Carrier device and semiconductor processing equipment

Abstract

The present application provides a carrier device and a semiconductor processing apparatus. The carrier device includes a cover plate, a first bracket, a second bracket, a driving member, and a pressing member. The first bracket is disposed on a first side of the cover plate. The first bracket has a first cavity and is configured to carry a first workpiece of a first size. The first cavity can expose a first region of the first workpiece. The second bracket is disposed on the first side of the cover plate and forms a receiving space with the cover plate. The first bracket is located within the receiving space. The second bracket is configured to carry a second workpiece of a second size, where the second size is greater than the first size. The second bracket has a second cavity, and the second cavity can expose the first cavity and a first region of the second workpiece. The driving member is mounted on the first side of the cover plate. The pressing member is connected to the driving member, and the driving member is configured to drive the pressing member to move so as to press a second region of the first workpiece, or press a second region of the second workpiece, or simultaneously press the second regions of the first workpiece and the second workpiece.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly, to a carrier device and a semiconductor processing apparatus. Background Art

[0002] The support platform of the existing semiconductor processing apparatus is only applicable to semiconductor materials of one size. When performing processing tasks such as processing, inspection, and coating, if semiconductor materials of another size are to be processed, either the semiconductor processing apparatus needs to be replaced, or the support platform in the semiconductor processing apparatus needs to be replaced. This will result in a reduction in production efficiency and does not meet the requirements of industrial production. Summary of the Invention

[0003] Embodiments of this application provide a carrier device and a semiconductor processing apparatus.

[0004] The carrier device of the embodiments of this application includes a cover plate, a first bracket, a second bracket, a driving member, and a pressing member. The first bracket is disposed on a first side of the cover plate. The first bracket has a first cavity and is used for carrying a first workpiece having a first size. The first cavity can expose a first area of the first workpiece. The second bracket is disposed on the first side of the cover plate and forms a receiving space with the cover plate. The first bracket is located in the receiving space. The second bracket is used for carrying a second workpiece having a second size, and the second size is greater than the first size. The second bracket has a second cavity, and the second cavity can expose a first area of the second workpiece. The driving member is installed on the first side of the cover plate. The pressing member is connected to the driving member. The driving member is used for driving the pressing member to move so as to press a second area of the first workpiece against the first bracket, or press a second area of the second workpiece against the second bracket, or simultaneously press the second area of the first workpiece against the first bracket and press the second area of the second workpiece against the second bracket. The second area of the first workpiece surrounds the first area of the first workpiece, and the second area of the second workpiece surrounds the first area of the second workpiece.

[0005] In some embodiments, the pressing member includes a first pressing portion, a second pressing portion, and a connecting portion. The first pressing portion is used for pressing the first workpiece carried on the first bracket. The second pressing portion is used for pressing the second workpiece carried on the second bracket, and the second pressing portion is farther from the cover plate than the first pressing portion. The connecting portion is used for connecting the first pressing portion and the second pressing portion.

[0006] In some embodiments, the pressing member further includes a first buffer portion. The first buffer portion is installed on the first pressing portion and is used for making soft contact with the first workpiece.

[0007] In some embodiments, the pressing member further includes a second buffer portion. The second buffer portion is installed on the second pressing portion and is used for making soft contact with the second workpiece.

[0008] In some embodiments, the driving member includes a cylinder body and a telescopic rod. The cylinder body is mounted on the first side of the cover plate, the telescopic rod is capable of telescoping relative to the cylinder body, and the telescopic rod is connected to any one of the first pressing portion, the connecting portion, and the second pressing portion.

[0009] In some embodiments, the number of driving members is multiple, the number of pressing members is multiple, the multiple driving members and the multiple pressing members correspond respectively, and each driving member is connected to the corresponding pressing member.

[0010] In some embodiments, the carrying device further includes a linkage member. The multiple pressing members are all connected to the linkage member, and the telescopic rod of each driving member passes through the corresponding pressing member and is connected to the linkage member.

[0011] In some embodiments, the multiple driving members are evenly distributed around the center of the cover plate.

[0012] In some embodiments, the multiple pressing members are evenly distributed around the center of the first cavity and / or the second cavity.

[0013] In some embodiments, the cover plate includes a body, a first extension arm, and a second extension arm. The first extension arm is disposed on the first side of the body and is connected to the first bracket. The second extension arm is disposed on the first side of the body and is connected to the second bracket, and the second extension arm is disposed around the first extension arm.

[0014] In some embodiments, the first bracket includes a hollow first support portion, a second support portion, and multiple first receiving portions spaced apart. The first support portion is connected to the first extension arm. The second support portion defines a first cavity, the second support portion is located within the first support portion, and the gap between the second support portion and the first support portion corresponds to the third region of the first workpiece. The third region of the first workpiece surrounds the first region of the first workpiece and is located between the first region and the second region of the first workpiece. The first receiving portions are located between the first support portion and the second support portion and are used to connect the first support portion and the second support portion, and the second region of the first workpiece is carried on the first support portion and / or the first receiving portions.

[0015] In some embodiments, the first receiving portion is provided with a first air groove and a first air passage. The first air passage is connected to the first air groove and is used for air extraction to adsorb the third region of the first workpiece on the first receiving portion.

[0016] In some embodiments, the first receiving portion is provided with a first boss. The first boss cooperates with the second region of the first workpiece to position the first workpiece.

[0017] In some embodiments, the second bracket includes a hollow first bearing portion, a second bearing portion, and a plurality of second receiving portions arranged at intervals. The first bearing portion is connected to the second extension arm. The second bearing portion is provided with a second cavity. The second bearing portion is located within the first bearing portion. The gap between the second bearing portion and the first bearing portion corresponds to the third region of the second workpiece. The third region of the second workpiece surrounds the first region of the second workpiece and is located between the first region and the second region of the second workpiece. The second receiving portions are located between the first bearing portion and the second bearing portion and are used to connect the first bearing portion and the second bearing portion. The second region of the second workpiece is carried on the first bearing portion and / or the second receiving portions.

[0018] In some embodiments, the second receiving portions are provided with second air grooves and second air paths. The second air paths are connected to the second air grooves and are used for air extraction to adsorb the third region of the second workpiece onto the second receiving portions.

[0019] In some embodiments, the second receiving portions are provided with second bosses. The second bosses cooperate with the second region of the second workpiece to position the second workpiece.

[0020] In some embodiments, the first support portion is in a closed ring shape, and the first bearing portion is in a closed ring shape. Or the first support portion is provided with a first notch, and the first bearing portion is provided with a second notch, and the first notch corresponds to the second notch.

[0021] In some embodiments, the carrying device further includes a rotating table. The rotating table is connected to the second side of the cover plate and can rotate to drive the cover plate, the first bracket, the second bracket, the driving member, and the pressing member to rotate synchronously.

[0022] The present application also provides a semiconductor processing device. The semiconductor processing device includes a first base, the carrying device according to any one of the above embodiments, a second base, and a processing device. The carrying device is installed on the first base and can rotate relative to the first base and move along a first direction relative to the first base. The first base is installed on the second base and can move along a second direction relative to the second base to drive the carrying device to move along the second direction together. The second direction is different from the first direction. The processing device is spaced opposite to the carrying device and is located on the first side of the cover plate. The processing device is used to process the area to be processed of the first workpiece and / or the area to be processed of the second workpiece on the carrying device.

[0023] In some embodiments, the semiconductor processing device further includes a third base. The processing device is installed on the third base and can move along a third direction relative to the third base. The third direction, the first direction, and the second direction are all different.

[0024] In the carrying device and semiconductor processing equipment of the present application, the pressing member is driven to move by the driving member, and workpieces of different sizes are pressed against the first bracket and the second bracket, so that the workpieces are stably placed on the carrying device, thereby improving the processing accuracy of the workpieces. At the same time, workpieces of different sizes can be processed without replacing the carrying device, meeting the needs of industrial production.

[0025] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] Figure 1 is a schematic diagram of the three-dimensional structure of a carrying device in certain embodiments of the present application;

[0028] Figure 2 is a perspective exploded schematic diagram of a carrying device according to certain embodiments of the present application;

[0029] Figure 3 is a three-dimensional schematic diagram of a cover plate in a carrying device according to certain embodiments of the present application;

[0030] Figure 4 is a schematic three-dimensional assembly diagram of a driving member and a pressing member in a carrying device according to certain embodiments of the present application;

[0031] Figure 5 yes Figure 4 A schematic exploded perspective view of a driving member and a pressing member in the carrying device shown;

[0032] Figure 6 is a schematic three-dimensional assembly diagram of a first bracket, a second bracket, a driving member, and a pressing member in a carrying device according to certain embodiments of the present application;

[0033] Figure 7 is a three-dimensional assembly diagram of a first bracket, a second bracket, a driving member, a pressing member, a first workpiece, and a second workpiece in a carrying device according to certain embodiments of the present application;

[0034] Figure 8 yes Figure 7 A schematic plan view of the assembly of the first bracket, the second bracket, the driving member, the pressing member, the first workpiece, and the second workpiece in the carrying device shown;

[0035] Figure 9 is a perspective schematic diagram of a first workpiece according to certain embodiments of the present application;

[0036] Figure 10Is a three-dimensional schematic diagram of the second workpiece in some embodiments of the present application;

[0037] Figure 11 Is a structural schematic diagram of a semiconductor processing device in some embodiments of the present application. Detailed embodiments

[0038] The following further describes the embodiments of the present application with reference to the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions throughout.

[0039] In addition, the embodiments of the present application described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and should not be construed as a limitation to the present application.

[0040] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0041] Please refer to Figure 1 、 Figure 2 、 Figure 9 and Figure 10, the carrier device 100 according to the embodiments of the present application includes a cover plate 10, a first bracket 20, a second bracket 30, a driving member 40, and a pressing member 50. The first bracket 20 is disposed on the first side 111 of the cover plate 10. The first bracket 20 is provided with a first cavity 221. The first bracket 20 is used for carrying a first workpiece 2000 having a first size. The first cavity 221 can expose a first area 2001 of the first workpiece 2000. The second bracket 30 is disposed on the first side 111 of the cover plate 10 and forms a receiving space 35 with the cover plate 10. The first bracket 20 is located in the receiving space 35. The second bracket 30 is used for carrying a second workpiece 3000 having a second size, and the second size is greater than the first size. The second bracket 30 is provided with a second cavity 321. The second cavity 321 can expose a first area 3001 of the second workpiece 3000. The driving member 40 is mounted on the first side 1111 of the cover plate 10. The pressing member 50 is connected to the driving member 40. The driving member 40 is used for driving the pressing member 50 to move so as to press a second area 2003 of the first workpiece 2000 against the first bracket 20, or press a second area 3003 of the second workpiece 3000 against the second bracket 30, or simultaneously press the second area 2003 of the first workpiece 2000 against the first bracket 20 and press the second area 3003 of the second workpiece 3000 against the second bracket 30. The second area 2003 of the first workpiece 2000 surrounds the first area 2001 of the first workpiece 2000, and the second area 3003 of the second workpiece 3000 surrounds the first area 3001 of the second workpiece 3000.

[0042] Among them, the carrier device 100 can be used to carry various workpieces for subsequent processing, such as carrying components such as wafers, chips, display panels, mobile phone front covers, mobile phone back covers, VR glasses, AR glasses, smart watch cover plates, glass, lenses, wood, iron plates, and the housings of any device (such as mobile phone cases), etc., for subsequent detection, etching, coating, cutting and other processing.

[0043] The first workpiece 2000 can be components such as wafers, chips, display panels, mobile phone front covers, mobile phone back covers, VR glasses, AR glasses, smart watch cover plates, glass, lenses, wood, iron plates, and the housings of any device (such as mobile phone cases), etc. Please refer to Figure 9, the first workpiece 2000 includes a first region 2001, a second region 2003 and a third region 2002. The first region 2001 is located at the middle position of the first workpiece 2000. The third region 2002 surrounds the first region 2001, and the second region 2003 surrounds the third region 2002. When the first workpiece 2000 is carried by the carrying device 100 for processing, it can be that the front side of the first workpiece 2000 faces the cover plate 10, and the back side of the first region 2001 of the first workpiece 2000 is exposed from the first cavity 221 to perform processing on the back side of the first workpiece 2000. It can also be that the back side of the first workpiece 2000 faces the cover plate 10, and the front side of the first region 2001 of the first workpiece 2000 is exposed from the first cavity 221 to perform processing on the back side of the first workpiece 2000. For example, when the first workpiece 2000 is jointly formed by a film frame, a film and a wafer, the wafer is mounted on the film, and the film is mounted on the film frame. The region where the wafer is located corresponds to the first region 2001 of the first workpiece 2000, the region where the film frame is located corresponds to the second region 2003 of the first workpiece 2000, and the film region between the wafer and the film frame corresponds to the third region 2002 of the first workpiece 2000. When the first workpiece 2000 is carried by the carrying device 100 to perform processing such as detection, it can be that the wafer faces the cover plate 10, and the film on the back side of the wafer is exposed from the first cavity 221 to detect the film, so as to detect whether there are void bubbles, foreign particles, and whether the film has wrinkles and other bonding quality problems between the wafer and the film. When the first workpiece 2000 is carried by the carrying device 100 to perform processing such as detection, it can also be that the wafer deviates from the cover plate 10 and is exposed from the first cavity 221, and the film on the back side of the wafer faces the cover plate 10, so as to detect at least one of the defects of the wafer, the concentricity between the wafer and the film, and the concentricity between the wafer and the film frame.

[0044] Similarly, the second workpiece 3000 can also be components such as a wafer, a chip, a display panel, a front cover of a mobile phone, a back cover of a mobile phone, a VR glasses, an AR glasses, a cover plate of a smart watch, glass, a lens, wood, an iron plate, a housing of any device (such as a mobile phone case), etc. Please refer to Figure 10, the second workpiece 3000 includes a first region 3001, a second region 3003 and a third region 3002. The first region 3001 is located at the middle position of the second workpiece 3000. The third region 3002 surrounds the first region 3001, and the second region 3003 surrounds the third region 3002. When the second workpiece 3000 is carried on the carrying device 100 for processing, it can be that the front side of the second workpiece 3000 faces the cover plate 10, and the back side of the first region 3001 of the second workpiece 3000 is exposed from the first cavity 221 to perform processing on the back side of the second workpiece 3000. Or it can be that the back side of the second workpiece 3000 faces the cover plate 10, and the front side of the first region 3001 of the second workpiece 3000 is exposed from the first cavity 221 to perform processing on the back side of the second workpiece 3000. For example, when the second workpiece 3000 is jointly formed by a film frame, a film and a wafer, the wafer is mounted on the film, and the film is mounted on the film frame. The region where the wafer is located corresponds to the first region 3001 of the second workpiece 3000, the region where the film frame is located corresponds to the second region 3003 of the second workpiece 3000, and the film region between the wafer and the film frame corresponds to the third region 3002 of the second workpiece 3000. When the second workpiece 3000 is carried on the carrying device 100 to perform processing such as detection, it can be that the wafer faces the cover plate 10, and the film on the back side of the wafer is exposed from the first cavity 221 to be able to detect the film, so as to detect whether there are void bubbles, foreign particles between the wafer and the film, and whether the film has wrinkles and other bonding quality problems. When the second workpiece 3000 is carried on the carrying device 100 to perform processing such as detection, it can also be that the wafer faces away from the cover plate 10 and is exposed from the first cavity 221, and the film on the back side of the wafer faces the cover plate 10, so as to be able to detect at least one of the defects of the wafer, the concentricity between the wafer and the film, and the concentricity between the wafer and the film frame.

[0045] The carrying device 100 of the present application drives the pressing member 50 to move through the driving member 40, and presses workpieces of different sizes against the first bracket 20 and the second bracket 30, so as to stably place the workpiece on the carrying device 100 and improve the processing accuracy of the workpiece. In addition, when the first workpiece 2000 and the second workpiece 3000 are carried on the carrying device 100, due to the settings of the first cavity 221 and the second cavity 321, both the front side and the back side of the first workpiece 2000 can be processed (detected), and both the front side and the back side of the second workpiece 3000 can be processed (detected), which broadens the applicable scenarios of the carrying device 100.

[0046] The following will be further described with reference to the drawings.

[0047] Please refer to Figure 3, the cover plate 10 includes a body 11, a first extension arm 12 and a second extension arm 13. The first extension arm 12 is disposed on the first side 111 of the body 11 and is connected to the first bracket 20. The second extension arm 13 is disposed on the first side 111 of the body 11 and is connected to the second bracket 20, and the second extension arm 13 is disposed around the first extension arm 12. Specifically, the first extension arm 12 is provided with a through hole 121, and the second extension arm 13 is provided with a perforation 131. The second extension arm 13 is disposed around the first extension arm 12, and there is a certain gap between the second extension arm 13 and the first extension arm 12 to facilitate the connection of the cover plate 10 to the first bracket 20 and the second bracket 30 of different sizes, so that the carrying device 100 can carry the first workpiece 2000 of the first size and the second workpiece 3000 of the second size, saving costs to a certain extent. In one embodiment, the body 11, the first extension arm 12 and the second extension arm 13 are an integral structure, with a simple structure, which can prevent any one or more of the body 11, the first extension arm 12 and the second extension arm 13 from falling off. In another embodiment, the body 11, the first extension arm 12 and the second extension arm 13 are a split structure, and the first extension arm 12 and the second extension arm 13 can be connected to the body 11 by detachable connection methods such as screws, buckles, hinges, etc., facilitating the replacement of any one or more of the body 11, the first extension arm 12 and the second extension arm 13. The first extension arm 12 and the second extension arm 13 can be connected to the body 11 by fixed connection methods such as welding and fusion welding, which can prevent any one or more of the body 11, the first extension arm 12 and the second extension arm 13 from falling off.

[0048] Specifically, in some embodiments, the first size can be 8 inches, and the second size can be 12 inches. In other embodiments, the cover plate 10 is not limited to only providing an extension arm group formed by a plurality of first extension arms 12 and an extension arm group formed by a plurality of second extension arms 13. It can also be provided with more groups of extension arms corresponding to connect a plurality of brackets to adapt to the sizes of different workpieces. The first size is not limited to 8 inches. For example, it can also be 7 inches, 6 inches, 5 inches, 4 inches, 3 inches, 2 inches, etc. The second size is not limited to 12 inches, and can also be 17 inches, 16 inches, 15 inches, 14 inches, 13 inches, 11 inches, etc., as long as the second size is greater than the first size.

[0049] Please refer to Figure 2 , Figure 3 and Figure 9, the first bracket 20 may include a hollow first support portion 21, a second support portion 22, and a plurality of first receiving portions 23 arranged at intervals. The first support portion 21 is connected to the first extension arm 12. The second support portion 22 is provided with a first cavity 221. The second support portion 22 is located within the first support portion 21. The gap 24 between the second support portion 22 and the first support portion 21 corresponds to the third region 2002 of the first workpiece 2000. The first receiving portions 23 are located between the first support portion 21 and the second support portion 22 and are used to connect the first support portion 21 and the second support portion 22. The second region 2003 of the first workpiece 2000 is carried on the first support portion 21 and / or the first receiving portions 23.

[0050] The first support portion 21 has a hollow structure, which can reduce the overall weight of the first bracket 20 and effectively save the use of materials, thereby saving costs to a certain extent. In this embodiment, the first support portion 21 is provided with a first notch 212. The manipulator can place the first workpiece 2000 on the first bracket 20 through the first notch 212. The first notch 212 plays a role of avoiding and protecting the first workpiece 2000. At the same time, the setting of the first notch 212 can further save the use of materials and save more costs. In another embodiment, the first support portion 21 may be in a closed ring shape. At this time, the manipulator can place the first workpiece 2000 on the first bracket 20 through the receiving space 35.

[0051] Please refer to Figure 2 and Figure 3 , in this embodiment, the first bracket 20 and the cover plate 10 are of a split structure. Specifically, the first support portion 21 is provided with a through hole 211. The through hole 211 of the first support portion 21 corresponds to the through hole 121 of the first extension arm 12. Screws sequentially pass through the through hole 211 of the first support portion 21 and the through hole 121 of the first extension arm 12 to fixedly connect the first bracket 20 to the first side 111 of the cover plate 10. In another embodiment, the first bracket 20 can be connected to the cover plate 10 by detachable connection methods such as buckles and hinges. The detachable connection method facilitates detaching the first bracket 20 from the first side 111 of the cover plate 1,0 thereby facilitating the replacement of the first bracket 20. In yet another embodiment, the first bracket 20 can be connected to the cover plate 10 by fixed connection methods such as welding and fusion welding. The fixed connection between the first bracket 20 and the cover plate 10 can prevent the first bracket 20 from detaching from the cover plate 10 during use. In other embodiments, the first bracket 20 and the cover plate 10 can also be of an integral structure, which is simple in structure and can prevent the first bracket 20 from falling off the cover plate 10.

[0052] Please refer to Figure 2 and Figure 9, multiple first receiving portions 23 are spaced apart from each other and are all disposed between the first support portion 21 and the second support portion 22, which serves to connect the first support 21 and the second support portion 22, can further reduce the overall weight of the first bracket 20, and can further reduce the use of materials for the first bracket 20, saving costs. Please refer to Figure 11 , in one embodiment, when the first workpiece 2000 is formed by the adhesive film frame, the adhesive film and the wafer as described above, the first region 2001 can be exposed from the first cavity 221, and the adhesive film at the third region 2002 can be exposed from the gap 24 between the first support portion 21 and the second support portion 22. If the front side of the first workpiece 2000 faces the cover plate 10, that is, the wafer faces the cover plate 10, it is convenient for the processing device 400 of the semiconductor processing device 1000 to detect whether there are void bubbles, foreign particles between the wafer and the adhesive film, and whether there are wrinkles in the adhesive film and other bonding quality problems from the first cavity 221. The gap 24 can facilitate the processing device 400 of the semiconductor processing device 1000 to detect whether there are quality problems on the back side of the adhesive film corresponding to the third region 2002; if the back side of the first workpiece 2000 faces the cover plate 10, that is, the wafer faces away from the cover plate 10, it is convenient for the processing device 400 to detect the defects of the wafer from the first cavity 221, and the gap 24 can facilitate the processing device 400 to detect whether there are quality problems on the front side of the adhesive film corresponding to the third region 2002. The gap 24 and the first cavity 221 are jointly used to facilitate the processing device 400 to detect the concentricity between the wafer and the adhesive film and the concentricity between the wafer and the adhesive film frame.

[0053] Further, the first receiving portion 23 may be provided with a first air groove and a first air path, and the first air path is connected to the first air groove. An external air extraction device extracts air through the first air path to flatly adsorb the adhesive film on the third region 2002 of the first workpiece 2000 on the first receiving portion 23, which serves to fix the adhesive film and ensure the stability of the wafer. In this embodiment, the first receiving portion 23, the first support portion 21, and the second support portion 22 are of an integral structure, with a simple structure, which can prevent any one or more of the first support portion 21, the second support portion 22, and the first receiving portion 23 from falling off. In other embodiments, the first receiving portion 23 and the first support portion 21, the second support portion 22 are of a split structure, and the first receiving portion 23 can be connected to the first support portion 21 and the second support portion 22 by detachable connection methods such as screws, buckles, hinges, etc., which is convenient for replacing any one or more of the first support portion 21, the second support portion 22, and the first receiving portion 23. The first receiving portion 23 can also be connected to the first support portion 21 and the second support portion 22 by fixed connection methods such as welding and fusion welding, preventing any one or more of the first support portion 21, the second support portion 22, and the first receiving portion 23 from falling off.

[0054] In one embodiment, the first receiving portion 23 may be provided with a first boss 231, and the first boss 231 cooperates with the second region 2003 of the first workpiece 2000 to position the first workpiece 2000. Specifically, the film frame corresponding to the second region 2003 is a hollow structure and is provided with a hollow cavity ( Figure 9 the wafer corresponding to the first region 2001 and the film corresponding to the third region 2002 block the hollow cavity), the height of the first boss 231 is lower than or equal to the depth of the hollow cavity of the film frame. When the first workpiece 2000 is carried on the first bracket 20, the film frame is carried on the first support portion 21 and / or the first receiving portion 23, and the first boss 231 can extend into the hollow cavity of the film frame to position the first workpiece 2000.

[0055] Please refer to again Figure 2 , Figure 3 and Figure 9 , the second bracket 30 may include a hollow first carrying portion 31, a second carrying portion 32 and a plurality of second receiving portions 33 arranged at intervals. The first carrying portion 31 is connected to the second extension arm 13. The second carrying portion 32 is provided with a second cavity 321. The second carrying portion 32 is located within the first carrying portion 31. The gap 34 between the second carrying portion 32 and the first carrying portion 31 corresponds to the third region 3002 of the second workpiece 3000. The second receiving portion 33 is located between the first carrying portion 31 and the second carrying portion 32 and is used to connect the first carrying portion 31 and the second carrying portion 32. The second region 3003 of the second workpiece 3000 is carried on the first carrying portion 31 and / or the second receiving portion 33.

[0056] Please refer to in combination with Figure 6 , the first carrying portion 31 is a hollow structure, which can reduce the overall weight of the second bracket 30 and can also effectively save the use of materials, thereby saving costs to a certain extent. In this embodiment, the first carrying portion 31 is provided with a second notch 312, where the second notch 3 to 12 corresponds to the first notch 212. The manipulator can place the second workpiece 3000 on the second bracket 30 through the second notch 312, and the second notch 312 plays a role of avoiding and protecting the first workpiece 2000. At the same time, the setting of the second notch 212 can further save the use of materials and save more costs. In another embodiment, the first carrying portion 31 may be a closed ring shape. At this time, the manipulator can place the second workpiece 3000 on the second bracket 30 through the receiving space 35.

[0057] Please refer to Figure 2 and Figure 3, in this embodiment, the second bracket 30 and the cover plate 10 are of a split structure. Specifically, the first bearing portion 31 is provided with a through hole 311, and the through hole 311 of the first bearing portion 31 corresponds to the through hole 131 of the second extension arm 13. Screws sequentially pass through the through hole 311 of the first bearing portion 31 and the through hole 131 of the second extension arm 13 to fixedly connect the second bracket 30 to the first side 111 of the cover plate 10. In another embodiment, the second bracket 30 can be connected to the cover plate 10 by detachable connection methods such as buckles and hinges. The detachable connection method facilitates detaching the second bracket 30 from the first side 111 of the cover plate 10, thereby facilitating the replacement of the second bracket 30. In yet another embodiment, the second bracket 30 can be connected to the cover plate 10 by fixed connection methods such as welding and fusion welding. The fixed connection of the second bracket 30 and the cover plate 10 can prevent the second bracket 30 from detaching from the cover plate 10 during use. In other embodiments, the second bracket 30 and the cover plate 10 can also be of an integral structure, which is simple in structure and can prevent the second bracket 30 from falling off the cover plate 10.

[0058] Please refer to Figure 2 and Figure 9 , a plurality of second receiving portions 33 are spaced apart from each other and are all provided between the first bearing portion 31 and the second receiving portion 32, serving to connect the first bearing portion 31 and the second bearing portion 32, which can further reduce the overall weight of the second bracket 30 and can further reduce the use of materials for the second bracket 30, saving costs. Please combine Figure 11 , in one embodiment, when the second workpiece 3000 is formed by the adhesive film frame, the adhesive film and the wafer as described above, the first region 3001 can be exposed from the second cavity 321, and the adhesive film at the third region 3002 can be exposed from the gap 34 between the first bearing portion 31 and the second bearing portion 32. If the front side of the second workpiece 3000 faces the cover plate 10, that is, the wafer faces the cover plate 10, it is convenient for the processing device 400 to detect whether there are void bubbles, foreign particles between the wafer and the adhesive film, and whether there are wrinkles in the adhesive film and other bonding quality problems in the second cavity 321. The gap 34 can facilitate the processing device 400 to detect whether there are quality problems on the back side of the adhesive film corresponding to the third region 3002; if the back side of the second workpiece 3000 faces the cover plate 10, that is, the wafer faces away from the cover plate 10, it is convenient for the processing device 400 to detect the defects of the wafer in the second cavity 321, and the gap 34 can facilitate the processing device 400 to detect whether there are quality problems on the front side of the adhesive film corresponding to the third region 3002. The gap 24 and the first cavity 221 are jointly used to facilitate the processing device 400 to detect the concentricity between the wafer and the adhesive film and the concentricity between the wafer and the adhesive film frame.

[0059] Further, the second receiving portion 33 may be provided with a second air groove and a second air passage. The second air passage is connected to the second air groove. An external air extraction device sucks through the second air passage to flatly adsorb the adhesive film on the third region 3002 of the second workpiece 3000 onto the second receiving portion 33, which plays a role in fixing the adhesive film and ensuring the stability of the wafer. In this embodiment, the second receiving portion 33, the first carrying portion 31, and the second carrying portion 32 are of an integral structure, with a simple structure, which can prevent any one or more of the first carrying portion 31, the second carrying portion 32, and the second receiving portion 33 from falling off. In other embodiments, the second receiving portion 33 and the first carrying portion 31, the second carrying portion 32 are of a split structure. The second receiving portion 33 can be connected to the first carrying portion 31 and the second carrying portion 32 by detachable connection methods such as screws, buckles, and hinges, which is convenient for replacing any one or more of the first carrying portion 31, the second carrying portion 32, and the second receiving portion 33. The second receiving portion 33 can also be connected to the first carrying portion 31 and the second carrying portion 32 by fixed connection methods such as welding and fusing, preventing any one or more of the first carrying portion 31, the second carrying portion 32, and the second receiving portion 33 from falling off.

[0060] In one embodiment, the second receiving portion 33 may be provided with a second boss 331. The second boss 331 cooperates with the second region 3003 of the second workpiece 3000 to position the second workpiece 3000. Specifically, the adhesive film frame corresponding to the second region 3003 is of a hollow structure and is provided with a hollow cavity ( Figure 10 the wafer corresponding to the first region and the adhesive film corresponding to the third region 3002 in the middle cover the hollow cavity), and the height of the second boss 331 is lower than or equal to the depth of the hollow cavity of the adhesive film frame. When the second workpiece 3000 is carried on the second bracket 30, the adhesive film frame is carried on the first carrying portion 31 and / or the second receiving portion 33, and the second boss 331 can extend into the hollow cavity of the adhesive film frame to position the second workpiece 3000.

[0061] Please refer to Figure 2 、 Figure 4 and Figure 6 As shown in, the driving member 40 may include a cylinder body 41 and a telescopic rod 42. The cylinder body 41 is installed on the cover plate 10, the telescopic rod 42 can telescopically move relative to the cylinder body 41, and the telescopic rod 42 is connected to the pressing member 50.

[0062] Please refer to Figure 3 and Figure 5, specifically, the cylinder body 41 is provided with a through hole 411 and a mounting hole 412. The main body 11 of the cover plate 10 may further be provided with a groove 14 corresponding to the cylinder body 41. The groove 14 is provided with a connecting hole 141. The through hole 411 of the cylinder body 41 corresponds to the connecting hole 141 of the groove 14. A screw sequentially passes through the through hole 411 of the cylinder body 41 and the connecting hole 141 of the groove 14 to mount the cylinder body 41 on the first side 111 of the cover plate 10. One end of the telescopic rod 42 close to the pressing member 50 is provided with a locking hole 421.

[0063] Please refer to Figure 4 and Figure 5 , the pressing member 50 includes a first pressing portion 51, a second pressing portion 52, a connecting portion 53, a first buffer portion 54 and a second buffer portion 55. Specifically, the pressing member 50 is an integral structure with a simple structure. The first pressing portion 51 is provided with a through hole 511. One end of the first buffer portion 54 passes through the through hole 511 of the first pressing portion 51 and the first buffer portion 54 is fixed to the first pressing portion 51 by a screw. Please combine Figure 6 and Figure 9 , the first pressing portion 51 presses the first workpiece 2000 against the first support portion 21 and / or the first receiving portion 23 through the first buffer portion 54. The first buffer portion 54 makes soft contact with the first workpiece 2000, which can effectively prevent the first pressing portion 51 from wearing the first workpiece 2000. Similarly, the second pressing portion 52 is provided with a through hole 521. One end of the second buffer portion 55 passes through the through hole 521 of the second pressing portion 52 and the second buffer portion 55 is fixed to the second pressing portion 52 by a screw. The second pressing portion 52 presses the second workpiece 3000 against the first bearing portion 31 and / or the second receiving portion 33 through the second buffer portion 55. The second buffer portion 55 makes soft contact with the second workpiece 3000, which can effectively prevent the second pressing portion 52 from wearing the second workpiece 3000. Due to the design of the pressing member 50, the first workpiece 2000 and the second workpiece 2000 can be simultaneously pressed against the first bracket 20 and the second bracket 30 respectively. In one embodiment, the materials of the first buffer portion 54 and the second buffer portion 55 are rubber or sponge and other materials, so as to achieve soft contact between the pressing member 50 and the first workpiece 2000 and the second workpiece 3000, and avoid scratching the surfaces of the first workpiece 2000 and / or the second workpiece 3000, and protect the first workpiece 2000 and / or the second workpiece 3000 while realizing the processing work.

[0064] Please refer to Figure 2 and Figure 5, in this embodiment, the carrying device 100 may further include a linkage member 60. The second pressing portion 52 is further provided with a through hole 522, and the telescopic rod 42 is provided with a locking hole 421. A plurality of through holes (not shown in the figure) are provided on the linkage member 60. The number of driving members 40 is plural, and the number of pressing members 50 is plural. The plurality of driving members 40 and the plurality of pressing members 50 correspond to each other respectively, and the plurality of pressing members 50 are all connected to the linkage member 60. The plurality of driving members 40 are evenly distributed around the center of the cover plate 10, and the plurality of pressing members 50 are evenly distributed around the center of the first cavity 221 and / or the second cavity 321. Specifically, the telescopic rod 42 passes through the mounting hole 412 of the cylinder body 41, and the screw sequentially passes through the through hole (not shown in the figure) of the linkage member 60, the through hole 522 of the second pressing portion 52, and the locking hole 421 of the telescopic rod 42, so as to install the driving member 40 on the second pressing portion 52. In another embodiment, the telescopic rod 42 may be connected to the first pressing portion 51 or the connecting portion 53. The evenly distributed driving members 40 and pressing members 50 can realize placing the first workpiece 2000 and / or the second workpiece 3000 flatly on the first bracket 20 and the second bracket 30. When the plurality of driving members 40 drive the corresponding pressing members 50 to move simultaneously to press the workpiece, the linkage member 60 can well make the plurality of pressing members 50 move synchronously and always maintain the same height, so that the stress points of the workpiece are always in the same plane, avoiding warping of the workpiece.

[0065] Please refer to Figure 2 , the carrying device 100 may further include a rotating table 70. The rotating table 70 is connected to the second side 112 of the cover plate 10 and can rotate to drive the cover plate 10, the first bracket 20, the second bracket 30, the driving member 40, and the pressing member 50 to rotate synchronously. Please combine Figures 9 to 10 , the setting of the rotating table 70 can realize the rotation processing of the semiconductor processing device 1000 on the first workpiece 2000 and the second workpiece 3000. In one embodiment, the rotating table 70 and the cover plate 10 may be connected by detachable means such as screws, buckles, hinges, etc., which is convenient for replacing the rotating table 70 or / and the cover plate 10. In another embodiment, the rotating table 70 and the cover plate 10 may also be connected by fixed connection means such as welding and fusion welding to prevent the rotating table 70 from detaching from the cover plate 10 during the rotation process.

[0066] Please refer to Figure 11, the present application further provides a semiconductor processing device 1000. The semiconductor processing device 1000 includes the carrier device 100, the first base 200, the second base 300, the processing device 400, and the third base 500 of any of the above embodiments. The carrier device 100 is mounted on the first base 200 and can rotate relative to the first base 200 and move along the first direction X relative to the first base 200. The first base 200 is mounted on the second base 300 and can move along the second direction Y relative to the second base 300 to drive the carrier device 100 to move along the second direction Y together. The second direction Y is different from the first direction X. The processing device 400 is spaced opposite to the carrier device 100 and is located on the first side 111 ( Figure 2 shown) of the cover plate 10 ( Figure 2 shown). Specifically, the processing device 400 is mounted on the third base 500 and can move along the third direction Z relative to the third base 500. The first direction X, the second direction Y, and the third direction Z are all different. Please refer to Figure 9 . The processing device 400 is used to process the first region 2001, the third region 2002 of the first workpiece 2000 and / or the first region 3001, the third region 3002 of the second workpiece 3000 on the carrier device 100. The processing device 400 can process the front or back of the first workpiece 2000 or the second workpiece 3000 along the third direction Z. For example, the processing device 400 can be disposed below the carrier device 100 to process the exposed portions of the first workpiece 2000 or the second workpiece 3000 from the first cavity 221 and / or the second cavity 321 of the carrier device 100.

[0067] In one embodiment, the processing device 400 can be an inspection device, and the inspection device can be used to detect defects of the workpiece carried on the carrier device 100. In one embodiment, the processing device 400 can be an etching device, and the etching device can be used to etch the workpiece carried on the carrier device 100. In another embodiment, the processing device 400 can also be a coating device, and the coating device can be used to perform evaporation plating, sputtering, etc. on the workpiece carried on the carrier device 100. In yet another embodiment, the processing device 400 can also be a cutting device, and the cutting device can be used to cut the workpiece carried on the carrier device 100, etc. The processing device 400 can also be of other types, which all fall within the protection scope of the present application and will not be listed one by one here.

[0068] Please refer to Figure 2, the semiconductor processing equipment 1000 of the present application drives the pressing member 50 to move through the driving member 40, and presses workpieces of different sizes against the first support 20 and the second support 30, so as to stably place the workpieces on the carrying device 100, improve the processing accuracy of the workpieces, and at the same time, it is possible to process workpieces of different sizes without replacing the carrying device 100, meeting the needs of industrial production. In addition, when the first workpiece 2000 and the second workpiece 3000 are carried on the carrying device 100, due to the settings of the first cavity 221 and the second cavity 321, both the front and back surfaces of the first workpiece 2000 can be processed (detected), and both the front and back surfaces of the second workpiece 3000 can be processed (detected), broadening the applicable scenarios of the carrying device 100.

[0069] In the description of this specification, the description of reference terms such as "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0070] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the said features. In the description of the present application, "a plurality" means at least two, such as two, three, unless otherwise specifically and clearly defined.

[0071] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A carrying device, characterized in that: The carrying device includes: cover; a first bracket, the first bracket being disposed on a first side of the cover plate, the first bracket defining a first cavity, the first bracket being configured to carry a first workpiece having a first size, the first cavity being capable of exposing a first area of the first workpiece; a second bracket, the second bracket being disposed on a first side of the cover plate and forming a receiving space with the cover plate, the first bracket being located within the receiving space, the second bracket being configured to carry a second workpiece having a second size, the second size being larger than the first size, the second bracket being configured to define a second cavity capable of exposing a first area of the second workpiece; a driving member mounted on the first side of the cover plate; and A pressing member connected to the driving member, wherein the driving member is used to drive the pressing member to move so as to press the second area of the first workpiece on the first bracket, or to press the second area of the second workpiece on the second bracket, or to simultaneously press the second area of the first workpiece on the first bracket and the second area of the second workpiece on the second bracket, wherein the second area of the first workpiece surrounds the first area of the first workpiece, and the second area of the second workpiece surrounds the first area of the second workpiece.

2. The carrying device according to claim 1, characterized in that: The pressing member comprises: a first pressing portion, the first pressing portion being used to press the first workpiece carried on the first bracket; a second pressing portion, the second pressing portion being used to press the second workpiece carried on the second bracket, the second pressing portion being further away from the cover plate than the first pressing portion; and A connecting portion, wherein the connecting portion is used to connect the first pressing portion and the second pressing portion.

3. The carrying device according to claim 2, characterized in that: The pressing member further comprises: a first buffer portion, which is mounted on the first pressing portion and is used for soft contact with the first workpiece; and / or The second buffer portion is installed on the second pressing portion and is used for soft contact with the second workpiece.

4. The carrying device according to claim 2, characterized in that: The driving member includes a cylinder body and a telescopic rod. The cylinder body is installed on the first side of the cover plate. The telescopic rod can be telescoped relative to the cylinder body. The telescopic rod is connected to any one of the first pressing part, the connecting part, and the second pressing part.

5. The carrying device according to claim 4, characterized in that: There are multiple driving members, and there are multiple pressing members. The multiple driving members correspond to the multiple pressing members respectively, and each driving member is connected to the corresponding pressing member.

6. The carrying device according to claim 5, characterized in that: The carrying device further includes: A linkage member, a plurality of the pressing members are connected to the linkage member, and the telescopic rod of each driving member passes through the corresponding pressing member and is connected to the linkage member.

7. The carrying device according to claim 5, characterized in that: The plurality of driving members are evenly distributed around the center of the cover plate; and / or The plurality of pressing members are evenly distributed around the center of the first cavity and / or the second cavity.

8. The carrying device according to claim 1, characterized in that: The cover plate comprises: ontology; a first extension arm, the first extension arm being disposed on a first side of the body and connected to the first bracket; and The second extension arm is arranged on the first side of the body and connected to the second bracket. The second extension arm is arranged around the first extension arm.

9. The carrying device according to claim 8, characterized in that: The first bracket includes: a hollow first support portion, wherein the first support portion is connected to the first extension arm; a second supporting portion, wherein the first cavity is defined in the second supporting portion, the second supporting portion is located within the first supporting portion, a gap between the second supporting portion and the first supporting portion corresponds to a third region of the first workpiece, the third region of the first workpiece surrounds the first region of the first workpiece, and is located between the first region of the first workpiece and the second region of the first workpiece; and A plurality of first receiving portions are arranged at intervals, wherein the first receiving portion is located between the first supporting portion and the second supporting portion and is used to connect the first supporting portion and the second supporting portion, and the second area of the first workpiece is supported by the first supporting portion and / or the first receiving portion.

10. The carrying device according to claim 9, characterized in that: The first receiving portion is provided with a first air groove and a first air path. The first air path is communicated with the first air groove and is used for pumping air to adsorb the third area of the first workpiece onto the first receiving portion.

11. The carrying device according to claim 9, characterized in that: The first receiving portion is provided with a first boss, and the first boss cooperates with the second area of the first workpiece to position the first workpiece.

12. The carrying device according to claim 9, characterized in that: The second bracket includes: a hollow first bearing portion, wherein the first bearing portion is connected to the second extension arm; a second bearing portion, wherein the second bearing portion defines the second cavity, the second bearing portion is located within the first bearing portion, a gap between the second bearing portion and the first bearing portion corresponds to the third region of the second workpiece, the third region of the second workpiece surrounds the first region of the second workpiece, and is located between the first region of the second workpiece and the second region of the second workpiece; and A plurality of second receiving parts are arranged at intervals, wherein the second receiving parts are located between the first bearing part and the second bearing part and are used to connect the first bearing part and the second bearing part, and the second area of the second workpiece is supported by the first bearing part and / or the second receiving part.

13. The carrying device according to claim 12, characterized in that: The second receiving portion is provided with a second air groove and a second air path. The second air path is communicated with the second air groove and is used for pumping air to adsorb the third area of the second workpiece onto the second receiving portion.

14. The carrying device according to claim 12, characterized in that: The second receiving portion is provided with a second boss, and the second boss cooperates with the second area of the second workpiece to position the second workpiece.

15. The carrying device according to claim 12, characterized in that: The first supporting portion is in the shape of a closed ring, and the first bearing portion is in the shape of a closed ring; or The first supporting portion is provided with a first notch, and the first bearing portion is provided with a second notch, and the first notch corresponds to the second notch.

16. The carrying device according to claim 12, characterized in that: Also includes: The rotating platform is connected to the second side of the cover plate and can rotate to drive the cover plate, the first bracket, the second bracket, the driving member, and the pressing member to rotate synchronously.

17. A semiconductor processing device, characterized in that: include: First abutment; The carrying device according to any one of claims 1 to 16, wherein the carrying device is mounted on the first base and is capable of rotating relative to the first base and moving relative to the first base in a first direction; a second base, the first base being mounted on the second base and capable of moving relative to the second base in a second direction to drive the carrying device to move along the second direction, the second direction being different from the first direction; and A processing device is spaced apart from the carrying device and is located on the first side of the cover plate. The processing device is used to process the area to be processed of the first workpiece and / or the area to be processed of the second workpiece on the carrying device.

18. The semiconductor processing equipment according to claim 17, wherein: Also includes: A third base, the processing device is mounted on the third base and is movable relative to the third base along a third direction, wherein the third direction, the first direction, and the second direction are all different.

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