Carrier tapes and related methods for microelectronic devices

Abstract

This application relates to carrier tapes for microelectronic devices and related methods. A carrier tape for a microelectronic device may comprise an elongated tape body including recesses. The size, shape, and position of the recesses are configured to accommodate a corresponding microelectronic device therein. The coefficient of thermal expansion of the tape body material and the construction of the portion of the tape body adjacent to the recesses allow the tape body to expand in response to an increase in temperature, thereby enlarging at least one dimension of the recesses surrounded by the temperature-increased portion of the tape body. This expansion and enlargement allows the recesses to accommodate the microelectronic device, and in response to a decrease in temperature in the portion, allows the recesses to contract, causing at least two opposing surfaces of the tape body adjacent to the recesses to contact and hold the microelectronic device.

Description

[0001] Priority requirements

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 119,946, filed on December 1, 2020, entitled “Carrier Tapes for Microelectronic Devices and Related Methods”. Technical Field

[0003] This disclosure generally relates to carrier tapes and related methods for storing microelectronic devices, such as semiconductor dies, on reels for transport and for use with pick-and-place devices. More specifically, this disclosure relates to carrier tapes that reduce the likelihood of damage to microelectronic devices during removal from the carrier tape, require less material and resources for temporary storage of microelectronic devices on the carrier tape, and improve the accuracy of the pick-and-place process during removal of semiconductor dies from the carrier tape. Background Technology

[0004] When placing a microelectronic device, such as a semiconductor die, onto another component, such as another semiconductor die, a wafer, or other semiconductor substrate, interposer, or printed circuit board (PCB), the semiconductor die can be mounted in a tape-and-roll configuration on a carrier tape having other longitudinally spaced semiconductor dies. For example, the semiconductor die can be housed in recesses or gaps in the carrier tape and can be conventionally held in these recesses or gaps using an adhesive material. An optional flexible cover tape can be used to cover the recesses or gaps on one or more sides of the carrier tape and can provide a surface with an adhesive. The carrier tape with the semiconductor die adhered to it can be wound onto a reel together with the optional cover tape for storage, transport, etc. When it is time to pick up or place the semiconductor die, the optional cover tape can be removed, and the semiconductor die can be lifted from the recesses or gaps (e.g., using a pick-and-place device) to place and secure it onto another component. Such tape and reel assemblies can be used for the transport and handling of so-called "Known Good Dies" (KGDs), which are semiconductor dies that have been tested and qualified (i.e., characterized) to determine suitability for a particular application, such as a memory device comprising multiple stacked memory dies. Summary of the Invention

[0005] In some embodiments, a carrier tape for a microelectronic device may comprise an elongated tape body with recesses. The size, shape, and position of the recesses are configured to accommodate a corresponding microelectronic device within the respective recess. The coefficient of thermal expansion of the tape body material and the construction of the portion of the tape body adjacent to the recess allow the tape body material to expand in response to an increase in the temperature of the tape body, thereby increasing at least one dimension of the recess surrounded by the portion of the tape body that has increased in temperature. This expansion and increase allows the recess to accommodate the microelectronic device, and in response to a decrease in the temperature of that portion, allows the recess to contract and allow at least two opposing surfaces of the adjacent recess of the tape body to contact and hold the microelectronic device.

[0006] In other embodiments, a method of storing a microelectronic device on a carrier tape may include heating a portion of the carrier tape from a contracted state to an expanded state, such that at least one recess in the carrier tape expands in at least one dimension to accommodate the microelectronic device. The microelectronic device may be at least partially placed within the at least one recess. The portion of the carrier tape may be cooled (e.g., actively or passively) to cause the at least one recess to contract in the at least one dimension and secure the microelectronic device placed therein, with the portion of the carrier tape adjacent to the recess.

[0007] In other embodiments, the method of processing a microelectronic device may include: in response to heating at least a portion of a carrier tape including the at least some recesses, expanding at least some of the recesses of the carrier tape from a contracted state to an expanded state, such that: at least one surface of the carrier tape defining a corresponding recess among the at least some recesses disengages from contact with the microelectronic device located within the corresponding recess among the at least some recesses. The microelectronic device can then be removed from the corresponding recess among the at least some recesses. Attached Figure Description

[0008] Although this disclosure concludes with claims that particularly point out and expressly claim protection for particular embodiments, various features and advantages of embodiments within the scope of this disclosure can be more readily identified from the following description when read in conjunction with the accompanying drawings. In the drawings:

[0009] Figure 1 This is a cross-sectional side view of a portion of a carrier belt according to this disclosure;

[0010] Figure 2 This is a cross-sectional side view of a portion of another embodiment of a carrier belt;

[0011] Figure 3 This is a cross-sectional side view of a portion of another embodiment of a carrier belt;

[0012] Figure 4 This is a cross-sectional side view of a portion of another embodiment of a carrier belt;

[0013] Figure 5 This is a cross-sectional side view of a portion of another embodiment of a carrier belt;

[0014] Figure 6 This is a top view of a portion of a carrier tape according to this disclosure;

[0015] Figure 7 This is a top view of a portion of another embodiment of a carrier tape;

[0016] Figure 8 This is a flowchart of a method of using a carrier tape according to the present disclosure;

[0017] Figure 9 yes Figure 8 A schematic diagram of the behavior side view section in the method;

[0018] Figure 10 yes Figure 8 A side view cross-sectional diagram of another behavior in the method;

[0019] Figure 11 This is a perspective view of the spool used to support the carrier tape;

[0020] Figure 12 This is a flowchart of a method of using a carrier tape according to the present disclosure; and

[0021] Figure 13 yes Figure 12 A side-view cross-sectional diagram of the behavior in the method. Detailed Implementation

[0022] The illustrations presented in this disclosure are not intended to be actual views of any particular carrier tape, reel, semiconductor die or other microelectronic device, chuck, pick-and-place device or component thereof, but are merely idealized representations for describing illustrative embodiments. Therefore, the drawings are not necessarily drawn to scale.

[0023] The disclosed embodiments generally relate to carrier tapes that reduce the likelihood of damage to microelectronic devices, such as semiconductor dies, during removal from the carrier tape. They require less material and resources to store semiconductor dies on the carrier tape and improve the accuracy of the pick-and-place process during removal. More specifically, embodiments of carrier tapes for temporarily storing semiconductor dies are disclosed, which utilize temperature-induced expansion and contraction rather than adhesive materials to temporarily hold the semiconductor die in recesses within the carrier tape. For example, the shapes of the carrier tape and the recesses disclosed herein can hold the semiconductor die in the recesses through friction between the contact surfaces of the carrier tape and the semiconductor die or protruding features superimposed on the surface of the semiconductor die.

[0024] As used herein, the terms “approximately” and “about” with respect to a given parameter, property, or condition mean and include to some extent that, as will be understood by one of ordinary skill in the art, a given parameter, property, or condition satisfies a degree of variation, such as within acceptable manufacturing tolerances. For example, a parameter that is approximately or about a specified value could be at least about 90%, at least about 95%, at least about 99%, or even at least about 99.9% of the specified value.

[0025] As used herein, the term “recess” in the context of a carrier or belt includes not only a cavity with sidewalls and a bottom surface, but also a slot or gap with only sidewalls that extends completely through the carrier or belt.

[0026] Figure 1 This is a cross-sectional side view of a portion of a carrier tape 100 according to the present disclosure. The carrier tape 100 may comprise, for example, a strip or sheet material having at least one recess 102 extending from a first main surface 104 of the carrier tape 100 to a second main surface 106 of the carrier tape 100. More specifically, the carrier tape 100 may comprise a series or pattern of equally spaced recesses 102 distributed along the longitudinal length of the carrier tape 100, at least some of the recesses 102 being sized, shaped, and positioned to support corresponding semiconductor dies therein. In some embodiments, such as Figure 1 In the illustrated embodiment, the second main surface 106 may be at least substantially continuous along at least the entire longitudinal length of the carrier tape 100, and the first main surface 104 may be discontinuous, with the interruption in the first main surface 104 formed at least by the opening of the recess 102. This configuration may represent certain processes for forming the carrier tape 100 according to the present disclosure, such as injection molding or extrusion processes, followed by material removal processes (e.g., machining, milling, laser drilling, etching).

[0027] At least some of the recesses 102 are sized, shaped, and positioned to support a corresponding semiconductor die therein. In some embodiments, a recess 102 may include a bottom surface 108 and two or more side surfaces 110, the bottom surface 108 being positioned to contact and support a main surface of the semiconductor die, and the side surfaces 110 being positioned to contact and form a friction fit with a corresponding side surface of the semiconductor die when the respective recess is in a contracted state. More specifically, the bottom surface 108 and the side surfaces 110 may define a recess 102 that is generally rectangular prism-shaped, the size of which is configured to allow a semiconductor die (e.g., with a clearance fit) to enter the recess 102 when the recess 102 is in an expanded state, and to contact at least some portions of some side surfaces of the semiconductor die (e.g., with an interference fit) such that when the recess 102 is in a contracted state, the semiconductor die is temporarily secured in the recess 102.

[0028] The tolerances in the dimensions and shape of the recesses 102, as well as the coefficient of thermal expansion (CTE) of the material of the carrier tape 100, allow the recesses 102 to behave in response to heat applied to the carrier tape 100 closest to each recess 102, expanding to accommodate the corresponding semiconductor die, and contracting in response to heat dissipation to contact the corresponding semiconductor die accommodated in that recess 102. For example, the specific dimensions and shape of the recesses 102 may be the same as the average dimensions and shape or specific dimensions and shape of the semiconductor dies expected to be accommodated in the recesses 102, with specific tolerances for the recesses 102 being less than the extent of expansion and contraction achieved in response to heating and subsequent heat dissipation. More specifically, the tolerances in the dimensions and shape of the recesses 102 may be between about 25% and about 50% of the extent of expansion and contraction achieved by the length and width of a given recess in response to a given amount of heating and subsequent heat dissipation. As a specific, non-limiting example, the size and shape tolerances of the recess 102 may be between about + / -20 micrometers and about + / -35 micrometers (e.g., about + / -25 micrometers, about + / -30 micrometers), and the degree of expansion and contraction in response to heat and subsequent heat dissipation may be between about 60 micrometers and about 80 micrometers (e.g., about 70 micrometers).

[0029] The coefficient of thermal expansion (CTE) of the material of carrier tape 100 may, for example, be about 3 or greater. More specifically, the coefficient of thermal expansion (CTE) of the material of carrier tape 100 may, for example, be between about 5 and about 80. As a specific, non-limiting example, the coefficient of thermal expansion (CTE) of the material of carrier tape 100 may be between about 10 and about 70 (e.g., 12, 15, 18, 20, 25). The material of carrier tape 100 may be, for example, a polymer, a metal, a metal alloy, or a composite material. In some embodiments, materials conventionally used for carrier tapes may be used to form carrier tape 100 according to this disclosure. As a specific, non-limiting example, the material of carrier tape 100 may be polystyrene carbonate, such as that provided by Advantek of Eden Prairie, Minnesota. The material used in the carrier tape. All surfaces of the carrier tape 100 may be completely free of adhesive material, particularly the surfaces defining the recesses 102, such as the bottom surface 108 and the side surfaces 110. The carrier tape 100 can hold the semiconductor die within the corresponding recesses 102 by forces other than adhesive forces. More specifically, Figure 1 , Figure 2 and Figure 3 The illustrated embodiment of the carrier tape 100 may utilize the frictional force between one or two pairs of opposing side surfaces 110 defining recesses 102. In other embodiments of the carrier tape according to this disclosure, for example... Figure 4 and Figure 5 The carrier tape shown in the diagram allows mechanical interference to keep the semiconductor die within its associated recess.

[0030] In conventional implementations of carrier tapes used for temporary storage of semiconductor dies, adhesive materials are typically used to secure and hold the semiconductor die within a recess in the carrier tape. When attempting to remove the semiconductor die from its recess using the pick-and-place head of a pick-and-place device, the adhesive forces between the lower surfaces of the semiconductor die adhered to the bottom surface 108 of the recess containing the die can induce stress within the semiconductor die in response to the upward force of the pick-and-place head. For example, since the adhesive portions of the die (e.g., peripheral portions) can exhibit stronger adhesion than the central portions, the resistance of the adhesive material to the adhesive forces between the semiconductor die surfaces facing the bottom surface of the recess can induce uneven stress within the semiconductor die when the semiconductor die is removed from the recess. This phenomenon becomes more pronounced as semiconductor dies become thinner (e.g., approximately 60 to 65 μm thick), and since semiconductor dies with a thickness of approximately 50 μm are already commercialized, this has become a significant issue in terms of yield, and it is expected to severely impact yield as dies with thicknesses approaching approximately 30 μm or less (currently under development) enter the market.

[0031] The inventors of this paper have discovered that, in some cases, during removal from a recess, tension, bending, or both stresses induced in the semiconductor die adhered to the recess surface can damage the semiconductor die by, for example, forming or propagating microcracks or fissures in the die material. As mentioned above, thinner semiconductor dies are more prone to breakage and damage, and this damage itself may not be apparent unless the die is assembled into a higher-level package assembly for testing or operation. By eliminating the adhering material and modifying the carrier tape and the technique used in using the carrier tape, the carrier tape according to this disclosure reduces the likelihood of damage to semiconductor dies, including thin semiconductor dies, during removal from the carrier tape and provides other benefits.

[0032] In summary, a carrier tape for a microelectronic device may comprise an elongated tape body with recesses. The size, shape, and position of the recesses are configured to accommodate a corresponding microelectronic device within the respective recess. The coefficient of thermal expansion of the tape body material and the construction of the portion of the tape body adjacent to the recess allow the tape body material to expand in response to an increase in the temperature of the tape body, thereby increasing the size of at least one dimension of the recess surrounded by the portion of the tape body that has increased in temperature. This expansion and increase allows the recess to accommodate the microelectronic device, and in response to a decrease in the temperature of that portion, allows the recess to contract and allow at least two opposing surfaces of the adjacent recess of the tape body to contact and hold the microelectronic device.

[0033] Figure 2 This is a cross-sectional side view as part of another embodiment of the carrier belt 200. Figure 1 The carrier tape is the same as 100. Figure 2The carrier tape 200 shown may comprise, for example, a strip or sheet material having at least one recess 202 extending from a first main surface 204 of the carrier tape 200 toward a second main surface 206 of the carrier tape 200. Figure 1 The difference between the carrier tape 100 and the carrier tape 100 is that Figure 2 The second main surface 206 of the carrier tape 200 may be discontinuous along the longitudinal length of the carrier tape 100, and the first main surface 104 may also be discontinuous. Interruptions in the first main surface 204 may be formed by recesses 102 (and possibly other features formed in the first main surface 204), and interruptions in the second main surface 206 may be formed by notches 208 longitudinally intervening between adjacent recesses 202. Recesses 202 may be located on a first side of the carrier tape 200 and open toward that first side, while notches 208 may be located on a second opposite side of the carrier tape 200 and open toward that second opposite side. This configuration may represent certain processes for forming the carrier tape 200 according to the present disclosure, such as injection molding or extrusion processes, selectively followed by forming processes (e.g., die stamping).

[0034] Figure 3 This is a cross-sectional side view as part of another embodiment of the carrier belt 300. Figure 1 Carrier 100 and Figure 2 The carrier tape is the same as 200. Figure 3 The carrier tape 300 may comprise, for example, an elongated strip or sheet-like material body having at least one recess 302 extending from a first main surface 304 of the carrier tape 300 toward a second main surface 306 of the carrier tape 300. Figure 1 Carrier 100 and Figure 2 Unlike the 200 carrier belt, Figure 3 At least some of the recesses 302 of the carrier tape 300 shown may be shaped such that at least a majority of each main surface of the respective semiconductor die does not contact the surface defining the recess 302. For example, each recess 302 may include a side 308 shaped and positioned to surround a corresponding side of the semiconductor die located within the recess 302, and two or all of the side 308 may optionally be shaped and positioned to form a frictional fit against the corresponding side of the semiconductor die when the recess 302 is in a retracted state. Each recess 302 may also include a bottom surface 310 thereon that can support a portion of the main surface of the semiconductor die, the bottom surface 310 being oriented at least substantially perpendicular to the side 308. Figure 3As shown, the bottom surface 310 may be the upper surface of a shoulder 312 extending around at least a portion of the periphery of the recess 302. In some embodiments, the shoulder 312 may extend only along the two sides 308 of the recess 302 and along the corresponding surface of the semiconductor die. In other embodiments, the shoulder 312 may extend completely around the periphery of the recess 302 and completely below the corresponding periphery of the semiconductor die.

[0035] To define a portion of the shoulder 312, a recess 314 may be located within the recess 302. The recess 314 may extend from the bottom surface 310 toward the second main surface 306 into the material of the carrier tape 300. The size, shape, and location of the recess 314 may be configured to define a space between the remaining portion of the main surface of the semiconductor die and the material of the carrier tape 300 beneath the die. For example, the recess 314 may have a right-angled rectangular or trapezoidal shape in at least one cross-section of the recess 302, and when the semiconductor die is supported on the bottom surface 310 of the shoulder 312 in the recess 302, the bottom surface 316 of the recess 314 may be spaced from the main surface of the semiconductor die by the depth of the recess 314. By providing such a recess 314 to form such a space, and supporting the main surface of the semiconductor die only at the periphery of the shoulder 312, the possibility of damaging the semiconductor die during removal from the recess 302 can be reduced, for example, by the contact between the material of the carrier tape 300 and the main surface of the semiconductor die or by the force caused by the pressure difference between the inside and outside of the recess 302.

[0036] Figure 4 This is a cross-sectional side view, part of another embodiment of the carrier tape 400. Figure 1 Carrier belt 100, Figure 2 Carrier belt 200 and Figure 3 The carrier tape is the same as 300. Figure 4 The carrier tape 400 may comprise, for example, a strip or sheet material having at least one recess 402 extending from a first main surface 404 of the carrier tape 400 toward a second main surface 406 of the carrier tape 400. Figure 1 Carrier belt 100, Figure 2 Carrier belt 200 and Figure 3 Unlike the 300 carrier belt, Figure 4At least some recesses 402 of the carrier tape 400 shown may include one or more tabs 412 shaped, positioned, and configured to contact a semiconductor die to hold the semiconductor die within the recess 402 when it is in a retracted state. For example, the tabs 412 may include protrusions, shoulders, or lumps extending from near a first main surface 404 and laterally across portions of the recess 402 from one or more side surfaces 408. More specifically, the depth of the recess 402 may be selected such that when the semiconductor die is in the recess 402 and the recess 402 is in a retracted state, the tabs 412 can be positioned to cover a portion of the upper main surface of the semiconductor die. In another embodiment, the depth of the recess 402 may be selected such that the free end of the tab 412 contacts a side surface of the semiconductor die housed in the recess 402.

[0037] When the recess 402 is in a contracted state, each tab 412 may be positioned to prevent a semiconductor die from entering or leaving the recess 402 by passing over the corresponding tab 412. For example, the recess 402 may have a first width 414 and a second width 416, the first width 414 being smaller than the corresponding width of the semiconductor die with the tab 412, and the second width 416 being greater than or equal to the corresponding width of the semiconductor die. When the recess is in an expanded state, each tab 412 may be positioned to allow a semiconductor die to enter or leave the recess 402 by passing over the corresponding tab 412. For example, the first width 414 may expand to a size greater than or equal to the corresponding width of the semiconductor die in response to applied heat, allowing the semiconductor die to be placed in or removed from the recess 402.

[0038] The shortest distance between the distal end 418 of the given tab 412 and the side 408 defining the associated recess 402 can be, for example, less than half the distance by which the second width 416 of the recess 402 expands compared to its contracted state when the recess 402 is in an extended state. For example, the shortest distance between the distal end 418 of the tab 412 and the side 408 defining the associated recess 402 can be less than about 75 micrometers. More specifically, the shortest distance between the distal end 418 of the tab 412 and the side 408 defining the associated recess 402 can be between about 15 micrometers and about 50 micrometers (e.g., about 25 micrometers).

[0039] Figure 5 This is a cross-sectional side view, part of another embodiment of the carrier belt 500. Figure 1 Carrier tape 100, Figure 2 Carrier tape 200, Figure 3 Carrier tape 300 and Figure 4 The carrier tape in the middle is the same as 400. Figure 5The carrier tape 500 shown may comprise, for example, a strip or sheet material having at least one recess 502 extending from a first main surface 504 of the carrier tape 500 toward a second main surface 506 of the carrier tape 500. Also like... Figure 4 The carrier tape is the same as 400. Figure 5 The recess 502 of the carrier tape 500 shown may include one or more tabs 512, which are shaped, positioned, and configured to contact the semiconductor die to hold the semiconductor die within the recess 502 when the recess 502 is in a retracted state. Figure 4 Unlike the 400 carrier belt, Figure 5 The tab 512 of the carrier tape 500 shown may have a reverse chamfered shape. For example, the tab 512 may include a bevel 514 such that the first width 516 of the recess 502 aligned with the tab 512 decreases with increasing distance from the second main surface 506. Thus, the semiconductor die housed in the recess 502 can be pressed against the bottom surface 510 of the recess 502 by the bevel 514.

[0040] As the inventors anticipated, where feasible, Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The features shown can be combined with each other. For example, Figure 4 412 or Figure 5 The protrusion 512 can be combined with Figure 1 Carrier belt 100, Figure 2 Carrier belt 200 or Figure 3 The 300 carrier tapes are arranged together. Similarly, Figure 3 The 314 depression can be used Figure 1 Carrier belt 100, Figure 2 Carrier belt 200, Figure 4 Carrier belt 400 or Figure 5 The carrier tape 500. As another example, it can be used to form Figure 1 Carrier belt 100 or Figure 2 The carrier tape is manufactured using the 200 process. Figure 3 300 carrier belts Figure 4 Carrier belt 400 or Figure 5 The carrier tape 500, wherein the resulting shape is modified as well as potentially modified to provide tabs 412 or tabs 512 in the stamped recess using a material addition process (e.g., 3D printing).

[0041] Figure 6 This is a top view of a portion of the carrier tape 600 according to this disclosure. Figure 6The carrier tape 600 shown may comprise, for example, a strip or sheet material having at least one recess 602 extending from a first main surface 604 of the carrier tape 200 into the material of the carrier tape 200. In some embodiments, at least some of the recesses 602 of the carrier tape 600 may be shaped such that, when other surfaces of the recesses 602 contact a corresponding semiconductor die, corners 606 of the recesses 602 are spaced apart from the corresponding semiconductor die. For example, the third width 608 and first length 610 of the recesses 602 at corners 606 of the recesses 602, or the third width 608 and first length 610, may be greater than the third width 608 and first length 610, or the third width 608 and first length 610, at at least some locations between the recesses 602. At least two sides defining the recesses 602 may be located at a fourth width 616 smaller than the third width 608, a second length 618 shorter than the first length 610, or the fourth width 616 and the second length 618. For example, each lateral side 612 extending along the length of the carrier belt 600 may be recessed relative to the third width 608 of the corner 606, and each longitudinal side 614 extending at least substantially perpendicular to the lateral side 612 may be recessed relative to the first length 610 of the corner 606.

[0042] In this configuration, each of the lateral side 612 and the longitudinal side 614 can be positioned and configured to contact a corresponding side of the semiconductor die housed in the recess 602 when the recess 602 is in a contracted state. More specifically, the lateral side 612 and the longitudinal side 614 can be positioned and configured such that when the recess 602 is in an expanded state (e.g., in response to heating), the semiconductor die is allowed to enter the recess 602, and when the recess 602 is in a contracted state (e.g., in response to cooling to room temperature), a frictional fit is formed against the corresponding side of the semiconductor die. Figure 7 This is a top view of a portion of the carrier tape 600 according to this disclosure. Figure 6 The carrier tape is the same as 600. Figure 7 The carrier tape 700 shown may comprise, for example, a strip or sheet material having at least one recess 702 extending from a first main surface 704 of the carrier tape 700 into the material of the carrier tape 700. Also like... Figure 6 The carrier belt is the same as 600. Figure 7 At least some of the recesses 702 of the carrier tape 700 shown can be shaped such that when the other surfaces of the recesses 702 contact the corresponding semiconductor die, the corners 706 of the recesses 702 are spaced apart from the corresponding semiconductor die. For example, only two sides defining the recesses 702 (e.g., the lateral side 710 or the longitudinal side 712) can be recessed relative to the corresponding corners 706.

[0043] In this configuration, two opposing lateral sides 710 or two opposing longitudinal sides 712 may be positioned and configured to contact the corresponding sides of the semiconductor die when the recess 702 is in a contracted state. More specifically, the lateral sides 710 or longitudinal sides 712 may be positioned and configured to allow the semiconductor die to enter the recess 702 when the recess 702 is in an expanded state (e.g., in response to heating), and to form a frictional fit against the corresponding sides of the semiconductor die when the recess 702 is in a contracted state (e.g., in response to cooling to room temperature).

[0044] As the inventors anticipated, where feasible, Figure 6 and Figure 7 The features shown can be compared with Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The combination of features. For example, Figure 6 or Figure 7 The concave side shown can be with Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The recess shown can be used with any cross-sectional shape of the carrier tape. As another example, Figures 1 to 7 Any of the carrier tapes shown can utilize the surface of the defined recess without any adhesive material.

[0045] Figure 8 This is a flowchart of the method 800 for using a carrier tape according to this disclosure. Figure 9 yes Figure 8 A side-view cross-sectional diagram of the behavior in method 800. (Refer to reference...) Figure 8 and Figure 9 Method 800 may involve expanding the recess 302 of the carrier tape 300 from a contracted state to an expanded state in response to heating at least a portion of the carrier tape 300 including the recess 302, as shown in action 802. For example, a surface of the carrier tape, such as a second main surface 306, may be heated using a heat source, and in response to the high temperature, the material of the carrier tape 300 may expand from a contracted state. This expansion may cause the lateral, longitudinal, or lateral and longitudinal distance between the sides 308 of the recess 302 or the tabs of the recess 302 to increase to the expanded state, providing a gap for introducing a semiconductor die 902 into the recess 302.

[0046] Heating the carrier tape 300 or a portion thereof using a heat source may include, for example, supporting a portion of the second main surface 306 of the carrier tape 300 on, such as Figure 9The heated chuck 904 is shown. More specifically, portions of the carrier tape 300 can be sequentially moved across the main surface 908 of the heated chuck 904, thereby heating the corresponding portions of the carrier tape 300 with heat emitted from the heated chuck 904. As a specific, non-limiting example, the carrier tape 300 can be pulled from a reel wound with the carrier tape 300 to deliver a portion of the carrier tape 300 over the heated chuck 904, thereby heating the main surface 908 such that: when a portion of the carrier tape 300 containing a series of corresponding recesses 302 is located on the heated chuck 904, the series of corresponding recesses 302 are in a contracted state (see...). Figure 10 ) Convert to Figure 9 The expansion state is shown. The number of recesses 302 that can be positioned above the heated chuck 904 and change into the expanded state each time can be approximately, for example, 2 to 20. More specifically, the number of recesses 302 that can be positioned on the main surface 908 of the heated chuck 904 each time can be approximately, for example, 3 to 10 (for example, approximately 5).

[0047] When transitioning from a contracted state to an expanded state, carrier tape 300 or a portion thereof may be initiated at an initial temperature and exposed to a higher temperature to heat the relevant portion of carrier tape 300. For example, carrier tape 300 may initially be at ambient temperature (i.e., room temperature), and the relevant portion of carrier tape 300 may be exposed to a temperature above room temperature but below a temperature that could damage carrier tape 300 and / or semiconductor die 902. More specifically, carrier tape 300 may initially be at a temperature between about 20°C and about 25°C, and the carrier tape may be exposed to a temperature between about 80°C and about 120°C (e.g., about 90°C, about 100°C) to transform the material of carrier tape 300 into an expanded state.

[0048] The time required to heat the recess 302 is sufficient to allow for a transition from a contracted state to an expanded state to remove the semiconductor die 902, and to ensure that any semiconductor die 902 can be introduced into the expanded recess 302 for transport and handling. For example, this portion of the carrier tape 300 may be exposed to high temperatures for no more than 60 seconds. More specifically, the relevant portion of the carrier tape 300 may be exposed to high temperatures for approximately 1 second to approximately 30 seconds (e.g., approximately 3 seconds, approximately 5 seconds).

[0049] The variation in the shortest distance between the sides 308 of the recess 302 or between the opposite tabs reflects the transition between a contracted state and an expanded state, and may be, for example, about 100 micrometers or less. More specifically, the variation in distance between the sides 308 of the recess 302 or between the opposite tabs may be between about 25 micrometers and about 75 micrometers (e.g., about 50 micrometers).

[0050] Once a given recess 302 has transitioned to an expanded state, a semiconductor die 902 can be placed within that corresponding recess 302, as shown in action 804. For example, a pick-and-place device 910 can be used to retrieve a semiconductor die 902 from its supply source (e.g., a single wafer or test tray having a semiconductor die 902 characterized as a known good die (KGD)) and place the semiconductor die 902 into one of the recesses of 302 that is now in an expanded state. This process can be repeated until each recess 302 currently in an expanded state contains a semiconductor die 902. At least a portion of the main surface 908 of the semiconductor die 902 can be supported on the bottom surface 310 defining the recess 302, and the side surfaces 308 defining the recess 302 can be spaced apart from the corresponding side surfaces 914 of the semiconductor die 902. Where applicable, the tabs covering the recesses may be positioned outward from the side surface 914 of the semiconductor die 902 in a transverse, longitudinal, or transverse and longitudinal direction, and may space the bottom surface 316 of any recess 314 in the recess 302 from the main surface 912 of the semiconductor die 902.

[0051] In some embodiments, the semiconductor die 902 may be a thin die. For example, the thickness 916 of each semiconductor die 902 may be about 50 micrometers or less. More specifically, the thickness 916 of each semiconductor die 902 may be between, for example, about 20 micrometers and about 50 micrometers (e.g., about 30 micrometers).

[0052] Figure 10 yes Figure 8 A side view cross-section diagram of another behavior in method 800. (Refer to reference...) Figure 8 and Figure 10 The recess 302 can retract to secure each semiconductor die 902 in the associated recess 302 in response to heat dissipation of this portion of the carrier tape 300, as shown in action 806. In some embodiments, the carrier tape 300 can be simply fed through a heated chuck 904 (see...). Figure 9 ) main surface 908 (see Figure 9 ), until the relevant portion of the carrier tape 300 containing the recess 302 with the inserted semiconductor die 902 is located in the heated chuck 904 (see Figure 9 Outside the range of ), and allows the carrier tape 300 to cool to room temperature. In other embodiments, the carrier tape 300 has partially recessed recesses 302 in an expanded state, containing a semiconductor die 902, which can be actively cooled to shrink these recesses 302 to Figure 10 The contracted state is shown. For example, carrier tape 300 can be displaced from heated chuck 904 (see...). Figure 9The tape 300 is fed through the main surface 1002 of the cooling chuck 1004 to actively cool the relevant portions of the carrier tape 300. Active cooling of the carrier tape 300 allows the recesses 302 to return to the contracted state at a faster rate, thereby advantageously increasing throughput when the semiconductor die 902 is stored in the recesses 302 of the carrier tape 300 and the carrier tape 300 with the semiconductor die is assembled on the reel.

[0053] As the carrier tape 300 cools after heat dissipation and active cooling, it can contract, causing the recess 302 to change from an expanded state to a contracted state. When the recess 302 is in the contracted state and the semiconductor die 902 is located within the associated recess 302, two or more sides 308 defining the recess 302 can contact corresponding sides 914, or partial tabs can cover corresponding portions of the upper main surface 912 of the semiconductor die 902 facing outwards from the recess 302. For example, two or four sides 308 defining the recess 302 can form a frictional fit against corresponding sides 914 of the semiconductor die 902, or partial tabs can contact corresponding portions of the main surface 912 positioned inwards from the sides 914. More specifically, since the side 308 of the defined recess 302 contacts and forms a frictional fit with the corresponding side 914 of the semiconductor die 902, a maximum bending strain is caused in the semiconductor die 902, which may be, for example, about 0.002 mm / mm (about 0.2%) or less.

[0054] In the embodiment, the protrusion 412 (see...) is used. Figure 4 ) or plate 512 (see Figure 5 The semiconductor die 902 is held within the associated recess 302, with the tab 412 (see...) Figure 4 ) or plate 512 (see Figure 5 The maximum overlap between the tab 412 and the main surface 912 of the semiconductor die 902 can be, for example, about 75 micrometers or less. More specifically, given tab 412 (see... Figure 4 ) or plate 512 (see Figure 5 The maximum overlap between the semiconductor die 902 and the main surface 912 can be, for example, between about 15 micrometers and about 50 micrometers (e.g., about 25 micrometers).

[0055] Although the above behavior has been specifically described and applied to Figure 3 The carrier tape 300, but the same expansion and contraction that temporarily fixes the semiconductor die within the recess 302 of the carrier tape 300 can also be applied. Figures 1 to 7 Any carrier tape.

[0056] In summary, a method for storing a microelectronic device on a carrier tape may include: heating a portion of the carrier tape from a contracted state to an expanded state, such that at least one recess in the carrier expands in at least one dimension to accommodate the microelectronic device. The microelectronic device may be at least partially placed within the at least one recess. The portion of the carrier tape may be cooled (e.g., actively or passively) to cause the at least one recess to contract in the at least one dimension and secure the microelectronic device placed therein, with the portion of the carrier tape adjacent to the recess.

[0057] Figure 11 This is a perspective view of a reel 1100 for supporting the carrier tape 100. The reel 1100 may include, for example, two discs 1104 oriented at least generally parallel to each other, and a hub 1106 around which the carrier tape 100 can be wound, such that a helix of the carrier tape 100 can be positioned between the discs 1104 around the hub 1106. In some embodiments, a cover tape 1102 may be positioned over the recesses 102 to reduce the possibility of contamination or damage to the semiconductor dies 902 supported therein. For example, the cover tape 1102 may be positioned to contact at least a portion of the carrier tape 100 to seal at least some of the semiconductor dies 902 in the associated recesses 102. More specifically, the cover tape 1102 may be adhered along the length of the carrier tape 100 to a first main surface 104 to cover each recess 102 and seal each associated semiconductor die 902 within its respective recess 102. Once the cover tape 1102 is applied to the carrier tape 100, the carrier tape 100 and the cover tape 1102 can be wound together on the reel 1100 for transport, storage, and subsequently with the pick-and-place device 910 (see [link]). Figure 9 They can be used together, or in any combination thereof.

[0058] In other embodiments, the carrier tape 100, in its recess 102 supporting a semiconductor die 902 (e.g., through contact with the side 110 or through mechanical interference from the tabs), can be wound onto the reel 1100 without any cover tape 1102. Once the carrier tape 100 is fully wound around the reel 1100, the cover tape 1102 can be placed only around the outermost circumference of the carrier tape 100 wound around the reel 1100, or it can be placed around the reel 1100 itself. For example, the cover tape 1102 can adhere to a first main surface 104 of the carrier tape 100, rotating only once around the reel 1100, the cover tape 1102 can be located around the circumference of the reel 1100 itself, with the carrier tape 100 below it, or the cover tape 1102 can be wound around the entire exterior of the reel 1100, including the circumference and outer surface of the disk 1104 and the hub 1106 forming the reel 1100. Compared to applying the cover tape 1102 to the entire length of the first main surface 104 of the carrier tape 100, wrapping the cover tape 1102 only around the outermost portion of the carrier tape 100 or around the reel 1100 or a portion thereof utilizes fewer resources and generates less waste. In another embodiment, the cover tape 1102 can be omitted entirely, and the reel 1100 equipped with the tape can be placed alone or together with other carrier tapes in a sealed container to achieve environmental protection during further processing and transportation to the destination, where the semiconductor die is removed and processed in a clean environment.

[0059] Although the above behavior has been specifically described and applied to Figure 1 The carrier tape 100, but the same temporary positioning around the reel 1100 and the protection provided by the cover tape 1102 can also be applied to Figures 1 to 7 In any carrier tape.

[0060] Figure 12 This is a flowchart of the method 1200 for using a carrier tape according to this disclosure. Figure 13 yes Figure 12 A side-view cross-sectional diagram of the behavior in Method 1200. (Refer to reference...) Figure 12 and Figure 13Method 1200 may include: in response to heating at least a portion of the carrier tape 300, expanding a recess 302 of the carrier tape 300 from a contracted state to an expanded state, as shown in action 1202. Also as shown in action 1202, heating this portion of the carrier tape 300 may disengage at least one surface defining each recess 302 from a semiconductor die 902 located within each recess 302. For example, a second main surface 306 may be heated using a heat source, and the material of the carrier tape 300 may expand from a contracted state in response to heating using the heat source. This expansion may cause the lateral, longitudinal, or lateral and longitudinal distance between the sides 308 of the recess 302 or the tabs of the recess 302 to increase to the expanded state, thereby introducing the semiconductor die 902 into the recess 302.

[0061] Heating the carrier tape 300 or a portion thereof using a heat source may include, for example, supporting a portion of the second main surface 306 of the carrier tape 300 on a heated chuck 1302. More specifically, portions of the carrier tape 300 may be sequentially moved through the main surface 1304 of the heated chuck 1302 (which may be the same as or different from the heated chuck 904 used when the semiconductor die 902 was initially placed in the carrier tape 300), thereby heating the corresponding portions of the carrier tape 300 by heat emitted from the heated chuck 904. As a specific, non-limiting example, when portions of the carrier tape 300 are pulled and sequentially fed over the main surface 908, the carrier tape 300 can be unwound from the reel 110 while the heated chuck 1302 heats the main surface 1304 such that: when a recess 302 on a relevant portion of the carrier tape 300 is located on the heated chuck 1302, a corresponding series of recesses 302 retract from a contracted state (see Figure 10 ) Convert to Figure 13 The expansion state is shown. The number of recesses 302 that can be positioned in the expansion state each time can be, for example, about 2 to 20. More specifically, the number of recesses 302 that can be positioned on the main surface 1304 of the heated chuck 1302 each time can be, for example, about 3 to 10 (for example, about 5).

[0062] When transitioning from a contracted state to an expanded state, carrier tape 300, or a portion thereof, may be activated at an initial temperature and exposed to a higher temperature to heat the relevant portion of carrier tape 300. For example, carrier tape 300 may initially be at ambient temperature (i.e., room temperature), and the relevant portion of carrier tape 300 including the recess 302 housing the semiconductor die 902 may be exposed to a temperature above room temperature but below a temperature that could damage carrier tape 300 and / or semiconductor die 902. More specifically, carrier tape 300 may initially be between about 20°C and about 25°C, and the carrier tape may be exposed to temperatures between about 80°C and about 120°C (e.g., about 90°C, about 100°C).

[0063] The time required to heat the relevant recess 302 is sufficient to achieve a transition from a contracted state to an expanded state, and to ensure that any semiconductor die 902 can be removed from the expanded recess 302. For example, this portion of the carrier tape 300 may be exposed to high temperatures for no more than 60 seconds. More specifically, the relevant portion of the carrier tape 300 may be exposed to high temperatures for approximately 1 second to approximately 30 seconds (e.g., approximately 3 seconds, approximately 5 seconds).

[0064] The variation in the shortest distance between the sides 308 of the recess 302 or between the opposite tabs reflects the transition between a contracted state and an expanded state, and may be, for example, about 100 micrometers or less. More specifically, the variation in distance between the sides 308 of the recess 302 or between the opposite tabs may be between about 25 micrometers and about 75 micrometers (e.g., about 50 micrometers).

[0065] Once a given recess 302 has transitioned to an expanded state, the semiconductor die 902 can be removed from that corresponding recess 302, as shown in step 1204. For example, a pick-and-place device 1306 (which may be of the same or different type as the pick-and-place device 910 initially used to place the semiconductor die 902 in the recess 302) can be used to lift the semiconductor die 902 from one of the recesses 302 that is now in an expanded state, and this process can be repeated until there are no semiconductor dies 902 in each recess 302 currently in an expanded state. At least a portion of the main surface 908 of the semiconductor die 902 can be supported on the bottom surface 310 defining the recess 302, and the side surfaces 308 defining the recess 302 can be spaced apart from the corresponding side surfaces 914. Where applicable, the tabs covering the recesses may be positioned outward from the side surface 914 of the semiconductor die 902 in a transverse, longitudinal, or transverse and longitudinal direction, and the bottom surface 316 of any recess 314 in the recess 302 may be spaced apart from the main surface 912 of the semiconductor die 902. The semiconductor die 902 may then be positioned on, for example, another component (e.g., a wafer or other bulk substrate, another semiconductor die, an interposer, or a PCB) to electrically connect the semiconductor die 902 to other components in an electrical system (e.g., a memory device).

[0066] In summary, the method for processing a microelectronic device may include: in response to heating at least a portion of a carrier tape including the at least some recesses, expanding the at least some recesses of the carrier tape from a contracted state to an expanded state, such that: at least one surface of the carrier tape defining a corresponding recess among the at least some recesses disengages from contact with the microelectronic device located within the corresponding recess among the at least some recesses. The microelectronic device can then be removed from the corresponding recess among the at least some recesses.

[0067] The carrier tape according to this disclosure reduces the likelihood of damage to the semiconductor die during removal from the carrier tape. For example, reducing (e.g., eliminating) reliance on adhesive materials to temporarily hold the semiconductor die in the recesses of the carrier tape reduces stress on the semiconductor die, and reduces the formation and / or propagation of microcracks or fissures that occur simultaneously in the semiconductor die during insertion into and removal from the recess. By reducing the need for a cover tape across the entire main surface of the carrier tape, the carrier tape according to this disclosure also allows for the temporary storage of semiconductor dies on the carrier tape for transport and handling with less material and resources. The carrier tape further reduces the likelihood of semiconductor die contamination by eliminating adhesive materials. Furthermore, the construction disclosed in the embodiments of the carrier tape allows each semiconductor die to be more precisely positioned in the recess with respect to the X and Y directions and to the angle (i.e., θ) about the vertical axis, thus facilitating accurate orientation when removed by the pick-and-place head of a pick-and-place device that requires less active compensation when placing the semiconductor die on another component. In other words, because the expansion and contraction of the recess tend to align and reposition the semiconductor die if it is not placed accurately during insertion, the carrier tape can improve the accuracy of the pick-and-place process during the removal of the semiconductor die from the carrier tape.

[0068] Although primarily described as a carrier tape comprising a cavity having sidewalls and a bottom surface, as mentioned above, the carrier tape can also take the form of a slot extending entirely through the thickness of the carrier tape. Typically, for example, in... In the carrier tape, the bottom of the slots is at least partially covered with an adhesive film, to which the semiconductor die in each slot is adhered. However, embodiments of this disclosure employ the expansion and contraction of surfaces that define recesses and are configured to contact two or more sides or edges of the semiconductor die when the carrier tape material contracts, thereby holding each semiconductor die in place without requiring a support surface beneath the die. Specifically, modifications are possible. Figure 4 The design places the tab 412 at a horizontal position corresponding to the middle thickness of the mandrel housed within, to securely mate and engage the mandrel's side edges. Furthermore, modifications are possible. Figure 5 The design includes an extended tab at the bottom of the slot with an upward-sloping surface to clamp the side edge of the die housed in the slot.

[0069] Although the use of a single reel equipped with carrier tape is described according to embodiments of this disclosure, it is conceivable that if the time required to heat or cool the carrier tape via the chuck exceeds the time required to place or pick up the semiconductor die using a pick-and-place device, multiple reels can be fed in parallel on a common chuck, allowing the pick-and-place device to interact with multiple recesses on different carrier tapes and avoiding reduced throughput. Similarly, a so-called "Woolworth assembly" comprising rows of recesses for receiving semiconductor dies can be configured according to embodiments of this disclosure and used in conjunction with a heated and cooled chuck. Furthermore, multiple spools can be used in parallel, each spool carrying a carrier tape bearing KGDs exhibiting different functions, to assemble components including KGDs with different functions, such as hybrid memory cubes (HMCs). Each HMC includes: a stack of dynamic random access memory (DRAM) dies configured as a controller, or high bandwidth memory (HBM), the high bandwidth memory (HBM) including a stack of DRAM dies on a controller die, the high bandwidth memory (HBM) being mounted to a common interposer having a processor die (e.g., a graphics processing unit (GPU)). In another embodiment, embodiments of this disclosure may employ a carrier tape mounted on a spool to receive different types of semiconductor dies picked up from different compartments in a specific order, the specific order corresponding to the order in which the semiconductor dies are retrieved from the carrier tape, for assembly with other components on a substrate wafer, interposer, printed circuit board (PCB), or other components. In this embodiment, different recesses may have different sizes and configurations and may be manufactured in a suitable order to accommodate different semiconductor dies of different sizes and shapes.

[0070] Other non-limiting embodiments within the scope of this disclosure include:

[0071] Example 1: A carrier tape for a microelectronic device, comprising: an elongated tape body including recesses, the size, shape, and position of which are configured to accommodate a corresponding microelectronic device within the recess; wherein the coefficient of thermal expansion of the material of the tape body and the configuration of the portion of the tape body adjacent to the recess allow the material of the tape body to expand in response to an increase in temperature of the tape body and enlarge at least one dimension of the recess surrounded by the temperature-increased portion of the tape body, and allow the recess to accommodate the microelectronic device and contract in response to a decrease in temperature of the portion, such that at least two opposing surfaces of the tape body adjacent to the recess contact and hold the microelectronic device.

[0072] Example 2: The carrier tape according to Example 1, wherein the coefficient of thermal expansion of the material of the tape body is 3 or greater.

[0073] Example 3: The carrier tape according to Example 1 or Example 2, wherein the tape body does not contain adhesive material on the surface of the tape body adjacent to the recess.

[0074] Example 4: A carrier tape according to any one of Examples 1 to 3, wherein at least some of the recesses are shaped such that their corners are spaced apart from the microelectronic device held in the recess.

[0075] Example 5: A carrier tape according to any one of Examples 1 to 4, wherein two opposing lateral sides of the tape body adjacent to at least some of the recesses are positioned to contact and retain the microelectronic device housed in the at least some of the recesses in response to a decrease in temperature.

[0076] Example 6: A carrier tape according to any one of Examples 1 to 5, wherein two lateral sides and two longitudinal sides of the tape body adjacent to at least some of the recesses are positioned to contact and hold the microelectronic device housed in at least some of the recesses in response to a decrease in temperature.

[0077] Example 7: A carrier tape according to any one of Examples 1 to 6, wherein the tape body adjacent to at least some of the recesses is configured such that at least a majority of the main surface of the microelectronic device held in the at least some of the recesses does not contact the tape body.

[0078] Example 8: The carrier tape according to Example 7, wherein the tape body adjacent to the at least some of the recesses includes a shoulder that surrounds and extends within a space below at least a portion of the periphery below the peripheral portion of the main surface of the microelectronic device and below the remaining portion of the main surface.

[0079] Example 9: A carrier tape according to any one of Examples 1 to 8, wherein the tape body adjacent to at least some of the recesses includes: opposing tabs adjacent to the openings of the at least some of the recesses, the opposing tabs being positioned to cover the main surface of a microelectronic device housed in the recesses in response to a decrease in temperature.

[0080] Example 10: The carrier tape according to Example 9, wherein each opposing tab is shaped as a reverse chamfer toward the recess.

[0081] Example 11: A method of storing a microelectronic device on a carrier tape, comprising: heating a portion of a carrier tape from a contracted state to an expanded state such that at least one recess in the carrier tape expands in at least one dimension to accommodate a microelectronic device; placing the microelectronic device at least partially within the at least one recess; and cooling the portion of the carrier tape such that the at least one recess contracts in the at least one dimension and secures the microelectronic device placed therein, wherein the portion of the carrier tape is adjacent to the recess.

[0082] Example 12: The method according to Example 11 further includes: repeatedly performing the heating, placement and cooling on different longitudinally spaced portions of the carrier tape while advancing the carrier tape and winding it around the portion of the carrier tape to which the microelectronic device is fixed.

[0083] Example 13: The method according to Example 12 further includes: placing the cover tape above the recess in the portion of the carrier tape having the microelectronic device before winding it around the spool, or placing the cover tape around the outermost portion of the carrier tape after winding.

[0084] Example 14: According to any one of Examples 11 to 13, heating at least a portion of the carrier tape comprises: exposing the at least a portion of the carrier tape to a temperature between about 80°C and about 120°C.

[0085] Example 15: The method according to any one of Examples 11 to 14, wherein placing the microelectronic device in the at least one recess comprises: placing a microelectronic device with a thickness of about 50 micrometers or less.

[0086] Example 16: The method according to any one of Examples 11 to 15, wherein fixing includes: abutting the side of the microelectronic device with the opposing surface of the carrier adjacent to the at least one recess, or extending the opposing portion of the carrier on the peripheral portion of the main surface of the microelectronic device.

[0087] Example 17: The method according to any one of Examples 11 to 16, wherein cooling the portion of the belt body includes: actively cooling the portion of the carrier belt body.

[0088] Example 18: A method of processing a microelectronic device, comprising: in response to heating at least a portion of a carrier tape including the at least some recesses, expanding at least some recesses of the carrier tape from a contracted state to an expanded state such that: at least one surface of the carrier tape defining a corresponding recess among the at least some recesses disengages from contact with a microelectronic device located within the corresponding recess among the at least some recesses; and removing the microelectronic device from the corresponding recess among the at least some recesses.

[0089] Example 19: According to the method of Example 18, heating the at least portion of the carrier tape includes: supporting the at least portion of the carrier tape on a heated chuck.

[0090] Example 20: The method according to Example 18 or Example 19, wherein removing the microelectronic device from the corresponding recess of the at least some recesses includes: removing the microelectronic device from the corresponding recess of the at least some recesses using a pick-and-place device.

[0091] While certain illustrative embodiments have been described in conjunction with the accompanying drawings, those skilled in the art will recognize and understand that the scope of this disclosure is not limited to the embodiments explicitly shown and described herein. Rather, many additions, deletions, and modifications can be made to the embodiments described herein to produce embodiments within the scope of this disclosure, such as explicitly claimed embodiments, including legal equivalents. Furthermore, features from one disclosed embodiment may be combined with features from another disclosed embodiment, while still remaining within the scope of this disclosure.

Claims

1. A carrier tape for a microelectronic device, comprising: An elongated tape body includes recesses of a size, shape, and position configured to accommodate a corresponding microelectronic device within the recess. The recesses extend from a first main surface of the carrier tape to a second main surface of the carrier tape and along the entire longitudinal length of the carrier tape. The second main surface is continuous. At least some of the recesses are shaped such that their corners are spaced apart from the microelectronic devices held within the recesses. The thermal expansion coefficient of the material of the strip and the construction of the portion of the strip adjacent to the recess allow the material of the strip to expand in response to an increase in the temperature of the strip and enlarge at least one dimension of the recess surrounded by the portion of the strip with the increased temperature, and allow the recess to accommodate the microelectronic device and contract in response to the temperature of the portion from rising to falling, and allow at least two opposing surfaces of the strip adjacent to the recess to contact and hold the microelectronic device.

2. The carrier tape according to claim 1, wherein, The coefficient of thermal expansion of the material of the belt is greater than or equal to 3.

3. The carrier tape according to claim 1, wherein, The belt body does not contain any adhesive material on the surface of the belt body adjacent to the recess.

4. The carrier tape according to any one of claims 1 to 3, wherein, Two opposing lateral sides of the strip adjacent to at least some of the recesses are positioned to contact and retain the microelectronic device housed in the at least some of the recesses in response to a decrease in temperature.

5. The carrier tape according to any one of claims 1 to 3, wherein, Two lateral and two longitudinal sides of the strip adjacent to at least some of the recesses are positioned to contact and retain the microelectronic device housed in at least some of the recesses in response to the decrease in temperature.

6. The carrier tape according to any one of claims 1 to 3, wherein, The strip adjacent to at least some of the recesses is configured such that at least a majority of the main surface of the microelectronic device held in the at least some of the recesses does not contact the strip.

7. The carrier tape according to claim 6, wherein, The strip adjacent to at least some of the recesses includes a shoulder that surrounds and extends within a space below at least a portion of the periphery below the peripheral portion of the main surface of the microelectronic device and below the remainder of the main surface.

8. The carrier tape according to any one of claims 1 to 3, wherein, The strip adjacent to at least some of the recesses includes opposing tabs near the openings of the at least some of the recesses, the opposing tabs being positioned to cover the main surface of the microelectronic device housed in the recess in response to the decrease in temperature.

9. The carrier tape according to claim 8, wherein, Each opposing tab is shaped as a reverse chamfer facing the recess.

10. A method for storing a microelectronic device on a carrier tape, comprising: A portion of the carrier body is heated from a contracted state to an expanded state, such that at least one recess in the carrier body expands in at least one dimension to accommodate a microelectronic device, the recess extending from a first main surface of the carrier body to a second main surface of the carrier body and along the entire longitudinal length of the carrier body, the second main surface being continuous, wherein at least some of the recesses are shaped such that their corners are spaced apart from the microelectronic device held in the recess. The microelectronic device is placed at least partially within the at least one recess; as well as The portion of the carrier tape is cooled to shrink the at least one recess in the at least one dimension and fix the microelectronic device placed therein, wherein the portion of the carrier tape is adjacent to the recess.

11. The method of claim 10, further comprising: While repeatedly performing the heating, placement, and cooling on different longitudinally spaced portions of the carrier tape, the carrier tape is advanced and wound around the portion of the carrier tape to which the microelectronic device is fixed.

12. The method of claim 11, further comprising: Before winding around the spool, the cover tape is placed over the recess in the portion of the carrier tape containing the microelectronic device, or after winding, the cover tape is placed around the outermost portion of the carrier tape.

13. The method according to claim 10, wherein, Heating at least a portion of the carrier tape includes exposing the at least a portion of the carrier tape to a temperature between 80°C and 120°C.

14. The method according to any one of claims 10 to 13, wherein, Placing a microelectronic device in the at least one recess includes placing a microelectronic device with a thickness of 50 micrometers or less.

15. The method according to any one of claims 10 to 13, wherein, Fixing includes: mating the side of the microelectronic device with the opposing surface of the carrier adjacent to at least one recess, or extending the opposing portion of the carrier onto the peripheral portion of the main surface of the microelectronic device.

16. The method according to any one of claims 10 to 13, wherein, Cooling the portion of the tape body includes: actively cooling the portion of the carrier tape body.

17. A method for processing a microelectronic device, comprising: In response to heating at least a portion of a carrier tape comprising at least some recesses, the at least some recesses of the carrier tape are expanded from a contracted state to an expanded state such that at least one surface of the carrier tape defining a corresponding recess among the at least some recesses is disengaged from a microelectronic device located within the corresponding recess among the at least some recesses, wherein the at least some recesses are shaped such that their corners are spaced apart from the microelectronic device held in the recess. as well as The microelectronic device is removed from a corresponding recess among the at least some recesses, the recesses extending from a first main surface of the carrier tape to a second main surface of the carrier tape and along the entire longitudinal length of the carrier tape, the second main surface being continuous.

18. The method according to claim 17, wherein, Heating the at least portion of the carrier tape includes supporting the at least portion of the carrier tape on a heated chuck.

19. The method according to claim 17 or claim 18, wherein, Removing the microelectronic device from a corresponding recess among the at least some recesses includes: using a pick-and-place device to remove the microelectronic device from the corresponding recess among the at least some recesses.

Images