Substrate support assembly and substrate processing device

Abstract

A substrate support assembly of an embodiment of the present application includes: a susceptor plate including at least one substrate placement portion on which a substrate is placed, and formed with a plurality of gas flow lines for supplying a floating gas, a rotation gas, and a deceleration gas to the substrate placement portion; and at least one ring member disposed on the at least one substrate placement portion and on which the substrate is placed, and formed with a rotation pattern portion on a back surface for receiving a rotation force and a braking force from the rotation gas and the deceleration gas, wherein the at least one ring member is floated on the at least one substrate placement portion by the floating gas supplied from the at least one substrate placement portion, relatively rotated with respect to the susceptor plate by the rotation gas supplied in a forward rotation direction to make the substrate rotate, and braked by the deceleration gas supplied in a reverse rotation direction.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor apparatus for processing a substrate, and more particularly, to a substrate support assembly and a substrate processing apparatus. BACKGROUND

[0002] Generally, in order to manufacture a semiconductor element, a display element, or a solar cell, various processes are performed in a substrate processing apparatus including a process chamber in a vacuum environment. For example, a process of loading a substrate in the process chamber, depositing a thin film on the substrate, or etching a thin film can be performed. The substrate is supported by a substrate support assembly provided in the process chamber, and a process gas can be injected to the substrate through a gas injection portion provided opposite to the substrate support assembly.

[0003] In such a substrate processing apparatus, in order to uniformly process the substrate, it is necessary to process the substrate while rotating the substrate. The substrate is self-rotated during the substrate is exposed to the process gas, and thus uniform substrate processing can be sought. In order to self-rotate the substrate, a technique of rotating the substrate in a state of floating the substrate by a satellite is being applied. SUMMARY

[0004] PROBLEMS TO BE SOLVED

[0005] In the case of such a substrate support assembly, even if the rotation gas is interrupted, a considerable time is required until the substrate stops rotating. Accordingly, necessity of rapidly decelerating the self-rotation of the satellite is being focused.

[0006] The present application has been made to solve various problems including the above-mentioned problems, and aims to provide a substrate support assembly and a substrate processing apparatus capable of controlling the rotation and stop speed of a substrate. However, the problem is only an example, and the scope of the present application is not limited thereby.

[0007] MEANS FOR SOLVING PROBLEMS

[0008] A substrate support assembly of an embodiment of the present application includes: a susceptor plate including at least one substrate placement portion on which a substrate is placed, and formed with a plurality of gas flow lines for supplying a floating gas, a rotation gas, and a deceleration gas to the substrate placement portion; and at least one satellite disposed on the at least one substrate placement portion and on which the substrate is placed, and formed with a rotation pattern portion on a back surface thereof for receiving a rotation force and a braking force from the rotation gas and the deceleration gas. The at least one satellite is floated on the at least one substrate placement portion by the floating gas supplied from the at least one substrate placement portion, relatively rotated with respect to the susceptor plate by the rotation gas supplied in a forward rotation direction to self-rotate the substrate, and braked by the deceleration gas supplied in a reverse rotation direction.

[0009] According to the substrate support assembly, at least one gas distribution plate is combined with the at least one substrate placing portion, and the at least one gas distribution plate distributes the floating gas, the rotation gas, and the deceleration gas supplied from the at least one substrate placing portion to supply to the at least one surround. The at least one gas distribution plate can include a floating gas hole for supplying the floating gas, at least one rotation gas hole formed to be inclined in the forward rotation direction to supply the rotation gas, and at least one deceleration gas hole formed to be inclined in the reverse rotation direction to supply the deceleration gas.

[0010] According to the substrate support assembly, the at least one substrate placing portion includes a plurality of substrate placing portions arranged along a circumferential direction of the base plate. The plurality of gas flow lines can include a plurality of floating gas flow lines respectively connected to the plurality of substrate placing portions, a plurality of rotation gas flow lines respectively connected to the plurality of substrate placing portions, and a plurality of deceleration gas flow lines respectively connected to the plurality of substrate placing portions.

[0011] According to the substrate support assembly, a rotatable shaft can be included, the shaft being combined with the base plate to make the substrate revolve, and a plurality of gas supply lines are formed in the shaft to move the floating gas, the rotation gas, and the deceleration gas.

[0012] According to the substrate support assembly, the plurality of gas supply lines can include a first gas supply line commonly connected with the plurality of floating gas flow lines, a second gas supply line commonly connected with the plurality of deceleration gas flow lines, and a plurality of third gas supply lines respectively connected to the plurality of rotation gas flow lines.

[0013] According to the substrate support assembly, a power transmission pattern can be included in a back surface of the at least one surround, the power transmission pattern being formed along a rotation line to receive a rotation force and a braking force from the rotation gas and the deceleration gas.

[0014] According to the substrate support assembly, the power transmission pattern can include a plurality of grooves formed in an edge portion of the back surface of the at least one surround.

[0015] According to the substrate support assembly, in the base plate, a fixed position protrusion is formed in a center portion of the at least one substrate placing portion, and in the at least one surround, a protrusion groove portion can be formed below to insert at least a portion of the fixed position protrusion.

[0016] The substrate processing apparatus of another aspect of the present application includes a process chamber, the above-described substrate support assembly disposed in the process chamber, and a gas jet portion disposed in the process chamber, facing the substrate support assembly, and jetting a processing gas toward the substrate support assembly.

[0017] Effects of the Invention

[0018] According to the substrate support assembly and the substrate processing apparatus of one embodiment of the present application configured as described above, the rotational braking force of the substrate is increased, and thus productivity can be increased.

[0019] Of course, the scope of the present application is not limited to this effect. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a perspective view schematically showing a substrate support assembly of one embodiment of the present application.

[0021] Figure 2 is a perspective view schematically showing a substrate support assembly of another embodiment of the present application.

[0022] Figure 3 is a partial plan view showing a substrate placement portion of the substrate support assembly of Figure 2 .

[0023] Figure 4 is a partial cross-sectional view showing supply of rotational gas in the substrate placement portion of Figure 3 .

[0024] Figure 5 is a partial cross-sectional view showing supply of deceleration gas in the substrate placement portion of Figure 3 .

[0025] Figure 6 is a rear view showing a ring member of the substrate support assembly of one embodiment of the present application.

[0026] Figure 7 is a perspective view schematically showing a shaft of the substrate support assembly of one embodiment of the present application.

[0027] Figure 8 is a graph showing an action characteristic of the substrate support assembly of one embodiment of the present application.

[0028] Figure 9 is a cross-sectional view showing a substrate processing apparatus of one embodiment of the present application.

[0029] (Explanation of Reference Numerals)

[0030] 100, 100a: substrate support assembly

[0031] 110: base plate

[0032] 120: substrate placing portion

[0033] 130: ring member

[0034] 140: gas distribution plate

[0035] 160: shaft

[0036] 200: substrate processing apparatus

[0037] 210: process chamber

[0038] 220: gas jet portion DETAILED DESCRIPTION

[0039] Hereinafter, preferred various embodiments of the present application will be explained in detail with reference to the accompanying drawings.

[0040] Embodiments of the present application are provided in order to more completely explain the present application to those having ordinary knowledge in the art, and the following embodiments can be modified in various forms, and the scope of the present application is not limited to the following embodiments. Rather, the embodiments are provided in order to make the disclosure of the present application more complete and complete, and to completely convey the idea of the present application to those skilled in the art. In addition, for convenience and clarity of explanation, the thickness or size of each layer is exaggerated in the drawings.

[0041] Hereinafter, embodiments of the present application will be explained with reference to the accompanying drawings which schematically show ideal embodiments of the present application. For example, in the drawings, deformation of shape can be predicted according to manufacturing technology and / or tolerance. Thus, embodiments of the idea of the present application should not be interpreted as limited to a specific shape in the area shown in the specification, but should include shape changes such as those that occur in manufacturing.

[0042] Figure 1 is a perspective view schematically showing a substrate support assembly 100 of an embodiment of the present application.

[0043] Referring to Figure 1 , the substrate support assembly 100 can include a susceptor plate 110 and a ring member 130.

[0044] The susceptor plate 110 can include at least one substrate placing portion 120 in which a substrate S is placed. For example, the substrate placing portion 120 can be provided in a pocket slot shape on the susceptor plate 110. In order to process a plurality of substrates S at a time, a plurality of substrate placing portions 120 can be provided. For example, the plurality of substrate placing portions 120 can be formed on the susceptor plate 110 at a predetermined interval along a circumferential direction. More specifically, the substrate placing portions 120 are arranged radially with the rotational axis of the susceptor plate 110 as a center at equal angles.

[0045] A plurality of gas flow lines 112, 114, 116 connected to the substrate placing portions 120 can be formed in the base plate 110. For example, predetermined gases such as a floating gas for floating the substrate S, a rotation gas for rotating the substrate S, and / or a deceleration gas for decelerating or stopping the rotating substrate S can be supplied to the substrate placing portions 120 through the gas flow lines 112, 114, 116. The floating gas, the rotation gas, and the deceleration gas are separated from each other by the gas flow lines 112, 114, 116, and are supplied to the surrounding members 130 through the substrate placing portions 120.

[0046] For example, the gas flow lines 112, 114, 116 can include a plurality of floating gas flow lines 112, a plurality of rotation gas flow lines 114, and a plurality of deceleration gas flow lines 116. The floating gas flow lines 112 supply the floating gas to the substrate placing portions 120, the rotation gas flow lines 114 supply the rotation gas to the substrate placing portions 120, and the deceleration gas flow lines 116 can supply the deceleration gas to the substrate placing portions 120.

[0047] More specifically, the floating gas flow lines 112 are connected to the substrate placing portions 120, respectively, the rotation gas flow lines 114 are connected to the substrate placing portions 120, respectively, and the deceleration gas flow lines 116 can be connected to the substrate placing portions 120, respectively.

[0048] First injection holes 122 connected to the floating gas flow lines 112, second injection holes 124 connected to the rotation gas flow lines 114, and third injection holes 126 connected to the deceleration gas flow lines 116 can be formed in each of the substrate placing portions 120. For example, the first injection holes 122 can be formed to be elongated in a vertical direction at least for the substrate placing portions 120 to supply the floating gas upward in the vertical direction. Further, the second injection holes 124 are formed to be inclined to supply the rotation gas in a forward rotation direction, and the third injection holes 126 are formed to be inclined to supply the deceleration gas in a reverse rotation direction.

[0049] At least one surrounding member 130 can be disposed at the substrate placing portions 120. The substrate S can be placed on the upper surface of the surrounding member 130. For example, a plurality of surrounding members 130 can be disposed at the plurality of substrate placing portions 120, in which case the number of the surrounding members 130 can be the same as the number of the substrate placing portions 120.

[0050] The surrounding member 130 receives floating gas from the substrate placement section 120 and can float within the substrate placement section 120. Furthermore, the surrounding member 130 is rotated relative to the base plate 110 by rotating gas supplied from the substrate placement section 120 in the forward rotation direction, thereby causing the substrate S to rotate relative to the base plate 110. Since this rotation is relative to the base plate 110, it can be referred to as rotation. Even further, the surrounding member 130 can be braked by decelerating gas supplied from the substrate placement section 120 in the reverse rotation direction.

[0051] For example, the forward rotation direction is called the direction of rotation of the surrounding member 130; the reverse rotation direction can be called the opposite direction of the forward rotation direction, so as to decelerate the rotating surrounding member 130. More specifically, the forward rotation direction and the reverse rotation direction can be opposite directions to each other according to the circumferential tangent, depending on the position of the surrounding member 130.

[0052] In some embodiments, such as Figure 6 As shown, the surround 130 may include a power transmission pattern 134 below to easily receive rotational and braking forces from the supplied rotating and decelerating gases. For example, the power transmission pattern 134 may be formed using a plurality of grooves formed along the circumference at the edge portion of the back side of the surround 130. More specifically, the power transmission pattern 134 may be formed as a groove pattern with a symmetrical shape to receive rotational and braking forces from rotating and decelerating gases supplied from mutually different directions; for example, it may be formed as a circular curve pattern.

[0053] Furthermore, in the base plate 110, a fixed position protrusion 121 is formed at the center of the substrate placement portion 120; in the surrounding member 130, a protrusion groove (not shown) can be formed on the underside to insert at least a portion of the fixed position protrusion 121. Accordingly, the position of the surrounding member 130 can be guided by the fixed position protrusion 121, and the surrounding member 130 can perform stable rotational movement.

[0054] Additionally, shaft 160 may be coupled to base plate 110. Shaft 160 allows base plate S to rotate in a revolution manner. For example, shaft 160 may be coupled to a drive device (not shown), by which shaft 160 can be rotated or moved up and down. By rotating or moving shaft 160 up and down, base plate 110 can also rotate or move up and down accordingly.

[0055] The structure of shaft 160 will be described in more detail below.

[0056] Figure 7 This is a perspective view schematically illustrating the axis 160 of the substrate support assembly according to an embodiment of the present invention.

[0057] Reference Figure 1 and Figure 7A plurality of gas supply lines 162, 164, 166 for moving floating gas, rotating gas, and deceleration gas can be formed in the shaft 160. For example, the gas supply lines 162, 164, 166 can include first gas supply lines 162 commonly connected with the floating gas flow line 112, second gas supply lines 166 commonly connected with the deceleration gas flow line 116, and a plurality of third gas supply lines 164 commonly connected with the rotating gas flow line 114.

[0058] More specifically, the first gas supply lines 162 can be formed to pass through from the lower surface of the shaft 160 to the upper surface of the shaft 160, and can be commonly connected with the floating gas flow line 112. The second gas supply lines 166 can be formed to pass through from the lower surface of the shaft 160 to the upper surface of the shaft 160, and can be commonly connected with the deceleration gas flow line 116. The third gas supply lines 164 can be formed to pass through from the sidewall of the shaft 160 to the upper surface of the shaft 160, and can be commonly connected with the rotating gas flow line 114.

[0059] For example, the first gas supply lines 162 for supplying floating gas and the second gas supply lines 166 for supplying deceleration gas can be commonly connected with the plurality of substrate placing portions 120 by one line, respectively, so as to be moved along the axis of the shaft 160 by one line.

[0060] The third gas supply lines 164 for supplying rotating gas can be commonly connected with the substrate placing portions 120, respectively, and the number of the third gas supply lines 164 can be the same as the number of the substrate placing portions 120. Accordingly, the third gas supply lines 164 can be formed to extend from different positions in the sidewall of the shaft 160 to the upper surface of the shaft 160.

[0061] More specifically, a plurality of annular groove portions 163 can be formed in the sidewall of the shaft 160, and the third gas supply lines 164 can extend from the annular groove portions 163 to the upper surface of the shaft 160. Rotating gas is supplied to the annular groove portions 163, and can be supplied to the rotating gas flow line 114 through the third gas supply lines 164. The annular groove portions 163 can be sealed by a magnetic fluid, so that the rotating gas can be supplied to the third gas supply lines 164 while maintaining the seal even when the shaft 160 rotates.

[0062] On the other hand, in an example of a modification of the embodiment, a plurality of first gas supply lines 162 for supplying floating gas or second gas supply lines 166 for supplying deceleration gas can be formed to be commonly connected with the substrate placing portions 120, respectively.

[0063] On the other hand, in an example of another modification of the embodiment, the third gas supply lines 164 can be formed to pass through from the lower surface of the shaft 160 to the upper surface of the shaft 160.

[0064] Figure 2 FIG. 1 is a perspective view schematically showing a substrate support assembly 100 according to an embodiment of the present application; Figure 3 is a perspective view schematically showing a substrate support assembly 100a according to another embodiment of the present application;Figure 2 FIG. 6 is a partial plan view of a substrate placing portion 120 of a substrate support assembly 100a according to an embodiment of the present application; Figure 4 Figure 3 FIG. 7 is a partial cross-sectional view illustrating a supply of a rotation gas in the substrate placing portion 120 of the substrate support assembly 100a according to the embodiment of the present application; Figure 5 Figure 3 FIG. 8 is a partial cross-sectional view illustrating a supply of a deceleration gas in the substrate placing portion 120 of the substrate support assembly 100a according to the embodiment of the present application. The substrate support assembly 100a of the embodiment is a substrate support assembly 100 to which a portion of a structure is added or modified to the substrate support assembly 100 of FIG. 6. Figure 1 The substrate support assembly 100 of FIG. 6 and the substrate support assembly 100a of FIG. 8 can be referred to each other and repeated explanations are omitted in the embodiment.

[0065] Referring to FIG. 6, Figures 2 to 5 The substrate support assembly 100a can include at least one gas distribution plate 140. The gas distribution plate 140 can distribute a float gas, a rotation gas, and a deceleration gas to be supplied to the surround 130. For example, the gas distribution plate 140 can be coupled to the substrate placing portion 120 or can be fastened to the substrate placing portion 120 by a fixing means such as a screw. More specifically, a plurality of gas distribution plates 140 can be respectively coupled to the substrate placing portion 120.

[0066] Further, the gas distribution plate 140 can be disposed between the substrate placing portion 120 and the surround 130. For example, the gas distribution plate 140 is fixed to the substrate placing portion 120, and the surround 130 can be mounted on the gas distribution plate 140.

[0067] The gas distribution plate 140 can include at least one float gas hole 142 for supplying the float gas, at least one rotation gas hole 144 inclined in a forward rotation direction for supplying the rotation gas, and at least one deceleration gas hole 146 inclined in a reverse rotation direction for supplying the deceleration gas. A plurality of float gas holes 142 can be disposed in a circumferential direction of the surround 130 to balance the float of the surround 130. The rotation gas hole 144 and the deceleration gas hole 146 can be formed in one or a plurality of numbers.

[0068] The rotation gas is supplied in a direction to accelerate the surround 130, and the deceleration gas is supplied in a direction to decelerate the surround 130. The rotation gas colliding with one side of the power transmission pattern 134 at the back of the surround 130 can rotate the surround 130 in a direction of one side, and the deceleration gas colliding with the other side of the power transmission pattern 134 at the back of the surround 130 can decelerate the surround 130. In Figure 4 In FIG. 7, an arrow (AG) can mean a direction in which the rotation gas is injected. Figure 5 In FIG. 8, an arrow (DG) can mean a direction in which the deceleration gas is injected.

[0069] ​​A distribution flow path for distributing the lifting gas, the acceleration gas, and the deceleration gas can be formed on the back surface of the gas distribution plate 140. One end of the distribution flow path is connected to the gas flow lines 112, 114, 116 of the substrate placing portion 120 to receive supply of the lifting gas, the acceleration gas, and the deceleration gas, and the other end is connected to the lifting gas hole 142, the acceleration gas hole 144, and the deceleration gas hole 146, respectively, to be able to jet the lifting gas, the acceleration gas, and the deceleration gas in the direction of the ring 130.

[0070] According to the substrate support assembly 100a, the direction is formed at the same time as the lifting gas hole 142, the acceleration gas hole 144, and the deceleration gas hole 146 are formed in the gas distribution plate 140, so the structure of the gas flow lines 112, 114, 116 in the base plate 110 can be simplified.

[0071] Figure 8 is a graph showing the operation characteristics of the substrate support assembly 100, 100a according to an embodiment of the present application.

[0072] Referring to Figure 8 It can be known that if the acceleration gas is supplied after the lifting gas is supplied (acceleration gas on), the ring 130 is accelerated and saturated in the rotational speed, and if the acceleration gas is stopped and the deceleration gas is supplied (deceleration gas on) after the process is finished, the ring 130 can be decelerated and stopped in a short time. Generally, in the case where there is no deceleration gas, it takes more than 200 seconds to stop the ring 130, but in the case where the deceleration gas is supplied as described above, the stopping can be achieved in less than 100 seconds.

[0073] Thus, in the case of the substrate support assembly 100, 100a according to an embodiment of the present application, rapid stopping can be achieved, and the process time can be shortened, so the productivity of the substrate processing can be improved. Further, the deceleration gas can be used for the purpose of reducing the rotational speed of the ring 130 and the substrate S to a normal speed in the case where the rotational speed is very fast.

[0074] Further, in the case of the substrate support assembly 100, 100a, the ring 130 is decelerated by the separate deceleration gas, so the lifting gas is used only for the purpose of lifting the ring 130, and thus the ring 130 and the substrate S can be stably maintained in the floating step in the process, compared to the case where the lifting gas is used for deceleration, so the shaking phenomenon and the like can be reduced.

[0075] Figure 9 is a cross-sectional view showing a substrate processing apparatus 200 according to an embodiment of the present application.

[0076] Referring to Figure 9 , the substrate processing apparatus 200 can include a process chamber 210, a substrate support assembly 100a, and a gas injection portion 220.

[0077] The process chamber 210 can confine a processing space for processing the substrate S inside. For example, the process chamber 210 is configured to maintain airtightness, and can be connected to a vacuum pump (not shown) through at least one exhaust port 212 to discharge process gas in the processing space and adjust a vacuum degree in the processing space.

[0078] The process chamber 210 can be provided in various shapes, for example, can include a sidewall portion defining the processing space and a cover portion at an upper end of the sidewall portion. Further, the process chamber 210 can include a switchable gate (not shown) at the sidewall portion to move the substrate S.

[0079] The substrate support assembly 100a can be provided to be lifted and / or rotated in the process chamber 210. For example, the substrate support assembly 100a can be coupled to the process chamber 210 using a bellows structure (not shown) to maintain airtightness of the process chamber 210 when the shaft 160 is lifted and / or rotated.

[0080] The gas injection portion 220 can be provided in the process chamber 210 to supply process gas supplied from the outside of the process chamber 210 to the processing space in the process chamber 210. For example, the gas injection portion 220 is provided in the process chamber 210 to face the substrate support assembly 100a, and thus can inject process gas toward the substrate support assembly 100a. More specifically, the gas injection portion 220 can be provided in the upper portion of the process chamber 210 to face the susceptor plate 110 to inject process gas to the substrate S placed on the substrate support assembly 100a.

[0081] The gas injection portion 220 can include at least one inlet hole formed in an upper side or a side portion to receive process gas from the outside, and a plurality of injection holes formed to face downward of the substrate S to inject process gas to the substrate S. For example, the gas injection portion 220 can be various types such as a shower head type, a nozzle type, etc.

[0082] In an example of a variation of the embodiment, the substrate support assembly 100a in the substrate processing apparatus 200 can be replaced with the substrate support assembly 100 of Figure 1 .

[0083] The substrate processing apparatus 200 can be used as a thin film deposition apparatus that forms a thin film on the substrate S. For example, the substrate processing apparatus 200 can be used in a thin film deposition apparatus that uses chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0084] The application is illustrated by reference to the embodiments shown in the drawings, but this is merely exemplary, and as long as a person with ordinary knowledge in the art should understand that various modifications and equivalent other embodiments can be realized therefrom. Thus, the true technical scope of the application should be defined by the technical idea within the scope of the claims.

Claims

1. A substrate support assembly comprising: a susceptor plate including at least one substrate placing portion on which a substrate is placed, and formed with a plurality of gas flow lines for supplying a floating gas, a rotation gas, and a deceleration gas to the substrate placing portion; at least one ring member disposed on the at least one substrate placing portion and on which the substrate is placed, and formed with a power transmission pattern on a back surface thereof for receiving a rotation force and a braking force from the rotation gas and the deceleration gas; wherein the at least one ring member is floated by the floating gas supplied from the at least one substrate placing portion, relatively rotated with respect to the susceptor plate by the rotation gas supplied in a forward rotation direction to make the substrate rotate, and braked by the deceleration gas supplied in a reverse rotation direction, the power transmission pattern includes a plurality of grooves having a symmetrical shape formed in an edge portion of the back surface of the at least one ring member, the plurality of grooves each include one side for receiving the rotation force transmitted from the rotation gas and an opposite side for receiving the braking force transmitted from the deceleration gas, at least one gas distribution plate is combined on the at least one substrate placing portion, the at least one gas distribution plate distributing the floating gas, the rotation gas, and the deceleration gas supplied from the at least one substrate placing portion to be supplied to the at least one ring member; the at least one gas distribution plate includes floating gas holes for supplying the floating gas, at least one rotation gas hole formed inclined in the forward rotation direction for supplying the rotation gas, and at least one deceleration gas hole formed inclined in the reverse rotation direction for supplying the deceleration gas.

2. The substrate support assembly according to claim 1, wherein the at least one substrate placing portion includes a plurality of substrate placing portions disposed along a circumferential direction of the susceptor plate; the plurality of gas flow lines includes a plurality of floating gas flow lines connected to the plurality of substrate placing portions, respectively, a plurality of rotation gas flow lines connected to the plurality of substrate placing portions, respectively, and a plurality of deceleration gas flow lines connected to the plurality of substrate placing portions, respectively.

3. The substrate support assembly according to claim 2, wherein the substrate support assembly includes a rotatable shaft combined to the susceptor plate to make the substrate revolve; the shaft is formed with a plurality of gas supply lines to move the floating gas, the rotation gas, and the deceleration gas.

4. The substrate support assembly according to claim 3, wherein the plurality of gas supply lines includes a first gas supply line commonly connected to the plurality of floating gas flow lines, a second gas supply line commonly connected to the plurality of deceleration gas flow lines, and a plurality of third gas supply lines connected to the plurality of rotation gas flow lines, respectively.

5. The substrate support assembly according to claim 1, wherein a fixing position protrusion is formed in the susceptor plate at a center portion of the at least one substrate placing portion. In the at least one surround, a raised groove portion is formed underneath to insert at least a portion of the raised fixed position.

6. A substrate processing apparatus comprising: a process chamber; a substrate support assembly according to any one of claims 1 to 5 disposed in the process chamber; and a gas jet disposed in the process chamber facing and jetting a process gas towards the substrate support assembly.

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