Chip transfer device and chip transfer method

Abstract

The present application provides a chip transfer device and a chip transfer method; the chip transfer device is provided with a data acquisition mechanism, and acquires the first position information of the chip in real time through the first data acquisition mechanism, and detects the information of the solder paste on the pad in real time through the second data acquisition mechanism, specifically including but not limited to the shape and volume of the solder paste, and integrates the data through a control mechanism to process the data, and determine the actual position information of the chip on the substrate, so that the determined first position information and second position information are more accurate, and the accuracy is higher during the chip transfer process, so as to avoid poor display caused by inaccurate chip alignment.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a chip transfer device and a chip transfer method. Background Art

[0002] With the development of display technology, miniLED (mini light emitting diode) has been widely used due to its advantages such as high contrast, partitionable control, and low power consumption. In the preparation process of miniLED display devices, the light-emitting chip needs to be transferred to the substrate. The existing transfer technology is to position the light-emitting chip by pre-determining the outer dimensions of the pad, placing the light-emitting chip in the center, or setting it at equal intervals according to the substrate. However, due to a series of problems such as expansion and contraction of the material on the substrate, warping, pad production yield, and tinning during the chip transfer process, the chip will have poor contact with the substrate after transfer, resulting in the display device failing to display normally.

[0003] Therefore, in the existing chip transfer process, there is a technical problem that the process is unstable, resulting in poor contact between the chip and the substrate after transfer. Summary of the invention

[0004] The embodiments of the present application provide a chip transfer device and a chip transfer method, which are used to alleviate the technical problem that the chip is not in stable process in the existing chip transfer process, resulting in poor contact between the chip and the substrate after transfer.

[0005] The present application provides a chip transfer device, which includes:

[0006] A substrate carrier, used for carrying a substrate;

[0007] A chip carrier, used for carrying the chip;

[0008] The data acquisition mechanism includes a first data acquisition mechanism and a second data acquisition mechanism, wherein the first data acquisition mechanism is used to acquire first position information of a chip on the chip carrier, and the second data acquisition mechanism is used to acquire information of solder paste in a substrate on the substrate carrier;

[0009] The transfer mechanism includes a control mechanism and a driving mechanism, wherein the control mechanism is connected to the driving mechanism, and the control mechanism is electrically connected to the data acquisition mechanism. The control mechanism is used to receive information from the first data acquisition mechanism and the second data acquisition mechanism, and determine second position information of the chip according to the information from the first data acquisition mechanism and the second data acquisition mechanism, and control the driving mechanism to transfer the chip to the substrate according to the first position information and the second position information of the chip.

[0010] In some embodiments, the transfer mechanism further includes a crossbeam, the control mechanism and the drive mechanism are disposed on the crossbeam, and the drive mechanism is a movable component, and the drive mechanism is used to move along the crossbeam when transferring different chips.

[0011] In some embodiments, the driving mechanism includes a driving body, a swing arm and a suction nozzle, one end of the swing arm is connected to the driving body, and the other end of the swing arm is connected to the suction nozzle.

[0012] In some embodiments, the first data acquisition mechanism is disposed on the crossbeam, and on a side facing the chip carrier, a length of the first data acquisition mechanism extending beyond the crossbeam is less than a length of the driving body extending beyond the crossbeam.

[0013] In some embodiments, the second data acquisition mechanism is disposed on the beam and is located on both sides of the driving body with the first data acquisition mechanism. On the side facing the substrate carrier, the length of the second data acquisition mechanism extending beyond the beam is less than the length of the driving body extending beyond the beam.

[0014] In some embodiments, the control mechanism is disposed in the driving mechanism, the driving mechanism includes a driving motor, and the control mechanism is connected to the driving motor.

[0015] In some embodiments, the control mechanism includes an analysis unit and a control unit, wherein the analysis unit is connected to the control unit, and the analysis unit is used to receive data information sent by the second data acquisition mechanism, and analyze the data information to determine the second position information of the chip, and the control unit is used to control the driving mechanism to transfer the chip to the substrate according to the second position information input by the analysis unit and the first position information.

[0016] In some embodiments, the first data acquisition mechanism includes a first charge coupled device, and the first data acquisition mechanism is arranged corresponding to the chip carrier.

[0017] In some embodiments, the second data acquisition mechanism includes a second charge coupled device, and the second charge coupled device is arranged corresponding to the substrate carrier.

[0018] At the same time, an embodiment of the present application provides a chip transfer method, which uses the chip transfer device described in any of the above embodiments, and the chip transfer method includes:

[0019] placing a substrate on a substrate carrier, and placing a chip on a chip carrier;

[0020] Acquire first position information of the chip on the chip carrier by a first data acquisition mechanism, and acquire information of solder paste in the substrate on the substrate carrier by a second data acquisition mechanism;

[0021] Sending the first position information and the solder paste information to a control mechanism, and determining the second position information of the chip placement;

[0022] According to the first position information and the second position information, the driving mechanism is controlled to transfer the chip onto the substrate.

[0023] Beneficial effect: The present application provides a chip transfer device and a chip transfer method; the chip transfer device includes a substrate carrier, a chip carrier, a data acquisition mechanism and a transfer mechanism, the substrate carrier is used to carry the substrate, the chip carrier is used to carry the chip, the data acquisition mechanism includes a first data acquisition mechanism and a second data acquisition mechanism, the first data acquisition mechanism is used to obtain the first position information of the chip on the chip carrier, and the second data acquisition mechanism is used to obtain the information of the solder paste in the substrate on the substrate carrier; the transfer mechanism includes a control mechanism and a driving mechanism, the control mechanism is connected to the driving mechanism, the control mechanism is electrically connected to the data acquisition mechanism, the control mechanism is used to receive information from the first data acquisition mechanism and the second data acquisition mechanism, and according to the information from the first data acquisition mechanism and the second data acquisition mechanism, determine the second position information of the chip, and according to the first position information and the second position information of the chip, control the driving mechanism to transfer the chip to the substrate. The present application sets up a data acquisition mechanism, acquires the first position information of the chip in real time through the first data acquisition mechanism, and detects the information of the solder paste on the pad in real time through the second data acquisition mechanism, specifically including but not limited to the shape and volume of the solder paste, and processes the data through a control mechanism to determine the actual position information of the chip on the substrate, so that the determined first position information and second position information are more accurate, and the accuracy is higher during the chip transfer process, thereby avoiding poor display caused by inaccurate chip alignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0025] Figure 1 A schematic diagram of a chip transfer device provided in an embodiment of the present application.

[0026] Figure 2 A flowchart of a chip transfer method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0032] In order to solve the technical problem that the chip transfer process is unstable, resulting in poor contact between the chip and the substrate after transfer, the embodiments of the present application provide a chip transfer device and a chip transfer method to alleviate the above technical problem.

[0033] like Figure 1 As shown, an embodiment of the present application provides a chip transfer device, and the chip transfer device 1 includes:

[0034] The substrate carrier 11 is used to carry the substrate 22;

[0035] A chip carrier 12, used for carrying a chip 21;

[0036] The data acquisition mechanism 13 includes a first data acquisition mechanism 131 and a second data acquisition mechanism 132, wherein the first data acquisition mechanism 131 is used to acquire first position information of the chip 21 on the chip carrier 12, and the second data acquisition mechanism 132 is used to acquire information of the solder paste 222 in the substrate 22 on the substrate carrier 11;

[0037] The transfer mechanism 14 includes a control mechanism 142 and a driving mechanism 143. The control mechanism 142 is connected to the driving mechanism 143. The control mechanism 142 is electrically connected to the data acquisition mechanism 13. The control mechanism 142 is used to receive information from the first data acquisition mechanism 131 and the second data acquisition mechanism 132, and determine the second position information of the chip placement according to the information from the first data acquisition mechanism 131 and the second data acquisition mechanism 132, and control the driving mechanism 143 to transfer the chip 21 to the substrate 22 according to the first position information and the second position information of the chip 21.

[0038] An embodiment of the present application provides a chip transfer device, which, by setting a data acquisition mechanism, acquires first position information of a chip in real time through a first data acquisition mechanism, and detects information of solder paste on a pad in real time through a second data acquisition mechanism, specifically including but not limited to the shape and volume of the solder paste, and integrates the data through a control mechanism to process the data and determine the actual position information of the chip on a substrate, so that the determined first position information and second position information are more accurate, and the accuracy is higher during the chip transfer process, thereby avoiding poor display caused by inaccurate chip alignment.

[0039] It should be noted that electrical connection means that two institutions can be connected through network communication without physical connection, but electrical connection does not limit the two institutions to not be physically connected.

[0040] In one embodiment, if Figure 1 As shown, the transfer mechanism 14 further includes a crossbeam 141, the control mechanism 142 and the drive mechanism 143 are arranged on the crossbeam 141, and the drive mechanism 143 is a movable component, and the drive mechanism 143 is used to move along the crossbeam 141 when transferring different chips. By arranging the crossbeam, and arranging the control mechanism and the drive mechanism on the crossbeam, when transferring chips in different regions or chips of different sizes, the chips can be transferred by moving the control mechanism and the drive mechanism on the crossbeam, without replacing the chip transfer device, thereby improving the chip transfer efficiency.

[0041] Specifically, for example, for multiple chips on a chip carrier, the chips at different positions can be transferred by a mobile driving mechanism. Specifically, the first position information of the chip can be determined by a first data acquisition mechanism, so that the control mechanism controls the driving mechanism to move after receiving the first position information of the chip, thereby transferring the chips at different positions.

[0042] Specifically, for multiple chips on chip carriers at different positions, after transferring the chip on a certain chip carrier, the chip on another chip carrier can be transferred by moving the driving mechanism and the control mechanism, thereby improving the efficiency of chip transfer without replacing the chip transfer device and reducing costs.

[0043] In one embodiment, if Figure 1As shown, the driving mechanism 143 includes a driving body 143a, a swing arm 143b and a suction nozzle 143c, wherein one end of the swing arm 143b is connected to the driving body 143a, and the other end of the swing arm 143b is connected to the suction nozzle 143c. By connecting one end of the swing arm to the driving body and the other end of the swing arm to the suction nozzle, when the chip is extracted, the suction nozzle can be driven to move by the movement of the swing arm, and the position of the chip on the chip carrier is determined by the first data acquisition mechanism, so that the chip can be accurately extracted and the accuracy of chip transfer is improved.

[0044] Specifically, the suction nozzles may include multiple suction nozzles, and by providing multiple suction nozzles, when transferring the chip, the chip can be transferred through multiple suction nozzles, thereby improving the transfer efficiency of the chip. Specifically, when multiple swing arms are required to cooperate with the suction nozzles, multiple swing arms can also be connected to the suction nozzles to improve the transfer efficiency of the chip.

[0045] In one embodiment, the chip carrier includes a blue film and a ejector pin. The ejector pin is arranged under the blue film. The blue film is used to carry the chip. By arranging the blue film to carry the chip, when the chip needs to be transferred, the chip can be lifted up by the ejector pin, which facilitates the transfer mechanism to transfer the chip.

[0046] Specifically, the suction nozzle includes a negative pressure suction nozzle, and the negative pressure suction nozzle is arranged corresponding to the top pin. By making the suction nozzle a negative pressure suction nozzle, when extracting the chip, the negative pressure suction nozzle can adsorb the chip to avoid the chip falling or the chip cannot be fixed, resulting in the inability to transfer the chip or damage the chip. When transferring the chip to the substrate, the transfer stability of the chip can be improved to avoid damage to the chip.

[0047] Deviations in chip position may result in deviations in the chip grabbing process, leading to errors or low efficiency in chip transfer. Figure 1 As shown, the first data acquisition mechanism 131 is arranged on the crossbeam 141, and on the side facing the chip carrier 12, the length of the first data acquisition mechanism 131 beyond the crossbeam 141 is less than the length of the driving body 143a beyond the crossbeam 141. By arranging the first data acquisition mechanism on the crossbeam, when there is an error or offset in the chip position, the actual position of the chip can be determined by the movement of the first data acquisition mechanism, so as to obtain the accurate setting position of the chip and accurately extract the chip. And by making the length of the first data acquisition mechanism beyond the crossbeam less than the length of the driving body beyond the crossbeam, when the first data acquisition mechanism and the driving mechanism are working, interference between the first data acquisition mechanism and the driving mechanism is avoided, so that the first data acquisition mechanism and the driving mechanism can work normally.

[0048] Specifically, the above embodiment is described in detail by taking the example that the length of the first data acquisition mechanism extending beyond the cross beam is less than the length of the driving body extending beyond the cross beam. However, the embodiments of the present application are not limited thereto. For example, the first data acquisition mechanism and the driving mechanism can work in time sharing mode. In this case, the length of the first data acquisition mechanism extending beyond the cross beam can be greater than or equal to the length of the driving body extending beyond the cross beam. Since the first data acquisition mechanism and the driving mechanism work in time sharing mode, no interference will occur.

[0049] For each component on the substrate, there may be process errors, expansion and contraction, etc., which may cause position deviation of the pad or solder paste on the substrate, thereby causing chip transfer failure. In one embodiment, the second data acquisition mechanism is arranged on the beam, and is located on both sides of the driving body with the first data acquisition mechanism. On the side facing the substrate carrier, the length of the second data acquisition mechanism beyond the beam is less than the length of the driving body beyond the beam. By arranging the second data acquisition mechanism on the beam, when the substrate expands or contracts or has position deviation due to the process or temperature, or the pad or solder paste on the substrate expands or contracts or has position deviation, the information of the solder paste is determined by the movement of the second data acquisition mechanism, so that the actual position of the chip placement can be determined, so as to accurately place the chip and improve the stability of the electrical connection between the chip and the substrate. And by arranging the first data acquisition mechanism and the second data acquisition mechanism on both sides of the driving body, the first data acquisition mechanism and the second data acquisition mechanism are prevented from interfering with each other. By making the length of the second data acquisition mechanism beyond the beam less than the length of the driving body beyond the beam, when the second data acquisition mechanism and the driving mechanism are working, the second data acquisition mechanism and the driving mechanism are prevented from interfering with each other, so that the second data acquisition mechanism and the driving mechanism work normally.

[0050] Specifically, the above embodiment is described in detail by taking the example that the length of the second data acquisition mechanism extending beyond the cross beam is less than the length of the driving body extending beyond the cross beam. However, the embodiments of the present application are not limited thereto. For example, the second data acquisition mechanism and the driving mechanism can work in time sharing mode. In this case, the length of the second data acquisition mechanism extending beyond the cross beam can be greater than or equal to the length of the driving body extending beyond the cross beam. Since the second data acquisition mechanism and the driving mechanism work in time sharing mode, no interference will occur.

[0051] In one embodiment, the control mechanism is arranged in the driving mechanism, the driving mechanism includes a driving motor, and the control mechanism is connected to the driving motor. By arranging the control mechanism in the driving mechanism, the control mechanism controls the driving mechanism, and the control mechanism does not need to be arranged separately, thereby reducing the space occupied by the transfer mechanism.

[0052] In one embodiment, the control mechanism includes an analysis unit and a control unit, the analysis unit is connected to the control unit, the analysis unit is used to receive the data information sent by the second data acquisition mechanism, and analyze the data information to determine the second position information of the chip, and the control unit is used to control the drive mechanism to transfer the chip to the substrate according to the second position information input by the analysis unit and the first position information. By setting up the analysis unit, when receiving the second data acquisition mechanism, the actual position of the chip can be determined according to the actual data information, so that when transferring the chip, the chip and the substrate can be accurately aligned and well connected.

[0053] Specifically, when obtaining information of the substrate through the second data acquisition mechanism, for example, obtaining an image of the solder paste through the second data acquisition mechanism, the image is sent to the control mechanism, and the image is analyzed by the analysis unit to determine the size and shape of the solder paste. At the same time, the position information of the substrate can be determined, so as to determine the actual placement position of the chip according to the size and shape of the solder paste, and determine the coordinate position of the chip placement through the position information of the substrate, thereby determining the second position information, and transferring the chip through the first position information and the second position information, thereby improving the accuracy of chip transfer.

[0054] In one embodiment, the first data acquisition mechanism includes a first charge coupled device, and the first data acquisition mechanism is arranged corresponding to the chip carrier. The image of the chip on the chip carrier is acquired by the first charge coupled device, so that when the chip placement position deviates or the chip is deformed due to temperature changes, the placement position of the chip can be accurately acquired, so that the transfer mechanism can accurately acquire the chip.

[0055] In one embodiment, the second data acquisition mechanism includes a second charge coupled device, and the second charge coupled device is arranged corresponding to the substrate stage. The image of the substrate on the substrate stage, specifically including the image of the solder paste, is acquired through the second charge coupled device, and the size, shape and other characteristics of the solder paste can be determined, so that the actual placement position of the chip can be determined according to the characteristics of the solder paste. When the solder paste deviates due to temperature or process, the chip can still be accurately placed on the substrate, thereby improving the connection stability between the chip and the substrate.

[0056] It should be noted that the alignment structure is not mentioned in the above embodiment, but during the chip transfer process, the transfer of components between the components needs to be aligned to realize the transfer of the substrate and the chip. Therefore, an alignment structure will be set to align the components, which will not be repeated here.

[0057] Specifically, Figure 1As shown, the first position information of the chip and the information of the solder paste are respectively obtained by the first data acquisition mechanism 131 and the second data acquisition mechanism 132, and then the first position information of the chip and the information of the solder paste are sent to the control mechanism 142, so that the control mechanism 142 determines the second position information of the chip, and then controls the driving mechanism 143 to obtain the chip 21 from the chip carrier 12, and transfer the chip 21 to the substrate 22. Specifically, since the characteristics of the solder paste 222 on the pad 221 are determined, the chip 21 can be accurately set on the substrate when it is transferred to the substrate, and the connection effect with the pad is better.

[0058] At the same time, an embodiment of the present application provides a chip transfer method, which uses the chip transfer device described in any of the above embodiments, and the chip transfer method includes:

[0059] S1, placing a substrate on a substrate carrier, and placing a chip on a chip carrier;

[0060] S2, acquiring first position information of the chip on the chip carrier by a first data acquisition mechanism, and acquiring information of solder paste in the substrate on the substrate carrier by a second data acquisition mechanism;

[0061] S3, sending the first position information and the information of the solder paste to a control mechanism, and determining the second position information of the chip placement;

[0062] S4, controlling the driving mechanism to transfer the chip onto a substrate according to the first position information and the second position information.

[0063] An embodiment of the present application provides a chip transfer method. The chip transfer device in the chip transfer method is equipped with a data acquisition mechanism. The first data acquisition mechanism acquires the first position information of the chip in real time. The second data acquisition mechanism detects the information of the solder paste on the pad in real time, including but not limited to the shape and volume of the solder paste. The data is processed by a control mechanism to determine the actual position information of the chip on the substrate, so that the determined first position information and second position information are more accurate, and the accuracy is higher during the chip transfer process, thereby avoiding poor display caused by inaccurate chip alignment.

[0064] According to the above embodiments, it can be seen that:

[0065] The present application provides a chip transfer device and a chip transfer method; the chip transfer device includes a substrate carrier, a chip carrier, a data acquisition mechanism and a transfer mechanism, the substrate carrier is used to carry the substrate, the chip carrier is used to carry the chip, the data acquisition mechanism includes a first data acquisition mechanism and a second data acquisition mechanism, the first data acquisition mechanism is used to obtain first position information of the chip on the chip carrier, and the second data acquisition mechanism is used to obtain information of solder paste in the substrate on the substrate carrier; the transfer mechanism includes a control mechanism and a driving mechanism, the control mechanism is connected to the driving mechanism, the control mechanism is electrically connected to the data acquisition mechanism, the control mechanism is used to receive information from the first data acquisition mechanism and the second data acquisition mechanism, and according to the information from the first data acquisition mechanism and the second data acquisition mechanism, determine the second position information of the chip, and according to the first position information and the second position information of the chip, control the driving mechanism to transfer the chip to the substrate. The present application sets up a data acquisition mechanism, acquires the first position information of the chip in real time through the first data acquisition mechanism, and detects the information of the solder paste on the pad in real time through the second data acquisition mechanism, specifically including but not limited to the shape and volume of the solder paste, and processes the data through a control mechanism to determine the actual position information of the chip on the substrate, so that the determined first position information and second position information are more accurate, and the accuracy is higher during the chip transfer process, thereby avoiding poor display caused by inaccurate chip alignment.

[0066] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0067] The above is a detailed introduction to a chip transfer device and a chip transfer method provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip transfer device, characterized in that: include: A substrate carrier, used for carrying a substrate; A chip carrier, used for carrying a chip; The data acquisition mechanism includes a first data acquisition mechanism and a second data acquisition mechanism, wherein the first data acquisition mechanism is used to acquire first position information of a chip on the chip carrier, and the second data acquisition mechanism is used to acquire information of solder paste in a substrate on the substrate carrier; The transfer mechanism comprises a control mechanism and a driving mechanism, wherein the control mechanism is connected to the driving mechanism, and the control mechanism is electrically connected to the data acquisition mechanism, and the control mechanism is used to receive information from the first data acquisition mechanism and the second data acquisition mechanism, and determine second position information of the chip according to the information from the first data acquisition mechanism and the second data acquisition mechanism, and control the driving mechanism to transfer the chip to the substrate according to the first position information and the second position information of the chip; Wherein, the transfer mechanism also includes a crossbeam, the control mechanism and the driving mechanism are arranged on the crossbeam, and the driving mechanism is a movable component, the driving mechanism is used to move along the crossbeam when transferring different chips, the driving mechanism includes a driving body, a swing arm and a suction nozzle, one end of the swing arm is connected to the driving body, and the other end of the swing arm is connected to the suction nozzle, the control mechanism includes an analysis unit and a control unit, the analysis unit is connected to the control unit, the analysis unit is used to receive data information sent by the second data acquisition mechanism, and analyze the data information to determine the second position information of the chip, the control unit is used to control the driving mechanism to transfer the chip to the substrate according to the second position information input by the analysis unit and the first position information.

2. The chip transfer device according to claim 1, characterized in that: The first data acquisition mechanism is disposed on the crossbeam, and on a side facing the chip carrier, a length of the first data acquisition mechanism extending beyond the crossbeam is less than a length of the driving body extending beyond the crossbeam.

3. The chip transfer device according to claim 1, characterized in that: The second data acquisition mechanism is arranged on the crossbeam and is located on both sides of the driving body together with the first data acquisition mechanism. On the side facing the substrate carrier, the length of the second data acquisition mechanism exceeding the crossbeam is less than the length of the driving body exceeding the crossbeam.

4. The chip transfer device according to claim 1, characterized in that: The control mechanism is arranged in the driving mechanism, the driving mechanism comprises a driving motor, and the control mechanism is connected to the driving motor.

5. The chip transfer device according to claim 1, characterized in that: The first data acquisition mechanism includes a first charge coupled device, and the first data acquisition mechanism is arranged corresponding to the chip carrier.

6. The chip transfer device according to claim 1, characterized in that: The second data acquisition mechanism includes a second charge coupled device, and the second charge coupled device is arranged corresponding to the substrate carrier.

7. A chip transfer method, characterized in that: Using the chip transfer device according to any one of claims 1 to 6, the chip transfer method comprises: placing a substrate on a substrate carrier, and placing a chip on a chip carrier; Acquire first position information of the chip on the chip carrier by a first data acquisition mechanism, and acquire information of solder paste in the substrate on the substrate carrier by a second data acquisition mechanism; Sending the first position information and the solder paste information to a control mechanism, and determining the second position information of the chip placement; According to the first position information and the second position information, the driving mechanism is controlled to transfer the chip onto the substrate.

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