Glass composite layout

Abstract

Shown is a substrate stack and housing, comprising at least a base substrate and a cover substrate, the base substrate and the cover substrate constituting at least a portion of the housing. The functional area may be positioned so that it is circumferentially enclosed in the housing. At least the cover substrate preferably comprises glass or a glass-like material. The base substrate and the cover substrate are hermetically welded by at least one laser welding line, wherein the laser welding line has a height HL in a direction perpendicular to the plane of connection thereof, and wherein the mechanical stress in the at least one laser welding line is reduced, thereby improving the mechanical stability of the housing.

Description

Technical Field

[0001] The present invention relates to a glass composite arrangement, for example for providing a hermetically sealed compartment in at least two layers of the glass composite arrangement, and a manufacturing method for making the glass composite arrangement. Background Art

[0002] For example, glass and glass-like housings can be used to protect electronics, circuit systems or sensors. Hermetic sealing embodiments of the above housings can be used, for example, in therapies to cure heart disease or medical implants, such as in the retina, or any type of bioprocessor. Bioprocessors made of titanium are known.

[0003] Sensors can be protected by the invention, for example, in order to be used in particularly harsh climatic conditions. Other examples are micro-electromechanical systems (MEMS), pressure sensors, blood gas sensors, glucose meters such as blood glucose meters, etc.

[0004] Other fields of use of the invention can be found in the field of mobile phones, protective covers for wearable devices, virtual reality and augmented reality goggles and headsets and similar devices. For example, the invention can also be used in the field of electric vehicles, aviation and space environments, high temperature environments and micro-optical devices.

[0005] The above applications all involve some form of electronic device that is subject to harsh environmental conditions and therefore must be particularly durable - or protected from such conditions. Thus, for example, in order to allow the use of any electronic device that may not be expected to withstand the above environmental conditions but can be manufactured at low cost, or the use of electronic devices where there are not even durable electronic devices that can withstand such conditions, the present invention can be used for such devices to protect electronic devices and the like.

[0006] Furthermore, the invention enables to some extent a communication or communication method with the internal area of ​​the device according to the invention (e.g. the housing) or a cavity located inside the housing. This communication or communication method can be realized, for example, by electromagnetic radiation, for example in the visible light region and / or in the microwave radiation region. In order to realize this communication or communication method, the housing is at least partially and / or at least transparent for a certain wavelength range. This transparency enables communication methods, any type of data or energy transmission, and measurements performed with and by electronic devices or sensors located in the cavity. In particular, optical communication methods or optical data or energy transmission are possible.

[0007] However, implementing the cavity in the housing is only one embodiment of the possible use of the present invention. As will be understood below, the present invention is not limited to the cavity, and it can also be used to improve the housing with the cavity. In fact, the present invention can already be implemented only in the substrate stack.

[0008] As is known, several parts or layers are placed and arranged so that the component can be located in the inner area. For example, European patent EP3012059B1 shows a method for manufacturing a transparent component for protecting an optical component. A new laser welding method is used.

[0009] The invention may be used to improve the reliability and / or robustness of a substrate stack and / or housing, for example with respect to environmental conditions. Summary of the invention

[0010] It is an object of the invention to increase the mechanical stability of a substrate stack and / or a housing.

[0011] According to the present invention, the hermetically sealed housing comprises at least a substrate substrate and a cover substrate constituting at least a portion of the housing. The functional area is positioned so that it is circumferentially enclosed in the housing, for example surrounded by the substrate substrate and the cover substrate. The substrate can be a variety of materials, for example from homogeneous substrates such as glass or single crystal silicon wafers to more complex substrates such as chemically hardened glass covered with multiple layers of optical coatings.

[0012] At least the cover substrate of the housing preferably comprises glass or a glass-like material, such as glass ceramic or crystal. In addition, a silicone-based substrate can be used as the base substrate and / or the cover substrate, also in combination with a glass substrate or a glass-based substrate. The base substrate and the cover substrate are welded airtightly by at least one laser welding line. The laser welding line is usually obtained by emitting a short pulsed laser beam with a defined wavelength and energy from a laser source into the material, so that a series of beam spots are placed in the material of the housing at each laser focus arranged in the laser source.

[0013] To this end, for example, the laser source can be arranged so that the cumulative thermal energy placed in several adjacent beam spots adds up to an amount sufficient to melt the material in the weld zone. This can be achieved, for example, when several beam spots overlap each other, so that thermal energy is continuously deposited along the laser welding line and a limited area of ​​the weld zone is heated sufficiently to melt the material in the weld zone.

[0014] At the same time, the dissipation of heat from the laser welding line to the substrate stack (housing) during the welding process can be critical. For example, when some electrical or electronic devices or components are arranged in the functional area (cavity) of the housing, it may be necessary to protect these electrical or electronic devices or components from overheating and / or prevent any heat transfer to the devices or components exceeding certain thresholds. For this reason, it is advantageous that the thermal energy introduced at one time during the application of a laser welding line is limited and the substrate stack (housing) as a whole is not kept at a high temperature level.

[0015] According to the method proposed herein, in a first course of action, a first laser weld line is applied, wherein only a limited amount of energy is introduced into the material, which is just enough to locally melt the material in the fusion zone of each laser spot. This heat energy is dissipated to the rest of the substrate stack (housing), but is so low that the temperature rise is sufficiently low even close to the laser weld line. After the first laser weld line is applied, the substrate stack (housing) will even have enough time to cool down and / or the heat can be dissipated throughout the substrate stack (housing), so that there is no or only a small amount of heat accumulation in the laser weld line.

[0016] Thereafter, and possibly after a cooling period between the application steps of two laser weld lines, a second laser weld line is applied. Again, the heat energy introduced by the second (or any consecutive laser weld line) is spatially confined to the weld line itself, where the heat is dissipated into the substrate stack (housing), but does not force a significant heating of the rest of the material and / or any object / device placed in the functional area (cavity). Thus, having two laser weld lines close to each other or even overlapping each other does not accumulate heat in the substrate stack (housing), or at least not to a critical amount, thus protecting the device / component from overheating.

[0017] For example, if the substrate stack (housing) or even just the laser weld line area is preheated before the laser weld line is applied, and / or if it is necessary to introduce other significant heat into the substrate stack (housing) after the laser weld line has been applied to slow down the cooling of the laser weld line, a certain critical amount of thermal energy may be introduced into the substrate stack (housing), and any device / component mounted in the functional area (cavity) may be damaged. Therefore, the process proposed in this specification is also advantageous when it comes to mounting any device / component near any laser weld line, and in this case, the stress in the substrate stack (housing) can also be significantly reduced or relieved.

[0018] As mentioned above, by placing the beam spots so close together in the same process step that the resulting nonlinear absorption zone at least contacts or even overlaps with the adjacent nonlinear absorption zone of the same laser weld line, a limited heat accumulation can be generated in the area to be welded, and a continuous weld "line" is obtained. In some aspects, it can be seen that this is very similar to known welding methods (for example, for welding metals), and it is even possible to finally obtain a nearly continuous weld line in the metal through a point-by-point spot welding method. Therein, for example, the energy deposition can be adjusted so that the use of one beam spot does not induce melting of the material, so that the energy deposited is less than the energy required for melting. However, by placing several beam spots close enough to each other, sufficient heat energy is deposited overall to just melt the material in the weld zone. Any of these preferred embodiments can be implemented alone or in combination in the method to improve the protection of any device / component in the functional area (cavity).

[0019] In other words, in order to form the housing in a first step, a first substrate (base substrate) and at least a second substrate (cover substrate) are provided, wherein the at least one second substrate (cover substrate) preferably comprises a transparent material, i.e. the second substrate (cover substrate) is transparent at least partially or at least in the second substrate area and at least for a set of wavelengths. The at least one second substrate (cover substrate) is, for example, arranged directly above the first substrate (base substrate) so that, for example, the second substrate (cover substrate) covers the functional area (cavity), wherein the first substrate may provide a bottom side of the functional area (cavity).

[0020] The first substrate and the second substrate together establish a contact area or contact zone, which is located at the position where the first substrate contacts the second substrate. Therefore, each shell includes at least one contact area. Thereafter, the functional area (cavity) is hermetically sealed by introducing the laser welding line along the contact area (for example along a line around the edge of the shell). For example, several shells can be produced in a shared substrate stack that is large enough to provide several shells, such as a wafer stack. In this case, each shell can be separated subsequently by a separation step.

[0021] The laser weld line comprises a height HL in a direction perpendicular to its joining plane. The joining plane is the direction in which adjacent or consecutive beam spots are arranged. Typically, laser welding is performed from "above", that is, the substrate stack is positioned, for example, on a surface (e.g. a table) and the laser is emitted from above through at least the uppermost substrate layer or through more than one substrate layer to the location of the beam focus. Thus, the height HL is measured in the direction of the laser beam, wherein the width of the laser weld line is measured perpendicular to the direction of the laser beam.

[0022] When defining a first laser weld line in a volume of material in the housing, thermal stresses may be induced locally in the volume of material, for example in the area around the laser weld line. It may therefore be the case that the mechanical stability of the volume of material is low when one laser weld line has been defined. It has therefore been found that when only one laser weld line is provided for each contact surface, the mechanical stability of the housing as a whole may also be low.

[0023] Surprisingly, it has been found that when the second laser weld line is placed close to the first laser weld line, the mechanical stability of the same amount of material in the housing can be improved, even relative to the absence of any laser weld line. That is, by defining a second laser weld line in the housing that overlaps at least the first laser weld line, thermal stresses in at least that amount of material can be reduced. In addition, when the second laser weld line is positioned to overlap the first laser weld line, thermal stresses in the housing can also be reduced overall.

[0024] The mechanical stability of the housing is improved as described in the application document. That is, the mechanical stability is preferably improved by introducing at least two laser welding lines for each contact surface, wherein one contact surface is arranged between each two adjacent substrate layers. In addition, the mechanical stability can be further improved when at least one laser welding line on each side of each contact surface overlaps with a laser welding line on the other side of the same contact surface.

[0025] Furthermore, or in other words, the mechanical stresses in at least one laser weld line are reduced, thereby increasing the mechanical stability of the hermetically sealed housing as a whole. This means that by introducing an additional laser weld line into the material and overlapping the "old" laser weld line that has previously been placed in the material, the mechanical stresses in the material can be reduced or even eliminated.

[0026] That is, the mechanical stress in at least one laser weld line, i.e. the "old" laser weld line already placed in the material, is reduced by a stress reduction process step and / or by a crack reduction step. During the stress reduction process step (which may also involve crack reduction as described), any stress in the stress zone near the new laser spot may be changed. Depending on where the new laser spot is set in the material, this may involve, among other adjustable features, an increase or a decrease in stress in the material until it stops.

[0027] The new laser spot can advantageously be arranged as another welding line, but is not necessarily limited to this. In other words, stress reduction can also be achieved by carefully placing the laser spots, without arranging the second laser spot in the welding line sequence. However, the housing can include at least a second laser welding line, which is located near the first laser welding line and / or is positioned so that stress reduction is achieved by the second laser welding line. This is a preferred embodiment, because in this case, when the arrangement sequence of the second laser spots is the same as the sequence of the first laser spots, i.e., the second laser welding line is placed next to the first laser welding line, it can be easily ensured that the stress introduced by the first laser welding line is eliminated in the entire material. However, several laser spots distributed around or along the first laser welding line without establishing a continuous (e.g., uninterrupted) sequence of spots can also be understood as the second laser welding line.

[0028] The first laser weld line may introduce a stress zone in the housing where internal stresses or tensions persist in the cured material.

[0029] Thus, the second laser weld line is advantageously positioned in or near the stress zone caused by the first laser weld line. In this way, the second laser weld line interacts with the stress zone and can even eliminate the stress zone located near the second laser weld line. In other words, the second laser weld line relieves the stress zone, so that a stress-free or almost stress-free zone is established and / or the laser welded housing is made stress-free or almost stress-free.

[0030] The housing may include a cavity inside the housing, and the functional area may be the cavity enclosed inside the housing. Residual stresses in the cavity region of the package may be particularly critical because damage to the package is most common in the area where the cavity reaches the frame of the package. Advantageously, at least two-dimensional laser welding lines are placed around the cavity for tempering the edges of the cavity, i.e., for tempering the material located around the cavity. In this way, the inner side of the housing surrounding the cavity or the cavity in the housing can be tempered and strengthened so that it can be more resistant to any force from the inside or outside. For example, the inside of the cavity may include a higher or lower pressure than the outside of the housing, thereby introducing additional tension through the pressure difference. When the material around one or more cavities in the housing is tempered, the housing can withstand higher forces without breaking or loss of function.

[0031] At least one laser bonding line can be designed to surround the functional area at a predetermined distance. This distance can be set to be equal around the functional area. As an example, the distance can correspond to the height HL or less than the height HL, or correspond to twice the height HL or less than twice the height HL.

[0032] Each laser bond line may be positioned such that it extends into two different substrates of the housing, wherein for example the laser bond line extends from the substrate cover layer to its adjacent layer, such as the top cover layer, and wherein the laser bond line welds the two different substrates to each other.

[0033] The housing may comprise an elastic or flexible layer, in particular as an intermediate layer between other layers, so that the hermetically sealed housing is deformable, for example by pressure changes or by mechanical forces. By means of such an elastic layer, the housing may be used as, for example, an adjustable lens.

[0034] The housing may further be implemented to include, for example, an inner coating zone positioned around the functional area. For example, a welding process using a laser source may be directed to change the material properties on the surface area directly surrounding the functional area / cavity. This corresponds to placing a coating on said surface area.

[0035] Furthermore, each substrate may comprise a plurality of layers and be provided as a multi-layer composite. In other words, the multi-layer composite may be used and joined by a laser welding process. This may involve preparing the multi-layer composite in advance and welding the multi-layer composite as a whole with one or more other substrates during the manufacturing process to provide the housing.

[0036] By including a multilayer composite, other material properties can be added to the housing in a simple manner. For example, such a multilayer composite can include a prestress, or a preferred prestress direction, so that when laser bonding such a multilayer composite, the internal stress level of the multilayer composite can enhance the resistance of, for example, the housing, e.g. to a hardened multilayer composite. Thus, even better hardening can be produced for the entire housing. Additionally or alternatively, such a multilayer composite can include a coating, e.g. a coating that is difficult to weld by laser welding, so that some or all of the intermediate composite layers are provided as a "package" or "stack" that is already glued together. Such a coating can include an optical coating.

[0037] Glass or glass-like substrates with added optical coatings on the front or back side or both can also be welded to other substrates (coated or uncoated) and subsequently hardened. Preferably, the substrate including the coating is at least partially transparent at the emission wavelength of the welding laser if it extends into the planned beam line of the welding laser. For example, substrates with a reflective coating in the VIS wavelength range are realized by sputtering several alternating thin layers of titanium oxide and silicon oxide. Here, welding can be realized by lasers emitting in the NIR.

[0038] The outer shell may include any number of additional intermediate layers, such as three intermediate layers, between the substrate layer and the cover layer.

[0039] The functional area may be located in the intermediate layer or in one of the intermediate layers. In this configuration, the bottom side of the functional area may be covered by the substrate layer and / or the top side by the cover layer.

[0040] The functional area may be designed as a cavity, wherein functional components, such as electrical components, may be arranged in the cavity so as to be protected by the housing.

[0041] The hermetically sealed housing may include one or more functional components, including a power semiconductor, such as a GaN-LED, a SiC power transistor, a GaAs power transistor, or a GaN power transistor, positioned within the cavity. Additionally or alternatively, the hermetically sealed housing may include through holes for establishing electrical contact between the interior of the housing and the exterior, such as contact pads for contacting the exterior of the housing.

[0042] Thus, at least one of the substrate layers, eg the substrate cover layer, may comprise one or more through holes for electrically contacting the functional area with surrounding parts outside the housing, eg contact pads on the underside of the substrate cover layer.

[0043] The thickness of the substrate of the housing may be less than 3 mm, preferably less than 1500 μm, preferably less than 500 μm, preferably less than 120 μm and further preferably less than 80 μm. The substrate cover layer and / or the top cover layer may also be thinner than one or more intermediate layers, for example comprising half the width of the intermediate layer or less. The dimensions of the housing may be 10 mm×10 mm or less, preferably 5 mm×5 mm or less, further preferably 2 mm×2 mm or 1 mm×1 mm or less. Furthermore, the housing may comprise a height greater than its width.

[0044] The invention also relates to the use of the hermetically sealed housing for the manufacture of medical implants, microlens composites, micro-optical chips, pharmaceutical packages or LED devices.

[0045] Furthermore, the present invention relates to a method for providing a hermetically sealed enclosure, e.g. as explained above and in detail below, wherein the enclosure encloses a functional area, e.g. a cavity, the method comprising the following steps: providing a substrate substrate, and aligning a cover substrate above the substrate substrate in such a way that at least one contact surface is arranged between the substrate substrate and the cover substrate.

[0046] In other words, the substrate layers (e.g., base substrate and cover substrate) are stacked in direct contact with each other, i.e., they are arranged adjacent to each other. Note that no other and / or interfering materials are arranged between the substrate layers, so that the substrate layers are in close contact with each other and in planar / layered contact. For example, the base substrate is arranged to be in direct contact with the cover substrate, in particular to avoid other materials or spaces or gaps remaining between the base substrate and the cover substrate. If, for example, more than two substrates are to be provided, the base substrate will be in close and direct contact with the intermediate substrate, and the other side of the intermediate substrate will be in close and direct contact with the cover substrate. That is to say, the substrate is provided in close proximity to the corresponding next substrate.

[0047] Thereafter, the substrates are welded by a novel laser welding method, wherein a substrate layer is welded directly to an adjacent substrate layer without the need for additional and / or other and / or non-aerospace materials or intermediate layers. The substrates are welded directly to each other, so that the laser welding line placed in the aerial contact area / zone between each two substrate layers connects these adjacent substrate layers in an irremovable manner. Thus, the fusion zone of the laser welding line is simultaneously located in both substrates being welded and is seamless from the first substrate (substrate substrate) to the second substrate (covering substrate).

[0048] Thus, an approximate, aerial or even fully aerial transition is established, being a substrate-substrate-transition or a glass-glass-transition (as the case may be). A locally limited volume is established as a welding zone (laser welding line), in which material transfer or mixing of adjacent substrate layers, which may be planar, occurs. For example, material from a first substrate (base substrate) enters a second substrate (cover substrate) and vice versa, so that in the welding zone there is a complete material mixing of adjacent substrates. Thus, a laser welding line can also be described as a convection zone.

[0049] A new laser welding technique is advantageously provided without any intermediate layers or materials, such as frits, foils or adhesives, which were required in previously known techniques. A new non-detachable connection between substrate layers can advantageously be provided without the restriction of intermediate layers or additional materials, such as bonding materials. This facilitates manufacturing, makes such additional materials unnecessary, increases the robustness and / or hardness of the housing, and allows for a secure and hermetic sealing of functional areas (cavities). For example, a laser weld line in the final product can be identified by a specific local change in the refractive index of the material in a small weld zone.

[0050] For example, if the substrates are not provided completely flat, which may be the case due to, for example, production tolerances, such a gap between the substrates (base substrate and cover substrate) is tolerable if the gap is less than or equal to 5 μm, preferably less than or equal to 1 μm. Such a gap may originate from substrate production tolerances, or by thermal influences, or even from the inclusion of particles such as dust. Even when there is such a permissible spacing between the substrates considered to be adjacent to each other according to the invention, welding can be performed so that the width of the welding zone (laser welding line) is about 10 to 50 μm in order to make a gas-tight seal. In this case as well, the fusion zone seamlessly enters the second substrate from the first substrate. That is, the laser welding line is brought into the contact area between the first substrate and the second substrate and directly merges the substrates into an inseparable composite. By the welding process, the material of the two substrates located in the laser welding line is directly melted, and the material from the first substrate is mixed with the material from the second substrate to form an inseparable integral composite. The housing thus produced ultimately comprises an integral composite, at least in the laser welding line.

[0051] Therefore, a method for hermetically sealing a housing includes: hermetically sealing a functional area by introducing a first laser welding line in the housing; introducing a second laser welding line at the same position as the first laser welding line or close to the first laser welding line or overlapping with the first laser welding line; and relieving stress in the area of ​​the first laser welding line of the housing by introducing the second laser welding line.

[0052] In the method, a laser weld line may be introduced into the housing using a laser beam source. The laser beam may be directed around the functional area to form a laser weld line along a contact area between the substrate substrate (3) and its adjacent substrate (eg, a cover substrate).

[0053] The laser source may be a pulsed laser source, wherein several laser pulses are introduced along the laser welding line, so that a continuous or substantially continuous welding line is composed of the several laser pulses.

[0054] According to the present invention, there is also provided a tempered sealed housing produced by the method as described above and below.

[0055] The present invention will be described in more detail below in conjunction with preferred embodiments. Referring to the accompanying drawings, similar reference numerals have been applied to the same or similar components. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In the figure

[0057] Figure 1a shows a schematic cross-sectional side view of the housing,

[0058] Figure 1b Detail of Figure 1 showing a laser welding line,

[0059] Figure 1c shows a cross-sectional side view of another embodiment comprising five substrate layers,

[0060] Figure 2 shows a schematic top view of the housing,

[0061] Figure 3 shows a cross-sectional side view along a laser weld line in the housing,

[0062] Figure 4 shows a cross-sectional view of the laser spot area,

[0063] Figure 5 An example of tempering a previously welded line is shown,

[0064] Figures 6 to 15 An exemplary method of manufacturing a housing / several housings is shown,

[0065] Fig.16 shows a cross-sectional side view of the housing as the cavity edge is tempered,

[0066] Fig.17 shows a cross-sectional side view of a multi-layer housing, wherein several cavities are arranged in each housing,

[0067] Fig.18 A detailed side view of the multi-layer housing is shown,

[0068] Fig.19 shows a cross-sectional side view of a multi-layer housing, for example as a gas-tight biomedical implant,

[0069] Fig. 20 shows a top view of a multi-layer housing,

[0070] Fig.21 shows a bottom view of the multi-layer housing,

[0071] Fig. 22 shows a cross-sectional side view of another example of a multi-layer housing,

[0072] Fig.23 shows a bottom view of the multi-layer housing,

[0073] Fig.24 A cross-sectional side view showing yet another example of a multi-layer housing for a plug connector,

[0074] Fig.25 A cross-sectional side view of yet another example of a multi-layer enclosure having an interface is shown,

[0075] Fig.26 A cross-sectional side view showing yet another example of a multi-layer housing having a plurality of electrical contacts,

[0076] Fig. 27 A photograph showing multiple weld lines in and around the contact surfaces of two substrates. DETAILED DESCRIPTION

[0077] Figure 1a A cross-sectional view of an embodiment of a housing is shown. An intermediate layer 4 is arranged on top of a substrate layer 3, wherein a functional area 12 is arranged in the intermediate layer 4 of the housing 1. A cover layer 5 is arranged on top of the intermediate layer 4. All layers 3, 4, 5 can also be multilayer components, such as chemically hardened glass with a dielectric coating that partially or completely covers one or both sides. All the following descriptions can also be the case. The functional area 12 is a cavity, in which a functional component 2 such as an electronic component or a lens is located. There are corresponding contact surfaces 25 between the substrate layer 3 and the intermediate layer 4 on one side and between the intermediate layer 4 and the cover layer 5 on the other side. The substrate layer provides a bottom 22 of the cavity 12, the intermediate layer 4 comprises a side wall 21, wherein the cover layer 5 comprises a top 23 of the cavity 12.

[0078] refer to Figure 1b , which shows a detail of a corner of the housing 1, wherein the interface zone 8 welded by the laser beam is shown in more detail. In this embodiment, each contact surface 25 has one interface zone 8, wherein each interface zone 8 is a laser weld line around the cavity 8. In other words, each interface zone 8 constitutes a circumferential closed ring or closed line.

[0079] Figure 1c Another example of a housing is shown, in which several intermediate layers 4a, 4b, 4c are used and a stack 18 of layers 3, 4a, 4b, 4c, 5 is formed. Again, a corresponding laser welding line 8 is arranged at each contact surface 25. The corresponding layer or substrate is firmly joined or attached to the adjacent layer by laser welding. The top layer 5 of this example can be a glass layer. The intermediate layers 4a, 4b and 4c can also be provided as a multilayer composite 4, and then the cavity 12 can be cleaned out, for example, by grinding methods.

[0080] For example, the substrate substrate may be a wafer or a printed circuit board, for example made of aluminum nitride. The functional area 13 (or cavity 12) may also be formed, for example, as a groove on the substrate layer 3, for example by a grinding method such as sandblasting.

[0081] Figure 2 A top view of the housing 1 according to the invention, wherein the circumferential laser weld line 8 encloses the functional area 13. The functional area 13 can be designed to meet different requirements as required, for example it can be an optical receiver, or a technical, electromechanical and / or device 2 arranged in the functional area 13. It is also possible to accomplish several different tasks by means of the functional area 13 (for example because different devices 2 are installed in the functional area 13).

[0082] refer to Figure 3 , which shows another cross-sectional view of an embodiment of a housing 1, the housing 1 comprising a substrate layer 3 and a cover layer 5, both in the form of substrates. In other words, the housing 1 comprises two layers, namely the substrate substrate 3 and the cover substrate 5. In addition, Figure 3 It is shown how the laser welding line 8 is typically constructed, i.e. a plurality of laser pulses 16 are arranged so close to one another and aligned in a straight line that the materials of the substrate base 3 and the cover layer 5 melt and fuse to one another (preferably melt and fuse to one another without any gaps), so that the functional area 13 or the cavity 12 is hermetically sealed by one or more laser welding lines 8 surrounding the functional area 13 or the cavity 12.

[0083] Reference now Figure 4 and 5 , which explains how, by introducing several laser welding lines 8 close to each other, the stresses in the material of the various substrates 3, 4a, 4b, 5, etc. can be creatively reduced. Figure 4 A cross section of a typical weld line 8 is shown, ie a modified cross section caused by several laser pulse firings 16 , wherein the multiple fired laser pulses 16 pass through overlapping nonlinear absorption regions, forming a line where heat accumulates and forming the laser weld line 8 . Figure 4A cross section of such a weld line is depicted. It comprises several distinguishable regions. Firstly, there is a nonlinear absorption region 31 which corresponds more or less to the laser focus and has a size of a few micrometers. Above said region 31 (when the laser is emitted from above the substrate stack 18), an elongated "bubble-like" region 32 may be formed which has a width of only a few micrometers but a height of typically tens of micrometers (due to its characteristic shape which is typically comparable to an elongated bubble, it is also referred to as "bubble 32"). Around said bubble-like region 32, a fusion zone 33 of width w and height h is located, where temperatures above Tg may be reached and where the glass (after cooling or heat dissipation) has therefore resolidified. The fusion zone 33 including the elongated bubble 32 can usually be clearly identified, for example with an optical microscope, since its density and refractive index have changed relative to the surrounding glass. In some cases, the nonlinear absorption region 31 may also be observed as an optical damage at the lower end of the fusion zone 33.

[0084] Around the fusion zone 33 and in the heated zone 34, the glass has received a certain amount of energy from the heat accumulation of multiple laser shots, by which the temperature of the glass is raised to below Tg (the melting temperature of the corresponding material), but still significantly above room temperature. Due to thermal diffusion, this temperature is not the same in each corner of the heated zone 34. The size of the heated zone 34 is proportional to the size of the fusion zone 33. Therefore, the size of the fusion zone 33 and in particular the boundary can be used as an indicator of the size of the heated zone 34.

[0085] While making the present invention, it has been discovered that any weld line 8 can also double as a local heat source for tempering the substrate material. Tempering is generally referred to as heat treatment of glass to make it tougher, more heat resistant and crack resistant. This is the same as the tempering proposed in the present disclosure, but the present disclosure does not have several disadvantages of any tempering method known in the art. Here, given the specific profile of the weld line 8, which is characterized by the height h and width w of the weld zone 33, the heated zone 34 can be placed through the weld line 8 and relative to the area or part to be tempered. Through this tempering feature, the stress of the previous weld line 8 can be reduced, or even micro cracks can be removed from the material.

[0086] Typical values ​​found for the modification or tempering of the substrate layer material are presented in Table 1 below:

[0087] Table 1: Typical values ​​for tempering

[0088] part benefit X Y Other welding lines Stress reduction 0.5w-5w 1h-5h Cavity edge Repair of micro cracks 1w-2w not applicable Pre-marked plane Splitting tension reduction; micro crack repair 1w-2w not applicable waveguide Gradient refractive index reduces losses 1w-1.5w 1h-1.5h The interface between the two layers Stress reduction not applicable 1h-1.5h Glass-Coating-Glass Interface Hermetic seal with coated interface not applicable <1h (Tempered) Surface / Edge Local stress distribution adaptation >2w >2h Metal filling through glass vias Better retention of metal in the hole 1w-1.5w 1h-1.5h Cutting Line Strengthened edge of a single chip 0.5w-10w not applicable Outer conductive layer Avoid harmful effects such as delamination or thinning 1w-2w 1h-2h

[0089] Table 1 indicates the respective benefits obtained when tempering for different purposes ("characteristics"). In the third and fourth columns, typical values ​​are listed, i.e. the typical widths that can be obtained for the respective zones improved by the "laser induced tempering" method proposed herein. The coordinates indicated by "X" and "Y" in Table 1 can be indicated, for example, relative to the part to be tempered. w refers to the width of the weld zone 33 of the laser weld line 8, wherein h refers to the height of the weld zone 33. The dimensions of the weld zone introduced by the laser weld line 8 can typically be about w = 50 μm, possibly ± 10 µm, and / or h = 100 µm, possibly ± 20 µm.

[0090] For example, in the case where one laser welding line 8 has been shot into the substrate layer, the material of the corresponding substrate layer has received a certain amount of stress stored therein. By shooting the second laser welding line 8 close to the first laser welding line 8, the stress introduced by the first laser welding line 8 can be reduced or even eliminated, as will be further explained below. In another example given in Table 1, when the edge of the cavity 12 is improved, micro cracks can be eliminated, thereby making the cavity 12 more stable and more resistant to any forces from the outside or inside.

[0091] In another example given in Table 1, in the pre-scored plane, the cleavage tension can be repaired and the micro cracks can be reduced or eliminated. For example, in a waveguide element, a gradient refractive index can be set, thereby reducing the loss of the waveguide.

[0092] In the interface between two layers, stresses and microcracks can also be reduced. For example, at the glass-coating-glass interface, a hermetic seal can be performed on the coating interface. When the surface or edge has been hardened by other means, such as by chemical hardening or temperature hardening, or even for any surface or edge, a local stress distribution adaptation can be performed in the material. In the case of metal filling via glass through-holes, better retention of the metal in the hole can be achieved, as given in Table 1. Close to any cutting line, the edges of the singulated chips can be toughened. With regard to the optional external conductive layer, some harmful effects, such as delamination or thinning, can be avoided.

[0093] refer to Figure 5 , the lower laser weld line 8 is performed first, followed by the "curing" second laser weld line 8a. Any deformation that has been introduced by the first laser weld line 8 has been neutralized by performing the second laser weld line 8a. In this example, the two laser weld lines 8, 8a achieve the additional feature of welding the substrates together, wherein the first laser weld line 8 welds the substrate substrate 3 to the first intermediate layer 4a, and the second laser weld line 8a welds the first intermediate layer 4a with the second intermediate layer 4b along each contact surface 25.

[0094] Figures 6 to 14An exemplary way of constructing a housing 1 according to the invention is shown, as is a method of manufacturing the housing. The housing 1 of this embodiment is covered on both sides by a covering substrate, which may be thinner than the "inner" substrate, but this is for exemplary purposes only. It may be advantageous to introduce an additional covering substrate on both sides of the template, as will be described in more detail below and as has been found when carrying out the invention: by introducing an additional covering substrate, it is possible to eliminate even more stress in the material of the inner substrate.

[0095] It should be noted that this does not have to be performed in isolation Figures 6 to 14 Instead, the steps shown can provide a complete stack 18 (such as Fig.14 ) and laser weld each laser weld line 8 in a complete stack 18, rather than providing each layer in a layer-by-layer manner after the next higher layer has been provided.

[0096] Furthermore, it may be noted that in Figures 6 to 14 In the process, a plurality of housings 1 (here, two housings 1) are prepared and manufactured simultaneously using the same manufacturing process, and then the two housings 1 are connected along the same direction as in the embodiment of the present invention. Figure 6 The cutting lines 10 shown in FIG. 1 are separated from each other. However, of course, each housing 1 can also be prepared and manufactured separately.

[0097] according to Figure 6 , a lower cover substrate 3 is provided and a first intermediate layer 4a is arranged on top of the lower cover substrate 3. Thus, it can be said that an intermediate product 1 is formed, but in a simple embodiment, the shell 1 can also be formed by adjoining two layers and welding each shell 1 by at least one laser welding line 8.

[0098] Figure 7 Indication of a stressed zone 35 in the first intermediate layer 4a introduced by forming a laser weld line 8 in the material of the housing 1. In the present example, the formation of the laser weld line 8 in the material leads to residual stresses and / or micro cracks in the weld zone 35, which are caused by rapid local heating and relaxation of the material and / or by thermal differences in the material. For the sake of explanation, it can be added that such a structurally weak zone 35 can even be made worse when cracks or initial cracks can even intensify in the area below the next / second weld line.

[0099] The "physical" weld line 8 corresponding to the fusion zone 33 can be observed by the change in the refractive index at its outer circumference. "Above" this physical weld line 8 (when the laser is also injected into the material from above) a stressed zone 35 with an initial "deformation pool" appears. The deformation pool is mainly caused by thermally induced stresses in the weld affected zone 35, but may include initial micro cracks, etc.

[0100] Figure 8The substrate stack 18 is shown when the second welding line 8a and the third welding line 8b are placed into the housing 1, wherein the second intermediate layer 4b is arranged on top of the first intermediate layer 4a. The second intermediate layer 4b forms the edge 21 or "frame" of the other cavities 12. The indication of the stress area 35 is similar to Figure 7 In the embodiment shown in Figure 8 At the moment of the embodiment, the stress region 35 still exists, but will be reduced thereafter, such as Fig. 9 The first weld line 8 has cooled down, while the second and third "hot" weld lines 8a, 8b still show the heated area 34, the elongated bubbles 32, the fusion zone 33 and the nonlinear absorption region 31 (see for example Figure 4 The contact surface 25 between the first intermediate layer 4a and the second intermediate layer 4b is mostly welded by two welding lines 8a and 8b, while Figure 8 The left part in indicates how the material changes when only one welding line 8a is used.

[0101] refer to Fig. 9 ,exist Figure 8 The housing 1 after the welding step is shown to have cooled down and the stress zone 35 has formed. Figure 8 As can be seen in the middle and rightmost part, the material of the first intermediate layer 4a is stress-free at the locations where the two welding lines 8a and 8b have been arranged. It has been found that stresses and even possible microcracks in the material around the welding zone can be "repaired" if the two welding lines 8a, 8b are arranged close to each other, for example one below and one above the contact surface 25 to be welded. This is particularly interesting because the contact surface 25 between any substrate layer / housing 1 of the stack 18 usually constitutes one of the most critical areas with regard to its overall stability. New stress areas 35 have now been formed in the second intermediate layer 4b surrounding the subsequent cavity 12; these stress areas 35 can be relieved of stress in subsequent steps (see Fig.10 ).

[0102] Now return to Fig. 9 , only a second weld line 8a is introduced into the material. In this area, stress persists in the material of the first intermediate layer 4a, resulting in a weaker material component, that is, a more poor resistance to any bending forces or impacts, wherein even microcracks may persist.

[0103] Fig.10 The next sequential step of manufacturing the housing 1 according to the invention is shown. The third intermediate layer 4c is located on top of the second intermediate layer 4b so as to enclose the cavity 12. If any electronic or functional component 2 should be inserted into the cavity 12 or functional area 13, then in this exemplary method of manufacturing the housing 1, it should be Fig.10Any electronic or functional component 2 is inserted into the cavity 12 or functional area 13 before the step shown. For exemplary purposes, the left cavity 12 includes the functional component 2. The third laser weld line 8c and the fourth laser weld line 8d have been shot at the housing 1, leaving a relatively hot area that has not yet cooled. The stress area 35 shown in this example corresponds to Fig. 9 Those stress zones shown in FIG. 2 are those stress zones because the laser welding zone is still hot and the stresses in the corresponding zone have not yet been relieved. The contact surface 25 between the second intermediate layer 4b and the third intermediate layer 4c has been welded with two laser welding lines 8c and 8d.

[0104] from Fig.11 It can be seen that the stress area 35 in the middle and rightmost part of the figure has disappeared, which means that the stress in the material of the housing 1 has been reduced or eliminated. Fig.11 In the left part shown only for comparison purposes, each contact surface 25 is welded using only each laser welding line 8b, 8d, and stress persists in the material, as indicated by the stress area 35, which also remains in the first intermediate layer 4a and the second intermediate layer 4b.

[0105] Reference now Fig.12 , which shows the successive steps for producing a housing 1 according to the invention, wherein the upper cover layer 5 is arranged above the third intermediate layer 4c and is welded to the third intermediate layer via an additional welding line 8e. Fig.12 indicates that the stress zone 35 is Fig.11 The same situation is shown. The complete stack 18 of substrates is completed. Fig.13 In the figure, the resulting stress relief can be seen, since no stress zones 35 remain in the middle and right parts. In the left part, again indicated only for comparison purposes, to make it easier to understand the reason, and in the case where only one laser welding line 8 is used to weld each contact surface 25, stress zones 35 still exist in the material, weakening it. But in the third intermediate layer 4c, where the two laser welding lines 8d and 8e are located, complete stress relief can be achieved. Now from Fig.13 As can be clearly seen from the above explanation, the bottom cover layer 3 and the top cover layer 5 finally form a housing, which benefits from all the advantages of laser welding, but does not suffer from additional stresses in the material. The material is tempered so that the microcracks are the same, but without the disadvantages of the classical tempering method. For example, an electronic or functional component 2 can be installed in the housing 1, which is impossible under normal tempering, because the entire material of the housing 1 must be at high temperature. However, the outermost layers, i.e. the lower cover layer 3 and the upper cover layer 5, can be tempered (i.e.: stress relieved), for example, by classical methods, i.e. by heating the layers 3, 5 above the melting temperature.

[0106] Reference now Fig.14 , shows an embodiment in which the substrates 3, 4a, 4b, 4c and 5 constituting the complete stack 18 are arranged on top of each other, wherein laser welding lines 8, 8a, 8b, 8c, 8d and 8e are introduced into the material one after the other. Finally, the two housings 1 are cut or separated along the cutting line 10 and at Fig.15 A single housing 1 is shown, which can be obtained by the housing manufacturing method explained above.

[0107] Fig.16 Another example of tempering around the edge of the cavity 12 is shown. An at least two-dimensional weld line 8 is formed around the cavity 12, wherein by the laser weld line 8, not only are the previously separated substrates 3, 4 and 5 welded together, but any stress 12 in the area around the cavity is eliminated or at least significantly reduced, including the elimination of possible microcracks. Such microcracks can persist in the material or be introduced into the material, for example when cutting away material to make the cavity 12. A subsequent series of laser shots 16 are arranged close to each other to form the laser weld line 8 around the cavity 12.

[0108] refer to Fig.17 , shows a multi-layer example, where each housing 1 includes three cavities 12, and at the same time three housings 1 are manufactured together in the same manufacturing process, but in the completion, for example, along Fig.17 The laser welding performed by the cutting lines 10 shown in FIG. 1 is then separated in a separation step. As described above, several laser welding lines 8 are introduced into the material to eliminate or reduce stress in the material of the housing 1. Each cavity 12 generally includes a functional component, but such a functional component 2 is indicated as being in one cavity 12 only for the purpose of easy understanding.

[0109] Fig.18 A side view orientation of a detail of a housing 1 having a cavity 12 is shown, with only the upper and lower substrates 5, 3 and the cavity 12 partially shown. The laser weld line 8 surrounding or encircling the cavity 12 is indicated with a safety margin 41 relative to the edges of the layers 3 and 4. The safety margin 41 helps ensure that the laser weld line 8 is properly made in the material of the housing 1. The safety margin or pre-scored plane 41 may include a width of 0.5w to 2w.

[0110] like Fig.18 As shown, the lower base plate 3 has a larger size than the adjacent base plates 4, 5, wherein the lower base plate 3 is extended further by the extension 7. The extension 7 has a width 47, wherein a relatively small width 47 is usually required in order to reduce the overall size of the housing 1. Due to the similarity of the construction details, Figures 18 to 21 The same embodiment may be shown, for example, as a hermetic biomedical implant with electrical contacts.

[0111] The extension 7 can be used to arrange the contact pad 54 at the side of the cavity 12 and thus accessible from above. For example, the through-glass via 52 filled with metal can connect the contact pad 54 with the conductive part 56, such as a conductive strip installed below the substrate substrate 3. The through-glass via 52 is arranged to be spaced apart from the laser welding line by a margin 43 so that the through-glass via 52 is not changed or disturbed when the laser welding line 8 is produced in the housing 1. The safety margin 43 between the welding line 8, 8a, 8b, 8c, 8d, 8e and the through-glass via 52 can be, for example, horizontally in the range of 1w to 1.5w, as depicted. If the welding line 8, 8a, 8b, 8c, 8d, 8e is located or arranged below the through-glass via 52, the corresponding safety margin can be in the range of 1h to 1.5h.

[0112] The conductive portion 56 may include a further electrical contact area to establish electrical contact with the contact pad 54. The safety margin 45 between the conductive portion 56 and the bonding wire 8, 8a, 8b, 8c, 8d, 8e may be selected to be approximately 1h to 2h in the depicted vertical arrangement, and / or approximately 1w to 2w in case of a horizontal arrangement.

[0113] refer to Fig.19 , a side cross-sectional view of a housing 1 having a cavity 12 showing laser weld lines 8, 8a surrounding the cavity 12; and Fig.18 The same reference numerals used indicate the same parts. The housing 1 can be used as an airtight biomedical implant with electrical contacts 54, 55 (see Fig. 20 ). The contact pad 54 located on the extension 7 of the lower substrate 3 is connected to the conductive portion 56 through the through-glass via 52, and is further connected to the functional component 2 arranged in the cavity 12 through the through-glass via 53. In other words, the electrical paths 52, 53, 54, 56 are defined from the interior of the housing 1 to the exterior thereof, wherein the contact pad can be easily accessed, for example from above or from the side.

[0114] Fig. 20 The housing 1 is shown (e.g. also Fig.19 1 ) with electrical contacts 54, 55, wherein two contact pads 54, 55 can be seen on the extension 7 of the housing. The laser welding lines 8, 8a are drawn airtightly around the functional areas 12, 13 with the functional component 2. The two contact pads 54, 55 facilitate handling and electrical contact. Next, Fig.21 A bottom view of the housing 1 is shown with electrical contact strips 56, 57 which are separated from each other and arranged below the lower substrate 3 in order to contact two electrical contacts which are isolated from each other. Fig.18 As outlined in FIG. 19 , for example, through-glass vias 52 , 52 a , 53 , 53 a may be electrically connected to contact strips 56 , 57 .

[0115] refer to Fig. 22 , shows a housing 1 including an encapsulated conductive layer 58, which is arranged below a substrate 3 and encapsulated, in particular electrically encapsulated, by a thin substrate 3a (e.g., a cover glass 3a). Through-glass vias 52 and 53 are each interconnected with the conductive layer 58, wherein the through-glass via 52 is in contact with a connection pad 54, and the through-glass via 53 is in contact with a functional component 2 in a cavity 12 of the housing 1.

[0116] On the side of the housing 1 where it is not necessary to guide the electrical contacts to the outside of the housing, the laser welding line 8a can be placed through the conductive layer 58. On the side including the extension 7, the laser welding line 8 ends near the conductive layer 58 so as not to extend to or through said conductive layer 58. For example, another laser welding line 8b can be placed in the extension 7 and provide a hermetic seal of the housing there and, alternatively or cumulatively, firmly mechanically connect at least one of the conductive layer 58 and the substrate 3a to the rest of the housing 1. Depending on the width of the conductive layer 58 and the location of the electrical contacts to be connected to the conductive layer 58, the laser welding lines can also be arranged so that other parts than close to the edge of the housing 1 can be welded together with the lower substrate 3.

[0117] Fig.23 A bottom view of the housing 1 is shown, showing individual conductive strips 59, 60 which have been separated from the conductive layer 58. Thus, individual electrical contacts can be easily established in the conductive layer 58, for example even by directing different electrical contacts to different sides of the housing 1 (including more than one side of the housing 1) (see e.g. Fig.26 ). The conductive layer 58 may have the same extension size as, for example, the lower substrate 3 , but may also be kept slightly smaller so that the side surfaces of the encapsulation layer 3 a may isolate the conductive layer 58 .

[0118] Fig.24 A cross-sectional view of a housing 1 is shown, in which a top contact 74 and a bottom contact 76 are established, i.e. electrical contacts are established on the lower side as well as on the upper side of the housing 1. For example, the upper contact 76 can be in contact with the functional component 2 through an upper contact portion, one side of which is in contact with the upper contact 76 through the through-glass hole 62, and the other side is in contact with the functional component 2 through the through-glass hole 64 and a contact member 65 (e.g., a solder drop). On its side, a compartment 68 is established for accommodating a connector, such as a plug-type connector. Two separate electrical contacts 74, 76 are arranged on the upper side and the lower side of the compartment 68. One or more connector retention notches 70 can be provided to retain the connector in the compartment 68, wherein, when the force on the connector is released, a ridge or any member functionally coupled to the connector retention notch 70 can press against the connector retention member 72 and retain the connector in the compartment 68. Arrow 80 shows a possible insertion direction of the connector.

[0119] Fig.25 Another housing 1 is shown, in which components with the same reference numerals in other figures represent the same or similar components in this figure. A clamping portion 82 is established on one side of the housing 1, for example above the contact pad 54, wherein any electrical conductor can be clamped on the contact pad 54 by the clamping portion 82. For example, a nerve 85 can be in contact with the contact pad 54 and stimulated by an electrical pulse from a functional component 2 in the housing 1. All electrical components of the housing 1, or at least those components that need to be protected, can be encapsulated in the housing 1, where interaction with the outside can be established in different embodiments. The clamping portion 82 can be structurally reinforced, for example by another welding line 8b.

[0120] Fig.26 Another housing 1 is shown, in which electrical contacts 54, 55 are arranged on both sides of the housing 1. Distinguishable contacts 56, 56a are arranged below the lower substrate 3, wherein different sides of the housing 1 can be marked with different codes, such as colors, for example, so that the functional component 2 can be electrically contacted with the external contacts through the contact pads 54, 55.

[0121] Fig. 27 A photograph of two substrates 3 and 5 laser welded together along a laser weld line 8 is shown, wherein a change in the refractive properties as well as a reduction in stress in the material can be seen, which should prove the principle of the method and housing 1 described above.

[0122] It will be appreciated that the features defined herein in accordance with any aspect of the invention or in relation to any particular embodiment of the invention may be used alone or in combination with any other feature or aspect of the invention or an embodiment. In particular, the invention is intended to cover a housing 1 and / or a method of manufacturing a housing 1 configured to include any of the components described herein. It will generally be appreciated that any feature disclosed herein may be an essential feature of the invention alone, even if disclosed in combination with other features, whether disclosed in the specification, claims and / or drawings.

[0123] It will be further appreciated that the above embodiments of the invention have been described by way of example and illustration only and that further modifications and variations may be made thereto without departing from the scope of the invention. Finally, it will be apparent that features described, for example, in conjunction with a particular embodiment (e.g., housing) may also be combined with any other embodiment, for example, in combination with a substrate stack.

[0124] List of reference numerals:

[0125] 1 Shell

[0126] 2Device or functional component

[0127] 3. Lower substrate, underlayer or lower cover substrate

[0128] 3a Substrate

[0129] 4.4a,4b Intermediate layer or multi-layer composite

[0130] 4c Middle Layer

[0131] 5 Upper covering layer, covering substrate

[0132] 7, 7a extension

[0133] 8, 8a, 8b, 8c, 8d, 8e laser welding lines

[0134] 10 Cutting Line

[0135] 12 Cavity

[0136] 13 Functional Areas

[0137] 14 Edge

[0138] 15 laser units

[0139] 16 laser pulses

[0140] 18Substrate stacking, wafer stacking

[0141] 21 Edge / rim of cavity

[0142] 22 Bottom of the cavity

[0143] 23 Top of cavity

[0144] 25 contact surface

[0145] 31 Nonlinear absorption region

[0146] 32 Slender bubbles

[0147] 33 Welding area

[0148] 34 heating zones

[0149] 35 Stress Zone

[0150] 41 Safety margin or pre-marked plane

[0151] 43 Safety margin to glass through hole

[0152] 45 to the safety margin of the conductive layer

[0153] 47 Width of extension 7

[0154] 52, 52a Glass through hole

[0155] 53, 53a second glass through hole

[0156] 54 contact device or contact plate

[0157] 55 second contact portion or contact plate

[0158] 56, 56a contact portion or contact layer

[0159] 57 second contact portion or contact layer

[0160] 58 conductive layer

[0161] 59, 60 conductive strips

[0162] 62 Upper outer glass through hole

[0163] 64 Upper inner glass through hole

[0164] 65 Contact member, such as solder drop

[0165] 66 upper contact portion or contact layer

[0166] 68 socket (female connector)

[0167] 70 Connector retention notch

[0168] 72 Connector holding member

[0169] 74 first electrical contact, bottom contact

[0170] 76 Second electrical contact, top contact

[0171] 80 connector insertion direction

[0172] 82 Flexible clamp

[0173] 85 Nerve.

Claims

1. A substrate stack (18), comprising at least: Substrate base plate (3); as well as Covering substrate (5); wherein at least the cover substrate or the base substrate comprises glass or glass-like material or silicon-based material; at least one first laser welding line (8), the at least one first laser welding line being used to weld the base substrate and the cover substrate, wherein the first laser welding line (8) introduces a stress zone (35) in the housing including the substrate stack (18); At least one second beam spot or at least one second laser welding line (8a, 8b, 8c, 8d, 8e, 8f), the at least one second beam spot or at least one second laser welding line being located near the first laser welding line (8) and / or being positioned such that stress reduction in the at least one first laser welding line (8) is achieved by the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f), thereby improving the mechanical stability of the substrate stack (18), wherein the first laser welding line (8) has a height HL in a direction perpendicular to its connection plane and a width w in the connection plane, and wherein the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) is positioned such that: i) the distance between the first laser welding line (8) and the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) in a direction perpendicular to the connection plane is less than 5HL; and / or ii) The distance between the first laser welding line (8) and the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) in the direction within the connection plane is less than 5w.

2. A housing (1) comprising the substrate stack according to claim 1, wherein the base substrate (3) and the cover substrate (5) constitute at least a part of the housing; and The housing (1) further comprises a functional area (13), which is positioned so as to be at least partially enclosed in the housing.

3. The housing (1) according to claim 2, The mechanical stresses in at least one first laser weld line (8) are also reduced by a crack reduction step.

4. The housing (1) according to claim 2, wherein the second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) is positioned in or near the stress zone caused by the first laser welding line, and The second laser welding line releases the stress zone, so that a stress-free or almost stress-free zone is established, and / or the laser welded housing is stress-free or almost stress-free.

5. The housing (1) according to claim 2, further comprising a cavity (12), wherein the cavity is within the housing (1), or wherein the functional area (13) is the cavity (12), The housing further comprises at least a two-dimensional laser welding line surrounding the cavity (12) for tempering the edge of the cavity (12).

6. The housing (1) according to claim 2, wherein at least one laser welding line (8, 8a, 8b, 8c, 8d, 8e, 8f) surrounds the functional area (13) at a predetermined distance, and the predetermined distance represents the distance from the at least one laser welding line to the border of the functional area.

7. The housing (1) according to claim 6, wherein the predetermined distance corresponds to the height HL or is smaller than the height HL, or corresponds to twice the height HL or is smaller than twice the height HL.

8. The housing (1) according to claim 2, The housing provides an airtight seal for the functional area, such that the housing is an airtight sealed housing; and / or The functional area (13) is circumferentially enclosed in the housing.

9. The housing (1) according to claim 2, It further comprises an elastic or flexible layer (4a, 4b, 4c, 4d) such that the housing is deformable.

10. The housing (1) according to claim 9, wherein the housing is deformable by pressure changes or by mechanical forces.

11. The housing (1) according to claim 2, further comprising an inner coating region (36).

12. The housing (1) according to claim 11, wherein the inner coating zone (36) is positioned around the functional zone (13).

13. The housing (1) according to claim 2, wherein at least one of the substrates of the housing is provided as a multilayer composite (4).

14. The housing (1) according to claim 13, wherein the multilayer composite comprises one or more coatings or prestressed areas and / or provides one or more substrates.

15. The housing (1) according to claim 2, further comprising an intermediate layer (4, 4a, 4b, 4c, 4d, 4e) positioned between the base substrate (3) and the cover substrate (5).

16. The housing (1) according to claim 15, wherein The intermediate layer is provided as a multi-layer composite.

17. The housing (1) according to claim 15 or 16, wherein the functional area (13) is located in the intermediate layer (4, 4a, 4b, 4c, 4d, 4e) or in one of the plurality of intermediate layers (4, 4a, 4b, 4c, 4d, 4e), and its bottom side is covered by the base substrate (3) and its top side is covered by the cover substrate (5).

18. The housing (1) according to claim 2, wherein the functional area (13) is a cavity (12), and wherein a functional component (2) is arranged in the cavity so as to be protected by the housing (1).

19. The housing (1) according to claim 18, wherein the functional component (2) is an electrical component.

20. The housing (1) of claim 18, wherein the functional component (2) comprises a power semiconductor positioned within the cavity (12).

21. The housing (1) according to claim 20, wherein the power semiconductor comprises a GaN-LED, a SiC power transistor, a GaAs power transistor or a GaN power transistor.

22. The housing (1) according to claim 2, wherein each laser welding line (8, 8a, 8b, 8c, 8d, 8e, 8f) is positioned so that it extends into two different substrates (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) of the housing (1), and wherein the laser welding line welds the two different substrates to each other.

23. The housing (1) according to claim 22, wherein the laser welding line extends from the base substrate (3) into the cover substrate (5).

24. The housing (1) according to claim 2, wherein the thickness of the substrate (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) is less than 3 mm, and / or The base substrate (3) and / or the cover substrate (5) are thinner than one or more intermediate layers (4a, 4b, 4c, 4d, 4e, 4f).

25. The housing (1) according to claim 2, wherein the thickness of the substrate (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) is lower than 1500 μm.

26. The housing (1) according to claim 2, wherein the thickness of the substrate (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) is lower than 500 μm.

27. The housing (1) according to claim 2, wherein the thickness of the substrate (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) is lower than 120 μm.

28. The housing (1) according to claim 2, wherein the thickness of the substrate (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) is lower than 80 μm.

29. The housing (1) according to claim 15, wherein the base substrate (3) and / or the cover substrate (5) has a width half or less than that of the intermediate layer.

30. The housing (1) according to claim 2, wherein at least one of the substrates (3, 4a, 4b, 4c, 4d, 4e, 4f, 5) comprises a through hole for making electrical contact between the functional area (13) and surrounding parts outside the housing (1).

31. The housing (1) according to claim 2, wherein the substrate base plate (3) comprises through holes for making electrical contact between the functional area (13) and surrounding parts outside the housing (1).

32. The housing (1) according to claim 2, wherein the size of the housing (1) is 10 mm x 10 mm or less, and / or The height of the housing is greater than its width.

33. The housing (1) according to claim 2, wherein the size of the housing (1) is 5 mm x 5 mm or less.

34. The housing (1) according to claim 2, wherein the size of the housing (1) is or 2 mm x 2 mm or 1 mm x 1 mm or smaller.

35. Use of the housing (1) according to claim 2 for producing a medical implant, a microlens composite, a micro-optical chip, a pharmaceutical package, an LED or an optical component of an augmented reality device.

36. A method of providing a housing (1) according to any one of claims 2 to 34, wherein the housing (1) encloses a functional area (13), the method comprising the following steps: A base substrate (3) is provided and a cover substrate (5) is aligned above the base substrate in such a way that at least one contact surface (25) is arranged between the base substrate and the cover substrate, hermetically sealing the functional area (13) by introducing a first laser weld line (8) in the housing, introducing a second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) at the same position as the first laser welding line or at a position close to the first laser welding line (8) or overlapping with the first laser welding line (8), and Stress in the region of the first laser weld line (8) of the housing (1) is relieved by introducing the second laser weld line, wherein the first laser weld line (8) has a height HL in a direction perpendicular to its connection plane and a width w in the connection plane, and wherein the at least one second beam spot or second laser weld line (8a, 8b, 8c, 8d, 8e, 8f) is positioned such that: i) the distance between the first laser welding line (8) and the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) in a direction perpendicular to the connection plane is less than 5HL; and / or ii) The distance between the first laser welding line (8) and the at least one second beam spot or second laser welding line (8a, 8b, 8c, 8d, 8e, 8f) in the direction within the connection plane is less than 5w.

37. The method according to claim 36, wherein a laser welding line (8, 8a, 8b, 8c, 8d, 8e, 8f) is introduced into the housing using a laser source; and A laser beam is directed around the functional area (13) so as to form the laser welding line along the contact surface (25) between the base substrate (3) and the cover substrate (5).

38. The method according to claim 37, wherein the laser source is a pulsed laser source and wherein several laser pulses are introduced along the laser welding line (8, 8a, 8b, 8c, 8d, 8e, 8f) so that a continuous or substantially continuous welding line is composed of the several laser pulses.

39. Method according to claim 36 or 37, wherein the functional area (13) is a cavity (12).

40. A tempered sealed housing (1) produced by the method according to any one of claims 36 to 39.

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