Display panel and manufacturing method thereof

Abstract

A display panel and a manufacturing method thereof. The display panel includes a substrate, a plurality of light-emitting diodes (LEDs), and a cured light-opaque adhesive layer. The LEDs are located on a first surface of the substrate. The cured light-opaque adhesive layer is located on the first surface of the substrate and surrounds the LEDs. A portion of the cured light-opaque adhesive layer is located on a side surface of the substrate. The second surface of the cured light-opaque adhesive layer faces away from the substrate and has a rough surface.

Description

Technical Field

[0001] The present invention relates to a display panel and a manufacturing method thereof. Background Art

[0002] Light-emitting diodes (LEDs) are considered an excellent choice for display device pixels due to their long lifespan, resistance to damage, fast response time, and high reliability. Currently, when manufacturing LED displays, the LEDs are typically transferred to a circuit substrate using mass transfer technology, and then encapsulated with a sealant. Summary of the Invention

[0003] The present invention provides a display panel, which can improve the problem of light reflection on the surface of the display panel.

[0004] The present invention provides a method for manufacturing a display panel, which can improve the problem of light reflection on the surface of the display panel.

[0005] At least one embodiment of the present invention provides a display panel comprising a substrate, a plurality of light-emitting diodes (LEDs), and a cured light-opaque adhesive layer. The LEDs are located on a first surface of the substrate. The cured light-opaque adhesive layer is located on the first surface of the substrate and surrounds the LEDs. A portion of the cured light-opaque adhesive layer is located on a side surface of the substrate. A second surface of the cured light-opaque adhesive layer faces away from the substrate and has a rough surface.

[0006] At least one embodiment of the present invention provides a method for manufacturing a display panel, comprising: placing a plurality of light-emitting diodes on a first surface of a substrate; providing an opaque adhesive layer on the first surface of the substrate, wherein the opaque adhesive layer covers the light-emitting diodes; curing the opaque adhesive layer to form a cured light-emitting adhesive layer, wherein the cured light-emitting adhesive layer surrounds the light-emitting diodes, and a portion of the cured light-emitting adhesive layer is located on the side of the substrate; performing an etching process to etch the cured light-emitting adhesive layer, wherein after the etching process, the cured light-emitting adhesive layer has a rough surface on a second surface facing away from the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figures 1A to 1K It is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0008] Figure 2 is a cross-sectional schematic diagram of a spliced ​​display device according to an embodiment of the present invention.

[0009] Figure 3 is a cross-sectional schematic diagram of a spliced ​​display panel according to an embodiment of the present invention.

[0010] Figure 4 is a cross-sectional schematic diagram of a spliced ​​display device according to an embodiment of the present invention.

[0011] Figure 5 is a cross-sectional schematic diagram of a spliced ​​display panel according to an embodiment of the present invention.

[0012] Figure 6 is a cross-sectional schematic diagram of a spliced ​​display panel according to an embodiment of the present invention.

[0013] 7A to 7B It is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0014] Description of reference numerals:

[0015] 1,2: Spliced ​​display device

[0016] 10, 20, 30, 40, 50: Display panel

[0017] 100: Substrate

[0018] 100s,,2101s,2102s: Side

[0019] 100t: First side

[0020] 100b: Side 2

[0021] 102: Pad

[0022] 110: Light Emitting Diode

[0023] 110h, 2101h, 2102sh, 3101h: thickness

[0024] 110t: Top

[0025] 112: Electrode

[0026] 200: Release layer

[0027] 210: opaque adhesive layer

[0028] 2101,2102: Cured opaque adhesive layer

[0029] 2102t: Side 2

[0030] 3101: Transparent flat layer

[0031] 3101s: Side

[0032] 3101A: Part One

[0033] 3101B: Part 2

[0034] 400: Optical film

[0035] 510: Side wiring

[0036] 520: Protective layer

[0037] GP: Gap

[0038] H: Heating head

[0039] M: mold

[0040] Ms: inner side

[0041] w1: width

[0042] w2: tilt angle DETAILED DESCRIPTION

[0043] Figures 1A to 1K It is a cross-sectional schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention.

[0044] Please refer to Figure 1A , a plurality of light-emitting diodes 110 are placed on the first surface 100t of the substrate 100. For example, the light-emitting diodes 110 are formed on one or more growth substrates (not shown), and then the light-emitting diodes 110 are placed on the first surface 100t of the substrate 100 using a mass transfer technique.

[0045] In some embodiments, the LEDs 110 include LEDs of different colors, such as a red LED, a green LED, and a blue LED. In other embodiments, the LEDs 110 are all of the same color. In some embodiments, the thickness 110h of the LEDs 110 is between 5 μm and 80 μm.

[0046] In this embodiment, substrate 100 is a circuit substrate. Substrate 100 includes, for example, a plurality of conductive lines (omitted from the drawings), a plurality of active components (omitted from the drawings), a plurality of passive components (omitted from the drawings), and a plurality of pads 102. Pads 102 are located on a first surface 100t of substrate 100. In this embodiment, electrodes 112 of light-emitting diodes 110 are connected to pads 102 on substrate 100 via eutectic bonding, but the present invention is not limited thereto. In other embodiments, light-emitting diodes 110 are connected to pads 102 on substrate 100 via anisotropic conductive adhesive or other conductive structures.

[0047] Please refer to Figure 1B The substrate 100 and the light-emitting diode 110 are placed in a mold M. In some embodiments, a gap GP is defined between the side surface 100s of the substrate 100 and the inner side surface Ms of the mold M. The width w1 of the gap GP is, for example, 50 μm to 200 μm.

[0048] Please refer to Figure 1CA light-proof adhesive layer 210 is provided on the first surface 100t of the substrate 100, and the light-proof adhesive layer 210 covers the light-emitting diode 110. In this embodiment, the light-proof adhesive layer 210 is formed on the release layer 200, and then the light-proof adhesive layer 210 is attached to the light-emitting diode 110.

[0049] In some embodiments, the opaque adhesive layer 210 is a resin in a B-stage state, where the B-stage state refers to a semi-cured state. For example, the opaque adhesive layer 210 includes a resin and a curing agent, and the resin and curing agent partially react to form a semi-cured state. The opaque adhesive layer 210 in the B-stage state can be heated to achieve low viscosity and high fluidity. Furthermore, further heating of the opaque adhesive layer 210 can cure the B-stage state of the opaque adhesive layer 210.

[0050] Compared to printing or coating, using a B-stage resin allows for the formation of a thicker opaque adhesive layer 210 on the substrate 100. This helps reduce the vertical distance between the top surface of the opaque adhesive layer 210 and the top surface of the LED 110, thereby alleviating the problem of bubbles forming around the LED 110 in subsequently formed layers. Specifically, if the opaque adhesive layer is formed by printing or coating, the thickness of the formed opaque adhesive layer may be too thin, resulting in bubbles in the subsequently formed layers on the LED 110 due to the height difference between the opaque adhesive layer and the LED 110.

[0051] Please refer to Figure 1D , a lamination process is performed on the opaque adhesive layer 210. For example, the opaque adhesive layer 210 is heat-pressed using a heating head H. During the heat-pressing process, the opaque adhesive layer 210 is filled between the LED 110 and the substrate 100. In this embodiment, during the heat-pressing process, the opaque adhesive layer 210 is further filled between the side surface 100s of the substrate 100 and the inner side surface Ms of the mold M. In some embodiments, the lamination process of the opaque adhesive layer 210 is performed in a vacuum environment.

[0052] In this embodiment, the opaque adhesive layer 210 can serve as an underfill material for the LED 110 to protect the contact between the LED 110 and the substrate 100. Specifically, the opaque adhesive layer 210 surrounds the electrode 112 of the LED 110 to prevent the electrode 112 from being damaged during subsequent processes.

[0053] After the opaque adhesive layer 210 is filled between the LED 110 and the substrate 100, and between the side surface 100s of the substrate 100 and the inner side surface Ms of the mold M, the opaque adhesive layer 210 is further heated to cure, thereby forming a cured opaque adhesive layer 2101. The cured opaque adhesive layer 2101 is located on the first surface 100t of the substrate 100 and surrounds the LED 110. In this embodiment, the cured opaque adhesive layer 2101 is located between the LED 110 and the substrate 100. A portion of the cured opaque adhesive layer 2101 is located on the side surface 100s of the substrate 100.

[0054] In this embodiment, the cured light-impermeable adhesive layer 2101 is, for example, a light-absorbing layer or a combination of a light-absorbing layer and a reflective layer, wherein the optical density (OD) of the light-absorbing layer is greater than or equal to 3. In this embodiment, since a portion of the cured light-impermeable adhesive layer 2101 is located on the side surface 100s of the substrate 100, light leakage from the edge of the display panel can be avoided.

[0055] In some embodiments, a thickness 2101h of the cured light-proof adhesive layer 2101 on the first surface 100t of the substrate 100 is in a range of 10 micrometers to 100 micrometers.

[0056] Please refer to Figure 1E , remove the mold M. For example, the release layer 200 , the opaque adhesive layer 2101 , the light-emitting diode 110 and the substrate 100 are taken out of the mold M.

[0057] Please refer to Figure 1F , remove the release layer 200.

[0058] Please refer to Figure 1G , an etching process is performed to etch the cured light-proof adhesive layer 2102 until the second surface 2102t of the cured light-proof adhesive layer 2102 is aligned with or lower than the top surface 110t of the light-emitting diode 110. The etching process includes, for example, a plasma etching process. After the etching process, the top surface 110t of the light-emitting diode 110 is exposed by the cured light-proof adhesive layer 2102, and the second surface 2102t of the cured light-proof adhesive layer 2102 facing away from the substrate 100 is a rough surface ( Figure 1G The rough surface of the opaque adhesive layer 2102 is simply represented by a thick line. In this embodiment, an etching process is performed to obtain a roughened second surface 2102t, thereby improving the surface haze of the cured opaque adhesive layer 2102. In some embodiments, the Ra value of the second surface 2102t of the cured opaque adhesive layer 2102 is between 0.1 microns and 2.5 microns. In this embodiment, the roughened second surface 2102t of the cured opaque adhesive layer 2102 can alleviate the problem of glare on the display panel surface.

[0059] In some embodiments, the second surface 2102t of the cured light-proof adhesive layer 2102 on the first surface 100t of the substrate 100 is substantially flush with the top surface 110t of the LED 110. Specifically, the second surface 2102t of the cured light-proof adhesive layer 2102 is aligned with or lower than the top surface 110t of the LED 110, and the height difference between the second surface 2102t and the top surface 110t can be 0 to 75 microns.

[0060] In some embodiments, after the etching process is performed, a cleaning process is selectively performed on the second surface 2102 t of the cured opaque adhesive layer 2102 to remove residues generated by the etching process.

[0061] Please refer to Figure 1H , a cutting process is performed to remove excess portions of the cured light-proof adhesive layer 2102. In some embodiments, the cutting process includes, for example, laser or other suitable processes.

[0062] In this embodiment, after the cutting process, the portion of the cured light-proof adhesive layer 2102 located on the side surface 100s of the substrate 100 and the portion of the cured light-proof adhesive layer 2102 located on the first surface 100t of the substrate 100 remain. The thickness 2102sh of the cured light-proof adhesive layer 2102 on the side surface 100s of the substrate 100 is, for example, 10 micrometers to 250 micrometers.

[0063] In this embodiment, the cutting process reduces the thickness 2102sh, but the present invention is not limited thereto.

[0064] Please refer to Figure 1I , forming a light-transmitting flat layer 3101 on the cured light-opaque adhesive layer 2102. In some embodiments, the method of forming the light-transmitting flat layer 3101 is similar to Figures 1C to 1F The process of forming a solidified opaque adhesive layer 2101 is described, but the present invention is not limited thereto. The light-transmitting flat layer 3101 can also be formed by other suitable processes. In some embodiments, black particles are selectively doped in the light-transmitting flat layer 3101, and the content of the black particles is in the range of 0wt% to 0.5wt%. For example, the light-transmitting flat layer 3101 includes a base material and black particles dispersed in the base material. For example, the base material is epoxy, silicone or other resin materials. The black particles are distributed in the base material. In some embodiments, the black particles include carbon, chromium, light-absorbing dyes similar to filter elements, or other light-absorbing materials.

[0065] In some embodiments, the cured opaque adhesive layer 2102 also includes a base material and black particles dispersed in the base material, and the cured opaque adhesive layer 2102 and the transparent flat layer 3101 include the same material. The difference between the cured opaque adhesive layer 2102 and the transparent flat layer 3101 is that the cured opaque adhesive layer 2102 contains a higher content of black particles.

[0066] The light-transmitting planarizing layer 3101 covers and contacts the top surface 110t of the LED 110, the second surface 2102t of the cured light-opaque adhesive layer 2102, the side surface 2102s of the cured light-opaque adhesive layer 2102, and the side surface 100s of the substrate 100. The light-transmitting planarizing layer 3101 has a thickness 3101h of 10 to 100 micrometers on the first surface 100t of the substrate 100.

[0067] In this embodiment, because the second surface 2102t of the cured light-opaque adhesive layer 2102 on the first surface 100t of the substrate 100 is substantially flush with the top surface 110t of the light-emitting diode 110, bubbles are less likely to form between the light-transmitting planarizing layer 3101 and the cured light-opaque adhesive layer 2102. Furthermore, the provision of the light-transmitting planarizing layer 3101 prevents moisture from entering the display panel from the edges of the display panel.

[0068] Please refer to Figure 1J , an optical film 400 is formed on the light-transmitting flat layer 3101. The optical film 400 is, for example, a polarizing film, an anti-glare film, an anti-reflection film or other suitable optical films.

[0069] Please refer to Figure 1K The optical film 400 and the light-transmitting flat layer 3101 are cut to obtain the display panel 10. In this embodiment, when the optical film 400 and the light-transmitting flat layer 3101 are cut, the cured light-opaque adhesive layer 2102 is not cut.

[0070] In this embodiment, the light-transmitting planarizing layer 3101 includes a first portion 3101A and a second portion 3101B. The first portion 3101A covers the second surface 2102t of the cured light-opaque adhesive layer 2102 and the top surface 110t of the LED 110. The second portion 3101B is located on the side surface 100s of the substrate 100 and covers the portion of the cured light-opaque adhesive layer 2102 located on the side surface 100s. In this embodiment, the first portion 3101A and the second portion 3101B are connected to each other.

[0071] Figure 2 is a cross-sectional schematic diagram of a spliced ​​display device according to an embodiment of the present invention.

[0072] Please refer to Figure 2The spliced ​​display device 1 is obtained by splicing a plurality of display panels 10. The display panels 10 are spliced ​​together, for example, by a back frame (not shown) or other components.

[0073] In this embodiment, the light-transmitting planar layers 3101 of adjacent display panels 10 contact each other. To prevent light leakage at the joints between the display panels 10 in the spliced ​​display device 1, black particles are doped into the light-transmitting planar layers 3101. In this embodiment, in the front-view direction, the thickness 3101h1 of the light-transmitting planar layer 3101 at the joints between the display panels 10 is greater than the thickness 3101h2 of the light-transmitting planar layer 3101 on the first surface 100t of the substrate 100. Therefore, by controlling the content of black particles in the light-transmitting planar layer 3101, the thicker light-transmitting planar layer 3101 (having a thickness 3101h2) can be rendered opaque, while the thinner light-transmitting planar layer 3101 (having a thickness 3101h1) can be rendered translucent. In some embodiments, the content of black particles in the light-transmitting planar layer 3101 ranges from 0 wt% to 0.5 wt%.

[0074] Figure 3 is a cross-sectional diagram of a spliced ​​display panel according to an embodiment of the present invention. It must be noted that Figure 3 The implementation examples follow Figures 1A to 1K The component numbers and partial contents of the embodiments are the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the above embodiments and will not be repeated here.

[0075] Figure 3 The display panel 20 and Figure 1K The main difference of the display panel 10 is that: Figure 3 In the display panel 20, after the optical film 400 and the light-transmitting flat layer 3101 are cut, the side surface 3101s of the light-transmitting flat layer 3101 is aligned with the side surface 2102s of the cured light-opaque adhesive layer 2102, wherein the aforementioned cutting process selectively cuts the light-opaque adhesive layer 2102.

[0076] Please refer to Figure 3In this embodiment, the light-transmitting planar layer 3101 includes a first portion 3101A and a second portion 3101B. The first portion 3101A covers the second surface 2102t of the cured light-opaque adhesive layer 2102 and the top surface 110t of the light-emitting diode 110. The second portion 3101B is located on the side surface 100s of the substrate 100. In this embodiment, the portion of the cured light-opaque adhesive layer 2102 located on the side surface 100s of the substrate 100 is located between the first portion 3101A and the second portion 3101B. The light-transmitting planar layer 3101 does not cover the side surface 2102s of the portion of the cured light-opaque adhesive layer 2102 located on the side surface 100s. In this embodiment, the first portion 3101A and the second portion 3101B are separated from each other.

[0077] Figure 4 is a cross-sectional schematic diagram of a spliced ​​display device according to an embodiment of the present invention.

[0078] Please refer to Figure 4 The spliced ​​display device 2 is obtained by splicing a plurality of display panels 20. The display panels 20 are spliced ​​together, for example, by a back frame (not shown) or other components.

[0079] In this embodiment, the cured opaque adhesive layers 2102 of adjacent display panels 20 are in contact with each other. Therefore, it is not necessary to dope the transparent flat layer 3101 with black particles to avoid light leakage at the joints of the display panels 20 of the spliced ​​display device 2 .

[0080] Figure 5 is a cross-sectional diagram of a spliced ​​display panel according to an embodiment of the present invention. It must be noted that Figure 5 The implementation examples follow Figures 1A to 1K The component numbers and partial contents of the embodiments are the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the above embodiments and will not be repeated here.

[0081] Figure 5 The display panel 30 and Figure 1K The main differences of the display panel 10 are: Figure 5 The display panel 30 further includes side wiring 510 and a protection layer 520 .

[0082] Please refer to Figure 5, forming a side trace 510 on the side surface 100s of the substrate 100. In this embodiment, the side trace 510 extends from the first surface 100t of the substrate 100 along the side surface 100s to the second surface 100b of the substrate 100, where the second surface 100b is opposite to the first surface 100t. In this embodiment, the side trace 510 is electrically connected to a circuit (not shown) located on the first surface 100t of the substrate 100, and the side trace 510 is electrically connected to a chip, circuit board, or other circuit structure located on the second surface 100b of the substrate 100.

[0083] The protective layer 520 covers the side traces 510. The cured opaque adhesive layer 2102 located on the side surface 100s of the substrate 100 partially covers the side traces 510 and the protective layer 520. The transparent planar layer 3101 located on the side surface 100s of the substrate 100 (e.g., the second portion 3101B of the transparent planar layer 3101) partially covers the side traces 510 and the protective layer 520.

[0084] Figure 6 is a cross-sectional diagram of a spliced ​​display panel according to an embodiment of the present invention. It must be noted that Figure 5 The implementation examples follow Figure 3 The component numbers and partial contents of the embodiments are the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the above embodiments and will not be repeated here.

[0085] Figure 6 The display panel 40 and Figure 3 The main differences of the display panel 20 are: Figure 5 The display panel 40 further includes side wiring 510 and a protection layer 520 .

[0086] Please refer to Figure 6 , forming a side trace 510 on the side surface 100s of the substrate 100. In this embodiment, the side trace 510 extends from the first surface 100t of the substrate 100 along the side surface 100s to the second surface 100b of the substrate 100, where the second surface 100b is opposite to the first surface 100t. In this embodiment, the side trace 510 is electrically connected to a circuit (not shown) located on the first surface 100t of the substrate 100, and the side trace 510 is electrically connected to a chip, circuit board, or other circuit structure located on the second surface 100b of the substrate 100.

[0087] The protective layer 520 covers the side traces 510. The cured opaque adhesive layer 2102 located on the side surface 100s of the substrate 100 partially covers the side traces 510 and the protective layer 520. The transparent planar layer 3101 located on the side surface 100s of the substrate 100 (e.g., the second portion 3101B of the transparent planar layer 3101) partially covers the side traces 510 and the protective layer 520.

[0088] 7A to 7B FIG. 1 is a cross-sectional view of a method for manufacturing a display panel according to an embodiment of the present invention. It must be noted that 7A to 7B The implementation examples follow Figures 1A to 1K The component numbers and partial contents of the embodiments are the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the above embodiments and will not be repeated here.

[0089] Please refer to Figure 7A , similar to Figures 1A to 1D The lamination process is performed on the opaque adhesive layer 210 in the following step. However, in this embodiment, the inner side surface Ms of the mold M includes a bevel. Therefore, the side surface of the opaque adhesive layer 210 inserted between the LED 110 and the substrate 100 is a bevel. In some embodiments, the width w1 between the inner side surface Ms of the mold M and the bottom surface of the substrate 100 is, for example, 50 to 200 microns. In some embodiments, the inclination angle w2 of the inner side surface Ms of the mold M is 0 to 6 degrees. The inclination angle w2 can also be referred to as the draft angle.

[0090] The opaque adhesive layer 210 is further heated to solidify, thereby forming a solidified opaque adhesive layer 2101. The solidified opaque adhesive layer 2101 is located on the first surface 100t of the substrate 100 and surrounds the light-emitting diode 110. In this embodiment, a side surface 2101s of the solidified opaque adhesive layer 2101 corresponds to the inner side surface Ms of the mold M. In this embodiment, the side surface 2101s is a bevel.

[0091] Please refer to Figure 7B ,right Figure 7A The structure is similar to Figures 1E to 1K The steps are performed to obtain the display panel 50. In this embodiment, the cured opaque adhesive layer 2102 after the etching and cutting processes includes a side surface 2102s and a side surface 2101s, wherein the side surface 2102s is a vertical surface after cutting, and the side surface 2101s is an inclined surface corresponding to the inner side surface of the mold. The side surface 2101s is connected to the bottom of the side surface 2102s. In other embodiments, the side surface 2101s is removed by the cutting process. In other words, the cured opaque adhesive layer 2102 may not have the side surface 2101s.

Claims

1. A display panel, comprising: a substrate; A plurality of light emitting diodes are located on a first surface of the substrate; as well as a cured light-proof adhesive layer located on the first surface of the substrate and surrounding the light-emitting diodes, wherein a portion of the cured light-proof adhesive layer is located on a side surface of the substrate, and wherein a second surface of the cured light-proof adhesive layer faces away from the substrate, and the second surface is a rough surface; Also includes: a light-transmitting flat layer, located on the cured light-opaque adhesive layer, wherein the light-transmitting flat layer comprises: a first portion covering the second surface of the cured light-proof adhesive layer; and A second portion is located on the side of the substrate, wherein the solidified light-proof adhesive layer of the second portion is located between the first portion and the second portion. 2 . The display panel as claimed in claim 1 , wherein the cured light-proof adhesive layer is located between the light-emitting diodes and the substrate. 3 . The display panel as claimed in claim 1 , wherein an Ra value of the second surface of the cured light-opaque adhesive layer is 0.1 μm to 2.5 μm. 4 . The display panel as claimed in claim 1 , wherein the second portion covers the portion of the cured light-proof adhesive layer. The display panel as claimed in claim 1 , wherein a side surface of the light-transmitting planar layer is aligned with a side surface of the cured light-opaque adhesive layer. The display panel as claimed in claim 1 , wherein the light-transmitting planar layer is doped with black particles. 7 . The display panel as claimed in claim 1 , wherein the light emitting diodes are connected to a plurality of pads on the substrate by eutectic bonding. 8 . The display panel as claimed in claim 1 , wherein the second surface of the cured light-opaque adhesive layer is lower than top surfaces of the LEDs, and a height difference between the second surface and the top surfaces of the LEDs is less than or equal to 75 μm.

9. The display panel according to claim 1, further comprising: A side wiring is located on the side of the substrate, wherein the portion of the solidified light-proof adhesive layer partially covers the side wiring.

10. A method for manufacturing a display panel, comprising: Placing a plurality of light-emitting diodes on a first surface of a substrate; Providing a light-proof adhesive layer on the first surface of the substrate, wherein the light-proof adhesive layer covers the light-emitting diodes; Curing the light-proof adhesive layer to form a cured light-proof adhesive layer, wherein the cured light-proof adhesive layer surrounds the light-emitting diodes, and a portion of the cured light-proof adhesive layer is located on a side surface of the substrate; as well as performing an etching process to etch the solidified light-proof adhesive layer, wherein after the etching process, the solidified light-proof adhesive layer has a rough surface on a second surface facing away from the substrate, Also includes: A light-transmitting flat layer is formed on the cured light-opaque adhesive layer, wherein the light-transmitting flat layer comprises: a first portion covering the second surface of the cured light-proof adhesive layer; and A second portion is located on the side of the substrate, wherein the solidified light-proof adhesive layer of the second portion is located between the first portion and the second portion.

11. The method for manufacturing a display panel according to claim 10, further comprising: The light-proof adhesive layer is hot-pressed, wherein the light-proof adhesive layer is filled between the light-emitting diodes and the substrate during the hot-pressing process. 12 . The method for manufacturing a display panel as claimed in claim 10 , wherein the second portion covers the portion of the cured light-proof adhesive layer. 13 . The method for manufacturing a display panel as claimed in claim 10 , wherein a cutting process is performed on the light-transmitting planar layer to align a side surface of the light-transmitting planar layer with a side surface of the cured light-opaque adhesive layer.

14. The method for manufacturing a display panel according to claim 10, further comprising: The light emitting diodes are connected to a plurality of pads on the substrate through eutectic bonding.

15. The method for manufacturing a display panel according to claim 10, further comprising: forming a side trace on a side surface of the substrate; as well as The light-proof adhesive layer is provided on the first surface of the substrate and on the side surface of the substrate, and the light-proof adhesive layer partially covers the side traces.

16. The method for manufacturing a display panel according to claim 10, further comprising: Before providing the light-proof adhesive layer on the first surface of the substrate, the substrate and the light-emitting diodes are placed in a mold. 17 . The method for manufacturing a display panel as claimed in claim 10 , wherein the light-impermeable adhesive layer is a resin in a B-stage state.

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