Modules and apparatuses
By employing a double-layer wiring board structure and connecting components in the image capture device, the problems of thermal noise and induced noise are solved, resulting in a more stable power supply and higher image quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CANON KK
- Filing Date
- 2021-11-16
- Publication Date
- 2026-06-09
AI Technical Summary
Existing technologies struggle to effectively reduce or prevent the effects of heat on image sensors, leading to increased noise and impacting the performance of image capture devices.
The system employs a double-layer wiring board structure, with integrated circuit components overlapping the wiring board and electrically connected through connecting components. This reduces heat conduction and optimizes the power supply path, forming a closed-loop control system to reduce induced noise.
It effectively reduces noise, improves the operational stability of integrated circuit components, especially the performance of analog circuit image capture and display devices, and reduces the impact of thermal noise on image quality.
Smart Images
Figure CN114520242B_ABST
Abstract
Claims
1. A module comprising: First wiring board; A first integrated circuit assembly is mounted on the first wiring board; The second wiring board overlaps with the first wiring board, and the second wiring board is a rigid wiring board. A second integrated circuit assembly is mounted on the second wiring board; Electronic components, the electronic components being mounted on the second wiring board; as well as A connecting member is disposed between the first wiring board and the second wiring board and is configured to electrically connect the first wiring board and the second wiring board. The electronic components are soldered to the second wiring board, and the connecting members are soldered to both the first and second wiring boards. An air gap is positioned between the first wiring board and the second wiring board, and Wherein, the second integrated circuit component overlaps with the first wiring board, and The second integrated circuit component supplies power to the first integrated circuit component via the connecting member.
2. The module according to claim 1, wherein, The second integrated circuit component overlaps with the first integrated circuit component.
3. The module according to claim 1, wherein, The connection component includes a first wiring and a second wiring, the first wiring being configured to supply a power potential from the second integrated circuit component to the first integrated circuit component, and the second wiring being configured to supply a ground potential from the second integrated circuit component to the first integrated circuit component.
4. The module according to claim 3, wherein, In the plan view of the first integrated circuit assembly along the direction in which the first wiring board and the second wiring board overlap, the distance between the first wiring board and the second wiring board is less than the size of the external shape of the first integrated circuit assembly.
5. The module according to claim 4, wherein, The distance is less than or equal to 1 / 10 of the dimension.
6. The module according to claim 3, wherein, The distance between the first wiring and the second wiring is less than the distance between the first wiring board and the second wiring board.
7. The module according to claim 1, wherein, The distance between the first wiring board and the second wiring board is greater than 500 μm and less than 5 mm, and an air gap is inserted between the second integrated circuit component and the first wiring board.
8. The module according to claim 1, wherein, The second integrated circuit component is deployed between the first wiring board and the second wiring board.
9. The module according to claim 1, wherein, The second wiring board is deployed between the second integrated circuit component and the first wiring board.
10. The module according to claim 1, wherein, When power is supplied, the temperature of the first integrated circuit component is higher than that of the second integrated circuit component.
11. The module according to claim 1, wherein, The first integrated circuit component includes analog circuitry, and the second integrated circuit component is a device including a linear regulator or a DC-DC converter, and / or the second integrated circuit component is a power integrated circuit or a power management IC.
12. The module according to claim 1, wherein, The first integrated circuit component is one of an image capture device and a display device.
13. The module according to claim 1, in, The first integrated circuit component is connected to the first wiring board by bonding wiring. The second integrated circuit component is connected to the second wiring board with solder. The connecting member is connected to the first wiring board with solder, and The connecting member is connected to the second wiring board with solder.
14. The module of claim 1, further comprising a third integrated circuit assembly mounted on the second wiring board.
15. The module according to claim 14, wherein, The third integrated circuit component is a storage device.
16. The module according to claim 14, wherein, The second integrated circuit component supplies power to the third integrated circuit component.
17. The module according to claim 1, wherein, The passive component is mounted on the second wiring board.
18. The module according to claim 1, wherein, The connecting member includes a portion made of glass epoxy resin.
19. The module according to claim 1, wherein, The connecting member includes a portion made of thermosetting resin.
20. The module according to any one of claims 1 to 19, in, The connecting member includes a conductor portion and an insulator portion configured to support the conductor portion. The conductor portion includes a first conductive portion, a second conductive portion, and a third conductive portion along a first direction in which the first wiring board and the second wiring board overlap each other, wherein the third conductive portion is disposed between the first conductive portion and the second conductive portion. Wherein, the first conductive portion is connected to the first wiring board via a first conductive member, and the second conductive portion is connected to the second wiring board via a second conductive member, and In a second direction perpendicular to the first direction, the first conductive portion is disposed between the first conductive member and the insulating portion, and the second conductive portion is disposed between the second conductive member and the insulating portion.
21. The module according to claim 20, further comprising: A separation portion, wherein the separation portion is disposed between the first conductive member and the second conductive member in the first direction. In the second direction, the third conductive portion is disposed between the separated portion and the insulator portion.
22. The module according to claim 21, wherein, Each of the first conductive member and the second conductive member is a solder corner, and the separated portion is solder resist.
23. An equipment comprising: The module according to any one of claims 1 to 22; Third wiring board; as well as A connection component configured to electrically connect the module and the third wiring board. The connecting component is flexible.
24. An equipment comprising: The module according to any one of claims 1 to 22; as well as Coil.
25. An apparatus comprising at least one of the following: The module according to any one of claims 1 to 22; Semiconductor devices manufactured using 1 nm to 4 nm processes; A communication device configured to perform communication using terahertz waves; and All-solid-state battery.