A Multimodal Flexible Pressure Sensor and Its Manufacturing Method

Abstract

The present invention belongs to the technical field of sensors, and particularly relates to a multimodal flexible pressure sensor and a manufacturing method thereof, including a first flexible substrate, a piezoresistive flexible sensor, a piezoelectric flexible sensor, and a capacitive flexible sensor that are horizontally arranged or vertically overprinted on the first flexible substrate; the multimodal flexible pressure sensor of the present invention can simultaneously achieve wide-range, wide-frequency, and highly sensitive detection of dynamic / static mechanical information, and the manufacturing method of the present invention uses flexible additive manufacturing technology for integrated molding, overcoming the defects of currently splicing or attaching three independent piezoresistive sensors, piezoelectric sensors, and capacitive sensors together.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and particularly relates to a multimodal flexible pressure sensor and a manufacturing method thereof. Background Art

[0002] With the rapid development of flexible electronics technology, there are more and more application demands in the fields of smart wearables, human-computer interaction, medical health, consumer electronics, etc. Under the complex measurement environment and miscellaneous loading processes faced in these application fields, pressure detection requires the simultaneous measurement of static and dynamic forces, so as to more completely and accurately obtain the application situation of the external environmental mechanical parameters contacted by the sensor. The existing solutions mainly use single-modal sensors for measurement, or simply splice or attach multiple single-modal pressure sensors together, or prepare multiple single-modal sensitive materials through mixing or lamination. This solution cannot meet the requirements of new application scenarios for miniaturized, ultra-thin, integrated, and intelligent multimodal flexible pressure sensors. Summary of the Invention

[0003] The purpose of the present invention is to overcome the defect that the measurement parameters of single-modal pressure sensors in the prior art are limited, and provide a miniaturized, integrated, and ultra-thin multimodal flexible pressure sensor and a manufacturing method thereof, which can simultaneously realize the detection of multi-modal mechanical information such as dynamic / static, as well as the detection of the magnitude, rate, and direction of pressure or deformation in complex loading processes.

[0004] The technical solution adopted by the present invention to solve its technical problems is:

[0005] A multimodal flexible pressure sensor, characterized in that: a first flexible substrate, a piezoresistive flexible sensor, a piezoelectric flexible sensor, and a capacitive flexible sensor arranged horizontally or vertically printed on the first flexible substrate.

[0006] As a preferred embodiment, it further includes a second flexible substrate and a first flexible encapsulation layer. On the upper surface of the first flexible substrate, a piezoresistive first electrode layer, a piezoelectric first electrode layer, and a capacitive first electrode layer are arranged in parallel. A first piezoresistive sensitive material layer is arranged on the piezoresistive first electrode layer, a piezoelectric sensitive material layer is arranged on the piezoelectric first electrode layer, a capacitive sensitive material layer is arranged on the capacitive first electrode layer. A piezoelectric second electrode layer is printed on the upper surface of the piezoelectric sensitive material layer. A piezoresistive second electrode layer and a capacitive second electrode layer are printed on the lower surface of the second flexible substrate. A second piezoresistive sensitive material layer is printed on the piezoresistive second electrode layer. The upper and lower surfaces of the first flexible encapsulation layer are adhesively bonded to the upper surface of the first flexible substrate and the lower surface of the second flexible substrate respectively. The height of the first flexible encapsulation layer makes there be a gap between the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer.

[0007] As another preferred embodiment, it further includes a third flexible substrate, a first flexible cover layer, and a second flexible encapsulation layer. A piezoresistive first electrode layer and a piezoelectric first electrode layer are printed on the front surface of the first flexible substrate. A first piezoresistive sensitive material layer is disposed on the piezoresistive first electrode layer, and a piezoelectric sensitive material layer is disposed on the piezoelectric first electrode layer. A piezoelectric second electrode layer is printed on the upper surface of the piezoelectric sensitive material layer. A piezoresistive second electrode layer is disposed on the lower surface of the third flexible substrate, and a second piezoresistive sensitive material layer is disposed on the piezoresistive second electrode layer. The upper and lower surfaces of the second flexible encapsulation layer are respectively bonded to the upper surface of the first flexible substrate and the lower surface of the third flexible substrate. The height of the second flexible encapsulation layer provides a gap between the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer; A capacitive first electrode layer is printed on the lower surface of the first flexible substrate, a capacitive sensitive material layer is disposed on the lower surface of the capacitive first electrode layer, a capacitive second electrode layer is disposed on the capacitive sensitive material layer, and the capacitive second electrode layer is covered with the first flexible cover layer.

[0008] As a preferred embodiment, it further includes a fourth flexible substrate and a fifth flexible substrate. A capacitive first electrode layer is disposed on the fourth flexible substrate, and a third flexible encapsulation layer is pasted on the upper surface of the capacitive first electrode layer. A capacitive sensitive material layer is encapsulated in the third flexible encapsulation layer; A capacitive second electrode layer is disposed on the lower surface of the fifth flexible substrate, and the upper surface of the third flexible encapsulation layer is bonded to the capacitive second electrode layer; A piezoresistive first electrode layer is disposed on the upper surface of the fifth flexible substrate, a first piezoresistive sensitive material layer is disposed on the upper surface of the piezoresistive first electrode layer, a piezoresistive second electrode layer is disposed on the lower surface of the first flexible substrate, and a second piezoresistive sensitive material layer is disposed on the lower surface of the piezoresistive second electrode layer. A gap is formed between the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer through the support of the fourth flexible encapsulation layer; A piezoelectric first electrode layer is disposed on the upper surface of the first flexible substrate, a piezoelectric sensitive material layer is disposed on the upper surface of the piezoelectric first electrode layer, a piezoelectric second electrode layer is disposed on the upper surface of the piezoelectric sensitive material layer, and a second flexible cover layer is disposed on the surface of the piezoelectric second electrode layer.

[0009] As a preferred embodiment, the upper and lower surfaces of the fourth flexible encapsulation layer are respectively pasted to the lower surface of the first flexible substrate and the upper surface of the fifth flexible substrate.

[0010] As a preferred embodiment, the upper and lower surfaces of the fourth flexible encapsulation layer are respectively pasted to the edges of the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer.

[0011] The present invention also discloses a manufacturing method of a multimodal flexible pressure sensor, which is characterized by including the following steps:

[0012] S1. Simultaneously print a piezoresistive first electrode layer, a piezoelectric first electrode layer, and a capacitive first electrode layer on the upper surface of the first flexible substrate material;

[0013] S2. Fabricate a first piezoresistive sensitive material layer on the upper surface of the piezoresistive first electrode layer, a piezoelectric sensitive material layer on the upper surface of the piezoelectric first electrode layer, and a capacitive sensitive material layer on the upper surface of the capacitive first electrode layer;

[0014] S3. Print a piezoelectric second electrode layer on the piezoelectric sensitive material layer;

[0015] S4. Print a piezoresistive second electrode layer and a capacitive second electrode layer on the lower surface of the second flexible substrate material;

[0016] S5. Fabricate a second piezoresistive sensitive material layer on the lower surface of the piezoresistive second electrode;

[0017] S6. Paste the first flexible substrate and the second flexible substrate on the lower surface and the upper surface of the first flexible encapsulation layer respectively, so that there is a gap between the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer.

[0018] The present invention also discloses a manufacturing method of another multi-modal flexible pressure sensor, which is characterized by the following steps:

[0019] S1. Print a capacitive first electrode layer on the upper surface of the fourth flexible substrate;

[0020] S2. Fabricate an integrated capacitive sensitive material layer and encapsulate the capacitive sensitive material layer in the first flexible encapsulation layer;

[0021] S3. Print a capacitive second electrode layer on the lower surface of the fifth flexible substrate and a piezoresistive first electrode layer on the upper surface of the fifth flexible substrate;

[0022] S4. Print a first piezoresistive sensitive material layer on the upper surface of the piezoresistive first electrode layer, print a piezoresistive second electrode layer on the lower surface of the first flexible substrate, and print a second piezoresistive sensitive material layer on the piezoresistive second electrode layer;

[0023] S5. Print a piezoelectric first electrode layer on the upper surface of the first flexible substrate, print a piezoelectric sensitive material layer on the upper surface of the piezoelectric first electrode layer, and print a piezoelectric second electrode layer on the surface of the piezoelectric sensitive material layer;

[0024] S6. Print a second flexible covering layer on the surface of the piezoelectric second electrode layer;

[0025] S7. Bond the third flexible encapsulation layer to the upper surface of the fourth flexible substrate and the lower surface of the fifth flexible substrate respectively, and bond the fourth flexible encapsulation layer to the upper surface of the fifth flexible substrate and the lower surface of the first flexible substrate respectively, so that there is a gap between the first piezoresistive sensitive material layer and the second piezoresistive sensitive material layer.

[0026] The beneficial effects of a multimodal flexible pressure sensor and its manufacturing method of the present invention are as follows:

[0027] 1. By using flexible printing technology, a piezoresistive flexible sensor, a piezoelectric flexible sensor, and a capacitive flexible sensor are integrated together. The piezoresistive sensor is used to detect static or low-frequency pressure and pressure distribution signals, the piezoelectric sensor is used to achieve highly sensitive capture of dynamic pressure, and the capacitive sensor is used for highly sensitive and high-precision detection of transient force and vibration. Compared with a single piezoresistive sensor, piezoelectric sensor, or capacitive sensor, the multimodal flexible pressure sensor of the present invention can simultaneously achieve wide-range, wide-frequency, and highly sensitive detection of dynamic / static mechanical information.

[0028] 2. The multimodal flexible pressure sensor of the present invention is integrally formed by flexible additive manufacturing technology, overcoming the defects of currently splicing or attaching three independent piezoresistive sensors, piezoelectric sensors, and capacitive sensors together. At the same time, the multimodal flexible pressure sensor adopts a layered structure design, avoiding mutual interference of piezoresistive signals, piezoelectric signals, and capacitive signals, and overcoming the defects of hybrid or laminated preparation between the piezoresistive sensitive layer, piezoelectric sensitive layer, and capacitive sensitive layer. Description of the Drawings

[0029] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0030] Figure 1 is a schematic structural diagram of Embodiment 1 of the present invention;

[0031] Figure 2 is a top view of the first flexible substrate of Embodiment 1 of the present invention;

[0032] Figure 3 is a top view of the second flexible substrate of Embodiment 1 of the present invention;

[0033] Figure 4 is a schematic structural diagram of Embodiment 2 of the present invention;

[0034] Figure 5 is a schematic diagram of the mechanism of Embodiment 3 of the present invention;

[0035] Figure 6 is a schematic structural diagram of Embodiment 4 of the present invention.

[0036] In the figure: 1. First flexible substrate; 21. Piezoresistive first electrode layer; 22. First piezoresistive sensitive material layer; 23. Second piezoresistive sensitive material layer; 24. Piezoresistive second electrode layer; 31. Piezoelectric first electrode layer; 32. Piezoelectric sensitive material layer; 33. Piezoelectric second electrode layer; 41. Capacitive first electrode layer; 42. Capacitive sensitive material layer; 43. Capacitive second electrode layer; 5. Second flexible substrate; 6. First flexible encapsulation layer; 7. Third flexible substrate; 8. First flexible covering layer; 9. Second flexible encapsulation layer; 10. Fourth flexible substrate; 11. Fifth flexible substrate; 12. Second flexible covering layer; 13. Third flexible encapsulation layer; 14. Fourth flexible encapsulation layer. Detailed implementation manners

[0037] Now, the present invention will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention.

[0038] Since each layer in the embodiments of the present application is very thin, in order to express the structural relationship, the thickness of each layer structure is exaggerated in the drawings, which is only a schematic representation.

[0039] Embodiment 1

[0040] As Figures 1 - 3 shown in a specific embodiment of a multimodal flexible pressure sensor, a piezoresistive flexible sensor, a piezoelectric flexible sensor, and a capacitive flexible sensor are horizontally arranged on the first flexible substrate, and the horizontal arrangement order of the three is not limited, and the three are integrally formed.

[0041] The multimodal flexible pressure sensor of Embodiment 1 of the present invention further includes a second flexible substrate 5 and a first flexible encapsulation layer 6. The piezoresistive first electrode layer 21, the piezoelectric first electrode layer 31, and the capacitive first electrode layer 41 are arranged in parallel on the upper surface of the first flexible substrate 1. A first piezoresistive sensitive material layer 22 is provided on the piezoresistive first electrode layer 21, a piezoelectric sensitive material layer 32 is provided on the piezoelectric first electrode layer 31, a capacitive sensitive material layer 42 is provided on the capacitive first electrode layer 41. A piezoelectric second electrode layer 33 is printed on the upper surface of the piezoelectric sensitive material layer 32. A piezoresistive second electrode layer 24 and a capacitive second electrode layer 43 are printed on the lower surface of the second flexible substrate 5. A second piezoresistive sensitive material layer 23 is printed on the piezoresistive second electrode layer 24. The upper and lower surfaces of the first flexible encapsulation layer 6 are respectively bonded to the upper surface of the first flexible substrate 1 and the lower surface of the second flexible substrate 5. The height of the first flexible encapsulation layer 6 makes there be a gap between the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23.

[0042] In this embodiment, the first flexible encapsulation layer 6 may be a flexible encapsulation strip disposed around the outer circles of the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23.

[0043] Meanwhile, as another preferred embodiment, the first flexible encapsulation layer 6 may also be directly pasted on the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23, as long as it is ensured that part of the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23 are not in contact in the non-pressure state. The first flexible encapsulation layer 6 plays a supporting role on the one hand and a pasting and connecting role between the upper and lower layers on the other hand.

[0044] The manufacturing method of the multimodal pressure sensor in Embodiment 1 includes the following steps:

[0045] S1. Simultaneously print the piezoresistive first electrode layer 21, the piezoelectric first electrode layer 31, and the capacitive first electrode layer 41 on the upper surface of the first flexible substrate 1 material;

[0046] S2. Fabricate the first piezoresistive sensitive material layer 22 on the upper surface of the piezoresistive first electrode layer 21, fabricate the piezoelectric sensitive material layer 32 on the upper surface of the piezoelectric first electrode layer 31; fabricate the capacitive sensitive material layer 42 on the upper surface of the capacitive first electrode layer 41;

[0047] S3. Print the piezoelectric second electrode layer 33 on the piezoelectric sensitive material layer 32;

[0048] S4. Print the piezoresistive second electrode layer 24 and the capacitive second electrode layer 43 on the lower surface of the second flexible substrate 5 material;

[0049] S5. Fabricate the second piezoresistive sensitive material layer 23 on the lower surface of the piezoresistive second electrode;

[0050] S6. Paste the first flexible substrate 1 and the second flexible substrate 5 on the lower surface and the upper surface of the first flexible encapsulation layer 6 respectively; make there be a gap between the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23.

[0051] Embodiment 2

[0052] As another embodiment, the piezoresistive flexible sensor and the piezoelectric flexible sensor may also be disposed on the upper surface of the first flexible substrate 1, and the capacitive flexible sensor may be disposed on the lower surface of the first flexible substrate 1.

[0053] See Figure 4, the multimodal flexible pressure sensor further includes a third flexible substrate 7, a first flexible covering layer 8, and a second flexible encapsulation layer 9. A piezoresistive first electrode layer 21 and a piezoelectric first electrode layer 31 are printed on the front surface of the first flexible substrate 1. A first piezoresistive sensitive material layer 22 is disposed on the piezoresistive first electrode layer 21, and a first piezoelectric sensitive material layer 32 is disposed on the piezoelectric first electrode layer 31. A piezoresistive second electrode layer 24 and a piezoelectric second electrode layer 33 are disposed on the lower surface of the third flexible substrate 7. A second piezoresistive sensitive material layer 23 is disposed on the piezoresistive second electrode layer 24. The upper and lower surfaces of the second flexible encapsulation layer are adhesively bonded to the upper surface of the first flexible substrate 1 and the lower surface of the third flexible substrate 7 respectively. The height of the second flexible encapsulation layer 9 provides a gap between the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23; a capacitive first electrode layer 41 is printed on the lower surface of the first flexible substrate 1. A capacitive sensitive material layer 42 is disposed on the lower surface of the capacitive first electrode layer 41. A capacitive second electrode layer 43 is disposed on the capacitive sensitive material layer 42, and the capacitive second electrode layer 43 is covered with the first flexible covering layer 8.

[0054] As another preferred embodiment, any two of the piezoresistive flexible sensor, the piezoelectric flexible sensor, and the capacitive flexible sensor can be disposed on the front surface of the first flexible substrate, and the other sensor can be disposed on the back surface of the first flexible substrate.

[0055] Embodiment 3

[0056] See Figure 5 , the multimodal flexible pressure sensor of this embodiment further includes a fourth flexible substrate 10 and a fifth flexible substrate 11. A capacitive first electrode layer 41 is disposed on the fourth flexible substrate 10. A third flexible encapsulation layer 13 is adhesively bonded to the upper surface of the capacitive first electrode layer 41, and a capacitive sensitive material layer 42 is encapsulated within the third flexible encapsulation layer 13; a capacitive second electrode layer 43 is disposed on the lower surface of the fifth flexible substrate 11, and the upper surface of the third flexible encapsulation layer 13 is adhesively bonded to the capacitive second electrode layer 43; a piezoresistive first electrode layer 21 is disposed on the upper surface of the fifth flexible substrate 11. A first piezoresistive sensitive material layer 22 is disposed on the upper surface of the piezoresistive first electrode layer 21. A piezoresistive second electrode layer 24 is disposed on the lower surface of the first flexible substrate 1. A second piezoresistive sensitive material layer 23 is disposed on the lower surface of the piezoresistive second electrode layer 24. A gap is formed between the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23 through the support 14 of the fourth flexible encapsulation layer; a piezoelectric first electrode layer 31 is disposed on the upper surface of the first flexible substrate 1. A piezoelectric sensitive material layer 32 is disposed on the upper surface of the piezoelectric first electrode layer 31. A piezoelectric second electrode layer 33 is disposed on the upper surface of the piezoelectric sensitive material layer 32, and a second flexible covering layer 12 is disposed on the surface of the piezoelectric second electrode layer 33.

[0057] The upper and lower surfaces of the fourth flexible encapsulation layer 14 are respectively pasted to the lower surface of the first flexible substrate 1 and the upper surface of the fifth flexible substrate 11.

[0058] The manufacturing method of the multimodal flexible pressure sensor according to Embodiment 3 of the present invention includes the following steps:

[0059] S1. Print the first capacitor electrode layer 41 on the upper surface of the fourth flexible substrate 10;

[0060] S2. Fabricate the integrated capacitor sensitive material layer 42 and encapsulate the capacitor sensitive material layer 42 in the first flexible encapsulation layer 13;

[0061] S3. Print the second capacitor electrode layer 43 on the lower surface of the fifth flexible substrate 11; print the first piezoresistive electrode layer 21 on the upper surface of the fifth flexible substrate 11;

[0062] S4. Print the first piezoresistive sensitive material layer 22 on the upper surface of the first piezoresistive electrode layer 21; print the second piezoresistive electrode layer 24 on the lower surface of the first flexible substrate 1 and print the second piezoresistive sensitive material layer 23 on the second piezoresistive electrode layer 24;

[0063] S5. Print the first piezoelectric electrode layer 31 on the upper surface of the first flexible substrate 1, print the piezoelectric sensitive material layer 32 on the upper surface of the first piezoelectric electrode layer 31, and print the second piezoelectric electrode layer 33 on the surface of the piezoelectric sensitive material layer 32;

[0064] S6. Print the second flexible covering layer 12 on the surface of the second piezoelectric electrode layer 33;

[0065] S7. Bond the third flexible encapsulation layer 13 to the upper surface of the fourth flexible substrate 10 and the lower surface of the fifth flexible substrate 11 respectively, and bond the fourth flexible encapsulation layer 14 to the upper surface of the fifth flexible substrate 11 and the lower surface of the first flexible substrate 1 respectively, so that there is a gap between the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23.

[0066] Embodiment 4

[0067] As Figure 6 shown, different from Embodiment 3, the upper and lower surfaces of the fourth flexible encapsulation layer 14 are respectively pasted to the edges of the first piezoresistive sensitive material layer 22 and the second piezoresistive sensitive material layer 23.

[0068] The electrode layer of the multimodal flexible pressure sensor according to the embodiment of the present invention can be single-point type or array type.

[0069] The multimodal flexible pressure sensor of the present invention integrates a piezoresistive flexible pressure sensor, a piezoelectric flexible pressure sensor, and a capacitive flexible pressure sensor. The piezoresistive flexible pressure sensor is used to detect static or low-frequency pressure and pressure distribution signals. The piezoelectric flexible pressure sensor is used to achieve highly sensitive capture of dynamic pressure. The capacitive flexible pressure sensor is used for highly sensitive and high-precision detection of transient force and vibration. Compared with a single piezoresistive sensor, piezoelectric sensor, or capacitive sensor, the multimodal flexible pressure sensor of the present invention can simultaneously achieve wide-range, wide-frequency, and highly sensitive detection of dynamic / static mechanical information.

[0070] The multimodal flexible pressure sensor of the present invention is integrally formed by a flexible additive manufacturing technology, overcoming the defects of currently splicing or attaching three independent piezoresistive sensors, piezoelectric sensors, and capacitive sensors together. At the same time, this multimodal flexible pressure sensor adopts a hierarchical structure design, avoiding mutual interference between piezoresistive signals, piezoelectric signals, and capacitive signals, and overcoming the defects of hybrid or laminated preparation between the piezoresistive sensitive layer, piezoelectric sensitive layer, and capacitive sensitive layer.

[0071] It should be understood that the specific embodiments described above are only used to explain the present invention and are not used to limit the present invention. Obvious changes or variations derived from the spirit of the present invention are still within the protection scope of the present invention.

Claims

1. A multimodal flexible pressure sensor, characterized in that: The first flexible substrate (1), a piezoresistive flexible sensor, a piezoelectric flexible sensor, and a capacitive flexible sensor vertically overprinted on the first flexible substrate (1); further comprising a fourth flexible substrate (10) and a fifth flexible substrate (11), a capacitive first electrode layer (41) is provided on the fourth flexible substrate (10), a third flexible encapsulation layer (13) is pasted on the upper surface of the capacitive first electrode layer (41), and a capacitive sensitive material layer (42) is encapsulated in the third flexible encapsulation layer (13); a capacitive second electrode layer (43) is provided on the lower surface of the fifth flexible substrate (11), and the upper surface of the third flexible encapsulation layer (13) is bonded to the capacitive second electrode layer (43); a piezoresistive first electrode layer (21) is provided on the upper surface of the fifth flexible substrate (11), a first piezoresistive sensitive material layer (22) is provided on the upper surface of the piezoresistive first electrode layer (21), a piezoresistive second electrode layer (24) is provided on the lower surface of the first flexible substrate (1), a second piezoresistive sensitive material layer (23) is provided on the lower surface of the piezoresistive second electrode layer (24), and a gap is formed between the first piezoresistive sensitive material layer (22) and the second piezoresistive sensitive material layer (23) through the support of the fourth flexible encapsulation layer (14); a piezoelectric first electrode layer (31) is provided on the upper surface of the first flexible substrate (1), a piezoelectric sensitive material layer (32) is provided on the upper surface of the piezoelectric first electrode layer (31), a piezoelectric second electrode layer (33) is provided on the upper surface of the piezoelectric sensitive material layer (32), and a second flexible covering layer (12) is provided on the surface of the piezoelectric second electrode layer (33).

2. The multimodal flexible pressure sensor according to claim 1, wherein: The upper and lower surfaces of the fourth flexible encapsulation layer (14) are respectively pasted to the lower surface of the first flexible substrate (1) and the upper surface of the fifth flexible substrate (11).

3. The multimodal flexible pressure sensor according to claim 1, wherein: The upper and lower surfaces of the fourth flexible encapsulation layer (14) are respectively pasted to the edges of the first piezoresistive sensitive material layer (22) and the second piezoresistive sensitive material layer (23).

4. The manufacturing method of a multimodal flexible pressure sensor according to claim 1, wherein: Comprising the following steps: S1. Print the capacitive first electrode layer (41) on the upper surface of the fourth flexible substrate (10); S2. Fabricate an integrated capacitive sensitive material layer (42) and encapsulate the capacitive sensitive material layer (42) in the third flexible encapsulation layer (13); S3. Print the capacitive second electrode layer (43) on the lower surface of the fifth flexible substrate (11); print the piezoresistive first electrode layer (21) on the upper surface of the fifth flexible substrate (11); S4. Print the first piezoresistive sensitive material layer (22) on the upper surface of the piezoresistive first electrode layer (21); print the piezoresistive second electrode layer (24) on the lower surface of the first flexible substrate (1) and print the second piezoresistive sensitive material layer (23) on the piezoresistive second electrode layer (24); S5. Print the piezoelectric first electrode layer (31) on the upper surface of the first flexible substrate (1), print the piezoelectric sensitive material layer (32) on the upper surface of the piezoelectric first electrode layer (31), and print the piezoelectric second electrode layer (33) on the surface of the piezoelectric sensitive material layer (32); S6. Print a second flexible cover layer (12) on the surface of the piezoelectric second electrode layer (33); S7. Bond the third flexible encapsulation layer (13) to the upper surface of the fourth flexible substrate (10) and the lower surface of the fifth flexible substrate (11) respectively, and bond the fourth flexible encapsulation layer (14) to the upper surface of the fifth flexible substrate (11) and the lower surface of the first flexible substrate (1) respectively, so that there is a gap between the first piezoresistive sensitive material layer (22) and the second piezoresistive sensitive material layer (23).

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