Electromagnetic Interference Coupling and Transfer Mechanism Model of Integrated Electronic System and Its Modeling Method

Abstract

The present invention discloses an electromagnetic interference coupling transfer mechanism model for a comprehensive electronic system, which includes a main circuit. An inductive coupling is formed between the main circuit and a drive circuit, a capacitive coupling is formed between the drive circuit and a sampling conditioning circuit, and a capacitive coupling is formed between the sampling conditioning circuit and a communication circuit. The present invention also discloses a design method for the above model. The present invention can realize the prediction and evaluation of electromagnetic interference coupling in a complex comprehensive electronic system, and ensure the safe and stable operation of the comprehensive electronic system.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronics and electromagnetic compatibility, and relates to an electromagnetic interference coupling transfer mechanism model for an integrated electronic system. The present invention also relates to a modeling method for the above model. Background Art

[0002] With the increasingly complex circuit structure and diverse circuit types of integrated electronic systems, electromagnetic interference within the integrated electronic system will be transmitted in each loop, forming multi-loop transmission type electromagnetic interference. This coupled and transmitted electromagnetic interference is difficult to detect and most difficult to suppress. Currently, the mechanism of electromagnetic interference coupling transfer in integrated electronic systems is not clear, mainly because there is a lack of an electromagnetic interference coupling transfer mechanism model for integrated electronic systems to explain it. At the same time, due to the lack of this electromagnetic interference coupling transfer mechanism model for integrated electronic systems, it is impossible to accurately predict and evaluate the electromagnetic interference of integrated electronic systems. Especially for high-demand electronic devices such as military electronic equipment, the electromagnetic interference coupling transfer mechanism model for integrated electronic systems is even more important. Summary of the Invention

[0003] The purpose of the present invention is to provide an electromagnetic interference coupling transfer mechanism model for an integrated electronic system, which can realize the prediction and evaluation of electromagnetic interference coupling in complex integrated electronic systems and ensure the safe and stable operation of the integrated electronic system.

[0004] The purpose of the present invention is also to provide a design method for an electromagnetic interference coupling transfer mechanism model of an integrated electronic system.

[0005] The first technical solution adopted by the present invention is that the electromagnetic interference coupling transfer mechanism model of the integrated electronic system includes a main loop. The main loop forms an inductive coupling with the drive loop, the drive loop forms a capacitive coupling with the sampling conditioning loop, and the sampling conditioning loop and the communication loop form a capacitive coupling.

[0006] The characteristics of the first technical solution adopted by the present invention are further as follows:

[0007] The main loop includes a main loop power supply Us1, and the negative pole of the main loop voltage source U S1 is connected to the internal impedance R of the voltage source 11 and then is connected in parallel with the inductor L of the high-frequency model of the filter capacitor 11 , resistor R 12 and capacitor C 11 . The positive pole of the main loop voltage source U S1 is sequentially connected to the line impedance L 12 , resistor R 13 , the inductor L of the high-frequency model of the load inductor 13 , resistor R 14 , inductor L 13 and resistor R 14A capacitor C is connected in parallel at both ends 12 , a resistor R 14 One end of is also connected to a load resistor R 15 .

[0008] The drive circuit includes a drive circuit power supply U S2 , a drive circuit voltage source U S2 The negative pole is connected to the internal impedance R of the voltage source 21 , a drive circuit voltage source U S2 The positive pole is connected to a drive resistor R 22 , a drive circuit voltage source U S2 And the two ends of the internal impedance R of the voltage source are connected in parallel with a voltage-controlled voltage source U2, and the drive resistor R 21 Is also connected to a line impedance L 22 And a resistor R 21 , a resistor R 23 Finally, it is connected to the load resistor R of the drive circuit 23 . 24 .

[0009] The sampling and conditioning circuit includes two resistors R connected in parallel 31 And a resistor R 32 , a resistor R 31 And a resistor R 32 One end of the parallel circuit is connected to a line impedance R 33 And L 31 , a resistor R 31 And a resistor R 32 The two ends of are also connected in parallel with three routes. Route 1 is the capacitor C of the capacitor high-frequency model 31 , an inductor L 32 And a resistor R 34 , Route 2 is a voltage source U S3 ; Route 3 is a voltage-controlled voltage source U3, and an internal impedance R is provided on the connection line between the voltage-controlled voltage source U3 and the voltage source U S3 , and the voltage source U 35 Is connected in parallel with a load resistor R S3 . 36 .

[0010] The communication circuit includes a communication circuit voltage source U S4 , a communication circuit voltage source U S4 The negative pole is connected to the internal impedance of the communication circuit voltage source as R 41 , a communication circuit voltage source U S4 The positive pole is connected to a line impedance L 41 And R 42 , and finally the communication circuit load resistor is R 43 And grounded

[0011] The second technical solution adopted by the present invention is a design method for the electromagnetic interference coupling transfer mechanism model of an integrated electronic system. In the integrated electronic system, the coupling transfer method of each functional loop system is judged according to the physical position and size of each functional loop system;

[0012] When there is a loop parallel mode, that is, when any two functional loops are parallel and the included angle θ1 between the two loops is ≤ 45°, it is stipulated that the two functional loop systems are inductively coupled;

[0013] When there is a wire parallel mode, that is, when there is a long-distance wire parallel setting in any two functional loops and the included angle θ2 between the two wires is ≤ 30°, it is stipulated that the two functional loop systems are capacitively coupled;

[0014] Determination of the electromagnetic interference coupling transfer sequence of each functional loop: In the electromagnetic interference coupling transfer model of the integrated electronic system, the loop with high power and strong coupling effect is used as the first-level transfer loop of the coupling transfer mechanism model, and the main loop is the first-level transfer loop; the drive loop that is connected to the main loop and drives large-voltage and large-current power switching devices through low voltage and small current is used as the second-level loop of the coupling transfer mechanism model; the communication loop of the low-voltage and low-power loop that is sensitive to high-frequency signals is used as the last-level loop of the coupling transfer mechanism model.

[0015] Step 1, determine the transfer method and coupling method of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system, specifically:

[0016] Coupling mechanism between the main loop and the drive loop: There are parallel loops between the main loop and the drive loop, so the coupling between the two is modeled as mutual inductance, and the mutual inductance is denoted as M;

[0017] Coupling mechanism between the drive loop and the acquisition conditioning loop: That is, there is a long-distance wire parallel setting between the drive loop and the sampling conditioning loop. Therefore, the coupling between the drive loop and the sampling conditioning loop is modeled as capacitive coupling, and the coupling capacitance is denoted as C1;

[0018] Coupling mechanism between the acquisition conditioning circuit and the communication loop: There is a long-distance wire parallel design between the drive loop and the sampling conditioning loop. Therefore, the coupling between the sampling conditioning loop and the communication loop is modeled as capacitive coupling, and the coupling capacitance is denoted as C2;

[0019] Step 2, calculate the mutual inductance coefficient and coupling capacitance between each functional loop system of the integrated electronic system;

[0020] Step 2.1, use the following formula (1) to determine the mutual inductance coefficient M between the main loop and the drive loop:

[0021]

[0022] Among them, S a is the equivalent area of the main circuit, S b is the equivalent area of the drive circuit, d1 is the shortest distance between the main circuit and the drive circuit, θ a is the angle between the main circuit and the drive circuit;

[0023] Step 2.2, determine the coupling capacitor C1 between the drive circuit and the sampling conditioning circuit by using the following formula (2):

[0024]

[0025] Among them, h x is the height of the drive circuit from the ground, h y is the height of the sampling conditioning circuit from the ground, D1 is the shortest distance between the drive circuit and the signal conditioning circuit, d x is the wire diameter of the drive circuit, d y is the wire diameter of the signal conditioning circuit, θ b is the angle between the drive circuit and the sampling conditioning circuit;

[0026] Step 2.3, determine the coupling capacitor C2 between the sampling conditioning circuit and the communication circuit by using the following formula (3) as:

[0027]

[0028] Among them, h y is the height of the sampling conditioning circuit from the ground, h z is the height of the communication circuit from the ground, D2 is the shortest distance between the sampling conditioning circuit and the communication circuit, d y is the wire diameter of the signal conditioning circuit, d z is the wire diameter of the communication circuit, θ c is the angle between the sampling conditioning circuit and the communication circuit;

[0029] Step 3, calculate the interference voltage U S1 on the communication circuit brought by the main circuit voltage source U N of the comprehensive electronic system coupling transfer system by using the following formula (4):

[0030]

[0031] Z1 is the equivalent source impedance of the main circuit, which can be obtained by calculating with the following formula:

[0032]

[0033] Among them, R 11 is the internal impedance of the main circuit voltage source, L 11 、R12 and C 11 are the inductance, resistance, and capacitance of the high-frequency model of the filter capacitor;

[0034] Z2 is the equivalent load impedance of the main circuit and can be calculated by the following formula:

[0035]

[0036] where, L 12 and R 13 are the line impedance, L 13 , R 14 and C 12 are the inductance, resistance, and capacitance of the high-frequency model of the load inductor, and R 15 is the load resistance;

[0037] Z3 is the equivalent source impedance of the drive circuit and can be calculated by the following formula:

[0038] Z3 = R 21 + R 22 (7);

[0039] where, R 21 is the internal impedance of the voltage source in the drive circuit, and R 22 is the drive resistance;

[0040] Z4 is the equivalent load impedance of the drive circuit and can be calculated by the following formula:

[0041] Z4 = R 23 + R 24 (8);

[0042] where, R 23 is the equivalent resistance of the line, and R 24 is the load resistance of the drive circuit;

[0043] Z5 is the equivalent source impedance of the sampling conditioning circuit and is calculated by the following formula:

[0044]

[0045] where, R 31 and R 32 are the impedances of the sampling device, R 33 and L 31 are the line impedance, and C 31 , L 32 and R 34 are the capacitance, inductance, and resistance of the high-frequency model of the filter capacitor;

[0046] Z6 is the equivalent load impedance of the sampling conditioning circuit and can be calculated by the following formula:

[0047] Z6 = R35 +R 36 (10);

[0048] Wherein, R 35 is the internal impedance of the sampling conditioning circuit voltage source, and R 36 is the load impedance of the sampling conditioning circuit;

[0049] Z7 is the equivalent source impedance of the communication circuit, which is obtained by the following formula:

[0050] Z7 = R 41 + jωL 41 (11);

[0051] Wherein, R 41 is the internal impedance of the communication circuit voltage source, and L 41 is the equivalent inductance of the line;

[0052] Z8 is the equivalent load impedance of the communication circuit, which is obtained by the following formula:

[0053] Z8 = R 42 + R 43 (12);

[0054] Wherein, R 42 is the equivalent impedance of the line, and R 43 is the load resistance of the communication circuit.

[0055] The beneficial effects of the present invention are that the electromagnetic interference coupling transfer mechanism model and its modeling method of the integrated electronic system proposed by the present invention can explain the mechanism of electromagnetic interference coupling transfer of the integrated electronic system, make up for the lack of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system, and the coupling transfer mechanism modeling method established by the present invention is a general method, suitable for electromagnetic interference coupling transfer modeling of various complex electronic systems, and can realize the prediction and evaluation of electromagnetic interference coupling of complex integrated electronic systems, ensuring the safe and stable operation of the integrated electronic system. Description of the Drawings

[0056] Figure 1 is the electromagnetic interference coupling transfer mechanism diagram of the integrated electronic system of the present invention;

[0057] Figure 2 is the structural schematic diagram of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system of the present invention. Detailed Embodiments

[0058] The present invention will be described in detail below with reference to the drawings and specific embodiments.

[0059] The electromagnetic interference coupling transfer mechanism model of the integrated electronic system of the present invention can establish a coupling model for the electromagnetic interference coupling transfer of the integrated electronic system according to the actual physical structure and position of the integrated electronic system, and proposes a quantitative calculation method for the coupling relationship. At the same time, according to the circuit electrical parameters and the interference energy level, the present invention can give the coupling transfer relationship and sequence of each level loop of the integrated electronic system.

[0060] The integrated electronic system includes multiple functional loops, such as a main loop for power transmission, a drive loop for driving power switching devices, a sampling conditioning loop for conditioning signals, a communication loop for signal transmission, etc. In the integrated electronic system, the main loop is the electromagnetic interference source, which will affect the drive loop through mutual inductance, and then affect the sampling conditioning loop through capacitive coupling, and finally affect the communication loop that is easily interfered. Figure 1 This is the electromagnetic interference coupling transfer mechanism diagram of the integrated electronic system of the present invention.

[0061] Figure 2 This is the electromagnetic interference coupling transfer mechanism model of the integrated electronic system of the present invention, including a main loop, a drive loop, a sampling conditioning loop and a communication loop. In the main loop, the internal impedance of the main loop voltage source is extracted as R 11 , the inductance, resistance and capacitance of the high-frequency model of the filter capacitor are extracted as L 11 , R 12 and C 11 , the line impedance is extracted as L 12 and R 13 , the inductance, resistance and capacitance of the high-frequency model of the load inductor are extracted as L 13 , R 14 and C 12 , the load resistance is extracted as R 15 .

[0062] The negative pole of the main loop voltage source U S1 is connected to the internal impedance R of the voltage source 11 , and then the inductance L of the high-frequency model of the filter capacitor 11 , the resistance R 12 and the capacitor C 11 are connected in parallel. The positive pole of the main loop voltage source U S1 is sequentially connected to the line impedance L 12 , the resistance R 13 , the inductance L of the high-frequency model of the load inductor 13 , the resistance R 14 . The two ends of the inductance L 13 and the resistance R 14 are connected in parallel with the capacitor C 12 . One end of the resistance R 14 is also connected to the load resistance R 15 .

[0063] In the drive circuit, the internal impedance of the drive circuit voltage source is extracted as R 21 and the drive resistance is extracted as R 22 and the line impedance is extracted as L 21 and R 23 and the load resistance of the drive circuit is extracted as R 24 . The drive circuit voltage source U S2 has its negative terminal connected to the internal impedance R of the voltage source 21 , and the positive terminal of the drive circuit voltage source U S2 is connected to the drive resistance R 22 . A voltage-controlled voltage source U2 is connected in parallel across both ends of the drive circuit voltage source U S2 and the internal impedance R of the voltage source 21 . The drive resistance R 22 is also connected to the line impedance L 21 and the resistance R 23 . The resistance R 23 is finally connected to the load resistance R of the drive circuit 24 .

[0064] In the sampling and conditioning circuit, the impedance of the sampling device is extracted as R 31 and R 32 , and the line impedance is extracted as R 33 and L 31 . The capacitance, inductance, and resistance of the high-frequency model of the filter capacitor are extracted as C 31 , L 32 and R 34 . The internal impedance of the sampling and conditioning circuit voltage source is extracted as R 35 , and the load impedance of the sampling and conditioning circuit is extracted as R 36 . The sampling and conditioning circuit includes two resistors R 31 and resistor R 32 connected in parallel. One end of the parallel circuit of resistor R 31 and resistor R 32 is connected to the line impedance R 33 and L 31 . Both ends of resistor R 31 and resistor R 32 are also connected in parallel with the capacitance C of the capacitor high-frequency model 31 , inductance L 32 and resistor R 34 . The voltage source U of the sampling and conditioning circuit is also connected in parallel S3 . One end of U S3 is connected to the internal impedance of the voltage source as R 35 . Then, a voltage-controlled voltage source U3 is connected in parallel across both ends, and finally, the load resistance is R 36 .

[0065] In the communication circuit, the internal impedance of the communication circuit voltage source is extracted as R 41 , and the line impedance is extracted as L41 and R 42 , extract the communication loop load resistance as R 43 . The voltage source U of the communication loop S4 The negative pole is connected to the internal impedance of the communication loop voltage source as R 41 , the voltage source U of the communication loop S4 The positive pole is connected to the line impedance L 41 and R 42 , and finally connect the communication loop load resistance as R 43 and grounded.

[0066] Among them, the main loop and the drive loop form an inductive coupling, and the coupling coefficient is M; the drive loop and the sampling conditioning loop form a capacitive coupling, and the coupling capacitance is C1; the sampling conditioning loop and the communication loop form a capacitive coupling, and the coupling capacitance is C2.

[0067] The present invention relates to a comprehensive electronic system electromagnetic interference coupling transfer mechanism model and its modeling method, and the specific steps are as follows:

[0068] Step 1: Design the transfer mode and coupling mode of the comprehensive electronic system electromagnetic interference coupling transfer mechanism model.

[0069] Design of the coupling transfer mode of each functional loop system: In the comprehensive electronic system, judge the coupling transfer mode of each functional loop system according to the physical position mode and size of each functional loop system. When there is a loop parallel mode, that is, any two functional loops are parallel and the included angle θ1 between the two loops ≤ 45°, it is stipulated that the two functional loop systems are inductively coupled. When there is a wire parallel mode, that is, there is a long-distance wire parallel setting in any two functional loops and the included angle θ2 between the two wires ≤ 30°, it is stipulated that the two functional loop systems are capacitively coupled.

[0070] Determination of the electromagnetic interference coupling transfer sequence of each functional loop: In the comprehensive electronic system electromagnetic interference coupling transfer model, the loop with high power and strong coupling effect is used as the first-level transfer loop of the coupling transfer mechanism model, such as the main loop; the drive loop connected to the main loop and driving a large-voltage and large-current power switch device through a low voltage and small current is used as the second-level loop of the coupling transfer mechanism model; the communication loop with low voltage and small power and sensitive to high-frequency signals is used as the last-level loop of the coupling transfer mechanism model.

[0071] As Figure 1 shown, it is the electromagnetic interference coupling transfer mechanism diagram of the comprehensive electronic system of the present invention.

[0072] Coupling mechanism between the main circuit and the drive circuit: The controller transmits signals to the drive chip, and then the drive chip outputs signals to control the operation of IGBT or MOSFET. There are parallel circuits between the main circuit and the drive circuit, so the coupling is modeled as mutual inductance, denoted as M.

[0073] Coupling mechanism between the drive circuit and the acquisition conditioning circuit: The purpose of the drive circuit is to drive IGBT or MOSFET. The controller transmits signals to the drive chip, and then the drive chip outputs signals to control the on and off of IGBT or MOSFET, which is the circuit from the main circuit to the DSP. The sampling conditioning circuit mainly collects signals from the main circuit, and the collected signals will reach near the controller. That is, there is a parallel arrangement of long-distance wires between the drive circuit and the sampling conditioning circuit. Therefore, the coupling between the drive circuit and the sampling conditioning circuit is modeled as capacitive coupling, and the coupling capacitance is denoted as C1.

[0074] Coupling between the acquisition conditioning circuit and the communication circuit: The sampling conditioning circuit mainly collects signals from the main circuit, and the collected signals will reach near the controller. The communication circuit needs to transmit signals with the controller. That is, there is a parallel design of long-distance wires between the drive circuit and the sampling conditioning circuit. Therefore, the coupling between the sampling conditioning circuit and the communication circuit is modeled as capacitive coupling, and the coupling capacitance is denoted as C2.

[0075] Step 2: Calculate the mutual inductance coefficient and coupling capacitance between the functional loop systems of the integrated electronic system.

[0076] Step 2.1, calculate the coupling coefficient between two functionally coupled loops, and denote the two loops as Loop I and Loop II.

[0077]

[0078] Among them, S1 is the equivalent area of Loop I, S2 is the equivalent area of Loop II, d is the shortest distance between Loop I and Loop II, and θ1 is the angle between Loop I and Loop II.

[0079] Such as Figure 2 The mutual inductance coefficient between the main circuit and the drive circuit in is:

[0080]

[0081] Among them, S a is the equivalent area of the main circuit, S b is the equivalent area of the drive circuit, d1 is the shortest distance between the main circuit and the drive circuit, and θ a is the angle between the main circuit and the drive circuit.

[0082] Step 2.2, calculate the coupling capacitance between the two capacitive coupling functional lines. Denote the two lines as Line III and Line IV.

[0083]

[0084] Among them, h3 is the height of Line III from the ground, h4 is the height of Line IV from the ground, D is the shortest distance between Line III and Line IV, d3 is the wire diameter of Line III, d4 is the wire diameter of Line IV, and θ2 is the included angle between Line III and Line IV.

[0085] Such as Figure 2 the coupling capacitance between the drive loop and the sampling conditioning loop in

[0086]

[0087] Among them, h x is the height of the drive loop from the ground, h y is the height of the sampling conditioning loop from the ground, D1 is the shortest distance between the drive loop and the signal conditioning loop, d x is the wire diameter of the drive loop, d y is the wire diameter of the signal conditioning loop, θ b is the included angle between the drive loop and the sampling conditioning loop.

[0088] Such as Figure 2 the coupling capacitance between the sampling conditioning loop and the communication loop in

[0089]

[0090] Among them, h y is the height of the sampling conditioning loop from the ground, h z is the height of the communication loop from the ground, D2 is the shortest distance between the sampling conditioning loop and the communication loop, d y is the wire diameter of the signal conditioning loop, d z is the wire diameter of the communication loop, θ c is the included angle between the sampling conditioning loop and the communication loop.

[0091] Step 3, calculate the interference voltage U S1 on the communication loop brought by the main loop voltage source U N .

[0092]

[0093] Among them, M is the mutual inductance between the main loop and the drive loop, which can be obtained by calculation in Step 2.1;

[0094] C1 is the coupling capacitor between the drive circuit and the sampling conditioning circuit, which can be calculated from Step 2.2;

[0095] C2 is the coupling capacitor between the sampling conditioning circuit and the communication circuit, which can be calculated from Step 2.2;

[0096] Z1 is the equivalent source impedance of the main circuit, which can be calculated by the following formula:

[0097]

[0098] where, R 11 is the internal impedance of the main circuit voltage source, L 11 , R 12 and C 11 are the inductance, resistance and capacitance of the high-frequency model of the filter capacitor.

[0099] Z2 is the equivalent load impedance of the main circuit, which can be calculated by the following formula:

[0100]

[0101] where, L 12 and R 13 are the line impedance, L 13 , R 14 and C 12 are the inductance, resistance and capacitance of the high-frequency model of the load inductor, and R 15 is the load resistance.

[0102] Z3 is the equivalent source impedance of the drive circuit, which can be calculated by the following formula:

[0103] Z3 = R 21 +R 22

[0104] where, R 21 is the internal impedance of the drive circuit voltage source, and R 22 is the drive resistance.

[0105] Z4 is the equivalent load impedance of the drive circuit, which can be calculated by the following formula:

[0106] Z4 = R 23 +R 24

[0107] where, R 23 is the equivalent resistance of the line, and R 24 is the load resistance of the drive circuit.

[0108] Z5 is the equivalent source impedance of the sampling conditioning circuit, which can be calculated by the following formula:

[0109]

[0110] Among them, R 31 and R 32 are the impedances of the sampling device, R 33 and L 31 are the line impedances, and C 31 , L 32 and R 34 are the capacitance, inductance and resistance of the high-frequency model of the filter capacitor.

[0111] Z6 is the equivalent load impedance of the sampling conditioning circuit and can be calculated by the following formula:

[0112] Z6 = R 35 +R 36

[0113] Among them, R 35 is the internal impedance of the voltage source of the sampling conditioning circuit, and R 36 is the load impedance of the sampling conditioning circuit.

[0114] Z7 is the equivalent source impedance of the communication circuit and can be calculated by the following formula:

[0115] Z7 = R 41 +jωL 41

[0116] Among them, R 41 is the internal impedance of the voltage source of the communication circuit, and L 41 is the equivalent inductance of the line. Z8 is the equivalent load impedance of the communication circuit and can be calculated by the following formula:

[0117] Z8 = R 42 +R 43

[0118] Among them, R 42 is the equivalent impedance of the line, and R 43 is the load resistance of the communication circuit.

Claims

1. The electromagnetic interference coupling and transfer mechanism model of an integrated electronic system, characterized in that: It includes a main circuit. The main circuit forms an inductive coupling with the drive circuit, the drive circuit forms a capacitive coupling with the sampling and conditioning circuit, and the sampling and conditioning circuit and the communication circuit form a capacitive coupling; The main circuit includes a main circuit power supply Us 1. The main circuit voltage source U S1 The negative pole is connected to the internal impedance of the voltage source R 11 and then is connected in parallel with the inductor of the high-frequency model of the filter capacitor L 11 , resistor R 12 and capacitor C 11 . The positive pole of the main circuit voltage source U S1 is sequentially connected to the line impedance L 12 , resistor R 13 , the inductor of the high-frequency model of the load inductor L 13 , resistor R 14 . Capacitor L 13 and resistor R 14 are connected in parallel at both ends with capacitor C 12 . One end of resistor R 14 is also connected to the load resistor R 15 ; The drive circuit includes a drive circuit power supply U S2 , driving circuit voltage source U S2 Negative connection voltage source internal impedance R 21 , driving circuit voltage source U S2 Positive connection drive resistor R 22 , driving circuit voltage source U S2 and the voltage source internal impedance R 21 A voltage-controlled voltage source is connected in parallel at both ends of U 2. Driving resistance R 22 Also connect the line impedance L 21 and resistor R 23 ,resistance R 23 Finally, connect the load resistor of the drive circuit R 24 ; The sampling and conditioning circuit includes two resistors connected in parallel R 31 and resistor R 32 , resistor R 31 and resistor R 32 One end of the parallel circuit of the resistor R 33 and L 31 is connected to the line impedance R 31 and resistor R 32 The two ends of the resistor C 31 and the inductor L 32 and resistor R 34 are also connected in parallel with three lines. Line 1 is the capacitor U S3 of the capacitor high-frequency model, the inductor U 3, and the voltage-controlled voltage source U 3. There is an internal impedance U S3 on the connection line between the voltage-controlled voltage source R 35 and the voltage source U S3 The voltage source R 36 is connected in parallel with a load resistor The communication circuit includes a communication circuit voltage source U S4 , the internal impedance of the negative electrode of the communication circuit voltage source U S4 is R 41 , the positive electrode of the communication circuit voltage source U S4 is connected to the line impedance L 41 and R 42 , and finally connected to the communication circuit load resistance R 43 and grounded.

2. The design method of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system according to claim 1, characterized in that: In the integrated electronic system, the coupling transfer methods of each functional circuit system are judged according to the physical location and size of each functional circuit system; When there is a loop parallel mode, that is, any two functional loops are parallel and the included angle between the two loops is specified as inductive coupling between the two functional loop systems; When there is a parallel wire arrangement, that is, there is a long-distance parallel wire setting in any two functional circuits and the included angle between the two wires is specified as capacitive coupling between the two functional circuit systems; Determination of the electromagnetic interference coupling transfer sequence of each functional circuit: In the electromagnetic interference coupling transfer model of the integrated electronic system, the circuit with high power and strong coupling effect is used as the first-level transfer circuit of the coupling transfer mechanism model, and the main circuit is the first-level transfer circuit; The drive circuit connected to the main circuit and driving large-voltage and large-current power switch devices through low voltage and small current is used as the second-level circuit of the coupling transfer mechanism model; The communication circuit, which is a low-voltage and low-power circuit sensitive to high-frequency signals, is used as the last-level circuit of the coupling transfer mechanism model.

3. The design method of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system according to claim 2, wherein: Specifically, it includes the following steps: Step 1, determine the transfer method and coupling method of the electromagnetic interference coupling transfer mechanism model of the integrated electronic system, specifically: Coupling mechanism between the main circuit and the drive circuit: There are parallel circuits between the main circuit and the drive circuit, so the coupling between them is modeled as mutual inductance, and the mutual inductance is denoted as M; Coupling mechanism between the drive circuit and the acquisition conditioning circuit: That is, there is a parallel arrangement of long-distance wires between the drive circuit and the sampling conditioning circuit. Therefore, the coupling between the drive circuit and the sampling conditioning circuit is modeled as capacitive coupling, and the coupling capacitance is denoted as C 1; Coupling mechanism between the acquisition conditioning circuit and the communication loop: There is a parallel design of long-distance wires between the drive loop and the sampling conditioning loop. Therefore, the coupling between the sampling conditioning loop and the communication loop is modeled as capacitive coupling, and the coupling capacitance is denoted as C 2; Step 2, calculate the mutual inductance coefficient and coupling capacitance between each functional circuit system of the integrated electronic system; Step 2.1, use the following formula (1) to determine the mutual inductance coefficient M between the main circuit and the drive circuit: （1）； Among them, S a is the equivalent area of the main circuit, S b is the equivalent area of the drive circuit, d 1 is the shortest distance between the main circuit and the drive circuit, is the angle between the main circuit and the drive circuit; Step 2.2, use the following formula (2) to determine the coupling capacitance C1 between the drive circuit and the sampling and conditioning circuit: （2）； Among them, h x is the height of the drive circuit from the ground, h y is the height of the sampling and conditioning circuit from the ground, D 1 is the shortest distance between the drive circuit and the signal conditioning circuit, d x is the wire diameter of the drive circuit, d y is the wire diameter of the signal conditioning circuit, is the angle between the drive circuit and the sampling and conditioning circuit; Step 2.3, use the following formula (3) to determine the coupling capacitance C2 between the sampling and conditioning circuit and the communication circuit as: （3）； wherein, h y is the height of the sampling conditioning circuit from the ground, h z is the height of the communication circuit from the ground, D 2 is the shortest distance between the sampling conditioning circuit and the communication circuit, d y is the wire diameter of the signal conditioning circuit, d z is the wire diameter of the communication circuit, is the included angle between the sampling conditioning circuit and the communication circuit; Step 3: Calculate the interference voltage on the communication loop caused by the main circuit voltage source in the comprehensive electronic system coupling transfer system using the following formula (4) U S1 U N :​ （4）； Z 1 is the equivalent source impedance of the main circuit and is obtained by calculation using the following formula: （5）； Among them, R 11 is the internal impedance of the main circuit voltage source, L 11 , R 12 and C 11 are the inductance, resistance and capacitance of the high-frequency model of the filter capacitor; Z 2 is the equivalent load impedance of the main circuit and is obtained by calculation using the following formula: （6）； Among them, L 12 and R 13 are the line impedances, L 13 , R 14 and C 12 are the inductance, resistance and capacitance of the high-frequency model of the load inductor, R 15 is the load resistance; Z 3 is the equivalent source impedance of the drive circuit and is obtained by calculation according to the following formula: （7）； Among them, R 21 is the internal impedance of the driving circuit voltage source, R 22 is the driving resistor; Z 4 is the equivalent load impedance of the drive circuit and is obtained by calculation using the following formula: （8）； Among them, R 23 is the equivalent resistance of the circuit, R 24 is the load resistance of the drive circuit; Z 5 is the equivalent source impedance of the sampling conditioning circuit and is obtained by the following formula: （9）； Among them, R 31 and R 32 are the impedances of the sampling device, R 33 and L 31 are the line impedances, C 31 、 L 32 and R 34 are the capacitance, inductance, and resistance of the high-frequency model of the filter capacitor; Z 6 is the equivalent load impedance of the sampling conditioning circuit and is obtained by the following formula: （10）； Among them, R 35 is the internal impedance of the voltage source of the sampling conditioning circuit, R 36 is the load impedance of the sampling conditioning circuit; Z 7 is the equivalent source impedance of the communication circuit and is obtained by the following calculation: （11）； Among them, R 41 is the internal impedance of the communication loop voltage source, L 41 is the equivalent inductance of the line; Z 8 is the equivalent load impedance of the communication circuit and is obtained by calculation using the following formula: （12）； Among them, R 42 is the equivalent impedance of the line, R 43 is the load resistance of the communication loop.

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