A transport device for a precursor and a semiconductor device

Abstract

The present invention relates to a transport device for a precursor and a semiconductor device. The transport device for the precursor includes a liquid delivery section, a vaporization device, and a first pipeline. The liquid delivery section is used for delivering the precursor, and the vaporization device is used for vaporizing the precursor. The liquid delivery section is connected to the input end of the vaporization device, and the output end of the vaporization device is communicated to an air inlet on the upper cover plate of the reaction chamber through the first pipeline. The relative position of the vaporization device and the upper cover plate remains unchanged. The present invention can reduce the risk of condensation of the precursor vapor and at the same time reduce the risk of contamination caused by the exposure of the vapor pipeline to the atmosphere.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a transport device for a precursor and a semiconductor device. Background Art

[0002] In plasma chemical vapor deposition and atomic layer deposition reactions, it is often necessary to use a liquid precursor, and a vaporizer needs to be configured to convert the liquid precursor into a gaseous vapor, which is then transported into the reaction chamber for gas-phase and surface reactions. In the prior art, the liquid supply pipeline for supplying the precursor, the vaporizer, and the high-temperature vapor pipeline are all connected by rigid pipelines, which will interfere with the operation of opening the upper cover plate of the reaction chamber. When maintaining the equipment, the vapor pipeline needs to be disconnected, but this will expose the vapor pipeline to the air, resulting in condensation. In addition, the precursor has a very high reaction activity and will quickly form by-products when encountering air, which will adhere to the pipeline, leading to contamination and thus affecting the utilization efficiency of the semiconductor process equipment. Summary of the Invention

[0003] The object of the present invention is to provide a transport device for a precursor and a semiconductor device to reduce the risk of condensation of the precursor vapor and at the same time reduce the risk of contamination caused by the exposure of the vapor pipeline to the atmosphere.

[0004] The object of the present invention is achieved by the following technical solutions. A transport device for a precursor according to the present invention includes a liquid delivery section, a vaporization device, and a first pipeline. Among them, the liquid delivery section is used to transport the precursor, the vaporization device is used to vaporize the precursor, the liquid delivery section is connected to the input end of the vaporization device, the output end of the vaporization device is communicated to an air inlet on the upper cover plate of the reaction chamber through the first pipeline, and the relative position of the vaporization device and the upper cover plate remains unchanged.

[0005] In some embodiments, the vaporization device is arranged above the upper cover plate or at a position flush with the upper surface of the upper cover plate.

[0006] In some embodiments, the first pipeline is a rigid connection pipeline, the first end of the first pipeline is communicated with the output end of the vaporization device, and the second end of the first pipeline is communicated with the air inlet on the upper cover plate.

[0007] In some embodiments, the liquid delivery section includes a second pipeline, and the second pipeline is connected to the input end of the vaporization device.

[0008] In some embodiments, the second pipeline is a flexible connection pipeline.

[0009] In some embodiments, the liquid delivery unit further includes a tension sensor for detecting tension, and the tension sensor is disposed on the second pipeline.

[0010] In some embodiments, the second pipeline includes a flexible double sleeve, a protective layer, and a connection joint. The flexible double sleeve includes an inner pipe, an outer pipe, and a sandwich layer between the inner pipe and the outer pipe. The inner pipe is used for transporting the precursor. The protective layer is sleeved on the outer pipe, and the first end of the connection joint is disposed in the sandwich layer.

[0011] In some embodiments, the liquid delivery unit further includes a third pipeline, and the second end of the connection joint is communicated to a vacuum system through the third pipeline.

[0012] In some embodiments, the transport device further includes a support portion, the support portion is disposed on the upper cover plate, and the second pipeline is lapped on the support portion.

[0013] The present invention also provides a semiconductor device, including the transport device for the foregoing precursor.

[0014] The beneficial effects of the present invention at least include:

[0015] 1. The relative positions of the vaporization device, the first pipeline, and the upper cover plate remain unchanged. Thus, during maintenance, there is no need to disconnect the first pipeline, thereby reducing the risk of condensation of the precursor vapor in the first pipeline and reducing the risk of contamination caused by the exposure of the first pipeline to the atmosphere.

[0016] 2. The vaporization device is installed above the upper cover plate of the semiconductor reaction chamber or at a position flush with the upper surface of the upper cover plate, so that the overall length of the first pipeline can be shortened. On the one hand, fewer heaters for the first pipeline are required, and at the same time, there are fewer pipeline corners in the first pipeline itself, avoiding the phenomenon of condensation of the precursor vapor caused by insufficient heating efficiency. On the other hand, the travel of the precursor vapor can be reduced, thereby improving production capacity and purge efficiency. On the other hand, the pressure at the outlet of the vaporization device can be significantly reduced, thereby improving the vaporization efficiency of the precursor and reducing the risk of particles appearing in the precursor vapor.

[0017] 3. The first end of the connection joint is disposed in the sandwich layer of the flexible double sleeve, and the second end of the connection joint is communicated to the vacuum system through the third pipeline, thereby preventing the liquid precursor from leaking directly into the air.

[0018] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given and described in detail in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 1 is a schematic structural diagram of a precursor transport device according to an embodiment of the present invention;

[0020] Figure 2 FIG. 2 is a schematic structural diagram of a second pipeline according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] To further elaborate on the technical means of the present invention, the following describes in detail the specific embodiments of the precursor transport device and the semiconductor device according to the present invention in conjunction with the accompanying drawings and preferred embodiments.

[0022] As Figure 1 shown, the precursor transport device according to the present invention includes a liquid delivery unit 1, a vaporization device 2, and a first pipeline 3. Among them, the liquid delivery unit 1 is used to deliver the liquid precursor, the vaporization device 2 is used to vaporize the liquid precursor, and the liquid delivery unit 1 is connected to the input end of the vaporization device 2 through a threaded joint to deliver the liquid precursor into the vaporization device 2. After being vaporized by the vaporization device 2, the liquid precursor will become gaseous. The output end of the vaporization device 2 is connected to the air inlet on the upper cover 5 of the semiconductor reaction chamber 7 through the first pipeline 3, so as to provide the gaseous precursor to the semiconductor reaction chamber 7. The first pipeline 3 is used to transport the precursor vapor. A plurality of heaters 6 are provided on the first pipeline 3 to heat the first pipeline 3, thereby preventing the precursor vapor from condensing. Therefore, the first pipeline 3 is preferably a rigid connection pipeline. The first end of the first pipeline 3 is connected to the output end of the vaporization device 2 through a threaded joint, and the second end of the first pipeline 3 is connected to the air inlet on the upper cover 5 through a threaded joint. In the present invention, the relative positions of the vaporization device 2 and the upper cover 5 remain unchanged. Specifically, the vaporization device 2 can be fixed on the upper surface of the upper cover 5 or above the upper cover 5 through threaded parts or transitional mechanical connection lines. In some other embodiments, the first end of a connecting rod can be fixedly connected to the upper cover 5, and the second end of the connecting rod can be fixedly connected to the vaporization device 2, so as to fix the vaporization device 2 below the upper cover 5. The present invention does not limit the specific positions of the vaporization device 2 and the upper cover 5, as long as the relative positions between the vaporization device 2 and the upper cover 5 can be kept unchanged. Since the first pipeline 3 is connected to the upper cover 5 and the vaporization device 2, the relative positions among the first pipeline 3, the upper cover 5, and the vaporization device 2 can be kept unchanged.

[0023] In the present invention, the relative positions of the vaporization device 2, the first pipeline 3, and the upper cover plate 5 remain unchanged. When the upper cover plate 5 is opened, the positions of the vaporization device 2, the first pipeline 3, and the upper cover plate 5 rise together. When the upper cover plate 5 is closed, the positions of the vaporization device 2, the first pipeline 3, and the upper cover plate 5 drop together. Thus, during the maintenance of the pipeline, it is not necessary to disconnect the first pipeline 3, thereby reducing the risk of condensation of the precursor vapor in the first pipeline 3 and simultaneously reducing the risk of contamination caused by the exposure of the first pipeline 3 to the atmosphere.

[0024] In a preferred embodiment, the present invention installs the vaporization device 2 above the upper cover plate 5 of the semiconductor reaction chamber or at a position flush with the upper surface of the upper cover plate 5, so as to be able to shorten the overall length of the first pipeline 3. On the one hand, this enables fewer heaters 6 for the first pipeline 3 and at the same time results in fewer pipeline bends in the first pipeline 3 itself, avoiding the phenomenon of condensation of the precursor vapor due to insufficient heating efficiency; on the other hand, it can also reduce the travel of the precursor vapor, thereby improving production capacity and purging efficiency; on yet another hand, it can also significantly reduce the pressure at the outlet of the vaporization device 2, thereby improving the vaporization efficiency of the precursor and reducing the risk of particles appearing in the precursor vapor.

[0025] As Figure 1 shown, the liquid delivery section 1 of the present invention includes a second pipeline 11, and the second pipeline 11 is connected to the input end of the vaporization device 2. The second pipeline 11 of the present invention is a flexible connection pipeline connected to the input end of the vaporization device 2. Therefore, when the upper cover plate 5 is opened, the positions of the vaporization device 2, the first pipeline 3, and the upper cover plate 5 rise together, and the second pipeline 11 also rises together. When the upper cover plate 5 is closed, the positions of the vaporization device 2, the first pipeline 3, and the upper cover plate 5 drop together, and the second pipeline 11 also drops together. The relative positions of the second pipeline 11, the vaporization device 2, the first pipeline 3, and the upper cover plate 5 remain unchanged, so it is not necessary to disconnect the second pipeline 11 either. The transport device of the present invention further includes a support section 4 for supporting the second pipeline 11, and the support section 4 is arranged on the upper cover plate 5, and the second pipeline 11 is lapped on the support section 4. The liquid delivery section 1 further includes a precursor supply section 14, and the liquid precursor is provided by the precursor supply section 14.

[0026] As Figure 1 shown, in some other embodiments, the liquid delivery section 1 further includes a tension sensor 12 for detecting the tension of the second pipeline 11, and the tension sensor 12 is arranged on the second pipeline 11.

[0027] As Figure 1 and Figure 2As shown in the figure, the second pipeline 11 includes a flexible double sleeve 111, a protective layer 112, and a connection joint 113. The flexible double sleeve 111 includes an inner pipe 1111, an outer pipe 1112, and a sandwich layer 1113 between the inner pipe 1111 and the outer pipe 1112. The inner pipe 1111 is used to transport the precursor. The protective layer 112 is sleeved on the outer pipe 1112. The first end of the connection joint 113 is arranged in the sandwich layer 1113. The liquid delivery part 1 further includes a third pipeline 13. The second end of the connection joint 113 is connected to a vacuum system through the third pipeline 13. If the inner pipe 1111 leaks, the liquid precursor will enter the sandwich layer 1113 and be discharged into the vacuum system through the connection joint 113 and the third pipeline 13, thereby preventing the liquid precursor from leaking directly into the air. The protective layer 112 can preferably be an outer braided layer, and this outer braided layer provides a certain flexural strength as a mechanical protective layer. The connection joint 113 can preferably be a vacuum connection joint to ensure the sealing performance.

[0028] The present invention also provides a semiconductor device, which uses the above-mentioned precursor transport device to transport the precursor into a semiconductor reaction chamber for reaction.

[0029] Words such as "including", "comprising", "having", etc. involved in the present invention are open-ended words, meaning "including but not limited to", and can be used interchangeably with each other. The words "or" and "and" used here mean "and / or", and can be used interchangeably with it, unless the context clearly indicates otherwise.

[0030] The above description of the disclosed aspects enables any person skilled in the art to implement the present invention. Various modifications to these aspects are obvious to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the aspects shown herein, but to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A transport device for a precursor, characterized in that, It includes a liquid delivery section, a vaporization device, and a first pipeline. Among them, the liquid delivery section is used to deliver the precursor, the vaporization device is used to vaporize the precursor, the liquid delivery section is connected to the input end of the vaporization device, the output end of the vaporization device is communicated to the air inlet on the upper cover plate of the reaction chamber through the first pipeline, and the vaporization device is fixedly connected to the upper cover plate; The first pipeline is a rigid connection pipeline. The first end of the first pipeline is communicated with the output end of the vaporization device, and the second end of the first pipeline is communicated with the air inlet on the upper cover plate; The relative positions of the vaporization device, the first pipeline, and the upper cover plate remain unchanged, and the positions of the vaporization device and the first pipeline change together with the position of the upper cover plate when the upper cover plate is opened or closed; The vaporization device is arranged above the upper cover plate or at a position flush with the upper surface of the upper cover plate; The liquid delivery section includes a second pipeline, and the second pipeline is connected to the input end of the vaporization device; The second pipeline is a flexible connection pipeline, including a flexible double sleeve, a protective layer, and a connection joint. The flexible double sleeve includes an inner tube, an outer tube, and a sandwich layer between the inner tube and the outer tube. The inner tube is used to transport the precursor, the protective layer is sleeved on the outer tube, and the first end of the connection joint is arranged in the sandwich layer; The liquid delivery section further includes a third pipeline, and the second end of the connection joint is communicated to the vacuum system through the third pipeline.

2. The transport device for the precursor according to claim 1, characterized in that The liquid delivery section further includes a tension sensor for detecting tension, and the tension sensor is arranged on the second pipeline.

3. The transport device for the precursor according to claim 1, characterized in that, The transport device further includes a support section, the support section is arranged on the upper cover plate, and the second pipeline is lapped on the support section.

4. A semiconductor device, characterized in that, It includes a transport device for the precursor according to any one of claims 1 to 3.

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