Method for inspecting defects of LED circuit board

Abstract

The present application relates to a kind of LED circuit board defect repair method suitable for, by high-precision automatic testing machine, LED circuit board is detected, generates test result data file.Test result data file is converted, generates the connection test data suitable for connection flying probe machine.Connection flying probe machine is detected to the connection test data.Generation final detection result.Therefore, only need to make a set of tool can test hundreds of thousands of points LED board, the open-circuit defect data obtained after testing.Can be realized by software to convert test result data file, let defect data become the repair data readable by flying probe machine.Can utilize connection flying probe machine to complete connection repair for each board once, greatly improve test repair efficiency, eliminate the risk of missing test caused by multiple tests.Can realize automatic detection, free from complicated manual operation.

Description

TECHNICAL FIELD

[0001] The present application relates to a maintenance method, in particular to a maintenance method for LED circuit board defects. BACKGROUND

[0002] The existing connection test system and method can only solve the problems of conventional mainboards, memory bar boards, automobile boards, and early ordinary LED boards, and the relatively simple circuit boards of which each unit is tested once. The mold used during testing is greatly limited in use, thereby failing to safely, effectively, quickly, and at low cost solve the problem of connection test.

[0003] For example, the size of an LED substrate is 132.5*170mm, and the lamp bead welding surface has 60000 welding points (i.e. test points). Due to the existing conventional PCB test equipment itself and the supporting test fixture (or mold) manufacturing capability, it is impossible to make a set of fixtures to test all 60000 test points of the board. According to the network relationship of the internal circuit of the board, it may be divided into 5 or 6 sets of fixtures, that is, the same board needs to be tested 5-6 times using 5-6 different fixtures. That is, each time the test is completed, the fixture on the equipment needs to be removed and another set of fixtures needs to be installed for testing. This process is repeated 5-6 times. If there is an open defect in each test, the same board needs to be tested 5-6 times.

[0004] The disadvantages of the above existing method are obvious. Not only does the cost of making fixtures increase exponentially, but because the same board needs to be tested repeatedly, the test efficiency is greatly reduced, and the test site management is greatly troubled, thereby greatly increasing the risk of missed testing.

[0005] If the existing method is used for higher precision and higher density LED boards and mini LED boards (the number of test points on the lamp bead surface is from 100,000 to 300,000, and the test point diameter is about 0.08mm), it is impossible to divide them into more sets of fixtures, and due to the number of points and the network relationship of the board, it is also impossible to divide them into more sets of fixtures to solve the test problem.

[0006] In short, the existing technology has the following technical defects:

[0007] (1) The particularity of the LED circuit board, that is, the number of test points reaches tens of thousands or hundreds of thousands, and at present, there is no fixture test machine that can test once. It must be tested by using a special step-by-step test method for LED circuit boards.

[0008] (2) The density of the lamp bead surface pad of the LED circuit board is high. Due to the consistency of the pattern, it is difficult to find the accurate corresponding point even by using a microscope by artificial means, so it is impossible to perform maintenance.

[0009] (3) LED line board test and maintenance need to confirm the electrical performance of the upper and lower two lines, so you must use a specific device to accurately locate the test, the implementation of high cost.

[0010] In view of the above-mentioned defects, the present design person actively researches and innovates, in order to create a LED line board bad defect repair method, so that it has more industrial use value. SUMMARY

[0011] To solve the above technical problems, the purpose of the present application is to provide a LED line board bad defect repair method.

[0012] The LED line board bad defect repair method of the present application comprises the following steps:

[0013] Step one, through the high-precision automatic testing machine, the LED line board is detected, and the test result data file is generated;

[0014] Step two, convert the test result data file to generate a connection test data suitable for a connection flying probe machine;

[0015] Step three, through the connection flying probe machine and the connection test data obtained after conversion, the LED line board with defective defects is detected;

[0016] Step four, generate the final detection result.

[0017] Further, the LED line board bad defect repair method, wherein the test result data file is a data packet containing defect Log, which is packaged and saved in the dat format used by the high-precision detection machine.

[0018] Further, the LED line board bad defect repair method, wherein the content of the data packet includes material number name, batch number plate serial number, date and time, test bench number, test block number, bad code, test pcs skip quantity, test result layout.

[0019] Further, the LED line board bad defect repair method, wherein the test result data file is converted in step two,

[0020] (1) receive the test result data file;

[0021] (2) through the point coordinate file provided by the engineering design department;

[0022] (3) set the import position of the test result data file and the directory position of the point coordinate file, and set the save position of the output connection flying probe machine Log data;

[0023] (4) According to the actual density of the converted material number, set the lower starting point, according to the moving amount of the step test of the converted material number, input the corresponding movement compensation value, and set the step value according to the actual test step number;

[0024] (5) Data conversion, generate a wired test data suitable for a wired flying probe machine.

[0025] Further, the above-mentioned LED circuit board defect repair method, wherein the wired test data is converted into a two-dimensional code for printing output; or, the wired test data is converted into a bar code for printing output.

[0026] Further, the above-mentioned LED circuit board defect repair method, wherein the wired flying probe machine scans the wired test data, and obtains the flying probe wired data inner coordinate point position after analysis, and locates the open defect point position on the LED circuit board.

[0027] Further, the above-mentioned LED circuit board defect repair method, wherein the high-precision automatic test machine is an ICT detection device, or a TPC detection device, or an AOI detection device, or an automatic influence detection instrument.

[0028] Further, the above-mentioned LED circuit board defect repair method, wherein the high-precision automatic test machine is provided with a separate detection jig, and the detection jig comprises a jig body, and a plurality of welding point sensing pins are arranged on the jig body.

[0029] Through the above-mentioned scheme, the present application at least has the following advantages:

[0030] 1. Only one set of jig is needed to test hundreds of thousands of points of LED board, and the open defect data obtained after testing.

[0031] 2. The conversion of the test result data file can be realized by software, so that the defect data becomes the repair data readable by the flying probe machine.

[0032] 3. The wired flying probe machine can complete the wired repair of each board at one time, greatly improving the test and repair efficiency and eliminating the risk of missed test caused by multiple tests.

[0033] 4. Automatic detection can be realized, and complex manual operation can be avoided.

[0034] 5. The wired test data can be in electronic data format or paper barcode format, which can adapt to different transmission and input needs and improve the universality.

[0035] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application clearer and to enable the present application to be implemented according to the content of the description, the preferred embodiments of the present application are described in detail as follows. DETAILED DESCRIPTION

[0036] The specific embodiments of the present application are further described in detail below in combination with examples. The following examples are used to illustrate the present application, but are not used to limit the scope of the present application.

[0037] The LED circuit board defect repair method is different from others in that it includes the following steps:

[0038] Step one, through the high-precision automatic testing machine, the LED circuit board is detected to generate test result data file. Considering the convenience of implementation, the test result data file is a data packet containing defect Log, which is packaged and saved in the dat format used by the high-precision detection machine, which is convenient for subsequent processing. During implementation, the content of the data packet can include: material number name, batch number, plate serial number, date and time, test table number, test block number, defective code, test pcs skip quantity, test result layout. Of course, it can also be appropriately extended.

[0039] For example, the dat format data packet contains the following contents:

[0040] Model Name: S42F008--2W;

[0041] Lot SheetNo: 0001 0002;

[0042] Date: 01 / 20 / 22 15:53:22;

[0043] Shuttle No: 1;

[0044] ***TestBlock No: 5***;

[0045] ***Result IO: OPEN***;

[0046] 1O: 449 / 2250 (>100);

[0047] ***T / T = 1.57S;

[0048] [PIECE] PCS Skip: 0;

[0049] PPP O O P PPPP.

[0050] The actual meaning is:

[0051] Model Name: S42F008--2W.

[0052] Lot Sheet No: 0001 0002.

[0053] Date: 01 / 20 / 22 15:53:13.

[0054] Shuttle No: 1.

[0055] ***TestBlock No: 4***. Other characters can be used instead to improve recognition.

[0056] Defect code, which can represent the results of defect site 1 / defect site 2 determination, can be represented as, 1O:449 / 1799 (>100).

[0057] Test pcs skip quantity (determine whether to convert), [PIECE] PCS Skip: 0.

[0058] Test result layout, PPP O OP PPPP.

[0059] Step 2, convert the test result data file to generate a test data suitable for the in-circuit flying probe machine, the conversion process is as follows:

[0060] (1), receive the test result data file (LogData) automatically generated by the high-precision tester.

[0061] (2), through the product point coordinate file (ADR) provided by the engineering design department.

[0062] (3), set the import position of the test result data file and the directory position of the point coordinate file, set the save position of the output in-circuit flying probe machine Log data.

[0063] (4), according to the actual density of the material number to be converted, set the lower starting point, according to the movement amount of the material number to be converted step by step test, input the corresponding movement compensation value, according to the actual test step number Set the number of steps.

[0064] (5) data conversion, generate a test data suitable for the in-circuit flying probe machine.

[0065] During actual implementation, the data conversion software can automatically calculate the point position and coordinates corresponding to each step of testing to form the connection test data. Meanwhile, the data conversion software can automatically calculate the coordinate compensation of the flying probe machine connection data according to the conditions. After all the related conditions are set, the conversion of the related data can be started. After all the data conversion is completed, the software interface displays whether each LogData is successful, so that the user can know the current state.

[0066] Since the high-precision testing machine uses a jig and is divided into an upper mold and a lower mold, the starting point 1 is unchanged for the upper mold, and the lower starting point will be different according to the order. Therefore, the conversion of the next starting point can be performed according to the following table.

[0067] Density 8K 16K 32K Lower starting point 4097 8193 16385

[0068] Step three, detecting the LED circuit board with defects through the flying probe machine and the connection test data obtained after conversion.

[0069] Step four, generating the final detection result.

[0070] In combination with a preferred embodiment of the present application, the connection test data is converted into a two-dimensional code for printing output; or the connection test data is converted into a bar code for printing output. In this way, without manual input, the code scanner or camera can be used for convenient identification, and the subsequent data restoration can be used for the fastest input.

[0071] Further, the flying probe machine scans the connection test data, analyzes the inner coordinate points of the flying probe connection data, and locates the open defect points on the LED circuit board. Considering the convenience of implementation, the high-precision automatic testing machine is an ICT detection device. It can also be a TPC detection device or an AOI detection device. For some special LED circuit boards, an automatic impact detector can also be used. Of course, in order to cooperate with different LED circuit boards, other types of high-precision automatic testing machines can also be used, such as a four-wire test inspection machine (BBT), which will not be described here. In addition, considering stable placement detection, the high-precision automatic testing machine is provided with a separate detection jig, and the detection jig includes a jig body, and a plurality of solder point sensing pins are arranged on the jig body.

[0072] Further, during the implementation of the present application, the data conversion software can be set to realize the appropriate foolproof function. During actual implementation, the following common error phenomena can be found and perceived:

[0073] The "lower starting point" setting error can be perceived. The data conversion software can prompt "the number of rows in the Adr file is inconsistent with the number of board edge points".

[0074] The "Block number" setting error can be perceived. The "Block number error" can be prompted by the data conversion software.

[0075] The "lower starting point compensation" setting error can be perceived. The "Adr file lacks line number and inconsistent with the number of edge points" can be prompted by the data conversion software.

[0076] The "number of edge points" setting error can be perceived. The "Adr file lacks line number and inconsistent with the number of edge points" can be prompted by the data conversion software.

[0077] In this way, the setting error can be prevented from causing the exported coordinate position to be not the real defect point coordinate, and finally affecting the flying probe test result or causing a judgment error.

[0078] It should be noted that the data conversion software mentioned in the present application can be constituted by different programming languages or carriers, and is not the content to be protected by the present application. The description in the specification is only for better implementation of the present application by those skilled in the art, and will not be described here.

[0079] The working principle of the present application is as follows:

[0080] The LED circuit board is tested by a high-precision automatic tester capable of step-by-step testing. If there is an open circuit defect, the tester automatically generates a test result data file, which can be referred to as defect Log data, and prints defect bar code printing paper.

[0081] The defect Log data is converted into flying probe data that can be read by the flying probe machine through the data conversion software. During implementation, because the test is performed by using a step-by-step testing method, a set of jigs is used for multi-step movement testing. The data conversion software automatically calculates the point and coordinate corresponding to each step of testing according to the condition setting. Then, the bar code scanning gun equipped on the flying probe machine scans the defect point printing printed by the jig tester. During this period, the flying probe machine automatically reads the converted flying probe data, and accurately measures the corresponding open circuit defect point on the board according to the coordinate point in the converted flying probe data during the connection. In addition, the defect data conversion by the data conversion software can be performed in batches, and has a foolproof function, which can prevent the occurrence of missing conversion and less conversion, so that each piece of board that needs to be connected for repair is safely and accurately guaranteed.

[0082] As can be seen from the above description, after the present application is adopted, the following advantages are obtained:

[0083] 1. Only one set of jigs is needed to test hundreds of thousands of LED boards, and the open circuit defect data obtained after testing.

[0084] 2. Test result data files can be converted using software, making defect data readable maintenance data by the flying probe machine.

[0085] 3. It can use a wire connection flying probe machine to complete the wire connection inspection for each board in one go, which greatly improves the efficiency of testing and inspection and eliminates the risk of missed tests caused by multiple tests.

[0086] 4. It can achieve automated detection, eliminating complicated manual operations.

[0087] 5. The connection test data can be converted into electronic data format or paper barcode format to adapt to different transmission and input needs and improve versatility.

[0088] The terms "primary" and "secondary" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "primary" or "secondary" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0089] Similarly, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0090] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "setup," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, it can be directly on another component or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to that other component or indirectly connected to it.

[0091] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicating orientation or positional relationships are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0092] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. It should be pointed out that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present application, and these improvements and modifications should also be considered as falling within the protection scope of the present application.

Claims

1. A method for repairing defects of an LED circuit board, characterized in that It comprises the following steps: Step one, through the high-precision automatic test machine capable of step-by-step testing, the LED circuit board is detected to generate a test result data file, the test result data file is a data package containing defect Log, and the dat format of the high-precision detection machine is used for packaging and saving; The contents of the data package include material number name, batch number, plate serial number, date and time, test bench number, test block number, defective code, test pcs skip quantity, test result layout; Step two, convert the test result data file to generate a connection test data suitable for the flying probe machine, the process of converting the test result data file is, (1) receiving the test result data file; (2) through the point coordinate file provided by the engineering design department; (3) set the import position of the test result data file and the directory position of the point coordinate file, and set the save position of the output flying probe machine Log data; (4) set the lower starting point according to the actual density of the converted material number, set the movement amount of the step-by-step test according to the need to convert the material number, input the corresponding movement compensation value, and set the step number value according to the actual test step number; (5) data conversion, generate a connection test data suitable for the flying probe machine, the data conversion software has an anti-fumble function, which can sense the setting error of the lower starting point, the setting error of the Block number, the setting error of the lower starting point compensation and the setting error of the board edge point number, and the data conversion software automatically calculates the coordinate compensation of the flying probe machine connection data according to the conditions; Step three, through the flying probe machine and the connection test data obtained after conversion, the LED circuit board with defects is detected; Step four, generate the final detection result; The connection test data is converted into a two-dimensional code for printing output; or, the connection test data is converted into a bar code for printing output; the flying probe machine scans the connection test data, analyzes and obtains the coordinate points in the flying probe connection data, and locates the open circuit defect points on the LED circuit board.

2. The method for repairing defects of an LED circuit board according to claim 1, wherein: The high-precision automatic test machine is an ICT detection device, or a TPC detection device, or an AOI detection device, or an automatic impact detector.

3. The method for repairing defects of LED circuit board according to claim 1, wherein: The high-precision automatic test machine is provided with a separate detection jig, and the detection jig comprises a jig body, and a plurality of welding point sensing pins are arranged on the jig body.