Component handling and component inspection

Abstract

An apparatus for inspecting multiple components having at least one top surface, multiple sides to be inspected, and / or edges of these sides, the apparatus having at least one pick-up tool arranged on a flipping device for one of these components in each case, the pick-up tool being designed and configured to pick up the component on the top surface of the respective component, the flipping device being designed and configured to rotate the component in a flipping plane along a transport path about a flipping axis using the pick-up tool, and in the process transporting the component on the pick-up tool, which is angled to the flipping path or flipping plane, to an inspection position, and at the inspection position, first and second imaging devices, as optical component inspection devices, are arranged at an angle to each other such that a first side or edge of the component at the inspection position is inspected by the first imaging device, and a second side or edge of the component adjacent to the first side at the inspection position is inspected by the second imaging device.

Description

Technical Field

[0001] This document describes a component processing apparatus and a corresponding method. Details of the component processing are defined in the claims; the specification and drawings contain descriptions of the component processing apparatus, its operation, and the design of the apparatus.

[0002] This document also describes a component inspection apparatus and a corresponding method. Details of the component inspection are defined in the claims; the specification and drawings contain descriptions of the component inspection, its operation, and the design of the component inspection apparatus. Background Technology

[0003] The component herein is, for example, an electronic component, also known as a "chip" or "die." Such a component typically has a prismatic shape and a generally polygonal, such as quadrilateral (rectangular or square) cross-section, which includes multiple sides and a front, top, or bottom surface. The sides of this component are referred to synonymously below. The component may also have a number of sides not equal to four. The component may also be an electronic and / or optical component (prism, mirror, lens, etc.), or include the aforementioned electronic and / or optical components. In general, the component can have any geometry.

[0004] The applicant's operational practice has led to the development of so-called pick-and-place devices, in which components are picked up from a substrate using a pick-up tool and then placed on a carrier, transport container, or similar object. Before placement, the component is inspected. For this purpose, images of one or more sides of the component are recorded using one or more cameras and evaluated through automated image processing.

[0005] EP 1 470 747 B 1 relates to a chip removal apparatus, a chip removal system, an assembly system, and a method for removing and further processing a chip. The chip is removed from a wafer and transported to a transport position while being flipped. The removal apparatus for removing a semiconductor wafer with its own chip structure includes a rotatable removal tool for removing the chip from the wafer and flipping the removed chip about its longitudinal or transverse axis by 180°, and a rotatable flipping tool that works in conjunction with the rotatable removal tool for further flipping the removed chip about its longitudinal or transverse axis by 180°. The removal tool has a first transport position, and the flipping tool has a second transport position, at which the chip can be transported to an assembly head for further processing.

[0006] EP 0 906 011 A2 relates to an apparatus for removing and assembling electronic components onto a substrate. This apparatus includes a rotatable conveyor that removes the electronic components from a feed module at a pick-up position and conveys them to a siphon belt at a first conveying position for further processing. The components are picked up from the siphon belt by a rotatable assembly head and conveyed to a second conveying position.

[0007] WO 02 / 054480A1 relates to an apparatus for optically inspecting different surfaces of a chip to be mounted. The apparatus includes a first upper transport tray configured to remove a chip from a feeding unit and convey it to a first transport position. The chip is held in an inlet constructed on the side of the upper transport tray and moved by rotation of the upper transport tray. The apparatus also has a second lower transport tray corresponding to the upper transport tray, which receives the removed chip at the first transport position and conveys it to a second transport position. The apparatus inspects the chip by positioning a camera on the side of the transport tray to inspect the front and back surfaces of the chip. The chip is then conveyed to a sorting device without being flipped relative to its original orientation for further processing.

[0008] US 4,619,043 discloses an apparatus and method for removing and mounting electronic components, particularly chips, on a printed circuit board. The apparatus includes a transport member for picking up a chip in a pick-up unit and transporting the picked-up chip to a first transport position. The transport member has a transport chain and rotatable sprockets meshing together. The apparatus also includes a rotatable mounting tool with an assembly head for picking up the chip at the first transport position. A clamping tool is further configured to transport the picked-up chip to a second transport position by a rotational motion, wherein the chip is flipped.

[0009] JP 2-193813 relates to equipment for inspecting electronic components. This apparatus includes a feeding unit from which a chip-shaped electronic component is removed and arranged around the circumference of a first rotating body. The electronic component is conveyed to a first conveying position by the rotational motion of the rotating body, causing the electronic component to flip about its longitudinal or transverse axis. The apparatus also includes a second rotating body that picks up the removed electronic component at the first conveying position and conveys it to a second conveying position, whereby the electronic component undergoes another flip about its longitudinal or transverse axis. This apparatus allows for the inspection of different sides of the component.

[0010] Other technical background references include EP 3 336 024 A1, EP 1 588 402B1, WO 2017 / 220 245A1, WO 2019 / 039 568A1, JP 502 94 39A, KR 2017 001 86 07A, JP 2018 077 083A, JP 599 9859B1, US 9,261,463B2, WO 2018 / 110 500A1, WO 2019 / 009 381A1, WO 2016 / 080 162A1, WO2019 / 039 552A1, KR 2012 096 37B1, EP 2075 829B1, JP 59 75 556 B1, WO 2014 112041A1, WO 2015 083211A1, WO 2017 022 074A1, WO 2013 / 108 398A1, WO2013 / 084 298A1, WO 2012 / 073 285A1, US 9,510,460 B2, JP 4911 714B2, US 7,191,511 B2, JP 55 10 923B2, JP 57 83 652 B2, JP 2007 095 725A, JP 2012 116 529A, JP 2001-74664A, JP 1-193630A, US 5,750,979, DE 199 13 134A1, JP 8 227 904 A.

[0011] When separating a (semiconductor) component from a substrate / wafer foil and picking it up using a pick-up tool (e.g., a negative pressure pipette), positional tolerances of the component are formed on the pick-up tool. The deviation of the component's position and rotation on the pick-up tool is affected by several parameters: the adhesion between the component and the substrate / wafer foil, the lifting height of the needle used to release the component from the substrate / wafer foil, the position of the needle relative to the center of the component, the reaction force of the pick-up tool, the pick-up tool's position relative to the center of the component when picking it up, the intensity of the negative pressure at the pick-up tool, the available time to form the negative pressure for picking up the component, the surface characteristics of the component facing the pick-up tool, and the surface characteristics of the pick-up tool, etc.

[0012] Furthermore, the industrial demand for optically identifying increasingly smaller defects on components is constantly increasing. Defects can be optically identified using suitable lenses and matching illumination of the component to be inspected. However, available lenses reach their limits with the necessary image sharpness and increasingly shallow depth of field. Due to the component's offset position on the pick-up tool and the lens's shallow depth of field, the quality of optical inspection is limited. The likelihood of identifying defects on out-of-focus components is low. This can lead to defective components being mistakenly not identified as malfunctioning and undergoing further processing / packaging.

[0013] The traditional solution to this problem involves a centered station for the component upstream of the optical evaluation to improve the quality of optical component inspection. This involves measuring the component's X and Y positions and rotation. Subsequently, the X and Y positions and rotation of the component are corrected by moving and rotating a pickup tool along the X and Y directions. With this solution, each pickup tool must be equipped with an additional rotary driver, or the pickup tool must be designed so that the driver can engage each pickup tool. Alternatively, the pickup tool is rotated, and the evaluation camera is displaced relative to the component along the X and Y directions. Another traditional variation involves placing the component on a carrier, aligning its X and Y positions and rotation on the carrier, and then picking the component up from the carrier using a pickup tool. There is a risk that the component will slip again relative to the pickup tool when picking up the component from the carrier.

[0014] Systems for visually inspecting all (four) sides (and, depending on, one or two) of electronic components (see above) either have two or more cooperating transport bodies (e.g., transport wheels, transport star wheels, transport belts) or complex configurations of imaging systems. When using two or more transport bodies, electronic components must be moved from one transport body to another and recalibrated for visual inspection. These solutions are costly and have limited throughput (the number of electronic components inspected per unit time). The solution proposed in this invention should be able to process components accurately in a manner improved over prior art and inspect these components with high throughput. Summary of the Invention

[0015] This document provides an apparatus and a method. The apparatus has at least one pick-up tool arranged on a flipping device for aligning and optically inspecting components on a corresponding pick-up tool. The pick-up tool is designed and configured to pick up the component on one of its faces. The flipping device is designed and configured such that the pick-up tool rotates about a flipping axis within a flipping plane and selectively conveys the component on the pick-up tool from a pick-up position to at least one orientation position, selectively to at least one inspection position, to a placement position, and selectively to a pop-out position. The apparatus is designed and configured to process components having multiple sides to be optically inspected. For this purpose, the apparatus has a holding and feeding device for a component reservoir facing the pick-up position. The component reservoir may be a (thin-film) substrate with components separated from each other on its side facing the pick-up tool. An unloading device is designed and configured to, at a time, convey one of these components from the component reservoir in the holding and feeding device toward or to the corresponding pick-up tool in the pick-up position. The holding and feeding device is designed and configured to align all or only the corresponding components to be released from the component reservoir relative to the pick-up tool in the pick-up position such that one or each side of the component to be optically inspected, which is at an acute angle to the flip plane, forms an angle of approximately 30° to approximately 60° with the flip plane, or one or each side of the component to be optically inspected, which is at an obtuse angle to the flip plane, forms an angle of approximately 120° to approximately 150° with the flip plane. Thus, the sides of the components can, for example, be aligned with the orthogonal principal alignment axes X and Y of the device, while the flip plane of the device is oriented along or parallel to the angle bisector of the X and Y axes.

[0016] This configuration features only one flipping device that rotates within a single flipping plane. Therefore, the component is transported from the pick-up position to the drop-off position at an angle relative to this flipping plane. This allows the component on the pick-up tool to be aligned at this angle, followed by optical inspection of its sides / edges, without needing to introduce components of the optical inspection device into the component's flipping or transport path. In other words, the sides of the component are neither parallel to nor perpendicular to the flipping plane.

[0017] This configuration also enables faster maintenance, especially for adjusting the device and, in particular, the pick-up tool before it is put into operation, as the flipping device and its interoperable components are more readily accessible. No additional removal of components or modules is required for maintenance or adjustment. Therefore, for example, the pick-up tool's pipette might need periodic adjustment relative to the imaging equipment, or replacement due to wear or the different characteristics of the components being processed. This allows for a greater overall throughput of components to be processed / inspected.

[0018] In addition to the aforementioned pickup, orientation, inspection, placement, and ejection positions, or as alternatives, other processing stations may be provided in other locations, such as electrical testing stations or adhesive nozzles.

[0019] The configuration proposed herein allows for better access to the flipping device, which is virtually unobstructed along its circumference. This configuration differs from known configurations, in which the component storage above the flipping device and the receiving device below it restrict access, the control device and supply lines restrict access from the rear, and the processing stations arranged on the radial outer circumference of the flipping device restrict access.

[0020] The transport path of the component lies between two parallel edges extending between the component's upper and lower top surfaces. These edges terminate at opposite corners of the lower and upper top surfaces, respectively. These two parallel edges lie in a plane transverse to the flip plane. The transport path of the component lies within or parallel to this flip plane (coplanar).

[0021] The side edge of the component (oriented at least approximately parallel to the central longitudinal axis of the pickup tool) is located in front of the two sides adjacent to this side edge along the circumference of the flipping device from the pickup position to the placement position or the ejection position on the component's flipping or transport path. This angled arrangement of the component's sides with the flipping plane allows for side inspection without the need for (temporary) obstructive profiles in the form of inspection or alignment devices in the component's flipping plane and transport path.

[0022] This approach differs from known configurations with, for example, two mutually right-angled flipping devices, where the component is transferred from one flipping device to the other, and in the process, the component is flipped relative to its front or bottom surface. In that known configuration, all sides of the component, which has a quadrilateral top view, are also inspected. Since there are two flipping devices, two flipping planes are provided here. Within each flipping plane, only two opposing sides can be inspected at a time without setting interfering contours, because the two sides of the component are aligned with the corresponding flipping plane, and the two sides of the component are perpendicular to the corresponding flipping plane.

[0023] The pickup tool is configured and designed to pick up an assembly with four sides to be optically inspected. In one variant, two pairs of optical assembly inspection devices are arranged along the transport path of the assembly along the circumference of the flipping device. These inspection devices are arranged at an angle to their optical axes outside the transport path of the assembly along the circumference of the flipping device. The transport path of the assembly is generally arc-shaped (e.g., a semicircle from the pickup position (0°) to the lowering position (180°), or optionally a quarter-circle up to the pop-out position (e.g., 240° or 270°).

[0024] In the apparatus proposed herein, these (e.g., two) imaging devices and their (e.g., two) illumination devices (in the case of an assembly with four sides to be inspected) can be arranged in an X-shape at (e.g., two) separate inspection positions within the same flipping plane on the flipping device. This reduces processing time (and increases throughput). In this variant, a transmitted light illumination device is employed.

[0025] In another variation of the X layout, at a single inspection position, four imaging devices are pointed at the four sides of the component to be inspected, and each imaging device is associated with an illumination device that illuminates the corresponding side to be inspected with one or more spectra.

[0026] The proposed apparatus is particularly advantageous for infrared transmitted light inspection using infrared (IR) illumination arranged opposite to the imaging device. This configuration achieves a reduced cycle time because only in the orientation position is a radial (Z) stroke of the components relative to the rotation axis of the flipping device along the radial direction of the pickup tool required to align the components on the pickup tool in a centered position. This radial (Z) stroke can be performed simultaneously with the radial (Z) strokes of other components on the flipping device, for example, in the pickup and / or placement positions, since the flipping device is at least briefly stationary or nearly stationary during this time.

[0027] The device proposed in this paper is space-saving and reduces complexity, as it requires only a flipping mechanism to inspect the sides of the component and to flip the component. The proposed device is applicable to component sizes ranging from, for example, 0.3 mm to, for example, 12 × 12 × 2.5 mm. Therefore, compared to known devices, the proposed device can handle and / or inspect components of various sizes.

[0028] Optional pop-up locations are used, for example, to remove components that are identified as faulty from the process using a suction machine.

[0029] Optional orientation positions are used to correct the position and orientation of the component on the pick-up tool using appropriate sliders or grippers if the component is not delivered to the pick-up tool with the required inspection precision. For this purpose, the device for aligning the component is designed and configured such that the component is aligned relative to the center of the pick-up tool in at least one axial direction and rotational direction. In this device, the component can be transported from the pick-up position to the placement position with its side angled relative to the flipping plane, while the component's flipping or transport path along the circumference of the flipping device is unaffected by the components of the optical component inspection device.

[0030] In a variation of this device, alternatively or additionally, two imaging devices and their illumination devices are arranged in an X-shape at each inspection position as optical component inspection devices, such that a first side of the component is inspected using a first illumination device and a first imaging device, and a second side adjacent to the first side is inspected using a second illumination device and a second imaging device. The optical paths (beam paths) of the two imaging devices may intersect or cross in an X-shape at the point where the component on the pickup tool is positioned at the inspection position.

[0031] In a variation of the device, alternatively or additionally, the pickup tool is configured and designed to pick up a component with four sides to be optically inspected. Two pairs of optical component inspection devices are arranged along the component's transport path, angled outside the transport path of the component along the circumference of the flipping device, wherein the transport path is generally arc-shaped.

[0032] In a variant of the device, alternatively or additionally, the imaging device is provided with infrared (IR) illumination devices arranged opposite to it as illumination devices for infrared transmitted light inspection, wherein each illumination device is activated by a control device when the pickup tool with components is in the inspection area of ​​the respective imaging device, or these illumination devices are permanently activated.

[0033] In a variation of the device, alternatively or additionally, the orientation position is used to correct the position and orientation of the component on the pickup tool, wherein a means for aligning the component is provided, which is designed and configured such that the component is aligned with the center of the pickup tool in at least one orientation at an angle to the transport path and / or in a rotational direction relative to the central longitudinal axis of the pickup tool and / or the component.

[0034] In a variation of the device, alternatively or additionally, the alignment device has two sliders that can approach and diverge from each other, the sliders having relatively oriented sliding sections that are designed and configured to at least partially contact two opposing first sides or sides of the component located on the receiving tool to align the component.

[0035] In a variation of the device, alternatively or additionally, these sliders are designed and configured to slide or rotate the assembly toward the inspection position in a direction relative to at least one of the two sliding sections during the pickup tool holding assembly.

[0036] In one variation of the device, there are 8, 16, 24, 32, 48 or more pickup tools arranged at equal angular intervals along the circumference of a flipping device, which has a circular (ring) or star-shaped shape. To date, the version with 24 pickup tools has proven advantageous in terms of size, accessibility at each location, and speed.

[0037] In one variation of the device, a stroke device is provided at the pick-up position for picking up components from a component reservoir in the holding and feeding device, at the orientation position for centering and aligning components on the pick-up tool, and / or at the placement position for placing components, to induce a radial (Z) stroke of the pick-up tool, which radially extends from the rotation axis of the flipping device toward the component reservoir in the holding and feeding device for picking up components, toward the device for centering and aligning components, and / or toward the receiving device for placing components.

[0038] In a variant of the device, alternatively or additionally, the stroke device has a servo motor or cam / paddle configuration at the corresponding position for the radial (Z) stroke, so that the pickup tool moves in a controlled manner in the longitudinal direction of the pickup tool.

[0039] In one variation of the device, the flipping device is moved in a controlled manner along the flipping axis of the flipping device by a linear drive, so as to receive components from the component reservoir at a precise position on the pick-up tool, and / or place components at a precise position on the drop-off position.

[0040] A method for processing components having multiple sides and / or side edges includes the steps of: providing a component reservoir in a holding and feeding device for a component reservoir, such that the component reservoir faces a pickup position; conveying one of these components at a time from the component reservoir in the holding and feeding device toward or to a corresponding pickup tool in the pickup position via a discharge device; picking up one of the components on the top surface of the components by at least one pickup tool arranged on a flipping device; rotating the pickup tool about a flipping axis in a flipping plane; optionally conveying the component on the pickup tool from the pickup position to one or more orientation positions, optionally to one or more inspection positions, conveying to a placement position, and optionally to a pop-out position; aligning the component reservoir in the holding and feeding device such that at least the component to be released is aligned relative to the pickup tool in the pickup position, with the side of the component at an acute angle to the flipping plane forming an angle of about 30° to about 60° with the flipping plane, or the side of the component at an obtuse angle to the flipping plane forming an angle of about 120° to about 150° with the flipping plane.

[0041] Subsequently, optical inspection of the aforementioned sides of the component can be performed at the inspection position, and / or it can be aligned at an orientation position. In another variation, the apparatus for inspecting a component having at least one top surface, multiple sides to be inspected, and / or side edges has at least one pick-up tool arranged on a flipping device for one of the components in each case. The pick-up tool is designed and configured to pick up the component from the top surface of the respective component. The flipping device is designed and configured to rotate the component along a transport path about a flipping axis in a flipping plane using the pick-up tool, and in the process, transport the component on the pick-up tool at an angle to the flipping path or flipping plane to the inspection position. At the inspection position, the first and second imaging devices, which are optical component inspection devices, are arranged at an angle to each other such that the first side or edge of the component at the inspection position is inspected by the first imaging device, and the second side or edge of the component at the inspection position adjacent to the first side or edge is inspected by the second imaging device.

[0042] In a variant of this apparatus, alternatively or additionally, two pairs of optical component inspection devices are arranged along the component's transport path. These inspection devices are arranged at an angle outside the transport path of the component along the circumference of the flipping device, wherein the transport path is generally arc-shaped. In another variant of this apparatus, alternatively or additionally, the imaging device is equipped with infrared (IR) illumination devices arranged opposite it for infrared transmitted light inspection. When the pickup tool carrying the component is within the inspection area of ​​the corresponding imaging device, each illumination device is activated by a control device, or these illumination devices are permanently activated.

[0043] In a variation of this device, alternatively or additionally, two optical component inspection devices, each in the form of an imaging sensor and its illumination device, are arranged at two inspection positions in an X-shaped optical path configuration, such that the first illumination device points towards the first imaging device and the second illumination device points towards the second imaging device. A pickup tool is configured and designed to transport the components to an area where the optical paths intersect or cross.

[0044] In a variant of the device, alternatively or additionally, when the components are in the respective positions, each of the inspection positions has two adjacent sides, in other words, two non-parallel sides are simultaneously optically inspected, while the imaging device and / or its illumination device do not need to enter the transport path of the components, or the components on the pick-up tool do not need to move radially outward or inward to enter the optical path of the imaging device and its illumination device.

[0045] In a variant of the device, alternatively or additionally, the pick-up tool on the flipping device is configured and designed to pick up the component and transport the component along the transport path of the component with the side of the component to be optically inspected passing through at least one or two pairs of optical component inspection devices, which are configured and designed to inspect two adjacent sides respectively.

[0046] In a variation of the device, alternatively or additionally, the component can be inspected using transmitted light and / or incident light, specifically by having the imaging device correspond to an infrared (IR) transmitted light or incident light illumination device as an illumination device, which is oriented at a point where the side of the component to be inspected is in the corresponding inspection position.

[0047] In a variation of the device, the component is transported at an angle to the transport path, or alternatively or supplementally, wherein two imaging devices and their illumination devices are respectively provided at the inspection position, each equipped with a deflection device for the optical path.

[0048] In a variant of the device, alternatively or additionally, the imaging device, its illumination device, and / or deflection device are moved into and out of the component's transport path by a corresponding linear actuator.

[0049] In a variant of the device, alternatively or additionally, the deflection device is designed to deflect / reflect completely or partially and to enter radially below the component to be inspected (between two adjacent pick-up tools) at a position where it is fully retracted into the transport path of the component.

[0050] In a variant of the device, alternatively or additionally, for a reflective imaging device used to inspect the side or edge of a component, an illumination device is provided on one side of the imaging device on the side or edge of the component.

[0051] In a variant of this apparatus, alternatively or additionally, for the incident light imaging device used to inspect the end face of the component remote from the pickup tool and / or to inspect the position / or orientation of the component on the pickup tool, an imaging device and its illumination device (with different wavelengths depending on the situation) are arranged, as well as a deflection device that is transparent to the portion of the optical path from the imaging device to the end face of the component, and / or other illumination devices surrounding the deflection device. This configuration is used to inspect the position / or orientation of the component on the pickup tool. In a variant of this apparatus, alternatively or additionally, the imaging device and the illumination device are moved relative to the component by a corresponding linear actuator, and the deflection device may also be moved, depending on the situation.

[0052] In one variation, alternatively or additionally, the device is equipped with two sliders that can move closer to and further away from each other, these sliders having, for example, sliding sections oriented parallel to each other. These two sliding sections are designed and configured to at least partially contact two, for example, opposing first sides of a component located on the pickup tool, in order to align the component.

[0053] In one variation, alternatively or additionally, these sliders are designed and configured to push and / or rotate the component toward the inspection position, for example, in a direction perpendicular to at least one of the two sliding sections, while the component is held by the pick-up tool (e.g., by negative pressure). Alternatively or additionally, at one or more optional successive directional positions, in each case, a similar means is provided for aligning the component for the first device in order to align the component in a further axial direction and / or rotational direction.

[0054] In one variation, the proposed device has 8, 16, 24, 32, 36, 48 or more picking tools arranged at equal angular intervals along the circumference of the annular or star-shaped flipping device.

[0055] Depending on the spatial conditions and the dimensions of the components corresponding to the device (diameter of the flipping device, pickup tools, alignment devices, imaging devices, etc.), for example, in a variant with 24 pickup tools, along the circumference of the flipping device...

[0056] The first position (0°) has a pickup position for picking up components from the substrate.

[0057] The second position (45°) is provided with an orientation position for centering and aligning the components on the pickup tool.

[0058] The third position (60°) is equipped with an inspection position for verifying the centering and alignment of the components on the pickup tool.

[0059] The fourth position (90°) provides an inspection position for optically inspecting two (e.g., adjacent) sides of the component.

[0060] The fifth position (105°) provides an inspection position for optically inspecting the other two (e.g., adjacent) sides of the component.

[0061] The sixth position (180°) is provided with a placement position for placing the component into a container or another substrate, and in

[0062] Position 7 (240°) provides a pop-up location for removing the component from the process. The angle illustration along the circumference of the flipping device is for illustrative purposes only.

[0063] A radial (Z) stroke of the pickup tool is caused at the pickup position of the substrate pickup assembly, the orientation position for centering and aligning the assembly on the pickup tool, and the placement position for placing the assembly, respectively, the stroke being directed toward the substrate for picking up the assembly, toward the means for centering and aligning the assembly, or toward the receiving means for placing the assembly.

[0064] In the inspection position used for optical inspection, the components on the pick-up tool remain in a corresponding radially non-working position, i.e., do not radially move away from the rotation axis of the flipping device with the radial (Z) stroke of the pick-up tool. In a variant of this type of device, a linear drive is provided for the pick-up tool assigned to the flipping device.

[0065] These linear actuators engage with correspondingly positioned pickup tools from outside the flipping device, extending and retracting the respective pickup tools radially. In another variation, these linear actuators extend only the respective pickup tool, while a return spring retracts the respective pickup tool. In yet another variation, each of the pickup tools is equipped with a bidirectional or unidirectional radial actuator.

[0066] Here, alignment by pushing and rotating the component to the inspection position means that the sliding section moves the component on the pickup tool so that the component is as close as possible to the depth of field of the corresponding camera configuration in the next inspection. The component does not need to be precisely aligned in these two directions (X and Y axes) and in the rotational direction (around the Z axis). The component only needs to be aligned so that its side and top surfaces, which are to be observed in the corresponding inspection, are as perpendicular as possible to the optical axis of the corresponding camera configuration and are fully aligned within the field of view of the corresponding camera configuration.

[0067] In one variation, the first and / or second slider each have a driver to change the radial distance between the corresponding sliding segment and the pickup tool of the corresponding flipping device relative to the flipping axis. Therefore, each slider has its own driver to change the distance between the corresponding sliding segment and the top surface of the corresponding pickup tool along the corresponding longitudinal central axis of the pickup tool. This allows adjustment of the location where the corresponding sliding segment engages with and contacts the side of the assembly.

[0068] In another variation, alternatively or additionally, the sliders acting together on the flipping device are configured and designed to move in the same direction and at least approximately synchronously toward or away from the corresponding inspection position of the component. This propels and rotates the component to the corresponding inspection position.

[0069] A method for inspecting an assembly having at least one top surface, multiple sides and / or side edges to be inspected, comprising the steps of: providing pick-up tools arranged on a flipping device for one of the assemblies; picking up the assembly on the top surface of the assembly by means of the pick-up tools at an angle to a flipping path or flipping plane to transport the assembly to an inspection position; rotating the flipping device and the pick-up tools to transport the assembly to the inspection position along a flipping path within a flipping plane; providing first and second imaging devices arranged at an angle to each other (and at an angle to the flipping plane) as optical assembly inspection devices at the inspection position; inspecting a first side surface or edge of the assembly at the inspection position using the first imaging device; and inspecting a second side surface or edge of the assembly at the inspection position adjacent to the first side surface or edge using the second imaging device.

[0070] Therefore, the configuration proposed herein forms an integrated processing / inspection device. The imaging sensor inspects all or almost all of the top and / or sides of the component and provides relevant data for the positioning of the pickup tool (robotic arm, pickup tool) and the receiving point.

[0071] Therefore, this device forms the core of a closed machine system with the necessary process technology peripherals, such as for providing components (e.g., on a wafer substrate) and providing component placement (e.g., in a slot or carrier tape).

[0072] The component processing apparatus proposed herein uses, for example, a fixed-position unloading device (ejection unit) to receive components from, for example, a component reservoir (wafer disk) arranged horizontally in the area above the component processing apparatus. The component reservoir moves relative to the ejection unit in this plane. The ejection unit operates by needles or in a non-contact manner, thereby releasing components one by one from the component reservoir and picking them up by a pick-up tool. The ejected components can be sequentially conveyed to multiple inspection steps and finally placed at a placement position. The terms "receiving point," "placement position," and "slot" are used synonymously herein. Defective components identified can be rejected. The component optical inspection integrated into the conveying process is divided into multiple inspection steps. This inspection uses one or more imaging sensors configured as cameras to optically inspect the top surface and / or sides of the component and the position of the pick-up tool at the receiving point. These imaging sensors are configured to acquire at least one image of the top surface and / or sides of the component in each of the multiple inspection steps. The components are conveyed / transported while the pick-up tool of the flipping device holds one component at a time. The held components pass through each inspection step during transport. The image data detected by the imaging sensor is also used to coordinate the positional adjustments of the robotic arm (pickup tool) and the receiving point. The component transport is configured to transport components generally continuously or periodically along their path.

[0073] In one variation, components are transported from a horizontal component storage area to a horizontal placement area. Alternatively, the component storage area and placement area can be arranged at an angle to each other; for example, a horizontal component storage area and a vertical placement area can be configured.

[0074] Furthermore, in a variation of this device, a holding and feeding device for the component storage and placement positions is electrically or manually moved in controlled directions (X-axis, Y-axis, rotation angle), such as a belt or pallet with a loading groove. This allows the corresponding components to be delivered to the pick-up tool or transported to the placement position in the desired orientation and location.

[0075] The configuration and method presented herein have two functional aspects: processing and inspection. These two functions can be intertwined in time and space to enable rapid and accurate qualitative evaluation of multiple (up to six or more) sides of components, while simultaneously removing these components individually from the component storage and accurately placing them at receiving points after inspection and classification as acceptable parts. The device has an adjustable tilting mechanism, for example, in a star or wheel shape. In one variant, the device has a polygonal shape. The tilting mechanism carries multiple pick-up tools, which in several variants are also radially movable relative to the rotation axis of the tilting mechanism, to convey the components, fixed on the pick-up tools, within the rotational angle between component pickup and discharge to one or more processing stations for positioning, inspection, and rejection of defective parts, and, as appropriate, to other stations.

[0076] In the proposed device, a star-shaped or wheel-shaped flipping device carries components on radially outward-facing pickup tools arranged on an imaginary circumference of the flipping device. This differs from devices where the pickup tools of the flipping device are oriented parallel to the rotation axis of the flipping device.

[0077] Depending on the number of picking tools in the flipping device, multiple components can be accommodated on the flipping device at the same time. Therefore, each inspection step can also be performed simultaneously on different components.

[0078] In each inspection step, the top (upper / lower) surface and / or (lateral) side surface of the component inspected by the imaging sensor can be different top surfaces and / or side surfaces of the component.

[0079] According to one aspect of optical inspection, the component transport completes the component path with extremely short pauses at each location. During this movement or within the shortest possible pause, one or more top and / or side surfaces of the component are inspected using an imaging device. These images are then evaluated using image processing methods.

[0080] According to a variant of this optical inspection / check, one or more color imaging sensors or black and white imaging sensors are provided as imaging devices, wherein in one variant, the sensors and optical components are optimized for certain light wavelength ranges, such as infrared light, white light, or UV light.

[0081] The imaging sensor may have one or more mirrors, optical prisms, lenses, or such optical components. The imaging sensor may be equipped with radiation sources or light sources. Each radiation source or light source is configured to emit light / radiation with a different spectral range or wavelength range to illuminate at least a segment of the component. These wavelength ranges may be at least partially offset, overlap, or coincident. Thus, the light from the first source may be, for example, red, and the light from the second source may be, for example, blue. However, reverse correspondences or other wavelength pairs (e.g., infrared and visible light) may also be selected.

[0082] The light source can be briefly switched on via a control device the instant the pickup tool with the component is within the corresponding inspection range, thereby exposing the top surface and / or side surface of the component to a brief flash for inspection by the corresponding imaging sensor. Alternatively, permanent illumination can be applied.

[0083] In one variant, the device includes a discharge device configured to release one component at a time from a structured component reservoir onto a pick-up tool of a flipping device, positioned accordingly by a control device. This discharge device can be a component ejector that ejects the component through a wafer carrier film using a needle, or a laser pulse generator that specifically reduces the adhesion of the component to the carrier film, causing the component to separate from the carrier film. The discharge device is also equipped with position and / or characteristic sensors, configured to inspect the position and / or characteristics of the component to be released, and / or the characteristics of the component to be released, and use this information to control the operation of the discharge device.

[0084] In one variant, when the device is used, the pick-up tool of the flipping device is configured to extend and retract in a controlled manner radially relative to the rotation axis or rotation center of the flipping device, and / or to be subject to controlled negative pressure and / or overpressure to receive or release the component to be transported, and / or to be immovable about its respective radial axis of motion, or to be controlled to rotate about its respective radial axis of motion at a certain rotation angle.

[0085] In one variation of the device, the valve provides each of the pickup tools with a separate and appropriately positioned negative and overpressure inlet to perform the following functions in a free or position-controlled manner: (i) drawing in the component, (ii) holding the component on the flipping device during processing, particularly when centering and aligning the component on the pickup tool and during subsequent inspection, and (iii) placing the component with or without a controlled air pulse, and / or blowing the component free.

[0086] In a variation of this device, the flipping mechanism includes position and characteristic sensors, in the form of optical imaging inspection devices, distributed between the pick-up position and the placement point. These sensors are configured to inspect and use the position data and / or characteristics of the conveyed components, as well as / or position data for adjusting the position of the pick-up tool and the placement point, for control purposes.

[0087] In one variant of the device, at least some of the position and characteristic sensors are configured to inspect at least one top surface and / or one or more sides of the conveyed component to record its position data and / or characteristics and make them available to the control system. In another variant of the component handling device, the flipping device is equipped with an integer number of n pick-up tools, where n >= 2.

[0088] In one variant of the device, the position / characteristic sensor is an imaging sensor with consistent or different inspection spectra, or a position sensor that measures distance in contact or non-contact manner, or a characteristic sensor that performs inspection in contact or non-contact manner.

[0089] Position and characteristic sensors can be imaging sensors, which have a linear optical axis or an optical axis bent by an optical lens, mirror, prism or grating.

[0090] The imaging sensor system of the position and characteristic sensors, along with its reflector and illumination unit, can be combined in such a spatial arrangement that the inspection of the components on both sides can be performed in parallel at a single processing position. Therefore, a total of two processing positions are required on the flipping device for complete inspection of, for example, all four sides of a square component. The top surface of the component, furthest from the pick-up tool, can be inspected at a third processing position on the flipping device; another imaging sensor can be used to check the correct position of the component at the receiving point.

[0091] Compared to existing technologies, the proposed solution is less expensive and offers greater component throughput, longer inspection time, and lower motion mass. Attached Figure Description

[0092] More features, characteristics, advantages, and possible variations for those skilled in the art will be described in detail below with reference to the accompanying drawings. The drawings schematically illustrate an optical inspection apparatus for components.

[0093] Figure 1 A side view of a device for handling components is shown, in which the component is conveyed from a pick-up position to a drop-off position via a flipping device.

[0094] Figure 1a , Figure 1b The (electronic) component is shown, which has a prismatic shape and appears as a quadrilateral or square shape in top view, including four sides as well as a bottom and top surface.

[0095] Figure 2 The diagram illustrates how multiple pick-up tools rotate around a flip axis in a flip plane on a flipping device, and how components on the respective pick-up tools are transported from a pick-up position to one or more orientation positions, one or more inspection positions, a drop position, and a pop-up position during this process.

[0096] Figure 3 Three variations of the component’s angular orientation relative to the flip plane are shown.

[0097] Figure 4 The diagram illustrates how the pickup tool picks up the component and how it transports the component along its transport path through two pairs of optical component inspection devices with the side to be optically inspected facing it.

[0098] Figure 4a This illustrates how an assembly on a pickup tool with four sides to be optically inspected is inspected by two pairs of optical component inspection devices at a single inspection position.

[0099] Figure 5 A device for calibration using two V-shaped sliders is shown, which are laterally fed from the outside to two opposite corners of component C. The sliders then move to the opposite corners.

[0100] Figure 6 It shows how the component is transported from the pick-up position to the drop-off position along an orientation at an angle to the transport path, and that two imaging devices and their illumination devices are provided at each of the two inspection positions.

[0101] Figure 7 This demonstrates how to use reflected light images to inspect the end face of a component and its position / orientation on a pickup tool.

[0102] Figure 8 The stroke device is shown at the pick-up position, orientation position, and drop position of the component. Detailed Implementation

[0103] Figure 1 A component processing apparatus is shown for removing prismatic components C, in the form of electronic semiconductor chips, from a component reservoir BV and placing them on a receiving device 300, which may be constructed, for example, as a slotted tape or carrier tape, a (thin-film) substrate, or a tray having (placement) slots arranged in multiple rows and columns. The component processing apparatus proposed herein receives the component C at a pick-up position 20 from a component reservoir BV, which is horizontally arranged in the area above the component processing apparatus. This component reservoir is in the form of a wafer disk, which is housed in a holding and feeding device 30 facing the pick-up position 20.

[0104] In the variant shown (see also...) Figure 1a , Figure 1b Component C is an electronic component with a prismatic shape that appears quadrilateral in top view. It has four sides a, b, c, and d, as well as top and bottom surfaces e and f. The top and bottom surfaces e and f of component C are prismatic.

[0105] The component handling device has a flipping device 150 in the form of a flipping wheel. At the radial outer edge region of the flipping device 150, a plurality of (16 in the illustrated variant, but also 8, 24, 32 or other numbers) picking tools 160 are arranged at equal angular intervals along the circumference of the flipping device 150, which has an annular or star-shaped shape.

[0106] Each of the pick-up tools 160 is used to pick up a component C from the component reservoir BV at pick-up position 20 with the top surface e of the component. The flipping device 150 has a motor drive such that it rotates about a flipping axis WA within a flipping plane WE. The flipping plane coincides with the plane from which the pick-up tool 160 rotates. The flipping axis WA coincides with the central axis of the wheel-shaped flipping device 150. In the illustrated variant, during rotation, the component C on the pick-up tool 160 is conveyed from pick-up position 20 to one or more (here, one) orientation positions 22, 24, to one or more inspection positions 26, 28, to placement position 32, and optionally to ejection position 34.

[0107] For this purpose, the pickup tool 160 is arranged radially outward on the (imaginary) circumference of the star-shaped or wheel-shaped flipping device 150 and carries the component C. In the variant shown, the pickup tool 160 is radially movable relative to the flipping axis WA of the flipping device 150. Thus, these pickup tools 160 pivot within a pivot angle (here between 0° and 180°) between the pickup position 20 and the lowering position 32 (or up to the ejection position 34) and deliver the component, each fixed to one of the pickup tools 160.

[0108] In the illustrated variant, the unloading device 180 includes needles controlled by a control device, or the unloading device, for example, uses a laser beam in a non-contact manner to release components C one by one from the component reservoir BV and then supply them to the flipping device 150. Each pick-up tool 160 is configured to receive a component from the component reservoir BV at the pick-up position 20 when it is closest to the unloading device 180 at the 0° position of the flipping device 150. Thus, the unloading device 180 delivers one component C at a time from the component reservoir BV located in the holding and feeding device 30 to the corresponding pick-up tool 160 at the pick-up position 20.

[0109] The holding and feeding device 30 is mounted in such a way that it can rotate about its central longitudinal axis, such that the component C to be released from the component storage BV is aligned with the picking tool 160 in the picking position 20, such that the sides a, b, c, d of the component C to be optically inspected, which are at an acute angle to the flipping plane WE, form an angle alpha of about 30° to about 60° with the flipping plane WE, or the sides of the component C to be optically inspected, which are at an obtuse angle to the flipping plane WE, form an angle beta of about 120° to about 150° with the flipping plane WE. Figure 3 The above scenario is illustrated by showing three variations of the position of component C relative to the flip plane WE within a given angular range.

[0110] In other words, the side edge g of component C, which is substantially perpendicular to the top or bottom surface of component C, is located in front of the two sides a, b adjacent to the side edge g of component C on the flipping or transport path WB along the circumference of component C from the pick-up position 20 to the drop position 32 (or to the pop-out position 34). This is in Figure 2 Shown in.

[0111] This ensures that the side of component C to be optically inspected is not oriented transversely to the flipping plane WE along the circumference of the flipping device 150. Therefore, the side of component C to be inspected can be inspected without the imaging device and its illumination device needing to enter the flipping path WB or transport path of component C, or without component C on the pick-up tool 160 needing to move radially outward or inward to enter the optical path of the imaging device and its illumination device. However, on the transport path of component C from pick-up position 20 to drop position 32 on a (single) flipping device 150, all four sides can be inspected (e.g., in the case where component C has four sides). This cannot be achieved with known devices to date, which require two orthogonal flipping devices to transport the component from one flipping device to the other.

[0112] To draw component C into pickup tool 160, to hold component C on pickup tool 160, to place component C with or without controllable air pulses, and to freely blow component C out of pickup tool 160, pickup tool 160 is connected to a pneumatic unit (not shown further). Under the control of a control device, the pneumatic unit applies overpressure or negative pressure to each pickup tool 160 at necessary times or for necessary periods of time in a valve-controlled manner to pick up, hold, and release component C respectively.

[0113] Figure 1 An imaging device 320 (at 45°) is shown, which can be used to inspect the position / orientation of component C on the pickup tool 160 and evaluate it in the control device before the component C is transported to inspection positions 26, 28. Figure 1 An imaging device 332 (at 180°) is also shown, which can be used to check the position / orientation of component C in the receiving device 300 and to evaluate it in the control device, and an imaging device that can be used to check the position / orientation of component C at the receiving position and to evaluate it in the control device.

[0114] In the variant shown, component C is transported from the pick-up position to the placement position 32 with its sides a, b, c, d oriented at an angle of approximately 45° or 135° (± approximately 30°) relative to the flipping plane WE. Component C is protected from / unaffected by the components of the optical component inspection device along the flipping or transport path WB of the flipping device 150 circumference.

[0115] Figure 4 The diagram illustrates how two high-resolution (4-12 megapixels in one variant) imaging sensors and their illumination devices 306A, 306B, 308A, 308B (in one variant, configured as infrared LEDs) and optical component inspection devices 302A, 302B, 304A, 304B are arranged in an X-layout to perform transmitted light inspection at each of two consecutive inspection positions 26, 28. At the first inspection position 26, the first illumination device 306A points towards the first imaging device 304A, and the second illumination device 308A points towards the second imaging device 302A. At the second inspection position 28, the second illumination device 306B points towards the second imaging device 304B, and the second illumination device 308B points towards the second imaging device 302B.

[0116] Therefore, when component C is in the corresponding position, two sides are simultaneously optically inspected in each of the two consecutive inspection positions, and the imaging device and its illumination device do not need to enter the transport path of component C, or component C on the pick-up tool 160 does not need to move radially outward or inward to enter the optical path of the imaging device and its illumination device.

[0117] Figure 4 The diagram specifically illustrates how the pickup tool 160 picks up component C on the flipping device 150 and how component C is transported along the transport path WB of component C along the circumference of the flipping device 150 through the two pairs of optical component inspection devices, with the four sides a, b, c, and d to be optically inspected. These optical component inspection devices are arranged at an angle outside the generally arc-shaped transport path WB of component C along the circumference of the flipping device 150. One pair of imaging devices 302A, 304A, 302B, 304B and their illumination devices 306A, 308A, 306B, 308B are respectively arranged at inspection positions 26 and 28, and respectively inspect two adjacent sides a, b, c, and d.

[0118] Therefore, at the first inspection position 26, the first pair of imaging devices 302A, 304A and their illumination devices 306A, 308A inspect the adjacent side surfaces d and a of component C under transmitted light, and at the second inspection position 28, the second pair of imaging devices 302B, 304B and their illumination devices 306B, 308B inspect the adjacent side surfaces c and b of component C under transmitted light.

[0119] In a variant of the device, to further shorten the cycle, the first pair of imaging devices 302A, 304A and the second pair of imaging devices 302B, 304B may each correspond to a separate image data processing device, which is used to evaluate the acquired image data of the side of component C. These image data processing devices may be connected to a central machine control device.

[0120] In the variant shown, component C is inspected under transmitted light (with infrared light). Alternatively, a configuration using reflected light can also be employed, where illumination devices 306, 308, for example, annularly surround imaging devices 302, 304 or are designed to emit two arrays (LEDs) of different wavelengths and oriented at a position where the sides a, b, c, d to be inspected are at their respective inspection positions 26, 28.

[0121] Here, the optical component inspection device is respectively arranged in a manner consisting of... Figure 4 The two lines in the middle define the outer edge of the channel.

[0122] Therefore, infrared (IR) and / or reflected light illumination devices 306, 308 are associated with each of the imaging devices 302, 304 as illumination devices for infrared transmitted light inspection and / or reflected light inspection. Each illumination device 306, 308 is activated by a control device that synchronizes the image acquisition performed by the imaging devices 302, 304 when the pickup tool 160 with component C is within the inspection area of ​​the corresponding imaging device 302, 304. In another variation, the illumination devices 306, 308 are permanently activated.

[0123] In one variant, prior to optical inspection of component C, the position and orientation of component C on the pickup tool 160 are corrected at one or more orientation positions 22, 24, or appropriately oriented for subsequent inspection. Figure 4 In the variant shown, the device for orienting component C is used to orient component C relative to the center of the pickup tool 160, i.e., the central longitudinal axis of the suction tube 162 of the pickup tool 160, such that it is oriented at an angle to the transport path WB, i.e., 45° in the variant shown, or oriented along the direction of rotation relative to the central longitudinal axis of the pickup tool 160. Therefore, in Figure 4 In the variant shown, alignment devices are arranged at two oriented positions 22 and 24 of component C, respectively at angles (approximately 45° or 135° ± approximately 30°) to the transport path WB. These devices each have two sliders that can approach and diverge from each other. Each slider has a sliding section oriented towards the other sliding section so that, when the slider is closed, it contacts two opposing sides of component C on the pickup tool 160. Thus, component C is aligned for inspection.

[0124] If component C is aligned at the two orientation positions 22, 24, the focusing difficulty of the imaging device and / or its illumination device at the subsequent inspection positions is reduced. In another variation, component C is aligned at an angle to the transport path WB in only one direction, and then the position of component C relative to the pickup tool 160 or its suction tube 162 is checked by the imaging device 320, which is radially external. Optionally, the characteristics of the top surface of component C away from the pickup tool are also checked, and the focusing paths of the imaging devices 302, 304 and / or its illumination devices 306, 308 at the subsequent inspection positions 26, 28 are determined.

[0125] Subsequently, based on these determined focusing paths, the imaging devices 302, 304 and / or their illumination devices are moved by a control device at one or both subsequent inspection positions to focus before / when / during / after the component C reaches the corresponding inspection positions 26, 28. In another variant not further shown, no directional position is provided for aligning the component C. Specifically, the component C received from the component reservoir BV is inspected directly by the radially external imaging device 320 at positions that may have a few degrees and some 1 / 100 mm to several millimeters of distortion, thereby determining the focusing paths of the imaging devices 302, 304 and / or their illumination devices 306, 308 at the two subsequent inspection positions 26, 28 accordingly. The imaging devices and / or their illumination devices are then moved by a control device to focus before / when / during / after the component C reaches the corresponding inspection positions 26, 28.

[0126] If there is at least one means of alignment using two sliders that can be brought close to and separated from each other, the sliders are used to push / rotate component C toward the inspection position in a direction oriented toward at least one of the two sliding sections while the pick-up tool 160 holds component C.

[0127] Figure 4a Another variation of the X-layout illustrates how, at a single inspection position 26, four imaging devices 302A, 304A, 302B, and 304B are aligned with the four sides a, b, c, and d to be inspected of the same component C. Imaging devices 302A, 304A, 302B, and 304B are associated with illumination devices 306A, 306A, 308B, and 308B, respectively. These illumination devices illuminate the corresponding sides a, b, c, and d of component C with incident light using one or more different spectra. This allows for image acquisition of the respective sides via the corresponding imaging devices 302A, 304A, 302B, and 304B.

[0128] Figure 5 A variation is shown in which two generally V-shaped sliders 410, 412 are laterally fed from outside the channel defined by two lines K to two opposite corners of, for example, a quadrilateral component C. Component C is aligned parallel to the legs of sliders 410, 412 and centered relative to the straw 162 of the pickup tool 160.

[0129] Figure 6A variation is shown in which component C (whose side facing the transport path WB, for example, at an angle of about 45° ± about 30° to the transport path WB) is transported from the pick-up position of component C to the placement position 32 of component C with an angular orientation to the transport path WB, and two imaging devices 600 and their illumination devices 610 are respectively provided at these two inspection positions 26, 28 (for clarity, Figure 6 (Only one is shown). Imaging device 600 and its illumination device 610 are respectively assigned to a deflecting device 440, 450 for the optical path, which is in the form of a mirror, and is moved into or out of the transport path WB of component C by means of a control device via corresponding linear actuators 420, 430. Thus, the mirror or prism is completely or partially deflected / reflected, and in the position of being fully inserted into the transport path WB of component C, it extends radially below component C between two adjacent pick-up tools 160. Illumination device 610 may also be assigned a condenser lens 680, depending on the situation. Figure 6 The variant shown allows for the inspection of a transmitted light image of the side of component C using infrared light. For the inspection of a reflected light image of the side of component C, as an alternative to or supplement to illumination device 610, an illumination device is provided on the side of component C facing the imaging device. This illumination device, for example, takes the form of an illumination ring surrounding the object or its optical path, and is directed towards the side or edge of component C to be inspected. Thus, in one variant, visible light, such as blue light, can be used to illuminate the side, which is reflected off the side and inspected by the imaging device.

[0130] Figure 7 The illustrated variant allows reflected light imaging to inspect the front f of component C away from the pick-up tool 160's suction tube 162 and the position / orientation of component C on the pick-up tool 160's suction tube 162. In this variant, the imaging device 700 has illumination devices 710, 720, and 730 containing different wavelengths (here, infrared, red, and blue), and a deflection device 740 in the form of a mirror 750, which is partially transparent to the illumination light from the illumination device 710 for the optical path from the imaging device 700 to the front f of component C. Additional illumination devices 720 and 730 may be optionally provided if the illumination device 710 provides only visible wavelength light and can be arranged as an illumination ring around the deflection device 740. In one variant, the imaging device 700, illumination devices 710, 720, and 730 are moved relative to component C by means of corresponding linear actuators 760, 770, and 780, and the deflection device 740 may also be moved as appropriate.

[0131] If necessary, in a variant (see also) Figure 8A stroke device 900 is provided at one or more of the following locations: at the pick-up position 20 for picking up component C from the component reservoir BV in the holding and feeding device 30; at the orientation position 22 for centering and aligning component C on the pick-up tool 160; and at the placement position 32 for placing component C. The stroke device 900 is used to induce a radial (Z) stroke of the pick-up tool 160, which radially extends from the rotation axis DA of the flipping device toward the component reservoir BV in the holding and feeding device 30 for picking up component C, toward the device for centering and aligning component (C), and / or toward the receiving point 32 of component C. In the illustrated variant, the stroke device 900 for the radial (Z) stroke has cam / paddle configurations 910, 920 at the corresponding positions to allow the pick-up tool 160 to move radially outward in a controlled manner along the longitudinal direction of the pick-up tool 160. The return motion of the pickup tool 160 is achieved by a spring configuration (not shown further). Alternatively, servo motors may also be provided separately. The magnitude of the lifting motion is determined such that component C on the pickup tool 160 is disengaged from other transport paths WB. Rotary drivers for the cam / toggle configurations 910, 920 cause cam 910 to rotate about a rotation axis oriented parallel to the tilting axis WA of the tilting device 150. This rotational motion actuates a rotatably mounted rocker arm 920, the end of which, away from cam 910, is shaped as a plunger. The return motion of toggle 920 is also achieved by a spring configuration. Advantageously, the cam / toggle configurations 910, 920 and their rotary drivers are arranged on the side of the tilting device 150 facing the motor driver of the tilting device 150.

[0132] In one variant, this configuration features only a single flipping device containing, for example, 24 pick-up tools. This flipping device rotates 45° (or within the range of 30°–60°) relative to the X and Y axes. In this variant, the component storage is positioned above the flipping device, and the placement area is positioned below it. An inspection system with (four) imaging sensors and optical path deflectors (mirrors) for lateral inspection of components at two inspection positions can directly inspect the sides at two non-parallel edges during the rotation or movement of the flipping device, without requiring a Z-stroke for the pick-up tools. The absence of a Z-stroke on the pick-up tools at the side inspection positions saves time, thereby increasing component throughput.

[0133] The methods, apparatus, functions, and operations described herein are provided solely to facilitate understanding of the structure, operation, and characteristics; the disclosure herein is not limited to these embodiments. The accompanying drawings are partially schematic, with key features and effects partially enlarged to illustrate functions, operating principles, technical solutions, and characteristics. Any operating mode, principle, technical solution, or feature disclosed in the drawings or text can be freely combined with any feature in any claim, specification, or other drawings, or with other operating modes, principles, technical solutions, and features included in or derived from this disclosure. Any conceivable combination can be assigned to the processing described herein. Furthermore, combinations between individual embodiments in the various sections of the specification and claims, as well as combinations between different solutions in the specification, claims, and drawings, also constitute the disclosure of this invention. The claims do not limit the disclosure of this invention or the possible combinations of all disclosed features. Clearly, all disclosed features, whether as a single feature or in combination with all other features, are part of the disclosure of this invention.

Claims

1. An apparatus for inspecting a plurality of components (C), said component (C) having at least one top surface, a plurality of sides to be inspected (a, b, ...) and / or the edges of these sides (a, b, ...), The device has at least one picking tool arranged on the flipping device, the picking tool being used in each case for one of the plurality of said components (C), the picking tool being designed and configured to pick up said component (C) from the top surface of said component (C). For this purpose, the flipping device is designed and configured such that, The component (C) is rotated about the flip axis (WA) along the transport path (WB) within the flip plane (WE) using the pick-up tool. This transports the component (C), which is positioned on the pickup tool and oriented at an angle to the transport path (WB) or the flipping plane (WE), to the inspection position, and At the inspection position, the first imaging device and the second imaging device, serving as optical component inspection apparatuses, are arranged at an angle to each other such that a first side or edge of the component (C) at the inspection position is inspected by the first imaging device, and a second side or edge of the component (C) adjacent to the first side or edge at the inspection position is inspected by the second imaging device, wherein... The component (C) is inspected under transmitted light and / or reflected light, wherein each of the imaging devices (302, 304) is associated with an infrared (IR) transmitted light and / or reflected light illumination device (306, 308) as an illumination device, and each illumination device is oriented at a position where the sides to be inspected (a, b, c, d) are in the corresponding inspection positions (26, 28).

2. The apparatus for inspecting a plurality of components (C) as claimed in claim 1, wherein, Two pairs of optical component inspection devices are arranged along the transport path (WB) of the component (C), each of the optical component inspection devices being arranged at an angle outside the transport path (WB) along the circumference of the flipping device, wherein the transport path (WB) of the component (C) is generally arc-shaped.

3. The apparatus for inspecting a plurality of components (C) as described in any of the preceding claims, wherein, The imaging device is associated with an infrared (IR) illumination device in each case as an illumination device for infrared transmission light inspection, wherein each illumination device is activated by a control device or is permanently activated when the pickup tool with the component is in the inspection area of ​​the corresponding imaging device.

4. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein at two consecutive inspection positions (26, 28), two imaging devices (302A, 302B, 304A, 304B) and their illumination devices (306A, 306B, 308A, 308B) are arranged in an X-shaped optical path for transmitted light inspection. The two consecutive inspection positions (26, 28) include a first inspection position (26) and a second inspection position (28), wherein at the first inspection position (26), the first illumination device ( The second illumination device (306A) points to the first imaging device (304A), the second illumination device (308A) points to the second imaging device (302A), and at the second inspection position (28), the second illumination device (306B) points to the first imaging device (304B) and the second illumination device (308B) points to the second imaging device (302B), and the pickup tool is configured to deliver the component (C) to the area of ​​the corresponding inspection position (26, 28), in each case two of these optical paths intersect or cross within the area.

5. The apparatus for inspecting a plurality of components (C) as described in claim 1 or 2, wherein, With the component (C) in the corresponding position, two sides of each of these inspection positions are simultaneously optically inspected, and the imaging devices and / or their illumination devices do not enter the transport path of the component (C), or the component (C) on the pickup tool does not move radially outward or inward to enter the optical path of the imaging devices and their illumination devices.

6. The apparatus for inspecting a plurality of components (C) as described in claim 1 or 2, wherein, The pick-up tool (160) on the flipping device (150) is configured and designed to pick up the component (C) and transport the component (C) along the transport path (WB) of the component (C) through at least one or two pairs of optical component inspection devices with the sides (a, b, c, d) to be optically inspected. These optical component inspection devices are configured and designed to inspect two adjacent sides (a, b, c, d) respectively.

7. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein, The component (C) is inspected by incident light through four imaging devices (302A, 304A, 302B, 304B) arranged in an X-shape at a single inspection position (26), each of which is assigned an illumination device (306A, 306A, 308B, 308B) configured to illuminate the component (C) with incident light when the pickup tool has delivered the component (C) to the area of ​​the inspection position (26), thereby inspecting the corresponding inspection sides (a, b, c, d) of the component (C) in an X-shape.

8. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein the components (C) are conveyed in an orientation angular to the transport path (WB), wherein, Two corresponding imaging devices (600) and their illumination devices (610) are provided at the inspection positions (26, 28). Each imaging device (600) is associated with a deflection device (420, 430) for the optical path. The imaging device (600), its illumination device (610) and / or deflection device (440, 450) associated with the first inspection position and / or the second inspection position (26, 28) are moved into and out of the transport path (WB) of the component (C) by corresponding linear drivers, and / or the deflection device (440, 450) is designed to deflect / reflect completely or partially.

9. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein, An illumination device is provided for the incident light imaging device for inspecting the side or edge of component (C) on one side of the imaging device.

10. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein at a single inspection position (26), four imaging devices (302A, 304A, 302B, 304B) are arranged in an X configuration pointing toward four sides (a, b, c, d) of the same component (C), each of the imaging devices (302A, 304A, 302B, 304B) being provided with an illumination device (306A, 306A, 308B, 308B) illuminating the corresponding sides (a, b, c, d) of the component (C) under reflected light.

11. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein, An incident light imaging device (700) for inspecting the surface (f) of the component (C) away from the pickup tool (160) and / or inspecting the position / or orientation of the component (C) on the pickup tool (160) has an illumination device including different wavelengths, a deflection device that is transparent to the portion of the optical path from the imaging device to the front of the component (C), and / or other illumination devices surrounding the deflection device, and / or wherein the imaging device (700), the illumination device and / or the deflection device are moved relative to the component by a corresponding linear driver.

12. The apparatus for inspecting a plurality of components (C) as claimed in claim 1 or 2, wherein one of the holding and feeding devices is designed and configured to align the component reservoir (BV) together with the component (C) to be released relative to the pick-up tool in the pick-up position such that, in each case, at least for the components (C) released from said component reservoir (BV), The side of the component (C) that forms an acute angle with the flip plane (WE) forms an angle of 30° to 60° with the flip plane (WE), or, The side of the component (C) that forms an obtuse angle with the flip plane (WE) forms an angle of 120° to 150° with the flip plane (WE).

13. A method for inspecting a plurality of components (C), said components having at least one top surface, a plurality of sides (a, b, ...) to be inspected, and / or the edges of these sides (a, b, ...), the method comprising: Provides a picking tool for one of the plurality of components (C) in each case arranged on the flipping device; The component (C) is picked up from the top surface of the assembly using the picking tool at an angle to the transport path (WB) or the flip plane (WE) to transport the component (C) to at least one inspection position. Rotate the flipping device and the picking tool to transport the component (C) along the transport path (WB) within the flipping plane (WE) to the inspection position, and A first imaging device and a second imaging device arranged at an angle to each other are provided at the inspection position as an optical component inspection device, and The first imaging device is used to examine the first side or edge of the component (C) at the examination location. The second imaging device is used to inspect the second side or edge of the component (C) adjacent to the first side or edge at the inspection position, wherein the component (C) is inspected under transmitted light and / or with reflected light, wherein each of the imaging devices (302, 304) is associated with an infrared (IR) transmitted light and / or reflected light illumination device (306, 308) as an illumination device, each illumination device being oriented at a position where the sides to be inspected (a, b, c, d) are in the corresponding inspection positions (26, 28).

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