Conductive device for coating and coating machine

Abstract

The present invention relates to a conductive device for film coating and a film coating machine. The conductive device for film coating comprises a frame and two conductive mechanisms, wherein: the frame is provided with a plating tank for accommodating plating solution; the two conductive mechanisms are both fixed on the frame and are arranged opposite to each other along the depth direction of the plating tank at intervals; the conductive mechanism comprises a conductive roller, a titanium basket and a rectifier, the positive pole of the rectifier is electrically connected to the titanium basket, the negative pole of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, one side of the conductive roller along its radial direction is immersed in the plating solution, and the other side is exposed outside the plating solution, and the cross section of the conductive roller in its axial direction is in an I-shape; when a film-coated product passes through the conductive mechanism, one side of the film-coated product contacts one of the two conductive rollers, and the other side contacts the other conductive roller; the conductive device for film coating provided by the present invention can prevent the middle part of the conductive roller from contacting the plating solution during the electroplating process of the film-coated product, thereby significantly improving the coating quality of the film-coated product.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplated thin films, and in particular to a conductive device for film coating and a film coating machine. Background Art

[0002] Electroplating is an important process in the production of composite current collector copper film. The rectifier is connected to the conductive roller and titanium basket. The current flows from the positive electrode of the rectifier through the titanium basket, through the plating solution, the conductive mechanism and the negative electrode of the rectifier, so that the entire electroplating system forms a complete circuit, thereby forming a thin film on the plated product.

[0003] At present, the conductive roller is usually a tubular structure with the same diameter. During the coating process, the conductive roller contacts the coated product and also contacts the plating solution (copper solution) directly or indirectly, forming the phenomenon of copper re-plating or copper deposition on the conductive roller. During the long copper plating process, when the copper plating on the conductive roller accumulates to a certain extent, an irregular copper crystal layer will be formed on its surface. This copper crystal layer is extremely unevenly distributed on the conductive roller, resulting in the formation of copper slag or copper thorns at local positions of the conductive roller. When the coated product contacts the conductive roller, the copper slag or copper thorns formed on the conductive roller will scratch the copper film deposited on the surface of the coated product, seriously affecting the electroplating quality of the copper film on the surface of the coated product. In addition, when the copper crystal layer on the conductive roller accumulates too thick, it will also affect the color and uniformity of the copper film on the surface of the coated product. Summary of the invention

[0004] Based on this, it is necessary to provide a conductive device and a coating machine for coating to address the problem that during the coating process of the existing conductive device, the conductive roller will directly or indirectly contact the plating solution, resulting in copper back-plating or copper deposition on its surface, which seriously affects the coating quality of the copper film on the surface of the coated product.

[0005] A conductive device for coating, used for electroplating a thin film on the surface of a coating product, comprising:

[0006] A frame, wherein the frame is provided with a plating tank for containing a plating solution;

[0007] Two conductive mechanisms, both of which are fixed on the frame and arranged opposite to each other along the depth direction of the plating tank, the conductive mechanisms comprising a conductive roller, a titanium basket and a rectifier, the positive electrode of the rectifier is electrically connected to the titanium basket, the negative electrode of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, one side of the conductive roller along the radial direction is immersed in the plating solution, and the other side is exposed outside the plating solution, and the cross section of the conductive roller in the axial direction is I-shaped;

[0008] When the coated product passes through the conductive mechanism, one side of the coated product contacts one of the two conductive rollers, and the other side of the coated product contacts the other conductive roller.

[0009] The above-mentioned conductive device for coating has a coating tank on the frame, which can be used to contain the coating solution, and two conductive mechanisms are fixed on the frame to realize the fixed connection between the two conductive mechanisms and the frame. The positive electrode of the rectifier is electrically connected to the titanium basket, and the negative electrode of the rectifier is electrically connected to the conductive roller. The titanium basket is at least partially immersed in the coating solution, and one side of the conductive roller along its radial direction is immersed in the coating solution, and the other side of the conductive roller is exposed outside the coating solution. The rectifier, the titanium basket, the conductive roller and the coating solution form a complete current loop. When the coated product passes through the conductive mechanism, one side of the coated product contacts one of the two conductive rollers, and the other side of the coated product contacts the other of the two conductive rollers, so that a thin film is plated on both surfaces of the coated product, and double-sided coating of the coated product is realized, thereby improving the electroplating efficiency on the surface of the coated product. In addition, the cross-section of the conductive roller in the axial direction is I-shaped. During the electroplating process of the plated product, the middle part of the conductive roller is neither in contact with the plating solution nor with the middle part of the plated product, thereby preventing the middle part of the conductive roller from directly or indirectly contacting the plating solution, reducing the copper re-plating or copper deposition phenomenon on the conductive roller, reducing the risk of the conductive roller scratching the deposited film on the surface of the plated product, and significantly improving the coating quality of the plated product.

[0010] In one embodiment, the diameters of the two ends of the conductive roller are 5 cm-20 cm, and the middle position of the conductive roller is recessed by 1 cm-3 cm compared to the end positions thereof.

[0011] In one embodiment, the conductive roller is a tubular structure with a hollow interior.

[0012] In one embodiment, the conductive roller is made of 304 stainless steel or 316 stainless steel.

[0013] In one embodiment, the conductive mechanism further includes an auxiliary anode, and the positive electrode of the rectifier is electrically connected to the auxiliary anode.

[0014] In one embodiment, the auxiliary anode is made of titanium metal, and an iridium metal layer is uniformly coated on its surface.

[0015] A coating machine comprises an unwinding mechanism, a winding mechanism and a conductive device for coating as described in any one of the above technical solutions, wherein the unwinding mechanism and the winding mechanism are both fixed on the frame and are arranged at intervals on the conveying path of the coated product.

[0016] In the above-mentioned coating machine, the cross-section of the conductive roller in the axial direction is I-shaped. During the electroplating process of the coated product, the middle part of the conductive roller is neither in contact with the plating solution nor in contact with the middle part of the coated product, thereby preventing the conductive roller from directly or indirectly contacting the plating solution, causing copper back-plating or copper deposition on the conductive roller, and preventing the conductive roller from scratching the thin film deposited on the surface of the coated product, thereby significantly improving the coating quality of the coated product.

[0017] In one of the embodiments, it further comprises a plurality of tensioning elements, wherein the plurality of tensioning elements are all fixed on the frame and are evenly distributed between the unwinding mechanism and the rewinding mechanism.

[0018] In one of the embodiments, two spray elements are further included, both of which are fixed on the frame, and the spray elements have spray ports, one of the two spray ports faces one of the two conductive rollers, and the other faces the other of the two conductive rollers.

[0019] In one of the embodiments, a heating element is further included, and the heating element is fixed on the frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A top view of the conductive device for film coating provided by the present invention;

[0021] Figure 2 The front view of the coating machine provided by the present invention.

[0022] Reference numerals:

[0023] 100. Conductive device for coating;

[0024] 110, rack;

[0025] 120. Conductive mechanism; 121. Conductive roller; 122. Titanium basket; 123. Rectifier; 124. Auxiliary anode;

[0026] 200. Coated products;

[0027] 300, coating machine;

[0028] 310. Unwinding mechanism; 320. Rewinding mechanism; 330. Tensioning element. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0035] The technical solution provided by the embodiments of the present invention is described below in conjunction with the accompanying drawings.

[0036] like Figure 1 As shown, the present invention provides a conductive device 100 for coating, which includes a frame 110 and two conductive mechanisms 120 . The conductive device 100 for coating is used for electroplating a thin film on the surface of a coating product 200 .

[0037] The frame 110 is provided with a plating tank (not shown in the figure), which can contain a plating solution, which can be used to form a thin film on the coated product 200 and also to conduct current. The frame 110 can be integrally formed with a plating tank by casting, molding, etc., so as to simplify the molding process of the frame 110 and save the manufacturing cost of the frame 110; the plating tank can also be formed by other auxiliary tools after the frame 110 is formed. The plating solution can be a fluid medium such as copper liquid, iron liquid, etc. that can form a thin film on the surface of the coated product 200. In this embodiment, only copper liquid is used as a representative.

[0038] The two conductive mechanisms 120 are fixed to the frame 110 by screwing, welding, etc., so as to realize the fixed connection between the two conductive mechanisms 120 and the frame 110. The two conductive mechanisms 120 are arranged opposite to each other in the depth direction of the plating tank, that is, there is a gap between the two conductive mechanisms 120. In this embodiment, the two conductive mechanisms 120 are arranged in a vertical direction. The conductive mechanism 120 includes a conductive roller 121, a titanium basket 122 and a rectifier 123. The conductive roller 121 and the titanium basket 122 are both fixed on the frame 110. The positive electrode of the rectifier 123 is electrically connected to the titanium basket 122, and the negative electrode of the rectifier 123 is electrically connected to the conductive roller 121. The titanium basket 122 is at least partially immersed in the plating solution. In the radial direction of the conductive roller 121, one side of the conductive roller 121 is immersed in the plating solution, and the other side of the conductive roller 121 is exposed outside the plating solution. Since the plating solution is conductive, the rectifier 123, the titanium basket 122, the conductive roller 121 and the plating solution form a complete current loop to provide current for the coating product 200. In addition, the cross-section of the conductive roller 121 in its axial direction is I-shaped. During the electroplating process of the coated product 200, the middle part of the conductive roller 121 is neither in contact with the plating solution nor with the middle part of the coated product 200, thereby preventing the middle part of the conductive roller 121 from directly or indirectly contacting the plating solution, reducing the copper re-plating or copper deposition phenomenon on the conductive roller 121, and reducing the risk of the conductive roller 121 scratching the deposited film on the surface of the coated product 200, thereby significantly improving the coating quality of the coated product 200.

[0039] When the coated product 200 passes through the conductive mechanism 120, one side of the coated product 200 contacts one of the two conductive rollers 121, and the other side of the coated product 200 contacts the other of the two conductive rollers 121, so as to electroplate a thin film on both surfaces of the coated product 200, thereby improving the electroplating efficiency on the surface of the coated product 200.

[0040] In order to make the cross section of the conductive roller 121 in the axial direction be I-shaped, a preferred embodiment is as follows: Figure 1 As shown, the diameters of the two ends of the conductive roller 121 are 5cm-20cm, and the middle position of the conductive roller 121 is concave by 1cm-3cm compared to the end position thereof. In other words, the conductive roller 121 is a cylindrical structure with large ends and a small middle, that is, the diameter of the middle position of the conductive roller 121 is smaller than the diameters of the two ends of the conductive roller 121. During the electroplating process of the plated product 200, the middle part of the conductive roller 121 is neither in contact with the plating solution nor with the middle part of the plated product 200, which prevents the middle part of the conductive roller 121 from directly or indirectly contacting the plating solution, reduces the phenomenon of copper re-plating or copper deposition on the conductive roller 121, reduces the risk of the conductive roller 121 scratching the deposited film on the surface of the plated product 200, and significantly improves the coating quality of the plated product 200.

[0041] In specific settings, the diameter of the two ends of the conductive roller 121 can be one of 5 cm, 10 cm, 15 cm, and 20 cm. Of course, the diameter of the two ends of the conductive roller 121 is not limited to the above range, and can also be other values ​​within the range of 5 cm-20 cm. In addition, for different installation processes or molding processes of the conductive roller 121, the diameter of the two ends of the conductive roller 121 is not limited to the above diameter setting range, and the diameter of the two ends of the conductive roller 121 can be specifically set according to the installation process or molding process of the conductive roller 121.

[0042] In order to save the manufacturing cost of the conductive roller 121, a preferred embodiment is as follows: Figure 1 As shown, the conductive roller 121 is a hollow tubular structure, and the material required in the molding process of the conductive roller 121 is reduced, which can save the manufacturing cost of the conductive roller 121. In addition, the bearing strength requirement for the frame 110 is relatively low, and the lightweight design of the conductive device 100 for coating can be achieved.

[0043] In order to facilitate the manufacturing and forming of the conductive roller 121, a preferred embodiment is as follows: Figure 1 As shown, the conductive roller 121 is made of one of 304 stainless steel and 316 stainless steel. Since both 304 stainless steel and 316 stainless steel have excellent formability, the conductive roller 121 can be easily manufactured and formed. In addition, stainless steel has excellent corrosion resistance and toughness, which can significantly improve the service life of the conductive roller 121 and prevent the conductive roller 121 from deforming during long-term use.

[0044] Of course, in other embodiments, the conductive roller 121 can also be made of other materials with excellent formability and conductivity, such as 316L stainless steel. The present invention does not limit the specific material of the conductive roller 121, and it can be specifically selected according to process requirements or budget costs.

[0045] In order to further improve the coating quality of the coated product 200, a preferred implementation is as follows: Figure 1 As shown, the conductive mechanism 120 further includes an auxiliary anode 124, and the positive electrode of the rectifier 123 is electrically connected to the auxiliary anode 124. Since the cross section of the conductive roller 121 along its axial direction is an I-shaped, the conductivity of the middle position of the conductive roller 121 is relatively weak, and the rectifier 123, the auxiliary anode 124, the conductive roller 121 and the plating solution form a complete current loop, which together with the current loop formed by the rectifier 123, the titanium basket 122, the conductive roller 121 and the plating solution enhances the conductivity of the conductive roller 121, makes up for the disadvantage of low current density in the middle of the conductive roller 121, greatly improves the uniformity of the thin film formed on the surface of the plated product 200, and improves the coating quality of the plated product 200.

[0046] The auxiliary anode 124 is made of titanium metal. Since titanium metal is insoluble in strong acid, it is not easy to deform, corrode or other undesirable phenomena when in contact with the plating solution, which helps to extend the service life of the auxiliary electrode. However, the conductivity of titanium metal is relatively weak, so an iridium metal layer is evenly coated on its surface to enhance the conductivity of the auxiliary anode 124, making up for the disadvantage of low current density in the middle of the conductive roller 121, greatly improving the uniformity of the thin film formed on the surface of the plated product 200, so as to improve the coating quality of the plated product 200.

[0047] In addition, if Figure 1 and Figure 2 As shown, the present invention further provides a coating machine 300, which includes an unwinding mechanism 310, a rewinding mechanism 320, and a conductive device for coating 100 as described in any of the above technical solutions. The unwinding mechanism 310 is fixed to the frame 110 by screwing, welding, etc., and the rewinding mechanism 320 is also fixed to the frame 110 by screwing, welding, etc., so as to realize the installation and fixation of the unwinding mechanism 310 and the rewinding mechanism 320. The unwinding mechanism 310 and the rewinding mechanism 320 are arranged at intervals on the conveying path of the coating product 200. The unwinding mechanism 310 is used to automatically convey the coating product 200 before electroplating, and the rewinding mechanism 320 is used to automatically collect the coating product 200 after electroplating.

[0048] In the above-mentioned coating machine 300, the cross-section of the conductive roller 121 in the axial direction is I-shaped. During the electroplating process of the coated product 200, the middle part of the conductive roller 121 is neither in contact with the plating solution nor in contact with the middle part of the coated product 200, thereby preventing the conductive roller 121 from directly or indirectly contacting the plating solution, causing copper back-plating or copper deposition on the conductive roller 121, and preventing the conductive roller 121 from scratching the thin film deposited on the surface of the coated product 200, thereby significantly improving the coating quality of the coated product 200.

[0049] In order to improve the coating quality of the coating product 200, a preferred implementation is as follows: Figure 1 and Figure 2 As shown, the coating machine 300 further includes a plurality of tensioning elements 330, which are fixed to the frame 110 by screwing, riveting, etc., and the plurality of tensioning elements 330 are evenly distributed between the unwinding mechanism 310 and the winding mechanism 320. In other words, the plurality of tensioning elements 330 are evenly distributed on the conveying path of the coated product 200. When the coated product 200 passes through the tensioning elements 330, the tensioning elements 330 can tension the coated product 200 to ensure the surface flatness of the coated product 200, further improve the uniformity of the thin film formed on the surface of the coated product 200, and improve the coating quality on the surface of the coated product 200.

[0050] The tensioning element 330 is a tensioning wheel or a tensioning spring, so as to ensure that when the coated product 200 passes through the tensioning element 330, the tensioning element 330 can tension the coated product 200 to ensure the surface flatness of the coated product 200. Of course, the tensioning element 330 is not limited to the tensioning wheel or tensioning spring provided above, and can also be other elements capable of tensioning the coated product 200. The present invention does not limit the specific type of the tensioning element 330.

[0051] In order to reduce the copper re-plating or copper deposition phenomenon on the conductive roller 121, a preferred embodiment is as follows: Figure 1 and Figure 2 As shown, the coating machine 300 further includes two spray elements (not shown in the figure), and the two spray elements are fixed to the frame 110 by screwing, riveting, etc. The spray element has a spray port, one of the two spray ports is directed toward one of the two conductive rollers 121, and the other of the two spray ports is directed toward the other of the two conductive rollers 121. The cleaning medium sprayed by the spray element cleans the conductive roller 121 to clean the plating solution remaining on the conductive roller 121, thereby preventing the plating solution remaining on the conductive roller 121 from being exposed to the air for a long time, resulting in copper re-plating or copper deposition on the conductive roller 121.

[0052] The spray element is a spray head to clean the plating solution remaining on the conductive roller 121. Of course, the spray element is not limited to the spray head provided above, and can also be other elements capable of cleaning the plating solution remaining on the conductive roller 121. The present invention does not limit the specific type of the spray element.

[0053] In order to improve the electroplating efficiency of the coating machine 300 on the coated product 200, a preferred embodiment is as follows: Figure 1 and Figure 2 As shown, the coating machine 300 also includes a heating element (not shown in the figure), which is fixed to the frame 110 by screwing, welding, etc. The heating element can accelerate the forming rate of the thin film on the surface of the coating product 200 and improve the electroplating efficiency of the coating machine 300 on the coating product 200.

[0054] The heating element is an oven, which can accelerate the forming rate of the thin film on the surface of the coated product 200. Of course, the heating element is not limited to the oven provided above, but can also be other elements that can accelerate the forming rate of the thin film on the surface of the coated product 200. The present invention does not limit the specific type of the heating element.

[0055] The present invention will be further described below in conjunction with specific implementation modes.

[0056] It should be noted that the embodiment uses the square resistance uniformity and the pore morphology of the film surface to express the coating quality of the coating product surface. The resistance of the film formed on the surface of the coating product 200 is measured using a four-probe tester. The electroplated coated product 200 is unfolded, and a CCD camera (industrial camera) is used to photograph the thin film formed on the surface of the unfolded coated product 200. The coating quality of the surface of the coated product 200 is indicated by observing the number of holes and the hole diameter.

[0057] Example 1

[0058] The surface of the polypropylene film is selected for electroplating a thin film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the existing conductive roller 121, and the auxiliary anode 124 is not provided.

[0059] Plating solution ingredients: 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, 8ml / L brightener.

[0060] Antioxidant liquid: DP-A agent 5ml / L, DP-B agent 10ml / L, process temperature 20-30℃, PH 1.8-3.5.

[0061] Oven setting temperature: 80℃.

[0062] Conveyor line speed of polypropylene film: 2m / min.

[0063] The total current of one side of the polypropylene film (hereinafter referred to as side A) is 1152A; the total current of the other side of the polypropylene film (hereinafter referred to as side B) is 1164A.

[0064] The tension of polypropylene film during transportation: 80N.

[0065] The results are shown in Table 1 and Table 2:

[0066] Table 1 Square resistance of 1200m polypropylene film at different positions on surface A and surface B

[0067] Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 A side square resistance 22 20 21 23 23 22 23 24 22 21 19 19 B side square resistance 19 21 22 22 24 23 23 22 20 21 19 19

[0068] Table 2 Hole detection data of polypropylene film surface film

[0069]

[0070] It can be seen from Table 1 and Table 2 that when the existing conductive roller 121 is used to electroplate the polypropylene film without the auxiliary anode 124, the resistance of the film formed on the surface of the polypropylene film within a range of 1200 m is measured by a four-probe tester. The square resistance uniformity of the polypropylene film A surface is 11.6%, and the square resistance uniformity of the polypropylene film B surface is 11.6%. The CCD camera is used to photograph the film formation on the surface of the polypropylene film within a range of 1200 m2 after the film is unfolded. The total number of holes is 1752, and the hole diameters in each interval are relatively large.

[0071] Example 2

[0072] The surface of the polypropylene film is selected for electroplating film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the conductive roller 121 used in the present invention (the cross section of the conductive roller 121 along its axial direction is I-shaped), and the auxiliary anode 124 is not set.

[0073] Plating solution ingredients: 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, 8ml / L brightener.

[0074] Antioxidant liquid: DP-A agent 5ml / L, DP-B agent 10ml / L, process temperature 20-30℃, PH 1.8-3.5.

[0075] Oven setting temperature: 80℃.

[0076] Conveyor line speed of polypropylene film: 2m / min.

[0077] The total current of the polypropylene film side A is 1152A; the total current of the polypropylene film side B is 1164A.

[0078] The tension of polypropylene film during transportation: 80N.

[0079] The results are shown in Table 3 and Table 4:

[0080] Table 3 Square resistance of 1200m polypropylene film at different positions on surface A and surface B

[0081] Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 A side square resistance 18 19 22 23 23 23 23 23 20 19 20 18 B side square resistance 19 20 22 23 24 23 24 22 21 21 18 19

[0082] Table 4 Hole detection data of polypropylene film surface film

[0083]

[0084]

[0085] It can be seen from Table 3 and Table 4 that when the conductive roller 121 used in the present invention is used to electroplate a polypropylene film without the auxiliary anode 124, the resistance of the film formed on the surface of the polypropylene film within a range of 1200 m is measured by a four-probe tester. The square resistance uniformity of the polypropylene film surface A is 12.2%, and the square resistance uniformity of the polypropylene film surface B is 14.3%. The film formation on the surface of the polypropylene film within a range of 1200 m2 after unfolding is photographed by a CCD camera. The total number of holes is 492, and the hole diameters in each interval are all small.

[0086] Example 3

[0087] The surface of the polypropylene film is selected for electroplating film, the thickness of the polypropylene film is 6 μm, the conductive roller 121 is the conductive roller 121 used in the present invention (the cross section of the conductive roller 121 along its axial direction is I-shaped), and an auxiliary anode 124 is provided.

[0088] Plating solution ingredients: 130g / L copper sulfate, 140g / L sulfuric acid, 60mg / L hydrochloric acid, 8ml / L brightener.

[0089] Antioxidant liquid: DP-A agent 5ml / L, DP-B agent 10ml / L, process temperature 20-30℃, PH 1.8-3.5.

[0090] Oven setting temperature: 80℃.

[0091] Conveyor line speed of polypropylene film: 2m / min.

[0092] The total current of the polypropylene film side A is 1152A; the total current of the polypropylene film side B is 1164A.

[0093] The total current of the auxiliary anode 124A surface is 52A; the total current of the auxiliary anode 124B surface is 64A.

[0094] The tension of polypropylene film during transportation: 80N.

[0095] The results are shown in Table 5 and Table 6:

[0096] Table 5 Square resistance of 1200m polypropylene film at different positions on surface A and surface B

[0097] Coating position (m) 50 150 250 350 450 550 650 750 850 950 1050 1150 A side square resistance 22 21 21 20 22 22 22 22 22 21 20 19 B side square resistance 20 21 22 22 22 22 21 22 20 21 19 19

[0098] Table 6 Hole detection data of polypropylene film surface film

[0099]

[0100] It can be seen from Table 5 and Table 6 that, when the conductive roller 121 used in the present invention is used to electroplate a polypropylene film in the case of an auxiliary anode 124, the resistance of the film formed on the surface of the polypropylene film within a range of 1200 m is measured by a four-probe tester, and the square resistance uniformity of the polypropylene film surface A is 7.3%, and the square resistance uniformity of the polypropylene film surface B is 7.3%. The CCD camera is used to photograph the film formation on the surface of the polypropylene film within a range of 1200 m2 after the film is unfolded, and the total number of holes is 456, and the hole diameter in each interval is significantly reduced.

[0101] In summary, when the conductive roller 121 of the present invention is used (the cross section of the conductive roller 121 along its axial direction is an I-shaped cross section), the number of holes formed on the surface of the polypropylene film is significantly reduced, and the diameter of the holes in each interval is relatively small, indicating that during the electroplating process of the plated product 200, the phenomenon of copper re-plating or copper deposition on the conductive roller 121 has been weakened, the risk of the conductive film scratching the deposited film on the surface of the plated product 200 is reduced, and the coating quality of the plated product 200 is significantly improved. In addition, when the auxiliary anode 124 is provided, the current density in the middle of the conductive roller 121 is increased, which greatly improves the uniformity of the film formed on the surface of the plated product 200, and further improves the coating quality of the plated product 200.

[0102] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A conductive device for coating, configured in a coating machine, for electroplating a thin film on the surface of a coating product, the coating machine comprising a plurality of tensioning elements, the plurality of tensioning elements being evenly distributed on a conveying path of the coating product, characterized in that: include: A frame, wherein the frame is provided with a plating tank for containing a plating solution; Two conductive mechanisms, both of which are fixed on the frame and arranged opposite to each other along the depth direction of the plating tank, the conductive mechanisms comprising a conductive roller, a titanium basket, a rectifier and an auxiliary anode, the positive electrode of the rectifier is electrically connected to the titanium basket and the auxiliary anode, the negative electrode of the rectifier is electrically connected to the conductive roller, the titanium basket is at least partially immersed in the plating solution, one side of the conductive roller along the radial direction is immersed in the plating solution, and the other side is exposed outside the plating solution, the cross section of the conductive roller in the axial direction is I-shaped, the diameters of the two ends of the conductive roller are 5cm-20cm, and the middle position of the conductive roller is concave by 1cm-3cm compared with the end position; When the coated product passes through the conductive mechanism, one side of the coated product contacts one of the two conductive rollers, and the other side contacts the other conductive roller. During the electroplating process of the coated product, the middle part of the conductive roller contacts neither the plating solution nor the middle part of the coated product.

2. The conductive device for film coating according to claim 1, characterized in that: The diameters of the two ends of the conductive roller are 10 cm to 15 cm.

3. The conductive device for film coating according to claim 1, characterized in that: The conductive roller is a tubular structure with a hollow interior.

4. The conductive device for film coating according to claim 1, characterized in that: The conductive roller is made of 304 stainless steel or 316 stainless steel.

5. The conductive device for film coating according to claim 1, characterized in that: The auxiliary anode is made of titanium metal, and an iridium metal layer is evenly coated on its surface.

6. The conductive device for film coating according to claim 1, characterized in that: The two conductive mechanisms are arranged at intervals in the vertical direction.

7. A coating machine, characterized in that: It comprises an unwinding mechanism, a rewinding mechanism and a conductive device for coating as described in any one of claims 1 to 6, wherein the unwinding mechanism and the rewinding mechanism are both fixed on the frame and are arranged at intervals on the conveying path of the coating product.

8. The coating machine according to claim 7, characterized in that: It also includes a plurality of tensioning elements, which are all fixed on the frame and evenly distributed between the unwinding mechanism and the rewinding mechanism.

9. The coating machine according to claim 7, characterized in that: It also includes two spray elements, both of which are fixed on the frame, and the spray elements have spray ports, one of the two spray ports faces one of the two conductive rollers, and the other faces the other of the two conductive rollers.

10. The coating machine according to claim 7, characterized in that: It also includes a heating element, which is fixed on the frame.

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