in the first direction X and the second direction Y is slowed down, the supply amount under a specified length can be increased even if the ejection speed is the same.

[0116] The resin sealing mold 200 is a pair of molds (a lower mold 210 and an upper mold 220) for resin sealing the workpiece 10 using a compression molding technique. In the present embodiment, the resin sealing mold 200 is an upper mold cavity structure having a cavity 201 in the upper mold 220. In addition, the resin sealing mold 200 includes a closing ring 203 (e.g., an O-ring) that closes the interior of the resin sealing mold 200 (the space between the lower mold 210 and the upper mold 220). Furthermore, although not shown in the figure, the resin sealing device 1 includes a pressure regulating unit (e.g., a vacuum pump) for regulating the internal pressure of the resin sealing mold 200, or a temperature regulating unit (e.g., a heater) for regulating the internal temperature (molding temperature).

[0117] The upper mold 220 includes a chase 221, a cavity block 223, a clamper 225 surrounding the cavity block 223, and a cavity block 227 surrounding the clamper 225 at intervals. The cavity block 223 is fixed to the chase 221. The clamper 225 protrudes toward the lower mold 210 from the cavity block 223, and together with the cavity block 223, forms the cavity 201. The clamper 225 is connected to the chase 221 via a spring, and is configured to be slidable relative to the cavity block 223. When the mold is closed, the outer region 10A of the workpiece 10 is clamped between the clamper 225 and the lower mold 210. A plurality of concave exhaust ports 226 are provided on the lower surface (the surface facing the lower mold 210) of the clamper 225 to connect the space on the cavity block 227 side with the cavity 201. The plurality of exhaust ports 226 extend radially with the cavity 201 as the center. The air in the mold cavity 201 is exhausted through the exhaust port 226 between the upper mold 220 and the lower mold 210 after the mold is closed. In addition, in each of the drawings, the exhaust port 226 is illustrated in depth for ease of understanding, but in fact, the air or gas in the mold is exhausted to a depth (for example, about several μm) at which the resin 13 does not flow out. An exhaust hole 228 is provided in a part of the cavity block 227, and the exhaust hole 228 is connected to a pump to exhaust the air in the mold cavity 201. The exhaust hole 228 of the cavity block 227 extends radially with the mold cavity 201 as the center. The closed ring 203 is clamped by the cavity block 227 and the lower mold 210.

[0118] In the resin sealing mold 200 after mold closing, at least one of the plurality of exhaust ports 226 may be provided on an extension line of a region 19 between mutually adjacent linear paths 14 among the plurality of linear paths 14. Figure 2 As shown, an exhaust port 226 is provided on an extension line of the region 19A between the first linear path 14A and the second linear path 14B.

[0119] Secondly, refer to Figures 3 to 6 , a method for manufacturing a resin-sealed product using the resin sealing device 1 of the present embodiment will be described. Figure 3 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device of the first embodiment. Figure 4 This is a cross-sectional view schematically showing the resin on the workpiece immediately after being placed inside the resin sealing mold. Figure 5 This is a cross-sectional view schematically showing the resin in the process of spreading through the resin sealing mold. Figure 6 FIG. 1 is a cross-sectional view schematically showing the resin filled into the mold cavity by heating and pressurizing. Figures 4 to 6 The illustration of the chamber block 227 is omitted.

[0120] First, the structural information of the cavity 201 is obtained (S11). For example, the model of the resin sealing mold 200 used is input to the acquisition unit 110 from an external terminal, and the structural information of the cavity 201 corresponding to the model is obtained from the database. At this time, the acquisition unit 110 also obtains the configuration information of the components 12 on the workpiece 10. For example, the acquisition unit 110 photographs the workpiece 10, analyzes the image of the workpiece 10, and obtains the configuration information of the components 12 arranged in the first direction X and the second direction Y.

[0121] Next, the resin supply pattern is calculated based on the structural information of the cavity 201 (S12). For example, the calculation unit 130 calculates the resin supply pattern according to a pre-registered rule (e.g., the inclination angle of the linear path 14 relative to the symmetry axis SM of the cavity 201, the thickness or length of the linear path 14, etc.) based on the structural information of the cavity 201 registered by the acquisition unit 110, and determines the desired moving path and moving speed of the supply unit 120. Furthermore, as the structural information of the cavity 201, the inner circumference size of the cavity or the depth of the cavity during final molding, etc. can be cited.

[0122] Next, the resin 13 is supplied onto the workpiece 10 along the resin supply pattern (S13). Here, in a state where the workpiece 10 is positioned in the first direction X, the second direction Y, and the rotation direction centered on the Z axis, the driving unit 140 is driven based on the resin supply pattern to move the supply unit 120 relative to the workpiece 10. After the supply unit 120 moves to the supply start position (one end of the resin supply pattern), the push rod 122 is pressed on the syringe 121, and the clamping valve 123 is opened to start supplying the resin 13. After the supply unit 120 that continuously supplies the resin 13 is moved along the resin supply pattern and the supply unit 120 moves to the supply end position (the other end of the resin supply pattern), the push rod 122 is stopped on the syringe 121, and the clamping valve 123 is closed to end supplying the resin 13.

[0123] Next, the isolation film RF is placed on the upper mold 220, and the workpiece 10 is placed on the lower mold 210. The isolation film RF is moved into the interior of the opened resin sealing mold 200 in a manner covering the mold cavity 201. The isolation film RF can also be supplied, for example, by sending it out from a roller of an unused film arranged in front of the mold and winding it up using a roller of a used film arranged behind the mold. The air is removed from the gap between the cavity block 223 and the clamp 225, or from the air intake hole in the upper mold 220 (not shown), so that the isolation film RF is adsorbed on the upper mold 220. In addition, the workpiece 10 supplied with the resin 13 is moved into the interior of the opened resin sealing mold 200. The air is removed from the air intake hole in the upper mold 220 (not shown), so that the workpiece 10 is adsorbed on the lower mold 210.

[0124] Next, the resin 13 is expanded by closing the mold (S15).

[0125] First, if Figure 4 As shown, for example, the outer area 10A of the workpiece 10 having the flip-chip mounted component 12 and the substrate 11 is clamped by the clamp 225 and the lower mold 210. At this time, although not shown in the figure, the closed ring 203 is clamped by the chamber block 227 and the lower mold 210. A shallow excavation provided on the lower surface of the clamp 225 forms an exhaust port 226 between the lower mold 210 and the clamp 225 (between the workpiece 10 and the clamp 225), and the exhaust port 226 connects the space inside the clamp 225 (the mold cavity 201) and the space outside the clamp 225. Thus, Figure 4 The air in the mold is shown being exhausted to the outside of the cavity block 227.

[0126] Secondly, if Figure 5 As shown, in the mold in a decompressed state, the resin 13 can be expanded through the cavity block 223. At this time, the resin 13 can not only penetrate the gap between the component 12 and the isolation film RF, but also penetrate the gap between the workpiece 10 and the component 12 mounted on the flip chip to perform bottom filling. During the expansion of the resin 13, the area 19 between the adjacent linear paths 14 is filled with the resin 13 from the side where one linear path approaches the other linear path. The area 19 between the linear paths 14 of the paths adjacent to each other on the workpiece 10 will not be divided by the resin 13 before being completely filled with the resin 13, so that air can be exhausted from the exhaust port 226.

[0127] By further closing the mold, the mold cavity block 223 is relatively lowered, such as Figure 6 As shown, the resin 13 is spread throughout the cavity 201, and the fine space such as the gap between the component 12 and the substrate 11 is also filled with the resin 13. Thus, the resin 13 is filled to the front of the exhaust port 226. Here, the resin 13 is softened while being heated by a heater (not shown), and pressurized by the cavity block 223, thereby filling (molding) the resin 13 in the cavity, and filling the gap between the workpiece 10 and the component 12 mounted by flip chip at the bottom of the resin 13.

[0128] Finally, heating and pressurization (curing) are continued for a predetermined time to harden the resin 13 ( S16 ). In this way, the resin sealing of the workpiece 10 is completed.

[0129] According to the structure described in the above embodiment, the resin supply pattern calculated by the calculation unit 130 based on the shape of the cavity 201 has a plurality of linear paths 14, one of the mutually adjacent linear paths 14 is inclined relative to the symmetry axis SM of the cavity 201, the other linear path is inclined relative to the one linear path, and the region 19 between the mutually adjacent linear paths 14 is open to the outside of the workpiece 10 on the side of at least one of the adjacent linear paths 14 away from the other linear path. According to this, when the resin 13 is expanded by the resin sealing mold 200 to resin-seal the workpiece 10, the air remaining inside the resin sealing mold 200 or the gas generated by the resin 13 can be discharged through the region 19. Therefore, the occurrence of defects (such as air pockets or non-filling) caused by the inclusion of air or the like generated by the resin 13 can be suppressed. According to this, when the penetration of the resin 13 into the fine part of the workpiece 10 is not easily hindered by air or the like, for example, the filling of the resin 13 into the gap between the flip-chip mounted component 12 and the substrate 11 can be promoted, thereby suppressing the occurrence of poor filling.

[0130] The second linear path 14B located between the first linear path 14A and the third linear path 14C is connected to the end of the first linear path 14A at one end, and is connected to the end of the third linear path 14C at the other end. In addition, the resin supply pattern is a continuous linear shape. According to this, the resin 13 can be supplied in one go while the air is exhausted in a shape in which the adjacent linear paths are not connected to each other at least at any end side. Therefore, it is not necessary to stop the ejection of the resin 13 during the supply, and the resin 13 can be efficiently supplied to the workpiece 10 by continuously ejecting the resin 13.

[0131] The resin supply device 100 may also include an acquisition unit 110 that acquires the shape of the workpiece 10 or the arrangement information of the component 12. The calculation unit 130 may also calculate the resin supply pattern by adopting the shape of the workpiece 10 or the arrangement information of the component 12. Thus, the resin 13 can be efficiently infiltrated into a fine space such as a gap between the substrate 11 and the component 12, and the occurrence of poor sealing can be suppressed.

[0132] The supply amount of the resin 13 can also be adjusted by adopting the arrangement information of the components 12. For example, the resin supply pattern can be calculated so that the supply amount of the resin 13 in the area where the ratio of the occupied area per unit area of ​​the components 12 on the workpiece 10 (hereinafter referred to as "area ratio") is small is larger than the supply amount of the resin 13 in the area where the area ratio of the components 12 is large. In this way, the occurrence of defects caused by insufficient resin 13 when the resin 13 is heated and pressurized can be suppressed.

[0133] The mutually adjacent linear paths 14 extend to reach the outermost element 12 on the workpiece 10 and are connected to each other on the outermost element 12. Thus, compared with a resin supply pattern in which mutually adjacent linear paths 14 are connected to each other on the element 12 inside the outermost element 12, the occurrence of defects due to insufficient resin 13 in the space on the outer region 10B of the workpiece 10 where a large amount of resin 13 is required can be suppressed compared with the absence of the element 12.

[0134] The exhaust port 226 is provided on the extension line of the region 19 between the adjacent linear paths 14. Thus, the exhaust port is not clogged before the region 19 between the adjacent linear paths 14 is filled with the resin 13, and exhaust can be performed from the inside of the resin sealing mold 200.

[0135] In this embodiment, the acquisition unit 110 acquires the configuration information of the component 12 and the structural information of the cavity 201. The acquisition unit 110 may only acquire the structural information of the cavity 201 without acquiring the configuration information of the component 12. Alternatively, an acquisition unit for acquiring the configuration information of the component 12 and an acquisition unit for acquiring the structural information of the cavity 201 may be provided separately.

[0136] In addition, the resin supply pattern is not limited to the above. It is sufficient as long as at least one of the mutually adjacent linear paths 14 is inclined relative to the symmetry axis SM of the mold cavity 201, and it is sufficient as long as one of the mutually adjacent linear paths 14 is inclined relative to the other linear path. The mutually adjacent linear paths 14 can be connected to each other on the outer area 10B of the workpiece 10. The mutually adjacent linear paths 14 can also extend to the element 12 that is closer to the inner side than the outermost element 12 in addition to the outermost element 12 on the workpiece 10, and the mutually adjacent linear paths 14 are connected to each other on the element 12 that is closer to the inner side than the outermost element 12. The mutually adjacent linear paths 14 can also be separated, and the area 19 between the mutually adjacent linear paths 14 is open to the outside of the workpiece 10 on both the positive direction side and the negative direction side of the first direction X. The angle formed by the linear paths 14 adjacent to each other at the center of the workpiece 10 in the second direction Y may be different from the angle formed by the linear paths 14 adjacent to each other at the end portions of the workpiece 10 in the second direction Y.

[0137] Hereinafter, a modified example of the resin supply pattern and the structure of the resin sealing device of another embodiment of the present invention will be described. Furthermore, matters common to the first embodiment are assumed to be matters that can also be similarly applied to the following embodiments, and their descriptions are omitted, and only the differences are described. In particular, the same symbols are given to the same structures, and the same results and the same effects brought about by the same structures will not be described in sequence.

[0138] Figures 7 to 12The following are schematic plan views showing resin supply patterns according to different modified examples. Figures 7 to 12 In the figure, external areas 20A, 30A, 40A, 50A, 60A, and 70A represent areas clamped by a resin sealing mold; external areas 20B, 30B, 40B, 50B, 60B, and 70B represent areas closer to components 22, 32, 42, 52, 62, and 72 than external areas 20A, 30A, 40A, 50A, 60A, and 70A; symbols 21, 31, 41, 51, 61, and 71 represent substrates; symbols 23, 33, 43, 53, 63, and 73 represent resins; symbols 29, 39, 49, 59, 69, and 79 represent areas between linear paths.

[0139] like Figure 7 As shown, when looking down at the workpiece 20, one of the adjacent linear paths 24 among the multiple linear paths 24 is inclined relative to the symmetry axis SM of the mold cavity, and another linear path is inclined relative to one of the linear paths and is parallel to the symmetry axis SM of the mold cavity.

[0140] like Figure 8 As shown, when the workpiece 30 is viewed from above, the mutually adjacent linear paths 34 are connected by a relay path 35 extending in the second direction Y. The relay path 35 is, for example, in the shape of an arc. Since the mutually adjacent linear paths 34 are connected via the relay path 35, the degree of freedom in designing the interval between the mutually adjacent linear paths 34 or the angle formed by the mutually adjacent linear paths 34 is improved. Furthermore, the relay path 35 is not limited to the above if it does not form a narrowed portion in the area 39 between the mutually adjacent linear paths 34 and does not divide the area 39. For example, if the relay path 35 is in a straight line, a sharp shape may be formed at the connection portion with the linear path 34.

[0141] like Fig. 9 As shown in FIG. 1 , when the workpiece 40 is viewed from above, the mutually adjacent linear paths 44 are separated from each other. The region 49 between the mutually adjacent linear paths 44 is open to the outside of the workpiece 40 on the side where the other linear path of the mutually adjacent linear paths 44 approaches one of the linear paths. That is, the region 49 between the mutually adjacent linear paths 44 is open to the outside of the workpiece 40 on both the positive direction side and the negative direction side of the first direction X parallel to the symmetry axis SM of the mold cavity.

[0142] like Fig.10As shown in FIG. 1 , a component 52A and a component 52B larger than the component 52A are arranged on the workpiece 50. The component 52A is shorter than the component 52B, and the area ratio of the component 52A is smaller than the area ratio of the component 52B. Therefore, the area where the component 52A is arranged requires more resin 53 than the area where the component 52B is arranged. Therefore, by making the linear path 54 extending on the area where the component 52A is arranged thicker than the linear path 54 extending on the area where the component 52B is arranged, the occurrence of defects caused by poor filling can be suppressed.

[0143] like Fig.11 As shown, when the workpiece 60 is viewed from above, the angle formed by the linear paths 64 adjacent to each other in the central portion of the workpiece 60 in the second direction Y is larger than the angle formed by the linear paths 64 adjacent to each other in the end portions of the workpiece 60 in the second direction Y. Accordingly, by making the supply amount of the resin 63 at the end portions of the workpiece 60 having a large outer region 60B larger than the supply amount of the resin 63 at the central portion of the workpiece 60 having a small outer region 60B, the occurrence of defects caused by poor filling can be suppressed.

[0144] like Fig.12 As shown in FIG. 1 , when the workpiece 70 is viewed from above, the angle formed by the linear paths 74 adjacent to each other in the center of the workpiece 70 in the second direction Y is smaller than the angle formed by the linear paths 74 adjacent to each other at the ends of the workpiece 70 in the second direction Y. Accordingly, the width of the open end of the region 79 between the linear paths 74 adjacent to each other in the center of the workpiece 70 and the width of the open end of the region 79 between the linear paths 74 adjacent to each other at the ends of the workpiece 70 can be made substantially the same size. In this way, by appropriately adjusting the width of the region 79 between the adjacent linear paths 74, the occurrence of defects caused by poor filling can be suppressed.

[0145] Even if Figures 7 to 12 The modified example of the first embodiment shown in FIG. Figure 2 The first embodiment shown in the figure also suppresses the occurrence of defects caused by poor filling. Figure 2 and Figure 7 to Figure 12 The respective resin supply patterns can be appropriately combined and applied to one workpiece.

[0146] Fig.13 FIG. 1 is a modified example of a workpiece, and shows a rectangular workpiece 10 used in panel level packaging (PLP: Panel Level Packaging). Fig.13As shown, when looking down at the workpiece 80, the substrate 81 (workpiece 80) is in a rectangular shape having a pair of short sides and a pair of long sides. The linear paths 84 extend along the short sides of the substrate 81, and more specifically, are inclined relative to the short sides of the substrate 81 and arranged along the long sides of the substrate 81. Accordingly, compared with a structure in which the linear paths 84 extend along the long sides of the substrate 81, the length of the region 89 between the adjacent linear paths 84 is shortened, and the resins 13 of the linear paths 84 contact and clog each other during the process of unfolding the resin 83 in the region 89, thereby preventing air from being drawn into the resin 83. Furthermore, Fig.13 The modified examples shown can be appropriately applied to the above-mentioned respective resin supply patterns. Fig.13 In FIG. 8 , the outer region 80A indicates a region sandwiched by the resin sealing mold; and the outer region 80B indicates a region closer to the component 82 than the outer region 80A.

[0147] <Second embodiment>

[0148] Reference Fig.14 , the structure of the resin supply pattern of the second embodiment is described. Fig.14 It is a diagram schematically showing the structure of a resin sealing device according to a second embodiment.

[0149] In the present embodiment, the object to be coated is an isolation film RF that transfers the supplied resin 13 to the workpiece 10. The isolation film RF is placed on the stage 150, and based on the information about the shape of the cavity 901 obtained by the acquisition unit 110, the driving unit 140 moves the supply unit 120 to supply the resin 13 onto the isolation film RF. The resin sealing mold 900 is a lower mold cavity structure including a lower mold 910 having a cavity 901 and an upper mold 920. The isolation film RF is placed on the lower mold 910, and the workpiece 10 is placed on the upper mold 920. The lower mold 910 has a cavity block 913 and a clamp 915 that constitute the cavity 901, and an exhaust port 916 is provided on the upper surface of the clamp 915 (the surface facing the upper mold 920) when the mold is closed.

[0150] Secondly, refer to Fig.14 , a method for manufacturing a resin-sealed product using the resin sealing device 9 of the present embodiment will be described. Fig.15 This is a flowchart showing a method for manufacturing a resin-sealed product using the resin sealing device according to the second embodiment.

[0151] First, the structural information of the cavity 901 is obtained (S91). Secondly, the resin supply pattern is calculated based on the structural information of the cavity 901 (S92). Considering that when the resin supply pattern is calculated by adopting the configuration information of the component 12, the resin supply pattern on the isolation film RF is reversed on the workpiece 10. Next, the resin 13 is supplied to the isolation film RF along the resin supply pattern (S93). Next, the isolation film RF is placed on the lower mold 910, and the workpiece 10 is placed on the upper mold 920 (S94). At this time, by positioning the isolation film RF and the workpiece 10 in the first direction X, the second direction Y and the rotation direction centered on the Z axis, the same effect as when the resin 13 applied on the isolation film RF is supplied to the position corresponding to the component 12 in the workpiece 10 can be obtained. Next, by closing the mold, the resin 13 is brought into contact with the component 12 or the substrate 11 while exhausting air from the cavity of the mold, and the resin 13 is expanded by closing the mold (S95). The resin 13 placed on the isolation film RF of the lower mold 910 is pressed against the workpiece 10 placed on the upper mold 920, and the resin 13 is clamped and expanded by the workpiece 10 and the isolation film RF. Here, it is also considered that by exhausting the air before the resin 13 is brought into contact with the element 12 or the substrate 11, cavitation can be prevented even if a closed space is formed by the contact between the resins 13 on the isolation film RF. However, when the resin 13 is expanded, the gas generated by the heating of the resin 13 remains, which may cause poor filling. In contrast, by providing a path for exhausting the gas as in the present embodiment, the occurrence of adverse conditions such as cavitation caused by the gas can be suppressed. Next, the resin 13 is hardened by heating and pressurizing (S96). In this way, even a mold with a lower mold cavity structure can obtain the same effect as the above-described invention.

[0152] In addition, regarding the form described in this embodiment, any one or more of the resin supply patterns described in the first embodiment can be appropriately combined and applied.

[0153] As described above, according to one embodiment of the present invention, it is possible to provide a resin supply device, a resin sealing device, and a method for manufacturing a resin sealed product that can suppress the occurrence of defects.

[0154] The above-described embodiments are intended to facilitate the understanding of the present invention and are not intended to limit the interpretation of the present invention. The various elements and their configurations, materials, conditions, shapes, and sizes included in the embodiments are not limited to the illustrated contents and may be appropriately changed. In addition, the structures shown in different embodiments may also be partially replaced or combined with each other.

Claims

1. A resin sealing device, include: A resin supply device supplies resin to an object to be coated arranged on a lower mold of a resin sealing mold, the resin supply device comprising: a calculation unit that calculates a resin supply pattern based on a shape of a cavity of the resin sealing mold, and a supply unit that supplies resin to the object to be coated along the resin supply pattern, The resin supply pattern has a plurality of linear paths arranged in a first direction, One of the mutually adjacent linear paths among the plurality of linear paths is inclined from the first direction toward a second direction and is inclined relative to a symmetry axis that symmetrically divides the cavity line, wherein the first direction and the second direction are located on the same plane, and the second direction is perpendicular to the first direction, Another one of the plurality of linear paths adjacent to each other is inclined from the first direction toward a direction opposite to the second direction and is inclined relative to one of the plurality of linear paths adjacent to each other, and a region between the plurality of linear paths adjacent to each other is open to the outside of the coated object on at least one side of the other one of the plurality of linear paths away from at least one of the plurality of linear paths adjacent to each other, wherein the resin supply pattern is a pattern formed by repeatedly folding back an inclined linear path; The resin sealing mold performs resin sealing on the components on the workpiece. The resin sealing mold has a cavity filled with resin and a plurality of exhaust ports for exhausting air from the cavity. The object to be coated is disposed in the resin sealing mold such that an extension portion of at least one of the plurality of exhaust ports radially extending around the cavity of the resin sealing mold is located in a region between adjacent linear paths among the plurality of linear paths.

2. The resin sealing device according to claim 1, wherein the plurality of linear paths include a first linear path, a second linear path adjacent to the first linear path, and a third linear path adjacent to the second linear path, The second linear path is connected to the first linear path at an end portion on a side close to the first linear path, and is connected to the third linear path at an end portion on a side close to the third linear path. 3 . The resin sealing device according to claim 1 , wherein the resin supply pattern is in the form of a continuous line. 4 . The resin sealing device according to claim 1 , wherein a corner portion of the resin supply pattern has an R shape. 5 . The resin sealing device according to claim 1 , wherein a region between adjacent linear paths among the plurality of linear paths is open to the outside of the coating object on a side where the other linear path is close to the one linear path. 6 . The resin sealing device according to claim 1 , wherein the object to be coated is a workpiece to be sealed using the supplied resin.

7. The resin sealing device according to claim 1 or 2, wherein the object to be coated is a separator that transfers the supplied resin to the workpiece. 8 . The resin sealing device according to claim 1 , further comprising an acquisition unit that acquires a shape of a cavity of the resin sealing mold and provides the shape to the calculation unit. 9 . The resin sealing device according to claim 1 , wherein the calculation unit calculates the resin supply pattern by taking into account a shape of a workpiece sealed with the resin supplied to the object to be coated. 10 . The resin sealing device according to claim 1 , wherein the calculation unit calculates the resin supply pattern by adopting arrangement information of components on a workpiece to be sealed with the supplied resin. 11 . The resin sealing device according to claim 10 , wherein the axis of symmetry extends in a direction in which the components are arranged. 12 . The resin sealing device according to claim 1 , wherein the resin supply pattern is calculated so that the resin supply amount in a region where the component area ratio is small in the workpiece is larger than the resin supply amount in a region where the component area ratio is large.

13. The resin sealing device according to claim 1 or 2, wherein the plurality of linear paths include a group of linear paths adjacent to each other in a central portion of the workpiece, and another group of linear paths adjacent to each other in an end portion of the workpiece, The angle formed by the one set of linear paths is larger than the angle formed by the other set of linear paths.

14. The resin sealing device according to claim 1 or 2, wherein the plurality of linear paths include a group of linear paths adjacent to each other in a central portion of the workpiece, and another group of linear paths adjacent to each other in an end portion of the workpiece, The angle formed by the one set of linear paths is smaller than the angle formed by the other set of linear paths.

15. A method for manufacturing a resin-sealed product, comprising supplying a resin onto an object to be coated arranged on a lower mold of a resin-sealed mold, wherein the method include: calculating a resin supply pattern based on a shape of a cavity of the resin sealing mold; supplying resin to the object to be coated along the resin supply pattern, The resin supply pattern has a plurality of linear paths arranged in a first direction, One of the mutually adjacent linear paths among the plurality of linear paths is inclined from the first direction toward a second direction and is inclined relative to a symmetry axis that symmetrically divides the cavity line, wherein the first direction and the second direction are located on the same plane, and the second direction is perpendicular to the first direction, Another one of the plurality of linear paths adjacent to each other is inclined from the first direction toward a direction opposite to the second direction and is inclined relative to one of the plurality of linear paths adjacent to each other. The region between the mutually adjacent linear paths among the plurality of linear paths is open to the outside of the coated object on at least one side of another of the mutually adjacent linear paths away from at least one of the mutually adjacent linear paths, wherein the resin supply pattern is a pattern formed by repeatedly folding back an inclined linear path; as well as Resin seal the components on the workpiece, The resin sealing mold has a cavity filled with resin and a plurality of exhaust ports for exhausting air from the cavity. The object to be coated is disposed in the resin sealing mold such that an extension portion of at least one of the plurality of exhaust ports radially extending from the cavity of the resin sealing mold is located in a region between adjacent linear paths among the plurality of linear paths. 16 . The method for producing a resin-sealed product according to claim 15 , wherein the object to be coated is a workpiece to be sealed using the supplied resin.

17. The method for manufacturing a resin sealed product according to claim 15, wherein the object to be coated is a separator for transferring the supplied resin to a workpiece.

Images