Conductive film, rolled body, connection structure, and method for manufacturing connection structure

Abstract

Provided are a conductive film, a wound body, a connection structure, and a method for manufacturing a connection structure. The conductive film of the present application includes a long peeling film and a plurality of adhesive film pieces having conductivity provided on the peeling film. The plurality of adhesive film pieces are arranged along the length direction X of the peeling film, and the end edge of the peeling film in the width direction of the peeling film is separated from the adhesive film piece closest to the end edge. Thus, the shape of the adhesive film piece can be arbitrarily set. Therefore, the adhesive film piece can be attached to an adhesive surface of various shapes, and the adhesive film piece can be effectively utilized.

Description

[0001] The present application is a divisional application of an application No. 201780061285.1 (international application No. PCT / JP2017 / 034743), filed on September 26, 2017, entitled "Conductive film, wound body, connection structure, and method for manufacturing connection structure". TECHNICAL FIELD

[0002] The present application relates to a conductive film, a wound body, a connection structure, and a method for manufacturing a connection structure. BACKGROUND

[0003] When a first circuit member such as an IC chip and a second circuit member such as a glass substrate are connected to manufacture a connection structure, a conductive film such as an anisotropic conductive film is sometimes used (for example, refer to Patent Literatures 1 and 2). The conductive film is a film in which an adhesive film is formed on the entire surface of a long peeling film. The anisotropic conductive film is a film in which an adhesive film in which conductive particles are dispersed in an adhesive is formed on the entire surface of a long peeling film. The conductive film is provided in the form of a wound body in which the conductive film is wound around a winding core, and is unwound from the wound body when the first circuit member and the second circuit member are connected. Then, the adhesive film of the conductive film is attached to an adhesive surface of the first circuit member, and thereafter, the adhesive surface of the first circuit member and an adhesive surface of the second circuit member are overlapped with the adhesive film interposed therebetween.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Publication No. 2008-274019

[0007] Patent Literature 2: Japanese Patent Application Publication No. 2015-135748 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] However, depending on the type of the connection structure, the shape of the adhesive surface to which the adhesive film is attached differs. Therefore, if the adhesive film is formed on the entire surface of the peeling film, the adhesive film can be attached only to the rectangular adhesive surface having the same width as the peeling film. In the case where the shape of the adhesive surface is not a rectangle having the same width as the peeling film, only a part of the adhesive film formed on the peeling film is attached to the adhesive surface. Therefore, the remaining adhesive film is wasted.

[0010] Therefore, an object of one aspect of the present application is to provide a conductive film, a wound body, a connection structure, and a method for manufacturing a connection structure, which can attach an adhesive film to an adhesive surface having various shapes and can efficiently use the adhesive film.

[0011] Means for solving the problem

[0012] One aspect of the present application relates to an electroconductive film provided with a long strip-shaped release film, and a plurality of adhesive film pieces having electroconductivity provided on the release film, the plurality of adhesive film pieces being arranged in a longitudinal direction of the release film.

[0013] In the electroconductive film, the plurality of adhesive film pieces are arranged in the longitudinal direction of the release film on the long strip-shaped release film. Therefore, the shape of the adhesive film pieces can be arbitrarily set. Thus, the adhesive film pieces can be attached to adhesive surfaces of various shapes, and the adhesive film pieces can be effectively utilized.

[0014] In the electroconductive film, the plurality of adhesive film pieces can be separated in the longitudinal direction of the release film. In the electroconductive film, since the plurality of adhesive film pieces are separated in the longitudinal direction of the release film, the adhesive film pieces can be attached to the adhesive surfaces without affecting the adjacent adhesive film pieces. Thus, the adhesive film pieces can be easily attached to the adhesive surfaces. In addition, the degree of freedom of the shape of the adhesive film pieces can be further expanded.

[0015] In the electroconductive film, the plurality of adhesive film pieces can have the same shape. In the electroconductive film, since the plurality of adhesive film pieces have the same shape, the adhesive film pieces can be efficiently attached to the plurality of adhesive surfaces having the same shape.

[0016] In the electroconductive film, the plurality of adhesive film pieces can be disposed at a central portion in a width direction of the release film. In the electroconductive film, since the plurality of adhesive film pieces are disposed at the central portion in the width direction of the release film, the positioning of the electroconductive film with respect to the adhesive surfaces when the adhesive film pieces are attached to the adhesive surfaces can be easily performed.

[0017] In the electroconductive film, the plurality of adhesive film pieces can be disposed at end portions in the width direction of the release film. In the electroconductive film, since the plurality of adhesive film pieces are disposed at the end portions in the width direction of the release film, the adhesive film pieces can be easily attached to the adhesive surfaces even in a case where there is not enough space on one direction side of the adhesive surfaces.

[0018] In the electroconductive film, the plurality of adhesive film pieces can also be arranged in the width direction of the release film. In the electroconductive film, since the plurality of adhesive film pieces are also arranged in the width direction of the release film, the density of the adhesive film pieces with respect to the release film can be increased. Thus, more adhesive film pieces can be provided on the release film.

[0019] In the conductive film described above, the interval of the plurality of adhesive film pieces in the longitudinal direction of the release film can be greater than or equal to 0.1 mm and less than or equal to 10 mm. In the conductive film, since the interval of the plurality of adhesive film pieces in the longitudinal direction of the release film is greater than or equal to 0.1 mm, the adhesive film pieces can be easily attached to the adhesive surface without affecting adjacent adhesive film pieces. On the other hand, since the interval is less than or equal to 10 mm, the density of the adhesive film pieces with respect to the release film can be increased, and more adhesive film pieces can be provided on the release film.

[0020] In the conductive film described above, the interval of the end edge of the release film in the width direction of the release film and the adhesive film piece closest to the end edge can be greater than or equal to 0.1 mm and less than or equal to 10 mm. In the conductive film, since the interval of the end edge of the release film in the width direction of the release film and the adhesive film piece closest to the end edge is greater than or equal to 0.1 mm, even if the end portion of the release film interferes with other members or the like, the adhesive film pieces can be prevented from being peeled from the release film. On the other hand, since the interval is less than or equal to 10 mm, the adhesive film pieces can be efficiently provided on the release film.

[0021] However, in attaching the adhesive film pieces to the adhesive surface with high precision, the position of the adhesive film pieces on the conductive film needs to be determined. Therefore, it is considered that the position of the adhesive film pieces on the conductive film is detected by a camera device. However, if the adhesive film pieces are attached to the adhesive surface after the consideration, it is preferable that the camera device is arranged on the side of the release film opposite to the adhesive film pieces. Therefore, in the conductive film described above, the release film can have light transmittance. In the conductive film, since the release film has light transmittance, even if the camera device is arranged on the side of the release film opposite to the adhesive film pieces, the position of the adhesive film pieces on the conductive film can be detected by the camera device.

[0022] In the conductive film described above, the transmittance of the release film can be greater than or equal to 15% and less than or equal to 100%. In the conductive film, since the transmittance of the release film is greater than or equal to 15%, the position of the adhesive film pieces can be easily detected from the side of the release film. On the other hand, since the transmittance of the release film is less than or equal to 100%, the release film can be easily manufactured.

[0023] In the conductive film described above, the haze value of the release film can be greater than or equal to 3% and less than or equal to 100%. In the conductive film, since the haze value of the release film is greater than or equal to 3%, the position of the adhesive film pieces can be easily detected from the side of the release film. On the other hand, since the haze value of the release film is less than or equal to 100%, the release film can be easily manufactured.

[0024] The conductive film can further include a second release film provided on the adhesive film. In the conductive film, the surface of the adhesive film is covered with the second release film, and thus the adhesive film can be protected. Therefore, for example, in a case where the conductive film is wound as a roll, the adhesive film can be prevented from being transferred to the release film adjacent to the inner circumferential side or the outer circumferential side.

[0025] In the conductive film, the adhesive film can include conductive particles dispersed in the adhesive. In the conductive film, the adhesive film includes the conductive particles dispersed in the adhesive, and thus the adhesive film can have anisotropic conductivity.

[0026] One aspect of the present application relates to a roll including any of the above-described conductive films and a core on which the conductive film is wound.

[0027] In the roll, the adhesive film can be attached to an adhesive surface having various shapes, and the adhesive film can be effectively used, because the adhesive film is wound on the core.

[0028] One aspect of the present application relates to a connection structure including a first circuit member having a first adhesive surface, a second circuit member having a second adhesive surface, and any of the above-described adhesive films connecting the first adhesive surface and the second adhesive surface.

[0029] In the connection structure, the first adhesive surface and the second adhesive surface are connected by any of the above-described adhesive films. Therefore, the connection structure in which the adhesive film is appropriately attached to the first adhesive surface and the second adhesive surface can be obtained regardless of the shapes of the first adhesive surface and the second adhesive surface.

[0030] One aspect of the present application relates to a method for manufacturing a connection structure including a film manufacturing step of manufacturing a conductive film including a plurality of adhesive films having conductivity provided on a long release film, and the plurality of adhesive films arranged in a longitudinal direction of the release film, and a connection step of connecting a first adhesive surface of a first circuit member and a second adhesive surface of a second circuit member through the adhesive film of the conductive film.

[0031] In the method for manufacturing the connection structure, the conductive film including the plurality of adhesive films provided on the release film is manufactured, and the first adhesive surface and the second adhesive surface are connected through the adhesive film. Since the shape of the adhesive film can be arbitrarily set, the connection structure in which the adhesive film is appropriately attached to the first adhesive surface and the second adhesive surface can be manufactured regardless of the shapes of the first adhesive surface and the second adhesive surface. In addition, the adhesive film can be effectively used.

[0032] In the manufacturing method of the connection structure, the adhesive film sheet can have the conductive particles dispersed in the adhesive. In the manufacturing method of the connection structure, since the adhesive film sheet has the conductive particles dispersed in the adhesive, the adhesive film sheet can have anisotropic conductivity.

[0033] In the manufacturing method of the connection structure, the film manufacturing process can include an adhesive film layer forming process of forming an adhesive film layer having conductivity on the entire surface of the release film, an adhesive film layer cutting process of cutting the adhesive film layer along a contour line that outlines the adhesive film sheet, and a blank release process of releasing a blank portion that is a portion of the adhesive film layer other than the adhesive film sheet from the release film along the cut contour line. In the manufacturing method of the connection structure, the adhesive film layer is formed on the entire surface of the release film, the adhesive film layer is cut along the contour line, and the blank portion is released from the release film along the cut contour line. Thus, the plurality of adhesive film sheets can be easily provided on the release film.

[0034] In the manufacturing method of the connection structure, the adhesive film layer can have the conductive particles dispersed in the adhesive. In the manufacturing method of the connection structure, since the adhesive film layer has the conductive particles dispersed in the adhesive, the adhesive film sheet obtained by cutting the adhesive film layer can have anisotropic conductivity.

[0035] In the manufacturing method of the connection structure, the connection process can include a position detection process of detecting a position of the adhesive film sheet on the conductive film by an imaging device, an attachment process of attaching the adhesive film sheet to the first adhesive surface based on the position detected by the position detection process, and a superimposition process of superimposing the first adhesive surface and the second adhesive surface with the adhesive film sheet interposed therebetween. In the manufacturing method of the connection structure, the position of the adhesive film sheet on the conductive film is detected by the imaging device, and the adhesive film sheet is attached to the first adhesive surface based on the detected position. Thus, the position accuracy of the adhesive film sheet with respect to the adhesive surface can be improved. Further, since the first adhesive surface and the second adhesive surface are superimposed with the adhesive film sheet interposed therebetween, the adhesive film sheet can be easily placed in the first adhesive surface and the second adhesive surface.

[0036] In the manufacturing method of the connection structure, the film manufacturing process can manufacture the conductive film with the second release film sheet provided on the adhesive film sheet. In the manufacturing method of the connection structure, since the surface of the adhesive film sheet is covered with the second release film sheet, the adhesive film sheet can be protected. Thus, for example, in a case where the conductive film is wound as a roll, the adhesive film sheet can be prevented from being transferred to the release film adjacent to the inner circumferential side or the outer circumferential side.

[0037] In the manufacturing method of the connection structure, the film manufacturing process can include: an adhesive film layer forming process of forming an adhesive film layer having conductivity on the entire surface of a release film, further covering a second release film on the entire surface of the adhesive film layer; an adhesive film layer cutting process of cutting the adhesive film layer and the second release film along a contour line that forms an outline of the adhesive film piece; and a blank release process of releasing a blank portion that is a portion other than the adhesive film piece from the release film along the cut contour line. In the manufacturing method of the connection structure, the adhesive film layer is formed on the entire surface of the release film, the second release film is covered on the entire surface of the adhesive film layer, the adhesive film layer is cut along the contour line, and the blank portion is released from the release film along the cut contour line. Thus, the plurality of adhesive film pieces can be easily provided on the release film, and the second release film piece can be covered on the adhesive film piece.

[0038] In the manufacturing method of the connection structure, the adhesive film layer can have conductive particles dispersed in an adhesive. In the manufacturing method of the connection structure, since the adhesive film layer has the conductive particles dispersed in the adhesive, the adhesive film piece cut from the adhesive film layer can have anisotropic conductivity.

[0039] In the manufacturing method of the connection structure, the connection process can include: a position detection process of detecting a position of the adhesive film piece on the conductive film by an imaging device; an attachment process of attaching the adhesive film piece to the first adhesive surface based on the position detected by the position detection process; a superposition process of superposing the first adhesive surface and the second adhesive surface with the adhesive film piece interposed therebetween; and a second release film piece release process of releasing the second release film piece from the adhesive film piece before the attachment process. In the manufacturing method of the connection structure, the position of the adhesive film piece on the conductive film is detected by the imaging device, and the adhesive film piece is attached to the first adhesive surface based on the detected position. Thus, the position accuracy of the adhesive film piece with respect to the adhesive surface can be improved. Further, since the first adhesive surface and the second adhesive surface are superposed with the adhesive film piece interposed therebetween, the adhesive film piece can be easily placed in the first adhesive surface and the second adhesive surface. Further, since the second release film piece is released from the adhesive film piece before the attachment process, the adhesive film piece can be surely attached to the first adhesive surface.

[0040] In the manufacturing method of the connection structure, the release film can be released from the adhesive film piece after the adhesive film piece is attached to the first adhesive surface by the attachment process. In the manufacturing method of the connection structure, since the release film is released from the adhesive film piece after the adhesive film piece is attached to the first adhesive surface, the adhesive film piece can be easily attached to the first adhesive surface.

[0041] In the manufacturing method of the connection structure, the connecting step can further include a film cutting step of cutting the conductive film into a plurality of conductive film pieces each having one or more pieces of the adhesive film provided on the release film before the position detecting step. In the position detecting step, the position of the piece of the adhesive film on the conductive film piece can be detected by the imaging device. In the manufacturing method of the connection structure, since the conductive film is cut into the plurality of conductive film pieces, even in a case where the pieces of the adhesive film are attached at a plurality of positions, a case where the direction in which the pieces of the adhesive film are attached is to be changed, or the like, it is possible to respond flexibly. Also, since the position of the piece of the adhesive film on the conductive film piece is detected by the imaging device, even if the conductive film is cut into the plurality of conductive film pieces, it is possible to improve the position accuracy of the piece of the adhesive film with respect to the adhesive surface.

[0042] Effects of Invention

[0043] According to the present application, it is possible to attach the adhesive film to the adhesive surface of various shapes, and it is possible to effectively use the adhesive film. BRIEF DESCRIPTION OF DRAWINGS

[0044] [ Figure 1 ] is a perspective view showing a winding body to which the present embodiment is applied.

[0045] [ Figure 2 ] is a plan view showing an anisotropic conductive film to which the present embodiment is applied.

[0046] [ Figure 3 ] is a cross-sectional view of the III-III line shown in Figure 2

[0047] [ Figure 4 ] is a plan view for explaining the position of the piece of the adhesive film with respect to the release film.

[0048] [ Figure 5 ] is a cross-sectional view showing a connection structure to which the present embodiment is applied.

[0049] [ Figure 6 ] is a flowchart showing a manufacturing method of a connection structure to which the present embodiment is applied.

[0050] [ Figure 7 ] is a flowchart showing Figure 6

[0051] [ Figure 8 ] Figure 8 (a), Figure 8 (b), Figure 8 (c) and Figure 8 (d) are cross-sectional views for explaining Figure 6

[0052] ​​​[ Figure 9 ] Figure 9 (a) Figure 9 (b) Figure 9 (c) and Figure 9 (d) is used to explain Figure 6 The diagram shows a three-dimensional view of the membrane manufacturing process.

[0053] [ Figure 10 ] indicates Figure 6 The flowchart shown is for the connection process.

[0054] [ Figure 11 [ is used for explanation] Figure 6 The diagram shows a simplified process flow chart of the connection steps.

[0055] [ Figure 12 [Illustration 1] is a plan view of an anisotropic conductive film representing a modified example.

[0056] [ Figure 13 ] Figure 13 (a) Figure 13 (b) and Figure 13 (c) is a plan view of the anisotropic conductive film of the modified example.

[0057] [ Figure 14 ] Figure 14 (a) Figure 14 (b) and Figure 14 (c) is a plan view showing the anisotropic conductive film of the modified example.

[0058] [ Figure 15 [Illustration 1] is a plan view of an anisotropic conductive film representing a modified example.

[0059] [ Figure 16 [Illustration 1] is a plan view of an anisotropic conductive film representing a modified example.

[0060] [ Figure 17 ] Figure 17 (a) Figure 17 (b) and Figure 17 (c) is a plan view showing the anisotropic conductive film of the modified example.

[0061] [ Figure 18 ] Figure 18 (a) Figure 18 (b) and Figure 18 (c) is a plan view showing the anisotropic conductive film of the modified example.

[0062] [ Figure 19 [Illustration 1] is a cross-sectional view of the anisotropic conductive film of modified example 1.

[0063] [ Figure 20 ] Figure 20(a) Figure 20 (b) Figure 20 (c) Figure 20 (d) and Figure 20 (e) is a cross-sectional view of the film manufacturing process in the method for manufacturing the anisotropic conductive film of Modified Example 1.

[0064] [ Figure 21 [ ] is a flowchart illustrating the connection process in the manufacturing method of the connection structure of Modified Example 2.

[0065] [ Figure 22 [ is used for explanation] Figure 21 The diagram shows a simplified process flow chart of the connection steps.

[0066] [ Figure 23 [ is used for explanation] Figure 21 The diagram shows a plan view of the membrane cutting process.

[0067] Symbol Explanation

[0068] 1: Wound body; 2 (2A, 2B1, 2B2, 2B3, 2C1, 2C2, 2C3, 2D, 2E, 2F1, 2F2, 2F3, 2G1, 2G2, 2G3, 2H): Anisotropic conductive film (conductive film); 2Z: Anisotropic conductive sheet (conductive sheet); 3: Core; 3a: Core material; 3b: Side plate; 4: Release film; 5: Adhesive film; 5A: Adhesive film layer; 5A1 : Inner part, 5A2: Blank part, 5B: Outline, 6: Adhesive, 7: Conductive particles, 8: Second release film, 8A: Second release film, 8A1: Inner part, 8A2: Blank part, 10: Connecting structure, 11: First circuit component, 11a: First adhesive surface, 12: Second circuit component, 12a: Second adhesive surface, 21: Camera device, X: Long side direction, Y: Width direction, Z: Thickness direction. Detailed Implementation

[0069] The following is a reference to the appendix. Figure 1 The preferred embodiments of the present invention will be described in detail below. This embodiment applies the conductive film of the present invention to anisotropic conductive films having anisotropic conductivity. However, the conductive film of the present invention can also be applied to various conductive films that do not have anisotropic conductivity. It should be noted that in the accompanying drawings, the same or corresponding parts are given the same reference numerals, and repeated descriptions are omitted. Furthermore, in the accompanying drawings, the size proportions, etc., are appropriately changed for ease of understanding.

[0070] [Wound Body]

[0071] like Figures 1-3As shown, the wound body 1 comprises a long strip (ribbon-shaped) anisotropic conductive film 2 and a core 3 on which the anisotropic conductive film 2 is wound. That is, the wound body 1 is formed by winding the anisotropic conductive film 2 on the core 3.

[0072] The core 3 comprises a core material 3a and a pair of side plates 3b. The core material 3a is formed into a cylindrical shape. An anisotropic conductive film 2 is wound around the outer peripheral surface of the core material 3a. The pair of side plates 3b are mounted at both ends in the axial direction of the core material 3a. The pair of side plates 3b support the anisotropic conductive film 2 from the left and right. The spacing between the pair of side plates 3b is slightly wider than the width of the anisotropic conductive film 2.

[0073] [Anisotropic conductive film]

[0074] like Figure 11 As shown, the anisotropic conductive film 2 includes a strip-shaped release film 4 and a plurality of conductive adhesive films 5 disposed on the release film 4. The adhesive films 5 have conductive particles 7 dispersed in the adhesive 6 to ensure conductivity. It should be noted that, viewed from above, the outline of the anisotropic conductive film 2 is determined by the outline of the release film 4.

[0075] The release film 4 is attached to and supports the adhesive film 5. The material of the release film 4 can be, for example, polyethylene terephthalate (PET), polyethylene, polypropylene, etc. The release film 4 may contain any filler. Furthermore, the surface of the release film 4 may undergo demolding treatment, plasma treatment, etc.

[0076] However, when attaching the adhesive film 5 with high precision to the bonding surface (not shown) of the bonding object (not shown), it is necessary to determine the position of the adhesive film 5 on the anisotropic conductive film 2. Therefore, it is considered to use the camera device 21 (see reference) Figure 2 The position of the adhesive film 5 on the anisotropic conductive film 2 is detected. However, if the adhesive film 5 is to be attached to the bonding surface later, it is preferable to place the camera device 21 on the side of the release film 4 opposite to the adhesive film 5.

[0077] Therefore, the release film 4 can be light-transmitting so that the position of the adhesive film 5 can be detected from the side of the release film 4 by the camera device 21.

[0078] In this case, the permeability of the peeling membrane 4 can be set to greater than or equal to 15% and less than or equal to 100%, preferably greater than or equal to 15% and less than or equal to 99%, and more preferably greater than or equal to 16% and less than or equal to 98%.

[0079] The transmittance of the release film 4 can be measured as follows. The release film cut into a square of 50 mm x 50 mm is set on a haze meter (for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.), and the total light transmittance is measured. The measured result is set as the transmittance of the release film 4.

[0080] In addition, the haze value of the release film 4 can be set to be greater than or equal to 3% and less than or equal to 100%, preferably greater than or equal to 3% and less than or equal to 99%, more preferably greater than or equal to 4% and less than or equal to 99%.

[0081] The haze value of the release film 4 can be measured as follows. The release film cut into a square of 50 mm x 50 mm is set on a haze meter (for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.), and the haze value is measured. The measured result is set as the haze value of the release film 4.

[0082] As the adhesive 6 forming the adhesive film pieces 5, for example, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, a photocurable resin can be used. As the thermoplastic resin, for example, a styrene resin system, a polyester resin system can be used. As the thermosetting resin, for example, an epoxy resin system, a silicone resin system can be used. In the case of using a thermoplastic resin, a thermosetting resin, generally, heating and pressurization are required. In the case of a thermoplastic resin, it is in order to obtain adhesion to the adherend by flowing the resin, and in the case of a thermosetting resin, it is in order to further proceed with the curing reaction of the resin. In addition, the photocurable resin does not require heating in curing, and is useful in the case where connection at a low temperature is required.

[0083] As the conductive particles 7 forming the adhesive film pieces 5, for example, metal particles such as Au, Ag, Ni, Cu, Pd, solder, and carbon particles can be used. In addition, the conductive particles 7 can be particles in which the surface of a transition metal such as Ni or Cu is coated with a noble metal such as Au or Pd. In addition, the conductive particles 7 can be particles in which a non-conductive particle such as glass, ceramic, or plastic is coated with a conductive substance to form a conductive layer on the surface of the non-conductive particle. The conductive particles 7 can further be particles in which the outermost layer is formed of a noble metal, particles using a hot-melt metal, and the like.

[0084] The plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the release film 4. The longitudinal direction X of the release film 4 refers to the direction in which the anisotropic conductive film 2 is unwound from the roll body 1.

[0085] Here, the plurality of adhesive film pieces 5 can be separated in the longitudinal direction X of the release film 4, or can be connected in the longitudinal direction X of the release film 4. For example, Figure 12In the present embodiment, as shown, the plurality of adhesive film pieces 5 are separated in the longitudinal direction X of the release film 4. However, the plurality of adhesive film pieces 5 can be connected in the longitudinal direction X of the release film 4, as in the anisotropic conductive film 2A shown in Figure 2

[0086] In addition, the shape of the adhesive film piece 5 is not particularly limited and can be set to various shapes. As shown in Figure 13 In the present embodiment, as shown, the adhesive film piece 5 is formed in a circular shape. However, the adhesive film piece 5 can be formed in an elliptical shape, as in the anisotropic conductive film 2B1 shown in Figure 14 (a), in an elongated linear shape, as in the anisotropic conductive film 2C1 shown in Figure 13 (a). In these cases, the adhesive film piece 5 can extend in a direction orthogonal to the longitudinal direction X of the release film 4, as in the anisotropic conductive film 2B1 shown in Figure 14 (a), in a direction parallel to the longitudinal direction X of the release film 4, as in the anisotropic conductive film 2B2 shown in Figure 13 (b), or in a direction inclined to the longitudinal direction X of the release film 4, as in the anisotropic conductive film 2C3 shown in Figure 14 (c). Figure 13 (c). Figure 14 (c). Figure 2 (c).

[0087] In addition, the adhesive film piece 5 can be formed with a hole. As shown in Figure 18 In the present embodiment, as shown, the adhesive film piece 5 is not formed with a hole. However, the adhesive film piece 5 can be formed with a hole, as in the anisotropic conductive film 2G1 shown in Figure 18 (a), the anisotropic conductive film 2G2 shown in Figure 18 (b), and the anisotropic conductive film 2G3 shown in Figure 18 ​(c) As shown in the anisotropic conductive film 2G3, a hole 5a is formed in the adhesive film piece 5. The hole 5a is a hole formed by punching (piercing) a portion of the adhesive film piece 5. The shape, size, position, number, and the like of the hole 5a are not particularly limited. For example, the hole 5a can be similar in shape to the adhesive film piece 5, or can not be similar in shape to the adhesive film piece 5. As the shape of the hole 5a, a circular shape such as a circle, an ellipse, and the like, a polygonal shape such as a triangle, a quadrangle, and the like, a complex shape such as a star, various marks, and the like, and the like can be given. As the quadrangle, a square, a rectangle, a trapezoid, and the like can be given. The position of the hole 5a can be the central portion of the adhesive film piece 5, or can be the end portion of the adhesive film piece 5. The number of the hole 5a formed in one adhesive film piece 5 can be one, or can be two or more. In a case where a plurality of holes 5a are formed in one adhesive film piece 5, the shape, size, and the like of each hole 5a can be the same or can be different. Figure 18 (a) As shown in the anisotropic conductive film 2G1, a hole 5a having a quadrangular shape similar to that of the adhesive film piece 5 is formed in the central portion of the adhesive film piece 5 having a quadrangular outline. Figure 18 (b) As shown in the anisotropic conductive film 2G2, a hole 5a having a circular shape similar to that of the adhesive film piece 5 is formed in the central portion of the adhesive film piece 5 having a circular outline. Figure 2 (c) As shown in the anisotropic conductive film 2G3, a hole 5a having a circular quadrangular shape is formed in the central portion of the adhesive film piece 5 having a quadrangular outline.

[0088] In addition, the plurality of adhesive film pieces 5 can be the same in shape, or can be different in shape. As shown in Figure 15 , in the present embodiment, the plurality of adhesive film pieces 5 are all the same in shape. However, the plurality of adhesive film pieces 5 can be different in shape as shown in Figure 3 . In this case, all of the adhesive film pieces 5 can be different in shape from each other, or the adhesive film pieces 5 different in shape can be mixed with the adhesive film pieces 5 the same in shape.

[0089] In addition, the plurality of adhesive film pieces 5 can be disposed at any position in the width direction Y of the release film 4. The width direction Y of the release film 4 refers to a direction orthogonal to the longitudinal direction X of the release film 4 and the thickness direction Z of the release film 4 (see Figure 2 ). For example, as shown in Figure 16 , in the present embodiment, the adhesive film piece 5 is disposed at the central portion in the width direction Y of the release film 4. However, the adhesive film piece 5 can be disposed at the end portion in the width direction Y of the release film 4 as shown in Figure 2 . In this case, all of the adhesive film pieces 5 can be different in shape from each other, or the adhesive film pieces 5 different in shape can be mixed with the adhesive film pieces 5 the same in shape.

[0090] In addition, the plurality of adhesive film pieces 5 can be arranged in one row in the width direction of the release film 4, or can be arranged in a plurality of rows in the width direction of the release film 4. As shown in Figure 17 In the present embodiment, the plurality of adhesive film pieces 5 are arranged in one row in the width direction of the release film 4. However, the plurality of adhesive film pieces 5 can be arranged in two rows in the width direction of the release film 4 as shown in Figure 17 (a), can be arranged in three rows in the width direction of the release film 4 as shown in Figure 17 (b), or can be arranged such that the number of rows in the width direction of the release film 4 differs in the longitudinal direction of the release film 4 as shown in Figure 2 (c).

[0091] In addition, the plurality of adhesive film pieces 5 separated in the longitudinal direction of the release film 4 can be disposed at positions that do not overlap each other as viewed in the width direction Y of the release film 4, or can be disposed at positions that overlap each other as viewed in the width direction Y of the release film 4. As shown in Figure 13 In the present embodiment, the plurality of adhesive film pieces 5 separated in the longitudinal direction of the release film 4 are disposed at positions that do not overlap each other as viewed in the width direction Y of the release film 4. However, the plurality of adhesive film pieces 5 separated in the longitudinal direction of the release film 4 can be disposed at positions that overlap each other as viewed in the width direction Y of the release film 4 as shown in Figure 14 (a), and Figure 4 (c) as shown in the anisotropic conductive film 2B3 and (c) as shown in the anisotropic conductive film 2C3.

[0092] Figure 5 As shown in , the interval A of the plurality of adhesive film pieces 5 in the longitudinal direction X of the release film 4 can be set to be greater than or equal to 0.1 mm and less than or equal to 10 mm, preferably greater than or equal to 0.1 mm and less than or equal to 0.8 mm, and more preferably greater than or equal to 0.2 mm and less than or equal to 0.5 mm. In addition, the interval B of the end edge of the release film 4 and the adhesive film piece 5 closest to the end edge in the width direction Y of the release film 4 can be set to be greater than or equal to 0.1 mm and less than or equal to 10 mm, preferably greater than or equal to 0.1 mm and less than or equal to 0.8 mm, and more preferably greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

[0093] [Connection Structure]

[0094] As shown in Figure 6 , the connection structure 10 includes a first circuit member 11 having a first adhesive surface 11a, a second circuit member 12 having a second adhesive surface 12a, and an adhesive film piece 5 connecting the first adhesive surface 11a and the second adhesive surface 12a.

[0095] The first circuit component 11 is, for example, a chip component such as an IC chip, an LSI chip, a resistor chip, or a capacitor chip. In the first circuit component 11, the surface facing the second circuit component 12 is a first bonding surface 11a. A first electrode (not shown) for conducting with the second circuit component 12 is disposed on the first bonding surface 11a.

[0096] The second circuit component 12 is, for example, a transparent substrate such as a glass substrate, polyimide substrate, polyethylene terephthalate substrate, polycarbonate substrate, cyclic olefin polymer (COP) substrate, polyethylene naphthalate substrate, glass-reinforced epoxy board, paper-phenol substrate, ceramic substrate, or laminate. In the second circuit component 12, the surface opposite to the first bonding surface 11a of the first circuit component 11 is the second bonding surface 12a. A second electrode (not shown) for conducting with the first circuit component 11 is disposed on the second bonding surface 12a.

[0097] It should be noted that, instead of explicitly distinguishing between the first circuit component 11 and the second circuit component 12, any component can be used for each circuit component. For example, the first circuit component 11 can be a transparent substrate such as a glass substrate, polyimide substrate, polyethylene terephthalate substrate, polycarbonate substrate, cyclic olefin polymer (COP) substrate, polyethylene naphthalate substrate, glass-reinforced epoxy board, paper-phenol substrate, ceramic substrate, or laminate. Furthermore, the second circuit component 12 can be a chip component such as an IC chip, LSI chip, resistor chip, or capacitor chip.

[0098] The adhesive film 5 is an adhesive film peeled off from the anisotropic conductive film 2. The adhesive film 5 connects the first adhesive surface 11a and the second adhesive surface 12a through the adhesive 6, and the first electrode of the first adhesive surface 11a and the second electrode of the second adhesive surface 12a are made conductive through the conductive particles 7 dispersed in the adhesive 6.

[0099] [Manufacturing method for connecting structures]

[0100] like Figure 7 As shown, the manufacturing method of the connecting structure includes: a membrane manufacturing process (S1) and a connecting process (S2) performed after the membrane manufacturing process (S1).

[0101] In the film manufacturing step (S1), an anisotropic conductive film 2 is manufactured, which is provided with a plurality of adhesive film pieces 5 having conductivity on a long strip-shaped release film 4, and the plurality of adhesive film pieces 5 are arranged along the longitudinal direction of the release film 4. The adhesive film pieces 5 have conductive particles 7 dispersed in an adhesive 6 in order to have anisotropic conductivity. In the connecting step (S2), a first adhesive surface 11a of a first circuit member 11 and a second adhesive surface 12a of a second circuit member 12 are connected through the adhesive film pieces 5 of the anisotropic conductive film 2.

[0102] As shown in Figure 8 , the film manufacturing step (S1) includes an adhesive film layer forming step (S11), an adhesive film layer cutting step (S12) performed after the adhesive film layer forming step (S1), and a blank release step (S13) performed after the adhesive film layer cutting step (S12).

[0103] In the adhesive film layer forming step (S11), first, as shown in Figure 9 (a) and Figure 8 (a), the release film 4 is prepared. Then, as shown in Figure 9 (b) and Figure 8 (b), an adhesive film layer 5A having conductivity is formed on the entire surface of the release film 4. The adhesive film layer 5A is an adhesive film layer in which the conductive particles 7 are dispersed in the adhesive 6. The adhesive 6 and the conductive particles 7 that form the adhesive film layer 5A are the same as the adhesive 6 and the conductive particles 7 that form the above-described adhesive film pieces 5.

[0104] In the adhesive film layer cutting step (S12), as shown in Figure 9 (c) and Figure 8 (c), the adhesive film layer 5A formed on the release film 4 is cut along a contour line 5B that outlines the adhesive film pieces 5. Thus, the adhesive film layer 5A is separated into an inner side portion 5A1 located on the inner side of the contour line 5B, and a plurality of blank portions 5A2 located on the outer side of the contour line 5B. The inner side portion 5A1 is a portion that becomes the adhesive film pieces 5. The blank portions 5A2 are portions that become portions other than the adhesive film pieces 5. The cutting of the adhesive film layer 5A is performed, for example, by pressing the adhesive film layer 5A against a roll cutter having a cutting blade formed on the outer circumferential surface. Thus, even if the adhesive film pieces 5 are complex shapes, fine shapes, or the like, the adhesive film layer 5A can be easily cut along the contour line 5B.

[0105] In the blank release step (S13), as shown in Figure 9 (d) and Figure 10As shown in (d), along the cut contour line 5B, the blank portion 5A2, which is the part other than the adhesive film 5, in the adhesive film layer 5A is peeled off from the release film 4. The peeling of the blank portion 5A2 is performed, for example, by attaching an adhesive tape to the blank portion 5A2, stretching the adhesive tape, and peeling the blank portion 5A2 off from the release film 4. In this way, the inner portion 5A1 remaining on the release film 4 becomes the adhesive film 5. Thus, an anisotropic conductive film 2 with a plurality of adhesive film 5 provided on the release film 4 is manufactured.

[0106] The anisotropic conductive film 2 manufactured in the above manner is stored and transported in the form of a wound body 1 wound around the core 3, and then transferred to the bonding process (S2). It should be noted that the anisotropic conductive film 2 may also be transferred to the bonding process (S2) without being wound into a wound body 1.

[0107] like Figure 11 As shown, the connection process (S2) includes: a position detection process (S21), an attachment process (S22), and an overlap process (S23).

[0108] In the position detection process (S21), firstly, the anisotropic conductive film 2 is wound out from the winding body 1. Then, as... Figure 11 As shown, the position of the adhesive film 5 on the anisotropic conductive film 2 is detected by the camera device 21. At this time, the camera device 21 can be positioned on the adhesive film 5 side of the release film 4, or on the side of the release film 4 opposite to the adhesive film 5. Figure 19 As shown, in this embodiment, the camera device 21 is disposed on the side of the release film 4 opposite to the adhesive film 5. In this case, by using the light-transmitting release film 4, the camera device 21 can detect the position of the adhesive film 5 on the anisotropic conductive film 2 from the release film 4 side.

[0109] In the application process (S22), the adhesive film 5 is applied to the first adhesive surface 11a based on the position detected by the position detection process (S21). Then, the release film 4 is peeled off from the adhesive film 5 applied to the first adhesive surface 11a.

[0110] In the overlapping step (S23), the first adhesive surface 11a and the second adhesive surface 12a are overlapped with the adhesive film sheet 5 interposed therebetween. Thus, the first adhesive surface 11a and the second adhesive surface 12a are temporarily connected by the adhesive 6 of the adhesive film sheet 5. Then, the first circuit member 11 and the second circuit member 12 are pressed, so that the first circuit member 11 and the second circuit member 12 are made to be conductive by the conductive particles 7 of the adhesive film sheet 5, and the adhesive 6 of the adhesive film sheet 5 is subjected to heat or light, so that the adhesive 6 is cured. Thus, the connection structure 10 in which the first adhesive surface 11a and the second adhesive surface 12a are connected by the adhesive film sheet 5 can be obtained.

[0111] Thus, in the anisotropic conductive film 2 according to the present embodiment, the plurality of adhesive film sheets 5 are arranged along the longitudinal direction X of the release film 4 on the long release film 4. Therefore, the shape of the adhesive film sheet 5 can be arbitrarily set. Thus, the adhesive film sheet 5 can be attached to the adhesive surface of various shapes, and the adhesive film sheet 5 can be efficiently used.

[0112] Further, in the anisotropic conductive film 2, when the plurality of adhesive film sheets 5 are separated in the longitudinal direction X of the release film 4, the adhesive film sheet 5 can be attached to the adhesive surface without affecting the adjacent adhesive film sheet 5. Thus, the adhesive film sheet 5 can be easily attached to the adhesive surface. Further, the degree of freedom of the shape of the adhesive film sheet 5 can be further expanded.

[0113] Further, in the anisotropic conductive film 2, when the plurality of adhesive film sheets 5 are of the same shape, the adhesive film sheet 5 can be efficiently attached to the plurality of adhesive surfaces of the same shape.

[0114] Further, in the anisotropic conductive film 2, when the plurality of adhesive film sheets 5 are arranged at the central portion in the width direction of the release film 4, the positioning of the anisotropic conductive film 2 with respect to the adhesive surface can be easily performed when the adhesive film sheet 5 is attached to the adhesive surface.

[0115] Further, in the anisotropic conductive film 2, when the plurality of adhesive film sheets 5 are arranged at the end portion in the width direction of the release film 4, the adhesive film sheet 5 can be easily attached to the adhesive surface even when there is not enough space on one side of the adhesive surface.

[0116] Further, in the anisotropic conductive film 2, when the plurality of adhesive film sheets 5 are arranged along the width direction Y of the release film 4 as well, the density of the adhesive film sheet 5 with respect to the release film 4 can be increased. Thus, more adhesive film sheets 5 can be provided on the release film 4.

[0117] In addition, in the anisotropic conductive film 2, when the interval of the plurality of adhesive film pieces 5 in the long side direction X of the release film 4 is greater than or equal to 0.1 mm, the adhesive film pieces 5 can be easily attached to the adhesive surface without affecting the adjacent adhesive film pieces 5. On the other hand, when the interval is less than or equal to 10 mm, the density of the adhesive film pieces 5 with respect to the release film 4 can be increased, and thus more adhesive film pieces 5 can be provided on the release film 4.

[0118] In addition, in the anisotropic conductive film 2, when the interval of the end edge of the release film 4 in the width direction of the release film 4 and the adhesive film piece 5 closest to the end edge is greater than or equal to 0.1 mm, even when the end portion of the release film 4 interferes with another member or the like, the adhesive film piece 5 can be prevented from being peeled from the release film 4. On the other hand, when the interval is less than or equal to 10 mm, the adhesive film pieces 5 can be efficiently provided on the release film 4.

[0119] In addition, in the anisotropic conductive film 2, when the release film 4 has light transmittance, even when the imaging device 21 is disposed on the side of the release film 4 opposite the adhesive film pieces 5, the position of the adhesive film pieces 5 on the anisotropic conductive film 2 can be detected by the imaging device 21.

[0120] In addition, in the anisotropic conductive film 2, when the transmittance of the release film 4 is greater than or equal to 15%, the position of the adhesive film pieces 5 can be easily detected from the side of the release film 4. On the other hand, when the transmittance of the release film 4 is less than or equal to 100%, the release film 4 can be easily manufactured.

[0121] In addition, in the anisotropic conductive film 2, when the haze value of the release film 4 is greater than or equal to 3%, the position of the adhesive film pieces 5 can be easily detected from the side of the release film 4. On the other hand, when the haze value of the release film 4 is less than or equal to 100%, the release film 4 can be easily manufactured.

[0122] In the wound body 1 according to the present embodiment, since the anisotropic conductive film 2 described above is wound around the winding core 3, the adhesive film pieces 5 can be attached to various shapes of adhesive surfaces, and the adhesive film pieces 5 can be efficiently utilized.

[0123] In the connection structure 10 according to the present embodiment, the first adhesive surface 11a and the second adhesive surface 12a are connected by the adhesive film pieces 5 described above. Therefore, regardless of the shapes of the first adhesive surface 11a and the second adhesive surface 12a, the connection structure 10 in which the adhesive film pieces 5 are appropriately attached to the first adhesive surface 11a and the second adhesive surface 12a can be obtained.

[0124] In the manufacturing method of the connecting structure according to this embodiment, an anisotropic conductive film 2 with a plurality of adhesive films 5 disposed on a release film 4 is manufactured, and the first adhesive surface 11a and the second adhesive surface 12a are connected through the adhesive films 5 of the anisotropic conductive film 2. Furthermore, since the adhesive films 5 can be arbitrarily shaped, a connecting structure 10 in which the adhesive films 5 are appropriately attached to the first adhesive surface 11a and the second adhesive surface 12a can be manufactured regardless of the shape of the first adhesive surface 11a and the second adhesive surface 12a. In addition, the adhesive films 5 can be used effectively.

[0125] Furthermore, in the manufacturing method of this connecting structure, an adhesive film layer 5A is formed on the entire surface of the release film 4, the adhesive film layer 5A is cut along the contour line 5B, and the blank portion 5A2 is peeled off from the release film 4 along the cut contour line 5B. Thus, multiple adhesive film sheets 5 can be easily provided on the release film 4.

[0126] Furthermore, in the manufacturing method of this connecting structure, the position of the adhesive film 5 on the anisotropic conductive film 2 is detected by the camera device 21, and the adhesive film 5 is attached to the first adhesive surface 11a based on the detected position. Therefore, the positional accuracy of the adhesive film 5 relative to the adhesive surface can be improved. Moreover, since the first adhesive surface 11a and the second adhesive surface 12a are overlapped through the adhesive film 5, the adhesive film 5 can be easily placed within the first adhesive surface 11a and the second adhesive surface 12a.

[0127] Furthermore, in the manufacturing method of this connecting structure, since the release film 4 is peeled off from the adhesive film 5 after the adhesive film 5 is attached to the first adhesive surface 11a, the adhesive film 5 can be easily attached to the first adhesive surface 11a.

[0128] This invention is not limited to the embodiments described above, and appropriate modifications can be made without departing from the spirit of the invention. Hereinafter, variations of the above embodiments will be described.

[0129] [Variation Example 1]

[0130] like Figure 20 As shown, the anisotropic conductive film 2H of Modification 1 further includes a second release film 8 covering the adhesive film 5. That is, the anisotropic conductive film 2H includes: a strip of release film 4; a plurality of adhesive films 5 disposed on the release film 4 and in which conductive particles 7 are dispersed; and a second release film 8 disposed on each adhesive film 5. The second release film 8 protects the adhesive film 5 by covering its surface. Therefore, in Modification 1, the winding body 1 is formed by winding the anisotropic conductive film 2H onto the core 3.

[0131] In Modification 1, the film manufacturing step (S1) and the connecting step (S2) are as described below.

[0132] In the adhesive film layer forming step (S11) of the film manufacturing step (S1), first, as shown in (a), the release film 4 is prepared. Next, as shown in (b), the adhesive film layer 5A is formed on the entire surface of the release film 4. Next, as shown in (c), the second release film 8A is overlaid (attached) on the entire surface of the adhesive film layer 5A. The material of the second release film 8A is the same as that of the second release sheet 8. Figure 20 Figure 20 Figure 20

[0133] In the adhesive film layer cutting step (S12) of the film manufacturing step (S1), as shown in (d), the adhesive film layer 5A and the second release film 8A formed on the release film 4 are cut along the contour line 5B. Thus, the adhesive film layer 5A is separated into the inner side portion 5A1 located on the inner side of the contour line 5B and the plurality of blank portions 5A2 located on the outer side of the contour line 5B. Similarly, the second release film 8A is separated into the inner side portion 8A1 located on the inner side of the contour line 5B and the plurality of blank portions 8A2 located on the outer side of the contour line 5B. Figure 20

[0134] Figure 21 (e) shows, the blank portions 5A2 and the blank portions 8A2 are peeled from the release film 4 along the cut contour line 5B. As a result, the inner side portion 5A1 and the inner side portion 8A1 remain on the release film 4. The inner side portion 5A1 and the inner side portion 8A1 remaining on the release film 4 become the adhesive film sheet 5 and the second release film sheet 8. Thus, the anisotropic conductive film 2H in which the plurality of adhesive film sheets 5 covered with the second release film sheet 8 is provided on the release film 4 is manufactured.

[0135] The anisotropic conductive film 2H manufactured in the above-described manner is transferred to the connecting step (S2) after being stored, transported, or the like in the form of the roll 1 wound on the core 3. Note that the anisotropic conductive film 2H can be transferred to the connecting step (S2) without being wound into the roll 1.

[0136] ​​​​​In the connecting step (S2), the second release sheet peeling step is performed before the attaching step (S22). In the peeling step, first, the second release sheet 8 is peeled from the adhesive sheet 5 in the anisotropic conductive film 2H pulled out from the roll body 1. The peeling of the second release sheet 8 can be performed, for example, by adhering an adhesive tape to the second release sheet 8, stretching the adhesive tape, and peeling the second release sheet 8 from the adhesive sheet 5. Note that the peeling step can be performed at any stage of the connecting step (S2) as long as it precedes the attaching step (S22). Then, as in the above embodiment.

[0137] Thus, in the anisotropic conductive film 2H of the modified example 1, the surface of the adhesive sheet 5 is covered with the second release sheet 8, so the adhesive sheet 5 can be protected. Therefore, in the roll body 1 in which the anisotropic conductive film 2H is wound around the core 3, the adhesive sheet 5 can be inhibited from being transferred to the release film 4 adjacent to the inner circumferential side or the outer circumferential side.

[0138] In addition, in the modified example 1, the adhesive film layer 5A is formed on the entire surface of the release film 4, the second release sheet 8A is overlaid on the entire surface of the adhesive film layer 5A, the adhesive film layer 5A is cut along the contour line 5B, and the blank portion 5A2 is peeled from the release film 4 along the cut contour line 5B. Thus, a plurality of adhesive sheets 5 can be easily provided on the release film 4, and the second release sheet 8 can be overlaid on the adhesive sheet 5.

[0139] In addition, since the second release sheet 8 is peeled from the adhesive sheet 5 before the attaching step, the adhesive sheet 5 can be surely attached to the first adhesive surface 11a.

[0140] [Modified Example 2]

[0141] As shown in Figure 22 In the manufacturing method of the connection structure body of the modified example 2, the connecting step (S2) further includes a film cutting step (S24) performed before the position detecting step (S21).

[0142] In the film cutting step (S24), as shown in Figure 23 and ​As shown, first, the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z. The anisotropic conductive film piece 2Z is a piece in which one or a plurality of pieces of the adhesive film 5 are provided on the release film 4. Then, in the position detection process (S21) immediately after the film cutting process (S24), the position of the piece of the adhesive film 5 on the anisotropic conductive film piece 2Z is detected by the imaging device 21. On the anisotropic conductive film piece 2Z, one piece of the adhesive film 5 can be provided, or two or more pieces of the adhesive film 5 can be provided. In the present embodiment, one piece of the adhesive film 5 is provided on the anisotropic conductive film piece 2Z.

[0143] In the manufacturing method of the connection structure, since the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z, even in a case where the pieces of the adhesive film 5 are attached at a plurality of positions, a case where the direction in which the pieces of the adhesive film 5 are attached is to be changed, or the like, it is possible to respond flexibly. Also, since the position of the piece of the adhesive film 5 on the anisotropic conductive film piece 2Z is detected by the imaging device 21, even if the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z, it is possible to improve the position accuracy of the piece of the adhesive film 5 with respect to the adhesive surface.

[0144] [Modified Example 3]

[0145] In the above-described embodiment, the conductive film to which the present application is applied is described as an embodiment in which the anisotropic conductive film having anisotropic conductivity is used, but the conductive film to which the present application is applied is not limited to the anisotropic conductive film having anisotropic conductivity. That is, the piece of the adhesive film and the layer of the adhesive film can have conductivity, and can not have conductive particles dispersed in the adhesive. As the piece of the adhesive film and the layer of the adhesive film at this time, a piece of the adhesive film and a layer of the adhesive film including a metal oxide such as indium-tin-oxide (ITO), indium oxide, tin oxide, a conductive fiber, or the like can be cited. As the conductive fiber, for example, a metal fiber such as gold, silver, platinum, or the like, and a carbon fiber such as a carbon nanotube can be cited.

Claims

1. A manufacturing method of a connection structure, comprising: a film manufacturing process of manufacturing a conductive film; and a connection process of connecting a first adhesive surface of a first circuit member and a second adhesive surface of a second circuit member through the adhesive film piece of the conductive film, A film manufacturing process for manufacturing an electroconductive film provided with a plurality of adhesive film pieces having electroconductivity on a long release film, and the plurality of adhesive film pieces are arranged along a longitudinal direction of the release film, and an end edge of the release film in a width direction of the release film is separated from the adhesive film piece closest to the end edge; the film manufacturing process has: an adhesive film layer forming process of forming an adhesive film layer having conductivity on the entire surface of the release film; an adhesive film layer cutting process of cutting the adhesive film layer along a contour line forming an outline of the adhesive film piece; and a blank peeling process of peeling a blank portion, which is a portion other than the adhesive film piece, from the release film along the cut contour line.

2. A manufacturing method of a connection structure, comprising: a film manufacturing process of manufacturing a conductive film; and a connection process of connecting a first adhesive surface of a first circuit member and a second adhesive surface of a second circuit member through the adhesive film piece of the conductive film, the film manufacturing process has: an adhesive film layer forming process of forming an adhesive film layer having conductivity on the entire surface of the release film; an adhesive film layer cutting process of cutting the adhesive film layer along a contour line forming an outline of the adhesive film piece; and A film preparation step prepares a conductive film provided with a plurality of adhesive film pieces having conductivity on a long release film, and the plurality of adhesive film pieces are arranged along a longitudinal direction of the release film, and an end edge of the release film in a width direction of the release film is separated from the adhesive film piece closest to the end edge; a blank peeling process of peeling a blank portion, which is a portion other than the adhesive film piece, from the release film along the cut contour line.

3. The manufacturing method of a connection structure according to claim 1 or 2, wherein the adhesive film piece has conductive particles dispersed in an adhesive.

4. The manufacturing method of a connection structure according to claim 1 or 2, wherein the adhesive film layer has conductive particles dispersed in an adhesive.

5. The manufacturing method of a connection structure according to claim 1 or 2, the connection process has: a position detection process of detecting a position of the adhesive film piece on the conductive film by an imaging device; an attaching process of attaching the adhesive film piece to the first adhesive surface based on the position detected by the position detection process; and a superimposition process of superimposing the first adhesive surface and the second adhesive surface through the adhesive film piece.

6. The manufacturing method of a connection structure according to claim 1 or 2, the film manufacturing process manufactures the conductive film provided with a second release film piece on the adhesive film piece.

7. The manufacturing method of a connection structure according to claim 6, the film manufacturing process has: an adhesive film layer forming process of forming an adhesive film layer having conductivity on the entire surface of the release film, further covering a second release film on the entire surface of the adhesive film layer; an adhesive film layer cutting process of cutting the adhesive film layer and the second release film along a contour line forming an outline of the adhesive film piece; and a blank peeling process of peeling a blank portion, which is a portion other than the adhesive film piece, from the release film along the cut contour line. ​ ​ ​ ​ ​ ​ 8. The method of manufacturing a connected structure according to claim 7, wherein the adhesive film layer has conductive particles dispersed in the adhesive.

9. The method of manufacturing a connected structure according to claim 6, wherein the connecting step has: a position detecting step of detecting a position of the adhesive film piece on the conductive film by an imaging device; an attaching step of attaching the adhesive film piece to the first adhesive surface based on the position detected by the position detecting step; a superimposing step of superimposing the first adhesive surface and the second adhesive surface with the adhesive film piece interposed therebetween; and a second release film piece peeling step of peeling the second release film piece from the adhesive film piece before the attaching step.

10. The method of manufacturing a connected structure according to claim 5, wherein, in the attaching step, the release film is peeled from the adhesive film piece after the adhesive film piece is attached to the first adhesive surface.

11. The method of manufacturing a connected structure according to claim 9, wherein, in the attaching step, the release film is peeled from the adhesive film piece after the adhesive film piece is attached to the first adhesive surface.

12. The method of manufacturing a connected structure according to claim 5, wherein the connecting step further has a film cutting step of cutting the conductive film into a plurality of conductive film pieces each having one or more adhesive film pieces provided on the release film before the position detecting step, and wherein, in the position detecting step, the position of the adhesive film piece on the conductive film piece is detected by the imaging device.

13. The method of manufacturing a connected structure according to claim 9, wherein the connecting step further has a film cutting step of cutting the conductive film into a plurality of conductive film pieces each having one or more adhesive film pieces provided on the release film before the position detecting step, and wherein, in the position detecting step, the position of the adhesive film piece on the conductive film piece is detected by the imaging device.

14. The method of manufacturing a connected structure according to claim 1 or 2, wherein the plurality of adhesive film pieces are formed with holes. ​ ​ ​ ​ ​ ​ ​

Images