A method for encapsulating a ceramic shell and the ceramic shell itself.

Abstract

This invention provides a method for encapsulating a ceramic housing and the ceramic housing itself. The method includes: providing a ceramic encapsulation base, the ceramic encapsulation base having a cavity for device encapsulation, and multiple preset areas at the bottom of the cavity; fabricating a low-resistance sheet with a shape matching the preset areas, wherein the thickness of the plating on the low-resistance sheet matches the plating thickness requirement of the preset areas; fixing the corresponding low-resistance sheet in the preset areas of the ceramic encapsulation base, and mounting and bonding the electronic components to be encapsulated; and sealing the ceramic encapsulation base with a cover plate. The ceramic housing encapsulation method provided by this invention has a simple manufacturing process and is easy to process.

Description

Technical Field

[0001] This invention relates to the field of ceramic shell packaging technology, and more particularly to a method for packaging a ceramic shell and a ceramic shell. Background Technology

[0002] System-in-package (SIP) refers to a packaging solution that integrates multiple functional wafers, such as processors and memory wafers, into a single package based on factors such as application scenario, packaging substrate, and number of layers, thereby achieving a basic and complete functional package.

[0003] Taking a power system-in-package (SoC) enclosure as an example, the cavity of a power system-in-package enclosure integrates bare chips or devices such as bonding control chips, MOSFETs, capacitors, and inductors, and features high integration and compact layout.

[0004] However, traditional packaging methods place high demands on the processing technology of the packaging shell. Different metal plating thicknesses are required for different functional areas such as bonding and soldering, making processing difficult. Furthermore, these shells are characterized by low voltage and high current; excessive resistance in the current transmission path can lead to insufficient voltage drop, increased power consumption, and reduced power conversion efficiency. Therefore, there is an urgent need for a packaging method using ceramic shells with a simple processing technology. Summary of the Invention

[0005] This invention provides a method for packaging a ceramic shell and a ceramic shell to solve the problem of complex packaging processes for ceramic shells.

[0006] In a first aspect, embodiments of the present invention provide a method for encapsulating a ceramic shell, comprising:

[0007] A ceramic packaging base is provided, wherein the ceramic packaging base has a cavity for device packaging, and a plurality of preset areas are provided at the bottom of the cavity;

[0008] A low-resistance sheet is fabricated to match the shape of the preset region. A coating is provided on the first surface of the low-resistance sheet, and the thickness of the coating matches the thickness requirement of the preset region for the coating. The low-resistance sheet includes a first surface and a second surface disposed opposite to each other.

[0009] The second surface of the low-resistance sheet is attached to a predetermined area of ​​the ceramic encapsulation base;

[0010] The electronic components to be packaged are mounted and bonded, and the ceramic package base is sealed with a cover plate.

[0011] In one possible implementation, the preset region includes: a current transmission path region for current transmission, and a plurality of metal plating preset regions for thickness transition.

[0012] Optionally, attaching the second surface of the low-resistance sheet to a predetermined area of ​​the ceramic packaging base includes:

[0013] The second surface of a low-resistance sheet with a matching shape and coating thickness is respectively attached to the current transmission path region and the preset region of the metal coating.

[0014] In one possible implementation, the mounting includes: welding or bonding the second surface of the low-resistance sheet to a predetermined area of ​​the ceramic package substrate with conductive adhesive.

[0015] In one possible implementation, the low-resistivity sheet is made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper; the plating is composed of one or more materials selected from nickel or gold.

[0016] This invention provides a method for encapsulating a ceramic housing. First, a ceramic encapsulation base is provided, comprising a cavity for device encapsulation. Multiple preset areas are located at the bottom of the cavity. Then, a low-resistance sheet matching the shape of each preset area is fabricated, and the thickness of the plating on the first surface of the low-resistance sheet matches the thickness requirement of the metal plating in the preset areas. Next, the corresponding low-resistance sheet is mounted on the preset areas of the ceramic encapsulation base, and the electronic components to be encapsulated are mounted and bonded. Finally, the ceramic encapsulation base is sealed with a cover plate. Therefore, for areas requiring metal plating of different thicknesses within the cavity of the encapsulation base, traditional complex plating processes cannot be used. Instead, without complicated procedures, the second surface of a pre-fabricated low-resistance sheet matching the shape and thickness of the preset areas can be directly fixed to the preset areas, simplifying the manufacturing process.

[0017] Secondly, embodiments of the present invention provide a ceramic housing, comprising: a ceramic encapsulation base, a sealing ring, and a cover plate;

[0018] The ceramic packaging base has a cavity for device packaging. At the bottom of the cavity of the ceramic packaging base, there are multiple preset areas. A pre-made low-resistance sheet that matches the shape of the preset area is fixed in the preset area. A coating is provided on the first surface of the low-resistance sheet, and the thickness of the coating matches the thickness requirement of the preset area for the low-resistance sheet. The second surface is attached to the preset area. The low-resistance sheet includes a first surface and a second surface that are disposed opposite to each other.

[0019] In one possible implementation, the ceramic packaging base cavity is further provided with bonding fingers for device bonding, and the bottom surface of the ceramic packaging base is provided with pads corresponding to the bonding fingers and the preset area.

[0020] In one possible implementation, the preset area includes: a current transmission path area and multiple preset areas for metal plating for thickness transition.

[0021] In one possible implementation, the low-resistivity layer is made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper; the plating layer is composed of one or more materials selected from nickel or gold.

[0022] In one possible implementation, the second surface of the low-resistance sheet is welded or bonded to the predetermined area using conductive adhesive.

[0023] This invention provides a ceramic housing by fixing a pre-made low-resistance sheet within a preset area, wherein the thickness of the plating layer on the first surface of the low-resistance sheet matches the thickness requirement of the metal plating layer in the preset area, and then mounting and bonding electronic components inside the cavity, thereby realizing a ceramic packaging housing with simple manufacturing process and convenient processing, which facilitates mass production and reduces costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional structural diagram of a ceramic packaging base provided in an embodiment of the present invention;

[0026] Figure 2 yes Figure 1 A bottom view of the ceramic packaging base shown.

[0027] Figure 3 yes Figure 1 A top view of the ceramic packaging base shown.

[0028] Figure 4 These are schematic diagrams of three low-resistivity thin-film structures provided in embodiments of the present invention;

[0029] Figure 5 This is a side view of the second low-resistivity sheet provided in an embodiment of the present invention.

[0030] In the figure, 10-ceramic shell, 11-ceramic packaging base, 12-cavity, 13-low resistance sheet, 14-pad, 15-first preset area, 16-second preset area, 17-third preset area, 18-sealing ring, 21-first low resistance sheet, 22-second low resistance sheet, 23-third low resistance sheet. Detailed Implementation

[0031] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0032] To make the objectives, technical solutions, and advantages of the present invention clearer, specific embodiments will be described below in conjunction with the accompanying drawings.

[0033] As described in the background section, different types of chips and electronic components need to be integrated into the ceramic cavity of a power system-in-package (PSP) enclosure. Due to the miniaturization requirements of PSP enclosures, the internal layout must be compact, which places high demands on the assembly process and makes the processing technology of the ceramic enclosure increasingly complex. Traditional methods require different metal plating thicknesses for different functional zones and result in excessively high resistance in the current transmission path, which cannot meet the needs of today's ceramic enclosures. Therefore, there is an urgent need for a ceramic enclosure packaging method with a simple processing technology.

[0034] To address the aforementioned problems, this invention provides a method for encapsulating a ceramic shell and a ceramic shell. The encapsulation method for the ceramic shell will be described below.

[0035] A method for encapsulating a ceramic housing, comprising:

[0036] S110 provides a ceramic encapsulation base.

[0037] The ceramic packaging base has a cavity for device packaging, and multiple preset areas are provided at the bottom of the cavity.

[0038] The ceramic housing includes a ceramic packaging base, a sealing ring, and a cover plate. The ceramic packaging base is a ceramic body with a cavity; bonding fingers are provided on the upper edge of the ceramic packaging base for bonding with electronic components.

[0039] The preset areas include current transmission path areas for current transmission and multiple preset areas for thickness transition of metal plating. As pointed out in the background art, since different functional areas such as bonding and soldering require different metal plating thicknesses, and excessive resistance of the current transmission path will cause the voltage drop to fail to meet the requirements and increase power consumption, the shape and thickness of all preset areas are planned and calculated before mounting electronic components for metal plating of different thicknesses and current transmission path areas.

[0040] S120. A low-resistance sheet is made that matches the shape of the preset area, and a coating is provided on the first surface of the low-resistance sheet, and the thickness of the coating matches the thickness requirement of the preset area for the coating.

[0041] The low-resistance sheet includes a first surface and a second surface that are disposed opposite to each other.

[0042] Specifically, the low-resistivity sheet is made of one or more of the following materials: oxygen-free copper, molybdenum copper, or tungsten copper. Of course, other low-resistivity metals can also be used according to user requirements, as long as the user's needs are met.

[0043] The shape of the low-resistivity sheet matches the shape of the preset area, meaning that different shapes of low-resistivity sheets can be fabricated for different preset areas. A plating layer is provided on the first surface of the low-resistivity sheet, which is composed of one or more materials selected from nickel and gold. Furthermore, the thickness of the plating layer matches the thickness requirements of the preset area.

[0044] The pre-fabricated low-resistance sheet can be made using any process, the manufacturing process is simple, it is not affected by the small size of the ceramic shell, and it can be mass-produced, which is convenient for processing and has a low cost.

[0045] By preparing a coating on the first surface of a low-resistance sheet that meets the requirements for the thickness of the metal coating within a preset area, and since the thickness of the low-resistance sheet is negligible, the second surface of the low-resistance sheet can be directly mounted on the preset area to meet the requirements for different metal coating thicknesses within the preset area, without having to directly fabricate metal coatings of different thicknesses within the preset area of ​​the ceramic encapsulation cavity. This simplifies the process and allows for direct mass production.

[0046] S130. The second surface of the low-resistance thin film is mounted on a preset area of ​​the ceramic package base.

[0047] Because there are multiple different preset areas, low-resistance sheets of the corresponding shape and thickness need to be applied sequentially to each preset area.

[0048] In some embodiments, a low-resistance current-carrying sheet with a shape matching the current-carrying path region is fixed in the current-carrying path region, and the thickness of the plating on the first surface of the low-resistance current-carrying sheet matches the thickness requirement of the current-carrying metal plating in the current-carrying path region. By fabricating a low-resistance current-carrying sheet with a shape and thickness matching the current-carrying path region, and fixing the low-resistance current-carrying sheet in this region, the problems of traditional packaging shells having low voltage and high current characteristics, excessive resistance in the current-carrying path causing voltage drop that does not meet the requirements of the packaging shell and increasing power consumption, reducing power conversion efficiency, and traditional packaging methods being unable to reduce the resistance of the current-carrying path, with post-packaging performance mainly depending on the shell, making it difficult to meet current-carrying requirements of 10A and above. However, by fixing the second surface of the low-resistance sheet to the current-carrying path region, the low-resistance sheet can directly serve as the current-carrying path, thereby reducing the resistance of the current-carrying path without forming a large voltage drop, reducing power consumption, improving power conversion efficiency, and meeting current-carrying requirements of 20A and above.

[0049] A low-resistance thickness adapter sheet, matching the shape of the pre-defined metal plating area, is fixed within the thickness-adjusting metal plating area. The thickness of the plating on the first surface of the low-resistance thickness adapter sheet matches the thickness requirement of the metal plating area for the sheet. The pre-defined metal plating area can be any of multiple pre-defined metal plating areas for thickness adjustment. The second surface of this low-resistance thickness adapter sheet is directly welded to the corresponding area within the cavity of the ceramic packaging base. Through this transition using the low-resistance thickness adapter sheet, the ceramic shell no longer needs to be plated with different metal plating thicknesses, reducing the processing difficulty of the ceramic shell. The transition using the low-resistance sheet reduces the number of processing steps for the ceramic shell, lowers processing difficulty, improves processing efficiency, and facilitates mass production.

[0050] In some embodiments, the second surface of the low-resistance sheet is welded to a predetermined area on all ceramic package bases, and welding can effectively reduce the resistance of the predetermined area.

[0051] In some embodiments, the second surface of the low-resistance sheet may also be bonded to a predetermined area of ​​the ceramic package base with conductive adhesive.

[0052] S140. Finally, seal the ceramic encapsulation base with a cover plate.

[0053] After mounting low-resistance films in multiple preset areas, pre-packaged electronic components can be mounted inside the cavity. After mounting the electronic components, they are bonded to the bonding fingers to form an electrical connection.

[0054] The already bonded ceramic encapsulation base and cover plate are sealed to complete the production of the ceramic shell.

[0055] The packaging method provided in this invention firstly involves providing a ceramic packaging base, wherein the ceramic packaging base has a cavity for device packaging, and multiple preset areas are provided at the bottom of the cavity. Then, a low-resistance sheet matching the shape of the preset areas is fabricated, and the thickness of the plating layer on the first surface of the low-resistance sheet matches the thickness requirement of the preset areas. Next, the second surface of the low-resistance sheet is fixed to the preset areas of the ceramic packaging base, and the electronic components to be packaged are mounted and bonded. Finally, the ceramic packaging base is sealed with a cover plate. Therefore, for areas requiring metal plating of different thicknesses within the cavity of the packaging base, traditional complex plating processes cannot be used. Instead, without complicated procedures, a pre-fabricated low-resistance sheet matching the shape and thickness of the preset areas can be directly fixed to the preset areas, simplifying the manufacturing process.

[0056] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0057] On the other hand, the present invention also provides a ceramic housing, comprising: a ceramic encapsulation base, a sealing ring, and a cover plate.

[0058] The ceramic packaging base has a cavity for device packaging. Multiple preset areas are located at the bottom of the cavity. A pre-fabricated low-resistance sheet, matching the shape of the preset area, is fixed within each preset area. A plating layer is applied to the first surface of the low-resistance sheet, the thickness of which matches the thickness requirement of the preset area. A second surface is mounted on the preset area. The low-resistance sheet includes a first surface and a second surface arranged opposite to each other.

[0059] In some embodiments, the preset area includes: a current transmission path area and multiple preset areas for metal plating for thickness transition.

[0060] The second surface of the low-resistance sheet is welded or bonded to the predetermined area using conductive adhesive. The low-resistance layer is made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper.

[0061] In some embodiments, the cavity of the ceramic packaging base is further provided with bonding fingers for device bonding, and the bottom surface of the ceramic packaging base is provided with pads corresponding to the bonding fingers and the preset area.

[0062] Specifically, the low-resistivity layer is made of one or more of oxygen-free copper, molybdenum copper, or tungsten copper; the plating layer is composed of one or more of nickel or gold.

[0063] Please refer to the above as well. Figures 1-5 A ceramic housing 10 includes: a ceramic packaging base 11, a sealing ring 18, and a cover plate. The ceramic packaging base 11 includes a cavity 12 for packaging electronic components and bonding fingers for bonding. The lower surface of the ceramic packaging base is provided with pads 15 that are electrically connected to the bonding fingers. The cover plate and bonding fingers are not shown in the figure.

[0064] Multiple preset areas are provided at the bottom of the cavity 12 of the ceramic encapsulation base 11, such as... Figure 3 As shown, there are multiple preset regions, including a first preset region 15, a second preset region 16 and a third preset region 17, wherein the first preset region 15 and the third preset region 17 are metal plating regions with different preset thicknesses, and the second preset region 16 is a current transmission path region.

[0065] Based on the shapes of the first preset region 15, the second preset region 16, and the third preset region 17, and the preset metal plating thickness of each preset region, three different low-resistance sheets corresponding to the first preset region 15, the second preset region 16, and the third preset region 17 are fabricated, namely, the first low-resistance sheet 21, the second low-resistance sheet 22, and the third low-resistance sheet 23. Each of the three low-resistance sheets includes a first surface and a second surface arranged opposite to each other, and the first surface of each of the three low-resistance sheets is provided with a plating layer, while the second surface is attached to the cavity 12.

[0066] Specifically, the three low-resistance sheets are made according to the shape of three different preset regions and the thickness of the matching coating. That is, the coating thickness of the first low-resistance sheet 21 matches the thickness of the preset metal coating area of ​​the first preset region 15, the coating thickness of the second low-resistance sheet 22 matches the thickness of the preset metal coating area of ​​the second preset region 16, and the coating thickness of the third low-resistance sheet 23 matches the thickness of the preset metal coating area of ​​the third preset region 17.

[0067] The first preset region 15 and the third preset region 17 are metal plating areas with different preset thicknesses, thus satisfying the different metal plating thicknesses for different functional areas such as bonding and welding. Through the connection between the first low-resistance sheet 21 and the third low-resistance sheet 23, the outer shell body no longer needs to be plated with metal plating of different thicknesses, reducing the processing difficulty of the outer shell.

[0068] The second preset area 16 is the current transmission path area, which can reduce the resistance on the current transmission path of the casing. The coating on the second low-resistance sheet 22 can be directly used as the current transmission path, which can effectively reduce the transmission resistance of the casing and meet the current transmission requirements of 20A or more.

[0069] The first low-resistivity sheet 21, the second low-resistivity sheet 22, and the third low-resistivity sheet 23 are all made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper. The plating on the first low-resistivity sheet 21, the second low-resistivity sheet 22, and the third low-resistivity sheet 23 is made of one or more materials selected from nickel and gold. Of course, users can also use other metals with low resistivity for welding as needed.

[0070] The second surfaces of the first low-resistance sheet 21, the second low-resistance sheet 22, and the third low-resistance sheet 23 are respectively attached to the first preset area 15, the second preset area 16, and the third preset area 17, respectively, by welding or bonding with conductive adhesive. Since the resistance is relatively high when bonding with conductive adhesive, welding is the preferred fixing method.

[0071] After fixing the first low-resistance sheet 21, the second low-resistance sheet 22, and the third low-resistance sheet 23 to the first preset region 15, the second preset region 16, and the third preset region 17 respectively, electronic components can be mounted inside the cavity of the packaging base. Then, the electronic components are bonded to the bonding fingers on the surface of the packaging base to achieve electrical connection. Finally, sealing the cover plate with the packaging base completes the encapsulation of the ceramic shell.

[0072] The ceramic shell provided in this invention achieves a simple and convenient ceramic packaging shell by fixing a pre-made low-resistance sheet in a preset area, and then mounting and bonding electronic components in the cavity, which facilitates mass production and reduces costs.

[0073] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for encapsulating a ceramic shell, characterized in that, include: A ceramic packaging base is provided, the ceramic packaging base having a cavity for device packaging, and a plurality of preset regions being provided at the bottom of the cavity; wherein, the preset regions include: a current transmission path region for current transmission, and a plurality of metal plating preset regions for thickness transition. A low-resistance sheet is fabricated to match the shape of the preset region. A coating is provided on the first surface of the low-resistance sheet, and the thickness of the coating matches the thickness requirement of the preset region for the coating. The low-resistance sheet includes a first surface and a second surface disposed opposite to each other. The second surface of a low-resistance sheet with a matching shape and coating thickness is respectively attached to the current transmission path region and the preset region of the metal coating. The electronic components to be packaged are mounted and bonded, and the ceramic package base is sealed with a cover plate.

2. The method as described in claim 1, characterized in that, The mounting process includes welding or bonding the second surface of the low-resistance sheet to a predetermined area of ​​the ceramic encapsulation base with conductive adhesive.

3. The method as described in claim 1, characterized in that, The low-resistivity sheet is made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper; the plating layer is composed of one or more materials selected from nickel and gold.

4. A ceramic shell, characterized in that, include: Ceramic encapsulation base, sealing ring, and cover plate; The ceramic packaging base has a cavity for device packaging. Multiple preset areas are located at the bottom of the cavity. A pre-fabricated low-resistance sheet matching the shape of the preset area is fixed within each preset area. A plating layer is provided on the first surface of the low-resistance sheet, and the thickness of the plating layer matches the thickness requirement of the preset area. A second surface is attached to the preset area. The low-resistance sheet includes a first surface and a second surface arranged opposite to each other. Each preset area includes a current transmission path area and multiple preset areas for thickness transition using metal plating. The ceramic packaging base is provided with bonding fingers for device bonding inside its cavity, and with pads corresponding to the bonding fingers and the preset area on the bottom surface of the ceramic packaging base.

5. The ceramic shell as described in claim 4, characterized in that, The low-resistivity sheet is made of one or more materials selected from oxygen-free copper, molybdenum copper, or tungsten copper; the plating is composed of one or more materials selected from nickel and gold.

6. The ceramic shell as described in claim 4, characterized in that, The second surface of the low-resistance sheet is welded or bonded to the preset area using conductive adhesive.

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