Housing, Electronic Device and Method for Manufacturing the Housing

Abstract

The present application discloses a housing, which includes a base body, a transition layer and an appearance layer. The base body includes a gap, and an insulator is filled in the gap. Both the transition layer and the appearance layer are insulating, and are sequentially laminated on an outer surface of the base body, covering both the base body and the insulator at the same time. There is no color difference on the first surface of the transition layer facing away from the base body and the insulator. The appearance layer is attached to the side of the transition layer facing away from the base body, and is used to achieve at least one appearance effect such as color, texture or high gloss of the housing. The housing of the present application enables the appearance layer to achieve a unified appearance effect on the color-difference-free transition layer by means of the shielding of the color difference between the base body and the insulator by the transition layer. The present application also relates to a method for manufacturing the housing and an electronic device including the housing.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and in particular, to a housing, an electronic device including the housing, and a method for manufacturing the housing. Background Art

[0002] Currently, the outer shells of terminal products are mostly made of metal materials to enhance the texture and reliability of the terminal products. At the same time, in order to eliminate the shielding effect of metal materials on signals, gaps allowing signals to pass through are also opened on the outer shell, and plastic materials are filled in the gaps. There is usually a color difference between the plastic materials and the metal materials in the surrounding areas, and it is difficult to eliminate the color difference, resulting in the destruction of the overall appearance of the terminal products. Summary of the Invention

[0003] The purpose of this application is to provide a housing, an electronic device including the housing, and a method for manufacturing the housing. By means of the layer structure provided on the housing, the color difference caused by the gap is shielded, and the consistency of the appearance surface of the housing is improved. The electronic device of this application thus obtains a relatively high-consistency appearance effect.

[0004] In a first aspect, this application relates to a housing, including: a substrate, and a transition layer and an appearance layer stacked on the outer surface of the substrate. The substrate includes a gap filled with an insulator; the transition layer is located between the outer surface of the substrate and the appearance layer, the transition layer covers the substrate and the insulator, and the first surface of the transition layer facing away from the substrate has no color difference; the appearance layer is used to achieve at least one of the appearance effects of the color, texture, or high gloss of the housing; both the transition layer and the appearance layer are insulated.

[0005] In this application, by opening a gap in the substrate, the substrate is at least divided into two parts by the gap. The insulator filled in the gap can ensure that signals pass through the housing via the gap to eliminate the signal shielding defect caused by the overall conductivity when the housing is made of a metal material. The housing of this application also eliminates the color difference between the insulator and the substrate through the transition layer stacked and covering the outer surface of the substrate, and finally makes the appearance layer on the first surface of the transition layer without color difference, so as to achieve the appearance effects such as the color, texture, or high gloss of the housing, and make the appearance effects have consistency and integrity. In this way, while providing the overall appearance effect, the housing of this application also has the communication ability.

[0006] In a possible embodiment, the outer surface of the substrate has a porous structure.

[0007] In this embodiment, by forming a porous structure on the outer surface of the substrate, the substrate and the transition layer made on the outer surface can form an interlocking shape, thereby enhancing the adhesion between the transition layer and the substrate.

[0008] A possible embodiment is that the porosity P of the porous structure satisfies the condition: 10% ≤ P ≤ 60%.

[0009] In this embodiment, by setting the porosity of the porous structure, the reliability of the interlocking form between the transition layer and the substrate can be ensured, thereby ensuring the adhesion between the transition layer and the substrate.

[0010] A possible embodiment is that the thickness h1 of the porous structure satisfies the condition: 0.2 μm ≤ h1 ≤ 12 μm.

[0011] In this embodiment, by limiting the thickness of the porous structure, the adhesion between the transition layer and the substrate can be improved, further ensuring the reliable adhesion of the transition layer on the substrate.

[0012] A possible embodiment is that the transition layer includes at least two stacked masking film layers, the thickness h2 of each masking film layer satisfies the condition: 5 μm ≤ h2 ≤ 20 μm, and the total thickness h3 of the transition layer satisfies the condition: 10 μm ≤ h3 ≤ 95 μm.

[0013] In this embodiment, by limiting the overall thickness of the transition layer, the effect of eliminating the color difference between the substrate and the insulator can be ensured. Under the masking of the transition layer, the color difference value between the substrate and the insulator can be controlled within the range of ΔE ≤ 2.0, ensuring that the appearance effect of the appearance layer will not be affected. And using the structure of stacking multiple masking film layers to form the transition layer is beneficial to controlling the thickness and flatness of each masking film layer, thereby ensuring the overall thickness and flatness of the transition layer.

[0014] A possible embodiment is that the height difference h0 of the first surface satisfies the condition: h0 ≤ 0.05 mm.

[0015] In this embodiment, by controlling the height difference of the first surface of the transition layer, a relatively flat surface of the transition layer can be provided for the appearance layer, which is beneficial for the appearance layer to achieve the preset appearance effect.

[0016] A possible embodiment is that the housing further includes an adhesive layer, the adhesive layer is disposed between the appearance layer and the transition layer, and the appearance layer is adhesively fixed to the transition layer through the adhesive layer.

[0017] In this embodiment, by adhesively fixing the transition layer and the appearance layer through the adhesive layer, the reliable fitting between the transition layer and the appearance layer can be ensured.

[0018] A possible embodiment is that the appearance layer includes a color film layer and / or an effect film layer, the color film layer is used to achieve the color effect of the housing, and the effect film layer is used to achieve the texture and / or high-gloss effect of the housing.

[0019] In this embodiment, based on the differences in the formation methods of color effects and texture and highlight effects, the color film layer and the texture and highlight effects of the appearance layer are respectively achieved using a color film layer and an effect film layer, thereby ensuring the appearance quality of the appearance layer.

[0020] In a possible embodiment, the appearance layer includes a stacked color film layer and an effect film layer, and the color film layer is located between the transition layer and the effect film layer, the color film layer is used to achieve the color effect of the shell, and the effect film layer is used to achieve the texture and / or highlight effect of the shell.

[0021] In this embodiment, the appearance layer includes both a color film layer and an effect film layer, and the color film layer is disposed between the transition layer and the effect film layer to ensure that the appearance layer provides a texture and highlight corresponding to the color on the basis of providing a preset color background, thereby improving the appearance performance of the appearance layer.

[0022] In a possible embodiment, the shell is further provided with a reinforcement layer, which is located on the side of the substrate away from the outer surface, completely covers the gap, and contacts with parts of the substrate located on both sides of the gap, respectively, and is used to connect and reinforce the substrate.

[0023] In this embodiment, the substrate is divided into at least two parts by the gap, and the rigidity of the substrate itself is damaged. By providing a reinforcement layer on the side of the substrate away from the outer surface, the rigidity of the substrate can be improved, and the reinforcement layer will not affect the appearance of the shell.

[0024] In a second aspect, the present application provides an electronic device, including an antenna assembly and the above-mentioned shell, wherein the antenna assembly is accommodated in the shell, and the antenna assembly is arranged at a position corresponding to a gap in the shell.

[0025] In the second aspect of the present application, the electronic device adopts the above-mentioned shell, so that the appearance of the electronic device has integrity and consistency, and the texture of the electronic device is improved. At the same time, the gap opened on the shell also allows the internal and external signals of the electronic device to pass through, and the antenna component arranged at the corresponding gap position thereby realizes the communication function of the electronic device.

[0026] In a possible embodiment, the shell includes a back cover and a frame, and the gap is opened on the back cover and / or the frame.

[0027] In this embodiment, the shell of the electronic device includes a back cover and a frame, and the gap can be set on the back cover, or on the frame, or on the shell and the frame at the same time, which can maintain the consistency of the overall appearance of the shell and will not affect its appearance due to the opening of the gap.

[0028] In a possible embodiment, the shell is provided with a micro-slit area, and there are a plurality of slits, and the plurality of slits are arranged at intervals within a range of the substrate corresponding to the micro-slit area.

[0029] In this embodiment, the gaps on the substrate are concentrated and correspondingly arranged in the micro-gap region, which can reduce the area of color difference between the insulator filled in the gaps and the substrate, facilitating the transition layer to cover the color difference. At the same time, the concentrated arrangement of multiple gaps can also ensure that signals pass through the housing smoothly.

[0030] In a third aspect, the present application provides a method for manufacturing a housing, including the following steps:

[0031] Manufacture gaps on the substrate to divide the substrate into at least two parts;

[0032] Fill the gaps with an insulator;

[0033] Manufacture an insulating transition layer on the outer surface of the substrate. The transition layer covers both the substrate and the insulator at the same time, and the first surface of the transition layer facing away from the substrate has no color difference;

[0034] Manufacture an insulating appearance layer on the side of the transition layer facing away from the substrate to achieve at least one of the appearance effects of the color, texture, or high gloss of the housing.

[0035] In the method for manufacturing the housing according to the third aspect of the present application, by manufacturing gaps on the substrate and filling them with an insulator, and then sequentially manufacturing a transition layer for eliminating color difference and an appearance layer for achieving the appearance effect on the outer surface of the substrate, the housing according to the first aspect of the present application can be obtained. The method for manufacturing the housing of the present application can also improve the appearance consistency of the housing and ensure that the housing allows wireless signals to pass through.

[0036] In a possible embodiment, before manufacturing the insulating transition layer on the outer surface of the substrate, it further includes:

[0037] Roughen the side of the substrate corresponding to the manufacturing of the transition layer to form a porous structure on the substrate.

[0038] In this embodiment, by roughening the side of the substrate corresponding to the manufacturing of the transition layer, a porous structure can be formed on the side of the substrate corresponding to the manufacturing of the transition layer, thereby enabling the substrate to form a reliable adhesion to the transition layer.

[0039] In a possible embodiment, before roughening the side of the substrate corresponding to the manufacturing of the transition layer, it further includes:

[0040] Grind the side of the substrate corresponding to the manufacturing of the transition layer to be flat.

[0041] In this embodiment, before roughening the side of the substrate corresponding to the manufacturing of the transition layer, grinding this surface can eliminate the burr phenomenon formed by the insulator filled in the gaps and ensure the effect of the roughening treatment.

[0042] In a possible embodiment, manufacturing the insulating transition layer on the outer surface of the substrate includes:

[0043] Fabricate a first masking film layer on the outer surface of the substrate;

[0044] Fabricate a second masking film layer on the side of the first masking film layer away from the substrate. The first masking film layer and the second masking film layer together form a transition layer.

[0045] In this embodiment, the transition layer is formed by laminating the first masking film layer and the second masking film layer, which is beneficial to increasing the overall thickness of the transition layer, thereby better eliminating the color difference between the substrate and the insulator. At the same time, the setting of the multi-layer masking film layer is also beneficial to controlling the overall flatness of the transition layer.

[0046] A possible embodiment, fabricating a first masking film layer on the outer surface of the substrate, includes:

[0047] Fabricate a base material for the first masking film layer on the outer surface of the substrate;

[0048] Perform supplementary coating and polishing on the base material of the first masking film layer to form the first masking film layer.

[0049] In this embodiment, after fabricating the base material of the first masking film layer, perform supplementary coating and polishing on the base material of the first masking film layer to form a first masking film layer with a flat surface, which can improve the flatness of the first masking film layer, and thus the second shielding film layer laminated on the first masking film layer can also have a high flatness effect.

[0050] A possible embodiment, before fabricating an insulating appearance layer on the side of the transition layer away from the substrate, further includes:

[0051] Fabricate an adhesive layer on the side of the transition layer away from the substrate.

[0052] In this embodiment, reliable connection and fixation between the transition layer and the appearance layer can be achieved by fabricating the adhesive layer.

[0053] A possible embodiment, fabricating an insulating appearance layer on the side of the transition layer away from the substrate, includes:

[0054] Fabricate a color film layer and / or an effect film layer on the transition layer, where the color film layer is used to achieve the color effect of the housing, and the effect film layer is used to achieve the texture and / or high-gloss effect of the housing.

[0055] In this embodiment, based on the difference in the formation methods of the color effect and the texture and high-gloss effect, using the color film layer and the effect film layer to respectively achieve the color effect and the texture and high-gloss effect of the appearance layer can ensure the appearance quality of the appearance layer.

[0056] A possible embodiment, fabricating a color film layer and an effect film layer on the transition layer, includes:

[0057] Fabricate a color film layer on the transition layer;

[0058] The effect film layer is fabricated on the color film layer.

[0059] In this embodiment, by fabricating the color film layer first and then the effect film layer, and disposing the color film layer between the transition layer and the effect film layer, it can be ensured that on the basis of providing a preset color background for the appearance layer, the texture and highlight corresponding to the color are further provided, thereby enhancing the appearance performance of the appearance layer.

[0060] In a possible embodiment, after making a gap in the substrate, it further includes:

[0061] A reinforcement layer is fabricated on the side of the substrate facing away from the outer surface. The reinforcement layer completely covers the gap, and the reinforcement layer also contacts the parts of the substrate on both sides of the gap respectively.

[0062] In this embodiment, by fabricating the reinforcement layer, the rigidity and strength of the substrate can be enhanced, ensuring that the substrate with the gap maintains sufficient structural stability and avoiding the possible influence on the structures of each layer caused by the deformation of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 is a schematic diagram of the appearance of an electronic device provided by an embodiment of the present application;

[0064] Figure 2 is Figure 1 a schematic diagram of the appearance of the electronic device shown in another viewing direction;

[0065] Figure 3 is Figure 1 a schematic exploded view of the housing in the electronic device shown;

[0066] Figure 4 is Figure 1 a schematic diagram of another embodiment of the housing in the electronic device shown;

[0067] Figure 5 is Figure 3 a schematic exploded view of the rear cover in the housing shown;

[0068] Figure 6 is Figure 5 a schematic partial cross-sectional view of the rear cover shown;

[0069] Figure 7 and Figure 8 are respectively Figure 5 schematic partial cross-sectional views in two other embodiments of the rear cover shown;

[0070] Figure 9 is a flowchart of the method for fabricating the housing of the present application;

[0071] Figures 9a - 9e is Figure 9Schematic diagrams of the structures of the respective steps in the method for manufacturing the housing shown;

[0072] Figure 10 Flowcharts of some other embodiments of the method for manufacturing the housing of the present application;

[0073] Figures 10a - 10c is Figure 10 Schematic diagrams of the structures of two steps in some other methods for manufacturing the housing shown;

[0074] Figure 11 is Figure 9 Sub-step flowchart of step S30 in the method for manufacturing the housing shown;

[0075] Figure 11a and Figure 11b is Figure 11 Schematic diagram of the structure of sub-step S30 in the method for manufacturing the housing shown;

[0076] Figure 12 is Figure 11 Sub-step flowchart of step S31 in the method for manufacturing the housing shown;

[0077] Figure 13 is Figure 9 Sub-step flowchart of step S40 in the method for manufacturing the housing shown;

[0078] Figure 13a and Figure 13b is Figure 13 Schematic diagram of the structure of sub-step S40 in the method for manufacturing the housing shown;

[0079] Figure 14 and Figure 15 Specific manufacturing step flows of two different methods for manufacturing the housing of the present application. Detailed implementation manners

[0080] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application.

[0081] As used in the present application, "connection" includes both direct and indirect connections unless otherwise specified. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "top", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0082] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above" and "over" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0083] Please refer to Figure 1 and Figure 2 the electronic device 200 provided by this application shown in the figure. The electronic device 200 may be in a flat structure and includes a display screen 210 and a housing 220 that are fixedly connected. The housing 220 may include a frame 221 and a rear cover 222 that are fixedly connected. The display screen 210 and the rear cover 222 are respectively arranged on opposite sides of the frame 221. The display screen 210 is fixedly connected to the housing 220 by being fixedly connected to the frame 221. The display screen 210 and the housing 220 form the external structure of the electronic device 200 and enclose the internal space of the electronic device 200. The remaining components of the electronic device 200 are accommodated in this internal space to implement various functions of the electronic device 200.

[0084] The interior of the electronic device 200 includes an antenna assembly 230. The antenna assembly 230 receives or transmits wireless signals through the housing 220 to implement the wireless communication function of the electronic device 200. The housing 220 is provided with a micro-slit area 223. The micro-slit area 223 can allow wireless signals to pass through. The antenna assembly 230 can be arranged corresponding to the position of the micro-slit area 223 so as to facilitate the antenna assembly 230 to pass through the micro-slit area 223 to implement the function of receiving and transmitting wireless signals.

[0085] The main material of the housing 220 of this application may be metal, such as aluminum alloy, magnesium alloy, and titanium alloy, etc. That is to say, the main materials of the rear cover 222 and the frame 221 are both metal. In some other embodiments, the main material of the housing 220 may also be ceramic or glass, etc. That is to say, the main materials of the rear cover 222 and the frame 221 may also be ceramic or glass, etc. It can be understood that when the rear cover 222 and the frame 221 are independent structural components respectively, the main materials of the rear cover 222 and the frame 221 may be the same or different. And when the rear cover 222 and the frame 221 are made in an integrated structure, the main materials of the rear cover 222 and the frame 221 are the same.

[0086] Among them, the metal has relatively high rigidity and strength and can support the shapes of the rear cover 222 and the frame 221 as the main material of the housing 220. However, since the metal is a conductive material, it has a shielding effect on the wireless signals transmitted and received by the antenna assembly 230. The electronic device 200 of the present application can ensure the normal operation of the antenna assembly 230 and realize the wireless communication function of the electronic device 200 by opening a micro-slit area 223 on the housing 220 that allows wireless signals to pass through.

[0087] Figure 3 FIG. is an exploded schematic view of the housing 220 in an embodiment of the present application. The frame 221 and the rear cover 222 of the housing 220 are each independent structural components. The micro-slit area 223 can be separately provided on the frame 221, or as Figure 3 shown, it can be separately provided on the rear cover 222, or the micro-slit area 223 can also be simultaneously provided on the frame 221 and the rear cover 222.

[0088] Figure 4 FIG. is a schematic view of the housing 220 in another embodiment of the present application. The frame 221 and the rear cover 222 in the housing 220 are provided as an integral structure. At this time, the micro-slit area 223 can also be separately provided on the corresponding area of the rear cover 222, or the micro-slit area 223 can be separately provided on the corresponding area of the frame 221, or the micro-slit area 223 as Figure 4 shown is simultaneously provided on the corresponding areas of the frame 221 and the rear cover 222.

[0089] In subsequent embodiments of the present application, taking the Figure 3 scheme shown where the rear cover 222 and the frame 221 are each independent structural components and the micro-slit area 223 is separately provided on the rear cover 222 as an example for illustration.

[0090] Please refer to Figure 5 the exploded schematic view of the rear cover 222 shown. The rear cover 222 includes a base body 10, and a transition layer 20 and an appearance layer 30 laminated on the base body 10. Among them, the base body 10 serves as the main structure of the rear cover 222 and is used to form the main shape of the rear cover 222. The transition layer 20 and the appearance layer 30 are used to achieve the appearance effect of the rear cover 222.

[0091] In one embodiment, the base body 10 has a flat area 101 in the middle and a bent area 102 surrounding the periphery of the flat area 101. The bent area 102 is used to connect with the frame 221 to achieve a smooth transition between the rear cover 222 and the frame 221. The transition layer 20 and the appearance layer 30 simultaneously cover the flat area 101 and the bent area 102. In some embodiments, when the rear cover 222 and the frame 221 are an integral structure, the transition layer 20 and the appearance layer 30 can also simultaneously cover the side of the frame 221 facing away from the inside of the electronic device 200.

[0092] A slit 11 is further formed on the substrate 10. Please refer to the Figure 6 partial cross-sectional schematic view of the rear cover 222 shown in the figure. The slit 11 penetrates through the substrate 10 along the thickness direction of the substrate 10 to form a channel allowing wireless signals to pass through. When the number of slits 11 is one, the substrate 10 is separated by the slit 11 into mutually independent first part 10a and second part 10b. When the substrate 10 is made of a conductive material, the first part 10a and the second part 10b are also insulated from each other. In the Figure 6 embodiment, the number of slits 11 is multiple, and the multiple slits 11 are arranged at intervals. The substrate 10 can be separated by the multiple slits 11 into a first part 10a, a second part 10b, and several strip-shaped structures 10c with smaller widths. Each strip-shaped structure 10c is formed between two adjacent slits 11 and is located between the first part 10a and the second part 10b. When the substrate 10 is made of a conductive material, the first part 10a, the second part 10b, and the several strip-shaped structures 10c are electrically insulated from each other. At this time, each of the multiple slits 11 forms a channel allowing wireless signals to pass through.

[0093] It can be understood that the slit 11 on the substrate 10 can be correspondingly formed in the micro-slit area 223 of the housing 220, so as to form a channel allowing wireless signals to pass through in the micro-slit area 223. When the number of slits 11 is multiple, the multiple slits 11 of the substrate 10 are all correspondingly formed within the micro-slit area 223. At this time, the antenna assembly 230 in the electronic device 200 is arranged corresponding to the micro-slit area 223, and can send or receive external signals through the channels formed by the slits 11 in the micro-slit area 223, realizing the communication function of the electronic device 200.

[0094] In some embodiments, the thickness of the substrate 10 can be between 0.1 mm and 3 mm. In this application, the range of "A to B" includes the endpoint values A and B. And the width of the slit 11 can be between 10 μm and 300 μm. When there are multiple slits 11, the distance between two adjacent slits 11 can be greater than the width of the slit 11 itself. For example, the distance between two adjacent slits 11 is greater than 1.5 times its own width.

[0095] Each slit 11 is further filled with an insulator 40. The insulator 40 can be made of materials such as plastic and glue, and is used to connect the first part 10a and the second part 10b into an integral structure. When the number of slits 11 is multiple, the insulator 40 is also used to connect the several strip-shaped structures 10c, the first part 10a, and the second part 10b into an integral structure together. The insulator 40 also allows wireless signals to pass through, and the filling of the insulator 40 makes the inner and outer surfaces of the substrate 10 flat, which is beneficial to the transition layer 20 and the appearance layer 30 covering the substrate 10 in sequence.

[0096] The materials for making the transition layer 20 and the appearance layer 30 are also insulating materials, and wireless signals can pass through the transition layer 20 and the appearance layer 30. Together with the insulator 40 filled in the gap 11, it enables wireless signals to pass through the rear cover 222 and enter the electronic device 200, or be emitted outward from the electronic device 200 through the rear cover 222.

[0097] As Figure 6 shown, the substrate 10 includes an outer surface 12, which is a plane of the substrate 10 facing away from the interior of the electronic device 200. The gap 11 opened on the substrate 10 needs to pass through the outer surface 12 of the substrate 10. And the insulator 40 filled in the gap 11 also constitutes a part of the outer surface 12. That is, the outer surface 12 is jointly constituted by the first part 10a, the second part 10b, and the insulator 40. When there are multiple gaps 11, the strip structure 10c will also constitute a part of the outer surface 12.

[0098] As mentioned above, in this embodiment, the material of the substrate 10 can be metal, while the insulator 40 is made of materials such as plastic and glue. Due to the different materials, there will always be a color difference between the two. In the solution of this application, the transition layer 20 completely covers the outer surface 12, that is, the transition layer 20 covers both the substrate 10 and the insulator 40 at the same time. In the rear cover 222 of this application, the function of the transition layer 20 is to eliminate the color difference between the substrate 10 and the insulator 40, so that when the user observes the rear cover 222 from one side of the outer surface 12, due to the shielding effect of the transition layer 20, there is no obvious color difference between the substrate 10 and the insulator 40 covered under the transition layer 20. That is, there is no color difference on the first surface 21 of the transition layer 20 facing away from the substrate 10. In some embodiments, the transition layer 20 can control the color difference value between the insulator 40 and the substrate 10 within the range of ΔE≤2.0. Where ΔE refers to the color difference value perceived by the human eye in a uniform color perception space. On the other hand, the transition layer 20 can also provide a flat surface for the appearance layer 30 to ensure the appearance effect of the appearance layer 30.

[0099] Exemplarily, the transition layer 20 can be formed by spraying, evaporation coating, chemical vapor deposition, spray molding, cold spraying and other methods. For example, spraying a polymer paint on the outer surface 12 to form the transition layer 20, or evaporating a metal layer such as aluminum alloy or magnesium alloy on the outer surface 12 to form the transition layer 20. It should be noted that when evaporating a metal layer on the outer surface 12, the thickness of the metal layer should be controlled to be less than or equal to 8μm to ensure the wireless signal penetration ability of the evaporated metal layer and avoid the metal layer from shielding the wireless signal.

[0100] The appearance layer 30 completely covers the transition layer 20, that is, the transition layer 20 is located between the substrate 10 and the appearance layer 30, which also means that the transition layer 20 is located between the outer surface 12 and the appearance layer 30. By covering the transition layer 20, the appearance layer 30 also covers the substrate 10 and the insulator 40. The appearance layer 30 is used to achieve the appearance effect of the rear cover 222, and the appearance effect includes at least one of color, texture, and high gloss (high reflectivity). It can be understood that the appearance layer 30 can also be used to simultaneously achieve the combination of any two of the above appearance effects, or simultaneously achieve the above three appearance effects. Since the color difference between the substrate 10 and the insulator 40 is eliminated at the first surface 21 of the transition layer 20, and the first surface 21 is relatively flat, the appearance layer 30 can be prepared on the relatively flat substrate formed by the transition layer 20 without color difference. Thus, when the user observes the rear cover 222 of the present application from the side of the outer surface 12, because the transition layer 20 shields the color difference between the substrate 10 and the insulator 40, the appearance effect presented by the appearance layer 30 can act on the entire area of the rear cover 222. That is, the overall appearance effect of the rear cover 222 of the present application is provided by the appearance layer 30, and the rear cover 222 thus has the consistency of the overall appearance effect and will not be affected by the setting of the gap 11. At the same time, the rear cover 222 of the present application also has the ability to allow wireless signals to penetrate and will not affect the communication function of the electronic device 200 due to the consistency of the appearance effect.

[0101] In one embodiment, please refer to Figure 7, the outer surface 12 of the substrate 10 is a porous structure 13, that is, the side of the substrate 10 facing the transition layer 20 is a porous structure 13. Among them, the porous structure 13 can be formed by a roughening treatment process. The porosity P of the porous structure 13 satisfies the condition: 10% ≤ P ≤ 60%. The setting of the porous structure 13 can improve the adhesion between the transition layer 20 and the substrate 10. The transition layer 20 is simultaneously bonded and fixed to the insulator 40 and the substrate 10. The material of the insulator 40 and the material of the transition layer 20 can achieve a good bonding effect, but the adhesion between the material of the substrate 10 and the transition layer 20 is relatively poor. If the bonding between the transition layer 20 and the substrate 10 is not firm, it is easy to cause cracking between the transition layer 20 and the substrate 10. Therefore, the outer surface 12 of the substrate 10 facing the transition layer 20 is formed into a porous structure 13, and the porous structure 13 is densely distributed with nano-scale pores, so that after the transition layer 20 is fabricated on the porous structure 13, the material of the transition layer 20 can be embedded in the porous structure 13 to form an interlocking form with the porous structure 13, thereby achieving the effect of increasing the contact area between the transition layer 20 and the substrate 10 and improving the adhesion between the transition layer 20 and the substrate 10. At the same time, it can also make the adhesion between the transition layer 20 and the substrate 10 close to the adhesion between the transition layer 20 and the insulator 40, so as to eliminate the phenomenon of poor bonding between the transition layer 20 and the substrate 10 caused by the difference in the expansion coefficients between the insulator 40 and the substrate 10.

[0102] Exemplarily, the roughening treatment of the side of the substrate 10 facing the transition layer 20 can adopt processes such as T solution treatment (TaiseiPlas Treatment), micro-arc oxidation treatment (Microarc oxidation, MAO treatment), chemical conversion treatment, anodic treatment, and laser engraving treatment, etc., to form a porous structure 13 with a porosity P less than or equal to 60% and greater than or equal to 10% within a certain depth range from the outer surface 12 of the substrate 10. Please refer to Figure 8 the partial schematic diagram of the substrate 10 shown. In one embodiment, the thickness h1 of the porous structure 13 can also satisfy the condition: 0.2 μm ≤ h1 ≤ 12 μm. Within this thickness range, it can ensure that the porous structure 13 forms sufficient pores and forms a reliable interlocking structure with the transition layer 20. At the same time, the thickness of the porous structure 13 will not affect the structural stability of the substrate 10 and ensure the overall rigidity and strength of the back cover 222.

[0103] Please continue to refer to Figure 8As shown in the figure, in one embodiment, the transition layer 20 is configured as a multi-layer stacked structure, which includes at least two stacked shielding film layers 22. The thickness h2 of each shielding film layer 22 satisfies the condition: 5μm ≤ h2 ≤ 20μm, and the total thickness h3 of the transition layer 20 satisfies the condition: 10μm ≤ h3 ≤ 95μm. Due to the limitations of processes such as spraying and evaporation coating, if a relatively thick transition layer 20 is to be formed at one time, the cost is relatively high, and it is difficult to control the flatness of the relatively thick transition layer 20. Therefore, the transition layer 20 is formed by stacking multiple shielding film layers 22, which is beneficial to controlling the flatness and thickness of the transition layer 20 and saving the manufacturing cost. And after each shielding film layer 22 is manufactured, the flatness of each shielding film layer 22 can also be controlled by means of supplementary coating and polishing, and then the flatness of the entire transition layer 20 can be effectively controlled. It can be understood that for each shielding film layer 22, any method such as spraying, evaporation coating, electrophoresis, chemical vapor deposition, spray coating, cold spraying, etc. can be used to form it, and then the forming process of the entire transition layer 20 can also be any combination of the above methods. In order to ensure the shielding effect of the transition layer 20 on the insulator 40 and the substrate 10, it is necessary to control the total thickness h3 of the transition layer 20 to be greater than or equal to 10μm and less than or equal to 95μm to ensure no color difference on the first surface 21. The thickness setting of the transition layer 20 can also control the color difference between the regions (including the region covering the insulator 40 and the region covering the substrate 10) in the transition layer 20 within the range of ΔE ≤ 2.0.

[0104] In some embodiments, the height difference h0 of the first surface 21 is controlled to satisfy the condition: h0 ≤ 0.05mm to control the flatness of the transition layer 20. It can be understood that when the appearance layer 30 is disposed on the relatively flat transition layer 20, a uniform appearance effect of the appearance layer 30 can be ensured.

[0105] In one embodiment, please also refer to Figure 7 and Figure 8 , the back cover 222 of the present application further includes an adhesive layer 50. The adhesive layer 50 is disposed between the appearance layer 30 and the transition layer 20, and the appearance layer 30 is adhesively fixed to the transition layer 20 through the adhesive layer 50. The materials of the adhesive layer 50 include but are not limited to epoxy resin, polyvinyl alcohol, carboxymethyl cellulose, shellac, etc. The adhesive layer 50 can be mutually compatible with the materials of the transition layer 20 and the appearance layer 30 respectively, so as to achieve the effect of reliably attaching the appearance layer 30 to the transition layer 20.

[0106] Exemplarily, the thickness of the adhesive layer 50 can be between 2μm and 20μm, and it is made on the first surface 21 of the transition layer 20 by means of roll coating, brush coating, spraying, etc. The adhesive layer 50 can also maintain the same or similar height difference as the first surface 21 to provide a flat supporting surface for the appearance layer 30.

[0107] In one embodiment, as Figure 7 and Figure 8 shown, the appearance layer 30 may include a color film layer 31 and / or an effect film layer 32. The color film layer 31 can be produced by means such as silk screening, spraying, heat transfer printing, etc., while the effect film layer 32 can be produced by means such as embossing, lithography, spraying, etc. In one embodiment, when the appearance layer 30 only includes the color film layer 31, the color film layer 31 can be directly produced on the transition layer 20 to achieve the color effect of the rear cover 222; and when the rear cover 222 is also provided with an adhesive layer 50, the color film layer 31 is produced on the adhesive layer 50. In some other embodiments, when the appearance layer 30 only includes the effect film layer 32, the effect film layer 32 can also be produced on the transition layer 20 to achieve the texture and / or high-gloss effect of the rear cover 222. The high-gloss effect of the effect film layer 32 can include effects such as high-gloss and imitation anodizing; and when the rear cover 222 is also provided with an adhesive layer 50, the effect film layer 32 is produced on the adhesive layer 50.

[0108] It can be understood that there are also some embodiments where the appearance layer 30, as Figure 7 and Figure 8 shown, includes both the color film layer 31 and the effect film layer 32 at the same time, and different appearance effects of the rear cover 222 are respectively achieved through the color film layer 31 and the effect film layer 32. At this time, the color film layer 31 and the effect film layer 32 are stacked, and the color film layer 31 is located between the adhesive layer 50 and the effect film layer 32. Thus, it can be ensured that on the basis of the appearance layer 30 providing a preset color background through the color film layer 31, the texture and high-gloss corresponding to this color are further provided through the effect film layer 32, improving the appearance performance of the appearance layer 30.

[0109] In one embodiment, the thickness of the color film layer 31 can be between 5 μm and 20 μm, and the thickness of the effect film layer 32 can be between 5 μm and 20 μm. Because the transition layer 20 shields the color difference between the insulator 40 and the substrate 10, the appearance layer 30 can form an overall consistent appearance effect on the rear cover 222, avoiding the damage to the overall appearance effect of the rear cover 222 due to the formation of the gap 11 on the substrate 10.

[0110] For one embodiment, please continue to refer to Figure 7, the back cover 222 is also provided with a reinforcement layer 60. The reinforcement layer 60 is located on the side of the substrate 10 away from the outer surface 12, that is, the reinforcement layer 60 is arranged on the inner surface 15 of the substrate 10. The reinforcement layer 60 is in contact with the inner surface 15 of the substrate 10, and the reinforcement layer 60 completely covers all the gaps 11 opened on the substrate 10, and partially covers the substrate 10 on both sides of all the gaps 11. That is, the reinforcement layer 60 spans all the gaps 11 and is in contact with the first part 10a and the second part 10b of the substrate 10 respectively, for connecting and reinforcing the substrate 10. The reinforcement layer 60 can be completely in contact with the first part 10a, or it can be only in contact with part of the surface of the first part 10a. Correspondingly, the reinforcement layer 60 can also be completely in contact with the second part 10b or only in contact with part of the surface.

[0111] Exemplarily, the reinforcement layer 60 can be disposed on the inner surface 15 by nano injection molding, overmolding, tape bonding, etc. Because the substrate 10 is separated into a first part 10a and a second part 10b that are independent of each other by the gap 11, the rigidity of the substrate 10 itself is damaged. By setting the reinforcement layer 60, the first part 10a and the second part 10b can be connected and fixed, thereby improving the rigidity of the substrate 10. It can be understood that when there are multiple gaps 11 opened on the substrate 10, the substrate 10 also includes a plurality of strip structures 10c, and when the reinforcement layer 60 completely covers all the gaps 11, the reinforcement layer 60 also fits and contacts with the plurality of strip structures 10c at the same time, thereby simultaneously achieving the fixation of the plurality of strip structures 10c, which can further improve the rigidity of the substrate 10. Because the reinforcement layer 60 is disposed on one side of the inner surface 15 of the substrate 10, the setting of the reinforcement layer 60 will not affect the overall appearance of the back cover 222.

[0112] Based on the settings of the above-mentioned embodiments, the back cover 222 of the present application still obtains a unified appearance effect on the basis of setting the gap 11 for realizing the communication function, which can ensure the appearance consistency of the shell 220 of the present application and enhance the texture of the electronic device 200 using the shell 220 of the present application.

[0113] It is understandable that the stacking design of the substrate 10, the transition layer 20 and the appearance layer 30 in the above-mentioned back cover 222 can also be transferred to the frame 221, so that when the micro-seam area 223 is opened on the frame 221, the appearance consistency of the frame 221 can also be ensured. For the embodiment in which the back cover 222 and the frame 221 are set as an integral structure, the structure of the above-mentioned back cover 222 can also act on the back cover 222 and the frame 221 at the same time. Therefore, the housing 220 of the present application can maintain the consistency of its appearance in the above-mentioned implementation methods and improve the texture of the electronic device 200. At the same time, the housing 220 of the present application also ensures the communication function of the electronic device 200.

[0114] See also Figure 9The flowchart of the method for manufacturing the housing of the present application is shown. The housing manufacturing method can be used to manufacture the housing 220 shown above. Similarly, the present housing manufacturing method also uses the rear cover 222 with an independent structure as an illustration, and can be understood in combination with Figures 5 to 8 the structure of the rear cover 222 in

[0115] The housing manufacturing method provided by the present application includes the following steps:

[0116] S10. Make a slit 11 on the substrate 10 to divide the substrate 10 into at least two parts;

[0117] S20. Fill the slit 11 with an insulator 40;

[0118] S30. Make an insulating transition layer 20 on the outer surface 12 of the substrate 10. The transition layer 20 covers both the substrate 10 and the insulator 40 at the same time, and the first surface 21 of the transition layer 20 facing away from the substrate 10 has no color difference;

[0119] S40. Make an insulating appearance layer 30 on the side of the transition layer 20 facing away from the substrate 10 to achieve at least one of the appearance effects of color, texture or high gloss of the rear cover 222.

[0120] Specifically, please refer to Figures 9a - 9e for illustration. The housing manufacturing method of the present application needs to first provide a substrate 10 ( Figure 9a ); then make a slit 11 on the substrate 10 by methods such as laser engraving or chemical etching ( Figure 9b ), and then use materials such as plastic or glue as the insulator 40 to fill each slit 11 ( Figure 9c ). Each part of the substrate 10 separated by the slit 11 is adhesively fixed by the insulator 40, so that the substrate 10 is an integral structure. Then, by making a transition layer 20 on the substrate 10 and covering the insulator 40 at the same time, the color difference between the substrate 10 and the insulator 40 is eliminated ( Figure 9d ), that is, there is no color difference at the first surface 21. Finally, make an insulating appearance layer 30 on the first surface 21 of the transition layer 20 to achieve the appearance effect of the rear cover 222 ( Figure 9e ). In the method of the present application, the transition layer 20 can be prepared by spraying, evaporation coating, chemical vapor deposition, spray coating and cold spraying, etc., such as spraying polymer paint, or evaporation coating of aluminum alloy, magnesium alloy, etc.; the appearance layer 30 can be prepared by silk screen printing, spraying, heat transfer printing, embossing, and flat printing, etc.

[0121] The back cover 222 manufactured by the method of the present application shields the color difference between the substrate 10 and the insulator 40 by manufacturing the transition layer 20, enabling the appearance layer 30 manufactured on the transition layer 20 to achieve the overall appearance effect of the back cover 222 on a background without color difference, improving the appearance consistency and texture of the back cover 222. At the same time, due to the insulating properties of the insulator 40, the transition layer 20, and the appearance layer 30, the back cover 222 manufactured by the method of the present application also has the ability to penetrate signals.

[0122] Please refer to Figure 10 The flowchart of another embodiment of the method for manufacturing the housing of the present application is shown schematically. Before step S30, "manufacturing the insulating transition layer 20 on the outer surface 12 of the substrate 10", the method further includes:

[0123] S25. Roughen the side of the substrate 10 corresponding to the manufacturing of the transition layer 20 to form a porous structure 13.

[0124] Specifically, please refer to Figure 10b As shown schematically, after roughening the side of the substrate 10 corresponding to the manufacturing of the transition layer 20, a porous structure 13 is formed on the side of the substrate 10 where the transition layer 20 is manufactured. The outer surface 12 of the substrate 10 is located on the side of the porous structure 13 facing the transition layer 20. The roughening treatment can be carried out by methods such as T solution treatment, MAO treatment, chemical conversion treatment, anodic treatment, and laser engraving treatment to form a porous structure 13 with a certain thickness and densely distributed nano-scale pores on the substrate 10. During the process of manufacturing the transition layer 20 in step S30, the material of the transition layer 20 can be embedded in the pores of the porous structure 13 to form an interlocking structure with the substrate 10, increasing the contact area between the transition layer 20 and the substrate 10 and enhancing the adhesion between the transition layer 20 and the substrate 10.

[0125] Before step S25, "roughen the outer surface 12 of the substrate 10", the method can further include:

[0126] S23. Grind the side of the substrate 10 corresponding to the manufacturing of the transition layer 20 to be flat.

[0127] Specifically, after step S20, "filling the gap 11 with the insulator 40", the side of the substrate 10 where the transition layer 20 is to be manufactured can be polished and buffed with materials such as sandpaper to achieve pre-flattening of the plane, thereby eliminating possible burrs, unevenness, etc. between the plastic or glue in the insulator 40 and the substrate 10. When manufacturing the porous structure 13 on the ground and flat surface, a relatively flat outer surface 12 can be formed, which is conducive to achieving the flatness of the transition layer 20.

[0128] For an embodiment, please refer to Figure 11For step S30, "fabricate an insulating transition layer 20 on the outer surface 12 of the substrate 10", the following sub-steps may also be included:

[0129] S31. Fabricate a first masking film layer 22a on the outer surface 12 of the substrate 10;

[0130] S32. Fabricate a second masking film layer 22b on the side of the first masking film layer 22a away from the substrate 10. The first masking film layer 22a and the second masking film layer 22b together form the transition layer 20.

[0131] Specifically, please refer to Figure 11a the structural schematic diagram corresponding to step S31, and Figure 11b the structural schematic diagram corresponding to step S32. Considering the manufacturing cost and processability, forming the transition layer 20 by laminating the first masking film layer 22a and the second masking film layer 22b is beneficial to controlling the thickness and flatness of each transition film layer 21, and further ensuring the overall thickness of the transition layer 20 to achieve the masking effect of the transition layer 20. The first masking film layer 22a can be fabricated by means such as spraying polymer paint, evaporation coating, electrophoresis, chemical vapor deposition, spraying plastic, and cold spraying. The second masking film layer 22b can also be fabricated by the above-mentioned methods.

[0132] In some embodiments, more masking film layers 22 may also be fabricated to together form the transition layer 20, and the fabrication process of the transition layer 20 can also be any combination form of the above-mentioned multiple processes. For example, after fabricating the second masking film layer 22b, a third masking film layer, a fourth masking film layer, etc. can be successively fabricated on the side of the second masking film layer 22b away from the first masking film layer 22a. The fabrication methods of the third masking film layer, the fourth masking film layer, etc. refer to those of the second masking film layer. Briefly, the process of fabricating the transition layer 20 includes fabricating multiple stacked masking film layers on the outer surface 12 of the substrate 10, and the multiple masking film layers are formed successively.

[0133] For an embodiment, please refer to Figure 12 the fabrication steps of step S31, "fabricate the first masking film layer 22a", may include:

[0134] S311. Fabricate a first masking film layer base material on the outer surface 12 of the substrate 10;

[0135] S312. Perform supplementary coating and grinding on the first masking film layer base material to form the first masking film layer 22a.

[0136] Specifically, after the first masking film layer 22a is fabricated, the flatness of the first masking film layer 22a may not meet the requirements for the overall flatness of the transition layer 20. Therefore, in order to control the flatness of the first masking film layer 22a, after the substrate of the first masking film layer 22a is fabricated, a putty agent is used to recoat and polish the first masking film layer 22a to improve the flatness of the first masking film layer 22a, thereby ensuring that the flatness of the second masking film layer 22b can meet the requirements for the overall flatness of the transition layer 20. It can be understood that when a third masking film layer and a fourth masking film layer need to be fabricated on the second masking film layer 22b, the substrates of the second masking film layer 22b and the third masking film layer also need to be recoated and polished respectively. That is, in an embodiment where the transition layer 20 is formed by three or four masking film layers 22, before fabricating the subsequent masking film layer 22, the substrate of the previous masking film layer 22 can be recoated and polished, so that the transition layer 20 formed by laminating multiple masking film layers 22 also has a high flatness effect.

[0137] An embodiment, before step S40, "fabricating an insulating appearance layer 30 on the side of the transition layer 20 away from the substrate 10", the method further includes:

[0138] S35. Fabricating an adhesive layer 50 on the side of the transition layer 20 away from the substrate 10.

[0139] Specifically, please refer to Figure 10c . Before fabricating the appearance layer 30, the adhesive layer 50 can be fabricated on the first surface 21 of the transition layer 20 away from the substrate 10, and the appearance layer 30 is fabricated on the adhesive layer 50 to ensure a reliable connection between the appearance layer 30 and the transition layer 20. The material of the adhesive layer 50 can be a colloid of an epoxy resin system, a polyacrylic acid system, or a phenolic resin system, and is fabricated on the first surface 21 of the transition layer 20 by means of roll coating, brush coating, spray coating, etc.

[0140] An embodiment, for step S40, "fabricating an insulating appearance layer 30 on the side of the transition layer 20 away from the substrate 10", may include:

[0141] S40a. Fabricating a color film layer 31 and / or an effect film layer 32 on the side of the transition layer 20 away from the substrate 10, where the color film layer 31 is used to achieve the color effect of the rear cover 222, and the effect film layer 32 is used to achieve the texture and / or high-gloss effect of the rear cover 222.

[0142] Specifically, in this embodiment, during the process of fabricating the appearance layer 30, based on the differences in the formation methods of the color effect, texture, and high-gloss effect, the color film layer 31 for achieving the color effect of the rear cover 222 and the effect film layer 32 for achieving the texture and / or high-gloss effect of the rear cover 222 can be fabricated to achieve different appearance effects of the rear cover 222.

[0143] The color film layer 31 can be made by silk screen printing, spraying, thermal transfer, etc., and the effect film layer 32 can be made by embossing, flat printing, spraying, etc. The color film layer 31 can be made alone on the first surface 21 of the transition layer 20, and in the embodiment where the back cover 222 is also provided with an adhesive layer 50, the color film layer 31 can be made on the adhesive layer 50; the effect film layer 32 can also be made alone on the first surface 21, and in the embodiment where the back cover 222 is also provided with an adhesive layer 50, the effect film layer 32 is also made on the adhesive layer 50.

[0144] See also Figure 13 In the embodiment shown, for the embodiment of "forming the color film layer 31 and the effect film layer 32 on the side of the transition layer 20 facing away from the substrate 10" in step S40a, the following sub-steps may also be included:

[0145] S41a, forming a color film layer 31 on the side of the transition layer 20 away from the substrate 10;

[0146] S42a, manufacturing the effect film layer 32 on the color film layer 31.

[0147] For details, see Figure 13a The corresponding structure of step S31, and Figure 13b The corresponding structure of step S32 is schematically shown. In this embodiment, by first manufacturing the color film layer 31 and then manufacturing the effect film layer 32, the color film layer 31 can be disposed between the adhesive layer 50 and the effect film layer 32, and the appearance layer 30 can provide a texture and highlight corresponding to the color on the basis of providing a preset color background, thereby improving the appearance performance of the appearance layer 30. It can be understood that the manufacturing method of the color film layer 31 is the same as that in step S40a, and the color film layer 31 can be manufactured on the transition layer 20 or the adhesive layer 50.

[0148] For an example, please see Figure 10 After step S10 of "making the gap 11 on the substrate 10", the method further comprises:

[0149] S15 , a reinforcement layer 60 is formed on the side of the substrate 10 away from the outer surface 12 , the reinforcement layer 60 completely covers all the gaps 11 , and the reinforcement layer 60 is also in contact with the parts of the substrate 10 located on both sides of the gap 11 .

[0150] For details, see Figure 10a, in this embodiment, the reinforcement layer 60 can be disposed on the inner surface 15 of the substrate 10 by means of nano-injection molding, overmolding, tape bonding, etc. The reinforcement layer 60 is used to connect the first part 10a and the second part 10b separated by the gap 11. The reinforcement layer 60 can supplement the strength of the substrate 10 to a certain extent after the gap 11 is made in the substrate 10 and the structural strength is damaged. It can be understood that when the number of gaps 11 is multiple and several strip-shaped structures 10c are formed between the multiple gaps 11, the reinforcement layer 60 is also used to connect the first part 10a, the second part 10b and the several strip-shaped structures 10c at the same time. Through the connection and fixation of the reinforcement layer 60, when the insulating material 40 is filled in the gap 11 and polished subsequently, the substrate 10 can be ensured to have sufficient rigidity and structural stability and support the substrate 10 to maintain the shape of the rear cover 222.

[0151] Figure 14 and Figure 15 Schematically shows two embodiments of the method for manufacturing the housing of the present application, where Figure 14 The schematically shown housing manufacturing method is used to realize an aluminum alloy black high-gloss flat housing, and the specific implementation steps are as follows:

[0152] S10b. Make the gap 11 on the 0.5-mm-thick aluminum alloy plate by chemical etching;

[0153] Specifically, in this embodiment, the substrate 10 is made of a 0.5-mm-thick aluminum alloy plate, such as an aluminum alloy plate of model 5052. The gap 11 is etched on the aluminum alloy plate by chemical etching, and the width of the formed gap 11 is between 0.1 mm and 2 mm.

[0154] S15b. Bond a tape at the inner surface 15 to reinforce the aluminum alloy plate;

[0155] Specifically, a tape is bonded as the reinforcement layer 60 at the inner surface 15 of the substrate 10 facing away from the outer surface 12, and the tape is used to connect and reinforce at least two parts of the aluminum alloy plate divided by the gap 11.

[0156] S20b. Fill each gap 11 with glue by means of dispensing;

[0157] Specifically, glue is used as the insulating material 40 to fill each gap 11.

[0158] S23b. Use 600#, 1200# and 2000# sandpapers to polish and buff the side of the aluminum alloy plate corresponding to the production of the transition layer 20 respectively;

[0159] Specifically, sandpapers of different models are used to polish the side of the aluminum alloy plate corresponding to the production of the transition layer 20, and the models of the sandpapers are gradually increased to polish the outer surface 12 of the substrate 10 flat.

[0160] S25b. Treat the side of the aluminum alloy plate corresponding to the production of the transition layer 20 with T solution to form a porous structure 13;

[0161] Specifically, the side of the aluminum alloy plate corresponding to the production of the transition layer 20 is roughened by chemical etching to form a porous structure 13, and the outer surface 12 is located on the side of the porous structure 13 facing the transition layer 20. The pore diameter of the porous structure 13 is about 0.2 μm.

[0162] S311b. Spray a polymer paint substrate on the outer surface 12 of the aluminum alloy plate;

[0163] S312b. Retouch and polish the polymer paint substrate to form a flat polymer paint film;

[0164] S32b. Continuously spray the substrates of three layers of polymer paint films on the side of the polymer paint film facing away from the aluminum alloy plate, and retouch and polish the substrates of the first two layers of polymer paint films made. The four layers of polymer paint films together form the transition layer 20.

[0165] Specifically, each layer of polymer paint film needs to complete the processes of spraying and baking, and in addition to the outermost layer of polymer paint film, the other three layers of polymer paint films also need to complete the processes of retouching and polishing. The thickness of the first layer of polymer paint film (i.e., the polymer paint film in contact with the outer surface 12) is approximately 10 μm, and the thickness of the other three layers of polymer paint films is approximately 8 μm. The relatively thick thickness of the first layer of polymer paint film is beneficial to ensuring the reliable fixation of the first layer of polymer paint film on the outer surface 12. The baking temperature of each layer of polymer paint film is 80 °C / 30 min. When retouching, an aluminum alloy commercial putty FTW6516 can be used, and when polishing, a 2000# model sandpaper is used. In this embodiment, the transition layer 20 is formed by a total of four masking film layers 22, and all four masking film layers 22 are retouched and polished after being made.

[0166] S35b. Roll-coat an epoxy resin adhesive on the side of the transition layer 20 facing away from the substrate 10.

[0167] Specifically, the epoxy resin adhesive makes an adhesive layer 50, which is made on the first surface 21 of the transition layer 20 by roll-coating. The thickness of the adhesive layer 50 made of the epoxy resin adhesive is approximately 3 μm.

[0168] S41b. Screen-print a black high-gloss ink coating on the adhesive layer 50 made of the epoxy resin adhesive;

[0169] Specifically, a black high-gloss ink coating is used as the color film layer 31 and is made on the adhesive layer 50 by means of screen printing. The thickness of the black high-gloss ink coating is approximately 10 μm.

[0170] S42b. Imprint a polyurethane ultraviolet coating on the black high-gloss ink coating.

[0171] Specifically, a polyurethane ultraviolet (UV) coating is used to make the appearance film layer 32 and is made by means of flat imprinting. The polyurethane ultraviolet coating is a transparent coating with a thickness of approximately 15 μm, and after imprinting, ultraviolet irradiation curing is required, and the curing duration is not less than 5 s.

[0172] Figure 15 The schematic housing manufacturing method is used to implement a magnesium alloy blue texture flat housing. The specific implementation steps are as follows:

[0173] S10c. Laser engrave the slit 11 on a 0.3-mm-thick magnesium alloy sheet.

[0174] Specifically, in this embodiment, the substrate 10 uses a 0.3-mm-thick magnesium alloy sheet, such as a magnesium alloy sheet of model AZ31B. The slit 11 is cut on the magnesium alloy sheet by means of laser engraving, and the width of the formed slit 11 is between 10 μm and 50 μm.

[0175] S15c. Perform nano-injection molding (Nano Molding Technology, NMT) on the inner surface 15 to reinforce the magnesium alloy sheet.

[0176] Specifically, nano-injection molding is performed on the inner surface 15 of the substrate 10 to make the reinforcement layer 60, thereby connecting and reinforcing at least two parts of the magnesium alloy sheet divided by the slit 11.

[0177] S20c. Fill each slit 11 with plastic.

[0178] Specifically, plastic is used as the insulator 40 to fill each slit 11.

[0179] S23c. Use 1200# and 2000# sandpapers to polish and buff the side of the magnesium alloy sheet corresponding to the transition layer 20.

[0180] Specifically, sandpapers of different models are used to polish and buff the side of the magnesium alloy sheet corresponding to the transition layer 20, and the model of the sandpaper gradually increases to polish the outer surface 12 of the substrate 10 flat.

[0181] S25c. Perform MAO treatment on the side of the magnesium alloy sheet corresponding to the production of the transition layer 20 to form the porous structure 13.

[0182] Specifically, the side of the magnesium alloy sheet corresponding to the production of the transition layer 20 is roughened by micro-arc oxidation to form a porous structure 13 on the outer surface 12, and the outer surface 12 is located on the side of the porous structure 13 facing the transition layer.

[0183] S311c. Spraying the substrates of two layers of polymer paint films on the outer surface 12 of the magnesium alloy sheet in sequence;

[0184] S312c. Filling and polishing the substrates of each layer of polymer paint film to form two flat polymer paint films in sequence;

[0185] S32c. Evaporating a layer of aluminum film layer on the side of the polymer paint film away from the magnesium alloy sheet, and the two layers of polymer paint films and one layer of aluminum film layer together form the transition layer 20.

[0186] Specifically, in this embodiment, the number of the shielding film layers 22 is three. Among them, the two layers of polymer paint films close to the magnesium alloy sheet are both made by electrophoresis, and both layers of polymer paint films need to complete the processes of electrophoresis-baking-filling-polishing. The thickness of both layers of polymer paint films is approximately 10 μm, the baking temperature is 80 °C / 30 min, the magnesium alloy commercial putty 2050 can be used for filling, and the 2000# sandpaper is used for polishing. The evaporation thickness of the aluminum film layer is approximately 0.2 μm to ensure that the aluminum film layer will not cause signal shielding.

[0187] S35c. Roller-coating an epoxy resin adhesive on the side of the transition layer 20 away from the substrate 10.

[0188] Specifically, in this embodiment, the epoxy resin adhesive is also used to make the adhesive layer 50, and it is made on the first surface 21 of the transition layer 20 by roller-coating. The thickness of the adhesive layer 50 made of the epoxy resin adhesive is approximately 5 μm.

[0189] S41c. Screen-printing a blue ink coating on the adhesive layer 50 made of the epoxy resin adhesive;

[0190] Specifically, the blue ink is used to make the color film layer 31, and the blue ink material is made on the adhesive layer 50 by screen printing through a screen plate. The thickness of the blue ink coating is approximately 10 μm.

[0191] S42c. Imprinting a polyurethane ultraviolet coating on the blue ink coating.

[0192] Specifically, the polyurethane ultraviolet coating is used to make the appearance film layer 32, and the preset texture is imprinted on the blue ink coating by flat imprinting. Among them, the polyurethane ultraviolet coating is a transparent coating, its thickness is approximately 20 μm, and after the imprinting process, ultraviolet irradiation curing operation is also required to cure the texture effect of the appearance.

[0193] The rear covers 222 produced by the above two method embodiments respectively have a consistent overall black high-gloss effect and a blue texture effect, enhancing the texture of the rear covers 222.

[0194] Similar to the embodiments of the rear cover 222 described above, the method for manufacturing the housing of the present application, through the manufacturing process of stacking the transition layer 20 and the appearance layer 30 on the substrate 10, can also be transferred to the manufacturing method of the frame 221. Furthermore, when the micro-slit area 223 is formed on the frame 221, the appearance consistency of the frame 221 can also be ensured. For the embodiments in which the rear cover 222 and the frame 221 are provided as an integral structure, the above method for manufacturing the rear cover 222 can also act on both the rear cover 222 and the frame 221 simultaneously. Thus, the housing 220 manufactured by the method for manufacturing the housing of the present application can also maintain the consistency of its appearance and enhance the texture of the electronic device 200. At the same time, the housing 220 of the present application also ensures the communication function of the electronic device 200.

[0195] The above description is only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, such as reducing or adding structural components, changing the shape of structural components, etc., which should all be covered within the protection scope of the present application; without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A housing, characterized in that, Comprising: a substrate, and a transition layer and an appearance layer stacked on the outer surface of the substrate; the substrate includes a gap, and an insulator is filled in the gap; the transition layer is located between the outer surface of the substrate and the appearance layer, and the transition layer covers the substrate and the insulator; the transition layer controls the color difference between the insulator and the substrate within the range of ΔE≤2.0, where ΔE refers to the color difference perceived by the human eye in a uniform color perception space; the material of the transition layer includes polymer paint; the appearance layer is used to achieve at least one of the appearance effects of color, texture or high gloss of the housing; both the transition layer and the appearance layer are insulated.

2. The housing according to claim 1, characterized in that, The outer surface of the substrate has a porous structure.

3. The housing according to claim 2, characterized in that, The porosity P of the porous structure satisfies the condition: 10%≤P≤60%.

4. The housing according to claim 2 or 3, characterized in that, The thickness h1 of the porous structure satisfies the condition: 0.2μm≤h1≤12μm.

5. The housing according to any one of claims 1-3, characterized in that, The transition layer includes at least two stacked shielding film layers, the thickness h2 of each shielding film layer satisfies the condition: 5μm≤h2≤20μm, and the total thickness h3 of the transition layer satisfies the condition: 10μm≤h3≤95μm.

6. The housing according to any one of claims 1-3, characterized in that, The side of the transition layer facing away from the substrate is the first surface, and the height difference h0 of the first surface satisfies the condition: h0≤0.05mm.

7. The housing according to any one of claims 1-3, characterized in that, The housing further includes an adhesive layer, the adhesive layer is located between the appearance layer and the transition layer, and the appearance layer is adhesively fixed to the transition layer through the adhesive layer.

8. The housing according to any one of claims 1-3, characterized in that, The appearance layer includes a color film layer or an effect film layer, the color film layer is used to achieve the color effect of the housing, and the effect film layer is used to achieve the texture and / or high gloss effect of the housing.

9. The housing according to any one of claims 1 to 3, characterized in that, The appearance layer includes a stacked color film layer and an effect film layer, and the color film layer is located between the transition layer and the effect film layer, the color film layer is used to achieve the color effect of the housing, and the effect film layer is used to achieve the texture and / or high gloss effect of the housing.

10. The housing according to any one of claims 1 to 3, characterized in that, The housing is further provided with a reinforcement layer, the reinforcement layer is located on the side of the substrate away from the outer surface, the reinforcement layer completely covers the gap, and is in contact with the parts of the substrate on both sides of the gap respectively, and the reinforcement layer is used to connect and reinforce the substrate.

11. An electronic device, characterized in that, The electronic device includes an antenna assembly and a housing according to any one of claims 1-10, the antenna assembly is received in the housing, and the antenna assembly is disposed corresponding to the position of the gap in the housing.

12. The electronic device according to claim 11, wherein The housing includes a rear cover and a frame, and the gap is opened on the rear cover and / or the frame.

13. A method for manufacturing a housing, characterized in that, Including the following steps: Making a gap in the substrate to divide the substrate into at least two parts; Filling the gap with an insulator; Making an insulating transition layer on the outer surface of the substrate, the transition layer covering both the substrate and the insulator at the same time; the transition layer controls the color difference between the insulator and the substrate within the range of ΔE≤2.0, where ΔE refers to the color difference perceived by the human eye in a uniform color perception space; the material of the transition layer includes polymer paint; An insulating appearance layer is fabricated on the side of the transition layer facing away from the substrate to achieve at least one of the appearance effects of color, texture, or high gloss of the housing.

14. The method for manufacturing the housing according to claim 13, wherein Before fabricating the insulating transition layer on the outer surface of the substrate, it further includes: Roughening the side of the substrate corresponding to the fabrication of the transition layer to form a porous structure on the substrate.

15. The method for manufacturing a housing according to claim 13 or 14, characterized in that, Fabricating the insulating transition layer on the outer surface of the substrate includes: Fabricating a first masking film layer on the outer surface of the substrate; Fabricating a second masking film layer on the side of the first masking film layer facing away from the substrate, and the first masking film layer and the second masking film layer together form the transition layer.

16. The method for manufacturing the housing according to claim 15, wherein, Fabricating the first masking film layer on the outer surface of the substrate includes: Fabricating a first masking film layer substrate on the outer surface of the substrate; Performing supplementary coating and polishing on the first masking film layer substrate to form the first masking film layer.

17. The method for manufacturing a housing according to claim 13 or 14, characterized in that, Before fabricating the insulating appearance layer on the side of the transition layer facing away from the substrate, it further includes: Fabricating an adhesive layer on the side of the transition layer facing away from the substrate.

18. The method for manufacturing a housing according to claim 13 or 14, characterized in that, Fabricating the insulating appearance layer on the side of the transition layer facing away from the substrate includes: Fabricating a color film layer and / or an effect film layer on the transition layer, where the color film layer is used to achieve the color effect of the housing, and the effect film layer is used to achieve the texture and / or high gloss effect of the housing.

19. The method for manufacturing the housing according to claim 18, wherein, Fabricating the color film layer and the effect film layer on the transition layer includes: Fabricating the color film layer on the transition layer; Fabricating the effect film layer on the color film layer.

20. The method for manufacturing a housing according to claim 13 or 14, characterized in that, After fabricating a gap in the substrate, it further includes: Fabricating a reinforcing layer on the side of the substrate facing away from the outer surface, the reinforcing layer completely covers the gap, and the reinforcing layer also contacts the parts of the substrate on both sides of the gap respectively.

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